CN207909619U - Antenna assembly, card-type information medium and Wireless IC device - Google Patents
Antenna assembly, card-type information medium and Wireless IC device Download PDFInfo
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- CN207909619U CN207909619U CN201690001054.2U CN201690001054U CN207909619U CN 207909619 U CN207909619 U CN 207909619U CN 201690001054 U CN201690001054 U CN 201690001054U CN 207909619 U CN207909619 U CN 207909619U
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- 239000000758 substrate Substances 0.000 claims abstract description 226
- 239000004020 conductor Substances 0.000 claims abstract description 52
- 239000011229 interlayer Substances 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims description 48
- 229920005989 resin Polymers 0.000 claims description 48
- 230000005684 electric field Effects 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 12
- 238000004891 communication Methods 0.000 description 33
- 238000009434 installation Methods 0.000 description 13
- 239000003990 capacitor Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- BGOFCVIGEYGEOF-UJPOAAIJSA-N helicin Chemical compound O[C@@H]1[C@@H](O)[C@H](O)[C@@H](CO)O[C@H]1OC1=CC=CC=C1C=O BGOFCVIGEYGEOF-UJPOAAIJSA-N 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 230000009931 harmful effect Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Details Of Aerials (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
A kind of antenna assembly of the utility model offer, card-type information medium and Wireless IC device.Antenna assembly, which is characterized in that have：The first substrate of insulating properties has the first interarea and the second interarea；Second substrate has third interarea and the 4th interarea, and opposed with first interarea with the 4th interarea is set as；First conductive pattern is formed in the first substrate；Second conductive pattern is formed in the second substrate；And interlayer connection conductor, the first end of first conductive pattern is at least connect via the interlayer connection conductor with the first end of second conductive pattern, the second end of first conductive pattern is at least connect via the interlayer connection conductor with the second end of second conductive pattern, and the antenna assembly constitutes the coil comprising first conductive pattern, second conductive pattern, the interlayer connection conductor.
Description
Technical field
The utility model is related to coil part or antenna assemblies, more particularly to have the first conductor for being formed in first substrate
Coil part, the antenna assembly of pattern, the second conductive pattern for being formed in second substrate and closing line.In addition, this practicality is new
Type is related to card-type information medium, more particularly to has the card-type information medium and wireless IC of these coil parts or antenna element
Device.In turn, the utility model is related to electronic equipment, be related to having these coil parts, antenna element, card-type information medium or
The electronic equipment of Wireless IC device.
Background technology
Conventionally, there is known following technology, that is, by the way that conducting wire to be used as to a part for coil, in circuit board (printing
Wiring plate) on form coil.
For example, in patent document 1, disclosing a kind of inductor element, having：It arranges and is formed on circuit board
Multiple wiring patterns；And multiple conducting wires.In the inductor element, by being formed into the interarea standing in circuit board
The both ends of conducting wire of arc-shaped be attached (wire bonding) with adjacent wiring pattern respectively, it is spiral helicine to constitute
Coil.
Citation
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2005-26384 bulletins
Utility model content
The utility model project to be solved
But in the structure shown in patent document 1, to form the big coil that is open, then need to be formed into circular arc
The conducting wire of shape lengthens, if each conducting wire is elongated, conducting wire becomes easy flexure.Therefore, adjacent conducting wire becomes easy each other
It contacts (short-circuit between conductors).Further, since conducting wire is bent, can change to the characteristic of coil.
On the other hand, if in order to inhibit the adjacent mutual contact of conducting wire by the diameter overstriking of each conducting wire, connection is led
The pad of line also becomes larger, and the occupied area of coil becomes larger.In turn, it if the diameter of each conducting wire is thick, becomes difficult to connect into line lead
It closes.
The purpose of the utility model is to provide it is a kind of by conducting wire be used as coil a part structure in, with
While big coil aperture, the adjacent mutual contact of conducting wire can be inhibited in the case where not increasing occupied area and can
Coil part, antenna assembly, the card-type information medium of the variation of suppression coil characteristic.In addition, it is therefore intended that, one kind is provided and is had
Their Wireless IC device and electronic equipment.
A technical solution to solve project
(1) coil part of the utility model is characterized in that having：
The first substrate of insulating properties has the first interarea and the second interarea；
Second substrate has third interarea and the 4th interarea, and opposed with first interarea with the 4th interarea is set as；
First conductive pattern is formed in the first substrate；
Second conductive pattern is formed in the second substrate；
First closing line；And
Second closing line,
The first end of first conductive pattern via first closing line and second conductive pattern first end
Connection,
The second end of first conductive pattern via second closing line and second conductive pattern second end
Connection,
The coil part is constituted comprising first conductive pattern, second conductive pattern, first closing line
And the coil of second closing line.
In this configuration, by the first conductive pattern for being formed in first substrate, be formed in the second conductor figure of second substrate
Case, the first closing line and the second closing line are used as a part for coil.Therefore, with the two of the closing line for being formed into arc-shaped
Compared with the case where both ends of the first conductive pattern are attached and constitute coil, the length of each closing line can be configured at end
It is short.If each closing line shortens, become not pliable.It therefore, with this configuration, can while with big coil aperture
Inhibit the variation of the coil characteristics as caused by being bent closing line, and the adjacent mutual contact of closing line can be inhibited (short between line
Road).
(2) preferably, in above-mentioned (1),
The quantity of first conductive pattern, the quantity of second conductive pattern, the quantity of first closing line, institute
The quantity for stating the second closing line is respectively multiple,
Length in the X-direction of X, Y, Z rectangular coordinate system of the second substrate is than the length in the Z axis directions
It is long,
Multiple first conductive patterns arrange respectively in the Y direction, and extend in the X-direction,
Multiple second conductive patterns arrange respectively in the Y direction, and extend in the X-direction,
The first end of first conductive pattern in the X-direction between the second end at a distance from compare institute
The length stated in the X-direction of second substrate is long,
The coil is to include the multiple first conductive pattern, the multiple second conductive pattern, the multiple first
The helical form of closing line and the multiple second closing line.
In this configuration, by multiple first conductive patterns, multiple second conductive patterns, multiple first closing lines and multiple
Second closing line constitutes the spiral helicine coil of multiturn.In addition, in this configuration, the length in the Z-direction of second substrate is short,
Therefore it can shorten the length of each first closing line, the length of each second closing line.In addition, being easy the X of the second conductive pattern
Length in axis direction forms long, therefore can further increase the ratio for the conductive pattern for constituting coil.In turn, by this
The low level of structure, coil part is possibly realized.
(3) preferably, in above-mentioned (1) or (2), the length of each first closing line is than first conductive pattern
X-direction on length it is short, the length of each second closing line is than long in the X-direction of first conductive pattern
It spends short.In this configuration, be attached with the both ends of closing line that are formed into arc-shaped and the both ends of the first conductive pattern and
The case where constituting coil is compared, and the length of each closing line (the first closing line 31 or the second closing line 32) is short.Therefore, can inhibit by
The variation of coil characteristics caused by closing line is bent, and the adjacent mutual contact (short-circuit between conductors) of closing line can be inhibited.
(4) preferably, in any one of above-mentioned (1) to (3), at least part of the second substrate is magnetism
Body.It with this configuration, can be not making to obtain the coil part of given inductance value in the case of coil enlargement.
(5) antenna assembly of the utility model is characterized in that having：
The first substrate of insulating properties has the first interarea and the second interarea；
Second substrate has third interarea and the 4th interarea, and opposed with first interarea with the 4th interarea is set as；
First conductive pattern is formed in the first substrate；
Second conductive pattern is formed in the second substrate；And
Interlayer connection conductor,
The first end of first conductive pattern is at least via the interlayer connection conductor and second conductive pattern
First end connects,
The second end of first conductive pattern is at least via the interlayer connection conductor and second conductive pattern
Second end connects,
The antenna assembly is constituted leads comprising first conductive pattern, second conductive pattern, interlayer connection
The coil of body.
(6) preferably, in above-mentioned (5),
The antenna assembly is also equipped with：
First closing line, between first conductive pattern first end and second conductive pattern first end it
Between；And
Second closing line, between first conductive pattern second end and second conductive pattern second end it
Between.
In this configuration, by the first conductive pattern for being formed in first substrate, be formed in the second conductor figure of second substrate
Case, the first closing line and the second closing line are used as a part for coil.Therefore, with the two of the closing line for being formed into arc-shaped
End can shorten the length of each closing line compared with the case where both ends of the first conductive pattern are attached and constitute coil.If
Each closing line shortens, then becomes not pliable.Therefore, with this configuration, while with big coil aperture, can inhibit by
The variation of coil characteristics caused by closing line is bent, and the adjacent mutual contact (short-circuit between conductors) of closing line can be inhibited.
