KR102675550B1 - Dual camera module, Optical apparatus and Manufacturing method of the dual camera module - Google Patents

Abstract

This embodiment includes: a rigid first substrate on which a first image sensor is disposed; a rigid second substrate on which a second image sensor is disposed and spaced apart from the first substrate; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit connecting the first substrate and the second substrate, wherein the first substrate includes a first side and the second substrate includes a second side opposite the first side. , the connection unit relates to a dual camera module connecting the first side of the first substrate and the second side of the second substrate.

Description

Dual camera module, optical apparatus and manufacturing method of the dual camera module}

This embodiment relates to a dual camera module, optical devices, and a method of manufacturing the dual camera module.

The content described below only provides background information for this embodiment and does not describe prior art.

As various types of portable terminals become widespread and wireless Internet services become commercialized, consumer demands related to portable terminals are also diversifying, and various types of additional devices are being installed on portable terminals.

Among them, a representative one is a camera module that takes photos or videos of a subject. The camera module includes an AF camera module with an auto focus (AF) function, which automatically adjusts focus according to the distance to the subject, and an optical image stabilization (OIS) function, which corrects the user's hand shake when shooting. There is an OIS camera module equipped with.

In a conventional dual camera module, there is no way to adjust the alignment between the image sensors after the two image sensors are mounted on the printed circuit board, and this is a problem because the alignment between the image sensors becomes misaligned due to heat or impact. .
(Patent Document 1) US 2014-0212127 A1

This embodiment is a single printed circuit board, but adds a flexible part (flex material) between the two image sensors to provide a dual camera module that can adjust the alignment between the two image sensors after mounting the image sensors. .

Additionally, it is intended to provide an optical device including the dual camera module.

In addition, it is intended to provide a method of manufacturing the dual camera module.

The dual camera module according to this embodiment includes a rigid first substrate on which a first image sensor is disposed; a rigid second substrate on which a second image sensor is disposed and spaced apart from the first substrate; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit connecting the first substrate and the second substrate, wherein the first substrate includes a first side and the second substrate includes a second side opposite the first side. , the connection unit may connect the first side of the first substrate and the second side of the second substrate.

The third substrate includes a body portion, a first connection portion extending from the body portion and connected to the first substrate, and a second connection portion extending from the body portion and connected to the second substrate. The connection portion may be spaced apart from the second connection portion.

The first substrate includes a third side adjacent to the first side, the second substrate includes a fourth side adjacent to the second side, and the first connection portion is connected to the third side and the The second connection part may be connected to the fourth side.

The first connection portion is connected to the third side with a bias toward a corner of both corners of the third side that is closest to the second substrate, and the second connection portion is connected to the first substrate and one of both corners of the fourth side. It may be connected to the fourth side by being biased toward the corner of the near side.

The third board is a flexible printed circuit board (FPCB), and a connector connected to the outside may be placed on the body part.

The connection unit includes a first moving part and a second moving part spaced apart from the first moving part, a portion where the first flowing portion meets the first side, and a portion where the second flowing portion meets the first side. may be symmetrical with respect to the center of the first side.

As at least a portion of the first and second flow parts are spaced apart from the first and second substrates, the cross-sectional area parallel to the first side may become smaller.

The connection unit may have insulating properties, and no conductive line may be formed in the connection unit.

and a stiffener disposed on a lower surface of the first substrate and a lower surface of the second substrate, wherein the first substrate and the second substrate are coupled to the stiffener by epoxy for active alignment (AA). You can.

The connection unit may be formed integrally with the first substrate and the second substrate.

The length of the connection unit in the width direction may be more than 50% of the length of the long side of the first side of the first substrate, and the width direction of the connection unit may be parallel to the long side of the first side.

The dual camera module according to this embodiment includes a rigid first substrate on which a first image sensor is disposed; a rigid second substrate on which a second image sensor is disposed and spaced apart from the first substrate; a third substrate connected to the first substrate and the second substrate; and a connecting portion disposed on the third substrate and electrically connected to an external component, wherein the first substrate includes a first side and the second substrate includes a second side opposite the first side. , the first substrate includes a third side adjacent to the first side, the second substrate includes a fourth side adjacent to the second side, and the third substrate includes the first substrate and the third side. They are connected on three sides, and the third substrate is connected to the second substrate and the fourth side, and the separation distance between the third side and the connecting part may correspond to the separation distance between the fourth side and the connecting part.

The optical device according to this embodiment includes a main body, a dual camera module disposed on the main body, and a display unit disposed on one side of the main body and outputting an image captured by the dual camera module, the dual camera module , a rigid first substrate on which the first image sensor is disposed; a rigid second substrate on which a second image sensor is disposed and spaced apart from the first substrate; a third substrate connected to the first substrate and the second substrate; and a flexible connection unit connecting the first substrate and the second substrate, wherein the first substrate includes a first side and the second substrate includes a second side opposite the first side. , the connection unit may connect the first side of the first substrate and the second side of the second substrate.

