CN113467183B - Resin composition for forming insulating film, insulating film produced using the same, image display device, and method for producing insulating film - Google Patents

Resin composition for forming insulating film, insulating film produced using the same, image display device, and method for producing insulating film Download PDF

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Publication number
CN113467183B
CN113467183B CN202110199968.1A CN202110199968A CN113467183B CN 113467183 B CN113467183 B CN 113467183B CN 202110199968 A CN202110199968 A CN 202110199968A CN 113467183 B CN113467183 B CN 113467183B
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insulating film
forming
resin composition
compound
group
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CN113467183A (en
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李贤普
金秀虎
金正植
曺升铉
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Dongwoo Fine Chem Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material

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  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

The present invention provides a resin composition for forming an insulating film, an image display device, and a method for manufacturing an insulating film, wherein the resin composition for forming an insulating film comprises (A) a binder resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a light absorber, and (E) a solvent, the (B) photopolymerizable compound comprises a fluorene compound, and the (D) light absorber comprises an azole compound, thereby improving heat resistance, chemical resistance, and permeability, preventing corrosion of lower metal, and improving fine pattern and hole characteristics.

Description

Resin composition for forming insulating film, insulating film produced using the same, image display device, and method for producing insulating film
Technical Field
The invention relates to a resin composition for forming an insulating film, an insulating film manufactured by using the same, an image display device and a manufacturing method of the insulating film.
Background
The photosensitive resin is a material necessary for a display such as a color filter, a liquid crystal display material, and an organic light emitting element, and various photosensitive resin compositions can be used depending on the purpose of use such as a red pixel (R), a green pixel (G), a blue pixel (B), a Black Matrix (BM), and a Column Spacer (CS) used in the color filter.
In addition, the photosensitive resin composition can be used as a photosensitive resin composition for forming an insulating film for protecting and insulating a plurality of wires and circuits included in a plurality of semiconductor elements or displays developed in recent years, and particularly, in recent display devices, there is an increasing demand for improving reliability while the size of a pattern becomes smaller with an increase in resolution, and there is an increasing protection of the display device due to permeation of external oxygen and moisture, so that such a photosensitive resin composition is actively used.
As a substance that can be used for such an insulating film, various substances such as polyethylene, polyvinyl chloride, natural rubber, polyester, epoxy resin, melamine resin, phenol resin, synthetic resin such as polyurethane, and the like can be used.
On the other hand, as the use of photosensitive resin compositions has increased in many aspects, in recent years, designs have been made for the purpose of flattening the inside of devices such as displays, as well as for the purpose of electrically insulating wirings, or for the purpose of affecting the flow of electric current.
Specifically, development of a photosensitive resin composition which is excellent in chemical resistance and can adjust the line width and the pore size of an insulating film is demanded, and particularly, a metal corrosion improving effect of a portion in contact with the insulating film is demanded.
In particular, when a metal film such as copper is disposed under an insulating film in order to realize energization for driving a device, corrosion of copper is induced by moisture permeation due to the characteristics of the organic film. For this reason, it is required to prevent or improve the corrosion characteristics of a metal film such as copper disposed adjacent to an insulating film.
Registered patent No. 10-0732641 also discloses a resin composition which is mixed with the resin composition by combining a cyanoacrylate ultraviolet absorber and a benzotriazole ultraviolet absorber, thereby exhibiting excellent light resistance, and which does not undergo yellowing even after long-term use. However, there are limitations in chemical resistance, adjustment of line width and pore size of a coating film or pattern to be formed, and corrosion prevention effect of an adjacent film. For this reason, in recent years, the necessity of a resin composition having a more versatile use has been highlighted for a display device due to miniaturization of a pattern and thinning of a display.
Prior art literature
Patent literature
Korean registered patent No. 10-0732641
Disclosure of Invention
Problems to be solved
The purpose of the present invention is to provide a resin composition for forming an insulating film, which has improved pattern characteristics, hole (Hole) characteristics, and bevel (Taper) characteristics.
The present invention also provides a resin composition for forming an insulating film having improved chemical resistance.
The present invention also provides a resin composition for forming an insulating film, which has improved corrosion resistance to lower metals and the like.
The present invention also provides a resin composition for forming an insulating film, which has improved processability at low temperatures.
Further, an object of the present invention is to provide an insulating film produced using the resin composition for forming an insulating film and an image display device including the insulating film.
The present invention also provides a method for producing an insulating film using the resin composition for forming an insulating film.
Means for solving the problems
The present invention relates to a resin composition for forming an insulating film, which comprises (A) a binder resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a light absorber, and (E) a solvent, wherein the (B) photopolymerizable compound comprises a fluorene (Fluorene) compound, and the (D) light absorber comprises an azole (Azole) compound.
In the first aspect of the present invention, the binder resin (A) may contain a tetrahydropyran (Tetrahydropyran; THP) based ring.
In the second aspect of the present invention, the Tetrahydropyran (THP) ring may be polymerized by including at least one or more of an acyclic compound and a cyclic compound capable of forming a Tetrahydropyran (THP) ring during polymerization.
In the third aspect of the present invention, the acyclic compound may include a compound represented by the following chemical formula 1.
[ Chemical formula 1]
(In the chemical formula 1, R 1、R2 is an aliphatic hydrocarbon group having 1 to 20 carbon atoms or an aromatic hydrocarbon group having 6 to 18 carbon atoms, each of which may or may not contain a hetero atom.)
In the fourth aspect of the present invention, the cyclic compound may contain one or more selected from the group consisting of tetrahydropyran-2-yl (meth) acrylate, (tetrahydropyran-2-yl) methyl (meth) acrylate, 2, 6-dimethyl-8- (tetrahydropyran-2-yloxy) -1-octen-3-one, 1- (tetrahydropyran-2-yloxy) -3-buten-2-one, 4- (1, 4-dioxa-5-oxo-6-heptenyl) -6-methyl-2-pyrone, and 4- (1, 5-dioxa-6-oxo-7-octenyl) -6-methyl-2-pyrone.
In the fifth aspect of the present invention, the binder resin (a) may contain an epoxy-based binder resin.
In the sixth aspect of the present invention, the epoxy-based adhesive resin may include a compound represented by the following chemical formula 2.
[ Chemical formula 2]
(In the above chemical formula 2, R 3 and R 4 are each independently hydrogen or CH 3,
A and b are each independently integers of 3 to 20. )
In a seventh aspect of the present invention, the fluorene compound may include a compound represented by the following chemical formula 3.
[ Chemical formula 3]
( In the above chemical formulA 3, X 1 and X 2 each independently represent A hydroxyl group, - (O-A-O) p H group (A represents an alkylene group having 2 to 3 carbon atoms, p represents an integer of 1 to 10), R 5～R8 each independently represents A hydrocarbon group having 1 to 20 carbon atoms which may be substituted, an alkoxy group having 1 to 20 carbon atoms which may be substituted, or A halogen atom, m1 and m2 each independently represent an integer of 0 to 3, and n1 to n4 each independently represent an integer of 0 to 4. Wherein m1+n1 and m2+n2 are each independently integers of 0 to 5. )
In the eighth aspect of the present invention, the fluorene compound may be contained in an amount of 3 to 35 wt% based on the total weight of solid components in the insulating film-forming resin composition.
In the ninth aspect of the present invention, the azole compound may contain one or more selected from the group consisting of benzotriazole (Benzotriazole; BTA) and pyrazole (Pyrazole).
In the tenth aspect of the present invention, the resin composition may contain (a) 10 to 50% by weight of the binder resin, (B) 5 to 70% by weight of the photopolymerizable compound, (C) 3 to 20% by weight of the photopolymerization initiator, and (D) 1 to 10% by weight of the light absorber, based on the total weight of the solid content in the resin composition for forming an insulating film, and may contain (E) 60 to 90% by weight of the solvent, based on the total weight of the resin composition for forming an insulating film.
