KR102160528B1 - Low dielectric coverlay film and coverlay film composition for the same - Google Patents

Low dielectric coverlay film and coverlay film composition for the same Download PDF

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KR102160528B1
KR102160528B1 KR1020180170233A KR20180170233A KR102160528B1 KR 102160528 B1 KR102160528 B1 KR 102160528B1 KR 1020180170233 A KR1020180170233 A KR 1020180170233A KR 20180170233 A KR20180170233 A KR 20180170233A KR 102160528 B1 KR102160528 B1 KR 102160528B1
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composition
coverlay film
weight
film
ester
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KR20200080612A (en
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도윤선
조원선
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한화글로벌에셋 주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/55—Liquid crystals

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

본 발명은 저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물 에 관한 것으로, 구체적으로 액정 고분자 필름층 및 저유전 접착 수지층을 순차적층되어 있고, 이를 통해 고주파 영역에서 전송 손실을 감소시키는 것은 물론 다양한 제품에 적용되는 연성회로기판에 필요한 우수한 내열성, 접착력을 제공할 수 있다.The present invention relates to a low dielectric coverlay film and a composition for a coverlay film therefor, and specifically, a liquid crystal polymer film layer and a low dielectric adhesive resin layer are sequentially layered, thereby reducing transmission loss in a high frequency region as well as It can provide excellent heat resistance and adhesion required for flexible circuit boards applied to various products.

Description

저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물{Low dielectric coverlay film and coverlay film composition for the same}Low dielectric coverlay film and composition for coverlay film therefor

본 발명은 저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물 에 관한 것이다.The present invention relates to a low dielectric coverlay film and a composition for a coverlay film therefor.

커버레이(coverlay)는 전자 재료를 보호하기 위한, 예를 들어 연성회로기판, 전자 구성요소, 집적 회로 패키지의 리드프레임(leadframe) 등을 보호하기 위한 베리어(barrier) 필름으로서 알려져 있다. Coverlays are known as barrier films to protect electronic materials, for example, to protect flexible circuit boards, electronic components, leadframes of integrated circuit packages, and the like.

또한 최근에는 컴퓨터와 정보통신장치의 고성능화, 고기능화 및 네트워크화로의 발전에 따라 고속적으로 대용량의 정보를 전송 및 처리하기 위하여 작동신호는 고주파화되는 경향이 있으며, 회로 기판은 고다층화, 고 배선밀도의 방향으로 발전하고 있으므로, 그 사용되는 기판 재료에 대하여 새로운 요구를 제출하였으며, 상기 요구는 구체적으로, 좋은 유전 성능(즉 낮은 유전상수와 낮은 유전 손실 탄젠트)을 구비하고, 또한 비교적 넓은 범위의 온도와 주파수 조건하에서 안정성을 유지할 수 있어야 하고, PCB가공 과정에서 산，알칼리, 고온 및 고습환경의 영향에 견딜 수 있어, 흡습에 의한 팽창, 및 이로 인한 층간 분리가 발생하지 말아야 하고, 고온에서의 가공 및 설치 공정 요구에 적응할 수 있어야 하고, 양호한 난연 안전성을 가져야 한다.In addition, in recent years, in order to transmit and process large amounts of information at high speed with the development of high performance, high functionality, and network of computers and information communication devices, operation signals tend to be high frequency, and circuit boards have high multilayered, high wiring density. As it is developing in the direction of, it has submitted a new request for the substrate material used, which specifically has good dielectric performance (i.e., low dielectric constant and low dielectric loss tangent), and has a relatively wide range of temperature. It must be able to maintain stability under the condition of and frequency, and can withstand the influence of acid, alkali, high temperature and high humidity environment in the PCB processing process, so that expansion due to moisture absorption and interlayer separation due to this should not occur, and processing at high temperature And it should be able to adapt to the requirements of the installation process, and should have good flame retardant safety.

이러한 최근의 전송신호의 고속화 요구에 수반하여, 전송 신호의 고주파화가 현저하게 진행되고 있어, 고주파영역, 구체적으로는, 3.5~28 ㎓의 영역에서의 전기신호 손실을 효율적으로 저감할 수 있는 것이 요구되고 있고, 이러한 요구는 기판 자체뿐 아니라 커버레이 필름으로서 사용하는 접착 필름에 대해서도, 고주파 영역에서 우수한 전기 특성(저유전율(ε), 저유전정접(tanδ))을 나타내는 것이 요구된다.Along with these recent demands for high-speed transmission signals, high-frequency transmission signals are remarkably progressing, and it is required to be able to efficiently reduce electrical signal loss in the high-frequency region, specifically in the 3.5-28 GHz region. In addition, such a demand is required to exhibit excellent electrical properties (low dielectric constant (ε), low dielectric loss tangent (tanδ)) in a high frequency region for the adhesive film used as the coverlay film as well as the substrate itself.

