KR20200128551A - Optical styrenic resin composition and optical parts - Google Patents
Optical styrenic resin composition and optical parts Download PDFInfo
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- KR20200128551A KR20200128551A KR1020207028242A KR20207028242A KR20200128551A KR 20200128551 A KR20200128551 A KR 20200128551A KR 1020207028242 A KR1020207028242 A KR 1020207028242A KR 20207028242 A KR20207028242 A KR 20207028242A KR 20200128551 A KR20200128551 A KR 20200128551A
- Authority
- KR
- South Korea
- Prior art keywords
- resin composition
- transmittance
- mass
- styrene
- optical
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 35
- 229920001890 Novodur Polymers 0.000 title claims abstract description 23
- 230000003287 optical effect Effects 0.000 title claims abstract description 22
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 95
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- -1 anthraquinone compound Chemical class 0.000 claims abstract description 24
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 24
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 21
- 239000011574 phosphorus Substances 0.000 claims abstract description 21
- 239000002530 phenolic antioxidant Substances 0.000 claims abstract description 19
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 17
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000002834 transmittance Methods 0.000 claims description 37
- 238000000034 method Methods 0.000 claims description 28
- 238000001746 injection moulding Methods 0.000 claims description 12
- 238000012360 testing method Methods 0.000 claims description 11
- 238000004020 luminiscence type Methods 0.000 abstract description 21
- 230000007774 longterm Effects 0.000 abstract description 17
- 235000006708 antioxidants Nutrition 0.000 description 21
- 239000000178 monomer Substances 0.000 description 14
- 238000006116 polymerization reaction Methods 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 13
- 230000008569 process Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 5
- 239000003505 polymerization initiator Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000013112 stability test Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 4
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 3
- WBWXVCMXGYSMQA-UHFFFAOYSA-N 3,9-bis[2,4-bis(2-phenylpropan-2-yl)phenoxy]-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C=1C=C(OP2OCC3(CO2)COP(OC=2C(=CC(=CC=2)C(C)(C)C=2C=CC=CC=2)C(C)(C)C=2C=CC=CC=2)OC3)C(C(C)(C)C=2C=CC=CC=2)=CC=1C(C)(C)C1=CC=CC=C1 WBWXVCMXGYSMQA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000005469 granulation Methods 0.000 description 3
- 230000003179 granulation Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- QOSTVEDABRQTSU-UHFFFAOYSA-N 1,4-bis(methylamino)anthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C(NC)=CC=C2NC QOSTVEDABRQTSU-UHFFFAOYSA-N 0.000 description 2
- KZYAYVSWIPZDKL-UHFFFAOYSA-N 1,4-diamino-2,3-dichloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C(N)=C(Cl)C(Cl)=C2N KZYAYVSWIPZDKL-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004605 External Lubricant Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- MOYAFQVGZZPNRA-UHFFFAOYSA-N Terpinolene Chemical compound CC(C)=C1CCC(C)=CC1 MOYAFQVGZZPNRA-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000012662 bulk polymerization Methods 0.000 description 2
- 239000012986 chain transfer agent Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- LJFWQNJLLOFIJK-UHFFFAOYSA-N solvent violet 13 Chemical compound C1=CC(C)=CC=C1NC1=CC=C(O)C2=C1C(=O)C1=CC=CC=C1C2=O LJFWQNJLLOFIJK-UHFFFAOYSA-N 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- VDCOSJPGDDQNJH-JVSYPLCOSA-N (8s,9s,10r,11r,13s,14s)-11-hydroxy-13-methyl-1,2,6,7,8,9,10,11,12,14,15,16-dodecahydrocyclopenta[a]phenanthrene-3,17-dione Chemical compound O=C1CC[C@@H]2[C@H]3[C@H](O)C[C@](C)(C(CC4)=O)[C@@H]4[C@@H]3CCC2=C1 VDCOSJPGDDQNJH-JVSYPLCOSA-N 0.000 description 1
- ZUDLIFVTNPYZJH-UHFFFAOYSA-N 1,1,2,2-tetraphenylethylbenzene Chemical compound C1=CC=CC=C1C(C(C=1C=CC=CC=1)(C=1C=CC=CC=1)C=1C=CC=CC=1)C1=CC=CC=C1 ZUDLIFVTNPYZJH-UHFFFAOYSA-N 0.000 description 1
- IMYCVFRTNVMHAD-UHFFFAOYSA-N 1,1-bis(2-methylbutan-2-ylperoxy)cyclohexane Chemical compound CCC(C)(C)OOC1(OOC(C)(C)CC)CCCCC1 IMYCVFRTNVMHAD-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- DMDRBXCDTZRMHZ-UHFFFAOYSA-N 1,4-bis(2,4,6-trimethylanilino)anthracene-9,10-dione Chemical compound CC1=CC(C)=CC(C)=C1NC(C=1C(=O)C2=CC=CC=C2C(=O)C=11)=CC=C1NC1=C(C)C=C(C)C=C1C DMDRBXCDTZRMHZ-UHFFFAOYSA-N 0.000 description 1
- IBABXJRXGSAJLQ-UHFFFAOYSA-N 1,4-bis(2,6-diethyl-4-methylanilino)anthracene-9,10-dione Chemical compound CCC1=CC(C)=CC(CC)=C1NC(C=1C(=O)C2=CC=CC=C2C(=O)C=11)=CC=C1NC1=C(CC)C=C(C)C=C1CC IBABXJRXGSAJLQ-UHFFFAOYSA-N 0.000 description 1
- KTEFLEFPDDQMCB-UHFFFAOYSA-N 1,4-bis(4-butylanilino)-5,8-dihydroxyanthracene-9,10-dione Chemical compound C1=CC(CCCC)=CC=C1NC(C=1C(=O)C2=C(O)C=CC(O)=C2C(=O)C=11)=CC=C1NC1=CC=C(CCCC)C=C1 KTEFLEFPDDQMCB-UHFFFAOYSA-N 0.000 description 1
- OCQDPIXQTSYZJL-UHFFFAOYSA-N 1,4-bis(butylamino)anthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C(NCCCC)=CC=C2NCCCC OCQDPIXQTSYZJL-UHFFFAOYSA-N 0.000 description 1
- JUUJTYPMICHIEM-UHFFFAOYSA-N 1,4-bis(ethylamino)anthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C(NCC)=CC=C2NCC JUUJTYPMICHIEM-UHFFFAOYSA-N 0.000 description 1
- OZQQAZPMNWJRDQ-UHFFFAOYSA-N 1,4-dihydroxy-5,8-bis(4-methylanilino)anthracene-9,10-dione Chemical compound C1=CC(C)=CC=C1NC(C=1C(=O)C2=C(O)C=CC(O)=C2C(=O)C=11)=CC=C1NC1=CC=C(C)C=C1 OZQQAZPMNWJRDQ-UHFFFAOYSA-N 0.000 description 1
- ZKIVUFFTMWIBCO-UHFFFAOYSA-N 1,5-bis(4-methylanilino)anthracene-9,10-dione Chemical compound C1=CC(C)=CC=C1NC1=CC=CC2=C1C(=O)C1=CC=CC(NC=3C=CC(C)=CC=3)=C1C2=O ZKIVUFFTMWIBCO-UHFFFAOYSA-N 0.000 description 1
- GBAJQXFGDKEDBM-UHFFFAOYSA-N 1-(methylamino)-4-(3-methylanilino)anthracene-9,10-dione Chemical compound C1=2C(=O)C3=CC=CC=C3C(=O)C=2C(NC)=CC=C1NC1=CC=CC(C)=C1 GBAJQXFGDKEDBM-UHFFFAOYSA-N 0.000 description 1
- ITYXXSSJBOAGAR-UHFFFAOYSA-N 1-(methylamino)-4-(4-methylanilino)anthracene-9,10-dione Chemical compound C1=2C(=O)C3=CC=CC=C3C(=O)C=2C(NC)=CC=C1NC1=CC=C(C)C=C1 ITYXXSSJBOAGAR-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- VKCMZEUOQWUNAR-UHFFFAOYSA-N 2,2-bis(2,4-ditert-butyl-6-methylphenyl)ethyl dihydrogen phosphite Chemical compound CC1=CC(C(C)(C)C)=CC(C(C)(C)C)=C1C(COP(O)O)C1=C(C)C=C(C(C)(C)C)C=C1C(C)(C)C VKCMZEUOQWUNAR-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 1
- VTFXHGBOGGGYDO-UHFFFAOYSA-N 2,4-bis(dodecylsulfanylmethyl)-6-methylphenol Chemical compound CCCCCCCCCCCCSCC1=CC(C)=C(O)C(CSCCCCCCCCCCCC)=C1 VTFXHGBOGGGYDO-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- GHNBXRQAFVCOJI-UHFFFAOYSA-N 2-[2-[1-[2-hydroxy-3,5-bis(2-methylbutan-2-yl)phenyl]ethyl]-4,6-bis(2-methylbutan-2-yl)phenyl]prop-2-enoic acid Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(C(C)C=2C(=C(C=C(C=2)C(C)(C)CC)C(C)(C)CC)C(=C)C(O)=O)=C1O GHNBXRQAFVCOJI-UHFFFAOYSA-N 0.000 description 1
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- TVWGHFVGFWIHFN-UHFFFAOYSA-N 2-hexadecan-2-yl-4,6-dimethylphenol Chemical compound CCCCCCCCCCCCCCC(C)C1=CC(C)=CC(C)=C1O TVWGHFVGFWIHFN-UHFFFAOYSA-N 0.000 description 1
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- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- UJTRCPVECIHPBG-UHFFFAOYSA-N 3-cyclohexylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C2CCCCC2)=C1 UJTRCPVECIHPBG-UHFFFAOYSA-N 0.000 description 1
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 1
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- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
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- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
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- 229910052717 sulfur Inorganic materials 0.000 description 1
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- 229960000984 tocofersolan Drugs 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/07—Aldehydes; Ketones
- C08K5/08—Quinones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
초기의 균일면 발광성이 뛰어나고 또한 장기적인 균일면 발광성이 뛰어난 스티렌계 수지 조성물 및 광학 부품을 제공한다.