The method of manufacturing a dual camera according to this embodiment includes mounting a first image sensor on a first substrate, and mounting a second image sensor on a second substrate that is spaced apart from the first substrate and connected to the first substrate by a connection unit. Mounting step; coupling a first lens driving device coupled with a first lens module to the first substrate; coupling a second lens driving device coupled with a second lens module to the second substrate; coupling the first substrate to a stiffener; and coupling the second substrate to the stiffener.

The step of coupling the first lens driving device to the first substrate is performed by temporarily bonding the first substrate and the first lens driving device with a first epoxy and bonding the first lens module and the first image sensor to each other. Aligning and curing the first epoxy includes the step of coupling the second lens driving device to the second substrate by attaching the second substrate and the second lens driving device to the second epoxy. Aligning the second lens module and the second image sensor in an adhesive state and curing the second epoxy, wherein coupling the second substrate to the stiffener includes the step of aligning the second lens module and the second image sensor with the second image sensor and curing the second epoxy. It may include aligning the first image sensor and the second image sensor while the stiffener is temporarily bonded using a third epoxy, and curing the third epoxy.

Through this embodiment, alignment adjustment is possible after mounting the image sensor, thereby reducing the process defect rate.

Compared to before, the quality of alignment between image sensors is improved.

Alignment changes between image sensors in response to shock and temperature are improved. More specifically, conventionally, changes in the flatness of the printed circuit board due to shock and temperature lead to changes in the alignment between image sensors, but in this embodiment, the alignment between image sensors can be adjusted even if there is a change in the flatness of the printed circuit board. .

Figure 1 is a perspective view showing a printed circuit board and related configuration of a dual camera module according to this embodiment.
Figure 2 is a perspective view of a dual camera module according to this embodiment.
Figure 3 is an exploded perspective view of the first camera module according to this embodiment.
Figure 4 is an exploded perspective view of the mover of the first camera module according to this embodiment.
Figure 5 is an exploded perspective view of the stator of the first camera module according to this embodiment.
Figure 6 is an exploded perspective view of the AF support member of the first camera module according to this embodiment.
Figure 7 is an exploded perspective view of the second camera module according to this embodiment.
Figure 8 is an exploded perspective view of the AF mover of the second camera module according to this embodiment.
Figure 9 is an exploded perspective view of the OIS mover of the second camera module according to this embodiment.
Figure 10 is an exploded perspective view of the stator of the second camera module according to this embodiment.
Figure 11 is an exploded perspective view of the AF support member of the second camera module according to this embodiment.
FIG. 12 is a perspective view showing a state in which the stiffener is coupled to the first and second substrates in FIG. 1.
Figure 13 is a perspective view showing a printed circuit board and related configuration of a dual camera module according to a modification.
Figure 14 is a perspective view showing a printed circuit board and related configuration of a dual camera module according to another modification.

Hereinafter, some embodiments of the present invention will be described through exemplary drawings. When assigning reference numerals to components in each drawing, identical components are indicated with the same reference numerals as much as possible, even if they are shown in different drawings. Additionally, when describing embodiments of the present invention, if detailed descriptions of related known configurations or functions are judged to impede understanding of the embodiments of the present invention, the detailed descriptions will be omitted.

Additionally, when describing the components of an embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only used to distinguish the component from other components, and the nature, sequence, or order of the component is not limited by the term. When a component is described as being “connected,” “coupled,” or “connected” to another component, that component may be directly connected, coupled, or connected to that other component, but that component and that other component It should be understood that another component may be “connected,” “coupled,” or “connected” between elements.

The “optical axis direction” used below is defined as the optical axis direction of the lens module of the camera module. Meanwhile, “optical axis direction” can be used interchangeably with vertical direction, z-axis direction, etc.

The "autofocus function" used below focuses on the subject by adjusting the distance to the image sensor by moving the lens module in the optical axis direction according to the distance to the subject so that a clear image of the subject can be obtained on the image sensor. Defined as a function. Meanwhile, “auto focus” can be used interchangeably with “AF (Auto Focus).”

The “image shake correction function” used below is defined as a function that moves or tilts the lens module in a direction perpendicular to the optical axis to offset vibration (movement) generated in the image sensor by external force. Meanwhile, “image stabilization” can be used interchangeably with “OIS (Optical Image Stabilization).”

Below, the configuration of the optical device according to this embodiment will be described.

Optical devices may be mobile phones, mobile phones, smart phones, portable smart devices, digital cameras, laptop computers, digital broadcasting terminals, PDAs (Personal Digital Assistants), PMPs (Portable Multimedia Players), navigation devices, etc. . However, it is not limited to this and any device for taking videos or photos is possible.

