KR20200080612A - Low dielectric coverlay film and coverlay film composition for the same - Google Patents

Low dielectric coverlay film and coverlay film composition for the same Download PDF

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KR20200080612A
KR20200080612A KR1020180170233A KR20180170233A KR20200080612A KR 20200080612 A KR20200080612 A KR 20200080612A KR 1020180170233 A KR1020180170233 A KR 1020180170233A KR 20180170233 A KR20180170233 A KR 20180170233A KR 20200080612 A KR20200080612 A KR 20200080612A
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composition
coverlay film
weight
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ester
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KR102160528B1 (en
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도윤선
조원선
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한화글로벌에셋 주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/55—Liquid crystals

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a low dielectric coverlay film and a coverlay film composition therefor. Specifically, a coverlay film comprises a liquid crystal polymer film layer and a low dielectric adhesive resin layer which are sequentially layered, thereby reducing transmission loss in a high frequency region, and can provide excellent heat resistance and adhesion required for flexible circuit boards applied to various products.

Description

저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물{Low dielectric coverlay film and coverlay film composition for the same}Low dielectric coverlay film and coverlay film composition therefor {Low dielectric coverlay film and coverlay film composition for the same}

본 발명은 저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물 에 관한 것이다.The present invention relates to a low dielectric coverlay film and a composition for a coverlay film therefor.

커버레이(coverlay)는 전자 재료를 보호하기 위한, 예를 들어 연성회로기판, 전자 구성요소, 집적 회로 패키지의 리드프레임(leadframe) 등을 보호하기 위한 베리어(barrier) 필름으로서 알려져 있다. Coverlays are known as barrier films for protecting electronic materials, for example for protecting flexible circuit boards, electronic components, leadframes of integrated circuit packages, and the like.

또한 최근에는 컴퓨터와 정보통신장치의 고성능화, 고기능화 및 네트워크화로의 발전에 따라 고속적으로 대용량의 정보를 전송 및 처리하기 위하여 작동신호는 고주파화되는 경향이 있으며, 회로 기판은 고다층화, 고 배선밀도의 방향으로 발전하고 있으므로, 그 사용되는 기판 재료에 대하여 새로운 요구를 제출하였으며, 상기 요구는 구체적으로, 좋은 유전 성능(즉 낮은 유전상수와 낮은 유전 손실 탄젠트)을 구비하고, 또한 비교적 넓은 범위의 온도와 주파수 조건하에서 안정성을 유지할 수 있어야 하고, PCB가공 과정에서 산，알칼리, 고온 및 고습환경의 영향에 견딜 수 있어, 흡습에 의한 팽창, 및 이로 인한 층간 분리가 발생하지 말아야 하고, 고온에서의 가공 및 설치 공정 요구에 적응할 수 있어야 하고, 양호한 난연 안전성을 가져야 한다.In addition, in recent years, with the development of high-performance, high-functionality, and networked computers and information and communication devices, the operation signal tends to be high-frequency in order to transmit and process large-capacity information at high speed, and the circuit board is highly multilayered and high wiring density. As it is developing in the direction of, it has submitted a new request for the substrate material used, which specifically has good dielectric performance (i.e., low dielectric constant and low dielectric loss tangent), and also a relatively wide range of temperature. It must be able to maintain stability under the and frequency conditions, and it can withstand the effects of acids, alkalis, high temperature and high humidity environments in the PCB processing process, so that expansion due to moisture absorption and interlayer separation due to this should not occur, and processing at high temperatures And must be able to adapt to the needs of the installation process and have good flame retardant safety.

이러한 최근의 전송신호의 고속화 요구에 수반하여, 전송 신호의 고주파화가 현저하게 진행되고 있어, 고주파영역, 구체적으로는, 3.5~28 ㎓의 영역에서의 전기신호 손실을 효율적으로 저감할 수 있는 것이 요구되고 있고, 이러한 요구는 기판 자체뿐 아니라 커버레이 필름으로서 사용하는 접착 필름에 대해서도, 고주파 영역에서 우수한 전기 특성(저유전율(ε), 저유전정접(tanδ))을 나타내는 것이 요구된다.With the recent demand for high-speed transmission signals, high-frequency transmission signals have progressed remarkably, and it is required to efficiently reduce electrical signal loss in the high-frequency region, specifically, in the region of 3.5 to 28 GHz. These demands are required to exhibit excellent electrical properties (low dielectric constant (ε), low dielectric loss tangent (tanδ)) in the high frequency region not only for the substrate itself but also for the adhesive film used as a coverlay film.

