KR20200066173A - Apparatus for cutting substrate - Google Patents

Abstract

An objective of the present invention is to provide an apparatus for cutting a substrate which can prevent deflection of the rear end of a substrate. According to embodiments of the present invention, the apparatus for cutting a substrate comprises: a scribing unit configured to form a scribing line on a substrate; a first stage to transport the substrate to the scribing unit; a clamp module to grip the substrate and move in a transport direction of the substrate; a second stage which is arranged on a downstream side of the scribing unit, receives the substrate with a scribing line formed by the scribing unit, and has an accommodation part to accommodate the clamp module; an accommodation part position detection sensor to detect the position of the accommodation part; and a control unit to control the clamp module and the second stage based on the position of the accommodation part detected by the accommodation part position detection sensor to accommodate the clamp module in the accommodation part.

Description

Substrate cutting device {APPARATUS FOR CUTTING SUBSTRATE}

The present invention relates to a substrate cutting device for cutting a substrate.

In general, liquid crystal display panels used in flat panel displays, organic electroluminescent display panels, inorganic electroluminescent display panels, transmissive projector substrates, reflective projector substrates, etc. are brittle mother glass panels such as glass (hereinafter referred to as'substrate') A unit glass panel (hereinafter referred to as a'unit substrate') cut from a predetermined size is used.

The process of cutting the substrate into unit substrates is a scribing process of forming a scribing line on the substrate by moving a scribing wheel made of a diamond-like material to the substrate while moving along a line to be cut as a reference for cutting the substrate. It includes.

In this scribing process, the trailing end of the substrate is gripped by the clamp and transferred to the scribing unit while the substrate is supported by the first transfer belt. That is, as the first transfer belt is driven with the clamp moving to the scribing unit while the trailing end of the substrate is held, the substrate is transferred to the scribing unit.

The substrate on which the scribing line is formed by the scribing unit is transferred to the second transfer belt. At this time, in order to maintain the accuracy of a plurality of unit processes, it is important that the entire bottom surface of the substrate is stably seated on the upper surface of the second transfer belt.

However, to prevent interference between the second transfer belt and the clamp, the clamp releases the trailing end of the substrate before the trailing end of the substrate is seated on the second transfer belt. Accordingly, since the clamp releases the trailing end of the substrate while the trailing end of the substrate is not supported on the upper surface of the second transfer belt, the entire bottom surface of the substrate cannot be stably seated on the second transfer belt, and the substrate after There is a problem that the steps are drooping down.

The present invention is to solve the above problems, an object of the present invention, when the substrate is transferred from the first transfer belt to the second transfer belt, provides a substrate cutting device that can prevent the trailing end of the substrate sagging To do it.

A substrate cutting apparatus according to an embodiment of the present invention for achieving the above object, a scribing unit configured to form a scribing line on a substrate; A first stage for transferring the substrate to the scribing unit; A clamp module configured to grip the substrate and moving in a transfer direction of the substrate; A second stage disposed on the downstream side of the scribing unit, receiving the substrate on which the scribing line is formed by the scribing unit, and having a receiving portion for receiving the clamp module; Receiving unit position detection sensor for sensing the position of the receiving unit; And a control unit that controls the clamp module and the second stage based on the position of the receiving part sensed by the receiving position detecting sensor so that the clamp module is accommodated in the receiving part.

The control unit may move the second stage based on the position of the receiving part sensed by the receiving position detecting sensor to position the receiving part in the standby position.

The second stage may consist of one belt operating in a caterpillar manner.

The substrate cutting apparatus according to the embodiment of the present invention further includes a clamp module position detection sensor that detects the position of the clamp module, and the control unit detects the position of the receiving portion and the clamp module position detection sensor detected by the receiving portion position detection sensor. The clamp module and the second stage may be controlled based on the position of the clamp sensed by to allow the clamp module to be accommodated in the receiving portion of the second stage.

The clamp module position detection sensor includes: a first optical element connected to the clamp module; And a second optical element installed on the upstream side of the substrate in the transport direction with respect to the clamp module, and detecting the position of the clamp module based on the position of the first optical element with respect to the second optical element. have.

The substrate cutting apparatus according to the embodiment of the present invention may further include a substrate position sensing sensor that detects the position of the tip of the substrate, and the control unit is based on the position of the tip of the substrate detected by the substrate position sensing sensor. By detecting the position of the clamp module, and controlling the clamp module and the second stage based on the position of the clamp module and the position of the receiving portion detected by the receiving position sensor, the clamp module is accommodated in the receiving portion of the second stage. can do.

