KR20210012218A - Display apparatus having touch electrodes - Google Patents

Abstract

The present invention relates to a display device having touch electrodes disposed on an encapsulation member. According to the present invention, the encapsulation member covers a light emitting device disposed in a display area of a device substrate. Touch pads spaced apart from the encapsulation member are disposed on the device substrate. A part of the touch electrodes is connected to one of the touch pads through a corresponding first touch line. The rest of the touch electrodes is connected to a corresponding connection line through a corresponding second touch line. The connection line extends between the device substrate and the encapsulation member to be connected to one of the touchpads. Accordingly, the area of a bezel area due to the touch lines can be reduced.

Description

Display apparatus including touch electrodes TECHNICAL FIELD

The present invention relates to a display device including touch electrodes disposed on a sealing member covering a light emitting element.

In general, electronic devices such as monitors, TVs, notebook computers, and digital cameras include display devices to implement images. For example, the display device may include at least one light emitting element. The light emitting device may emit light representing a specific color. For example, the light emitting device may include a light emitting layer positioned between the first electrode and the second electrode.

The display device may detect a touch of a user and/or a tool to drive a specific program or input a specific signal. For example, the display device may include touch electrodes. The touch electrodes may be positioned on an encapsulation member covering the light emitting device. Each touch electrode may be connected to a corresponding touch pad through one of touch lines extending along the surface of the encapsulation member. The touch lines may be positioned on the same layer as the touch electrodes. For example, the display device may include a self-capacitive touch structure.

However, in the display device, the number of the touch lines may be the same as the number of the touch electrodes. Accordingly, in the display device, as the number of the touch electrodes increases in order to improve touch sensitivity, an area occupied by the touch lines may increase. That is, in the display device, the area of the bezel area located outside the display area where the light emitting element is located may increase. Accordingly, the overall size of the display device can be increased.

The problem to be solved by the present invention is to provide a display device capable of reducing the area of a bezel area.

Another problem to be solved by the present invention is to provide a display device capable of reducing an area occupied by touch lines.

The problems to be solved by the present invention are not limited to the aforementioned problems. Tasks not mentioned herein will be clearly understood by those skilled in the art from the following description.

A display device according to the present invention for achieving the above-described problem includes a light emitting device positioned on a display area of an element substrate. The light-emitting element is covered by a sealing member. The sealing member extends outside the display area. A first touch electrode and a second touch electrode are positioned on the sealing member. The second touch electrode is positioned parallel to the first touch electrode. The first touch electrode and the second touch electrode overlap the display area. The first touch electrode is connected to the first touch pad by a first touch line. The first touch pad is spaced apart from the sealing member in a first direction. The first touch line extends in a first direction. The second touch pad is positioned parallel to the first touch pad in a second direction different from the first direction. The second touch pad is connected to the connection link. The connecting link extends in the first direction. The second touch electrode is connected to the connection link by the second touch line. The second touch line is located on the same layer as the first touch line. The connection link is located on a layer different from the first touch line.

The first and second touch lines may extend along the surface of the encapsulation member facing the device substrate. The connection link may include a region positioned between the device substrate and the encapsulation member.

The second touch electrode may be positioned on the same layer as the first touch electrode. The first touch electrode may be positioned on the same layer as the first touch line.

The first touch electrode, the second touch electrode, the first touch line, and the second touch line may include the same material.

The second touch pad may be positioned on a different layer from the first touch pad.

A cover pad may be positioned on the second touch pad. The cover pad may include the same material as the first touch pad.

The second touch pad may contact the connection link. The first touch pad may contact the first touch line.

The connection link may include a material different from the first touch line.

A thin film transistor may be positioned between the device substrate and the light emitting device. The connection link may include the same material as the source electrode and the drain electrode of the thin film transistor.

The second touch electrode may be positioned parallel to the first touch electrode in the first direction. The distance between the first touch electrode and the first touch pad in the first direction may be smaller than the distance between the second touch electrode and the second touch pad in the first direction.

A display device according to the present invention for achieving another problem to be solved includes a light emitting device positioned on a display area of an element substrate. The light-emitting element is covered by a sealing member. The sealing member extends outside the display area. Touch electrodes are positioned on the encapsulation member. The touch electrodes are individually connected to the touch lines. The touch lines extend outward of the encapsulation member. A first touch pad and a second touch pad are positioned on the device substrate. The first touch pad is spaced apart from the sealing member in a first direction. The second touch pad is positioned parallel to the first touch pad in a second direction different from the first direction. The second touch pad is positioned on a different layer from the first touch pad. The second touch pad is connected to the connection link. The connection link includes a region positioned between the device substrate and the encapsulation member. The touch lines include a first touch line connected to the first touch pad and a second touch line connected to a connection link.