(a)스티렌계 수지와, (b)인계 산화 방지제 및/또는 페놀계 산화 방지제와 (c)안트라퀴논계 화합물을 포함하고,
스티렌계 수지 조성물 100질량% 중의 상기 (b)의 함유량은 0.02 ~ 1질량%이며,
수지 성분 전체 질량에 대한 상기 (c)의 함유량은 0.1 ~ 90ppb인 것을 특징으로 하는 광학용 스티렌계 수지 조성물.It provides a styrenic resin composition and optical component excellent in initial uniform surface luminescence and long-term uniform surface luminescence.
(a) a styrene resin, (b) a phosphorus antioxidant and/or a phenolic antioxidant, and (c) an anthraquinone compound,
The content of (b) in 100% by mass of the styrene resin composition is 0.02 to 1% by mass,
The content of (c) relative to the total mass of the resin component is 0.1 to 90 ppb, characterized in that the optical styrenic resin composition.
Description
본 발명은 광학용 스티렌계 수지 조성물 및 광학 부품에 관한 것이다.The present invention relates to an optical styrene resin composition and an optical component.
스티렌계 수지는 투명성, 강성, 저흡수성, 치수 안정성 등의 특성이 뛰어나고, 성형 가공성이 뛰어나 사출 성형, 압출 성형, 블로우 성형 등의 각종 성형 방법에 의해 전기 제품이나 각종 공업 재료, 식품 포장 용기, 잡화 등으로 널리 사용되고 있다. 또한 투명성을 살린 용도로 도광판 등의 광학 부재에도 사용되고 있다.Styrene resins have excellent properties such as transparency, stiffness, low water absorption, and dimensional stability, and excellent molding processability. Electrical products, various industrial materials, food packaging containers, and miscellaneous goods are made by various molding methods such as injection molding, extrusion molding, and blow molding. It is widely used as such. In addition, it is used for optical members such as light guide plates for the purpose of utilizing transparency.
액정 디스플레이의 백라이트에는 광원을 표시 장치의 정면에 배치하는 직하형 백라이트와 측면에 배치하는 엣지 라이트형 백라이트가 있다. 도광판은 엣지 라이트형 백라이트에 삽입되어, 측면에서의 빛을 액정 패널에 유도하는 역할을 하고, TV, 데스크톱 개인용 컴퓨터의 모니터, 노트북형 개인용 컴퓨터, 휴대폰, 카네비게이션(car navigation) 등 다양한 용도로 사용된다. 이러한 도광판에 사용되는 스티렌계 수지 조성물로, 장기간의 사용에도 투과율의 변화가 작은 스티렌계 수지 조성물이 특허문헌 1에 기재되어 있다.The backlight of a liquid crystal display includes a direct type backlight in which a light source is disposed in front of the display device and an edge light type backlight in which a light source is disposed in a side surface. The light guide plate is inserted into the edge light type backlight and serves to guide the light from the side to the liquid crystal panel, and is used for various purposes such as TV, desktop personal computer monitor, notebook type personal computer, mobile phone, car navigation, etc. do. As a styrene resin composition used for such a light guide plate, a styrene resin composition having a small change in transmittance even when used for a long period of time is described in Patent Document 1.
그러나, 상기 문헌에 기재된 종래 기술에는, 장기간의 사용에 있어서의 투과율의 변화를 억제할 수 있지만, 균일면 발광성 및 장기적인 균일면 발광성이 충분하지 않은 문제가 있었다.However, in the prior art described in the above document, a change in transmittance in long-term use can be suppressed, but there is a problem in that the uniform surface luminescence property and the long-term uniform surface luminescence property are insufficient.
본 발명은 상기 사정을 감안하여 이루어진 것이며, 초기의 균일면 발광성이 뛰어나고 또한 장기적인 균일면 발광성이 뛰어난 스티렌계 수지 조성물 및 광학 부품을 제공하는 과제를 달성하는 것을 목적으로 한다.The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a styrenic resin composition and optical component having excellent initial uniform surface luminescence and long-term uniform surface luminescence.
본 발명에 의하면, (a)스티렌계 수지와, (b)인계 산화 방지제 및/또는 페놀계 산화 방지제와 (c)안트라퀴논계 화합물을 포함하고, 스티렌계 수지 조성물 100질량% 중의 상기 (b)의 함유량은 0.02 ~ 1질량%이며, 수지 성분 전체 질량에 대한 상기 (c)의 함유량은 0.1 ~ 90ppb인 것을 특징으로 하는 광학용 스티렌계 수지 조성물이 제공된다.According to the present invention, (a) a styrene resin, (b) a phosphorus antioxidant and/or a phenolic antioxidant, and (c) an anthraquinone compound, and the above (b) in 100% by mass of the styrene resin composition The content of (c) is from 0.02 to 1% by mass, and the content of (c) with respect to the total mass of the resin component is from 0.1 to 90 ppb. A styrene resin composition for optics is provided.
본 발명자들은 상기 과제를 달성하기 위해 예의 연구를 진행한 결과, 특정량의 인계 산화 방지제 및/또는 페놀계 산화 방지제와, 안트라퀴논계 화합물을 병용하는 것에 의해, 상기 목적이 달성되는 것을 발견하고, 본 발명의 완성에 이르렀다.The present inventors have conducted extensive research in order to achieve the above object, and found that the above object is achieved by using a specific amount of a phosphorus antioxidant and/or a phenolic antioxidant in combination with an anthraquinone compound, The present invention has been completed.
이하, 본 발명의 다양한 실시 형태를 예시한다. 다음과 같은 다양한 실시 형태는 서로 조합 가능하다.Hereinafter, various embodiments of the present invention will be illustrated. The following various embodiments can be combined with each other.
바람직하게는 광로 길이 115mm에서의 파장 380nm ~ 780nm의 평균 투과율이 80% 이상이다(단, 상기 평균 투과율은 실린더 온도 230℃, 금형 온도 50℃에서 사출 성형을 실시하여 얻은 127 × 127 × 3mm 두께의 판 형상 성형품에서 115 × 85 × 3mm 두께의 시험편을 잘라 내어, 단면을 버프 연마에 의해 연마하여 작성한 단면에 경면을 갖는 시험편을 사용하여 측정한다).Preferably, the average transmittance at a wavelength of 380 nm to 780 nm at a length of 115 mm is 80% or more (however, the average transmittance is 127 × 127 × 3 mm thick obtained by injection molding at a cylinder temperature of 230°C and a mold temperature of 50°C. A test piece having a thickness of 115 × 85 × 3 mm is cut out from a plate-shaped molded article, and the cross section is polished by buffing, and the resulting cross section is measured using a test piece having a mirror surface).
바람직하게는 파장 480nm의 투과율(t480)과 파장 580nm의 투과율(t580)의 비율이 이하의 관계이다.Preferably, the ratio of the transmittance at a wavelength of 480 nm (t480) to the transmittance at a wavelength of 580 nm (t580) is in the following relationship.
0.96 < t580/t480 < 1.040.96 <t580/t480 <1.04
바람직하게는 (a)스티렌계 수지와, (b)인계 산화 방지제 및/또는 페놀계 산화 방지제와 (c)안트라퀴논계 화합물을 포함하고, 스티렌계 수지 조성물 100질량% 중의 상기 (b)의 함유량은 0.02 ~ 1질량%이며, 광로 길이 115mm에서의 파장 380nm ~ 780nm의 평균 투과율이 80% 이상이며(단, 상기 평균 투과율은 실린더 온도 230℃, 금형 온도 50℃에서 사출 성형을 실시하여 얻은 127 × 127 × 3mm 두께의 판 형상 성형품에서 115 × 85 × 3mm 두께의 시험편을 잘라 내어, 단면을 버프 연마에 의해 연마하여 작성한 단면에 경면을 갖는 시험편을 사용하여 측정함), 파장 480nm의 투과율(t480)과 파장 580nm의 투과율(t580)의 비율이 이하의 관계이다.Preferably (a) a styrene resin, (b) a phosphorus antioxidant and/or a phenolic antioxidant and (c) an anthraquinone compound, and the content of (b) in 100% by mass of the styrene resin composition Is 0.02 to 1 mass%, and the average transmittance at a wavelength of 380 nm to 780 nm at a length of 115 mm is 80% or more (however, the average transmittance is 127 × obtained by injection molding at a cylinder temperature of 230°C and a mold temperature of 50°C. A test piece with a thickness of 115 × 85 × 3 mm is cut out from a 127 × 3 mm thick plate-shaped molded product, and the cross section is polished by buffing, and measured using a test piece having a mirror surface on the prepared cross section), transmittance at a wavelength of 480 nm (t480) The ratio of the transmittance (t580) to the wavelength of 580 nm is the following relationship.