커버레이 필름은 전형적으로 폴리이미드와 접착제(예를 들어, 폴리이미드 필름에 에폭시가 도포된 구조)의 2층 구조로 이루어져 있다. 폴리이미드 층은 굴곡성 및 전기적 특성이 우수하지만, 접착제 층인 에폭시는 굴곡성 및 전기적 특성이 낮으므로, 전체적인 특성도 떨어진다. 또한 일반적으로 연성회로기판용 커버 필름으로 사용되는 폴리이미드 커버레이 및 에폭시 수지 접착 필름은 모두 유전상수 (Dk, Dielectric Constant) 및 유전 손실(Df, Dielectric Dissipation) 및 값이 크기 때문에, 고주파 영역(3.5 ~ 28GHz)에서는 전송 손실이 높아지는 어려움이 있다. Coverlay films typically consist of a two-layer structure of polyimide and an adhesive (eg, a structure in which epoxy is applied to a polyimide film). The polyimide layer has excellent flexibility and electrical properties, but the epoxy, which is an adhesive layer, has low flexibility and electrical properties, and thus overall properties are also inferior. In addition, polyimide coverlays and epoxy resin adhesive films, which are generally used as cover films for flexible circuit boards, all have large dielectric constants (Dk, Dielectric Constant), dielectric losses (Df, Dielectric Dissipation) and values, so the high frequency range (3.5 ~ 28GHz), there is a difficulty in increasing the transmission loss.

따라서 특히 고주파가 요구되는 5G 이동통신에 적용되는 연성회로기판에서는 사용하는데 문제점이 있기 때문에, 고주파 영역에서도 유전 특성 및 접착력, 내열성이 모두 우수한 커버레이 필름이 요구된다.Therefore, since there is a problem in using a flexible circuit board applied to 5G mobile communication that requires a high frequency in particular, a coverlay film excellent in both dielectric properties, adhesion, and heat resistance is required even in the high frequency region.

1. 한국등록특허 제10-1397950호1. Korean Patent Registration No. 10-1397950

본 발명은 전술한 종래 기술의 문제점을 해결하여 고주파 영역에서 전송손실을 감소시킬 수 있는 저유전 특성 구현하는 저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물을 제공하기 위한 것이다.An object of the present invention is to provide a low-dielectric coverlay film and a composition for a cover-lay film therefor, which realizes low-dielectric properties capable of reducing transmission loss in a high frequency region by solving the problems of the prior art described above.

상기 상술한 목적을 달성하기 위하여 본 발명은 저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물을 제공한다.In order to achieve the above object, the present invention provides a low dielectric coverlay film and a composition for a coverlay film therefor.

본 발명은 액정 고분자 필름층, 저유전 접착 수지층이 순차적으로 적층되어 있는 커버레이 필름을 제공한다.The present invention provides a coverlay film in which a liquid crystal polymer film layer and a low-dielectric adhesive resin layer are sequentially stacked.

본 발명의 커버레이 필름은 통상의 폴리이미드(PI) 필름을 사용하는 대신 액정 고분자 필름층을 사용하여 유전상수 및 유전손실을 고주파 영역에 요구되는 수준으로 낮출 수 있다.The coverlay film of the present invention uses a liquid crystal polymer film layer instead of using a conventional polyimide (PI) film, so that the dielectric constant and dielectric loss can be reduced to the level required in the high frequency region.

또한 본 발명은 액정 고분자 필름층 및 저유전 접착 수지층 위에 추가로 이형 필름층이 순차로 적층되어 있는 커버레이 필름을 제공할 수 있다.In addition, the present invention can provide a coverlay film in which a release film layer is sequentially laminated on a liquid crystal polymer film layer and a low-dielectric adhesive resin layer.

상기 이형 필름층을 이루는 물질은 손상 없이 박리될 수 있는 것이라면 특별히 한정되지 않으나, 폴리에스터, 폴리에틸렌테레프탈레이트, 폴리에틸렌, 폴리프로필렌, 폴리에스테르, 또는 실리콘 등을 들 수 있다.The material forming the release film layer is not particularly limited as long as it can be peeled off without damage, but may include polyester, polyethylene terephthalate, polyethylene, polypropylene, polyester, or silicone.

상기 저유전 접착 수지층이란 3.5 내지 28 GHz의 고주파 영역에서 유전 특성이 3 미만이고 유전손실이 0.005 이하인 필름 조성물로 형성된 층을 의미한다. The low dielectric adhesive resin layer refers to a layer formed of a film composition having a dielectric property of less than 3 and a dielectric loss of 0.005 or less in a high frequency range of 3.5 to 28 GHz.

본 발명의 커버레이 필름의 상기 저유전 접착 수치층은, 조성물 총 중량 대비, 아민형 에폭시 레진을 1 내지 5 중량%, 및 폴리이미드계 레진을 20 내지 25 중량% 포함하는 커버레이 필름용 조성물을 통해 제공할 수 있다.The low dielectric adhesive numerical layer of the coverlay film of the present invention comprises a composition for a coverlay film comprising 1 to 5% by weight of an amine-type epoxy resin, and 20 to 25% by weight of a polyimide-based resin based on the total weight of the composition. Can be provided through.