Each touch line may contact a corresponding touch electrode.

The first touch pad may include the same material as the touch lines. The second touch pad may include the same material as the connection link.

The connection link may be located outside the display area.

A storage capacitor may be positioned between the device substrate and the light emitting device. The connection link may include the same material as one of the conductive layers of the storage capacitor.

A common voltage supply line may be located outside the display area. The common voltage supply line may be positioned between the device substrate and the encapsulation member. The connection link may be located on a different layer from the common voltage supply line.

The second direction may be a direction perpendicular to the first direction.

A display device according to the present invention includes a first touch electrode in which touch electrodes positioned on a sealing member are connected to a first touch pad by a first touch line, and a second touch pad through a connection link with the second touch line And a second touch electrode connected to and the connection link may be located on a layer different from the first touch line and the second touch line. Accordingly, in the display device according to the technical idea of the present invention, an area required for connecting each touch electrode to a corresponding touch pad may be reduced. That is, in the display device according to the technical idea of the present invention, the area of the bezel area may be minimized.

1 is a schematic diagram of a display device according to an exemplary embodiment of the present invention.
FIG. 2 is a diagram illustrating a cross section taken along line II′ of FIG. 1.
3 is a view showing a cross-section taken along line II-II' of FIG. 1.
FIG. 4 is a view showing a cross section taken along line III-III' of FIG. 1.
5 to 7 are views each showing a display device according to another exemplary embodiment of the present invention.

Details of the object, technical configuration, and operational effects of the present invention will be more clearly understood by the following detailed description with reference to the drawings showing an embodiment of the present invention. Here, since the embodiments of the present invention are provided to sufficiently convey the technical idea of the present invention to those skilled in the art, the present invention may be embodied in other forms so as not to be limited to the embodiments described below.

In addition, throughout the specification, portions denoted by the same reference numerals denote the same components, and in the drawings, the length and thickness of a layer or region may be exaggerated for convenience. In addition, when it is described that the first component is "on" the second component, not only the first component is located on the upper side in direct contact with the second component, but also the first component and the It includes a case where a third component is positioned between the second component.

Here, the terms “first” and “second” are used to describe various constituent elements, and are used to distinguish one constituent element from other constituent elements. However, within the scope not departing from the technical idea of the present invention, the first component and the second component may be arbitrarily named for convenience of those skilled in the art.

Terms used in the specification of the present invention are used only to describe specific embodiments, and are not intended to limit the present invention. For example, a component expressed in the singular includes a plurality of components unless the context clearly means only the singular. In addition, in the specification of the present invention, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or a combination thereof described in the specification, one or It is to be understood that no further features or possibilities of the presence or addition of numbers, steps, actions, components, parts, or combinations thereof are precluded.

In addition, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and in an ideal or excessively formal meaning unless explicitly defined in the specification of the present invention. It is not interpreted.

(Example)

1 is a schematic diagram of a display device according to an exemplary embodiment of the present invention. FIG. 2 is a diagram illustrating a cross section taken along line II′ of FIG. 1. 3 is a view showing a cross-section taken along line II-II' of FIG. 1. FIG. 4 is a view showing a cross section taken along line III-III' of FIG. 1.

1 to 4, a display device according to an embodiment of the present invention may include a device substrate 100. The device substrate 100 may include an insulating material. For example, the device substrate 100 may include glass or plastic.

The device substrate 100 may include a display area AA and a bezel area NA. The bezel area NA may be located outside the display area AA. For example, the display area AA may be surrounded by the bezel area NA.

At least one light emitting device 300 may be positioned on the display area AA of the device substrate 100. The light-emitting device 300 may emit light having a specific color. For example, the light-emitting element 300 may include a first electrode 310, a light-emitting layer 320, and a second electrode 330 stacked in order.

The first electrode 310 may include a conductive material. The first electrode 310 may have a relatively high reflectivity. The first electrode 310 may have a multilayer structure. For example, the first electrode 310 may have a structure in which a reflective electrode formed of a metal such as aluminum (Al) and silver (Ag) is positioned between transparent electrodes formed of a transparent conductive material such as ITO and IZO. .