커버레이 필름은 전형적으로 폴리이미드와 접착제(예를 들어, 폴리이미드 필름에 에폭시가 도포된 구조)의 2층 구조로 이루어져 있다. 폴리이미드 층은 굴곡성 및 전기적 특성이 우수하지만, 접착제 층인 에폭시는 굴곡성 및 전기적 특성이 낮으므로, 전체적인 특성도 떨어진다. 또한 일반적으로 연성회로기판용 커버 필름으로 사용되는 폴리이미드 커버레이 및 에폭시 수지 접착 필름은 모두 유전상수 (Dk, Dielectric Constant) 및 유전 손실(Df, Dielectric Dissipation) 및 값이 크기 때문에, 고주파 영역(3.5 ~ 28GHz)에서는 전송 손실이 높아지는 어려움이 있다. Coverlay films typically consist of a two-layer structure of polyimide and an adhesive (eg, a structure in which an epoxy is applied to a polyimide film). The polyimide layer has excellent flexibility and electrical properties, but the adhesive layer epoxy has low flexibility and electrical properties, and thus the overall properties are also poor. In addition, the polyimide coverlay and epoxy resin adhesive films, which are generally used as cover films for flexible circuit boards, both have high dielectric constant (Dk, Dielectric Constant) and dielectric loss (Df, Dielectric Dissipation) and high values, resulting in high-frequency regions (3.5 ~ 28GHz), it is difficult to increase the transmission loss.

따라서 특히 고주파가 요구되는 5G 이동통신에 적용되는 연성회로기판에서는 사용하는데 문제점이 있기 때문에, 고주파 영역에서도 유전 특성 및 접착력, 내열성이 모두 우수한 커버레이 필름이 요구된다.Therefore, in particular, since there is a problem in use in a flexible circuit board applied to 5G mobile communication requiring high frequency, a coverlay film having excellent dielectric properties, adhesion and heat resistance is also required in the high frequency region.

1. 한국등록특허 제10-1397950호1. Korean Registered Patent No. 10-1397950

본 발명은 전술한 종래 기술의 문제점을 해결하여 고주파 영역에서 전송손실을 감소시킬 수 있는 저유전 특성 구현하는 저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물을 제공하기 위한 것이다.The present invention is to provide a low-dielectric coverlay film and a composition for a coverlay film for the same to solve the problems of the prior art described above and implement low-dielectric properties capable of reducing transmission loss in a high-frequency region.

상기 상술한 목적을 달성하기 위하여 본 발명은 저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물을 제공한다.In order to achieve the above object, the present invention provides a low dielectric coverlay film and a composition for a coverlay film therefor.

본 발명은 액정 고분자 필름층, 저유전 접착 수지층이 순차적으로 적층되어 있는 커버레이 필름을 제공한다.The present invention provides a coverlay film in which a liquid crystal polymer film layer and a low dielectric adhesive resin layer are sequentially stacked.

본 발명의 커버레이 필름은 통상의 폴리이미드(PI) 필름을 사용하는 대신 액정 고분자 필름층을 사용하여 유전상수 및 유전손실을 고주파 영역에 요구되는 수준으로 낮출 수 있다.The coverlay film of the present invention can lower the dielectric constant and dielectric loss to a level required for a high frequency region by using a liquid crystal polymer film layer instead of using a conventional polyimide (PI) film.

또한 본 발명은 액정 고분자 필름층 및 저유전 접착 수지층 위에 추가로 이형 필름층이 순차로 적층되어 있는 커버레이 필름을 제공할 수 있다.In addition, the present invention can provide a coverlay film in which a release film layer is sequentially laminated on a liquid crystal polymer film layer and a low dielectric adhesive resin layer.

상기 이형 필름층을 이루는 물질은 손상 없이 박리될 수 있는 것이라면 특별히 한정되지 않으나, 폴리에스터, 폴리에틸렌테레프탈레이트, 폴리에틸렌, 폴리프로필렌, 폴리에스테르, 또는 실리콘 등을 들 수 있다.The material forming the release film layer is not particularly limited as long as it can be peeled without damage, and examples thereof include polyester, polyethylene terephthalate, polyethylene, polypropylene, polyester, or silicone.

상기 저유전 접착 수지층이란 3.5 내지 28 GHz의 고주파 영역에서 유전 특성이 3 미만이고 유전손실이 0.005 이하인 필름 조성물로 형성된 층을 의미한다. The low dielectric adhesive resin layer means a layer formed of a film composition having a dielectric property of less than 3 and a dielectric loss of 0.005 or less in a high frequency region of 3.5 to 28 GHz.

본 발명의 커버레이 필름의 상기 저유전 접착 수치층은, 조성물 총 중량 대비, 아민형 에폭시 레진을 1 내지 5 중량%, 및 폴리이미드계 레진을 20 내지 25 중량% 포함하는 커버레이 필름용 조성물을 통해 제공할 수 있다.The low-k dielectric layer of the coverlay film of the present invention comprises a composition for a coverlay film comprising 1 to 5% by weight of an amine-type epoxy resin and 20 to 25% by weight of a polyimide resin, based on the total weight of the composition. Can be provided through

상기 아민형 에폭시 레진은 기존의 에폭시계 레진 경화 반응성 및 레진 흐름성이 우수하고, 상기 폴리이미계 레진은 접착력이 높아, 유전상수는 3 미만이고 유전손실은 0.005이하로서 고주파 영역에서 요구되는 저유전 조건을 충족하는 것은 물론 우수한 접착력까지 확보할 수 있다.The amine-type epoxy resin is excellent in curing reactivity and resin flowability of the existing epoxy-based resin, and the polyimide-based resin has high adhesion, a dielectric constant of less than 3 and a dielectric loss of 0.005 or less, which is a low dielectric constant required in the high-frequency region. In addition to satisfying the conditions, excellent adhesion can be secured.

