JP7375658B2 - resin composition - Google Patents

Description

The present invention relates to a resin composition. Furthermore, the present invention relates to a cured product of the resin composition, as well as a resin sheet, a printed wiring board, and a semiconductor device obtained using the resin composition.

As a manufacturing technique for printed wiring boards, a manufacturing method using a build-up method in which insulating layers and conductive layers are alternately stacked is known. In the build-up manufacturing method, the insulating layer is generally formed by curing a resin composition. As such a resin composition, for example, a resin composition disclosed in Patent Document 1 is known.

JP 2019-66792 Publication

A cured product formed by curing the resin composition can be used as an insulating layer of a printed wiring board of a semiconductor device. Therefore, it is required to lower the dielectric loss tangent of the cured product. Further, it is desirable that the insulating layer formed of this cured product has strong adhesion strength to the conductor layer formed on the insulating layer.

The present invention was devised in view of the above-mentioned problems; a resin composition capable of obtaining an insulating layer having a low dielectric loss tangent and excellent adhesion strength with a conductor layer; a cured product of the resin composition; The object of the present invention is to provide a resin sheet including a resin composition layer containing the composition; a printed wiring board including an insulating layer formed of a cured product of the resin composition; and a semiconductor device including the printed wiring board. do.

The inventors of the present invention have made extensive studies to solve the above problems. As a result, the present inventor found that (A) a maleimide compound, and (B) a resin containing an aromatic ring and a radically polymerizable unsaturated group, and (A) a maleimide compound containing (A-1) trimethyl The inventors have discovered that a resin composition containing a maleimide compound containing an indane skeleton can solve the above problems, and have completed the present invention.
That is, the present invention includes the following.

（式（Ａ４）において、
Ａｒ^ａ１は、置換基を有していてもよい２価の芳香族炭化水素基を表し；
Ｒ^ａ１は、それぞれ独立に、炭素原子数１～１０のアルキル基、炭素原子数１～１０のアルキルオキシ基、炭素原子数１～１０のアルキルチオ基、炭素原子数６～１０のアリール基、炭素原子数６～１０のアリールオキシ基、炭素原子数６～１０のアリールチオ基、炭素原子数３～１０のシクロアルキル基、ハロゲン原子、ニトロ基、水酸基、又は、メルカプト基を表し；
Ｒ^ａ２は、それぞれ独立に、炭素原子数１～１０のアルキル基、炭素原子数１～１０のアルキルオキシ基、炭素原子数１～１０のアルキルチオ基、炭素原子数６～１０のアリール基、炭素原子数６～１０のアリールオキシ基、炭素原子数６～１０のアリールチオ基、炭素原子数３～１０のシクロアルキル基、ハロゲン原子、水酸基、又は、メルカプト基を表し；
Ｒ^ａ３は、それぞれ独立に、２価の脂肪族炭化水素基を表し；
ｎ_ａ１は、正の整数を表し；
ｎ_ａ２は、それぞれ独立に、０～４の整数を表し；
ｎ_ａ３は、それぞれ独立に、０～３の整数を表す。
Ｒ^ａ１のアルキル基、アルキルオキシ基、アルキルチオ基、アリール基、アリールオキシ基、アリールチオ基、及びシクロアルキル基の水素原子は、ハロゲン原子で置換されていてもよい。
Ｒ^ａ２のアルキル基、アルキルオキシ基、アルキルチオ基、アリール基、アリールオキシ基、アリールチオ基、及びシクロアルキル基の水素原子は、ハロゲン原子で置換されていてもよい。
ｎ_ａ２が２～４の場合、Ｒ^ａ１は、同一環内で同じであってもよく異なっていてもよい。
ｎ_ａ３が２～３の場合、Ｒ^ａ２は、同一環内で同じであってもよく異なっていてもよい。）
〔３〕 （Ａ－１）成分の量が、樹脂組成物中の樹脂成分１００質量％に対して、１０質量％以上７０質量％以下である、〔１〕又は〔２〕に記載の樹脂組成物。
〔４〕 （Ａ）成分の量が、樹脂組成物中の樹脂成分１００質量％に対して、１０質量％以上８０質量％以下である、〔１〕～〔３〕のいずれか一項に記載の樹脂組成物。
〔５〕 （Ｂ）成分が、下記式（Ｂ１）で表される基を含む、〔１〕～〔４〕のいずれか一項に記載の樹脂組成物。

（式（Ｂ１）において、Ｒ^Ａ１、Ｒ^Ａ２及びＲ^Ａ３は、それぞれ独立に、水素原子又はアルキル基を表し；Ｒ^Ａ４は、それぞれ独立に、アルキル基を表し；ｍ_ａ１は、０又は１を表し；ｍ_ａ２は、０～４の整数を表し；＊は、結合手を表す。）
〔６〕 （Ｂ）成分の量が、樹脂組成物中の樹脂成分１００質量％に対して、１０質量％以上８０質量％以下である、〔１〕～〔５〕のいずれか一項に記載の樹脂組成物。
〔７〕 さらに、（Ｃ）重合開始剤を含む、〔１〕～〔６〕のいずれか一項に記載の樹脂組成物。
〔８〕 さらに、（Ｄ）無機充填材を含む、〔１〕～〔７〕のいずれか一項に記載の樹脂組成物。
〔９〕 絶縁層形成用である、〔１〕～〔８〕のいずれか１項に記載の樹脂組成物。
〔１０〕 〔１〕～〔９〕のいずれか１項に記載の樹脂組成物の硬化物。
〔１１〕 支持体と、該支持体上に〔１〕～〔９〕のいずれか１項に記載の樹脂組成物で形成された樹脂組成物層と、を備える、樹脂シート。
〔１２〕 〔１〕～〔９〕のいずれか１項に記載の樹脂組成物の硬化物で形成された絶縁層を含む、プリント配線板。
〔１３〕 〔１２〕に記載のプリント配線板を含む、半導体装置。 [1] (A) a maleimide compound, and (B) a resin containing an aromatic ring and a radically polymerizable unsaturated group,
(A) A resin composition in which the maleimide compound includes (A-1) a maleimide compound containing a trimethylindane skeleton.
[2] The resin composition according to [1], wherein the component (A-1) includes a structure represented by the following formula (A4).

(In formula (A4),
Ar ^a1 represents a divalent aromatic hydrocarbon group which may have a substituent;
R ^a1 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, a carbon represents an aryloxy group having 6 to 10 atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group;
R ^a2 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, a carbon represents an aryloxy group having 6 to 10 atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group;
R ^a3 each independently represents a divalent aliphatic hydrocarbon group;
n _a1 represents a positive integer;
n _a2 each independently represents an integer from 0 to 4;
n _a3 each independently represents an integer from 0 to 3.
The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^a1 may be substituted with a halogen atom.
The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^a2 may be substituted with a halogen atom.
When n _a2 is 2 to 4, R ^a1 may be the same or different within the same ring.
When n _a3 is 2 to 3, R ^a2 may be the same or different within the same ring. )
[3] The resin composition according to [1] or [2], wherein the amount of component (A-1) is 10% by mass or more and 70% by mass or less with respect to 100% by mass of the resin component in the resin composition. thing.
[4] According to any one of [1] to [3], the amount of component (A) is 10% by mass or more and 80% by mass or less with respect to 100% by mass of the resin component in the resin composition. resin composition.
[5] The resin composition according to any one of [1] to [4], wherein the component (B) contains a group represented by the following formula (B1).

(In formula (B1), R ^A1 , R ^A2 and R ^A3 each independently represent a hydrogen atom or an alkyl group; R ^A4 each independently represents an alkyl group; m _a1 represents 0 or 1; (Representation: m _a2 represents an integer from 0 to 4; * represents a bond.)
[6] According to any one of [1] to [5], the amount of component (B) is 10% by mass or more and 80% by mass or less, based on 100% by mass of the resin component in the resin composition. resin composition.
[7] The resin composition according to any one of [1] to [6], further comprising (C) a polymerization initiator.
[8] The resin composition according to any one of [1] to [7], further comprising (D) an inorganic filler.
[9] The resin composition according to any one of [1] to [8], which is used for forming an insulating layer.
[10] A cured product of the resin composition according to any one of [1] to [9].
[11] A resin sheet comprising a support and a resin composition layer formed from the resin composition according to any one of [1] to [9] on the support.
[12] A printed wiring board comprising an insulating layer formed from a cured product of the resin composition according to any one of [1] to [9].
[13] A semiconductor device comprising the printed wiring board according to [12].

According to the present invention, a resin composition capable of obtaining an insulating layer having a low dielectric loss tangent and excellent adhesion strength with a conductor layer; a cured product of the resin composition; and a resin composition layer containing the resin composition. It is possible to provide a resin sheet; a printed wiring board including an insulating layer formed of a cured product of the resin composition; and a semiconductor device including the printed wiring board.

Hereinafter, the present invention will be explained by showing embodiments and examples. However, the present invention is not limited to the embodiments and examples shown below, and may be implemented with arbitrary changes within the scope of the claims of the present invention and equivalents thereof.

[1. Overview of resin composition]
A resin composition according to one embodiment of the present invention includes (A) a maleimide compound, and (B) a resin containing an aromatic ring and a radically polymerizable unsaturated group. In the following description, the "resin containing an aromatic ring and a radically polymerizable unsaturated group" as component (B) may be referred to as "radically polymerizable aromatic resin." Furthermore, (A) the maleimide compound includes (A-1) a maleimide compound containing a trimethylindane skeleton. However, even if the maleimide compound (A) contains an aromatic ring, the maleimide compound is not included in the radically polymerizable aromatic resin (B). Maleimide compounds containing an aromatic ring are classified as component (A). Therefore, the resin composition according to the present embodiment includes a combination of (A) a maleimide compound and (B) a radically polymerizable aromatic resin other than the (A) maleimide compound.

According to such a resin composition, an insulating layer having a low dielectric loss tangent and excellent adhesion strength to a conductor layer can be obtained. Further, the cured product of the resin composition can usually have a low dielectric constant. Furthermore, when an insulating layer is formed using a cured product of the resin composition, the surface roughness of the insulating layer can usually be reduced.

The resin composition may further contain optional components such as (C) a polymerization initiator, (D) an inorganic filler, (E) a thermoplastic resin, and (F) an elastomer, as necessary. .

[2. (A) Maleimide compound]
The maleimide compound as component (A) contained in the resin composition represents a compound containing one or more maleimide groups in the molecule. The maleimide group is represented by the following formula (A2). In formula (A2), * represents a bond. The number of maleimide groups contained in one molecule of the maleimide compound (A) is usually 1 or more, preferably 2 or more. The upper limit is not particularly limited and may be, for example, 22 or less, 10 or less, 6 or less, 4 or less, or 3 or less.

The maleimide compound (A) included in the resin composition according to the present embodiment includes (A-1) a maleimide compound containing a trimethylindane skeleton. In the following description, a "maleimide compound containing a trimethylindane skeleton" may be referred to as a "specific maleimide compound." The trimethylindane skeleton represents a skeleton represented by the following formula (A3).

A substituent may be bonded to the benzene ring included in the trimethylindane skeleton. Examples of the substituent include an alkyl group, an alkyloxy group, an alkylthio group, an aryl group, an aryloxy group, an arylthio group, a cycloalkyl group, a halogen atom, a hydroxyl group, and a mercapto group.
The number of carbon atoms in the alkyl group is preferably 1 to 10. Examples of the alkyl group include methyl group, ethyl group, propyl group, n-butyl group, t-butyl group, and the like.
The number of carbon atoms in the alkyloxy group is preferably 1 to 10. Examples of the alkyloxy group include methoxy group, ethoxy group, propoxy group, butoxy group, and the like.
The number of carbon atoms in the alkylthio group is preferably 1 to 10. Examples of the alkylthio group include methylthio group, ethylthio group, propylthio group, and butylthio group.
The number of carbon atoms in the aryl group is preferably 6 to 10. Examples of the aryl group include phenyl group and naphthyl group.
The number of carbon atoms in the aryloxy group is preferably 6 to 10. Examples of the aryloxy group include phenyloxy group and naphthyloxy group.
The number of carbon atoms in the arylthio group is preferably 6 to 10. Examples of the arylthio group include phenylthio group and naphthylthio group.
The number of carbon atoms in the cycloalkyl group is preferably 3 to 10. Examples of the cycloalkyl group include a cyclopentyl group, a cyclohexyl group, and a cycloheptyl group.
Examples of the halogen atom include a fluorine atom, a chlorine atom, an iodine atom, and the like.

Among the above substituents, the hydrogen atoms of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group may be substituted with a halogen atom.

The number of substituents bonded to one benzene ring included in the trimethylindane skeleton may be 1 or 2 or more. The number of substituents bonded to the benzene ring contained in the trimethylindane skeleton is usually 0 or more and 3 or less. When the number of substituents is two or more, the two or more substituents may be the same or different. Among these, it is preferable that no substituent is bonded to the benzene ring included in the trimethylindane skeleton.

(A-1) The number of trimethylindane skeletons contained in one molecule of the specific maleimide compound may be 1 or 2 or more. The upper limit can be, for example, 10 or less, 8 or less, 7 or less, or 6 or less.

(A-1) It is preferable that the specific maleimide compound further contains an aromatic ring skeleton in addition to the above-mentioned trimethylindane skeleton. The number of carbon atoms constituting the aromatic ring skeleton is preferably 6 to 10. Examples of the aromatic ring skeleton include a benzene ring skeleton and a naphthalene ring skeleton. (A-1) The number of the aromatic ring skeletons contained in one molecule of the specific maleimide compound is preferably 1 or more, more preferably 2 or more, preferably 6 or less, more preferably 4 or less, particularly preferably is 3 or less. (A-1) When the specific maleimide compound contains two or more aromatic ring skeletons in addition to the trimethylindane skeleton, these aromatic ring skeletons may be the same or different.

A substituent may be bonded to the aromatic ring included in the aromatic ring skeleton. Examples of the substituent include the substituents described above as substituents that can be bonded to the benzene ring included in the trimethylindane skeleton, and a nitro group. The number of substituents bonded to one aromatic ring may be 1 or 2 or more. The number of substituents bonded to the aromatic ring is usually 0 or more and 4 or less. When the number of substituents is two or more, the two or more substituents may be the same or different.

(A-1) It is preferable that the specific maleimide compound further contains a divalent aliphatic hydrocarbon group in addition to the above-mentioned trimethylindane skeleton. In particular, when (A-1) the specific maleimide compound contains an aromatic ring skeleton other than the benzene ring included in the trimethylindane skeleton, it is preferable that the (A-1) specific maleimide compound contains a divalent aliphatic hydrocarbon group. . In this case, the divalent aliphatic hydrocarbon group preferably connects the benzene ring included in the trimethylindane skeleton and the aromatic ring skeleton. Moreover, it is preferable that the divalent aliphatic hydrocarbon group connects the aromatic ring skeletons with each other.