The emission layer 320 may generate light having a luminance corresponding to a voltage difference between the first electrode 310 and the second electrode 330. For example, the emission layer 320 may include an emission material layer (EML) including a light emitting material. The light emitting material may include an organic material. For example, the display device according to an embodiment of the present invention may be an organic light emitting display device including an emission layer 320 formed of an organic material.

The emission layer 320 may have a multilayer structure. For example, the light emitting layer 320 includes a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). ) May further include at least one of.

The second electrode 330 may include a conductive material. The second electrode 330 may include a material different from that of the first electrode 310. For example, the second electrode 330 may be a transparent electrode formed of a transparent conductive material such as ITO and IZO. Accordingly, in the display device according to the exemplary embodiment of the present invention, light generated by the emission layer 320 may be emitted to the outside through the second electrode 330.

A driving circuit may be positioned between the device substrate 100 and the light emitting device 300. The driving circuit may provide a driving current according to a gate signal and a data signal to the light emitting device 300. For example, the driving circuit may include at least one thin film transistor 210 and a storage capacitor 230.

The thin film transistor 210 may generate the driving current by the gate signal and the data signal. For example, the thin film transistor 210 includes a semiconductor pattern 211, a gate insulating layer 212, a gate electrode 213, a first interlayer insulating layer 214, a second interlayer insulating layer 215, and a source electrode 214. And a drain electrode 215.

The semiconductor pattern 211 may be positioned close to the device substrate 100. The semiconductor pattern 211 may include a semiconductor material. For example, the semiconductor pattern 211 may include amorphous Si or poly Si. The semiconductor pattern 211 may be an oxide semiconductor. For example, the semiconductor pattern 211 may include IGZO.

The semiconductor pattern 211 may include a channel region positioned between a source region and a drain region. The source region and the drain region may have a lower resistance than the channel region. For example, the channel region may have an impurity concentration lower than that of the source region and the drain region.

The gate insulating layer 212 may be positioned on the semiconductor pattern 211. The gate insulating layer 212 may extend outside the semiconductor pattern 211. For example, a side surface of the semiconductor pattern 211 may be covered by the gate insulating layer 212. The gate insulating layer 212 may include an insulating material. For example, the gate insulating layer 212 may include silicon oxide (SiO) and/or silicon nitride (SiN). The gate insulating layer 212 may include a High-K material. For example, the gate insulating layer 212 may include titanium oxide (TiO). The gate insulating layer 212 may have a multilayer structure.

The gate electrode 213 may be positioned on the gate insulating layer 212. The gate electrode 213 may overlap the channel region of the semiconductor pattern 211. The gate electrode 213 may be insulated from the semiconductor pattern 211 by the gate insulating layer 212. The gate electrode 213 may include a conductive material. For example, the gate electrode 213 may include a metal such as aluminum (Al), chromium (Cr), copper (Cu), titanium (Ti), molybdenum (Mo), and tungsten (W).

The first interlayer insulating layer 214 and the second interlayer insulating layer 215 may be sequentially stacked on the gate electrode 213. The first interlayer insulating layer 214 and the second interlayer insulating layer 215 may extend outside the semiconductor pattern 211. For example, the first interlayer insulating layer 214 and the second interlayer insulating layer 215 may extend along the gate insulating layer 212. The first interlayer insulating layer 216 and the second interlayer insulating layer 217 may include an insulating material. For example, the first interlayer insulating layer 216 and the second interlayer insulating layer 217 may include silicon oxide (SiO) or silicon nitride (SiN). The second interlayer insulating layer 217 may include a material different from the first interlayer insulating layer 216. For example, the first interlayer insulating layer 216 may include silicon oxide (SiO), and the second interlayer insulating layer 217 may include silicon nitride (SiN).

The source electrode 216 and the drain electrode 217 may be positioned on the second interlayer insulating layer 215. The source electrode 214 may be electrically connected to the source region of the semiconductor pattern 211. For example, the first interlayer insulating layer 216 and the second interlayer insulating layer 217 may include a source contact hole exposing the source region of the semiconductor pattern 211. The source electrode 214 may be electrically connected to the semiconductor pattern 211 through the source contact hole. For example, the source electrode 214 may include a region overlapping the source region of the semiconductor pattern 211. The drain electrode 215 may be connected to the drain region of the semiconductor pattern 211. For example, the first interlayer insulating layer 216 and the second interlayer insulating layer 217 may include a drain contact hole exposing the drain region of the semiconductor pattern 211. The drain electrode 215 may be electrically connected to the semiconductor pattern 211 through the drain contact hole. For example, the drain electrode 215 may include a region overlapping the drain region of the semiconductor pattern 211. The drain electrode 215 may be spaced apart from the source electrode 214.