A substrate cutting apparatus according to an embodiment of the present invention includes: a scribing unit configured to form a scribing line on a substrate; A first stage for transferring the substrate to the scribing unit; A clamp module configured to grip the substrate and movable in a transfer direction of the substrate; A second stage disposed on the downstream side of the scribing unit, receiving the substrate on which the scribing line is formed by the scribing unit, and having a receiving portion for receiving the clamp module; A clamp module position detection sensor that detects the position of the clamp module; And a control unit that controls the clamp module and the second stage based on the position of the clamp module sensed by the clamp module position detection sensor so that the clamp module is accommodated in the receiving portion of the second stage.

A substrate cutting apparatus according to an embodiment of the present invention includes: a scribing unit configured to form a scribing line on a substrate; A first stage for transferring the substrate to the scribing unit; A clamp module configured to grip the substrate and movable in a transfer direction of the substrate; A second stage disposed on the downstream side of the scribing unit, receiving the substrate on which the scribing line is formed by the scribing unit, and having a receiving portion for receiving the clamp module; A substrate position sensor for sensing the position of the tip of the substrate; And detecting the position of the clamp module based on the position of the tip of the substrate detected by the substrate position sensing sensor, and controlling the clamp module and the second stage based on the position of the clamp module so that the clamp module receives the second stage. It may include a control unit to be accommodated in.

According to the substrate cutting apparatus according to an embodiment of the present invention, the clamp module on the first stage holding the substrate, based on the position of the receiving portion and the position of the clamp detected by the position detecting sensor and the clamp module position detecting sensor It can be stably moved to the second receiving portion of the second stage. Therefore, it is possible to prevent the trailing end of the substrate from sagging in the second stage, and the entire bottom surface of the substrate is stably seated on the second stage, thereby providing the accuracy of the unit process.

1 is a plan view schematically showing a substrate cutting apparatus according to an embodiment of the present invention.
2 is a view schematically showing a substrate cutting apparatus according to an embodiment of the present invention.
3 and 4 are views schematically showing an operation process of the first transfer unit and the clamp unit of the substrate cutting apparatus according to the embodiment of the present invention.
5 and 6 are views schematically showing an operation process of the clamp module of the substrate cutting apparatus according to the embodiment of the present invention.
7 and 8 are diagrams schematically showing a substrate transfer process of the substrate cutting apparatus according to the embodiment of the present invention.
9 is a view schematically showing another example of a substrate cutting apparatus according to an embodiment of the present invention.
10 is a view schematically showing another example of a substrate cutting apparatus according to an embodiment of the present invention.

Hereinafter, a substrate cutting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

The object to be cut by the substrate cutting apparatus according to the embodiment of the present invention may be a bonding substrate to which a plurality of substrates are bonded. For example, the bonding substrate is a substrate on which the first substrate and the second substrate are bonded, and the first substrate may include a thin film transistor, and the second substrate may include a color filter. Conversely, the first substrate may include a color filter, and the second substrate may include a thin film transistor. Hereinafter, the bonded substrate is simply referred to as a substrate, the surface of the first substrate exposed to the outside is referred to as a first surface, and the surface of the second substrate exposed to the outside is referred to as a second surface.

In addition, a direction in which the substrate to be processed for cutting the substrate is transferred is defined as a Y-axis direction, and a direction perpendicular to a direction in which the substrate is transferred (Y-axis direction) is defined as an X-axis direction. In addition, a direction perpendicular to the X-Y plane on which the substrate is placed is defined as a Z-axis direction.

1 and 2 are views schematically showing a substrate cutting apparatus according to an embodiment of the present invention.

1 and 2, a substrate cutting apparatus according to an embodiment of the present invention scribes a scribing unit 30 and a substrate S for forming a scribing line on the substrate S The first transfer unit 10 transferring to the unit 30, the second transfer unit 20 transferring the substrate S from the scribing unit 30 to a subsequent process, gripping one end of the substrate during transfer of the substrate It may include a clamp unit 40, a control unit 50 (see FIGS. 3 to 6) for controlling the operation of the components of the substrate cutting device.

The scribing unit 30 is configured to form scribing lines in the X-axis direction on first and second surfaces of the substrate S, respectively.

The scribing unit 30 is a first scribing head movably installed in the X-axis direction on a first frame 31 and a first frame 31 disposed on an upper side of a substrate transferred for process progress ( 32), a second frame 35 disposed parallel to the first frame 31 on the lower side of the substrate, and a second scribing head 36 installed to be movable in the X-axis direction on the second frame 35 It may include.

