KR20200028090A - Lens driving device and camera device - Google Patents

Abstract

The present invention relates to a lens driving device that minimizes heat loss by forming an escape groove of a c over in a part where an elastic member and a substrate are soldered. According to an embodiment of the present invention, the lens driving device comprises: a cover; a housing; a bobbin; a coil; a first magnet; a substrate; a Hall sensor; a second magnet; and a lower elastic member. The substrate includes an inner surface, an outer surface disposed opposite the inner surface and partially disposed on a side plate of the cover, and a terminal formed on the inner surface of the substrate. The coil is connected to the terminal of the substrate through the lower elastic member, and the cover forms a groove at a position corresponding to the terminal so that at least a part of the terminal of the substrate does not overlap the side plate of the cover.

Description

Lens driving device and camera device

The present embodiment relates to a lens driving device and a camera device.

The contents described below provide background information for the present embodiment, but do not describe the prior art.

As the spread of smart phones is widely generalized and wireless Internet services are commercialized, the needs of consumers related to smart phones are also diversified, and various types of additional devices are mounted on smart phones.

One of them is a camera device that photographs a subject as a photograph or video. On the other hand, in recent camera devices, an auto focus function that automatically adjusts focus according to a distance of a subject is applied.

Current supply to the coil is required for the autofocus function, and for this purpose, the substrate and the coil can be connected via an elastic member. At this time, soldering is performed between the substrate and the elastic member. When soldering is performed with a soldering iron, there is a problem that a foreign object and a solder ball splash, and when soldering is performed with hot air, heat is lost through a cover contacting the substrate. There is a problem in that cold solder is generated.

In addition, in the case of the CLAF actuator to which the integral driver is applied, it is difficult to check the AF driving characteristics while directly changing the current value flowing through the coil from the outside.

This embodiment is intended to provide a lens driving device that minimizes heat loss by forming an escape groove of a cover in a portion where the elastic member and the substrate are soldered.

In addition, the present embodiment is to provide a lens driving device for evaluating AF characteristics by exposing the terminals connected to the coil (+) terminal and the coil (-) terminal to the outside in addition to VDD, GND, SDA, and SCL required for the driver. .

A lens driving apparatus according to the present embodiment includes a cover including an upper plate and a side plate extending from the upper plate; A housing disposed in the cover; A bobbin disposed in the housing; A coil disposed on the bobbin; A first magnet disposed in the housing and facing the coil; A substrate disposed between the side surface of the housing and the side plate of the cover; A hall sensor disposed on the substrate; A second magnet disposed on the bobbin and facing the hall sensor; And a lower elastic member coupled to the lower portion of the bobbin, wherein the substrate is an inner surface, an outer surface disposed on the opposite side of the inner surface and partially disposed on the side plate of the cover, and a terminal formed on the inner surface of the substrate. Including, the coil is connected to the terminal of the substrate through the lower elastic member, the cover is at a position corresponding to the terminal so that at least a portion of the terminal of the substrate does not overlap with the side plate of the cover Grooves may be formed.

The outer surface of the substrate includes a first region disposed on the side plate of the cover, and a second region corresponding to the groove of the side plate of the cover, wherein at least a portion of the second region is the terminal of the substrate. And may overlap in a direction perpendicular to the optical axis.

The lens driving apparatus further includes a base disposed under the housing, the base includes a stepped portion formed on a side surface of the base, and a lower end of the side plate of the cover is disposed on the stepped portion, and the lower elastic member Includes a terminal portion connected to the terminal of the substrate, and the terminal portion of the lower elastic member may be disposed between the housing and the base.

The terminal portion of the lower elastic member may overlap the side plate of the cover in a direction perpendicular to the optical axis.

The lower elastic member includes an inner portion coupled with a lower portion of the bobbin, an outer portion coupled with a lower portion of the housing or an upper portion of the base, and a connecting portion connecting the inner portion and the outer portion, and the terminal portion of the lower elastic member Extending from the outer portion, the base includes a first groove formed in a position corresponding to the terminal portion of the lower elastic member on the upper surface of the base, and the housing is the terminal portion of the lower elastic member on the lower surface of the housing It may include a second groove formed in a position corresponding to.

The lower elastic member includes an extension portion extending from the terminal portion of the lower elastic member to the opposite side of the outer portion, and the extension portion may be disposed on an upper surface of the base and a lower surface of the housing.

The cover may further include a protrusion extending to a portion corresponding to the lower end of the substrate.

The lower elastic member includes first and second lower elastic units spaced apart from each other, and the coil includes a first end connected to the first lower elastic unit and a second end connected to the second lower elastic unit. Including, The terminal portion of the lower elastic member includes a first terminal formed on the first lower elastic unit and a second terminal formed on the second lower elastic unit, the terminal of the substrate is the first It may include a first terminal connected to the first terminal of the lower elastic unit, and a second terminal connected to the second terminal of the second lower elastic unit.

The hall sensor is disposed on the inner surface of the substrate, the substrate is formed on the inner surface of the substrate and includes a pad portion on which the hall sensor is mounted, the pad portion includes a plurality of pads, and photo solder on the inner surface of the substrate A photo solder resist (PSR) is disposed, and the photo solder resist may include a portion disposed between the plurality of pads.

The substrate includes a fourth terminal disposed at a lower end of the outer surface of the substrate, the fourth terminal of the substrate includes six terminals, and four of the six terminals are pad portions of the substrate And the other two of the six terminals may be connected to the terminal of the substrate.

The driver IC may further include a driver IC disposed on the substrate and electrically connected to the coil, and the hall sensor may be embedded in the driver IC.

The base includes a third groove formed at a position corresponding to the protrusion of the side plate of the cover on a side surface of the base, and the protrusion of the side plate of the cover has a first portion that becomes narrower as it goes down. , A second portion disposed under the first portion and extending obliquely inward to be disposed in the third groove of the base.

The groove of the cover may be formed at the bottom of the side plate of the cover such that at least a portion of the terminal of the substrate is disposed below the side plate of the cover.

The camera device according to the present embodiment includes a printed circuit board; An image sensor disposed on the printed circuit board; A cover including a top plate and a side plate extending from the top plate; A housing disposed in the cover; A bobbin disposed in the housing; A lens coupled to the bobbin; A coil disposed on the bobbin; A first magnet disposed in the housing and facing the coil; A substrate disposed between the side surface of the housing and the side plate of the cover; A hall sensor disposed on the substrate; A second magnet disposed on the bobbin and facing the hall sensor; And a lower elastic member coupled to the lower portion of the bobbin, wherein the substrate includes an inner surface, an outer surface disposed opposite the inner surface and disposed on the side plate of the cover, and a terminal formed on the inner surface of the substrate. , The coil is electrically connected to the terminal of the substrate through the lower elastic member, and the cover is grooved in a position corresponding to the terminal so that at least a portion of the terminal of the substrate does not overlap with the side plate of the cover. This is formed, and the cover includes a protrusion extending to a portion corresponding to the lower end of the substrate, and the protrusion of the cover can be coupled to the printed circuit board by soldering.

