KR20210115617A - An electronic device comprising a housing - Google Patents

Abstract

An objective of the present invention is to provide a housing to which a decoration film is attached without the occurrence of folds, wrinkles, or air bubbles. The present invention relates to an electronic device including: a window forming at least a part of the front surface of the electronic device; a housing disposed below the window and forming at least a part of the side surface and the back surface of the electronic device; a first film layer disposed on the entire inner surface of the housing; and a second film layer disposed on the first film layer to overlap a part of at least a first surface of the inner surface. The first film layer has a first elongation. The second film layer has a second elongation lower than the first elongation. The housing includes a back surface-forming bottom portion and a side wall extending to bend toward the window from at least a part of the edge of the bottom portion. The inner surface of the housing includes a first surface formed by the bottom portion and a second surface formed by the side wall. Various other embodiments are also possible.

Description

Electronic device comprising a housing {AN ELECTRONIC DEVICE COMPRISING A HOUSING}

Various embodiments relate to an electronic device including a housing.

The housing of the electronic device may include a 3D shape for design differentiation and excellent grip. The housing having a 3D shape may include a bottom portion and a side wall extending with a curvature from an edge of the bottom portion.

The housing of the electronic device may include a non-metal material, for example, glass, ceramic, or resin, and may be formed to be transparent or semi-transparent. A layer having a color and/or a three-dimensional pattern, for example, a decoration film, may be provided on the inner surface of the housing in order to impart a design aesthetic to the substantially transparent housing. The decoration film may include, for example, a UV molding layer, a deposition layer, and a printing layer provided on one surface of a PET (polyethylene terephthalate) film for imparting a visual effect, and is adhered to the housing As a means for doing so, an adhesive such as an optically clear adhesive (OCA) provided on the other side of the PET film may be included. The decoration film provided with the adhesive may be attached to the inner surface of the housing through a lamination process. For example, in the case of a 2D housing that does not include a curved surface, the decoration film may be attached to the housing through a laminating process using a roller. On the other hand, in the case of a 3D housing including a curved surface, the attachment of the decoration film may be made in a vacuum condition in order to reduce defects such as folds, wrinkles, and bubbles of the film during the lamination process. For example, it may be attached by seating the housing on a jig in a vacuum environment and pressing the decoration film to the housing with a silicone pad. The decoration film may be compressed by a silicone pad while seated on the guide film, and the guide film may be removed after the decoration film is adhered.

On the other hand, mobile devices, such as smartphones, 5G (5 ^th generation) have been required radio transmission performance of high performance with the arrival of the times, so that a trend that comprises the reduction of a portion formed of a metal member in the facade of a mobile device, . As a method for reducing the metal member, the height of the non-metallic 3D housing (eg, the height from the plane to the end of the side wall when the bottom of the housing is placed on a plane) is increased so that the metal member occupies the appearance of the mobile device. area can be replaced. The method of increasing the height of the 3D housing is receiving a lot of attention as a design element that can improve the aesthetics of a smart phone as well as secure radio communication performance.

Since the 3D housing includes a curved surface, it may be difficult to laminate a decoration film of the prior art (eg, a decoration film using PET as a base film). For example, the sidewall of the 3D housing may extend in the height direction of the housing while being bent from the four edges (top, bottom, left, and right) of the bottom part. As the curvature and height of the housing increase, the complexity of the inner surface of the housing requiring film attachment increases, and a non-developable double curvature surface may be formed. In order for the flat decoration film to accurately correspond to the non-developable curved surface, at least a portion of the decoration film must be stretched or cut, so that compressive stress is applied to the flat decoration film attached to the double curved surface, so that the decoration film is wrinkled or the attachment position is misaligned. In the process of attaching the decoration film to the double curved surface, folding and bubbles of the film may occur. In addition, due to the compressive stress applied to the decoration film attached to the housing, defects such as folds or wrinkles may occur over time, which worsens over time.

In order to solve the above problems, a highly stretchable film having a higher elongation than a PET film, for example, polyamide (PA), polymethylmethacrylate (PMMA), polyvinyl chloride (PVC) , polypropylene (polypropylene, PP), polyurethane (polyurethane, PU) or thermoplastic polyurethane (TPU) can be used as the base material of the decoration film. However, when using a high-stretch film, defects such as bubbles and folds on the double-curved surface may be improved depending on the stretchability of the film, but defects such as back pressing by internal parts may occur due to a low surface hardness value. Defects such as pressing of the back side of the decoration film may be recognized even when the electronic device is viewed from the outside. In addition, the decoration film may be stretched in an opening such as a camera hole formed in the 3D housing due to the stretching property of the high stretchable film, and the boundary of the opening and the boundary of the decoration film may not match.

In an electronic device according to an embodiment, a window forming at least a portion of a front surface of the electronic device, a housing forming at least a portion of a side surface and a rear surface of the electronic device, and disposed under the window - the housing forming the rear surface and a sidewall extending from at least a portion of an edge of the bottom to be bent toward the window, wherein an inner surface of the housing is formed by a first surface formed by the bottom portion and a second surface formed by the sidewall a first film layer disposed on all of the inner surface of the housing, and a second film layer disposed over the first film layer to overlap at least a portion of the first surface of the inner surface; The first film layer may have a first elongation, and the second film layer may have a second elongation lower than the first elongation.

The electronic device according to an embodiment may provide a housing to which a decoration film is attached without generating folds, wrinkles, or bubbles.

The electronic device according to an embodiment may prevent the decoration film attached to the housing from being deformed by the internal components of the electronic device.

The electronic device according to an embodiment may prevent a position shift of the decoration film attached to the housing.

1 illustrates an electronic device according to an embodiment.
2 is an exploded perspective view of an electronic device according to an exemplary embodiment;
3A is a perspective view of a housing according to an exemplary embodiment;
FIG. 3B is a partially cut-away perspective view of the housing as viewed in the +z-axis direction of FIG. 3A .
FIG. 4 shows an inner surface of the housing as viewed in the +z-axis direction of FIG. 3A .
5 illustrates a first film layer and a second film layer, according to an embodiment.
6A is a cross-sectional view of a housing to which a first film layer and a second film layer are attached, according to an exemplary embodiment;
6B is a cross-sectional view of a housing to which a first film layer and a second film layer are attached, according to an exemplary embodiment.
6C illustrates a first film layer, a second film layer, and a housing, according to an embodiment.
7 illustrates a second film layer including micro-holes according to another embodiment.
8A is a cross-sectional view of a housing to which a first film layer and a second film layer including micro-holes are attached, according to an exemplary embodiment.
8B is a cross-sectional view of a housing to which a first film layer and a second film layer including micro-holes are attached, according to an exemplary embodiment.
9 illustrates examples of micro-hole patterns according to an embodiment.
10 is a partially cut-away perspective view of a housing according to another embodiment.
11 is a partially cut-away perspective view of a housing according to another embodiment.
12 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

1 illustrates an electronic device 101 according to an embodiment.

Referring to FIG. 1 , an electronic device 101 according to an embodiment may include a window 102 , a display 160 , a housing 110 , and a first bracket 120 .

In an embodiment, the window 102 of the electronic device 101 may be substantially transparent. The window 102 may form at least a portion of the front surface 101A of the electronic device 101 . Window 102 may be formed by glass and/or polymer including various coating layers.

