KR20210119688A - Photosensitive resin composition, insulation film manufactured and display device by using the same - Google Patents

Abstract

The present invention relates to a photosensitive resin composition, an insulating film manufactured therefrom, and an image display device. The photosensitive resin composition according to the present invention comprises: a binder resin; a photopolymerizable compound; a polymerization initiator; a metal ion trapping agent; and a solvent. The photosensitive resin composition comprises a metal ion trapping agent so as to have excellent pattern characteristics and chemical resistance, and at the same time has an excellent effect of effectively suppressing corrosion of metal located inside a display device.

Description

Photosensitive resin composition, insulating film and image display device manufactured using the same

The present invention relates to a photosensitive resin composition, an insulating film manufactured using the same, and an image display device.

Recently, the display industry has undergone a rapid change from a cathode-ray tube (CRT) to a flat panel display represented by a plasma display panel (PDP), an organic light-emitting diode (OLED), and a liquid-crystal display (LCD). Among them, a liquid crystal display (LCD) is one of the currently widely used flat panel display devices, in which a thin film transistor (TFT) substrate on which a pixel electrode is formed and a color filter substrate on which a common electrode is formed face each other, and between the A liquid crystal layer is inserted. In such a liquid crystal display, a panel is formed by introducing a color filter layer and a liquid crystal layer to an organic substrate on which a TFT-array is formed, and then an electrical signal is applied to display.

As a protective film to protect and insulate the TFT (Thin Film Transistor) circuit included in the display, an inorganic protective film such as silicon nitride has been conventionally used, but it is difficult to improve the aperture ratio due to the high dielectric constant value. In order to overcome this problem, the demand for an insulating film having a low dielectric constant tends to increase.

As such an insulating film, a photosensitive resin, which is a polymer compound whose solubility in a specific solvent is changed by chemical reaction with light and electron beams, is generally used. by crosslinking reaction. In particular, the insulating film material utilizes the property of changing solubility in a solvent such as an aqueous alkali solution after exposure.

Basically, in order for a photosensitive resin to be used for an insulating film, it must have high sensitivity, high transmittance, excellent coating properties, and storage stability, and heat resistance is required because it is exposed to high temperatures during the liquid crystal alignment film forming process and the electrode forming process in the subsequent process.

In addition, in order to realize high productivity, it is necessary to have the ability of uniformity of the coating, which is important in the substrate size that is becoming larger and larger. In addition, since the electrode pattern is exposed to a stripper or an alkali developer during the process of forming or developing, chemical resistance is also required.

In addition, the copper wiring of the display substrate is easily corroded and damaged due to the penetration of ionic impurities, oxygen, moisture, etc. introduced into the substrate from the outside during the circuit process, so it is necessary to effectively prevent corrosion of the metal wiring is becoming

Existing prior art such as Korean Patent Registration No. 10-1249997 has tried to provide a photosensitive resin composition for an insulating film with improved heat resistance, chemical resistance, dielectric constant and storage stability, etc., but An insulating film having a property of effectively preventing corrosion of copper wiring, or a photosensitive resin composition for an insulating film therefor is not known.

Republic of Korea Patent Publication No. 10-1249997 (2013.04.03. Announcement)

In order to solve the problems of the prior art, the present invention provides a photosensitive resin composition capable of effectively improving corrosion of metal located in a display device while maintaining excellent pattern and chemical resistance properties by including a metal ion scavenger, and at the same time An object of the present invention is to provide an insulating film and an image display device manufactured using the same.

The present invention provides a photosensitive resin composition comprising a binder resin, a photopolymerizable compound, a photoinitiator, a metal ion trapping body, and a solvent.

The metal ion trap may include two or more metals selected from Zr, Mg, and Al.

In addition, the present invention provides an insulating film, characterized in that made of the photosensitive resin composition.

In addition, the present invention provides an image display device including the insulating film.

The photosensitive resin composition according to the present invention, an insulating film and an image display device manufactured using the same, contain a metal ion scavenger, and thus have excellent characteristics such as pattern and chemical resistance, and at the same time effectively improve corrosion of metal located in the display device. It can provide an excellent effect.

