CN206388849U - Antenna assembly and electronic equipment - Google Patents
Antenna assembly and electronic equipment Download PDFInfo
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- CN206388849U CN206388849U CN201621274092.3U CN201621274092U CN206388849U CN 206388849 U CN206388849 U CN 206388849U CN 201621274092 U CN201621274092 U CN 201621274092U CN 206388849 U CN206388849 U CN 206388849U
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- connecting portion
- conductor
- coil
- antenna assembly
- roundabout component
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Abstract
Antenna assembly (101) possesses：Base material (1), with insulating properties；Spiral-shaped coil-conductor (10), is formed at the interarea of base material (1)；With roundabout component (21), the 1st connecting portion and the 2nd connecting portion with mutual conduction.At least a portion and coil-conductor (10) between the 1st connecting portion and the 2nd connecting portion of roundabout component (21) is arranged opposite.At least one of 1st connecting portion of roundabout component (21) and the 2nd connecting portion are connected via conductive bonding material with the inner peripheral portion or peripheral part of coil-conductor (10).So, the roundabout component (21) that (configuration) is attached to the inner peripheral portion and peripheral part of coil-conductor (10) is installed with conductive bonding material, therefore, it is possible to carry out surface installation in the same manner as the general surface mounting assembly with RFIC elements etc..
Description
The application is Application No. " 201690000156.2 ", and the applying date is on January 26th, 2016, entitled " my god
The divisional application of the application of line apparatus and electronic equipment ".
Technical field
The utility model is related to the antenna assembly and electricity utilized in the communication system, power transmission system of HF frequency bands
Sub- equipment.
Background technology
In the past, as Patent Document 1, possess and be formed at the spiral-shaped conductive pattern of substrate surface and constituted
The antenna assembly of aerial coil be practical.
In the case where this antenna assembly and RFID wireless IC chip, external circuit are connected, typically make and day
The terminal of the inner circumferential end of line coil and outer circumference end connection is close to simultaneously aligned configuration.Thus, as by the inner circumferential end of aerial coil
(the inner circumferential end of spiral-shaped conductive pattern) travels back across the composition in the region in spiral-shaped outside or by outside aerial coil
Zhou Duan (outer circumference end of spiral-shaped conductive pattern) travels back across the composition in the region of spiral-shaped inner side.
A kind of manufacture method of antenna assembly is recorded in patent document 1, the antenna assembly has：It is arranged at substrate
The spiral-shaped aerial coil in one face and be arranged at substrate another face (face of the side opposite with a face) bridge
Map interlinking case.Bridge joint pattern is engaged with the terminal of the outer circumference end of aerial coil and the terminal at inner circumferential end.That is, bridge joint pattern is via setting
The terminal for the outer circumference end for being placed in the through hole of substrate to connect aerial coil and the terminal at inner circumferential end.
Citation
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2014-220016 publications
Utility model content
The utility model problem to be solved
But, in the manufacture method shown in patent document 1, due to needing to press in bridge joint pattern and being welded to antenna line
The process for enclosing (coil-conductor), therefore manufacturing process's complication.In addition, substrate can melt in welding, substrate is easily produced attached
The manufacture in the manufacture device of antenna assembly etc. is bad.
In addition, in the aerial coil (coil-conductor) for being arranged at a face of substrate and the bridge diagram for being arranged at another face
In the case of being attached between case by through hole etc., due to needing in substrate formation through hole and filling electroconductive member etc.
Process, therefore still manufacturing process can be complicated.
The purpose of this utility model is can be by simply constructing and process is formed in connection in base there is provided one kind
The inner peripheral portion of spiral helicine coil-conductor and the antenna assembly of peripheral part of the interarea of material and the electronics for possessing the antenna assembly
Equipment.
Means for solving the problems
(1) antenna assembly of the present utility model is characterised by possessing：
Base material, with insulating properties；
Spiral-shaped coil-conductor, is formed at least one interarea of the base material；
Roundabout component, has conductor, and the 1st connecting portion and the 2nd connecting portion with mutual conduction at least a portion；
Adhesive linkage, between the roundabout component and the coil-conductor；With
Other components beyond the adhesive linkage, between the roundabout component and the coil-conductor,
At least a portion and the coil between the 1st connecting portion of the roundabout component and the 2nd connecting portion
Conductor is arranged opposite,
At least one of 1st connecting portion and the 2nd connecting portion via conductive bonding material with the line
Inner peripheral portion or the peripheral part connection of conductor are enclosed,
The adhesive linkage is made up of the dielectric constant material lower than other described components.
In this composition, due to installing the inner peripheral portion and peripheral part of (configuration) to coil-conductor with conductive bonding material
The roundabout component being attached, therefore, it is possible to carry out surface peace in the same manner as the general surface mounting assembly with RFIC elements etc.
Dress.Thus, the process such as need not pressing roundabout component and be welded to coil-conductor.Accordingly, it is capable to which realize can be by letter
Single construction and process are formed in connection in the inner peripheral portion and the day of peripheral part of the spiral helicine coil-conductor of the interarea of base material
Line apparatus.
(2) it can use and be constructed as below, i.e. the 1st connecting portion is led via conductive bonding material with the coil
The inner peripheral portion connection of body, the periphery of the 2nd connecting portion via conductive bonding material with the coil-conductor
Portion is connected.
(3) the preferably roundabout component is made up of metal plate.In this composition, due to without in the other shape of roundabout component
Into conductor, thus it is easy to manufacture, cost degradation can be sought.
(4) in above-mentioned (1)~(3) preferably, the roundabout component is in the 1st connecting portion and the 2nd connection
Groove is formed between portion.In this composition, conductive bonding material moistening can be suppressed and expand to the 1st connecting portion and the 2nd company
Between socket part.Thus, it is possible to prevent from being located between the 1st connecting portion and coil-conductor and the 2nd connecting portion and coil-conductor (or
Person, the conductor being connected with coil-conductor) between conductive bonding material reduction.Therefore, it is possible to by the 1st connecting portion and coil
The bond strength of the bond strength of conductor and the 2nd connecting portion and coil-conductor (or, be connected with coil-conductor conductor) is tieed up
Hold higher.
(5) in above-mentioned (1)~(4) preferably, compared between the 1st connecting portion and the 2nd connecting portion, extremely
Few 1st connecting portion and the 2nd connecting portion are relatively higher to the wettability of the conductive bonding material.According to the structure
Into, can suppress conductive bonding material moistening expand between the 1st connecting portion and the 2nd connecting portion.Thus, it is possible to prevent from being located at
Between 1st connecting portion and coil-conductor and between the 2nd connecting portion and coil-conductor (or, be connected with coil-conductor conductor)
Conductive bonding material reduction.Therefore, it is possible to by the bond strength and the 2nd connecting portion of the 1st connecting portion and coil-conductor
Maintain higher with the bond strength of coil-conductor (or, be connected with coil-conductor conductor).
(6) in above-mentioned (5) preferably, the 1st connecting portion and the 2nd connecting portion are formed with plating film.According to this
Constitute, be able to easily form compared between the 1st connecting portion and the 2nd connecting portion and the wettability of conductive bonding material is relative
The 1st higher connecting portion and the 2nd connecting portion.
(7) in above-mentioned (1) or (2) preferably, the roundabout component has linear expansion coefficient and the base material near
As substrate layer, be formed with conductor in the face opposed with the coil-conductor.If the linear expansion coefficient of roundabout component and base material
Linear expansion coefficient is different, then when conductive bonding material is heated, roundabout component warpage, but according to above-mentioned composition
The warpage can be prevented.Therefore, it is possible to suppress between the 1st connecting portion and coil-conductor and the 2nd connecting portion and coil-conductor it
Between loose contact, short circuit, it is possible to increase manufacture antenna assembly when yields.
(8) in above-mentioned (1)~(7) preferably, the roundabout component is in the 1st connecting portion and the 2nd connection
At least a portion between portion is formed with insulator layer.In this composition, conductive bonding material moistening can be suppressed and expanded to
Between 1st connecting portion and the 2nd connecting portion.Thus, it is possible to prevent from being located between the 1st connecting portion and coil-conductor and the 2nd connection
The reduction of conductive bonding material between portion and coil-conductor.Therefore, it is possible to which the engagement of the 1st connecting portion and coil-conductor is strong
The bond strength of degree and the 2nd connecting portion and coil-conductor maintains higher.
