KR20210052274A - 플렉시블 프린트 배선판용 적층 필름의 제조 방법 및 플렉시블 프린트 배선판 - Google Patents
플렉시블 프린트 배선판용 적층 필름의 제조 방법 및 플렉시블 프린트 배선판 Download PDFInfo
- Publication number
- KR20210052274A KR20210052274A KR1020200138162A KR20200138162A KR20210052274A KR 20210052274 A KR20210052274 A KR 20210052274A KR 1020200138162 A KR1020200138162 A KR 1020200138162A KR 20200138162 A KR20200138162 A KR 20200138162A KR 20210052274 A KR20210052274 A KR 20210052274A
- Authority
- KR
- South Korea
- Prior art keywords
- flexible printed
- printed wiring
- film
- curing
- laminated film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2019-196803 | 2019-10-29 | ||
| JP2019196803A JP7699424B2 (ja) | 2019-10-29 | 2019-10-29 | フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20210052274A true KR20210052274A (ko) | 2021-05-10 |
Family
ID=75714059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020200138162A Pending KR20210052274A (ko) | 2019-10-29 | 2020-10-23 | 플렉시블 프린트 배선판용 적층 필름의 제조 방법 및 플렉시블 프린트 배선판 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP7699424B2 (https=) |
| KR (1) | KR20210052274A (https=) |
| TW (1) | TW202124149A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230009005A (ko) | 2021-07-08 | 2023-01-17 | 주식회사 엠아이이큅먼트코리아 | 플립칩 본딩을 위한 정밀 가압장치 |
| KR20230024511A (ko) | 2021-08-12 | 2023-02-21 | 주식회사 엠아이이큅먼트코리아 | 정밀 가압장치를 구비한 플립칩 레이저 본딩기 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015149552A (ja) | 2014-02-05 | 2015-08-20 | 株式会社ニコン | ウェアラブル型電子機器 |
| JP2017204538A (ja) | 2016-05-10 | 2017-11-16 | 日立化成株式会社 | 柔軟性シート、透明フレキシブルプリント配線板及びそれらの製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3111441B2 (ja) * | 1993-11-30 | 2000-11-20 | 宇部興産株式会社 | プリント配線板用基板 |
| JP5500074B2 (ja) * | 2008-08-29 | 2014-05-21 | 味の素株式会社 | 金属膜付きフィルム |
| JP6325326B2 (ja) * | 2014-04-18 | 2018-05-16 | 積水フーラー株式会社 | 硬化性組成物 |
| JP7225546B2 (ja) * | 2018-03-01 | 2023-02-21 | 味の素株式会社 | 封止用樹脂組成物 |
-
2019
- 2019-10-29 JP JP2019196803A patent/JP7699424B2/ja active Active
-
2020
- 2020-10-23 KR KR1020200138162A patent/KR20210052274A/ko active Pending
- 2020-10-27 TW TW109137216A patent/TW202124149A/zh unknown
-
2024
- 2024-08-13 JP JP2024134892A patent/JP2024159771A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015149552A (ja) | 2014-02-05 | 2015-08-20 | 株式会社ニコン | ウェアラブル型電子機器 |
| JP2017204538A (ja) | 2016-05-10 | 2017-11-16 | 日立化成株式会社 | 柔軟性シート、透明フレキシブルプリント配線板及びそれらの製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230009005A (ko) | 2021-07-08 | 2023-01-17 | 주식회사 엠아이이큅먼트코리아 | 플립칩 본딩을 위한 정밀 가압장치 |
| KR20230024511A (ko) | 2021-08-12 | 2023-02-21 | 주식회사 엠아이이큅먼트코리아 | 정밀 가압장치를 구비한 플립칩 레이저 본딩기 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7699424B2 (ja) | 2025-06-27 |
| JP2021072324A (ja) | 2021-05-06 |
| TW202124149A (zh) | 2021-07-01 |
| JP2024159771A (ja) | 2024-11-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5950005B2 (ja) | 樹脂組成物 | |
| KR102561850B1 (ko) | 배선판의 제조 방법 | |
| JP5378620B2 (ja) | 積層板及びプリント配線板の製造方法 | |
| TWI761483B (zh) | 預浸體的製造方法、預浸體、積層板、印刷線路板及半導體封裝體 | |
| JP6467774B2 (ja) | プリント配線板の製造方法 | |
| JP6119441B2 (ja) | 樹脂組成物 | |
| KR102122183B1 (ko) | 조화 경화체, 적층체, 프린트 배선판 및 반도체 장치 | |
| JP6596811B2 (ja) | 熱硬化性樹脂組成物、これを用いるプリプレグ、樹脂付フィルム、積層板、多層プリント配線板及び半導体パッケージ | |
| JP2024159771A (ja) | フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板 | |
| TW201842046A (zh) | 樹脂組成物層 | |
| JP6519307B2 (ja) | 熱硬化性絶縁樹脂組成物、並びにそれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板 | |
| JP6534986B2 (ja) | 樹脂組成物 | |
| WO2014091750A1 (ja) | 硬化性樹脂組成物、絶縁フィルム、プリプレグ、硬化物、複合体、及び、電子材料用基板 | |
| JP6623632B2 (ja) | 絶縁樹脂フィルム及び多層プリント配線板 | |
| KR20160096606A (ko) | 접착층 부착 이형 폴리이미드 필름, 접착층 부착 이형 폴리이미드 필름이 부착된 적층판, 적층판, 접착층 부착 이형 폴리이미드 필름이 부착된 단층 또는 다층 배선판, 및 다층 배선판의 제조 방법 | |
| JP6269401B2 (ja) | 表面処理無機充填材、該無機充填材の製造方法、および該無機充填材を含有する樹脂組成物 | |
| JP2019116630A (ja) | 樹脂組成物 | |
| JPWO2018151287A1 (ja) | プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法 | |
| JP2011246406A (ja) | 有機けい素化合物 | |
| KR101203156B1 (ko) | 에폭시 수지 조성물, 이를 이용하여 제조된 접착필름 및 다층 프린트 배선판 | |
| JP6819062B2 (ja) | 熱硬化性樹脂組成物、これを用いたプリプレグ、樹脂付フィルム、積層板、プリント配線板及び半導体パッケージ、並びにイミド樹脂及びその製造方法 | |
| JP6225422B2 (ja) | 硬化体、硬化体の製造方法、積層体、プリント配線板及び半導体装置 | |
| TW202124150A (zh) | 熱硬化性樹脂薄膜、附有銅箔之熱硬化性樹脂薄膜、可撓性印刷線路板用積層薄膜的製造方法、及可撓性印刷線路板 | |
| JP2020026486A (ja) | プリプレグ、プリプレグの硬化物、積層板、プリント配線板及び半導体パッケージ | |
| JP6597755B2 (ja) | 粗化硬化体の製造方法、積層体の製造方法、プリント配線板の製造方法及び半導体装置の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| D21 | Rejection of application intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |