KR20210122712A - Resin composition - Google Patents

Abstract

The objective of the present invention is to provide a resin composition from which an insulating layer having a low dissipation factor and excellent adhesion strength with a conductor layer can be obtained. To this end, the present invention provides a resin composition contains: (A) a maleimide compound and; and (B) a resin having an aromatic ring and a radically polymerizable unsaturated group, wherein (A) the maleimide compound contains (A-1) a maleimide compound having a trimethyl-indan skeleton.

Description

Resin composition {RESIN COMPOSITION}

The present invention relates to a resin composition. Moreover, this invention relates to the hardened|cured material of the said resin composition, and the resin sheet obtained using the said resin composition, a printed wiring board, and a semiconductor device.

As a manufacturing technique of a printed wiring board, the manufacturing method by the build-up system which overlaps an insulating layer and a conductor layer alternately is known. In the manufacturing method by a build-up method, in general, an insulating layer is formed by hardening|curing a resin composition. As such a resin composition, the resin composition disclosed by patent document 1 is known, for example.

Japanese Laid-Open Patent Publication No. 2019-66792

The cured product formed by curing the resin composition can be used as an insulating layer of a printed wiring board of a semiconductor device. For this reason, making the dielectric loss tangent of the said hardened|cured material low is calculated|required. Moreover, it is preferable that the insulating layer formed from this hardened|cured material has strong adhesive strength with respect to the conductor layer formed on the said insulating layer.

The present invention was devised in view of the above problems, comprising: a resin composition capable of obtaining an insulating layer having a low dielectric loss tangent and excellent adhesion strength with a conductor layer; a cured product of the resin composition; A resin sheet provided with the resin composition layer containing the said resin composition; a printed wiring board including an insulating layer formed of a cured product of the resin composition; and a semiconductor device including the printed wiring board. aims to provide

MEANS TO SOLVE THE PROBLEM This inventor earnestly examined in order to solve the said subject. As a result, this inventor contains (A) a maleimide compound and resin containing (B) an aromatic ring and a radically polymerizable unsaturated group, and (A) a maleimide compound is (A-1) trimethylindane The resin composition containing the maleimide compound containing frame|skeleton revealed that said subject could be solved, and completed this invention.

That is, the present invention includes the following.

[1] (A) a maleimide compound, and (B) a resin containing an aromatic ring and a radically polymerizable unsaturated group,

(A) The resin composition in which a maleimide compound contains the maleimide compound containing (A-1) trimethylindane skeleton.

[2] The resin composition according to [1], wherein the component (A-1) contains a structure represented by the following formula (A4).

Formula A4

In the formula A4,

Ar ^a1 represents a divalent aromatic hydrocarbon group which may have a substituent;

R ^a1 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryl having 6 to 10 carbon atoms an oxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group;

R ^a2 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryl having 6 to 10 carbon atoms an oxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group;

R ^a3 each independently represents a divalent aliphatic hydrocarbon group;

n _a1 represents a positive integer;

n _a2 each independently represents an integer of 0 to 4;

n _a3 each independently represents an integer of 0 to 3.

The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^{a1 may be substituted with a halogen atom.}

The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^{a2 may be substituted with a halogen atom.}

When n _a2 is 2 to 4, R ^a1 may be the same or different within the same ring.

When n _a3 is 2 to 3, R ^a2 may be the same or different within the same ring.

[3] The resin composition according to [1] or [2], wherein the amount of the component (A-1) is 10% by mass or more and 70% by mass or less with respect to 100% by mass of the resin component in the resin composition.

[4] The resin composition according to any one of [1] to [3], wherein the amount of component (A) is 10% by mass or more and 80% by mass or less with respect to 100% by mass of the resin component in the resin composition.

[5] The resin composition according to any one of [1] to [4], wherein the component (B) contains a group represented by the following formula (B1).

Formula B1

In Formula B1,

R ^A1 , R ^A2 and R ^A3 each independently represent a hydrogen atom or an alkyl group;

R ^A4 each independently represents an alkyl group;

m _a1 represents 0 or 1;

m _a2 represents an integer from 0 to 4;

* indicates the number of bonds.

[6] The resin composition according to any one of [1] to [5], wherein the amount of component (B) is 10% by mass or more and 80% by mass or less with respect to 100% by mass of the resin component in the resin composition.

[7] The resin composition according to any one of [1] to [6], further comprising (C) a polymerization initiator.

[8] The resin composition according to any one of [1] to [7], further comprising (D) an inorganic filler.

[9] The resin composition according to any one of [1] to [8], which is for forming an insulating layer.

[10] A cured product of the resin composition according to any one of [1] to [9].

[11] A resin sheet comprising a support and a resin composition layer formed of the resin composition according to any one of [1] to [9] on the support.

[12] A printed wiring board comprising an insulating layer formed of a cured product of the resin composition according to any one of [1] to [9].

[13] A semiconductor device comprising the printed wiring board according to [12].

ADVANTAGE OF THE INVENTION According to this invention, the resin composition which can obtain the insulating layer excellent in adhesive strength with a low dielectric loss tangent with a conductor layer; a cured product of the resin composition; A resin sheet provided with the resin composition layer containing the said resin composition; a printed wiring board including an insulating layer formed of a cured product of the resin composition; and a semiconductor device containing the printed wiring board; can provide

EMBODIMENT OF THE INVENTION Hereinafter, this invention is shown and demonstrated embodiment and an illustration. However, this invention is not limited to embodiment and illustration shown below, In the range which does not deviate from the range which does not deviate from the scope of the claims of the present invention and its equivalent, it can be implemented by changing arbitrarily.

[One. Outline of resin composition]

A resin composition according to an embodiment of the present invention contains (A) a maleimide compound, and (B) a resin containing an aromatic ring and a radically polymerizable unsaturated group. In the following description, "resin containing an aromatic ring and a radically polymerizable unsaturated group" as (B) component may be called "radically polymerizable aromatic resin." Moreover, (A) maleimide compound contains the maleimide compound containing (A-1) trimethylindane skeleton. However, even if (A) the maleimide compound contains the aromatic ring, the maleimide compound is not contained in (B) radically polymerizable aromatic resin. The maleimide compound containing an aromatic ring is classified into (A) component. Therefore, the resin composition which concerns on this embodiment contains (A) a maleimide compound and (B) radically polymerizable aromatic resin other than the said (A) maleimide compound in combination.

According to such a resin composition, the insulating layer excellent in adhesive strength with a conductor layer with a low dielectric loss tangent can be obtained. Moreover, the hardened|cured material of said resin composition can make dielectric constant low normally. In addition, when an insulating layer is formed from the hardened|cured material of said resin composition, the surface roughness of the said insulating layer can be made small normally.

Said resin composition may contain arbitrary components, such as (C) polymerization initiator, (D) inorganic filler, (E) thermoplastic resin, (F) elastomer, further as needed.

[2. (A) maleimide compound]

The maleimide compound as (A) component which the resin composition contains represents the compound containing one or more maleimide groups in a molecule|numerator. The maleimide group is represented by the following general formula (A2). In the formula (A2), * represents the number of bonds. (A) The number of maleimide groups which one molecule of a maleimide compound contains is 1 or more normally, Preferably it is 2 or more. The upper limit is not particularly limited, and may be, for example, 22 or less, 10 or less, 6 or less, 4 or less, or 3 or less.

Formula A2

(A) Maleimide compound which the resin composition which concerns on this embodiment contains contains the maleimide compound containing (A-1) trimethylindane skeleton. In the following description, "a maleimide compound containing a trimethylindane skeleton" may be referred to as a "specific maleimide compound". The trimethylindane skeleton represents a skeleton shown in the following general formula (A3).

Formula A3

A substituent may couple|bond with the benzene ring which trimethylindane frame|skeleton contains. Examples of the substituent include an alkyl group, an alkyloxy group, an alkylthio group, an aryl group, an aryloxy group, an arylthio group, a cycloalkyl group, a halogen atom, a hydroxyl group, and a mercapto group.

The number of carbon atoms in the alkyl group is preferably 1 to 10. As an alkyl group, a methyl group, an ethyl group, a propyl group, n-butyl group, t-butyl group, etc. are mentioned, for example.

The number of carbon atoms in the alkyloxy group is preferably 1 to 10. As an alkyloxy group, a methoxy group, an ethoxy group, a propoxy group, a butoxy group etc. are mentioned, for example.

The number of carbon atoms in the alkylthio group is preferably 1 to 10. Examples of the alkylthio group include a methylthio group, an ethylthio group, a propylthio group, and a butylthio group.

The number of carbon atoms in the aryl group is preferably 6 to 10. As an aryl group, a phenyl group, a naphthyl group, etc. are mentioned, for example.

The number of carbon atoms in the aryloxy group is preferably 6 to 10. As an aryloxy group, a phenyloxy group, a naphthyloxy group, etc. are mentioned, for example.

The number of carbon atoms in the arylthio group is preferably 6 to 10. As an arylthio group, a phenylthio group, a naphthylthio group, etc. are mentioned, for example.

The number of carbon atoms in the cycloalkyl group is preferably 3 to 10. Examples of the cycloalkyl group include a cyclopentyl group, a cyclohexyl group, and a cycloheptyl group.

As a halogen atom, a fluorine atom, a chlorine atom, an iodine atom etc. are mentioned, for example.

Among the above substituents, hydrogen atoms of an alkyl group, an alkyloxy group, an alkylthio group, an aryl group, an aryloxy group, an alithio group, and a cycloalkyl group may be substituted with a halogen atom.

The number of the substituents couple|bonded with one benzene ring which trimethylindane skeleton contains may be 1, and 2 or more may be sufficient as it. The number of substituents couple|bonded with the benzene ring which trimethylindane frame|skeleton contains is 0 or more and 3 or less normally. When the number of substituents is two or more, these two or more substituents may be same or different. Among these, it is preferable that the substituent is not couple|bonded with the benzene ring which trimethylindane frame|skeleton contains.

(A-1) The number of trimethylindane skeletons contained in 1 molecule of a specific maleimide compound may be 1, and 2 or more may be sufficient as it. The upper limit may be, for example, 10 or less, 8 or less, 7 or less, or 6 or less.

(A-1) It is preferable that a specific maleimide compound contains aromatic ring skeleton further in addition to said trimethylindane skeleton. The number of ring-constituting carbons in the aromatic ring skeleton is preferably 6 to 10. As aromatic ring skeleton, a benzene ring skeleton, a naphthalene ring skeleton, etc. are mentioned, for example. (A-1) The number of said aromatic ring skeletons contained in 1 molecule of a specific maleimide compound becomes like this. Preferably it is 1 or more, More preferably, it is 2 or more, Preferably it is 6 or less, More preferably, it is 4 or less. , particularly preferably 3 or less. (A-1) When the specific maleimide compound contains two or more aromatic ring skeletons in addition to trimethylindane skeleton, these aromatic ring skeletons may be the same or different;

A substituent may couple|bond with the aromatic ring which said aromatic ring skeleton contains. As a substituent, the above-mentioned substituent and a nitro group are mentioned as a substituent which can couple|bond with the benzene ring which trimethylindane skeleton contains, for example. One may be sufficient as the number of the substituent couple|bonded with one aromatic ring, and 2 or more may be sufficient as it. The number of substituents couple|bonded with an aromatic ring is 0 or more and 4 or less normally. When the number of substituents is two or more, these two or more substituents may be same or different.

(A-1) It is preferable that a specific maleimide compound further contains a divalent aliphatic hydrocarbon group in addition to said trimethylindane skeleton. In particular, (A-1) when the specific maleimide compound contains an aromatic ring skeleton other than the benzene ring contained in the trimethylindane skeleton, it is preferable that the (A-1) specific maleimide compound contains a divalent aliphatic hydrocarbon group. do. In this case, it is preferable that a bivalent aliphatic hydrocarbon group connects between the benzene ring which trimethylindane frame|skeleton contains, and aromatic ring frame|skeleton. In addition, it is preferable that the divalent aliphatic hydrocarbon group connects between aromatic ring skeletons.

The number of carbon atoms in the divalent aliphatic hydrocarbon group is preferably 1 or more, preferably 12 or less, more preferably 8 or less, particularly preferably 5 or less. As the divalent aliphatic hydrocarbon group, an alkylene group as a saturated aliphatic hydrocarbon group is more preferable. Examples of the divalent aliphatic hydrocarbon group include a straight-chain alkylene group such as a methylene group, an ethylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, and a hexamethylene group; ethylidene group (-CH(CH ₃ )-), propylidene group (-CH(CH ₂ CH ₃ )-), isopropylidene group (-C(CH ₃ ) ₂ -), ethylmethylmethylene group (-C branched chain alkylene groups such as (CH ₃ )(CH ₂ CH ₃ )-) and diethylmethylene group (—C(CH ₂ CH ₃ ) _{2 -);} and the like. (A-1) When a specific maleimide compound adds two or more bivalent aliphatic hydrocarbon groups to trimethylindane skeleton, and contains, these divalent aliphatic hydrocarbon groups may be same or different.

(A-1) It is preferable that a specific maleimide compound contains the structure shown by following formula (A4). (A-1) The whole specific maleimide compound may have the structure shown by General formula A4, and (A-1) The part of a specific maleimide compound may have the structure shown by General formula A4.

Formula A4

In the formula A4,

Ar ^a1 represents a divalent aromatic hydrocarbon group which may have a substituent;

R ^a1 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryl having 6 to 10 carbon atoms an oxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group;

R ^a2 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryl having 6 to 10 carbon atoms an oxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group;

R ^a3 each independently represents a divalent aliphatic hydrocarbon group;

n _a1 represents a positive integer;

n _a2 each independently represents an integer of 0 to 4;

n _a3 each independently represents an integer of 0 to 3.

The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^{a1 may be substituted with a halogen atom.} The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^{a2 may be substituted with a halogen atom.} When n _a2 is 2 to 4, R ^a1 may be the same or different within the same ring. When n _a3 is 2 to 3, R _a2 may be the same or different within the same ring.

In the formula (A4), Ar ^a1 represents a divalent aromatic hydrocarbon group which may have a substituent. The number of carbon atoms in the divalent aromatic hydrocarbon group is preferably 6 or more, preferably 20 or less, and more preferably 16 or less. Examples of the divalent aromatic hydrocarbon group include a phenylene group and a naphthylene group. Examples of the substituent that the divalent aromatic hydrocarbon group may have include an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, and aryl having 6 to 10 carbon atoms. group, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, and a mercapto group. The hydrogen atom of each substituent may further be substituted by the halogen atom. Moreover, as a specific example of these substituents, the example similar to the substituent which can couple|bond with the benzene ring which trimethylindane skeleton contains is mentioned, for example. When a divalent aromatic hydrocarbon group has a substituent, the number of the substituent becomes like this. Preferably it is 1-4. When the number of the substituents which a divalent aromatic carbon-hydrogen group has is 2 or more, these 2 or more substituents may be same or different. Among these, Ar ^a1 is preferably a divalent aromatic hydrocarbon group having no substituent.