The source electrode 214 and the drain electrode 215 may include a conductive material. For example, the source electrode 214 and the drain electrode 215 are metals such as aluminum (Al), chromium (Cr), copper (Cu), titanium (Ti), molybdenum (Mo), and tungsten (W). It may include. The drain electrode 215 may include the same material as the source electrode 214. The source electrode 214 and the drain electrode 215 may include a material different from that of the gate electrode 213.

The storage capacitor 230 may maintain the operation of the thin film transistor 210 for one frame. The storage capacitor 230 may include at least two conductive layers 231, 232, 233 and 234. For example, the storage capacitor 230 may include a first storage electrode 231, a second storage electrode 232, a third storage electrode 233, and a fourth storage electrode 234 stacked in order. have.

The storage capacitor 230 may be formed simultaneously with the thin film transistor 210. For example, the first storage electrode 231 may be positioned on the same layer as the semiconductor pattern 211. The second storage electrode 232 may be positioned on the same layer as the gate electrode 213. For example, the second storage electrode 232 may be positioned on the gate insulating layer 212. The third storage electrode 233 may be positioned between the first interlayer insulating layer 214 and the second interlayer insulating layer 215. The fourth storage electrode 234 may be positioned on the second interlayer insulating layer 215. For example, the fourth storage electrode 234 may be positioned on the same layer as the source electrode 214 and the drain electrode 215.

The first storage electrode 231 may include the same material as the semiconductor pattern 211. The second storage electrode 232, the third storage electrode 233, and the fourth storage electrode 234 may include a conductive material. For example, the second storage electrode 232, the third storage electrode 233, and the fourth storage electrode 234 are aluminum (Al), chromium (Cr), copper (Cu), titanium (Ti). , Molybdenum (Mo) and tungsten (W) may be included. The second storage electrode 232 may include the same material as the gate electrode 213. The fourth storage electrode 234 may include the same material as the source electrode 214 and the drain electrode 215. The third storage electrode 233 may include a material different from that of the fourth storage electrode 234.

A buffer insulating layer 110 may be positioned between the device substrate 100 and the driving circuit. The buffer insulating layer 110 may prevent contamination by the device substrate 100 in a process of forming the driving circuit. The buffer insulating layer 110 may extend outward of the driving circuit. For example, the buffer insulating layer 110 may extend onto the bezel area NA. The gate insulating layer 212, the first interlayer insulating layer 213, and the second interlayer insulating layer 214 may extend along the buffer insulating layer 110. For example, the buffer insulating layer 110, the gate insulating layer 212, the first interlayer insulating layer 214, and the second interlayer insulating layer 215 are formed on the bezel area NA of the device substrate 100. They can be stacked in sequence.

The buffer insulating layer 110 may include an insulating material. For example, the buffer insulating layer 110 may include silicon oxide (SiO) and/or silicon nitride (SiN). The buffer insulating layer 110 may have a multilayer structure. For example, the buffer insulating layer 110 may have a structure in which a layer formed of silicon oxide (SiO) and a layer formed of silicon nitride (SiN) are stacked.

An overcoat layer 120 may be positioned between the driving circuit and the light emitting device 300. The overcoat layer 120 may remove a step due to the driving circuit. For example, the surface of the overcoat layer 120 facing the light emitting device 300 may be a flat surface. The overcoat layer 120 may include an insulating material. For example, the overcoat layer 120 may include an organic insulating material. The overcoat layer 120 may include an electrode contact hole exposing a partial region of the thin film transistor 210. For example, the overcoat layer 120 may expose a partial region of the drain electrode 217. The light emitting device 300 may be electrically connected to the thin film transistor 210 through the electrode contact hole. For example, the first electrode 310 may directly contact the drain electrode 217 within the electrode contact hole.

A bank insulating layer 130 may be positioned on the overcoat layer 120. The bank insulating layer 130 may independently control the operation of the light emitting device 300. For example, the bank insulating layer 130 may cover an edge of the first electrode 310. The bank insulating layer 130 may include an insulating material. For example, the bank insulating layer 130 may include an organic insulating material. The bank insulating layer 130 may include a material different from that of the overcoat layer 120. The emission layer 320 and the second electrode 330 may be sequentially stacked on a partial region of the first electrode 310 exposed by the bank insulating layer 130.