The present invention provides a photosensitive resin composition capable of maintaining excellent pattern and chemical resistance properties by including a metal ion scavenger, and at the same time effectively improving corrosion of metal located in a display device, an insulating film and an image display device manufactured using the same to provide.

Hereinafter, the present invention will be described in detail.

<Photosensitive resin composition>

The photosensitive resin composition according to the present invention includes a binder resin, a photopolymerizable compound, a photopolymerization initiator, a metal ion trapping body, and a solvent.

binder resin

The binder resin contained in the photosensitive resin composition of the present invention is not particularly limited as long as it has reactivity and alkali solubility under the action of light or heat, and may be a matrix resin for forming an insulating film.

The binder resin may act to form a pattern by making the non-exposed portion of the photosensitive resin layer formed by using the photosensitive resin composition alkali-soluble.

The binder resin can be selected from various polymers used in the technical field, and typically, a binder resin including an epoxy group can be selected to improve reliability, and the functional groups constituting the binder resin can be used in a combination suitable for a desired purpose. have.

The binder resin including the epoxy group may be selected from various polymers used in the applicable technical field, but may preferably be a compound represented by the following formula (1).

[Formula 1]

In Formula 1,

R ₁ and R ₂ are each independently hydrogen or CH ₃ , and may preferably be hydrogen.

a and b are each independently an integer of 3 to 20, preferably an integer of 5 to 15.

The binder resin including the epoxy group contains at least one monomer that is a 3,4-epoxytricyclo[5.2.1.0 ^2,6 ]decane ring-containing compound and at least one monomer that is an unsaturated carboxylic acid or an acid anhydride thereof. It may be copolymerized.

The 3,4-epoxytricyclo[5.2.1.0 ^2,6 ]decane ring-containing compound is, 3,4-epoxytricyclo[5.2.1.0 ^2,6 ]decan-9-ylacrylate, 3,4-epoxy tricyclo [5.2.1.0 ^2,6 ] decan-8-yl acrylate, acryl acid, etc., and 3,4-epoxy tricyclo [5.2.1.0 ^2,6 ] decan-9-yl acrylate and 3,4 -Epoxytricyclo[5.2.1.0 ^2,6 ]decan-8-yl acrylate is preferably a mixture, and the 3,4-epoxytricyclo[5.2.1.0 ^2,6 ]decan-9-ylacrylate It is more preferable that 3,4-epoxytricyclo[5.2.1.0 ^2,6 ]decan-8-ylacrylate is mixed in a volume ratio of 50:50.

The carboxylic acid or its acid anhydride is ?, ?-unsaturated carboxylic acids such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, and acid anhydrides thereof (maleic anhydride) acid, itaconic anhydride, etc.), preferably methacrylic acid.

The binder resin according to the present invention may affect the patterning process of the photosensitive resin composition depending on the acid value and molecular weight.

The acid value is a value measured as the amount (mg) of potassium hydroxide required to neutralize 1 g of the acrylic polymer, and can be usually obtained by titration using an aqueous potassium hydroxide solution, and may affect pattern formation during the process.

The acid value of the binder resin is preferably in the range of 20 to 200 (KOH mg/g). When the acid value is in the above range, the solubility in the developer is improved, so that the non-exposed portion is easily dissolved and the sensitivity is increased, so that the pattern of the exposed portion remains at the time of development, which is preferable, thereby improving the film remaining ratio.

The molecular weight of the binder resin may affect the viscosity of the composition and the surface of the formed pattern, and the polystyrene equivalent weight average molecular weight measured by gel permeation chromatography (GPC; using tetrahydrofuran as the elution solvent) A binder resin having a weight average molecular weight ') of 3,000 to 200,000, preferably 5,000 to 100,000 is preferred. When the molecular weight is in the above range, the hardness of the coating film is improved, the film remaining rate is high, the solubility of the non-exposed part in the developer is excellent, and the resolution tends to be improved, which is preferable.