In Formula A4, R ^a1 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, 6 carbon atoms an aryloxy group of -10, an arylthio group of 6-10, a cycloalkyl group of 3-10, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group. The hydrogen atoms of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group may be substituted with a halogen atom. Specific examples of these groups include, for example, the same examples as the substituents capable of bonding to the benzene ring contained in the trimethylindane skeleton. Among these, R ^a1 is more preferably at least one group selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an aryl group having 6 to 10 carbon atoms, more preferably having 1 carbon atom Alkyl groups of 4 to 4 are particularly preferred.

In Formula A4, R ^a2 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, 6 carbon atoms an aryloxy group of -10, an arylthio group of 6-10, a cycloalkyl group of 3-10, a halogen atom, a hydroxyl group, or a mercapto group. The hydrogen atoms of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group may be substituted with a halogen atom. Specific examples of these groups include, for example, the same examples as the substituents capable of bonding to the benzene ring contained in the trimethylindane skeleton. Among these, R ^a2 is more preferably at least one group selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an aryl group having 6 to 10 carbon atoms.

In formula (A4), R ^a3 each independently represents a divalent aliphatic hydrocarbon group. The preferred range of the divalent aliphatic hydrocarbon group is as described above.

In Formula A4, n _a1 represents a positive integer. n _a1 is preferably 1 or more, preferably 10 or less, more preferably 8 or less.

In Formula A4, n _a2 each independently represents an integer of 0 to 4. n _a2 becomes like this. Preferably it is 2 or 3, More preferably, it is 2. Although a plurality of n _a2 may be different, the same thing is preferable. When n _a2 is 2 or more, ^several R a1 may be same or different within the same ring.

In Formula A4, n _a3 each independently represents an integer of 0 to 3. Although a plurality of n _a3 may be different, it is preferable that they are the same. n _a3 is preferably 0.

(A-1) It is especially preferable that the specific maleimide compound contains the structure shown by following formula (A5). (A-1) The entire specific maleimide compound may have a structure represented by the general formula (A5), and (A-1) a portion of the specific maleimide compound may have a structure represented by the general formula (A5).

Formula A5

In the formula A5,

R ^b1 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryl having 6 to 10 carbon atoms an oxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group;

R ^b2 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryl having 6 to 10 carbon atoms an oxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group;

n _b1 represents a positive integer;

n _b2 each independently represents an integer of 0 to 4;

n _b3 each independently represents an integer of 0 to 3.

The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^{b1 may be substituted with a halogen atom.} The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^{b2 may be substituted with a halogen atom.} When n _b2 is 2 to 4, R ^b1 may be the same or different within the same ring. When n _b3 is 2 to 3, R ^b2 may be the same or different within the same ring.

In Formula A5, R ^b1 , R ^b2 , n _b1 , n _b2 and n _b3 are the same as R ^a1 , R ^a2 , na _a1 , _na2 and na _a3 in Formula A4, respectively.

(A-1) The specific maleimide compound may further contain the structure represented by following formula (A6).

Formula A6

In the above formula A6, R ^c1, R ^c2, n _c2, and n _c3 are each the same as R ^a1, R _^a2, n ^a2 and _a3 n in Formula A4. In addition, in the formula (A6), n _c1 is the number of repeating units, and represents an integer of 1 to 20. In addition, in the formula (A6), * represents the number of bonds. For example, (A-1) in the specific maleimide compound, in formula A4, n _a2 is 3 or less, and at least two of the ortho and para positions of the benzene ring to which the maleimide group is bonded to the maleimide group , when R ^a1 is not bonded, the structure represented by the formula (A6) may be contained in combination with the structure represented by the formula (A4). Further, for example, in the specific maleimide compound (A-1), in the general formula (A5), n _b2 is 3 or less, and the benzene ring to which the maleimide group is bonded has two of the ortho and para positions with respect to the maleimide group. As described above, when R ^b1 is not bonded, the structure represented by the above formula (A6) may be contained in combination with the structure represented by the formula (A5).

(A-1) The specific maleimide compound (A-1) as a component may be used individually by 1 type, and may be used combining two or more types by arbitrary ratios.

(A-1) Maleimide group equivalent of a specific maleimide compound becomes like this. Preferably it is 50 g/eq. or more, more preferably 100 g/eq. or more, particularly preferably 200 g/eq. or more, preferably 2000 g/eq. Hereinafter, more preferably 1000 g/eq. or less, particularly preferably 800 g/eq. is below. The maleimide group equivalent represents the mass of the maleimide compound per equivalent of the maleimide group. (A-1) When the maleimide group equivalent of a specific maleimide compound exists in the said range, the effect of this invention can be acquired remarkably.

The amount of the specific maleimide compound (A-1) in the resin composition is preferably 5 mass % or more, more preferably 8 mass % or more, particularly preferably 10 mass % or more with respect to 100 mass % of the nonvolatile component in the resin composition. % or more, preferably 70 mass % or less, more preferably 60 mass % or less, and particularly preferably 50 mass % or less. (A-1) When the quantity of a specific maleimide compound exists in the said range, the effect of this invention can be acquired remarkably.

Preferably the quantity of (A-1) specific maleimide compound in a resin composition is 10 mass % or more with respect to 100 mass % of resin components in a resin composition, More preferably, it is 20 mass % or more, Especially preferably, 30 mass %. It is more than, Preferably it is 70 mass % or less, More preferably, it is 60 mass % or less, Especially preferably, it is 50 mass % or less. The resin component in a resin composition represents the component except the (D) inorganic filler among the non-volatile components in a resin composition. (A-1) When the quantity of a specific maleimide compound exists in the said range, the effect of this invention can be acquired remarkably.

The amount of the specific maleimide compound (A-1) in the resin composition is preferably 40% by mass or more, more preferably 50% by mass or more, particularly with respect to 100% by mass of the (B) radically polymerizable aromatic resin in the resin composition. Preferably it is 60 mass % or more, Preferably it is 200 mass % or less, More preferably, it is 150 mass % or less, Especially preferably, it is 120 mass % or less. (A-1) When the quantity of a specific maleimide compound exists in the said range, the effect of this invention can be acquired remarkably.

(A-1) ratio of the total number of maleimide groups of a specific maleimide compound to the total number of radically polymerizable unsaturated groups of (B) radically polymerizable aromatic resin (maleimide group/radically polymerizable unsaturated group) It is preferable to be in a specific range. The above ratio (maleimide group/radically polymerizable unsaturated group) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, preferably 5 or less, more preferably 3 or less, Especially preferably, it is 2 or less. "(A-1) The total number of maleimide groups of a specific maleimide compound" is a value obtained by dividing the mass of the nonvolatile component of (A-1) specific maleimide compound present in the resin composition by the maleimide group equivalent. , is the sum of all values. In addition, "(B) the total number of radically polymerizable unsaturated groups of the radically polymerizable aromatic resin" is a value obtained by dividing the mass of the nonvolatile components of the radically polymerizable aromatic resin present in the resin composition by the equivalent of radically polymerizable unsaturated groups. is the sum of all . When said ratio (maleimide group/radically polymerizable unsaturated group) exists in said range, the effect of this invention can be acquired remarkably.

The amount of the specific maleimide compound (A-1) in the resin composition is preferably 30% by mass to 100% by mass, more preferably 40% by mass to 100% by mass to 100% by mass of the total amount of the maleimide compound (A) % by mass, particularly preferably 50% by mass to 100% by mass. (A-1) When the quantity of a specific maleimide compound exists in the said range, the effect of this invention can be acquired remarkably.

(A-1) There is no restriction|limiting in particular in the manufacturing method of a specific maleimide compound. (A-1) A specific maleimide compound can be manufactured, for example by the method described in Invention Association Publication No. 2020-500211. According to the manufacturing method described in this Invention Association Publication No. 2020-500211, a maleimide compound having a distribution in the number of repeating units of the trimethylindane skeleton can be obtained. The maleimide compound obtained by this method contains a structure represented by the following general formula (A1). Therefore, (A) the maleimide compound may contain the maleimide compound containing the structure represented by general formula (A1).

Formula A1

In the formula A1,

R ¹ is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryl having 6 to 10 carbon atoms an oxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group;

R ² is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryl having 6 to 10 carbon atoms an oxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group;

n ₁ represents an average number of repeating units of 0.95 to 10.0;

n ₂ each independently represents an integer of 0 to 4;

n ₃ each independently represents an integer of 0 to 3.

Alkyl group of R ^1, alkyloxy group, alkylthio group, aryl group, aryloxy group, aryl tea hydrogen atoms of import, and cycloalkyl groups, may be substituted with a halogen atom. Alkyl group of R ^2, alkyloxy group, alkylthio group, aryl group, aryloxy group, aryl tea hydrogen atoms of import, and cycloalkyl groups, may be substituted with a halogen atom. When n ₂ is 2 to 4, R ¹ may be the same or different within the same ring. When n ₃ is 2 to 3, R ² may be the same or different within the same ring.

In Formula A1, R ¹ , R ² , n ₂ and n ₃ are the same as ^{R a1} , R ^a2 , n _a2 and na ₃ in Formula A4, respectively.

In the formula (A1), n ₁ represents the average number of repeating units, and the range is 0.95 to 10.0. According to the manufacturing method described in Invention Association Publication No. 2020-500211, a group of maleimide compounds containing a structure represented by Formula A1 are obtained. As can be seen from the fact that the average number of repeating units (n ₁ ) in the formula (A1) can be less than 1.00, in the maleimide compound containing the structure represented by the formula (A1) obtained in this way, the number of repeating units of the trimethylindane skeleton is 0 maleimide compounds may be included. Therefore, from the maleimide compound containing the structure represented by the formula (A1), by purification, (A-1) a specific maleimide compound is obtained, except for the maleimide compound having 0 repeating units in the trimethylindane skeleton, and the obtained ( A-1) The resin composition may contain only a specific maleimide compound. However, even when the maleimide compound whose number of repeating units of a trimethylindane skeleton is 0 is contained in a resin composition, the effect of this invention can be acquired. Moreover, when a refinement|purification is abbreviate|omitted, suppression of cost is possible. Then, it is preferable that the resin composition contains the maleimide compound containing the structure represented by Formula (A1) without excluding the maleimide compound whose number of repeating units of a trimethylindane skeleton is 0.

In the formula (A1), the average number of repeating units (n ₁ ) is preferably 0.95 or more, more preferably 0.98 or more, still more preferably 1.0 or more, particularly preferably 1.1 or more, preferably 10.0 or less, more preferably Preferably it is 8.0 or less, More preferably, it is 7.0 or less, Especially preferably, it is 6.0 or less. When the average number of repeating units (n ₁ ) is within the above range, the effects of the present invention can be significantly obtained. In particular, the glass transition temperature of a resin composition can be raised effectively.

Examples of the structure represented by the formula (A1) include the following.

The maleimide compound containing the structure represented by the general formula (A1) may further contain a structure represented by the above-mentioned general formula (A6). For example, in the maleimide compound containing the structure represented by the formula (A1), in the formula (A1), n ₂ is 3 or less, and the benzene ring to which the maleimide group is bonded is in the ortho and para positions with respect to the maleimide group, In the ^{case where R 1} is not bonded to more than one, the structure represented by the formula (A6) may be contained in combination with the structure represented by the formula (A1).

It is preferable that the molecular weight distribution (Mw/Mn) computed from gel permeation chromatography (GPC) measurement exists in the specific range of the maleimide compound containing the structure represented by Formula (A1). Molecular weight distribution is a value obtained by dividing a weight average molecular weight (Mw) by a number average molecular weight (Mn), and is represented by "Mw/Mn." Specifically, the molecular weight distribution (Mw/Mn) of the maleimide compound containing the structure represented by the formula (A1) is preferably 1.0 to 4.0, more preferably 1.1 to 3.8, still more preferably 1.2 to 3.6, particularly Preferably it is 1.3-3.4. When the molecular weight distribution (Mw/Mn) of the maleimide compound containing the structure represented by the formula (A1) is within the above range, the effects of the present invention can be remarkably obtained.

Among the maleimide compounds containing the structure represented by the general formula (A1), the amount of the maleimide compound having an average number of repeating units (n ₁ ) of 0 is preferably within a specific range. When the above GPC measurement of the maleimide compound containing the structure represented by the formula A1 is performed, the amount of the maleimide compound having an average number of repeating units (n ₁ ) of 0 is expressed in area% based on the result of the GPC measurement. can _{Specifically, in the chromatogram obtained by the GPC measurement, the average number of repeating units (n 1} ) with respect to the total area of the peaks of the maleimide compound containing the structure represented by the formula (A1) is 0. The amount of the maleimide compound having an _{average number of repeating units (n 1} ) of 0 can be expressed by the ratio (area %) of the peak area. _{Specifically, the amount of the maleimide compound having an average number of repeating units (n 1} ) of 0 with respect to 100 area% of the total amount of the maleimide compound containing the structure represented by the formula (A1) is preferably 32 area% or less, more Preferably it is 30 area% or less, More preferably, it is 28 area% or less. When the amount of the maleimide compound having an average number of repeating units (n ₁ ) of 0 is within the above range, the effects of the present invention can be remarkably obtained.

It is preferable that the maleimide group equivalent of the maleimide compound containing the structure represented by Formula (A1) exists in the same range as the maleimide group equivalent of the above-mentioned (A-1) specific maleimide compound. When the maleimide group equivalent of the maleimide compound containing the structure represented by the formula (A1) is within the above range, the effects of the present invention can be remarkably obtained.

The amount of the maleimide compound containing the structure represented by the formula (A1) is preferably 5% by mass or more, more preferably 8% by mass or more, particularly preferably 10% by mass, based on 100% by mass of the nonvolatile component in the resin composition. % or more, preferably 70 mass % or less, more preferably 60 mass % or less, and particularly preferably 50 mass % or less. When the amount of the maleimide compound containing the structure represented by the formula (A1) is within the above range, the effects of the present invention can be remarkably obtained.

The amount of the maleimide compound containing the structure represented by the formula (A1) is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass based on 100% by mass of the resin component in the resin composition. It is more than, Preferably it is 70 mass % or less, More preferably, it is 60 mass % or less, Especially preferably, it is 50 mass % or less. When the amount of the maleimide compound containing the structure represented by the formula (A1) is within the above range, the effects of the present invention can be remarkably obtained.

The amount of the maleimide compound containing the structure represented by the formula (A1) is preferably 40 mass% or more, more preferably 50 mass% or more, with respect to 100 mass% of (B) radically polymerizable aromatic resin in the resin composition, particularly Preferably it is 60 mass % or more, Preferably it is 200 mass % or less, More preferably, it is 150 mass % or less, Especially preferably, it is 120 mass % or less. When the amount of the maleimide compound containing the structure represented by the formula (A1) is within the above range, the effects of the present invention can be remarkably obtained.

Ratio (maleimide group/radically polymerizable unsaturated group) to the total number of maleimide groups of the maleimide compound containing the structure represented by formula (A1) and the total number of radically polymerizable unsaturated groups of (B) radically polymerizable aromatic resin ) is preferably in a specific range. The above ratio (maleimide group/radically polymerizable unsaturated group) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, preferably 5 or less, more preferably 3 or less, Especially preferably, it is 2 or less. "The total number of maleimide groups of the maleimide compound containing the structure represented by Formula A1" is the mass of nonvolatile components of the maleimide compound containing the structure represented by Formula A1 present in the resin composition, maleimide The value divided by the group equivalent is the sum of all values. When said ratio (maleimide group/radically polymerizable unsaturated group) exists in said range, the effect of this invention can be acquired remarkably.