0.96 < t580/t480 < 1.040.96 <t580/t480 <1.04
바람직하게는 상기 광학용 스티렌계 수지 조성물로 이루어지는 광학 부품.An optical component preferably made of the above optical styrene resin composition.
본 발명의 내열 스티렌계 수지 조성물은 초기의 균일면 발광성이 뛰어나고 또한 장기적인 균일면 발광성이 뛰어난 스티렌계 수지 조성물 및 광학 부품을 얻을 수 있다.The heat-resistant styrenic resin composition of the present invention can obtain a styrenic resin composition and an optical component having excellent initial uniform surface luminescence and long-term uniform surface luminescence.
이하, 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail.
<<스티렌계 수지>><<Styrene resin>>
본 발명의 스티렌계 수지는 스티렌계 단량체를 중합하여 얻을 수 있다. 스티렌계 단량체는 방향족 비닐계 모노머인 스티렌, α-메틸스티렌, o-메틸스티렌, p-메틸스티렌, m-메틸스티렌, 에틸스티렌, p-t-부틸스티렌 등의 단독 또는 2종 이상의 혼합물이고, 바람직하게는 스티렌이다. 또한, 본 발명의 특징을 손상시키지 않는 범위에서 스티렌계 단량체와 공중합 가능한 단량체와 공중합하여도 되고, 예를 들면, 아크릴산, 메타크릴산 등의 (메트)아크릴산류, 아크릴로니트릴, 메타크릴로니트릴 등의 시안화 비닐 모노머나, 무수 말레산, 푸마르산 등의 α,β-에틸렌 불포화 카르복시산류, 페닐말레이미드, 시클로헥실말레이미드 등의 이미드계 모노머류를 들 수 있다. 또한, 이들 중에서도 스티렌계 단량체만으로 이루어진 중합체가 바람직하고, 특히 스티렌 호모 폴리머가 바람직하다.The styrenic resin of the present invention can be obtained by polymerizing a styrenic monomer. The styrene-based monomer is an aromatic vinyl-based monomer such as styrene, α-methylstyrene, o-methylstyrene, p-methylstyrene, m-methylstyrene, ethylstyrene, pt-butylstyrene, and the like, or a mixture of two or more, preferably Is styrene. In addition, it may be copolymerized with a monomer copolymerizable with a styrene-based monomer within the range not impairing the characteristics of the present invention. For example, (meth)acrylic acids such as acrylic acid and methacrylic acid, acrylonitrile, and methacrylonitrile Vinyl cyanide monomers such as, and α,β-ethylenically unsaturated carboxylic acids such as maleic anhydride and fumaric acid, and imide-based monomers such as phenylmaleimide and cyclohexylmaleimide. In addition, among these, a polymer composed of only a styrene-based monomer is preferable, and a styrene homopolymer is particularly preferable.
스티렌계 수지 조성물은 스티렌계 수지와 각종 첨가제로 구성되는 것이 바람직하고, 스티렌계 수지 조성물 100질량% 중 스티렌계 수지의 비율은, 예를 들어 90 ~ 99.96질량% 이며, 95 ~ 99.96질량%가 바람직하다. 스티렌계 수지의 비율은 구체적으로 예를 들면, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 99.96질량%이며, 여기에서 예시된 수치의 어느 2개 사이의 범위 내여도 된다.The styrenic resin composition is preferably composed of a styrenic resin and various additives, and the ratio of the styrenic resin in 100% by mass of the styrenic resin composition is, for example, 90 to 99.96% by mass, preferably 95 to 99.96% by mass. Do. The proportion of the styrenic resin is specifically, for example, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 99.96% by mass, and within the range between any two of the numerical values exemplified herein. You can open it.
스티렌계 수지가 스티렌계 단량체와 (메트)아크릴산을 공중합하여 얻어지는 스티렌-(메트)아크릴산 공중합 수지인 경우, 스티렌계 수지의 스티렌계 단량체 단위의 함유량이 80.0 ~ 99.9질량%, (메트)아크릴산 단위의 함유량이 0.1 ~ 20.0질량%인 것이 바람직하다. 단, 스티렌계 단량체 단위와 (메트)아크릴산 단위의 함유량의 합계를 100질량%로 한다. (메트)아크릴산은 아크릴산, 메타크릴산 등이며, 메타크릴산이 바람직하다.When the styrene-based resin is a styrene-(meth)acrylic acid copolymer resin obtained by copolymerizing a styrene-based monomer and (meth)acrylic acid, the content of the styrene-based monomer unit of the styrene-based resin is 80.0 to 99.9% by mass, and the (meth)acrylic acid unit is It is preferable that the content is 0.1 to 20.0 mass%. However, the total of the content of the styrene-based monomer unit and the (meth)acrylic acid unit is set to 100% by mass. (Meth)acrylic acid is acrylic acid, methacrylic acid, etc., and methacrylic acid is preferable.
스티렌계 수지 중의 (메트)아크릴산 단위 함유량의 측정은 실온에서 실시한다. 스티렌계 수지 0.5g을 칭량하고, 톨루엔/에탄올 = 8/2(체적비)의 혼합 용액에 용해시킨 후, 수산화 칼륨 0.1mol/L 에탄올 용액으로 중화 적정하고, 종점을 검출하고, 수산화 칼륨 에탄올 용액의 사용량으로, (메트)아크릴산 단위의 질량 기준의 함유량을 산출한다. 한편, 전위차 자동적정장치를 사용할 수 있고, 교토 전자공업 가부시키가이샤(京都電子工業株式會社)제 AT-510에 의해 측정할 수 있다. 스티렌계 수지 중의 (메트)아크릴산 단위의 함유량은, 스티렌계 수지의 중합시의 원료의 스티렌계 단량체와 (메트)아크릴산 단량체의 조성비에 의해 조정할 수 있지만, 상용(相溶)하는 범위에서 (메트)아크릴산 단위를 함유하는 스티렌계 수지와 (메트)아크릴산 단위를 함유하지 않는 스티렌계 수지를 배합하여 조정할 수도 있다.The measurement of the content of the (meth)acrylic acid unit in the styrene resin is performed at room temperature. 0.5 g of styrene resin was weighed, dissolved in a mixed solution of toluene/ethanol = 8/2 (volume ratio), neutralized and titrated with 0.1 mol/L ethanol solution of potassium hydroxide, and the end point was detected, and the potassium hydroxide ethanol solution As the amount used, the content based on the mass of the (meth)acrylic acid unit is calculated. On the other hand, an automatic potential difference titration device can be used, and measurement can be performed by AT-510 manufactured by Kyoto Electronics Co., Ltd. (Kyoto Electric Industries Co., Ltd.). The content of the (meth)acrylic acid unit in the styrene-based resin can be adjusted by the composition ratio of the styrene-based monomer and the (meth)acrylic acid monomer as a raw material at the time of polymerization of the styrene-based resin, but within a compatible range (meth) A styrene resin containing an acrylic acid unit and a styrene resin not containing a (meth)acrylic acid unit may be mixed and adjusted.
스티렌계 수지의 중합 방법으로서는, 괴상(塊狀) 중합법, 용액 중합법, 현탁 중합법, 유화 중합법 등 공지된 스티렌 중합 방법을 들 수 있다. 품질면이나 생산성 면에서는, 괴상 중합법, 용액 중합법이 바람직하고, 연속 중합하는 것이 바람직하다. 용매로서 예를 들면 벤젠, 톨루엔, 에틸벤젠 및 크실렌 등의 알킬 벤젠류나, 아세톤이나 메틸에틸케톤 등의 케톤류, 헥산이나 시클로헥산 등의 지방족 탄화수소 등을 사용할 수 있다.As the polymerization method of the styrene-based resin, a known styrene polymerization method such as a bulk polymerization method, a solution polymerization method, a suspension polymerization method, and an emulsion polymerization method may be mentioned. From the viewpoint of quality and productivity, the bulk polymerization method and the solution polymerization method are preferable, and continuous polymerization is preferable. As the solvent, for example, alkyl benzenes such as benzene, toluene, ethylbenzene and xylene, ketones such as acetone and methylethylketone, aliphatic hydrocarbons such as hexane and cyclohexane, and the like can be used.
