KR20210100862A - Electronic device including semitransparent layer - Google Patents

Abstract

An electronic device according to various embodiments of the present disclosure includes a semitransparent layer including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, wherein a plurality of recesses are formed in at least a portion of the first surface; and a color layer including a third surface in contact with the second surface and displayed to the outside of the electronic device through the semitransparent layer. An object of the present invention is to allow the recessed semitransparent layer to display at least one of a pattern or a character to the outside.

Description

ELECTRONIC DEVICE INCLUDING SEMITRANSPARENT LAYER

Various embodiments of the present disclosure relate to electronic devices including translucent layers.

As the degree of integration of electronic devices increases and high-speed and large-capacity wireless communication becomes common, various functions may be mounted in one electronic device, such as a mobile communication terminal, in recent years. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, etc., and functions such as schedule management and electronic wallets are integrated into one electronic device. have.

Recently, as miniaturization, thinness, and portability of portable electronic devices such as smart phones are emphasized, research on forming an aesthetically pleasing appearance of an electronic device is continuously being conducted.

In order to improve aesthetics as an exterior material for electronic devices, a design demand for a ceramic texture that implements a soft feel is increasing. The housing forming the exterior of the electronic device may include various colors or patterns to improve aesthetics. When a ceramic is used as the housing, the color or pattern of the housing may be changed by changing the composition of the powder constituting the ceramic. However, when the powder composition of the ceramic is changed according to the product design, there may be problems in that productivity is lowered due to an increase in the manufacturing process and manufacturing cost is increased. In addition, an expression range of a color or pattern implemented by changing the powder composition of the ceramic may be limited.

The translucent layer in which the recess is formed according to various embodiments of the present disclosure may display at least one of a pattern or a character to the outside.

The color layer according to various embodiments of the present disclosure may be externally displayed through the translucent layer.

However, the problems to be solved in the present disclosure are not limited to the above-mentioned problems, and may be variously expanded without departing from the spirit and scope of the present disclosure.

Electronic apparatus, according to various embodiments of the present disclosure, the first direction toward the first surface and a second surface facing a second direction which is opposite the first direction, at least a portion of the first surface, the A translucent layer in which a plurality of recesses are formed and a third surface in contact with the second surface, and a color layer displayed to the outside of the electronic device through the translucent layer.

An electronic device according to various embodiments of the present disclosure includes a first surface that faces in a first direction, a plurality of recesses are formed in at least a partial region, and is laminated with a translucent first ceramic member and the first ceramic member a second ceramic disposed and including a first area exposed to the outside of the electronic device through the first ceramic member and a second area exposed to the outside of the electronic device through at least some of the plurality of recesses member may be included.

The method of manufacturing an electronic device according to various embodiments of the present disclosure includes a process of combining the second ceramic blank formed by pressing a color ceramic powder under the first ceramic blank formed by pressing a translucent ceramic powder, the first The method may include sintering the first ceramic blank and the second ceramic blank to form the first ceramic member and the second ceramic member, and forming a recess in the first ceramic member.

The electronic device according to various embodiments of the present disclosure may display a detailed color or pattern by using a translucent ceramic member having a plurality of recesses formed thereon.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;
2 is a front perspective view of an electronic device, according to various embodiments of the present disclosure;
3 is a rear perspective view of an electronic device, according to various embodiments of the present disclosure;
4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure;
5 is a rear view of an electronic device according to various embodiments of the present disclosure;
6 is a cross-sectional view taken along line AA′ of FIG. 5 .
FIG. 7 is another cross-sectional view taken along line AA′ of FIG. 5 .
FIG. 8 is another cross-sectional view taken along line AA′ of FIG. 5 .
9A is a rear view of an electronic device according to various embodiments of the present disclosure;
9B is a cross-sectional view taken along the BB′ plane of FIG. 9A .
10A is a rear view of an electronic device according to various embodiments of the present disclosure;
10B is a cross-sectional view taken along the line CC′ of FIG. 10A.
11 is a rear view of an electronic device including a camera module according to various embodiments of the present disclosure;
12 is a cross-sectional view taken along the DD′ plane of FIG. 11 .
13 is another rear view of an electronic device according to various embodiments of the present disclosure;
FIG. 14 is a cross-sectional view taken along plane EE′ of FIG. 13 .
15 is a flowchart illustrating a method of manufacturing an electronic device according to various embodiments of the present disclosure;
16 is a photograph of an electronic device according to various embodiments of the present disclosure.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments.

Referring to FIG. 1 , in a network environment 100 , the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output unit 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 . According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphics processing unit, an image signal processor) that can be operated independently or in conjunction with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). there is.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output unit 155 may output a sound signal to the outside of the electronic device 101 . The sound output unit 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. there is.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output unit 155 ) connected directly or wirelessly with the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 388 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). Among these communication modules, a corresponding communication module may be a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or infrared data association (IrDA)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified and authenticated.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 197 .

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the electronic devices 102 and 104 may be the same or a different type of the electronic device 101 . According to an embodiment, all or part of the operations executed in the electronic device 101 may be executed in one or more of the external electronic devices 102 and 104 or the server 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. The one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A , B, or C" each may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

2 is a front perspective view of an electronic device 101 according to various embodiments of the present disclosure. 3 is a rear perspective view of the electronic device 101 according to various embodiments of the present disclosure.