In an eleventh aspect of the present invention, the insulating film-forming resin composition can prevent copper corrosion.
In the twelfth aspect of the present invention, the firing temperature of the insulating film-forming resin composition may be 80 to 150 ℃.
In the thirteenth aspect of the present invention, the firing temperature may be a post-firing temperature.
The present invention also relates to an insulating film formed from the resin composition for forming an insulating film.
The present invention also relates to an image display device including the insulating film.
The present invention also relates to a method for producing an insulating film, comprising a step of forming an insulating film by a low-temperature firing step at 80 to 150 ℃ using the resin composition for forming an insulating film.
Effects of the invention
According to the resin composition for forming an insulating film of the present invention, the pattern characteristics, hole characteristics and slope characteristics can be further improved as compared with the conventional resin composition for forming an insulating film.
Further, according to the resin composition for forming an insulating film of the present invention, the chemical resistance can be further improved as compared with the conventional resin composition for forming an insulating film.
Further, according to the resin composition for forming an insulating film of the present invention, corrosion resistance against lower metals and the like can be further improved as compared with the conventional resin composition for forming an insulating film.
Further, according to the resin composition for forming an insulating film of the present invention, the workability at low temperature can be further improved as compared to the conventional resin composition for forming an insulating film.
Detailed Description
The invention provides a resin composition for forming an insulating film, an image display device and a method for manufacturing the insulating film, wherein the resin composition for forming the insulating film is characterized by comprising a photopolymerizable compound containing a fluorene compound and a light absorber containing an azole compound.
The resin composition for forming an insulating film of the present invention can improve heat resistance, chemical resistance, and permeability by containing the photopolymerizable compound containing the fluorene compound, and can prevent corrosion of lower metals (for example, copper (Cu) and the like). Further, by including the light absorber containing the azole compound, fine pattern and pore characteristics can be improved by achieving adjustment of the degree of photocuring.
More specifically, the present invention provides a resin composition for forming an insulating film, which comprises (A) a binder resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a light absorber, and (E) a solvent, wherein the (B) photopolymerizable compound comprises a fluorene compound, and the (D) light absorber comprises an azole compound, an insulating film, an image display device, and a method for producing an insulating film using the same.
The term "solid component" as used herein means the remainder of the component excluding the solvent.
< Resin composition for Forming insulation film >
The resin composition for forming an insulating film of the present invention is not particularly limited as long as it contains a photopolymerizable compound containing a fluorene compound and a light absorber containing an azole compound.
The resin composition for forming an insulating film of the present invention preferably does not contain an amine compound or a diamine compound, in order to minimize the reaction with other functional groups and to improve the storage stability.
The insulating film-forming resin composition of the present invention has a function of preventing corrosion of metals adjacent to an insulating film made of the insulating film-forming resin composition, and is preferably used for preventing corrosion of adjacent copper (Cu).
The firing temperature of the resin composition for forming an insulating film of the present invention may be 80 to 150 ℃, and preferably the post-firing temperature may be 80 to 150 ℃.
(A) Adhesive resin
The binder resin contained in the insulating film-forming resin composition of the present invention is not particularly limited as long as it imparts alkali solubility to the insulating film formed using the insulating film-forming resin composition and imparts patterning properties.
In one embodiment, the binder resin may include a Tetrahydropyran (THP) based ring. In this case, the coating film has advantages in that the transparency, heat resistance and pattern characteristics of the coating film can be improved.
The Tetrahydropyran (THP) ring may be polymerized by including at least one or more of an acyclic compound and a cyclic compound capable of forming a Tetrahydropyran (THP) ring upon polymerization.
The acyclic compound may have an unsaturated bond forming a Tetrahydropyran (THP) ring in the main chain. For example, a compound represented by the following chemical formula 1 may be contained, and in this case, it is preferable in terms of maximizing the ring formation rate in the copolymer at the time of polymerization, but it is not necessarily limited thereto.
[ Chemical formula 1]
In chemical formula 1, R 1、R2 is an aliphatic hydrocarbon group having 1 to 20 carbon atoms or an aromatic hydrocarbon group having 6 to 18 carbon atoms, each of which may or may not contain a heteroatom.
Specific examples of R 1 and R 2 include methyl, ethyl, n-propyl, isopropyl, n-butyl, t-amyl, stearyl, lauryl, cyclohexyl, ethylhexyl, methoxyethyl, ethoxyethyl, benzyl, etc., and among them, methyl, ethyl, cyclohexyl, benzyl are preferred.
The hetero atom may be oxygen (O), sulfur (S), nitrogen (N), or the like, but is not necessarily limited thereto.
When the polymerization is carried out by including the compound of chemical formula 1 in a monomer, two kinds of recurring units forming a Tetrahydropyran (THP) ring may be formed in a polymer, and the proportion of each recurring unit is not particularly limited, and one of the two kinds of recurring units may be a main recurring unit in the binder resin.
The cyclic compound may contain a pyran (Pyran) ring and/or a Tetrahydropyran (THP) ring in one molecule and have an unsaturated bond capable of polymerization. For example, the pyran-based ring-containing compound may be 4- (1, 4-dioxa-5-oxo-6-heptenyl) -6-methyl-2-pyrone, 4- (1, 5-dioxa-6-oxo-7-octenyl) -6-methyl-2-pyrone, etc., and the Tetrahydropyran (THP) -based ring-containing compound may be tetrahydropyran-2-yl (meth) acrylate, (tetrahydropyran-2-yl) methyl (meth) acrylate, 2, 6-dimethyl-8- (tetrahydropyran-2-yloxy) -1-octen-3-one, 1- (tetrahydropyran-2-yloxy) -3-buten-2-one, etc.
The binder resin may contain a compound having an unsaturated bond copolymerizable with the acyclic compound and the cyclic compound. The compound having an unsaturated bond capable of copolymerization is not particularly limited, and examples thereof include unsaturated carboxyl group-containing monomers and other unsaturated monomers.
Examples of the unsaturated carboxyl group-containing monomer include unsaturated carboxylic acids having 1 or more carboxyl groups in the molecule, such as unsaturated monocarboxylic acids, unsaturated dicarboxylic acids, and unsaturated polycarboxylic acids.
Examples of the unsaturated monocarboxylic acid include acrylic acid, methacrylic acid, crotonic acid, α -chloroacrylic acid, and sarcosilicic acid.
Examples of the unsaturated dicarboxylic acid include maleic acid, fumaric acid, itaconic acid, citraconic acid, mesaconic acid, and the like.
The unsaturated polycarboxylic acid may be an acid anhydride, and specifically, maleic anhydride, itaconic anhydride, citraconic anhydride, and the like may be mentioned. The unsaturated polycarboxylic acid may be a mono (2-methacryloxyalkyl) ester thereof, for example, a succinic acid mono (2-acryloxyethyl) ester, a succinic acid mono (2-methacryloxyethyl) ester, a phthalic acid mono (2-acryloxyethyl) ester, a phthalic acid mono (2-methacryloxyethyl) ester, or the like. The unsaturated polycarboxylic acid may be a mono (meth) acrylate of a dicarboxylic polymer at both ends thereof, and examples thereof include ω -carboxypolycaprolactone monoacrylate and ω -carboxypolycaprolactone monomethacrylate.
The above unsaturated carboxyl group-containing monomers may be used each alone or in combination of two or more.