The first frame 31 may be equipped with a plurality of first scribing heads 32 in the X-axis direction, and the second frame 35 may have a plurality of second scribing heads 36 in the X-axis direction. Can be mounted. A space through which the substrate S passes may be formed between the first frame 31 and the second frame 35. The first frame 31 and the second frame 35 may be manufactured and assembled as separate members, or may be integrally manufactured.

The first scribing head 32 and the second scribing head 36 may be arranged to face each other in the Z-axis direction. A first scribing wheel 34 and a second scribing wheel 38 may be installed on the first scribing head 32 and the second scribing head 36, respectively. The first scribing wheel 34 and the second scribing wheel 38 are first scribing heads 32 and second by a first wheel holder 33 and a second wheel holder 37, respectively. It can be mounted on the scribing head 36. The first scribing wheel 34 mounted on the first scribing head 32 and the second scribing wheel 38 mounted on the second scribing head 36 face each other in the Z-axis direction. Can be placed.

The first and second scribing wheels 34 and 38 may press the first and second surfaces of the substrate S, respectively. In the state where the first and second scribing wheels 34 and 38 press the first and second surfaces of the substrate S, respectively, the first and second scribing heads 32 and 36 are attached to the substrate ( By moving in the X-axis direction relative to S), scribing lines may be formed in the X-axis direction on the first and second surfaces of the substrate S.

Meanwhile, the first and second scribing heads 32 and 36 may be configured to be movable in the Z-axis direction with respect to the first frame 31 and the second frame 35, respectively. To this end, the first frame 31 and the second frame 35 may be provided with a pneumatic or hydraulic actuator, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism. . The linear movement mechanism can provide a driving force for moving the first and second scribing heads 32 and 36 in the Z-axis direction.

As the first and second scribing heads 32 and 36 move in the Z-axis direction with respect to the first frame 31 and the second frame 35, respectively, the first and second scribing wheels 34 , 38) may pressurize the substrate S or be spaced apart from the substrate S. And by adjusting the degree to which the first and second scribing heads 32 and 36 move in the Z-axis direction, the first and second scribing wheels 34 and 38 are applied to the substrate S. The pressing force can be adjusted. Further, the first and second scribing heads 32 and 36 are moved in the Z-axis direction, so that the cutting depths of the first and second scribing wheels 34 and 38 to the substrate S are reduced. Can be adjusted.

The first transfer unit 10 may include a first stage 11 supporting the substrate S. The first stage 11 may be moved reciprocally in the Y-axis direction. As the first stage 11 is moved in the Y-axis direction, the substrate S supported on the first stage 11 may be moved in the Y-axis direction. The first stage 11 may be made of various configurations that can be moved horizontally while supporting a substrate S such as a vacuum table or belt.

The first stage 11 may be composed of one belt having an area equal to or greater than the total area of the substrate S. Since the first stage 11 is made of one belt, it is possible to prevent a problem that may occur due to a configuration in which a plurality of belts are spaced apart in the X-axis direction. When the first stage 11 is composed of a belt, the first stage 11 is supported by a plurality of pulleys 12. At least one of the plurality of pulleys 12 may be a drive pulley providing a driving force for rotating the first stage 11.

The first stage 11 has a support surface on which the substrate S is supported. A first accommodating portion 111 in which the clamp module 41 of the clamp unit 40 is inserted and accommodated may be formed on the support surface of the first stage 11. A plurality of first accommodating parts 111 may be provided, and the plurality of first accommodating parts 111 may be arranged along the X-axis direction to correspond to the plurality of clamp modules 41. The number of the first receiving parts 111 may be the same as the number of clamp modules 41. The first accommodating part 111 may be formed in the form of a through hole penetrating the first stage 11 in the Z-axis direction. In addition, when the first stage 11 has a sufficient thickness, the first accommodating part 111 may be formed in the form of a groove recessed in the first stage 11 without penetrating the first stage 11. have.

As an example, the clamp module 41 may be selectively accommodated in the first receiving portion 111. That is, the clamp module 41 may be accommodated in the first accommodating part 111 while moving in the Z-axis direction, or may be spaced apart from the first accommodating part 111. As another example, the clamp module 41 may be maintained in a state accommodated in the first receiving portion 111.

As described above, since the clamp module 41 can be accommodated in the first accommodating portion 111 formed on the first stage 11, the first stage 11 is formed into a plurality of parts to accommodate the clamp module 41. It does not need to be divided. Therefore, it is possible to prevent problems such as sagging of the substrate, which may occur due to a configuration in which the plurality of first stages 11 are spaced apart in the X-axis direction.

The clamp unit 40 is connected to the clamp module 41 for gripping the trailing end of the substrate S supported on the first stage 11 and the clamp module 41 and a support 42 extending in the X-axis direction , It may include a guide rail 43 that is connected to the support 42 and extends in the Y-axis direction.