The molecular weight distribution [weight average molecular weight (Mw)/number average molecular weight (Mn)] of the binder resin is preferably 1.5 to 6.0, more preferably 1.8 to 4.0. A molecular weight distribution [weight average molecular weight (Mw)/number average molecular weight (Mn)] of 1.5 to 6.0 is preferable because developability is excellent.

The binder resin of the present invention may be included in an amount of 10 to 80% by weight based on the total weight of the solid content in the photosensitive resin composition. When the binder resin is included in the above range, the solubility in the developer is sufficient, so that it is difficult to generate a developing residue on the substrate in the non-pixel portion, and it is difficult to reduce the film in the pixel portion of the exposed portion during development, so that the non-pixel portion is omitted. This is preferable because it tends to be favorable.

In the present invention, "solid content" means a component excluding a solvent in the total composition of the photosensitive resin composition.

photopolymerizable compound

The present invention includes a photopolymerizable compound capable of forming a photosensitive resin layer by performing a photoreaction with a photoinitiator.

The photopolymerizable compound contained in the photosensitive resin composition of the present invention may include an unsaturated group and generally used (meth)acrylate as a functional group, and if it contains an unsaturated group and has photosensitivity, its use is not limited.

Specific examples of the photopolymerizable compound include a compound obtained by reacting a polyhydric alcohol with α, β-unsaturated carboxylic acid; bisphenol A (meth)acrylate compounds such as bisphenol A di(meth)acrylate compounds and hydrogenated bisphenol A di(meth)acrylate compounds; a compound obtained by reacting a glycidyl group-containing compound with α, β-unsaturated carboxylic acid; Urethane monomers, such as a (meth)acrylate compound which has a urethane bond in a molecule|numerator; nonylphenoxypolyethyleneoxyacrylate; phthalic acid-based compounds; (meth)acrylic acid alkyl ester; polyalkylene glycol (meth)acrylate compounds; trimethylolpropane (meth)acrylate compound; trimethylolpropane triacrylate (TMPT); pentaerythritol triacrylate (PETA); and dipentaerythritol hexaacrylate (DPHA). Each of the photopolymerizable compounds exemplified above may be used alone or in combination of two or more.

The photopolymerizable compound may be included in an amount of 1 to 70% by weight, preferably 10 to 70% by weight, based on the total weight of the solid content in the photosensitive resin composition. When the photopolymerizable compound is included in the above range, it is preferable because the pattern characteristic can be formed favorably and the strength and smoothness of the pixel portion are good.

photopolymerization initiator

The photopolymerization initiator of the present invention initiates a radical reaction of the photosensitive resin composition to cause curing and improve sensitivity. The photopolymerization initiator is a photopolymerization initiator generally used in the photosensitive resin composition, and acetophenone-based, benzophenone-based, triazine-based, thioxanthone-based, oxime-based, benzoin-based, biimidazole-based and anthracene-based compounds may be used.

Examples of the acetophenone-based compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, and 2-hydroxy-1-[4-(2). -Hydroxyethoxy)phenyl]-2-methylpropan-1-one, 1-hydroxycyclohexylphenylketone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropane-1- One, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 2-hydroxy-2-methyl[4-(1-methylvinyl)phenyl]propane-1- an oligomer of one, preferably 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one.

Examples of the benzophenone compound include benzophenone, 2,2'-hydroxy-4,4'-dimethoxybenzophenone, methyl o-benzoylbenzoate, 4-phenylzophenone, and 4-benzoyl-4' -methyldiphenyl sulfide, 3,3',4,4'-tetra(t-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, etc. are mentioned.

Examples of the triazine-based compound include 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl) -6-(4-Methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-tri Azine, 2,4-bis(trichloromethyl)-6-[2-(5-methylfuran-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl )-6-[2-(furan-2-yl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino- 2-methylphenyl)ethenyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4 dimethoxyphenyl)ethenyl]-1,3,5 -triazine, etc. are mentioned.