The emission layer 320 may include an end positioned on the bank insulating layer 130. For example, the emission layer 320 may be formed by a fine metal mask (FMM). A spacer 140 may be positioned on the bank insulating layer 130. The spacer 140 may prevent damage due to the fine metal mask FMM in the process of forming the light emitting layer 320. The second electrode 330 may extend over the bank insulating layer 130 and the spacer 140. The second electrode 330 may extend onto the bezel area NA. A side surface of the overcoat layer 120, a side surface of the bank insulating layer 130, and a side surface of the spacer 140 on the bezel area NA may be covered by the second electrode 330. Accordingly, in the display device according to an exemplary embodiment of the present invention, penetration of external moisture through the overcoat layer 120, the bank insulating layer 130 and/or the spacer 140 may be prevented.

A common voltage supply line 350 may be positioned on the bezel area NA of the device substrate 100. The common voltage supply line 350 may be connected to the second electrode 330. For example, the second electrode 330 may directly contact the common voltage supply line 350 from the outside of the overcoat layer 120. The common voltage supply line 350 may include a conductive material. The common voltage supply line 350 may have a higher conductivity than the second electrode 330. For example, the common voltage supply line 350 may include metals such as aluminum (Al), chromium (Cr), copper (Cu), titanium (Ti), molybdenum (Mo), and tungsten (W). . Accordingly, in the display device according to the embodiment of the present invention, luminance deviation due to resistance of the second electrode 330 may be prevented by the common voltage supply line 350.

The common voltage supply line 350 may be located on the second interlayer insulating layer 217. The overcoat layer 120 may cover one end of the common voltage supply line 350. For example, the common voltage supply line 350 may include the same material as the source electrode 214 and the drain electrode 215.

An encapsulation member 400 may be positioned on the light emitting device 300, the bank insulating layer 130, and the spacer 140. The sealing member 400 may prevent damage to the light emitting device 300 due to external impact and moisture. The encapsulation member 400 may have a multilayer structure. For example, the encapsulation member 400 may include a first encapsulation layer 410, a second encapsulation layer 420 and a third encapsulation layer 430 stacked in order. The first encapsulation layer 410, the second encapsulation layer 420 and the third encapsulation layer 430 may include an insulating material. The second encapsulation layer 420 may include a material different from the first encapsulation layer 410 and the third encapsulation layer 430. For example, the first encapsulation layer 410 and the third encapsulation layer 430 may include an inorganic insulating material, and the second encapsulation layer 420 may include an organic insulating material. Accordingly, in the display device according to the exemplary embodiment of the present invention, a step due to the light emitting element 300, the bank insulating layer 130, and the spacer 140 may be removed by the encapsulation member 400.

The encapsulation member 400 may extend outside the display area AA. For example, the encapsulation member 400 may include a region overlapping the bezel region NA of the device substrate 100. At least one dam 800 may be positioned on the common voltage supply line 350. For example, on the common voltage supply line 350, a first dam 810, a second dam 820, and a third dam 830 may be positioned side by side. The third dam 830 spaced farthest from the side surface of the overcoat layer 120 may cover the other end of the common voltage supply line 350. For example, the first dam 810 and the second dam 820 supply the common voltage to face the device substrate 100 between the overcoat layer 120 and the third dam 830 It may be located on the surface of the line 350. The second electrode 330 may be connected to the common voltage supply line 350 between the overcoat layer 120 and the first dam 810. The dam 800 may control the flow of the encapsulation member 400. For example, the second encapsulation layer 420 formed of an organic material may include a side surface positioned between the overcoat layer 120 and the first dam 810. The first dam 810, the second dam 820, and the third dam 830 may be covered by the third encapsulation layer 430 formed of an inorganic material.

The first dam 810, the second dam 820, and the third dam 830 may include an insulating material. The first dam 810, the second dam 820, and the third dam 830 may have a multilayer structure. For example, the third dam 830 may include a first dam pattern 831, a second dam pattern 832, and a third dam pattern 833 stacked in order. Each of the first dam pattern 831, the second dam pattern 832, and the third dam pattern 833 includes one of insulating layers positioned between the device substrate 100 and the encapsulation member 400. It can be formed at the same time. For example, the first dam pattern 831 includes the same material as the overcoat layer 120, the second dam pattern 832 includes the same material as the bank insulating layer 130, and the The third dam pattern 833 may include the same material as the spacer 140. The first dam 810 and the second dam 820 may have the same structure as the third dam 830.