Between the support 42 and the guide rail 43, a pneumatic or hydraulic actuator, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism may be provided. Therefore, as the support 42 is moved in the Y-axis direction by the linear movement mechanism in the state where the clamp module 41 grips the trailing end of the substrate S, the substrate S may be transferred in the Y-axis direction. have. At this time, the first stage 11 may stably support the substrate S while moving in synchronization with the movement of the clamp module 41.

The clamp module 41 can press and hold the trailing end of the substrate S. As another example, the clamp module 41 may be configured to adsorb the substrate S by having a vacuum hole connected to a vacuum source. The plurality of clamp modules 41 may be disposed along the support 42 in the X-axis direction.

3 and 4, the clamp module 41 may be installed to be movable in the X-axis direction along the guide 45 extending along the support 42. To this end, an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism may be provided between the clamp module 41 and the guide 45. Therefore, as the plurality of clamp modules 41 are moved in the X-axis direction by the linear movement mechanism, the interval between the plurality of clamp modules 41 can be adjusted. Accordingly, a plurality of clamp modules 41 are appropriately disposed to correspond to the width of the substrate S, so that the substrate S can be stably held. As the plurality of clamp modules 41 are moved in the X-axis direction by a linear movement mechanism, the plurality of clamp modules 41 may be positioned to correspond to the plurality of first receiving portions 111 of the first stage 11, respectively. Can be.

A movement module 44 for moving the clamp module 41 in the Z-axis direction may be provided between the clamp module 41 and the support 42. The moving module 44 may be a pneumatic or hydraulic actuator, a linear motor operated by electromagnetic interaction, or a linear moving mechanism such as a ball screw mechanism. When the substrate S is carried into or out of the first stage 11, the clamp module 41 is moved away from the first stage 11 by the moving module 44, Accordingly, interference between the clamp module 41 and the substrate S can be prevented.

While the clamp module 41 is moved in the Z-axis direction by the moving module 44, it may be accommodated in the first accommodating part 111 of the first stage 11 or may be disengaged from the first accommodating part 111.

The second transfer unit 20 may include a second stage 21 disposed adjacent to the scribing unit 30 to support the substrate S. The second stage 21 may be configured to be movable in a direction parallel to the direction in which the substrate S is transferred (Y-axis direction).

The second stage 21 may be composed of one belt having an area equal to or greater than the total area of the substrate S. Since the second stage 21 is made of one belt, it is possible to prevent problems such as sagging of the substrate, which may occur due to a configuration in which a plurality of belts are spaced apart in the X-axis direction. When the second stage 21 is composed of a belt, the second stage 21 may be supported by a plurality of pulleys 22. At least one of the plurality of pulleys 22 may be a drive pulley providing a driving force for rotating the second stage 21.

The second stage 21 has a support surface on which the substrate S is supported. A second accommodating portion 211 in which the clamp module 41 is inserted and received is formed on the support surface of the second stage 21. A plurality of second accommodating parts 211 may be provided, and the plurality of second accommodating parts 211 may be arranged along the X-axis direction to correspond to the plurality of clamp modules 41. The number of the second receiving portions 211 may be the same as the number of clamp modules 41. The second accommodating part 211 is formed in the form of a through hole penetrating the second stage 21.

The second transfer unit 20 may include a receiving portion position sensor 23 for detecting the location of the second receiving portion 211. When the second stage 21 of the second transfer unit 20 is composed of a belt in the form of a caterpillar, the receiving position sensor 23 is a first sensor holder 24 disposed inside the second stage 21 ). However, the installation position of the accommodating part position sensor 23 is not limited to the above-described position, and the accommodating part position sensing sensor 23 may be installed outside the second stage 21.

As an example, an optical sensor may be applied to the receiver position sensing sensor 23. In this case, the receiver position sensing sensor 23 may be composed of a light emitting unit that emits light toward the second stage 21 and a light receiving unit that receives light reflected by the second stage 21. According to this configuration, when the light emitted from the light emitting portion is emitted to the second receiving portion 211, since the light passes through the second receiving portion 211, the light receiving portion cannot receive the reflected light. In addition, when light emitted from the light emitting unit is emitted to a portion of the second stage 21 except for the second receiving unit 211, light may be reflected by the second stage 21 and received by the light receiving unit. Therefore, it is possible to detect the current position of the second receiving unit 211 according to whether the light receiving unit receives the reflected light.

In the process of rotating the second stage 21 under the control of the control unit 50, the current position of the second accommodating portion 211 may be sensed by the accommodating portion position sensing sensor 23.

