KR20200074527A - Display apparatus having at least one pad - Google Patents

Abstract

The present invention relates to a display device including at least one pad positioned on a pad area of a device substrate. A device substrate may include a display area on which a light emitting device is positioned. The pad area of the device substrate may be positioned at the outside the display area of the device substrate. The device substrate may be combined with a sealing substrate by a sealing layer covering the light emitting device. Each of the sealing layer and the sealing substrate may include a pad open hole overlapping with the pad area of the device substrate. Accordingly, process efficiency may be improved in the display device and cost of a process may be reduced.

Description

Display apparatus having at least one pad

The present invention relates to a display device in which at least one pad is positioned on a pad area of an element substrate.

In general, electronic devices such as monitors, TVs, laptops, and digital cameras include display devices for realizing images. For example, the display device may be an organic light emitting display device including an organic light emitting material.

The display device may include at least one pad for receiving a signal from the outside. For example, in the display device, the device substrate includes a display area where the light emitting device is located and a non-display area located outside the display area, wherein the at least one pad is on the non-display area of the device substrate. Can be located.

The device substrate may be combined with an encapsulation substrate by an encapsulation layer covering the light emitting device. The encapsulation layer and the encapsulation substrate may expose the pad located on the device substrate. The encapsulation layer and the encapsulation substrate may have a smaller size than the device substrate. For example, the pad region of the device substrate on which the pad is located may be located outside the encapsulation layer and the encapsulation substrate.

However, the pad area of the device substrate positioned outside the encapsulation substrate and the outer area of the device substrate positioned outside the pad area may be easily damaged by external impact. Accordingly, in the display device, a separate component, such as a back cover, is used to protect the pad region and the outer region of the device substrate, so that process efficiency may decrease and process cost may increase.

The problem to be solved by the present invention is to provide a display device capable of minimizing damage to the non-display area of the device substrate due to external impact without using a separate component.

The problems to be solved by the present invention are not limited to the aforementioned problems. The tasks not mentioned here will be clearly understood by those skilled in the art from the following description.

The display device according to the technical idea of the present invention for achieving the above-mentioned problems includes an element substrate. The device substrate includes a display area and a pad area. The pad area is located outside the display area. The light emitting element is positioned on the display area of the element substrate. The light emitting element is covered by an encapsulation layer. An encapsulation substrate is positioned on the encapsulation layer. The encapsulation layer and the encapsulation substrate each include a pad open hole overlapping the pad region of the device substrate.

At least one pad may be positioned on the pad region of the device substrate. Each pad can be connected to a printed circuit board through a flexible film. The encapsulation substrate may be located between the encapsulation layer and the printed circuit board.

An adhesive member positioned between the encapsulation substrate and the printed circuit board may be further included. The adhesive member may include an insulating material.

The encapsulation substrate may include metal.

The encapsulation substrate may have a larger size than the device substrate.

The encapsulation substrate may include sidewall regions extending on the side surfaces of the device substrate.

The side wall of the pad open hole of the encapsulation substrate overlapping the display area may be inclined.

The inclined sidewall of the pad open hole of the encapsulation substrate may include a first region having a first inclination angle and a second region having a second inclination angle. The first region may be located between the encapsulation layer and the second region. The second inclination angle may be greater than the first inclination angle.

The device substrate may further include an outer region located outside the pad region.

The outer region of the device substrate may contact the encapsulation layer.

The area of the encapsulation layer in contact with the outer region of the device substrate may be 7 mm 2 or more.

The pad opening hole of the encapsulation substrate may extend along the edge of the device substrate.

The side wall of the pad open hole may be covered by an insulating member.

The insulating member can extend onto the outer surface of the encapsulation substrate.

In the display device according to the technical concept of the present invention, a pad opening hole may be respectively located in an encapsulation substrate coupled to an element substrate and an encapsulation layer positioned between the element substrate and the encapsulation substrate. Accordingly, in the display device according to the technical concept of the present invention, external shock applied to the non-display area of the device substrate may be alleviated without using a separate component such as a back cover. Therefore, in the display device according to the technical idea of the present invention, process efficiency can be improved and process cost can be reduced.

1A is a schematic view of a display device according to an embodiment of the present invention.
1B is a view showing a cross-section taken along line I-I' of FIG. 1A.
FIG. 2A is an enlarged view of the region P in FIG. 1B.
FIG. 2B is an enlarged view of the region R in FIG. 1B.
3 is a graph showing the adhesive force according to the adhesive area of the encapsulation layer in the display device according to the embodiment of the present invention.
4 to 6 are views each showing a display device according to another embodiment of the present invention.