(7) preferably, in above-mentioned (5),
First conductive pattern is formed in the second interarea of the first substrate,
Second conductive pattern is formed in the third interarea of the second substrate,
The interlayer connection conductor is formed in the first substrate.
(8) it in above-mentioned (5), can be set as, the second substrate is dielectric, and the antenna assembly is electric field type day
Line.
(9) it in above-mentioned (5), can be set as, the second substrate is magnetic substance, and the antenna assembly is field type day
Line.
(10) Wireless IC device of the utility model is characterized in that having：
Antenna assembly described in above-mentioned (5)；And
The RFIC elements being connect with the coil.
(11) preferably, in above-mentioned (10), the RFIC elements are embedded in setting in the first substrate and described the
Resin component between two substrates.
(12) the card-type information medium of the utility model is characterized in that having：
Coil part described in any one of above-mentioned (1) to (4).
(13) the card-type information medium of the utility model is characterized in that, has the antenna assembly of above-mentioned (5).
(14) the card-type information medium of the utility model is characterized in that, has the Wireless IC device of above-mentioned (10).
(15) electronic equipment of the utility model is characterized in that having：
Shell；And
It is contained in the coil part described in any one of described shell, above-mentioned (1) to (4), in above-mentioned (5) to (9)
Any one of them antenna assembly, above-mentioned (10) or (11) Wireless IC device or any one of above-mentioned (12) to (14)
Any one of described card-type information medium.
With this configuration, the coil part for having the utility model, antenna assembly, Wireless IC device or card can be realized
The electronic equipment of any one of type information medium.
Utility model effect
According to the utility model, can realize in conducting wire to be used as to the structure of a part of coil, with big line
While circle opening, the mutual contact of adjacent conducting wire can be inhibited in the case where not increasing occupied area and line can be inhibited
Enclose coil part, antenna assembly, the card-type information medium of the variation of characteristic.Has their wireless IC device furthermore it is possible to realize
Part and electronic equipment.
Description of the drawings
Fig. 1 (A) is the stereoscopic figure for the coil part 101 that first embodiment is related to, and Fig. 1 (B) is coil part
101 exploded perspective view.
Fig. 2 is the vertical view for the coil part 102 that second embodiment is related to.
Fig. 3 (A) is the stereoscopic figure for the communication terminal 301 that third embodiment is related to, and Fig. 3 (B) is to show to lead to
The magnified partial view for the antenna assembly 201 that letter terminal installation 301 has.
Fig. 4 is the stereoscopic figure for the communication terminal 302 that the 4th embodiment is related to.
Fig. 5 (A) is the stereoscopic figure for the Wireless IC device 401 that the 5th embodiment is related to, and Fig. 5 (B) is wireless IC device
The circuit diagram of part 401.
Fig. 6 (A) is the vertical view for the Wireless IC device 402 that sixth embodiment is related to, and Fig. 6 (B) is the A- in Fig. 6 (A)
A sectional views.
Fig. 7 (A) is the vertical view for the first substrate 1F that Wireless IC device 402 has, and Fig. 7 (B) is the B-B in Fig. 7 (A)
Sectional view.
Fig. 8 (A) is the vertical view for the second substrate 2F that Wireless IC device 402 has, and Fig. 8 (B) is the C-C in Fig. 8 (A)
Sectional view.
Fig. 9 (A) is the vertical view for the Wireless IC device 403 that the 7th embodiment is related to, and Fig. 9 (B) is the D- in Fig. 9 (A)
D sectional views.
Figure 10 (A) is the vertical view for the first substrate 1G that Wireless IC device 403 has, and Figure 10 (B) is in Figure 10 (A)
E-E sectional views.
Figure 11 (A) is the vertical view for the second substrate 2G that Wireless IC device 403 has, and Figure 11 (B) is in Figure 11 (A)
F-F sectional views.
Figure 12 is the vertical view for the electronic equipment 501 that the 8th embodiment is related to.
Specific implementation mode
After, with reference to attached drawing and several specific examples are enumerated, multiple modes for implementing the utility model are shown.
In each figure, same reference numeral is marked to same place.In view of the explanation of main points or the easiness of understanding, for the sake of convenient, point
The aliquot replacement for the structure opened and show embodiment, but can be shown in various embodiments or combination.
After two embodiments, the description pair item common with first embodiment is omitted, only difference is illustrated.Especially
It is that, for the same function and effect based on same structure, will not successively be referred in each embodiment.
The coil part of the several embodiments shown later is set to portable telephone terminal (including smart phone)
For the electronic equipment etc. of representative, the field type that can be e.g. used in HF frequency ranges etc. as the radiating element of magnetic flux
The radiating element of antenna, radiated electromagnetic wave (electric wave) can use in uhf band etc. by forming electric field around
The radiating element of electric field type antenna.In addition, above-mentioned coil part can also be used as inductor element.Therefore, it is not saying especially
In the case of bright, the several embodiments shown later are the examples to the both sides of the radiating element and inductor element of antenna
Show.
《First embodiment》
Fig. 1 (A) is the stereoscopic figure for the coil part 101 that first embodiment is related to, and Fig. 1 (B) is coil part
101 exploded perspective view.In Fig. 1 (B), the diagram of the first closing line 31 and the second closing line 32 is omitted.
Coil part 101 has：First substrate 1；Second substrate 2；Be formed in first substrate 1 the first conductive pattern 11a,
11b、11c、11d、11e、11f、11g、11h；Be formed in second conductive pattern 21a, 21b of second substrate 2,21c, 21d, 21e,
21f、21g；Multiple first closing lines 31；And multiple second closing lines 32.
First substrate 1 is long side direction consistent with the X-direction of X, Y, Z rectangular coordinate system and short side direction and Y direction
The insulating properties tablet of consistent rectangle has the first interarea VS1 and the second interarea VS2.First substrate 1 is, for example, printed wiring
Plate.
First conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h is formed in the first interarea of first substrate 1
VS1, and arrange in the Y-axis direction.First conductive pattern 11a, 11h is the conductive pattern of rectangle.First conductive pattern 11b,
11c, 11d, 11e, 11f, 11g are the linear conductive pattern for substantially extending and being mutually parallel in the X-axis direction.First conductor
Pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h are, for example, the pattern of Cu foils.
Here, the meaning of " in the X-axis direction extend ", however it is not limited to first conductive pattern 11b, 11c, 11d, 11e,
11f, 11g all situations parallel relative to X-direction, further include first conductive pattern 11b, 11c, 11d, 11e, 11f, 11g
The direction of extension diagrammatically towards X-direction the case where, that is, substantially the case where extending in the X-axis direction.
Second substrate 2 is the magnetic substance for the rectangle that short side direction is consistent with X-direction and long side direction is consistent with Y direction
Tablet has third interarea VS3 and the 4th interarea VS4.As shown in Fig. 1 (B), the length in the X-direction of second substrate 2
X2 is shorter (X2 ＜ X1) than the length X1 in the X-direction of first substrate 1.In addition, the length Y2 in the Y direction of second substrate 2
It is shorter (Y2 ＜ Y1) than the length Y1 in the Y direction of first substrate 1.Second substrate 2 is, for example, magnetic substance ferrite-plate.
Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g is formed in the third interarea VS3 of second substrate 2
Substantially the entire area, and arrange in the Y-axis direction.Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g be
The linear conductive pattern for extending in X-direction and being mutually parallel.Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f,
21g is, for example, pattern made of making the conductor paste solidification (metallization) comprising Cu.
Here, the meaning of " in the X-axis direction extend ", however it is not limited to second conductive pattern 21a, 21b, 21c, 21d,
21e, 21f, 21g all situations parallel relative to X-direction, further include second conductive pattern 21a, 21b, 21c, 21d, 21e,
The direction that 21f, 21g extend diagrammatically towards X-direction the case where, that is, substantially the case where extending in the X-axis direction.