The control unit 50 moves the second stage 21 based on the position of the second accommodating portion 211 detected by the accommodating portion position sensing sensor 23 to move the second accommodating portion 211 to the standby position. Can be placed. That is, when the position of the second accommodating portion 211 of the second stage 21 is sensed by the accommodating portion position sensing sensor 23, the second stage 21 is rotated under the control of the control unit 50 Accordingly, the second accommodating portion 211 of the second stage 21 may move to the standby position. Here, the standby position is a position where the clamp module position detection sensor 25 to be described later can detect the position of the clamp module 41 through the second accommodating portion 211.

The second transfer unit 20 may further include a clamp module position detection sensor 25 for sensing the position of the clamp module 41. When the second stage 21 of the second transfer unit 20 is composed of a belt in the form of a caterpillar, the clamp module position sensing sensor 25 is a second sensor holder 26 disposed inside the second stage 21 ). However, the installation position of the clamp module position detection sensor 25 is not limited to the above-described position, and the clamp module position detection sensor 25 may be installed outside the second stage 21.

The clamp module position detection sensor 25 may be disposed at a position close to the scribing unit 30.

As shown in FIG. 7, if the clamp module position detection sensor 25 is installed inside the second stage 21, the second accommodating portion 211 of the second stage 21 is in the standby position. At this time, the clamp module position detection sensor 25 may be configured to detect the position of the clamp module 41 through the second receiving portion 211. As an example, an optical sensor may be applied to the clamp module position sensing sensor 25. In this case, the clamp module position detection sensor 25 may be composed of a light emitting unit that emits light toward the clamp module 41 and a light receiving unit that receives light reflected by the clamp module 41. Therefore, the current of the clamp module 41 is based on whether the light receiving unit receives the light reflected by the clamp module 41 and based on the time until the light receiving unit receives the reflected light after the light is emitted from the light emitting unit. Can detect the location of

The control unit 50 is based on the position of the second accommodating portion 211 detected by the accommodating portion position detection sensor 23 and the position of the clamp module 41 detected by the clamp module position sensing sensor 25. Furnace, the clamp module 41 and the second transfer unit 20 can be controlled. That is, in the state in which the second accommodating portion 211 of the second stage 21 is located in the standby position, the clamp module position sensing sensor 25 is through the second accommodating portion 211 of the second stage 21. When the position of the clamp module 41 is sensed, the clamp module 41 holding the substrate S may be moved to the second receiving portion 211 of the second stage 21.

Therefore, the clamp module 41 holding the substrate S is the second portion of the second stage 21 by the receiving portion position detection sensor 23, the clamp module position detection sensor 25 and the control unit 50. It can be stably accommodated in the receiving portion 211. Therefore, the entire bottom surface of the substrate S is stably mounted on the second stage 21, and accordingly, the trailing end of the substrate S can be prevented from sagging.

3 and 4 are cross-sectional views schematically showing an operation process of the clamp module of the substrate cutting apparatus according to the embodiment of the present invention.

Referring to FIG. 3, when the clamp module 41 is moved away from the first stage 11, the clamp module 41 may be spaced apart from the first accommodating portion 111 of the first stage 11. have. Therefore, in the process of bringing the substrate S into the first stage 11, interference between the substrate S and the clamp module 41 can be prevented.

Referring to FIG. 4, the clamp module 41 may be moved in the Z-axis direction by the moving module 44 to be accommodated in the first receiving portion 111 of the first stage 11. Accordingly, the substrate S may be held by the clamp module 41 at the same height as the supporting surface of the first stage 11.

5 and 6 are views schematically showing a clamp module of a substrate cutting apparatus according to an embodiment of the present invention.

5 and 6, the clamp module 41 includes a base member 411 connected to the support 42, a clamp body 412 movably installed on the base member 411, and a clamp body 412 ), a pair of clamp members 414 that are moved adjacent to each other or spaced apart from each other, and a driving unit 416 that drives the pair of clamp members 414.

The base member 411 is detachably fixed to the support 42, and accordingly, the clamp module 41 can be supported by the support 42.

When the pair of clamp members 414 are moved adjacent to each other with the substrate S interposed therebetween, the trailing end of the substrate S can be held by the pair of clamp members 414. A portion of the substrate S held by the pair of clamp members 414 may be a portion that is not actually utilized for the function of the product. For example, a portion of the substrate S held by the pair of clamp members 414 may be a dummy portion discarded after cutting the substrate S. The pair of clamp members 414 may be moved adjacent to or spaced apart from each other by being rotated about each central axis. To this end, a mechanism for converting the driving force from the driving unit 416 into a rotating force for rotating the pair of clamp members 414 may be provided. In a state where the pair of clamp members 414 are rotated to be spaced apart from each other, the substrate S may be transferred in the Z-axis direction from the upper side of the pair of clamp members 414, and accordingly, the pair of clamp members A trailing end of the substrate S may be positioned between the 414s.