Examples of the thioxanthone-based compound include 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro- 4-propoxythioxanthone etc. are mentioned.

As a benzoin type compound, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzo isobutyl ether, etc. are mentioned, for example. Examples of the benzophenone-based compound include benzophenone, methyl o-benzoylbenzoate, 4-phenylzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 3,3',4,4'-tetra( t-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, etc. are mentioned. Examples of the thioxanthone-based compound include 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro- 4-propoxythioxanthone etc. are mentioned.

Examples of the anthracene-based compound include 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene or 2-ethyl-9,10-diethoxyanthracene. .

The photopolymerization initiator used in the photosensitive resin composition according to the present invention may be included in an amount of 0.01 to 6.0 wt%, preferably 0.05 to 6.0 wt%, based on the total solid weight of the photosensitive resin composition.

When the photopolymerization initiator is included in the above range, it is preferable because pattern formation is improved and the photosensitive resin composition is highly sensitive, so that the strength and smoothness on the surface of the pixel portion formed using this composition tend to be good. .

In addition, in the present invention, a photopolymerization initiation auxiliary may be additionally used. The photopolymerization initiation adjuvant may be used in combination with the photopolymerization initiator, and by accelerating polymerization of the photopolymerizable compound, the photosensitive resin composition may become more sensitive and productivity may be improved.

The photopolymerization initiation adjuvant can be used without limitation, and includes carboxylic acid-based compounds and sulfonic acid-based compounds.

In the case of using the photopolymerization initiation adjuvant, the photopolymerization initiator and the photopolymerization initiation adjuvant are preferably used in a molar ratio of 1:0.01 to 10, preferably 1:0.01 to 5 molar ratio. When using in said range, since there exists a tendency for the sensitivity of the photosensitive resin composition to become higher and productivity to improve, it is preferable.

In addition, in the present invention, a light absorber may be additionally used. The light absorber can play a role in controlling when the degree of curing of the photopolymerizable compound or the photosensitive resin composition is too high and not controlled, and can improve the pattern and hole characteristics, reliability, etc. of the photosensitive resin composition by adjusting the degree of curing.

metal ion scavenger

The photosensitive resin composition of the present invention contains a metal ion scavenger to prevent corrosion of metal located inside the display.

The metal ion trapping agent may include two or more metals selected from Zr, Mg, and Al.

The ions captured by the metal ion trapping agent react by irradiation with light, electron beams, etc., sodium ions (Na ⁺ ), chlorine ions (Cl ⁻ ), bromine ions (Br ⁻ ), copper ions used in the display manufacturing process. ions such as (Cu ⁺ , Cu ²⁺ ), and by trapping these ions, electrical insulation and electrolytic corrosion resistance can be improved.

In addition, excellent pattern and hole formation characteristics can be exhibited through ion trapping, and adhesion between the insulating film and the display substrate can be improved.

In addition, it can contribute to reliability improvement and chemical resistance by trapping and inactivating ions that affect reliability.

The metal ion trapping agent is not particularly limited as long as it can trap ions and has a function of trapping at least one of a cation and an anion, and can be used alone or in combination of a plurality of types.

As the anion trapping agent, for example, IXE-700 (Mg, Al-containing compound), IXE-700F (Mg, Al-containing compound), IXE-770D (Mg, Al-containing compound), etc. available from Toagosei can be used. can

As the cation trapping agent, for example, IXE-1320 (Mg, Al-containing compound), IXEPLAS-A1 (Zr, Mg, Al-containing compound), IXEPLAS-A2 (Zr, Mg, Al-containing compound) marketed by Toagosei Co., Ltd. ) can be used.

In the case of the metal ion scavenger according to the present invention, the particle size may be 100 to 800 nm. When the particle size is in the nanometer range in the above range, the effect may be large according to the addition of a small amount to Cu ion trapping, and if the particle size is in μm unit, the efficiency may be lowered compared to the ion trapping agent of the present invention, and Cu corrosion prevention is may not be appropriate.