4th interarea VS4 of second substrate 2 carries (adherency) in first substrate 1 through not shown resin bonding material
The first interarea VS1 center.That is, the 4th interarea VS4 of second substrate 2 matches the first interarea pair being set as with first substrate 1
It sets, and the 4th interarea VS4 of second substrate 2 is connect with the first interarea of first substrate 1.In addition, carrying (adherency) in the first base
Length X2 in the X-direction of the second substrate 2 of first interarea VS1 of plate 1 is than length Z2 long (the X2 ＞ in Z-direction
Z2)。
Here, the length X11 in the X-direction of first conductive pattern 11b, 11c, 11d, 11e, 11f, 11g is than the second base
Length X2 long (X11 ＞ X2) in the X-direction of plate 2.Therefore, even if second substrate 2 is carried (adherency) in first substrate 1
The center of first interarea VS1, first end (the first conductive pattern 11a in Fig. 1 (B) and the first conductor of the first conductive pattern
The left part of pattern 11b~11g) and second end (right part of first conductive pattern 11b~11g in Fig. 1 (B) and
First conductive pattern 11h) it can also expose the first interarea VS1 in first substrate 1.
First conductive pattern first end (the first conductive pattern 11a and the first conductive pattern 11b in Fig. 1 (B)~
The left part of 11g) via first end (the second conductive pattern 21a in Fig. 1 (A) of the first closing line 31 and the second conductive pattern
The left part of~21g) connection.
Specifically, the first conductive pattern 11a is connect via the first closing line 31 with the first end of the second conductive pattern 21a.
The first end of first conductive pattern 11b is connect via the first closing line 31 with the first end of the second conductive pattern 21b.First conductor
The first end of pattern 11c is connect via the first closing line 31 with the first end of the second conductive pattern 21c.First conductive pattern 11d
First end connect with the first end of the second conductive pattern 21d via the first closing line 31.The first end of first conductive pattern 11e
It is connect with the first end of the second conductive pattern 21e via the first closing line 31.The first end of first conductive pattern 11f is via first
Closing line 31 is connect with the first end of the second conductive pattern 21f.The first end of first conductive pattern 11g is via the first closing line 31
It is connect with the first end of the second conductive pattern 21g.
In addition, the first conductive pattern second end (right part of first conductive pattern 11b~11g in Fig. 1 (B), with
And the first conductive pattern 11h) via second end (the second conductor figure in Fig. 1 (A) of the second closing line 32 and the second conductive pattern
The right part of case 21a~21g) connection.
Specifically, the second end of the first conductive pattern 11b is via the second of the second closing line 32 and the second conductive pattern 21a
End connection.The second end of first conductive pattern 11c is connect via the second closing line 32 with the second end of the second conductive pattern 21b.
The second end of first conductive pattern 11d is connect via the second closing line 32 with the second conductive pattern 21c.First conductive pattern 11e
Second end connect with the second end of the second conductive pattern 21d via the second closing line 32.The second end of first conductive pattern 11f
It is connect with the second end of the second conductive pattern 21e via the second closing line 32.The second end of first conductive pattern 11g is via
Two closing lines 32 are connect with the second end of the second conductive pattern 21f.First conductive pattern 11h is via the second closing line 32 and second
The second end of conductive pattern 21g connects.
Like this, by first conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h, the second conductive pattern 21a,
21b, 21c, 21d, 21e, 21f, 21g, multiple first closing lines 31 and multiple second closing lines 32 constitute the rectangle of 6.5 circles
Spiral helicine coil.
In addition, so-called " first end of the first conductive pattern " in the utility model, indicates to connect in the first conductive pattern
The part of first closing line 31, so-called " second end of the first conductive pattern " in the utility model are indicated in the first conductor figure
Case connects the part of the second closing line 32.In addition, so-called " first end of the second conductive pattern " in the utility model, indicates
Second conductive pattern connects the part of the first closing line 31, so-called " second end of the second conductive pattern " in the utility model,
It indicates in the part of the second conductive pattern the second closing line 32 of connection.It is also same in this each embodiment afterwards.
The coil part 101 being related to according to the present embodiment, can reach following effect.
(a) in coil part 101 of the present embodiment, the first conductive pattern, the shape of first substrate 1 will be formed in
It is used as a part for coil at the second conductive pattern, the first closing line 31 and the second closing line 32 in second substrate 2.Cause
This, is attached and constitutes the feelings of coil with the both ends of closing line and the both ends of the first conductive pattern for being formed into arc-shaped
Condition is compared, and the length of each closing line (each first closing line 31 or each second closing line 32) is short.If each closing line shortens, become
It obtains not pliable.Therefore, with this configuration, while with big coil aperture, can inhibit as caused by being bent closing line
The variation of coil characteristics, and the adjacent mutual contact (short-circuit between conductors) of closing line can be inhibited.
In addition, in order to reach said effect, the X-direction of the length of preferably each first closing line than the first conductive pattern
On length X11 it is short, and the length of each second closing line is shorter than the length X11 in the X-direction of the first conductive pattern.
In this configuration, it is attached and constitutes with the both ends of closing line and the both ends of the first conductive pattern for being formed into arc-shaped
The case where coil, is compared, and the length of each closing line (the first closing line 31 or the second closing line 32) is short.Therefore, it can inhibit by engaging
The variation of coil characteristics caused by line is bent, and the adjacent mutual contact (short-circuit between conductors) of closing line can be inhibited.In addition,
Coil part is more preferably such as lower structure, that is, total length of each first closing line 31 and each second closing line 32 is than first
Length X11 in the X-direction of conductive pattern is short.
(b) the first conductive pattern and the second conductive pattern for being utilized as a part for coil are not conducting wires etc., are shape
At the conductive pattern on substrate, therefore the first adjacent conductive pattern is each other or the second adjacent conductive pattern is in contact with each other
The possibility of (short-circuit between conductors) is low.Therefore, it is possible to easily reduce mutual of the first conductive pattern arranged in the Y-axis direction
Gap, and can easily reduce the mutual gap of the second conductive pattern arranged in the Y-axis direction.Therefore, with this configuration,
Compared to the number of turns, the size (occupied area) in the Y direction of coil can be reduced.In addition, being led by selectively selecting first
The mutual gap of body pattern, the mutual gap of the second conductive pattern, even if to size (occupied area) phase in Y axis directions
Together, also it is easy to get the spiral helicine coil with desired the number of turns, desired inductance value.
(c) in addition, it is not conducting wire etc. to be utilized as the first conductive pattern of a part for coil and the second conductive pattern,
To be formed in the conductive pattern on substrate, therefore the first adjacent conductive pattern is each other or the second adjacent conductive pattern connects each other
The possibility for touching (short-circuit between conductors) is low.It therefore, in this configuration, being capable of the first conductive pattern of easily overstriking and the second conductor
The line width of pattern.Therefore, it is possible to reduce the DCR of the first conductive pattern and the second conductive pattern, conductor losses can be reduced.Separately
Outside, the line width of the first conductive pattern and the second conductive pattern being capable of selectively overstriking.
(d) in coil part 101, the length Z2 long in length X2 ratio Z axis directions in the X-direction of second substrate 2
(X2 ＞ Z2).In this configuration, because the length Z2 in the Z-direction of second substrate 2 is short, each first engagement can be shortened
The length of the length of line 31, each second closing line.In addition, because being easy the length shape in the X-direction of the second conductive pattern
Cheng get Chang, so the ratio for the conductive pattern for constituting coil can be further increased.In turn, with this configuration, coil part
Low level is possibly realized.
(e) second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g of coil part 101 is formed in the second base
The third interarea VS3 of plate 2.With this configuration, compared with the case where forming the second conductive pattern in the inside of second substrate 2, energy
Enough increase the effective coil aperture in the case of coil part 101.
(f) in coil part 101 of the present embodiment, second substrate 2 is magnetic substance.It with this configuration, can be
The coil part 101 that given inductance value is obtained in the case of coil enlargement is not made.In addition, second substrate 2 is not limited to
Generally magnetic substance.At least part that can also be second substrate 2 is magnetic substance.
(g) in addition, second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g is formed in second as magnetic substance
The third interarea VS3 of substrate 2.In this configuration, because second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g is formed
In the surface of magnetic substance (second substrate 2) and exposing, so can be while improving the inductance of coil part 101 efficiently
Magnetic flux is radiated to the outside of coil part 101.By the way that the first of the 4th interarea VS4 of second substrate 2 and first substrate 1 is led
Face connects, to which in the same manner as above-mentioned situation, first conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h is leaned on
Early work is the 4th interarea VS4 of the second substrate 2 of magnetic substance.Therefore, it is possible to while improving the inductance of coil part 101
Efficiently magnetic flux is radiated to the outside of coil part 101.
《Second embodiment》
In this second embodiment, the coil part 102 with the coil for being configured to helix tube (toroidal) shape is shown.