However, the present invention is not limited to this configuration, and the pair of clamp members 414 may be configured to move linearly in the Z-axis direction. To this end, a mechanism for converting the driving force from the driving unit 416 to a driving force for moving the pair of clamp members 414 in a straight line may be provided.

A contact pad 415 may be provided on a surface of the pair of clamp members 414 facing each other, that is, a surface of the pair of clamp members 414 facing the first and second surfaces of the substrate S. have. The contact pad 415 may be made of a soft material such as urethane. The contact pad 415 absorbs the shock generated when the pair of clamp members 414 grip the trailing end of the substrate S and prevents the pair of clamp members 414 or the substrate S from being damaged do. In addition, the contact pad 415 allows the pair of clamp members 414 to grip the trailing end of the substrate S with a uniform pressing force.

The clamp body 412 may be configured to be movable relative to the base member 411. Accordingly, the position of the clamp body 412 relative to the base member 411 can be adjusted. The position of the pair of clamp members 414 can be precisely adjusted by adjusting the position of the clamp body 412 relative to the base member 411. For example, the clamp body 412 may be configured to be movable in the X-axis direction, the Y-axis direction and/or the Z-axis direction with respect to the base member 411. Accordingly, the position of the clamp body 412 relative to the base member 411 in the X-axis direction, the Y-axis direction and/or the Z-axis direction can be adjusted, and accordingly, the X of the pair of clamp members 414 The position in the axial direction, the Y axis direction and/or the Z axis direction can be adjusted.

In order to adjust the position of the clamp body 412 with respect to the base member 411, a position adjustment unit 413 may be provided between the base member 411 and the clamp body 412. For example, the position adjusting unit 413 may include a screw and a rotating mechanism for rotating the screw. Thus, by rotating the screw by the rotating mechanism, the clamp body 412 can be moved relative to the base member 411, so that the position of the pair of clamp members 414 can be adjusted. The screw of the position adjustment unit 413 may be configured to be manually operated by an operator.

Particularly, when a plurality of clamp modules 41 are provided on the support 42, a pair of clamp members of each of the plurality of clamp modules 41 through the position adjusting unit 413 of the plurality of clamp modules 41 ( The position of 414) can be adjusted, so that the plurality of clamp modules 41 can grasp the trailing end of the substrate S uniformly. Since the plurality of clamp modules 41 uniformly grip the trailing end of the substrate S, during the process of transferring the substrate S by gripping the trailing end of the substrate S, deformation of the substrate S, such as bending, Can be prevented.

The driving unit 416 may be configured as an electric motor, particularly a servo motor. As another example, the driving unit 416 may be composed of an actuator using pneumatic or hydraulic pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism. The driving unit 416 serves to drive the pair of clamp members 414 using power supplied to the driving unit 416. The driving unit 416 may be connected to the control unit 50 and controlled by the control unit 50.

7 and 8 are views showing a substrate transfer process of the substrate cutting apparatus according to the embodiment of the present invention.

Before the substrate S is carried into the first stage 11, the clamp module 41 may be spaced apart from the first stage 11. In this state, the substrate S is carried into the first stage 11. When the substrate S is brought into the first stage 11, the trailing end of the substrate S may be positioned at a position corresponding to the clamp module 41. As another example, while the support 42 is moved in the Y-axis direction, the clamp module 41 may be moved to a position suitable for gripping the trailing end of the substrate S.

As shown in FIG. 7, the clamp module 41 is moved by the moving module 44 to be accommodated in the first receiving portion 111 of the first stage 11. And the trailing end of the board|substrate S is held by the pair of clamp members 414 of the clamp module 41. Since the clamp module 41 grips the trailing end of the substrate S in a state accommodated in the first accommodating portion 111 of the first stage 11, the substrate S is in contact with the supporting surface of the first stage 11 It can be supported on the clamp module 41 at the same height.

In a state where the substrate S is supported on the support surface of the first stage 11 and the trailing end of the substrate S is held by the clamp module 41, the first stage 11 and the clamp module 41 are It is moved toward the scribing unit 30 in the Y-axis direction.

When the substrate S is positioned on the first stage 11 and the second stage 21 in the process of transferring the substrate to the scribing unit 30 by the first transfer unit 10, the first and After the first and second scribing wheels 34 and 38 of the second scribing heads 32 and 36 contact the substrate S, respectively, they are moved in the X-axis direction. As the first and second scribing wheels 34 and 38 move, an X-axis scribing line is formed on the substrate S.