A lens driving apparatus according to the present embodiment includes a cover including an upper plate and a side plate extending from the upper plate; A housing disposed in the cover; A bobbin disposed in the housing; A coil disposed on the bobbin; A first magnet disposed in the housing and facing the coil; A substrate disposed between the side surface of the housing and the side plate of the cover; A hall sensor disposed on the substrate; A second magnet disposed on the bobbin and facing the hall sensor; And a lower elastic member coupled to the lower portion of the bobbin, wherein the substrate is an inner surface, an outer surface disposed on the opposite side of the inner surface and partially disposed on the side plate of the cover, and a terminal formed on the inner surface of the substrate. Including, the coil is connected to the terminal of the substrate through the lower elastic member, the cover is the terminal so that a portion of the terminal of the substrate does not overlap in the direction perpendicular to the side plate and the optical axis of the cover A groove is formed at a position corresponding to, and the lower elastic member is disposed on the upper portion of the terminal of the substrate and may overlap the side plate of the cover and a direction perpendicular to the optical axis.

Through this embodiment, even if the soldering between the substrate and the elastic member is performed with hot air, heat loss through the cover is minimized and cold soldering can be prevented.

In addition, it has an advantage that the sealing operation between the cover and the substrate is facilitated by the shape of the cover.

In addition, it is possible to determine the driving characteristics of CLAF and OLAF by exposing a separate terminal connected to the coil to the outside.

In addition, the tolerance can be reduced by using a PSR in an area excluding the terminal on the surface of the substrate, so that the tilting and pushing phenomenon after the SMT of the hall sensor can be minimized.

1 is a perspective view of a lens driving apparatus according to this embodiment.
FIG. 2 is a cross-sectional view seen from AA of FIG. 1.
3 is a cross-sectional view as viewed from BB of FIG. 1.
4 is a cross-sectional view as viewed from CC of FIG. 1.
5 is an exploded perspective view of the lens driving apparatus according to the present embodiment.
6 is a side view of the lens driving apparatus according to the present embodiment.
7 is a perspective view of FIG. 6.
8 is a plan view of a part of the lens driving apparatus according to the present embodiment.
9 is a perspective view of a part of the lens driving apparatus according to the present embodiment.
10 is a bottom perspective view of a part of the lens driving apparatus according to the modification.
11 is a perspective view of a part of the lens driving apparatus according to the modification.
12 is a photograph of a part of the inner surface of the substrate of the lens driving apparatus according to the present embodiment.
13 is a view of the substrate of the lens driving apparatus according to the present embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the technical spirit of the present invention is not limited to some embodiments described, but may be implemented in various different forms, and within the scope of the technical spirit of the present invention, one or more of its components between embodiments may be selectively selected. It can be used in combination or substitution.

In addition, terms (including technical and scientific terms) used in the embodiments of the present invention, unless clearly defined and specifically described, can be generally understood by those skilled in the art to which the present invention pertains. It can be interpreted as a meaning, and terms that are commonly used, such as predefined terms, may be interpreted by considering the contextual meaning of the related technology.

In addition, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention.

In the present specification, a singular form may also include a plural form unless specifically stated in the phrase, and is combined with A, B, C when described as "at least one (or more than one) of A and B, C". It can contain one or more of all possible combinations.

In addition, in describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only for distinguishing the component from other components, and the term is not limited to the nature, order, or order of the component.

And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, the component is directly 'connected', 'coupled', or 'connected' to the other component In addition to the case, it may also include a case of 'connected', 'coupled', or 'connected' due to another component between the component and the other components.

Further, when described as being formed or disposed in the "top (top)" or "bottom (bottom)" of each component, "top (top)" or "bottom (bottom)" means that the two components are directly in contact with each other. This includes not only the case of contact, but also the case where one or more other components are formed or disposed between two components. In addition, when expressed as "up (up)" or "down (down)", the meaning of the downward direction as well as the upward direction based on one component may be included.

The 'optical axis direction' used hereinafter is defined as the optical axis direction of the lens and / or image sensor coupled to the lens driving device. Meanwhile, the 'optical axis direction' may correspond to 'up and down direction', 'z axis direction', and the like.

The 'autofocus function' used below automatically shifts the focus on the subject by adjusting the distance from the image sensor by moving the lens in the optical axis direction according to the distance from the subject so that a clear image of the subject can be obtained on the image sensor. It is defined as a matching function. Meanwhile, 'auto focus' may be used interchangeably with 'AF (auto focus)'.

'OLAF' used hereinafter is an abbreviation of 'Open-loop auto focus' and means 'open-loop auto focus'. Meanwhile, 'CLAF' is an abbreviation of 'Closed-loop auto focus' and means 'closed loop auto focus'. That is, OLAF means auto focus not performing feedback control (feedback control), and CLAF means auto focus performing feedback control.

Hereinafter, the configuration of the optical device according to the present embodiment will be described with reference to the drawings.

Optical devices include mobile phones, cell phones, smart phones, portable communication devices, portable smart devices, digital cameras, laptop computers, digital broadcasting terminals, PDAs (Personal Digital Assistants), PMPs (Portable Multimedia Players), and It can be any one of navigation. However, the type of the optical device is not limited to this, and any device for taking an image or picture may be included in the optical device.

The optical device may include a body. The body can form the appearance of the optical device. The body can accommodate a camera device. A display unit may be disposed on one surface of the main body. For example, the display unit and the camera device may be disposed on one surface of the main body, and the camera device may be additionally disposed on the other surface of the main body (a surface positioned on the opposite side of the one surface).

The optical device may include a display unit. The display unit may be disposed on one surface of the main body. The display unit may output an image captured by the camera device.

The optical device may include a camera device. The camera device may include a camera module. The camera device can be arranged on the body. At least a portion of the camera device may be accommodated inside the body. A plurality of camera devices may be provided. The camera device may include a dual camera device. The camera device may be disposed on each side of the main body and the other side of the main body. The camera device can take an image of the subject.

Hereinafter, a configuration of the camera device according to the present embodiment will be described.

The camera device may include a lens module. The lens module may include at least one lens. The lens module may include a barrel and a plurality of lenses coupled to the inside of the barrel. The lens module may be coupled to the bobbin 310 of the lens driving device. The lens module may be coupled to the bobbin 310 by screwing and / or adhesive. The lens module may be integrally moved with the bobbin 310.