The details of the above object and the technical configuration of the present invention and the effect of the effect thereof will be more clearly understood by the following detailed description with reference to the drawings showing embodiments of the present invention. Here, since the embodiments of the present invention are provided to enable the technical spirit of the present invention to be sufficiently transmitted to those skilled in the art, the present invention may be embodied in other forms so as not to be limited to the embodiments described below.

In addition, parts indicated by the same reference numerals throughout the specification mean the same components, and in the drawings, the length and thickness of a layer or region may be exaggerated for convenience. In addition, when the first component is described as being "on" the second component, the first component and the first component are not only located on the upper side in direct contact with the second component, but also the first component and the Also included is the case where the third component is located between the second components.

Here, the terms first, second, etc. are for describing various components, and are used for the purpose of distinguishing one component from other components. However, the first component and the second component may be arbitrarily named according to the convenience of those skilled in the art without departing from the technical spirit of the present invention.

Terms used in the specification of the present invention are only used to describe specific embodiments, and are not intended to limit the present invention. For example, a component expressed as a singular includes a plurality of components unless the context clearly refers to the singular. Further, in the specification of the present invention, terms such as “comprises” or “haves” are intended to designate the existence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, or It should be understood that it does not preclude the existence or addition possibility of other features or numbers, steps, actions, components, parts or combinations of the above.

In addition, unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains. Terms such as those defined in a dictionary used in general should be interpreted as having meanings consistent with meanings in the context of related technologies, and unless they are explicitly defined in the specification of the present invention, in an ideal or excessively formal meaning. Is not interpreted.

(Example)

1A is a schematic view of a display device according to an embodiment of the present invention. 1B is a view showing a cross-section taken along line I-I' of FIG. 1A. FIG. 2A is an enlarged view of the region P in FIG. 1B. FIG. 2B is an enlarged view of the region R in FIG. 1B.

1A, 1B, 2A, and 2B, a display device according to an exemplary embodiment of the present invention may include a device substrate 100. The device substrate 100 may include an insulating material. The device substrate 100 may include a transparent material. For example, the device substrate 100 may include glass or plastic.

The device substrate 100 may include a display area AA and a non-display area NA. The display area AA may implement an image provided to a user. For example, a plurality of light emitting devices 150 may be positioned on the display area AA of the device substrate 100.

The light emitting device 150 may emit light having a specific color. For example, the light emitting device 150 may include a first electrode 151, a light emitting layer 152, and a second electrode 153 stacked on the device substrate 100 in order.

The first electrode 151 may include a conductive material. The first electrode 151 may include a transparent material. For example, the first electrode 151 may be a transparent electrode formed of a transparent conductive material such as ITO and IZO.

The light emitting layer 152 may generate light having luminance corresponding to a voltage difference between the first electrode 151 and the second electrode 153. For example, the light emitting layer 152 may include an emission material layer (EML) including a light emitting material. The light-emitting material may be an organic material. For example, the display device according to an embodiment of the present invention may be an organic light emitting display device including an organic light emitting material.

The light emitting layer 153 may have a multi-layer structure in order to increase light emission efficiency. For example, the emission layer 153 may further include at least one of a hole injection layer (HIL), a hole hydrogen layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).

The second electrode 153 may include a conductive material. The second electrode 153 may include a different material from the first electrode 151. The second electrode 153 may have a higher reflectance than the first electrode 151. For example, the second electrode 153 may include metals such as aluminum (Al) and silver (Ag). Accordingly, in the display device according to an embodiment of the present invention, light generated by the light emitting layer 152 may be emitted to the outside through the first electrode 151 and the device substrate 100.

A driving circuit may be positioned between the display area AA of the device substrate 100 and the light emitting device 150. The operation of the light emitting device 150 may be controlled by the driving circuit. For example, the driving circuit may supply a driving current to the light emitting device 150 according to a gate signal and a data signal. The driving circuit may include at least one thin film transistor 120. For example, the thin film transistor 120 may include a semiconductor pattern 121, a gate insulating film 122, a gate electrode 123, an interlayer insulating film 124, a source electrode 125, and a drain electrode 126. have.