상기 본 발명의 조성물은 에스테르 경화제, 경화 보조제, 또는 이들의 혼합물을 추가로 포함할 수 있다. 이를 통해 내열성을 추가 확보할 수 있어 더욱 우수한 품질을 확보할 수 있다.The composition of the present invention may further include an ester curing agent, a curing aid, or a mixture thereof. Through this, it is possible to additionally secure heat resistance, thereby ensuring a better quality.

상기 아민형 에폭시 레진은 특별히 제한되지 않지만, 벤질디메틸아민, 트리에탄올아민, 트리에틸렌디아민, 디메틸아미노에탄올, 트리(디메틸아미노메틸)페놀 등일 수 있고, 구체적으로 다음 화학식 구조를 갖는 화합물일 수 있다.The amine-type epoxy resin is not particularly limited, but may be benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tri(dimethylaminomethyl)phenol, and the like, and may be a compound having the following chemical structure.

[화학식 1][Formula 1]

Figure pat00001
Figure pat00001

(N,N-디글리시딜-4-글리시딜옥사닐린, N,N-Diglycidyl-4-glycidyloxyaniline)(N,N-Diglycidyl-4-glycidyloxaniline, N,N-Diglycidyl-4-glycidyloxyaniline)

[화학식 2][Formula 2]

Figure pat00002
Figure pat00002

상기 식에서 X는 알킬 사슬이고, 구체적으로 CnH2n (n=1~5), 터트-부틸일 수 있고, 더 구체적으로, CH2 (테트라글리시딜메틸렌디아닐린, Tetraglycidyl methylenedianiline)일 수 있다.In the above formula, X is an alkyl chain, specifically C n H 2n (n=1-5), may be tert-butyl, and more specifically, CH 2 (tetraglycidylmethylenedianiline, Tetraglycidyl methylenedianiline). .

상기 폴리이미드계 레진은 반복단위 내에 이미드 링키지를 함유하고 있는 고분자로서 특별히 제한되지 않고, 일례로 알킬 사슬이 치환된 치환체 등을 포함하며, 더 구체적으로 다음의 구조를 갖는 화합물일 수 있다.The polyimide-based resin is not particularly limited as a polymer containing an imide linkage in a repeating unit, and includes, for example, a substituent substituted with an alkyl chain, and more specifically, may be a compound having the following structure.

[화학식 3-1][Formula 3-1]

Figure pat00003
Figure pat00003

[화학식 3-2][Formula 3-2]

Figure pat00004
Figure pat00004

[화학식 3-3][Formula 3-3]

Figure pat00005
Figure pat00005

[화학식 3-4][Formula 3-4]

Figure pat00006
Figure pat00006

[화학식 3-5][Formula 3-5]

Figure pat00007
Figure pat00007

[화학식 3-6][Formula 3-6]

Figure pat00008
Figure pat00008

상기 에스테르 경화제는 다음의 반응식을 통하여 아민형 에폭시 레진과 경화 반응을 일으키는 역할을 한다. The ester curing agent serves to cause a curing reaction with the amine-type epoxy resin through the following reaction formula.

[반응식 1] [Scheme 1]

Figure pat00009
Figure pat00009

따라서, 에스테르 경화제는 상기 경화 반응을 일으킬 수 있는 물질이면 특별히 한정되지 않고, 페놀 에스테르 화합물, 티오페놀 에스테르 화합물, N-히드록시아민에스테르 화합물, 복소환 히드록시 화합물의 에스테르 화합물 등일 수 있으며, 더 구체적으로 다음 화학식 구조를 갖는 화합물일 수 있다.Therefore, the ester curing agent is not particularly limited as long as it is a substance capable of causing the curing reaction, and may be a phenol ester compound, a thiophenol ester compound, an N-hydroxyamine ester compound, an ester compound of a heterocyclic hydroxy compound, and more specifically It may be a compound having the following formula structure.

[화학식 4][Formula 4]

Figure pat00010
Figure pat00010

상기 식에서 R은

Figure pat00011
임.Where R is
Figure pat00011
being.

상기 경화 보조제는 특별히 제한되지 않지만, 이미다졸계 경화 촉진제 등의 각종 경화 촉진제를 사용할 수 있다. 경화 촉진제 중에서도, 이미다졸계 경화 촉진제가, 필름용 조성물의 다른 성분과의 상용성, 및 필름용 조성물의 경화 속도의 측면에서 우수하기 때문에 바람직하다. 더 구체적으로 다음 화학식 구조를 갖는 화합물일 수 있다.Although the curing aid is not particularly limited, various curing accelerators such as imidazole-based curing accelerators can be used. Among the curing accelerators, an imidazole-based curing accelerator is preferable because it is excellent in terms of compatibility with other components of the composition for films and the curing rate of the composition for films. More specifically, it may be a compound having the following chemical structure.