2 and 3 , an electronic device 101 according to an exemplary embodiment includes a front surface 310A, a rear surface 310B, and a side (eg, a side surface) surrounding a space between the front surface 310A and the rear surface 310B. : It may include a housing 310 (eg, the housing 310 of FIGS. 2 to 3 ) including the side surface 310C of FIGS. 2 to 3 ). In another embodiment (not shown), the housing 310 includes a first surface (eg, a front surface 310A of FIG. 2 ), a second surface (eg, a rear surface 310B of FIG. 3 ) of FIG. 2 ) and It may also refer to a structure that forms part of the side surfaces 310C. According to one embodiment, the front surface 310A is at least a portion of a substantially transparent front plate 302 (eg, glass including various coating layers). plate, or a polymer plate.) The rear surface 310B may be formed by a rear plate 311. The rear plate 311 may be formed of, for example, coated or colored glass, ceramic, It may be formed of a polymer, a metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing. The side 310C includes a front plate 302 and a rear plate ( 311, and may be formed by a side bezel structure (or "side member") 318 comprising a metal and/or a polymer, in some embodiments, a back plate 311 and a side bezel structure 318 ) may be integrally formed and include the same material (eg, ceramic).

In the illustrated embodiment, the front plate 302 includes two first edge regions 310D extending seamlessly from the front surface 310A toward the rear plate 311, the front plate ( 302) may be included at both ends of the long edge. In the illustrated embodiment (refer to FIG. 3 ), the rear plate 311 includes two second edge regions 310E extending seamlessly from the rear surface 310B toward the front plate 302 at both ends of the long edge. can be included in In some embodiments, the front plate 302 (or the back plate 311 ) may include only one of the first edge regions 310D (or the second edge regions 310E). In another embodiment, some of the first edge areas 310D or the second edge areas 310E may not be included. In the above embodiments, when viewed from the side of the electronic device 101 , the side bezel structure 318 does not include the first edge regions 310D or the second edge regions 310E as described above. The side may have a first thickness (or width), and the side including the first edge regions 310D or the second edge regions 310E may have a second thickness that is thinner than the first thickness.

According to an embodiment, the electronic device 101 includes a display 301 , audio modules 303 , 307 , 314 , camera modules 305 and 312 , a key input device 317 , and connector holes 308 and 309 . It may include at least one or more of In some embodiments, the electronic device 101 may omit at least one of the components (eg, the key input device 317 ) or additionally include other components.

The display 301 may be exposed through a substantial portion of the front plate 302 , for example. In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the first edge regions 310D of the front surface 310A and the side surface 310C. In some embodiments, the edge of the display 301 may be formed to be substantially the same as an adjacent outer shape of the front plate 302 . In another embodiment (not shown), in order to expand the area to which the display 301 is exposed, the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.

In another embodiment, a sensor module (not shown) that forms a recess or an opening in a part of the screen display area of the display 301 and is aligned with the recess or the opening, and a camera module ( 305) may include at least one or more of. In another embodiment (not shown), at least one of an audio module 314 , a sensor module (not shown), a camera module 305 , and a light emitting device (not shown) on the rear surface of the screen display area of the display 301 . may include more than one. In another embodiment (not shown), the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed. In some embodiments, at least a portion of the key input device 317 may be disposed in the first edge regions 310D and/or the second edge regions 310E.

The audio modules 303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 . In the microphone hole 303, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a call receiver hole 314 . In some embodiments, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as a single hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker).

The sensor module (not shown) may generate, for example, an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. The sensor module (not shown) includes, for example, a first sensor module (not shown) (eg, proximity sensor) and/or a second sensor module (not shown) disposed on the front surface 310A of the housing 310 ( for example: a fingerprint sensor), and/or a third sensor module (eg, HRM sensor) and/or a fourth sensor module (eg, fingerprint sensor) disposed on the rear surface 310B of the housing 310 . . The fingerprint sensor may be disposed on the first surface 310A (eg, the display 301) as well as the second surface 310B of the housing 310. The electronic device 101 may include a sensor module, not shown, for example. For example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown). may include more.

The camera modules 305 and 312 include, for example, a first camera module 305 disposed on the front side 310A of the electronic device 101, and a second camera module 312 disposed on the rear side 310B of the electronic device 101, and/or flash 313 . The camera module 305, 312 may include one or more lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 101 .

The connector holes 308 and 309 are, for example, a first connector hole 308 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or Alternatively, it may include a second connector hole (eg, earphone jack) 309 capable of accommodating a connector for transmitting and receiving audio signals to and from an external electronic device.

4 is an exploded perspective view of an electronic device 101 according to various embodiments of the present disclosure.

Referring to FIG. 4 , the electronic device 101 (eg, the electronic device 101 of FIGS. 2 to 3 ) includes a side bezel structure 331 (eg, the side bezel structure 318 of FIG. 2 ), a first Support member 332 (eg, bracket), front plate 320 (eg, front plate 302 in FIG. 2 ), display 330 (eg, display 301 in FIG. 2 ), printed circuit board 340 ), a battery 350 , a second support member 360 (eg, a rear case), an antenna 370 , and a rear plate 380 (eg, the rear plate 311 of FIG. 3 ). In some embodiments, the electronic device 101 may omit at least one of the components (eg, the first support member 332 or the second support member 360 ) or additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and overlapping descriptions will be omitted below.

The first support member 332 may be disposed inside the electronic device 101 and connected to the side bezel structure 331 , or may be integrally formed with the side bezel structure 331 . The first support member 332 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The first support member 332 may have a display 330 coupled to one surface and a printed circuit board 340 coupled to the other surface.

The printed circuit board 340 may be equipped with, for example, a processor, memory, and/or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

The battery 350 is a device for supplying power to at least one component of the electronic device 101 and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. . At least a portion of the battery 350 may be disposed substantially on the same plane as the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 101 or may be detachably disposed with the electronic device 101 .

The second support member 360 (eg, a rear case) may be disposed between the printed circuit board 340 and the antenna 370 . According to an embodiment, the second support member 360 may include one surface to which at least one of the printed circuit board 340 and the battery 350 is coupled and the other surface to which the antenna 370 is coupled.