스티렌계 수지의 중합시에, 필요에 따라 중합 개시제, 연쇄 이동제를 사용할 수 있다. 중합 개시제로서는, 라디칼 중합 개시제가 바람직하고, 공지된 관용의 예를 들면, 1,1-디(t-부틸퍼옥시)시클로헥산, 2,2-디(t-부틸퍼옥시)부탄, 2,2-디(4,4-디-t-부틸퍼옥시시클로헥실)프로판, 1,1-디(t-아밀퍼옥시)시클로헥산 등의 퍼옥시케탈류, 쿠멘히드로퍼옥사이드, t-부틸히드로퍼옥사이드 등의 히드로퍼옥사이드류, t-부틸퍼옥시아세테이트, t-아밀퍼옥시이소노나노에이트 등의 알킬퍼옥사이드류, t-부틸쿠밀퍼옥사이드, 디-t-부틸퍼옥사이드, 디쿠밀퍼옥사이드, 디-t-헥실퍼옥사이드 등의 디알킬퍼옥사이드류, t-부틸퍼옥시아세테이트, t-부틸퍼옥시벤조에이트, t-부틸퍼옥시이소프로필모노카보네이트 등의 퍼옥시에스테르류, t-부틸퍼옥시이소프로필카보네이트, 폴리에테르테트라키스(t-부틸퍼옥시카보네이트) 등의 퍼옥시카보네이트류, N,N'-아조비스(시클로헥산-1-카르보니트릴), N,N'-아조비스(2-메틸부티로니트릴), N,N'-아조비스(2,4-디메틸발레로니트릴), N,N'-아조비스[2-(히드록시메틸)프로피오니트릴] 등을 들 수 있고, 이들의 1종 혹은 2종 이상을 조합시켜 사용할 수 있다. 연쇄 이동제로서는, 지방족 메르캅탄, 방향족 메르캅탄, 펜타페닐에탄, α-메틸스티렌 다이머 및 테르피놀렌 등을 들 수 있다. In the polymerization of the styrenic resin, a polymerization initiator and a chain transfer agent may be used as necessary. As the polymerization initiator, a radical polymerization initiator is preferable, and known and common examples include 1,1-di(t-butylperoxy)cyclohexane, 2,2-di(t-butylperoxy)butane, 2, Peroxy ketals such as 2-di(4,4-di-t-butylperoxycyclohexyl)propane, 1,1-di(t-amylperoxy)cyclohexane, cumene hydroperoxide, t-butyl hydro Hydroperoxides such as peroxide, alkyl peroxides such as t-butylperoxyacetate, t-amylperoxyisononanoate, t-butylcumylperoxide, di-t-butylperoxide, dicumylperoxide, Dialkyl peroxides such as di-t-hexyl peroxide, peroxy esters such as t-butylperoxyacetate, t-butylperoxybenzoate, t-butylperoxyisopropylmonocarbonate, t-butylper Peroxy carbonates such as oxyisopropyl carbonate and polyether tetrakis (t-butyl peroxy carbonate), N,N'-azobis (cyclohexane-1-carbonitrile), N,N'-azobis (2 -Methylbutyronitrile), N,N'-azobis(2,4-dimethylvaleronitrile), N,N'-azobis[2-(hydroxymethyl)propionitrile], etc. are mentioned, These can be used alone or in combination of two or more. Examples of the chain transfer agent include aliphatic mercaptan, aromatic mercaptan, pentaphenylethane, α-methylstyrene dimer and terpinolene.
연속 중합의 경우, 먼저 중합 공정에서 공지된 완전 혼합조형(混合槽型) 교반조나 탑형 반응기 등을 사용하고, 목표 분자량, 분자량 분포, 반응 전화율이 되도록, 중합 온도 조정 등에 의해 중합 반응이 제어된다. 중합 공정을 거친 중합체를 포함하는 중합 용액은, 탈휘(脫揮) 공정으로 이송되고, 미반응의 단량체 및 중합 용매가 제거된다. 탈휘 공정은 가열기가 부착된 진공 탈휘조나 벤트가 부착된 탈휘 압출기 등으로 구성된다. 탈휘 공정을 거친 용융 상태의 중합체는 조립 공정으로 이송된다. 조립 공정에서는, 다공 다이로부터 스트랜드 형상으로 용융 수지를 압출하고, 콜드 컷 방식이나 공중 핫 컷 방식, 수중 핫 컷 방식으로 펠렛 형상으로 가공된다.In the case of continuous polymerization, first, a known complete mixing tank type stirring tank or tower type reactor is used in the polymerization process, and the polymerization reaction is controlled by adjusting the polymerization temperature so that the target molecular weight, molecular weight distribution, and reaction conversion rate are achieved. The polymerization solution containing the polymer that has passed through the polymerization process is transferred to a devolatilization process, and unreacted monomers and polymerization solvents are removed. The devolatilization process consists of a vacuum devolatilizer with a heater or a devolatilization extruder with a vent. The molten polymer that has gone through the devolatilization process is transferred to the granulation process. In the granulation process, the molten resin is extruded from a porous die into a strand shape, and processed into a pellet shape by a cold cut method, an air hot cut method, or an underwater hot cut method.
<<인계 산화 방지제/페놀계 산화 방지제>><<Phosphorous antioxidant/phenolic antioxidant>>
본 발명의 스티렌계 수지 조성물은 인계 산화 방지제 및 페놀계 산화 방지제 중 적어도 하나를 필수 성분으로 함유한다. 바람직하게는 인계 산화 방지제 및 페놀계 산화 방지제를 모두 함유한다.The styrenic resin composition of the present invention contains at least one of a phosphorus antioxidant and a phenolic antioxidant as an essential component. Preferably it contains both a phosphorus antioxidant and a phenolic antioxidant.
인계 산화 방지제는 스티렌계 수지 조성물 100질량% 중 0.02 ~ 1질량% 함유하는 것이 바람직하고, 0.02 ~ 0.50질량% 함유하는 것이 보다 바람직하고, 0.02 ~ 0.30질량% 함유하는 것이 더욱 바람직하다. 또한, 페놀계 산화 방지제는 스티렌계 수지 조성물 100질량% 중 0.02 ~ 1질량% 함유하는 것이 바람직하고, 0.02 ~ 0.50질량% 함유하는 것이 보다 바람직하고, 0.02 ~ 0.30질량% 함유하는 것이 더욱 바람직하다. 인계 또는 페놀계 산화 방지제를 상기 함유량으로 첨가한 경우, 장기적인 균일면 발광성이 뛰어나기 때문이다. 스티렌계 수지 조성물 100질량% 중의 인계 산화 방지제 및 페놀계 산화 방지제의 함유량은 각각 구체적으로 예를 들면, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08이며, 0.09, 0.10, 0.15, 0.20, 0.25, 0.30, 0.35, 0.40, 0.45, 0.50, 0.55, 0.60, 0.65, 0.70, 0.75, 0.80, 0.85, 0.90, 0.95, 1질량%이며, 여기에서 예시된 수치의 어느 2개 사이의 범위 내여도 된다.The phosphorus antioxidant is preferably contained in an amount of 0.02 to 1% by mass, more preferably 0.02 to 0.50% by mass, and still more preferably 0.02 to 0.30% by mass in 100% by mass of the styrene resin composition. In addition, the phenolic antioxidant is preferably contained in an amount of 0.02 to 1% by mass, more preferably 0.02 to 0.50% by mass, and even more preferably 0.02 to 0.30% by mass in 100% by mass of the styrene resin composition. This is because when a phosphorus-based or phenol-based antioxidant is added in the above content, long-term uniform surface luminescence is excellent. The content of the phosphorus antioxidant and the phenolic antioxidant in 100% by mass of the styrene resin composition is specifically, for example, 0.02, 0.03, 0.04, 0.05, 0.06, 0.07, 0.08, 0.09, 0.10, 0.15, 0.20, 0.25 , 0.30, 0.35, 0.40, 0.45, 0.50, 0.55, 0.60, 0.65, 0.70, 0.75, 0.80, 0.85, 0.90, 0.95, 1 mass%, and may be in the range between any two of the numerical values exemplified herein.
인계 산화 방지제란, 3가의 인화합물인 아인산 에스테르류이다. 인계 산화 방지제는, 예를 들면, 트리스(2,4-디-tert-부틸페닐)포스파이트, 2,2'-메틸렌비스(4,6-디-tert-부틸-1-페닐옥시)(2-에틸헥실옥시)포스포러스, 비스(2,4-디쿠밀페닐)펜타에리트리톨디포스파이트, 4,4'-비페닐렌디포스핀산테트라키스(2,4-디-tert-부틸페닐), 3,9-비스(2,6-디-tert-부틸-4-메틸페녹시)-2,4,8,10-테트라옥사-3,9-디포스파스피로[5.5]운데칸, 사이클릭네오펜탄테트라일비스(2,4-디-t-부틸페닐포스파이트), 디스테아릴펜타에리트리톨디포스파이트, 비스(노닐페닐)펜타에리트리톨디포스파이트, 비스-[2-메틸-4,6-비스-(1,1-디메틸에틸)페닐]에틸포스파이트, 9,10-디히드로-9-옥사-10-포스파페난트렌-10-옥사이드, 테트라키스(2,4-디-tert-부틸-5-메틸페닐)-4,4'-비페닐렌디포스포나이트 등을 들 수 있다. 인계 산화 방지제로서는, 내가수분해성이 뛰어난 것이 바람직하고, 트리스(2,4-디-tert-부틸페닐)포스파이트, 2,2'-메틸렌비스(4,6-디-tert-부틸-1-페닐옥시)(2-에틸헥실옥시)포스포러스, 비스(2,4-디쿠밀페닐)펜타에리트리톨디포스파이트, 3,9-비스(2,6-디-tert-부틸-4-메틸페녹시)-2,4,8,10-테트라옥사-3,9-디포스파스피로[5.5]운데칸인 것이 바람직하다. 특히 바람직하게는, 트리스(2,4-디-tert-부틸페닐)포스파이트이다. 인계 산화 방지제는, 단독이어도 되지만 2종 이상을 병용하여도 된다. Phosphorus antioxidants are phosphorous acid esters which are trivalent phosphorus compounds. Phosphorous antioxidants are, for example, tris(2,4-di-tert-butylphenyl)phosphite, 2,2'-methylenebis(4,6-di-tert-butyl-1-phenyloxy)(2 -Ethylhexyloxy) phosphorus, bis (2,4-dicumylphenyl) pentaerythritol diphosphite, 4,4'-biphenylenediphosphinic acid tetrakis (2,4-di-tert-butylphenyl) , 3,9-bis(2,6-di-tert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane, cyclic Neopentanetetraylbis(2,4-di-t-butylphenylphosphite), distearylpentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, bis-[2-methyl-4,6 -Bis-(1,1-dimethylethyl)phenyl]ethylphosphite, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, tetrakis(2,4-di-tert- Butyl-5-methylphenyl)-4,4'-biphenylenediphosphonite, and the like. As the phosphorus antioxidant, those excellent in hydrolysis resistance are preferable, and tris(2,4-di-tert-butylphenyl)phosphite, 2,2'-methylenebis(4,6-di-tert-butyl-1- Phenyloxy) (2-ethylhexyloxy) phosphorus, bis (2,4-dicumylphenyl) pentaerythritol diphosphite, 3,9-bis (2,6-di-tert-butyl-4-methylphenoxy) Si)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane is preferred. Particularly preferably, it is tris(2,4-di-tert-butylphenyl)phosphite. Phosphorus antioxidants may be used alone, but may be used in combination of two or more.