The semiconductor pattern 121 may be positioned close to the device substrate 100. The semiconductor pattern 121 may include a semiconductor material. For example, the semiconductor pattern 121 may include amorphous silicon or polycrystalline silicon. The semiconductor pattern 121 may be an oxide semiconductor. For example, the semiconductor pattern 121 may include IGZO.

The semiconductor pattern 121 may include a source region, a drain region, and a channel region. The channel region may be located between the source region and the drain region. The channel region may have a lower conductivity than the source region and the drain region. For example, the source region and the drain region may have a higher impurity concentration than the channel region.

The gate insulating layer 122 may be positioned on a portion of the semiconductor pattern 121. For example, the gate insulating layer 122 may be positioned on the channel region of the semiconductor pattern 121. The source region and the drain region of the semiconductor pattern 121 may be exposed by the gate insulating layer 122.

The gate insulating layer 122 may include an insulating material. For example, the gate insulating layer 122 may include silicon oxide (SiO) and/or silicon nitride (SiN). The gate insulating layer 122 may have a multi-layer structure. The gate insulating layer 122 may include a high-K material. For example, the gate insulating layer 122 may include hafnium oxide (HfO) or titanium oxide (TiO).

The gate electrode 123 may be positioned on the gate insulating layer 122. The gate electrode 123 may be insulated from the semiconductor pattern 121 by the gate insulating layer 122. For example, the gate electrode 123 may overlap the channel region of the semiconductor pattern 121.

The gate electrode 123 may include a conductive material. For example, the gate electrode 123 may include metal such as aluminum (Al), chromium (Cr), molybdenum (Mo), and tungsten (W).

The interlayer insulating layer 124 may be positioned on the semiconductor pattern 121 and the gate electrode 123. The interlayer insulating layer 124 may extend outside the semiconductor pattern 121. For example, side surfaces of the semiconductor pattern 121 and side surfaces of the gate electrode 123 may be covered by the interlayer insulating layer 124.

The interlayer insulating layer 124 may include an insulating material. For example, the interlayer insulating layer 124 may include silicon oxide (SiO).

The source electrode 125 may be positioned on the interlayer insulating layer 124. The source electrode 125 may be electrically connected to the source region of the semiconductor pattern 121. For example, the interlayer insulating layer 124 may include a contact hole partially exposing the source region of the semiconductor pattern 121. The source electrode 125 may include a region overlapping the source region of the semiconductor pattern 121.

The source electrode 125 may include a conductive material. For example, the source electrode 125 may include metals such as aluminum (Al), chromium (Cr), molybdenum (Mo), and tungsten (W). The source electrode 125 may include a different material from the gate electrode 123.

The drain electrode 126 may be positioned on the interlayer insulating layer 124. The drain electrode 126 may be spaced apart from the source electrode 125. The drain electrode 126 may be electrically connected to the drain region of the semiconductor pattern 121. For example, the interlayer insulating layer 124 may include a contact hole partially exposing the drain region of the semiconductor pattern 121. The drain electrode 126 may include a region overlapping the drain region of the semiconductor pattern 121.

The drain electrode 126 may include a conductive material. For example, the drain electrode 126 may include metals such as aluminum (Al), chromium (Cr), molybdenum (Mo), and tungsten (W). The drain electrode 126 may include the same material as the source electrode 125. The drain electrode 126 may include a different material from the gate electrode 123.

A buffer insulating layer 110 may be positioned between the display area AA of the device substrate 100 and the driving circuit. The buffer insulating layer 110 may prevent contamination by the device substrate 100 in the process of forming the driving circuit. The buffer insulating layer 110 may extend outside the corresponding driving circuit. For example, the buffer insulating layer 110 on the outside of the semiconductor pattern 121 may directly contact the interlayer insulating layer 240.

A lower protective layer 130 and an overcoat layer 140 may be sequentially stacked between the driving circuit and the light emitting device 150. The lower passivation layer 130 may prevent damage to the driving circuit due to external moisture and impact. For example, the thin film transistor 120 may be covered by the lower passivation layer 120. The overcoat layer 140 may remove a step caused by the driving circuit. For example, the surface of the overcoat layer 140 facing the light emitting device 150 may be a flat surface.