(9) in above-mentioned (1)~(8) preferably, it is also equipped with：Surface mounting assembly, via conductive bonding material
Turned on the coil-conductor.According to this composition, external circuit can be easily configured and used or humorous with matching for coil-conductor
The circuit of vibration frequency setting, enables to the circuit of outside to become or simplify.
(10) electronic equipment of the present utility model, is preferably provided with：Day described in any one of above-mentioned (1)~(9) is traditional thread binding
Put；And power supply circuit, be connected with the coil-conductor or with the coil-conductor electromagnetic field couples., can according to this composition
Realize the electronic equipment of the antenna assembly utilized in the communication system for possessing HF frequency bands, power transmission system.
The effect of utility model
According to the utility model, can realize can be by simply constructing and process is formed in connection in the interarea of base material
The inner peripheral portion of spiral helicine coil-conductor and the antenna assembly of peripheral part and the electronic equipment for possessing the antenna assembly.
Brief description of the drawings
Fig. 1 (A) is the top view of the antenna assembly 101 involved by the 1st embodiment, and Fig. 1 (B) is the institute of antenna assembly 101
The top view of the conductive pattern possessed.
Fig. 2 is the exploded perspective view of antenna assembly 101.
Fig. 3 (A) is the upward view of roundabout component 21, and Fig. 3 (B) is the A-A sectional views in Fig. 1.
Fig. 4 (A) is the top view of the antenna assembly 102 involved by the 2nd embodiment, and Fig. 4 (B) is the B-B in Fig. 4 (A)
Sectional view.
Fig. 5 (A) is the top view of the antenna assembly 103A involved by the 3rd embodiment, and Fig. 5 (B) is antenna assembly 103B
Top view.
Fig. 6 (A) is the rearview of the roundabout component 24 involved by the 4th embodiment, and Fig. 6 (B) is cuing open for roundabout component 24
View, Fig. 6 (C) is the sectional view for the mounting portion for representing roundabout component 24.
Fig. 7 is the sectional view for representing not formed the comparative example of the roundabout component 24A of groove mounting portion.
Fig. 8 (A) is the rearview of the roundabout component 25A involved by the 5th embodiment, and Fig. 8 (B) is roundabout component 25A
Sectional view, Fig. 8 (C) is the sectional view for the mounting portion for representing roundabout component 25A.
Fig. 9 (A) is the rearview of the roundabout component 25B involved by the 5th embodiment, and Fig. 9 (B) is roundabout component 25B
Sectional view, Fig. 9 (C) is the sectional view for the mounting portion for representing roundabout component 25B.
Figure 10 (A) is the rearview of the roundabout component 26 involved by the 6th embodiment, and Figure 10 (B) is roundabout component 26
Sectional view, Figure 10 (C) is the sectional view for the mounting portion for representing roundabout component 26.
Figure 11 (A) is the rearview of the roundabout component 27 involved by the 7th embodiment, and Figure 11 (B) is roundabout component 27
Sectional view, Figure 11 (C) is the sectional view for the mounting portion for representing roundabout component 27.
Figure 12 (A) is the top view of the antenna assembly 108 involved by the 8th embodiment, and Figure 12 (B) is the 8th embodiment
The rearview of involved roundabout component 28.Figure 12 (C) is the C-C sectional views in Figure 12 (A).
Figure 13 (A) is the top view of the antenna assembly 109 involved by the 9th embodiment, and Figure 13 (B) is the 9th embodiment
The rearview of involved roundabout component 29, Figure 13 (C) is the sectional view for the mounting portion for representing roundabout component 29.
Figure 14 is the top view of the construction for the enclosure interior for representing the electronic equipment involved by the 10th embodiment.
Figure 15 is the top view of the construction for the enclosure interior for representing the electronic equipment involved by the 11st embodiment.
Embodiment
After, several specific examples are enumerated referring to the drawings, to represent to be used for implement multiple modes of the present utility model.Each
In accompanying drawing, identical symbol is assigned for identical part.Each embodiment is to illustrate, and can realize different embodiments
The aliquot replacement of shown composition or combination.
In each embodiment as shown below, so-called " antenna assembly " refers to the antenna for radiating magnetic flux.Antenna assembly
It is the antenna in order to make use of the near-field communication of magnetic coupling with the progress of the antenna of communication counterpart side and utilize, for example, is used in
NFC(Near field communication：Near-field communication) etc. communication.Frequency band used in antenna assembly is for example in HF frequencies
Use, especially used under the frequency near 13.56MHz or 13.56MHz in band.The size of antenna assembly is compared to being made
Wavelength X under frequency is very small, and the radiation characteristic of the electromagnetic wave in service band is poor.On antenna assembly, antenna assembly
The size of the coil antenna possessed is below λ/10.In addition, wavelength referred in this, refers to the base material for considering to form antenna
Dielectricity, the wavelength caused by magnetic conductivity shorten the EWL of effect.The two ends for the coil-conductor that coil antenna has
It is connected with the power supply circuit worked under service band (HF frequency bands, especially 13.56MHz or 13.56MHz near).
《1st embodiment》
Fig. 1 (A) is the top view of the antenna assembly 101 involved by the 1st embodiment, and Fig. 1 (B) is the institute of antenna assembly 101
The top view of the conductive pattern possessed.Fig. 2 is the exploded perspective view of antenna assembly 101.In fig. 2, adhesive linkage 71 is eliminated
Diagram.Fig. 3 (A) is the upward view of roundabout component 21, and Fig. 3 (B) is the A-A sectional views in Fig. 1.Fig. 3 (A) and Fig. 3 (B) in order to
It should be readily appreciated that the construction of accompanying drawing and principle and the roundabout component 21 of simplified illustration.In addition, in Fig. 3 (B), exaggerating each portion of diagram
Thickness.It is also same on the sectional view in following each embodiment.
Antenna assembly 101 possesses：Base material 1, coil-conductor 10, protective layer 2, adhesive linkage 71, the 1st external connection terminal daughter board 3,
2nd external connection terminal daughter board 4 and roundabout component 21.Base material 1 is the rectangular-shaped flat board being made up of Ins. ulative materials such as resins.
Base material 1 is, for example, polyimides, PET (Poly Ethylene Terephthalate：Polyethylene terephthalate), liquid
The resin-made sheet material of crystalline polymer (LCP) etc., the Young's modulus E of base material 1BFor example, 3GPa.
Coil-conductor 10 is formed at the spiral-shaped metal foil of an interarea (upper surface in Fig. 3 (B)) for base material 1
Plate, for example, Cu paper tinsels, Al paper tinsels.Coil-conductor 10 has the 1st connection terminal 11, the 2nd connection terminal 12, the 1st external connection terminals
13 and the 2nd external connection terminals 14.
In the present embodiment, the flat shape of the 1st connection terminal 11 is square, is formed at the interior of coil-conductor 10
Zhou Duan conductive pattern.The flat shape of 2nd connection terminal 12 is square, and the outer circumference end for being formed at coil-conductor 10 is led
Body pattern.In the antenna assembly 101 involved by present embodiment, the 1st connection terminal 11 and the 2nd connection terminal 12 are configured
Near a corner (upper right corner in Fig. 1) for antenna assembly 101.
In addition, " inner peripheral portion of coil-conductor 10 " (" coil-conductor in the application utility model in present specification
Inner peripheral portion ") and " peripheral part of coil-conductor 10 " (" peripheral part of coil-conductor " in the application utility model) respectively
The inner circumferential end of coil-conductor 10 and the outer circumference end of coil-conductor 10 are not simply meant to, but at least across the one of coil-conductor 10
Circle, is referred to as " inner peripheral portion of coil-conductor 10 " by the inner circumferential side of coil-conductor 10, the outer circumferential side of coil-conductor 10 is referred to as into " coil
The peripheral part of conductor 10 ".
The flat shape of 1st external connection terminals 13 and the 2nd external connection terminals 14 is square, is RFIC elements etc.
The conductive pattern of the connection of external circuit and coil-conductor 10.1st external connection terminals 13 and the 2nd external connection terminals 14
It is arranged on the midway or end of coil-conductor 10.In the antenna assembly 101 involved by present embodiment, the 1st external connection
The external connection terminals 14 of terminal 13 and the 2nd are formed in the midway in coil-conductor 10 and the coil aperture of coil-conductor 10
Side.In addition, the 1st connection terminal 11, the 2nd connection terminal 12, the 1st external connection terminals 13 and the 2nd external connection terminals 14
Flat shape is not limited to these shapes, can suitably change.
