KR20210031837A - 수지 조성물 - Google Patents

수지 조성물 Download PDF

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Publication number
KR20210031837A
KR20210031837A KR1020200115844A KR20200115844A KR20210031837A KR 20210031837 A KR20210031837 A KR 20210031837A KR 1020200115844 A KR1020200115844 A KR 1020200115844A KR 20200115844 A KR20200115844 A KR 20200115844A KR 20210031837 A KR20210031837 A KR 20210031837A
Authority
KR
South Korea
Prior art keywords
resin composition
mass
resin
component
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020200115844A
Other languages
English (en)
Korean (ko)
Inventor
가즈히코 쓰루이
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20210031837A publication Critical patent/KR20210031837A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020200115844A 2019-09-13 2020-09-10 수지 조성물 Pending KR20210031837A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2019-167177 2019-09-13
JP2019167177A JP7676106B2 (ja) 2019-09-13 2019-09-13 樹脂組成物

Publications (1)

Publication Number Publication Date
KR20210031837A true KR20210031837A (ko) 2021-03-23

Family

ID=74861527

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200115844A Pending KR20210031837A (ko) 2019-09-13 2020-09-10 수지 조성물

Country Status (4)

Country Link
JP (2) JP7676106B2 (https=)
KR (1) KR20210031837A (https=)
CN (1) CN112500702B (https=)
TW (1) TWI867037B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7849949B2 (ja) * 2021-06-18 2026-04-22 パナソニックハウジングソリューションズ株式会社 アクリル樹脂組成物、及び成形体
JP7196275B1 (ja) * 2021-12-27 2022-12-26 東洋インキＳｃホールディングス株式会社 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器
CN115637013B (zh) * 2022-10-31 2024-04-30 深圳伊帕思新材料科技有限公司 双马来酰亚胺组合物、半固化胶片以及铜箔基板
CN115975569A (zh) * 2023-02-23 2023-04-18 深圳市汉思新材料科技有限公司 系统级封装用封装胶及其制备方法
CN116867174B (zh) * 2023-07-06 2024-11-12 宁波科浩达电子有限公司 一种pcb印制线路板的制作方法及pcb印制线路板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014095047A (ja) 2012-11-12 2014-05-22 Ajinomoto Co Inc 絶縁樹脂材料

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01215818A (ja) * 1988-02-23 1989-08-29 Hitachi Chem Co Ltd 耐熱性樹脂組成物
JPH03103424A (ja) * 1989-09-18 1991-04-30 Fujitsu Ltd マレイミド樹脂組成物
JP3645604B2 (ja) * 1995-02-16 2005-05-11 住友ベークライト株式会社 樹脂組成物
JP4028672B2 (ja) * 1999-07-15 2007-12-26 荒川化学工業株式会社 反応生成物の製造方法
CN104619498B (zh) * 2012-08-16 2016-08-24 三菱瓦斯化学株式会社 树脂片、带树脂层的支承体、层叠板和覆金属箔层叠板
JP6375774B2 (ja) * 2013-11-15 2018-08-22 Jsr株式会社 液晶配向膜の製造方法、液晶表示素子用基板及びその製造方法、並びに液晶表示素子
KR102572390B1 (ko) * 2015-07-06 2023-08-29 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 레진 시트, 금속박 피복 적층판 및 프린트 배선판
SG11201810798PA (en) * 2016-08-08 2018-12-28 Toray Industries Resin composition, and sheet, laminate, power semiconductor device, and plasma processing apparatus including the same, and method of producing semiconductor using the same
JP6217832B2 (ja) * 2016-11-21 2017-10-25 味の素株式会社 樹脂組成物
TWI773745B (zh) * 2017-04-24 2022-08-11 日商味之素股份有限公司 樹脂組成物
WO2020176898A1 (en) 2019-02-28 2020-09-03 Juul Labs, Inc. Wireless device pairing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014095047A (ja) 2012-11-12 2014-05-22 Ajinomoto Co Inc 絶縁樹脂材料

Also Published As

Publication number Publication date
TW202116912A (zh) 2021-05-01
TWI867037B (zh) 2024-12-21
JP2021042340A (ja) 2021-03-18
JP2023138760A (ja) 2023-10-02
CN112500702B (zh) 2025-03-04
CN112500702A (zh) 2021-03-16
JP7676106B2 (ja) 2025-05-14

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