KR102666875B1 - Display apparatus having at least one pad - Google Patents

Abstract

The present invention relates to a display device including at least one pad located on a pad area of a device substrate. The device substrate may include a display area where a light emitting device is located. The pad area of the device substrate may be located outside the display area of the device substrate. The device substrate may be coupled to the encapsulation substrate by an encapsulation layer covering the light emitting device. The encapsulation layer and the encapsulation substrate may each include a pad open hole that overlaps the pad area of the device substrate. Accordingly, in the display device, process efficiency can be improved and process costs can be reduced.

Description

Display apparatus having at least one pad}

The present invention relates to a display device in which at least one pad is located on a pad area of a device substrate.

In general, electronic devices such as monitors, TVs, laptops, and digital cameras include display devices for displaying images. For example, the display device may be an organic light emitting display device including an organic light emitting material.

The display device may include at least one pad for receiving signals from the outside. For example, in the display device, the device substrate includes a display area where a light emitting device is located and a non-display area located outside the display area, and the at least one pad is located on the non-display area of the device substrate. can be located

The device substrate may be coupled to the encapsulation substrate by an encapsulation layer covering the light emitting device. The encapsulation layer and the encapsulation substrate may expose the pad located on the device substrate. The encapsulation layer and the encapsulation substrate may have a smaller size than the device substrate. For example, the pad area of the device substrate where the pad is located may be located outside the encapsulation layer and the encapsulation substrate.

However, the pad area of the device substrate located outside the encapsulation substrate and the outer region of the device substrate located outside the pad area can be easily damaged by external impact. Accordingly, in the display device, separate components, such as a back cover, are used to protect the pad area and outer area of the device substrate, which may reduce process efficiency and increase process cost.

The problem to be solved by the present invention is to provide a display device that can minimize damage to the non-display area of the device substrate due to external impact without using separate components.

The problems to be solved by the present invention are not limited to the problems mentioned above. Problems not mentioned herein will become clear to those skilled in the art from the description below.

A display device according to the technical idea of the present invention to achieve the problem to be solved above includes a device substrate. The device substrate includes a display area and a pad area. The pad area is located outside the display area. A light emitting device is located on the display area of the device substrate. The light emitting element is covered by an encapsulation layer. An encapsulation substrate is positioned on the encapsulation layer. The encapsulation layer and the encapsulation substrate each include a pad open hole that overlaps the pad area of the device substrate.

At least one pad may be located on the pad area of the device substrate. Each pad can be connected to a printed circuit board through a flexible film. The encapsulation substrate may be positioned between the encapsulation layer and the printed circuit board.

It may further include an adhesive member positioned between the encapsulation substrate and the printed circuit board. The adhesive member may include an insulating material.

The encapsulation substrate may include metal.

The encapsulation substrate may have a larger size than the device substrate.

The encapsulation substrate may include a sidewall region extending onto a side of the device substrate.

The sidewall of the pad open hole of the encapsulation substrate overlapping the display area may be inclined.

The inclined sidewall of the pad open hole of the encapsulation substrate may include a first area having a first inclination angle and a second area having a second inclination angle. The first region may be located between the encapsulation layer and the second region. The second tilt angle may be greater than the first tilt angle.

The device substrate may further include an outer area located outside the pad area.

The outer area of the device substrate may be in contact with the encapsulation layer.

The area of the encapsulation layer in contact with the outer area of the device substrate may be 7㎟ or more.

The pad open hole of the encapsulation substrate can extend along the edge of the device substrate.

The sidewall of the pad open hole may be covered by an insulating member.

The insulating member may extend onto the outer surface of the encapsulation substrate.

A display device according to the technical idea of the present invention may have pad open holes located in an encapsulation substrate coupled to a device substrate and an encapsulation layer located between the device substrate and the encapsulation substrate. Accordingly, in the display device according to the technical idea of the present invention, external shock applied to the non-display area of the device substrate can be alleviated without using a separate component such as a back cover. Therefore, in the display device according to the technical idea of the present invention, process efficiency can be improved and process costs can be reduced.

Figure 1A is a diagram schematically showing a display device according to an embodiment of the present invention.
FIG. 1B is a diagram showing a cross section taken along line II' of FIG. 1A.
FIG. 2A is an enlarged view of area P in FIG. 1B.
FIG. 2b is an enlarged view of area R in FIG. 1b.
Figure 3 is a graph showing the adhesive force according to the adhesive area of the encapsulation layer in the display device according to an embodiment of the present invention.
4 to 6 are diagrams showing a display device according to another embodiment of the present invention, respectively.