[화학식 5][Formula 5]

Figure pat00012
Figure pat00012

(6-[2-(2-Ethyl-4-methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine)(6-[2-(2-Ethyl-4-methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine)

[화학식 6][Formula 6]

Figure pat00013
Figure pat00013

(6-[2-(2-Methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine)(6-[2-(2-Methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine)

[화학식 7][Formula 7]

Figure pat00014
Figure pat00014

(1-Cyanomethyl-2-ethyl-4-methylimidazole)(1-Cyanomethyl-2-ethyl-4-methylimidazole)

본 발명의 조성물은 필러, 중합개시제, 점착성 부여제, 소포제, 유동조정제, 성막보조제, 분산보조제, 도전성 입자 등의 통상적인 첨가제를 추가로 포함할 수 있다. The composition of the present invention may further include conventional additives such as fillers, polymerization initiators, tackifiers, defoamers, flow modifiers, film-forming aids, dispersion aids, and conductive particles.

상기 필러는 특별히 제한되지 않지만, 알루미나, 실리카 및 알루미늄 트리 하이드록시이드 중에서 선택된 어느 하나 이상일 수 있다.The filler is not particularly limited, but may be any one or more selected from alumina, silica, and aluminum tri hydroxide.

상기 첨가제는 특별히 제한되지 않지만, 실란 커플링제, 계면활성제 및 산화방지제 중에서 선택된 어느 하나 이상일 수 있다.The additive is not particularly limited, but may be any one or more selected from silane coupling agents, surfactants and antioxidants.

본 발명의 구현예에 따르면, 상기 조성물은 조성물 총 중량 대비 아민형 에폭시 레진을 1 내지 5 중량%, 구체적으로, 1.2 내지 2.5 중량% 포함할 수 있다. 상기 아민형 에폭시 레진은 최소한의 경화 반응 및 내열성을 위하여 1 중량%이상 필요하고, 5 중량% 초과시 유전 특성 저하될 수 있다.According to the embodiment of the present invention, the composition may include 1 to 5% by weight, specifically, 1.2 to 2.5% by weight of the amine-type epoxy resin based on the total weight of the composition. The amine-type epoxy resin is required at least 1% by weight for the minimum curing reaction and heat resistance, and when it exceeds 5% by weight, the dielectric properties may be deteriorated.

본 발명의 구현예에 따르면, 상기 조성물은 조성물 총 중량 대비 폴리이미드계 레진을 20 내지 25 중량%, 구체적으로, 21.5 내지 24.5 중량% 포함할 수 있다. 유연성 및 저유전 특성 확보를 위하여 20 중량%이상 필요하고, 25 중량%초과시에는 미반응이 발생할 수 있다.According to the embodiment of the present invention, the composition may include 20 to 25% by weight, specifically 21.5 to 24.5% by weight of the polyimide resin based on the total weight of the composition. More than 20% by weight is required to ensure flexibility and low dielectric properties, and unreacted reaction may occur when it exceeds 25% by weight.

본 발명의 구현예에 따르면, 상기 조성물은 조성물 총 중량 대비 에스테르 경화제를 1 내지 10 중량%, 경화 보조제를 0.001 내지 1 중량% 포함한다. 이를 통해 자칫 유전 특성이 저하될 수 있는 아민형 경화제를 사용하지 않고, 에스테르 경화제를 더욱 포함하여 접착력은 물론 내열성을 추가 확보할 수 있다. 이 때 경화 보조제를 추가로 포함할 수 있으며, 구체적으로 이미다졸계의 경화 촉진제를 사용할 수 있다.According to an embodiment of the present invention, the composition comprises 1 to 10% by weight of the ester curing agent relative to the total weight of the composition, and 0.001 to 1% by weight of the curing aid. Through this, without using an amine-type curing agent that can degrade the dielectric properties, it is possible to further secure the adhesive strength as well as heat resistance by further including an ester curing agent. At this time, a curing aid may be additionally included, and specifically, an imidazole-based curing accelerator may be used.

본 발명의 조성물은 그 외 커버레이 필름의 접착용 조성물에 포함될 수 있는 필러, 실란 커플링제, 계면활성제, 산화 방지제 등의 성분을 추가로 포함할 수 있다. The composition of the present invention may further include components such as fillers, silane coupling agents, surfactants, and antioxidants that may be included in other adhesive compositions for the coverlay film.

본 발명은 상기 상술한 필름용 조성물로 저유전 접착 수지층을 형성한 커버레이 필름을 제공한다. The present invention provides a coverlay film having a low dielectric adhesive resin layer formed of the above-described composition for films.

본 발명은 상기 상술한 필름용 조성물을 사용하여 제작되는 접착 필름을 제공한다. The present invention provides an adhesive film produced using the above-described composition for a film.

본 발명의 구현예에 따르면, 액정 고분자 필름층, 상술한 필름용 조성물로 제작한 접착 수지층 및 이형 필름층이 순차로 적층되어 있는 커버레이 필름을 제공한다.According to an embodiment of the present invention, there is provided a coverlay film in which a liquid crystal polymer film layer, an adhesive resin layer and a release film layer made of the above-described composition for films are sequentially stacked.