Fig. 2 is the vertical view for the coil part 102 that second embodiment is related to.
Relative to the coil part 101 that first embodiment is related to, be formed in first substrate 1B of coil part 102
The structure of one conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h, 11i is different.In addition, relative to coil part
101, the second substrate 2B of coil part 102 and be formed in second conductive pattern 21a, 21b of second substrate, 21c, 21d,
The structure of 21e, 21f, 21g, 21h are different.About other structures, the coil part 101 being related to first embodiment is substantive
It is upper identical.
Coil part 102 has：First substrate 1B；Second substrate 2B；It is formed in the first conductive pattern of first substrate 1B
11a、11b、11c、11d、11e、11f、11g、11h、11i；Be formed in second substrate 2B second conductive pattern 21a, 21b,
21c、21d、21e、21f、21g、21h；Multiple first closing lines 31；And multiple second closing lines 32.
First substrate 1B be with two orthogonal with X-direction while and with Y direction orthogonal two while pros
The insulating properties tablet of shape.
First conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h, 11i is formed in the first of first substrate 1B
Interarea.First conductive pattern 11a, 11i is the conductive pattern of rectangle.First conductive pattern 11b, 11c, 11d, 11e, 11f, 11g,
11h is the linear conductive pattern radially extended from the substantial middle of the first interarea of first substrate 1B.
Second substrate 2B is to form the magnetic substance tablet of the bread cast (annular shape) in hole in round center.Such as Fig. 2 institutes
Show, the outer diameter of second substrate 2B is all shorter than any side of first substrate 1B.
Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h is formed in the third master of second substrate 2B
Face.Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h is radially prolonged from the center of second substrate 2B
The linear conductive pattern stretched.
Second substrate 2B carries (adherency) in the center of the first interarea VS1 of first substrate 1.
Here, first conductive pattern 11b, 11c, 11d, 11e, 11f, 11g, 11h from the center of second substrate 2B
Length radially is shorter than the length radially from center of second substrate 2B.Therefore, even if second substrate 2B is carried
(adherency) is in the center of the first interarea of first substrate 1B, first end (the first conductive pattern in Fig. 2 of the first conductive pattern
11a and positioned at the outside of second substrate 2B first conductive pattern 11b, 11c, 11d, 11e, 11f, 11g, 11h end)
And second end (first conductive pattern 11b, 11c of the inside positioned at the hole of second substrate 2B in Fig. 2,11d, 11e, 11f,
The end of 11g, 11h and the first conductive pattern 11i) it can also expose the first interarea in first substrate 1B.
The first end of first conductive pattern via the first closing line 31 and the second conductive pattern the first end (position in Fig. 2
In the end of second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h of the peripheral side of second substrate 2B) respectively
Connection.
In addition, the second end of the first conductive pattern is via the second end of the second closing line 32 and the second conductive pattern (in Fig. 2
The inner circumferential side positioned at the hole of second substrate 2B second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g, the 21h
End) it is separately connected.
Like this, by first conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g, 11h, 11i, the second conductive pattern
21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h, multiple first closing lines 31 and multiple second closing lines 32 constitute spiral
The coil of tubulose.
Even such structure, also reach the coil part 101 being related to first embodiment similarly effect, effect
Fruit.
《Third embodiment》
In the third embodiment, the communication for the antenna assembly 201 for having as helical antenna (electric field type antenna) is shown
Terminal installation 301.
Helical antenna mentioned here is the helical antenna of normal mode type, is one kind of unipole antenna, and is electric field type
Antenna.That is, antenna assembly 201 is around by forming electric field, to radiated electromagnetic wave (electric wave).
(far field is logical for the communication that electric field type antenna is used to carry out using electromagnetic wave (electric wave) with the antenna of communication counterpart side
Letter).For example, being used in the satellite-signal in the call in portable telephone terminal, data communication, the communication of Wireless LAN, GPS
Reception etc..
Fig. 3 (A) is the stereoscopic figure for the communication terminal 301 that third embodiment is related to, and Fig. 3 (B) is to show to lead to
The magnified partial view for the antenna assembly 201 that letter terminal installation 301 has.
The number of turns of the coil of antenna assembly 201 is different from the coil part 101 that first embodiment is related to.About other knots
Structure, it is substantially the same with coil part 101.Communication terminal 301 is also equipped with RFIC elements other than antenna assembly 201
61, earth conductor 40.
First substrate 1C is the insulation for the rectangle that long side direction is consistent with Y direction and short side direction is consistent with X-direction
Mild-natured plate.First conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g is formed in the first interarea VS1 of first substrate 1C
One jiao (upper left corner in Fig. 3 (A)) near, and arrange in the Y-axis direction.First conductive pattern 11g is the conductor figure of rectangle
Case.First conductive pattern 11a, 11b, 11c, 11d, 11e, 11f is the threadiness for substantially extending and being mutually parallel in the X-axis direction
Conductive pattern.
Second substrate 2C is that the electricity for the rectangle that short side direction is consistent with X-direction and long side direction is consistent with Y direction is situated between
Matter tablet.Second substrate 2C is, for example, the sheet material that high-dielectric constant inorganic filler is filled in PPE resin bases.Second conductor
Pattern 21a, 21b, 21c, 21d, 21e, 21f are formed in the substantially the entire area of the third interarea VS3 of second substrate 2C, and in Y
It is arranged in axis direction.Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f extends and is mutually parallel in the X-axis direction
Linear conductive pattern.
Second substrate 2C carries (adherency) in the first interarea VS1 of first substrate 1C.First conductive pattern 11a, 11b,
Length in the X-direction of 11c, 11d, 11e, 11f is longer than the length in the X-direction of second substrate 2C.It therefore, even if will
Second substrate 2C carries (adherency) near one jiao of the first interarea VS1 of first substrate 1C, the first end of the first conductive pattern
(left part of first conductive pattern 11a~11f in Fig. 3 (B)) and second end (the first conductive pattern 11b in Fig. 3 (B)
The right part of~11f and the first conductive pattern 11g) it can also expose the first interarea VS1 in first substrate 1C.
The first end of first conductive pattern is via the first end of the first closing line 31 and the second conductive pattern (in Fig. 3 (B)
Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f left part) connection.
In addition, second end (the Fig. 3 of the second end of the first conductive pattern via the second closing line 32 and the second conductive pattern
(B) right part of second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f in) connection.
Like this, by first conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g, second conductive pattern 21a, 21b,
21c, 21d, 21e, 21f, multiple first closing lines 31 and multiple second closing lines 32 constitute the line of the rectangular coil shape of 6 circles
Circle.
RFIC elements 61 are mounted on the first interarea VS1 of first substrate 1C.RFIC elements 61 are, for example, uhf band or SHF
Frequency range RFIC is the power supply circuit of the communication system of the Wireless LAN of 2.4GHz frequency ranges.
Conductor figure of one side of the input and output portion of RFIC elements 61 through the formation of the first interarea VS1 of first substrate 1C
Case 41 is connect with the second end of the first conductive pattern 11a of antenna assembly 201.In addition, the input and output portion of RFIC elements 61
Another party through the formation of the first interarea of first substrate 1C conductive pattern 42 and be formed in the first interarea of first substrate 1C
The earth conductor 40 of VS1 connects.Earth conductor 40 is, for example, the pattern of Cu foils.In addition, the first conductor figure of antenna assembly 201
Case 11g opens a way relative to RFIC elements 61.
In the present embodiment, antenna assembly 201 is functioned as the radiating element of helical antenna.That is, it is traditional thread binding
The coil for setting the electrical length of the 201 1/4 wavelength degree with frequency of use or more, has so as to realize as unipole antenna
A kind of helical antenna antenna assembly 201.Be formed as helical form by coil, so as to constitute antenna assembly 201
It obtains small.
In addition, though in the present embodiment, showing that communication terminal 301 has as helical antenna (electric field type
Antenna) radiating element and the configuration example of antenna assembly 201 that functions, but it's not limited to that.Communication terminal
It can also be the structure for having the coil part 101 functioned as inductor element.
Although in addition, in the present embodiment, showing that the input and output portion in RFIC elements 61 connects antenna assembly 201
And earth conductor 40 and be unipole antenna type helical antenna (electric field type antenna) antenna assembly example, but not
It is defined in this.Two antenna assemblies 201 can also be connected in the input and output portion of RFIC elements 61, constitute so-called dipole antenna
The helical antenna (electric field type antenna) of type.