Examples of the other unsaturated monomer include aromatic vinyl compounds such as styrene, α -methylstyrene, o-vinyltoluene, m-vinyltoluene, p-chlorostyrene, o-methoxystyrene, m-methoxystyrene, p-methoxystyrene, o-vinylbenzyl methyl ether, m-vinylbenzyl methyl ether, p-vinylbenzyl methyl ether, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, and indene; methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, n-butyl acrylate, n-butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 3-hydroxypropyl acrylate, 3-hydroxypropyl methacrylate, 2-hydroxybutyl acrylate, 2-hydroxybutyl methacrylate, 3-hydroxybutyl acrylate 3-hydroxybutyl methacrylate, 4-hydroxybutyl acrylate, 4-hydroxybutyl methacrylate, allyl acrylate, allyl methacrylate, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, phenyl acrylate, phenyl methacrylate, 2-methoxyethyl acrylate, 2-methoxyethyl methacrylate, 2-phenoxyethyl acrylate, 2-phenoxyethyl methacrylate, methoxydiethylene glycol acrylate, methoxydiethylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, methoxypropylene glycol acrylate, methoxypropylene glycol methacrylate, unsaturated carboxylic acid esters such as methoxy dipropylene glycol acrylate, methoxy dipropylene glycol methacrylate, isobornyl acrylate, isobornyl methacrylate, dicyclopentadiene acrylate, dicyclopentadiene methacrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy-3-phenoxypropyl methacrylate, glycerol monoacrylate, and glycerol monomethacrylate; unsaturated carboxylic acid aminoalkyl esters such as 2-aminoethyl acrylate, 2-aminoethyl methacrylate, 2-dimethylaminoethyl acrylate, 2-dimethylaminoethyl methacrylate, 2-aminopropyl acrylate, 2-dimethylaminopropyl methacrylate, 3-aminopropyl acrylate, 3-aminopropyl methacrylate, 3-dimethylaminopropyl acrylate, and 3-dimethylaminopropyl methacrylate; glycidyl esters of unsaturated carboxylic acids such as glycidyl acrylate and glycidyl methacrylate; vinyl esters of carboxylic acids such as vinyl acetate, vinyl propionate, vinyl butyrate and vinyl benzoate; unsaturated ethers such as vinyl methyl ether, vinyl ethyl ether and allyl glycidyl ether; vinyl cyanide compounds such as acrylonitrile, methacrylonitrile, α -chloroacrylonitrile, dicyanoethylene and the like; unsaturated amides such as acrylamide, methacrylamide, α -chloroacrylamide, N-2-hydroxyethyl acrylamide, N-2-hydroxyethyl methacrylamide, and the like; unsaturated imides such as maleimide, N-benzylmaleimide, N-phenylmaleimide and N-cyclohexylmaleimide; aliphatic conjugated dienes such as 1, 3-butadiene, isoprene and chloroprene; and a macromonomer having a monoacrylic group or a monomethacrylic group at the end of the polymer chain of polystyrene, polymethyl acrylate, polymethyl methacrylate, poly-n-butyl acrylate, poly-n-butyl methacrylate, polysiloxane, and the like. These monomers may be used each alone or in combination of two or more.
In one embodiment, the adhesive resin may include an epoxy adhesive resin. In this case, by reducing the firing temperature of the insulating film-forming resin composition, preferably the post-firing temperature to 80 to 150 ℃, the process can be properly performed even on a substrate in which the process cannot be performed at a high temperature, and the reliability can be improved.
The epoxy adhesive resin may be selected from a wide variety of polymers used in the technical field of the present invention, and one or two or more kinds thereof may be used singly or in combination, and the functional groups constituting the adhesive may be used in combination according to the intended purpose. In the case of combining two or more kinds, for example, two or more kinds of binder resins composed of different copolymerization components, two or more kinds of binder resins having different weight average molecular weights, and two or more kinds of binder resins having different dispersibility can be cited.
In one or more embodiments, the epoxy-based adhesive resin may include one or more selected from the group consisting of bisphenol-type epoxy resin, phenol novolac-type epoxy resin, t-butyl catechol-type epoxy resin, naphthalene-type epoxy resin, glycidylamine-type epoxy resin, biphenyl-type epoxy resin, phenol aralkyl-type epoxy resin, cresol novolac-type epoxy resin, linear aliphatic epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, spiro-ring-containing epoxy resin, cyclohexanedimethanol-type epoxy resin, and halogenated epoxy resin.
In one embodiment, the epoxy-based adhesive resin may contain a compound represented by the following chemical formula 2, and in this case, it is preferable in terms of developability and reliability. The compound represented by the following chemical formula 2 may have a structure to which a known functional group is added.
[ Chemical formula 2]
In the above-mentioned chemical formula 2,
R 3 and R 4 are each independently hydrogen or CH 3, preferably can be hydrogen.
A and b are each independently an integer of 3 to 20, preferably an integer of 5 to 15.
The epoxy-based binder resin may be obtained by copolymerizing a monomer containing one or more compounds containing 3, 4-epoxytricyclo [5.2.1.0 2 ,6 ] decane ring and a monomer containing one or more unsaturated carboxylic acids or anhydrides thereof, and may further contain a functional group.
The 3, 4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yl acrylate-containing compound is exemplified by 3, 4-epoxytricyclo [5.2.1.0 2,6 ] decan-9-yl acrylate and 3, 4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yl acrylate, and is preferably a mixture of 3, 4-epoxytricyclo [5.2.1.0 2,6 ] decan-9-yl acrylate and 3, 4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yl acrylate, more preferably a mixture of the 3, 4-epoxytricyclo [5.2.1.0 2,6 ] decan-9-yl acrylate and 3, 4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yl acrylate in a volume ratio of 50:50.
The carboxylic acid or its anhydride may be an α, β -unsaturated carboxylic acid such as acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, or an anhydride thereof (maleic anhydride, itaconic anhydride, or the like), and methacrylic acid is preferable.
In the patterning process of the resin composition for forming an insulating film of the present invention, the molecular weight of the binder resin and the acid value may be factors that have a great influence, and the molecular weight may have an influence on the viscosity of the composition and the surface of the pattern to be formed, and the acid value may have an influence on the pattern formation during the process.
The weight average molecular weight (hereinafter referred to as "molecular weight (Mw)") of the binder resin of the present invention in terms of polystyrene measured by GPC may be 5,000 to 30,000, preferably 7,000 to 28,000, and the molecular weight distribution (Mw/Mn) may be 2.0 to 3.0, preferably 2.1 to 2.5.
The acid value of the binder resin of the present invention may be 20 to 100mgKOH/g, and preferably 30 to 90mgKOH/g.
When the molecular weight (Mw) and the acid value of the binder resin satisfy the above ranges, there are advantages in pattern characteristics, pore characteristics, and improved developability.
The content of the binder resin may be 10 to 50% by weight, and preferably 20 to 45% by weight, based on the total weight of solid components in the resin composition for forming an insulating film. When the above range is satisfied, there is an advantage in that the pattern property, pore property and developability of the composition are improved.
(B) Photopolymerizable compound
The photopolymerizable compound of the present invention is not particularly limited as long as it is polymerized and cured upon irradiation with light such as ultraviolet light, and preferably contains a fluorene compound. In this case, corrosion of lower copper (Cu) can be prevented, heat resistance and chemical resistance are excellent, and transmittance can be improved.
In one embodiment, the fluorene compound may include a compound represented by the following chemical formula 3.
[ Chemical formula 3]
In the above chemical formulA 3, X 1 and X 2 each independently represent A hydroxyl group, - (O-A-O) p H group (A represents an alkylene group having 2 to 3 carbon atoms, p represents an integer of 1 to 10), R 5～R8 each independently represents A hydrocarbon group having 1 to 20 carbon atoms which may be substituted, an alkoxy group having 1 to 20 carbon atoms which may be substituted, or A halogen atom, m1 and m2 each independently represent an integer of 0 to 3, and n1 to n4 each independently represent an integer of 0 to 4. Wherein m1+n1 and m2+n2 are integers of 0 to 5.
The substitution positions of X 1 and X 2 are not particularly limited, and may be Ortho (Ortho), meta (Meta) or Para (Para) with respect to fluorene, and are preferably Meta or Para.