The optical device may include a main body (not shown), a dual camera module, and a display unit (not shown). However, in the optical device, one or more of the main body, dual camera module, and display unit may be omitted or changed.

The body can form the appearance of the optical device. As an example, the main body may include a rectangular parallelepiped shape. However, it is not limited to this. As a variation, the main body may be formed to be rounded at least in part. The main body can accommodate a dual camera module. A display unit may be disposed on one side of the main body.

The dual camera module can be placed in the main body. The dual camera module can be placed on one side of the main body. At least part of the dual camera module can be accommodated inside the main body. The dual camera module can capture images of subjects.

The display unit may be placed in the main body. The display unit may be placed on one side of the main body. That is, the display unit can be placed on the same side as the dual camera module. Alternatively, the display unit may be placed on the other side of the main body. The display unit may be placed on a side opposite to the side where the dual camera module is placed. The display unit can output images captured by the dual camera module.

Hereinafter, the configuration of the dual camera module according to this embodiment will be described with reference to the drawings.

FIG. 1 is a perspective view showing a printed circuit board and related configuration of a dual camera module according to this embodiment, and FIG. 12 is a perspective view showing a state in which a stiffener is coupled to the first and second substrates in FIG. 1.

The dual camera module according to this embodiment includes a first image sensor 10, a first substrate 100, a second image sensor 20, a second substrate 200, a third substrate 300, and a connection unit 400. ) may include. However, in the dual camera module according to this embodiment, one or more of the first substrate 100, the second substrate 200, the third substrate 300, and the connection unit 400 may be omitted or changed.

The first image sensor 10 may be disposed on the first substrate 100 . The first image sensor 10 may be disposed on the top surface of the first substrate 100. As a modified example, the first image sensor 10 may be coupled to the lower surface of the first substrate 100 so that the effective image area is exposed upward through the through hole. The first image sensor 10 may be electrically connected to the first substrate 100. The first image sensor 10 may be coupled to the first substrate 100 using surface mounting technology (SMT). The first image sensor 10 may be coupled to the first substrate 100 using flip chip technology. The first image sensor 10 may be arranged so that its optical axis coincides with that of the first lens module. That is, the optical axis of the first image sensor 10 and the optical axis of the first lens module may be aligned. Through this, the first image sensor 10 can acquire light that has passed through the first lens module. The first image sensor 10 can convert light irradiated to the effective image area into an electrical signal. The first image sensor 10 may be one of a charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD, and a CID. However, the type of the first image sensor 10 is not limited to this, and the first image sensor 10 may include any configuration that can convert incident light into an electrical signal.

A first lens driving device 1000 may be disposed on the upper surface of the first substrate 100. The first substrate 100 may be disposed below the first lens driving device 1000. The first substrate 100 may be combined with the first lens driving device 1000. A first image sensor 10 may be disposed on the first substrate 100. The first substrate 100 may be electrically connected to the first image sensor 10. For example, a holder member may be disposed between the first substrate 100 and the first lens driving device 1000. At this time, the holder member may accommodate the first image sensor 10 inside. As another example, the first lens driving device 1000 may be directly disposed on the first substrate 100. At this time, the first lens driving device 1000 may accommodate the first image sensor 10 inside. Through this structure, light passing through the first lens module coupled to the first lens driving device 1000 can be irradiated to the first image sensor 10 disposed on the first substrate 100. The first substrate 100 can supply power (current) to the first lens driving device 1000.

The first substrate 100 may have rigidity. The first substrate 100 may be a rigid printed circuit board (RPCB). A first image sensor 10 may be disposed on the first substrate 100. A first image sensor 10 may be disposed on the upper surface of the first substrate 100. The first substrate 100 may have a quadrangular plate shape. At this time, the four edges of the first substrate 100 may be formed to be rounded. The area of the top surface of the first substrate 100 may be smaller than the area of the top surface of the second substrate 200.

A terminal 110 may be disposed on the top surface of the first substrate 100. The terminal 110 may be electrically connected to the first lens driving device 1000 disposed on the top surface of the first substrate 100. The terminal 110 may be coupled to the first lower support member 1620. The terminal 110 and the lower end of the terminal portion 1624 of the first lower support member 1620 may be joined by soldering. Current may be provided from the first substrate 100 to the first coil 1220 through the terminal 110.

A passive element 120 may be disposed on the top surface of the first substrate 100. The passive element 120 may be disposed outside the first image sensor 10. The passive element 120 may be arranged to be spaced apart from the first image sensor 10. The passive element 120 may be used to remove noise generated from the first image sensor 10.

The first substrate 100 may include a first side 101. The first substrate 100 may include a first side 101 that faces the second side 201 of the second substrate 200 . The first substrate 100 may include a third side 102. The first substrate 100 may include a third side 102 adjacent to the first side 101. The first side 101 and the third side 102 may be adjacent to each other. The first side 101 of the first substrate 100 may face the second side 201 of the second substrate 200. The third side 102 of the first substrate 100 may face the same direction as the fourth side 202 of the second substrate 200.