The number of carbon atoms in the divalent aliphatic hydrocarbon group is preferably 1 or more, preferably 12 or less, more preferably 8 or less, particularly preferably 5 or less. As the divalent aliphatic hydrocarbon group, an alkylene group as a saturated aliphatic hydrocarbon group is more preferable. Examples of divalent aliphatic hydrocarbon groups include linear alkylene groups such as methylene group, ethylene group, trimethylene group, tetramethylene group, pentamethylene group, and hexamethylene group; ethylidene group (-CH(CH ₃ )-); Propylidene group (-CH(CH ₂ CH ₃ )-), isopropylidene group (-C(CH ₃ ) ₂ -), ethylmethylmethylene group (-C(CH ₃ )(CH ₂ CH ₃ )-), diethylmethylene Branched alkylene groups such as a group (-C(CH ₂ CH ₃ ) ₂ -); and the like. (A-1) When the specific maleimide compound contains two or more divalent aliphatic hydrocarbon groups in addition to the trimethylindane skeleton, these divalent aliphatic hydrocarbon groups may be the same or different. .

(A-1) The specific maleimide compound preferably includes a structure represented by the following formula (A4). (A-1) The entire specific maleimide compound may have a structure represented by formula (A4), or (A-1) a portion of the specific maleimide compound may have a structure represented by formula (A4). good.

(In formula (A4), Ar ^a1 represents a divalent aromatic hydrocarbon group which may have a substituent; R ^a1 each independently represents an alkyl group having 1 to 10 carbon atoms, a carbon Alkyloxy group having 1 to 10 atoms, alkylthio group having 1 to 10 carbon atoms, aryl group having 6 to 10 carbon atoms, aryloxy group having 6 to 10 carbon atoms, arylthio group having 6 to 10 carbon atoms , represents a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group; R ^a2 each independently represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 1 to 10 carbon atoms, 10 alkyloxy group, alkylthio group having 1 to 10 carbon atoms, aryl group having 6 to 10 carbon atoms, aryloxy group having 6 to 10 carbon atoms, arylthio group having 6 to 10 carbon atoms, number of carbon atoms Represents 3 to 10 cycloalkyl groups, halogen atoms, hydroxyl groups, or mercapto groups; R ^a3 each independently represents a divalent aliphatic hydrocarbon group; n _a1 represents a positive integer; n _a2 each independently represents an integer of 0 to 4; n _a3 each independently represents an integer of 0 to 3; R ^a1 alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group , arylthio group, and cycloalkyl group may be substituted with a halogen atom.R ^a2 alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group The hydrogen atom of may be substituted with a halogen atom. When n _a2 is 2 to 4, R ^a1 may be the same or different within the same ring. When n _a3 is 2 to 3 In this case, R ^a2 may be the same or different within the same ring.)

In formula (A4), Ar ^a1 represents a divalent aromatic hydrocarbon group which may have a substituent. The number of carbon atoms in this divalent aromatic hydrocarbon group is preferably 6 or more, preferably 20 or less, and more preferably 16 or less. Examples of the divalent aromatic hydrocarbon group include a phenylene group and a naphthylene group. Examples of substituents that the divalent aromatic hydrocarbon group may have include an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, Aryl group having 6 to 10 carbon atoms, aryloxy group having 6 to 10 carbon atoms, arylthio group having 6 to 10 carbon atoms, cycloalkyl group having 3 to 10 carbon atoms, halogen atom, hydroxyl group, and mercapto Examples include groups. The hydrogen atom of each substituent may be further substituted with a halogen atom. Specific examples of these substituents include, for example, the same substituents that can be bonded to the benzene ring included in the trimethylindane skeleton. When the divalent aromatic hydrocarbon group has a substituent, the number of substituents is preferably 1 to 4. When the divalent aromatic hydrocarbon group has two or more substituents, the two or more substituents may be the same or different. Among these, Ar ^a1 is preferably a divalent aromatic hydrocarbon group having no substituents.

In formula (A4), R ^a1 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or an alkyl group having 6 to 10 carbon atoms. 10 aryl group, aryloxy group having 6 to 10 carbon atoms, arylthio group having 6 to 10 carbon atoms, cycloalkyl group having 3 to 10 carbon atoms, halogen atom, nitro group, hydroxyl group, or mercapto group represent. The hydrogen atoms of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group may be substituted with a halogen atom. Specific examples of these groups include the same substituents that can be bonded to the benzene ring included in the trimethylindane skeleton. Among these, R ^a1 is one or more groups selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an aryl group having 6 to 10 carbon atoms. It is more preferable that it exists, and an alkyl group having 1 to 4 carbon atoms is particularly preferable.

In formula (A4), R ^a2 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or an alkyl group having 6 to 10 carbon atoms. 10 aryl group, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. The hydrogen atoms of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group may be substituted with a halogen atom. Specific examples of these groups include the same substituents that can be bonded to the benzene ring included in the trimethylindane skeleton. Among these, R ^a2 is one or more groups selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, and an aryl group having 6 to 10 carbon atoms. It is more preferable that

In formula (A4), R ^a3 each independently represents a divalent aliphatic hydrocarbon group. The preferred range of the divalent aliphatic hydrocarbon group is as described above.

In formula (A4), n _a1 represents a positive integer. n _a1 is preferably 1 or more, preferably 10 or less, more preferably 8 or less.

In formula (A4), n _a2 each independently represents an integer of 0 to 4. n _a2 is preferably 2 or 3, more preferably 2. Although the plurality of n _a2 may be different, it is preferable that they are the same. When n _a2 is 2 or more, multiple R ^a1s may be the same or different within the same ring.

In formula (A4), n _a3 each independently represents an integer from 0 to 3. The plural n _a3 's may be different, but are preferably the same. n _a3 is preferably 0.

(A-1) It is particularly preferable that the specific maleimide compound includes a structure represented by the following formula (A5). (A-1) The entire specific maleimide compound may have a structure represented by formula (A5), or (A-1) a portion of the specific maleimide compound may have a structure represented by formula (A5). good.

(In formula (A5), R ^b1 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or 6 carbon atoms. -10 aryl group, C6-10 aryloxy group, C6-10 arylthio group, C3-10 cycloalkyl group, halogen atom, nitro group, hydroxyl group, or mercapto group R ^b2 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or an aryl group having 6 to 10 carbon atoms. group, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group; n _b1 is Represents a positive integer; n _b2 each independently represents an integer of 0 to 4; n _b3 each independently represents an integer of 0 to 3. ^{R b1} alkyl group, alkyloxy group, alkylthio group , the hydrogen atom of the aryl group, aryloxy group, arylthio group, and cycloalkyl group may be substituted with a halogen atom.R ^b2 alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, The hydrogen atoms of the arylthio group and the cycloalkyl group may be substituted with a halogen atom. When n _b2 is 2 to 4, R ^b1 may be the same or different within the same ring. . When n _b3 is 2 to 3, R ^b2 may be the same or different within the same ring.)

In formula (A5), R ^b1 , R ^b2 , n _b1 , n _b2 and n _b3 are the same as R ^a1 , R ^a2 , _na1 , _na2 and _na3 in formula (A4), respectively.

(A-1) The specific maleimide compound may further include a structure represented by the following formula (A6).

In formula (A6), R ^c1 , R ^c2 , n _c2 and n _c3 are the same as R ^a1 , R ^a2 , n _a2 and n _a3 in formula (A4), respectively. Further, in formula (A6), n _c1 is the number of repeating units and represents an integer from 1 to 20. Furthermore, in formula (A6), * represents a bond. For example, (A-1) the specific maleimide compound has formula (A4) in which n _a2 is 3 or less, and the benzene ring to which the maleimide group is bonded has two or more of the ortho and para positions with respect to the maleimide group. may contain the structure represented by the above formula (A6) in combination with the structure represented by formula (A4) when R ^a1 is not bonded. For example, (A-1) the specific maleimide compound has formula (A5) in which n _b2 is 3 or less, and 2 of the ortho and para positions to the maleimide group of the benzene ring to which the maleimide group is bonded. When R ^b1 is not bonded, the structure represented by formula (A6) may be included in combination with the structure represented by formula (A5).

The specific maleimide compound (A-1) as the component (A-1) may be used alone or in combination of two or more in any ratio.

(A-1) The maleimide group equivalent of the specific maleimide compound is preferably 50 g/eq. Above, more preferably 100g/eq. Above, particularly preferably 200g/eq. or more, preferably 2000g/eq. Below, more preferably 1000g/eq. Below, particularly preferably 800g/eq. It is as follows. The maleimide group equivalent represents the mass of the maleimide compound per equivalent of maleimide group. (A-1) When the maleimide group equivalent of the specific maleimide compound is within the above range, the effects of the present invention can be significantly obtained.

The amount of the specific maleimide compound (A-1) in the resin composition is preferably 5% by mass or more, more preferably 8% by mass or more, particularly preferably 10% by mass, based on 100% by mass of the nonvolatile components in the resin composition. It is at least 70% by mass, more preferably at most 60% by mass, particularly preferably at most 50% by mass. (A-1) When the amount of the specific maleimide compound is within the above range, the effects of the present invention can be significantly obtained.

The amount of the specific maleimide compound (A-1) in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass, based on 100% by mass of the resin component in the resin composition. It is at least 70% by mass, more preferably at most 60% by mass, particularly preferably at most 50% by mass. The resin component in the resin composition refers to the non-volatile components in the resin composition excluding (D) the inorganic filler. (A-1) When the amount of the specific maleimide compound is within the above range, the effects of the present invention can be significantly obtained.

The amount of the specific maleimide compound (A-1) in the resin composition is preferably 40% by mass or more, more preferably 50% by mass, based on 100% by mass of the (B) radically polymerizable aromatic resin in the resin composition. % or more, particularly preferably 60% by mass or more, preferably 200% by mass or less, more preferably 150% by mass or less, particularly preferably 120% by mass or less. (A-1) When the amount of the specific maleimide compound is within the above range, the effects of the present invention can be significantly obtained.

(A-1) The ratio of the total number of maleimide groups in the specific maleimide compound to the total number of radically polymerizable unsaturated groups in (B) the radically polymerizable aromatic resin (maleimide group/radically polymerizable unsaturated group) is , preferably within a specific range. The ratio (maleimide group/radically polymerizable unsaturated group) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, and preferably 5 or less, more preferably 3 The number below is particularly preferably 2 or less. "(A-1) The total number of maleimide groups in the specific maleimide compound" refers to the value obtained by dividing the mass of the nonvolatile components of the specific maleimide compound (A-1) present in the resin composition by the maleimide group equivalent, This is the total value. Furthermore, "(B) the total number of radically polymerizable unsaturated groups in the radically polymerizable aromatic resin" refers to the mass of the nonvolatile components of the radically polymerizable aromatic resin present in the resin composition. This is the sum of all the values divided by the saturated group equivalents. When the ratio (maleimide group/radically polymerizable unsaturated group) is within the above range, the effects of the present invention can be significantly obtained.

The amount of the specific maleimide compound (A-1) in the resin composition is preferably 30% by mass to 100% by mass, more preferably 40% by mass to 100% by mass of the total amount of maleimide compound (A). It is 100% by weight, particularly preferably from 50% to 100% by weight. (A-1) When the amount of the specific maleimide compound is within the above range, the effects of the present invention can be significantly obtained.

(A-1) There are no particular limitations on the method for producing the specific maleimide compound. (A-1) The specific maleimide compound can be produced, for example, by the method described in Japan Institute of Invention and Innovation Publication No. 2020-500211. According to the production method described in Japan Institute of Invention and Innovation Publication Technical Report No. 2020-500211, a maleimide compound having a distribution in the number of repeating units of the trimethylindane skeleton can be obtained. The maleimide compound obtained by this method includes a structure represented by the following formula (A1). Therefore, the maleimide compound (A) may include a maleimide compound having a structure represented by formula (A1).

(In formula (A1), R ¹ each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, or 6 carbon atoms. -10 aryl group, C6-10 aryloxy group, C6-10 arylthio group, C3-10 cycloalkyl group, halogen atom, nitro group, hydroxyl group, or mercapto group R ² is each independently an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms; group, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group; n ₁ is represents an average repeating unit number of 0.95 to 10.0; n ₂ each independently represents an integer of 0 to 4; n ₃ each independently represents an integer of 0 to 3 ^; The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group may be substituted with a halogen atom.R2 ^'s alkyl group, alkyloxy group, alkylthio group The hydrogen atom of the group, aryl group, aryloxy group, arylthio group, and cycloalkyl group may be substituted with a halogen atom. When _{n 2} is 2 to 4, R ¹ is the same within the same ring. (They may be present or different. When n ₃ is 2 to 3, R ² may be the same or different within the same ring.)

In formula (A1), R ¹ , R ² , n ₂ and n ₃ are the same as R ^a1 , R ^a2 , n _a2 and n _a3 in formula (A4), respectively.

In formula (A1), n ₁ represents the average number of repeating units, and its range is from 0.95 to 10.0. According to the production method described in Japan Institute of Invention and Innovation Publication No. 2020-500211, a group of maleimide compounds containing the structure represented by formula (A1) can be obtained. As can be seen from the fact that the average number of repeating units n ₁ in formula (A1) can be smaller than 1.00, the maleimide compound containing the structure represented by formula (A1) thus obtained has a repeating trimethylindane skeleton. A maleimide compound having 0 units may be included. Therefore, a specific maleimide compound (A-1) is obtained by purification from a maleimide compound containing the structure represented by formula (A1), excluding the maleimide compound in which the number of repeating units of the trimethylindane skeleton is 0. (A-1) The resin composition may contain only the specific maleimide compound. However, even when the resin composition contains a maleimide compound in which the number of repeating units in the trimethylindane skeleton is 0, the effects of the present invention can be obtained. Furthermore, when purification is omitted, costs can be reduced. Therefore, it is preferable that the resin composition contains a maleimide compound having a structure represented by formula (A1) without excluding maleimide compounds having a repeating unit number of 0 in the trimethylindane skeleton.

In formula (A1), the average number of repeating units n ₁ is preferably 0.95 or more, more preferably 0.98 or more, even more preferably 1.0 or more, particularly preferably 1.1 or more, and preferably 10 .0 or less, more preferably 8.0 or less, still more preferably 7.0 or less, particularly preferably 6.0 or less. When the average number of repeating units _n1 is within the above range, the effects of the present invention can be significantly obtained. In particular, the glass transition temperature of the resin composition can be effectively increased.

Examples of the structure represented by formula (A1) include the following.