The camera device may include a filter. The filter may include an infrared filter. The infrared filter may block light from the infrared region from entering the image sensor. The infrared filter can be disposed between the lens and the image sensor. The infrared filter may be disposed on the base 500. Alternatively, the infrared filter may be disposed on a sensor base disposed between the lens driving device and the printed circuit board.

The camera device may include a printed circuit board. A lens driving device may be disposed on the printed circuit board. Alternatively, a sensor base may be disposed between the printed circuit board and the lens driving device. The printed circuit board may be electrically connected to the lens driving device. An image sensor may be disposed on the printed circuit board. The printed circuit board can be electrically connected to the image sensor.

The camera device may include an image sensor. The image sensor can be disposed on a printed circuit board. The image sensor can be electrically connected to the printed circuit board. In one example, the image sensor may be coupled to a printed circuit board by surface mounting technology (SMT). As another example, the image sensor may be coupled to a printed circuit board by flip chip technology. The image sensor may be arranged such that the lens and optical axis are aligned. That is, the optical axis of the image sensor and the optical axis of the lens may be aligned. The image sensor may convert light irradiated to the effective image area of the image sensor into an electrical signal. The image sensor may be any one of a charge coupled device (CCD), a metal oxide semi-conductor (MOS), a CPD, and a CID.

The camera device may include a controller. The controller can be arranged on the printed circuit board. The controller can control the lens driving device. However, in this embodiment, since the driver IC 700 for controlling the coil 320 is disposed inside the lens driving apparatus, a separate controller may be omitted.

Hereinafter, a configuration of the lens driving apparatus according to the present embodiment will be described with reference to the drawings.

1 is a perspective view of a lens driving apparatus according to the present embodiment, FIG. 2 is a cross-sectional view seen from AA of FIG. 1, FIG. 3 is a cross-sectional view seen from BB of FIG. 1, and FIG. 4 is a cross-sectional view seen from CC of FIG. 1 , FIG. 5 is an exploded perspective view of the lens driving device according to the present embodiment, FIG. 6 is a side view of the lens driving device according to the present embodiment, FIG. 7 is a perspective view of FIG. 6, and FIG. 8 is a lens according to the present embodiment 9 is a perspective view of a part of the lens driving device according to the present embodiment, FIG. 10 is a bottom perspective view of a part of the lens driving device according to a modification, and FIG. 11 is a modification A perspective view of a part of the lens driving apparatus according to the present invention, FIG. 12 is a photograph of a portion of the inner surface of the substrate of the lens driving apparatus according to the present embodiment, and FIG. 13 is a drawing of the substrate of the lens driving apparatus according to the present embodiment. to be.

The lens driving device may be a voice coil motor (VCM). The lens driving device may be a lens driving motor. The lens driving device may be a lens driving actuator. The lens driving device may include an AF module. Alternatively, the lens driving device may include an OIS module.

In this embodiment, the lens driving device should automatically minimize heat loss for soldering or halogen work by hot air, but the structure for solving the problem of difficulty in soldering due to the contact between the cover 100 and the substrate 600 It may include. In this embodiment, the escape groove of the cover 100 may be formed in a portion where the lower elastic member 420 and the substrate 600 are soldered to prevent heat loss.

The lens driving device may include a cover 100. The cover 100 may include a 'cover can'. The cover 100 may include a 'yoke'. The cover 100 may be disposed to surround at least a portion of the housing 210. The cover 100 may be combined with the base 500. The cover 100 can accommodate the housing 210 therein. The cover 100 may form an external appearance of the lens driving device. The cover 100 may have a hexahedral shape with a lower surface open. The cover 100 may be non-magnetic. The cover 100 may be formed of a metal material. The cover 100 may be formed of a metal plate. The cover 100 may block electromagnetic interference (EMI). At this time, the cover 100 may be referred to as an 'EMI shield can'.

The cover 100 may include a top plate 110 and a side plate 120. The cover 100 may include a top plate 110 including holes and a side plate 120 extending downward from an outer periphery or edge of the top plate 110. The top plate 110 of the cover 100 may be disposed on the bobbin 310. The lower end of the side plate 120 of the cover 100 may be disposed on the stepped portion 510 of the base 500. The inner surface of the side plate 120 of the cover 100 may be fixed to the base 500 by an adhesive.

The cover 100 may include a groove 121. The groove 121 may be formed at the bottom of the side plate 120 of the cover 100. The groove 121 may be formed at a position corresponding to the terminal 610 so that at least a portion of the terminal 610 of the substrate 600 does not overlap with the side plate 120 of the cover 100. The groove 121 may be formed at the bottom of the side plate 120 of the cover 100 so that at least a portion of the terminal 610 of the substrate 600 is disposed below the side plate 120 of the cover 100. The groove 121 may be formed so that at least a portion of the terminals 610 of the substrate 600 do not overlap the side plate 120 of the cover 100 in a direction perpendicular to the optical axis. At this time, the direction perpendicular to the optical axis may be the x-axis direction on the xyz coordinate system. That is, the groove 121 may be an escape groove for avoiding the overlap of the substrate 600 with the terminal 610. In this embodiment, heat loss is generated through the cover 100 in the soldering process between the terminal 610 of the substrate 600 and the terminal portion 424 of the lower elastic member 420 through the groove 121 of the cover 100. It can minimize the phenomenon that occurs. The reason to escape to the opposite side of the soldering surface in this embodiment is to improve soldering by allowing lead formation on the lower side. In addition, it has an advantage that the shape of the escape of the cover 100 is easier than the straight portion when sealing to suppress foreign matter penetration.

The cover 100 may include a protrusion 122. The protrusion 122 may extend from the bottom of the side plate 120 of the cover 100 to a height corresponding to the bottom of the substrate 600. In this case, the protrusion 122 may be directly coupled to the printed circuit board disposed under the base 500. The protrusion 122 may be coupled to the printed circuit board by soldering. Through this, the cover 100 may be grounded. The protruding portion 122 of the side plate 120 of the cover 100 is disposed under the first portion 122a and the first portion 122a, which narrows in width as it goes down, and extends inward as it goes down, and the base 500 ) May include a second portion 122b disposed in the third groove 530. The second portion 122b of the protrusion 122 may include an inclined surface. The protrusion 122 may be formed such that a portion is bent to have a slope with the remaining portion.

The cover 100 may include an inner yoke 130. The inner yoke 130 may extend downward from the inner periphery of the top plate 110 of the cover 100. At least a portion of the inner yoke 130 may be disposed in the second groove 312 of the bobbin 310. Through this, the inner yoke 130 may prevent the bobbin 310 from rotating.