The light emitting device 150 may be electrically connected to the thin film transistor 120. For example, the lower passivation layer 130 may include a lower contact hole 130h partially exposing the drain electrode 126 of the thin film transistor 120. The overcoat layer 140 may include an overcoat contact hole 140h overlapping the lower contact hole 130h. The first electrode 151 of the light emitting device 150 is electrically connected to the drain electrode 126 of the thin film transistor 120 through the lower contact hole 130h and the overcoat contact hole 140h. Can. For example, the first electrode 151 may extend along the sidewall of the lower contact hole 130h and the sidewall of the overcoat contact hole 140h to directly contact the drain electrode 126.

The lower protective layer 130 and the overcoat layer 140 may include an insulating material. The overcoat layer 140 may include a different material from the lower protective layer 130. For example, the lower passivation layer 130 may include an inorganic insulating material such as silicon oxide (SiO) and silicon nitride (SiN), and the overcoat layer 140 may include an organic insulating material.

A plurality of light emitting devices 150 may be positioned on the display area AA of the device substrate 100. Each light emitting device 150 can be individually controlled. For example, the first electrode 151 of each light emitting device 150 may be spaced apart from the first electrode 151 of the adjacent light emitting device 150. A bank insulating layer 160 may be positioned between adjacent first electrodes 151. For example, the edge of the first electrode 151 may be covered by the bank insulating layer 160. The light emitting layer 152 and the second electrode 153 may be stacked on a portion of the first electrode 151 exposed by the bank insulating layer 160. Each light emitting device 150 may emit light having the same color as the adjacent light emitting device 150. For example, the emission layer 152 may extend over the bank insulating layer 160. The second electrode 153 may extend along the light emitting layer 152.

A color filter 145 may be positioned between the lower passivation layer 130 and the overcoat layer 140. The color filter 145 may implement a specific color by using light emitted from the light emitting device 150. The color filter 145 may overlap the light emitting device 150. The thin film transistor 120 may be located outside the color filter 145. For example, the thin film transistor 120 may overlap the bank insulating layer 160. Accordingly, the display device according to the exemplary embodiment of the present invention may prevent light emitted from the light emitting device 150 from being blocked by the thin film transistor 120.

An upper passivation layer 170 may be positioned on the light emitting device 150. The upper passivation layer 170 may prevent damage to the light emitting device 150 due to external moisture and impact. For example, the upper passivation layer 170 may extend along the second electrode 153.

The upper passivation layer 170 may include an insulating material. For example, the upper passivation layer 170 may include an inorganic insulating material such as silicon oxide (SiO) and silicon nitride (SiN). The upper passivation layer 170 may have a multi-layer structure.

An encapsulation layer 200 may be positioned on the upper passivation layer 170. The encapsulation layer 200 may prevent damage to the light emitting device 150 due to external moisture and impact. For example, the encapsulation layer 200 may cover the light emitting device 150. The encapsulation layer 200 may include an area directly contacting the display area AA of the device substrate 100.

The encapsulation layer 200 may have a multi-layer structure. For example, the encapsulation layer 200 may be a stacked structure of the lower encapsulation layer 210 and the upper encapsulation layer 220. The lower encapsulation layer 210 may be positioned between the upper passivation layer 170 and the upper encapsulation layer 220. The encapsulation layer 200 may include hygroscopic particles 200p for trapping the infiltrated moisture. The moisture absorbing particles 200p may be dispersed in the upper encapsulation layer 220. Accordingly, in the display device according to the exemplary embodiment of the present invention, the pressure applied to the light emitting element 150 by the expansion of the absorbent particles 200p may be relaxed by the lower encapsulation layer 210.

The encapsulation layer 200 may include an insulating material. The encapsulation layer 200 may include a material that does not require a curing process. For example, the encapsulation layer 200 may include an olefin-based material. Accordingly, in the display device according to the exemplary embodiment of the present invention, deterioration of the light emitting device 150 by the process of forming the encapsulation layer 200 may be prevented. The lower encapsulation layer 210 may include a different material from the upper encapsulation layer 220.

An encapsulation substrate 300 may be positioned on the encapsulation layer 200. The encapsulation substrate 300 may be combined with the device substrate 100 on which the light emitting device 150 is formed by the encapsulation layer 200. For example, the encapsulation substrate 300 may directly contact the encapsulation layer 200. The encapsulation substrate 300 may include a different material from the device substrate 100. The encapsulation substrate 300 may emit heat generated by the operation of the light emitting device 150 and/or the operation of the driving circuit. The encapsulation substrate 300 may have a higher thermal conductivity than the device substrate 100. For example, the encapsulation substrate 300 may include metal, such as aluminum (Al).