The maleimide compound containing the structure represented by formula (A1) may further contain the structure shown by formula (A6). For example, a maleimide compound having a structure represented by formula (A1) is such that in formula (A1), n ₂ is 3 or less, and the maleimide group is bonded to the benzene ring at the ortho and para positions with respect to the maleimide group. Two or more of them may contain a structure represented by formula (A6) in combination with a structure represented by formula (A1) when R ¹ is not bonded.

The maleimide compound containing the structure represented by formula (A1) preferably has a molecular weight distribution Mw/Mn calculated from gel permeation chromatography (GPC) measurement within a specific range. The molecular weight distribution is a value obtained by dividing the weight average molecular weight Mw by the number average molecular weight Mn, and is expressed as "Mw/Mn". Specifically, the molecular weight distribution Mw/Mn of the maleimide compound containing the structure represented by formula (A1) is preferably 1.0 to 4.0, more preferably 1.1 to 3.8, even more preferably 1.2 to 3.6, particularly preferably 1.3 to 3.4. When the molecular weight distribution Mw/Mn of the maleimide compound containing the structure represented by formula (A1) is within the above range, the effects of the present invention can be significantly obtained.

Among the maleimide compounds containing the structure represented by formula (A1), the amount of the maleimide compound having an average repeating unit number n ₁ of 0 is preferably within a specific range. When performing the GPC measurement of a maleimide compound containing the structure represented by formula (A1), the amount of the maleimide compound in which the average number of repeating units n ₁ is 0 shall be expressed in area % based on the result of the GPC measurement. I can do it. Specifically, in the chromatogram obtained by the above GPC measurement, the area of the peak of the maleimide compound having an average number of repeating units n ₁ of 0 relative to the total area of the peak of the maleimide compound containing the structure represented by formula (A1) The amount of the maleimide compound having an average repeating unit number n ₁ of 0 can be expressed by the ratio (area %). Specifically, the amount of the maleimide compound in which the average number of repeating units _n1 is 0 is preferably 32 area% or less, and more preferably Preferably it is 30 area % or less, more preferably 28 area % or less. When the amount of the maleimide compound having an average repeating unit number n ₁ of 0 is within the above range, the effects of the present invention can be significantly obtained.

The maleimide group equivalent of the maleimide compound containing the structure represented by formula (A1) is preferably in the same range as the maleimide group equivalent of the specific maleimide compound (A-1) described above. When the maleimide group equivalent of the maleimide compound containing the structure represented by formula (A1) is within the above range, the effects of the present invention can be significantly obtained.

The amount of the maleimide compound containing the structure represented by formula (A1) is preferably 5% by mass or more, more preferably 8% by mass or more, particularly preferably 10% by mass, based on 100% by mass of the nonvolatile components in the resin composition. It is at least 70% by mass, more preferably at most 60% by mass, particularly preferably at most 50% by mass. When the amount of the maleimide compound containing the structure represented by formula (A1) is within the above range, the effects of the present invention can be significantly obtained.

The amount of the maleimide compound containing the structure represented by formula (A1) is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass, based on 100% by mass of the resin component in the resin composition. It is at least 70% by mass, more preferably at most 60% by mass, particularly preferably at most 50% by mass. When the amount of the maleimide compound containing the structure represented by formula (A1) is within the above range, the effects of the present invention can be significantly obtained.

The amount of the maleimide compound containing the structure represented by formula (A1) is preferably 40% by mass or more, more preferably 50% by mass, based on 100% by mass of the (B) radically polymerizable aromatic resin in the resin composition. % or more, particularly preferably 60% by mass or more, preferably 200% by mass or less, more preferably 150% by mass or less, particularly preferably 120% by mass or less. When the amount of the maleimide compound containing the structure represented by formula (A1) is within the above range, the effects of the present invention can be significantly obtained.

The ratio of the total number of maleimide groups in the maleimide compound containing the structure represented by formula (A1) to the total number of radically polymerizable unsaturated groups in (B) the radically polymerizable aromatic resin (maleimide group/radically polymerizable (unsaturated group) is preferably within a specific range. The ratio (maleimide group/radically polymerizable unsaturated group) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, and preferably 5 or less, more preferably 3 The number below is particularly preferably 2 or less. "The total number of maleimide groups in the maleimide compound containing the structure represented by formula (A1)" refers to the mass of the nonvolatile components of the maleimide compound containing the structure represented by formula (A1) present in the resin composition. , is the sum of all the values divided by the maleimide group equivalent. When the ratio (maleimide group/radically polymerizable unsaturated group) is within the above range, the effects of the present invention can be significantly obtained.

The amount of the maleimide compound containing the structure represented by formula (A1) is preferably 30% by mass to 100% by mass, more preferably 40% by mass to 100% by mass of the total amount of the maleimide compound (A). It is 100% by weight, particularly preferably from 50% to 100% by weight. When the amount of the maleimide compound containing the structure represented by formula (A1) is within the above range, the effects of the present invention can be significantly obtained.

The maleimide compound (A) may further contain any maleimide compound that does not contain a trimethylindane skeleton, in combination with the specific maleimide compound (A-1) described above. Examples of the optional maleimide compound include (A-2) a biphenyl maleimide compound and (A-3) an aliphatic maleimide compound. One kind of arbitrary maleimide compounds may be used alone, or two or more kinds may be used in combination in any ratio.

(A-2) Biphenyl-type maleimide compound represents a maleimide compound containing a biphenyl skeleton.

(A-2) One or more substituents may be bonded to the benzene ring of the biphenyl skeleton contained in the biphenyl-type maleimide compound. Examples of the substituent include a halogen atom, -OH, -O-C _1-10 alkyl group, -N(C _1-10 alkyl group) ₂ , C _1-10 alkyl group, C _6-10 aryl group, - Examples include NH ₂ , -CN, -C(O)O-C _1-10 alkyl group, -COOH, -C(O)H, -NO ₂ and the like. Here, the term "C _xy " (x and y are positive integers, satisfying x<y) means that the number of carbon atoms of the organic group immediately after this term is between x and y. express something. For example, the expression "C _1-10 alkyl group" refers to an alkyl group having 1 to 10 carbon atoms. These substituents may be bonded to each other to form a ring. The above-mentioned rings also include spiro rings and fused rings. The above-mentioned substituents may further have a substituent (hereinafter sometimes referred to as "secondary substituent"). As the secondary substituent, the same substituents as mentioned above can be used. Among these, it is preferable that no substituent is bonded to the benzene ring of the biphenyl skeleton contained in the (A-2) biphenyl-type maleimide compound.

(A-2) The biphenyl-type maleimide compound preferably contains either an aliphatic hydrocarbon group or an aromatic hydrocarbon group in combination with the biphenyl skeleton, and preferably contains both an aliphatic hydrocarbon group and an aromatic hydrocarbon group. It is more preferable to have the following. Preferred biphenyl-type maleimide compounds (A-2) include maleimide compounds represented by the following formula (A7).

(In formula (A7), R ^d1 each independently represents an alkylene group; R ^d2 each independently represents an alkyl group that may have a substituent, or an alkyl group that may have a substituent. represents a good aryl group; R ^d3 each independently represents a substituent; n _d1 represents an integer from 1 to 100; n _d2 each independently represents an integer from 0 to 2; n _d3 represents , each independently represents an integer from 0 to 4.)

In formula (A7), R ^d1 each independently represents an alkylene group. The alkylene group preferably has 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 3 carbon atoms. As the alkylene group, a straight chain alkylene group is preferable, and a methylene group is more preferable.

In formula (A7), R ^d2 each independently represents an alkyl group that may have a substituent or an aryl group that may have a substituent.
The number of carbon atoms in the alkyl group is preferably 1 to 10, more preferably 1 to 6, particularly preferably 1 to 3. The alkyl group may be linear, branched or cyclic. Further, examples of the substituent that the alkyl group may have include the same examples as those mentioned above as the substituent that can be bonded to the benzene ring of the biphenyl skeleton.
The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 15, particularly preferably 6 to 10. Examples of the substituent that the aryl group can have include the same examples as those mentioned above as the substituent that can be bonded to the benzene ring of the biphenyl skeleton.

In formula (A7), R ^d3 each independently represents a substituent. Examples of this substituent include the same examples as those mentioned above as the substituent that can be bonded to the benzene ring of the biphenyl skeleton.

In formula (A7), n _d1 represents an integer of 1 to 100, preferably 1 to 50, more preferably 1 to 20, and still more preferably 1 to 5.

In formula (A7), n _d2 each independently represents an integer of 0 to 2, preferably 0.

In formula (A7), n _d3 each independently represents an integer of 0 to 4, preferably 0 to 3, more preferably 0 or 1, particularly preferably 0.

Examples of the (A-2) biphenyl maleimide compound represented by formula (A7) include "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd. (main component: compound of formula (A8) below) . In the following formula (A8), _nd4 represents 1 or 2.

(A-2) The amount of the biphenyl maleimide compound is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition. 0% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, particularly preferably 10% by mass or less. (A-2) When the amount of the biphenyl maleimide compound is within the above range, the effects of the present invention can be significantly obtained.

(A-2) The amount of the biphenyl maleimide compound is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, based on 100% by mass of the resin component in the resin composition. 0% by mass or more, preferably 30% by mass or less, more preferably 20% by mass or less, particularly preferably 15% by mass or less. (A-2) When the amount of the biphenyl maleimide compound is within the above range, the effects of the present invention can be significantly obtained.

(A-3) Aliphatic maleimide compound represents a maleimide compound containing an aliphatic hydrocarbon group having 5 or more carbon atoms.

(A-3) The number of carbon atoms in the aliphatic hydrocarbon group contained in the aliphatic maleimide compound is usually 5 or more, preferably 6 or more, more preferably 8 or more, and preferably 50 or less, more preferably 45 or less, More preferably, it is 40 or less.

(A-3) The aliphatic hydrocarbon group contained in the aliphatic maleimide compound may be saturated or unsaturated, but saturated aliphatic hydrocarbon groups are particularly preferred. Further, the aliphatic hydrocarbon group may be a chain group or a cyclic group. Furthermore, the aliphatic hydrocarbon group may be a monovalent group or a divalent group.

(A-3) Examples of aliphatic hydrocarbon groups contained in the aliphatic maleimide compound include alkyl groups such as pentyl group, hexyl group, heptyl group, octyl group, nonyl group, and decyl group; pentylene group, hexylene group, and heptylene group. group, octylene group, nonylene group, decylene group, undecylene group, dodecylene group, tridecylene group, heptadecylene group, hexatriacontylene group, group having an octylene-cyclohexylene structure, group having an octylene-cyclohexylene-octylene structure, propylene - Alkylene groups such as groups having a cyclohexylene-octylene structure;

(A-3) A substituent may be bonded to the aliphatic hydrocarbon group contained in the aliphatic maleimide compound. Examples of the substituent include the same examples as those mentioned above as the substituent that can be bonded to the benzene ring of the biphenyl skeleton in the description of (A-2) biphenyl-type maleimide compound. Among these, it is preferable that no substituent is bonded to the aliphatic hydrocarbon group contained in the aliphatic maleimide compound (A-3).

(A-3) The aliphatic maleimide compound preferably includes a polyimide structure. Preferred aliphatic maleimide compounds (A-3) include maleimide-terminated polyimide compounds represented by the following formula (A9).

(In formula (A9), R ^e1 each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent; R ^e2 each independently represents a divalent linking group. ; n _e1 represents an integer from 1 to 10.)

In formula (A9), R ^e1 each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. Specifically, the number of carbon atoms in R ^e1 is usually 5 or more, preferably 6 or more, more preferably 8 or more, and preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. Examples of the substituent that the alkylene group can have include the same examples as those mentioned above as the substituent that can be bonded to the benzene ring of the biphenyl skeleton in the description of (A-2) biphenyl-type maleimide compound. Among these, R ^e1 is preferably an alkylene group without a substituent.

In formula (A9), R ^e2 each independently represents a divalent linking group. The divalent linking group is preferably an oxygen atom, an arylene group, an alkylene group, or a divalent group consisting of a combination of two or more of these groups. The number of carbon atoms in the arylene group is preferably 6 to 24, more preferably 6 to 18, still more preferably 6 to 14, particularly preferably 6 to 10. Preferred arylene groups include, for example, phenylene, naphthylene, and anthracenylene groups. The number of carbon atoms in the alkylene group is preferably 1 to 50, more preferably 1 to 45, even more preferably 1 to 40. This alkylene group may be linear, branched, or cyclic. Preferred alkylene groups include, for example, methylethylene group, cyclohexylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, decylene group, undecylene group, dodecylene group, tridecylene group, heptadecylene group, hexatriacontylene group. group, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, a group having a propylene-cyclohexylene-octylene structure, and the like. Among these, an oxygen atom is preferable as ^Re2 .

In formula (A9), n _e1 represents an integer from 1 to 10.

Examples of the aliphatic maleimide compound (A-3) represented by formula (A9) include "BMI-1500" (compound of formula (A10)) and "BMI-1700" (compound of formula (A10)) manufactured by Designer Molecules, Inc. Compound (A11)). In the following formulas (A10) and (A11), n _e2 and n _e3 each independently represent an integer from 1 to 10.

(A-3) The amount of the aliphatic maleimide compound is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, based on 100% by mass of the nonvolatile components in the resin composition. 0% by mass or more, preferably 10.0% by mass or less, more preferably 6.0% by mass or less, particularly preferably 4.0% by mass or less. (A-3) When the amount of the aliphatic maleimide compound is within the above range, the effects of the present invention can be significantly obtained.

(A-3) The amount of the aliphatic maleimide compound is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass, based on 100% by mass of the resin component in the resin composition. 0% by mass or more, preferably 20% by mass or less, more preferably 15% by mass or less, particularly preferably 10% by mass or less. (A-3) When the amount of the aliphatic maleimide compound is within the above range, the effects of the present invention can be significantly obtained.

The maleimide group equivalent of any maleimide compound such as (A-2) biphenyl-type maleimide compound and (A-3) aliphatic maleimide compound is in the same range as the maleimide group equivalent of the above-mentioned (A-1) specific maleimide compound. It is preferable. When the maleimide group equivalent of any maleimide compound is within the above range, the effects of the present invention can be significantly obtained.

The amount of the maleimide compound (A) is preferably 5% by mass or more, more preferably 8% by mass or more, particularly preferably 10% by mass or more, and preferably It is 70% by mass or less, more preferably 60% by mass or less, particularly preferably 50% by mass or less. When the amount of the maleimide compound (A) is within the above range, the effects of the present invention can be significantly obtained.

The amount of the maleimide compound (A) is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably 30% by mass or more, based on 100% by mass of the resin component in the resin composition. It is 80% by mass or less, more preferably 70% by mass or less, particularly preferably 60% by mass or less. When the amount of the maleimide compound (A) is within the above range, the effects of the present invention can be significantly obtained.