상기 아민형 에폭시 레진은 기존의 에폭시계 레진 경화 반응성 및 레진 흐름성이 우수하고, 상기 폴리이미계 레진은 접착력이 높아, 유전상수는 3 미만이고 유전손실은 0.005이하로서 고주파 영역에서 요구되는 저유전 조건을 충족하는 것은 물론 우수한 접착력까지 확보할 수 있다.The amine-type epoxy resin has excellent curing reactivity and resin flowability of the existing epoxy-based resin, and the polyimide resin has high adhesion, a dielectric constant of less than 3, and a dielectric loss of 0.005 or less, which is required in the high-frequency region. In addition to meeting the conditions, it is possible to secure excellent adhesion.

상기 본 발명의 조성물은 에스테르 경화제, 경화 보조제, 또는 이들의 혼합물을 추가로 포함할 수 있다. 이를 통해 내열성을 추가 확보할 수 있어 더욱 우수한 품질을 확보할 수 있다.The composition of the present invention may further include an ester curing agent, a curing aid, or a mixture thereof. Through this, heat resistance can be additionally secured, so that more excellent quality can be secured.

상기 아민형 에폭시 레진은 특별히 제한되지 않지만, 벤질디메틸아민, 트리에탄올아민, 트리에틸렌디아민, 디메틸아미노에탄올, 트리(디메틸아미노메틸)페놀 등일 수 있고, 구체적으로 다음 화학식 구조를 갖는 화합물일 수 있다.The amine-type epoxy resin is not particularly limited, but may be benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tri(dimethylaminomethyl)phenol, and the like, and specifically, may be a compound having the following formula structure.

[화학식 1][Formula 1]

Figure 112018130835104-pat00001
Figure 112018130835104-pat00001

(N,N-디글리시딜-4-글리시딜옥사닐린, N,N-Diglycidyl-4-glycidyloxyaniline)(N,N-Diglycidyl-4-glycidyloxaniline, N,N-Diglycidyl-4-glycidyloxyaniline)

[화학식 2][Formula 2]

Figure 112018130835104-pat00002
Figure 112018130835104-pat00002

상기 식에서 X는 알킬 사슬이고, 구체적으로 CnH2n (n=1~5), 터트-부틸일 수 있고, 더 구체적으로, CH2 (테트라글리시딜메틸렌디아닐린, Tetraglycidyl methylenedianiline)일 수 있다.In the above formula, X is an alkyl chain, specifically C n H 2n (n = 1 to 5), may be tert-butyl, more specifically, CH 2 (tetraglycidyl methylenedianiline, Tetraglycidyl methylenedianiline). .

상기 폴리이미드계 레진은 반복단위 내에 이미드 링키지를 함유하고 있는 고분자로서 특별히 제한되지 않고, 일례로 알킬 사슬이 치환된 치환체 등을 포함하며, 더 구체적으로 다음의 구조를 갖는 화합물일 수 있다.The polyimide resin is not particularly limited as a polymer containing an imide linkage in a repeating unit, and includes, for example, a substituent substituted with an alkyl chain, and more specifically may be a compound having the following structure.

[화학식 3-1][Formula 3-1]

Figure 112018130835104-pat00003
Figure 112018130835104-pat00003

[화학식 3-2][Chemical Formula 3-2]

Figure 112018130835104-pat00004
Figure 112018130835104-pat00004

[화학식 3-3][Chemical Formula 3-3]

Figure 112018130835104-pat00005
Figure 112018130835104-pat00005

[화학식 3-4][Formula 3-4]

Figure 112018130835104-pat00006
Figure 112018130835104-pat00006

[화학식 3-5][Formula 3-5]

Figure 112018130835104-pat00007
Figure 112018130835104-pat00007

[화학식 3-6][Formula 3-6]

Figure 112018130835104-pat00008
Figure 112018130835104-pat00008

상기 에스테르 경화제는 다음의 반응식을 통하여 아민형 에폭시 레진과 경화 반응을 일으키는 역할을 한다. The ester curing agent serves to cause a curing reaction with an amine-type epoxy resin through the following reaction formula.

[반응식 1] [Scheme 1]

Figure 112018130835104-pat00009
Figure 112018130835104-pat00009

따라서, 에스테르 경화제는 상기 경화 반응을 일으킬 수 있는 물질이면 특별히 한정되지 않고, 페놀 에스테르 화합물, 티오페놀 에스테르 화합물, N-히드록시아민에스테르 화합물, 복소환 히드록시 화합물의 에스테르 화합물 등일 수 있으며, 더 구체적으로 다음 화학식 구조를 갖는 화합물일 수 있다.Therefore, the ester curing agent is not particularly limited as long as it is a substance capable of causing the curing reaction, and may be a phenol ester compound, a thiophenol ester compound, an N-hydroxyamine ester compound, an ester compound of a heterocyclic hydroxy compound, and the like, and more specifically It may be a compound having the following formula structure.

[화학식 4][Formula 4]

Figure 112018130835104-pat00010
Figure 112018130835104-pat00010

상기 식에서 R은

Figure 112018130835104-pat00011
임.In the above formula, R is
Figure 112018130835104-pat00011
being.