Details regarding the above-mentioned purpose, technical configuration, and effects thereof of the present invention will be more clearly understood through the following detailed description with reference to the drawings showing embodiments of the present invention. Here, since the embodiments of the present invention are provided so that the technical idea of the present invention can be sufficiently conveyed to those skilled in the art, the present invention may be embodied in other forms so as not to be limited to the embodiments described below.

In addition, parts indicated with the same reference numerals throughout the specification refer to the same components, and the length and thickness of a layer or region in the drawings may be exaggerated for convenience. Additionally, when a first component is described as being “on” a second component, it does not only mean that the first component is located above and in direct contact with the second component, but also that the first component and the It also includes cases where a third component is located between second components.

Here, the terms first, second, etc. are used to describe various components and are used for the purpose of distinguishing one component from other components. However, without departing from the technical spirit of the present invention, the first component and the second component may be arbitrarily named according to the convenience of those skilled in the art.

The terms used in the specification of the present invention are only used to describe specific embodiments and are not intended to limit the present invention. For example, an element expressed in the singular includes plural elements unless the context clearly indicates only the singular. In addition, in the specification of the present invention, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, operations, components, parts, or a combination thereof described in the specification, but are intended to indicate the presence of one or It should be understood that this does not preclude the existence or addition of other features, numbers, steps, operations, components, parts, or combinations thereof.

Additionally, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the technical field to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and unless clearly defined in the specification of the present invention, they should not be taken in an idealistic or excessively formal sense. It is not interpreted.

(Example)

Figure 1A is a diagram schematically showing a display device according to an embodiment of the present invention. FIG. 1B is a diagram showing a cross section taken along line II' of FIG. 1A. FIG. 2A is an enlarged view of area P in FIG. 1B. FIG. 2b is an enlarged view of area R in FIG. 1b.

Referring to FIGS. 1A, 1B, 2A, and 2B, a display device according to an embodiment of the present invention may include a device substrate 100. The device substrate 100 may include an insulating material. The device substrate 100 may include a transparent material. For example, the device substrate 100 may include glass or plastic.

The device substrate 100 may include a display area (AA) and a non-display area (NA). The display area AA may implement an image provided to the user. For example, a plurality of light emitting devices 150 may be located on the display area AA of the device substrate 100.

The light emitting device 150 may emit light representing a specific color. For example, the light-emitting device 150 may include a first electrode 151, a light-emitting layer 152, and a second electrode 153 sequentially stacked on the device substrate 100.

The first electrode 151 may include a conductive material. The first electrode 151 may include a transparent material. For example, the first electrode 151 may be a transparent electrode formed of a transparent conductive material such as ITO and IZO.

The light emitting layer 152 may generate light with a brightness corresponding to the voltage difference between the first electrode 151 and the second electrode 153. For example, the light-emitting layer 152 may include an emission material layer (EML) containing a light-emitting material. The light-emitting material may be an organic material. For example, a display device according to an embodiment of the present invention may be an organic light emitting display device including an organic light emitting material.

The light emitting layer 153 may have a multi-layer structure to increase light emitting efficiency. For example, the light-emitting layer 153 may further include at least one of a hole injection layer (HIL), a hole hydrogen layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL).

The second electrode 153 may include a conductive material. The second electrode 153 may include a material different from that of the first electrode 151. The second electrode 153 may have a higher reflectivity than the first electrode 151. For example, the second electrode 153 may include metal such as aluminum (Al) and silver (Ag). Accordingly, in the display device according to an embodiment of the present invention, light generated by the light emitting layer 152 may be emitted to the outside through the first electrode 151 and the device substrate 100.

A driving circuit may be located between the display area AA of the device substrate 100 and the light emitting device 150. The operation of the light emitting device 150 may be controlled by the driving circuit. For example, the driving circuit may supply driving current to the light emitting device 150 according to the gate signal and data signal. The driving circuit may include at least one thin film transistor 120. For example, the thin film transistor 120 may include a semiconductor pattern 121, a gate insulating film 122, a gate electrode 123, an interlayer insulating film 124, a source electrode 125, and a drain electrode 126. there is.