The non-display area NA of the device substrate 100 may be located outside the display area AA of the device substrate 100. Circuit parts and signal wirings for providing various signals for realizing an image to the driving circuit and the light emitting device 150 may be positioned on the non-display area NA of the device substrate 100. For example, at least one pad 105 may be positioned on the non-display area NA of the device substrate 100.

The pad 105 may be spaced apart from the side surface of the device substrate 100. For example, the non-display area NA of the device substrate 100 includes a pad area PA where the pad 105 is located and an outer area CA located outside the pad area PA. It can contain. The outer area CA of the device substrate 100 may include a side surface of the device substrate 100.

The encapsulation layer 200 may extend on the non-display area NA of the device substrate 100. For example, the outer area CA of the device substrate 100 may include an area in contact with the encapsulation layer 200. The encapsulation layer 200 may expose the pad 105. For example, the encapsulation layer 200 may include a first pad open hole 200h overlapping the pad area PA of the device substrate 100.

The encapsulation substrate 300 may extend along the encapsulation layer 200. For example, the encapsulation substrate 300 may include an area overlapping the outer area CA of the device substrate 100. The encapsulation substrate 300 may expose the pad 105. For example, the encapsulation substrate 300 may include a second pad open hole 300h overlapping the first pad open hole 200h of the encapsulation layer 200. That is, in the display device according to the exemplary embodiment of the present invention, the encapsulation substrate 500 may overlap the display area AA and the outer area CA of the device substrate 100. Accordingly, an external impact applied to the non-display area NA of the device substrate 100 by the encapsulation substrate 300 may be alleviated in the display device according to the exemplary embodiment of the present invention. Therefore, in the display device according to the exemplary embodiment of the present invention, a separate component for protecting the non-display area NA of the device substrate 100 may not be used.

The first pad open hole 200h of the encapsulation layer 200 may have a larger size than the second pad open hole 300h of the encapsulation substrate 300. Accordingly, in the display device according to the exemplary embodiment of the present invention, the second pad open hole 300h by the deformation of the encapsulation layer 200 generated in the bonding process of the device substrate 100 and the encapsulation substrate 300 ) Size reduction can be prevented. Therefore, in the display device according to the exemplary embodiment of the present invention, the area of the second pad open hole 300h exposing the pad 105 may be stably maintained.

The encapsulation substrate 300 may have a larger size than the device substrate 100. The encapsulation substrate 300 may extend on the side surface of the device substrate 100. For example, the encapsulation substrate 300 is a sidewall region 310 positioned on a side surface of the device substrate 100 and a plane positioned on the surface of the device substrate 100 on which the light emitting device 150 is formed. Area 320 may be included. The device substrate 100 and the encapsulation layer 200 may be positioned between the sidewall regions 310 of the encapsulation substrate 300. For example, the device substrate 100 and the encapsulation layer 200 may be surrounded by the encapsulation substrate 300. Accordingly, in the display device according to the exemplary embodiment of the present invention, damage to the non-display area NA of the device substrate 100 due to external impact may be effectively prevented by the encapsulation substrate 300.

The display device according to an embodiment of the present invention may receive an external signal through the pad 105. For example, each pad 105 may be connected to a printed circuit board (PCB, 400) through a flexible film (500). The printed circuit board 400 may apply a data signal to the pad 105 through the flexible film 500. For example, a plurality of source drive ICs may be mounted on the printed circuit board 400.

The printed circuit board 400 may be located on the outer surface of the encapsulation substrate 300. The encapsulation substrate 300 may be located between the encapsulation layer 200 and the printed circuit board 400. The flexible film 500 may be connected to the pad 105 through the first pad open hole 200h of the encapsulation layer 200 and the second pad open hole 300h of the encapsulation substrate 300. have. Accordingly, in the display device according to an embodiment of the present invention, the non-display area NA of the device substrate 100 is prevented from being damaged by using the encapsulation substrate 400, and the printed circuit board 400 and Between the pads 105 may be electrically connected through the flexible film 500.

The printed circuit board 400 may be attached to the surface of the encapsulation substrate 300 through an adhesive member 600. Accordingly, in the display device according to the exemplary embodiment of the present invention, damage to the flexible circuit 500 due to the flow of the printed circuit board 400 may be prevented. The adhesive member 600 may include an insulating material. Accordingly, in the display device according to the exemplary embodiment of the present invention, malfunction of the printed circuit board 400 by the encapsulation substrate 300 including metal may be prevented.