The amount of the maleimide compound containing the structure represented by the formula (A1) is preferably 30% by mass to 100% by mass, more preferably 40% by mass to 100% by mass relative to 100% by mass of the total amount of the maleimide compound (A) % by mass, particularly preferably 50% by mass to 100% by mass. When the amount of the maleimide compound containing the structure represented by the formula (A1) is within the above range, the effects of the present invention can be remarkably obtained.

(A) The maleimide compound may further contain the arbitrary maleimide compound which does not contain a trimethylindane skeleton in combination with said (A-1) specific maleimide compound. As arbitrary maleimide compounds, (A-2) a biphenyl type maleimide compound and (A-3) aliphatic maleimide compound are mentioned, for example. Arbitrary maleimide compounds may be used individually by 1 type, and may be used combining two or more types by arbitrary ratios.

(A-2) A biphenyl-type maleimide compound represents the maleimide compound containing a biphenyl skeleton.

(A-2) 1 or 2 or more substituents may couple|bond with the benzene ring of the biphenyl skeleton which the biphenyl type maleimide compound contains. Examples of the substituent include a halogen atom, -OH, -OC _1-10 alkyl group, -N(C _1-10 alkyl group) ₂ , C _1-10 alkyl group, C _6-10 aryl group, -NH ₂ , -CN , -C(O)OC _1-10 alkyl group, -COOH, -C(O)H, -NO ₂ etc. are mentioned. Here, the term “C _xy ” (x and y are positive integers, satisfying x<y) indicates that the number of carbon atoms in the organic group described immediately after this term is x to y. For example, _{the expression "C 1-10} alkyl group" represents an alkyl group having 1 to 10 carbon atoms. These substituents may combine with each other to form a ring. Said ring also includes a spiro ring and a condensed ring. The above substituent may further have a substituent (hereinafter, may be referred to as a "secondary substituent"). As a secondary substituent, the thing similar to the above-mentioned substituent can be used. Among these, it is preferable that the substituent is not couple|bonded with the benzene ring of the biphenyl skeleton which the (A-2) biphenyl type maleimide compound contains.

(A-2) The biphenyl type maleimide compound preferably contains either an aliphatic hydrocarbon group or an aromatic hydrocarbon group in combination with a biphenyl skeleton, and it is more preferable to have both an aliphatic hydrocarbon group and an aromatic hydrocarbon group desirable. As a preferable (A-2) biphenyl type maleimide compound, the maleimide compound represented by following formula (A7) is mentioned.

Formula A7

In the formula A7,

R ^d1 each independently represents an alkylene group;

R ^d2 each independently represents an alkyl group which may have a substituent or an aryl group which may have a substituent;

R ^d3 each independently represents a substituent;

n _d1 represents an integer from 1 to 100;

n _d2 each independently represents an integer of 0 to 2;

n _d3 each independently represents the integer of 0-4.

In the formula (A7), ^{each R d1} independently represents an alkylene group. The number of carbon atoms in the alkylene group is preferably 1 to 10, more preferably 1 to 6, still more preferably 1 to 3. As an alkylene group, a linear alkylene group is preferable and a methylene group is more preferable.

In the formula (A7), R ^d2 each independently represents an alkyl group which may have a substituent or an aryl group which may have a substituent.

The number of carbon atoms in the alkyl group is preferably 1 to 10, more preferably 1 to 6, and particularly preferably 1 to 3. The alkyl group may be linear, branched, or cyclic. In addition, examples of the substituent that the alkyl group may have include the same examples as those described above as the substituent capable of bonding to the benzene ring of the biphenyl skeleton.

The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 15, particularly preferably 6 to 10. Examples of the substituent that the aryl group may have include the same examples as those described above as the substituent capable of bonding to the benzene ring of the biphenyl skeleton.

In formula (A7), ^{each R d3} independently represents a substituent. Examples of the substituent include the same examples as those described above as the substituent capable of bonding to the benzene ring of the biphenyl skeleton.

In the formula (A7), n _d1 represents an integer of 1 to 100, preferably 1 to 50, more preferably 1 to 20, still more preferably 1 to 5.

In the formula (A7), n _d2 each independently represents an integer of 0 to 2, preferably 0.

In the formula (A7), n _d3 each independently represents an integer of 0 to 4, preferably 0 to 3, more preferably 0 or 1, particularly preferably 0.

Examples of the biphenyl-type maleimide compound (A-2) represented by the formula (A7) include "MIR-3000-70MT" manufactured by Nippon Kayaku (main component: a compound of the following formula (A8)). In the following formula (A8), n _d4 represents 1 or 2.

Formula A8

(A-2) The amount of the biphenyl-type maleimide compound is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1.0% by mass based on 100% by mass of the nonvolatile component in the resin composition. It is more than, Preferably it is 20 mass % or less, More preferably, it is 15 mass % or less, Especially preferably, it is 10 mass % or less. (A-2) When the quantity of a biphenyl type maleimide compound exists in the said range, the effect of this invention can be acquired remarkably.

(A-2) The amount of the biphenyl-type maleimide compound is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1.0% by mass or more, based on 100% by mass of the resin component in the resin composition. Preferably, it is 30 mass % or less, More preferably, it is 20 mass % or less, Especially preferably, it is 15 mass % or less. (A-2) When the quantity of a biphenyl type maleimide compound exists in the said range, the effect of this invention can be acquired remarkably.

(A-3) The aliphatic maleimide compound represents a maleimide compound containing an aliphatic hydrocarbon group having 5 or more carbon atoms.

(A-3) The number of carbon atoms of the aliphatic hydrocarbon group contained in the aliphatic maleimide compound is usually 5 or more, preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less. , more preferably 40 or less.

(A-3) The aliphatic hydrocarbon group contained in the aliphatic maleimide compound may be saturated or unsaturated, but among these, a saturated aliphatic hydrocarbon group is preferable. In addition, a chain group may be sufficient as an aliphatic hydrocarbon group, and a cyclic group may be sufficient as it. In addition, a monovalent group may be sufficient as an aliphatic hydrocarbon group, and a bivalent group may be sufficient as it.

(A-3) As an aliphatic hydrocarbon group which an aliphatic maleimide compound contains, For example, Alkyl groups, such as a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group; Pentylene group, hexylene group, heptylene group, octylene group, nonylene group, decylene group, undecylene group, dodecylene group, tridecylene group, heptadecylene group, hexatriacontylene group, octylene-cyclohexylene an alkylene group such as a group having a structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure; can be heard

(A-3) A substituent may couple|bond with the aliphatic hydrocarbon group contained in an aliphatic maleimide compound. Examples of the substituent include the same examples as those described above as the substituent capable of bonding to the benzene ring of the biphenyl skeleton in the description of the (A-2) biphenyl-type maleimide compound. Among these, it is preferable that the substituent is not couple|bonded with the aliphatic hydrocarbon group which the (A-3) aliphatic maleimide compound contains.

(A-3) It is preferable that an aliphatic maleimide compound contains a polyimide structure. As a preferable (A-3) aliphatic maleimide compound, the maleimide terminal polyimide compound represented by following formula (A9) is mentioned.

Formula A9

In the formula A9,

R ^e1 each independently represents a divalent aliphatic hydrocarbon group having 5 or more carbon atoms which may have a substituent;

R ^e2 each independently represents a divalent linking group;

n _e1 represents an integer of 1 to 10.

In the formula (A9), ^{each R e1} independently represents a divalent aliphatic hydrocarbon group having 5 or more carbon atoms which may have a substituent. R ^e1 preferably represents an alkylene group having 5 or more carbon atoms which may have a substituent, an alkenylene group, or an alkapolyenylene group (more preferably, the number of double bonds is 2). R ^a1 preferably contains an alkylene group having 5 or more carbon atoms which may have a substituent. In this case, the alkylene group having 5 or more carbon atoms may be a part of an alkenylene group or an alkapolyenylene group. ^{Specifically, the number of carbon atoms of Re1} is usually 5 or more, preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. As a substituent which a divalent aliphatic hydrocarbon group such as an alkylene group, an alkenylene group and an alkapolyenylene group may have, for example, in the description of (A-2) biphenyl type maleimide compound, a benzene ring of a biphenyl skeleton Examples of the substituent that can be bonded to the same as those described above can be given. Among them, R ^e1 is preferably a divalent aliphatic hydrocarbon group having no substituent, and more preferably an alkylene group having no substituent.

In Formula A9, R ^e2 each independently represents a divalent linking group. The divalent linking group is preferably an oxygen atom, an arylene group, an alkylene group, or a divalent group composed of a combination of two or more of these groups. The number of carbon atoms in the arylene group is preferably 6 to 24, more preferably 6 to 18, still more preferably 6 to 14, particularly preferably 6 to 10. As a preferable arylene group, a phenylene group, a naphthylene group, anthracenylene group, etc. are mentioned, for example. The number of carbon atoms in the alkylene group is preferably 1 to 50, more preferably 1 to 45, still more preferably 1 to 40. Any of linear, branched, and cyclic|annular form may be sufficient as this alkylene group. Preferred examples of the alkylene group include a methylethylene group, a cyclohexylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, an undecylene group, a dodecylene group, and a tridecylene group. , a heptadecylene group, a hexatriacontylene group, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, a group having a propylene-cyclohexylene-octylene structure, and the like. Among these, as R ^c2 , an oxygen atom is preferable.

In Formula A9, n _e1 represents an integer of 1 to 10.

As the aliphatic maleimide compound (A-3) represented by the formula (A9), for example, "BMI-1500" (compound of formula A10, compound of formula A12) manufactured by Designer Molecules, "BMI-1700" (formula A12) a compound of A11, a compound of formula A13). In the following formulas A10, A11, A12, and A13, n _e2 , n _e3 , n _e4 and n _e5 each independently represent an integer of 1 to 10.

Formula A10

Formula A11

Formula A12

Formula A13

(A-3) The amount of the aliphatic maleimide compound is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1.0% by mass or more, based on 100% by mass of the nonvolatile component in the resin composition. , Preferably it is 10.0 mass % or less, More preferably, it is 6.0 mass % or less, Especially preferably, it is 4.0 mass % or less. (A-3) When the amount of the aliphatic maleimide compound is within the above range, the effects of the present invention can be remarkably obtained.

(A-3) The amount of the aliphatic maleimide compound is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1.0% by mass or less, with respect to 100% by mass of the resin component in the resin composition, Preferably it is 20 mass % or less, More preferably, it is 15 mass % or less, Especially preferably, it is 10 mass % or less. (A-3) When the amount of the aliphatic maleimide compound is within the above range, the effects of the present invention can be remarkably obtained.

(A-2) The maleimide group equivalent of arbitrary maleimide compounds, such as a biphenyl type maleimide compound and (A-3) an aliphatic maleimide compound, is the maleimide group of the above-mentioned (A-1) specific maleimide compound. It is preferably in the same range as the equivalent weight. When the maleimide group equivalent of any maleimide compound is in the above range, the effects of the present invention can be obtained remarkably.

(A) The amount of the maleimide compound is preferably 5 mass % or more, more preferably 8 mass % or more, particularly preferably 10 mass % or more, with respect to 100 mass % of the nonvolatile component in the resin composition, preferably is 70% by mass or less, more preferably 60% by mass or less, and particularly preferably 50% by mass or less. (A) When the quantity of a maleimide compound exists in the said range, the effect of this invention can be acquired remarkably.

(A) The amount of the maleimide compound is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass or more, with respect to 100% by mass of the resin component in the resin composition, preferably It is 80 mass % or less, More preferably, it is 70 mass % or less, Especially preferably, it is 60 mass % or less. (A) When the quantity of a maleimide compound exists in the said range, the effect of this invention can be acquired remarkably.

(A) The amount of the maleimide compound is preferably 40% by mass or more, more preferably 50% by mass or more, particularly preferably 60% by mass relative to 100% by mass of the (B) radically polymerizable aromatic resin in the resin composition. It is more than, Preferably it is 200 mass % or less, More preferably, it is 150 mass % or less, Especially preferably, it is 120 mass % or less. (A) When the quantity of a maleimide compound exists in the said range, the effect of this invention can be acquired remarkably.

(A) The ratio of the total number of maleimide groups of the maleimide compound to the total number of the radically polymerizable unsaturated groups of the (B) radically polymerizable aromatic resin (maleimide group/radically polymerizable unsaturated group) is within a specific range. It is preferable to have The above ratio (maleimide group/radically polymerizable unsaturated group) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, preferably 5 or less, more preferably 3 or less, Especially preferably, it is 2 or less. "The total number of maleimide groups of (A) maleimide compound" is the value obtained by dividing the mass of the nonvolatile component of (A) maleimide compound present in the resin composition by the maleimide group equivalent. . When said ratio (maleimide group/radically polymerizable unsaturated group) exists in said range, the effect of this invention can be acquired remarkably.

[3. (B) radically polymerizable aromatic resin]

The radically polymerizable aromatic resin as (B) component which the resin composition contains contains an aromatic ring and a radically polymerizable unsaturated group in a molecule|numerator.

(B) An aromatic hydrocarbon ring may be sufficient as the aromatic ring which radically polymerizable aromatic resin contains, and an aromatic heterocyclic ring may be sufficient as it. Further, the aromatic ring may be a monocyclic aromatic ring, a condensed aromatic ring obtained by condensing two or more monocyclic aromatic rings, or a condensed condensed ring obtained by condensing one or more monocyclic non-aromatic rings to one or more monocyclic aromatic rings. Directional rings are also good. As these aromatic rings, For example, monocyclic aromatic rings, such as a benzene ring and a pyridine ring; Condensed aromatic rings, such as an indan ring, a fluorene ring, and a naphthalene ring; can be heard Among these, as for an aromatic ring, an aromatic carbocyclic ring is preferable. The number of carbon atoms of the aromatic carbocyclic ring is preferably 6 or more and 10 or less.

(B) A substituent may couple|bond with the aromatic ring which radically polymerizable aromatic resin contains. As a substituent, the example similar to the substituent which can couple|bond with the benzene ring contained in the trimethylindane skeleton of (A-1) specific maleimide compound is mentioned, for example. One may be sufficient as the number of the substituent couple|bonded with one aromatic ring, and 2 or more may be sufficient as it. When the number of substituents is two or more, these two or more substituents may be same or different. Among these, as for the aromatic ring which (B) radically polymerizable aromatic resin contains, it is preferable that the substituent is not couple|bonded, or that the alkyl group is couple|bonded.

(B) The number of the aromatic rings which radically polymerizable aromatic resin contains is 1 or more normally, Preferably it is 2 or more. (B) When radically polymerizable aromatic resin contains two or more aromatic rings, these two or more aromatic rings may be same or different.

(B) The radically polymerizable unsaturated group which the radically polymerizable aromatic resin contains represents the group containing the unsaturated bond which shows radical polymerizability. As this radically polymerizable unsaturated group, the group containing an ethylenic double bond is mentioned, for example. (B) radically polymerizable aromatic resin containing such a radically polymerizable unsaturated group raise|generates radical polymerization with a heat|fever or an active energy ray, and can harden a resin composition.