The hydrocarbon group may be a linear or branched alkyl group having 1 to 6 carbon atoms, a linear or branched alkenyl group having 2 to 6 carbon atoms, a cycloalkyl group having 5 to 6 carbon atoms, a cycloalkenyl group having 5 to 6 carbon atoms, an aryl group having 6 to 10 carbon atoms, a linear or branched alkyl group having 1 to 4 carbon atoms, or the like.
The alkoxy group may be a straight-chain or branched alkoxy group having 1 to 6 carbon atoms.
The halogen atom includes fluorine (F), chlorine (Cl), bromine (Br) and iodine (I) atoms.
When the hydrocarbon group and the alkoxy group have a substituent, the substituent may be an alkoxy group such as a methoxy group, an aryl group such as a phenyl group, a benzyl group, or a tolyl group, an arylene group such as a phenylene group or a naphthylene group, or a (meth) acryloyl group, a (meth) acryloyloxy group, a nitro group, a hydroxyl group, or a phenoxy group, and the like, and is preferably a (meth) acryloyl group, a (meth) acryloyloxy group, or a hydroxyl group. In addition, there may be a plurality of substituents. Examples of the substituted hydrocarbon group include a 2-ethoxyethyl group, a 2-butoxyethyl group, a 2-nitropropyl group, a 2- (meth) acryloyloxyethyl group, a 2- (meth) acryloyloxypropyl group, and the like, and preferably a 2- (meth) acryloyloxyethyl group and a 2- (meth) acryloyloxypropyl group. Examples of the substituted alkoxy group include a 4-methoxyphenyl group, a 2-methoxy-2-nitroethoxy group, a 2- (meth) acryloyloxyethoxy group, and a 3- (meth) acryloyloxy-2-hydroxypropoxy group.
Each of n1 to n4 may be an integer of 0 to 4, preferably an integer of 0 to 2, and more preferably 0 or 1, independently of each other.
The above n3 and n4 are preferably integers of 0 to 3, more preferably integers of 0 to 2.
Each of m1 and m2 may be an integer of 0 to 3, preferably an integer of 0 to 2, and more preferably 0 or 1, independently of each other.
The m1+n1 and m2+n2 may each independently be an integer of 0 to 5.
The compound represented by the above chemical formula 3 may be, for example, 9-bis [4- (2-acryloyloxyethoxy) phenyl ] fluorene, 9-bis [4- (3-acryloyloxy-2-hydroxypropoxy) phenyl ] fluorene, 9-bis (4-hydroxyphenyl) fluorene 9, 9-bis (4-hydroxy-3-methylphenyl) fluorene, 9-bis (3-hydroxy-2-methylphenyl) fluorene, 9-bis (4-hydroxy-3, 5-dimethylphenyl) fluorene, 9-bis (4-hydroxy-2, 6-dimethylphenyl) fluorene, 9-bis (4-hydroxy-3, 5-di-tert-butylphenyl) fluorene 9, 9-bis (3, 4-dihydroxyphenyl) fluorene, 9-bis (2, 5-dihydroxyphenyl) fluorene, 9-bis (3, 4-dihydroxy-5-methylphenyl) fluorene, 9-bis (3, 4-dihydroxy-6-methylphenyl) fluorene 9, 9-bis (2, 4-dihydroxy-3, 6-dimethylphenyl) fluorene, 9-bis (3, 4, 5-trihydroxyphenyl) fluorene, 9-bis (2, 4, 6-trihydroxyphenyl) fluorene, 9-bis (2, 4, 5-trihydroxyphenyl) fluorene, 9-bis (2, 3, 4-trihydroxyphenyl) fluorene, 9, 9-bis (2, 3, 5-trihydroxyphenyl) fluorene, 9-bis (2, 3, 6-trihydroxyphenyl) fluorene, 9-bis (4-hydroxyethoxyphenyl) fluorene, 9-bis (4-hydroxyethoxy-3-methylphenyl) fluorene, 9-bis (4-hydroxyisopropoxy-3-methylphenyl) fluorene, 9-bis (4-hydroxyethoxy-3, 5-dimethylphenyl) fluorene 9, 9-bis (4-hydroxyisopropoxy 2, 6-dimethylphenyl) fluorene, 9-bis (4-hydroxyethoxy-3-cyclohexylphenyl) fluorene, 9-bis (4-hydroxyethoxy-3-phenylphenyl) fluorene, 9-bis [3, 4-bis (2-hydroxyethoxy) phenyl ] fluorene, 9-bis [3,4, 5-tris (2-hydroxyethoxy) phenyl ] fluorene, and the like.
The content of the fluorene compound may be 3 to 35 wt% based on the total weight of solid components in the photosensitive resin composition for forming an insulating film. When the content of the fluorene compound is less than 3 wt%, chemical resistance, bevel property, and copper (Cu) corrosion resistance may be poor, and when it is more than 35 wt%, pattern property and pore property may be poor.
In one or more embodiments, the photopolymerizable compound may further include a monofunctional monomer, a difunctional monomer, another polyfunctional monomer, and the like, in addition to the compound represented by the chemical formula 3.
The type of the monofunctional monomer is not particularly limited, and examples thereof include nonylphenyl carbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexyl carbitol acrylate, 2-hydroxyethyl acrylate, and N-vinylpyrrolidone.
The type of the difunctional monomer is not particularly limited, and examples thereof include 1, 6-hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, bis (acryloyloxyethyl) ether of bisphenol a, 3-methylpentanediol di (meth) acrylate, and the like.
Examples of the type of the polyfunctional monomer include, but are not limited to, trimethylolpropane tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, ethoxylated dipentaerythritol hexa (meth) acrylate, propoxylated dipentaerythritol hexa (meth) acrylate, and the like.
The content of the photopolymerizable compound may be 5 to 70% by weight, and preferably 20 to 60% by weight, based on the total weight of the solid components in the photosensitive resin composition. When the above range is satisfied, there is an advantage in terms of strength and smoothness of the pixel portion.
(C) Photopolymerization initiator
The photopolymerization initiator is not particularly limited as long as it is a component capable of initiating polymerization of the photopolymerizable compound or the like by irradiation with an active light, and a photopolymerization initiator developed in the past or later can be used.
In one or more embodiments, the photopolymerization initiator of the present invention may include one or more selected from the group consisting of acetophenone-based, benzophenone-based, triazine-based, thioxanthone-based, oxime-based, benzoin-based, and bisimidazole-based compounds.
Examples of the acetophenone-based compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1-one, benzildimethylketal, 2-hydroxy-1- [4- (2-hydroxyethoxy) phenyl ] -2-methylpropan-1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butane-1-one, and oligomers of 2-hydroxy-2-methyl [4- (1-methylvinyl) phenyl ] propan-1-one.
Examples of the benzophenone compound include benzophenone, 2' -hydroxy-4, 4' -dimethoxybenzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4 ' -methyldiphenyl sulfide, 3', 4' -tetra (t-butylperoxycarbonyl) benzophenone, and 2,4, 6-trimethylbenzophenone.
Examples of the triazine compound include 2, 4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3, 5-triazine, 2, 4-bis (trichloromethyl) -6- (4-methoxynaphthyl) -1,3, 5-triazine, 2, 4-bis (trichloromethyl) -6- (4-methoxystyryl) -1,3, 5-triazine, 2, 4-bis (trichloromethyl) -6- [2- (5-methylfuran-2-yl) ethylene ] -1,3, 5-triazine, 2, 4-bis (trichloromethyl) -6- [2- (furan-2-yl) ethylene ] -1,3, 5-triazine, 2, 4-bis (trichloromethyl) -6- [2- (4-diethylamino-2-methylphenyl) ethylene ] -1,3, 5-triazine, and 2, 4-bis (trichloromethyl) -6- [2- (3, 4-dimethoxyphenyl) ethylene ] -1,3, 5-triazine.
Examples of the thioxanthone compound include 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2, 4-diethylthioxanthone, 2, 4-dichlorothioxanthone, and 1-chloro-4-propoxythioxanthone.