The amount of the maleimide compound (A) is preferably 40% by mass or more, more preferably 50% by mass or more, particularly preferably 60% by mass, based on 100% by mass of the (B) radically polymerizable aromatic resin in the resin composition. % or more, preferably 200% by mass or less, more preferably 150% by mass or less, particularly preferably 120% by mass or less. When the amount of the maleimide compound (A) is within the above range, the effects of the present invention can be significantly obtained.

(A) The ratio of the total number of maleimide groups in the maleimide compound to the total number of radically polymerizable unsaturated groups in (B) the radically polymerizable aromatic resin (maleimide group/radically polymerizable unsaturated group) is determined by the specific Preferably within this range. The ratio (maleimide group/radically polymerizable unsaturated group) is preferably 0.01 or more, more preferably 0.3 or more, particularly preferably 0.5 or more, and preferably 5 or less, more preferably 3 The number below is particularly preferably 2 or less. The "total number of maleimide groups in (A) maleimide compound" is the sum of all the values obtained by dividing the mass of nonvolatile components of (A) maleimide compound present in the resin composition by the maleimide group equivalent. . When the ratio (maleimide group/radically polymerizable unsaturated group) is within the above range, the effects of the present invention can be significantly obtained.

[3. (B) Radical polymerizable aromatic resin]
The radically polymerizable aromatic resin as component (B) contained in the resin composition contains an aromatic ring and a radically polymerizable unsaturated group in its molecule.

(B) The aromatic ring contained in the radically polymerizable aromatic resin may be an aromatic carbocyclic ring or an aromatic heterocycle. Further, the aromatic ring may be a monocyclic aromatic ring, a condensed aromatic ring in which two or more monocyclic aromatic rings are condensed, or one or more monocyclic aromatic rings and one or more monocyclic aromatic rings. It may also be a condensed aromatic ring in which a cyclic non-aromatic ring is condensed. Examples of these aromatic rings include monocyclic aromatic rings such as benzene rings and pyridine rings; fused aromatic rings such as indane rings, fluorene rings, and naphthalene rings. Among these, the aromatic ring is preferably an aromatic carbon ring. The number of carbon atoms in the aromatic carbon ring is preferably 6 or more and 10 or less.

(B) A substituent may be bonded to the aromatic ring contained in the radically polymerizable aromatic resin. Examples of the substituent include the same substituents that can be bonded to the benzene ring contained in the trimethylindane skeleton of the specific maleimide compound (A-1). The number of substituents bonded to one aromatic ring may be 1 or 2 or more. When the number of substituents is two or more, the two or more substituents may be the same or different. Among these, it is preferable that the aromatic ring contained in the radically polymerizable aromatic resin (B) has no substituent bonded thereto or an alkyl group bonded thereto.

(B) The number of aromatic rings contained in the radically polymerizable aromatic resin is usually 1 or more, preferably 2 or more. (B) When the radically polymerizable aromatic resin contains two or more aromatic rings, the two or more aromatic rings may be the same or different.

(B) The radically polymerizable unsaturated group contained in the radically polymerizable aromatic resin represents a group containing an unsaturated bond exhibiting radical polymerizability. Examples of this radically polymerizable unsaturated group include a group containing an ethylenic double bond. The radically polymerizable aromatic resin (B) containing such a radically polymerizable unsaturated group can undergo radical polymerization by heat or active energy rays, thereby curing the resin composition.

Examples of the radically polymerizable unsaturated group include a vinyl group, a vinylphenyl group, an acryloyl group, a methacryloyl group, a fumaroyl group, and a maleoyl group. (B) The number of radically polymerizable unsaturated groups contained in the radically polymerizable aromatic resin is usually 1 or more, preferably 2 or more. (B) When the radically polymerizable aromatic resin contains two or more radically polymerizable unsaturated groups, the two or more radically polymerizable unsaturated groups may be the same or different.

Among these, it is preferable that the radically polymerizable aromatic resin (B) contains a group represented by the following formula (B1).

(In formula (B1), R ^A1 , R ^A2 and R ^A3 each independently represent a hydrogen atom or an alkyl group; R ^A4 each independently represents an alkyl group; m _a1 represents 0 or 1; (Representation: m _a2 represents an integer from 0 to 4; * represents a bond.)

In formula (B1), R ^A1 , R ^A2 and R ^A3 each independently represent a hydrogen atom or an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 18, more preferably 1 to 12, even more preferably 1 to 6, particularly preferably 1 to 2. The alkyl group may be linear, branched, or cyclic. Examples of alkyl groups include methyl, ethyl, propyl, n-butyl, t-butyl, and the like. Among these, R ^A1 is preferably a hydrogen atom or a methyl group, and R ^A2 and R ^A3 are preferably a hydrogen atom.

In formula (B1), R ^A4 each independently represents an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 12, more preferably 1 to 6, even more preferably 1 to 2. The alkyl group may be linear, branched, or cyclic. Examples of alkyl groups include methyl, ethyl, propyl, n-butyl, t-butyl, and the like. Among these, R ^A1 is preferably a methyl group.

In formula (B1), m _a1 represents 0 or 1. When R ^A1 is a hydrogen atom, m _a1 is preferably 0. Further, when R ^A1 is an alkyl group, m _a1 is preferably 1.

In formula (B1), m _a2 represents an integer of 0 to 4. m _a2 is preferably 0-2.

(B) The radically polymerizable aromatic resin may contain one group represented by formula (B1) per molecule, but preferably contains two or more groups.

(B) As the radically polymerizable aromatic resin, a compound containing a polyphenylene ether skeleton is preferable. Examples of the (B) radically polymerizable aromatic resin containing a polyphenylene ether skeleton include a compound represented by the following formula (B2).

(In formula (B2), L ¹ represents a divalent linking group; R ^B11 , R ^B12 , R ^B13 , R ^B21 , R ^B22 and R ^B23 each independently represent a hydrogen atom or an alkyl group; R ^B14 , R ^B15 , R ^B24 and R ^B25 each independently represent an alkyl group; R ^B16 and R ^B26 each independently represent an alkylene group; m _b11 and m _b21 each independently represent 0 or 1; m _b12 , m _b13 , m _b22 and m _b23 each independently represent an integer from 0 to 4; m _b14 and m _b24 each independently represent an integer from 0 to 300; m _b15 and m _b25 each independently represent 0 or 1.)

In formula (B2), L ¹ represents a divalent linking group. Examples of the divalent linking group include alkylene group, alkenylene group, arylene group, alkylarylene group, heteroarylene group, -O-, -NH-, -NR ^x -, -CO-, -CS-, -SO -, -SO ₂ -, -C(=O)O-, -NHC(=O)-, -NC(=O)N-, -NHC(=O)O-, -C(=O)-, Examples thereof include -S-, and a group combining two or more of these. R ^x represents a hydrocarbyl group having 1 to 12 carbon atoms. The number of carbon atoms in L ¹ is usually 60 or less, more preferably 48 or less, still more preferably 36 or less, particularly preferably 24 or less.

In formula (B2), R ^B11 , R ^B12 , R ^B13 , R ^B21 , R ^B22 and R ^B23 each independently represent a hydrogen atom or an alkyl group. R ^B11 , R ^B12 , R ^B13 , R ^B21 , R ^B22 and R ^B23 may be the same as R ^A1 , R ^A2 and R ^A3 in formula (B1). Among these, R ^B11 and R ^B21 are preferably a hydrogen atom or a methyl group, and R ^B12 , R ^B13 , R ^B22 and R ^B23 are preferably a hydrogen atom.

In formula (B2), R ^B14 , R ^B15 , R ^B24 and R ^B25 each independently represent an alkyl group. R ^B14 , R ^B15 , R ^B24 and R ^B25 may be the same as R ^A4 in formula (B1). Among these, R ^B14 , R ^B15 , R ^B24 and R ^B25 are preferably methyl groups.

In formula (B2), R ^B16 and R ^B26 each independently represent an alkylene group. The alkylene group preferably has 1 to 10 carbon atoms, more preferably 1 to 6 carbon atoms, and even more preferably 1 to 3 carbon atoms. As the alkylene group, a straight chain alkylene group is preferable, and a methylene group is more preferable.

In formula (B2), m _b11 and m _b21 each independently represent 0 or 1.

In formula (B2), m _b12 , m _b13 , m _b22 and m _b23 each independently represent an integer of 0 to 4. m _b12 , m _b13 , m _b22 and m _b23 are preferably 1 to 4, more preferably 2 to 3, particularly preferably 2.

In formula (B2), m _b14 and m _b24 each independently represent an integer from 0 to 300. In detail, m _b14 and m _b24 are usually 0 or more, preferably 1 or more, and usually 300 or less, preferably 100 or less, more preferably 50 or less, still more preferably 20 or less, particularly preferably 10 or less. .

In formula (B2), m _b15 and m _b25 each independently represent 0 or 1. When m _b11 is 0, m _b15 is preferably 1, and when m _b11 is 1, m _b15 is preferably 0. Further, when m _b21 is 0, m _b25 is preferably 1, and when m _b21 is 1, m _b25 is preferably 0.

Preferred examples of the compound represented by formula (B2) include the compound represented by formula (B3) below.

(In formula (B3), ^L2 represents a divalent linking group; R ^C15 and R ^C25 each independently represent an alkyl group; R ^C16 and R ^C26 each independently represent an alkylene group. ; m _c14 and m _c24 each independently represent an integer from 0 to 300.)

In formula (B3), L ² represents a divalent linking group. L ² may be the same as L ¹ in formula (B2). Among these, L ² is preferably a divalent group represented by the following formula (B3-1).

(In formula (B3-1), X ¹ to X ⁸ each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group. * represents a bond.)

In formula (B3), R ^C15 and R ^C25 each independently represent an alkyl group. R ^C15 and R ^C25 may be the same as R ^A4 in formula (B1). Among these, R ^C15 and R ^C25 are preferably methyl groups.

In formula (B3), R ^C16 and R ^C26 each independently represent an alkylene group. R ^C16 and R ^C26 may be the same as R ^B16 and R ^B26 in formula (B2). Among them, R ^C16 and R ^C26 are more preferably methylene groups.

In formula (B3), m _c14 and m _c24 each independently represent an integer from 0 to 300. m _c14 and m _c24 may be the same as m _b14 and m _b24 in formula (B2). Further, in formula (B3), preferably, a configuration in which one of m _c14 and m _c24 is 0 is excluded.

Examples of the compound represented by formula (B3) include a compound represented by formula (B4) below. In formula (B4), m _c14 and m _c24 represent the same numbers as in formula (B3). The compound represented by formula (B4) is available as "OPE-2St" manufactured by Mitsubishi Gas Chemical Company.

Another preferred example of the compound represented by formula (B2) is a compound represented by formula (B5) below.

(In formula (B5), L ³ represents a divalent linking group; R ^D11 and R ^D21 each independently represent a hydrogen atom or an alkyl group; R ^D14 , R ^D15 , R ^D24 and R ^D25 , each independently represents an alkyl group; m _d14 and m _d24 each independently represent an integer from 0 to 300.)

In formula (B5), L ³ represents a divalent linking group. L ³ may be the same as L ¹ in formula (B2). Among these, L ³ is preferably one selected from the group consisting of an alkylene group, an alkenylene group, -O-, -NR ^x -, -CO-, -CS-, -SO-, and -SO ₂ -. , alkylene groups are preferred, and isopropylidene groups (-C(CH ₃ ) ₂ --) are particularly preferred.

In formula (B5), R ^D11 and R ^D21 each independently represent a hydrogen atom or an alkyl group. R ^D11 and R ^D21 may be the same as R ^B11 and R ^B21 in formula (B2). Among these, R ^D11 and R ^D21 are preferably methyl groups.

In formula (B5), R ^D14 , R ^D15 , R ^D24 and R ^D25 each independently represent an alkyl group. R ^D14 , R ^D15 , R ^D24 and R ^D25 may be the same as R ^A4 in formula (B1). Among these, R ^D14 , R ^D15 , R ^D24 and R ^D25 are preferably methyl groups.

In formula (B5), m _d14 and m _d24 each independently represent an integer from 0 to 300. m _d14 and m _d24 may be the same as m _b14 and m _b24 in formula (B2). Moreover, it is preferable that the total of m _b14 and m _b24 is 2 or more.

Examples of the compound represented by formula (B5) include a compound represented by formula (B6) below. In formula (B6), L ³ , m _d14 and m _d24 are the same as in formula (B5). The compound represented by formula (B4) is available as "NORYL SA9000" manufactured by SABIC.

Another preferable example of the radically polymerizable aromatic resin (B) is a polymer containing a structural unit represented by the following formula (B7).

(In formula (B7), R ^E1 , R ^E2 and R ^E3 each independently represent a hydrogen atom or an alkyl group; R ^E4 each independently represents an alkyl group; R ^E5 , R ^E6 and R ^E7 each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; m _e1 represents 0 or 1; m _e2 represents an integer of 0 to 4; * represents a bond .)

In formula (B7), R ^E1 , R ^E2 and R ^E3 each independently represent a hydrogen atom or an alkyl group. R ^E1 , R ^E2 and R ^E3 may be the same as R ^A1 , R ^A2 and R ^A3 in formula (B1). Among these, R ^E1 , R ^E2 and R ^E3 are preferably hydrogen atoms.

In formula (B7), R ^E4 each independently represents an alkyl group. R ^E4 may be the same as R ^A4 in formula (B1).

In formula (B7), R ^E5 , R ^E6 and R ^E7 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Among them, R ^E5 , R ^E6 and R ^E7 are preferably hydrogen atoms.

In formula (B7), m _e1 represents 0 or 1, preferably 0.

In formula (B7), m _e2 represents an integer from 0 to 4, preferably 0.

The molar content of the structural unit represented by formula (B7) is within a specific range with respect to the total 100 mol% of all structural units contained in the polymer containing the structural unit represented by formula (B7). is preferred. Specifically, the molar content of the structural unit represented by formula (B7) is preferably from 2 mol% to 95 mol%, more preferably from 8 mol% to 81 mol%. Further, the average number of structural units represented by formula (B7) contained in one molecule of the polymer is preferably 1 to 160, more preferably 3 to 140.

The polymer containing the structural unit represented by formula (B7) may further contain any structural unit in combination with the structural unit represented by formula (B7). Examples of the arbitrary structural unit include a structural unit represented by the following formula (B7-1).

(In formula (B7-1), R ^E8 , R ^E9 and R ^E10 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms. Even if Ar ^E1 has a substituent, Represents a good aryl group. Examples of substituents that Ar ^E1 may have include alkyl groups having 1 to 6 carbon atoms. * represents a bond.)

