KR20200052802A - 응력 조절기를 가진 접속 회로기판 및 그의 플립 칩 조립체 - Google Patents

응력 조절기를 가진 접속 회로기판 및 그의 플립 칩 조립체 Download PDF

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Publication number
KR20200052802A
KR20200052802A KR1020190025829A KR20190025829A KR20200052802A KR 20200052802 A KR20200052802 A KR 20200052802A KR 1020190025829 A KR1020190025829 A KR 1020190025829A KR 20190025829 A KR20190025829 A KR 20190025829A KR 20200052802 A KR20200052802 A KR 20200052802A
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KR
South Korea
Prior art keywords
layer
circuit board
connection
stress
stress regulator
Prior art date
Application number
KR1020190025829A
Other languages
English (en)
Korean (ko)
Inventor
찰스 더블유. 씨. 린
치아-충 왕
Original Assignee
브릿지 세미컨덕터 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 브릿지 세미컨덕터 코포레이션 filed Critical 브릿지 세미컨덕터 코포레이션
Publication of KR20200052802A publication Critical patent/KR20200052802A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/46—Structure, shape, material or disposition of the wire connectors prior to the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
KR1020190025829A 2018-11-06 2019-03-06 응력 조절기를 가진 접속 회로기판 및 그의 플립 칩 조립체 KR20200052802A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW107139283 2018-11-06
TW107139283A TWI690253B (zh) 2018-11-06 2018-11-06 具有應力調節件之互連基板、其覆晶組體及其製作方法

Publications (1)

Publication Number Publication Date
KR20200052802A true KR20200052802A (ko) 2020-05-15

Family

ID=70679209

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190025829A KR20200052802A (ko) 2018-11-06 2019-03-06 응력 조절기를 가진 접속 회로기판 및 그의 플립 칩 조립체

Country Status (2)

Country Link
KR (1) KR20200052802A (zh)
TW (1) TWI690253B (zh)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8106504B2 (en) * 2008-09-25 2012-01-31 King Dragon International Inc. Stacking package structure with chip embedded inside and die having through silicon via and method of the same
CN106304611A (zh) * 2015-06-10 2017-01-04 宏启胜精密电子(秦皇岛)有限公司 电路板及其制造方法、应用该电路板的电子装置
JP2017050315A (ja) * 2015-08-31 2017-03-09 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
TWI611541B (zh) * 2015-09-07 2018-01-11 鈺橋半導體股份有限公司 具有內建電性隔離件以及防潮蓋之線路板製備方法及其半導體組體
JP6584939B2 (ja) * 2015-12-10 2019-10-02 新光電気工業株式会社 配線基板、半導体パッケージ、半導体装置、配線基板の製造方法及び半導体パッケージの製造方法
TWI598596B (zh) * 2016-12-05 2017-09-11 中華精測科技股份有限公司 積體電路之測試探針卡

Also Published As

Publication number Publication date
TW202019254A (zh) 2020-05-16
TWI690253B (zh) 2020-04-01

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E601 Decision to refuse application