The lens driving device may include a housing 210. The housing 210 may be disposed to surround at least a portion of the bobbin 310. The housing 210 may accommodate at least a portion of the bobbin 310 therein. The housing 210 may be disposed in the cover 100. The housing 210 may be disposed between the cover 100 and the bobbin 310. The housing 210 may be formed of a material different from the cover 100. The housing 210 may be formed of an insulating material. The housing 210 may be formed of an injection material. The outer side surface of the housing 210 may contact the inner surface of the side plate 120 of the cover 100. The first magnet 220 may be disposed in the housing 210. The housing 210 and the first magnet 220 may be combined by an adhesive. The upper elastic member 410 may be coupled to the upper or upper surface of the housing 210. A lower elastic member 420 may be coupled to the upper or lower surface of the housing 210. The housing 210 may be coupled to the elastic member 400 by heat fusion and / or adhesive. The adhesive bonding the housing 210 and the first magnet 220, and the housing 210 and the elastic member 400 may be epoxy (cured) cured by any one or more of ultraviolet (UV), heat and laser. have.

The housing 210 may include a plurality of sidewalls. The housing 210 may include four side walls. The housing 210 may include a first side wall, a second side wall disposed opposite the first side wall, and a third side wall and a fourth side wall disposed opposite each other between the first side wall and the second side wall. .

The housing 210 may include a second groove 211. The second groove 211 may be formed on the sidewall of the housing 210. The second groove 211 may be formed on the first side wall of the housing 210. The second groove 211 may be formed at a position corresponding to the terminal portion 424 on the lower surface of the housing 210. A solder ball connecting the terminal portion 424 of the lower elastic member 420 and the terminal 610 of the substrate 600 may be disposed in the second groove 211.

The housing 210 may include a first hole 212. The first hole 212 may be formed on the sidewall of the housing 210. The first hole 212 may be formed on the first side wall of the housing 210. The first hole 212 may be formed to penetrate the side wall of the housing 210 in a direction perpendicular to the optical axis. The driver IC 700 may be disposed in the first hole 212.

The housing 210 may include a second hole 213. The second hole 213 may be formed on the sidewall of the housing 210. The second hole 213 may be formed in each of the third side wall and the fourth side wall of the housing 210. The first magnet 220 may be disposed in the second hole 213. The housing 210 may include a protrusion supporting the inner surface of the first magnet 220 disposed in the second hole 213. Through this, the outer surface of the first magnet 220 disposed in the second hole 213 of the housing 210 is fixed to the inner surface of the side plate 120 of the cover 100, and the inner surface of the first magnet 220 is It is fixed to the protruding portion of the housing 210, the upper surface, the lower surface and both sides of the first magnet 220 can be fixed to the surface forming the second hole 213 of the housing 210. In this embodiment, the second hole 213 may not be formed in the first side wall and the second side wall of the housing 210.

The lens driving device may include a first magnet 220. The first magnet 220 may be disposed on the housing 210. The first magnet 220 may be fixed to the housing 210 by an adhesive. The first magnet 220 may be disposed between the bobbin 310 and the housing 210. The first magnet 220 may face the coil 320. The first magnet 220 may electromagnetically interact with the coil 320. The first magnet 220 may be disposed on the sidewall of the housing 210. The first magnet 220 may not be disposed on the first side wall and the second side wall of the housing 210. That is, the first magnet 220 may be disposed only on the third side wall and the fourth side wall of the housing 210. Through this, magnetic field interference between the first magnet 220 and the second and third magnets 810 and 820 may be minimized. The first magnet 220 may be a flat plate magnet having a flat plate shape. As a modification, the first magnet 220 may be disposed at a corner portion of the housing 210. In this case, the first magnet 220 may be a corner magnet having a hexahedral shape with an inner side wider than an outer side.

The lens driving device may include a bobbin 310. The bobbin 310 may be disposed in the housing 210. The bobbin 310 may be disposed in the hole of the housing 210. The bobbin 310 may be movably coupled to the housing 210. The bobbin 310 may move in the optical axis direction with respect to the housing 210. A lens may be coupled to the bobbin 310. The bobbin 310 may include a hole formed in the bobbin 310 in the optical axis direction. A lens may be coupled to the hole of the bobbin 310. The bobbin 310 and the lens may be combined by screwing and / or adhesive. The coil 320 may be coupled to the bobbin 310. The upper elastic member 410 may be coupled to the upper or upper surface of the bobbin 310. The lower elastic member 420 may be coupled to the lower or lower surface of the bobbin 310. The bobbin 310 may be coupled to the elastic member 400 by heat fusion and / or adhesive. The adhesive that combines the bobbin 310 and the lens, and the bobbin 310 and the elastic member 400 may be epoxy (UV), epoxy cured by any one or more of heat and laser.

The bobbin 310 may include a first groove 311. The first groove 311 may be formed on the side surface of the bobbin 310. A second magnet 810 may be disposed in the first groove 311. The first groove 311 may be formed in a shape corresponding to the second magnet 810. The bobbin 310 may include a groove on which the third magnet 820 is disposed on the opposite side of the first groove 311.

The bobbin 310 may include a second groove 312. The second groove 312 may be formed on the upper surface of the bobbin 310. At least a part of the inner yoke 130 may be disposed in the second groove 312. The inner yoke 130 disposed in the second groove 312 may prevent the bobbin 310 from rotating by causing the bobbin 310 to hang when the bobbin 310 rotates.

The lens driving device may include a coil 320. The coil 320 may be an 'AF driving coil' used for AF driving. The coil 320 may be disposed on the bobbin 310. The coil 320 may be disposed between the bobbin 310 and the housing 210. The coil 320 may be disposed on an outer lateral surface or an outer peripheral surface of the bobbin 310. The coil 320 may be directly wound on the bobbin 310. Alternatively, the coil 320 may be coupled to the bobbin 310 in a straight-wound state. The coil 320 may face the first magnet 220. The coil 320 may be disposed to face the first magnet 220. The coil 320 may electromagnetically interact with the first magnet 220. In this case, when current is supplied to the coil 320 and an electromagnetic field is formed around the coil 320, the coil 320 is first magnetized by electromagnetic interaction between the coil 320 and the first magnet 220. It can move about 220. The coil 320 may be formed of a single coil. Alternatively, the coil 320 may include a plurality of coils spaced apart from each other. The coil 320 may be electrically connected to the inner portion 421 of the lower elastic member 420 and electrically connected to the substrate 600 on which the driver IC 700 is mounted through the connection portion 423.

The coil 320 may be electrically connected to the substrate 600 through the lower elastic member 420. The coil 320 may include a pair of lead wires for supplying power. At this time, the first end (lead line) of the coil 320 may be connected to the first lower elastic unit 420a. The second end (lead line) of the coil 320 may be connected to the second lower elastic unit 420b. Also, the first and second lower elastic units 420a and 420b may be connected to the substrate 600 on which the driver IC 700 is disposed. Through this, the driver IC 700 and the coil 320 may be electrically connected. The coil 320 may be supplied with current under the control of the driver IC 700.