Touch electrodes 510 may be positioned on the encapsulation member 400. The touch electrodes 510 may sense a touch of a user and/or a tool. The touch electrodes 510 may be located in the display area AA. For example, the touch electrodes 510 may be arranged in a matrix form in the display area AA. The touch electrodes 510 may include a conductive material. The touch electrodes 510 may overlap at least one of the light emitting devices 300. The touch electrodes 510 may include a transparent material. For example, the touch electrodes 510 may be transparent electrodes formed of a transparent conductive material such as ITO and IZO.

The touch electrodes 510 may be individually connected to the touch lines 520. The touch lines 520 may be positioned on the same layer as the touch electrodes 510. For example, the touch electrodes 510 and the touch lines 520 may directly contact the encapsulation member 400. The touch lines 520 may include a conductive material. For example, the touch lines 520 may include the same material as the touch electrodes 510. Each touch line 520 may directly contact the corresponding touch electrode 510.

The touch lines 520 may extend outside the encapsulation member 400. For example, the touch lines 520 may extend along a surface of the encapsulation member 400 facing the device substrate 100. The touch lines 520 may include a first touch line 521 directly connected to one of the touch pads 103 and 105 spaced apart from the encapsulation member 400 in a first direction (Y). . For example, the first touch line 521 may extend in the first direction Y. The touch electrodes 510 may include a first touch electrode 511 connected to the corresponding touch pads 103 and 105 by the first touch line 521. For example, the first touch electrode 511 may directly contact the first touch line 521.

The touch lines 520 may include a second touch line 522 that is not directly connected to the touch pads 103 and 105. For example, the touch lines 520 may include a plurality of first touch lines 521 and at least one second touch line 522. The second touch line 522 may be positioned on the same layer as the first touch line 521. For example, the first touch line 521 and the second touch line 522 may directly contact the encapsulation member 400. The second touch line 522 may extend in a second direction X different from the first direction Y. The second direction X may be a direction perpendicular to the first direction Y. For example, an end of the second touch line 522 may be spaced apart from the encapsulation member 400 in a direction perpendicular to the first direction Y. The second touch line 522 may not include an area extending in the first direction Y.

The touch pads 103 and 105 include a first touch pad 105 directly connected to the first touch line 521 and a second touch pad 103 not connected to the first touch line 521. Can include. The second touch pad 103 may be positioned parallel to the first touch pad 105 in the second direction X.

The first touch pad 105 may include a conductive material. For example, the first touch pad 105 may include the same material as the first touch line 521. The first touch pad 105 may be positioned on the same layer as the first touch line 521. For example, the first touch pad 105 may directly contact the first touch line 521.

The second touch pad 103 may include a conductive material. The second touch pad 103 may include a material different from that of the first touch pad 105. For example, the second touch pad 103 may be positioned on a different layer from the first touch pad 105. The second touch pad 103 may be formed simultaneously with one of the conductive layers positioned between the device substrate 100 and the light emitting device 300. For example, the second touch pad 103 may include the same material as the source electrode 216 and the drain electrode 217 of the thin film transistor 210. The second touch pad 103 may be positioned on the second interlayer insulating layer 217.

The edge of the second touch pad 103 may be covered by a pad insulating layer 845. For example, the pad insulating layer 845 may include a pad through hole 845h exposing a partial area of the second touch pad 103. The first touch pad 105 may be positioned on the pad insulating layer 145. The pad insulating layer 845 may include an insulating material. The pad insulating layer 845 may be formed simultaneously with one of the insulating layers positioned between the second interlayer insulating layer 217 and the encapsulation member 400. For example, the pad insulating layer 845 may include the same material as the overcoat layer 120. An end of the third encapsulation layer 430 may be positioned on the pad insulating layer 845.

The second touch pad 103 may be connected to the connection link 600. The connection link 600 may extend in the first direction (Y). The connection link 600 may be located on a layer different from the first touch line 521 and the second touch line 522. For example, the connection link 600 may be located on the same layer as the second touch pad 103. The connection link 600 may include a region positioned between the device substrate 100 and the encapsulation member 400. For example, a partial region of the connection link 600 may be positioned between the second interlayer insulating layer 217 and the pad insulating layer 845. The connection link 600 may be located outside the display area AA. For example, the connection link 600 may be located within the bezel area NA. Accordingly, in the display device according to the exemplary embodiment of the present invention, reduction in the area of the display area AA by the connection link 600 may be prevented.