본 발명의 접착 필름 및 커버레이 필름은, 본 발명의 필름용 조성물로부터 공지의 방법에 의해 얻을 수 있다. 예를 들면, 본 발명의 필름용 조성물을 지지체의 적어도 편면에 도포하여, 건조시킨 후, 지지체 부착 필름, 또는, 지지체로부터 박리한 필름으로서 제공할 수 있다.The adhesive film and the coverlay film of the present invention can be obtained by a known method from the composition for films of the present invention. For example, after apply|coating the composition for films of this invention to at least one side of a support body, and drying, it can provide as a film with a support body or a film peeled from the support body.

본 발명의 접착 필름 및 커버레이 필름의 두께는, 용도에 따라서 요구되는 기계적 강도 등의 특성을 토대로 하여 적절히 설계되지만, 일반적으로 1~100 ㎛이고, 박막화가 요구되는 경우, 1~50 ㎛인 것이 바람직하다.The thickness of the adhesive film and the coverlay film of the present invention is appropriately designed based on characteristics such as mechanical strength required according to the application, but is generally 1 to 100 μm, and when thinning is required, it is 1 to 50 μm. desirable.

본 발명의 접착 필름 및 커버레이 필름은, 고주파에서의 유전 특성이 우수하다. 구체적으로는, 고주파 3.5~28 ㎓의 영역에서의 유전상수는 3 미만이고, 유전손실은 0.005 이하로서 우수하다. 또한, 본 발명의 접착 필름 및 커버레이 필름은 접착력이 0.5 kgf/cm 이상이고, 내열 한계도 280 이상으로 우수하다.The adhesive film and the coverlay film of the present invention are excellent in dielectric properties at high frequencies. Specifically, the dielectric constant in the region of high frequency 3.5 to 28 kHz is less than 3, and the dielectric loss is excellent as 0.005 or less. In addition, the adhesive film and the coverlay film of the present invention have an adhesive strength of 0.5 kgf/cm or more and a heat resistance limit of 280 or more.

본 발명의 저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물은 고주파 영역에서 고주파 3.5~28 ㎓의 영역에서의 유전상수는 3 미만이고, 유전손실은 0.005 이하로서 전송 손실을 감소시키는 것은 물론 다양한 제품에 적용되는 연성회로기판에 필요한 우수한 내열성, 접착력을 제공할 수 있다.The low dielectric coverlay film of the present invention and a composition for a coverlay film therefor have a dielectric constant of less than 3 in a high frequency region of 3.5 to 28 kHz in a high frequency region, and a dielectric loss of 0.005 or less, which reduces transmission loss as well as various It can provide excellent heat resistance and adhesion required for flexible circuit boards applied to products.

도 1은 본 발명의 일 실시예에 따라 제작한 커버레이 필름의 모식도이다.1 is a schematic view of a coverlay film produced according to an embodiment of the present invention.

이하, 실시 예를 통해서 본 발명을 보다 상세히 설명하기로 한다. 하지만, 이들은 본 발명을 보다 상세하게 설명하기 위한 것일 뿐 본 발명의 권리범위가 이에 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail through examples. However, these are only for explaining the present invention in more detail, and the scope of the present invention is not limited thereto.

1. 커버레이 필름용 조성물의 제조 1. Preparation of a composition for a coverlay film

하기 표의 조성대로 혼합하여 통상적인 제조 방법을 사용하여 커버레이 필름용 조성물을 제조하였다. The composition for the coverlay film was prepared by mixing according to the composition in the table below using a conventional manufacturing method.

구성 성분Composition 물질명Substance name 비교예 1Comparative Example 1 비교예 2Comparative Example 2 비교예 3Comparative Example 3 비교예 4Comparative Example 4 실시예 1Example 1 실시예 2Example 2 에폭시 레진Epoxy resin DGEBBA1 )
(비스-페놀 A형 에폭시)DGEBBA 1 )
(Bis-phenol A type epoxy) 1818 아민형 에폭시 레진Amine type epoxy resin N,N-디글리시딜-4-글리시딜옥사닐린N,N-diglycidyl-4-glycidyloxaniline 1.01.0 2.42.4 5.05.0 1.41.4 2.42.4 폴리이미드계 레진Polyimide resin 알킬사슬이 치환된 폴리이미드 레진(Arakawa社
PIAD 레진)Alkyl chain substituted polyimide resin (Arakawa)
PIAD resin) 24.324.3 20.020.0 22.422.4 24.324.3 22.022.0 에스테르 경화제Ester curing agent DIC社HPC-8000-65TDIC company HPC-8000-65T 3.43.4 아민형 경화제Amine-type curing agent 3, 3'-디아미노디페닐 설폰3, 3'-diaminodiphenyl sulfone 22 경화 보조제Curing aid 6-[2-(2-에틸-4-메틸-1H-이미다졸-1-일)에틸]-1,3,5-트리진-2,4-디아민6-[2-(2-ethyl-4-methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine 0.10.1 필러filler 알루미나Alumina 1010 실리카Silica 6.36.3 10.010.0 5.05.0 6.76.7 5.15.1 부타디엔 고무Butadiene rubber 아크릴로니트릴-부타디엔 러버Acrylonitrile-butadiene rubber 77 첨가제additive 신에츠社KBM-603Shin-Etsu Corporation KBM-603 1One 0.10.1 0.10.1 0.10.1 0.10.1 용제solvent 메틸에틸케톤, 톨루엔Methyl ethyl ketone, toluene 6262 67.567.5 67.567.5 67.567.5 67.567.5 67.067.0 합계Sum 100100 100100 100100 100100 100100 100100

1) DGEBBA의 화학식은 다음과 같음. One) The chemical formula of DGEBBA is as follows.