In one embodiment, the display 160 may be disposed below the window 102 . Display 160 can be seen through a significant portion of window 102 . In an embodiment, the edge of the display 160 may be formed to have substantially the same shape as an adjacent outer shape of the window 102 . In another embodiment, in order to expand the area to which the display 160 is visually exposed, the distance between the perimeter of the display 160 and the perimeter of the window 102 may be substantially the same.

In an embodiment, the display 160 may be disposed adjacent to or coupled to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. .

In an embodiment, the display 160 may include an opening 162 . At least one of an audio module, a sensor module, a camera module, and/or a light emitting device (not shown) may be disposed in the opening 162 . In another embodiment, at least one of the audio module, the sensor module, the camera module, the fingerprint sensor, and/or the light emitting device may be disposed on the rear surface of the display area of the display 160 rather than the opening 162 . In this case, the opening 162 may be omitted.

The audio module may include a receiver for a call that is distinct from the speaker hole 104 .

The sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. The sensor module may include, for example, a proximity sensor and/or a fingerprint sensor. The fingerprint sensor may be disposed on the rear surface 101B of the electronic device 101 instead of the opening 162 of the display 160 or the rear surface of the display 160 .

In an embodiment, the electronic device 101 may include a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. It may further include at least one of.

In an embodiment, the housing 110 of the electronic device 101 may include a substantially transparent region. For example, the entire housing 110 may be formed to be substantially transparent, or a portion of the housing 110 may be formed to be substantially transparent and the remaining portion may be formed to be substantially opaque. The housing 110 may be formed of glass, ceramic, polymer, or a combination of at least two of the above materials. The housing 110 may form at least a portion of the side surface 101C and the rear surface 101B of the electronic device 101 .

In an embodiment, the first bracket 120 may be disposed between the window 102 and the housing 110 . At least a portion of the first bracket 120 may be accommodated in the housing 110 , and a portion in which the first bracket 120 is accommodated in the housing 110 may not be visible from the outside of the electronic device 101 . In an embodiment, the first bracket 120 may support various components (eg, a battery) of the electronic device 101 . In an embodiment, the first bracket 120 may include a metal (eg, aluminum) and/or a polymer.

According to an embodiment, the electronic device 101 includes a speaker hole 104 , a microphone hole 103 , a connector hole 108 , a key input device 117 , a camera module 112 , and/or a flash 113 . ) may include at least one of.

In one embodiment, the microphone hole 103 may be provided with a microphone for acquiring an external sound, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.

In an embodiment, the speaker hole 104 may be disposed on the side surface 101C of the electronic device 101 . In an embodiment, the speaker hole 104 may be implemented as a single hole with the microphone hole 103, or a speaker in which the hole is omitted (eg, a piezo speaker) may be included.

In an embodiment, the connector hole 108 may accommodate a connector (eg, a USB connector) for transmitting and receiving at least one of power, data, and/or audio signals to and from an external electronic device.

In an embodiment, the key input device 117 may be disposed on the side surface 101C of the housing 110 . In another embodiment, the electronic device 101 may not include some or all of the key input devices 117 , and the not included key input devices 117 may be implemented in other forms, such as soft keys, on the display 160 . can be In some embodiments, the key input device 117 may include a sensor module (eg, an HRM sensor, a fingerprint sensor).

In an embodiment, the camera module 112 may be disposed on the rear surface 101B of the housing 110 . For example, the camera module 112 may be inserted into an opening formed in the rear surface 101B of the housing 110 , and a portion of the camera module 112 may be disposed to protrude from the housing 110 . The camera module 112 may include one or a plurality of lenses (eg, wide-angle and telephoto lenses, etc.), an image sensor, and/or an image signal processor.

In an embodiment, the flash 113 may include a light emitting diode or a xenon lamp. The flash 113 may provide a light source in association with the operation of the camera module 112 , or may provide a light source regardless of the operation of the camera module 112 .

2 is an exploded perspective view of the electronic device 101 according to an embodiment.

Referring to FIG. 2 , the electronic device 101 includes a window 102 , a display 160 , a first bracket 120 , a battery 210 , a printed circuit board (PCB) 230 , and a second bracket 220 . , and a housing 110 .

In an embodiment, the window 102 may be disposed on the display 160 (eg, in the direction ①). The window 102 may further include a light blocking film 202 for covering a portion of the first bracket 120 and a non-display area of the display 160 , which can be seen through the substantially transparent window 102 .

In an embodiment, the display 160 may be disposed between the window 102 and the first bracket 120 . The display 160 may be electrically connected to the PCB 230 by a flexible printed circuit board (not shown).

In an embodiment, the first bracket 120 may be disposed between the display 160 and the PCB 230 . The first bracket 120 may support various components of the electronic device 101 or provide a space for accommodating the components of the electronic device 101 . For example, the first bracket 120 may be disposed under the display 160 (eg, in the direction of ②) to support the display 160 . As another example, the first bracket 120 may provide a seating space 121 capable of accommodating the battery 210 .

In one embodiment, at least a portion of the first bracket 120 may be formed as an antenna radiator for transmitting and receiving a wireless communication signal. At least a portion of the first bracket 120 used as the antenna radiator may include metal.

In one embodiment, at least a portion of the battery 210 may be accommodated in the seating space 121 of the first bracket 120 . The battery 210 may store power required for the electronic device 101 . Battery 210 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. The battery 210 may be integrally disposed inside the electronic device 101 , or may be disposed to be detachably attached from the electronic device 101 .

In an embodiment, the PCB 230 may be disposed between the first bracket 120 and the second bracket 220 . The PCB 230 may be supported by the first bracket 120 and/or the second bracket 220 .

The PCB 230 may be equipped with a processor, a memory, and an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, at least one of a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

In an embodiment, the PCB 230 may provide an electrical connection path between various components of the electronic device 101 . For example, the camera module 112 , the battery 210 , the display 160 , and the processor are each directly or indirectly electrically connected to the PCB 230 , and the processor is electrically provided by the PCB 230 . It may be operatively coupled to the camera module 112 , the battery 210 , and the display 160 through a connection path.

In an embodiment, the PCB 230 includes a first PCB 231 , a second PCB 232 , and a flexible printed circuit board (FPCB) 233 connecting the first PCB 231 and the second PCB 232 . ) may be included. In another embodiment, unlike shown, the PCB 230 may be integrally formed without being separated into the first PCB 231 and the second PCB 232 .

In an embodiment, the second bracket 220 may be disposed between the PCB 230 and the housing 110 . The second bracket 220 may be accommodated in a space formed by the housing 110 . The second bracket 220 may include a metal and/or a non-metal (eg, a polymer).

In one embodiment, the housing 110 may be disposed under the second bracket 220 (eg, direction ②). In an embodiment, the housing 110 may be physically coupled to the first bracket 120 and/or the second bracket 220 . For example, the housing 110 may be coupled to the first bracket 120 and/or the second bracket 220 by at least one coupling member (eg, a screw and/or an adhesive tape) not shown.

3A is a perspective view of a housing 110 according to an exemplary embodiment.

3B is a partially cut-away perspective view of the housing 110 as viewed in the +z-axis direction of FIG. 3A .

3A and 3B , the housing 110 according to an exemplary embodiment may include a bottom portion 310 and a side wall 320 .