The second image sensor 20 may be disposed on the second substrate 200 . The second image sensor 20 may be disposed on the upper surface of the second substrate 200. As a modified example, the second image sensor 20 may be coupled to the lower surface of the second substrate 200 so that the effective image area is exposed upward through the through hole. The second image sensor 20 may be electrically connected to the second substrate 200. The second image sensor 20 may be coupled to the second substrate 200 using surface mounting technology (SMT). The second image sensor 20 may be coupled to the second substrate 200 using flip chip technology. The second image sensor 20 may be arranged so that its optical axis coincides with that of the second lens module. That is, the optical axis of the second image sensor 20 and the optical axis of the second lens module may be aligned. Through this, the second image sensor 20 can acquire light that has passed through the second lens module. The second image sensor 20 can convert light irradiated to the effective image area into an electrical signal. The second image sensor 20 may be one of a charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD, and a CID. However, the type of the second image sensor 20 is not limited to this, and the second image sensor 20 may include any configuration that can convert incident light into an electrical signal.

A second lens driving device 2000 may be disposed on the upper surface of the second substrate 200. The second substrate 200 may be disposed below the second lens driving device 2000. The second substrate 200 may be combined with the second lens driving device 2000. A second image sensor 20 may be disposed on the second substrate 200. The second substrate 200 may be electrically connected to the second image sensor 20. For example, a holder member may be disposed between the second substrate 200 and the second lens driving device 2000. At this time, the holder member can accommodate the second image sensor 20 inside. As another example, the second lens driving device 2000 may be directly disposed on the second substrate 200. At this time, the second lens driving device 2000 can accommodate the second image sensor 20 inside. Through this structure, light passing through the second lens module coupled to the second lens driving device 2000 can be irradiated to the second image sensor 20 disposed on the second substrate 200. The second substrate 200 may supply power (current) to the second lens driving device 2000.

The second substrate 200 may have rigidity. The second substrate 200 may be a rigid printed circuit board (RPCB). A second image sensor 20 may be disposed on the second substrate 200. A second image sensor 20 may be disposed on the upper surface of the second substrate 200. The second substrate 200 may have a quadrangular plate shape. At this time, the four edges of the second substrate 200 may be formed to be rounded. The upper surface area of the second substrate 200 may be larger than the upper surface area of the first substrate 200.

A terminal 210 may be disposed on the upper surface of the second substrate 200. The terminal 210 may be electrically connected to the second lens driving device 2000 disposed on the upper surface of the second substrate 200. The terminal 210 may be coupled to the terminal portion 2412 of the board 2410. The terminal 210 and the lower end of the terminal portion 2412 of the board 2410 may be joined by soldering. Current may be provided from the second substrate 200 to the second coil 2220 through the terminal 210.

A passive element 220 may be disposed on the upper surface of the second substrate 200. The passive element 220 may be disposed outside the second image sensor 20. The passive element 220 may be arranged to be spaced apart from the second image sensor 20. The passive element 220 may be used to remove noise generated from the second image sensor 20.

The second substrate 200 may include a second side 201. The second substrate 200 may include a second side 201 that faces the first side 101 of the first substrate 100 . The second substrate 200 may include a fourth side 202. The second substrate 200 may include a fourth side 202 adjacent to the second side 201. The second side 201 and the fourth side 202 may be adjacent to each other. The second side 201 of the second substrate 200 may face the first side 101 of the first substrate 100. The fourth side 202 of the second substrate 200 may face the same direction as the third side 102 of the first substrate 100.

The connector 30 may be disposed on the body portion 310 of the third substrate 300. The connector 30 may be placed on the third substrate 300. The connector 30 may be electrically connected to external components constituting the optical device. The connector 30 may be an example of a connecting portion. The connecting unit may be electrically connected to external components constituting the optical device.

The third substrate 300 may be connected to the first substrate 100. The third substrate 300 may be connected to the second substrate 200. The third substrate 300 may be connected to the first substrate 100 and the second substrate 200. The third substrate 300 may electrically connect the first substrate 100 and the second substrate 200 to external components. A connector 30 may be disposed on the third substrate 300. The third substrate 300 may be electrically connected to an external component through a connector 30. The third substrate 300 may be flexible. The third substrate 300 may be a flexible printed circuit board (FPCB). The thickness of at least a portion of the third substrate 300 may be thinner than the thickness of the first substrate 100 and the second substrate 200.

The third substrate 300 may be formed integrally with the first substrate 100 and the second substrate 200. That is, the first substrate 100, the second substrate 200, and the third substrate 300 may be formed of a Rigid Flexible Printed Circuit Board (RFPCB).