Figure pat00015
Figure pat00015

2. 본 발명에 따른 접착 필름의 특성 평가2. Evaluation of the properties of the adhesive film according to the present invention

상기에서 제조한 조성물로 제조한 접착 필름에 대하여 유전상수, 유전손실, 접착력 및 내열한계를 평가하였다. 평가 결과는 다음 표 2와 같다.The dielectric constant, dielectric loss, adhesive strength and heat resistance limit were evaluated for the adhesive film prepared with the composition prepared above. The evaluation results are shown in Table 2 below.

특 성Characteristics 단위unit 비교예 1Comparative Example 1 비교예 2.Comparative Example 2. 비교예 3Comparative Example 3 비교예 4Comparative Example 4 실시예 1Example 1 실시예 2Example 2 유전상수
(10GHz)Dielectric constant
(10 GHz) -- 3.43.4 2.72.7 2.82.8 3.03.0 2.82.8 2.72.7 유전손실(10GHz)Dielectric loss (10GHz) -- 0.0250.025 0.0040.004 0.0070.007 0.0100.010 0.0050.005 0.0050.005 90°Peel Strength(접착력)90°Peel Strength Kgf/㎝Kgf/cm > 0.7> 0.7 0.60.6 0.50.5 1.01.0 0.50.5 0.70.7 내열 한계
(Solder Floating, 30sec)Heat-resistant limit
(Solder Floating, 30sec) ℃℃ 288288 270270 280280 290290 280280 295295

실험 결과, 통상의 에폭시 레진 필름은 유전상수가 3 초과하고 유전손실이 0.0025라서 고주파 영역 요건을 모두 충족하지 못하였고, 아민형 에폭시 레진을 사용하더라도 비교예 3 및 4는 유전손실이 0.005 초과하여 불만족스럽고, 비교예 2는 유전상수 및 유전손실은 만족하였으나 내열성이 낮아 그다지 효율적이지 못한 반면, 본 발명의 실시예 1 및 2의 유전상수 및 유전손실이 고주파 영역 요구 요건을 충족한 것은 물론 내열성까지 우수한 것을 알 수 있다.As a result of the experiment, the conventional epoxy resin film had a dielectric constant of 3 and a dielectric loss of 0.0025, which did not satisfy all of the high-frequency region requirements. In contrast, Comparative Example 2 satisfied the dielectric constant and dielectric loss, but was not very efficient due to its low heat resistance, whereas the dielectric constant and dielectric loss of Examples 1 and 2 of the present invention met the requirements of the high frequency region as well as excellent heat resistance. You can see that

3. 본 발명에 따른 액상 고분자 필름의 유전 특성 평가3. Evaluation of dielectric properties of the liquid polymer film according to the present invention

본 발명의 액상 고분자 필름의 유전 특성을 기존의 폴리이미드계 필름과 대비하여 비교하였다. 측정 방법은 상기와 동일하다. 비교 결과는 다음 표와 같다. The dielectric properties of the liquid polymer film of the present invention were compared with the conventional polyimide-based film. The measurement method is the same as above. The comparison results are shown in the following table.

특 성Characteristics 폴리이미드 필름
(비교예 5)Polyimide film
(Comparative Example 5) 액상 고분자 필름
(실시예 3)Liquid polymer film
(Example 3) 유전상수
(10GHz)Dielectric constant
(10 GHz) 3.53.5 2.82.8 유전손실
(10GHz)Dielectric loss
(10 GHz) 0.0080.008 0.0020.002

실험 결과, 폴리이미드 필름 보다 액상 고분자 필름의 유전상수 및 유전손실이 낮아 고주파 영역에서 유전 특성이 우수함을 확인하였다.As a result of the experiment, it was confirmed that the dielectric properties of the liquid polymer film were lower than that of the polyimide film, and the dielectric properties were excellent in the high frequency region.

4. 본 발명에 따른 커버레이 필름의 특성 평가4. Evaluation of the properties of the coverlay film according to the present invention

본 발명에 따른 커버레이 필름의 전체적 특성을 평가하기 위하여, 상기의 액상 고분자 필름에 접착 필름층을 적층하여 커버레이 필름을 제조하여 (실시예 4) 상기와 동일하게 특성을 평가하였다. 평가 결과 다음과 같다. In order to evaluate the overall properties of the coverlay film according to the present invention, a coverlay film was prepared by laminating an adhesive film layer on the liquid polymer film (Example 4), and the properties were evaluated in the same manner as above. The evaluation results are as follows.