In an embodiment, the bottom portion 310 may include a first portion that is substantially flat and a second portion that extends from the first portion. The first portion of the bottom portion 310 may include at least the center CP of the housing 110 . The second portion may extend from an edge of the first portion. For example, the second portion may extend outwardly from an edge of the first portion. In an embodiment, the second portion may extend at the same inclination as the substantially flat first portion, and the bottom portion 310 may be formed to be substantially flat. In another embodiment, the second part may extend with a different inclination or curvature than that of the first part, unlike shown. When the second part has a different inclination or curvature than the first part, the second part may extend in a height direction (eg, -z direction) of the housing 110 , and the bottom part 310 may be It may be formed to be concave when viewed in the +z-axis direction.

In an embodiment, the sidewall 320 may extend from an edge of the bottom part 310 (eg, an edge of the second part) in a height direction of the housing 110 . For example, the sidewall 320 may extend from the edge of the bottom part 310 in the -z-axis direction.

In one embodiment, the sidewall 320 may include a curved surface. For example, the sidewall 320 may extend in the -z-axis direction while being bent from the edge of the bottom part 310 . In one embodiment, the curvature of the side wall 320 and the height from the bottom 310 may be various design changes. For example, the sidewall 320 is extended in the -z axis direction, the end of the sidewall 320 may be bent to face the -z axis direction, and unlike the illustration, the end of the sidewall 320 is the bottom It may be bent so as to face the direction of the part 310 (or the inside of the housing 110 ).

In an embodiment, the sidewall 320 may extend from at least a portion of an edge of the bottom portion 310 . For example, as shown in FIG. 3B , the sidewall 320 may extend from all edges of the bottom portion 310 . For another example, as shown in FIG. 10 , the sidewall 320 may extend from two edges of the edges of the bottom part 310 (eg, the first edge 310a and the second edge 310b of FIG. 10 ). . For another example, as shown in FIG. 11 , the sidewall 320 has three edges among the edges of the bottom portion 310 (eg, the first edge 310a, the second edge 310b, and the third edge of FIG. 11 ) 310c)).

In an embodiment, the sidewall 320 may form a corner having a curved shape of the housing 110 . The number of curved corners may vary according to the shape of the sidewall 320 . For example, as shown in FIG. 3B , the housing 110 may include four curved corners formed by the sidewall 320 . For another example, as shown in FIG. 10 , the housing 110 may not include curved corners. For another example, as shown in FIG. 11 , the housing 110 may include two curved corners formed by a sidewall 320 .

In an embodiment, the housing 110 provides a space in which the components of the electronic device 101 can be accommodated by the bottom part 310 and the sidewall 320 extending bent from the edge of the bottom part 310 . can

In one embodiment, the bottom portion 310 may include an opening 312 . The location and number of openings 312 are not limited by the illustrated examples. For example, the opening 312 may be formed in a different position than shown, or may be formed in plurality. Various components may be disposed in the opening 312 . For example, the camera module 112 may be disposed in such a way that at least a portion is accommodated in the opening 312 . In the following drawings, illustration of the opening 312 is omitted for convenience of description.

FIG. 4 shows the inner surface of the housing 110 as viewed in the +z-axis direction of FIG. 3A .

Referring to FIG. 4 , the inner surface of the housing 110 may include a first surface 410 , a second surface 420 , and a third surface 430 .

In an embodiment, the first surface 410 of the housing 110 may be formed by the bottom portion 310 . In an embodiment, the first surface 410 may include a flat surface and/or a curved surface. For example, the first surface 410 may be substantially flat. As another example, the first surface 410 may include a substantially flat surface and a curved surface extending from the flat surface. As another example, the entire first surface 410 may be formed as a curved surface.

In an embodiment, the first surface 410 may have a first range of curvature. For example, when the first surface 410 includes only a plane, the curvature of the first surface 410 may be zero. As another example, when the first surface 410 includes a flat surface and a curved surface extending from the flat surface, the minimum value of the curvature of the first surface 410 may be zero. As another example, when the first surface 410 includes only a curved surface, the minimum value of the curvature of the first surface 410 may be a value exceeding zero.

In an embodiment, the second surface 420 of the housing 110 may be formed by the sidewall 320 . The second surface 420 may extend from the first surface 410 to a second range of curvature. In an embodiment, the minimum value of the second range may be greater than or equal to the maximum value of the curvature of the first range. In another embodiment, the minimum value of the second range may be greater than or equal to the minimum value of the first range and less than the maximum value of the first range. However, even in this case, the degree of bending of the second surface 420 may be greater than the degree of bending of the first surface 410 .

In an embodiment, the third surface 430 of the housing 110 may be formed by the sidewall 320 . The third surface 430 may extend from the second surface 420 . The third surface 430 may correspond to a corner of the housing 110 formed by the sidewall 320 . For example, the third surface 430 may be a surface corresponding to the corner among the inner surfaces of the sidewall 320 . The third surface 430 may be a non-deployable double curved surface. The degree to which the third surface 430 is bent may be greater than the degree to which the first surface 410 is bent. The degree of bending of the third surface 430 may be greater than the degree of bending of the second surface 420 .

5 illustrates a first film layer 510 and a second film layer 520 , according to an embodiment.

6A is a cross-sectional view of the housing 110 to which the first film layer 510 and the second film layer 520 are attached, according to an exemplary embodiment. The cross-sectional views of FIG. 6A show cross-sections A-A', B-B', and C-C' of FIG. 4, respectively.

6B is a cross-sectional view of the housing 110 to which the first film layer 510 and the second film layer 520 are attached, according to an exemplary embodiment. The cross-sectional views of FIG. 6B show cross-sections A-A', B-B', and C-C' of FIG. 4, respectively.

The electronic device 101 according to an embodiment includes a housing 110 , a first film layer 510 attached to the housing 110 , and a second film layer 520 attached to the first film layer 510 . may include

Referring to FIG. 5 , the first film layer 510 may include a plurality of layers. In an embodiment, the first film layer 510 may include a first adhesive 511 , a first base film 512 , a pattern layer 513 , a deposition layer 514 , and a printed layer 515 . have.

In an embodiment, the first adhesive 511 may be disposed on one surface of the first base film 512 . The first film layer 510 may be attached to the housing 110 through a first adhesive 511 . In an embodiment, the first adhesive 511 may be formed to be substantially transparent and may include an optically clear adhesive (OCA). In one embodiment, when the housing 110 includes a fragile material such as glass, the first adhesive 511 attached to the entire inner surface of the housing 110 is a microscopic piece that may be generated by the destruction of the housing 110 . their scattering can be prevented. In one embodiment, the first adhesive 511 may have a thickness of about 15 um to 50 um.

In an embodiment, the first base film 512 may be disposed between the first adhesive 511 and the pattern layer 513 . In an embodiment, the first base film 512 may have a higher elongation than the second base film 522 . In an embodiment, the surface hardness of the first base film 512 may be lower than that of the second base film 522 . In an embodiment, the first base film 512 may be substantially transparent. In one embodiment, the first base film 512 may include a resin, for example, polyamide (PA), polymethylmethacrylate (PMMA), polyvinyl chloride (PVC), polypropylene (PP), or polyurethane (PU). It is not limited thereto. The first base film 512 may have a thickness of about 50 um to 100 um.