상기 경화 보조제는 특별히 제한되지 않지만, 이미다졸계 경화 촉진제 등의 각종 경화 촉진제를 사용할 수 있다. 경화 촉진제 중에서도, 이미다졸계 경화 촉진제가, 필름용 조성물의 다른 성분과의 상용성, 및 필름용 조성물의 경화 속도의 측면에서 우수하기 때문에 바람직하다. 더 구체적으로 다음 화학식 구조를 갖는 화합물일 수 있다.The curing aid is not particularly limited, but various curing accelerators such as imidazole-based curing accelerators can be used. Among the curing accelerators, an imidazole-based curing accelerator is preferable because it is excellent in terms of compatibility with other components of the composition for films and curing speed of the composition for films. More specifically, it may be a compound having the following formula structure.

[화학식 5][Formula 5]

Figure 112018130835104-pat00012
Figure 112018130835104-pat00012

(6-[2-(2-Ethyl-4-methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine)(6-[2-(2-Ethyl-4-methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine)

[화학식 6][Formula 6]

Figure 112018130835104-pat00013
Figure 112018130835104-pat00013

(6-[2-(2-Methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine)(6-[2-(2-Methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine)

[화학식 7][Formula 7]

Figure 112018130835104-pat00014
Figure 112018130835104-pat00014

(1-Cyanomethyl-2-ethyl-4-methylimidazole)(1-Cyanomethyl-2-ethyl-4-methylimidazole)

본 발명의 조성물은 필러, 중합개시제, 점착성 부여제, 소포제, 유동조정제, 성막보조제, 분산보조제, 도전성 입자 등의 통상적인 첨가제를 추가로 포함할 수 있다. The composition of the present invention may further contain conventional additives such as fillers, polymerization initiators, tackifiers, defoaming agents, flow regulators, film forming aids, dispersion aids, and conductive particles.

상기 필러는 특별히 제한되지 않지만, 알루미나, 실리카 및 알루미늄 트리 하이드록시이드 중에서 선택된 어느 하나 이상일 수 있다.The filler is not particularly limited, but may be any one or more selected from alumina, silica, and aluminum trihydroxyide.

상기 첨가제는 특별히 제한되지 않지만, 실란 커플링제, 계면활성제 및 산화방지제 중에서 선택된 어느 하나 이상일 수 있다.The additive is not particularly limited, but may be any one or more selected from a silane coupling agent, a surfactant, and an antioxidant.

본 발명의 구현예에 따르면, 상기 조성물은 조성물 총 중량 대비 아민형 에폭시 레진을 1 내지 5 중량%, 구체적으로, 1.2 내지 2.5 중량% 포함할 수 있다. 상기 아민형 에폭시 레진은 최소한의 경화 반응 및 내열성을 위하여 1 중량%이상 필요하고, 5 중량% 초과시 유전 특성 저하될 수 있다.According to an embodiment of the present invention, the composition may contain 1 to 5% by weight, specifically, 1.2 to 2.5% by weight of an amine-type epoxy resin based on the total weight of the composition. The amine-type epoxy resin is required at least 1% by weight for minimum curing reaction and heat resistance, and when it exceeds 5% by weight, dielectric properties may be deteriorated.

본 발명의 구현예에 따르면, 상기 조성물은 조성물 총 중량 대비 폴리이미드계 레진을 20 내지 25 중량%, 구체적으로, 21.5 내지 24.5 중량% 포함할 수 있다. 유연성 및 저유전 특성 확보를 위하여 20 중량%이상 필요하고, 25 중량%초과시에는 미반응이 발생할 수 있다.According to an embodiment of the present invention, the composition may contain 20 to 25% by weight, specifically, 21.5 to 24.5% by weight of a polyimide resin based on the total weight of the composition. In order to secure flexibility and low dielectric properties, more than 20% by weight is required, and when it exceeds 25% by weight, unreacted may occur.

본 발명의 구현예에 따르면, 상기 조성물은 조성물 총 중량 대비 에스테르 경화제를 1 내지 10 중량%, 경화 보조제를 0.001 내지 1 중량% 포함한다. 이를 통해 자칫 유전 특성이 저하될 수 있는 아민형 경화제를 사용하지 않고, 에스테르 경화제를 더욱 포함하여 접착력은 물론 내열성을 추가 확보할 수 있다. 이 때 경화 보조제를 추가로 포함할 수 있으며, 구체적으로 이미다졸계의 경화 촉진제를 사용할 수 있다.According to an embodiment of the present invention, the composition comprises 1 to 10% by weight of an ester curing agent and 0.001 to 1% by weight of a curing aid based on the total weight of the composition. Through this, it is possible to additionally secure heat resistance as well as adhesion by further including an ester curing agent without using an amine-type curing agent that may deteriorate dielectric properties. In this case, a curing aid may be additionally included, and specifically an imidazole-based curing accelerator may be used.

본 발명의 조성물은 그 외 커버레이 필름의 접착용 조성물에 포함될 수 있는 필러, 실란 커플링제, 계면활성제, 산화 방지제 등의 성분을 추가로 포함할 수 있다. The composition of the present invention may further include components such as fillers, silane coupling agents, surfactants, antioxidants, etc. that may be included in the adhesive composition of the coverlay film.

본 발명은 상기 상술한 필름용 조성물로 저유전 접착 수지층을 형성한 커버레이 필름을 제공한다. The present invention provides a coverlay film in which a low-dielectric adhesive resin layer is formed with the above-described film composition.

