TW202119501A - 熱處理裝置 - Google Patents

熱處理裝置 Download PDF

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Publication number
TW202119501A
TW202119501A TW109110774A TW109110774A TW202119501A TW 202119501 A TW202119501 A TW 202119501A TW 109110774 A TW109110774 A TW 109110774A TW 109110774 A TW109110774 A TW 109110774A TW 202119501 A TW202119501 A TW 202119501A
Authority
TW
Taiwan
Prior art keywords
door
support member
tube
opening
heat treatment
Prior art date
Application number
TW109110774A
Other languages
English (en)
Chinese (zh)
Inventor
中西裕也
辻本洋平
西岡昌浩
青栁圭太
中窪尚生
笠次克尚
浅野真
Original Assignee
日商光洋熱系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商光洋熱系統股份有限公司 filed Critical 日商光洋熱系統股份有限公司
Publication of TW202119501A publication Critical patent/TW202119501A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D5/00—Supports, screens, or the like for the charge within the furnace
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D1/00—Casings; Linings; Walls; Roofs
    • F27D1/18—Door frames; Doors, lids, removable covers
    • F27D1/1858—Doors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Heat Treatment Of Articles (AREA)
  • Furnace Housings, Linings, Walls, And Ceilings (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Details (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW109110774A 2019-10-31 2020-03-30 熱處理裝置 TW202119501A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-199264 2019-10-31
JP2019199264A JP7386045B2 (ja) 2019-10-31 2019-10-31 熱処理装置

Publications (1)

Publication Number Publication Date
TW202119501A true TW202119501A (zh) 2021-05-16

Family

ID=75645138

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109110774A TW202119501A (zh) 2019-10-31 2020-03-30 熱處理裝置

Country Status (4)

Country Link
JP (1) JP7386045B2 (ja)
KR (1) KR20210052143A (ja)
CN (1) CN112747601A (ja)
TW (1) TW202119501A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7339853B2 (ja) * 2019-10-31 2023-09-06 株式会社ジェイテクトサーモシステム 熱処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2533708Y2 (ja) * 1987-11-28 1997-04-23 東京エレクトロン東北 株式会社 処理チューブの開閉装置
JP2639723B2 (ja) * 1988-02-05 1997-08-13 東京エレクトロン株式会社 ボート搬送方法及び熱処理装置
JPH0734318Y2 (ja) * 1990-05-21 1995-08-02 石川島播磨重工業株式会社 ガス雰囲気炉における加熱室の扉開閉機構
JP4354371B2 (ja) 2004-09-08 2009-10-28 Ｄｏｗａホールディングス株式会社 金属材料の表面改質熱処理装置
JP5091296B2 (ja) * 2010-10-18 2012-12-05 東京エレクトロン株式会社 接合装置
JP5922534B2 (ja) 2012-09-10 2016-05-24 光洋サーモシステム株式会社 熱処理装置
JP5681253B1 (ja) * 2013-09-13 2015-03-04 中外炉工業株式会社 管材の熱処理装置
JP6263407B2 (ja) * 2014-02-10 2018-01-17 光洋サーモシステム株式会社 熱処理装置
JP6839009B2 (ja) * 2017-03-22 2021-03-03 Ykk Ap株式会社 換気装置及び建具

Also Published As

Publication number Publication date
KR20210052143A (ko) 2021-05-10
JP7386045B2 (ja) 2023-11-24
CN112747601A (zh) 2021-05-04
JP2021071260A (ja) 2021-05-06

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