The antenna 370 may be disposed between the rear plate 380 and the battery 350 . The antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 370 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 331 and/or the first support member 332 or a combination thereof. The rear plate 380 may form at least a portion of the rear surface of the electronic device 101 (eg, the rear surface 310B of FIG. 3 ).

5 is a rear view of an electronic device according to various embodiments of the present disclosure; 6 is a cross-sectional view taken along line A-A′ of FIG. 5 . FIG. 7 is another cross-sectional view taken along line A-A′ of FIG. 5 .

5 to 7 , the electronic device 101 may include a translucent layer 410 and a color layer 420 . The configuration of the translucent layer 410 of FIGS. 5 to 7 may be all or partly the same as that of the rear plate 311 of FIGS. 2 and 3 .

According to various embodiments, the translucent layer 410 may form at least a portion of the exterior of the electronic device 101 . For example, the translucent layer 410 refers to a structure that forms the rear surface (eg, the rear surface 310B of FIG. 3 ) of the electronic device 101 among the housings (eg, the housing 310 of FIGS. 2 to 3 ). can do. As another example, the translucent layer 410 may mean a structure that forms at least a portion of the rear surface 310B and the side surface (eg, the side surface 310C in FIG. 2 ) of the electronic device 101 of the housing 310 . can

According to various embodiments, the translucent layer 410 may include zirconium oxide (zirconia (ZrO ₂ )). For example, the translucent layer 410 may be a first ceramic member including the _{zirconium oxide (ZrO 2 ).} According to an embodiment, the translucent layer 410 may include yttria-stabilized zirconia (YSZ) formed by a combination of _{zirconium oxide (ZrO 2} ) and yttria (Y ₂ O _{3 ).} The particle size of the yttria-stabilized zirconia may be formed in a range of 60 μm to 75 μm. The translucent layer 410 including zirconia (ZrO ₂ ) may have high chemical resistance, high wear resistance, and high stress.

According to various embodiments, the translucent layer 410 may have a first surface 410a facing a first direction (+Z direction) and a second surface facing a second direction (−Z direction) opposite to the first direction. (410b) may be included. The first surface 410a is the upper surface of the translucent layer 410, which is exposed to the outside of the electronic device 101, and the second surface 410b is the lower surface of the translucent layer 410, the color It may be the side facing the layer 420 .

According to various embodiments, in order to form the translucent layer 410 with a preset light transmittance (eg, 40% to 60%), the surface roughness of the translucent layer 410 may be variously formed. For example, at least one of the first surface 410a or the second surface 410b of the translucent layer 410 may be formed with various surface roughness in order to adjust the ratio of specular reflection and diffuse reflection. According to an exemplary embodiment, as the surface roughness of at least one of the first surface 410a or the second surface 420b decreases, the ratio of the regular reflection of light toward the translucent layer 410 may increase. According to an embodiment, the surface roughness of the first surface 410a of the translucent layer 410 may be substantially the same as the roughness of the second surface 410b of the translucent layer 410 . According to another embodiment, the surface roughness of the first surface 410a may be smaller than the surface roughness of the second surface 410b.

According to various embodiments, the translucent layer 410 may include a recess 412 . For example, the recess 412 may be formed in at least a portion of the first surface 410a of the translucent layer 410 . The recess 412 is a through hole or opening passing through the first side 410a and the second side 410b of the translucent layer 410, the first side of the translucent layer 410 ( It may mean at least one of the grooves formed in 410a).

According to various embodiments, the recess 412 may include recesses of various shapes. For example, the recess 412 is formed of a plurality of recesses, and the plurality of recesses include a first recess 412a formed with a first depth t1 and a first recess 412a formed with a second depth t2. 2 recesses 412b. According to an embodiment, the first depth t1 may be greater than the second depth t2.

According to various embodiments, the translucent layer 410 may include a plurality of translucent regions 414 having different thicknesses. The semi-transparent area 414 may include at least one of a first semi-transparent area 414a, a second semi-transparent area 414b, and a third semi-transparent area 414c. The first translucent region 414a , the second translucent region 414b , and the third translucent region 414c may be at least a partial region of the translucent layer 410 formed by the recess 412 . According to an embodiment, at least a portion of the semi-transparent area 414 (eg, the second semi-transparent area 414b) may be a plurality of separated areas.

Although three types of translucent areas 414 are illustrated in FIG. 5 , this is only an example for description and may include four or more semi-transparent areas of the semi-transparent area 414 or may include two semi-transparent areas.

According to various embodiments, the light transmittance of the translucent layer 410 may be formed in various ways. The light transmittance of the translucent layer 410 may be changed based on the thickness of the translucent layer 410 . For example, the light transmittance of the second semi-transparent area 414b thicker than the first semi-transparent area 414a may be lower than the light transmittance of the first semi-transparent area 414a.

According to various embodiments, the translucent layer 410 may be formed to have various thicknesses. For example, the translucent layer 410 may have a thickness of 0.2 mm to 1.0 mm.

According to various embodiments, the translucent layer 410 may be formed to have a uniform color as a whole. For example, the hue, saturation, or brightness of the translucent layer 410 is uniformly formed as a whole, and the shape exposed to the outside of the electronic device 101 is based on the color layer 420 and the recess 412 . can be determined by According to an embodiment, the translucent layer 410 may not include different types of powders for displaying different colors, saturation, or brightness.

According to various embodiments, the color layer 420 may be visibly exposed to the outside of the electronic device 101 . For example, the translucent layer 410 is formed of a material that can transmit light, and the color layer 420 disposed under the translucent layer 410 is formed of the electronic device 101 through the translucent layer 410 . It can be visibly exposed to the outside.