페놀계 산화 방지제란, 기본 골격에 페놀성 수산기를 가지는 산화 방지제이다. 페놀계 산화 방지제는, 예를 들면, 옥타데실-3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트, 3,9-비스[2-[3-(3-tert-부틸-4-히드록시-5-메틸페닐)프로피오닐옥시]-1,1-디메틸에틸]-2,4,8,10-테트라옥사스피로[5.5]운데칸, 에틸렌비스(옥시에틸렌)비스[3-(5-tert-부틸-4-히드록시-m-톨릴)프로피오네이트], 4,6-비스(옥틸티오메틸)-o-크레졸, 4,6-비스[(도데실티오)메틸]-o-크레졸, 2,4-디메틸-6-(1-메틸펜타데실)페놀, 펜타에리트리톨테트라키스[3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트], DL-α-토코페롤, 2-t-부틸-6-(3-t-부틸-2-히드록시-5-메틸벤질)-4-메틸페닐아크릴레이트, 2-[1-(2-히드록시-3,5-디-t-펜틸페닐)에틸]-4,6-디-t-펜틸페닐아크릴레이트, 4,4'-티오비스(6-t-부틸-3-메틸페놀), 1,1,3-트리스(2-메틸-4-히드록시-5-t-부틸페닐)부탄, 4,4'-부틸리덴비스(3-메틸-6-t-부틸페놀), 비스-[3,3-비스-(4'-히드록시-3'-tert-부틸페닐)-부탄산]-글리콜 에스테르 등을 들 수 있다. 바람직하게는, 옥타데실-3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트, 3,9-비스[2-[3-(3-tert-부틸-4-히드록시-5-메틸페닐)프로피오닐옥시]-1,1-디메틸에틸]-2,4,8,10-테트라옥사스피로[5.5]운데칸, 에틸렌비스(옥시에틸렌)비스[3-(5-tert-부틸-4-히드록시-m-톨릴)프로피오네이트], 펜타에리트리톨테트라키스[3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트]이다. 페놀계 산화 방지제는, 단독으로 사용하여도 되지만 2종 이상을 병용하여도 된다. A phenolic antioxidant is an antioxidant having a phenolic hydroxyl group in a basic skeleton. Phenolic antioxidants are, for example, octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 3,9-bis[2-[3-(3- tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, ethylenebis(oxyethylene)bis [3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], 4,6-bis(octylthiomethyl)-o-cresol, 4,6-bis[(dodecylthio) Methyl]-o-cresol, 2,4-dimethyl-6-(1-methylpentadecyl)phenol, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)pro Cypionate], DL-α-tocopherol, 2-t-butyl-6-(3-t-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenylacrylate, 2-[1-(2- Hydroxy-3,5-di-t-pentylphenyl)ethyl]-4,6-di-t-pentylphenylacrylate, 4,4'-thiobis(6-t-butyl-3-methylphenol), 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, 4,4'-butylidenebis(3-methyl-6-t-butylphenol), bis- [3,3-bis-(4'-hydroxy-3'-tert-butylphenyl)-butanoic acid]-glycol ester, etc. are mentioned. Preferably, octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 3,9-bis[2-[3-(3-tert-butyl-4- Hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, ethylenebis(oxyethylene)bis[3-(5- tert-butyl-4-hydroxy-m-tolyl)propionate], pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]. Phenolic antioxidants may be used alone, but may be used in combination of two or more.
상기와 같이 인계 산화 방지제 및 페놀계 산화 방지제로는 매우 다양하지만, 그 중에서도 인계 산화 방지제가 이하에 나타내는 (B1-1) ~ (B1-4) 중에서 선택되는 적어도 1종이며, 페놀계 산화 방지제가 이하에 나타내는 (B2-1) ~ (B2-4) 중에서 선택되는 1종 이상인 것이 특히 바람직하다.As described above, there are a wide variety of phosphorus antioxidants and phenolic antioxidants, but among them, phosphorus antioxidants are at least one selected from (B1-1) to (B1-4) shown below, and phenolic antioxidants It is particularly preferably one or more selected from (B2-1) to (B2-4) shown below.
(B1-1) 트리스(2,4-디-tert-부틸페닐)포스파이트(B1-1) Tris (2,4-di-tert-butylphenyl) phosphite
(B1-2) 2,2'-메틸렌비스(4,6-디-tert-부틸-1-페닐옥시)(2-에틸헥실옥시)포스포러스(B1-2) 2,2'-methylenebis(4,6-di-tert-butyl-1-phenyloxy)(2-ethylhexyloxy)phosphorus
(B1-3) 비스(2,4-디쿠밀페닐)펜타에리트리톨디포스파이트(B1-3) Bis (2,4-dicumylphenyl) pentaerythritol diphosphite
(B1-4) 3,9-비스(2,6-디-tert-부틸-4-메틸페녹시)-2,4,8,10-테트라옥사-3,9-디포스파스피로[5.5]운데칸(B1-4) 3,9-bis(2,6-di-tert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5] Cannes
(B2-1) 옥타데실-3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트(B2-1) Octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate
(B2-2) 3,9-비스[2-[3-(3-tert-부틸-4-히드록시-5-메틸페닐)프로피오닐옥시]-1,1-디메틸에틸]-2,4,8,10-테트라옥사스피로[5.5]운데칸(B2-2) 3,9-bis[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy]-1,1-dimethylethyl]-2,4,8 ,10-tetraoxaspiro[5.5]undecane
(B2-3) 에틸렌비스(옥시에틸렌)비스[3-(5-tert-부틸-4-히드록시-m-톨릴)프로피오네이트](B2-3) Ethylenebis(oxyethylene)bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate]
(B2-4) 펜타에리트리톨테트라키스[3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트](B2-4) pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]
인계 산화 방지제 및 페놀계 산화 방지제의 첨가 방법으로서는, 스티렌계 수지의 중합 공정, 탈휘 공정, 조립 공정에서 첨가 혼합하는 방법이나 성형 가공시의 압출기나 사출 성형기 등으로 첨가 혼합하는 방법, 친수성 첨가제를 고농도로 조정한 수지 조성물을 무첨가의 스티렌계 수지에 의해 원하는 함유량으로 희석 혼합하는 방법 등을 들 수 있고, 특별히 한정되는 것이 아니다.As a method of adding a phosphorus antioxidant and a phenolic antioxidant, a method of adding and mixing a styrene resin in a polymerization process, a devolatilization process, a granulation process, an extruder or injection molding machine during molding processing, and a high concentration of a hydrophilic additive. A method of diluting and mixing the resin composition adjusted to at a desired content with an additive-free styrene resin, etc. are mentioned, and it is not particularly limited.
<<안트라퀴논계 화합물>><<Anthraquinone compound>>
본 발명의 스티렌계 수지 조성물은 안트라퀴논계 화합물을 필수 성분으로 함유한다. 스티렌계 수지 조성물 중의 수지 성분 전체 질량에 대한 안트라퀴논계 화합물의 함유량은 0.1 ~ 90ppb가 바람직하고, 1 ~ 70ppb가 보다 바람직하고, 5 ~ 50ppb가 더욱 바람직하고, 15 ~ 45ppb가 특히 바람직하다. 안트라퀴논계 화합물을 상기 함유량으로 첨가한 경우, 초기 및 장기적인 균일면 발광성이 뛰어나기 때문이다. 상기 안트라퀴논계 화합물의 함유량은 구체적으로 예를 들면, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90ppb이며, 여기에서 예시된 수치의 어느 2개 사이의 범위 내여도 된다.The styrenic resin composition of the present invention contains an anthraquinone compound as an essential component. The content of the anthraquinone compound relative to the total mass of the resin component in the styrene resin composition is preferably 0.1 to 90 ppb, more preferably 1 to 70 ppb, still more preferably 5 to 50 ppb, and particularly preferably 15 to 45 ppb. This is because when the anthraquinone-based compound is added in the above content, the initial and long-term uniform surface luminescence is excellent. The content of the anthraquinone compound is specifically, for example, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90 ppb, and may be within the range between any two of the numerical values exemplified herein .