The connection link 600 may include a conductive material. The connection link 600 may include the same material as the second touch pad 103. For example, the connection link 600 may include the same material as the source electrode 216 and the drain electrode 217 of the thin film transistor 210. The second touch pad 103 may be directly connected to the connection link 600.

The connection link 600 may be connected to the second touch line 522 outside the encapsulation member 400. For example, the pad insulating layer 845 may include a link contact hole 600h for connecting the connection link 600 and the second touch line 522. That is, in the display device according to the embodiment of the present invention, the second touch electrode 512 may be connected to the second touch pad 103 through the second touch line 522 and the connection link 600. . Accordingly, in the display device according to an embodiment of the present invention, the area occupied by the touch lines 520 to connect the touch electrodes 510 and the touch pads 103 and 105 may be reduced. have. Accordingly, in the display device according to the exemplary embodiment of the present invention, the area of the bezel area NA may be minimized.

In the first direction Y, the second touch electrode 512 may be spaced farther from the touch pads 103 and 105 than the first touch electrode 511. For example, a distance between the first touch electrode 511 and the first touch pad 105 in the first direction (Y) is equal to a distance between the second touch electrode 512 and the first touch pad 105 in the first direction (Y). It may be smaller than the distance between the second touch pads 103. Accordingly, in the display device according to an embodiment of the present invention, a connection structure between the touch electrodes 510 and the touch pads 103 and 105 by the touch lines 520 and the connection link 600 Can be simplified. Accordingly, in the display device according to the exemplary embodiment, the area of the bezel area NA may be effectively reduced.

A touch protection layer 150 may be positioned on the touch electrodes 510 and the touch lines 520. The touch protective layer 150 may prevent damage to the touch electrodes 510 and the touch lines 520 due to external impact and moisture. The touch protection layer 150 may include an insulating material. The touch protection layer 150 includes first pad open holes 151h exposing a partial area of the first touch pad 105 and second pad open holes 152h overlapping the pad through hole 845h. It may include.

As a result, the display device according to the exemplary embodiment of the present invention includes the first touch electrode 511 and the second touch electrode 512 positioned side by side on the sealing member 400, and the first touch electrode 511 is connected to the first touch pad 105 by the first touch line 521 extending along the surface of the encapsulation member 400 facing the device substrate 100, and the second The touch electrode 512 may be connected to the second touch pad 103 using the connection link 600 positioned between the device substrate 100 and the encapsulation member 400. Accordingly, in the display device according to the exemplary embodiment of the present invention, an area required to connect the second touch electrode 512 and the second touch pad 103 may be reduced. Accordingly, in the display device according to the exemplary embodiment of the present invention, the area of the bezel area NA may be minimized.

In the display device according to an exemplary embodiment of the present invention, it is described that the power supply line 350, the second touch line 103, and the connection link 600 include the same material. However, in the display device according to another embodiment of the present invention, the second touch line 103 and/or the connection link 600 may include a material different from the power supply line 350. For example, as shown in FIG. 5, in the display device according to another embodiment of the present invention, the connection link 600 may include the same material as the third storage electrode 233 of the storage capacitor 230. . The connection link 600 may be located on the same layer as the third storage electrode 233. For example, the connection link 600 may be positioned between the first interlayer insulating layer 216 and the second interlayer insulating layer 217. A link contact hole 600h exposing a partial region of the connection link 600 may be formed in the second interlayer insulating layer 217. Accordingly, in the display device according to another exemplary embodiment of the present invention, a degree of freedom for the formation process and position of the connection link 600 may be improved.

In the display device according to the exemplary embodiment of the present invention, the touch protection layer 150 is described as exposing a partial area of the second touch pad 103. However, as shown in FIG. 6, in the display device according to another embodiment of the present invention, the cover pad 107 may be positioned on the second touch pad 103. The second pad open hole 152h of the touch passivation layer 150 may expose a partial area of the cover pad 107. The cover pad 107 may be positioned on the same layer as the first touch pad 105. For example, the cover pad 107 may include a region positioned on the pad insulating layer 845. The cover pad 107 may directly contact the second touch pad 103 within the pad through hole 845h of the pad insulating layer 845. The cover pad 107 may include a conductive material. For example, the cover pad 107 may include the same material as the first touch pad 105.