The semiconductor pattern 121 may be located close to the device substrate 100. The semiconductor pattern 121 may include a semiconductor material. For example, the semiconductor pattern 121 may include amorphous silicon or polycrystalline silicon. The semiconductor pattern 121 may be an oxide semiconductor. For example, the semiconductor pattern 121 may include IGZO.

The semiconductor pattern 121 may include a source region, a drain region, and a channel region. The channel region may be located between the source region and the drain region. The channel region may have a lower conductivity than the source region and the drain region. For example, the source region and the drain region may have a higher impurity concentration than the channel region.

The gate insulating film 122 may be located on a partial area of the semiconductor pattern 121 . For example, the gate insulating layer 122 may be located on the channel region of the semiconductor pattern 121 . The source region and the drain region of the semiconductor pattern 121 may be exposed by the gate insulating layer 122 .

The gate insulating layer 122 may include an insulating material. For example, the gate insulating layer 122 may include silicon oxide (SiO) and/or silicon nitride (SiN). The gate insulating layer 122 may have a multi-layer structure. The gate insulating layer 122 may include a high-K material. For example, the gate insulating layer 122 may include hafnium oxide (HfO) or titanium oxide (TiO).

The gate electrode 123 may be located on the gate insulating film 122. The gate electrode 123 may be insulated from the semiconductor pattern 121 by the gate insulating film 122 . For example, the gate electrode 123 may overlap the channel region of the semiconductor pattern 121.

The gate electrode 123 may include a conductive material. For example, the gate electrode 123 may include metal such as aluminum (Al), chromium (Cr), molybdenum (Mo), or tungsten (W).

The interlayer insulating film 124 may be located on the semiconductor pattern 121 and the gate electrode 123. The interlayer insulating film 124 may extend outside the semiconductor pattern 121 . For example, the side of the semiconductor pattern 121 and the side of the gate electrode 123 may be covered by the interlayer insulating film 124.

The interlayer insulating film 124 may include an insulating material. For example, the interlayer insulating film 124 may include silicon oxide (SiO).

The source electrode 125 may be located on the interlayer insulating film 124 . The source electrode 125 may be electrically connected to the source region of the semiconductor pattern 121. For example, the interlayer insulating film 124 may include a contact hole that partially exposes the source region of the semiconductor pattern 121 . The source electrode 125 may include a region that overlaps the source region of the semiconductor pattern 121 .

The source electrode 125 may include a conductive material. For example, the source electrode 125 may include metal such as aluminum (Al), chromium (Cr), molybdenum (Mo), or tungsten (W). The source electrode 125 may include a material different from that of the gate electrode 123.

The drain electrode 126 may be located on the interlayer insulating film 124. The drain electrode 126 may be spaced apart from the source electrode 125. The drain electrode 126 may be electrically connected to the drain region of the semiconductor pattern 121. For example, the interlayer insulating film 124 may include a contact hole that partially exposes the drain region of the semiconductor pattern 121 . The drain electrode 126 may include a region that overlaps the drain region of the semiconductor pattern 121 .

The drain electrode 126 may include a conductive material. For example, the drain electrode 126 may include metal such as aluminum (Al), chromium (Cr), molybdenum (Mo), or tungsten (W). The drain electrode 126 may include the same material as the source electrode 125. The drain electrode 126 may include a material different from that of the gate electrode 123.

A buffer insulating layer 110 may be positioned between the display area AA of the device substrate 100 and the driving circuit. The buffer insulating film 110 can prevent contamination by the device substrate 100 during the forming process of the driving circuit. The buffer insulating film 110 may extend outside the corresponding driving circuit. For example, on the outside of the semiconductor pattern 121, the buffer insulating layer 110 may directly contact the interlayer insulating layer 240.

A lower protective film 130 and an overcoat layer 140 may be sequentially stacked between the driving circuit and the light emitting device 150. The lower protective film 130 can prevent damage to the driving circuit due to external moisture and shock. For example, the thin film transistor 120 may be covered by the lower protective film 120. The overcoat layer 140 can remove steps caused by the driving circuit. For example, the surface of the overcoat layer 140 facing the light emitting device 150 may be a flat surface.

