KR20200139800A - Cd-sem을 사용한 프로세스 시뮬레이션 모델 캘리브레이션 - Google Patents

Cd-sem을 사용한 프로세스 시뮬레이션 모델 캘리브레이션 Download PDF

Info

Publication number
KR20200139800A
KR20200139800A KR1020207032077A KR20207032077A KR20200139800A KR 20200139800 A KR20200139800 A KR 20200139800A KR 1020207032077 A KR1020207032077 A KR 1020207032077A KR 20207032077 A KR20207032077 A KR 20207032077A KR 20200139800 A KR20200139800 A KR 20200139800A
Authority
KR
South Korea
Prior art keywords
profile
semiconductor device
simulation model
computer
device manufacturing
Prior art date
Application number
KR1020207032077A
Other languages
English (en)
Korean (ko)
Inventor
예 펭
쥴리앙 메일페흐
양 루
에밀리 앤 알덴
리셩 가오
데이비드 엠. 프라이드
다니엘 안토니 시몬
앤드류 디. 베일리 3세
Original Assignee
램 리써치 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/946,940 external-priority patent/US10572697B2/en
Application filed by 램 리써치 코포레이션 filed Critical 램 리써치 코포레이션
Publication of KR20200139800A publication Critical patent/KR20200139800A/ko

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/398Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation
    • G06F30/27Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/36Circuit design at the analogue level
    • G06F30/367Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/18Manufacturability analysis or optimisation for manufacturability
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Artificial Intelligence (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Drying Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020207032077A 2018-04-06 2019-04-03 Cd-sem을 사용한 프로세스 시뮬레이션 모델 캘리브레이션 KR20200139800A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US15/946,940 2018-04-06
US15/946,940 US10572697B2 (en) 2018-04-06 2018-04-06 Method of etch model calibration using optical scatterometry
US201862656299P 2018-04-11 2018-04-11
US62/656,299 2018-04-11
PCT/US2019/025668 WO2019195481A1 (en) 2018-04-06 2019-04-03 Process simulation model calibration using cd-sem

Publications (1)

Publication Number Publication Date
KR20200139800A true KR20200139800A (ko) 2020-12-14

Family

ID=68101510

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207032077A KR20200139800A (ko) 2018-04-06 2019-04-03 Cd-sem을 사용한 프로세스 시뮬레이션 모델 캘리브레이션

Country Status (3)

Country Link
KR (1) KR20200139800A (zh)
CN (1) CN112136135A (zh)
WO (1) WO2019195481A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022231837A1 (en) * 2021-04-30 2022-11-03 Kla Corporation High resolution profile measurement based on a trained parameter conditioned measurement model
WO2023039186A1 (en) * 2021-09-10 2023-03-16 Fractilia, Llc Detection of probabilistic process windows
WO2023204344A1 (ko) * 2022-04-19 2023-10-26 한국핵융합에너지연구원 플라즈마 시뮬레이션 방법 및 시스템
US11996265B2 (en) 2017-04-13 2024-05-28 Fractilla, LLC System and method for generating and analyzing roughness measurements and their use for process monitoring and control

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202240734A (zh) * 2020-12-15 2022-10-16 美商蘭姆研究公司 多步驟半導體製造程序中的機器學習
CN113051863B (zh) * 2021-03-12 2023-02-24 广东省大湾区集成电路与系统应用研究院 半导体建模方法、装置、存储介质及计算机设备
CN113471093B (zh) * 2021-06-08 2024-06-04 广东省大湾区集成电路与系统应用研究院 一种用于半导体器件的薄膜形貌预测方法及装置
CN114036649B (zh) * 2021-12-15 2024-08-09 成都飞机工业(集团)有限责任公司 一种无人机数学模型校对方法、装置、设备及存储介质
US20230367302A1 (en) * 2022-05-11 2023-11-16 Applied Materials, Inc. Holistic analysis of multidimensional sensor data for substrate processing equipment
CN116129427A (zh) * 2022-12-22 2023-05-16 东方晶源微电子科技(北京)有限公司 基于设计版图的扫描电子显微镜图像轮廓提取方法、装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7171284B2 (en) * 2004-09-21 2007-01-30 Timbre Technologies, Inc. Optical metrology model optimization based on goals
US7525673B2 (en) * 2006-07-10 2009-04-28 Tokyo Electron Limited Optimizing selected variables of an optical metrology system
CN101840451B (zh) * 2010-04-21 2014-05-28 云南大学 一种集成电路工艺参数模型的优化方法
WO2011158239A1 (en) * 2010-06-17 2011-12-22 Nova Measuring Instruments Ltd. Method and system for optimizing optical inspection of patterned structures
US8666703B2 (en) * 2010-07-22 2014-03-04 Tokyo Electron Limited Method for automated determination of an optimally parameterized scatterometry model
US9412673B2 (en) * 2013-08-23 2016-08-09 Kla-Tencor Corporation Multi-model metrology
US9792393B2 (en) * 2016-02-08 2017-10-17 Lam Research Corporation Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
CN107633103A (zh) * 2016-07-15 2018-01-26 中国科学院微电子研究所 一种cmp模型参数优化方法和装置
CN106874616B (zh) * 2017-03-06 2021-04-20 北京经纬恒润科技股份有限公司 一种参数优化调整方法及系统

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11996265B2 (en) 2017-04-13 2024-05-28 Fractilla, LLC System and method for generating and analyzing roughness measurements and their use for process monitoring and control
WO2022231837A1 (en) * 2021-04-30 2022-11-03 Kla Corporation High resolution profile measurement based on a trained parameter conditioned measurement model
WO2023039186A1 (en) * 2021-09-10 2023-03-16 Fractilia, Llc Detection of probabilistic process windows
WO2023204344A1 (ko) * 2022-04-19 2023-10-26 한국핵융합에너지연구원 플라즈마 시뮬레이션 방법 및 시스템
KR20230149059A (ko) * 2022-04-19 2023-10-26 한국핵융합에너지연구원 플라즈마 시뮬레이션 방법 및 시스템

Also Published As

Publication number Publication date
TW201945967A (zh) 2019-12-01
CN112136135A (zh) 2020-12-25
WO2019195481A1 (en) 2019-10-10

Similar Documents

Publication Publication Date Title
US11704463B2 (en) Method of etch model calibration using optical scatterometry
KR20200139800A (ko) Cd-sem을 사용한 프로세스 시뮬레이션 모델 캘리브레이션
TWI805580B (zh) 透過邊緣放置誤差預測之設計佈局圖案近接校正
US11624981B2 (en) Resist and etch modeling
US10254641B2 (en) Layout pattern proximity correction through fast edge placement error prediction
US10585347B2 (en) Photoresist design layout pattern proximity correction through fast edge placement error prediction via a physics-based etch profile modeling framework
US10303830B2 (en) Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
US20190049937A1 (en) Methods and apparatuses for etch profile optimization by reflectance spectra matching and surface kinetic model optimization
TW201734684A (zh) 藉由表面動力模型最佳化之蝕刻輪廓匹配用方法及設備
TWI851567B (zh) 使製程模擬模型最佳化的方法、系統、及電腦程式產品

Legal Events

Date Code Title Description
E902 Notification of reason for refusal