As a radically polymerizable unsaturated group, a vinyl group, a vinylphenyl group, an acryloyl group, a methacryloyl group, a fumaroyl group, and a maleoyl group are mentioned, for example. (B) The number of radically polymerizable unsaturated groups which radically polymerizable aromatic resin contains is 1 or more normally, Preferably it is 2 or more. (B) When radically polymerizable aromatic resin contains two or more radically polymerizable unsaturated groups, these two or more radically polymerizable unsaturated groups may be same or different.

Among these, it is preferable that (B) radically polymerizable aromatic resin contains group represented by following formula (B1).

Formula B1

In Formula B1,

R ^A1 , R ^A2 and R ^A3 each independently represent a hydrogen atom or an alkyl group;

R ^A4 each independently represents an alkyl group;

m _a1 represents 0 or 1;

m _a2 represents an integer from 0 to 4;

* indicates the number of bonds.

In the formula (B1), R ^A1 , R ^A2 and R ^A3 each independently represent a hydrogen atom or an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 18, more preferably 1 to 12, still more preferably 1 to 6, particularly preferably 1 to 2. The alkyl group may be linear, branched, or cyclic. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an n-butyl group, and a t-butyl group. Among these, a hydrogen atom or a methyl group is preferable for ^{R A1 , and a hydrogen atom is preferable for R A2} and R ^A3 .

In the formula (B1), ^{each R A4} independently represents an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 12, more preferably 1 to 6, still more preferably 1 to 2. The alkyl group may be linear, branched, or cyclic. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an n-butyl group, and a t-butyl group. Among these, R ^A1 is preferably a methyl group.

In the formula (B1), m _a1 represents 0 or 1. When R ^A1 is a hydrogen atom, m _a1 is preferably 0. In addition, when R ^A1 is an alkyl group, _ma 1 is preferably 1.

In Formula B1, m _a2 represents an integer of 0 to 4. m _a2 is preferably 0 to 2.

(B) Although radically polymerizable aromatic resin may contain one group represented by general formula (B1) per molecule, it is preferable to contain two or more.

(B) As a radically polymerizable aromatic resin, the compound containing polyphenylene ether skeleton is preferable. As (B) radically polymerizable aromatic resin containing polyphenylene ether skeleton, the compound represented by following formula (B2) is mentioned.

Formula B2

In the formula B2,

L ¹ represents a divalent linking group;

R ^B11 , R ^B12 , R ^B13 , R ^B21 , R ^B22 and R ^B23 each independently represent a hydrogen atom or an alkyl group;

R ^B14 , R ^B15 , R ^B24 and R ^B25 each independently represent an alkyl group;

R ^B16 and R ^B26 each independently represent an alkylene group;

m _b11 and m _b21 each independently represent 0 or 1;

m _b12 , m _b13 , m _b22 and m _b23 each independently represent an integer of 0 to 4;

m _b14 and m _b24 each independently represent an integer from 0 to 300;

m _b15 and m _b25 each independently represent 0 or 1.

In Formula B2, L ¹ represents a divalent linking group. Examples of the divalent linking group include an alkylene group, an alkenylene group, an arylene group, an alkylarylene group, a heteroarylene group, -O-, -NH-, -NR ^x -, -CO-, -CS-, -SO -, -SO ₂ -, -C(=O)O-, -NHC(=O)-, -NC(=O)N-, -NHC(=O)O-, -C(=O)-, -S- and the group which combined these two or more are mentioned. R ^x represents a hydrocarbyl group having 1 to 12 carbon atoms. The ^number of carbon atoms in L 1 is usually 60 or less, more preferably 48 or less, still more preferably 36 or less, particularly preferably 24 or less.

In formula (B2), R ^B11 , R ^B12 , R ^B13 , R ^B21 , R ^B22 and R ^B23 each independently represent a hydrogen atom or an alkyl group. R ^B11 , R ^B12 , R ^B13 , R ^B21 , R ^B22 and R ^B23 may be the same ^{as R A1} , R ^A2 and R ^A3 in Formula B1. Among them, R ^B11 and R ^B21 is a hydrogen atom or a methyl group and is preferably, R ^B12, R ^B13, R ^B22 and R ^B23 is preferably a hydrogen atom.

In formula (B2), R ^B14 , R ^B15 , R ^B24 and R ^B25 each independently represent an alkyl group. R ^B14 , R ^B15 , R ^B24 and R ^B25 may be the same ^{as R A4} in Formula B1. Among these, R ^B14 , R ^B15 , R ^B24 and R ^B25 are preferably a methyl group.

In formula (B2), R ^B16 and R ^B26 each independently represent an alkylene group. The number of carbon atoms in the alkylene group is preferably 1 to 10, more preferably 1 to 6, still more preferably 1 to 3. As an alkylene group, a linear alkylene group is preferable and a methylene group is more preferable.

In the formula (B2), m _b11 and m _b21 each independently represent 0 or 1.

In Formula (B2), m _b12 , m _b13 , m _b22 and m _b23 each independently represent an integer of 0 to 4. m _b12 , m _b13 , m _b22 and m _b23 are preferably 1 to 4, more preferably 2 to 3, particularly preferably 2.

In Formula B2, m _b14 and m _b24 each independently represent an integer of 0 to 300. Specifically, m _b14 and m _b24 are usually 0 or more, preferably 1 or more, and usually 300 or less, preferably 100 or less, more preferably 50 or less, still more preferably 20 or less, particularly preferably less than 10.

In the formula (B2), m _b15 and m _b25 each independently represent 0 or 1. When m _b11 is 0, m _b15 is preferably 1, and when m _b11 is 1, m _b15 is preferably 0. Further, when m _b21 is 0, m _b25 is preferably 1, and when m _b21 is 1, m _b25 is preferably 0.

Preferred examples of the compound represented by the formula (B2) include a compound represented by the following formula (B3).

Formula B3

In the formula B3,

L ² represents a divalent linking group;

R ^C15 and R ^C25 each independently represent an alkyl group;

R ^C16 and R ^C26 each independently represent an alkylene group;

m _c14 and m _c24 each independently represent an integer of 0 to 300.

In Formula B3, L ² represents a divalent linking group. L ² may be the same ^{as L 1} in Formula B2. Among these, L ² is preferably a divalent group represented by the following formula (B3-1).

Formula B3-1

In Formula B3-1,

X ¹ to X ⁸ each independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group,

* indicates the number of bonds.

In Formula B3, R ^C15 and R ^C25 each independently represent an alkyl group. R ^C15 and R ^C25 may be the same ^{as R A4} in Formula B1. Among these, R ^C15 and R ^C25 are preferably a methyl group.

In Formula B3, R ^C16 and R ^C26 each independently represent an alkylene group. R ^C16 and R ^C26 may be the same ^{as R B16} and R ^B26 in Formula B2. Among these, R ^C16 and R ^C26 are more preferably a methylene group.

In Formula B3, m _c14 and m _c24 each independently represent an integer of 0 to 300. _c14 and _c24 are m m, it may be the same as m and m _{b14 b24} in Formula B2. Further, in the general formula (B3), preferably, a configuration in which one of _{m c14} and m _{c24 is 0 is excluded.}

Examples of the compound represented by the formula (B3) include a compound represented by the following formula (B4). In formula (B4), m _c14 and m _c24 represent the same numbers as in formula (B3). The compound represented by the general formula (B4) can be obtained as "OPE-2St" manufactured by Mitsubishi Gas Chemical.

Formula B4

Another preferred example of the compound represented by the formula (B2) includes a compound represented by the following formula (B5).

Formula B5

In Formula B5,

L ³ represents a divalent linking group;

R ^D11 and R ^D21 each independently represent a hydrogen atom or an alkyl group;

R ^D14 , R ^D15 , R ^D24 and R ^D25 each independently represent an alkyl group;

m _d14 and m _d24 each independently represent an integer of 0 to 300.

In Formula B5, L ³ represents a divalent linking group. L ³ may be the same ^{as L 1} in Formula B2. Among them, L ³ is preferably any one selected from the group consisting of an alkylene group, an alkenylene group, -O-, -NR ^x -, -CO-, -CS-, -SO-, -SO _{2 -} , an alkylene group is preferred, and an isopropylidene group (-C(CH ₃ ) ₂ -) is particularly preferred.

In formula (B5), R ^D11 and R ^D21 each independently represent a hydrogen atom or an alkyl group. R ^D11 and R ^D21 may be the same ^{as R B11} and R ^B21 in Formula B2. Among these, R ^D11 and R ^D21 are preferably a methyl group.

In the formula (B5), R ^D14 , R ^D15 , R ^D24 and R ^D25 each independently represent an alkyl group. R ^D14 , R ^D15 , R ^D24 and R ^D25 may be the same ^{as R A4} in Formula B1. Among these, R ^D14 , R ^D15 , R ^D24 and R ^D25 are preferably a methyl group.

In Formula B5, m _d14 and m _d24 each independently represent an integer of 0 to 300. m _d14 and m _d24 may be the same _{as m b14} and m _b24 in Formula B2. Moreover, it is preferable that the sum total of _{m b14} and m _{b24 is 2 or more.}

Examples of the compound represented by the formula (B5) include a compound represented by the following formula (B6). In Formula B6, L ³ , m _d14 and m _d24 are the same as in Formula B5. The compound represented by the general formula (B4) can be obtained as "NORYL SA9000" manufactured by SABIC.

Formula B6

(B) As another preferable example of a radically polymerizable aromatic resin, the polymer containing the structural unit represented by following formula (B7) is mentioned.

Formula B7

In the formula B7,

R ^E1 , R ^E2 and R ^E3 each independently represent a hydrogen atom or an alkyl group;

R ^E4 each independently represents an alkyl group;

R ^E5 , R ^E6 and R ^E7 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms;

m _e1 represents 0 or 1;

m _e2 represents an integer from 0 to 4;

* indicates the number of bonds.

In the formula (B7), R ^E1 , R ^E2 and R ^E3 each independently represent a hydrogen atom or an alkyl group. R ^E1 , R ^E2 and R ^E3 may be the same ^{as R A1} , R ^A2 and R ^A3 in Formula B1. Among these, R ^E1 , R ^{E2 ,} and R ^E3 are preferably a hydrogen atom.

In Formula B7, ^{each R E4} independently represents an alkyl group. R ^E4 may be the same ^{as R A4} in Formula B1.

In the formula (B7), R ^E5 , R ^E6 and R ^E7 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Among these, R ^E5 , R ^E6 and R ^E7 are preferably a hydrogen atom.

In the formula (B7), m _c1 represents 0 or 1, preferably 0.

In the formula (B7), m _e2 represents an integer of 0 to 4, preferably 0.

It is preferable that the molar content of the structural unit represented by the formula (B7) is within a specific range with respect to 100 mol% in total of all the structural units contained in the polymer containing the structural unit represented by the formula (B7). Specifically, the molar content of the structural unit represented by the formula (B7) is preferably 2 mol% to 95 mol%, more preferably 8 mol% to 81 mol%. Moreover, it is preferable that it is 1-160, and, as for the average number of structural units represented by Formula (B7) contained in one molecule of said polymer, it is more preferable that it is 3-140.

The polymer containing the structural unit represented by the formula (B7) may further contain any structural unit in combination with the structural unit represented by the formula (B7). Examples of the optional structural unit include a structural unit represented by the following formula (B7-1).

Formula B7-1

In the formula B7-1,

R ^E8 , R ^E9 and R ^E10 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms;

Ar ^E1 represents an aryl group which may have a substituent;

Examples of ^{the substituent Ar E1} may have include an alkyl group having 1 to 6 carbon atoms,

* indicates the number of bonds.

As the polymer containing the structural unit represented by the formula (B7), for example, a structural unit represented by the following formula (B8), a structural unit represented by the following formula (B8-1), and a structural unit represented by the following formula (B8-2) The copolymer contained in combination is mentioned. In formulas B8, B8-1, and B8-2, * represents the number of bonds. In this copolymer, the molar content of the structural unit represented by the formula (B8), the structural unit represented by the formula (B8-1), and the structural unit represented by the formula (B8-2) is 8 mol% to 54 mol%, 0, respectively mol% to 92 mol%, 0 mol% to 89 mol%. Incidentally, the average number of structural units represented by the formula (B8), the structural units represented by the formula (B8-1), and the structural units represented by the formula (B8-2) contained in one molecule of the copolymer is 1 to 160, 0, respectively. to 350 and 0 to 270. This copolymer can be obtained as "ODV-XET (X03)", "ODV-XET (X04)", and "ODV-XET (X05)" manufactured by Nippon Chemical & Materials.

Formula B8

Formula B8-1

Formula B8-2

(B) A radically polymerizable aromatic resin may be used individually by 1 type, and may be used combining two or more types by arbitrary ratios.

(B) The radically polymerizable unsaturated group equivalent of a radically polymerizable aromatic resin becomes like this. Preferably it is 250 g/eq. to 1200 g/eq., more preferably 300 g/eq. to 1100 g/eq. The radically polymerizable unsaturated group equivalent represents the mass of the radically polymerizable aromatic resin per equivalent of the radically polymerizable unsaturated group. (B) When the radically polymerizable unsaturated group equivalent of a radically polymerizable aromatic resin exists in the said range, the effect of this invention can be acquired remarkably.

(B) The weight average molecular weight of radically polymerizable aromatic resin becomes like this. Preferably it is 1000-40000, More preferably, it is 1500-35000. The weight average molecular weight of resin can be measured as a polystyrene conversion value by the gel permeation chromatography (GPC) method.

The amount of the (B) radically polymerizable aromatic resin in the resin composition is preferably 5% by mass or more, more preferably 8% by mass or more, particularly preferably 10% by mass relative to 100% by mass of the nonvolatile component in the resin composition. It is more than, Preferably it is 70 mass % or less, More preferably, it is 60 mass % or less, Especially preferably, it is 50 mass % or less. (B) When the quantity of a radically polymerizable aromatic resin exists in the said range, the effect of this invention can be acquired remarkably.

The amount of the (B) radically polymerizable aromatic resin in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass or more with respect to 100% by mass of the resin component in the resin composition. and preferably 80% by mass or less, more preferably 70% by mass or less, particularly preferably 60% by mass or less. (B) When the quantity of a radically polymerizable aromatic resin exists in the said range, the effect of this invention can be acquired remarkably.

[4. (C) polymerization initiator]

The resin composition may further contain the (C) polymerization initiator as arbitrary components other than an above-described component. (C) By using the polymerization initiator as a component, reaction of (A) maleimide compound and (B) radically polymerizable aromatic resin can be accelerated|stimulated, and hardening of a resin composition can be advanced smoothly.

(C) Examples of the polymerization initiator include t-butylcumyl peroxide, t-butylperoxyacetate, α,α′-di(t-butylperoxy)diisopropylbenzene, and t-butylperoxylaurate. and peroxides such as t-butylperoxy-2-ethylhexanoate, t-butylperoxyneodecanoate, t-butylperoxybenzoate and di-t-hexyl peroxide.