After the X-axis scribing line is formed on the substrate S, the first and second scribing wheels 34 and 38 of the first and second scribing heads 32 and 36 are removed from the substrate S. Moved apart.

In this process, the current position of the clamp module 41 is detected by the clamp module position detection sensor 25. When the clamp module 41 is in a preset position, the clamp module 41 is transferred to the second stage 21 under the control of the control unit 50. At this time, the clamp module 41 is accommodated in the second accommodating portion 211 of the second stage 21 in a state where the trailing end of the substrate S is gripped, so that the substrate S of the second stage 21 Supported by the clamp module 41 at the same height as the support surface, the entire bottom surface of the substrate S can be stably mounted on the second stage 21.

Subsequently, the substrate S is transferred to the subsequent process by the second stage 21. In this process, as illustrated in FIG. 8, the position sensing sensor 23 of the receiving unit senses the position of the second receiving unit 211. When the position of the second accommodating portion 211 is sensed by the accommodating portion position sensing sensor 23, the accommodating portion position detecting sensor 23 transmits a signal to the control unit 50. Based on the signal from the receiver position sensing sensor 23, the control unit 50, the second stage, so that the clamp module 41 holding another substrate can be accommodated in the second receiver (211) 21) to rotate the second receiving portion 211 to the standby position.

For example, the receiver position detection sensor 23 may transmit a signal from the starting point of the second receiver 211 to the control unit 50. As another example, the receiver position detection sensor 23 may transmit a signal from the end point of the second receiver 211 to the control unit 50. In the control unit 50, data regarding a distance between a start point or an end point of the second receiving unit 211 and a standby position is stored in advance. Accordingly, the control unit 50 may rotate the second stage 21 based on the stored data to position the second receiving unit 211 in the standby position.

9 is a view schematically showing another example of a substrate cutting apparatus according to an embodiment of the present invention. The substrate cutting device shown in FIG. 9 includes a configuration for sensing the position of the clamp module 41.

The substrate cutting device includes a clamp module position sensing sensor 60. The clamp module position detection sensor 60 includes a first optical element 61 connected to the clamp module 41; And a second optical element 62 installed on the upstream side in the transport direction of the substrate S based on the clamp module 41, the first optical element for the second optical element 62 ( The position of the clamp module 41 may be detected based on the position of 61).

As an example, the first optical element 61 can be mounted to the clamp module 41. As another example, the first optical element 61 can be mounted to the support 42. The first optical element 61 can be moved along with the clamp module 41 in the Y-axis direction.

The second optical element 62 can remain stationary. Thus, the first optical element 61 can be moved relative to the second optical element 62. Therefore, by measuring the distance (distance change) between the first optical element 61 and the second optical element 62, it is possible to detect the position (position change) of the clamp module 41.

As an example, any one of the first optical element 61 and the second optical element 62 may be configured as a light emitting portion that emits light, and the first optical element 61 and the second optical element 62 Another of them may be configured as a light receiving unit for receiving light. Accordingly, by measuring the time until light is emitted from the light emitting portion and then light is received at the light receiving portion, the distance (distance change) between the first optical element 61 and the second optical element 62 can be measured. have. As another example, any one of the first optical element 61 and the second optical element 62 may be configured as an optical module integrally configured with a light emitting portion and a light receiving portion, and the first optical element 61 and the second optical element The other of the elements 62 can be configured as a reflector that reflects light. Accordingly, the distance between the first optical element 61 and the second optical element 62 is measured by measuring the time until light is emitted from the light emitting portion, reflected from the reflecting portion, and then light is received by the light receiving portion. Distance change).

Meanwhile, the control unit 50 controls the clamp module 41 and the second stage 21 based on the position of the clamp module 41 detected by the clamp module position detection sensor 60 to clamp the module 41 It can be accommodated in the second accommodating portion 211 of the second stage 21.

10 is a view schematically showing another example of a substrate cutting apparatus according to an embodiment of the present invention. The substrate cutting apparatus shown in FIG. 10 includes a configuration for sensing the position of the tip of the substrate S.

The substrate cutting device may include a substrate position sensing sensor 70 that senses the position of the tip of the substrate S.

For example, the substrate position sensor 70 may be mounted on the first frame 31. The substrate position sensing sensor 70 may be configured as an optical sensor including a light emitting unit and a light receiving unit. As another example, the substrate position sensing sensor 70 may be configured as a camera that images the tip of the substrate S.