As a polymer containing a structural unit represented by the formula (B7), for example, a structural unit represented by the following formula (B8), a structural unit represented by the following formula (B8-1), and a structural unit represented by the following formula ( Examples include copolymers containing a combination of the structural unit represented by B8-2). In formula (B8), formula (B8-1), and formula (B8-2), * represents a bond. In this copolymer, the molar content of the structural unit represented by formula (B8), the structural unit represented by formula (B8-1), and the structural unit represented by formula (B8-2) is as follows: They are 8 mol% to 54 mol%, 0 mol% to 92 mol%, and 0 mol% to 89 mol%, respectively. Furthermore, one molecule of this copolymer contains a structural unit represented by formula (B8), a structural unit represented by formula (B8-1), and a structural unit represented by formula (B8-2). The average numbers are 1-160, 0-350 and 0-270, respectively. This copolymer is available as "ODV-XET (X03)", "ODV-XET (X04)" and "ODV-XET (X05)" manufactured by Nippon Steel Chemical & Materials.

(B) The radically polymerizable aromatic resin may be used alone or in combination of two or more in any ratio.

(B) The radically polymerizable unsaturated group equivalent of the radically polymerizable aromatic resin is preferably 250 g/eq. ～1200g/eq. , more preferably 300g/eq. ～1100g/eq. It is. The radically polymerizable unsaturated group equivalent represents the mass of the radically polymerizable aromatic resin per equivalent of the radically polymerizable unsaturated group. (B) When the radically polymerizable unsaturated group equivalent of the radically polymerizable aromatic resin is within the above range, the effects of the present invention can be significantly obtained.

The weight average molecular weight of the radically polymerizable aromatic resin (B) is preferably 1,000 to 40,000, more preferably 1,500 to 35,000. The weight average molecular weight of the resin can be measured as a value in terms of polystyrene by gel permeation chromatography (GPC).

The amount of the radically polymerizable aromatic resin (B) in the resin composition is preferably 5% by mass or more, more preferably 8% by mass or more, particularly preferably The content is 10% by mass or more, preferably 70% by mass or less, more preferably 60% by mass or less, particularly preferably 50% by mass or less. (B) When the amount of the radically polymerizable aromatic resin is within the above range, the effects of the present invention can be significantly obtained.

The amount of the radically polymerizable aromatic resin (B) in the resin composition is preferably 10% by mass or more, more preferably 20% by mass or more, particularly preferably The content is 30% by mass or more, preferably 80% by mass or less, more preferably 70% by mass or less, particularly preferably 60% by mass or less. (B) When the amount of the radically polymerizable aromatic resin is within the above range, the effects of the present invention can be significantly obtained.

[4. (C) Polymerization initiator]
The resin composition may further contain (C) a polymerization initiator as an optional component in addition to the components described above. By using a polymerization initiator as component (C), the reaction between (A) the maleimide compound and (B) the radically polymerizable aromatic resin can be promoted, and the curing of the resin composition can proceed smoothly.

Examples of the polymerization initiator (C) include t-butylcumyl peroxide, t-butylperoxyacetate, α,α'-di(t-butylperoxy)diisopropylbenzene, t-butylperoxylaurate, and t-butylperoxyacetate. Examples include peroxides such as -butylperoxy-2-ethylhexanoate, t-butylperoxyneodecanoate, t-butylperoxybenzoate, and di-t-hexyl peroxide.

(C) Commercially available polymerization initiators include "Perbutyl (registered trademark) C", "Perbutyl (registered trademark) A", "Perbutyl (registered trademark) P", and "Perbutyl (registered trademark)" manufactured by NOF Corporation. ``Perbutyl (registered trademark) L'', ``Perbutyl (registered trademark) O'', ``Perbutyl (registered trademark) ND'', ``Perbutyl (registered trademark) Z'', ``Perbutyl (registered trademark) I'', ``Percmil P'', ``Percyl D'' , "Perhexyl (registered trademark) D", "Perhexyl (registered trademark) A", "Perhexyl (registered trademark) I", "Perhexyl (registered trademark) Z", "Perhexyl (registered trademark) ND", "Perhexyl (registered trademark)" Trademark) O," "Perhexyl (registered trademark) PV," "Perhexyl (registered trademark) O," and the like.

(C) The polymerization initiator may be used alone or in combination of two or more in any ratio.

The amount of the polymerization initiator (C) in the resin composition is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, particularly preferably is 0.3% by mass or more, preferably 5% by mass or less, more preferably 3% by mass or less, particularly preferably 1% by mass or less. When the amount of the polymerization initiator (C) is within the above range, the effects of the present invention can be significantly obtained.

The amount of the polymerization initiator (C) in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably is 1% by mass or more, preferably 10% by mass or less, more preferably 5% by mass or less, particularly preferably 3% by mass or less. When the amount of the polymerization initiator (C) is within the above range, the effects of the present invention can be significantly obtained.

The amount of the polymerization initiator (C) in the resin composition is preferably 0.1 mass% with respect to the total 100% by mass of the maleimide compound (A) and the radically polymerizable aromatic resin (B) in the resin composition. % or more, more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, preferably 10% by mass or less, more preferably 5% by mass or less, particularly preferably 3% by mass or less. When the amount of the polymerization initiator (C) is within the above range, the effects of the present invention can be significantly obtained.

[5. (D) Inorganic filler]
The resin composition may further contain (D) an inorganic filler as an optional component in addition to the above-mentioned components. The inorganic filler as component (D) is usually contained in the resin composition in the form of particles.

(D) An inorganic compound can be used as the material for the inorganic filler. (D) Materials for the inorganic filler include, for example, silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, and water. Aluminum oxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide , zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is particularly suitable. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Further, as the silica, spherical silica is preferable. (D) Inorganic fillers may be used alone or in combination of two or more in any ratio.

(D) Commercially available inorganic fillers include, for example, "UFP-30" manufactured by Denka Kagaku Kogyo Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumikin Materials; “YC100C”, “YA050C”, “YA050C-MJE”, “YA010C”; “UFP-30” manufactured by Denka; “Silfill NSS-3N”, “Silfill NSS-4N”, “Silfill NSS-” manufactured by Tokuyama Examples include "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Admatex; "DAW-03" and "FB-105FD" manufactured by Denka.

(D) The average particle size of the inorganic filler is preferably 0.01 μm or more, more preferably 0.05 μm or more, particularly preferably 0.1 μm or more, and preferably It is 5 μm or less, more preferably 2 μm or less, even more preferably 1 μm or less. (D) The average particle size of the inorganic filler can be measured by a laser diffraction/scattering method based on Mie scattering theory. Specifically, it can be measured by creating the particle size distribution of the inorganic filler on a volume basis using a laser diffraction scattering type particle size distribution measuring device, and using the median diameter as the average particle size. The measurement sample can be obtained by weighing 100 mg of the inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing them using ultrasonic waves for 10 minutes. The measurement sample was measured using a laser diffraction particle size distribution measuring device using a light source wavelength of blue and red, and the volume-based particle size distribution of the inorganic filler was measured using a flow cell method. The average particle size can be calculated as the median diameter. Examples of the laser diffraction particle size distribution measuring device include "LA-960" manufactured by Horiba, Ltd.

(D) The specific surface area of the inorganic filler is preferably 0.1 m ² /g or more, more preferably 0.5 m ² /g or more, and even more preferably 1 m ² /g, from the viewpoint of significantly obtaining the effects of the present invention. Above, it is particularly preferably 3 m ² /g or more, preferably 100 m ² /g or less, more preferably 70 m ² /g or less, still more preferably 50 m ² /g or less, particularly preferably 40 m ² /g or less. The specific surface area of the inorganic filler was determined by adsorbing nitrogen gas onto the sample surface using a BET fully automatic specific surface area measuring device (Macsorb HM-1210 manufactured by Mountec), and then measuring the specific surface area using the BET multi-point method. It can be obtained by calculating .

(D) The inorganic filler is preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. Examples of surface treatment agents include fluorine-containing silane coupling agents, aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds, and titanate-based coupling agents. Coupling agents and the like can be mentioned. Moreover, one type of surface treatment agent may be used alone, or two or more types may be used in any combination.

Commercially available surface treatment agents include, for example, "KBM-1003", "KBE-1003" (vinyl silane coupling agent); "KBM-303", "KBM-402", and "KBE-1003" manufactured by Shin-Etsu Chemical Co., Ltd. KBM-403", "KBE-402", "KBE-403" (epoxy silane coupling agent); "KBM-1403" (styryl silane coupling agent); "KBM-502", "KBM-503" , "KBE-502", "KBE-503" (methacrylic silane coupling agent); "KBM-5103" (acrylic silane coupling agent); "KBM-602", "KBM-603", "KBM-" 903'', ``KBE-903'', ``KBE-9103P'', ``KBM-573'', ``KBM-575'' (amino-based silane coupling agent); ``KBM-9659'' (isocyanurate-based silane coupling agent); "KBE-585" (ureide silane coupling agent); "KBM-802", "KBM-803" (mercapto silane coupling agent); "KBE-9007N" (isocyanate silane coupling agent); "X -12-967C” (acid anhydride silane coupling agent); “KBM-13”, “KBM-22”, “KBM-103”, “KBE-13”, “KBE-22”, “KBE-103” ", "KBM-3033", "KBE-3033", "KBM-3063", "KBE-3063", "KBE-3083", "KBM-3103C", "KBM-3066", "KBM-7103" ( non-silane coupling (alkoxysilane compound), etc.

The degree of surface treatment with the surface treatment agent is preferably within a predetermined range from the viewpoint of improving the dispersibility of the (D) inorganic filler. Specifically, 100% by mass of the inorganic filler (D) is preferably surface-treated with a surface treatment agent of 0.2% by mass to 5% by mass, and 0.2% by mass to 3% by mass of a surface treatment agent. It is more preferable that the surface be treated, and it is even more preferable that the surface be treated in an amount of 0.3% by mass to 2% by mass.

The degree of surface treatment by the surface treatment agent can be evaluated by the amount of carbon per unit surface area of the (D) inorganic filler. The amount of carbon per unit surface area of the inorganic filler is preferably 0.02 mg/m ² or more, more preferably 0.1 mg/m ² or more, and 0.2 mg/m ² from the viewpoint of improving the dispersibility of the inorganic filler. The above is more preferable. On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition or the melt viscosity in sheet form, the amount is preferably 1.0 mg/m ² or less, more preferably 0.8 mg/m ² or less, and 0.5 mg/m ² The following are more preferred.

(D) The amount of carbon per unit surface area of the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler whose surface has been treated with a surface treatment agent, and the mixture is subjected to ultrasonic cleaning at 25° C. for 5 minutes. After removing the supernatant and drying the nonvolatile components, the amount of carbon per unit surface area of the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, "EMIA-320V" manufactured by Horiba, Ltd., etc. can be used.

The amount of the inorganic filler (D) in the resin composition is preferably 20% by mass or more, more preferably 30% by mass or more, and even more preferably 40% by mass, based on 100% by mass of the nonvolatile components in the resin composition. Above, the content is particularly preferably 50% by mass or more, preferably 90% by mass or less, more preferably 80% by mass or less, and still more preferably 70% by mass or less. (D) When the amount of the inorganic filler is within the above range, the effects of the present invention can be significantly obtained.

The amount of the specific maleimide compound (A-1) based on 100% by mass of the (D) inorganic filler is preferably 5% by mass or more, more preferably 10% by mass or more, particularly preferably 20% by mass or more, and preferably 60% by mass or more. It is at most 50% by mass, more preferably at most 50% by mass, particularly preferably at most 40% by mass. When the inorganic filler (D) is used in an amount that satisfies this relationship, the effects of the present invention can be significantly obtained.

(D) The amount of the maleimide compound containing the structure represented by formula (A1) relative to 100% by mass of the inorganic filler is preferably 5% by mass or more, more preferably 10% by mass or more, particularly preferably 20% by mass or more. The content is preferably 60% by mass or less, more preferably 50% by mass or less, particularly preferably 40% by mass or less. When the inorganic filler (D) is used in an amount that satisfies this relationship, the effects of the present invention can be significantly obtained.

The amount of the maleimide compound (A) relative to 100% by mass of the inorganic filler (D) is preferably 5% by mass or more, more preferably 10% by mass or more, particularly preferably 20% by mass or more, and preferably 60% by mass or less. , more preferably 50% by mass or less, particularly preferably 40% by mass or less. When the inorganic filler (D) is used in an amount that satisfies this relationship, the effects of the present invention can be significantly obtained.

[6. (E) Thermoplastic resin]
The resin composition may further contain (E) a thermoplastic resin as an arbitrary component in addition to the above-mentioned components.

Examples of the thermoplastic resin as component (E) include phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, and polyphenylene ether resin. , polycarbonate resin, polyetheretherketone resin, polyester resin, etc. Among these, phenoxy resin is preferred from the viewpoint of significantly obtaining the effects of the present invention. Moreover, one type of thermoplastic resin may be used alone, or two or more types may be used in combination.

Examples of phenoxy resins include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenolacetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, and terpene. Examples include phenoxy resins having one or more types of skeletons selected from the group consisting of a skeleton and a trimethylcyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group.

Specific examples of phenoxy resins include "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both phenoxy resins containing bisphenol A skeleton); "YX8100" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing bisphenol S skeleton); "YX6954" (phenoxy resin containing bisphenolacetophenone skeleton) manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; "FX280" and "FX293" manufactured by Nippon Steel & Sumikin Chemical; "YL7500BH30", "YX6954BH30", "YX7553", "YX7553BH30" manufactured by Mitsubishi Chemical Corporation, Examples include "YL7769BH30," "YL6794," "YL7213," "YL7290," "YL7482," and "YL7891BH30."

Examples of the polyvinyl acetal resin include polyvinyl formal resin and polyvinyl butyral resin, with polyvinyl butyral resin being preferred. Specific examples of polyvinyl acetal resin include Denka Butyral 4000-2, Denka Butyral 5000-A, Denka Butyral 6000-C, and Denka Butyral 6000-EP manufactured by Denki Kagaku Kogyo; Sekisui Chemical Co., Ltd. Examples include the S-LEC BH series, BX series (for example, BX-5Z), KS series (for example, KS-1), BL series, and BM series manufactured by the company.

Examples of polyolefin resins include ethylene copolymers such as low density polyethylene, ultra-low density polyethylene, high density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer. Resin; Examples include polyolefin elastomers such as polypropylene and ethylene-propylene block copolymers.

Specific examples of the polyimide resin include "Ricacoat SN20" and "Ricacoat PN20" manufactured by Shin Nihon Rika Co., Ltd.