In addition, in the case of the metal ion trapping agent according to the present invention, an ion trapping effect may occur in a wide pH range.

The metal ion scavenger used in the photosensitive resin composition according to the present invention may be included in an amount of 2 to 6 wt% based on the total weight of the solid content of the photosensitive resin composition. When included in the above range, there is an advantage that can show an excellent effect in improving Cu corrosion without reducing other physical properties.

solvent

The solvent contained in the photosensitive resin composition of the present invention has compatibility with other components of the present invention, but is not particularly limited as long as it does not react, and various organic solvents used in the field of the photosensitive resin composition can be used.

For example, ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, di Diethylene glycol dialkyl ethers such as ethylene glycol dipropyl ether and diethylene glycol dibutyl ether, ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, propylene alkylene glycol alkyl ether acetates such as glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate and methoxypentyl acetate; aromatic hydrocarbons such as benzene, toluene, xylene and mesitylene; methyl ethyl ketone; Ketones such as acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone, alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, and glycerin, ethyl 3-ethoxypropionate, 3-methyl Esters, such as methyl oxypropionate, Cyclic esters, such as (gamma)-butyrolactone, etc. are mentioned.

Among the solvents, an organic solvent having a boiling point of 100° C. to 200° C. is preferable in order to increase the efficiency of coating properties and drying properties, and organic solvents having different boiling points may be mixed and used.

The content of the solvent in the photosensitive resin composition of the present invention may be included in a weight fraction of 60 to 90% by weight, preferably 70 to 85% by weight, based on the total amount of the photosensitive resin composition including it.

When the content of the solvent is in the range of 60 to 90% by weight based on the above criteria, good applicability when applied with an application device such as a roll coater, spin coater, slit and spin coater, slit coater (or die coater), or inkjet It is preferable in that it becomes easy to harden.

additive

The photosensitive resin composition of the present invention may further include an additive to improve coatability and adhesion.

The additive is a silane having a reactive substituent selected from the group consisting of a carboxyl group, a methacryloyl group, an isocyanate group, an epoxy group, and a combination thereof to increase the adhesion between the photosensitive resin composition and the insulating film manufactured using the same and the substrate. A coupling agent may be included.

Examples of the silane coupling agent include trimethoxysilyl benzoic acid, γ-methacryl oxypropyl trimethoxy silane, vinyltriacetoxysilane, vinyl trimethoxysilane, γ-isocyanate propyl triethoxysilane, γ-glycidoxy and propyl trimethoxysilane and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, which can be used alone or in combination of two or more.

In addition, an adhesion promoter may be included to enhance adhesion. Examples of the adhesion promoter include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris(2-methoxyethoxy)-silane, N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane, N -(2-aminoethyl)-3-aminopropylmethyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2-(3,4-ethoxy cyclohexyl)ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane or 3- Mercaptopropyltrimethoxysilane may be used, but is not limited thereto.

In addition, a leveling agent may be used to improve coating properties, for example, the leveling agent is BM-1000, BM-1100 (BM Chemie), Proride FC-135/FC-170C/FC-430 (Sumitomo 3M) ), SH-28PA/-190/SZ-6032 (Toray Silicon Co., Ltd.), DIC's F-475, F554, etc. Fluorine-based leveling agents can be used, but are not limited thereto.

In addition, a surfactant may be used to improve coating properties, and preferably, a fluorine-containing surfactant may be used, but the present invention is not limited thereto. Specific examples of the fluorine-containing surfactant include BM-1000, BM-1100 (BM Chemie), Proride FC-135, FC-170C, and FC-430 (trade name, Sumitomo 3M).

<insulation film>

An insulating film may be manufactured using the photosensitive resin composition according to the present invention.

In addition, the insulating film according to the present invention may prevent corrosion of an adjacent metal film. The metal film from which corrosion is prevented may be a copper film, but is not limited thereto.

The insulating film forming method according to the present invention may be manufactured by an insulating film forming method used in a conventional industry, but is not limited thereto.