In an embodiment, the pattern layer 513 may be disposed on one surface of the first base film 512 . For example, the pattern layer 513 may be disposed on a surface opposite to the surface on which the first adhesive 511 is disposed in the first base film 512 . The pattern layer 513 may include a plurality of three-dimensional patterns. In an embodiment, the plurality of three-dimensional patterns of the pattern layer 513 may vary according to a visual effect to be implemented through the pattern layer 513 . For example, in the case of implementing a three-dimensional hologram effect through the pattern layer 513, at least some of the three-dimensional patterns of the pattern layer 513 may have different heights, thicknesses, and/or intervals for light interference. have. In an embodiment, the three-dimensional patterns of the pattern layer 513 may be formed using a material that can be cured by ultraviolet rays. For example, three-dimensional patterns of the pattern layer 513 may be implemented by applying an ultraviolet curing material to a mold having a pattern and irradiating ultraviolet rays. The pattern layer 513 may have a thickness of about 10 um to 15 um.

In an embodiment, the deposition layer 514 may be disposed on the pattern layer 513 . In an embodiment, at least a portion of the deposition layer 514 may be accommodated between the plurality of three-dimensional patterns of the pattern layer 513 . In an embodiment, the deposition layer 514 may be formed using TiO ₂ , SiO ₂ , Sn, Al, In, or a combination thereof as a deposition source. The deposition layer 514 may be expressed as a background of a plurality of three-dimensional patterns included in the pattern layer 513 . The deposition layer 514 may emphasize the three-dimensional effect realized by the pattern layer 513 , and may impart a metallic texture to the housing 110 . In one embodiment, the deposition layer 514 may have a thickness of about 0.1 um to 1.0 um.

In an embodiment, the printed layer 515 may be disposed on the deposition layer 514 . The print layer 515 may include various colors. For example, the print layer 515 may have a single color or may have a gradation color that varies in color, saturation, or brightness depending on an area. The printed layer 515 may be expressed as a background of the patterned layer 513 and/or the deposited layer 514 . The printed layer 515 may be formed by various methods applicable to those skilled in the art. For example, the printing layer 515 may be formed through gravure printing or silk screen printing, but is not limited thereto. The printed layer 515 may have a thickness of about 15 um to 22 um. For smooth printing of the printed layer 515 , a primer may be applied on the deposition layer 514 before forming the printed layer 515 .

In an embodiment, a combination of the pattern layer 513 , the deposition layer 514 , and the printed layer 515 may give various colors and metal textures to the housing 110 , and may provide various colors such as a reflective pattern and a hologram pattern. Visual effects can be implemented.

In an embodiment, the second film layer 520 may include a second adhesive 521 and a second base film 522 .

In an embodiment, the second film layer 520 may be attached to the first film layer 510 via a second adhesive 521 . The second adhesive 521 may be disposed on the second base film 522 . The second adhesive 521 may include a double-sided adhesive tape, an adhesive solution, an adhesive film, or OCA. The second adhesive 521 may be substantially transparent or opaque. The second adhesive 521 may have a thickness of about 15 um to 50 um.

In an embodiment, the second base film 522 may have a higher surface hardness than the first base film 512 . In one embodiment, the first base film 512 may be substantially transparent or may be opaque. In an embodiment, the second base film 522 may include a resin material such as PET, but the second base film 522 is not limited to the resin material. For example, various materials having a surface hardness higher than that of the first base film 512 may be applied to the second base film 522 . In one embodiment, the second base film 522 may have a thickness of about 10 um to 50 um. In an embodiment, the elongation rates of the first base film 512 and the second base film 522 may vary according to their thicknesses. The thickness of each of the first base film 512 and the second base film 522 may be appropriately determined so that the elongation of the first base film 512 is higher than the elongation of the second base film 522 .

6A and 6B , the first film layer 510 according to an embodiment may be attached to the inner surface of the housing 110 . For example, the first film layer 510 may be attached to the first side 410 , the second side 420 , and the third side 430 of the housing 110 .

Since the second surface 420 of the housing 110 has a greater degree of bending than the first surface 410, in the case of the prior art, the film is uniformly attached to the second surface 420 rather than the first surface 410. it can be difficult For example, defects such as folds and wrinkles of the film may occur more on the second surface 420 than on the first surface 410 . In addition, since the third surface 430 of the housing 110 has a greater degree of bending than the second surface 420 , it may be difficult to uniformly attach the film to the third surface 430 than the second surface 420 . have. For example, defects such as folds and wrinkles of the film may occur more on the third surface 430 than on the second surface 420 .

In one embodiment, the first film layer 510 includes a first base film 512 having a higher elongation than a film (eg, PET) that can be used as a base film of the prior art, so that the The first surface 410 , the second surface 420 , and the third surface 430 may be uniformly attached without being folded or wrinkled.

In an embodiment, the second film layer 520 may be attached on the first film layer 510 . In an embodiment, the second film layer 520 may be disposed to correspond to at least the first surface 410 of the housing 110 . For example, referring to FIG. 6A , the second film layer 520 may be disposed on the first side 410 but not on the second side 420 and the third side 430 . For another example, referring to FIG. 6B , the second film layer 520 is disposed on at least a portion of the first side 410 and the second side 420 , but is not disposed on the third side 430 . can

In an embodiment, the second film layer 520 may overlap at least a portion of the first surface 410 . For example, referring to FIG. 6A , the second film layer 520 may overlap all of the first surface 410 of the housing 110 , and the second surface 420 and the third surface 430 . may not overlap. For another example, the second film layer 520 overlaps a portion of the first surface 410 , and the remaining portion of the first surface 410 except for the portion, the second surface 420 , and the third surface It may not overlap with 430 . In an embodiment, various components disposed inside the electronic device 101 may overlap the first film layer 510 attached to the entire inner surface of the housing 110 , and the first film layer 510 may be disposed on the rear surface thereof. It can be pressed or stamped by the parts in place. In an embodiment, the second film layer 520 may protect the first film layer 510 from being pressed or stamped by components of the electronic device 101 . In one embodiment, since the second film layer 520 has a relatively higher surface hardness than the first film layer 510, even if the second film layer 520 is pressed or stamped by other parts, it can be viewed There may be no traces, or the occurrence may be small. In an embodiment, when the second adhesive 521 is substantially opaque, it may not be visually recognized from the outside even if a trace of being pressed by another component occurs on the second film layer 520 . The electronic device 101 according to an embodiment may include components overlapping the first film layer 510 but not in contact with the first film layer 510 or in no danger of coming into contact with the first film layer 510 . The second film layer 520 may not be disposed on the remaining part of the first surface 410 corresponding to these components.

In an embodiment, since the first film layer 510 has a relatively high elongation, even if it is attached to the housing 110 , an adhesive position may be shifted or a portion thereof may be deformed. The second film layer 520 may be attached to the first film layer 510 to prevent the first film layer 510 from being misaligned or deformed. For example, the first film layer 510 and the second film layer 520 may include an opening having substantially the same boundary as the opening 312 formed in the housing 110 , and the second film layer 520 . is attached to the first film layer 510 , thereby preventing the opening of the first film layer 510 and/or the second film layer 520 from being out of alignment with the boundary of the opening 312 of the housing 110 . . As another example, the first film layer 510 and the second film layer 520 may include openings that do not overlap the openings 312 of the housing 110 (eg, the heart rate sensor is the first film layer). (when disposed in contact with the housing 110 through the opening of the 510 and the second film layer 520 ), the second film layer 520 is attached to the first film layer 510 , thereby the first film layer It is possible to prevent the boundary of the opening of the 510 and the second film layer 520 from being misaligned with each other.

6C illustrates a first film layer 510 , a second film layer 520 , and a housing 110 , according to an embodiment.

As for the description of the first film layer 510 , the second film layer 520 , and the housing 110 illustrated in FIG. 6C , the description provided with reference to FIGS. 1 to 6B may be equally applied.

