KR20200138193A - 수지 시트, 수지 시트의 사용 방법, 및 경화 수지층을 가지는 경화 봉지체의 제조 방법 - Google Patents
수지 시트, 수지 시트의 사용 방법, 및 경화 수지층을 가지는 경화 봉지체의 제조 방법 Download PDFInfo
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- KR20200138193A KR20200138193A KR1020207025722A KR20207025722A KR20200138193A KR 20200138193 A KR20200138193 A KR 20200138193A KR 1020207025722 A KR1020207025722 A KR 1020207025722A KR 20207025722 A KR20207025722 A KR 20207025722A KR 20200138193 A KR20200138193 A KR 20200138193A
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- cured
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- thermosetting resin
- resin sheet
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Chemical Kinetics & Catalysis (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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| JPJP-P-2018-068732 | 2018-03-30 | ||
| JP2018068732 | 2018-03-30 | ||
| PCT/JP2019/013504 WO2019189541A1 (ja) | 2018-03-30 | 2019-03-28 | 樹脂シート、樹脂シートの使用方法、及び硬化樹脂層付き硬化封止体の製造方法 |
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| KR20200138193A true KR20200138193A (ko) | 2020-12-09 |
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| WO (1) | WO2019189541A1 (ja) |
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| KR20100058646A (ko) | 2007-10-30 | 2010-06-03 | 니폰덴신뎅와 가부시키가이샤 | 화상 부호화 방법 및 복호 방법, 그들의 장치, 그들의 프로그램과 프로그램을 기록한 기록매체 |
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| JP4846406B2 (ja) * | 2006-03-28 | 2011-12-28 | リンテック株式会社 | チップ用保護膜形成用シート |
| JP5435685B2 (ja) * | 2007-02-28 | 2014-03-05 | ナミックス株式会社 | 封止用樹脂フィルム |
| CN104508069B (zh) * | 2012-08-02 | 2017-03-29 | 琳得科株式会社 | 膜状粘接剂、半导体接合用粘接片、和半导体装置的制造方法 |
| TW201704395A (zh) * | 2015-02-24 | 2017-02-01 | 琳得科股份有限公司 | 薄膜狀接著劑、接著板片以及半導體裝置之製造方法 |
| JP2017092335A (ja) * | 2015-11-13 | 2017-05-25 | 日東電工株式会社 | 半導体パッケージの製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20100058646A (ko) | 2007-10-30 | 2010-06-03 | 니폰덴신뎅와 가부시키가이샤 | 화상 부호화 방법 및 복호 방법, 그들의 장치, 그들의 프로그램과 프로그램을 기록한 기록매체 |
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| Publication number | Publication date |
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| JP2023107769A (ja) | 2023-08-03 |
| CN111902468A (zh) | 2020-11-06 |
| TWI834651B (zh) | 2024-03-11 |
| TW201941951A (zh) | 2019-11-01 |
| WO2019189541A1 (ja) | 2019-10-03 |
| JPWO2019189541A1 (ja) | 2021-04-22 |
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