본 발명은 상기 상술한 필름용 조성물을 사용하여 제작되는 접착 필름을 제공한다. The present invention provides an adhesive film produced by using the above-described film composition.

본 발명의 구현예에 따르면, 액정 고분자 필름층, 상술한 필름용 조성물로 제작한 접착 수지층 및 이형 필름층이 순차로 적층되어 있는 커버레이 필름을 제공한다.According to an embodiment of the present invention, there is provided a coverlay film in which a liquid crystal polymer film layer, an adhesive resin layer made of the above-described film composition, and a release film layer are sequentially laminated.

본 발명의 접착 필름 및 커버레이 필름은, 본 발명의 필름용 조성물로부터 공지의 방법에 의해 얻을 수 있다. 예를 들면, 본 발명의 필름용 조성물을 지지체의 적어도 편면에 도포하여, 건조시킨 후, 지지체 부착 필름, 또는, 지지체로부터 박리한 필름으로서 제공할 수 있다.The adhesive film and coverlay film of the present invention can be obtained from the composition for films of the present invention by a known method. For example, the composition for films of the present invention can be applied to at least one side of a support, dried, and then provided as a film with a support or as a film peeled from the support.

본 발명의 접착 필름 및 커버레이 필름의 두께는, 용도에 따라서 요구되는 기계적 강도 등의 특성을 토대로 하여 적절히 설계되지만, 일반적으로 1~100 ㎛이고, 박막화가 요구되는 경우, 1~50 ㎛인 것이 바람직하다.The thickness of the adhesive film and the coverlay film of the present invention is appropriately designed based on characteristics such as mechanical strength required according to the application, but is generally 1 to 100 μm, and when thinning is required, it is 1 to 50 μm. desirable.

본 발명의 접착 필름 및 커버레이 필름은, 고주파에서의 유전 특성이 우수하다. 구체적으로는, 고주파 3.5~28 ㎓의 영역에서의 유전상수는 3 미만이고, 유전손실은 0.005 이하로서 우수하다. 또한, 본 발명의 접착 필름 및 커버레이 필름은 접착력이 0.5 kgf/cm 이상이고, 내열 한계도 280 이상으로 우수하다.The adhesive film and the coverlay film of the present invention are excellent in dielectric properties at high frequencies. Specifically, the dielectric constant in the high frequency range of 3.5 to 28 GHz is less than 3, and the dielectric loss is excellent as 0.005 or less. In addition, the adhesive film and the coverlay film of the present invention have an adhesive strength of 0.5 kgf/cm or more, and a heat resistance limit of 280 or more.

본 발명의 저유전 커버레이 필름 및 이를 위한 커버레이 필름용 조성물은 고주파 영역에서 고주파 3.5~28 ㎓의 영역에서의 유전상수는 3 미만이고, 유전손실은 0.005 이하로서 전송 손실을 감소시키는 것은 물론 다양한 제품에 적용되는 연성회로기판에 필요한 우수한 내열성, 접착력을 제공할 수 있다.The low dielectric coverlay film of the present invention and the composition for a coverlay film therefor have a dielectric constant of less than 3 in a high frequency range of 3.5 to 28 ㎓ and a dielectric loss of 0.005 or less in the high frequency range, reducing transmission loss as well as various It can provide excellent heat resistance and adhesion required for flexible circuit boards applied to products.

도 1은 본 발명의 일 실시예에 따라 제작한 커버레이 필름의 모식도이다.1 is a schematic diagram of a coverlay film manufactured according to an embodiment of the present invention.

이하, 실시 예를 통해서 본 발명을 보다 상세히 설명하기로 한다. 하지만, 이들은 본 발명을 보다 상세하게 설명하기 위한 것일 뿐 본 발명의 권리범위가 이에 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail through examples. However, these are only for describing the present invention in more detail, and the scope of the present invention is not limited thereto.

1. 커버레이 필름용 조성물의 제조 1. Preparation of composition for coverlay film

하기 표의 조성대로 혼합하여 통상적인 제조 방법을 사용하여 커버레이 필름용 조성물을 제조하였다. A composition for a coverlay film was prepared by mixing according to the composition in the following table using a conventional manufacturing method.