《4th embodiment》
In the fourth embodiment, the communication for the antenna assembly 202 for having as loaded antenna (electric field type antenna) is shown
Terminal installation 302.Fig. 4 is the stereoscopic figure for the communication terminal 302 that the 4th embodiment is related to.
Relative to the communication terminal 301 that third embodiment is related to, the first substrate 1D's of communication terminal 302
Flat shape is different.In addition, in communication terminal 302, the plane for the first conductive pattern 11g that antenna assembly 202 has
Shape is different from the antenna assembly 201 of communication terminal 301.It is substantial with communication terminal 301 about other structures
It is identical.
Communication terminal 302 has antenna assembly 202, RFIC elements 61, the first interarea for being formed in first substrate 1D
The earth conductor 40 of VS1.
First substrate 1D is compared with the first substrate 1C of third embodiment in long side direction (Y axis directions) enterprising one
Walk the insulating properties tablet of the rectangle extended.First conductive pattern 11g is the linear conductive pattern extended in the Y-axis direction.
The antenna assembly 202 of present embodiment has：The coil of rectangular coil shape；And the line being connect with the front end of coil
The conductive pattern (the first conductive pattern 11g) of shape.With this configuration, antenna assembly 202 is used as so-called loaded antenna (electric field type
Antenna) and function.
《5th embodiment》
In the 5th embodiment, show that the Wireless IC device 401 for having antenna assembly 203, antenna assembly 203 are conducts
A kind of coil antenna (field type antenna) of small loop aerial.Wireless IC device 401 of the present embodiment is, for example,
Card-type information medium.
So-called " card-type information medium " in the utility model, be have the card-type device of above-mentioned coil part, such as
Be SD (registered trademark) storage card, SIM (registered trademark) card (include user identity module card (Subscriber Identity
Module Card), mini-SIM, micro-SIM, nano-SIM) etc. flash cards etc..
It is so-called " field type antenna " in each embodiment shown afterwards, it is the antenna for radiating magnetic flux.
Field type antenna is (close using the wireless near field communication of magnetic coupling for being carried out with the antenna of communication counterpart side
Communication) antenna, such as the communication that is used in NFC (Near field communication, near-field communication) etc..
Fig. 5 (A) is the stereoscopic figure for the Wireless IC device 401 that the 5th embodiment is related to, and Fig. 5 (B) is wireless IC device
The circuit diagram of part 401.In addition, in Fig. 5 (B), antenna assembly 203 is illustrated as coil antenna ANT.
The communication terminal 301 that Wireless IC device 401 and third embodiment are related to the difference lies in that having antenna
Device 203, RFIC elements 62, chip capacitor 63.In addition, the difference of wireless IC device 401 and communication terminal 301
It is do not have earth conductor 40.The structure of antenna assembly 203 and antenna assembly 201 are substantially the same.
In the first interarea VS1 of first substrate 1E, other than the first conductive pattern of antenna assembly 203, is also formed and led
Body pattern 43,44,45,46, electrode 51,52 and power supply terminal 53,54.These conductive patterns 43,44,45,46, electrode 51,
52 and power supply terminal 53,54 be, for example, Cu foils pattern.
As shown in Fig. 5 (A), the first conductive pattern 11a is connect via conductive pattern 44 with electrode 51, and electrode 51 is via conductor
Pattern 46 is connect with power supply terminal 54.That is, the first conductive pattern 11a is via conductive pattern 44, electrode 51 and conductive pattern 46
It is connect with power supply terminal 54.In addition, the first conductive pattern 11g is connect via conductive pattern 43 with electrode 52, electrode 52 is via leading
Body pattern 45 is connect with power supply terminal 53.That is, the first conductive pattern 11g is via conductive pattern 43, electrode 52 and conductive pattern
45 connect with power supply terminal 53.
In power supply terminal 53,54, (installation) RFIC elements 62 are connected via closing line 33.As shown in Fig. 5 (A), RFIC members
Part 62 is equipped on the first interarea VS1 of first substrate 1E.RFIC elements 62 are, for example, the RFIC chip for encapsulating RFID tag
The element of (bare chip), but can also be the RFIC of naked core sheet.
In addition, in first substrate 1E, RFIC elements 62 are not only installed, chip capacitor 63 is also installed.Chip capacitor 63
Via the conductive bonding materials such as solder connection (installation) in electrode 51,52.Chip capacitor 63 is, for example, laminated ceramic piece
Formula component.
As shown in Fig. 5 (B), with this configuration, above-mentioned coil antenna ANT is connected in RFIC elements 62, to coil antenna
ANT is connected in parallel chip capacitor 63.By the capacitance inside coil antenna ANT, chip capacitor 63 and RFIC elements 62 point
Amount constitutes LC resonance circuit.The capacitance of chip capacitor 63 is chosen to be, and the resonant frequency of above-mentioned LC resonance circuit becomes and RFID
The frequency (such as 13.56MHz) that the communication frequency of system is substantially equal.Chip capacitor 63 can also be arranged multiple.
In the present embodiment, the coil of antenna assembly 203 is short enough compared with wavelength (for example, 1/4 wave of frequency of use
It is long following), therefore antenna assembly 203 plays work(as a kind of coil antenna (field type antenna) for being small loop aerial
Energy.In addition, the second substrate 2C of present embodiment is for example preferably magnetic substance ferrite-plate.
Alternatively, it is also possible to the input and output portion of RFIC elements 62 and power supply terminal 53,54 be carried out via closing line 33
The process of connection is carried out at the same time with following process：Via the first closing line 31 by the first end of the first conductive pattern and the second conductor
The process that the first end of pattern is attached；And the second end of first conductive pattern and second are led via the second closing line 32
The process that the second end of body pattern is attached.By with by wire bonding by the first conductive pattern of coil part and second
The process that conductive pattern is attached be carried out at the same time by wire bonding by be installed on first substrate 1E component (electronic unit,
Element) process that is attached, so as to cut down operation quantity.
In addition, though in the present embodiment, showing Wireless IC device 401 as " card-type information medium " (by nothing
Line IC devices 401 are formed as card-type) example, but be not limited to the structure." the card-type information medium " of the utility model
It can also be the structure for individually having Wireless IC device and antenna assembly.
In addition, " the card-type information medium " of the utility model be not limited to have it is traditional thread binding as the day of field type antenna
Set the Wireless IC device of (coil antenna)." the card-type information medium " of the utility model can also be to have as inductor element
And the structure of the coil part functioned.
《Sixth embodiment》
Fig. 6 (A) is the vertical view for the Wireless IC device 402 that sixth embodiment is related to, and Fig. 6 (B) is the A- in Fig. 6 (A)
A sectional views.Fig. 7 (A) is the vertical view for the first substrate 1F that Wireless IC device 402 has, and Fig. 7 (B) is that the B-B in Fig. 7 (A) is cutd open
View.Fig. 8 (A) is the vertical view for the second substrate 2F that Wireless IC device 402 has, and Fig. 8 (B) is the C-C section views in Fig. 8 (A)
Figure.Wireless IC device 402 of the present embodiment is, for example, the Wireless IC tag for being used in food, toy etc..
The Wireless IC device 401 that Wireless IC device 402 and the 5th embodiment are related to the difference lies in that not having chip
Capacitor 63, and have resin component 71,72.In addition, Wireless IC device 402 and Wireless IC device 401 the difference lies in that
The construction of coil antenna (field type antenna), and have RFIC elements 62 in the inside of coil antenna (field type antenna).It closes
It is substantially the same with Wireless IC device 401 in other structures.
Wireless IC device 402 has coil antenna (explained later), RFIC elements 62, resin component 72.Above-mentioned day is traditional thread binding
It sets and has：First substrate 1F；Second substrate 2F；Be formed in first conductive pattern 11a, 11b of first substrate 1F, 11c, 11d,
11e、11f；It is formed in second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g of second substrate 2F；Multiple first connect
Zygonema 31；And multiple second closing lines 32.
First substrate 1F is the insulation for the rectangle that long side direction is consistent with Y direction and short side direction is consistent with X-direction
Mild-natured plate has the first interarea VS1 and the second interarea VS2.
First conductive pattern 11a, 11b, 11c, 11d, 11e, 11f is formed in the first interarea VS1 of first substrate 1F, and
It is arranged in Y direction.First conductive pattern 11a, 11b, 11c, 11d, 11e, 11f is substantial extension and phase in the X-axis direction
Mutually substantially parallel linear conductive pattern.