As a result, the display device according to the exemplary embodiment of the present invention includes the encapsulation layer 200 and the encapsulation substrate (stacked sequentially) on the surface of the element substrate 100 on which the light emitting device 150 and at least one pad 105 are located. 300), wherein the encapsulation layer 200 and the encapsulation substrate 300 overlap the pad area PA of the device substrate 100 on which the pad 105 is located, respectively, a pad open hole 200h, 300h). Accordingly, in the display device according to the exemplary embodiment of the present invention, the non-display area NA of the device substrate 100 covered by the encapsulation substrate 300 may be maximized. Therefore, in the display device according to an embodiment of the present invention, without using a separate component such as a back cover, damage to the non-display area NA of the device substrate 100 due to external impact can be minimized. have.

3 is a graph showing the adhesive force according to the adhesive area of the encapsulation layer in the display device according to the embodiment of the present invention.

Referring to FIG. 3, when the adhesive area of the encapsulation layer is less than 3 mm 2, the adhesive strength of the encapsulation layer does not change significantly, but when the adhesive area of the encapsulation layer is 7 mm 2 or more, it can be seen that the adhesion of the encapsulation layer is greatly increased. That is, in the display device according to the exemplary embodiment of the present invention, the device substrate 100 and the encapsulation layer (by the external force applied during the bonding process and/or transfer connecting the flexible film 500 to the pad 105) The area of the encapsulation layer 200 in contact with the outer area CA of the device substrate 100 may be 7 mm 2 or more so that peeling of the 200 is sufficiently prevented. When the area of the encapsulation layer 200 in contact with the outer area CA increases, the size of the display area AA may decrease. Accordingly, in the display device according to the exemplary embodiment of the present invention, peeling of the device substrate 100 and the encapsulation layer 200 is sufficiently prevented, and the outer area CA is minimized so that the size reduction of the display area AA is minimized. ), the area of the encapsulation layer 200 in contact may be 7 mm 2 to 9 mm 2. Therefore, in the display device according to the embodiment of the present invention, the electrical connection between the pad 105 and the printed circuit board 400 may be stably maintained.

In the display device according to the exemplary embodiment of the present invention, it is described that the non-display area NA of the device substrate 100 is located only on one side of the display area AA of the device substrate 100. However, in the display device according to another embodiment of the present invention, the display area AA of the device substrate 100 may be surrounded by the non-display area NA of the device substrate 100. For example, in a display device according to another embodiment of the present invention, a plurality of pads 105 may be disposed along side surfaces perpendicular to each other of the device substrate 100. Accordingly, in the display device according to another embodiment of the present invention, the first pad open hole 200h of the encapsulation layer 200 and the second pad open hole 300h of the encapsulation substrate 300 are'a It may be 'or'b' shaped. That is, in the display device according to another embodiment of the present invention, regardless of the arrangement of the pad 105, the non-display area NA of the device substrate 100 due to external impact by the sealing substrate 300 Damage can be minimized.

In the display device according to the exemplary embodiment of the present invention, it is described that the second pad open hole 300h of the encapsulation substrate 300 has a sidewall perpendicular to the surface of the encapsulation substrate 300. However, in the display device according to another embodiment of the present invention, the size of the second pad open hole 300h of the encapsulation substrate 300 may increase as the distance from the device substrate 100 increases. For example, as illustrated in FIG. 4, in the display device according to another exemplary embodiment of the present invention, the second pad open hole 300h of the encapsulation substrate 300 may have inclined sidewalls 300s. The inclined sidewall 300s of the second pad open hole 300h may be positioned adjacent to the display area AA. For example, the inclined sidewalls 300s of the second pad open hole 300h may overlap the display area AA of the device substrate 100. Accordingly, in the display device according to another embodiment of the present invention, damage to the flexible film 500 due to an edge of the second pad open hole 300h may be prevented. Therefore, in the display device according to another embodiment of the present invention, the electrical connection by the flexible film 500 may be stably maintained.