According to various embodiments, the color layer 420 may provide various images to the user. According to an embodiment, the color layer 420 may include a plurality of regions formed of various colors. The plurality of regions may have different at least one of hue, saturation, and brightness. The user may acquire various images based on the plurality of regions formed in the color layer 420 . According to another embodiment, the color layer 420 may be formed to have a uniform color as a whole. When the color layer 420 is formed in a uniform color as a whole, the image acquired by the user may be changed based on the shape of the translucent layer 410 . For example, the color layer 420 is externally displayed through the translucent layer 410 having a different light transmittance for each region, and the user can acquire various images.

According to various embodiments, the image of the color layer 420 displayed to the outside may be changed based on the thickness of the translucent layer 410 . For example, the color layer 420 disposed under the first recess 412a formed with a first depth t1 and a second recess formed with a second depth t2 different from the first depth t1 . A color displayed to the outside of the electronic device 101 by the color layer 420 disposed under 412b may be different.

According to various embodiments, the color layer 420 may be stacked under the translucent layer 410 (eg, in the second direction (-Z direction)). For example, the third surface 420a of the color layer 420 may be disposed in a direction facing the second surface 410b of the translucent layer 410 .

According to various embodiments, the color layer 420 may be combined with the translucent layer 410 . For example, the color layer 420 may include a third surface 420a in contact with the second surface 410b of the translucent layer 410 . According to one embodiment, the color layer 420 and the translucent layer 410 are bonded through sintering, and an adhesive (eg, an optically transparent adhesive film) between the color layer 420 and the translucent layer 410 . may not be placed.

According to various embodiments, the electronic device 101 may include an overlapping layer (not shown) disposed between the translucent layer 410 and the color layer 420 . When the translucent layer 410 and the color layer 420 are combined through sintering, the overlapping layer may be a layer in which a part of the translucent layer 410 and a part of the color layer 420 are mixed.

According to various embodiments, the color layer 420 disposed under the translucent layer 410 may be viewed from the outside of the electronic device 101 through the translucent layer 410 . According to an embodiment, the light transmittance of the translucent layer 410 may be 40% to 60%.

According to various embodiments, the color layer 420 may be formed of a variety of materials. For example, the color layer 420 may include zirconium oxide (zirconia (ZrO ₂ )). According to an embodiment, the color layer 420 may include yttria-stabilized zirconia (YSZ) formed by combining _{zirconium oxide (ZrO 2} ) and yttria (Y ₂ O _{3 ).} The particle size of the yttria-stabilized zirconia may be formed in a range of 60 μm to 75 μm. The color layer 420 including zirconia (ZrO ₂ ) may have high chemical resistance, high wear resistance, and high stress. As another example, the color layer 420 may include color powder. The color powder may _{include at least one of chromium oxide (Cr 2} O ₃ ), iron oxide (Fe ₂ O ₃ ), cobalt oxide (Cr ₂ O ₃ ) or erbium oxide (Er ₂ O ₃ ) to display a color. can The color layer 420 may be defined as a second ceramic member.

According to various embodiments, the color layer 420 may be formed in various thicknesses. For example, the color layer 420 may have a thickness of 0.2 mm to 0.3 mm.

According to various embodiments, the electronic device 101 may include an anti-shattering film 430 . The shatterproof film 430 may prevent scattering of at least one of the translucent layer 410 and the color layer 420 . For example, the anti-shattering film 430 may include an adhesive layer 432 for bonding with the color layer 420 , and a base layer 434 bonded with the color layer 420 using the adhesive layer 432 . may include The base layer 434 may be disposed under the adhesive layer 432 . When at least one of the translucent layer 410 or the color layer 420 formed of a ceramic member is broken by an external impact, the translucent layer 410 or the color layer is formed by the base layer 434 combined with the color layer 420 . The scattering of fragments of at least one of 420 may be prevented.

According to an embodiment, the adhesive layer 432 may be formed of an optically clear adhesive (OCA). According to another embodiment, the adhesive layer 432 may be formed of an optically clear resin (OCR).

According to various embodiments, the base layer 434 may be formed of a variety of materials. For example, the base layer 434 may be formed in consideration of at least one of transparency, strength, and hardness. According to an embodiment, the base layer 434 may be formed of polyethylene terephthalate (PET). For example, the base layer 434 may include at least one of oriented polyethylene terephthalate (OPET) or amorphous polyethylene terephthalate (APET).

FIG. 8 is another cross-sectional view taken along A-A′ of FIG. 5 . Referring to FIG. 8 , the electronic device 101 may include a translucent layer 410 , an anti-shattering film 430 , and a shielding printing layer 440 . The configuration of the semi-transparent layer 410 and the anti-shattering film 430 of FIG. 8 may be all or partly the same as the configuration of the semi-transparent layer 410 and the anti-shattering film 430 of FIGS. 5 to 7 .

According to various embodiments, the base layer 434 may provide various images to the user. For example, the base layer 434 may include a plurality of regions printed with various colors, and the base layer 434 may be displayed to the outside of the electronic device 101 through the translucent layer 410 . According to an embodiment, when various colors are printed on the base layer 434 , the printing film 430 including the base layer 434 may be disposed under the translucent layer 410 . For example, the adhesive layer 432 may be combined with the second surface 410b of the translucent layer 410 , and the color layer 420 may be omitted.

According to various embodiments, the shielding printing layer 440 is an electronic component (eg, the antenna 370 of FIG. 3 ) of the electronic device 101 disposed in the second direction (-Z direction) of the shatterproof film 430 . ) can reduce the visible exposure to the outside. For example, the shielding print layer 440 may include a substantially opaque ink or paint. According to an embodiment, when the user looks at the electronic device 101 of FIG. 5 in the second direction (-Z direction), the electronic component positioned below the shielding printed layer 440 cannot be recognized. For example, only the configuration of the electronic device 101 located in the first direction (+Z direction) rather than the shielding printed layer 440 may be recognized by a user who views the electronic device 101 in the second direction (-Z direction). can

9A is a rear view of an electronic device according to various embodiments of the present disclosure; 9B is a cross-sectional view taken along the line B-B′ of FIG. 9A . 10A is a rear view of an electronic device according to various embodiments of the present disclosure; 10B is a cross-sectional view taken along a line C-C′ of FIG. 10A. The configuration of the translucent layer 410 and the color layer 420 of FIGS. 9A, 9B, 10A and 10B is all or part of the configuration of the translucent layer 410 and the color layer 420 of FIGS. 5 to 7 . may be the same.

According to various embodiments, the recess 412 formed in the translucent layer 410 may provide various information to the user. For example, the recess 412 may be formed of a character for indicating at least one of a pattern, an International Mobile Equipment Identity (IMEI), or a logo of a manufacturer. According to an embodiment, the recess 412 may be formed in a portion of the translucent layer 410 to display characters. 9A and 9B , in order to display characters in an embossed shape, a recess 412 may be formed in a portion of the translucent layer 410 . 10A and 10B , in order to display characters in an engraved shape, a recess 412 may be formed in another portion of the translucent layer 410 .

11 is a rear view of an electronic device including a camera module according to various embodiments of the present disclosure; 12 is a cross-sectional view taken along the line D-D′ of FIG. 11 . The configuration of the camera module 312 of FIGS. 11 and 12 is all or part the same as that of the camera module 312 of FIG. 2, and the translucent layer 410 and the color layer 420 of FIGS. The configuration may be the same in whole or in part as the configuration of the translucent layer 410 and the color layer 420 of FIGS. 5 to 7 .

According to various embodiments, the electronic device 101 may include a camera module 312 . The camera module 312 is configured to include at least one lens facing the first direction (+Z direction), and may be disposed on the rear surface of the electronic device 101 (eg, the rear surface 310B of FIG. 3 ). .

According to various embodiments, the camera module 312 may be disposed to penetrate at least a portion of the translucent layer 410 . According to an embodiment, the camera module 312 may be formed to penetrate the translucent layer 410 and the color layer 420 . According to another embodiment, the camera module 312 may be formed to penetrate the translucent layer 410 and disposed on the color layer 420 .

According to various embodiments, the camera module 312 may include a fourth surface 312a facing the first direction (+Z direction). The fourth surface 312a may be formed to be substantially parallel to the rear surface 310B of the electronic device 101 .

According to various embodiments, the translucent layer 410 may include a protrusion 416 extending to the fourth surface 312a. The protrusion 416 is formed from the first surface 410a of the translucent layer 410 in order to reduce the clearance in the height direction (Z direction) between the translucent layer 410 and the camera module 312 . It may extend to the fourth surface 312a of the 312 . For example, the protrusion 416 may include a surface substantially parallel to the fourth surface 312a.

13 is another rear view of an electronic device according to various embodiments of the present disclosure; 14 is a cross-sectional view taken along line E-E′ of FIG. 13 .

13 and 14 , the electronic device 101 may include a translucent layer 410 and a color layer 420 . The configuration of the translucent layer 410 and the color layer 420 of FIGS. 13 and 14 may be all or partly the same as the configuration of the translucent layer 410 and the color layer 420 of FIGS. 5 to 7 .

According to various embodiments, the translucent layer 410 may include a recess 412 penetrating the translucent layer 410 .

According to various embodiments, the translucent layer 410 may be formed in various shapes. For example, the translucent layer 410 may include a first surface 410a facing the first direction and having a plurality of recesses 412 formed in at least a partial area thereof.

According to various embodiments, at least some of the plurality of recesses 412 may be formed to penetrate the translucent layer 410 . For example, when the translucent layer 410 is viewed from the top, the translucent layer 410 may be formed in a mesh shape.

According to various embodiments, at least a portion of the color layer 420 may be physically exposed to the outside of the electronic device 101 . For example, the color layer 420 may be formed through at least a portion of the first region 422 and the plurality of recesses 412 displayed to the outside of the electronic device 101 through the translucent layer 410 through the electronic device ( A second region 424 exposed to the outside of 101 may be included. When the electronic device 101 is viewed in the second direction (-Z direction), the second region 424 is the color layer 420 disposed inside the recess 412 penetrating the translucent layer 410 . region, and the first region 424 may be a region of the color layer 420 excluding the second region 424 .

According to various embodiments, the electronic device 101 may provide various images to the user. According to an embodiment, the color layer 420 may be formed to have a uniform color as a whole. For example, even when the first region 422 and the second region 424 are formed to have substantially the same color, the electronic device is transmitted from the first region 422 based on the light transmittance of the translucent layer 410 . A color displayed outside of 101 may be different from a color displayed outside of the electronic device 101 from the second region 424 . According to another embodiment, the color layer 420 may be formed of different colors. For example, a color of the first region 422 may be different from a color of the second region 424 . As another example, a color of a partial portion of the first region 422 may be different from a color of another partial portion of the first region 422 . When the color layer 420 is formed of different colors, various images may be displayed to the outside of the electronic device 101 based on the color of the color layer 420 and the light transmittance of the translucent layer 410 .

15 is a flowchart illustrating a method of manufacturing an electronic device according to various embodiments of the present disclosure;

Referring to FIG. 15 , a method 1000 of manufacturing the electronic device 101 includes a process of combining a first ceramic blank and a second ceramic blank ( S110 ) and a process of isostatically pressing the first ceramic blank and the second ceramic blank ( S120 ). ), the process of sintering the first ceramic blank and the second ceramic blank (S130), the process of forming a recess in the first ceramic member (S140), the process of grinding the first ceramic member (S150) and the scattering prevention film A step of bonding to the second ceramic member ( S160 ) may be included. The configuration of the ceramic member and the shatterproof film of FIG. 15 may be all or partly the same as the configuration of the translucent layer 410 , the color layer 420 and the shatterproof film 430 of FIGS. 5 to 7 . The manufacturing method 1000 of the electronic device 101 includes a partial process (eg, a process of isostatically pressing a first ceramic blank and a second ceramic blank (S120), a process of grinding the first ceramic member (S150), and scattering prevention). The process of bonding the film to the second ceramic member (at least one of S160 ) may be performed in a state except for the case.