In the display device according to an embodiment of the present invention, the touch pads 103 and 105 positioned side by side in the second direction X have different positions in the first direction Y perpendicular to the second direction X. Is described as. However, as shown in FIG. 7, in the display device according to another exemplary embodiment of the present invention, the distance between the touch pads 103 and 105 and the display area AA in the first direction Y is the same. Can have. Accordingly, in the display device according to another exemplary embodiment of the present invention, a degree of freedom in a process and position of the touch pads 103 and 105 may be improved.

In the display device according to the exemplary embodiment of the present invention, it is described that each touch line 520 contacts the corresponding touch electrode 510 in the same direction. However, in the display device according to the exemplary embodiment of the present invention, adjacent touch lines 520 may contact the corresponding touch electrode 510 in different directions. For example, as shown in FIG. 7, in the display device according to another exemplary embodiment of the present invention, two touch electrodes 511 and 512 adjacent to each other in a first direction Y are opposite to each other, and a corresponding touch line 521 , 522). Accordingly, in the display device according to another embodiment of the present invention, the display area AA may be located between the connection links 600. Accordingly, in the display device according to another embodiment of the present invention, the degree of freedom for the positions of the connection links 600 may be improved.

100: device substrate 300: light emitting device
400: sealing member 510: touch electrode
521: first touch line 522: second touch line
600: connecting link

Claims (17)

A light-emitting element positioned on the display area of the element substrate;
An encapsulation member covering the light emitting device and extending outward of the display area;
A first touch electrode positioned on the encapsulation member and overlapping the display area;
A second touch electrode positioned on the encapsulation member in parallel with the first touch electrode and overlapping the display area;
A first touch line extending in a first direction and connecting the first touch electrode to a first touch pad spaced apart from the encapsulation member in the first direction;
A connection link extending in the first direction and connected to a second touch pad disposed parallel to the first touch pad in a second direction different from the first direction; And
And a second touch line positioned on the same layer as the first touch line and connecting the second touch electrode to the connection link,
The connection link is positioned on a different layer from the first touch line. The method of claim 1,
The first touch line and the second touch line extend along a surface of the encapsulation member facing the device substrate,
The connection link includes a region positioned between the device substrate and the encapsulation member. The method of claim 1,
The second touch electrode is located on the same layer as the first touch electrode,
The first touch electrode is disposed on the same layer as the first touch line. The method of claim 3,
The first touch electrode, the second touch electrode, the first touch line, and the second touch line include the same material. The method of claim 1,
The second touch pad is disposed on a different layer from the first touch pad. The method of claim 5,
A display device further comprising a cover pad positioned on the second touch pad and including the same material as the first touch pad. The method of claim 5,
The second touch pad is in contact with the connection link,
The first touch pad is in contact with the first touch line. The method of claim 7,
The connection link includes a material different from that of the first touch line. The method of claim 1,
Further comprising a thin film transistor positioned between the device substrate and the light emitting device,
The connection link includes the same material as the source electrode and the drain electrode of the thin film transistor. The method of claim 1,
The second touch electrode is positioned parallel to the first touch electrode in the first direction,
A display device in which a distance between the first touch electrode and the first touch pad in the first direction is smaller than a distance between the second touch electrode and the second touch pad in the first direction. A light-emitting element positioned on the display area of the element substrate;
An encapsulation member covering the light emitting device and extending outward of the display area;
Touch electrodes positioned on the encapsulation member;
Touch lines individually connected to the touch electrodes and extending outward of the encapsulation member;
A first touch pad positioned on the device substrate and spaced apart from the encapsulation member in a first direction;
A second touch pad disposed parallel to the first touch pad in a second direction different from the first direction, and disposed on a layer different from the first touch pad; And
A connection link including a region positioned between the device substrate and the encapsulation member and connected to the second touch pad,
The touch lines include a first touch line connected to the first touch pad and a second touch line connected to the connection link. Following paragraph 11,
Each touch line is a display device in contact with a corresponding touch electrode. The method of claim 11,
The first touch pad includes the same material as the touch lines,
The second touch pad includes the same material as the connection link. The method of claim 13,
The connection link is a display device located outside the display area. The method of claim 11,
Further comprising a storage capacitor positioned between the device substrate and the light emitting device,
The connection link includes the same material as one of the conductive layers of the storage capacitor. The method of claim 15,
Further comprising a common voltage supply line positioned between the device substrate and the encapsulation member outside the display area,
The connection link is located on a layer different from the common voltage supply line. The method of claim 11,
The second direction is a direction perpendicular to the first direction.

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