Specific examples of the polyamide-imide resin include "Viromax HR11NN" and "Viromax HR16NN" manufactured by Toyobo. Specific examples of polyamide-imide resins include modified polyamide-imides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamide-imide) manufactured by Hitachi Chemical.

A specific example of the polyether sulfone resin includes "PES5003P" manufactured by Sumitomo Chemical Co., Ltd.

Specific examples of the polysulfone resin include polysulfone "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

Examples of the polyester resin include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, polytrimethylene terephthalate resin, polytrimethylene naphthalate resin, polycyclohexane dimethyl terephthalate resin, and the like.

(E) The weight average molecular weight (Mw) of the thermoplastic resin is preferably 8,000 or more, more preferably 10,000 or more, particularly preferably 20,000 or more, from the viewpoint of significantly obtaining the effects of the present invention. , preferably 70,000 or less, more preferably 60,000 or less, particularly preferably 50,000 or less.

The amount of the thermoplastic resin (E) in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, and even more preferably is 1% by mass or more, preferably 10% by mass or less, more preferably 8% by mass or less, even more preferably 6% by mass or less. (E) When the amount of thermoplastic resin is within the above range, the effects of the present invention can be significantly obtained.

The amount of the thermoplastic resin (E) in the resin composition is preferably 0.1% by mass or more, more preferably 1% by mass or more, even more preferably 2% by mass, based on 100% by mass of the resin component in the resin composition. It is at least 30% by mass, more preferably at most 20% by mass, even more preferably at most 10% by mass. (E) When the amount of thermoplastic resin is within the above range, the effects of the present invention can be significantly obtained.

[7. (F) Elastomer]
The resin composition may further contain (F) an elastomer as an optional component in addition to the components described above. The elastomer as component (F) is a flexible resin, preferably a resin that has rubber elasticity or a resin that exhibits rubber elasticity by polymerizing with other components. Examples of rubber elasticity include resins that exhibit an elastic modulus of 1 GPa or less when subjected to a tensile test at a temperature of 25° C. and a humidity of 40% RH in accordance with Japanese Industrial Standards (JIS K7161).

In one embodiment, the elastomer (F) has a polybutadiene structure, a polysiloxane structure, a poly(meth)acrylate structure, a polyalkylene structure, a polyalkyleneoxy structure, a polyisoprene structure, a polyisobutylene structure, a polycarbonate structure, a polystyrene structure in the molecule. It is preferable that the resin has one or more types of structures selected from the following structures. "(Meth)acrylate" refers to methacrylate and acrylate.

In another embodiment, the elastomer (F) is preferably one or more selected from resins having a glass transition temperature (Tg) of 25°C or lower and resins that are liquid at 25°C or lower. The glass transition temperature (Tg) of the resin is preferably 20°C or lower, more preferably 15°C or lower. The lower limit of the glass transition temperature is not particularly limited, but it can usually be -15°C or higher. Further, the resin that is liquid at 25°C is preferably a resin that is liquid at 20°C or lower, and more preferably a resin that is liquid at 15°C or lower. Glass transition temperature can be measured by DSC (differential scanning calorimetry).

(F) The elastomer is usually an amorphous resin component that can be dissolved in an organic solvent. The (F) elastomer may be used alone or in combination of two or more in any ratio.

(F) As the elastomer, for example, a resin containing a polybutadiene structure can be mentioned. The polybutadiene structure may be included in the main chain or in the side chain. Moreover, a part or all of the polybutadiene structure may be hydrogenated. A resin containing a polybutadiene structure is sometimes referred to as a "polybutadiene resin." Specific examples of polybutadiene resins include "Ricon 130MA8", "Ricon 130MA13", "Ricon 130MA20", "Ricon 131MA5", "Ricon 131MA10", "Ricon 131MA17", and "Ricon 131" manufactured by Clay Valley. MA20”, “Ricon 184MA6” (polybutadiene containing acid anhydride groups), “GQ-1000” manufactured by Nippon Soda Co., Ltd. (polybutadiene with hydroxyl and carboxyl groups introduced), “G-1000”, “G-2000”, “G-3000” (polybutadiene containing acid anhydride groups) hydroxyl group polybutadiene), “GI-1000”, “GI-2000”, “GI-3000” (hydrogenated polybutadiene with hydroxyl groups at both ends), “FCA-061L” manufactured by Nagase ChemteX (hydrogenated polybutadiene skeleton epoxy resin), etc. Specific examples of polybutadiene resins include linear polyimides made from hydroxyl-terminated polybutadiene, diisocyanate compounds, and tetrabasic acid anhydrides (polyimides described in JP-A No. 2006-37083 and International Publication No. 2008/153208). ), phenolic hydroxyl group-containing butadiene, and the like. The content of the butadiene structure in the polyimide resin is preferably 60% by mass to 95% by mass, more preferably 75% by mass to 85% by mass. For details of the polyimide resin, the descriptions in JP-A No. 2006-37083 and International Publication No. 2008/153208 can be referred to, the contents of which are incorporated herein.

Examples of the elastomer (F) include resins containing a poly(meth)acrylate structure. A resin containing a poly(meth)acrylate structure is sometimes referred to as a "poly(meth)acrylic resin." Specific examples of poly(meth)acrylic resins include Teisan Resin manufactured by Nagase ChemteX, "ME-2000", "W-116.3", "W-197C", and "KG-25" manufactured by Negami Kogyo Co., Ltd. ”, “KG-3000”, etc.

(F) Examples of the elastomer include resins containing a polycarbonate structure. A resin containing a polycarbonate structure is sometimes referred to as a "polycarbonate resin." Specific examples of polycarbonate resins include "T6002" and "T6001" (polycarbonate diol) manufactured by Asahi Kasei Chemicals, and "C-1090", "C-2090", and "C-3090" (polycarbonate diol) manufactured by Kuraray Corporation. etc. It is also possible to use linear polyimides made from hydroxyl-terminated polycarbonates, diisocyanate compounds, and tetrabasic acid anhydrides. The content of carbonate structure in the polyimide resin is preferably 60% by mass to 95% by mass, more preferably 75% by mass to 85% by mass. For details of the polyimide resin, the description in International Publication No. 2016/129541 can be referred to, the contents of which are incorporated herein.

(F) Examples of the elastomer include resins containing a polysiloxane structure. A resin containing a polysiloxane structure is sometimes referred to as a "siloxane resin." Specific examples of siloxane resins include "SMP-2006", "SMP-2003PGMEA", and "SMP-5005PGMEA" manufactured by Shin-Etsu Silicone Co., Ltd., linear polyimides made from amine group-terminated polysiloxanes and tetrabasic acid anhydrides ( International Publication No. 2010/053185, JP 2002-12667, JP 2000-319386, etc.).

Examples of the elastomer (F) include resins containing a polyalkylene structure or a polyalkyleneoxy structure. A resin containing a polyalkylene structure is sometimes referred to as an "alkylene resin." Further, a resin containing a polyalkyleneoxy structure is sometimes referred to as an "alkyleneoxy resin." The polyalkyleneoxy structure is preferably a polyalkyleneoxy structure having 2 to 15 carbon atoms, more preferably a polyalkyleneoxy structure having 3 to 10 carbon atoms, and particularly preferably a polyalkyleneoxy structure having 5 to 6 carbon atoms. Specific examples of alkylene resins and alkyleneoxy resins include "PTXG-1000" and "PTXG-1800" manufactured by Asahi Kasei Fibers.

(F) As the elastomer, for example, a resin containing a polyisoprene structure can be mentioned. A resin containing a polyisoprene structure is sometimes referred to as an "isoprene resin." Specific examples of isoprene resins include "KL-610" and "KL613" manufactured by Kuraray.

(F) As the elastomer, for example, a resin containing a polyisobutylene structure can be mentioned. A resin containing a polyisobutylene structure is sometimes referred to as an "isobutylene resin." Specific examples of the isobutylene resin include "SIBSTAR-073T" (styrene-isobutylene-styrene triblock copolymer) and "SIBSTAR-042D" (styrene-isobutylene diblock copolymer) manufactured by Kaneka Corporation.

(F) Examples of the elastomer include resins containing a polystyrene structure. A resin containing a polystyrene structure is sometimes referred to as a "styrene resin." Examples of the styrene resin include styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene- Ethylene-propylene-styrene block copolymer (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymer (SEEPS), styrene-butadiene-butylene-styrene block copolymer (SBBS), styrene-butadiene diblock Examples include copolymers, hydrogenated styrene-butadiene block copolymers, hydrogenated styrene-isoprene block copolymers, hydrogenated styrene-butadiene random copolymers, and the like. Specific examples of styrene resins include hydrogenated styrene thermoplastic elastomer "H1041", "Tuftec H1043", "Tuftec P2000", "Tuftec MP10" (manufactured by Asahi Kasei Corporation); epoxidized styrene-butadiene thermoplastic elastomer "Epofriend" AT501", "CT310" (manufactured by Daicel); modified styrene elastomer with hydroxyl group "Septon HG252" (manufactured by Kuraray); modified styrene elastomer with carboxyl group "Tuftec N503M", modified styrene with amino group Elastomer "Tuftec N501", modified styrene elastomer with acid anhydride group "Tuftec M1913" (manufactured by Asahi Kasei Chemicals); unmodified styrene elastomer "Septon S8104" (manufactured by Kuraray); styrene-ethylene/butylene-styrene block Examples include copolymer "FG1924" (manufactured by Kraton).

(F) The number average molecular weight (Mn) of the elastomer is preferably 1,000 or more, more preferably 1,500 or more, even more preferably 3,000 or more, particularly preferably 5,000 or more, and preferably 1,000,000 or less, more preferably Preferably it is 900,000 or less. The number average molecular weight (Mn) can be measured in terms of polystyrene using GPC (gel permeation chromatography).

The amount of the elastomer (F) in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, even more preferably 1% by mass, based on 100% by mass of the nonvolatile components in the resin composition. It is at least 10% by mass, more preferably at most 8% by mass, even more preferably at most 6% by mass. (F) When the amount of elastomer is within the above range, the effects of the present invention can be significantly obtained.

The amount of the elastomer (F) in the resin composition is preferably 0.1% by mass or more, more preferably 1% by mass or more, and even more preferably 2% by mass, based on 100% by mass of the resin component in the resin composition. The content is preferably 30% by mass or less, more preferably 20% by mass or less, even more preferably 10% by mass or less. (F) When the amount of elastomer is within the above range, the effects of the present invention can be significantly obtained.

[8. (G) Solvent]
In addition to the above-mentioned components, the resin composition may further contain (G) a solvent as an optional component. The solvent is usually a volatile component and may be an organic solvent. (G) Solvents include, for example, ketone solvents such as acetone, methyl ethyl ketone (MEK) and cyclohexanone; acetate ester solvents such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate and carbitol acetate; cellosolve and Carbitol solvents such as butyl carbitol; aromatic hydrocarbon solvents such as toluene and xylene; amide solvents such as dimethylformamide, dimethylacetamide (DMAc) and N-methylpyrrolidone; and the like. (G) Solvents may be used alone or in combination of two or more in any ratio.

(G) The amount of solvent is not particularly limited. (G) The amount of the solvent is, for example, 60% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, 10% by mass or less, based on 100% by mass of all the components in the resin composition. It may be less than % by mass.

[9. Other ingredients]
The resin composition may further contain arbitrary additives as arbitrary components in addition to the above-mentioned components. Examples of such additives include thermosetting resins, organic fillers, thickeners, antifoaming agents, leveling agents, adhesion agents, flame retardants, and the like. These may be used alone or in combination of two or more in any ratio.

[10. Manufacturing method of resin composition]
The resin composition can be manufactured, for example, by mixing the components described above in any order. Further, in the process of mixing each component, heating and/or cooling may be performed by appropriately adjusting the temperature. Further, during or after mixing each component, stirring may be performed using a stirring device such as a mixer to uniformly disperse each component. Furthermore, if necessary, the resin composition may be subjected to defoaming treatment.

[11. Characteristics of resin composition]
According to the resin composition described above, an insulating layer having a low dielectric loss tangent and excellent adhesion strength to a conductor layer can be obtained.

Specifically, the cured product obtained by curing the resin composition described above can have a low dielectric loss tangent. Therefore, when an insulating layer is formed using this cured product, an insulating layer with a low dielectric loss tangent can be obtained. For example, the dielectric loss tangent Df of the cured product obtained by curing the resin composition under the conditions described in the Examples below is preferably 0.010 or less, more preferably 0.005 or less, and even more preferably 0.004 or less. , particularly preferably 0.003 or less. The lower limit of the dielectric loss tangent Df of the cured product is not particularly limited, but may be 0.001 or more. The dielectric loss tangent of the cured product can be measured by the method described in Examples.

Furthermore, when an insulating layer is formed from a cured product of a resin composition and a conductor layer is formed on the insulating layer by plating, the plating peel strength, which is the adhesion strength between the insulating layer and the conductor layer, can be increased. For example, when an insulating layer and a conductor layer are formed by the method described in Examples described below, the plating peel strength between the insulating layer and the conductor layer is preferably 0.2 kgf/cm or more, more preferably 0.2 kgf/cm or more. It may be 3 kgf/cm or more, particularly preferably 0.4 kgf/cm or more. The upper limit of the plating peel strength is not particularly limited, but may be, for example, 2.0 kgf/cm or less. The plating peel strength between the insulating layer and the conductive layer can be measured by the method described in Examples.

A cured product of the resin composition can usually have a small dielectric constant. For example, the dielectric constant Dk of the cured product obtained by curing the resin composition under the conditions described in the Examples below is preferably 3.5 or less, more preferably 3.2 or less, particularly preferably 3.0 or less. It is. The lower limit of the dielectric constant of the cured product is not particularly limited, but may be, for example, 2.0 or more. The dielectric constant of the cured product can be measured by the method described in Examples.

When an insulating layer is formed from a cured product of a resin composition, the surface roughness of the insulating layer after roughening treatment can usually be reduced. For example, when an insulating layer is formed and roughened by the method described in the Examples below, the arithmetic mean roughness Ra of the surface of the insulating layer is preferably 200 nm or less, more preferably 150 nm or less, and particularly preferably is 100 nm or less. The lower limit of the arithmetic mean roughness Ra is not particularly limited, but may be, for example, 10 nm or more. The arithmetic mean roughness Ra of the surface of the insulating layer can be measured by the method described in Examples.