(C) Commercially available polymerization initiators include, for example, "Perbutyl (registered trademark) C", "Perbutyl (registered trademark) A", "Perbutyl (registered trademark) P", "perbutyl" manufactured by Nichiyu Corporation. (registered trademark) L”, “perbutyl (registered trademark) O”, “perbutyl (registered trademark) ND”, “perbutyl (registered trademark) Z”, “perbutyl (registered trademark) I”, “percumyl P", "Percumyl D", "Perhexyl (registered trademark) D", "Perhexyl (registered trademark) A", "Perhexyl (registered trademark) I", "Perhexyl (registered trademark) Z", " Perhexyl (registered trademark) ND", "Perhexyl (registered trademark) O", "Perhexyl (registered trademark) PV", "Perhexyl (registered trademark) O", etc. are mentioned.

(C) A polymerization initiator may be used individually by 1 type, and may be used combining two or more types by arbitrary ratios.

The amount of (C) polymerization initiator in the resin composition is preferably 0.01 mass % or more, more preferably 0.1 mass % or more, particularly preferably 0.3 mass % or more, with respect to 100 mass % of the nonvolatile component in the resin composition, Preferably it is 5 mass % or less, More preferably, it is 3 mass % or less, Especially preferably, it is 1 mass % or less. (C) When the quantity of a polymerization initiator exists in the said range, the effect of this invention can be acquired remarkably.

The amount of (C) polymerization initiator in the resin composition is preferably 0.1 mass % or more, more preferably 0.5 mass % or more, particularly preferably 1 mass % or more, with respect to 100 mass % of the resin component in the resin composition. Preferably it is 10 mass % or less, More preferably, it is 5 mass % or less, Especially preferably, it is 3 mass % or less. (C) When the quantity of a polymerization initiator exists in the said range, the effect of this invention can be acquired remarkably.

The amount of the polymerization initiator (C) in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more with respect to a total of 100% by mass of the maleimide compound (A) and the (B) radically polymerizable aromatic resin in the resin composition. It is mass % or more, Especially preferably, it is 1 mass % or more, Preferably it is 10 mass % or less, More preferably, it is 5 mass % or less, Especially preferably, it is 3 mass % or less. (C) When the quantity of a polymerization initiator exists in the said range, the effect of this invention can be acquired remarkably.

[5. (D) inorganic filler]

The resin composition may contain (D) inorganic filler further as an arbitrary component other than an above-described component. (D) The inorganic filler as a component is normally contained in a resin composition in the state of a particle.

(D) As a material of an inorganic filler, an inorganic compound can be used. (D) Examples of the inorganic filler material include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, hydroxide. Aluminum, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, and barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungsten phosphate. Among these, silica is particularly suitable. Examples of the silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Moreover, as a silica, spherical silica is preferable. (D) An inorganic filler may be used individually by 1 type, and may be used combining 2 or more types by arbitrary ratios.

(D) As a commercial item of an inorganic filler, "UFP-30" by a Denka Chemical Industry Co., Ltd. product, for example; "SP60-05", "SP507-05" manufactured by Shin-Nittetsu Sumikin Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", "YA010C" manufactured by Adomatex Corporation; "UFP-30" manufactured by Denka Corporation; "Silpil NSS-3N", "Silpil NSS-4N", and "Silpil NSS-5N" manufactured by Tokuyama Corporation; "SC2500SQ", "SO-C4", "SO-C2", "SO-C1" manufactured by Adomatex Corporation; "DAW-03", "FB-105FD" by Denka Corporation, etc. are mentioned.

(D) The average particle diameter of the inorganic filler is preferably 0.01 µm or more, more preferably 0.05 µm or more, particularly preferably 0.1 µm or more, and preferably 5 µm or more, from the viewpoint of significantly obtaining the effect of the present invention. It is micrometer or less, More preferably, it is 2 micrometers or less, More preferably, it is 1 micrometer or less. (D) The average particle diameter of an inorganic filler can be measured by the laser diffraction-scattering method based on the Mie scattering theory. Specifically, it can measure by creating the particle diameter distribution of an inorganic filler on a volume basis with a laser diffraction scattering type particle diameter distribution measuring apparatus, and making the median diameter into an average particle diameter. As the measurement sample, 100 mg of inorganic filler and 10 g of methyl ethyl ketone are weighed into a vial bottle and dispersed by ultrasonic waves for 10 minutes can be used. The measurement sample was measured using a laser diffraction particle size distribution analyzer, the light source wavelength was set to blue and red, the volume-based particle size distribution of the inorganic filler was measured by the Procell method, and the median diameter was obtained from the particle size distribution obtained. As a result, the average particle diameter can be calculated. As a laser diffraction type particle size distribution measuring apparatus, "LA-960" by Horibase Corporation etc. is mentioned, for example.

(D) the specific surface area of the inorganic filler is preferably 0.1 m 2 /g or more, more preferably 0.5 m 2 /g or more, still more preferably 1 m 2 /g or more, from the viewpoint of significantly obtaining the effect of the present invention; It is particularly preferably 3 m 2 /g or more, preferably 100 m 2 /g or less, more preferably 70 m 2 /g or less, still more preferably 50 m 2 /g or less, particularly preferably 40 m 2 /g or less. . The specific surface area of the inorganic filler is determined by adsorbing nitrogen gas to the sample surface using a BET fully automatic specific surface area measuring device (Macsorb HM-1210 manufactured by Mountec) according to the BET method, and calculating the specific surface area using the BET multi-point method. is obtained

(D) It is preferable that the inorganic filler is treated with a surface treatment agent from a viewpoint of improving moisture resistance and dispersibility. As the surface treatment agent, for example, a fluorine-containing silane coupling agent, an aminosilane-based coupling agent, an epoxysilane-based coupling agent, a mercaptosilane-based coupling agent, a silane-based coupling agent, an alkoxysilane, an organosilazane compound, a titanate-based coupler A ring agent etc. are mentioned. In addition, a surface treating agent may be used individually by 1 type, and may be used combining two or more types arbitrarily.

As a commercial item of a surface treatment agent, For example, "KBM-1003", "KBE-1003" (vinyl-based silane coupling agent) manufactured by Shin-Etsu Chemical Co., Ltd.; "KBM-303", "KBM-402", "KBM" -403", "KBE-402", "KBE-403" (epoxy-based silane coupling agent); "KBM-1403" (styryl-based silane coupling agent); "KBM-502", "KBM-503", "KBE" -502", "KBE-503" (methacrylic silane coupling agent); "KBE-5103" (acrylic silane coupling agent); "KBM-602", "KBM-603", "KBM-903", "KBE" -903", "KBE-9103P", "KBM-573", "KBM-575" (amino-based silane coupling agent); "KBM-9659" (isocyanurate-based silane coupling agent); "KBE-585" (Ureid-based silane coupling agent); “KBM-802”, “KBM-803” (mercapto-based silane coupling agent); “KBE-9007N” (isocyanate-based silane coupling agent); “X-12-967C” (acid) anhydride-based silane coupling agent); 「KBM-13」, 「KBM-22」, 「KBM-103」, 「KBE-13」, 「KBE-22」, 「KBE-103」, 「KBM-3033」, 「 KBE-3033”, “KBM-3063”, “KBE-3063”, “KBE-3083”, “KBM-3103C”, “KBM-3066”, “KBM-7103” (non-silane coupling-alkoxysilane compound), etc. can be heard

It is preferable that the grade of the surface treatment by a surface treatment agent falls within a predetermined range from a viewpoint of the dispersibility improvement of (D) inorganic filler. Specifically, (D) 100% by mass of the inorganic filler is preferably surface-treated with a surface treatment agent of 0.2 to 5% by mass, more preferably from 0.2 to 3% by mass, and 0.3 to 2% by mass %, it is more preferable that the surface is treated.

The grade of the surface treatment by a surface treating agent can be evaluated by the amount of carbon per unit surface area of (D) inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of the inorganic filler is preferably 0.02 mg/m 2 or more, more preferably 0.1 mg/m 2 or more, and still more preferably 0.2 mg/m 2 or more. On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition or melt viscosity in sheet form, 1.0 mg/m2 or less is preferable, 0.8 mg/m2 or less is more preferable, and 0.5 mg/m2 or less is still more preferable. .

(D) The amount of carbon per unit surface area of an inorganic filler can be measured, after washing-processing the inorganic filler after surface treatment with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler surface-treated with a surface treatment agent, followed by ultrasonic cleaning at 25°C for 5 minutes. After removing the supernatant and drying the nonvolatile components, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As a carbon analyzer, "EMIA-320V" manufactured by Horibase Corporation, etc. can be used.

The amount of the inorganic filler (D) in the resin composition is preferably 20% by mass or more, more preferably 30% by mass or more, still more preferably 40% by mass or more, with respect to 100% by mass of the nonvolatile component in the resin composition, particularly Preferably it is 50 mass % or more, Preferably it is 90 mass % or less, More preferably, it is 80 mass % or less, More preferably, it is 70 mass % or less. (D) When the quantity of an inorganic filler exists in the said range, the effect of this invention can be acquired remarkably.

(D) The amount of the specific maleimide compound (A-1) with respect to 100 mass % of the inorganic filler is preferably 5 mass % or more, more preferably 10 mass % or more, particularly preferably 20 mass % or more, preferably Preferably it is 60 mass % or less, More preferably, it is 50 mass % or less, Especially preferably, it is 40 mass % or less. When the amount of the inorganic filler (D) that satisfies such a relationship is used, the effect of the present invention can be remarkably obtained.

(D) The amount of the maleimide compound containing the structure represented by the formula (A1) relative to 100% by mass of the inorganic filler is preferably 5% by mass or more, more preferably 10% by mass or more, particularly preferably 20% by mass or more. and preferably 60 mass % or less, more preferably 50 mass % or less, and particularly preferably 40 mass % or less. When the amount of the inorganic filler (D) that satisfies such a relationship is used, the effect of the present invention can be remarkably obtained.

(D) The amount of the maleimide compound (A) with respect to 100 mass % of the inorganic filler is preferably 5 mass % or more, more preferably 10 mass % or more, particularly preferably 20 mass % or more, and preferably 60 It is mass % or less, More preferably, it is 50 mass % or less, Especially preferably, it is 40 mass % or less. When the amount of the inorganic filler (D) that satisfies such a relationship is used, the effect of the present invention can be remarkably obtained.

[6. (E) Thermoplastic resin]

The resin composition may further contain (E) a thermoplastic resin as an arbitrary component other than an above-described component.

(E) As a thermoplastic resin as a component, For example, phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone. Resin, polyphenylene ether resin, polycarbonate resin, polyether ether ketone resin, polyester resin, etc. are mentioned. Among these, a phenoxy resin is preferable from a viewpoint of acquiring the effect of this invention remarkably. In addition, a thermoplastic resin may be used individually by 1 type, or may be used in combination of 2 or more type.

Examples of the phenoxy resin include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenolacetphenone skeleton, novolak skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene. and phenoxy resins having at least one skeleton selected from the group consisting of skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton. Any functional group, such as a phenolic hydroxyl group and an epoxy group, may be sufficient as the terminal of a phenoxy resin.

Specific examples of the phenoxy resin include "1256" and "4250" manufactured by Mitsubishi Chemical (both are bisphenol A skeleton-containing phenoxy resins); "YX8100" manufactured by Mitsubishi Chemical (bisphenol S skeleton-containing phenoxy resin); "YX6954" manufactured by Mitsubishi Chemical (bisphenol acetphenone skeleton-containing phenoxy resin); "FX280" and "FX293" manufactured by Shin-Nittetsu Chemical Co., Ltd.; "YL7500VH30", "YX6954BH30", "YX7553", "YL7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290", "YL7482" and "YL7891BH30" manufactured by Mitsubishi Chemical; and the like.

As polyvinyl acetal resin, polyvinyl formal resin and polyvinyl butyral resin are mentioned, for example, Polyvinyl butyral resin is preferable. Specific examples of the polyvinyl acetal resin include "Denka Butyral 4000-2", "Denka Butyral 5000-A", "Denka Butyral 6000-C", "Denka Butyral 6000-EP" manufactured by Denki Chemical Co., Ltd. ; Sekisui Chemical Co., Ltd. S-Rec BH series, BX series (eg BX-5Z), KS series (eg KS-1), BL series, BM series; and the like.

Examples of the polyolefin resin include ethylene-based copolymer resins such as low-density polyethylene, ultra-low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer; Polyolefin type elastomers, such as a polypropylene and an ethylene-propylene block copolymer, etc. are mentioned.

As a specific example of polyimide resin, "Ricacoat SN20" and "Ricacoat PN20" by a Shin-Nippon Rica company are mentioned.

Specific examples of the polyamideimide resin include "Viromax HR11NN" and "Viromax HR16NN" manufactured by Toyobo Corporation. Specific examples of the polyamideimide resin include modified polyamideimides such as "KS9100" and "KS9300" (polyamideimide containing polysiloxane skeleton) manufactured by Hitachi Chemical.

Specific examples of the polyether sulfone resin include "PES5003P" manufactured by Sumitomo Chemical.

Specific examples of the polysulfone resin include polysulfone "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

Examples of the polyester resin include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, polytrimethylene terephthalate resin, polytrimethylene naphthalate resin, polycyclohexanedimethyl tere. A phthalate resin etc. are mentioned.

(E) The weight average molecular weight (Mw) of the thermoplastic resin is preferably 8,000 or more, more preferably 10,000 or more, particularly preferably 20,000 or more, and preferably 70,000 or more, from the viewpoint of significantly obtaining the effects of the present invention. or less, more preferably 60,000 or less, and particularly preferably 50,000 or less.

The amount of (E) thermoplastic resin in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, still more preferably 1% by mass or more, with respect to 100% by mass of the nonvolatile component in the resin composition, Preferably it is 10 mass % or less, More preferably, it is 8 mass % or less, More preferably, it is 6 mass % or less. (E) When the quantity of a thermoplastic resin exists in the said range, the effect of this invention can be acquired remarkably.

The amount of (E) thermoplastic resin in the resin composition is preferably 0.1% by mass or more, more preferably 1% by mass or more, still more preferably 2% by mass or more, with respect to 100% by mass of the resin component in the resin composition. Preferably it is 30 mass % or less, More preferably, it is 20 mass % or less, More preferably, it is 10 mass % or less. (When the amount of the E0 thermoplastic resin is within the above range, the effects of the present invention can be obtained remarkably.

[7. (F) Elastomer]

The resin composition may further contain the (F) elastomer as an arbitrary component other than an above-mentioned component. The elastomer as the component (F) is a resin having flexibility, preferably a resin having rubber elasticity or a resin showing rubber elasticity by polymerization with other components. Examples of the rubber elasticity include resins exhibiting an elastic modulus of 1 GPa or less when a tensile test is performed at a temperature of 25°C and a humidity of 40% RH in accordance with Japanese Industrial Standards (JIS K7161).

In one embodiment, (F) the elastomer is, in the molecule, a polybutadiene structure, a polysiloxane structure, a poly(meth)acrylate structure, a polyalkylene structure, a polyalkyleneoxy structure, a polyisoprene structure, a polyisobutylene It is preferable that it is resin which has 1 or more types of structures chosen from a structure, a polycarbonate structure, and a polystyrene structure. "(meth)acrylate" refers to a methacrylate and an acrylate.