The third substrate 300 may include a body portion 310, a first connection portion 320, and a second connection portion 330. However, in the third substrate 300, one or more of the body portion 310, the first connection portion 320, and the second connection portion 330 may be omitted or changed.

The body portion 310 may be combined with an external component of the dual camera. A connector 30 connected to the outside may be disposed on the body portion 310. The body portion 310 may be formed integrally with the first connection portion 320 and the second connection portion 330.

The first connection part 320 may extend from the body part 310. The first connection part 320 may be formed integrally with the body part 310. The first connection part 320 may be connected to the first substrate 100. The first connection part 320 may be spaced apart from the second connection part 330. A space may be disposed between the first connection part 320 and the second connection part 330. That is, the third substrate 300 may include a groove concave toward the body 310 by the body 310, the first connection portion 320, and the second connection portion 330. The first connection part 320 may be connected to the third side 102 of the first substrate 100. The first connection portion 320 may be connected to the third side 102 with a bias toward the corner on the side closer to the second substrate 200 among both corners of the third side 102.

The second connection portion 330 may extend from the body portion 310. The second connection portion 330 may be formed integrally with the body portion 310. The second connection portion 330 may be connected to the second substrate 200. The second connection part 330 may be spaced apart from the first connection part 320. The second connection part 330 may be connected to the fourth side 202 of the second substrate 200. The second connection portion 330 may be connected to the fourth side 202 with a bias toward the corner on the side closer to the first substrate 100 among both corners of the fourth side 202.

In this embodiment, the connection unit 400 can connect the first substrate 100 and the second substrate 200 so that they can move within a limited range. In this case, if compared to the case where the connection unit 400 is omitted and the first substrate 100 and the second substrate 200 are connected by a rigid printed circuit board, the first image sensor 10 is connected to the first substrate 100. ) and the second image sensor 20 is mounted on the second substrate 200, there is an advantage that the first image sensor 10 and the second image sensor 20 can be aligned. Meanwhile, the connection unit 400 may restrict the first substrate 100 and the second substrate 200 from moving in the horizontal direction while allowing each to be tilted within a certain range.

Recently, research is being conducted on a dual camera module that places an AF camera module and an OIS camera module side by side. However, in the mentioned dual camera module, an image sensor is used individually for each camera module, and the flatness of the printed circuit board has a large influence on the alignment between the two image sensors. However, in this embodiment, the first image sensor 10 and the second image sensor 20 can be aligned even if there is a change in the flatness of the printed circuit board.

The connection unit 400 may extend from the first substrate 100 . The connection unit 400 may extend from the first side 101 of the first substrate 100. The connection unit 400 may extend from the second substrate 200 . The connection unit 400 may extend from the second side 201 of the second substrate 200. The connection unit 400 may connect the first substrate 100 and the second substrate 200. The connection unit 400 may connect the first side 101 of the first substrate 100 and the second side 201 of the second substrate 200. At this time, the first side 101 of the first substrate 100 and the second side 201 of the second substrate 200 may face each other. The connection unit 400 may be formed integrally with the first substrate 100 and the second substrate 200. The connection unit 400 may have insulation properties. A conductive line may not be formed in the connection unit 400.

The connection unit 400 may include a first flow part 410 and a second flow part 420. However, in the connection unit 400, one or more of the first flow part 410 and the second flow part 420 may be omitted or changed. Additionally, the first flow part 410 and the second flow part 420 may be formed integrally without being spaced apart.

The first flow part 410 may be spaced apart from the second flow part 420. The cross-sectional area of at least a portion of the first flow portion 410 may become smaller as it is spaced apart from the first substrate 100 . At this time, the cross-sectional area may be parallel to the first side 101. That is, as the first and second flow parts 410 and 420 are spaced at least in part from the first substrate 100 and the second substrate 200, the cross-sectional area parallel to the first side 101 may become smaller. there is. The cross-sectional area of at least a portion of the first flow portion 410 may become smaller as it is spaced apart from the second substrate 200 . The first flow part 410 may have the same thickness as the first substrate 100 at a portion where it meets the first substrate 100. The first flow portion 410 may have a thickness thinner than the first substrate 100 at a portion spaced apart from the first substrate 100 . The width of the first flow portion 410 may be narrower at a portion spaced apart from the first substrate 100 than at a portion where it meets the first substrate 100 . The first flow portion 410 may have the same thickness as the second substrate 200 at the portion where it meets the second substrate 200. The first flow portion 410 may have a thinner thickness than the second substrate 200 at a portion spaced apart from the second substrate 200 . The width of the first flow portion 410 may be narrower at a portion spaced apart from the second substrate 200 than at a portion where it meets the second substrate 200 .