The lens driving device may include an elastic member 400. The elastic member 400 may be coupled to the bobbin 310 and the housing 210. The elastic member 400 may elastically support the bobbin 310. The elastic member 400 may have elasticity at least in part. The elastic member 400 may movably support the bobbin 310. The elastic member 400 may support the movement of the bobbin 310 when driving AF. At this time, the elastic member 400 may be referred to as an 'AF support member'.

The lens driving device may include an upper elastic member 410. The upper elastic member 410 may be coupled to the upper or upper surface of the bobbin 310 and the upper or upper surface of the housing 210. The upper elastic member 410 may be formed of a plate spring. The upper elastic member 410 may be integrally formed.

The upper elastic member 410 has an inner portion 411 coupled with the upper or upper surface of the bobbin 310, an outer portion 412 coupled with the upper or upper surface of the housing 210, and an inner portion 411 and the outer portion 412. It may include a connecting portion 413 for connecting.

The lens driving device may include a lower elastic member 420. The lower elastic member 420 may be coupled to the lower or lower surface of the bobbin 310 and the lower or lower surface of the housing 210. The lower elastic member 420 may be formed of a plate spring. The lower elastic member 420 may include a spring.

The lower elastic member 420 may include a plurality of lower elastic units. The lower elastic member 420 may include two lower elastic units. The lower elastic member 420 may include first to second lower elastic units 420a and 420b spaced apart from each other. The first lower elastic unit 420a is connected to the first end of the coil 320 and the first terminal 611 of the substrate 600, and the second lower elastic unit 420b is the second end of the coil 320. And the second terminal 612 of the substrate 600.

The lower elastic member 420 includes an inner portion 421 coupled with a lower or lower surface of the bobbin 310, an outer portion 422 coupled with a lower or lower surface of the housing 210, and an inner portion 421 and an outer portion 422. It may include a connecting portion 423 for connecting, a terminal portion 424 extending from the outer portion 422, and an extension portion 425 extending from the terminal portion 424 to the opposite side of the outer portion 422. At this time, the width of the portion connecting the outer portion 422 and the terminal portion 424 may be smaller than the width of the outer portion 422. This part may be referred to as an extension. Meanwhile, the width of the terminal portion 424 may be greater than the width of the outer portion 422. Furthermore, the width of the extension portion 425 may be the same as the width of the outer portion 422.

In this embodiment, the inner portion 421 of the lower elastic member 420 may be four. At this time, the lower elastic member 420 may include an inner connecting portion 427 connecting the two inner portions 421. The inner connecting portion 427 may connect the inner portion 421. Two inner connecting portions 427 may be provided to connect a total of four inner portions 421 by two. In this embodiment, the inner connection portion 427 makes the path from the portion where the coil 320 is connected to the terminal portion 424 to the parallel resistance in the lower elastic member 420, resulting in a loss of current than when there is no inner connection portion 427. Can be reduced.

The outer portion 422 may be combined with the upper or upper surface of the base 500. The outer portion 422 may be fixed between the housing 210 and the base 500. The outer portion 422 may be disposed on the upper surface of the base 500 and the lower surface of the housing 210. The outer portion 422 may contact the upper surface of the base 500 and the lower surface of the housing 210. The extension 425 may be disposed on the upper surface of the base 500 and the lower surface of the housing 210. The extension 425 may contact the upper surface of the base 500 and the lower surface of the housing 210. In this embodiment, as the extension portion 425 is fixed between the upper surface of the base 500 and the lower surface of the housing 210, it can be prevented from being broken by being broken at a portion such as the terminal portion 424. The connection portion 423 may include a leg spring.

The lower elastic member 420 may include a terminal portion 424. The terminal portion 424 may protrude from the outer portion 422. The terminal portion 424 may be connected to the terminal 610 of the substrate 600. The terminal portion 424 may be connected to the terminal 610 of the substrate 600 by soldering. In this embodiment, even if the soldering proceeds with hot air, heat loss through the cover 100 is minimized, and thus cold soldering can be prevented. The terminal unit 424 may be disposed between the housing 210 and the base 500. The terminal unit 424 may be disposed between the lower surface of the housing 210 and the upper surface of the base 500. The terminal unit 424 may be disposed at the boundary between the housing 210 and the base 500.

In this embodiment, the terminal portion 424 of the lower elastic member 420 may overlap the side plate 120 of the cover 100 in a direction perpendicular to the optical axis. At this time, the direction perpendicular to the optical axis may be the x-axis direction on the xyz coordinate system. In this case, at least a portion of the terminal 610 of the substrate 600 disposed below the terminal portion 424 may not overlap the side plate 120 of the cover 100 in a direction perpendicular to the optical axis. In the corresponding part (the part overlapping in the direction perpendicular to the optical axis), the lower end of the side plate 120 of the cover 100 is disposed higher than the lower end of the terminal 610 of the substrate 600 and the lower elastic member 420 It may be disposed lower than the terminal portion 424. Therefore, the lower end of the side plate 120 of the cover 100 in the corresponding portion may be disposed lower than the boundary between the housing 210 and the base 500. In a variant, the lower end of the side plate 120 of the cover 100 in the corresponding portion may be disposed at a height corresponding to the boundary between the housing 210 and the base 500. In addition, the lower end of the side plate 120 of the cover 100 in the corresponding portion may be disposed at a height corresponding to the terminal portion 424 of the lower elastic member 420. In this embodiment, a part of the soldering portion and the groove 121 of the cover 100 are structured to overlap so that heat loss during soldering can be minimized.

In the present embodiment, when the groove 121 of the side plate 120 of the cover 100 is deep enough not to overlap the terminal 610 of the substrate 600, the side plate 120 and the substrate of the cover 100 ( 600) may be difficult to seal. Meanwhile, in this case, since the area of the side plate 120 of the cover 100 is reduced, high-frequency noise and the like may be worsened. Therefore, it may be desirable that the groove 121 of the side plate 120 of the cover 100 overlaps a part of the terminal 610 of the substrate 600 in the horizontal direction.

The terminal portion 424 of the lower elastic member 420 may be disposed above the terminal 610 of the substrate 600. At this time, the solder ball connecting the terminal portion 424 of the lower elastic member 420 and the terminal 610 of the substrate 600 may be disposed more on the lower side than the upper side of the terminal portion 424 of the lower elastic member 420. . At this time, the depth of the first groove 520 of the base 500 accommodating the solder ball may be deeper than the depth of the second groove 211 of the housing 210. Alternatively, in a modified example, the terminal portion 424 of the lower elastic member 420 may be disposed at the center or lower portion of the terminal 610 of the substrate 600.