The other end (right part of the first conductive pattern 11c in Fig. 7 (A)) of first conductive pattern 11c and first
The one end (left part of the first conductive pattern 11d in Fig. 7 (A)) of conductive pattern 11d engages material via electric conductivity such as solders
Material is connect with RFIC elements 62.RFIC elements 62 carry (installation) in the center of the first interarea VS1 of first substrate 1F.
Resin component 71 carries (adherency) in the center of the first interarea VS1 of first substrate 1F.From Z-direction
The area of resin component 71 is more than the area of the RFIC elements 62 from Z-direction.In addition, the Z-direction of resin component 71
On length (thickness) be more than RFIC elements 62 Z-direction on length (thickness).Therefore, by taking resin component 71
(installation) is carried in the center of the first interarea VS1 of first substrate 1F, to which RFIC elements 62 are embedded in resin component 71.Separately
Outside, in the present embodiment, the flat shape of resin component 71 is and second substrate 2F same shapes.
Second substrate 2F is the magnetism for the rectangle that long side direction is consistent with Y direction and short side direction is consistent with X-direction
Body tablet has third interarea VS3 and the 4th interarea VS4.
Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f is formed in the third interarea VS3 of second substrate 2F, and
It is arranged in Y direction.Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f is to extend and be mutually parallel in the X-axis direction
Linear conductive pattern.Second conductive pattern 21g is formed in the 4th interarea VS4 of second substrate 2F, is from one jiao of (Fig. 8 (A)
In second substrate 2F the upper left corner) towards another angle (lower right corner of the second substrate 2F in Fig. 8 (A)) extend conductor figure
Case.The one end (the upper left end of the second conductive pattern 21g in Fig. 8 (A)) of second conductive pattern 21g is led via interlayer connection
Body is connect with the one end (left part of the second conductive pattern 21f in Fig. 8 (A)) of the second conductive pattern 21f.Second conductor
The other end (the bottom right end of the second conductive pattern 21g in Fig. 8 (A)) of pattern 21g is via interlayer connection conductor and second
The other end (right part of the second conductive pattern 21a in Fig. 8 (A)) of conductive pattern 21a connects.
The 4th interarea VS4 of second substrate 2F carries (adherency) in resin component 71.Therefore, as shown in Fig. 6 (B), second
The 4th interarea VS4 of substrate 2F, which matches, is set as opposed with the first interarea of first substrate 1F.
Here, the length X11 in the X-direction of first conductive pattern 11a, 11b, 11e, 11f is than resin component 71 (
Two substrate 2F) X-direction on length X71 (X2) long (X11 ＞ X71).Therefore, even if by 71 (second substrate of resin component
(adherency) 2F) is carried in the center of the first interarea VS1 of first substrate 1F, the first end of the first conductive pattern is (in Fig. 7 (A)
The left part of first conductive pattern 11a, 11b, 11c, 11e, 11f) and second end (the first conductive pattern in Fig. 7 (A)
The right part of 11a, 11b, 11d, 11e, 11f) it can also expose the first interarea VS1 in first substrate 1F.
The first end of first conductive pattern is via the first end of the first closing line 31 and the second conductive pattern (in Fig. 8 (A)
Second conductive pattern 21a, 21b, 21c, 21d, 21e left part) connection.
In addition, second end (the Fig. 8 of the second end of the first conductive pattern via the second closing line 32 and the second conductive pattern
(A) right part of second conductive pattern 21b, 21c, 21d, 21e, 21f in) connection.
Like this, by first conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, second conductive pattern 21a, 21b, 21c,
21d, 21e, 21f, 21g, multiple first closing lines 31 and multiple second closing lines 32 constitute the coil antenna of rectangular coil shape
(field type antenna).Moreover, RFIC elements 62 are configured in the inside of above-mentioned coil antenna (field type antenna), and it is embedded in tree
Fat component 71.
Resin component 72 carries (adherency) in the entire surface of the first interarea VS1 of first substrate 1F.Resin component 72 is put down
Face shape be and first substrate 1F same shapes.In addition, the length (thickness) in the Z-direction of resin component 72 is more than
The Z of above-mentioned coil antenna (being added together resin component 71, second substrate 2F, the first closing line 31 and the second closing line 32)
Length (thickness) in axis direction.Therefore, by the way that resin component 72 is carried (installation) in the first interarea of first substrate 1F
The entire surface of VS1, to which above-mentioned coil antenna is embedded in resin component 72.
With this configuration, it can realize have the wireless IC device of the antenna assembly (coil antenna) as field type antenna
Part 402.
In addition, according to the present embodiment, achieving the effect that as follows.
(a) the first interarea VS1 of the first substrate 1F of installation RFIC elements 62 is the volume with antenna assembly (coil antenna)
The direction parallel around axis (Y-axis), therefore harmful effect (malfunction of the magnetic field of antenna assembly (coil antenna) to RFIC elements 62
Work, unstable action etc.) it is small.In turn, the noise generated from the digital circuit portion of RFIC elements 62 is to antenna assembly (coil day
Line) harmful effect (decline of receiving sensitivity sends signal around to receiving circuit etc.) it is small.
(b) because RFIC elements 62 are configured in the inside of antenna assembly (coil antenna), Wireless IC device is whole
It is firm.Do not expose to the foreign side of Wireless IC device 402 for RFIC elements 62 in particular, can be easily configured, therefore
The defencive functions of RFIC elements 62 improves, and can avoid due to by RFIC elements 62 be mounted in it is external and caused by enlargement.
(c) RFIC elements 62, first conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, the second conductive pattern 21a,
21b, 21c, 21d, 21e, 21f, 21g, multiple first closing lines 31 and multiple second closing lines 32 are by resin component 71,72
It is protected, therefore Wireless IC device is integrally firm.In particular, the Wireless IC device is embedded in resin forming article
When, above-mentioned mounting portion can be protected to the resin (such as 300 DEG C or more high-temperature resin) of the high temperature flowed in ejection formation
The solder-joint parts of part (RFIC elements 62) etc. point.
(d) configuration such as RFIC elements 62 is by first conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, the second conductor
The area that pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g, multiple first closing lines 31 and multiple second closing lines 32 surround
Domain, and surrounded by resin component 71 and first substrate 1F.Therefore, it is not easy in installing component (RFIC elements 62) and power supply terminal
Coupling part, installing component (RFIC elements 62) between (first conductive pattern 11c, 11d) apply big thermic load.
In addition, though in the present embodiment, showing and being configured with RFIC members on the inside of antenna assembly (coil antenna)
The Wireless IC device of part 62, but it is not limited to the structure.It can also be by the chip capacitor for constituting LC resonance circuit
Equal installing components configuration is in the inside of antenna assembly (coil antenna).
Although in the present embodiment, showing that resin component 72 carries (adherency) in the first interarea of first substrate 1F
The example of the entire surface of VS1, but it is not limited to the structure.Resin component 72 can also carry (adherency) in first substrate
A part of the first interarea VS1 of 1F.In addition, shape, thickness etc. about resin component 72, also can suitably be become
More.But as shown in the first embodiment, in the present invention, resin component 72 is not required in that.
《7th embodiment》
Fig. 9 (A) is the vertical view for the Wireless IC device 403 that the 7th embodiment is related to, and Fig. 9 (B) is the D- in Fig. 9 (A)
D sectional views.Figure 10 (A) is the vertical view for the first substrate 1G that Wireless IC device 403 has, and Figure 10 (B) is the E- in Figure 10 (A)
E sectional views.Figure 11 (A) is the vertical view for the second substrate 2G that Wireless IC device 403 has, and Figure 11 (B) is in Figure 11 (A)
F-F sectional views.Wireless IC device 403 of the present embodiment is, for example, the Wireless IC tag for being used in food, toy etc..
In Wireless IC device 403, structure and the sixth embodiment of the first conductive pattern and the second conductive pattern relate to
And Wireless IC device 402 it is different.It is substantially the same with Wireless IC device 402 about other structures.
The antenna assembly of present embodiment has：First substrate 1G；Second substrate 2G；It is formed in the first of first substrate 1G
Conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g, 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h, 13a, 13b,
13c、13d、13e、13f、 13g、13h；Be formed in second conductive pattern 21a, 21b of second substrate 2G, 21c, 21d, 21e,
21f、21g、21h；Multiple first closing lines 31；And multiple second closing lines 32.
First conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g is formed in the second interarea of first substrate 1G
VS2, and arrange in the Y-axis direction.First conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g is substantially in X-axis side
The linear conductive pattern for upwardly extending and being mutually parallel.