The light emitting device 150 may be electrically connected to the thin film transistor 120. For example, the lower protective film 130 may include a lower contact hole 130h that partially exposes the drain electrode 126 of the thin film transistor 120. The overcoat layer 140 may include an overcoat contact hole 140h that overlaps the lower contact hole 130h. The first electrode 151 of the light emitting device 150 is electrically connected to the drain electrode 126 of the thin film transistor 120 through the lower contact hole 130h and the overcoat contact hole 140h. You can. For example, the first electrode 151 may extend along the sidewall of the lower contact hole 130h and the sidewall of the overcoat contact hole 140h and directly contact the drain electrode 126.

The lower protective film 130 and the overcoat layer 140 may include an insulating material. The overcoat layer 140 may include a material different from that of the lower protective layer 130. For example, the lower protective layer 130 may include an inorganic insulating material such as silicon oxide (SiO) and silicon nitride (SiN), and the overcoat layer 140 may include an organic insulating material.

A plurality of light emitting devices 150 may be located on the display area AA of the device substrate 100. Each light emitting device 150 can be individually controlled. For example, the first electrode 151 of each light-emitting device 150 may be spaced apart from the first electrode 151 of an adjacent light-emitting device 150. A bank insulating film 160 may be positioned between adjacent first electrodes 151 . For example, the edge of the first electrode 151 may be covered by the bank insulating layer 160. The light emitting layer 152 and the second electrode 153 may be stacked on a partial area of the first electrode 151 exposed by the bank insulating film 160. Each light-emitting device 150 may emit light having the same color as the adjacent light-emitting device 150. For example, the light emitting layer 152 may extend onto the bank insulating layer 160. The second electrode 153 may extend along the light emitting layer 152.

A color filter 145 may be positioned between the lower protective film 130 and the overcoat layer 140. The color filter 145 can implement a specific color using light emitted from the light emitting device 150. The color filter 145 may overlap the light emitting device 150. The thin film transistor 120 may be located outside the color filter 145. For example, the thin film transistor 120 may overlap the bank insulating layer 160. Accordingly, the display device according to an embodiment of the present invention can prevent light emitted from the light emitting device 150 from being blocked by the thin film transistor 120.

An upper protective film 170 may be positioned on the light emitting device 150. The upper protective film 170 can prevent damage to the light emitting device 150 due to external moisture and shock. For example, the upper protective film 170 may extend along the second electrode 153.

The upper protective film 170 may include an insulating material. For example, the upper protective layer 170 may include an inorganic insulating material such as silicon oxide (SiO) and silicon nitride (SiN). The upper protective film 170 may have a multi-layer structure.

An encapsulation layer 200 may be positioned on the upper protective film 170. The encapsulation layer 200 can prevent damage to the light emitting device 150 due to external moisture and impact. For example, the encapsulation layer 200 may cover the light emitting device 150. The encapsulation layer 200 may include an area in direct contact with the display area AA of the device substrate 100.

The encapsulation layer 200 may have a multi-layer structure. For example, the encapsulation layer 200 may have a stacked structure of a lower encapsulation layer 210 and an upper encapsulation layer 220. The lower encapsulation layer 210 may be located between the upper protective film 170 and the upper encapsulation layer 220. The encapsulation layer 200 may include moisture-absorbing particles 200p to capture infiltrated moisture. The moisture-absorbing particles 200p may be dispersed within the upper encapsulation layer 220. Accordingly, in the display device according to an embodiment of the present invention, the pressure applied to the light emitting device 150 due to expansion of the moisture absorption particles 200p may be relieved by the lower encapsulation layer 210.

The encapsulation layer 200 may include an insulating material. The encapsulation layer 200 may include a material that does not require a curing process. For example, the encapsulation layer 200 may include an olefin-based material. Accordingly, in the display device according to an embodiment of the present invention, deterioration of the light emitting device 150 due to the forming process of the encapsulation layer 200 can be prevented. The lower encapsulation layer 210 may include a material different from the upper encapsulation layer 220.

An encapsulation substrate 300 may be positioned on the encapsulation layer 200. The encapsulation substrate 300 may be combined with the device substrate 100 on which the light emitting device 150 is formed by the encapsulation layer 200. For example, the encapsulation substrate 300 may directly contact the encapsulation layer 200. The encapsulation substrate 300 may include a material different from that of the device substrate 100. The encapsulation substrate 300 may emit heat generated by the operation of the light emitting device 150 and/or the operation of the driving circuit. The encapsulation substrate 300 may have higher thermal conductivity than the device substrate 100. For example, the encapsulation substrate 300 may include a metal such as aluminum (Al).