Further, in another embodiment, (F) the elastomer is preferably at least one selected from a resin having a glass transition temperature (Tg) of 25° C. or less and a liquid resin at 25° C. or less. The glass transition temperature of resin whose glass transition temperature (Tg) is 25 degrees C or less becomes like this. Preferably it is 20 degrees C or less, More preferably, it is 15 degrees C or less. Although the lower limit of a glass transition temperature is not specifically limited, Usually, it can be made into -15 degreeC or more. Moreover, as resin which is liquid at 25 degreeC, Preferably it is resin which is liquid at 20 degrees C or less, More preferably, it is resin which is liquid at 15 degrees C or less. The glass transition temperature can be measured by DSC (Differential Scanning Calorimetry).

(F) An elastomer is an amorphous resin component which can melt|dissolve in the organic solvent normally. This (F) elastomer may be used individually by 1 type, and may be used combining two or more types by arbitrary ratios.

(F) As an elastomer, resin containing a polybutadiene structure is mentioned, for example. The polybutadiene structure may be contained in the main chain or may be contained in the side chain. In addition, a part or all of polybutadiene structure may be hydrogenated. A resin containing a polybutadiene structure is sometimes referred to as a "polybutadiene resin". Specific examples of the polybutadiene resin include "Ricon 130MA8", "Ricon 130MA13", "Ricon 130MA20", "Ricon 131MA5", "Ricon 131MA10", "Ricon 131MA17", "Ricon 131MA20", "Ricon" manufactured by Kureivare Co., Ltd. 184MA6" (polybutadiene containing an acid anhydride group), "GQ-1000" (polybutadiene introduced with hydroxyl groups and carboxyl groups) manufactured by Nippon Soda, "G-1000", "G-2000", "G-3000" (both terminals) Polybutadiene with hydroxyl groups), "GI-1000", "GI-2000", "GI-3000" (polybutadiene hydrogenated with hydroxyl groups at both ends), "FCA-061L" manufactured by Nagase Chemtex (Hydrogenated polybutadiene skeleton epoxy resin) , and the like. In addition, as a specific example of a polybutadiene resin, the linear polyimide using hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride as raw materials (Japanese Patent Application Laid-Open No. 2006-37083, International Publication No. 2008/153208) described polyimide), phenolic hydroxyl group-containing butadiene, and the like. The content rate of the butadiene structure of the said polyimide resin becomes like this. Preferably it is 60 mass % - 95 mass %, More preferably, they are 75 mass % - 85 mass %. For the detail of the said polyimide resin, description of Unexamined-Japanese-Patent No. 2006-37083 and International Publication No. 2008/153208 can be considered into consideration, and this content is taken in in this specification.

(F) As an elastomer, resin containing a poly(meth)acrylate structure is mentioned, for example. Resin containing a poly(meth)acrylate structure may be called "poly(meth)acrylate resin." As a specific example of a poly (meth)acrylic resin, "ME-2000", "W-116.3", "W-197C", "KG-25", "KG-25", "Teisan resin manufactured by Nagase Chemtex Co., Ltd." KG-3000" and the like.

(F) As an elastomer, resin containing a polycarbonate structure is mentioned, for example. A resin containing a polycarbonate structure is sometimes referred to as a "polycarbonate resin". Specific examples of the polycarbonate resin include "T6002", "T6001" (polycarbonate diol) manufactured by Asahi Kasei Chemicals, "C-1090", "C-2090", and "C-3090" (polycarbonate diol) manufactured by Kuraray. carbonate diol) and the like. Moreover, the linear polyimide which uses a hydroxyl-terminated polycarbonate, a diisocyanate compound, and a tetrabasic acid anhydride as raw materials can also be used. The content rate of the carbonate structure of the said polyimide resin becomes like this. Preferably it is 60 mass % - 95 mass %, More preferably, it is 75 mass % - 85 mass %. For the details of the polyimide resin, the description of International Publication No. 2016/129541 can be considered, and the content is incorporated herein.

(F) As an elastomer, resin containing a polysiloxane structure is mentioned, for example. A resin containing a polysiloxane structure is sometimes referred to as a "siloxane resin." As a specific example of a siloxane resin, "SMP-2006", "SMP-2003PGMEA", "SMP-5005PGMEA" manufactured by Shin-Etsu Silicone Co., Ltd., an amine group-terminated polysiloxane and a linear polyimide using a tetrabasic acid anhydride as raw materials (International Publication No. 2010) /053185, Japanese Unexamined Patent Publication No. 2002-12667, Japanese Unexamined Patent Publication No. 2000-319386, etc.).

(F) As an elastomer, resin containing a polyalkylene structure or a polyalkyleneoxy structure is mentioned, for example. Resin containing a polyalkylene structure may be called "alkylene resin." In addition, the resin containing a polyalkyleneoxy structure may be called "alkyleneoxy resin." The polyalkyleneoxy structure is preferably a polyalkyleneoxy structure having 2 to 15 carbon atoms, more preferably a polyalkyleneoxy structure having 3 to 10 carbon atoms, and a polyalkyleneoxy structure having 5 to 6 carbon atoms Especially preferred. Specific examples of the alkylene resin and the alkyleneoxy resin include "PTXG-1000" and "PTXG-1800" manufactured by Asahi Chemical Industries, Ltd.

(F) As an elastomer, resin which has a polyisoprene structure is mentioned, for example. A resin containing a polyisoprene structure is sometimes referred to as an "isoprene resin". Specific examples of the isoprene resin include "KL-610" and "KL613" manufactured by Kuraray.

(F) As an elastomer, resin containing a polyisobutylene structure is mentioned, for example. A resin containing a polyisobutylene structure is sometimes referred to as an "isobutylene resin". Specific examples of the isobutylene resin include "SIBSTAR-073T" (styrene-isobutylene-styrene triblock copolymer) and "SIBSTAR-042D" (styrene-isobutylene diblock copolymer) manufactured by Kaneka Corporation. can

(F) As an elastomer, resin containing a polystyrene structure is mentioned, for example. A resin containing a polystyrene structure is sometimes referred to as a "styrene resin". Examples of the styrene resin include styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-ethylene -propylene-styrene block copolymer (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymer (SEEPS), styrene-butadiene-butylene-styrene block copolymer (SBBS), styrene-butadiene diblock copolymer, A hydrogenated styrene-butadiene block copolymer, a hydrogenated styrene-isoprene block copolymer, a hydrogenated styrene-butadiene random copolymer, etc. are mentioned. Specific examples of the styrene resin include hydrogenated styrenic thermoplastic elastomers "H1041", "Taftek H1043", "Taftek P2000", and "Taftek MP10" (manufactured by Asahi Kasei Co., Ltd.); epoxidized styrene-butadiene thermoplastic elastomers "EpoFriend AT501" and "CT310" (manufactured by Daicel Corporation); Modified styrenic elastomer having a hydroxyl group &quot;Septon HG252&quot; (manufactured by Kuraray Co., Ltd.); A modified styrenic elastomer having a carboxyl group “Taftec N503M”, a modified styrenic elastomer having an amino group “Taftec N501”, a modified styrenic elastomer having an acid anhydride group “Taftec M1913” (manufactured by Asahi Kasei Chemicals) ; unmodified styrenic elastomer "Septon S8104" (manufactured by Kuraray); styrene-ethylene/butylene-styrene block copolymer "FG1924" (manufactured by Kraton); can be heard

(F) The number average molecular weight (Mn) of the elastomer is preferably 1,000 or more, more preferably 1500 or more, still more preferably 3000 or more, particularly preferably 5000 or more, preferably 1,000,000 or less, more preferably usually less than 900,000. A number average molecular weight (Mn) can be measured in polystyrene conversion using GPC (gel permeation chromatography).

The amount of the (F) elastomer in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, still more preferably 1% by mass or more, with respect to 100% by mass of the nonvolatile component in the resin composition, Preferably it is 10 mass % or less, More preferably, it is 8 mass % or less, More preferably, it is 6 mass % or less. (F) When the amount of the elastomer is within the above range, the effect of the present invention can be significantly obtained.

The amount of the (F) elastomer in the resin composition is preferably 0.1 mass % or more, more preferably 1 mass % or more, still more preferably 2 mass % or more, with respect to 100 mass % of the resin component in the resin composition. Preferably it is 30 mass % or less, More preferably, it is 20 mass % or less, More preferably, it is 10 mass % or less. (F) When the amount of the elastomer is within the above range, the effect of the present invention can be significantly obtained.

[8. (G) Solvent]

The resin composition may further contain the (G) solvent as an arbitrary component other than an above-described component. A solvent is a volatile component normally, and an organic solvent can be used. (G) As a solvent, For example, Ketone solvents, such as acetone, methyl ethyl ketone (MEK), and cyclohexanone; acetate ester solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; carbitol solvents such as cellosolve and butyl carbitol; aromatic hydrocarbon solvents such as toluene and xylene; amide solvents such as dimethylformamide, dimethylacetamide (DMAc) and N-methylpyrrolidone; and the like. (G) A solvent may be used individually by 1 type, and may be used in combination by 2 or more types of arbitrary ratios.

(G) The quantity of a solvent is not specifically limited. (G) The amount of the solvent is, for example, 60 mass % or less, 40 mass % or less, 30 mass % or less, 20 mass % or less, 15 mass % or less, 10 mass % with respect to 100 mass % of all components in the resin composition. The following may be the case.

[9. other ingredients]

The resin composition may contain further arbitrary additives as arbitrary components other than an above-described component. As such an additive, a thermosetting resin, an organic filler, a thickener, an antifoamer, a leveling agent, an adhesion-imparting agent, a flame retardant, etc. are mentioned, for example. These may be used individually by 1 type, and may be used combining two or more types by arbitrary ratios.

[10. Method for producing resin composition]

A resin composition can be manufactured by mixing an above-described component in arbitrary order, for example. In addition, in the process of mixing each component, you may perform heating and/or cooling by adjusting temperature suitably. Further, during or after mixing each component, stirring may be performed using a stirring device such as a mixer to uniformly disperse each component. Moreover, you may perform a defoaming process to a resin composition as needed.

[11. Characteristics of the resin composition]

According to the above-described resin composition, an insulating layer having a low dielectric loss tangent and excellent adhesion strength with the conductor layer can be obtained.

Specifically, the cured product obtained by curing the above-described resin composition may have a low dielectric loss tangent. Accordingly, when an insulating layer is formed from this cured product, an insulating layer having a low dielectric loss tangent can be obtained. For example, the dielectric loss tangent (Df) of the cured product obtained by curing the resin composition under the conditions described in Examples to be described later is preferably 0.010 or less, more preferably 0.005 or less, still more preferably 0.004 or less, particularly preferably is less than or equal to 0.003. The lower limit of the dielectric loss tangent (Df) of the cured product is not particularly limited, but may be 0.001 or more. The dielectric loss tangent of hardened|cured material can be measured by the method demonstrated in an Example.

Moreover, when an insulating layer is formed from the hardened|cured material of a resin composition, and the conductor layer is formed by plating on the insulating layer, the plating peeling strength as adhesive strength between an insulating layer and a conductor layer can be made high. For example, when the insulating layer and the conductor layer are formed by the method described in Examples to be described later, the plating peel strength between the insulating layer and the conductor layer is preferably 0.2 kgf/cm or more, more preferably 0.3 kgf/cm or more, particularly preferably 0.4 kgf/cm or more. Although the upper limit of plating peeling strength is not specifically limited, For example, it may be 2.0 kgf/cm or less. The plating peeling strength between an insulating layer and a conductor layer can be measured by the method demonstrated in an Example.

The cured product of the resin composition may usually have a small dielectric constant. For example, the dielectric constant (Dk) of the cured product obtained by curing the resin composition under the conditions described in Examples to be described later is preferably 3.5 or less, more preferably 3.2 or less, and particularly preferably 3.0 or less. The lower limit of the dielectric constant of the cured product is not particularly limited, but may be, for example, 2.0 or more. The dielectric constant of hardened|cured material can be measured by the method demonstrated in an Example.

When an insulating layer is formed from the hardened|cured material of a resin composition, the surface roughness after the roughening process of the insulating layer can be made small normally. For example, when the insulating layer is formed and roughened by the method described in Examples to be described later, the arithmetic mean roughness (Ra) of the surface of the insulating layer is preferably 200 nm or less, more preferably 150 nm. or less, particularly preferably 100 nm or less. Although the lower limit of the arithmetic mean roughness Ra is not specifically limited, For example, it may be 10 nm or more. The arithmetic mean roughness Ra of the surface of an insulating layer can be measured by the method demonstrated in an Example.

[12. Use of resin composition]

The resin composition which concerns on one Embodiment of this invention is suitable as a resin composition for insulation use, and especially, it is especially suitable as a resin composition for insulation layer formation. Therefore, for example, a resin composition is suitable as a resin composition for forming the insulating layer of a printed wiring board (resin composition for insulating layer formation of a printed wiring board). In addition, the resin composition is suitable as a resin composition (resin composition for forming an insulating layer for forming a conductor layer) for forming the insulating layer for forming a conductor layer (including a rewiring layer) formed on the insulating layer. . The resin composition is also widely used in applications in which the resin composition can be used, such as a resin sheet, a sheet-like laminated material such as a prepreg, a solder resist, an underfill material, a die bonding material, a semiconductor encapsulant, a hole filling resin, a component filling resin, and the like. Can be used.

Further, for example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition according to the present embodiment is used to form a redistribution forming layer as an insulating layer for forming a redistribution layer. It is suitable also as a resin composition (resin composition for rewiring forming layer formation) for this purpose, and a resin composition (resin composition for semiconductor chip sealing) for sealing a semiconductor chip. When a semiconductor chip package is manufactured, a redistribution layer may be further formed on the encapsulation layer.

(1) the step of laminating a temporarily fixed film on the substrate,

(2) the step of temporarily fixing the semiconductor chip on the temporarily fixing film,

(3) forming an encapsulation layer on the semiconductor chip;

(4) the step of peeling the substrate and the temporarily fixed film from the semiconductor chip,

(5) a step of forming a rewiring forming layer as an insulating layer on the surface where the substrate and the temporarily fixed film of the semiconductor chip are peeled; and

(6) Step of forming a redistribution layer as a conductor layer on the redistribution forming layer

Said resin composition can be used also when a printed wiring board is a component built-in circuit board.

[13. Sheet-like laminated material]

Although the resin composition according to one embodiment of the present invention may be applied in a varnish state and used, industrially, it is preferably used in the form of a sheet-like laminate material containing the resin composition. As a sheet-like laminated material, the resin sheet and prepreg shown below are preferable.

A resin sheet contains a support body and the resin composition layer formed from the above-mentioned resin composition on this support body.

The thickness of the resin composition layer is preferably 50 µm or less, more preferably 40 µm or less, from the viewpoint of reducing the thickness of the printed wiring board and providing a cured product excellent in insulation even if the cured product of the resin composition is a thin film; More preferably, it is 30 micrometers or less. Although the lower limit of the thickness of a resin composition layer is not specifically limited, For example, 3 micrometers or more, 5 micrometers or more may be sufficient.

As a support body, the film which consists of a plastic material, metal foil, and a release paper are mentioned, for example, The film which consists of a plastic material, and metal foil are preferable.