As the substrate, a glass substrate or a substrate having a copper pattern commonly used in liquid crystal display devices is mainly used, but it is not particularly limited depending on the characteristics of the display device used.

<Image display device>

The image display apparatus according to the present invention includes the above-described heat transfer film.

The image display device is specifically, a liquid crystal display (liquid crystal display device; LCD), an organic EL display (including an organic EL display device, OLED and QLED), a liquid crystal projector, a display device for a game machine, a display device for a portable terminal such as a mobile phone , a display device for a digital camera, a display device for navigation, and the like, and a color display device is particularly suitable.

The image display device may further include a configuration known to those skilled in the art, except for having the color conversion layer.

Hereinafter, examples will be given to describe the present invention in detail. However, the embodiments according to the present invention may be modified in various other forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those of ordinary skill in the art.

Preparation Example: Preparation of Binder Resin (B2)

277 g of methoxybutyl acetate was put into a 1 liter separable flask equipped with a stirrer, a thermometer, a reflux cooling tube, a dropping funnel and a nitrogen introduction tube, and heated to 80°C. 3,4-epoxytricyclo[5.2.1.0,2,6]decan-9-ylacrylate and 3,4-epoxytricyclo[5.2.1.0,2,6]decan-8-ylacrylate 50: 301 g of a mixture of 50 mol ratio, 49 g of methacrylic acid, and 23 g of azobisdimethylvaleronitrile are dissolved in 350 g of methoxybutyl acetate to prepare a solution. The prepared solution was added dropwise over 5 hours using a dropping funnel, and aged for 3 hours to obtain a copolymer solution [solid content (NV) 35.0 wt%]. The obtained copolymer had an acid value (dry) of 69.8 KOH mg/g, a weight average molecular weight (Mw) of 12,300, and a degree of dispersion (Mw/Mn) of 2.1.

Example: photosensitive resin composition

The photosensitive resin compositions of Examples 1 to 4 and Comparative Examples 1 to 5 having the composition and content shown in Table 1 were prepared (unit: wt%).

Preparation of test pieces

A 5cmX5cm substrate was prepared by washing with a neutral detergent and water and then drying. On the prepared substrate, each of the photosensitive resin compositions prepared in Examples and Comparative Examples is spin-coated to a final film thickness of 2.0 μm, pre-baked at 80 to 120° C., and heated for 1 to 3 minutes to volatilize the solvent to obtain photosensitivity. A resin composition layer was formed. Thereafter, the pattern was formed by exposure at an exposure amount of 30 to 80 mJ/cm 2 , and the unexposed portion was removed using an aqueous alkali solution. Then, post-baking was performed at 100 to 180° C. for 20 to 100 minutes to prepare a test piece.

Experimental Example 1. Evaluation of pattern characteristics and hole characteristics

Pattern characteristics and hole characteristics were measured using each photosensitive resin composition test piece obtained in Examples and Comparative Examples, and the results were compared. For the characteristics of the pattern and hole, the size of the pattern and hole size were measured using the SIS-2000 equipment of SNU (SNU). Then, CD-bias was calculated and the results were compared. CD (Critical Dimension)-bias is calculated as the difference between the size of the actually generated pattern (FI CD, Final inspection CD) with respect to the DI CD (Developed Inspection Critical Dimension) of the insulating film.

The pattern and hole characteristics of Examples and Comparative Examples were evaluated with the following evaluation criteria, and the results are shown in Table 2.

pattern characteristics

○: good, CD-bias +2㎛ or less

△: insufficient, CD-bias more than +2㎛ +6㎛ or less

X: No, more than +6 µm

Hole characteristics

○: good, CD-bias -6㎛ or less

△: insufficient, CD-bias more than -6㎛ -10㎛ or less

X: No, more than -10 μm

Experimental Example 2. Chemical resistance evaluation

Chemical resistance characteristics were evaluated using each photosensitive resin composition test piece obtained from the said Example and the comparative example. The chemical resistance was compared based on the change in the film thickness of the test piece after immersing the test piece in etchant and stripper sequentially. While maintaining the etchant at 45 °C, each of the prepared specimens was immersed for 2 minutes, and then the film thickness was checked. Then, the film thickness was checked after being immersed in the stripper maintained at 60° C. for 5 minutes. Thereafter, as shown in Equation 1 below, the difference between the film thickness before immersion in the etchant and the film thickness after immersion in the stripper was confirmed.