구성 성분Composition 물질명Substance name 비교예 1Comparative Example 1 비교예 2Comparative Example 2 비교예 3Comparative Example 3 비교예 4Comparative Example 4 실시예 1Example 1 실시예 2Example 2 에폭시 레진Epoxy resin DGEBBA1 )
(비스-페놀 A형 에폭시)DGEBBA 1 )
(Bis-phenol A type epoxy) 1818 아민형 에폭시 레진Amine type epoxy resin N,N-디글리시딜-4-글리시딜옥사닐린N,N-diglycidyl-4-glycidyloxaniline 1.01.0 2.42.4 5.05.0 1.41.4 2.42.4 폴리이미드계 레진Polyimide resin 알킬사슬이 치환된 폴리이미드 레진(Arakawa社
PIAD 레진)Polyimide resin substituted with an alkyl chain (Arakawa)
PIAD resin) 24.324.3 20.020.0 22.422.4 24.324.3 22.022.0 에스테르 경화제Ester hardener DIC社HPC-8000-65TDIC company HPC-8000-65T 3.43.4 아민형 경화제Amine type hardener 3, 3'-디아미노디페닐 설폰3, 3'-diaminodiphenyl sulfone 22 경화 보조제Curing aid 6-[2-(2-에틸-4-메틸-1H-이미다졸-1-일)에틸]-1,3,5-트리진-2,4-디아민6-[2-(2-ethyl-4-methyl-1H-imidazol-1-yl)ethyl]-1,3,5-triazine-2,4-diamine 0.10.1 필러filler 알루미나Alumina 1010 실리카Silica 6.36.3 10.010.0 5.05.0 6.76.7 5.15.1 부타디엔 고무Butadiene rubber 아크릴로니트릴-부타디엔 러버Acrylonitrile-butadiene rubber 77 첨가제additive 신에츠社KBM-603Shin-Etsu Corporation KBM-603 1One 0.10.1 0.10.1 0.10.1 0.10.1 용제solvent 메틸에틸케톤, 톨루엔Methyl ethyl ketone, toluene 6262 67.567.5 67.567.5 67.567.5 67.567.5 67.067.0 합계Sum 100100 100100 100100 100100 100100 100100

1) DGEBBA의 화학식은 다음과 같음. One) The formula of DGEBBA is as follows.

Figure 112018130835104-pat00015
Figure 112018130835104-pat00015

2. 본 발명에 따른 접착 필름의 특성 평가2. Evaluation of the properties of the adhesive film according to the present invention

상기에서 제조한 조성물로 제조한 접착 필름에 대하여 유전상수, 유전손실, 접착력 및 내열한계를 평가하였다. 평가 결과는 다음 표 2와 같다.The dielectric constant, dielectric loss, adhesion, and heat resistance limits were evaluated for the adhesive film prepared with the composition prepared above. The evaluation results are shown in Table 2 below.

특 성Characteristics 단위unit 비교예 1Comparative Example 1 비교예 2.Comparative Example 2. 비교예 3Comparative Example 3 비교예 4Comparative Example 4 실시예 1Example 1 실시예 2Example 2 유전상수
(10GHz)Dielectric constant
(10GHz) -- 3.43.4 2.72.7 2.82.8 3.03.0 2.82.8 2.72.7 유전손실(10GHz)Dielectric loss (10GHz) -- 0.0250.025 0.0040.004 0.0070.007 0.0100.010 0.0050.005 0.0050.005 90°Peel Strength(접착력)90°Peel Strength Kgf/㎝Kgf/cm > 0.7> 0.7 0.60.6 0.50.5 1.01.0 0.50.5 0.70.7 내열 한계
(Solder Floating, 30sec)Heat resistance limit
(Solder Floating, 30sec) ℃℃ 288288 270270 280280 290290 280280 295295

실험 결과, 통상의 에폭시 레진 필름은 유전상수가 3 초과하고 유전손실이 0.0025라서 고주파 영역 요건을 모두 충족하지 못하였고, 아민형 에폭시 레진을 사용하더라도 비교예 3 및 4는 유전손실이 0.005 초과하여 불만족스럽고, 비교예 2는 유전상수 및 유전손실은 만족하였으나 내열성이 낮아 그다지 효율적이지 못한 반면, 본 발명의 실시예 1 및 2의 유전상수 및 유전손실이 고주파 영역 요구 요건을 충족한 것은 물론 내열성까지 우수한 것을 알 수 있다.As a result of the experiment, a typical epoxy resin film did not meet all the high-frequency region requirements because the dielectric constant exceeded 3 and the dielectric loss was 0.0025, and even if an amine-type epoxy resin was used, Comparative Examples 3 and 4 were unsatisfied with dielectric loss exceeding 0.005 Comparative Example 2 satisfies the dielectric constant and dielectric loss, but is not very efficient due to its low heat resistance, whereas the dielectric constant and dielectric loss of Examples 1 and 2 of the present invention satisfy the requirements of the high frequency region as well as excellent heat resistance. Can be seen.

3. 본 발명에 따른 액상 고분자 필름의 유전 특성 평가3. Evaluation of dielectric properties of the liquid polymer film according to the present invention

본 발명의 액상 고분자 필름의 유전 특성을 기존의 폴리이미드계 필름과 대비하여 비교하였다. 측정 방법은 상기와 동일하다. 비교 결과는 다음 표와 같다. The dielectric properties of the liquid polymer film of the present invention were compared with that of a conventional polyimide-based film. The measurement method is the same as above. The comparison results are shown in the following table.

특 성Characteristics 폴리이미드 필름
(비교예 5)Polyimide film
(Comparative Example 5) 액상 고분자 필름
(실시예 3)Liquid polymer film
(Example 3) 유전상수
(10GHz)Dielectric constant
(10GHz) 3.53.5 2.82.8 유전손실
(10GHz)Dielectric loss
(10GHz) 0.0080.008 0.0020.002

실험 결과, 폴리이미드 필름 보다 액상 고분자 필름의 유전상수 및 유전손실이 낮아 고주파 영역에서 유전 특성이 우수함을 확인하였다.As a result of the experiment, it was confirmed that the dielectric constant and dielectric loss of the liquid polymer film was lower than that of the polyimide film, and thus the dielectric properties were excellent in the high frequency region.