When a film made of a plastic material is used as the support, the plastic material is, for example, polyethylene terephthalate (hereinafter, may be abbreviated as "PET"), polyethylene naphthalate (hereinafter may be abbreviated as "PEN"). Polyester such as polyester, polycarbonate (hereinafter sometimes abbreviated as “PC”), acrylic such as polymethyl methacrylate (PMMA), cyclic polyolefin, triacetyl cellulose (TAC), polyether sulfide ( PES), polyether ketone, polyimide, etc. are mentioned. Among these, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable.

When using metal foil as a support body, as metal foil, copper foil, aluminum foil, etc. are mentioned, for example, Copper foil is preferable. As the copper foil, a foil made of a single metal of copper may be used, or a foil made of an alloy of copper and another metal (eg, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) is used. also good

A support body may apply surface treatment, such as a mat treatment, a corona treatment, an antistatic treatment, to the surface to join with the resin composition layer.

Moreover, as a support body, you may use the support body with a mold release layer which has a mold release layer on the surface to join with the resin composition layer. As a mold release agent used for the mold release layer of a support body with a mold release layer, 1 or more types of mold release agents are mentioned from the group which consists of an alkyd resin, a polyolefin resin, a urethane resin, and a silicone resin, for example. The support with a release layer may use a commercial item, for example, "SK-1", "AL-5", "AL-" manufactured by Lintec which is a PET film which has a release layer which has an alkyd resin type mold release agent as a main component. 7", "Lumira T60" manufactured by Tore Corporation, "Purex" manufactured by Teijin Corporation, and "UNIFIEL" manufactured by UNITICA.

Although the thickness of a support body is not specifically limited, The range of 5 micrometers - 75 micrometers is preferable, and the range of 10 micrometers - 60 micrometers is more preferable. Moreover, when using a support body with a mold release layer, it is preferable that the thickness of the whole support body with a mold release layer is the said range.

In one embodiment, the resin sheet may further contain arbitrary layers as needed. As such an arbitrary layer, the protective film according to the support body etc. provided in the surface which is not joined to the support body of a resin composition layer (namely, the surface on the opposite side to a support body), etc. are mentioned, for example. Although the thickness of a protective film is not specifically limited, For example, they are 1 micrometer - 40 micrometers. By laminating|stacking a protective film, adhesion of dust, etc. to the surface of a resin composition layer, and a flaw can be suppressed.

A resin sheet is prepared by, for example, preparing a resin varnish in which a resin composition is dissolved in a solvent, applying this resin varnish on a support using a coating device such as a die coater, and drying again to form a resin composition layer. can As a solvent, the thing similar to what was demonstrated as (G)component which a resin composition can contain is mentioned, for example. A solvent may be used individually by 1 type, and may be used combining two or more types by arbitrary ratios.

What is necessary is just to perform drying by methods, such as heating and hot-air spraying. Although drying conditions are not specifically limited, Content of the organic solvent in a resin composition layer is 10 mass % or less, Preferably it is made to dry so that it may become 5 mass % or less. Although it also changes depending on the boiling point of the organic solvent in the resin varnish, for example, when using a resin varnish containing 30% by mass to 60% by mass of an organic solvent, by drying at 50°C to 150°C for 1 minute to 10 minutes, A resin composition layer can be formed.

The resin sheet can be wound and stored in roll shape. When a resin sheet has a protective film, it becomes usable by peeling a protective film.

In one embodiment, the prepreg is formed by impregnating a sheet-like fiber base with a resin composition.

The sheet-like fiber base material used for a prepreg is not specifically limited, For example, glass cloth, an aramid nonwoven fabric, liquid crystal polymer nonwoven fabric, etc. are mentioned. From a viewpoint of thickness reduction of a printed wiring board, the thickness of a sheet-like fiber base material becomes like this. Preferably it is 50 micrometers or less, More preferably, it is 40 micrometers or less, More preferably, it is 30 micrometers or less, Especially preferably, it is 20 micrometers or less. Although the lower limit of the thickness of a sheet-like fiber base material is not specifically limited, Usually, it is 10 micrometers or more.

A prepreg can be manufactured by well-known methods, such as a hot melt method and a solvent method.

The thickness of the prepreg may be in the same range as the resin composition layer in the resin sheet.

[14. printed wiring board]

A printed wiring board according to an embodiment of the present invention includes an insulating layer formed of a cured product obtained by curing the above-described resin composition.

A printed wiring board can be manufactured by the method including the process of following (I) and (II) using said resin sheet, for example.

(I) Step of laminating a resin sheet on the inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate

(II) Step of curing the resin composition layer to form an insulating layer

The "inner-layer substrate" used in step (I) is a member used as a substrate for a printed wiring board, for example, a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene. An ether substrate etc. are mentioned. In addition, the said board|substrate may have a conductor layer on the single side|surface or both surfaces, and this conductor layer may be pattern-processed. An inner-layer substrate in which a conductor layer is formed on one or both surfaces of the substrate is sometimes referred to as an "inner-layer circuit board". In addition, when manufacturing a printed wiring board, an intermediate product in which an insulating layer and/or a conductor layer should be further formed is also included in the "inner-layer substrate". When a printed wiring board is a component-embedded circuit board, you may use the inner-layer board which incorporated components.

Lamination of the inner layer substrate and the resin sheet can be performed, for example, by heat-compressing the resin sheet to the inner layer substrate from the support side. As a member (hereinafter also referred to as a "thermal compression member") for heat-bonding the resin sheet to the inner layer substrate, a heated metal plate (SUS head plate, etc.) or a metal roll (SUS roll or the like) is exemplified. In addition, it is preferable to press through an elastic material, such as a heat-resistant rubber, so that the resin sheet may fully harvest the surface unevenness|corrugation of an inner-layer board|substrate, rather than directly pressing a thermocompression-compression-bonding member to a resin sheet.

What is necessary is just to perform lamination|stacking of an inner-layer board|substrate and a resin sheet by the vacuum lamination method. In the vacuum lamination method, the thermocompression compression temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C, and the thermocompression compression pressure is preferably 0.098 MPa to 1.77 MPa, more preferably is in the range of 0.29 MPa to 1.47 MPa, and the heat compression time is preferably in the range of 20 seconds to 400 seconds, and more preferably in the range of 30 seconds to 300 seconds. Lamination can be preferably carried out under reduced pressure conditions of a pressure of 26.7 hPa or less.

Lamination can be performed by a commercially available vacuum laminator. As a commercially available vacuum laminator, a vacuum pressurization laminator by the Meiki Sesakusho company, a vacuum applicator by a Nikko Materials company, a batch type vacuum pressurization laminator etc. are mentioned, for example.

After lamination, a smoothing treatment of the laminated resin sheet may be performed under atmospheric pressure, for example, by pressing the thermocompression-bonding member from the support side. The press conditions of the smoothing process can be made into the same conditions as the thermocompression-bonding conditions of the said lamination|stacking. A smoothing process can be performed with a commercially available laminator. In addition, you may perform lamination|stacking and a smoothing process continuously using said commercially available vacuum laminator.

The support may be removed between the steps (I) and (II), or after the step (II).

In a process (II), the resin composition layer is hardened|cured and the insulating layer which consists of a hardened|cured material of a resin composition is formed. The curing conditions of the resin composition layer are not particularly limited, and the conditions employed when forming the insulating layer of the printed wiring board may be used. Although you may harden a resin composition layer by irradiation of active energy rays, such as an ultraviolet-ray, it is made to thermoset by heating normally.

For example, although the thermosetting conditions of a resin composition layer also change with the kind of resin composition, in one embodiment, a curing temperature becomes like this. Preferably it is 120 degreeC - 240 degreeC, More preferably, it is 150 degreeC - 220 degreeC , more preferably from 170°C to 210°C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, still more preferably 15 minutes to 100 minutes.

Before thermosetting a resin composition layer, you may preheat a resin composition layer to temperature lower than hardening temperature. For example, prior to thermosetting the resin composition layer, at a temperature of 50 ° C. to 120 ° C., preferably 60 ° C. to 115 ° C., more preferably 70 ° C. to 110 ° C., for 5 minutes or more, Preferably, you may preheat for 5 minutes - 150 minutes, More preferably, it is 15 minutes - 120 minutes, More preferably, it is 15 minutes - 100 minutes.

The method of manufacturing a printed wiring board may further include (III) the process of drilling into an insulating layer, (IV) the process of roughening an insulating layer, and (V) the process of forming a conductor layer. When the support is removed after the step (II), the support is removed between the steps (II) and (III), between the steps (III) and (IV), or between the steps (IV) and (V). It is good to do it in If necessary, the formation of the insulating layer and the conductor layer in the steps (I) to (V) may be repeated to form a multilayer wiring board.

In another embodiment, a printed wiring board can be manufactured using said prepreg. The manufacturing method is basically the same as in the case of using a resin sheet.

Step (III) is a step of drilling holes in the insulating layer, whereby holes such as via holes and through holes can be formed in the insulating layer. What is necessary is just to implement process (III) using a drill, a laser, plasma etc. according to the composition of the resin composition used for formation of an insulating layer, for example. What is necessary is just to determine the dimension and shape of a hole suitably according to the design of a printed wiring board.

Process (IV) is a process of roughening an insulating layer. Usually, in this process (IV), smear removal is also performed. The procedure and conditions of a roughening process are not specifically limited. For example, the insulating layer can be roughened by performing the swelling process by a swelling liquid, the roughening process by an oxidizing agent, and the neutralization process by a neutralizing liquid in this order.

As a swelling liquid used for a roughening process, an alkali solution, surfactant solution, etc. are mentioned, for example, Preferably, it is an alkali solution. As an alkali solution, sodium hydroxide solution and potassium hydroxide solution are more preferable. As a commercially available swelling liquid, "Swelling Deep Securigansu P", "Swelling Deep Securigansu SBU" manufactured by Atotech Japan, etc. are mentioned, for example. The swelling treatment by the swelling liquid is not particularly limited, and for example, it can be performed by immersing the insulating layer in a swelling liquid at 30°C to 90°C for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling solution at 40°C to 80°C for 5 minutes to 15 minutes.

As an oxidizing agent used for a roughening process, the alkaline permanganic acid solution which melt|dissolved potassium permanganate or sodium permanganate in the aqueous solution of sodium hydroxide is mentioned, for example. The roughening treatment with an oxidizing agent such as an alkaline permanganic acid solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 minutes to 30 minutes. Moreover, as for the density|concentration of the permanganate in an alkaline permanganic acid solution, 5 mass % - 10 mass % are preferable. As a commercially available oxidizing agent, alkaline permanganic acid solutions, such as "Concentrate Compact CP" and "Dosing Solution Securiganth P" by Atotech Japan, are mentioned, for example.

As a neutralizing liquid used for a roughening process, an acidic aqueous solution is preferable, and as a commercial item, "Reduction Solution Secure P" by Atotech Japan company is mentioned, for example. The treatment with the neutralizing solution can be performed by immersing the treated surface subjected to the roughening treatment with the oxidizing agent in a neutralizing solution at 30°C to 80°C for 5 minutes to 30 minutes. The method of immersing the target object in which the roughening process by an oxidizing agent was made|formed from points, such as workability|operativity, in the neutralization liquid of 40 degreeC - 70 degreeC for 5 minutes - 20 minutes is preferable.

In one embodiment, arithmetic mean roughness Ra of the insulating layer surface after a roughening process becomes like this. Preferably it is 500 nm or less, More preferably, it is 400 nm or less, More preferably, it is 300 nm or less. The lower limit is not particularly limited, and may be, for example, 1 nm or more, 2 nm or more, and the like. Moreover, the root mean square roughness (Rq) of the insulating layer surface after roughening becomes like this. Preferably it is 500 nm or less, More preferably, it is 400 nm or less, More preferably, it is 300 nm or less. It does not specifically limit about a lower limit, For example, it can be set as 1 nm or more, 2 nm or more, etc. The arithmetic mean roughness (Ra) and the root mean square roughness (Rq) of the surface of the insulating layer can be measured using a non-contact type surface roughness meter.

A process (V) is a process of forming a conductor layer, and forms a conductor layer on an insulating layer. The conductor material used for a conductor layer is not specifically limited. In a suitable embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. do. The conductor layer may be a single metal layer or an alloy layer, and the alloy layer is, for example, an alloy of two or more metals selected from the group described above (eg, a nickel-chromium alloy, a copper-nickel alloy, and a copper-titanium alloy). ) can be mentioned. Among these, from the viewpoint of versatility of conductor layer formation, cost, ease of patterning, etc., a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or a nickel-chromium alloy, a copper-nickel alloy , a copper/titanium alloy alloy layer is preferable, and a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or an alloy layer of a nickel/chromium alloy is more preferable, and a single metal layer of copper This is more preferable.

A single-layer structure may be sufficient as a conductor layer, and the multilayer structure in which the single-metal layer or alloy layer which consists of different types of metals or alloys was laminated|stacked may be sufficient as it. When the conductor layer has a multilayer structure, it is preferable that the layer in contact with the insulating layer is a single metal layer of chromium, zinc or titanium, or an alloy layer of a nickel-chromium alloy.

Although the thickness of a conductor layer changes with the design of a desired printed wiring board, it is 3 micrometers - 35 micrometers generally, Preferably it is 5 micrometers - 30 micrometers.

The conductor layer is preferably formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating on the surface of the insulating layer by a method such as a semiadditive method or a positive additive method. It is preferable to form by a semiadditive method from a viewpoint of manufacturing simplicity. Hereinafter, an example in which the conductor layer is formed by a semi-additive method is shown.

A plating seed layer is formed on the surface of the insulating layer by electroless plating. Then, on the formed plating seed layer, a mask pattern for exposing a portion of the plating seed layer corresponding to a desired wiring pattern is formed. After forming a metal layer by electrolytic plating on the exposed plating seed layer, the mask pattern is removed. Thereafter, the unnecessary plating seed layer is removed by etching or the like to form a conductor layer having a desired wiring pattern.

[15. semiconductor device]

A semiconductor device according to an embodiment of the present invention includes the above-described printed wiring board. This semiconductor device can be manufactured using said printed wiring board.

Examples of the semiconductor device include various semiconductor devices provided for electric appliances (eg, computers, mobile phones, digital cameras, televisions, etc.) and vehicles (eg, motorcycles, automobiles, trams, ships, and aircraft). have.

[Example]

Hereinafter, the present invention will be specifically described with reference to Examples. However, the present invention is not limited to the following examples. In the following description, "parts" and "%" indicating quantities mean "parts by mass" and "% by mass", respectively, unless otherwise specified. In addition, the operation demonstrated below was performed in the environment of normal temperature and normal pressure, unless otherwise indicated.

[Preparation of maleimide compound]

A MEK solution (70% by mass of nonvolatile components) of _{the maleimide compound (A 1} ) synthesized by the method described in Synthesis Example 1 of Invention Association Publication No. 2020-500211 was prepared. This maleimide compound (A ₁ ) has a structure represented by the following general formula.