특 성Characteristics 단위unit 비교예 1Comparative Example 1 실시예 1Example 1 실시예 2Example 2 실시예 4Example 4 유전상수(10GHz)Dielectric constant (10GHz) -- 3.43.4 2.82.8 2.72.7 2.82.8 유전손실(10GHz)Dielectric loss (10GHz) -- 0.0250.025 0.0050.005 0.0050.005 0.0040.004 90°Peel Strength(접착력)90°Peel Strength Kgf/㎝Kgf/cm > 0.7> 0.7 0.50.5 0.70.7 0.70.7 내열 한계
(Solder Floating, 30sec)Heat-resistant limit
(Solder Floating, 30sec) ℃℃ 288288 280280 295295 310310

평가 결과, 본원발명의 실시예 모두 바람직한 유전상수 및 유전손실, 접착력 및 내열한계를 갖는 것을 확인할 수 있었고, 특히 본원발명에 따른 액정 고분자 필름에 접착 필름용 조성물을 모두 적용하여 제조한 커버레이 필름인 실시예 4의 유전특성, 접착력 및 내열 한계 모두 현저히 우수한 것을 확인할 수 있다.As a result of the evaluation, it was confirmed that all of the examples of the present invention have desirable dielectric constant and dielectric loss, adhesion, and heat resistance limits. It can be seen that the dielectric properties, adhesion and heat resistance limits of Example 4 are remarkably excellent.

이상에서, 출원인은 본 발명의 바람직한 실시 예들을 설명하였지만, 이와 같은 실시예들은 본 발명의 기술적 사상을 구현하는 일 실시예일 뿐이며 본 발명의 기술적 사상을 구현하는 한 어떠한 변경예 또는 수정예도 본 발명의 범위에 속하는 것으로 해석되어야 한다.In the above, the applicant has described preferred embodiments of the present invention, but these embodiments are only one embodiment for implementing the technical concept of the present invention, and any modification or modification of the present invention as long as the technical concept of the present invention is implemented It should be construed as being within the scope.

Claims (18)

액정 고분자 필름층 및 저유전 접착 수지층이 순차적으로 적층되어 있는 커버레이 필름.
A coverlay film in which a liquid crystal polymer film layer and a low dielectric adhesive resin layer are sequentially stacked.
제1항에 있어서,
이형 필름층이 추가로 순차적으로 적층되어 있는 커버레이 필름.
According to claim 1,
A coverlay film in which a release film layer is additionally sequentially stacked.
제1항에 있어서,
상기 저유전 접착 수지층은 조성물 총 중량 대비, 아민형 에폭시 레진을 1 내지 5 중량%, 및 폴리이미드계 레진을 20 내지 25 중량% 포함하는 커버레이 필름용 조성물로 형성된 커버레이 필름.
According to claim 1,
The low dielectric adhesive resin layer is a coverlay film formed of a composition for a coverlay film comprising 1 to 5% by weight of an amine-type epoxy resin and 20 to 25% by weight of a polyimide resin, based on the total weight of the composition.
제3항에 있어서,
상기 조성물은 에스테르 경화제, 경화 보조제, 또는 이들의 혼합물을 추가로 포함하는 것을 특징으로 하는 커버레이 필름.
According to claim 3,
The composition is a coverlay film characterized in that it further comprises an ester curing agent, a curing aid, or a mixture thereof.
제3항에 있어서,
상기 아민형 에폭시 레진은 벤질디메틸아민, 트리에탄올아민, 트리에틸렌디아민, 디메틸아미노에탄올, 트리(디메틸아미노메틸)페놀, 및 다음 화학식 구조를 갖는 화합물 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름.
[화학식 1]
Figure pat00016

[화학식 2]
Figure pat00017

상기 식에서, X는 알킬임.
According to claim 3,
The amine-type epoxy resin is benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tri(dimethylaminomethyl)phenol, and a coverlay film, characterized in that at least one selected from compounds having the following formula structure.
[Formula 1]
Figure pat00016

[Formula 2]
Figure pat00017

In the above formula, X is alkyl.
제4항에 있어서,
상기 에스테르 경화제는 페놀 에스테르 화합물, 티오페놀 에스테르 화합물, N-히드록시아민에스테르 화합물 및 복소환 히드록시 화합물의 에스테르 화합물 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름.
According to claim 4,
The ester curing agent is a phenol ester compound, a thiophenol ester compound, N-hydroxyamine ester compound and a coverlay film, characterized in that at least one selected from ester compounds of heterocyclic hydroxy compounds.
제4항에 있어서,
상기 경화 보조제는 이미다졸계 경화 촉진제인 것을 특징으로 하는 커버레이 필름.
According to claim 4,
The curing aid is a coverlay film, characterized in that the imidazole-based curing accelerator.
제4항에 있어서,
상기 조성물은 조성물 총 중량 대비 에스테르 경화제를 1 내지 10 중량%, 경화 보조제를 0.001 내지 1 중량% 포함하는 것을 특징으로 하는 커버레이 필름.
According to claim 4,
The composition is a coverlay film, characterized in that it contains 1 to 10% by weight of the ester curing agent relative to the total weight of the composition, 0.001 to 1% by weight of the curing aid.
조성물 총 중량 대비, 아민형 에폭시 레진을 1 내지 5 중량%, 및 폴리이미드계 레진을 20 내지 25 중량% 포함하는 커버레이 필름용 조성물.
A composition for a coverlay film comprising 1 to 5% by weight of an amine-type epoxy resin and 20 to 25% by weight of a polyimide resin, based on the total weight of the composition.
제9항에 있어서,
상기 조성물은 에스테르 경화제, 경화 보조제, 또는 이들의 혼합물을 추가로 포함하는 것을 특징으로 하는 커버레이 필름용 조성물.
The method of claim 9,
The composition is a composition for a coverlay film, further comprising an ester curing agent, a curing aid, or a mixture thereof.
제9항에 있어서,
상기 아민형 에폭시 레진은 벤질디메틸아민, 트리에탄올아민, 트리에틸렌디아민, 디메틸아미노에탄올, 트리(디메틸아미노메틸)페놀, 및 다음 화학식 구조를 갖는 화합물 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름용 조성물.
[화학식 1]
Figure pat00018