First conductive pattern 12a, 12b, 12c, 12d, 12e, 12f, 12g, 12h is formed in the first interarea of first substrate 1G
One side (left side of the first substrate 1G in Figure 10 (A)) side of VS1, and arrange in the Y-axis direction.First conductive pattern 12a,
12b, 12c, 12d, 12e, 12f, 12g are the conductive patterns of ellipse.First conductive pattern 12h is from the one of first substrate 1G
Prolong towards another angle (lower right corner of the first substrate 1G in Figure 10 (A)) at angle (upper left corner of the first substrate 1G in Figure 10 (A))
The linear conductive pattern stretched.
First conductive pattern 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h is formed in the first interarea of first substrate 1G
Another side (the right of the first substrate 1G in Figure 10 (A)) side of VS1, and arrange in the Y-axis direction.First conductive pattern
13b, 13c, 13d, 13e, 13f, 13g, 13h are the conductive patterns of ellipse.First conductive pattern 13a is from first substrate 1G
Another angle towards one jiao of extension linear conductive pattern.
One end (the left end of first conductive pattern 11a~11g in Figure 10 (A) of first conductive pattern 11a~11g
Portion) it is separately connected via interlayer connection conductor and first conductive pattern 12a, 12b, 12c, 12d, 12e, 12f, 12g.First leads
The other end (right part of first conductive pattern 11a~11g in Figure 10 (A)) of body pattern 11a~11g is connected via interlayer
Conductor is separately connected with first conductive pattern 13b, 13c, 13d, 13e, 13f, 13g, 13h.First conductive pattern 12h's is another
One end (Figure 10 of end (the bottom right end of the first conductive pattern 12h in Figure 10 (A)) and the first conductive pattern 13a
(A) the upper left end of the first conductive pattern 13a in) it is connect with RFIC elements 62 via conductive bonding materials such as solders.
RFIC elements 62 carry (installation) in the center of the first interarea VS1 of first substrate 1G.
As shown in Fig. 9 (A) and Fig. 9 (B), by the way that resin component 71 is carried (installation) in the first of first substrate 1G
The center of interarea VS1, to which RFIC elements 62 are embedded in resin component 71.In addition, in the present embodiment, from Z-direction
The area of the resin component 71 of observation is less than the area of the second substrate 2G from Z-direction.
Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h is formed in the third interarea of second substrate 2G
VS3, and arrange in the Y-axis direction.Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h is in X-direction
Upper extension and the linear conductive pattern being mutually parallel.
The 4th interarea VS4 of second substrate 2G carries (adherency) in resin component 71.Therefore, such as Fig. 9 (B) and Figure 11
(B) shown in, the 4th interarea VS4 of second substrate 2G, which matches, is set as opposed with the first interarea of first substrate 1G.
Here, being formed in the first conductive pattern (11a~11g, 12a~12h, 13a~13h and the layer of first substrate 1G
Between connect conductor) X-direction on length X11 than the length X71 in the X-direction of resin component 71 (second substrate 2G)
(X2) long (X11 ＞ X71).Therefore, even if resin component 71 (second substrate 2G) is carried (adherency) in the of first substrate 1G
The center of one interarea VS1, first end (first conductive pattern 12a~12g, the Yi Ji in Figure 10 (A) of the first conductive pattern
The upper left end of one conductive pattern 12h) and second end (the bottom right end of the first conductive pattern 13a in Figure 10 (A) and
First conductive pattern 13b~13h) it can also expose the first interarea VS1 in first substrate 1G.
The first end of first conductive pattern is via the first end of the first closing line 31 and the second conductive pattern (in Figure 11 (A)
Second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h left part) connection.
In addition, second end (the Figure 11 of the second end of the first conductive pattern via the second closing line 32 and the second conductive pattern
(A) right part of second conductive pattern 21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h in) connection.
Like this, by first conductive pattern 11a, 11b, 11c, 11d, 11e, 11f, 11g, 12a, 12b, 12c, 12d,
12e, 12f, 12g, 12h, 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h, interlayer connection conductor, the second conductive pattern
21a, 21b, 21c, 21d, 21e, 21f, 21g, 21h, multiple first closing lines 31 and multiple second closing lines 32 constitute rectangle
Spiral helicine coil antenna (field type antenna).Moreover, the configuration of RFIC elements 62 is in above-mentioned coil antenna (field type antenna)
Inside, and it is embedded in resin component 71.
Resin component 72 carries (adherency) in the entire surface of the first interarea VS1 of first substrate 1G.Resin component 72 is put down
Face shape is and first substrate 1G same shapes.In addition, the length (thickness) in the Z-direction of resin component 72 is more than
The Z of above-mentioned coil antenna (being added together resin component 71, second substrate 2G, the first closing line 31 and the second closing line 32)
Length (thickness) in axis direction.Therefore, by the way that resin component 72 is carried (installation) in the first interarea of first substrate 1G
The entire surface of VS1, to which above-mentioned coil antenna (antenna assembly) is embedded in resin component 72.
With this configuration, it can realize have the Wireless IC device of the antenna assembly as coil antenna (field type antenna)
403。
In addition, in Wireless IC device 403 of the present embodiment, the first conductive pattern for extending in the X-axis direction
11a, 11b, 11c, 11d, 11e, 11f, 11g are formed in the second interarea VS2 of first substrate 1G.With this configuration, with first
The case where inside of substrate 1G, the first interarea VS1 form the first conductive pattern is compared, and capable of increasing coil antenna, (it is traditional thread binding
Set) effective coil aperture.
In addition, as shown in the embodiment, resin component 71 positioned at first substrate 1G and second substrate 2G between is put down
Face shape needs not be and second substrate 2G same shapes.Shape, thickness etc. about resin component 71, can be suitably
It changes.But as shown in the first embodiment, in the present invention, resin component 71 is not required.
《8th embodiment》
In the 8th embodiment, the card-type information medium (nothing for having shell 81 and the inside for being contained in shell 81 is shown
Line IC devices 402) electronic equipment 501.Figure 12 is the vertical view for the electronic equipment 501 that the 8th embodiment is related to.
" electronic equipment " in the utility model be the device for having shell and above-mentioned coil part, have shell and on
The device for the electric field type antenna stated, has shell and above-mentioned field type at the device for having shell and above-mentioned field type antenna
The device of antenna and electric field type antenna or the device etc. for having shell and above-mentioned Wireless IC device.Electronic equipment is, for example,
Portable telephone terminal, so-called smart phone, tablet computer terminal, PDA, notebook PC, wearable terminal (so-called intelligence
Wrist-watch, intelligent glasses etc.).
Electronic equipment 501 has the shell 81 of rectangular-shape, the wireless IC device 402 as card-type information medium.The nothing
Line IC devices 402 are identical as the Wireless IC device shown in the 5th embodiment.
Shell 81 has display 82, button portion 83 and speaker section 84.It is inserted in addition, shell 81 has inside it
Slot 86 and receiving portion 85.Wireless IC device 402 is inserted into the slot 86 of shell 81 and is contained in receiving portion 85.That is, wireless IC
Device 402 is contained in shell 81.
Like this, even not having wireless near field communication (NFC：Near Field Communication) system
Equipment, by having Wireless IC device (card-type information medium), the electronics that can also constitute corresponding to wireless near field communication is set
It is standby.
It is the wireless IC device as card-type information medium in addition, though in electronic equipment 501 of the present embodiment
Part 402 is inserted into the slot 86 of shell 81 and is contained in the structure of receiving portion 85, but is not limited to the structure.Slot 86 with
And receiving portion 85 is not required in that structure.Wireless IC device 402 needs not be card-type information medium, can also be Wireless IC device
402 are merely contained in the structure of the inside of shell 81.In addition it is also possible to be Wireless IC device 402 via electrode etc. and electronics
The structure of the internal circuit connection of equipment 501.
Although in electronic equipment 501 of the present embodiment, the inner containment wireless IC device in shell 81 is shown
The structure of part 402, but it is not limited to the structure.Can also be shell 81 inner containment as inductor element and
The structure of the coil part functioned.In addition it is also possible to be the structure in the inner containment antenna assembly of shell 81.In this way,
It can realize any one of the coil part for having the utility model, antenna assembly, Wireless IC device or card-type information medium
Electronic equipment.
In addition, though in the present embodiment, show that the shell 81 of electronic equipment 501 is the example of rectangular-shape, but
It is to be not limited to the structure.As long as can shell be contained in above-mentioned coil part (antenna assembly, Wireless IC device)
Inside, then the shape of shell (electronic equipment) can suitably change.