The control unit 50 may detect the position of the clamp module 41 based on the position of the tip of the substrate S sensed by the substrate position detection sensor 70. The control unit 50 is based on the position of the front end of the substrate S sensed by the substrate position detection sensor 70 and the length of the substrate S held by the clamp module 41 in the Y-axis direction. The distance between the position sensor 70 and the clamp module 41 can be measured, and the position of the clamp module 41 can be detected based on the distance between the substrate position sensor 70 and the clamp module 41. Can be.

In addition, the clamp module 41 and the second stage (based on the position of the control unit 50, the clamp module 41 and the position of the second accommodating portion 211 detected by the accommodating portion position sensing sensor 23 ( By controlling 21), the clamp module 41 may be accommodated in the second receiving portion 211 of the second stage 21.

Although a preferred embodiment of the present invention has been described by way of example, the scope of the present invention is not limited to such a specific embodiment, and may be appropriately changed within the scope described in the claims.

10: first transfer unit 11: first stage
111: first receiving portion 12: first pulley
20: second transfer unit 21: second stage
211: second receiving portion 22: second pulley
23: receptor position detection sensor 25: clamp module position detection sensor
30: scribing unit 31: first frame
32: first scribing head 33: first wheel holder
34: first scribing wheel 35: second frame
36: second scribing head 37: second wheel holder
38: second scribing wheel 40: clamp unit
41: clamp module 411: base member
412: clamp body 413: position adjustment
414: clamp member 415: contact pad
416: drive 42: support
43: guide 44: moving module
45: guide rail 50: control unit

Claims (8)

A scribing unit configured to form a scribing line on the substrate;
A first stage for transferring the substrate to the scribing unit;
A clamp module configured to grip the substrate and movable in a transfer direction of the substrate;
A second stage disposed on the downstream side of the scribing unit, receiving the substrate on which a scribing line is formed by the scribing unit, and having a receiving portion accommodating the clamp module;
A receiving position detecting sensor that senses a position of the receiving part; And
And a control unit that controls the clamp module and the second stage based on the position of the receiving portion sensed by the receiving portion position detecting sensor so that the clamp module is accommodated in the receiving portion. The method according to claim 1,
The control unit, the substrate cutting apparatus, characterized in that to move the second stage based on the position of the receiving portion detected by the receiving portion position detection sensor to place the receiving portion in the standby position. The method according to claim 2,
The second stage is a substrate cutting device, characterized in that it consists of one belt that operates in a caterpillar method. The method according to claim 1,
Further comprising a clamp module position detection sensor for detecting the position of the clamp module,
The control unit controls the clamp module and the second stage based on the position of the receiving portion sensed by the receiving portion position sensor and the position of the clamp module detected by the clamp module position detecting sensor to Device for cutting a substrate, characterized in that the clamp module is accommodated in the receiving portion of the second stage. The method according to claim 4,
The clamp module position detection sensor,
A first optical element connected to the clamp module; And
And a second optical element installed on the upstream side of the substrate in the transport direction based on the clamp module.
And detecting the position of the clamp module based on the position of the first optical element relative to the second optical element. The method according to claim 1,
Further comprising a substrate position sensor for sensing the position of the tip of the substrate,
The control unit detects the position of the clamp module based on the position of the front end of the substrate detected by the substrate position sensor, and the accommodation detected by the position of the clamp module and the position sensor of the receiving portion And controlling the clamp module and the second stage based on the position of the portion so that the clamp module is accommodated in the receiving portion of the second stage. A scribing unit configured to form a scribing line on the substrate;
A first stage for transferring the substrate to the scribing unit;
A clamp module configured to grip the substrate and movable in a transfer direction of the substrate;
A second stage disposed on the downstream side of the scribing unit, receiving the substrate on which a scribing line is formed by the scribing unit, and having a receiving portion accommodating the clamp module;
A clamp module position sensor for detecting the position of the clamp module; And
A substrate including a control unit that controls the clamp module and the second stage based on the position of the clamp module sensed by the clamp module position detection sensor so that the clamp module is accommodated in the receiving portion of the second stage Cutting device. A scribing unit configured to form a scribing line on the substrate;
A first stage for transferring the substrate to the scribing unit;
A clamp module configured to grip the substrate and movable in a transfer direction of the substrate;
A second stage disposed on the downstream side of the scribing unit, receiving the substrate on which a scribing line is formed by the scribing unit, and having a receiving portion accommodating the clamp module;
A substrate position sensor for sensing the position of the tip of the substrate; And
The clamp module is detected by detecting the position of the clamp module based on the position of the tip of the substrate sensed by the substrate position sensor and controlling the clamp module and the second stage based on the position of the clamp module. And a control unit adapted to be accommodated in an accommodating portion of the second stage.

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