The non-display area (NA) of the device substrate 100 may be located outside the display area (AA) of the device substrate 100 . Circuit units and signal wires for providing various signals for image implementation to the driving circuit and the light-emitting device 150 may be located on the non-display area (NA) of the device substrate 100. For example, at least one pad 105 may be located on the non-display area (NA) of the device substrate 100.

The pad 105 may be spaced apart from the side of the device substrate 100. For example, the non-display area (NA) of the device substrate 100 includes a pad area (PA) where the pad 105 is located and an outer area (CA) located outside the pad area (PA). It can be included. The outer area CA of the device substrate 100 may include a side surface of the device substrate 100.

The encapsulation layer 200 may extend onto the non-display area (NA) of the device substrate 100 . For example, the outer area CA of the device substrate 100 may include an area in contact with the encapsulation layer 200. The encapsulation layer 200 may expose the pad 105. For example, the encapsulation layer 200 may include a first pad open hole 200h that overlaps the pad area PA of the device substrate 100.

The encapsulation substrate 300 may extend along the encapsulation layer 200 . For example, the encapsulation substrate 300 may include an area that overlaps the outer area CA of the device substrate 100. The encapsulation substrate 300 may expose the pad 105. For example, the encapsulation substrate 300 may include a second pad open hole 300h that overlaps the first pad open hole 200h of the encapsulation layer 200. That is, in the display device according to an embodiment of the present invention, the encapsulation substrate 500 may overlap the display area AA and the outer area CA of the device substrate 100. Accordingly, in the display device according to an embodiment of the present invention, external shock applied to the non-display area (NA) of the device substrate 100 by the encapsulation substrate 300 can be alleviated. Therefore, in the display device according to an embodiment of the present invention, a separate component for protecting the non-display area (NA) of the device substrate 100 may not be used.

The first pad open hole 200h of the encapsulation layer 200 may have a larger size than the second pad open hole 300h of the encapsulation substrate 300. Accordingly, in the display device according to an embodiment of the present invention, the second pad open hole 300h is caused by deformation of the encapsulation layer 200 that occurs in the bonding process of the device substrate 100 and the encapsulation substrate 300. ) can be prevented from reducing its size. Therefore, in the display device according to an embodiment of the present invention, the area of the second pad open hole 300h exposing the pad 105 can be stably maintained.

The encapsulation substrate 300 may have a larger size than the device substrate 100. The encapsulation substrate 300 may extend on the side of the device substrate 100 . For example, the encapsulation substrate 300 has a side wall region 310 located on the side of the device substrate 100 and a plane located on the surface of the device substrate 100 on which the light emitting device 150 is formed. It may include area 320. The device substrate 100 and the encapsulation layer 200 may be positioned between the sidewall regions 310 of the encapsulation substrate 300 . For example, the device substrate 100 and the encapsulation layer 200 may be surrounded by the encapsulation substrate 300 . Accordingly, in the display device according to an embodiment of the present invention, damage to the non-display area (NA) of the device substrate 100 due to external impact can be effectively prevented by the encapsulation substrate 300.

The display device according to an embodiment of the present invention can receive external signals through the pad 105. For example, each pad 105 may be connected to a printed circuit board (PCB) 400 through a flexible film (500). The printed circuit board 400 may apply a data signal to the pad 105 through the flexible film 500 . For example, multiple source drive ICs may be mounted on the printed circuit board 400.

The printed circuit board 400 may be located on the outer surface of the encapsulation board 300. The encapsulation substrate 300 may be positioned between the encapsulation layer 200 and the printed circuit board 400. The flexible film 500 may be connected to the pad 105 through the first pad open hole 200h of the encapsulation layer 200 and the second pad open hole 300h of the encapsulation substrate 300. there is. Accordingly, in the display device according to an embodiment of the present invention, damage to the non-display area (NA) of the device substrate 100 is prevented by using the encapsulation substrate 400, and the printed circuit board 400 and The pads 105 may be electrically connected through the flexible film 500 .

The printed circuit board 400 may be attached to the surface of the encapsulation board 300 through an adhesive member 600. Accordingly, in the display device according to an embodiment of the present invention, damage to the flexible circuit 500 due to movement of the printed circuit board 400 can be prevented. The adhesive member 600 may include an insulating material. Accordingly, in the display device according to an embodiment of the present invention, malfunction of the printed circuit board 400 due to the encapsulation substrate 300 containing metal can be prevented.