Maleimide Compound A ₁

When the FD-MS spectrum of the maleimide compound (A ₁ ) is measured, the peaks of M+=560,718 and 876 are confirmed. These peaks _{correspond to the case where n 1} is 0, 1, and 2, respectively. Further, when the maleimide compound (A ₁ ) is analyzed by GPC and _{the value of the number of repeating units (n 1} ) of the indane skeleton moiety is calculated based on the number average molecular weight, n ₁ =1.47, and the molecular weight distribution (Mw/Mn) ) = 1.81. Further, the content of the maleimide compound (A ₁₎ of the total amount of 100% by area, the average number of repeat units (n ₁₎ a zero-maleimide compound, was 26.5% by area.

FD-MS spectrum of a maleimide compound (A ₁₎ of the can, indicating that the measurement by the measuring device and measuring conditions.

(FD-MS spectrum measurement device and measurement conditions)

Measuring device: JMS-T100GC AccuTOF

Measuring conditions

Measuring range: m/z=4.00 to 2000.00

Rate of change: 51.2mA/min

Final current value: 45mA

Cathode voltage: -10kV

Logging Interval: 0.07sec

GPC of the maleimide compound (A ₁₎ of said indicates that measured by the measuring device and measuring conditions.

Measuring device: "HLC-8320 GPC" manufactured by Tosoh Corporation

Column: Guard column "HXL-L" manufactured by Tosoh Corporation, "TSK-GEL G2000HXL" manufactured by Tosoh Corporation, "TSK-GEL G2000HXL" manufactured by Tosoh Corporation, "TSK-GEL G3000HXL" manufactured by Toso Corporation, "TSK-GEL G3000HXL" manufactured by Tosoh Corporation. GEL G4000HXL”

Detector: RI (Differential Refractometer)

Data processing: "GPC Workstation EcoSEC-WorkStation" manufactured by Tosoh Corporation

Measurement conditions: Column temperature 40°C

Developing solvent tetrahydrofuran

Flow rate 1.0ml/min

Standard: Monodisperse polystyrene of known molecular weight is used in accordance with the measurement manual of the above "GPC Workstation EcoSEC-WorkStation".

Sample: What filtered the 1.0 mass % tetrahydrofuran solution in conversion of the nonvolatile component of a maleimide compound with a microfilter (50 microliters).

The molecular weight distribution (weight average molecular weight (Mw)/number average molecular weight (Mn)) of the maleimide compound (A _{1 ), and the average number of repeating units contributing to the indane skeleton in the maleimide compound “n 1} ” are the above GPC What was computed from the GPC chart obtained by a measurement is shown. In addition, the average repeating unit number "n _1" indicates that the calculated, based on the number average molecular weight (Mn). Specifically, _{for the compound in which n 1} is 0 to 4, the theoretical molecular weight and the actual molecular weight in GPC are plotted on the scatter plot, and an approximate straight line is drawn. And finding a number average molecular weight (Mn) from the measured value points (Mn) (1) is shown on a straight line, and also output the "n _1" that the average repeating unit. In addition, based on a result of GPC measurement, the maleimide compound in the amount of 100% by area, the average number of repeat units (n ₁₎ is 0. The content of the maleimide compound (area%) of (A ₁₎ a, is calculated. For details, reference may be made to Invention Association Publication No. 2020-500211.

[Example 1]

Wherein the maleimide compound (A ₁₎ (a solution of 70% by mass non-volatile component), 20 parts of a radical polymerizable aromatic resin (Mitsubishi gas is flexors manufacture "OPE-2St", number average molecular weight of 1,200, a non-volatile content of 65% by weight toluene solution) of 20 parts, polymerization initiator (peroxide "Perbutyl (registered trademark) C" manufactured by Nichiyu Corporation) 0.5 parts, inorganic filler (amine-based alkoxysilane compound ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.)) 50 parts of spherical silica ("SO-C2" manufactured by Adomatex Corporation, average particle diameter 0.5 µm, specific surface area 5.8 m 2 /g), and ester-type phenoxy resin (“YL7891BH30” manufactured by Mitsubishi Chemical Corporation, solid content 30 mass % MEK and 1:1 solution of cyclohexanone) 10 parts were mixed and uniformly dispersed using a high-speed rotary mixer to obtain a resin varnish.

As a support body, the polyethylene terephthalate film ("AL5" manufactured by Lintec, 38 µm in thickness) provided with a release layer was prepared. On the release layer of this support body, the said resin varnish was apply|coated uniformly so that the thickness of the resin composition layer after drying might be set to 40 micrometers. Then, the resin varnish was dried at 80 degreeC - 100 degreeC (average 90 degreeC) for 4 minutes, and the resin sheet containing a support body and a resin composition layer was obtained.

[Example 2]

As a radically polymerizable aromatic resin, instead of "OPE-2St" manufactured by Mitsubishi Gas Chemical, "ODV-XET(X04)" manufactured by Nittetsu Chemical & Materials (weight average molecular weight 3110, vinyl equivalent 380 g/eq., 65 mass % solution) 20 parts were used. Except for the above, a resin varnish and a resin sheet were prepared in the same manner as in Example 1.

[Example 3]

As a radically polymerizable aromatic resin, 20 parts of "SA9000-111" (number average molecular weight 1850-1950) by SABIC was used instead of "OPE-2St" by Mitsubishi Gas Chemical. Except for the above, a resin varnish and a resin sheet were prepared in the same manner as in Example 1.

[Example 4]

The quantity of the maleimide compound (A ₁ ) (solution of 70 mass % of nonvolatile components) was changed into 15 parts from 20 parts. Further, to the resin composition, 5 parts of a biphenyl aralkyl maleimide compound ("MIR-3000-70MT" manufactured by Nihon Kayaku Co., Ltd., maleimide group equivalent: 275 g/eq., MEK/toluene mixed solution containing 70% of non-volatile content) added. Except for the above, in the same manner as in Example 1, a resin varnish and a resin sheet were prepared.

[Example 5]

The amount of the maleimide compound (A ₁₎ (a solution of 70% by mass non-volatile component) was changed from 20 parts 18 parts. Furthermore, 2 parts of a liquid aliphatic maleimide compound ("BMI-1500" by Designer Molecules, maleimide group equivalent 750 g/eq.) was added to the resin composition. Except for the above, in the same manner as in Example 1, a resin varnish and a resin sheet were prepared.

[Example 6]

Instead of 10 parts of an ester-type phenoxy resin (“YL7891BH30” manufactured by Mitsubishi Chemical, a 1:1 solution of MEK having a solid content of 30% by mass and cyclohexanone), an elastomer (styrene-ethylene/butylene-styrene block manufactured by Kraton) 3 parts of copolymer "FG1924") was used. Except for the above, a resin varnish and a resin sheet were prepared in the same manner as in Example 1.

[Comparative Example 1]

The maleimide compound (A ₁ ) (solution of 70 mass % of non-volatile components) was not used. Moreover, the quantity of the radically polymerizable aromatic resin ("OPE-2St" by Mitsubishi Gas Chemicals, toluene solution of 65 mass % of non-volatile matter) was changed from 20 parts to 40 parts. Except for the above, in the same manner as in Example 1, a resin varnish and a resin sheet were prepared.

[Comparative Example 2]

The maleimide compound (A ₁ ) (solution of 70 mass % of non-volatile components) was not used. Further, as a radically polymerizable aromatic resin, instead of "OPE-2St" manufactured by Mitsubishi Gas Chemical, "ODV-XET(X04)" manufactured by Nittetsu Chemical & Materials (weight average molecular weight 3110, vinyl equivalent weight 380 g/eq) ., 65 mass % solution) 40 parts were used. Except for the above, in the same manner as in Example 1, a resin varnish and a resin sheet were prepared.

[Comparative Example 3]

The maleimide compound (A ₁ ) (solution of 70 mass % of non-volatile components) was not used. In addition, 40 parts of "SA9000-111" (number average molecular weight 1850-1950) by SABIC was used instead of "OPE-2St" by Mitsubishi Gas Chemicals as a radically polymerizable aromatic resin. Except for the above, in the same manner as in Example 1, a resin varnish and a resin sheet were prepared.

[Comparative Example 4]

Instead of the maleimide compound (A ₁ ), a biphenyl aralkyl-type maleimide compound ("MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., maleimide group equivalent: 275 g/eq., MEK/toluene mixed solution of 70% nonvolatile matter ) 20 parts were used. Except for the above, in the same manner as in Example 1, a resin varnish and a resin sheet were prepared.

[Measurement of dielectric properties]

The resin sheet produced by the Example and the comparative example was heated at 200 degreeC for 90 minute(s), and the resin composition layer was thermosetted. Then, the support body was peeled, and the hardened|cured material of the resin composition was obtained. This cured product was cut into a test piece having a width of 2 mm and a length of 80 mm. Regarding the test piece, the dielectric constant (Dk) and dielectric loss tangent (Df) were measured at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C by the cavity resonance perturbation method using "HP8362B" manufactured by Agilent Technologies. Measurements were performed on three test pieces, and the average value is shown in the table below.

[Measurement of plating peel strength]

(1) Underlying treatment of inner-layer circuit board:

As an inner-layer circuit board, a glass cloth-based epoxy resin double-sided copper clad laminate (copper foil thickness 18 µm, substrate thickness 0.4 mm, "R1515A" manufactured by Panasonic Corporation) having inner layer circuits (copper foil) on both sides was prepared. Both surfaces of this inner-layer circuit board were etched by 1 µm with "CZ8101" manufactured by plating company, and the copper surface was roughened.

(2) Lamination of resin sheet:

The resin sheet was laminated on both surfaces of the inner-layer circuit board using a batch vacuum pressurized laminator (manufactured by Nikko Materials Co., Ltd., two-stage build-up laminator, CVP700). This lamination was performed so that the resin composition layer of a resin sheet might contact an inner-layer circuit board. In addition, this lamination was performed by pressure-reducing for 30 second, making the atmospheric pressure 13 hPa or less, and crimping|bonding for 45 second at 130 degreeC and pressure 0.7 Mpa. Then, hot pressing was performed at 120° C. and a pressure of 0.5 MPa for 75 seconds.

(3) curing of the resin composition:

The laminated resin sheet and inner-layer circuit board were heated at 130°C for 30 minutes, and then heated at 170°C for 30 minutes to cure the resin composition to form an insulating layer. Then, the support body was peeled, and the laminated board provided with an insulating layer, an inner-layer circuit board, and an insulating layer in this order was obtained.

(4) Harmonization treatment:

The above laminated substrate was immersed in a swelling solution (Swelling Dip Securigant P (glycol ether, aqueous sodium hydroxide solution) manufactured by Atotech Japan containing diethylene glycol monobutyl ether) at 60° C. for 10 minutes. . Next, the laminate substrate, roughening solution (Atotech Concentrate and compact P (KMn0 ₄ in Japan, manufactured by: 60g / L, NaOH:. , Was immersed in 80 ℃ 20 minutes in an aqueous solution of 40g / L) after that, The laminated substrate was immersed in a neutralizing solution (Atotech Japan Co., Ltd. Reduction Soleucine Securigant P (aqueous solution of sulfuric acid)) for 5 minutes at 40° C. Then, the laminated substrate was dried at 80° C. for 30 minutes. and "evaluation substrate A" was obtained.

(5) Plating by semi-additive method:

The evaluation substrate (A) was _{immersed in a solution for electroless plating containing PdCl 2} at 40°C for 5 minutes, and then immersed in an electroless copper plating solution at 25°C for 20 minutes. Then, it heated at 150 degreeC for 30 minutes, and performed annealing treatment. After that, an etching resist was formed, and pattern formation by etching was performed. Thereafter, copper sulfate electroplating was performed to form a conductor layer to a thickness of 20 µm. Next, annealing treatment was performed at 200 DEG C for 60 minutes to obtain &quot;evaluation substrate B&quot;.

(6) Measurement of plating peel strength:

In the conductor layer of the evaluation substrate B, a notch surrounding a rectangular portion having a width of 10 mm and a length of 100 mm was formed. One end of the rectangular part was peeled off and picked up with tongs (manufactured by T.S. Co., Ltd., Autocom-type testing machine "AC-50C-SL"). Using tongs, the above rectangular portion was pulled off in the vertical direction at a rate of 50 mm/min at room temperature with tongs, and the load (kgf/cm) when 35 mm was pulled off was measured as the plating peel strength.

[Measurement of surface roughness (Ra)]

The arithmetic mean roughness (Ra) of the surface of the insulating layer of the evaluation substrate (A) produced in the above [Measurement of plating peel strength] was measured. The measurement was measured using a non-contact type surface roughness meter (WYKO NT3300 manufactured by BCoin Instruments) in VSI mode and a 50x lens with a measurement range of 121 µm × 92 µm. This measurement was performed at 10 measurement points, and the average value was described in the following table|surface.

[result]

The results of Examples and Comparative Examples are shown in Table 1 below.

Claims (13)

(A) a maleimide compound, and (B) a resin containing an aromatic ring and a radically polymerizable unsaturated group,
(A) The resin composition in which a maleimide compound contains the maleimide compound containing (A-1) trimethylindane skeleton. The resin composition according to claim 1, wherein the component (A-1) contains a structure represented by the following formula (A4).
Formula A4

In the formula A4,
Ar ^a1 represents a divalent aromatic hydrocarbon group which may have a substituent;
R ^a1 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryl having 6 to 10 carbon atoms an oxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group;
R ^a2 is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryl having 6 to 10 carbon atoms an oxy group, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group;
R ^a3 each independently represents a divalent aliphatic hydrocarbon group;
n _a1 represents a positive integer;
n _a2 each independently represents an integer of 0 to 4;
n _a3 each independently represents an integer of 0 to 3.
The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^{a1 may be substituted with a halogen atom.}
The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^{a2 may be substituted with a halogen atom.}
When n _a2 is 2 to 4, R ^a1 may be the same or different within the same ring.
When n _a3 is 2 to 3, R ^a2 may be the same or different within the same ring. The resin composition of Claim 1 whose quantity of (A-1) component is 10 mass % or more and 70 mass % or less with respect to 100 mass % of resin components in a resin composition. The resin composition of Claim 1 whose quantity of (A) component is 10 mass % or more and 80 mass % or less with respect to 100 mass % of resin components in a resin composition. The resin composition according to claim 1, wherein the component (B) contains a group represented by the following formula (B1).
Formula B1

In Formula B1,
R ^A1 , R ^A2 and R ^A3 each independently represent a hydrogen atom or an alkyl group;
R ^A4 each independently represents an alkyl group;
m _a1 represents 0 or 1;
m _a2 represents an integer from 0 to 4;
* indicates the number of bonds. The resin composition of Claim 1 whose quantity of (B) component is 10 mass % or more and 80 mass % or less with respect to 100 mass % of resin components in a resin composition. The resin composition according to claim 1, further comprising (C) a polymerization initiator. The resin composition according to claim 1, further comprising (D) an inorganic filler. The resin composition according to claim 1, which is for forming an insulating layer. Hardened|cured material of the resin composition in any one of Claims 1-9. A resin sheet comprising a support and a resin composition layer formed from the resin composition according to any one of claims 1 to 9 on the support. The printed wiring board containing the insulating layer formed from the hardened|cured material of the resin composition in any one of Claims 1-9. A semiconductor device comprising the printed wiring board according to claim 12 .