The lower elastic member 420 may include a hole 426. The hole 426 may be formed in the outer portion 422 of the lower elastic member 420. An adhesive may be disposed in the hole 426. The adhesive may fix the lower elastic member 420 firmly to the base 500 and the housing 210 through the hole 426.

The lens driving device may include a base 500. The base 500 may be disposed under the housing 210. The base 500 may be disposed under the bobbin 310. The base 500 may be combined with the cover 100. The base 500 may be disposed on a printed circuit board.

The base 500 may include a stepped portion 510. The stepped portion 510 may protrude from the side surface of the base 500. The stepped portion 510 may support the lower end of the side plate 120 of the cover 100. The stepped portion 510 may be formed around a side surface of the base 500. On the side of the base 500, a step portion 510 is omitted in some areas, and this part may include a fourth groove 540. The substrate 600 may be disposed in the fourth groove 540 of the base 500. The fourth groove 540 of the base 500 may be formed to a depth corresponding to the thickness of the substrate 600. The fourth groove 540 may be formed in a shape corresponding to the shape of the substrate 600.

The base 500 may include a first groove 520. The first groove 520 may be formed at a position corresponding to the terminal portion 424 on the upper surface of the base 500. The first groove 520 may be formed larger than the size of the terminal portion 424. A solder ball connecting the terminal portion 424 of the lower elastic member 420 and the terminal 610 of the substrate 600 may be disposed in the first groove 520.

The base 500 may include a third groove 530. The third groove 530 may be formed on a side of the base 500 at a position corresponding to the protrusion 122 of the side plate 120 of the cover 100. At least a portion of the protrusion 122 of the side plate 120 of the cover 100 may be accommodated in the third groove 530. A solder ball for soldering the protrusion 122 of the cover 100 and the printed circuit board may be disposed in the third groove 530.

The base 500 may include a fourth groove 540. The substrate 600 may be disposed in the fourth groove 540. The fourth groove 540 may be formed to a depth corresponding to the thickness of the substrate 600. The fourth groove 540 may be formed in a shape corresponding to the shape of the substrate 600.

The base 500 may include a projection 550. The protrusion 550 may be formed on the lower surface of the base 500. The protrusion 550 may be inserted into a groove or hole of the printed circuit board. The protrusion 550 may have a cylindrical shape. The protrusion 550 is disposed in a corresponding groove or hole in the printed circuit board to fix the base 500 to the printed circuit board.

The lens driving device may include a substrate 600. The substrate 600 may include a printed circuit board (PCB). The substrate 600 may include a flexible printed circuit board (FPCB). The substrate 600 may be disposed between the side surface of the housing 210 and the side plate 120 of the cover 100. The substrate 600 may be disposed on the side plate 120 of the cover 100. The substrate 600 may be disposed on the housing 210. The substrate 600 may be disposed on the base 500. The outer surface of the substrate 600 may contact the inner surface of the side plate 120 of the cover 100. The inner surface of the substrate 600 may contact the side surface of the housing 210 and / or the side surface of the base 500. The driver IC 700 may be disposed on the inner surface of the substrate 600. The substrate 600 ) And the cover 100 may be sealed by a sealing member.

The substrate 600 may include an inner surface and an outer surface disposed opposite the inner surface. A part of the outer surface of the substrate 600 may be disposed on the side plate 120 of the cover 100. A portion of the outer surface of the substrate 600 is in contact with the side plate 120 of the cover 100, the remaining portion of the outer surface of the substrate 600 can be spaced apart from contact with the side plate 120 of the cover 100.

The outer surface of the substrate 600 includes a first region disposed on the side plate 120 of the cover 100 and a second region corresponding to the groove 121 of the side plate 120 of the cover 100, and the second region At least a portion of the region may overlap the terminal 610 of the substrate 600 in a direction perpendicular to the optical axis.

The outer surface of the substrate 600 is a first area disposed on the side plate 120 of the cover 100, and disposed under the side plate 120 of the cover 100 to be spaced apart from the side plate 120 of the cover 100 A second area and a third area corresponding to the opposite side of the terminal 610 may be included. At this time, at least a portion of the third region may overlap the second region. That is, at least a portion of the third area may be disposed under the side plate 120 of the cover 100 to be spaced apart from the side plate 120 of the cover 100.

The substrate 600 may include a terminal 610. The terminal 610 may be formed on the inner surface of the substrate 600. The terminal 610 may be connected to the terminal portion 424 of the lower elastic member 420 by soldering. The terminal 610 may include a first terminal 611 and a second terminal 612 spaced apart from each other. Two terminals 610 may be connected to two terminals of the eight third terminals 620 coupled with the terminals of the driver IC 700, respectively. Further, the terminal 610 may be connected to two terminals of the six fourth terminals 630 coupled to the printed circuit board, respectively. In this embodiment, the terminal 610 may be connected to both the third terminal 620 and the fourth terminal 630.

The substrate 600 may include a third terminal 620. The third terminal 620 may include a pad portion. The third terminal 620 may be formed on the inner surface of the substrate 600. The third terminal 620 may be coupled to the terminal of the driver IC 700. The third terminal 620 may include a plurality of terminals. The third terminal 620 may include eight terminals. Two of the eight terminals are used for power supply (VDD, GND), the other two terminals are used for communication (SDA, SCL), and the other two terminals can be electrically connected to both ends (+,-) of the coil 320. The remaining two terminals can be used for synchronizing the driver IC 700 or for analog output of the hole. Alternatively, the third terminal 620 of the substrate 600 may include six terminals in which two terminals are used to match the sink of the driver IC 700 or for analog output of the hole. The plurality of terminals of the third terminal 620 may be a plurality of pads.

The third terminal 620 may include 3-1 to 3-8 terminals 621, 622, 623, 624, 625, 626, 627, and 628. The 3-1 terminal 621 may be used as VDD. The 3-2 terminal 622 may be used as an SDA. The 3-3 terminal 623 may be used as an SCL. The 3-4 terminal 624 may be used as GND. The 3-5 terminal 625 may be used as a (-) output terminal. The 3-6 terminal 626 may be used as a (+) output terminal. The 3-7 terminals 627 may be used as test terminals. The 3-8th terminal 628 may be used as a port terminal. The 3-5 terminal 625 and the 3-6 terminal 626 are electrically connected to the coil 320 and may be used to supply current to the coil 320. The 3-7 terminal 627 and the 3-8 terminal 628 can be used for synchronization or other measurements in a dual module. Meanwhile, SDA and SCL may be data and clock for I2C communication. VDD and GND may be power supplies for driving the driver IC 700.

The pad portion may include a plurality of pads. In this case, the photo solder resist 900 disposed on the inner surface of the substrate 600 may include a portion disposed between the plurality of pads. That is, the plurality of pad portions may not be opened entirely, and each of the plurality of pads may be individually opened by the photo solder resist 900.