《Other embodiment》
Although in the above-described embodiment, showing that first substrate and second substrate are the flat of rectangular or square etc.
The example of plate, but it's not limited to that.The flat shape of first substrate and second substrate can also be polygon, L-shaped,
It is T-shaped, round, oval etc., it can suitably change.In addition, first substrate and second substrate are not limited to tablet,
In the range of having the function that the utility model, effect, additionally it is possible to be set as D structure etc..In addition, first substrate and
The interarea (the first interarea VS1, the second interarea VS2, third interarea VS3 and the 4th interarea VS4) of two substrates is not limited to put down
Face can also be curved surface etc..
Although in the above-described embodiment, showing the length Y1 in the Y direction of first substrate than second substrate
The structure (Y1 ＞ Y2) of length Y2 long in Y direction, but it's not limited to that.As long as in the X-direction of first substrate
Length X1 is than the length X2 long (X1 ＞ X2) in the X-direction of second substrate, then the length Y1 in the Y direction of first substrate
It can be shorter (Y1 ＜ Y2) than the length Y2 in the Y direction of second substrate.
In addition, though in the 5th above-mentioned embodiment to the 8th embodiment, mainly to magnetic coupling is utilized
Antenna assembly and electronic equipment in the communication system of NFC etc. are illustrated, but the 5th above-mentioned embodiment is to
The antenna assembly and electronic equipment that eight embodiments are related to can also be similarly used for that the contactless of magnetic coupling is utilized
Electrical power transmission system (electromagnetic induction method, magnetic resonance mode).For example, above-mentioned the 5th embodiment to the 8th embodiment
The antenna assembly being related to can be total to as the magnetic field of the frequency usage in HF frequency ranges (especially near 6.78MHz or 6.78MHz)
The power receiving antenna of power receiving device, the power transmission antenna of power transmitting device of the non-contact electric power Transmission system for mode of shaking are applied.
In this case, antenna assembly is also functioned as power receiving antenna or power transmission antenna device.Coil in antenna assembly
Both ends are connected with the power receiving circuit or power delivery circuit operated (near HF frequency ranges, especially 6.78MHz) to service band.
In power receiving circuit, for example, comprising for will the power supply from power receiving antenna to load (secondary cell etc.) matching electricity
Road, smooth circuit and DC/DC converters etc..Power receiving circuit cascade Connection is between power receiving antenna and load.In addition, transmitting electricity
In circuit, such as include the rectification circuit for being supplied electric power from source power supply to power transmission antenna, smooth circuit and as DC/
AC inverters and the switching circuit etc. functioned.Power delivery circuit cascade Connection is between source power supply and power transmission antenna.
Reference sign
ANT：Coil antenna；
VS1：First interarea of first substrate；
VS2：Second interarea of first substrate；
VS3：The third interarea of second substrate；
VS4：4th interarea of second substrate；
X1：Length in the X-direction of first substrate；
X2：Length in the X-direction of second substrate；
X11：Length in the X-direction of first conductive pattern；
X71：Length in the X-direction of resin component 71；
Y1：Length in the Y direction of first substrate；
Y2：Length in the Y direction of second substrate；
Z2：Length in the Z-direction of second substrate；
1、1B、1C、1D、1E、1F、1G：First substrate；
2、2B、2C、2F、2G：Second substrate；
11a、11b、11b、11c、11d、11e、11f、11g、11h、11i、12a、12b、 12c、12d、12e、12f、12g、
12h、13a、13b、13c、13d、13e、13f、13g、 13h：First conductive pattern；
21a、21b、21c、21d、21e、21f、21g、21h：Second conductive pattern；
31：First closing line；
32：Second closing line；
33：Closing line；
40：Earth conductor；
41、42、43、44、45、46：Conductive pattern；
51、52：Electrode；
53、54：Power supply terminal；
61、62：RFIC elements；
63：Chip capacitor；
71、72：Resin component；
81：Shell；
82：Display；
83：Button portion；
84：Speaker section；
85：Receiving portion；
86：Slot；
101、102：Coil part；
201、202：Antenna assembly；
401：Wireless IC device；
402、403：Wireless IC device (card-type information medium)；
501：Electronic equipment.
Claims (9)
1. a kind of antenna assembly, which is characterized in that have：
The first substrate of insulating properties has the first interarea and the second interarea；
Second substrate has third interarea and the 4th interarea, and opposed with first interarea with the 4th interarea is set as；
First conductive pattern is formed in the first substrate；
Second conductive pattern is formed in the second substrate；And
Interlayer connection conductor,
The first end of first conductive pattern is at least via the interlayer connection conductor and the first of second conductive pattern
End connection,
The second end of first conductive pattern is at least via the interlayer connection conductor and the second of second conductive pattern
End connection,
It includes first conductive pattern, second conductive pattern, the interlayer connection conductor that the antenna assembly, which is constituted,
Coil.
2. antenna assembly according to claim 1, which is characterized in that
The antenna assembly is also equipped with：
First closing line, between the first end and the first end of second conductive pattern of first conductive pattern；With
And
Second closing line, between the second end and the second end of second conductive pattern of first conductive pattern.
3. antenna assembly according to claim 1, which is characterized in that
First conductive pattern is formed in the second interarea of the first substrate,
Second conductive pattern is formed in the third interarea of the second substrate,
The interlayer connection conductor is formed in the first substrate.
4. antenna assembly according to claim 1, which is characterized in that
The second substrate is dielectric,
The antenna assembly is electric field type antenna.
5. antenna assembly according to claim 1, which is characterized in that
The second substrate is magnetic substance,
The antenna assembly is field type antenna.
6. a kind of Wireless IC device, which is characterized in that have：
Antenna assembly described in claim 1；And
The RFIC elements being connect with the coil.
7. Wireless IC device according to claim 6, which is characterized in that
The RFIC elements are embedded in the resin component of setting between the first substrate and the second substrate.
8. a kind of card-type information medium, which is characterized in that have：
Antenna assembly described in claim 1.
9. a kind of card-type information medium, which is characterized in that have：
Wireless IC device described in claim 6.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-166527 | 2015-08-26 | ||
| JP2015166527 | 2015-08-26 | ||
| PCT/JP2016/072890 WO2017033698A1 (en) | 2015-08-26 | 2016-08-04 | Coil element, antenna device, card-type information medium, wireless ic device and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207909619U true CN207909619U (en) | 2018-09-25 |
Family
ID=58099941
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201690001054.2U Active CN207909619U (en) | 2015-08-26 | 2016-08-04 | Antenna assembly, card-type information medium and Wireless IC device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207909619U (en) |
| WO (1) | WO2017033698A1 (en) |
Cited By (1)
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| WO2021092995A1 (en) * | 2019-11-14 | 2021-05-20 | 广东通宇通讯股份有限公司 | Microstrip line filtering radiation oscillator, filtering radiation unit, and antenna |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6781145B2 (en) * | 2017-12-28 | 2020-11-04 | 日本発條株式会社 | Portable wireless communication device and information identification device using portable wireless communication device |
| JP2020035009A (en) * | 2018-08-27 | 2020-03-05 | キオクシア株式会社 | Semiconductor storage |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745435A (en) * | 1993-07-29 | 1995-02-14 | Kyocera Corp | Inductor structure |
| JPH11251147A (en) * | 1998-02-27 | 1999-09-17 | Omron Corp | Inductor and transformer using the same |
| JP3420122B2 (en) * | 1999-07-06 | 2003-06-23 | エヌイーシーアクセステクニカ株式会社 | Board configuration of portable radio |
| TWM366158U (en) * | 2009-04-14 | 2009-10-01 | Domintech Co Ltd | Miniature inductance |
| CN106486779A (en) * | 2012-05-09 | 2017-03-08 | 株式会社村田制作所 | Coil antenna element and Anneta module |
-
2016
- 2016-08-04 WO PCT/JP2016/072890 patent/WO2017033698A1/en active Application Filing
- 2016-08-04 CN CN201690001054.2U patent/CN207909619U/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021092995A1 (en) * | 2019-11-14 | 2021-05-20 | 广东通宇通讯股份有限公司 | Microstrip line filtering radiation oscillator, filtering radiation unit, and antenna |
| US11996612B2 (en) | 2019-11-14 | 2024-05-28 | Tongyu Communication Inc. | Microstrip line filtering radiation oscillator, filtering radiation unit, and antenna |
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