Examples of the oxime-based compound include 1- [4- (phenylthio) phenyl ] -heptane-1, 2-dione 2- (O-benzoyl oxime), 1- [4- (phenylthio) phenyl ] -octane-1, 2-dione 2- (O-benzoyl oxime), 1- [4- (benzoyl) phenyl ] -octane-1, 2-dione 2- (O-benzoyl oxime), 1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] -ethanone 1- (O-acetyl oxime), 1- [ 9-ethyl-6- (3-methylbenzoyl) -9H-carbazol-3-yl ] -ethanone 1- (O-acetyl oxime), 1- (9-ethyl-6-benzoyl-9H-carbazol-3-yl) -ethanone 1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- (2-methyl-4-tetrahydrofuranyl benzoyl) -9.h ] -carbazol-3-yl ] -1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- (2-methyl-4-tetrahydropyranylmethyl benzoyl) -9.h. -carbazol-3-yl ] -1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- (2-methyl-5-tetrahydrofuranyl benzoyl) -9.h. -carbazol-3-yl ] -1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- (2-methyl-5-tetrahydropyranylmethyl benzoyl) -9.h. -carbazol-3-yl ] -1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- { 2-methyl-4- (2, 2-dimethyl-1, 3-dioxolanyl) benzoyl } -9.h. -carbazol-3-yl ] -1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- (2-methyl-4-tetrahydrofuranyl methoxybenzoyl) -9.h. -carbazol-3-yl ] -1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- (2-methyl-4-tetrahydropyranylmethoxybenzoyl) -9.h. -carbazol-3-yl ] -1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- (2-methyl-5-tetrahydrofuranylmethoxybenzoyl) -9.h. -carbazol-3-yl ] -1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] -1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- (2-methyl-5-tetrahydropyranylmethoxybenzoyl) -9.h. -carbazol-3-yl ] -1- (O-acetyl oxime), ethanone-1- [ 9-ethyl-6- { 2-methyl-4- (2, 2-dimethyl-1, 3-dioxolanyl) methoxy benzoyl } -9.h. -carbazol-3-yl ] -1- (O-acetyl oxime), and the like.
Examples of the benzoin compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether.
Examples of the bisimidazole compound include 2,2 '-bis (2-chlorophenyl) -4,4',5 '-tetrakis (4-ethoxycarbonylphenyl) -1,2' -bisimidazole, 2 '-bis (2-bromophenyl) -4,4',5,5 '-tetrakis (4-ethoxycarbonylphenyl) -1,2' -biimidazole, 2 '-bis (2-chlorophenyl) -4,4',5 '-tetraphenyl-1, 2' -biimidazole, 2 '-bis (2, 4-dichlorophenyl) -4,4',5,5 '-tetraphenyl-1, 2' -biimidazole, 2 '-bis (2, 4, 6-trichlorophenyl) -4,4',5 '-tetraphenyl-1, 2' -biimidazole, 2 '-bis (2-bromophenyl) -4,4',5,5 '-tetraphenyl-1, 2' -biimidazole, 2 '-bis (2, 4-dibromophenyl) -4,4',5 '-tetraphenyl-1, 2' -biimidazole, 2 '-bis (2, 4, 6-tribromophenyl) -4,4',5 '-tetraphenyl-1, 2' -biimidazole, and the like.
The content of the photopolymerization initiator may be 3 to 20% by weight, and preferably 5 to 15% by weight, based on the total weight of solid components in the resin composition for forming an insulating film. In the case where the above range is satisfied, there is an advantage in adjusting the pattern formation and improving the curing degree.
In order to improve the sensitivity of the resin composition for forming an insulating film of the present invention, the photopolymerization initiator may further contain a photopolymerization initiator auxiliary agent. The resin composition for forming an insulating film of the present invention can further improve sensitivity and productivity by containing the photopolymerization initiator aid.
The photopolymerization initiator may preferably be one or more compounds selected from the group consisting of amine compounds, carboxylic acid compounds, and polyfunctional thiol compounds.
As the amine compound, an aromatic amine compound is preferably used, and specifically, aliphatic amine compounds such as triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-ethylhexyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, N-dimethyl-p-toluidine, 4' -bis (dimethylamino) benzophenone (commonly referred to as Michler's ketone), 4' -bis (diethylamino) benzophenone, and the like can be used.
The carboxylic acid compound is preferably an aromatic heteroacetic acid, and specific examples thereof include phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylthioacetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenyl thioacetic acid, dichlorophenylthioacetic acid, N-phenylglycine, phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, naphthyloxyacetic acid, and the like.
Examples of the polyfunctional thiol compound include Tris- [ (3-mercaptopropionyloxy) -ethyl ] -isocyanurate (Tris- [ (3-mercaptopropionyloxy) -ethyl ] -isocyanurate), trimethylolpropane Tris-3-mercaptopropionate (Trimethylolpropane Tris-3-mercaptopropionate), pentaerythritol tetra-3-mercaptopropionate (Pentaerythritol tetrakis-3-mercaptopropionate), dipentaerythritol hexa-3-mercaptopropionate (Dipentaerythritol hexa-3-mercaptopropionate), and the like.
In the case of further containing the photopolymerization initiator, the content of the photopolymerization initiator may be 0.1 to 40% by weight, and preferably 1 to 30% by weight, based on the total weight of the binder resin and the solid content of the photopolymerizable compound. When the above range is satisfied, the effect of further improving the sensitivity of the colored photosensitive resin composition and improving the productivity of a color filter formed using the colored photosensitive resin composition can be provided.
(D) Light absorber
The insulating film-forming resin composition of the present invention may contain a light absorber. The light absorber is not particularly limited as long as it contains a functional group that absorbs light and a substituent attached to the basic structure, and preferably contains an azole compound. In this case, it is preferable in view of improving pattern characteristics, hole characteristics, and slope characteristics.
In one embodiment, the azole compound may include at least one selected from the group consisting of Benzotriazole (BTA) and pyrazole.
The light absorber containing Benzotriazole (BTA) and/or pyrazole can improve pattern and hole characteristics, reliability, and the like by adjusting the curing degree by the light absorption characteristics in the long wavelength region.
The case where the insulating film-forming resin composition contains Benzotriazole (BTA) and pyrazole can be analyzed by a commonly used analysis method. Specifically, the content of benzotriazole and pyrazole contained in the resin composition for forming an insulating film can be analyzed using nuclear magnetic resonance spectroscopy, infrared absorption spectroscopy, mass spectrometry, and the like.
The content of the light absorber may be 1 to 10% by weight, and preferably 2 to 6% by weight, based on the total weight of solid components in the resin composition for forming an insulating film. In the case where the above range is satisfied, there is an advantage in pattern characteristics as well as hole characteristics.
(E) Solvent(s)
The above-mentioned solvents may be used without particular limitation, and organic solvents known in the art may be used.
Specific examples of the solvent include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether and ethylene glycol monobutyl ether, diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether and diethylene glycol dibutyl ether, ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate, alkylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate and methoxypentyl acetate, aromatic hydrocarbons such as benzene, toluene, xylene and mesitylene, ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone and cyclohexanone, esters such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol and glycerin, cyclic esters such as ethyl 3-ethoxypropionate and methyl 3-methoxypropionate, and cyclic esters such as γ -butyrolactone.
From the viewpoint of coatability and drying properties, the solvent is preferably an organic solvent having a boiling point of 100 to 200 ℃, more preferably an alkylene glycol alkyl ether acetate, ketone, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate or other esters, and even more preferably propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate or the like.
The above solvents may be used each alone or in combination of two or more.
The content of the solvent may be 60 to 90% by weight, and preferably 70 to 85% by weight, based on the total weight of the resin composition for forming an insulating film. When the above range is satisfied, the effect of improving the coating properties is preferably provided when the coating is performed by a coating apparatus such as a roll coater, a spin coater, a slot coater (sometimes referred to as a die coater), or an inkjet printer.