The substrate 600 may include a fourth terminal 630. The fourth terminal 630 may be disposed on the lower end of the outer surface of the substrate 600. The fourth terminal 630 may include a plurality of terminals. The fourth terminal 630 may include six terminals. Four of the six terminals may be connected to the third terminal 620. The other two of the six terminals may be connected to the terminal 610. That is, the other two terminals may be directly connected to the coil 320 through the terminal 610 and the lower elastic member 420. In this embodiment, a separate terminal connected to the coil 320 is exposed to the outside to control driving characteristics in closed-loop auto focus (CLAF) and open loop auto focus (OLAF). I can judge. Of the total of six terminals of the fourth terminal 630, two terminals are used for power supply (VDD, GND), the other two terminals are used for communication (SDA, SCL), and the other two terminals are both ends of the coil 320 (+ ,-).

The fourth terminal 630 may include 4-1 to 4-6 terminals 631, 632, 633, 634, 635, and 636. The 4-1 terminal 631 may be used as VDD. The 4-2 terminal 632 may be used as an SDA. The 4-3 terminal 633 may be used as an SCL. The 4-4 terminal 634 may be used as GND. The 4-5 terminal 635 may be used as a (-) output terminal. The 4-6 terminal 636 may be used as a (+) output terminal. The 4-1 terminal 631 is connected to the 3-1 terminal 621, the 4-2 terminal 632 is connected to the 3-2 terminal 622, the 4-3 terminal 633 Is connected to the 3-3 terminal 623, the 4-4 terminal 634 is connected to the 3-4 terminal 624, the 4-5 terminal 635 is the 3-5 terminal (625) ), And the 4-6 terminal 636 may be connected to the 3-6 terminal 626.

The substrate 600 may include a fifth terminal 640. The fifth terminal 640 may be connected to a terminal of the capacitor 750. The fifth terminal 640 may be disposed spaced apart from the terminal 610 and the third terminal 620 on the inner surface of the substrate 600.

In this embodiment, the coil 320 may include a first end connected to the first lower elastic unit 420a and a second end connected to the second lower elastic unit 420b. The terminal portion 424 of the lower elastic member 420 may include a first terminal formed on the first lower elastic unit 420a and a second terminal formed on the second lower elastic unit 420b. The terminal 610 of the substrate 600 includes a first terminal 611 connected to a first terminal of the first lower elastic unit 420a, and a second terminal connected to a second terminal of the second lower elastic unit 420b. Terminal 612 may be included.

The lens driving device may include a driver IC 700. The driver IC 700 may be disposed on the inner surface of the substrate 600. The driver IC 700 may be coupled to the inner surface of the substrate 600 by soldering. The driver IC 700 may be coupled to the third terminal 620 of the substrate 600 by surface mounting technology (SMT). The driver IC 700 may be a single module in which a hall sensor and a driver IC are integrally formed. Also, it may be described that a Hall element is built in the driver IC 700. A Hall element, an electrically erasable programmable read-only memory (EEPROM), a temperature sensor, and the like may be built in the driver IC 700. Also, the driver IC 700 may include a hall sensor. Alternatively, it may be described as having a driver function built into the hall sensor.

 The driver IC 700 may include a plurality of terminals. The driver IC 700 may include a total of eight terminals. Two of the eight terminals of the driver IC 700 are used for power supply (VDD, GND), the other two terminals are used for communication (SDA, SCL), and the other two terminals are both ends of the coil 320 (+,- ) And the other two terminals can be used to match the sink or for analog output of the hole.

 The driver IC 700 may include a Hall element or a Hall sensor. The Hall element or Hall sensor may perform a sensor function for sensing a magnetic force. The hall sensor may face the second magnet 810. The hall sensor may sense the magnetic force of the second magnet 810. The hall sensor may sense the positions of the second magnet 810 and the bobbin 310 on which the second magnet 810 is disposed. The driver IC 700 may perform AF feedback control through the position of the bobbin 310 sensed by the hall sensor.

The driver IC 700 may be electrically connected to the coil 320. The driver IC 700 may apply current to the coil 320. The driver IC 700 may control the direction and amount of current applied to the coil 320. In this embodiment, the coil (+) terminal and the coil (-) terminal of the driver IC 700 may be designed to be connected to the coil 320 and electrically connected to an external printed circuit board.

The lens driving device may include a capacitor 750. The capacitor 750 may be disposed on the inner surface of the substrate 600. The capacitor 750 may be provided for normal operation of the driver IC 700. The capacitor 750 may be used to remove noise that may be generated in the driver IC 700. The capacitor 750 may be disposed at a corner side of the housing 210. In more detail, due to the thickness of the capacitor 750, the capacitor 750 may be disposed on a corner side of the housing 210 where the flesh thickness of the housing 210 can be secured.

The lens driving device may include a second magnet 810. The second magnet 810 may be a 'sensing magnet'. The second magnet 810 may be disposed on the bobbin 310. The second magnet 810 may face the hall sensor. The second magnet 810 may be detected by a hall sensor. The second magnet 810 may be disposed on the side of the bobbin 310. The second magnet 810 may be disposed inside the coil 320. The second magnet 810 may overlap the coil 320 in a direction perpendicular to the optical axis.

The lens driving device may include a third magnet 820. The third magnet 820 may be a 'compensation magnet'. The third magnet 820 may be disposed on the bobbin 310. The third magnet 820 may be disposed to achieve a magnetic force balance with the second magnet 810. The third magnet 820 may be symmetric with the second magnet 810 about the optical axis. The third magnet 820 may be disposed at a position corresponding to the second magnet 810 around the optical axis. The third magnet 820 may have a size and / or shape corresponding to the second magnet 810 around the optical axis. A second magnet 810 may be disposed on one side of the bobbin 310 and a third magnet 820 may be disposed on the other side of the bobbin 310. The third magnet 820 may be disposed on the side of the bobbin 310. The third magnet 820 may be disposed inside the coil 320. The third magnet 820 may overlap the coil 320 in a direction perpendicular to the optical axis.

The lens driving device may include a photo solder resist (PSR) 900. The photo solder resist 900 may be disposed on the inner surface of the substrate 600 in areas other than the terminal 610 and the third terminal 620. As a comparative example, when a coverlay is applied based on a ball grid array (BGA) size, when considering a coverlay error +/- 0.15mm and a coverlay bias error, the pattern passing through the center is opened and oxidized It becomes more likely. In this embodiment, by applying the PSR, the error is lowered to 70 μm, and thus it is possible to form a pattern in the center. When the coverlay is in progress, the open area is forced to widen due to the tolerance, so an increase in the open area compared to the BGA size may cause a tilt or push to one side after SMT. can do.