[12. Applications of resin composition]
The resin composition according to one embodiment of the present invention is suitable as a resin composition for insulation purposes, and is particularly suitable as a resin composition for forming an insulation layer. Therefore, for example, the resin composition is suitable as a resin composition for forming an insulating layer of a printed wiring board (resin composition for forming an insulating layer of a printed wiring board). In addition, the resin composition is a resin composition for forming a conductor layer (including a rewiring layer) formed on an insulating layer (insulating layer formation for forming a conductor layer). It is suitable as a resin composition for The resin composition can also be used in applications where the resin composition can be used, such as sheet-like laminated materials such as resin sheets and prepregs, solder resists, underfill materials, die bonding materials, semiconductor sealing materials, hole filling resins, and component embedding resins. Can be used widely.

Further, for example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition according to the present embodiment can be used for rewiring formation as an insulating layer for forming a rewiring layer. It is also suitable as a resin composition for forming a layer (a resin composition for forming a rewiring formation layer) and a resin composition for sealing a semiconductor chip (a resin composition for sealing a semiconductor chip). . When the semiconductor chip package is manufactured, a rewiring layer may be further formed on the sealing layer.
(1) The step of laminating a temporary fixing film on the base material,
(2) Temporarily fixing the semiconductor chip on the temporary fixing film,
(3) forming a sealing layer on the semiconductor chip;
(4) Peeling the base material and temporary fixing film from the semiconductor chip,
(5) Forming a rewiring layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled; and (6) Forming a rewiring layer as a conductive layer on the rewiring layer. Forming process

The resin composition described above can also be used when the printed wiring board is a circuit board with built-in components.

[13. Sheet-like laminated material]
Although the resin composition according to one embodiment of the present invention can be applied and used in the form of a varnish, industrially it is preferable to use it in the form of a sheet-like laminate material containing the resin composition. As the sheet-like laminated material, the following resin sheets and prepregs are preferred.

The resin sheet includes a support and a resin composition layer formed from the resin composition described above on the support.

The thickness of the resin composition layer is preferably 50 μm or less, more preferably 50 μm or less, from the viewpoint of making the printed wiring board thinner and providing a cured product with excellent insulation even if the cured product of the resin composition is a thin film. Preferably it is 40 μm or less, more preferably 30 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited, but may be, for example, 3 μm or more, 5 μm or more, etc.

Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and a film made of a plastic material and a metal foil are preferred.

When using a film made of a plastic material as a support, examples of the plastic material include polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"). ), polyesters such as polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether Examples include ketones and polyimides. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

When using metal foil as the support, examples of the metal foil include copper foil, aluminum foil, etc., with copper foil being preferred. As the copper foil, a foil made of a single metal such as copper may be used, or a foil made of an alloy of copper and other metals (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used. May be used.

The surface of the support to be bonded to the resin composition layer may be subjected to surface treatment such as matte treatment, corona treatment, and antistatic treatment.

Further, as the support, a support with a release layer having a release layer on the surface to be bonded to the resin composition layer may be used. Examples of the release agent used in the release layer of the support with a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. . The support with a release layer may be a commercially available product, such as "SK-1" manufactured by Lintec Corporation, which is a PET film having a release layer containing an alkyd resin mold release agent as a main component. Examples include "AL-5", "AL-7", "Lumirror T60" manufactured by Toray Industries, "Purex" manufactured by Teijin, and "Unipeel" manufactured by Unitika.

The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, more preferably in the range of 10 μm to 60 μm. In addition, when using the support body with a mold release layer, it is preferable that the thickness of the whole support body with a mold release layer is in the said range.

In one embodiment, the resin sheet may further include an arbitrary layer as necessary. Examples of such an arbitrary layer include a protective film similar to the support provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite to the support). It will be done. The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dust and the like to the surface of the resin composition layer and scratches can be suppressed.

For the resin sheet, for example, a resin varnish is prepared by dissolving a resin composition in a solvent, and this resin varnish is applied onto a support using a coating device such as a die coater, and then dried to form a resin composition layer. It can be manufactured by forming. Examples of the solvent include the same solvents as those described as component (G) that may be included in the resin composition. One type of solvent may be used alone, or two or more types may be used in combination in any ratio.

Drying may be performed by heating, blowing hot air, or the like. Although drying conditions are not particularly limited, drying is performed so that the content of organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. Although it varies depending on the boiling point of the organic solvent in the resin varnish, for example, when using a resin varnish containing 30% to 60% by mass of organic solvent, the resin composition can be adjusted by drying at 50°C to 150°C for 1 to 10 minutes. A material layer can be formed.

The resin sheet can be stored by winding it up into a roll. When the resin sheet has a protective film, it can be used by peeling off the protective film.

In one embodiment, the prepreg is formed by impregnating a sheet-like fibrous base material with a resin composition.

The sheet-like fiber base material used for the prepreg is not particularly limited, and examples thereof include glass cloth, aramid nonwoven fabric, liquid crystal polymer nonwoven fabric, and the like. From the viewpoint of making the printed wiring board thinner, the thickness of the sheet-like fiber base material is preferably 50 μm or less, more preferably 40 μm or less, still more preferably 30 μm or less, particularly preferably 20 μm or less. The lower limit of the thickness of the sheet-like fiber base material is not particularly limited, but is usually 10 μm or more.

Prepreg can be manufactured by a known method such as a hot melt method or a solvent method.

The thickness of the prepreg may be in the same range as the resin composition layer in the resin sheet described above.

[14. Printed wiring board]
A printed wiring board according to an embodiment of the present invention includes an insulating layer formed of a cured product obtained by curing the resin composition described above.

A printed wiring board can be manufactured, for example, using the above-mentioned resin sheet by a method including the following steps (I) and (II).
(I) Step of laminating the resin sheet on the inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate (II) Step of curing the resin composition layer to form an insulating layer

The "inner layer substrate" used in step (I) is a member that becomes a substrate of a printed wiring board, and includes, for example, a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate. etc. Further, the substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. An inner layer board having a conductor layer formed on one or both sides of the board is sometimes referred to as an "inner layer circuit board." Further, when manufacturing a printed wiring board, an intermediate product on which an insulating layer and/or a conductive layer is further formed is also included in the "inner layer board". If the printed wiring board is a circuit board with built-in components, an inner layer board with built-in components may be used.

The inner layer substrate and the resin sheet can be laminated, for example, by heat-pressing the resin sheet to the inner layer substrate from the support side. Examples of the member for heat-pressing the resin sheet to the inner layer substrate (hereinafter also referred to as "heat-pressing member") include a heated metal plate (SUS mirror plate, etc.) or a metal roll (SUS roll, etc.). Note that, instead of pressing the thermocompression bonding member directly onto the resin sheet, it is preferable to press the resin sheet through an elastic material such as heat-resistant rubber so that the resin sheet sufficiently follows the surface irregularities of the inner layer substrate.

The inner layer substrate and the resin sheet may be laminated by a vacuum lamination method. In the vacuum lamination method, the heat-pressing temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C, and the heat-pressing pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably 0. The pressure is in the range of .29 MPa to 1.47 MPa, and the heat-pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. Lamination may be carried out under reduced pressure conditions, preferably at a pressure of 26.7 hPa or less.

Lamination can be performed using a commercially available vacuum laminator. Examples of commercially available vacuum laminators include a vacuum pressure laminator manufactured by Meiki Seisakusho, a vacuum applicator manufactured by Nikko Materials, and a batch vacuum pressure laminator.

After lamination, the laminated resin sheets may be smoothed under atmospheric pressure, for example, by pressing a thermocompression bonding member from the support side. The pressing conditions for the smoothing treatment can be the same as the conditions for the heat-pressing of the lamination described above. The smoothing process can be performed using a commercially available laminator. Note that the lamination and smoothing treatment may be performed continuously using the above-mentioned commercially available vacuum laminator.

The support may be removed between step (I) and step (II) or after step (II).

In step (II), the resin composition layer is cured to form an insulating layer made of a cured product of the resin composition. The curing conditions for the resin composition layer are not particularly limited, and conditions employed when forming an insulating layer of a printed wiring board may be used. Although the resin composition layer may be cured by irradiation with active energy rays such as ultraviolet rays, it is usually thermally cured by heating.

For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, but in one embodiment, the curing temperature is preferably 120°C to 240°C, more preferably 150°C to 220°C, and even more preferably The temperature is 170°C to 210°C. The curing time can be preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, even more preferably 15 minutes to 100 minutes.

Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermosetting the resin composition layer, the resin composition layer is cured for 5 minutes or more at a temperature of 50°C to 120°C, preferably 60°C to 115°C, more preferably 70°C to 110°C. Preheating may be performed preferably for 5 minutes to 150 minutes, more preferably for 15 minutes to 120 minutes, even more preferably for 15 minutes to 100 minutes.

The method for manufacturing a printed wiring board may further include the steps of (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer. When the support is removed after step (II), the support may be removed between step (II) and step (III), between step (III) and step (IV), or between step (IV) and step (V). Furthermore, if necessary, the steps (I) to (V) for forming the insulating layer and the conductor layer may be repeated to form a multilayer wiring board.

In other embodiments, printed wiring boards can be manufactured using the prepregs described above. The manufacturing method is basically the same as when using a resin sheet.

Step (III) is a step of drilling a hole in the insulating layer, whereby holes such as via holes and through holes can be formed in the insulating layer. Step (III) may be carried out using, for example, a drill, laser, plasma, etc., depending on the composition of the resin composition used to form the insulating layer. The size and shape of the hole may be determined as appropriate depending on the design of the printed wiring board.

Step (IV) is a step of roughening the insulating layer. Usually, smear is also removed in this step (IV). The procedure and conditions for the roughening treatment are not particularly limited. For example, the insulating layer can be roughened by performing a swelling treatment using a swelling liquid, a roughening treatment using an oxidizing agent, and a neutralization treatment using a neutralizing liquid in this order.

Examples of the swelling liquid used in the roughening treatment include alkaline solutions, surfactant solutions, etc., and preferably alkaline solutions. As the alkaline solution, sodium hydroxide solution and potassium hydroxide solution are more preferable. Examples of commercially available swelling liquids include "Swelling Dip Securigance P" and "Swelling Dip Securigance SBU" manufactured by Atotech Japan. Swelling treatment with a swelling liquid is not particularly limited, but can be carried out, for example, by immersing the insulating layer in a swelling liquid at 30° C. to 90° C. for 1 minute to 20 minutes. From the viewpoint of suppressing the swelling of the resin in the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40° C. to 80° C. for 5 minutes to 15 minutes.

Examples of the oxidizing agent used in the roughening treatment include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment with an oxidizing agent such as an alkaline permanganic acid solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60° C. to 100° C. for 10 minutes to 30 minutes. Further, the concentration of permanganate in the alkaline permanganic acid solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Securigance P" manufactured by Atotech Japan.

The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and a commercially available product includes, for example, "Reduction Solution Securigant P" manufactured by Atotech Japan. The treatment with the neutralizing liquid can be carried out by immersing the treated surface, which has been roughened with an oxidizing agent, in the neutralizing liquid at 30° C. to 80° C. for 5 minutes to 30 minutes. From the viewpoint of workability, it is preferable to immerse the object that has been roughened with an oxidizing agent in a neutralizing solution at 40° C. to 70° C. for 5 minutes to 20 minutes.

In one embodiment, the arithmetic mean roughness Ra of the surface of the insulating layer after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and still more preferably 300 nm or less. The lower limit is not particularly limited, and may be, for example, 1 nm or more, 2 nm or more, etc. Further, the root mean square roughness (Rq) of the surface of the insulating layer after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and still more preferably 300 nm or less. The lower limit is not particularly limited, and may be, for example, 1 nm or more, 2 nm or more, etc. The arithmetic mean roughness (Ra) and root mean square roughness (Rq) of the surface of the insulating layer can be measured using a non-contact surface roughness meter.

Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer includes one or more selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. Contains metal. The conductor layer may be a single metal layer or an alloy layer, and the alloy layer may be, for example, an alloy of two or more metals selected from the above group (for example, a nickel-chromium alloy, a copper-chromium alloy, a copper-chromium alloy, etc.). nickel alloys and copper-titanium alloys). Among these, from the viewpoint of versatility in forming conductor layers, cost, ease of patterning, etc., monometallic layers of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, nickel-chromium alloys, copper, etc. An alloy layer of nickel alloy or copper/titanium alloy is preferable, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or an alloy layer of nickel/chromium alloy is more preferable, and a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper is more preferable. A metal layer is more preferred.

The conductor layer may have a single layer structure, or may have a multilayer structure in which two or more single metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductor layer has a multilayer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc, or titanium, or an alloy layer of nickel-chromium alloy.

The thickness of the conductor layer depends on the desired printed wiring board design, but is generally between 3 μm and 35 μm, preferably between 5 μm and 30 μm.

The conductor layer is preferably formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer by a method such as a semi-additive method or a fully additive method. From the viewpoint of manufacturing simplicity, it is preferable to form by a semi-additive method. An example of forming a conductor layer by a semi-additive method will be shown below.

A plating seed layer is formed on the surface of the insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer to expose a portion of the plating seed layer corresponding to a desired wiring pattern. After forming a metal layer on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layers can be removed by etching or the like to form a conductor layer having a desired wiring pattern.

[15. Semiconductor device]
A semiconductor device according to an embodiment of the present invention includes the above-described printed wiring board. This semiconductor device can be manufactured using the above-described printed wiring board.

Examples of semiconductor devices include various semiconductor devices used in electrical products (eg, computers, mobile phones, digital cameras, televisions, etc.), vehicles (eg, motorcycles, automobiles, trains, ships, aircraft, etc.), and the like.

Hereinafter, the present invention will be specifically explained by showing examples. However, the present invention is not limited to the following examples. In the following description, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. Further, the operations described below were performed in an environment of normal temperature and normal pressure unless otherwise specified.

[Preparation of maleimide compound]
An MEK solution (70% by mass of non-volatile components) of maleimide compound A ₁ synthesized by the method described in Synthesis Example 1 of Japan Institute of Invention and Innovation Publication No. 2020-500211 was prepared. This maleimide compound A ₁ has a structure represented by the following formula.

When measuring the FD-MS spectrum of maleimide compound A ₁ , peaks at M+=560, 718, and 876 are confirmed. These peaks correspond to n ₁ of 0, 1 and 2, respectively. Furthermore, when the maleimide compound A ₁ is analyzed by GPC and the value of the number n ₁ of repeating units in the indane skeleton portion is determined based on the number average molecular weight, n ₁ = 1.47, and the molecular weight distribution (Mw/Mn) =1.81. Furthermore, the content ratio of the maleimide compound having an average repeating unit number n ₁ of 0 in the total amount of 100 area % of the maleimide compound A ₁ is 26.5 area %.