(F) Additive agent
The photosensitive resin composition of the present invention may further contain additives as needed, and the types of the additives may be determined according to the needs of the user, and the present invention is not particularly limited, and examples thereof include fillers, other polymer compounds, curing agents, surfactants, adhesion promoters, antioxidants, ultraviolet absorbers, anticoagulants, dispersants, ink repellents, and the like. The above exemplified additives may be used singly or in combination of two or more.
The filler may be glass, silica, alumina, or the like, but is not limited thereto.
As the other polymer compound, a curable resin such as an epoxy resin or a maleimide resin can be used; thermoplastic resins such as polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester, and polyurethane; and the like, but is not limited thereto.
The curing agent is used for the purpose of improving the deep curing and mechanical strength, and specifically, an epoxy compound, a polyfunctional isocyanate compound, a melamine compound, an oxetane compound, and the like can be used, but the curing agent is not limited thereto. The epoxy compound may be specifically selected from bisphenol a type epoxy resins, hydrogenated bisphenol a type epoxy resins, bisphenol F type epoxy resins, hydrogenated bisphenol F type epoxy resins, novolak type epoxy resins, other aromatic epoxy resins, alicyclic epoxy resins, glycidyl ester type resins, glycidyl amine type resins, brominated derivatives of these epoxy resins, aliphatic, alicyclic or aromatic epoxy compounds other than epoxy resins and brominated derivatives thereof, butadiene (co) polymer epoxide, isoprene (co) polymer epoxide, glycidyl (meth) acrylate (co) polymer, triglycidyl isocyanurate, and the like, but is not limited thereto. Specific examples of the oxetane compound include carbonate dioxetane, xylene dioxetane, adipate dioxetane, terephthalate dioxetane, and cyclohexane dicarboxylic acid dioxetane, but are not limited thereto.
The curing agent may be used in combination with a co-curing compound capable of ring-opening polymerizing an epoxy group of an epoxy compound and an oxetane skeleton of an oxetane compound. Specifically, polycarboxylic acids, polycarboxylic acid anhydrides, acid generators and the like can be used as the auxiliary curing compound. The carboxylic acid anhydrides can be used as commercially available epoxy resin curing agents. Examples of the epoxy resin curing agent that is commercially available include ADEKA HARDENER EH-700 (trade name, manufactured by ADEKA corporation), RIKACID HH (trade name, manufactured by new japan physical and chemical corporation), MH-700 (trade name, manufactured by new japan physical and chemical corporation), and the like.
The above-exemplified curing agents and co-curing compounds may be used each alone or in combination of two or more.
The surfactant may be a commercially available surfactant, and examples thereof include a silicone surfactant, a fluorine surfactant, and a mixture thereof. Examples of the silicone surfactant include surfactants having a siloxane bond. Examples of the commercial products include TORAY SILICONE DC3PA、TORAY SILICONE SH7PA、TORAY SILICONE DC11PA、TORAY SILICONE SH21PA、TORAY SILICONE SH28PA、TORAY SILICONE 29SHPA、TORAY SILICONE SH30PA、 polyether modified silicone oil SH8400 (manufactured by Toshiba Silicones Co., ltd.), KP321, KP322, KP323, KP324, KP326, KP340, KP341 (manufactured by Xinshiba Silicones Co., ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF-4446, TSF4452, TSF4460 (manufactured by GE Toshiba Silicones Co., ltd.), and the like.
Examples of the fluorine-based surfactant include surfactants having a fluorocarbon chain. Specific examples thereof include FLUORINERT FC430, FLUORINERT FC431 (manufactured by Sumitomo 3M Co., ltd.), MEGAFAC (manufactured by Sumitomo 3M Co., ltd.), EFTOP (manufactured by DIC Co., ltd.), EF301, EFTOP EF, EFTOP EF351, EFTOP EF (manufactured by Xinqian chemical Co., ltd.), SURFLON (manufactured by Santa Clara chemical Co., ltd.), S381, SURFLON S382, SURFLON SC, SURFLON SC (manufactured by Asahi Kabushiki Kaisha), E5844 (manufactured by Dajinji Seisakusho, ltd.), BM-1000, BM-1100 (manufactured by Santa Clara chemical Co., ltd.: BMChemie), and the like.
The adhesion promoter may specifically be one or a mixture of two or more selected from the group consisting of vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2-aminoethyl) -3-aminopropyl methyldimethoxysilane, N- (2-aminoethyl) -3-aminopropyl trimethoxysilane, 3-aminopropyl triethoxysilane, 3-glycidoxypropyl trimethoxysilane, 3-glycidoxypropyl methyldimethoxysilane, 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyl trimethoxysilane, 3-mercaptopropyl trimethoxysilane, 3-isocyanatopropyl trimethoxysilane and 3-isocyanatopropyl triethoxysilane.
The antioxidant may include, for example, one or more selected from the group consisting of a phosphorus antioxidant, a sulfur antioxidant, and a phenol antioxidant, and in this case, a discoloration phenomenon which may occur at a high temperature in the process or yellowing which may occur due to a light source after the display is manufactured can be suppressed. The antioxidant may contain one or more selected from the group consisting of a phenol compound, a phosphorus compound, and a sulfur compound, and may be used in combination of a phenol-phosphorus compound, a phenol-sulfur compound, a phosphorus-sulfur compound, or a phenol-phosphorus-sulfur compound.
The ultraviolet absorber may be specifically, but not limited to, 2- (3-tert-butyl-2-hydroxy-5-methylphenyl) -5-chlorobenzotriazole, alkoxybenzophenone, and the like.
The anti-coagulant may be sodium polyacrylate, for example, but is not limited thereto.
The above-mentioned dispersant is added to maintain the dispersion stability of the pigment, and a dispersant generally used in the art can be used without limitation.
The ink repellent has a fluorine atom in a molecule. Thus, the ink repellent has properties of migration to the upper surface (upper surface migration) and ink repellency in forming a cured film using the photosensitive resin composition containing the same. By using the ink repellent, the upper layer portion including the upper surface of the obtained cured film becomes a layer in which the ink repellent is densely present (hereinafter, may be referred to as "ink repellent layer"), and the ink repellency of the upper surface of the cured film is imparted. In addition, from the viewpoint of improving the fixability of the ink repellent in the ink repellent layer, the ink repellent is preferably a compound having an ethylenic double bond. Since the ink repellent has an ethylenic double bond, the radical acts on the ethylenic double bond of the ink repellent migrating to the upper surface, and the ink repellent or the ink repellent and other components having ethylenic double bonds contained in the photosensitive resin composition for forming a partition wall can be crosslinked by (co) polymerization.
The type of the ink repellent is not particularly limited, and examples thereof include partial hydrolysis condensates of hydrolyzable silane compounds. The hydrolyzable silane compound may be used alone or in combination of two or more. An ink repellent composed of a partial hydrolysis condensate of a hydrolyzable silane compound and having a fluorine atom may be used, or an ink repellent composed of a compound having a hydrocarbon chain as a main chain and a fluorine atom in a side chain may be used.
The above-mentioned additives can be used as appropriate by those skilled in the art within the range of not impairing the effects of the present invention. For example, the additive may be used in an amount of 0.05 to 10 wt%, preferably 0.1 to 10 wt%, more preferably 0.1 to 5 wt%, based on the total weight of the photosensitive resin composition, but is not limited thereto.
< Insulating film >
The present invention comprises an insulating film formed from a resin composition for forming an insulating film on a substrate.
The substrate is not particularly limited as long as it functions as a structural base (base) for providing other elements and the like by including an insulating film formed from the resin composition for forming an insulating film. In one or more embodiments, the substrate may be a polymerizable film of polyethylene terephthalate, polypropylene, polyethylene, polyester, or the like.