안트라퀴논계 화합물로는, 예를 들면 이하의 것을 들 수 있다. 또한, 이하에 예로 든 명칭은 COLOR INDEX GENERIC NAME이다. Disperse Blue14, Disperse Blue60, Disperse Blue197, Disperse Blue198, Disperse Blue334, Disperse Blue72, Solvent Blue11, Solvent Blue35, Solvent Blue36, Solvent Blue45, Solvent Blue59, Solvent Blue63, Solvent Blue67, Solvent Blue78, Solvent Blue83, Solvent Blue87, Solvent Blue94, Solvent Blue95, Solvent Blue97, Solvent Blue104, Solvent Blue105, Solvent Blue122, Solvent Violet13, Solvent Violet33, Solvent Violet34, Solvent Violet14, Solvent Violet31, Solvent Violet36, Solvent Violet37, Disperse Violet26, Disperse Violet28, Disperse Violet31, Disperse Violet57, Solvent Green3, Solvent Green20, Solvent Green28.As an anthraquinone compound, the following are mentioned, for example. In addition, the name exemplified below is COLOR INDEX GENERIC NAME. Disperse Blue14, Disperse Blue60, Disperse Blue197, Disperse Blue198, Disperse Blue334, Disperse Blue72, Solvent Blue11, Solvent Blue35, Solvent Blue36, Solvent Blue45, Solvent Blue59, Solvent Blue63, Solvent Blue67, Solvent Blue78, Solvent Blue83, Solvent Blue87, Solvent Blue94 , Solvent Blue95, Solvent Blue97, Solvent Blue104, Solvent Blue105, Solvent Blue122, Solvent Violet13, Solvent Violet33, Solvent Violet34, Solvent Violet14, Solvent Violet31, Solvent Violet36, Solvent Violet37, Disperse Violet26, Disperse Violet28, Disperse Violet31, Disperse Violet31 Green3, Solvent Green20, Solvent Green28.
<<기타 첨가제>><<Other additives>>
스티렌계 수지 조성물은 본 발명의 무색 투명성을 손상하지 않는 범위에서 미네랄 오일을 함유하여도 된다. 또한, 스테아르산, 에틸렌비스 스테아릴아미드 등의 내부 윤활제나, 황계 산화 방지제, 락톤계 산화 방지제, 자외선 흡수제, 힌더드 아민계 안정제, 대전 방지제, 외부 윤활제 등의 첨가제가 포함되어 있어도 된다. 또한 외부 윤활제로는 에틸렌비스 스테아릴아미드가 바람직하며, 함유량은 수지 조성물 중에 30 ~ 200ppm인 것이 바람직하다.The styrenic resin composition may contain mineral oil within a range that does not impair the colorless transparency of the present invention. Further, additives such as internal lubricants such as stearic acid and ethylenebis stearylamide, sulfur-based antioxidants, lactone-based antioxidants, ultraviolet absorbers, hindered amine stabilizers, antistatic agents, and external lubricants may be contained. Further, as the external lubricant, ethylenebis stearylamide is preferable, and the content is preferably 30 to 200 ppm in the resin composition.
자외선 흡수제는, 자외선에 의한 열화나 착색을 억제하는 기능을 가지는 것으로, 예를 들면, 벤조페논계, 벤조트리아졸계, 트리아진계, 벤조에이트계, 살리실레이트계, 시아노아크릴레이트계, 옥살산 아닐리드계, 말론산 에스테르계, 포름아미딘계 등의 자외선 흡수제를 들 수 있다. 이것들은, 단독 또는 2종 이상을 조합시켜 이용할 수 있고, 힌더드 아민 등의 광안정제를 병용하여도 된다.The ultraviolet absorber has a function of suppressing deterioration or coloring caused by ultraviolet rays, for example, benzophenone-based, benzotriazole-based, triazine-based, benzoate-based, salicylate-based, cyanoacrylate-based, oxalic anilide Ultraviolet absorbers, such as a system, a malonic acid ester system, and a formamidine system, are mentioned. These can be used alone or in combination of two or more, and a light stabilizer such as hindered amine may be used in combination.
본 발명의 스티렌계 수지 조성물은 사출 성형, 압출 성형, 압축 성형, 블로우 성형 등 목적에 따른 성형 방법으로 성형할 수 있으며, 그 형상은 제한되는 것은 아니다. 예를 들면 판 형상 성형품이라면, 도광판 등으로 가공할 수 있다. 얻어진 성형품은 도광판 등의 성형품 내부에 빛을 투과시키는 것에 의해 기능하는 광학용 부재로서 사용된다. 도광판 등 광학 부재는 광의 투과 거리(광로 길이)가 길기 때문에 균일면 발광성이 뛰어난 것이 바람직하다. 여기에서 균일면 발광성이 뛰어난 것은 투과성이 뛰어나고 빛의 흡수율의 파장 의존성이 작은 재료임을 의미한다.The styrenic resin composition of the present invention may be molded by a molding method according to a purpose such as injection molding, extrusion molding, compression molding, and blow molding, and the shape is not limited. For example, if it is a plate-shaped molded article, it can be processed into a light guide plate or the like. The obtained molded article is used as a member for optics that functions by transmitting light into a molded article such as a light guide plate. An optical member such as a light guide plate has a long transmission distance (optical path length) of light, so it is preferable to have excellent uniform light emission properties. Here, excellent uniform light emission means that the material has excellent transmittance and a small wavelength dependence of light absorption.
투과율은 광로 길이 115mm에서의 파장 380nm ~ 780nm의 평균 투과율이 80% 이상인 것이 바람직하고, 82.5% 이상인 것이 보다 바람직하고, 84% 이상인 것이 더욱 바람직하다. 단, 상기 평균 투과율은 실린더 온도 230℃, 금형 온도 50℃에서 사출 성형을 실시하여 얻은 127 × 127 × 3mm 두께의 판 형상 성형품에서 115 × 85 × 3mm 두께의 시험편을 잘라내어 단면을 버프 연마에 의해 연마하여 작성한 단면에 경면을 갖는 시험편을 사용하여 측정하는 것으로 한다. 또한 80℃에서 1000시간 보관 후와 초기의 평균 투과율의 차이의 절대값은 2.0% 이하인 것이 바람직하고, 1.5% 이하인 것이 보다 바람직하고, 1.2% 이하인 것이 더욱 바람직하다.The transmittance is preferably 80% or more, more preferably 82.5% or more, and even more preferably 84% or more, with an average transmittance of 380 nm to 780 nm in the optical path length of 115 mm. However, the above average transmittance is obtained by injection molding at a cylinder temperature of 230°C and a mold temperature of 50°C. From a 127 × 127 × 3 mm thick plate-shaped molded product, a 115 × 85 × 3 mm thick specimen is cut out and the cross section is polished by buffing It is to be measured using a test piece having a mirror surface on the prepared cross section. Further, the absolute value of the difference between the average transmittance after storage at 80°C for 1000 hours and the initial period is preferably 2.0% or less, more preferably 1.5% or less, and further preferably 1.2% or less.
빛의 흡수율의 파장 의존성은 예를 들면 파장 480nm의 투과율(t480)과 파장 580nm의 투과율(t580)의 비율(t580/t480)에 의해 평가할 수 있다. 본 발명에서는 비율(t580/t480)은 0.96 < t580/t480 < 1.04인 것이 바람직하고, 0.97 < t580/t480 < 1.03인 것이 보다 바람직하고, 0.98 < t580/t480 < 1.02인 것이 더욱 바람직하다. 여기서 빛의 흡수율의 파장 의존성이 작다는 것은 상기 비율(t580/t480)이 원칙상 1에 가까운 것을 의미한다. 상기 비율(t580/t480)은 구체적으로는 예를 들면 0.97, 0.98, 0.99, 1.00, 1.01, 1.02, 1.03이며, 여기에서 예시된 수치의 어느 2개 사이의 범위 내여도 된다.The wavelength dependence of the absorption rate of light can be evaluated by, for example, a ratio (t580/t480) of a transmittance of 480 nm (t480) and a transmittance of 580 nm (t580). In the present invention, the ratio (t580/t480) is preferably 0.96 <t580/t480 <1.04, more preferably 0.97 <t580/t480 <1.03, and even more preferably 0.98 <t580/t480 <1.02. Here, the small wavelength dependence of the absorption rate of light means that the ratio (t580/t480) is in principle close to 1. Specifically, the ratio (t580/t480) is, for example, 0.97, 0.98, 0.99, 1.00, 1.01, 1.02, 1.03, and may be within a range between any two of the numerical values exemplified herein.
광로 길이 115mm의 투과율은 다음의 단계로 측정을 실시했다. 스티렌계 수지 조성물의 펠렛을 사용하여 실린더 온도 230℃, 금형 온도 50℃에서 사출 성형을 실시하고, 127 × 127 × 3mm 두께의 판 형상 성형품을 성형했다. 여기에 장기의 열안정성을 평가하는 샘플은 80℃의 오븐 내에서 1000시간 보관하였다. 다음, 판 형상 성형품에서 115 × 85 × 3mm 두께의 시험편을 잘라내어 단면을 버프 연마에 의해 연마하고 단면에 경면을 갖는 판 형상 성형품을 작성했다. 연마 후의 판 형상 성형품에 대하여 닛폰 분코 가부시키가이샤(日本分光株式會社) 제조의 자외선 가시 분광 광도계 V-670을 이용하여 크기 20 × 1.6mm 확산 각도 0°의 입사광에 있어서 광로 길이 115mm에서의 파장 350nm ~ 800nm의 분광 투과율을 측정했다.The transmittance of the optical path length of 115 mm was measured in the following steps. Using the pellets of the styrenic resin composition, injection molding was performed at a cylinder temperature of 230°C and a mold temperature of 50°C, and a plate-shaped molded article having a thickness of 127 × 127 × 3 mm was molded. Here, samples for evaluating long-term thermal stability were stored in an oven at 80° C. for 1000 hours. Next, a test piece having a thickness of 115 × 85 × 3 mm was cut out from the plate-shaped molded article, the cross-section was polished by buffing, and a plate-shaped molded article having a mirror surface in the cross-section was created. For the plate-shaped molded article after polishing, using a UV-visible spectrophotometer V-670 manufactured by Nippon Bunko Co., Ltd., for incident light with a diffusing angle of 0° with a size of 20 × 1.6 mm and a wavelength of 350 nm at an optical path length of 115 mm The spectral transmittance of ~ 800 nm was measured.
