KR20210052143A - 열처리 장치 - Google Patents
열처리 장치 Download PDFInfo
- Publication number
- KR20210052143A KR20210052143A KR1020200028164A KR20200028164A KR20210052143A KR 20210052143 A KR20210052143 A KR 20210052143A KR 1020200028164 A KR1020200028164 A KR 1020200028164A KR 20200028164 A KR20200028164 A KR 20200028164A KR 20210052143 A KR20210052143 A KR 20210052143A
- Authority
- KR
- South Korea
- Prior art keywords
- door
- tube
- support member
- opening
- support
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 69
- 230000007246 mechanism Effects 0.000 claims abstract description 135
- 238000000034 method Methods 0.000 claims 7
- 238000007789 sealing Methods 0.000 description 27
- 238000003825 pressing Methods 0.000 description 23
- 238000006073 displacement reaction Methods 0.000 description 11
- 230000008859 change Effects 0.000 description 10
- 238000001816 cooling Methods 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000005489 elastic deformation Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D5/00—Supports, screens, or the like for the charge within the furnace
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D1/00—Casings; Linings; Walls; Roofs
- F27D1/18—Door frames; Doors, lids, removable covers
- F27D1/1858—Doors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Furnace Details (AREA)
- Furnace Housings, Linings, Walls, And Ceilings (AREA)
- Muffle Furnaces And Rotary Kilns (AREA)
- Heat Treatment Of Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2019-199264 | 2019-10-31 | ||
JP2019199264A JP7386045B2 (ja) | 2019-10-31 | 2019-10-31 | 熱処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20210052143A true KR20210052143A (ko) | 2021-05-10 |
Family
ID=75645138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020200028164A KR20210052143A (ko) | 2019-10-31 | 2020-03-06 | 열처리 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7386045B2 (ja) |
KR (1) | KR20210052143A (ja) |
CN (1) | CN112747601A (ja) |
TW (1) | TW202119501A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7339853B2 (ja) * | 2019-10-31 | 2023-09-06 | 株式会社ジェイテクトサーモシステム | 熱処理装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014053550A (ja) | 2012-09-10 | 2014-03-20 | Koyo Thermo System Kk | 熱処理装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2533708Y2 (ja) * | 1987-11-28 | 1997-04-23 | 東京エレクトロン東北 株式会社 | 処理チューブの開閉装置 |
JP2639723B2 (ja) * | 1988-02-05 | 1997-08-13 | 東京エレクトロン株式会社 | ボート搬送方法及び熱処理装置 |
JPH0734318Y2 (ja) * | 1990-05-21 | 1995-08-02 | 石川島播磨重工業株式会社 | ガス雰囲気炉における加熱室の扉開閉機構 |
JP4354371B2 (ja) * | 2004-09-08 | 2009-10-28 | Dowaホールディングス株式会社 | 金属材料の表面改質熱処理装置 |
JP5091296B2 (ja) * | 2010-10-18 | 2012-12-05 | 東京エレクトロン株式会社 | 接合装置 |
JP5681253B1 (ja) * | 2013-09-13 | 2015-03-04 | 中外炉工業株式会社 | 管材の熱処理装置 |
JP6263407B2 (ja) * | 2014-02-10 | 2018-01-17 | 光洋サーモシステム株式会社 | 熱処理装置 |
JP6839009B2 (ja) * | 2017-03-22 | 2021-03-03 | Ykk Ap株式会社 | 換気装置及び建具 |
-
2019
- 2019-10-31 JP JP2019199264A patent/JP7386045B2/ja active Active
-
2020
- 2020-03-03 CN CN202010139120.5A patent/CN112747601A/zh not_active Withdrawn
- 2020-03-06 KR KR1020200028164A patent/KR20210052143A/ko not_active Application Discontinuation
- 2020-03-30 TW TW109110774A patent/TW202119501A/zh unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014053550A (ja) | 2012-09-10 | 2014-03-20 | Koyo Thermo System Kk | 熱処理装置 |
Also Published As
Publication number | Publication date |
---|---|
TW202119501A (zh) | 2021-05-16 |
JP7386045B2 (ja) | 2023-11-24 |
JP2021071260A (ja) | 2021-05-06 |
CN112747601A (zh) | 2021-05-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |