KR20200057868A - Electronic device - Google Patents

Abstract

An electronic device according to the present invention comprises: a display module; a first adhesive member which has a multilayered structure and whose first adhesive surface is attached to a rear surface of the display module; and a sensing module which comprises a sensing region, wherein the sensing region is attached to a second adhesive surface facing the first adhesive surface of the first adhesive member. According to the present invention, adhesion between the sensing module and the display module can be enhanced.

Description

Electronic device {ELECTRONIC DEVICE}

The present invention relates to an electronic device, and more particularly, to an electronic device having a fingerprint detection function.

The electronic device provides various functions to organically communicate with the user, such as displaying an image to provide information to the user or sensing the user's input.

Recently, electronic devices include a function for detecting a user's fingerprint. Fingerprint recognition methods include a capacitive method for sensing a change in capacitance formed between electrodes, an optical method for detecting incident light using an optical sensor, and an ultrasonic method for detecting vibration using a piezoelectric body.

In recent electronic devices, a sensing module for fingerprint detection may be disposed and assembled on a rear surface of a display panel.

An object of the present invention is to provide an electronic device having a fingerprint detection function.

An electronic device according to an embodiment of the present invention includes a display module; A first adhesive member having a multilayer structure and having a first adhesive surface attached to a rear surface of the display module; And a sensing module, wherein the sensing area is attached to a second adhesive surface facing the first adhesive surface of the first adhesive member.

The first adhesive member may include a base layer; A first adhesive layer provided on the first surface of the base layer; And a second adhesive layer provided on a second surface facing the first surface of the base layer.

Each of the first and second adhesive layers includes any one of an adhesive resin, a pressure-sensitive adhesive film, and an optically transparent adhesive film.

Each of the first and second adhesive layers has an adhesive strength of 300 gf / in or more.

The base layer contains a polymer material.

The base layer includes a polyester or polyimide material.

The base layer has a modulus of 150 MPa to 10 GPa.

The first adhesive member has a thickness of 50 μm to 200 μm.

The electronic device according to the present invention includes a photoinitiator, and further includes a second adhesive member that is bonded to the side surface of the sensing module, the side surface of the first adhesive member, and the rear surface of the display module, respectively.

The photoinitiator is activated by ultraviolet light.

The sensing module and the rear surface of the display module are spaced apart at predetermined intervals, and the space formed by separating the rear surface of the sensing module and the display module is filled with the first adhesive member.

The detection module includes a fingerprint detection sensor by an ultrasonic method.

The display module is divided into a display area on which a video is displayed and a peripheral area adjacent to the display area, and the sensing module overlaps the display area on a plane.

The electronic device further includes a circuit board electrically connected to the display module and disposed under the rear surface of the display module, and an opening overlapping the sensing module is defined on the circuit board.

The display module includes: a display panel including a plurality of pixels displaying an image; And a cover panel disposed on a rear surface of the display panel and having an opening defined therein.

The first adhesive member is attached to the rear surface of the display panel exposed by the opening.

The display panel includes a flat portion and a protrusion protruding from the flat portion and bent from the flat portion, and a portion of the cover panel is disposed between the flat portion and the protrusion.

The display panel may include a base substrate; A display element layer disposed on the base substrate; An encapsulation layer disposed on the display element layer; And an input sensing unit disposed on the encapsulation layer.

An electronic device according to an exemplary embodiment of the present invention includes a display module including a display area displaying an image, a front surface including a peripheral area adjacent to the display area, and a rear surface facing the front surface; A base layer, a first adhesive layer provided on a first surface of the base layer and attached to the rear surface of the display module, and a second adhesive layer provided on a second surface facing the first surface of the base layer A first adhesive member; A sensing module disposed over the display area to include a sensing area for sensing fingerprints in an ultrasonic manner, and the second adhesive layer of the first adhesive member adhered to the sensing area; And a second adhesive member that includes a photoinitiator and is bonded to a portion of the sensing module and the rear surface of the display module, respectively.

The rear surface of the sensing module and the display module is spaced apart at a predetermined interval, and a space formed by separating the rear surface of the sensing module and the display module is filled with the first adhesive member.

According to the present invention, the electronic device includes an adhesive member for attaching the sensing module to the rear surface of the display module. The adhesive member has a multi-layer structure and is attached to a sensing region of the sensing module including the sensing region, thereby enhancing adhesion between the sensing module and the display module.

1 is a perspective view of an electronic device according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view of the electronic device shown in FIG. 1.
3 is a block diagram of an electronic device of the electronic device shown in FIG. 1.
4 is a combined perspective view of the display module shown in FIG. 2.
5 is a plan view of the display panel shown in FIG. 4.
6 is an equivalent circuit diagram of the pixel illustrated in FIG. 5.
7 is a plan view showing a rear surface of a display device according to an exemplary embodiment of the present invention.
8 is a cross-sectional view taken along line II ′ of FIG. 7.
9 is an enlarged view of part II of FIG. 8.
10A and 10B are process diagrams illustrating a process of attaching the sensing module shown in FIG. 9.
11 is a plan view of a display device according to another exemplary embodiment of the present invention.
12 is a plan view illustrating a rear surface of the display device illustrated in FIG. 11.
13 is a cross-sectional view taken along line III-III` of FIG. 12.
14 is an exploded perspective view of a display device according to another exemplary embodiment of the present invention.
15 is a cross-sectional view taken along line IV-IV` of FIG. 14.

In this specification, when a component (or region, layer, part, etc.) is referred to as being “on”, “connected”, or “joined” with another component, it is directly connected / connected to the other component It means that they can be combined or a third component can be arranged between them.

The same reference numerals refer to the same components. In addition, in the drawings, the thickness, ratio, and dimensions of the components are exaggerated for effective description of technical content.

“And / or” includes all combinations of one or more of which the associated configurations may be defined.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from other components. For example, the first component may be referred to as a second component without departing from the scope of the present invention, and similarly, the second component may be referred to as a first component. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In addition, terms such as “below”, “below”, “above”, and “above” are used to describe the relationship between the components shown in the drawings. The terms are relative concepts and are explained based on the directions indicated in the drawings.

The terms "include" or "have" are intended to indicate the presence of a feature, number, step, action, component, part, or combination thereof described in the specification, one or more other features, numbers, or steps. It should be understood that it does not preclude the existence or addition possibility of the operation, components, parts or combinations thereof.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a perspective view of an electronic device according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the electronic device shown in FIG. 1. 3 is a block diagram of an electronic device of the electronic device shown in FIG. 1.

1 to 3, the electronic device ED may be a device activated according to an electrical signal. The electronic device ED may include various embodiments. For example, the electronic device ED may include a tablet, a laptop, a computer, and a smart television. In this embodiment, the electronic device ED is illustratively illustrated as a smart phone.

The display surface IS on which the image IM is displayed is parallel to the surface defined by the first direction axis D1 and the second direction axis D2. The display surface IS may include a transmission area TA and a bezel area BZA adjacent to the transmission area TA. In FIG. 1, an Internet search box is shown as an example of an image IM. As an example, the transmission area DA may have a rectangular shape. The bezel area BZA may surround the transmission area DA. In other words, the bezel area BZA forms a border of the display surface IS. However, this is illustratively illustrated, and the bezel area BZA may be disposed adjacent to only one side of the transmission area TA or may be omitted. An electronic device according to an embodiment of the present invention may include various embodiments, and is not limited to any one embodiment

The normal direction perpendicular to the display surface IS, that is, the thickness direction of the electronic device ED is indicated by the third direction axis D3. Based on the direction in which the image IM is displayed, the front (or top or first surface) and rear (or bottom, back or second surface) of each member are defined. However, the directions indicated by the first to third direction axes D1, D2, and D3 are relative concepts and may be converted to other directions. Hereinafter, the first to third directions refer to the same reference numerals in directions indicated by the first to third direction axes D1, D2, and D3, respectively.

The electronic device ED can detect the fingerprint FNG of the user applied from the outside. Accordingly, the electronic device ED may provide the fingerprint detection area FSA on the display surface IS. In this embodiment, the fingerprint sensing area FSA is shown as being provided in the transmissive area TA in which the image IM is displayed. However, this is illustratively illustrated, and the fingerprint detection area FSA may be provided in the bezel area BZA, all areas of the transmission area TA, or all areas of the display surface IS. have. The electronic device ED may detect the user's fingerprint FNG provided in the fingerprint detection area FSA.

The user's fingerprint (FNG) may include the surface state of the user's hand, for example, surface uniformity or surface curvature. However, this is illustratively illustrated, and when the input of the intrusive object is provided to the electronic device ED, the electronic device ED may sense surface information of the inert object.

Referring to FIGS. 2 and 3, the electronic device ED includes a display device DD, an electronic module EM, a power supply module PSM, a bracket BRK, and an external device. It may include a case (EDC). In Figures 2 and 3, the above configurations are simply shown.

The display device DD includes a window WM and a display module DM. As shown in FIG. 1, in the combined state, the window WM constitutes the appearance of the electronic device ED. The window WM protects internal components of the electronic device ED from external impact and may be a configuration that substantially provides a display surface IS of the electronic device ED.

The display module DM is disposed on the rear surface of the window WM. The display module DM may include a display panel DP and a sensing module FSU. The display panel DP may substantially generate an image IM. The image IM generated by the display panel DP is displayed on the display surface IS through the transmission area TA and is visually recognized by the user.

The sensing module FSU detects the fingerprint FNG of the user applied from the outside. As described above, the sensing module FSU may detect a user's fingerprint (FNG, including surface information of an object, shown in FIG. 1) provided to the fingerprint sensing area FSA (shown in FIG. 1). . Detailed description thereof will be described later.

The display module DM may be electrically connected to the electronic module EM through a flexible circuit board (not shown). The display module DM receives information on an image IM to be displayed through the electronic module EM, or provides information on the detected fingerprint FNG to the electronic module EM to process information based on the information Can be provided to the user.

The power supply module (PSM) supplies power required for the overall operation of the electronic device (ED). The power supply module (PSM) may include a conventional battery module.

The bracket BRK is combined with the display device DD and / or the outer case EDC to divide the internal space of the electronic device ED. The bracket BRK provides a space where other components can be arranged. In addition, the bracket BRK may support the display device DD such that the display device DD is fixed without shaking. A coupling groove corresponding to the shape of the electronic module EM may be defined in the bracket BRK so that the electronic module EM is fixed. The bracket BRK includes a metal or plastic member. Although one bracket BRK is illustrated as an example, the electronic device ED may include a plurality of brackets BRK.

The outer case EDC may be coupled to the bracket BRK and / or the display device DD. In this embodiment, the outer case EDC configures the appearance of the electronic device ED together with the window WM. In the present embodiment, the outer case EDC made of one body is exemplarily illustrated, but the outer case EDC may include a plurality of bodies assembled with each other. The outer case EDC may include a plurality of frames and / or plates made of glass, plastic, and metal.

The electronic module EM is mounted on the motherboard and the motherboard, and includes various functional modules for operating the electronic device ED. The motherboard may be electrically connected to the display device DD through a connector (not shown). Here, the motherboard may include a rigid-type printed circuit board.

The electronic module (EM) includes a control module 10, a wireless communication module 20, a video input module 30, an audio input module 40, an audio output module 50, a memory 60, and an external interface 70 , A light emitting module 80, a light receiving module 90, and a camera module 100. Some of the modules are not mounted on the motherboard, but may be electrically connected to the motherboard through a flexible circuit board.

The control module 10 controls the overall operation of the electronic device ED. The control module 10 can be a microprocessor. For example, the control module 10 activates or deactivates the display device DD. The control module 10 may control the image input module 30, the audio input module 40, and the audio output module 50 based on the touch signal received from the display device DD.

The wireless communication module 20 may transmit / receive wireless signals with other terminals using a Bluetooth or Wi-Fi line. The wireless communication module 20 may transmit / receive a voice signal using a general communication line. The wireless communication module 20 includes a transmitter 22 for modulating and transmitting a signal to be transmitted, and a receiver 24 for demodulating the received signal.

The image input module 30 processes the image signal and converts it into image data that can be displayed on the display device DD. The sound input module 40 receives an external sound signal by a microphone in a recording mode, a voice recognition mode, etc., and converts it into electrical voice data. The sound output module 50 converts sound data received from the wireless communication module 20 or sound data stored in the memory 60 and outputs the sound data.

The external interface 70 serves as an interface connected to an external charger, a wired / wireless data port, a card socket (eg, a memory card, SIM / UIM card), and the like.

The light emitting module 80 generates and outputs light. The light emitting module 80 may output infrared rays. The light emitting module 80 may include an LED element. The light receiving module 90 may detect infrared rays. The light receiving module 90 may be activated when infrared rays of a predetermined level or higher are detected. The light receiving module 90 may include a CMOS sensor. After the infrared light generated by the light emitting module 80 is output, it is reflected by an external object (eg, a user's finger or face), and the reflected infrared light may be incident on the light receiving module 90. The camera module 100 photographs an external image.

FIG. 4 is a combined perspective view of the display module shown in FIG. 2, FIG. 5 is a plan view of the display panel shown in FIG. 4, and FIG. 6 is an equivalent circuit diagram of the pixel shown in FIG. 5.

4 and 5, the display module DM includes a display panel DP and a circuit board FCB.

The display panel DP includes a base substrate BS, a plurality of signal lines DL, GL, and PL, and a plurality of pixels PX. In this embodiment, a signal circuit diagram of one pixel PX is briefly illustrated for easy description.

The base substrate BS is divided into a display area DA and a peripheral area NDA on a plane. In this embodiment, the back surface of the base substrate BS may be provided as the back surface of the display panel DP.

The display area DA may be an area where an image IM (see FIG. 1) is displayed. The display panel DP activates the display area DA according to an electrical signal. The image IM is displayed on the activated display area DA. The transmissive area TA (shown in FIG. 1) may overlap at least the entire display area DA.

The peripheral area NDA is adjacent to the display area DA. The peripheral area NDA may surround the edge of the display area DA. However, this is illustratively illustrated, and the peripheral area NDA may be adjacent to only some of the edges of the display area DA, and is not limited to any one embodiment.

Various signal lines or electronic devices that provide an electrical signal to the display area DA may be disposed in the peripheral area NDA. The peripheral area NDA may be covered by the bezel area BZA (shown in FIG. 1) and may not be viewed from the outside.

The plurality of signal lines SGL, the pixel PX, and the plurality of display pads PDD are disposed on the base substrate BS. The signal lines SGL may include a gate line GL, a data line DL, and a power line PL. The gate line GL, the data line DL, and the power line PL may each transmit different electrical signals.

The gate line GL extends along the first direction D1. The gate lines GL may be provided in plural, and may be arranged spaced apart from each other along the second direction D2, but a single gate line GL is exemplarily illustrated for easy description.

The display module DM may further include a driving circuit GDC provided on the base substrate BS to provide an electrical signal to the gate line GL. The driving circuit GDC may include a plurality of thin film transistors formed through the same process as the driving circuit of the pixels PX, for example, a low temperature polycrystalline silicon (LTPS) process or a low temperature polycrystalline oxide (LTPO) process. The signal lines SGL may further include a control signal line CSL for providing control signals to the driving circuit GDC.

The data line DL extends along the second direction D2. The data line DL may be electrically insulated from the gate line GL. The data lines DL may be provided in a plurality and may be arranged spaced apart from each other along the first direction D1, but a single data line DL is illustrated by way of example for easy description.

The power supply line PL extends along the second direction D2. The power line PL may be electrically insulated from the gate line GL and the data line DL. The power lines PL may be provided in plural and may be arranged spaced apart from each other along the first direction D1, but a single power line PL is illustrated by way of example for easy description. The power line PL may provide a power signal to the pixel PX.

The pixel PX is disposed in the display area DA. A plurality of pixels PX may be provided and respectively connected to corresponding signal wires, but a single pixel PX is exemplarily illustrated for easy description. The pixel PX displays light according to an electrical signal to implement an image IM.

Referring to FIG. 6, the pixel PX may include a first thin film transistor T1, a second thin film transistor T2, a capacitor CP, and a light emitting device EMD. The first thin film transistor T1, the second thin film transistor T2, the capacitor CP, and the light emitting device EMD are electrically connected.

The first thin film transistor T1 may be a switching element that controls turn-on and turn-off of the pixel PX. The first thin film transistor T1 is connected to the gate line GL and the data line DL. The first thin film transistor T1 is turned on by a gate signal provided through the gate line GL to provide a data signal provided through the data line DL to the capacitor CP.

The capacitor CP charges a voltage corresponding to a potential difference between the first power signal provided from the power line PL and the signal provided from the thin film transistor T1. The second thin film transistor T2 provides the first power signal provided from the power supply line PL to the light emitting device EMD in response to the voltage charged in the capacitor CP.

The light emitting device EMD may generate light or control the amount of light according to an electrical signal. For example, the light emitting device (EMD) may include an organic light emitting device, a quantum dot light emitting device, an electrophoretic device, or an electrowetting device.

The light emitting device EMD is connected to the power terminal VSS to receive a power signal different from the power signal provided by the power line PL. A driving current corresponding to the difference between the electrical signal provided from the second thin film transistor T2 and the second power signal ELVSS flows through the light emitting device EMD, and the light emitting device EMD is light corresponding to the driving current. Can generate

Meanwhile, this is illustratively illustrated, and the pixel PX may include electronic devices having various configurations and arrangements, and is not limited to any one embodiment.

The circuit board FCB is connected to one side of the display panel DP. The circuit board FCB provides an electrical signal to the display panel DP. The circuit board FCB may generate a signal for controlling the image IM or a power signal and provide it to the display panel DP. The circuit board FCB may be a flexible circuit board. A driving element (not shown) may be mounted on the circuit board FCB.

The circuit board FCB is electrically and physically coupled to the display panel DP through an adhesive member (eg, an anisotropic conductive film). The circuit board FCB may include signal lines not shown. The circuit board FCB may be bent toward the rear surface of the base substrate BS after being coupled to the display panel DP.

7 is a plan view showing a rear surface of a display device according to an exemplary embodiment of the present invention. 8 is a cross-sectional view taken along line I-I` of FIG. 7. 9 is an enlarged view of part II of FIG. 8.

According to the display device DD illustrated in FIGS. 7 to 9, a circuit board FCB and a sensing module FSU may be disposed on the rear surface of the display panel DP. Here, the back surface of the display panel DP may be the back surface of the base substrate BS.

The sensing module FSU may be disposed on the rear surface of the display panel DP corresponding to the fingerprint sensing area FSA. The sensing module FSU may overlap the fingerprint sensing area FSA. The sensing module FSU may include a sensor FS and a package PU that mounts the sensor FS.

According to an embodiment of the present invention, the sensor FS may be provided as a fingerprint recognition sensor, and a sensor capable of recognizing a fingerprint based on an ultrasonic method may be used. However, the sensor FS is described as being provided as a fingerprint recognition sensor, but is not limited thereto.

The sensor FS may be mounted on the package PU to face the rear surface of the display panel DP. The sensor FS may include an effective detection area (ESA) capable of recognizing a fingerprint. The package PU may pack the sensor FS such that the effective sensing area ESA is exposed. The fingerprint sensing area FSA may overlap the effective sensing area ESA. The effective sensing area ESA may be included in the fingerprint sensing area FSA.

The display device DD includes a first adhesive member AD1 interposed between the rear surface of the display module DP and the sensing module FSU. On the back surface, the first adhesive member AD1 may cover the sensing area ESA of the sensor FS.

The rear surfaces of the sensing module FSU and the display panel DP may be spaced apart at predetermined intervals. The space formed by the rear surfaces of the sensing module FSU and the display panel DP may be filled with the first adhesive member AD1.

The first adhesive member AD1 may partially overlap the package PU. That is, one surface of the first adhesive member AD1 may be adhered to the effective sensing area ESA of the package PU and the sensor FS.

Therefore, the ultrasound waves reflected from the user's fingerprint (FNG, shown in FIG. 1) may pass through the first adhesive member AD1 and then enter the sensor FS. That is, the sensor FS receives ultrasonic waves that have passed through the first adhesive member AD1.

As illustrated in FIG. 9, the first adhesive member AD1 includes a base layer BF, a first adhesive layer AF1 provided on a first surface of the base layer BF, and a first layer of the base layer BF. It includes a second adhesive layer (AF2) provided on the second surface facing the surface. Each of the first and second adhesive layers AF1 and AF2 may include any one of a pressure-sensitive adhesive film, an optically transparent adhesive film, and an optically transparent adhesive resin.

The first adhesive layer AF1 may be adhered to the back surface of the display module DM, and the second adhesive layer AF2 may be adhered to one surface of the sensing module FSU. One surface of the sensing module FSU may include an effective sensing area ESA. One surface including the effective sensing area ESA may be defined as a sensing surface FSUa. The second adhesive layer AF2 may be adhered to the sensing surface FSUa of the sensing module FSU. Each of the first and second adhesive layers AF1 and AF2 may have an adhesive strength of 300 gf / in or more.

The base layer (BF) may include a polymer material. The base layer (BF) may be a polyester or polyimide material. The base layer BF may have a modulus of 150 MPa to 10 GPa. When the base layer BF having a high modulus is used, deformation of the first adhesive member AD1 may be minimized. Also, the movement phenomenon between the first adhesive member AD1 and the display panel DP due to the deformation of the first adhesive member AD1 may be reduced.

The first adhesive member AD1 may have a thickness of 50 μm to 200 μm. Since the sensitivity of the sensing module FSU may decrease as the first adhesive member AD1 is thicker, the first adhesive member AD1 may have a thickness within the above range.

As such, the electronic device ED is attached so that the first adhesive member AD1 for attaching the sensing module FSU to the back surface of the display module DM covers the entire effective sensing area ESA, thereby detecting the sensing module FSU. ) And the display module DM to enhance adhesion.

In addition, since the adhesive layers AF1 and AF2 having high adhesive strength are provided on both sides of the base layer BF, the adhesive force between the first adhesive member AD1 and the display module DM and the first adhesive member AD1 and the sensing module The adhesive force between the (FSU) may be enhanced, and as a result, the sensing module FSU may be stably fixed to the display module DM.

The display device DD may further include a second adhesive member AD2. The second adhesive member AD2 may be adhered to a portion of the sensing module FSU and the rear surface of the display module DM, respectively. In particular, the second adhesive member AD2 may be adhered to the side of the sensing module FSU, the side of the first adhesive member AD1, and the back of the display module DM, respectively.

The second adhesive member AD2 may be bonded to four corner portions where two sides of the sensing module FSU meet. The structure in which the second adhesive member AD2 is disposed is not limited thereto. The second adhesive member AD2 may be formed in a ring shape to surround the side surface of the sensing module FSU.

The second adhesive member AD2 may include a photoinitiator. The photoinitiator can be activated by ultraviolet light.

Illustratively, the photoinitiator included in the second adhesive member (ADa) is 2,2-dimethoxy-1,2-diphenylethan-1-one (2,2-dimethoxy-1,2-diphenylethan-1 -one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone (2-hydroxy-2- methyl-1-phenyl-1-propanone), 2-hydroxy-1- [4- (2-hydroxyethoxy) phenyl] -2-methyl-1-propanone (2-hydroxy-1- [4- (2-hydroxyethoxy) phenyl] -2-methyl-1-propanone), and 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] -phenyl} -2-methylpropa-1-one (2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] -phenyl} -2-methylpropan-1-one), 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one (2-methyl-1 [4- (methylthio) phenyl] -2-morpholinopropan-1-one), 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 (2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1), 2-dimethylamino- 2- (4-methyl-benzyl) -1- (4-morpholin-4-yl-phenyl) -butan-1-non (2-dimethylamino-2- (4-methyl-benzyl) -1- (4- morpholin-4-yl-phenyl) -butan-1-one), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (2,4,6-trimethylbenzoyl-diphenylphosphine oxide), 2,4,6-trimethyl Benzoyl-diphenyl phosphinate (2,4,6-trimethylbenzoyl-diphenyl phosphinate), bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (bis (2,4,6-trimethylbenzoyl) -phenylphosphineo xide), [1- (4-phenylsulfanylbenzoyl) heptylideneamino] benzoate ([1- (4-phenylsulfanylbenzoyl) heptylideneamino] benzoate), [1- [9-ethyl-6- (2-methylbenzoyl) ) Carbazo-3-yl] ethylideneamino] acetate ([1- [9-ethyl-6- (2-methylbenzoyl) carbazol-3-yl] ethylideneamino] acetate), and bis (2,4-cyclopentadiene Neil) bis [2,6-difluoro-3- (1-pyryl) phenyl] titanium (IV) (Bis (2,4-cyclopentadienyl) bis [2,6-difluoro-3- (1-pyrryl) phenyl ] titanium (IV)).

By additionally fixing the sensing module FSU to the display module DM through the second adhesive member AD2, the bonding force between the sensing module FSU and the display module DM can be further improved.

The circuit board FCB may be spaced apart at a predetermined distance along the sensing module FSU and the second direction DR2. The circuit board FCB may be electrically connected to the sensing module FSU, and may be connected to each other through, for example, a flexible circuit board.

As shown in FIG. 8, the display panel DP includes a base substrate BS, a display element layer DML, and an encapsulation layer ECL.

The base substrate BS generally supports components of the display panel DP and may include a flexible material. For example, the base substrate BS may include a plastic substrate, a glass substrate, or an organic / inorganic composite substrate. Alternatively, the base substrate BS may be a laminate structure including a plurality of insulating layers. The plastic substrate is at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin and perylene resin. It may include.

The display element layer DML may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers may constitute a signal wiring or a control circuit of a pixel. The display element layer DML may further include a display element. The display element may include, for example, organic light emitting diodes. However, the present invention is not limited thereto, and depending on the type of the display panel DP, the display element may include inorganic light emitting diodes or organic-inorganic hybrid light emitting diodes.

The encapsulation layer ECL seals the display element layer DML. For example, the encapsulation layer (ECL) may be an encapsulation substrate. The encapsulation layer (ECL) protects the display element layer (DML) from foreign substances such as moisture, oxygen, and dust particles.

The display panel DP may further include an input sensing unit ISU. The input sensing unit ISU may be disposed on the encapsulation layer ECL.

In FIG. 8, it is exemplified that the input sensing unit ISU is directly formed on the encapsulation layer ECL by a continuous process, but the present invention is not limited thereto. For example, an adhesive member (not shown) may be provided between the input sensing unit (ISU) and the sealing layer (ECL), and the input sensing unit (ISU) and the sealing layer (ECL) may be adhered to each other by the adhesive member. You can.

Meanwhile, the display module DM further includes a polarizing layer POL, a window adhesive member AM, and a window WM.

The polarizing layer POL is disposed between the display module DM and the window WM. The polarization layer POL polarizes external light incident through the window WM, thereby preventing circuit elements included in the display module DM from being visually recognized. Depending on the embodiment, the polarization layer POL may be omitted. The window adhesive member AM is disposed between the polarizing layer POL and the window WM to bond the polarizing layer POL and the window WM to each other. For example, the window adhesive member AM may be an optically clear adhesive film or an optically clear resin or pressure sensitive adhesive film.

10A and 10B are process diagrams illustrating a process of attaching the sensing module shown in FIG. 9.

9 and 10A, the first adhesive member AD1 is attached on the back surface BS-B of the base substrate BS. The first adhesive member AD1 may be attached to the back surface BS-B of the base substrate BS in correspondence to the fingerprint sensing area FSA (shown in FIG. 9). The first adhesive layer AF1 of the first adhesive member AD1 may be adhered to the back surface BS-B of the base substrate BS.

For example, although the first adhesive member AD1 is shown as having a rectangular shape, the shape of the first adhesive member AD1 may be variously modified. The shape of the first adhesive member AD1 may be variously modified according to the shape of the sensing module FSU.

The sensing module FSU is disposed on the first adhesive member AD1. The sensing module FSU may overlap the first adhesive member AD1. The first adhesive member AD1 may overlap the effective sensing area ESA of the sensing module FSU.

9 and 10B, the sensing module FSU may be adhered to the second adhesive layer AF2 of the first adhesive member AD1.

Here, the order in which the first adhesive member AD1 is first attached to the base substrate BS and then the sensing module FSU is attached to the first adhesive member AD1 is illustrated. However, the present invention is not limited to this. That is, after the second adhesive layer AF2 of the first adhesive member AD1 is first adhered to the sensing module FSU, the first adhesive layer AF1 may be adhered to the back surface BS-B of the base substrate BS. have.

9 and 10B, the application mechanism ND may apply the photocurable adhesive material to overlap the sensing module FSU and a portion of the first adhesive member AD1.

According to an embodiment of the present invention, the photocurable adhesive material may include a photoinitiator. The photocurable adhesive material may overlap the four corners of the sensing module (FSU). The photocurable adhesive material may partially cover the side surface of the sensing module FSU, the side surface of the first adhesive member AD1, and the back surface BS-B of the base substrate BS.

Next, ultraviolet light (LB) may be irradiated to the photocurable adhesive material. The ultraviolet light LB may be irradiated by the light irradiation mechanism UD. As ultraviolet light LB is irradiated to the photocurable adhesive material, the second adhesive member AD2 may be formed while the photocurable adhesive material is cured. As a result, the first adhesive member AD1 and the sensing module FSU may be firmly fixed to each other by the second adhesive member AD2 to the base substrate BS.

11 is a plan view of a display device according to another exemplary embodiment of the present invention. 12 is a plan view illustrating a rear surface of the display device illustrated in FIG. 11. 13 is a cross-sectional view taken along line III-III` of FIG. 12.

11 to 13, the structure of the circuit board FCB2 and the position of the sensing module FSU are changed compared to the display device DD shown in FIGS. 7 to 9. , The structures of the remaining components may be substantially the same.

11 to 13, an opening OP may be defined in the circuit board FCB2 according to another embodiment of the present invention. The circuit board FCB2 may be bent along one side of the base substrate BS. As the circuit board FCB2 is bent, a portion of the circuit board FCB2 may be disposed on the back surface of the base substrate BS. In this case, the opening OP may be provided on a portion of the circuit board FCB2 positioned on the rear surface of the base substrate BS. The opening OP may overlap the fingerprint detection area FSA.

The sensing module FSU may be inserted into the opening OP and disposed on the rear surface of the base substrate BS. The sensing module FSU is electrically connected to the circuit board PCB2.

The first and second adhesive members AD1 and AD2 according to the present invention may fix the sensing module FSU to the base substrate BS. 12 and 13, a structure in which the display devices DD2 are provided by the first and second adhesive members AD1 and AD2 is not limited thereto. That is, the display device according to the present invention may include only the first adhesive member AD1.

14 is an exploded perspective view of a display device according to another exemplary embodiment of the present invention. 15 is a cross-sectional view taken along line IV-IV` of FIG. 14.

14 and 15, the display device DD3 according to another exemplary embodiment of the present invention includes a window WM and a display module DM2. Since the window WM corresponds to the window WM shown in FIG. 2, a duplicate description will be omitted below.

The display module DM2 may include a display panel DP2, a circuit board FCB, a touch sensor TS, a cover panel CVP, and a sensing module FSU. The display panel DP2 may have a shape in which one side protrudes on a plane. In this embodiment, the display panel DP2 may include a flat portion PP and a protrusion RP. The protruding portion RP has a shape protruding from one side of the flat portion PP.

The touch sensor TS may be disposed on the display panel DP2. The touch sensor TS may detect an external input and obtain location or intensity information of the external input. External Input External input may include various embodiments. For example, the external input includes various types of external inputs such as a part of the user's body, light, heat, or pressure. Also, the touch sensor TS may detect inputs that come into contact with the touch sensor TS, as well as inputs that are close or adjacent.

The touch sensor TS may include a sensing area SA and a non-sensing area NSA. The sensing area SA may overlap the display area DA.

The non-sensing area NSA is adjacent to the sensing area SA. The non-sensing area NSA may surround the edge of the sensing area SA. However, this is illustratively illustrated, and the non-sensing area NSA may be adjacent to only a part of the edge of the sensing area SA, may be omitted, and is not limited to any one embodiment.

The sensing electrode SS is disposed in the sensing area SA. The sensing electrode SS may include a first sensing electrode SP1 and a second sensing electrode SP2 that receive different electrical signals from each other. The sensing electrode SS may obtain information about the external input TC through a change in capacitance between the first sensing electrode SP1 and the second sensing electrode SP2.

The plurality of first sensing electrodes SP1 may be provided and may be arranged to be spaced apart from each other along the second direction D2. The plurality of first sensing electrodes SP1 may be electrically connected. A plurality of second sensing electrodes SP2 may be provided and may be arranged to be spaced apart from each other along the second direction D2. The plurality of second sensing electrodes SP2 may be electrically connected.

Although not shown in the drawing, the touch sensor TS is disposed in the non-sensing area NSA, and transmits an externally provided electrical signal to the first sensing electrode SP1, or a signal from the second sensing electrode SP2. It may further include detection signal lines to provide the outside.

The touch sensor TS may be directly disposed on the display panel DP2. For example, the sensing electrodes SP1 and SP2 or the sensing signal lines may be directly formed on the display panel DP2. Alternatively, after the touch sensor TS is formed separately from the display panel DP2, it may be attached to the display panel DP2 through an adhesive member or the like not shown. Alternatively, the touch sensor TS may be disposed on the rear surface of the display panel DP2 or may be disposed in the display panel DP2. The touch sensor TS according to an embodiment of the present invention may be provided in various forms, and is not limited to any one embodiment.

The circuit board FCB3 is coupled to one side of the display module DM2. Specifically, the circuit board FCB3 may be combined with the protrusion RP of the display panel DP2. The display panel DP2 and the touch sensor TS may be driven on one circuit board FCB3. However, this is illustratively illustrated, and the circuit board FCB3 may be separately provided in each of the display panel DP2 and the touch sensor TS, and is not limited to any one embodiment.

According to the present invention, the cover panel CVP may be disposed at a position corresponding to the flat portion PP and combined with the display panel DP2. The cover panel CVP may support the rear surface of the display panel DP2. The cover panel CVP may be a metal plate having a rigidity higher than a standard. The cover panel CVP may be a stainless steel plate. The cover panel CVP may have a black color to block external light incident on the display panel DP2.

An opening OP2 may be defined in the cover panel CVP. The opening OP2 may be provided through the cover panel CPV corresponding to the fingerprint detection area FSA. The opening OP2 may be defined at a position overlapping the flat portion PP.

The protrusion RP of the display panel DP2 may be banded. The circuit board FCB3 connected to the protruding portion RP may be arranged side by side in the flat portion PP of the display panel DP2. A portion of the cover panel CVP may be disposed between the flat portion PP and the protrusion RP of the display panel DP2. After the protrusion RP of the display panel DP2 is bent, the circuit board FCB3 may be seated on the back surface of the cover panel CVP. The circuit board FCB3 may be fixed to the back surface of the cover panel CVP through an adhesive member FAM.

The sensing module FSU may be inserted into the opening OP2 and disposed on the rear surface of the display panel DP2. The sensing module FSU may be fixed to the rear surface of the display panel DP2 through the first adhesive member AD1. Since the first adhesive member AD1 has the same configuration as the first adhesive member AD1 illustrated in FIGS. 7 to 9, overlapping descriptions are omitted.

14 and 15 illustrate a structure in which the display device DD3 includes the first adhesive member AD1, but is not limited thereto. That is, the display device DD3 according to the present invention may further include a second adhesive member AD2.

As illustrated in FIG. 15, the circuit board FCB may be disposed spaced apart from the sensing module FSU. That is, the circuit board FCB3 is disposed at a position not overlapping the fingerprint detection area FSA so that the detection module FSU may be attached to the rear surface of the display panel DP2 in correspondence with the fingerprint detection area FSA. Can be.

Although described with reference to the above embodiments, those skilled in the art understand that various modifications and changes can be made to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. Will be able to. In addition, the embodiments disclosed in the present invention are not intended to limit the technical spirit of the present invention, and all technical spirit within the scope of the following claims and equivalents thereof should be interpreted as being included in the scope of the present invention. .

ED: Electronic device FSA: Fingerprint detection area
DD: Display device DM: Display module
DP: Display panel WM: Windows
FCB: Circuit board FSU: Sensing module
AD1: First adhesive member AD2: Second adhesive member

Claims (20)

Display module;
A first adhesive member having a multilayer structure and having a first adhesive surface attached to a rear surface of the display module; And
An electronic device including a sensing module and a sensing module having the sensing area bonded to a second bonding surface facing the first bonding surface of the first adhesive member. The method of claim 1, wherein the first adhesive member,
Base layer;
A first adhesive layer provided on the first surface of the base layer; And
And a second adhesive layer provided on a second surface facing the first surface of the base layer. According to claim 2,
Each of the first and second adhesive layers includes an electronic resin, a pressure-sensitive adhesive film, and an optical transparent adhesive film. The method of claim 3, wherein each of the first and second adhesive layers,
Electronic device with adhesion of 300gf / in or more. The method of claim 2, wherein the base layer,
An electronic device comprising a polymer material. The method of claim 5, wherein the base layer,
An electronic device comprising a polyester or polyimide material. The method of claim 5, wherein the base layer,
An electronic device having a modulus of 150 MPa to 10 GPa. The method of claim 1, wherein the first adhesive member,
Electronic device having a thickness of 50㎛ to 200㎛. The electronic device of claim 1, further comprising a second adhesive member that includes a photoinitiator and is attached to a side surface of the sensing module, a side surface of the first adhesive member, and a rear surface of the display module. 10. The electronic device of claim 9, wherein the photoinitiator is activated by ultraviolet light. According to claim 1, The sensing module and the rear surface of the display module are spaced at a predetermined interval,
An electronic device filled with the first adhesive member in a space formed by separating the rear surface of the sensing module and the display module. 12. The electronic device of claim 11, wherein the sensing module includes a fingerprint sensing sensor using an ultrasonic method. The display module of claim 1, wherein the display module is divided into a display area in which an image is displayed and a peripheral area adjacent to the display area on a plane,
The sensing module is an electronic device that overlaps the display area on a plane. According to claim 1,
Further comprising a circuit board electrically connected to the display module and disposed under the rear surface of the display module,
An electronic device in which an opening overlapping the sensing module is defined on the circuit board. According to claim 1, The display module,
A display panel including a plurality of pixels displaying an image; And
An electronic device including a cover panel on the rear surface of the display panel and having an opening defined therein. 16. The electronic device of claim 15, wherein the first adhesive member is attached to a rear surface of the display panel exposed by the opening. The method of claim 15, wherein the display panel,
It includes a flat portion and a protrusion projecting from the flat portion and bent from the flat portion,
A part of the cover panel is an electronic device disposed between the flat portion and the protrusion. According to claim 1, The display panel,
Base substrate;
A display element layer disposed on the base substrate;
An encapsulation layer disposed on the display element layer; And
An electronic device comprising an input sensing unit disposed on the encapsulation layer. A display module including a front surface including a display area displaying an image and a peripheral area adjacent to the display area, and a rear surface facing the front surface;
A base layer, a first adhesive layer provided on a first surface of the base layer and attached to the rear surface of the display module, and a second adhesive layer provided on a second surface facing the first surface of the base layer A first adhesive member;
A sensing module disposed over the display area to include a sensing area for sensing fingerprints in an ultrasonic manner, and the second adhesive layer of the first adhesive member adhered to the sensing area; And
An electronic device including a photo-initiator and a second adhesive member that is bonded to a portion of the sensing module and the rear surface of the display module, respectively. The method of claim 19,
The sensing module and the rear surface of the display module are spaced at a predetermined interval,
An electronic device filled with the first adhesive member in a space formed by separating the rear surfaces of the sensing module and the display module.

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