4. 본 발명에 따른 커버레이 필름의 특성 평가4. Evaluation of the properties of the coverlay film according to the present invention

본 발명에 따른 커버레이 필름의 전체적 특성을 평가하기 위하여, 상기의 액상 고분자 필름에 접착 필름층을 적층하여 커버레이 필름을 제조하여 (실시예 4) 상기와 동일하게 특성을 평가하였다. 평가 결과 다음과 같다. In order to evaluate the overall characteristics of the coverlay film according to the present invention, a coverlay film was prepared by laminating an adhesive film layer on the liquid polymer film (Example 4), and properties were evaluated in the same manner as above. The evaluation results are as follows.

특 성Characteristics 단위unit 비교예 1Comparative Example 1 실시예 1Example 1 실시예 2Example 2 실시예 4Example 4 유전상수(10GHz)Dielectric constant (10GHz) -- 3.43.4 2.82.8 2.72.7 2.82.8 유전손실(10GHz)Dielectric loss (10GHz) -- 0.0250.025 0.0050.005 0.0050.005 0.0040.004 90°Peel Strength(접착력)90°Peel Strength Kgf/㎝Kgf/cm > 0.7> 0.7 0.50.5 0.70.7 0.70.7 내열 한계
(Solder Floating, 30sec)Heat resistance limit
(Solder Floating, 30sec) ℃℃ 288288 280280 295295 310310

평가 결과, 본원발명의 실시예 모두 바람직한 유전상수 및 유전손실, 접착력 및 내열한계를 갖는 것을 확인할 수 있었고, 특히 본원발명에 따른 액정 고분자 필름에 접착 필름용 조성물을 모두 적용하여 제조한 커버레이 필름인 실시예 4의 유전특성, 접착력 및 내열 한계 모두 현저히 우수한 것을 확인할 수 있다.As a result of the evaluation, it was confirmed that all of the examples of the present invention had desirable dielectric constant and dielectric loss, adhesive strength, and heat resistance. In particular, a coverlay film manufactured by applying all of the adhesive film composition to the liquid crystal polymer film according to the present invention It can be seen that all of the dielectric properties, adhesion, and heat resistance limits of Example 4 are remarkably excellent.

이상에서, 출원인은 본 발명의 바람직한 실시 예들을 설명하였지만, 이와 같은 실시예들은 본 발명의 기술적 사상을 구현하는 일 실시예일 뿐이며 본 발명의 기술적 사상을 구현하는 한 어떠한 변경예 또는 수정예도 본 발명의 범위에 속하는 것으로 해석되어야 한다.In the above, the applicant has described the preferred embodiments of the present invention, but such embodiments are only one embodiment embodying the technical idea of the present invention, and any change or modification of the present invention as long as the technical idea of the present invention is implemented. Should be construed as falling within the scope.

Claims (18)

액정 고분자 필름층 및 저유전 접착 수지층이 순차적으로 적층되어 있는 커버레이 필름으로서,
상기 저유전 접착 수지층은 커버레이 필름용 조성물로 형성되고,
상기 커버레이 필름용 조성물은 조성물 총 중량 대비, 아민형 에폭시 레진을 1.2 내지 2.5 중량%, 및 폴리이미드계 레진을 21.5 내지 24.5 중량% 포함하고,
상기 아민형 에폭시 레진은 벤질디메틸아민, 트리에탄올아민, 트리에틸렌디아민, 디메틸아미노에탄올, 트리(디메틸아미노메틸)페놀, 및 다음 화학식 구조를 갖는 화합물 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름.
[화학식 1]
Figure 112020057535113-pat00021

[화학식 2]
Figure 112020057535113-pat00022

(상기 식에서, X는 알킬 사슬임)
As a coverlay film in which a liquid crystal polymer film layer and a low-dielectric adhesive resin layer are sequentially laminated,
The low dielectric adhesive resin layer is formed of a composition for a coverlay film,
The composition for the coverlay film comprises 1.2 to 2.5% by weight of an amine-type epoxy resin, and 21.5 to 24.5% by weight of a polyimide resin, based on the total weight of the composition,
The amine-type epoxy resin is a coverlay film, characterized in that at least one selected from benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tri(dimethylaminomethyl)phenol, and a compound having the following formula structure.
[Formula 1]
Figure 112020057535113-pat00021