도광판은 판 형상의 성형품의 단면(측면)에서 빛을 입사하고 성형품의 후면(비 발광면)에 형성된 반사 패턴에 의해 성형품의 전면(발광면)에 빛을 인도하여 면 발광시키는 기능을 가진 부재이다. 반사 패턴은 스크린 인쇄법, 사출 성형법, 레이저법 또는 잉크젯법 등의 방법에 의해 형성할 수 있다. 판 형상의 성형품에서 도광판으로 가공할 때, 빛의 입사면 또는 단면 전면을 연마 처리하여 경면으로 하는 것이 바람직하다. 또한 출사광의 균일성을 높이기 위해, 판 형상 성형품의 전면(발광면)에 프리즘 패턴 등을 형성할 수 있다. 판 형상 성형품의 전면 또는 후면의 패턴은 판 형상 성형품의 성형시에 형성시킬 수 있으며, 예를 들어 사출 성형에서는 금형 형상, 압출 성형에서는 롤 전사 등으로 패턴을 형성시킬 수 있다.The light guide plate is a member that has a function of injecting light from the end face (side) of a plate-shaped molded product and guiding light to the front (light emitting surface) of the molded product by a reflective pattern formed on the rear (non-luminous surface) of the molded product to emit light. . The reflection pattern can be formed by a method such as a screen printing method, an injection molding method, a laser method, or an ink jet method. When processing from a plate-shaped molded article to a light guide plate, it is preferable to polish the incident surface or the entire end surface of the light to make it a mirror surface. Further, in order to increase the uniformity of the outgoing light, a prism pattern or the like can be formed on the entire surface (light emitting surface) of the plate-shaped molded article. The pattern on the front or rear surface of the plate-shaped molded article can be formed at the time of molding the plate-shaped molded article. For example, the pattern can be formed by a mold shape in injection molding and a roll transfer in extrusion molding.
[실시예][Example]
이하, 실시예를 들어 본 발명을 구체적으로 설명하지만, 본 발명은 이러한 실시예에 한정되는 것은 아니다.Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples.
(스티렌계 수지의 제조)(Production of styrene resin)
완전 혼합형 교반조인 제 1 반응기와 제 2 반응기 및 정적(靜的) 혼합기를 가진 플러그 플로우형 반응기인 제 3 반응기를 직렬로 접속하여 중합 공정을 구성하고, 표 1에 나타내는 조건에 의해 스티렌계 수지의 제조를 실시했다. 각 반응기의 용량은, 제 1 반응기를 39리터, 제 2 반응기를 39리터, 제 3 반응기를 16리터로 하였다. 표 1에 기재된 원료 조성으로, 원료 용액을 작성하고, 제 1 반응기에 원료 용액을 표 1에 기재된 유량으로 연속 공급하였다. 중합 개시제는, 제 1 반응기의 입구에서 표 1에 기재된 첨가 농도(원료 스티렌 및 메타크릴산의 합계량에 대한 질량기준의 농도)가 되도록 원료 용액에 첨가하고, 균일하게 혼합하였다. 표 1에 기재된 중합 개시제는 다음과 같다. A polymerization process was formed by connecting the first reactor, which is a completely mixed stirring tank, the second reactor, and the third reactor, which is a plug flow reactor having a static mixer, in series, and the conditions shown in Table 1 Manufacturing was carried out. The capacity of each reactor was 39 liters for the first reactor, 39 liters for the second reactor, and 16 liters for the third reactor. A raw material solution was prepared with the raw material composition shown in Table 1, and the raw material solution was continuously supplied to the first reactor at the flow rate shown in Table 1. The polymerization initiator was added to the raw material solution so that the concentration (concentration based on mass relative to the total amount of raw styrene and methacrylic acid) shown in Table 1 was added at the inlet of the first reactor, and uniformly mixed. The polymerization initiators listed in Table 1 are as follows.
중합 개시제: 2,2-디(4,4-t-부틸퍼옥시시클로헥실)프로판(니치유 가부시키가이샤제 퍼테트라(PERTETRA) A를 사용했다.) Polymerization initiator: 2,2-di(4,4-t-butylperoxycyclohexyl)propane (PERTETRA A manufactured by Nichiyu Corporation was used.)
한편, 제 3 반응기에서는, 흐름의 방향을 따라 온도 구배를 주고, 중간 부분, 출구 부분에서 표 1의 온도가 되도록 조정했다. On the other hand, in the 3rd reactor, a temperature gradient was given along the flow direction, and it adjusted so that it might become the temperature of Table 1 at the middle part and the outlet part.
계속하여, 제 3 반응기에서 연속적으로 취출한 중합체를 포함하는 용액을 직렬로 2단으로 구성되는 예열기(予熱器)가 부착된 진공 탈휘조에 도입하고, 표 1에 기재된 수지 온도가 되도록 예열기의 온도를 조정하고, 표 1에 기재된 압력으로 조정하는 것으로, 미반응 스티렌 및 에틸 벤젠을 분리한 후, 다공 다이로 스트랜드 형상으로 압출하고, 콜드 컷 방식으로, 스트랜드를 냉각 및 절단하여 펠렛화하였다.Subsequently, the solution containing the polymer continuously taken out from the third reactor was introduced into a vacuum devolatilization tank equipped with a preheater consisting of two stages in series, and the temperature of the preheater was adjusted to the resin temperature shown in Table 1. By adjusting and adjusting to the pressure shown in Table 1, unreacted styrene and ethylbenzene were separated, then extruded into a strand shape with a porous die, and the strand was cooled and cut by a cold cut method to pelletize.
(실시예 1 ~ 4 및 비교예 1 ~ 3)(Examples 1 to 4 and Comparative Examples 1 to 3)
표 2에 나타내는 함유량으로 (a)스티렌계 수지 PS-1과, (b)인계 산화 방지제/페놀계 산화 방지제, (c)안트라퀴논계 화합물을 스크류 직경 40mm의 단축 압출기를 사용하여 실린더 온도 230℃, 스크류 회전수 100rpm으로 용융 혼련하여 펠렛을 얻었다. 표 2에서 사용한 (b)의 인계 산화 방지제 및 페놀계 산화 방지제는 각각 2,2'-메틸렌비스(4,6-디-tert-부틸-1-페닐옥시)(2-에틸헥실옥시)포스포러스(주식회사 ADEKA제 ADEKA STAB HP-10), 옥타데실-3-(3,5-디-t-부틸-4-히드록시페닐)프로피오네이트(BASF 재팬 주식회사제 Irganox 1076)이며, (c)의 안트라퀴논계 화합물은 Solvent Violet33(미쓰비시 화학 주식회사제 Blue J)이다.In the content shown in Table 2, (a) a styrene resin PS-1, (b) a phosphorus antioxidant/phenolic antioxidant, and (c) an anthraquinone compound were mixed at a cylinder temperature of 230°C using a single screw extruder having a screw diameter of 40 mm. And melt-kneading at a screw rotation speed of 100 rpm to obtain a pellet. The phosphorus antioxidant and phenolic antioxidant of (b) used in Table 2, respectively, 2,2'-methylenebis(4,6-di-tert-butyl-1-phenyloxy)(2-ethylhexyloxy)phos Porous (ADEKA STAB HP-10 manufactured by ADEKA Corporation), octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl) propionate (Irganox 1076 manufactured by BASF Japan Corporation), and (c) The anthraquinone compound of is Solvent Violet 33 (Mitsubishi Chemical Co., Ltd. Blue J).
또한, 얻은 펠렛을 이용하여, 실린더 온도 230℃, 금형 온도 50℃에서 사출 성형하고, 127 × 127 × 3mm 두께의 판 형상 성형품을 성형했다. 장기적인 열안정성을 평가하기 위하여, 얻은 성형품을 80℃의 오븐 내에서 1000시간 보관했다. 보관 전의 초기의 성형품과 보관 후의 성형품에 대하여 광학특성을 평가하기 위하여, 판 형상 성형품에서 115 × 85 × 3mm 두께인 시험편을 잘라내어, 단면을 버프연마에 의해 연마하고, 단면에 경면을 가지는 판 형상 성형품을 작성했다. 연마 후의 판 형상 성형품에 대하여, 닛폰 분코 가부시키가이샤제(日本分光株式會社)의 자외선 가시 분광 광도계 V-670을 이용하여, 크기가 20 × 1.6mm, 퍼짐 각도가 0°인 입사광에 있어서, 광로 길이 115mm에서의 파장 350nm ~ 800nm의 분광 투과율을 측정했다.Further, using the obtained pellets, injection molding was performed at a cylinder temperature of 230°C and a mold temperature of 50°C, and a plate-shaped molded article having a thickness of 127 × 127 × 3 mm was molded. In order to evaluate long-term thermal stability, the obtained molded article was stored in an oven at 80°C for 1000 hours. In order to evaluate the optical properties of the initial molded product before storage and the molded product after storage, a 115 × 85 × 3 mm thick test piece is cut out of a plate-shaped molded product, the cross section is polished by buffing, and a plate-shaped molded product having a mirror surface in the cross section. I wrote. For the plate-shaped molded article after polishing, using a UV-visible spectrophotometer V-670 manufactured by Nippon Bunko Co., Ltd., in incident light with a size of 20 × 1.6 mm and a spreading angle of 0°, the optical path The spectral transmittance at a wavelength of 350 nm to 800 nm at 115 mm in length was measured.