The second flow part 420 may be spaced apart from the first flow part 410. The cross-sectional area of the second flow portion 420 may become smaller as the second flow portion 420 is spaced at least partially from the first substrate 100 . The cross-sectional area of at least a portion of the second flow portion 420 may become smaller as it is spaced apart from the second substrate 200 . The second flow portion 420 may have the same thickness as the first substrate 100 at the portion where it meets the first substrate 100. The second flow portion 420 may have a thinner thickness than the first substrate 100 at a portion spaced apart from the first substrate 100 . The width of the second flow portion 420 may be narrower at a portion spaced apart from the first substrate 100 than at a portion where it meets the first substrate 100 . The second flow portion 420 may have the same thickness as the second substrate 200 at the portion where it meets the second substrate 200. The second flow portion 420 may have a thinner thickness than the first substrate 200 at a portion spaced apart from the second substrate 200 . The width of the second flow portion 420 may be narrower at a portion spaced apart from the second substrate 200 than at a portion where it meets the second substrate 200 .

The part where the first flow part 410 meets the first side 101 and the part where the second flow part 420 meets the first side 101 are symmetrical with respect to the center of the first side 101. You can. In this case, compared to the case where the first flow part 410 and the second flow part 420 are disposed biased toward one corner of the first side 101, the size of the first substrate 100 and the second substrate 200 Horizontal movement may be more restricted. In other words, either the first flow part 410 or the second flow part 420 is omitted, or both the first flow part 410 and the second flow part 420 are located at one corner of the first side 101. If the first substrate 100 and the second substrate 200 are arranged side by side, the shape itself may be disturbed. In this embodiment, the first flow part 410 and the second flow part 420 combine the first substrate 100 and the second substrate 200 in a balanced manner to form the first substrate 100 and the second substrate 200. ) are always maintained side by side, and when necessary, either the first substrate 100 or the second substrate 200 is tilted to align the first image sensor 10 and the second image sensor 20. This can be realized.

As shown in FIG. 1, the width L2 of the connection unit 400 may be 50% or more of the width L1 of the first substrate 100. The length L2 in the width direction of the connection unit 400 may be 50% or more of the length L1 in the long side direction of the first side 101 of the first substrate 100. The width L2 of the connection unit 400 may be the distance from one end of the first flow part 410 to the other end of the second flow part 420. At this time, one side of the first flow part 410 may be in a direction away from the second flow part 420, and the other side of the second flow part 420 may be in a direction away from the first flow part 410. Alternatively, the connection unit 400 may be one in which the space between the first flow part 410 and the second flow part 420 is omitted and the first flow part 410 and the second flow part 420 are formed integrally. . At this time, the width of the connection unit 400 may be the distance from one end of the connection unit 400 to the other end.

The dual camera module according to this embodiment may further include a stiffener 40.

The stiffener 40 may be disposed on the lower surface of the first substrate 100 and the lower surface of the second substrate 200. A first substrate 100 and a second substrate 200 may be disposed on the stiffener 40. A first substrate 100 and a second substrate 200 may be disposed on the upper surface of the stiffener 40. The stiffener 40 may be coupled to the lower surface of the first substrate 100 and the lower surface of the second substrate 200. The stiffener 40 may be formed in a flat shape. The stiffener 40 may include a flat shape. Stiffener 40 may be a substrate. The stiffener 40 may have rigidity. Epoxy (not shown) for active alignment (AA) may be disposed between the stiffener 40 and the first substrate 100 and between the stiffener 40 and the second substrate 200. That is, the first substrate 100 and the second substrate 200 may be coupled to the stiffener 40 using epoxy for active alignment. For example, with the first substrate 100 first bonded to the stiffener 40 and the second substrate 200 temporarily bonded to the stiffener 40, the first image sensor 10 and the second image sensor 20 are aligned. The epoxy can be cured after adjusting the bonding state of the second substrate 200 so that it matches. Conversely, in a state where the second substrate 200 is first coupled to the stiffener 40 and the first substrate 100 is temporarily bonded with epoxy, the alignment of the second image sensor 20 and the first image sensor 10 After adjusting the bonding state of the first substrate 100 to match this, the epoxy can be cured. The stiffener 40 is formed integrally, and the upper surface of the stiffener 40 is aligned with the optical axis of the first image sensor 10 and the optical axis of the second image sensor 20, and the first substrate 100 and The second substrate 200 may be combined.

The dual camera module according to this embodiment may include a first camera module and a second camera module.

Figure 2 is a perspective view of a dual camera module according to this embodiment, Figure 3 is an exploded perspective view of a first camera module according to this embodiment, and Figure 4 is an exploded perspective view of a mover of a first camera module according to this embodiment. , FIG. 5 is an exploded perspective view of the stator of the first camera module according to this embodiment, FIG. 6 is an exploded perspective view of the AF support member of the first camera module according to this embodiment, and FIG. 7 is an exploded perspective view of the stator of the first camera module according to this embodiment. Figure 8 is an exploded perspective view of the second camera module, Figure 8 is an exploded perspective view of the AF mover of the second camera module according to this embodiment, Figure 9 is an exploded perspective view of the OIS mover of the second camera module according to this embodiment, and Figure 10 is an exploded perspective view of the stator of the second camera module according to this embodiment, and Figure 11 is an exploded perspective view of the AF support member of the second camera module according to this embodiment.