Referring to FIG. 6C , the electronic device 101 according to an embodiment may include a moisture-proof member 630 .

In an embodiment, the moisture-proof member 630 may be disposed along an edge of the second film layer 520 on the first film layer 510 . The moisture-proof member 630 may cover an edge of the second film layer 520 . The moisture barrier 630 may be disposed at a boundary between the first film layer 510 and the second film layer 520 . The moisture-proof member 630 may be disposed to cover a contact portion of the first film layer 510 and the second film layer 520 that may be exposed to the air. In an embodiment, the moisture-proof member 630 may prevent the second film layer 520 from being peeled off from the first film layer 510 by moisture. In an embodiment, the moisture-proof member 630 may prevent the boundary of the second film layer 520 from being viewed from the outside of the electronic device 101 . In an embodiment, the moisture-proof member 630 may be formed by applying a coating solution of various organic and/or inorganic materials applicable to those of ordinary skill in the art. The moisture-proof member 630 may be formed of a coating layer instead of a coating layer.

7 illustrates a second film layer 520 including micro-holes 720 according to another embodiment.

8A is a cross-sectional view of the housing 110 to which the first film layer 510 and the second film layer 520 including the micro-holes 720 are attached, according to an exemplary embodiment. The cross-sectional views of FIG. 8A show cross-sections A-A', B-B', and C-C' of FIG. 4, respectively.

8B is a cross-sectional view of the housing 110 to which the first film layer 510 and the second film layer 520 including the micro-holes 720 are attached, according to an embodiment. The cross-sectional views of FIG. 8B show cross-sections A-A', B-B', and C-C' of FIG. 4, respectively.

The second film layer 520 shown in FIG. 7 is the second film layer 520 provided in FIGS. 1 to 6C, except that a plurality of micro holes 720 are formed in the second part 722. The descriptions may be applied in the same way or in a corresponding manner.

The housing 110 and the first film layer 510 illustrated in FIGS. 8A and 8B may correspond to the housing 110 and the first film layer 510 of FIGS. 1 to 6C , respectively.

Referring to FIG. 7 , the second film layer 520 may include a second portion 722 in which a plurality of micro-holes 720 are formed and a first portion 721 excluding the second portion 722 . .

In an embodiment, the plurality of micro holes 720 may be formed along the edge of the second film layer 520 . The plurality of micro holes 720 may pass through the second film layer 520 . In one embodiment, the plurality of micro-holes 720 may be punched using a pinnacle blade mold (or embossed mold) or processed with a laser, and an appropriate method is selected according to the size and number of the plurality of micro-holes 720 . can be In another embodiment, the plurality of micro holes 720 may be implemented as a plurality of grooves having a depth smaller than the thickness of the second film layer 520 so as not to penetrate the second film layer 520 .

8A and 8B , the first film layer 510 may be attached to the first surface 410 , the second surface 420 , and the third surface 430 of the housing 110 . The second film layer 520 including the micro holes 720 is formed to overlap all of the first surface 410 , the second surface 420 , and the third surface 430 of the housing 110 , 1 may be disposed on the film layer 510 .

In one embodiment, the first portion 721 of the second film layer 520 may overlap at least the first surface 410 of the housing 110 , and the second portion 721 of the second film layer 520 ( 722 may overlap at least the third surface 430 of the housing 110 . For example, referring to FIG. 8A , the first portion 721 of the second film layer 520 may overlap the first surface 410 of the housing 110 , and the second portion 722 may be the second The surface 420 and the third surface 430 may overlap. For another example, referring to FIG. 8B , the first portion 721 of the second film layer 520 may overlap the first surface 410 and the second surface 420 of the housing 110 , The second portion 722 may overlap the third surface 430 .

In an embodiment, the second portion 722 of the second film layer 520 in which the plurality of micro holes 720 are formed may have a relatively higher elongation than the first portion 721 . The second portion 722 of the second film layer 520 overlaps the third surface 430 (or the second surface 420 and the third surface 430 ) of the housing 110 , which has a relatively high degree of bending. It can be attached in the form Even if the second film layer 520 is attached to all of the first side 410, the second side 420, and the third side 430 of the housing 110, it is possible to prevent the occurrence of wrinkles, folds, or air bubbles. can

In an embodiment, since the second film layer 520 including the micro-holes 720 overlaps all of the first film layer 510 , the first film layer 510 and the internal components of the electronic device 101 and can be prevented from being deformed due to physical contact of

9 illustrates examples of micro-hole 720 patterns according to an embodiment.

Referring to FIG. 9 , the second film layer 520 may include a plurality of micro holes 720 formed at an edge thereof.

In an embodiment, the plurality of micro holes 720 may have a pattern arranged in a direction toward the edge of the second film layer 520 . The plurality of patterns may be disposed along an edge of the second film layer 520 .

In an embodiment, the pattern of the plurality of micro-holes 720 may be subjected to various design changes.

For example, the plurality of micro holes 720 may have a first pattern 921 having the same diameter.

As another example, the plurality of micro-holes 720 may have a second pattern 922 whose diameter decreases as it approaches the edge of the second film layer 520 .

As another example, the plurality of micro holes 720 may include a third pattern 923 whose diameter increases as it approaches the edge of the second film layer 520 .

For another example, the plurality of micro holes 720 may have a first slit pattern 931 connected to each other and extending with a constant width in a direction toward the edge of the second film layer 520 .

As another example, the plurality of micro-holes 720 may have a second slit pattern 932 that is connected to each other and extends in a direction toward the edge of the second film layer 520 .

In an embodiment, the patterns of the plurality of micro-holes 720 may be different for each area. For example, in the embodiment of FIG. 8A , the plurality of micro-holes 720 disposed on the second surface 420 may have a first pattern 921 , and a plurality of micro-holes 720 disposed on the third surface 430 may be provided. The micro holes 720 may have a third pattern 923 . For another example, in the embodiment of FIG. 8B , the plurality of micro-holes 720 disposed in any one corner of the housing 110 among the third surfaces 430 may have a first pattern 921, A plurality of micro-holes 720 disposed at any one corner may have a second pattern 922 .

10 is a partially cut-away perspective view of the housing 110 according to another embodiment.

Although the housing 110 illustrated in FIG. 10 is partially cut out, it may have a symmetrical shape with respect to the y-axis. The housing 110 , the first film layer 510 , and the second film layer 520 of FIG. 10 are the housing 110 , the first film layer 510 , and the second film layer 520 provided through FIGS. 1 to 9 . Each of the descriptions of the film layer 520 may be applied in the same or corresponding manner.

Referring to FIG. 10 , the electronic device 101 according to an embodiment may include a housing 110 , a first film layer 510 , and a second film layer 520 .

In one embodiment, the bottom 310 of the housing 110 has a first edge 310a , a second edge 310b parallel to the first edge 310a , and substantially perpendicular to the first edge 310a . a third edge 310c extending from one end of the first edge 310a to one end of the second edge 310b in the direction, and the first edge 310a in a direction substantially perpendicular to the first edge 310a. A fourth edge 310d extending from the other end to the other end of the second edge 310b may be included.

In an embodiment, the sidewall 320 of the housing 110 may extend from the first edge 310a and the second edge 310b of the bottom part 310 .

In one embodiment, the sidewall 320 does not extend from the third edge 310c and the fourth edge 310d, unlike the housing 110 illustrated in FIG. 3B , and thus the second surface 420 of the housing 110 . ) may not include the third surface 430 surrounded by .