According to various embodiments, the first ceramic blank and the second ceramic blank may be combined. The first ceramic blank may be a material formed by pressing a translucent ceramic powder to form a translucent layer (eg, the translucent layer 410 of FIG. 6 ). The second ceramic blank may be a material formed by pressing color ceramic powder to form a color layer (eg, the color layer 420 of FIG. 6 ).

According to various embodiments, the translucent ceramic powder and the colored ceramic powder may include various materials. For example, the translucent ceramic powder may include zirconium oxide (zirconia (ZrO ₂ )). According to an embodiment, the translucent ceramic powder may include yttria-stabilized zirconia (YSZ) formed by a combination of _{zirconium oxide (ZrO 2} ) and yttria (Y ₂ O _{3 ).} For example, the translucent ceramic powder may include zirconium oxide (zirconia (ZrO ₂ )). According to an embodiment, the color ceramic powder is zirconium oxide (ZrO ₂ ) and yttria (Y ₂ O ₃ ) formed by a combination of yttria-stabilized zirconia (YSZ), chromium oxide (Cr ₂ O _{3 )} ), iron oxide (Fe ₂ O ₃ ), cobalt oxide (Cr ₂ O ₃ ), or erbium oxide (Er ₂ O ₃ ) may include at least one.

According to various embodiments, the first ceramic blank and the second ceramic blank may be combined in various ways. For example, a first ceramic blank may be laminated over a second ceramic blank. The first ceramic blank and the second ceramic blank may be combined by being pressed in a contact state.

According to various embodiments, the isobaric pressing of the first ceramic blank and the second ceramic blank ( S120 ) may be performed in various ways. For example, the first ceramic blank and the second ceramic blank may be disposed in water for a predetermined time in a combined state to receive water pressure. The first ceramic blank and the second ceramic blank receiving the hydraulic pressure may receive substantially the same pressure as a whole. The density of the first ceramic blank receiving the hydraulic pressure and the density of the second ceramic blank may be substantially the same.

According to various embodiments, the method 1000 of manufacturing the electronic device 101 may include a step ( S130 ) of sintering the first ceramic blank and the second ceramic blank. According to an embodiment, the first ceramic member may be formed through a process of sintering the first ceramic blank. For example, the first ceramic blank may be debinding and sintered to change into a first ceramic member having higher strength and hardness than the first ceramic blank. The first ceramic member may have the same configuration as the translucent layer (eg, the translucent layer 410 of FIG. 6 ). According to another embodiment, the second ceramic member may be formed through a process of sintering the second ceramic blank. For example, the second ceramic blank may be debinding and sintered to change into a second ceramic member having higher strength and hardness than the second ceramic blank. The second ceramic member may have the same configuration as the color layer (eg, the color layer 420 of FIG. 6 ).

According to various embodiments, a recess (eg, the recess 412 of FIG. 6 ) may be formed in the surface of the electronic device 101 . For example, the recess 412 may be formed in the first ceramic member (eg, the translucent layer 410 of FIG. 6 ).

According to various embodiments, the process of forming the recess 412 in the translucent layer 410 ( S140 ) may be performed through various methods. According to an embodiment, the recess 412 may be formed through a computer numerical control (CNC) process. For example, the recess 412 may be etched through a CNC process to be formed on the first surface of the translucent layer 410 (eg, the first surface 410a of FIG. 6 ). According to another embodiment, the recess 412 may be formed through a mold pressing process. For example, the recess 412 may be formed through a process in which a mold press presses the first ceramic blank. According to another embodiment, the recess 412 may be formed through laser processing. For example, the recess 412 may be formed by irradiating a laser on the first surface of the translucent layer 410 (eg, the first surface 410a of FIG. 6 ).

According to various embodiments, the process ( S140 ) of forming a recess (eg, the recess 412 of FIG. 6 ) in the translucent layer (eg, the translucent layer 410 of FIG. 6 ) may be performed in various orders. have. According to one embodiment, when forming the recess 412 in the translucent layer 410 through the CNC process, the process of forming the recess 412 in the translucent layer 410 (S140) is a first ceramic blank and The sintering of the second ceramic blank may be performed after the step (S130). According to another embodiment, when forming the recess 412 in the translucent layer 410 through the mold pressing process, the process of forming the recess 412 in the translucent layer 410 (S140) is the first ceramic blank and the second ceramic blank isostatically pressed (S120) or after the first ceramic blank and the second ceramic blank are sintered (S130). According to another embodiment, when the recess 412 is formed in the translucent layer 410 through a laser process, the process of forming the recess 412 in the translucent layer 410 ( S140 ) is the first ceramic member. It may be performed after the grinding process (S150).

According to various embodiments, the method 1000 of manufacturing the electronic device 101 may include a step of polishing the first ceramic member ( S150 ). For example, by polishing the translucent layer (eg, the translucent layer 410 of FIG. 6 ), the surface roughness of the translucent layer 410 may be reduced. The light transmittance of the translucent layer 410 with reduced surface roughness may be increased.

According to various embodiments, in the manufacturing method 1000 of the electronic device 101, the second ceramic member (eg, the color layer 420 of FIG. 6) )) may include a step (S160) of combining. For example, the anti-shattering film 430 may be combined under the color layer 420 using an adhesive layer (eg, the adhesive layer 432 of FIG. 7 ).

16 is a photograph of an electronic device according to various embodiments of the present disclosure.

Referring to FIG. 16 , the electronic device 101 may include various colors and patterns. The configuration of the electronic device 101 of FIG. 16 may be all or partly the same as that of the electronic device 101 of FIGS. 5 to 7 .