In one embodiment, the insulating film may include a predetermined pattern, for example, a pattern formed by applying the insulating film-forming resin composition on a substrate, exposing the substrate to light in a predetermined pattern, and developing the substrate.
Specifically, the method can comprise the following steps of: a step (S1) of producing a solution in which a resin composition for forming an insulating film is mixed; a step (S2) of applying the solution produced in the step (S1) to a substrate; a step (S3) of heating for removing the solvent of the solution applied in the step (S2); a step (S4) of forming a pattern by exposure and development; and a step (S5) of heating to increase the solidification degree of the formed pattern.
In the step (S2) of applying the solution to the substrate, the insulating film-forming resin composition is applied to the substrate and then dried by heating, whereby volatile components such as a solvent can be removed to form a smooth coating film.
The coating method may be performed by, for example, spin coating, flexible coating, roll coating, slit spin coating, slit coating, or the like. After the application, the solvent and other volatile components are volatilized by heating after drying by heating (pre-baking) or drying under reduced pressure.
The heating step (S3) for removing the solvent may be carried out at 70 to 150℃in general, and preferably at 80 to 130 ℃.
In the step (S4) of forming a pattern by exposure and development, first, ultraviolet rays are irradiated through a mask for forming a target pattern. In this case, in order to uniformly irradiate the exposure portion as a whole with parallel light and to precisely align the mask with the substrate, it is preferable to use a mask aligner, a stepper, or the like. In this case, the mask pattern may be in direct contact with the insulating film, or may be in contact with the film through which the active light rays can pass, and may be formed with a predetermined distance therebetween.
As the light source of the active light, a light source of the active light used in the exposure performed in the past or in the future, a light which effectively emits ultraviolet rays such as a carbon arc lamp, a mercury vapor arc lamp, an ultra-high pressure mercury lamp, a xenon lamp, or the like, a flat panel bulb for photography, a solar lamp, or the like, which effectively emits visible rays, or the like, may be used.
Then, the photo-cured coating film is brought into contact with a developer to dissolve the unexposed portion, whereby an insulating film having a desired pattern can be formed.
The heating step (S5) for increasing the curing degree of the pattern formed above may be performed at 80 to 150 ℃.
The insulating film formed from the resin composition for forming an insulating film of the present invention has an excellent effect in improving reliability and provides an effect of preventing corrosion of a lower copper substrate.
< Image display device >
The invention provides a display device comprising the insulating film.
The display device of the present invention may include a display device which has been developed in the past or later, and in one or more embodiments, may be a Liquid crystal display device (Liquid CRYSTAL DISPLAY; LCD), an electroluminescence (Electro Luminescent; EL) display device, a plasma display device (PLASMA DISPLAY PANEL; PDP), a field emission display device (Field Emission Display; FED), an Organic LIGHT EMITTING Diode (OLED) display device, or the like.
The display device may include a structure generally known in the art in addition to the insulating film.
The present invention will be described in more detail below based on examples, but the embodiments of the present invention disclosed below are merely illustrative, and the scope of the present invention is not limited to these embodiments. The scope of the present invention is defined in the claims, and all modifications within the meaning and scope equivalent to the meaning of the claims are included in the scope of the present invention. In the following examples and comparative examples, "%" and "parts" indicating the content are based on mass unless otherwise specified.
< Production example 1: production of Binder resin-
To a four-necked flask equipped with a dropping funnel, a thermometer, a condenser, and a stirrer, 23.3g of methyl-2- (bromomethyl) -acrylate (product of Aldrich Co.), 15.8g of triethylamine (product of Aldrich Co.), and 115.0g of propylene glycol methyl ether (product of TCI Co.) were charged, and the inside of the four-necked flask was replaced with nitrogen gas. Next, the flask was heated to 90℃and a mixed solution of 15.1g of methyl-2- (hydroxymethyl) -acrylate (product of Aldrich Co., ltd.), 3.2g of 2,2' -azobisisobutyronitrile (product of Wako Co., ltd.) and 110.0g of propylene glycol methyl ether (product of TCI Co., ltd.) was added dropwise over 1 hour, followed by polymerization for 30 minutes to thereby produce a pyran-containing polymer. Subsequently, a mixed solution of 37.5g of methacrylic acid, 19.0g of methyl methacrylate, 225.0g of propylene glycol methyl ether and 3.2g of 2,2' -azobisisobutyronitrile (and optical Co., ltd.) was slowly dropped over 1 hour, followed by polymerization for 8 hours, and then cooled to room temperature. After the inside of the four-necked flask was replaced with nitrogen, 61.5g of glycidyl methacrylate (Mitsubishi positive Co., ltd.), 3.6g of tetra-n-butylammonium bromide (TCI Co., ltd.) and 0.15g of 4-methoxyphenol (Methoquinone (4-methoxyphenol), pure Co., ltd.) were added to the flask, and the mixture was reacted at 80℃for 12 hours to obtain a binder resin B1 having GMA added to the carboxyl group of the copolymer. The weight average molecular weight (Mw) of the binder resin B1 measured by GPC was 23,000.
< Production example 2: production of Binder resin-
To a1 liter separation flask equipped with a stirrer, a thermometer, a reflux condenser, a dropping funnel, and a nitrogen inlet tube, 277g of methoxybutyl acetate was charged, the temperature was raised to 80℃and then a mixture [50:50 (molar ratio) ]301g of a mixture of 3, 4-epoxytricyclo [5.2.1.0,2,6] decan-9-ylacrylate and 3, 4-epoxytricyclo [5.2.1.0,2,6] decan-8-ylacrylate, 49g of methacrylic acid, and 23g of azobis-dimethylvaleronitrile were added dropwise over a period of 5 hours, and the mixture was dissolved in 350g of methoxybutyl acetate, followed by aging for 3 hours to obtain a binder resin B3[ 35.0 wt.% solid content (NV) ]. The acid value (dry) of the obtained binder resin B3 was 69.8mgKOH/g, the weight-average molecular weight (Mw) was 12,300, and the dispersity (Mw/Mn) was 2.1.
< Examples and comparative examples >
Referring to tables 1 to 2 below, resin compositions for forming insulating films of examples and comparative examples were produced, respectively.
TABLE 1
TABLE 2
< Experimental example >
The resin compositions for forming insulating films of examples and comparative examples were evaluated for pattern properties, hole properties, chemical resistance, copper (Cu) corrosion, and slope properties, and the results are shown in tables 3 to 4 below.
(1) Substrate fabrication
The substrate of 5cm x 5cm was washed with neutral detergent and water and dried. The applicable substrate may be a glass substrate (corning) or a substrate with a Cu pattern according to an evaluation method. The resin compositions for forming an insulating film manufactured in the above examples and comparative examples were spin-coated on a substrate so that the final film thickness became 2.0 μm, respectively, and dried for 1 to 3 minutes by pre-firing at 80 to 120 ℃ to remove the solvent. Thereafter, the resist is exposed to light at an exposure dose of 30 to 80mJ/cm 2 to form a pattern, and the non-exposed portion is removed by using an aqueous alkali solution. Then, the substrate is manufactured by baking at 100 to 180 ℃ for 20 to 60 minutes.
(2) Pattern properties and hole properties
The substrate with the pattern was fabricated as above. The pattern size and the pore size were measured using an SNU (SIS-2000) device. The CD bias (CD-bias) is calculated from the difference in the pattern size of the mask and the size of the pattern actually generated.
CD deviation= (Mask Size)) - (actual pattern Size)
< Evaluation criterion of Pattern Property >
O: CD deviation is less than or equal to +4mu.m
X: CD bias > +4 μm
< Criterion for evaluation of pore characteristics >
O: CD deviation of-4 to-7 mu m
X: CD bias of less than-7 μm or greater than-4 μm
(3) Resistance to chemical agents
After the substrates fabricated according to the above criteria were immersed in the etching solution and the stripping solution in order, the film thickness change was confirmed. The film thickness was confirmed after immersing the fabricated substrate for 2 minutes while maintaining the etching solution at 45 ℃. After that, the film thickness was confirmed after immersing in a stripping solution maintained at 60℃for 5 minutes. After all of this process was performed, the difference between the film thickness before immersion in the etching liquid and the film thickness after immersion in the stripping liquid was confirmed.