Protective layer 2 is rectangular-shaped flat board, protects base material 1, coil-conductor 10 from the impact from outside application, external force
Deng, and they are insulated.The flat shape of protective layer 2 is the shape substantially the same with base material 1, is glued via adhesive linkage 71
Invest an interarea of base material 1.In the present embodiment, being provided with protective layer 2 makes the 1st connection terminal 11, the 2nd connection terminal
12nd, the hole that the 1st external connection terminals 13 and the 2nd external connection terminals 14 expose.Protective layer 2 is, for example, polyimides, liquid crystal
The resin bed of polymer (LCP) etc..In addition, the flat shape of protective layer 2 is not limited to the shape substantially the same with base material 1,
Can suitably it change.The relative dielectric constant ε of protective layer 2PFor example, 3.4, the Young's modulus EP of protective layer 2 are, for example,
3GPa。
Adhesive linkage 71 has insulating properties and adhesiveness, is formed at the substantial entire surface of base material 1.Adhesive linkage 71 is, for example,
Layer that two-sided adhesion tablet material, bonding agent are constituted, PTFE (Polytetrafluoroethylene：Polytetrafluoroethylene (PTFE)) etc..Separately
Outside, adhesive linkage 71 is not limited to be formed at the composition of the substantial entire surface of base material 1, can suitably change.In adhesive linkage
In the case that 71 are PTFE, the relative dielectric constant ε of adhesive linkage 71GFor 2.5, the Young's modulus E of adhesive linkage 71GFor 0.1GPa.
In the present embodiment, the relative dielectric constant ε of adhesive linkage 71GThan the relative dielectric constant ε of protective layer 2PLow (gG
＜ εP).In the case where the surface mountable member of such as roundabout component 21 is conductive, in surface mountable member and coil-conductor
Parasitic capacitance can be produced between 10.The parasitic capacitance is with the adhesive linkage 71 being located between roundabout component 21 and coil-conductor 10
Thickness D1 variation and change, but positioned at adhesive linkage 71 between roundabout component 21 and coil-conductor 10 thickness D1 Nian Jie
It is easy to change when (solidification).Thus, it is preferable to which the adhesive linkage 71 between roundabout component 21 and coil-conductor 10 is dielectric constant
The material lower than other components (protective layer 2 etc.) beyond the adhesive linkage 71 between roundabout component 21 and coil-conductor 10.
According to this composition, with the variation (deviation) positioned at the thickness D1 for being bonded material 71 between roundabout component 21 and coil-conductor 10
Characteristic variations are suppressed.
In addition, in the present embodiment, the Young's modulus E of adhesive linkage 71GThan the Young's modulus E of base material 1B, protective layer 2
Low (the E of Young's modulus EPG＜ EP)(EG＜ EB).By configuring the low material of Young's modulus between base material 1 and protective layer 2, so that
Can suppress antenna assembly 101 due to pressing when antenna assembly 101 is fixed, it is damaged from outside impact etc..The opposing party
The Young's modulus E in face, as in the present embodiment adhesive linkage 71GThan base material 1, the Young's modulus E of protective layer 2PIn the case of low,
After the solidification of adhesive linkage 71, thickness is also easy to change.Therefore, in order to suppress with adhesive linkage 71 thickness D1 variation spy
Property change, particularly preferably the adhesive linkage 71 between roundabout component 21 and coil-conductor 10 be dielectric constant ratio be located at roundabout structure
The low material of other components between part 21 and coil-conductor 10.
Roundabout component 21 is rectangular-shaped metal plate, and the inner peripheral portion and peripheral part to coil-conductor 10 are attached.It is circuitous
Returning component 21 has the 1st connecting portion 31 and the 2nd connecting portion 32 of mutual conduction in the both ends side of long side direction.1st connection
Portion 31 is the part opposed with the 1st connection terminal 11, and the 2nd connecting portion 32 is the part opposed with the 2nd connection terminal 12.Thus,
In the antenna assembly 101 involved by present embodiment, roundabout component 21 configures a corner in antenna assembly 101 (in Fig. 1
Upper right corner) near.
Roundabout component 21 be the substrate 41 made such as stainless steel (SUS301, SUS304) two interareas form Ni plating
Coating 42,43 simultaneously forms the metal plate of Sn-Ag-Cu coating layers 44 in mounting surface (lower surface in Fig. 3 (B)) side.Thus,
The 1st connection end that 1st connecting portion 31 is formed via conductive bonding material 61 with the end of the inner peripheral portion of coil-conductor 10
Son 11 is connected, what the 2nd connecting portion 32 was formed via conductive bonding material 62 with the end of the peripheral part of coil-conductor 10
2nd connection terminal 12 is connected.That is, the inner peripheral portion of coil-conductor 10 and peripheral part (the 1st connection terminal 11 and the 2nd connection terminal
12) connected via roundabout component 21.Conductive bonding material 61,62 is, for example, Sn systems solder, ACP (anisotropic conductives
Cream), ACF (anisotropic conductive film).In addition, roundabout component 21 can be other materials, as long as phosphor bronze system, brass etc.
Even if unreal plating, which is covered, can also use.
In addition, as shown in Fig. 3 (B), in the antenna assembly 101 involved by present embodiment, roundabout component 21 is crossed (horizontal
Across) it is located at the coil-conductor 10 between the 1st connection terminal 11 and the 2nd connection terminal 12.In other words, roundabout component 21 carries out coil
The inner peripheral portion of conductor 10 and the bridge joint of peripheral part, at least a portion between the 1st connecting portion 31 and the 2nd connecting portion 32 are led with coil
Body 10 is arranged opposite.
1st external connection terminal daughter board 3 and the 2nd external connection terminal daughter board 4 are flat shapes for the flat board of square, be with
The terminal of the external circuit connection such as RFIC elements.1st external connection terminal daughter board 3 and the 2nd external connection terminal daughter board 4 are overlooked
When it is overlapping with the 1st external connection terminals 13 and the 2nd external connection terminals 14 respectively, and conducting.1st external connection terminal daughter board 3
And the 2nd external connection terminal daughter board 4 be, for example, Au etc. in coating surface Cu paper tinsels.In antenna assembly 101, such as Fig. 1 and
Shown in Fig. 2 etc., the 1st external connection terminal daughter board 3 and the 2nd external connection terminal daughter board 4 are a masters for being embedded in antenna assembly 101
Face (interarea of the upside in Fig. 2) and the composition exposed from protective layer 2.In addition, outside the 1st external connection terminal daughter board 3 and the 2nd
Connection end daughter board 4 can be other materials, can enumerate stainless steel (SUS301, SUS304 etc.) system, phosphor bronze system, nickel alloy system
Deng.
According to present embodiment, following effect can be played.
In the present embodiment, due to installing (configuration) in coil-conductor 10 with conductive bonding material 61,62
The roundabout component 21 that all portions and peripheral part are attached, it is same therefore, it is possible to the general surface mounting assembly with RFIC elements etc.
Ground carries out surface installation.Thus, the process such as need not pressing roundabout component 21 and be welded to coil-conductor 10.Therefore,
Can realize can be by simply constructing and process is formed in connection in the spiral helicine coil-conductor 10 of the interarea of base material 1
The antenna assembly of inner peripheral portion and peripheral part.
In addition, installing (configuration) the 1st external connection terminal daughter board 3 and the 2nd external connection with conductive bonding material
In the case of terminal board 4, installed due to that can utilize with conductive bonding material (configuration) the 1st external connection terminal daughter board 3 with
And the 2nd external connection terminal daughter board 4 manufacture device (erecting device of surface mounting assembly), it is therefore easy to manufacture, and can seek
Cost degradation.
In addition, in the antenna assembly 101 involved by present embodiment, due to being constituted roundabout component with metal plate
21, thus without being additionally formed conductor in roundabout component 21, it is easy to manufacture, and cost degradation can be sought.Further, since roundabout structure
Part 21 is overall conductive, suppresses the conductor losses in roundabout component 21 therefore, it is possible to make resistance components step-down, can obtain Q
High (low-loss) antenna assembly of value.
Antenna assembly 101 involved by present embodiment is for example manufactured according to following process.
First, the base material 1 of metal-foil-clad is prepared.If specifically bright, base material 1 an interarea it is substantial whole
Individual face configures (stickup) metal foil.As described above, the metal foil is, for example, Cu paper tinsels.