According to various embodiments, the electronic device 101 may include various patterns to enhance the appearance of the electronic device 101 . According to an embodiment, at least one of a rear surface (eg, a rear surface 310B of FIG. 2 ) and a side surface (eg, a side surface 310C of FIG. 2 ) of the electronic device 101 may include patterns having different thicknesses. . For example, since the light transmittance of the rear surface 310B and the side surface 310C is changed based on the thickness of the rear surface 310B and the side surface 310C, the rear surface 310B and the side surface 310C are lower An image of the color ceramic member (eg, the color layer 420 of FIG. 6 ) disposed on the outside of the electronic device 101 may be changed. The rear surface 310B and the side surface 310C may be formed of a translucent ceramic member (eg, the translucent layer 410 of FIG. 6 ).

The electronic device (eg, the electronic device 101 of FIG. 2 ) according to various embodiments of the present disclosure has a first surface (eg, the first surface of FIG. 6 ) facing the first direction (eg, the +Z direction of FIG. 5 ). surface 410a) and a second surface (eg, the second surface 410b of FIG. 6) facing a second direction (eg, -Z direction in FIG. 5) opposite to the first direction, wherein the A translucent layer (eg, the translucent layer 410 of FIG. 6 ) formed with a plurality of recesses (eg, the recesses 412 of FIG. 6 ) in at least a portion of the first surface, and a third surface in contact with the second surface (eg, the third surface 420a of FIG. 6 ), and may include a color layer (eg, the color layer 420 of FIG. 6 ) displayed to the outside of the electronic device through the translucent layer.

According to various embodiments, the translucent layer is formed of a first ceramic member including Yttria-stabilized zirconia (YSZ), and the color layer includes the yttria-stabilized zirconia and color powder. at least one of chromium oxide (Cr ₂ O ₃ ), iron oxide (Fe ₂ O ₃ ), cobalt oxide (Cr ₂ O ₃ ), or erbium oxide (Er ₂ O ₃ ). may include.

According to various embodiments, the electronic device includes an anti-shattering film (eg, the anti-shattering film 430 of FIG. 6 ) disposed under the color layer, and the anti-shattering film is adhesive combined with the color layer. a layer (eg, the adhesive layer 432 of FIG. 6 ) and a base layer disposed below the adhesive layer (eg, the base layer 434 of FIG. 6 ).

According to various embodiments, the base layer may include polyethylene terephthalate.

According to various embodiments, the electronic device is a camera module that is formed to penetrate at least a portion of the translucent layer and includes a fourth surface (eg, the fourth surface 312a of FIG. 11 ) facing the first direction. (eg, the camera module 312 of FIG. 10 ), wherein the translucent layer includes a projection (eg, the projection 416 of FIG. 11 ) extending from the first side to the fourth side of the camera module. can do.

According to various embodiments, the translucent layer may be formed in a uniform color as a whole.

According to various embodiments, the electronic device includes a front plate facing the second direction (eg, the front plate 310A of FIG. 2 ), and a rear plate facing the first direction (eg, the rear plate 310B of FIG. 3 ). )), and a side member surrounding the space between the front plate and the back plate (eg, the side member 310C in FIG. 2 ), wherein at least a portion of the back plate and at least a portion of the side member include: It may be formed of the translucent layer and the color layer.

According to various embodiments, the rear plate and the side member may be integrally formed.

According to various embodiments, the translucent layer may have a thickness of 0.2 mm to 1.0 mm, and the color layer may have a thickness of 0.2 mm to 0.3 mm.

According to various embodiments, the light transmittance of the translucent layer may be 40% to 60%.

According to various embodiments, the plurality of recesses may include a first recess (eg, the first recess 412a of FIG. 6 ) formed with a first depth (eg, the first depth t1 of FIG. 6 ); It may include a second recess (eg, the second recess 412b of FIG. 6 ) formed with a second depth different from the first depth (eg, the second depth t2 of FIG. 6 ).

According to various embodiments, the translucent layer includes a first translucent region (eg, the first translucent region 414a of FIG. 5 ) and a second translucent region (eg, the second translucent region 414b of FIG. 5 ) and a second translucent region (eg, the second translucent region 414b of FIG. 5 ). Three semi-transparent areas (eg, the third semi-transparent area 414c of FIG. 5 ) may be included, and thicknesses of the first semi-transparent area, the second semi-transparent area, and the third semi-transparent area may be different.

According to various embodiments, the plurality of recesses may form at least one of a pattern or a character.

According to various embodiments, the density of the translucent layer and the density of the color layer may be substantially the same.

According to various embodiments, the plurality of recesses may be formed through CNC machining, laser machining, or a mold press.

According to various embodiments of the present disclosure, in an electronic device (eg, the electronic device 101 of FIG. 2 ), a first direction (eg, the first direction (+Z direction) of FIG. 5 ) is oriented, and at least a portion The region includes a first surface (eg, the first surface 410a of FIG. 6 ) on which a plurality of recesses (eg, the recesses 412 of FIG. 6 ) are formed, and a translucent first ceramic member (eg, FIG. 6 ) 14 ) and a first region (eg, a first region 422 of FIG. 14 ) disposed in a stack with the first ceramic member and displayed to the outside of the electronic device through the first ceramic member and a second ceramic member (eg, the color of FIG. 14 ) including a second region (eg, the second region 424 of FIG. 14 ) exposed to the outside of the electronic device through at least a portion of the plurality of recesses layer 420).

