KR20210052262A - 기판 가열 장치 - Google Patents

기판 가열 장치 Download PDF

Info

Publication number
KR20210052262A
KR20210052262A KR1020200136633A KR20200136633A KR20210052262A KR 20210052262 A KR20210052262 A KR 20210052262A KR 1020200136633 A KR1020200136633 A KR 1020200136633A KR 20200136633 A KR20200136633 A KR 20200136633A KR 20210052262 A KR20210052262 A KR 20210052262A
Authority
KR
South Korea
Prior art keywords
shutter
substrate
plate
heating
heating plate
Prior art date
Application number
KR1020200136633A
Other languages
English (en)
Korean (ko)
Inventor
고스케 히사다
히비키 오오타니
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20210052262A publication Critical patent/KR20210052262A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Furnace Details (AREA)
  • Drying Of Semiconductors (AREA)
  • Resistance Heating (AREA)
  • Tunnel Furnaces (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020200136633A 2019-10-31 2020-10-21 기판 가열 장치 KR20210052262A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019199032A JP7422513B2 (ja) 2019-10-31 2019-10-31 基板加熱装置
JPJP-P-2019-199032 2019-10-31

Publications (1)

Publication Number Publication Date
KR20210052262A true KR20210052262A (ko) 2021-05-10

Family

ID=75648748

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200136633A KR20210052262A (ko) 2019-10-31 2020-10-21 기판 가열 장치

Country Status (3)

Country Link
JP (1) JP7422513B2 (ja)
KR (1) KR20210052262A (ja)
CN (1) CN112750724A (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018182263A (ja) 2017-04-21 2018-11-15 東京エレクトロン株式会社 基板加熱装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3500455B2 (ja) 1993-12-10 2004-02-23 東京エレクトロン株式会社 処理装置
JP3333748B2 (ja) 1998-10-15 2002-10-15 東京エレクトロン株式会社 塗布膜形成装置および硬化処理装置および硬化処理方法
JP2004014753A (ja) 2002-06-06 2004-01-15 Tokyo Electron Ltd 熱処理方法
JP3831310B2 (ja) 2002-07-18 2006-10-11 東京エレクトロン株式会社 処理装置
JP4755498B2 (ja) 2006-01-06 2011-08-24 東京エレクトロン株式会社 加熱装置及び加熱方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018182263A (ja) 2017-04-21 2018-11-15 東京エレクトロン株式会社 基板加熱装置

Also Published As

Publication number Publication date
CN112750724A (zh) 2021-05-04
JP2021071252A (ja) 2021-05-06
JP7422513B2 (ja) 2024-01-26

Similar Documents

Publication Publication Date Title
US11049738B2 (en) Substrate heating device
JP5195711B2 (ja) 基板冷却装置、基板冷却方法及び記憶媒体
KR101168102B1 (ko) 가열 장치, 가열 방법, 도포 장치 및 기억 매체
US7797855B2 (en) Heating apparatus, and coating and developing apparatus
US6402508B2 (en) Heat and cooling treatment apparatus and substrate processing system
JP5575706B2 (ja) 疎水化処理装置、疎水化処理方法、プログラム及びコンピュータ記録媒体。
JP2008177303A (ja) 基板処理装置、基板処理方法及び記憶媒体
US10964564B2 (en) Heating treatment apparatus and heating treatment method
US6815647B2 (en) Heat treatment unit and heat treatment method
JP6944990B2 (ja) 基板処理装置、半導体装置の製造方法およびプログラム
KR101667434B1 (ko) 열 처리 장치, 열 처리 방법 및 기억 매체
US20080182217A1 (en) Heating device, heating method and storage medium
KR20110112074A (ko) 기판 처리 장치 및 방법
JP2002083859A (ja) 基板処理装置及び基板処理方法
KR20210052262A (ko) 기판 가열 장치
US20200203194A1 (en) Inner Wall and substrate Processing Apparatus
JP2004235469A (ja) 熱的処理方法および熱的処理装置
JP7103418B2 (ja) 基板加熱装置及び基板加熱方法
KR102282145B1 (ko) 기판 처리 장치 및 방법
JP3545668B2 (ja) 加熱装置及びその方法
JP2001189250A (ja) 加熱処理装置および加熱処理方法
KR20220034304A (ko) 베이크 장치 및 기판 처리 장치
KR20190009701A (ko) 기판 가열 장치 및 기판 가열 방법
KR102319198B1 (ko) 기판 처리 장치 및 방법
KR102282146B1 (ko) 기판 처리 장치 및 방법