Secondly, the metal foil of an interarea by etching etc. to being pasted on base material 1 is patterned, and is led to form coil
Body 10, the 1st connection terminal 11, the 2nd connection terminal 12, the 1st external connection terminals 13 and the 2nd external connection terminals 14.
Next, forming adhesive linkage 71 on an interarea of base material 1.Specifically, by silk-screen printing etc. in base
Adhesive linkage 71 is formed on material 1.Then, paste in an interarea of base material 1 and be formed as the guarantor of the shape substantially the same with base material 1
Sheath 2.Furthermore it is possible to adhesive linkage 71 is formed on the interarea of protective layer 2 by silk-screen printing etc., it is then, viscous foring
The interarea for connecing the protective layer 2 of layer 71 pastes an interarea of base material 1.
Secondly, for roundabout component 21, by punch process, Laser Processing, etching etc., it is punched out from metal plate.
Now, plating is carried out on the surface of roundabout component 21 as needed.
Next, the 1st connecting portion 31 of roundabout component 21 via conductive bonding material 61 with coil-conductor 10
The 1st connection terminal 11 that the end in all portions is formed is connected, and the 2nd connecting portion 32 is led via conductive bonding material 62 with coil
The 2nd connection terminal 12 that the end of the peripheral part of body 10 is formed is connected.In addition, outside the 1st external connection terminal daughter board 3 and the 2nd
Portion connection end daughter board 4 is installed as overlapping with the 1st external connection terminals 13 and the 2nd external connection terminals 14 respectively when overlooking.
According to above-mentioned manufacture method, can easily manufacture can be by simply constructing and process is formed in connection in base
The inner peripheral portion of the spiral helicine coil-conductor 10 of the interarea of material 1 and the antenna assembly 101 of peripheral part.
《2nd embodiment》
Fig. 4 (A) is the top view of the antenna assembly 102 involved by the 2nd embodiment, and Fig. 4 (B) is the B-B in Fig. 4 (A)
Sectional view.In Fig. 4 (A) and Fig. 4 (B), for ease of understanding the structure of accompanying drawing and principle and the roundabout component 22 of simplified illustration
Make.
Antenna assembly 102 involved by 2nd embodiment is different on the point for being also equipped with magnetic layer 5 and adhesive linkage 72
In the antenna assembly 101 involved by the 1st embodiment.In addition, the shape of roundabout component 22 is different.Others are constituted with the 1st in fact
The antenna assembly 101 applied involved by mode is identical.
Hereinafter, the parts different from the antenna assembly 101 involved by the 1st embodiment are illustrated.
Magnetic layer 5 is rectangular-shaped flat board, and flat shape is the shape substantially the same with protective layer 2.In this implementation
In mode, magnetic layer 5 be provided with expose the 1st external connection terminal daughter board 3 and the 2nd external connection terminal daughter board 4 hole 7, with
And the hole 8 for exposing roundabout component 22.Magnetic layer 5 is pasted on an interarea (Fig. 4 (B) of protective layer 2 via adhesive linkage 72
In upper surface).Magnetic layer 5 is, for example, that ceramic body layer, magnetic ferrite powder such as magnetic ferrite ceramics disperse
The resin bed containing ferrite powder in resin.In addition, the flat shape of magnetic layer 5 is not limited to and the essence of protective layer 2
Upper identical shape, can suitably be changed.
In addition, adhesive linkage 71 is makes magnetic layer 5 and coil-conductor 10 close to being formed relatively thin.Roundabout component 22 and line
The thickness of the adhesive linkage 71 enclosed between conductor 10 is, for example, 5 μm~10 μm, but is easy to variation when being bonded (solidification).It is general and
Speech, if thickness variation occurs in the part for being formed relatively thin, the rate of change of thickness becomes big, surface mountable member (roundabout component
22 etc.) amplitude of fluctuation of the parasitic capacitance produced between coil-conductor 10 also becomes big.Therefore, in order to reduce roundabout component 22 with
The amplitude of fluctuation (deviation) of the parasitic capacitance produced between coil-conductor 10, be preferably placed at roundabout component 22 and coil-conductor 10 it
Between adhesive linkage 71 be dielectric constant than other structures beyond the adhesive linkage 71 between roundabout component 22 and coil-conductor 10
The low material of part (protective layer 2 etc.).
Adhesive linkage 72 has insulating properties and adhesiveness, is formed at the substantial entire surface of protective layer 2.Adhesive linkage 72 is for example
It is layer that two-sided adhesion tablet material, bonding agent are constituted etc..In addition, adhesive linkage 72 is not limited to be formed at the substantial of protective layer 2
Entire surface composition, can suitably change.
Roundabout component 21 involved by the embodiment of roundabout component 22 and the 1st of antenna assembly 102 is equally rectangular-shaped
Metal plate.Roundabout component 22 has projection 201 in an interarea (upper surface in Fig. 4 (B)).Projection 201 is, for example, in punching
Flash in acies portion of metal plate etc. is formed at during the punchings such as pressure processing, Laser Processing.
In antenna assembly 102, on roundabout component 22, it is formed with the face of projection 201 (in Fig. 4 (B) in processing
Upper surface) opposite side face (lower surface in Fig. 4 (B)) it is arranged opposite with coil-conductor 10.
It is even this to constitute, the basic composition of antenna assembly 102 also with the antenna assembly involved by the 1st embodiment
101 is identical, also functions to the effect/effect same with antenna assembly 101.
In addition, face and coil-conductor of the antenna assembly 102 due to the opposite side in the face that projection 201 is formed with processing
10 is opposed, therefore, it is possible to prevent the projection 201 of roundabout component 22 from being contacted with coil-conductor 10.Therefore, the contact of projection 201 institute is produced
The problems such as breakage of caused coil-conductor 10, broken string or short circuit, is suppressed.
Moreover, antenna assembly 102 is also equipped with magnetic layer 5.Thus, in the presence of the high permeability of magnetic layer 5, with
The few conductive pattern of the number of turn can obtain given inductance.In addition, according to the collection magnetic effect of magnetic layer 5, it is possible to increase with communication
The magnetic coupling of the antenna of other side side.Moreover, by possessing the composition of magnetic layer 5, can also obtain the magnetic screen effect of rear side
Really.
In addition, in the present embodiment, although show the configuration protection layer 2 between coil-conductor 10 and magnetic layer 5
Configuration example, but magnetic layer 5 can also be configured between protective layer 2 and coil-conductor 10.In addition, coil-conductor 10 can also match somebody with somebody
Put between protective layer 2 and magnetic layer 5.That is, magnetic layer 5 can suitably become relative to the configuration relation of coil-conductor 10
More.But, in the case where antenna assembly 102 is contained in housing, preferably with respect to coil-conductor 10 with being configured with housing
Side it is opposite side configuration magnetic layer 5.According to this composition, because coil-conductor 10 is configured to more lean on than magnetic layer 5
The antenna of nearly communication counterpart side, therefore the coupling raising of antenna assembly 102 and the antenna of communication counterpart side, communication characteristic lifting.
In addition, according to this composition, the Magnetic Shielding Effectiveness of the rear side of magnetic layer 5 can be obtained, can suppress to be configured in housing its
Unnecessary coupling between his part and the grade of antenna assembly 102.
《3rd embodiment》
In the 3rd embodiment, show to construct two different antenna assemblies.Fig. 5 (A) is involved by the 3rd embodiment
Antenna assembly 103A top view, Fig. 5 (B) is antenna assembly 103B top view.In Fig. 5 (A) and Fig. 5 (B), in order to
It should be readily appreciated that construction and omit diagram protective layer, adhesive linkage, the 1st external connection terminal daughter board, the 2nd external connection terminal daughter board and circuitous
Return component.
Antenna assembly 103A, 103B involved by 3rd embodiment are mainly formed at the coil of an interarea of base material 1
The flat shape of conductor 10 is different from the antenna assembly 101 involved by the 1st embodiment.Others are constituted and the 1st embodiment
Involved antenna assembly 101 is substantially the same.Hereinafter, illustrate different from the antenna assembly 101 involved by the 1st embodiment
Part.
Antenna assembly 103A shown in Fig. 5 (A) is also equipped with connection conductor 15A.In the present embodiment, the 1st connection terminal
11A is formed at the conductive pattern of the outer circumference end of coil-conductor 10, and the 2nd connection terminal 12A is formed at the interior of coil-conductor 10
Zhou Duan conductive pattern.