According to various embodiments, the first ceramic member includes Yttria-stabilized zirconia (YSZ), and the second ceramic member includes the yttria-stabilized zirconia and color powder, and the The color powder may include at least one of _{chromium oxide (Cr 2} O ₃ ), iron oxide (Fe ₂ O ₃ ), cobalt oxide (Cr ₂ O ₃ ), or erbium oxide (Er ₂ O _{3 ).}

According to various embodiments, the electronic device includes an anti-shattering film (eg, the anti-shattering film 430 of FIG. 6 ) disposed under the second ceramic member, and the anti-shattering film is combined with the color layer an adhesive layer (eg, the adhesive layer 432 of FIG. 6 ) and a base layer disposed under the adhesive layer (eg, the base layer 434 of FIG. 6 ).

According to various embodiments of the present disclosure, a method of manufacturing an electronic device (eg, the electronic device 101 of FIG. 2 ) (eg, the method 1000 of manufacturing the electronic device of FIG. 15 ) is performed by pressing a translucent ceramic powder to A process of combining the second ceramic blank formed by pressing color ceramic powder under the formed first ceramic blank (eg, a process of combining the first ceramic blank and the second ceramic blank of FIG. 15 ( S110 )), the second 1 A step of sintering a ceramic blank and the second ceramic blank to form a first ceramic member and a second ceramic member (eg, a step of sintering the first ceramic blank and the second ceramic blank of FIG. 15 ( S130 )), and A process of forming a recess in the first ceramic member (eg, a process of forming a recess ( S140 ) of FIG. 15 ) may be included.

According to various embodiments, the method of manufacturing the electronic device may include a step of bonding an anti-shattering film under the second ceramic member (eg, a step of bonding the shatter-proof film of FIG. 15 ( S160 )). .

The electronic device including the translucent layer of the various embodiments of the present disclosure described above is not limited by the above-described embodiments and drawings, and various substitutions, modifications and changes are possible within the technical scope of the present disclosure. It will be apparent to those of ordinary skill in the art.

101: electronic device
311: back plate
410: translucent layer
410a: first side
410b: second side
412: recess
420: color layer
430: shatterproof film

Claims (20)

In an electronic device,
a translucent layer comprising a first surface facing a first direction and a second surface facing a second direction opposite to the first direction, wherein a plurality of recesses are formed in at least a portion of the first surface; and
An electronic device comprising a third surface in contact with the second surface, and a color layer displayed to the outside of the electronic device through the translucent layer.
According to claim 1,
The translucent layer is formed of a first ceramic member including yttria-stabilized zirconia (YSZ),
The color layer is formed of a second ceramic member including the yttria-stabilized zirconia and color powder, and the color powder includes chromium oxide (Cr ₂ O ₃ ), iron oxide (Fe ₂ O ₃ ), and cobalt oxide (Cr _{2 ).} O ₃ ) or erbium oxide (Er ₂ O ₃ ) Electronic device comprising at least one.
According to claim 1,
The electronic device further comprises; an anti-shattering film disposed under the color layer,
wherein the anti-shattering film includes an adhesive layer bonded to the color layer and a base layer disposed under the adhesive layer.
4. The method of claim 3,
and the base layer includes polyethylene terephthalate.
According to claim 1,
The electronic device further includes a camera module that is formed to pass through at least a portion of the translucent layer and includes a fourth surface facing the first direction;
and the translucent layer includes a protrusion extending from the first surface to the fourth surface of the camera module.
According to claim 1,
The semi-transparent layer is formed in a uniform color as a whole.
According to claim 1,
The electronic device further includes a front plate facing the second direction, a rear plate facing the first direction, and a side member surrounding a space between the front plate and the rear plate,
At least a portion of the back plate and at least a portion of the side member are formed of the translucent layer and the color layer.
8. The method of claim 7,
The back plate and the side member are integrally formed.
According to claim 1,
The thickness of the translucent layer is formed in a range of 0.2 mm to 1.0 mm, and the thickness of the color layer is formed in a range of 0.2 mm to 0.3 mm.
According to claim 1,
The light transmittance of the translucent layer is 40% to 60%.
According to claim 1,
The plurality of recesses includes a first recess formed to a first depth and a second recess formed to a second depth different from the first depth.
According to claim 1,
The translucent layer includes a first translucent region, a second translucent region, and a third translucent region, wherein the first translucent region, the second translucent region, and the third translucent region have different thicknesses.
According to claim 1,
The plurality of recesses form at least one of a pattern or a character.
According to claim 1,
wherein the density of the translucent layer and the density of the color layer are substantially the same.
The electronic device of claim 1 , wherein the plurality of recesses are formed through CNC machining, laser machining, or a mold press.
In an electronic device,
a first ceramic member facing a first direction and having a first surface having a plurality of recesses formed in at least a partial area thereof, the first ceramic member being translucent; and
A second region stacked with the first ceramic member and exposed to the outside of the electronic device through at least a portion of a first region and the plurality of recesses displayed to the outside of the electronic device through the first ceramic member An electronic device comprising a second ceramic member including a region.
17. The method of claim 16,
The first ceramic member includes yttria-stabilized zirconia (YSZ),
The second ceramic member may include the yttria-stabilized zirconia and color powder, and the color powder may include chromium oxide (Cr ₂ O ₃ ), iron oxide (Fe ₂ O ₃ ), cobalt oxide (Cr ₂ O ₃ ), or oxide. An electronic device comprising at least one of Erbium (Er ₂ O _{3 ).}
17. The method of claim 16,
The electronic device further includes; an anti-shattering film disposed under the second ceramic member;
wherein the shatterproof film includes an adhesive layer bonded to the second ceramic member and a base layer disposed under the adhesive layer.
A method of manufacturing an electronic device, comprising:
bonding the second ceramic blank formed by pressing the color ceramic powder under the first ceramic blank formed by pressing the translucent ceramic powder;
sintering the first ceramic blank and the second ceramic blank to form a first ceramic member and a second ceramic member; and
and forming a recess in the first ceramic member.
20. The method of claim 19,
The method of manufacturing the electronic device includes a step of bonding an anti-shattering film under the second ceramic member.

Images