The FD-MS spectrum of the maleimide compound A ₁ described above was measured using the following measuring device and measuring conditions.
(FD-MS spectrum measurement device and measurement conditions)
Measuring device: JMS-T100GC AccuTOF
Measurement conditions Measurement range: m/z = 4.00 to 2000.00
Rate of change: 51.2mA/min
Final current value: 45mA
Cathode voltage: -10kV
Recording interval: 0.07sec

The GPC of the maleimide compound _A1 described above is measured using the following measuring device and measuring conditions.
Measuring device: “HLC-8320 GPC” manufactured by Tosoh Corporation
Column: Tosoh guard column “HXL-L”, Tosoh “TSK-GEL G2000HXL”, Tosoh “TSK-GEL G2000HXL”, Tosoh “TSK-GEL G3000HXL”, and Tosoh “TSK” -GEL G4000HXL”
Detector: RI (differential refractometer)
Data processing: “GPC Workstation EcoSEC-WorkStation” manufactured by Tosoh Corporation
Measurement conditions: Column temperature 40℃
Developing solvent Tetrahydrofuran
Flow rate: 1.0 ml/min Standard: Monodisperse polystyrene with a known molecular weight is used in accordance with the measurement manual of the "GPC Workstation EcoSEC-WorkStation".
Sample: A tetrahydrofuran solution containing 1.0% by mass in terms of nonvolatile components of a maleimide compound was filtered through a microfilter (50 μl).

The molecular weight distribution (weight average molecular weight (Mw)/number average molecular weight (Mn)) of maleimide compound A ₁ and the average number of repeating units “n ₁ ” contributing to the indane skeleton in the maleimide compound were obtained by the above-mentioned GPC measurement. It represents what was calculated from the GPC chart obtained. Moreover, the average number of repeating units "n ₁ " represents that calculated based on the number average molecular weight (Mn). Specifically, for compounds where n ₁ is 0 to 4, the theoretical molecular weight and the actual molecular weight measured by GPC are plotted on a scatter diagram, and an approximate straight line is drawn. Then, the number average molecular weight (Mn) is determined from the point indicated by the measured value Mn(1) on this straight line, and "n ₁ ", which is the average repeating unit, is further calculated. Further, based on the results of the GPC measurement, the content ratio (area %) of the maleimide compound having an average repeating unit number n ₁ of 0 in the total amount of 100 area % of the maleimide compound A ₁ is calculated. For details, reference may be made to Japan Institute of Invention and Innovation Publication No. 2020-500211.

[Example 1]
20 parts of the above-mentioned maleimide compound A ₁ (a solution with a non-volatile content of 70% by mass), a radically polymerizable aromatic resin ("OPE-2St" manufactured by Mitsubishi Gas Chemical Co., Ltd., number average molecular weight 1200), a toluene solution with a non-volatile content of 65% by mass. ), 0.5 parts of a polymerization initiator (peroxide "Perbutyl (registered trademark) C" manufactured by NOF Corporation), and an inorganic filler (amine-based alkoxysilane compound ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.)). 50 parts of surface-treated spherical silica (“SO-C2” manufactured by Admatex, average particle size 0.5 μm, specific surface area 5.8 m ² /g) and ester type phenoxy resin (“YL7891BH30” manufactured by Mitsubishi Chemical Corporation) , a 1:1 solution of MEK and cyclohexanone with a solid content of 30% by mass) were mixed and uniformly dispersed using a high-speed rotating mixer to obtain a resin varnish.

As a support, a polyethylene terephthalate film ("AL5" manufactured by Lintec Corporation, thickness 38 μm) provided with a release layer was prepared. The above resin varnish was uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying was 40 μm. Thereafter, the resin varnish was dried at 80° C. to 100° C. (average 90° C.) for 4 minutes to obtain a resin sheet including a support and a resin composition layer.

[Example 2]
As the radically polymerizable aromatic resin, instead of "OPE-2St" manufactured by Mitsubishi Gas Chemical, "ODV-XET (X04)" manufactured by Nippon Steel Chemical & Materials (weight average molecular weight 3110, vinyl group equivalent 380 g/eq. , 65% by mass solution) was used. A resin varnish and a resin sheet were manufactured in the same manner as in Example 1 except for the above matters.

[Example 3]
As the radically polymerizable aromatic resin, 20 parts of "SA9000-111" (number average molecular weight 1850-1950) manufactured by SABIC was used instead of "OPE-2St" manufactured by Mitsubishi Gas Chemical. A resin varnish and a resin sheet were manufactured in the same manner as in Example 1 except for the above matters.

[Example 4]
The amount of maleimide compound A ₁ (a solution containing 70% by mass of non-volatile components) was changed from 20 parts to 15 parts. In addition, 5 parts of a biphenylaralkyl maleimide compound ("MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., maleimide group equivalent: 275 g/eq., MEK/toluene mixed solution with non-volatile content of 70%) was added to the resin composition. Ta. A resin varnish and a resin sheet were manufactured in the same manner as in Example 1 except for the above matters.

[Example 5]
The amount of maleimide compound A ₁ (a solution containing 70% by mass of non-volatile components) was changed from 20 parts to 18 parts. Further, 2 parts of a liquid aliphatic maleimide compound ("BMI-1500" manufactured by Designer Molecules, maleimide group equivalent: 750 g/eq.) was added to the resin composition. A resin varnish and a resin sheet were manufactured in the same manner as in Example 1 except for the above matters.

[Example 6]
Instead of 10 parts of an ester phenoxy resin (YL7891BH30 manufactured by Mitsubishi Chemical Corporation, a 1:1 solution of MEK and cyclohexanone with a solid content of 30% by mass), an elastomer (styrene-ethylene/butylene-styrene block copolymer manufactured by Kraton) was used. 3 parts of the combined "FG1924") were used. A resin varnish and a resin sheet were manufactured in the same manner as in Example 1 except for the above matters.

[Comparative example 1]
Maleimide compound A ₁ (70% by weight solution of non-volatile components) was not used. Further, the amount of the radically polymerizable aromatic resin ("OPE-2St" manufactured by Mitsubishi Gas Chemical Co., Ltd., a toluene solution with a non-volatile content of 65% by mass) was changed from 20 parts to 40 parts. A resin varnish and a resin sheet were manufactured in the same manner as in Example 1 except for the above matters.

[Comparative example 2]
Maleimide compound A ₁ (solution of 70% by weight of non-volatile components) and were not used. In addition, as a radically polymerizable aromatic resin, "ODV-XET (X04)" manufactured by Nippon Steel Chemical & Materials Co., Ltd. (weight average molecular weight 3110, vinyl group equivalent weight 380 g/ eq., 65% by mass solution) 40 parts were used. A resin varnish and a resin sheet were manufactured in the same manner as in Example 1 except for the above matters.

[Comparative example 3]
Maleimide compound A ₁ (solution of 70% by weight of non-volatile components) and were not used. Further, as a radically polymerizable aromatic resin, 40 parts of "SA9000-111" (number average molecular weight 1850-1950) manufactured by SABIC was used instead of "OPE-2St" manufactured by Mitsubishi Gas Chemical. A resin varnish and a resin sheet were manufactured in the same manner as in Example 1 except for the above matters.

[Comparative example 4]
Instead of maleimide compound A ₁ , 20 parts of a biphenylaralkyl maleimide compound (Nippon Kayaku Co., Ltd. "MIR-3000-70MT", maleimide group equivalent: 275 g/eq., MEK/toluene mixed solution with non-volatile content of 70%) was added. Using. A resin varnish and a resin sheet were manufactured in the same manner as in Example 1 except for the above matters.

[Measurement of dielectric properties]
The resin sheets produced in Examples and Comparative Examples were heated at 200° C. for 90 minutes to thermoset the resin composition layer. Thereafter, the support was peeled off to obtain a cured resin composition. This cured product was cut into test pieces with a width of 2 mm and a length of 80 mm. Regarding the test piece, the dielectric constant Dk and the dielectric loss tangent Df were measured by the cavity resonance perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23° C. using "HP8362B" manufactured by Agilent Technologies. Measurements were performed on three test pieces, and the average values are shown in the table below.

[Measurement of plating peel strength]
(1) Surface treatment of inner layer circuit board:
As the inner layer circuit board, a glass cloth base epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, board thickness 0.4 mm, “R1515A” manufactured by Panasonic Corporation) having inner layer circuits (copper foil) on both sides was prepared. . Both surfaces of this inner layer circuit board were etched by 1 μm using "CZ8101" manufactured by MEC Co., Ltd. to roughen the copper surface.

(2) Lamination of resin sheet:
The resin sheet was laminated on both sides of the inner layer circuit board using a batch type vacuum pressure laminator (manufactured by Nikko Materials, 2-stage build-up laminator, CVP700). This lamination was carried out so that the resin composition layer of the resin sheet was in contact with the inner layer circuit board. Further, this lamination was carried out by reducing the pressure for 30 seconds to bring the atmospheric pressure to 13 hPa or less, and then press-bonding at 130° C. and a pressure of 0.74 MPa for 45 seconds. Then, hot pressing was performed at 120° C. and a pressure of 0.5 MPa for 75 seconds.

(3) Curing of resin composition:
The laminated resin sheet and inner layer circuit board were heated at 130° C. for 30 minutes, and then heated at 170° C. for 30 minutes to cure the resin composition and form an insulating layer. Thereafter, the support was peeled off to obtain a laminated board comprising an insulating layer, an inner circuit board, and an insulating layer in this order.

(4) Roughening treatment:
The laminated substrate was immersed in a swelling liquid (Swelling Dip Securigant P containing diethylene glycol monobutyl ether (aqueous solution of glycol ethers and sodium hydroxide) manufactured by Atotech Japan Co., Ltd.) at 60° C. for 10 minutes. Next, the laminated substrate was immersed in a roughening solution (Atotech Japan Co., Ltd. Concentrate Compact P (aqueous solution of KMnO ₄ : 60 g/L, NaOH: 40 g/L) at 80° C. for 20 minutes. After that, The laminated substrate was immersed in a neutralizing solution (Reduction Shoryushin Securigant P (aqueous sulfuric acid solution) manufactured by Atotech Japan Co., Ltd.) at 40°C for 5 minutes.Then, the laminated substrate was dried at 80°C for 30 minutes. "Evaluation board A" was obtained.

(5) Plating using semi-additive method:
Evaluation board A was immersed in an electroless plating solution containing PdCl ₂ at 40° C. for 5 minutes, and then in an electroless copper plating solution at 25° C. for 20 minutes. Thereafter, annealing treatment was performed by heating at 150° C. for 30 minutes. After that, an etching resist was formed and a pattern was formed by etching. Thereafter, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 20 μm. Next, an annealing treatment was performed at 200° C. for 60 minutes to obtain an “evaluation substrate B”.

(6) Measurement of plating peel strength:
A notch was formed in the conductor layer of evaluation board B to surround a rectangular portion with a width of 10 mm and a length of 100 mm. One end of the rectangular portion was peeled off and gripped with a grip (manufactured by TSE, Autocom type tester "AC-50C-SL"). The rectangular portion was peeled off in the vertical direction using a grip at room temperature at a speed of 50 mm/min, and the load (kgf/cm) when 35 mm was peeled off was measured as the plating peel strength.

[Measurement of surface roughness Ra]
The arithmetic mean roughness Ra of the surface of the insulating layer of the evaluation board A produced in the above [Measurement of plating peel strength] was measured. The measurement was performed using a non-contact surface roughness meter (WYKO NT3300 manufactured by Beco Instruments) in VSI mode with a 50x lens, with a measurement range of 121 μm x 92 μm. This measurement was performed at 10 measurement points, and the average values are shown in the table below.

[result]
The results of Examples and Comparative Examples are shown in Table 1 below.

Claims (12)

(A) a maleimide compound, (B) a resin containing an aromatic ring and a radically polymerizable unsaturated group, and (D) an inorganic filler,
(A) the maleimide compound includes (A-1) a maleimide compound containing a trimethylindane skeleton,
(A-1) The amount of the component is 10% by mass or more and 50% by mass or less with respect to 100% by mass of nonvolatile components in the resin composition,
The amount of component (B) is 5% by mass or more and 50% by mass or less based on 100% by mass of nonvolatile components in the resin composition,
(D) A resin composition (cyanic acid represented by the following formula (1)) in which the amount of inorganic filler is 40 % by mass or more and 80% by mass or less with respect to 100% by mass of nonvolatile components in the resin composition. (excluding resin compositions containing ester compound A1 and cyanate ester compound A2 represented by the following formula (2), and resin compositions containing boron nitride).

(In the formula, each R independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more.)

The resin composition according to claim 1, wherein the component (A-1) includes a structure represented by the following formula (A4).

(In formula (A4),
Ar ^a1 represents a divalent aromatic hydrocarbon group which may have a substituent;
R ^a1 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, a carbon represents an aryloxy group having 6 to 10 atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group;
R ^a2 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, a carbon represents an aryloxy group having 6 to 10 atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group;
R ^a3 each independently represents a divalent aliphatic hydrocarbon group;
n _a1 represents a positive integer;
n _a2 each independently represents an integer from 0 to 4;
n _a3 each independently represents an integer from 0 to 3.
The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^a1 may be substituted with a halogen atom.
The hydrogen atom of the alkyl group, alkyloxy group, alkylthio group, aryl group, aryloxy group, arylthio group, and cycloalkyl group of R ^a2 may be substituted with a halogen atom.
When n _a2 is 2 to 4, R ^a1 may be the same or different within the same ring.
When n _a3 is 2 to 3, R ^a2 may be the same or different within the same ring. ) The resin composition according to claim 1 or 2, wherein the amount of component (A-1) is 10% by mass or more and 70% by mass or less, based on 100% by mass of the resin component in the resin composition. The resin composition according to any one of claims 1 to 3, wherein the amount of component (A) is 10% by mass or more and 80% by mass or less, based on 100% by mass of the resin component in the resin composition. The resin composition according to any one of claims 1 to 4, wherein the component (B) contains a group represented by the following formula (B1).

(In formula (B1), R ^A1 , R ^A2 and R ^A3 each independently represent a hydrogen atom or an alkyl group; R ^A4 each independently represents an alkyl group; m _a1 represents 0 or 1; (Representation: m _a2 represents an integer from 0 to 4; * represents a bond.) The resin composition according to any one of claims 1 to 5, wherein the amount of component (B) is 10% by mass or more and 80% by mass or less, based on 100% by mass of the resin component in the resin composition. The resin composition according to any one of claims 1 to 6, further comprising (C) a polymerization initiator. The resin composition according to any one of claims 1 to 7, which is used for forming an insulating layer. A cured product of the resin composition according to any one of claims 1 to 8. A resin sheet comprising a support and a resin composition layer formed from the resin composition according to any one of claims 1 to 8 on the support. A printed wiring board comprising an insulating layer formed from a cured product of the resin composition according to any one of claims 1 to 8. A semiconductor device comprising the printed wiring board according to claim 11.