Connection conductor 15A is not the conductive pattern for the part for constituting coil-conductor 10, but is pointed to coil-conductor
The conductive pattern that 2nd connection terminal 12A of 10 inner side and the 2nd external connection terminals 14 are attached.That is, such as Fig. 5 (A) institute
Show, the 1st connection terminal 11A is the peripheral part of coil-conductor 10, but the 2nd connection terminal 12A is not the inner peripheral portion of coil-conductor 10.
Therefore, peripheral part (1st connection end of the 1st connecting portion of roundabout component 21 via conductive bonding material with coil-conductor 10
Sub- 11A) connection.
It is even this to constitute, antenna assembly 103A basic composition also with the antenna assembly involved by the 1st embodiment
101 is identical, also functions to the effect/effect same with antenna assembly 101.
Antenna assembly 103B shown in Fig. 5 (B) is also equipped with outside connection conductor 15B, the 1st external connection terminals 13B and the 2nd
Portion connection terminal 14B configuration is different.Antenna assembly 103B the 1st external connection terminals 13B and the 2nd external connection terminals
14B is configured in the outside of coil-conductor 10.In addition, in the present embodiment, the 1st connection terminal 11B is formed at coil-conductor
The conductive pattern at 10 inner circumferential end, the 2nd connection terminal 12B is formed at the conductive pattern of the outer circumference end of coil-conductor 10.
Connection conductor 15B is not the conductive pattern for the part for constituting coil-conductor 10, but is pointed to coil-conductor
The conductive pattern that the 2nd connection terminal 12B in 10 outside and the 1st external connection terminals 13B are attached.That is, such as Fig. 5 (B) institute
Show, the 1st connection terminal 11B is the inner peripheral portion of coil-conductor 10, but the 2nd connection terminal 12B is not the peripheral part of coil-conductor 10.
Therefore, inner peripheral portion (1st connection end of the 1st connecting portion of roundabout component 21 via conductive bonding material with coil-conductor 10
Sub- 11B) connection.
It is even this to constitute, antenna assembly 103B basic composition also with the antenna assembly involved by the 1st embodiment
101 is identical, also functions to the effect/effect same with antenna assembly 101.
In addition, shown in antenna assembly 103A, 103B as involved by present embodiment, antenna assembly of the present utility model is simultaneously
It is non-limiting be connected with the inner peripheral portion of coil-conductor 10 in the 1st connection terminal, the peripheral part of the 2nd connection terminal and coil-conductor 10 connects
The composition connect.As long as the composition that the 1st connecting portion of roundabout component 21 is connected with the inner peripheral portion or peripheral part of coil-conductor 10
.
《4th embodiment》
Fig. 6 (A) is the rearview of the roundabout component 24 involved by the 4th embodiment, and Fig. 6 (B) is cuing open for roundabout component 24
View, Fig. 6 (C) is the sectional view for the mounting portion for representing roundabout component 24.Fig. 7 is to represent not form the roundabout component of groove
The sectional view of the comparative example of 24A mounting portion.It is simple for ease of understanding accompanying drawing and principle in Fig. 6 (C) and Fig. 7
Change the construction of the roundabout component of diagram.
Roundabout component 24 is different in the point that mounting surface (lower surface in Fig. 6 (B) and Fig. 6 (C)) side is formed with groove 20
In the roundabout component 21 involved by the 1st embodiment.Others are constituted with the antenna assembly 101 involved by the 1st embodiment in fact
It is identical in matter.Hereinafter, the parts different from the antenna assembly 101 involved by the 1st embodiment are illustrated.
In the mounting surface of the roundabout component 24 involved by the 4th embodiment, the 1st connecting portion 31 and the 2nd connecting portion 32 it
Between be formed with two grooves 202.Groove 202 forms the vicinity in the 1st connecting portion 31 and the 2nd connecting portion 32, along roundabout structure
The short side direction of part 24 and formed.The both ends of groove 202 reach roundabout component 24 short side direction (top in Fig. 6 (B) with
And it is following) acies portion.
In the present embodiment, due to being formed with groove 202, therefore energy between the 1st connecting portion 31 and the 2nd connecting portion 32
Enough suppress the moistening of conductive bonding material 61,62 to expand between the 1st connecting portion 31 and the 2nd connecting portion 32.Thus, it is possible to prevent
Conductive bonding material 61 between the 1st connecting portion 31 and coil-conductor 10 and led positioned at the 2nd connecting portion 32 with coil
The reduction of conductive bonding material 62 between body 10.Therefore, it is possible to by the engagement of the 1st connecting portion 31 and the 1st connection terminal 11
The bond strength of intensity and the 2nd connecting portion 32 and the 2nd connection terminal 12 maintains higher.
In addition, as shown in fig. 7, in the case where the roundabout component 24A for not forming groove is installed on into base material 1, such as leading
Electrical grafting material 62A moistenings are expanded between the 1st connecting portion and the 2nd connecting portion, it is possible to causing roundabout component 24A's
Mounting surface becomes main surface parallel not with base material 1.Thus, what is produced between roundabout component 24A conductor and coil-conductor 10 posts
Raw electric capacity C1A, C2A become unstable, and the impedance of antenna assembly produces deviation.
In this way, in the present embodiment, the 1st connecting portion 31 is expanded to because conductive bonding material 61,62 will not be moistened
Between the 2nd connecting portion 32, therefore the mounting surface of roundabout component 24 becomes the main surface parallel with base material 1.Therefore, roundabout component 24
The stability lifting of parasitic capacitance C1, C2 produced between coil-conductor 10, can reduce the deviation of the impedance of antenna assembly.
In addition, in the antenna assembly involved by present embodiment, two grooves 202 are formed in the 1st connecting portion respectively
The vicinity of 31 and the 2nd connecting portion 32 and along formed by the short side direction of roundabout component 24 constitute.Therefore, compared to
The center of 1 connecting portion 31 and the 2nd connecting portion 32 forms the composition of groove 202, can further prevent conductive bonding material
Moistening extension.
Further, since the both ends of groove 202 reach the acies portion of roundabout component 24, therefore, it is possible to prevent electric conductivity from engaging
From the joint-cutting of groove 202 moistening extension occurs for material.
In addition, in the present embodiment, such as shown in Fig. 6 (B) and Fig. 6 (C), being formed with the side sight from roundabout component 24
When examining for rectangle groove 202, but be not limited to this composition, the section shape of groove 202 can be changed suitably.Groove
Section shape is such as being contemplated that V-shaped, U-shaped.In addition, in the present embodiment, groove 202 is the structure for reaching substrate 41
Into, but it is not limited to this composition.The depth of groove 202 can be changed suitably.
《5th embodiment》
In the 5th embodiment, the variation of the antenna assembly involved by the 4th embodiment is shown.Fig. 8 (A) is the 5th real
The rearview of the roundabout component 25A involved by mode is applied, Fig. 8 (B) is roundabout component 25A sectional view, and Fig. 8 (C) is to represent circuitous
Return the sectional view of component 25A mounting portion.Fig. 9 (A) is the rearview of the roundabout component 25B involved by the 5th embodiment, figure
9 (B) are roundabout component 25B sectional views, and Fig. 9 (C) is the sectional view for the mounting portion for representing roundabout component 25B.Fig. 8 (B),
(C) and in Fig. 9 (B), (C), for ease of understanding the construction of accompanying drawing and principle and the roundabout component of simplified illustration.
The composition of the groove of antenna assembly involved by 5th embodiment is different from the antenna involved by the 4th embodiment
Device.Others constitute substantially the same with antenna assembly 104 involved by the 4th embodiment.Hereinafter, illustrate to implement with the 4th
The different part of antenna assembly involved by mode.
In the mounting surface of the roundabout component 25A shown in Fig. 8 (A), possess between the 1st connecting portion 31 and the 2nd connecting portion 32
One groove 202A.Entire surface of the groove 202A formation between roundabout component 25A the 1st connecting portion 31 and the 2nd connecting portion 32.
Thus, groove 202A formation is in the vicinity of the 1st connecting portion 31 and the 2nd connecting portion 32, along roundabout component 25A short side direction
And formed.In addition, groove 202A both ends reach roundabout component 25A short side direction (top and following) in Fig. 8 (A)
Acies portion.
It is even this to constitute, roundabout component 25A basic composition also with the roundabout component 24 involved by the 4th embodiment
It is identical, also function to the effect/effect same with the antenna assembly involved by the 4th embodiment.In addition, as shown in the embodiment
Like that, the shape of groove, size etc. can suitably be changed in the range of above-mentioned effect/effect is played.