As a result, the display device according to an embodiment of the present invention includes an encapsulation layer 200 and an encapsulation substrate ( 300), wherein the encapsulation layer 200 and the encapsulation substrate 300 each overlap a pad area (PA) of the device substrate 100 where the pad 105 is located (200h, 300h). Accordingly, in the display device according to an embodiment of the present invention, the non-display area (NA) of the device substrate 100 obscured by the encapsulation substrate 300 can be maximized. Therefore, in the display device according to an embodiment of the present invention, damage to the non-display area (NA) of the device substrate 100 due to external impact can be minimized without using a separate component such as a back cover. there is.

Figure 3 is a graph showing the adhesive force according to the adhesive area of the encapsulation layer in the display device according to an embodiment of the present invention.

Referring to Figure 3, if the adhesive area of the encapsulation layer is less than 3㎟, the adhesive strength of the encapsulating layer does not change significantly, but if the adhesive area of the encapsulating layer is more than 7㎟, the adhesive strength of the encapsulating layer increases significantly. That is, in the display device according to an embodiment of the present invention, the device substrate 100 and the encapsulation layer ( To sufficiently prevent peeling of the device substrate 100, the area of the encapsulation layer 200 in contact with the outer area CA of the device substrate 100 may be 7 mm2 or more. As the area of the encapsulation layer 200 in contact with the outer area CA increases, the size of the display area AA may decrease. Accordingly, in the display device according to an embodiment of the present invention, peeling of the device substrate 100 and the encapsulation layer 200 is sufficiently prevented, and the size of the display area AA is minimized. ) The area of the encapsulation layer 200 in contact with the surface may be 7㎟ to 9㎟. Therefore, in the display device according to an embodiment of the present invention, the electrical connection between the pad 105 and the printed circuit board 400 can be stably maintained.

The display device according to an embodiment of the present invention is described in that the non-display area (NA) of the device substrate 100 is located only on one side of the display area (AA) of the device substrate 100. However, in a display device according to another embodiment of the present invention, the display area AA of the device substrate 100 may be surrounded by the non-display area NA of the device substrate 100. For example, in a display device according to another embodiment of the present invention, a plurality of pads 105 may be arranged along mutually perpendicular sides of the device substrate 100. Accordingly, in the display device according to another embodiment of the present invention, the first pad open hole 200h of the encapsulation layer 200 and the second pad open hole 300h of the encapsulation substrate 300 are 'a'. ' or 'ㄴ' shape. That is, in the display device according to another embodiment of the present invention, regardless of the arrangement of the pad 105, the non-display area (NA) of the device substrate 100 is damaged by an external impact by the encapsulation substrate 300. Damage can be minimized.

A display device according to an embodiment of the present invention is described in which the second pad open hole 300h of the encapsulation substrate 300 has a sidewall perpendicular to the surface of the encapsulation substrate 300. However, in a display device according to another embodiment of the present invention, the size of the second pad open hole 300h of the encapsulation substrate 300 may increase as the distance from the device substrate 100 increases. For example, as shown in FIG. 4, in a display device according to another embodiment of the present invention, the second pad open hole 300h of the encapsulation substrate 300 may have an inclined sidewall 300s. The inclined sidewall 300s of the second pad open hole 300h may be located adjacent to the display area AA. For example, the inclined sidewall 300s of the second pad open hole 300h may overlap the display area AA of the device substrate 100. Accordingly, in the display device according to another embodiment of the present invention, damage to the flexible film 500 caused by the edge of the second pad open hole 300h can be prevented. Therefore, in the display device according to another embodiment of the present invention, electrical connection by the flexible film 500 can be stably maintained.

A display device according to another embodiment of the present invention is described in which the inclined side wall 300s of the second pad open hole 300h has a single inclination angle. However, in the display device according to another embodiment of the present invention, sufficient space may be provided between the flexible film 500 and the inclined side wall 300s of the second pad open hole 300h. For example, as shown in FIG. 5, in a display device according to another embodiment of the present invention, the inclined side wall 300s of the second pad open hole 300h has a first inclination angle θ1. It may include a region 301s and a second region 302s having a second inclination angle θ2. The second tilt angle θ2 may be greater than the first tilt angle θ1. Accordingly, in the display device according to another embodiment of the present invention, the flexible film 500 is formed on the inclined side wall 300s of the second pad open hole 300h by the flow of the flexible film 500. Damage from collisions can be prevented. In addition, in the display device according to another embodiment of the present invention, the space between the inclined side wall 300s of the second pad open hole 300h and the flexible film 500 is used to A driver IC can be mounted on the surface. Accordingly, process efficiency can be effectively improved in the display device according to another embodiment of the present invention.