표 2에서는 각 평가에 대해 다음과 같은 기준에 의해 나타낸다. 또한, ×, △, ○, ◎을 설정하고 ×가 가장 떨어지고, ◎가 가장 뛰어나고, ×, △, ○, ◎의 순서로 평가가 높아진다.In Table 2, each evaluation is indicated by the following criteria. In addition, ×, △, ○, ◎ are set, and × is the lowest, ◎ is the most excellent, and evaluation increases in the order of ×, △, ○, ◎.
투과성Permeability
◎: 투과율이 84% 이상◎: transmittance of 84% or more
○: 투과율이 82.5% 이상, 84% 미만○: transmittance of 82.5% or more and less than 84%
△: 투과율이 80% 이상 82.5% 미만△: transmittance of 80% or more and less than 82.5%
×: 투과율이 80% 미만×: transmittance is less than 80%
파장 의존성Wavelength dependence
◎: 0.98 < t580/t480 < 1.02◎: 0.98 <t580/t480 <1.02
○: 0.97 < t580/t480 ≤ 0.98 또는 1.02 ≤ t580/t480 < 1.03○: 0.97 <t580/t480 ≤ 0.98 or 1.02 ≤ t580/t480 <1.03
△: 0.96 < t580/t480 ≤ 0.97 또는 1.03 ≤ t580/t480 < 1.04△: 0.96 <t580/t480 ≤ 0.97 or 1.03 ≤ t580/t480 <1.04
×: t580/t480 ≤ 0.96 또는 t580/t480 ≥ 1.04×: t580/t480 ≤ 0.96 or t580/t480 ≥ 1.04
균일면 발광성Uniform surface luminescence
투과성 및 파장 의존성의 2개의 평가를 함께 평가한 항목이다.It is an item in which two evaluations of transmittance and wavelength dependence were evaluated together.
◎: 투과성 및 파장 의존성이 모두 ◎◎: Both transmittance and wavelength dependence are ◎
○: 투과성과 파장 의존성이 모두 ○ 이상, 또한, 적어도 하나가 ○○: Both transmittance and wavelength dependence are ○ or more, and at least one is ○
△: 투과성과 파장 의존성이 모두 △ 이상, 또한, 적어도 하나가 △△: Both transmittance and wavelength dependence are △ or more, and at least one is △
×: 투과성과 파장 의존성의 적어도 하나가 ××: At least one of transmittance and wavelength dependence is ×
장기 균일면 발광성Long-term uniform surface luminescence
초기의 균일면 발광성 및 장기 열안정성 시험 후(80℃, 1000시간 후)의 균일면 발광성에 대해 종합 평가한 항목이다.This is a comprehensive evaluation of the initial uniform surface luminance and the uniform surface luminescence after a long-term thermal stability test (80°C, after 1000 hours).
◎: 초기의 균일면 발광성이 ◎ 또한 장기 열안정성 시험 후의 균일면 발광성이 ○ 이상◎: Initial uniform surface luminance ◎ In addition, uniform surface luminance after a long-term thermal stability test is greater than or equal to ○
○: 초기의 균일면 발광성이 ○ 또한 장기 열안정성 시험 후의 균일면 발광성이 △ 이상○: Initial uniform surface luminescence ○ In addition, uniform surface luminescence after a long-term thermal stability test is △ or more
△: 초기의 균일면 발광성이 △ 또한 장기 열안정성 시험 후의 균일면 발광성이 △△: Initial uniform surface luminance △ In addition, uniform surface luminance after long-term thermal stability test △
×: 초기의 균일면 발광성이 × 또는 장기 열안정성 시험 후의 균일면 발광성이 ××: The initial uniform surface luminescence is × or the uniform surface luminescence after a long-term thermal stability test is ×
실시예의 성형품은 초기의 균일면 발광성이 뛰어나고 또한 장기적인 균일면 발광성이 뛰어나다.The molded article of the example has excellent initial uniform surface luminescence and long-term uniform surface luminescence.
[산업상 이용 가능성][Industrial availability]
본 발명의 광학용 스티렌계 수지 조성물 및 성형품은 초기의 균일면 발광성이 뛰어나고 또한 장기적인 균일면 발광성이 뛰어난 점에서, 예를 들면 텔레비전, 탁상식 PC, 노트형 PC, 휴대전화기, 카네비게이션 등의 도광판 용도로 적합하게 사용할 수 있다.The optical styrenic resin composition and molded article of the present invention have excellent initial uniform surface luminescence and long-term uniform surface luminescence, for example, a light guide plate for TVs, desk PCs, notebook PCs, mobile phones, car navigation systems, etc. It can be used suitably for the purpose.
Claims (5)
스티렌계 수지 조성물 100질량% 중의 상기 (b)의 함유량은 0.02 ~ 1질량%이며,
수지 성분 전체 질량에 대한 상기 (c)의 함유량은 0.1 ~ 90ppb인 것을 특징으로 하는 광학용 스티렌계 수지 조성물.(a) a styrene resin, (b) a phosphorus antioxidant and/or a phenolic antioxidant, and (c) an anthraquinone compound,
The content of (b) in 100% by mass of the styrene resin composition is 0.02 to 1% by mass,
The content of (c) relative to the total mass of the resin component is 0.1 to 90 ppb, characterized in that the optical styrenic resin composition.
광로 길이 115mm에서의 파장 380nm ~ 780nm의 평균 투과율이 80% 이상인 것을 특징으로 하는 광학용 스티렌계 수지 조성물(단, 상기 평균 투과율은 실린더 온도 230℃, 금형 온도 50℃에서 사출 성형을 실시하여 얻은 127 × 127 × 3mm 두께의 판 형상 성형품에서 115 × 85 × 3mm 두께의 시험편을 잘라 내어, 단면을 버프 연마에 의해 연마하여 작성한 단면에 경면을 갖는 시험편을 사용하여 측정한 것이다).The method of claim 1,
Optical styrenic resin composition, characterized in that the average transmittance at a wavelength of 380 nm to 780 nm at a length of 115 mm is 80% or more (however, the average transmittance is 127 obtained by injection molding at a cylinder temperature of 230°C and a mold temperature of 50°C. A test piece having a thickness of 115 × 85 × 3 mm was cut out of a plate-shaped molded article having a thickness of × 127 × 3 mm, and the cross-section was polished by buffing, and the resulting cross-section was measured using a test piece having a mirror surface).
파장 480nm의 투과율(t480)과 파장 580nm의 투과율(t580)의 비율이 이하의 관계인 것을 특징으로 하는 광학용 스티렌계 수지 조성물:
0.96 < t580/t480 < 1.04.The method according to claim 1 or 2,
A styrenic resin composition for optics, characterized in that the ratio of the transmittance at a wavelength of 480 nm (t480) and the transmittance at a wavelength of 580 nm (t580) has the following relationship:
0.96 <t580/t480 <1.04.
스티렌계 수지 조성물 100질량% 중의 상기 (b)의 함유량은 0.02 ~ 1질량%이며,
광로 길이 115mm에서의 파장 380nm ~ 780nm의 평균 투과율이 80% 이상이며(단, 상기 평균 투과율은 실린더 온도 230℃, 금형 온도 50℃에서 사출 성형을 실시하여 얻은 127 × 127 × 3mm 두께의 판 형상 성형품에서 115 × 85 × 3mm 두께의 시험편을 잘라 내어, 단면을 버프 연마에 의해 연마하여 작성한 단면에 경면을 갖는 시험편을 사용하여 측정한 것으로 한다),
파장 480nm의 투과율(t480)과 파장 580nm의 투과율(t580)의 비율이 이하의 관계인 것을 특징으로 하는 광학용 스티렌계 수지 조성물:
0.96 < t580/t480 < 1.04.(a) a styrene resin, (b) a phosphorus antioxidant and/or a phenolic antioxidant, and (c) an anthraquinone compound,
The content of (b) in 100% by mass of the styrene resin composition is 0.02 to 1% by mass,
The average transmittance at a wavelength of 380nm to 780nm at a length of 115mm is 80% or more (however, the average transmittance is 127 × 127 × 3 mm thick plate-shaped molded product obtained by injection molding at a cylinder temperature of 230°C and a mold temperature of 50°C. A test piece with a thickness of 115 × 85 × 3 mm is cut out and the cross section is polished by buffing, and the resulting cross section is measured using a test piece having a mirror surface),
A styrenic resin composition for optics, characterized in that the ratio of the transmittance at a wavelength of 480 nm (t480) and the transmittance at a wavelength of 580 nm (t580) has the following relationship:
0.96 <t580/t480 <1.04.
An optical component comprising the styrene-based resin composition for optics according to claim 1.
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