In the mounting surface of the roundabout component 25B shown in Fig. 9 (B), formed between the 1st connecting portion 31 and the 2nd connecting portion 32
There are four grooves 202.Groove 202 forms the vicinity in the 1st connecting portion 31 and the 2nd connecting portion 32, along roundabout component 25B's
Short side direction and formed.The both ends of groove 202 reach roundabout component 25B short side direction (top in Fig. 9 (A) and under
Side) acies portion.In other words, it may be said that two grooves of the roundabout component 25B in the roundabout component 24 involved by the 4th embodiment
Two grooves are further defined between 202.
It is even this to constitute, roundabout component 25B basic composition also with the roundabout component 24 involved by the 4th embodiment
It is identical, also function to the effect/effect same with the antenna assembly involved by the 4th embodiment.
In addition, as shown in the embodiment, number of groove etc. can be fitted in the range of above-mentioned effect/effect is played
Locality change.Therefore, antenna assembly of the present utility model can also be used and is constructed as below, i.e. be connected in the 1st connecting portion the 31 and the 2nd
Multiple grooves are formed between socket part 32.
《6th embodiment》
Figure 10 (A) is the rearview of the roundabout component 26 involved by the 6th embodiment, and Figure 10 (B) is roundabout component 26
Sectional view, Figure 10 (C) is the sectional view for the mounting portion for representing roundabout component 26.
In the 6th embodiment, the construction of roundabout component 26 is different from the roundabout component 21 involved by the 1st embodiment.
Others constitute substantially the same with antenna assembly 101 involved by the 1st embodiment.Hereinafter, illustrate and the 1st embodiment institute
The different part of the antenna assembly 101 that is related to.
1st connecting portion 31 and 2nd of the roundabout component 26 in mounting surface (lower surface in Figure 10 (B) and Figure 10 (C))
Connecting portion 32 is formed with Sn-Ag-Cu coating layers 44, and the entire surface between the 1st connecting portion 31 and the 2nd connecting portion 32 is formed with Ni
Coating layer 43.Sn-Ag-Cu coating layers 44 are used as the moistening of the Sn systems solder of conductive bonding material compared to Ni coating layers 43
Property is higher.Therefore, in the present embodiment, the 1st connecting portion 31 and the 2nd connecting portion 32 connect compared to the 1st connecting portion the 31 and the 2nd
Between socket part 32, the wettability of conductive bonding material is relatively higher.
In the present embodiment, due to the wettability phase of the 1st connecting portion 31 and the conductive bonding material of the 2nd connecting portion 32
To height, expanded to therefore, it is possible to suppress the moistening of conductive bonding material 61,62 between the 1st connecting portion 31 and the 2nd connecting portion 32.Cause
And, it can prevent positioned at the conductive bonding material 61 between the 1st connecting portion 31 and coil-conductor 10 and positioned at the 2nd connection
The reduction of conductive bonding material 62 between portion 32 and coil-conductor 10.Therefore, it is possible to which the 1st connecting portion 31 is connected with the 1st
The bond strength of the bond strength of terminal 11 and the 2nd connecting portion 32 and the 2nd connection terminal 12 maintains higher.
In addition, in the present embodiment, the 1st connecting portion 31 is expanded to because conductive bonding material 61,62 will not be moistened
Between the 2nd connecting portion 32, therefore the mounting surface of roundabout component 26 becomes the main surface parallel with base material 1.Therefore, roundabout component 26
The stability lifting of parasitic capacitance C1, C2 produced between coil-conductor 10, can reduce the deviation of the impedance of antenna assembly.
In addition, in the present embodiment, can be more easily formed compared between the 1st connecting portion 31 and the 2nd connecting portion
And the wettability of conductive bonding material higher the 1st connecting portion 31 and the 2nd connecting portion 32 relatively.
《7th embodiment》
In the 7th embodiment, the variation of the antenna assembly involved by the 6th embodiment is shown.Figure 11 (A) is the 7th
The rearview of roundabout component 27 involved by embodiment, Figure 11 (B) is the sectional view of roundabout component 27, and Figure 11 (C) is to represent
The sectional view of the mounting portion of roundabout component 27.
In the 7th embodiment, the construction of roundabout component 27 is different from the roundabout component 26 involved by the 6th embodiment.
Others constitute substantially the same with antenna assembly involved by the 6th embodiment.Hereinafter, illustrate with the 6th embodiment involved by
And the different part of antenna assembly.
1st connecting portion 31 and 2nd of the roundabout component 27 in mounting surface (lower surface in Figure 11 (B) and Figure 11 (C))
Connecting portion 32 is formed with Ni coating layers 43 and Sn-Ag-Cu coating layers 44.Due to the 1st connecting portion 31 and the 2nd connecting portion 32 it
Between entire surface do not form plating film, therefore substrate 41 exposes.Sn-Ag-Cu coating layers 44 and Ni coating layers 43 are compared to base
Plate 41, the wettability as the Sn systems solder of conductive bonding material is higher.Therefore, in the present embodiment, the 1st connecting portion 31
And the 2nd connecting portion 32 compared between the 1st connecting portion 31 and the 2nd connecting portion 32, the wettability of conductive bonding material is relative
It is higher.
In this way, being formed at the species of the plating film of roundabout component, the number of plies, shape, size and scope etc. can play
Compared between the 1st connecting portion 31 and the 2nd connecting portion 32 and the electric conductivity of the 1st connecting portion 31 and the 2nd connecting portion 32 engages material
Suitably changed in the range of this relatively higher effect/effect of the wettability of material.
《8th embodiment》
Figure 12 (A) is the top view of the antenna assembly 108 involved by the 8th embodiment, and Figure 12 (B) is the 8th embodiment
The rearview of involved roundabout component 28.Figure 12 (C) is the C-C sectional views in Figure 12 (A).
Antenna assembly 108 involved by 8th embodiment is being also equipped with the point of insulator layer 6 and surface mounting assembly 51
The upper antenna assembly 101 different from involved by the 1st embodiment.In addition, the construction of coil-conductor 10 and roundabout component 28 is not
Together.Others constitute identical with the antenna assembly 101 involved by the 1st embodiment.Hereinafter, illustrate with the 1st embodiment involved by
And the different part of antenna assembly 101.
Insulator layer 6 is rectangular-shaped flat board, and flat shape is the shape substantially the same with base material 1.The shape of insulator layer 6
Into the interarea (upper surface in Figure 12 (B)) in base material 1.Insulator layer 6 is, for example, the layer of soldering-resistance layer, oxide-film etc..Separately
Outside, the flat shape of insulator layer 6 is not limited to the shape substantially the same with base material 1, can suitably change.
Roundabout component 28 involved by present embodiment is configured on one side (the right in Figure 12 (A)) of antenna assembly 108
Center near.Roundabout component 28 has the substrate layer 45 being made up of Ins. ulative materials such as resins.Roundabout component 28 with coil
The opposed face of conductor 10 (lower surface in Figure 12 (C)) is formed with conductor layer 46.Substrate layer 45 e.g. polyimides, liquid crystal gather
The resin-made sheet material of compound (LCP) etc..Conductor layer 46 is sheet metal, e.g. Cu paper tinsels.The substrate layer 45 of roundabout component 28 is
With the identical material of base material 1.
Surface mounting assembly 51 is installed on the interarea of protective layer 2, via conductive bonding material (not shown) and coil
Conductor 10 is connected.Surface mounting assembly 51 is, for example, the chip capacitor of the resonance circuit of antenna assembly 108.
Coil-conductor 10 involved by present embodiment does not have the 1st connection terminal and the 2nd connection terminal.In addition, such as
Shown in Figure 12 (A), it is connected via conductive bonding material 61,62 with the 1st connecting portion and the 2nd connecting portion of roundabout component 28
Coil-conductor 10 be not coil-conductor 10 inner peripheral portion and the end of peripheral part.
It is even this to constitute, the basic composition of antenna assembly 108 also with the antenna assembly involved by the 1st embodiment
101 is identical, also functions to the effect/effect same with antenna assembly 101 involved by the 1st embodiment.