[화학식 2]
Figure pat00019

상기 식에서, X는 알킬임.
The method of claim 9,
The amine-type epoxy resin is a composition for a coverlay film, characterized in that at least one selected from benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tri(dimethylaminomethyl)phenol, and compounds having the formula .
[Formula 1]
Figure pat00018

[Formula 2]
Figure pat00019

In the above formula, X is alkyl.
제10항에 있어서,
상기 에스테르 경화제는 페놀 에스테르 화합물, 티오페놀 에스테르 화합물, N-히드록시아민에스테르 화합물 및 복소환 히드록시 화합물의 에스테르 화합물 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름용 조성물.
The method of claim 10,
The ester curing agent is a phenol ester compound, a thiophenol ester compound, N-hydroxyamine ester compound and a composition for a coverlay film, characterized in that at least one selected from ester compounds of heterocyclic hydroxy compounds.
제10항에 있어서,
상기 경화 보조제는 이미다졸계 경화 촉진제인 것을 특징으로 하는 커버레이 필름용 조성물.
The method of claim 10,
The curing aid composition for a coverlay film, characterized in that the imidazole-based curing accelerator.
제9항에 있어서, 상기 조성물은 필러 및 첨가제를 추가로 포함하는 것을 특징으로 하는 커버레이 필름용 조성물.
The composition for a coverlay film according to claim 9, wherein the composition further comprises a filler and an additive.
제14항에 있어서, 상기 필러는 알루미나, 실리카 및 알루미늄 트리 하이드록시이드 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름용 조성물.
The composition for a coverlay film according to claim 14, wherein the filler is at least one selected from alumina, silica, and aluminum trihydroxide.
제14항에 있어서, 상기 첨가제는 실란 커플링제, 계면활성제 및 산화방지제 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름용 조성물.
The composition for a coverlay film according to claim 14, wherein the additive is at least one selected from silane coupling agents, surfactants and antioxidants.
제10항에 있어서, 상기 조성물은 조성물 총 중량 대비 에스테르 경화제를 1 내지 10 중량%, 경화 보조제를 0.001 내지 1 중량% 포함하는 것을 특징으로 하는 커버레이 필름용 조성물.
The composition for a coverlay film according to claim 10, wherein the composition contains 1 to 10% by weight of an ester curing agent and 0.001 to 1% by weight of a curing aid relative to the total weight of the composition.
제9항 내지 제17항 중 어느 한 항에 따른 커버레이 필름용 조성물을 사용하여 제작한 접착 필름.An adhesive film produced using the composition for a coverlay film according to any one of claims 9 to 17.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110095159A (en) * 2010-02-16 2011-08-24 신에쓰 가가꾸 고교 가부시끼가이샤 Epoxy resin composition and semiconductor device
KR101397950B1 (en) 2012-09-07 2014-05-27 피코맥스(주) Composition for fpcb coverlay and method for producing the same
KR101690095B1 (en) * 2009-01-30 2016-12-27 아지노모토 가부시키가이샤 Resin composition
KR20170134610A (en) * 2015-04-01 2017-12-06 미쓰비시 엔피쯔 가부시키가이샤 Based resin-containing polyimide precursor solution composition, polyimide, polyimide film, adhesive composition for circuit board, and method for manufacturing the same
KR20180001912A (en) * 2016-06-28 2018-01-05 주식회사 두산 Primer-coated copper and copper clad laminate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101690095B1 (en) * 2009-01-30 2016-12-27 아지노모토 가부시키가이샤 Resin composition
KR20110095159A (en) * 2010-02-16 2011-08-24 신에쓰 가가꾸 고교 가부시끼가이샤 Epoxy resin composition and semiconductor device
KR101397950B1 (en) 2012-09-07 2014-05-27 피코맥스(주) Composition for fpcb coverlay and method for producing the same
KR20170134610A (en) * 2015-04-01 2017-12-06 미쓰비시 엔피쯔 가부시키가이샤 Based resin-containing polyimide precursor solution composition, polyimide, polyimide film, adhesive composition for circuit board, and method for manufacturing the same
KR20180001912A (en) * 2016-06-28 2018-01-05 주식회사 두산 Primer-coated copper and copper clad laminate

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