The first camera module may be an AF driving camera module. At this time, the first camera module may be referred to as an “AF camera module.” Alternatively, the first camera module may be provided as an OIS driving camera module.

The first camera module includes a first lens driving device 1000, a first lens module (not shown), a first infrared filter (not shown), a first image sensor 10, a first substrate 100, and a first control unit. (not shown) may be included. However, in the first camera module, one or more of the first lens driving device 1000, first lens module, first infrared filter, first image sensor 10, first substrate 100, and first control unit are omitted. Or it may change. Here, the description of the first image sensor 10 and the first substrate 100 is the same as previously described.

The first lens module may include a lens and a lens barrel. The first lens module may include one or more lenses (not shown) and a lens barrel that accommodates one or more lenses. However, the configuration of the first lens module is not limited to the lens barrel, and any holder structure capable of supporting one or more lenses is possible. The first lens module is coupled to the first lens driving device 1000 and can move together with the first lens driving device 1000. The first lens module may be coupled to the inside of the first lens driving device 1000. The first lens module may be screw-coupled with the first lens driving device 1000. The first lens module may be coupled to the first lens driving device 1000 using an adhesive (not shown). Meanwhile, light passing through the first lens module may be irradiated to the first image sensor 10.

The terminal portion 1624 of the first lens driving device 1000 may be coupled to the terminal 110 of the first substrate 100. The terminal portion 1624 of the first lens driving device 1000 may be coupled to the terminal 110 of the first substrate 100 by soldering. The terminal 110 of the first substrate 100 may be disposed on the opposite side of the third side 102 on the top surface of the first substrate 100. The terminal portion 2412 of the second lens driving device 2000 may be coupled to the terminal 210 of the second substrate 200. The terminal portion 2412 of the second lens driving device 2000 may be coupled to the terminal 210 of the second substrate 200 by soldering. The terminal 210 of the second substrate 200 may be disposed on the fourth side 202 of the upper surface of the second substrate 200 . Additionally, the terminal 210 of the second substrate 200 may be disposed on the opposite side of the fourth side 202 on the upper surface of the second substrate 200.

The first lens driving device 1000 may be coupled to the first substrate 100 on which the first image sensor 10 is mounted using epoxy. The first lens driving device 1000 may be aligned with the first image sensor 10 using the epoxy. The first lens driving device 1000 may be directly mounted on the top surface of the first substrate 100. Alternatively, a separate holder member may be disposed between the first lens driving device 1000 and the first substrate 100. The second lens driving device 2000 may be coupled to the second substrate 200 on which the second image sensor 20 is mounted using epoxy. The second lens driving device 2000 can be aligned with the second image sensor 20 using the epoxy. The second lens driving device 2000 may be directly mounted on the upper surface of the second substrate 200. Alternatively, a separate holder member may be disposed between the second lens driving device 2000 and the second substrate 200.

The first infrared filter may block light in the infrared region from being incident on the first image sensor 10. The first infrared filter may be located between the first lens module and the first image sensor 10. The first infrared filter may be located on a holder member (not shown) that is provided separately from the first base 1500. However, the first infrared filter may be mounted in the opening 1510 formed in the center of the first base 1500. The first infrared filter may be made of a film material or a glass material. The first infrared filter may be formed by coating an infrared blocking coating material on a flat optical filter, such as a cover glass for protecting an imaging surface. The first infrared filter may be an infrared blocking filter or an infrared absorbing filter.

The first control unit may be mounted on the first substrate 100. The first control unit may be located outside the first lens driving device 1000. However, the first control unit may be located inside the first lens driving device 1000. The first control unit can control the direction, intensity, and amplitude of the current supplied to each component of the first lens driving device 1000. The first control unit may control the first lens driving device 1000 to perform one or more of the autofocus function and the camera shake correction function of the first camera module. That is, the first control unit can control the first lens driving device 1000 to move the first lens module in the optical axis direction, or to move or tilt the first lens module in a direction perpendicular to the optical axis direction. Furthermore, the first control unit may perform feedback control of the autofocus function and the hand shake correction function. In more detail, the first control unit receives the position of the first bobbin 1210 detected by a Hall sensor (not shown) and controls the power or current applied to the first coil 1220 to provide a more precise autofocus function. can be provided.