If in addition, the linear expansion coefficient of roundabout component is different with the linear expansion coefficient of base material, in conductive bonding material
When being heated, roundabout component warpage.But, in the antenna assembly involved by present embodiment, it can prevent this from sticking up
It is bent.Therefore, it is possible to suppress the contact between the 1st connecting portion and coil-conductor and between the 2nd connecting portion and coil-conductor not
Good, short circuit, it is possible to increase yields during manufacture antenna assembly.In the antenna assembly 108 involved by present embodiment, although
Substrate layer 45 is shown by the example that is constituted with the identical material of base material 1, but is not limited to this.As long as substrate layer 45 and base material
The approximate material of 1 linear expansion coefficient.
In addition, in the case where installing (configuration) surface mounting assembly 51 with conductive bonding material, due to can be
The manufacture for utilizing with conductive bonding material to install (configuration) surface mounting assembly 51 in the installation process of roundabout component 28 is filled
(erecting device of surface mounting assembly 51) is put, thus it is easy to manufacture, cost degradation can be sought.In addition, pacifying as installation surface
The electric conductivity cement of part 51 is filled, if using the electric conductivity cement identical species with installing roundabout component 28, can
Manufactured with more easy process.
In addition, as shown in the embodiment, protective layer is not essential composition.It is traditional thread binding in the day involved by present embodiment
Put in 108, due to an interarea without protective layer to be pasted on to base material 1 via adhesive linkage, therefore, it is possible to by simple
Construction and process constitute antenna assembly.In addition, by using the composition for removing protective layer, there is flexibility so as to realize
And the antenna assembly of slimming.
In addition, as shown in the embodiment, the position of roundabout component 28 is not limited to a corner of antenna assembly 108
Near, can suitably it change.In addition, the 1st connecting portion via conductive bonding material 61,62 with roundabout component 28 and
The coil-conductor 10 of 2nd connecting portion connection is not limited to the inner peripheral portion of coil-conductor 10 and the end of peripheral part.
《9th embodiment》
In the 9th embodiment, the variation of the antenna assembly involved by the 8th embodiment is shown.Figure 13 (A) is the 9th
The top view of antenna assembly 109 involved by embodiment, Figure 13 (B) is the roundabout component 29 involved by the 9th embodiment
Rearview, Figure 13 (C) is the sectional view for the mounting portion for representing roundabout component 29.
In the 9th embodiment, the construction of roundabout component 29 is different from the roundabout component 28 involved by the 8th embodiment,
Others constitute substantially the same with antenna assembly 108 involved by the 8th embodiment.Hereinafter, illustrate and the 8th embodiment institute
The different part of the antenna assembly 108 that is related to.
Roundabout component 29 is between the 1st connecting portion 31 and the 2nd connecting portion 32 of mounting surface (lower surface in Figure 13 (C))
Entire surface is formed with insulator layer 47.Insulator layer 47 forms the vicinity in the 1st connecting portion 31 and the 2nd connecting portion 32.In addition,
The both ends of insulator layer 47 reach the acies portion of the short side direction (top and following) in Figure 13 (B) of roundabout component 29.
Insulator layer 47 is, for example, the layer of soldering-resistance layer, oxide-film etc..
Insulator layer 47 is compared to conductor layer 46, and the wettability as the Sn systems solder of conductive bonding material is lower.Cause
This, in the present embodiment, the 1st connecting portion 31 and the 2nd connecting portion 32 compared to the 1st connecting portion 31 and the 2nd connecting portion 32 it
Between, the wettability of conductive bonding material 61,62 is relatively higher.
In the present embodiment, due to being formed with insulator layer 47 between the 1st connecting portion 31 and the 2nd connecting portion 32, because
This can suppress the moistening of conductive bonding material 61,62 and expand between the 1st connecting portion 31 and the 2nd connecting portion 32.Thus, it is possible to
Prevent positioned at the conductive bonding material 61 between the 1st connecting portion 31 and coil-conductor 10 and positioned at the 2nd connecting portion 32 and line
The reduction of the conductive bonding material 62 enclosed between conductor 10.Therefore, it is possible to by the engagement of the 1st connecting portion 31 and coil-conductor 10
The bond strength of intensity and the 2nd connecting portion 32 and coil-conductor 10 maintains higher.
In addition, in the present embodiment, the 1st connecting portion 31 is expanded to because conductive bonding material 61,62 will not be moistened
Between the 2nd connecting portion 32, therefore the mounting surface of roundabout component 29 becomes the main surface parallel with base material 1.Therefore, roundabout component 29
The stability lifting of the parasitic capacitance produced between coil-conductor 10, can reduce the deviation of the impedance of antenna assembly.
In the antenna assembly involved by present embodiment, insulator layer 47 be respectively formed at the 1st connecting portion 31 and
The composition of the vicinity of 2nd connecting portion 32.Therefore, insulator is formed compared in the center of the 1st connecting portion 31 and the 2nd connecting portion 32
The composition of layer 47, can further prevent the moistening of conductive bonding material from extending.
Further, since the both ends of insulator layer 47 reach the acies portion of roundabout component 29, therefore, it is possible to prevent electric conductivity
Moistening extension occurs for the part that grafting material never forms insulator layer 47.
In addition, as shown in the embodiment, shape, quantity, scope of insulator layer 47 etc. can play above-mentioned work
With suitably being changed in the range of/effect.Therefore, antenna assembly of the present utility model also can be using being constructed as below, i.e. the
Multiple insulator layers 47 are formed between 1 connecting portion 31 and the 2nd connecting portion 32.
《10th embodiment》
Figure 14 is the top view of the construction for the enclosure interior for representing the electronic equipment involved by the 10th embodiment.
The electronic equipment is, for example, portable phone (including smart mobile phone), Wearable terminal (intelligent watch etc.), pen
Remember this computer, tablet terminal, PDA, camera, game machine, RFID tag etc..
Camera model 93, circuit substrate 96A, 96B, battery pack 99 etc. are accommodated with the inside of upper body 82.In circuit
Substrate 96A is provided with HF frequency-band antennas 97A etc..In addition, circuit substrate 96B be provided with HF frequency-band antennas 97B, possess communication electricity
Power supply circuit 85, surface mounting assembly 87 and the power supply terminal 83,84 being connected with power supply circuit 85 on road.Circuit substrate 96A
And circuit substrate 96B is connected via coaxial cable 98.Surface mounting assembly 87 is, for example, the flaky electric capacity of resonance circuit
Device.
Antenna assembly 101A is pasted with the inside of lower case 81.Involved by antenna assembly 101A and the 1st embodiment
The difference of antenna assembly 101 be, be provided with the hole 92 of camera.Antenna assembly 101A possesses the 1st external connection terminal daughter board
3A and the 2nd external connection terminal daughter board 4A.1st external connection terminal daughter board 3A and the 2nd external connection terminal daughter board 4A respectively with
Power supply terminal 83,84 abuts to be connected with coil-conductor 10.
In this way, not having the electronic equipment of wireless communication system even, by the way that antenna assembly of the present utility model is matched somebody with somebody
It is placed in electronic equipment, communication system, the power transmission system that can also constitute with HF frequency bands (are discussed later in more detail.) correspondence
Communication terminal.Communication terminal, other external device (ED)s are carried out therefore, it is possible to wirelessly to be had
Data communication.
《11st embodiment》
Figure 15 is the top view of the construction for the enclosure interior for representing the electronic equipment involved by the 11st embodiment.
In the 11st embodiment, the antenna assembly and the construction of power supply circuit that communication terminal possesses are different,
Others constitute substantially the same with communication terminal involved by the 10th embodiment.Hereinafter, illustrate and the 10th embodiment party
The different part of communication terminal involved by formula.
Antenna assembly 101B is pasted with the inside of lower case 81.Involved by antenna assembly 101B and the 1st embodiment
The difference of antenna assembly 101 be, be also equipped with hole 92 and the surface mounting assembly 88 of camera.In addition, difference is,
Do not possess the 1st external connection terminals, the 1st external connection terminal daughter board, the 2nd external connection terminals and in antenna assembly 101B
2 external connection terminal daughter boards.In antenna assembly 101B interarea, surface peace is installed via conductive bonding material (not shown)
Fill part 88.Surface mounting assembly 88 is arranged on the midway of coil-conductor 10.Surface mounting assembly 88 is, for example, that resonance circuit is used
Chip capacitor.
The circuit substrate 96B stored in the inside of upper body 82, is provided with HF frequency-band antennas 97B, possesses communication electricity
Power supply circuit 85, surface mounting assembly 87 and the power coil 86 being connected with power supply circuit 85 on road.Power supply circuit 85 via
Power coil 86 and with the antenna assembly 101B electromagnetic field couples of coil-conductor 10.