A display device according to an embodiment of the present invention is described in which the sidewall of the first pad open hole 200h and the sidewall of the second pad open hole 300h are exposed to the outside. However, as shown in FIG. 6, the display device according to another embodiment of the present invention includes an insulating member 700 covering the sidewall of the first pad open hole 200h and the sidewall of the second pad open hole 300h. ) may include. The insulating member 700 may include an insulating material. For example, the insulating member 700 may include resin. The insulating member 700 may extend onto the outer surface of the encapsulation substrate 300 . For example, the insulating member 700 includes a first member region 710 located on the sidewall of the first pad open hole 200h and the sidewall of the second pad open hole 300h, and the encapsulation substrate ( It may include a second member area 720 covering the outer surface of 300). Accordingly, in the display device according to another embodiment of the present invention, damage to the flexible film 500 caused by the corners of the encapsulation substrate 300 can be prevented. That is, in the display device according to another embodiment of the present invention, damage to the flexible film 500 due to external force can be effectively prevented.

A display device according to an embodiment of the present invention is described in which the first pad open hole 200h and the second pad open hole 300h extend along the edge of the device substrate 100. However, in a display device according to another embodiment of the present invention, the first pad open hole 200h and/or the second pad open hole 300h may have a plurality of separated pattern shapes. For example, as shown in FIG. 7, in the display device according to another embodiment of the present invention, the encapsulation substrate 300 has a plurality of second pad open holes 300h having a size corresponding to the flexible film 500. may include. Accordingly, in the display device according to another embodiment of the present invention, the area of the non-display area of the device substrate covered by the encapsulation substrate 300 can be maximized. Therefore, in the display device according to another embodiment of the present invention, damage to the device substrate caused by the encapsulation substrate 300 can be effectively prevented.

100: device substrate 105: pad
150: light emitting device 200: encapsulation layer
200h: 1st pad open hole 300: Encapsulation substrate
300h: 2nd pad open hole 400: printed circuit board
500: flexible film

Claims (13)

a device substrate including a display area and a pad area located outside the display area;
a light emitting device located on the display area of the device substrate;
an encapsulation layer located on the device substrate and covering the light emitting device; and
Including an encapsulation substrate located on the encapsulation layer,
The encapsulation layer and the encapsulation substrate each include a pad open hole overlapping the pad area of the device substrate,
A display device wherein the encapsulation substrate including metal includes a sidewall region extending onto a side of the device substrate. According to claim 1,
at least one pad located on the pad area of the device substrate; and
Further comprising a printed circuit board connected to the pad through a flexible film,
The encapsulation substrate is a display device positioned between the encapsulation layer and the printed circuit board. According to claim 2,
Further comprising an adhesive member positioned between the encapsulation substrate and the printed circuit board,
A display device wherein the adhesive member includes an insulating material. According to claim 1,
A display device wherein the encapsulation substrate has a higher thermal conductivity than the device substrate. According to claim 1,
The encapsulation layer has a laminated structure of a lower encapsulation layer and an upper encapsulation layer,
The upper encapsulation layer is located between the lower encapsulation layer and the encapsulation substrate. According to claim 5,
The display device wherein the encapsulation layer includes moisture-absorbing particles dispersed in the upper encapsulation layer. According to claim 1,
A display device in which a sidewall adjacent to the display area in the pad open hole of the encapsulation substrate is inclined. According to claim 7,
The inclined sidewall of the pad open hole of the encapsulation substrate includes a first area having a first inclination angle and a second area having a second inclination angle greater than the first inclination angle,
The first area is a display device positioned between the encapsulation layer and the second area. According to claim 1,
The device substrate is located outside the pad area and further includes an outer area in contact with the encapsulation layer. According to clause 9,
A display device wherein the area of the encapsulation layer in contact with the outer region of the device substrate is 7 mm2 or more. According to claim 1,
A display device wherein the pad open hole of the encapsulation substrate extends along an edge of the device substrate. According to claim 1,
A display device further comprising an insulating member covering a sidewall of the pad open hole. According to claim 12,
A display device wherein the insulating member extends onto an outer surface of the encapsulation substrate.

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