In an embodiment, the first film layer 510 and the second film layer 520 may correspond to the first film layer 510 and the second film layer 520 illustrated in FIGS. 1 to 9 , respectively. For example, the first film layer 510 may be disposed on the first surface 410 and the second surface 420 that are the inner surfaces of the housing 110 . For example, the second film layer 520 may be disposed on the first film layer 510 to overlap at least a portion of the first surface 410 . In another example, the second film layer 520 is disposed to overlap the entire first film layer 510 , but the portion of the second film layer 520 overlapping the second surface 420 is shown in FIG. 7 . The second part 722 may be formed. As another example, the moisture-proof member 630 shown in FIG. 6C may be applied to the edge of the second film layer 520 .

11 is a partially cut-away perspective view of the housing 110 according to another embodiment.

Although the housing 110 illustrated in FIG. 11 is partially cut out, it may have a symmetrical shape with respect to the y-axis. The housing 110 , the first film layer 510 , and the second film layer 520 of FIG. 11 are the housing 110 , the first film layer 510 , and the second film layer 520 provided through FIGS. 1 to 9 . The description of the film layer 520 may be applied in the same or corresponding manner, respectively.

Referring to FIG. 11 , the electronic device 101 according to an embodiment may include a housing 110 , a first film layer 510 , and a second film layer 520 .

In one embodiment, the bottom 310 of the housing 110 has a first edge 310a , a second edge 310b parallel to the first edge 310a , and substantially perpendicular to the first edge 310a . a third edge 310c extending from one end of the first edge 310a to one end of the second edge 310b in the direction, and the first edge 310a in a direction substantially perpendicular to the first edge 310a. A fourth edge 310d extending from the other end to the other end of the second edge 310b may be included.

In an embodiment, the sidewall 320 of the housing 110 may extend from the first edge 310a, the second edge 310b, and the third edge 310c of the bottom part 310 .

In an embodiment, since the sidewall 320 does not extend from the fourth edge 310d, unlike the housing 110 illustrated in FIG. 3B , the curved housing 110 may have two corners. The housing 110 may include a third surface 430 corresponding to the two corners.

In an embodiment, the first film layer 510 and the second film layer 520 may correspond to the first film layer 510 and the second film layer 520 illustrated in FIGS. 1 to 9 , respectively. For example, the first film layer 510 may be disposed on the first surface 410 , the second surface 420 , and the third surface 430 that are the inner surfaces of the housing 110 . As another example, the second film layer 520 may be disposed on the first film layer 510 to overlap at least a portion of the first surface 410 . For another example, the second film layer 520 is disposed to overlap the entire first film layer 510 , and the second film layer 520 overlaps at least the third surface 430 of the inner surface of the housing 110 . ) may be formed as the second part 722 shown in FIG. 7 . As another example, the moisture-proof member 630 shown in FIG. 6C may be applied to the edge of the second film layer 520 .

In another embodiment, the housing 110 to which the first film layer 510 and the second film layer 520 of FIGS. 3A to 11 are attached may be equally applied to an accessory case other than the housing of the electronic device 101 . can For example, the accessory case may have a shape similar to that of the housing 110 , and may include curved surfaces corresponding to the second surface 420 and the third surface 430 of the housing 110 . The accessory case may be detachably coupled to the electronic device 101 . The first film layer 510 and the second film layer 520 may be disposed on an inner surface of the substantially transparent accessory case (eg, a surface that comes into contact with the electronic device 101 during bonding).

In the electronic device (eg, the electronic device 101 of FIG. 1 ) according to an embodiment, a window (eg, the front surface 101A of FIG. 1 ) forming at least a part of the electronic device (eg, the front surface 101A of FIG. 1 ) is provided. window 102), at least a portion of a side surface (eg, side 101C in FIG. 1) and a rear surface (eg, rear surface 101B in FIG. 1) of the electronic device, the housing disposed under the window ( For example: 110 in FIG. 3B), the housing has a bottom (eg, bottom 310 in FIG. 3B) forming the rear surface and a side wall extending to be bent toward the window from at least a portion of an edge of the bottom ( Example: the side wall 320 of FIG. 3B ), and the inner surface of the housing has a first surface (eg, the first surface 410 of FIG. 4 ) formed by the bottom part and a second surface formed by the side wall comprising two sides (eg, the second side 420 of FIG. 4 ), a first film layer disposed on all of the inner surface of the housing (eg, the first film layer 510 of FIG. 5 ), and the inner surface a second film layer (eg, the second film layer 520 of FIG. 5 ) disposed on the first film layer to overlap at least a portion of the first surface, wherein the first film layer has a first elongation , and the second film layer may have a second elongation lower than the first elongation.

In one embodiment, the sidewall extends from all edges of the bottom portion, and the inner surface of the housing corresponds to a corner of the housing formed by the sidewall, and a third surface (eg, a third surface extending from the second surface) : The third surface 430 of FIG. 4) may be included.

In an embodiment, the second film layer may be disposed on the first film layer to overlap all of the first surface.

In an embodiment, a coating layer (eg, the moisture-proof member 630 of FIG. 6C ) applied to a boundary between the first film layer and the second film layer may be included to cover the edge of the second film layer. .

In an embodiment, the second film layer may be disposed on the first film layer to overlap at least a portion of the first surface and the second surface.

The electronic device according to an embodiment further includes a sensor module (eg, the sensor module 1276 of FIG. 12 ), and the housing has a first opening (eg, the opening 312 of FIG. 3A ) formed in the bottom part. including, wherein the first film layer includes a second opening corresponding to the first opening, the second film layer includes a third opening corresponding to the second opening, and the sensor module includes the second opening corresponding to the second opening. At least a portion may be accommodated in the first opening, the second opening, and the third opening.

In an embodiment, the second film layer is disposed on the first film layer to overlap the first surface, the second surface, and the third surface, and overlaps the second surface and the third surface A portion of the second film layer (eg, the second portion 722 of FIG. 8B ) may include a plurality of micro-holes (eg, the micro-holes 720 of FIG. 7 ).

In an embodiment, the second film layer is disposed on the first film layer to overlap the first side, the second side, and the third side, and the second film overlaps the third side A portion of the layer (eg, the second portion 722 of FIG. 8A ) may include a plurality of micro-holes (eg, the micro-holes 720 of FIG. 7 ).

In one embodiment, the plurality of micro holes, A first pattern (eg, the first pattern 921 in FIG. 9 ) in which each of the plurality of micro-holes has substantially the same diameter; a second pattern in which the diameters of the plurality of micro-holes are decreased toward the outside of the second film layer (eg, the second pattern 922 of FIG. 9 ); A third pattern (eg, the third pattern 923 of FIG. 9 ) in which the diameters of the plurality of micro-holes increase toward the outside of the second film layer, extending toward the outside of the second film layer in the form of a slit , wherein the slit extends in the form of a slit toward the outside of a first slit pattern (eg, the first slit pattern 931 of FIG. 9 ) having substantially the same width, or the second film layer, wherein the slit is It may have a second slit pattern (eg, the second slit pattern of FIG. 9 ) that increases in width toward the outside of the second film layer.