In this embodiment, since the error is minimized through the photo solder resist 900, it can be opened for each of the eight terminals of the third terminal 620. This should be distinguished from the structure in which eight terminals of the third terminal 620 are opened with a barrel at a time.

In this embodiment, the outer surface of the substrate 600 may be subjected to PSR (photo solder resist) and coverlay or coverlay and PSR processing to maintain the thickness. At this time, the coverlay may be formed of polyimide tape. At this time, the polyimide tape may be yellow, and the photo solder resist may be green.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may be implemented in other specific forms without changing the technical spirit or essential features of the present invention. You will understand. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

Claims (15)

A cover including a top plate and a side plate extending from the top plate;
A housing disposed in the cover;
A bobbin disposed in the housing;
A coil disposed on the bobbin;
A first magnet disposed in the housing and facing the coil;
A substrate disposed between the side surface of the housing and the side plate of the cover;
A hall sensor disposed on the substrate;
A second magnet disposed on the bobbin and facing the hall sensor; And
It includes a lower elastic member coupled to the lower portion of the bobbin,
The substrate includes an inner surface, an outer surface disposed opposite the inner surface and partially disposed on the side plate of the cover, and a terminal formed on the inner surface of the substrate,
The coil is connected to the terminal of the substrate through the lower elastic member,
The cover is a lens driving device in which a groove is formed at a position corresponding to the terminal so that at least a portion of the terminal of the substrate does not overlap the side plate of the cover. According to claim 1,
The outer surface of the substrate includes a first region disposed on the side plate of the cover, and a second region corresponding to the groove of the side plate of the cover,
At least a portion of the second region is a lens driving device overlapping the terminal and the optical axis in the direction perpendicular to the substrate. According to claim 1,
Further comprising a base disposed under the housing,
The base includes a step formed on the side of the base,
The lower end of the side plate of the cover is disposed on the step portion,
The lower elastic member includes a terminal portion connected to the terminal of the substrate,
The terminal portion of the lower elastic member is a lens driving device disposed between the housing and the base. According to claim 3,
The terminal driving part of the lower elastic member overlaps the side plate of the cover in a direction perpendicular to the optical axis. According to claim 3,
The lower elastic member includes an inner portion coupled with a lower portion of the bobbin, an outer portion coupled with a lower portion of the housing or an upper portion of the base, and a connecting portion connecting the inner portion and the outer portion,
The terminal portion of the lower elastic member extends from the outer portion,
The base includes a first groove formed in a position corresponding to the terminal portion of the lower elastic member on the upper surface of the base,
The housing is a lens driving device including a second groove formed in a position corresponding to the terminal portion of the lower elastic member on the lower surface of the housing. The method of claim 5,
The lower elastic member includes an extension portion extending from the terminal portion of the lower elastic member to the opposite side of the outer portion,
The extension is a lens driving device disposed on the upper surface of the base and the lower surface of the housing. According to claim 3,
The cover further includes a projection extending to a portion corresponding to a lower end of the substrate. According to claim 3,
The lower elastic member includes first and second lower elastic units spaced apart from each other,
The coil includes a first end connected to the first lower elastic unit and a second end connected to the second lower elastic unit,
The terminal portion of the lower elastic member includes a first terminal formed on the first lower elastic unit and a second terminal formed on the second lower elastic unit,
The terminal of the substrate includes a first terminal connected to the first terminal of the first lower elastic unit and a second driving unit comprising a second terminal connected to the second terminal of the second lower elastic unit. According to claim 1,
The hall sensor is disposed on the inner surface of the substrate,
The substrate is formed on the inner surface of the substrate and includes a pad portion on which the hall sensor is mounted,
The pad portion includes a plurality of pads,
A photo solder resist (PSR) is disposed on an inner surface of the substrate,
The photo solder resist is a lens driving device including a portion disposed between the plurality of pads. The method of claim 9,
The substrate includes a fourth terminal disposed at a lower end of the outer surface of the substrate,
The fourth terminal of the substrate includes six terminals,
Four of the six terminals are connected to the pad portion of the substrate,
The remaining two terminals of the six terminals are connected to the terminals of the substrate. According to claim 1,
Further comprising a driver IC disposed on the substrate and electrically connected to the coil,
The hall sensor is a lens driving device built in the driver IC. The method of claim 7,
The base includes a third groove formed at a position corresponding to the protrusion of the side plate of the cover on the side of the base,
The protrusion of the side plate of the cover includes a first portion that narrows in width as it goes down, and a second portion that is disposed below the first portion and extends inwardly to be disposed in the third groove of the base. Lens drive. According to claim 1,
The groove of the cover is formed at the bottom of the side plate of the cover so that at least a portion of the terminal of the substrate is disposed below the side plate of the cover. Printed circuit boards;
An image sensor disposed on the printed circuit board;
A cover including a top plate and a side plate extending from the top plate;
A housing disposed in the cover;
A bobbin disposed in the housing;
A lens coupled to the bobbin;
A coil disposed on the bobbin;
A first magnet disposed in the housing and facing the coil;
A substrate disposed between the side surface of the housing and the side plate of the cover;
A hall sensor disposed on the substrate;
A second magnet disposed on the bobbin and facing the hall sensor; And
It includes a lower elastic member coupled to the lower portion of the bobbin,
The substrate includes an inner surface, an outer surface disposed on the opposite side of the inner surface and disposed on the side plate of the cover, and a terminal formed on the inner surface of the substrate,
The coil is electrically connected to the terminal of the substrate through the lower elastic member,
In the cover, a groove is formed at a position corresponding to the terminal so that at least a portion of the terminal of the substrate does not overlap the side plate of the cover,
The cover includes a protrusion extending to a portion corresponding to the bottom of the substrate,
The protrusion of the cover is a camera device coupled to the printed circuit board by soldering. A cover including a top plate and a side plate extending from the top plate;
A housing disposed in the cover;
A bobbin disposed in the housing;
A coil disposed on the bobbin;
A first magnet disposed in the housing and facing the coil;
A substrate disposed between the side surface of the housing and the side plate of the cover;
A hall sensor disposed on the substrate;
A second magnet disposed on the bobbin and facing the hall sensor; And
It includes a lower elastic member coupled to the lower portion of the bobbin,
The substrate includes an inner surface, an outer surface disposed opposite the inner surface and partially disposed on the side plate of the cover, and a terminal formed on the inner surface of the substrate,
The coil is connected to the terminal of the substrate through the lower elastic member,
In the cover, a groove is formed at a position corresponding to the terminal so that a part of the terminal of the substrate does not overlap the side plate of the cover in a direction perpendicular to the optical axis,
The lower elastic member is disposed on an upper portion of the terminal of the substrate and the lens driving device overlapping the side plate of the cover in a direction perpendicular to the optical axis.

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