In the display device according to another embodiment of the present invention, it is described that the inclined sidewalls 300s of the second pad open hole 300h have a single inclination angle. However, in the display device according to another embodiment of the present invention, sufficient space may be provided between the inclined sidewall 300s of the second pad open hole 300h and the flexible film 500. For example, as shown in FIG. 5, in the display device according to another embodiment of the present invention, the inclined side wall 300s of the second pad open hole 300h has a first inclination angle θ1. The region 301s and the second region 302s having the second inclination angle θ2 may be included. The second inclination angle θ2 may be greater than the first inclination angle θ1. Accordingly, in the display device according to another embodiment of the present invention, the flexible film 500 is provided on the inclined sidewall 300s of the second pad open hole 300h by the flow of the flexible film 500. It can be prevented from being hit and damaged. In addition, in the display device according to another embodiment of the present invention, the space between the inclined side wall 300s of the second pad open hole 300h and the flexible film 500 is used. A driving IC can be mounted on the surface. Therefore, in the display device according to another embodiment of the present invention, process efficiency may be effectively improved.

In the display device according to an embodiment of the present invention, the sidewalls of the first pad open hole 200h and the sidewalls of the second pad open hole 300h are described as being exposed to the outside. However, as illustrated in FIG. 6, the display device according to another exemplary embodiment of the present invention includes an insulating member 700 covering sidewalls of the first pad open hole 200h and sidewalls of the second pad open hole 300h. ). The insulating member 700 may include an insulating material. For example, the insulating member 700 may include resin. The insulating member 700 may extend on the outer surface of the encapsulation substrate 300. For example, the insulating member 700 includes a first member region 710 and an encapsulation substrate (located on the sidewall of the first pad open hole 200h and the sidewall of the second pad open hole 300h). 300 may include a second member region 720 covering the outer surface. Accordingly, in the display device according to another embodiment of the present invention, damage to the flexible film 500 due to an edge of the encapsulation substrate 300 may be prevented. That is, in the display device according to another embodiment of the present invention, damage to the flexible film 500 due to external force may be effectively prevented.

In the display device according to the exemplary embodiment of the present invention, it is described that the first pad open hole 200h and the second pad open hole 300h extend along the edge of the device substrate 100. However, in the display device according to another embodiment of the present invention, the first pad open hole 200h and/or the second pad open hole 300h may have a plurality of pattern shapes separated from each other. For example, as shown in FIG. 7, in the display device according to another embodiment of the present invention, the sealing substrate 300 has a plurality of second pad open holes 300h having a size corresponding to the flexible film 500. It may include. Accordingly, in the display device according to another embodiment of the present invention, the area of the non-display area of the element substrate covered by the encapsulation substrate 300 may be maximized. Therefore, in the display device according to another embodiment of the present invention, damage to the device substrate by the encapsulation substrate 300 may be effectively prevented.

100: element substrate 105: pad
150: light-emitting element 200: sealing layer
200h: first pad open hole 300: sealing substrate
300h: second pad open hole 400: printed circuit board
500: flexible film

Claims (13)

A device substrate including a display area and a pad area positioned outside the display area;
A light emitting element located on the display area of the element substrate;
An encapsulation layer on the device substrate and covering the light emitting device; And
Including the encapsulation substrate located on the encapsulation layer,
The encapsulation layer and the encapsulation substrate each include a pad open hole overlapping the pad region of the device substrate. According to claim 1,
At least one pad located on the pad area of the device substrate; And
Further comprising a printed circuit board connected to the pad through a flexible film,
The encapsulation substrate is a display device positioned between the encapsulation layer and the printed circuit board. According to claim 2,
Further comprising an adhesive member located between the encapsulation substrate and the printed circuit board,
The adhesive member is a display device comprising an insulating material. According to claim 1,
The encapsulation substrate is a display device comprising a metal. According to claim 1,
The encapsulation substrate is a display device having a larger size than the element substrate. The method of claim 5,
The encapsulation substrate includes a sidewall region extending on a side surface of the device substrate. According to claim 1,
The sidewall adjacent to the display area in the pad opening hole of the encapsulation substrate is an inclined display device. The method of claim 7,
The inclined sidewall of the pad open hole of the encapsulation substrate includes a first region having a first inclination angle and a second region having a second inclination angle greater than the first inclination angle,
The first area is a display device positioned between the encapsulation layer and the second area. According to claim 1,
The device substrate is located outside the pad area, and further comprising an outer area in contact with the encapsulation layer. The method of claim 9,
A display device having an area of an encapsulation layer in contact with the outer region of the device substrate is 7 mm2 or more. According to claim 1,
The pad opening hole of the encapsulation substrate extends along the edge of the device substrate. According to claim 1,
And an insulating member covering a sidewall of the pad open hole. The method of claim 12,
The insulating member is a display device extending on the outer surface of the encapsulation substrate.

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