In an embodiment, the bottom portion includes a first edge, a second edge substantially parallel to the first edge, and from one end of the first edge to one end of the second edge in a direction substantially perpendicular to the first edge. a third edge extending from the other end of the first edge in a direction substantially perpendicular to the first edge and a fourth edge extending from the other end of the second edge to the other end of the second edge; a second edge, and a third surface extending from the third edge and the inner surface of the housing corresponds to a corner of the housing formed by the sidewall and extends from the second surface (eg, the third surface of FIG. 11 ) It may include three sides (430).

In an embodiment, the second film layer may be disposed on the first film layer to overlap all of the first surface.

In an embodiment, the second film layer may be disposed on the first film layer to overlap the first surface and the second surface.

In an embodiment, the second film layer is disposed on the first film layer to overlap the first side, the second side, and the third side, and the second film overlaps the third side A portion of the layer may include a plurality of micro holes.

In an embodiment, the bottom portion includes a first edge, a second edge substantially parallel to the first edge, and from one end of the first edge to one end of the second edge in a direction substantially perpendicular to the first edge. a third edge extending from the other end of the first edge to the other end of the second edge in a direction substantially perpendicular to the first edge, wherein the sidewall includes the first edge; and It may extend from the second edge.

In an embodiment, the surface hardness of the second film layer may be higher than that of the first film layer.

In an embodiment, the first film layer is a first base film (eg, the first base film 512 in FIG. 5 ), a first adhesive layer ( Example: the first adhesive layer 511 of FIG. 5 ), a UV molding pattern layer (eg, the pattern layer 513 of FIG. 5 ) disposed on the other surface of the first base film (eg, the pattern layer 513 of FIG. 5 ), the UV molding It may include a deposition layer (eg, the deposition layer 514 of FIG. 5 ) disposed on the pattern layer, and a printed layer (eg, the printing layer 515 of FIG. 5 ) disposed on the deposition layer.

In an embodiment, the second film layer is disposed on one surface of the second base film (eg, the second base film 522 of FIG. 5 ), and the second base film, and adheres to the first film layer A second adhesive layer (eg, the second adhesive layer 521 of FIG. 5 ) may be included.

In an embodiment, the first film layer includes polyamide (PA), polymethylmethacrylate (PMMA), polyvinyl chloride (PVC), polypropylene (PP), or polyurethane (PU), and the second film layer is PET. (polyethylene terephthalate) may be included.

In an embodiment, the first surface may include a flat surface.

In an embodiment, the first surface is a curved surface, the first surface has a first range of curvature, the second surface has a second range of curvature, and the minimum value of the second range is the first It can be greater than or equal to the maximum value of the range.

12 is a block diagram of an electronic device 1201 in a network environment 1200 according to various embodiments of the present disclosure.

Referring to FIG. 12 , in a network environment 1200 , the electronic device 1201 (eg, the electronic device 101 of FIG. 1 ) communicates with the electronic device 1202 through a first network 1298 (eg, a short-range wireless communication network). or the electronic device 1204 or the server 1208 through the second network 1299 (eg, a remote wireless communication network). According to an embodiment, the electronic device 1201 may be a server It can communicate with the electronic device 1204 through 1208. According to an embodiment, the electronic device 1201 includes a processor 1220, a memory 1230, an input device 1250, and a sound output device 1255. , display device 1260 , audio module 1270 , sensor module 1276 , interface 1277 , haptic module 1279 , camera module 1280 , power management module 1288 , battery 1289 , communication module 1290, subscriber identification module 1296, or antenna module 1297. In some embodiments, electronic device 1201 includes at least one of these components (eg, display device 1260). Alternatively, the camera module 1280) may be omitted, or one or more other components may be added. In some embodiments, some of these components may be implemented as one integrated circuit. For example, a sensor The module 1276 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 1260 (eg, a display).

The processor 1220, for example, executes software (eg, a program 1240) to execute at least one other component (eg, a hardware or software component) of the electronic device 1201 connected to the processor 1220. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or computation, the processor 1220 may store commands or data received from other components (eg, the sensor module 1276 or the communication module 1290) into the volatile memory 1232 . may be loaded into , process commands or data stored in volatile memory 1232 , and store the resulting data in non-volatile memory 1234 . According to an embodiment, the processor 1220 includes a main processor 1221 (eg, a central processing unit or an application processor), and a co-processor 1223 (eg, a graphics processing unit, an image signal processor) that can be operated independently or in conjunction with the main processor 1221 (eg, a graphics processing unit or an image signal processor). , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 1223 may be configured to use less power than the main processor 1221 or to be specialized for a designated function. The coprocessor 1223 may be implemented separately from or as part of the main processor 1221 .

The coprocessor 1223 may be, for example, on behalf of the main processor 1221 while the main processor 1221 is in an inactive (eg, sleep) state, or when the main processor 1221 is active (eg, executing an application). ), together with the main processor 1221, at least one of the components of the electronic device 1201 (eg, the display device 1260, the sensor module 1276, or the communication module 1290) It is possible to control at least some of the related functions or states. According to one embodiment, coprocessor 1223 (eg, image signal processor or communication processor) may be implemented as part of another functionally related component (eg, camera module 1280 or communication module 1290). have.

The memory 1230 may store various data used by at least one component (eg, the processor 1220 or the sensor module 1276) of the electronic device 1201 . The data may include, for example, input data or output data for software (eg, the program 1240 ) and instructions related thereto. The memory 1230 may include a volatile memory 1232 or a non-volatile memory 1234 .

The program 1240 may be stored as software in the memory 1230 , and may include, for example, an operating system 1242 , middleware 1244 , or an application 1246 .

The input device 1250 may receive a command or data to be used in a component (eg, the processor 1220 ) of the electronic device 1201 from the outside (eg, a user) of the electronic device 1201 . The input device 1250 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 1255 may output a sound signal to the outside of the electronic device 1201 . The sound output device 1255 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display device 1260 may visually provide information to the outside (eg, a user) of the electronic device 1201 . The display device 1260 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display device 1260 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. have.

The audio module 1270 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 1270 acquires a sound through the input device 1250 or an external electronic device (eg, a sound output device 1255 ) directly or wirelessly connected to the electronic device 1201 . The sound may be output through the electronic device 1202) (eg, a speaker or a headphone).

The sensor module 1276 detects an operating state (eg, power or temperature) of the electronic device 1201 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 1276 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 1277 may support one or more specified protocols that may be used for the electronic device 1201 to directly or wirelessly connect with an external electronic device (eg, the electronic device 1202 ). According to an embodiment, the interface 1277 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 1278 may include a connector through which the electronic device 1201 can be physically connected to an external electronic device (eg, the electronic device 1202 ). According to an embodiment, the connection terminal 1278 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 1279 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 1279 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 1280 may capture still images and moving images. According to one embodiment, the camera module 1280 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 1288 may manage power supplied to the electronic device 1201 . According to an embodiment, the power management module 1288 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 1289 may supply power to at least one component of the electronic device 1201 . According to one embodiment, battery 1289 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 1290 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 1201 and an external electronic device (eg, the electronic device 1202, the electronic device 1204, or the server 1208). It can support establishment and communication through the established communication channel. The communication module 1290 may include one or more communication processors that operate independently of the processor 1220 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 1290 may include a wireless communication module 1292 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1294 (eg, : LAN (local area network) communication module, or a power line communication module) may be included. A corresponding communication module among these communication modules is a first network 1298 (eg, a short-range communication network such as Bluetooth, Wi-Fi direct, or infrared data association (IrDA)) or a second network 1299 (eg, a cellular network, the Internet). , or through a computer network (eg, a telecommunication network such as a LAN or WAN) to communicate with an external electronic device. These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 1292 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1296 within a communication network, such as the first network 1298 or the second network 1299 . The electronic device 1201 may be identified and authenticated.