[Equation 1]

Δfilm thickness = (film thickness before chemical resistance evaluation)- (film thickness after stripper immersion)

Chemical resistance of Examples and Comparative Examples was evaluated according to the following evaluation criteria, and the results are shown in Table 2.

chemical resistance

○: good, film thickness 0.2 μm or less

△: insufficient, film thickness greater than 0.2 µm and less than or equal to 0.5 µm

X: No, more than 0.5 µm

Experimental Example 3. Cu corrosion resistance evaluation

Cu corrosion resistance properties were evaluated using each photosensitive resin composition test piece obtained in Examples and Comparative Examples. Cu corrosion was measured using PCT (Pressure Cooker Test) equipment. In the Cu corrosion test, the specimen was placed in the PCT test equipment for 72 hours under the conditions of a temperature of 110 ℃ and a relative humidity of 100%, and the degree of corrosion was determined using a microscope. 10 random points were set on the specimen with Cu pattern before the test, and corrosion resistance was evaluated by checking how many points were corroded after the PCT test.

The corrosion resistance of Examples and Comparative Examples was evaluated by the following evaluation criteria, and the results are shown in Table 2.

corrosion resistance

○: Good, corrosion below 2 points out of 10 points

△: lack, 3 or 4 points out of 10 corrosion

X: No, more than 5 points out of 10 corrosion

Referring to Table 2, it can be seen that the insulating film formed of the photosensitive resin composition of Examples 1 to 4 according to the present invention has very excellent pattern, hole and chemical resistance characteristics. In addition, it can be confirmed that the corrosion resistance is very good as the degree of Cu corrosion is very low along with physical properties such as pattern, hole and chemical resistance. Therefore, it can be confirmed that the photosensitive resin composition and the insulating film formed using the photosensitive resin composition according to the present invention can effectively protect the wiring such as copper inside the display from oxygen or liquids from the outside, and have excellent corrosion resistance.

However, Comparative Examples using one of Zr, Mg and Al or a metal ion trapping agent containing other ions such as Bi showed reduced pattern, hole and chemical resistance properties compared to the Examples, and corrosion of Cu was also It can be seen that the corrosion resistance is significantly lowered due to poor quality.

Claims (10)

a binder resin, a photopolymerizable compound, a photoinitiator, a metal ion trapping body, and a solvent;
The metal ion trapping body is a photosensitive resin composition, characterized in that it contains two or more metals selected from Zr, Mg and Al.
According to claim 1,
The photosensitive resin composition, characterized in that the metal ion scavenger is included in an amount of 2 to 6% by weight based on the total weight of the photosensitive resin composition.
According to claim 1,
The photosensitive resin composition, characterized in that the particle size of the metal ion trapping agent is 100 to 800 nm.
According to claim 1,
The binder resin is a photosensitive resin composition comprising at least one of an acryl group and an epoxy group
According to claim 1,
The photopolymerizable compound is a photosensitive resin composition comprising (meth) acrylate as a functional group.
According to claim 1,
The photopolymerization initiator is at least one selected from the group consisting of acetophenone-based, benzophenone-based, triazine-based, thioxanthone-based, oxime-based, benzoin-based, biimidazole-based and anthracene-based compounds.
According to claim 1,
The solvent has a boiling point of 100 to 200 ℃ photosensitive resin composition, characterized in that.
According to claim 1,
The photosensitive resin composition is a photosensitive resin composition, characterized in that for copper corrosion prevention.
An insulating film made of the photosensitive resin composition of any one of claims 1 to 8.
An image display device comprising the insulating film of claim 9 .