Δfilm thickness = film thickness before chemical resistance evaluation-film thickness after stripping solution immersion
< Evaluation criterion for chemical resistance >
O: the thickness of the delta film is less than or equal to 0.2 mu m
X: delta film thickness >0.2 μm
(4) Cu corrosion
The substrate fabricated as above was subjected to high pressure retort test (Pressure Cooker Test, PCT) equipment to confirm Cu corrosion. In the experiment, the substrate thus produced was maintained in a device having a temperature of 110℃and a humidity of 100% for 72 hours, and then examined for corrosion by a microscope. The evaluation confirmed that several corrosions occurred at 10 using a Cu-patterned substrate.
< Copper (Cu) Corrosion evaluation criterion >
O: inner corrosion at 2 out of 10
X: corrosion at 3 or more
(5) Slope characteristics
The slope of the pattern produced according to the above standard was measured using an SEM (Hitachi, S-4300) apparatus.
< Evaluation criterion of inclined plane characteristics >
O: the taper angle (TAPER ANGLE) is 15 DEG or more and less than 80 DEG
X: cone angle of less than 15 DEG or 80 DEG or more
TABLE 3
TABLE 4
Referring to tables 3 to 4 above, in the case of producing an insulating film using the resin composition for forming an insulating film according to the embodiment of the present invention, the critical dimension deviation (Critical Dimension bias, CD deviation) of the pattern shows a value of +4 μm or less, and the CD deviation of the formed hole shows a value of-4 to-7 μm, so that it is found that undercut (Undercut) phenomenon which may occur in wet etching (WET ETCHING) is reduced, and advantageous effects are provided in forming a fine pattern and a hole.
Further, the film thickness variation after immersion in the etching liquid (Etchant) and the peeling liquid (Stripper) in this order was 0.2 μm or less, and thus it was confirmed that the loss of the insulating film which may occur during the peeling (stripping) process could be minimized.
Further, it was confirmed that corrosion of copper patterns within 2 out of 10 copper patterns on the substrate occurred, thereby exhibiting excellent effects for corrosion prevention of copper under high temperature, high humidity conditions which may occur in equipment, particularly in a display device.
Further, the measured taper angle of the formed pattern was 15 ° or more and less than 80 °, and thus it was found that the formed slope was excellent in characteristics.
On the other hand, in the case of producing an insulating film from the resin composition for forming an insulating film of comparative examples 1 to 4 which did not contain a fluorene compound as a photopolymerizable compound, it was confirmed that the difference in film thickness was more than 0.2 μm, and that the insulating film was excessively lost during peeling, and that the pattern at 3 or more out of the total 10 copper patterns was corroded, and thus, it was not suitable for use in equipment, particularly in an image display device such as a display.
Further, since the taper angle of the formed pattern was less than 15 ° or 80 ° or more, it was confirmed that the slope characteristics were poor.
In addition, in the case of producing an insulating film using the resin composition for forming an insulating film of comparative examples 5 and 6 which did not contain Benzotriazole (BTA) and pyrazole as light absorbers, it was confirmed that the chemical resistance, the bevel property and the copper (Cu) anticorrosive ability were poor, the CD deviation of the formed pattern was more than 4. Mu.m, the CD deviation of the formed hole was less than-7. Mu.m or more than-4. Mu.m, and the pattern property and the hole property were also poor, as in the case of comparative examples 1 to 4.

Claims (14)

1. A resin composition for forming an insulating film, which comprises (A) a binder resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a light absorber, and (E) a solvent,
The (A) binder resin contains a compound represented by the following chemical formula 2, the (A) binder resin further contains a tetrahydropyran THP-series ring,
The photopolymerizable compound (B) contains a fluorene compound,
The (D) light absorber comprises an azole compound,
Chemical formula 2
In the chemical formula 2, R 3 and R 4 are each independently hydrogen or CH 3,
A and b are each independently integers of 3 to 20.
2. The resin composition for forming an insulating film according to claim 1, wherein the tetrahydropyran THP-based ring is formed by polymerization including at least one of an acyclic compound and a cyclic compound that form a tetrahydropyran THP-based ring upon polymerization.
3. The resin composition for forming an insulating film according to claim 2, wherein the acyclic compound comprises a compound represented by the following chemical formula 1,
Chemical formula 1
In chemical formula 1, R 1、R2 is an aliphatic hydrocarbon group having 1 to 20 carbon atoms or an aromatic hydrocarbon group having 6 to 18 carbon atoms, each of which may or may not contain a heteroatom.
4. The resin composition for forming an insulating film according to claim 2, wherein the cyclic compound contains one or more selected from the group consisting of tetrahydropyran-2-yl (meth) acrylate, (tetrahydropyran-2-yl) methyl (meth) acrylate, 2, 6-dimethyl-8- (tetrahydropyran-2-yloxy) -1-octen-3-one, 1- (tetrahydropyran-2-yloxy) -3-buten-2-one, 4- (1, 4-dioxa-5-oxo-6-heptenyl) -6-methyl-2-pyrone, and 4- (1, 5-dioxa-6-oxo-7-octenyl) -6-methyl-2-pyrone.
5. The resin composition for forming an insulating film according to claim 1, wherein the fluorene compound comprises a compound represented by the following chemical formula 3,
Chemical formula 3
In the chemical formulA 3, X 1 and X 2 each independently represent A hydroxyl group, - (O-A-O) p H group, wherein A represents an alkylene group having 2 to 3 carbon atoms, p represents an integer of 1 to 10, R 5～R8 each independently represents A hydrocarbon group having 1 to 20 carbon atoms which may be substituted, an alkoxy group having 1 to 20 carbon atoms which may be substituted, or A halogen atom, m1 and m2 each independently represent an integer of 0 to 3, and n1 to n4 each independently represent an integer of 0 to 4, wherein m1+n1 and m2+n2 each independently represent an integer of 0 to 5.
6. The resin composition for forming an insulating film according to claim 1, wherein the fluorene compound is contained in an amount of 3 to 35% by weight based on the total weight of solid components in the resin composition for forming an insulating film.
7. The resin composition for forming an insulating film according to claim 1, wherein the azole compound comprises at least one selected from the group consisting of benzotriazole BTA and pyrazole.
8. The resin composition for forming an insulating film according to claim 1, comprising, relative to the total weight of solid components in the resin composition for forming an insulating film
(A) 10 to 50 weight percent of binder resin,
(B) 5 to 70% by weight of a photopolymerizable compound,
(C) 3 to 20 weight percent of photopolymerization initiator,
(D) 1 to 10 wt% of a light absorber,
And comprises, relative to the total weight of the resin composition for forming the insulating film
(E) 60 to 90 weight percent of solvent.
9. The resin composition for forming an insulating film according to claim 1, which prevents copper corrosion.
10. The resin composition for forming an insulating film according to claim 1, wherein the firing temperature of the resin composition for forming an insulating film is 80 to 150 ℃.
11. The resin composition for forming an insulating film according to claim 10, wherein the firing temperature is a post-firing temperature.
12. An insulating film formed from the resin composition for forming an insulating film according to any one of claims 1 to 11.
13. An image display device comprising the insulating film of claim 12.
14. A method for producing an insulating film, comprising the step of forming an insulating film by a low-temperature firing step at 80 to 150 ℃ using the resin composition for forming an insulating film according to any one of claims 1 to 11.
CN202110199968.1A 2020-03-30 2021-02-22 Resin composition for forming insulating film, insulating film produced using the same, image display device, and method for producing insulating film Active CN113467183B (en)

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