The antenna module 1297 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 1297 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 1298 or the second network 1299 is connected from the plurality of antennas by, for example, the communication module 1290 . can be selected. A signal or power may be transmitted or received between the communication module 1290 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 1297 .

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 1201 and the external electronic device 1204 through the server 1208 connected to the second network 1299 . Each of the electronic devices 1202 and 1204 may be the same or a different type of device as the electronic device 1201 . According to an embodiment, all or part of the operations executed by the electronic device 1201 may be executed by one or more of the external electronic devices 1202 , 1204 , or 1208 . For example, when the electronic device 1201 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 1201 may perform the function or service by itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. The one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1201 . The electronic device 1201 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 1236 or external memory 1238) readable by a machine (eg, electronic device 1201). may be implemented as software (eg, the program 1240) including For example, a processor (eg, processor 1220 ) of a device (eg, electronic device 1201 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the at least one command called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product). Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store™) or on two user devices (eg, It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

Effects obtainable in the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned may be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. will be.

Methods according to the embodiments described in the claims or specifications of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

When implemented in software, a computer-readable storage medium storing one or more programs (software modules) may be provided. One or more programs stored in the computer-readable storage medium are configured to be executable by one or more processors in an electronic device (device). One or more programs include instructions for causing an electronic device to execute methods according to embodiments described in a claim or specification of the present disclosure.

Such programs (software modules, software) include random access memory, non-volatile memory including flash memory, read only memory (ROM), electrically erasable programmable ROM (electrically erasable programmable read only memory, EEPROM), magnetic disc storage device, compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other It may be stored in an optical storage device or a magnetic cassette. Alternatively, it may be stored in a memory composed of a combination of some or all thereof. In addition, each configuration memory may be included in plurality.

In addition, the program is transmitted through a communication network consisting of a communication network such as the Internet, an intranet, a local area network (LAN), a wide area network (WAN), or a storage area network (SAN), or a combination thereof. It may be stored on an attachable storage device that can be accessed. Such a storage device may be connected to a device implementing an embodiment of the present disclosure through an external port. In addition, a separate storage device on the communication network may be connected to the device implementing the embodiment of the present disclosure.

In the specific embodiments of the present disclosure described above, components included in the disclosure are expressed in the singular or plural according to the specific embodiments presented. However, the singular or plural expression is appropriately selected for the context presented for convenience of description, and the present disclosure is not limited to the singular or plural element, and even if the element is expressed in plural, it is composed of the singular or singular. Even an expressed component may be composed of a plurality of components.

Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, various modifications are possible without departing from the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments and should be defined by the claims described below as well as the claims and equivalents.

Claims (20)

In an electronic device,
a window forming at least a portion of a front surface of the electronic device;
A housing forming at least a portion of a side surface and a rear surface of the electronic device, the housing being disposed under the window, the housing extending from at least a portion of a bottom portion forming the rear surface and an edge of the bottom portion to be bent toward the window wherein the inner surface of the housing includes a first surface formed by the bottom portion and a second surface formed by the sidewall;
a first film layer disposed on the entire inner surface of the housing; and
a second film layer disposed over the first film layer to overlap at least a portion of the first surface of the inner surface;
the first film layer has a first elongation,
and the second film layer has a second elongation lower than the first elongation. The method according to claim 1,
the sidewalls extend from all edges of the bottom portion;
The inner surface of the housing includes a third surface corresponding to a corner of the housing formed by the sidewall and extending from the second surface. 3. The method according to claim 2,
and the second film layer is disposed on the first film layer to overlap all of the first side. 4. The method according to claim 3,
and a coating layer applied to a boundary between the first film layer and the second film layer so as to cover an edge of the second film layer. 3. The method according to claim 2,
and the second film layer is disposed on the first film layer to overlap at least a portion of the first side and the second side. 3. The method according to claim 2,
Further comprising a sensor module,
The housing includes a first opening formed in the bottom portion,
the first film layer includes a second opening corresponding to the first opening,
the second film layer includes a third opening corresponding to the second opening;
At least a portion of the sensor module is accommodated in the first opening, the second opening, and the third opening. 3. The method according to claim 2,
the second film layer is disposed on the first film layer to overlap the first side, the second side, and the third side;
and a portion of the second film layer overlapping the second surface and the third surface includes a plurality of micro holes. 3. The method according to claim 2,
the second film layer is disposed on the first film layer to overlap the first side, the second side, and the third side;
and a portion of the second film layer overlapping the third surface includes a plurality of micro holes. 9. The method according to claim 7 or 8,
The plurality of micro-holes are:
a first pattern in which each of the plurality of micro-holes has substantially the same diameter;
a second pattern in which diameters of the plurality of micro-holes are reduced toward the outside of the second film layer;
a third pattern in which diameters of the plurality of micro-holes increase toward the outside of the second film layer;
a first slit pattern extending in the form of a slit toward the outside of the second film layer, the slit having substantially the same width; or
The electronic device of claim 1, wherein the slit has a second slit pattern extending outward from the second film layer in the form of a slit, the slit having a width increasing toward the outside of the second film layer. The method according to claim 1,
The bottom portion includes a first edge, a second edge substantially parallel to the first edge, and a third edge extending from one end of the first edge to one end of the second edge in a direction substantially perpendicular to the first edge. and a fourth edge extending from the other end of the first edge to the other end of the second edge in a direction substantially perpendicular to the first edge,
the sidewall extends from the first edge, the second edge, and the third edge;
and the inner surface of the housing includes a third surface corresponding to a corner of the housing formed by the sidewall and extending from the second surface. 11. The method of claim 10,
and the second film layer is disposed on the first film layer to overlap all of the first side. 11. The method of claim 10,
and the second film layer is disposed on the first film layer to overlap the first side and the second side. 11. The method of claim 10,
the second film layer is disposed on the first film layer to overlap the first side, the second side, and the third side;
and a portion of the second film layer overlapping the third surface includes a plurality of micro holes. The method according to claim 1,
The bottom portion includes a first edge, a second edge substantially parallel to the first edge, and a third edge extending from one end of the first edge to one end of the second edge in a direction substantially perpendicular to the first edge. and a fourth edge extending from the other end of the first edge to the other end of the second edge in a direction substantially perpendicular to the first edge,
and the sidewall extends from the first edge and the second edge. The method according to claim 1,
and a surface hardness of the second film layer is higher than that of the first film layer. The method according to claim 1,
The first film layer,
a first base film;
a first adhesive layer disposed on one surface of the first base film and adhered to the housing;
a UV molding pattern layer disposed on the other surface of the first base film;
a deposition layer disposed on the UV molding pattern layer; and
and a printed layer disposed on the deposition layer. The method according to claim 1,
The second film layer comprises:
a second base film; and
and a second adhesive layer disposed on one surface of the second base film and adhered to the first film layer. The method according to claim 1,
The first film layer includes PA (polyamide), PMMA (polymethylmethacrylate), PVC (polyvinyl chloride), PP (polypropylene), or PU (polyurethane),
The second film layer includes polyethylene terephthalate (PET). The method according to claim 1,
and the first side comprises a plane. The method according to claim 1,
The first surface is a curved surface,
the first face has a first range of curvature,
the second face has a second range of curvature,
and the minimum value of the second range is equal to or greater than the maximum value of the first range.

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