[Formula 2]
Figure 112020057535113-pat00022

(Wherein, X is an alkyl chain)
 제1항에 있어서,
이형 필름층이 추가로 순차적으로 적층되어 있는 커버레이 필름.
The method of claim 1,
A coverlay film in which a release film layer is additionally laminated in sequence.
 삭제delete 제1항에 있어서,
상기 조성물은 에스테르 경화제, 경화 보조제, 또는 이들의 혼합물을 추가로 포함하는 것을 특징으로 하는 커버레이 필름.
The method of claim 1,
The composition is a coverlay film, characterized in that it further comprises an ester curing agent, a curing aid, or a mixture thereof.
 삭제delete 제4항에 있어서,
상기 에스테르 경화제는 페놀 에스테르 화합물, 티오페놀 에스테르 화합물, N-히드록시아민에스테르 화합물 및 복소환 히드록시 화합물의 에스테르 화합물 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름.
The method of claim 4,
The ester curing agent is a coverlay film, characterized in that at least one selected from a phenol ester compound, a thiophenol ester compound, an N-hydroxyamine ester compound, and an ester compound of a heterocyclic hydroxy compound.
 제4항에 있어서,
상기 경화 보조제는 이미다졸계 경화 촉진제인 것을 특징으로 하는 커버레이 필름.
The method of claim 4,
The curing aid is a coverlay film, characterized in that the imidazole-based curing accelerator.
 제4항에 있어서,
상기 조성물은 조성물 총 중량 대비 에스테르 경화제를 1 내지 10 중량%, 경화 보조제를 0.001 내지 1 중량% 포함하는 것을 특징으로 하는 커버레이 필름.
The method of claim 4,
The composition is a coverlay film comprising 1 to 10% by weight of an ester curing agent and 0.001 to 1% by weight of a curing aid based on the total weight of the composition.
 저유전 접착 수지층을 형성하기 위한 커버레이 필름용 조성물로서,
상기 커버레이 필름용 조성물은 조성물 총 중량 대비, 아민형 에폭시 레진을 1.2 내지 2.5 중량%, 및 폴리이미드계 레진을 21.5 내지 24.5 중량% 포함하고,
상기 아민형 에폭시 레진은 벤질디메틸아민, 트리에탄올아민, 트리에틸렌디아민, 디메틸아미노에탄올, 트리(디메틸아미노메틸)페놀, 및 다음 화학식 구조를 갖는 화합물 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름용 조성물.
[화학식 1]
Figure 112020057535113-pat00023

[화학식 2]
Figure 112020057535113-pat00024

(상기 식에서, X는 알킬 사슬임)
As a composition for a coverlay film for forming a low dielectric adhesive resin layer,
The composition for the coverlay film contains 1.2 to 2.5% by weight of an amine-type epoxy resin, and 21.5 to 24.5% by weight of a polyimide resin, based on the total weight of the composition,
The amine-type epoxy resin is a composition for a coverlay film, characterized in that at least one selected from benzyldimethylamine, triethanolamine, triethylenediamine, dimethylaminoethanol, tri(dimethylaminomethyl)phenol, and a compound having the following formula structure .
[Formula 1]
Figure 112020057535113-pat00023

[Formula 2]
Figure 112020057535113-pat00024

(Wherein, X is an alkyl chain)
 제9항에 있어서,
상기 조성물은 에스테르 경화제, 경화 보조제, 또는 이들의 혼합물을 추가로 포함하는 것을 특징으로 하는 커버레이 필름용 조성물.
The method of claim 9,
The composition is a composition for a coverlay film, characterized in that it further comprises an ester curing agent, a curing aid, or a mixture thereof.
 삭제delete 제10항에 있어서,
상기 에스테르 경화제는 페놀 에스테르 화합물, 티오페놀 에스테르 화합물, N-히드록시아민에스테르 화합물 및 복소환 히드록시 화합물의 에스테르 화합물 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름용 조성물.
The method of claim 10,
The ester curing agent is a composition for a coverlay film, characterized in that at least one selected from a phenol ester compound, a thiophenol ester compound, an N-hydroxyamine ester compound and an ester compound of a heterocyclic hydroxy compound.
 제10항에 있어서,
상기 경화 보조제는 이미다졸계 경화 촉진제인 것을 특징으로 하는 커버레이 필름용 조성물.
The method of claim 10,
The curing aid is an imidazole-based curing accelerator composition for a coverlay film, characterized in that.
 제9항에 있어서, 상기 조성물은 필러 및 첨가제를 추가로 포함하는 것을 특징으로 하는 커버레이 필름용 조성물.
The composition for a coverlay film according to claim 9, wherein the composition further comprises a filler and an additive.
 제14항에 있어서, 상기 필러는 알루미나, 실리카 및 알루미늄 트리 하이드록시이드 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름용 조성물.
The composition for a coverlay film according to claim 14, wherein the filler is at least one selected from alumina, silica, and aluminum trihydroxide.
 제14항에 있어서, 상기 첨가제는 실란 커플링제, 계면활성제 및 산화방지제 중에서 선택된 어느 하나 이상인 것을 특징으로 하는 커버레이 필름용 조성물.
The composition for a coverlay film according to claim 14, wherein the additive is at least one selected from a silane coupling agent, a surfactant, and an antioxidant.
 제10항에 있어서, 상기 조성물은 조성물 총 중량 대비 에스테르 경화제를 1 내지 10 중량%, 경화 보조제를 0.001 내지 1 중량% 포함하는 것을 특징으로 하는 커버레이 필름용 조성물.
The composition for a coverlay film according to claim 10, wherein the composition comprises 1 to 10% by weight of an ester curing agent and 0.001 to 1% by weight of a curing aid based on the total weight of the composition.
 제9항, 제10항 및 제12항 내지 제17항 중 어느 한 항에 따른 커버레이 필름용 조성물을 사용하여 제작한 접착 필름.An adhesive film prepared by using the composition for a coverlay film according to any one of claims 9, 10, and 12 to 17.
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