Even this to constitute, the basic composition of the communication terminal involved by the 11st embodiment is also implemented with the 10th
Communication terminal involved by mode is identical, also functions to the work same with the communication terminal involved by the 10th embodiment
With/effect.
In addition, in the present embodiment, due to power supply circuit 85 via power coil 86 with antenna assembly 101B line
Enclose conductor 10 and occur electromagnetic field couples, therefore without possessing in circuit substrate 96B for power supply circuit 85 and coil-conductor
10 power supply terminals 83,84 being attached.
《Other embodiments》
In the above-described embodiment, although the flat shape for showing base material 1 is essentially the example of rectangle, but is not limited
Due to this composition.The shape of base material 1 can suitably be changed to polygonal shape, round-shaped, elliptical shape etc..In addition,
In the above-described embodiment, although show that base material 1 is the example of flat board, but be not limited to this composition.The thickness energy of base material 1
It is enough suitably to change.
In the above-described embodiment, although show that coil-conductor 10 is formed at the example of an interarea of base material 1, but simultaneously
It is not limited to this composition.Coil-conductor 10 can be formed at the composition of another interarea of base material 1 or be formed at two
The composition in face.
In the above-described embodiment, although the flat shape for showing roundabout component is essentially the example of rectangle, but simultaneously
It is not limited to this composition.The flat shape of roundabout component can suitably be changed to polygonal shape, round-shaped, oval shape
Shape etc..In addition, the section shape and thickness on roundabout component also can be changed suitably.
In addition, in the above-described embodiment, although show that the 1st connecting portion and the 2nd connecting portion are formed at roundabout component
Both ends example, but be not limited to this composition.The position of 1st connecting portion and the 2nd connecting portion relative to roundabout component
Can suitably it change.
In addition, in the above-described embodiment, although the flat shape for showing the 1st connecting portion and the 2nd connecting portion is circle
The example of shape, but do not limit this composition.1st connecting portion of roundabout component and the flat shape of the 2nd connecting portion can be appropriate
Ground is changed to polygonal shape, elliptical shape etc..
In addition, in the above-described embodiment, although primarily illustrate in the communication system that make use of the magnetic couplings such as NFC
Antenna assembly and electronic equipment, even if but antenna assembly and electronic equipment in above-mentioned embodiment make use of magnetic
Also can be also with the noncontact power transmission system (way of electromagnetic induction, magnetic resonance mode) of coupling.Above-mentioned
Antenna assembly in embodiment can for example be used as the frequency in HF frequency bands (especially 6.78MHz or 6.78MHz near)
The power receiving antenna device of current-collecting device in the noncontact power transmission system of the lower magnetic resonance mode used, power transmission device
Power transmission antenna assembly is applied.The power supply of antenna assembly and load (secondary cell etc.) supply electric power possessed to current-collecting device
Circuit (parasite power supplier) is connected.In this case, antenna assembly also serves as power receiving antenna device, power transmission antenna assembly to play work(
Energy.The two ends for the coil-conductor that the coil antenna of antenna assembly has with service band (HF frequency bands, especially 6.78MHz
Or near 6.78MHz) under work parasite power supplier, power transmission circuit connection.
Symbol description：
C1, C1A, C2, C2A ... parasitic capacitance；
The thickness of adhesive linkages of the D1 ... between roundabout component and coil-conductor；
IC ... is wireless；
1 ... base material；
2 ... protective layers；
3rd, the external connection terminal daughter boards of 3A ... the 1st；
4th, the external connection terminal daughter boards of 4A ... the 2nd；
5 ... magnetic layers；
6 ... insulator layers；
7th, 8 ... holes；
10 ... coil-conductors；
11st, the connection terminal of 11A, 11B ... the 1st；
12nd, the connection terminal of 12A, 12B ... the 2nd；
13rd, the external connection terminals of 13B ... the 1st；
14th, the external connection terminals of 14B ... the 2nd；
15A, 15B ... connect conductor；
21st, 22,24,24A, 25A, the roundabout component in 25B, 26,27,28,29 ... (routing member)；
31 ... the 1st connecting portions；
32 ... the 2nd connecting portions；
41 ... substrates；
42nd, 43 ... Ni coating layers；
44 ... Sn-Ag-Cu coating layers；
45 ... substrate layers；
46 ... conductor layers；
47 ... insulator layers；
51 ... surface mounting assemblies；
61st, 61A, 62,62A ... conductive bonding materials；
71st, 72 ... adhesive linkages；
81 ... lower cases；
82 ... upper bodies；
83rd, 84 ... power supply terminals；
85 ... power supply circuits；
86 ... power coils；
87th, 88 ... surface mounting assemblies；
The hole of 92 ... cameras；
93 ... camera models；
96A, 96B ... circuit substrate；
97A, 97B ... HF frequency-band antennas；
98 ... coaxial cables；
99 ... battery packs；
101st, 101A, 101B, 102,103A, the antenna assembly of 103B, 104,108,109 ...；
201 ... projections；
202nd, 202A ... grooves.
Claims (10)
1. a kind of antenna assembly, possesses：
Base material, with insulating properties；
Spiral-shaped coil-conductor, is formed at least one interarea of the base material；
Roundabout component, has conductor, and the 1st connecting portion and the 2nd connecting portion with mutual conduction at least a portion；
Adhesive linkage, between the roundabout component and the coil-conductor；With
Other components beyond the adhesive linkage, between the roundabout component and the coil-conductor,
At least a portion and the coil-conductor between the 1st connecting portion of the roundabout component and the 2nd connecting portion
It is arranged opposite,
At least one of 1st connecting portion and the 2nd connecting portion are led via conductive bonding material with the coil
Inner peripheral portion or the peripheral part connection of body,
The adhesive linkage is made up of the dielectric constant material lower than other described components.
2. antenna assembly according to claim 1, wherein,
1st connecting portion is connected via conductive bonding material with the inner peripheral portion of the coil-conductor,
2nd connecting portion is connected via conductive bonding material with the peripheral part of the coil-conductor.
3. antenna assembly according to claim 1 or 2, wherein,
The roundabout component is made up of metal plate.
4. antenna assembly according to claim 1 or 2, wherein,
At least a portion of the roundabout component between the 1st connecting portion and the 2nd connecting portion is formed with groove.
5. antenna assembly according to claim 1 or 2, wherein,
Compared between the 1st connecting portion and the 2nd connecting portion, at least described 1st connecting portion and the 2nd connecting portion
Wettability to the conductive bonding material is relatively higher.
6. antenna assembly according to claim 5, wherein,
1st connecting portion and the 2nd connecting portion are formed with plating film.
7. antenna assembly according to claim 1 or 2, wherein,
The roundabout component has the linear expansion coefficient substrate layer approximate with the base material, in the face opposed with the coil-conductor
It is formed with conductor.
8. antenna assembly according to claim 1 or 2, wherein,
At least a portion of the roundabout component between the 1st connecting portion and the 2nd connecting portion is formed with insulator layer.
9. antenna assembly according to claim 1 or 2, wherein,
The antenna assembly is also equipped with：Surface mounting assembly, is turned on via conductive bonding material with the coil-conductor.
10. a kind of electronic equipment, possesses：
Antenna assembly according to any one of claims 1 to 9；With
Power supply circuit, be connected with the coil-conductor or with the coil-conductor electromagnetic field couples.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-017185 | 2015-01-30 | ||
| JP2015017185 | 2015-01-30 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201690000156.2U Division CN206727226U (en) | 2015-01-30 | 2016-01-26 | Antenna assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206388849U true CN206388849U (en) | 2017-08-08 |
Family
ID=59486615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621274092.3U Expired - Fee Related CN206388849U (en) | 2015-01-30 | 2016-01-26 | Antenna assembly and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206388849U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199694A (en) * | 2018-11-16 | 2020-05-26 | 三星显示有限公司 | Electronic device |
-
2016
- 2016-01-26 CN CN201621274092.3U patent/CN206388849U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111199694A (en) * | 2018-11-16 | 2020-05-26 | 三星显示有限公司 | Electronic device |
| US11455818B2 (en) | 2018-11-16 | 2022-09-27 | Samsung Display Co., Ltd. | Electronic device comprising adhesive member |
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| CF01 | Termination of patent right due to non-payment of annual fee |
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| CF01 | Termination of patent right due to non-payment of annual fee |