The first lens driving device 1000 includes a first cover member 1100, a mover 1200, a stator 1300, a third magnet unit 1410, a fourth magnet unit 1420, and a first base 1500. , and may include an AF support member 1600. However, in the first lens driving device 1000, the first cover member 1100, the mover 1200, the stator 1300, the third magnet unit 1410, the fourth magnet unit 1420, and the first base ( 1500), and one or more of the AF support member 1600 may be omitted or changed. In particular, the fourth magnet unit 1420 may be omitted in the first modification. Additionally, the third magnet unit 1410 and the fourth magnet unit 1420 may be omitted in the second modification example.

The first lens driving device 1000 may be an AF module. At this time, the second lens driving device 2000 may be an OIS module. Here, the OIS module can also perform the AF function. However, the first lens driving device 1000 may be an OIS module. The second lens driving device 2000 may be an AF module. That is, one of the first lens driving device 1000 and the second lens driving device 2000 has an AF module and the other has an OIS module. Alternatively, both the first lens driving device 1000 and the second lens driving device 2000 may be AF modules. Alternatively, both the first lens driving device 1000 and the second lens driving device 2000 may be OIS modules.

The first cover member 1100 may be formed integrally with the first housing 1310. Alternatively, the first cover member 1100 may be omitted and the first housing 1310 may function as the first cover member 1100. That is, the first cover member 1100 may be the first housing 1310.

The first cover member 1100 may form the exterior of the first lens driving device 1000. The first cover member 1100 may have a hexahedral shape with an open bottom. However, it is not limited to this. The first cover member 1100 may be a non-magnetic material. If the first cover member 1100 is made of a magnetic material, the magnetic force of the first cover member 1100 may affect the second magnet unit 2320 of the second lens driving device 2000. The first cover member 1100 may be formed of a metal material. In more detail, the first cover member 1100 may be provided as a metal plate. In this case, the first cover member 1100 can block electromagnetic interference (EMI). Because of these characteristics of the first cover member 1100, the first cover member 1100 may be called an “EMI shield can.” The first cover member 1100 can block radio waves generated outside the first lens driving device from flowing into the first cover member 1100. Additionally, the first cover member 1100 can block radio waves generated inside the first cover member 1100 from being emitted to the outside of the first cover member 1100. However, the material of the first cover member 1100 is not limited to this.

The first cover member 1100 may include a top plate 1101 and a side plate 1102. The first cover member 1100 may include a top plate 1101 and a side plate 1102 extending downward from the outside of the top plate 1101. The lower end of the side plate 1102 of the first cover member 1100 may be mounted on the first base 1500. The lower end of the side plate 1102 of the first cover member 1100 may be coupled to the stepped portion 1540 of the first base 1500. The first cover member 1100 may be mounted on the first base 1500 with its inner surface in close contact with part or all of the side surface of the first base 1500. A mover 1200, a stator 1300, and an AF support member 1600 may be located in the internal space formed by the first cover member 1100 and the first base 1500. Through this structure, the first cover member 1100 can protect internal components from external impact and simultaneously prevent penetration of external contaminants. However, it is not limited to this, and the lower end of the side plate 1102 of the first cover member 1100 may be directly coupled to the first substrate 100 located below the first base 1500. Some of the plurality of side plates 1102 may face the second cover member 2100.

The first cover member 1100 may include an opening 1110 and an extension part 1120. However, the extension portion 1120 may be omitted or changed in the first cover member 1100.

The opening 1110 may be formed in the upper plate 1101. The opening 1110 may expose the first lens module. The opening 1110 may be provided in a shape corresponding to the first lens module. The size of the opening 1110 may be larger than the diameter of the first lens module so that the first lens module can be assembled through the opening 1110. Meanwhile, light introduced through the opening 1110 may pass through the first lens module. At this time, the light passing through the first lens module can be acquired as an image by the first image sensor.

The extension portion 1120 may be bent and extended downward from the inner peripheral surface of the upper plate 1101. The extension 1120 may be referred to as an “inner yoke.” At least a portion of the extension portion 1120 may be inserted into a groove formed in the first bobbin 1210. Through this structure, it is possible to prevent the first bobbin 1210 from rotating during the process of screwing the first lens module to the first bobbin 1210. In other cases, the extension part 1120 can prevent the first bobbin 1210 from rotating with respect to the first cover member 1100.

The mover 1200 may be coupled to the first lens module. The mover 1200 can accommodate the first lens module inside. The outer circumferential surface of the first lens module may be coupled to the inner circumferential surface of the mover 1200. The mover 1200 can move integrally with the first lens module through interaction with the stator 1300.

The mover 1200 may include a first bobbin 1210 and a first coil 1220. However, in the mover 1200, one or more of the first bobbin 1210 and the first coil 1220 may be omitted or changed.

The first bobbin 1210 may be located inside the first housing 1310. The first bobbin 1210 may be accommodated in the through hole 1311 of the first housing 1310. The first bobbin 1210 may be combined with the first lens module. In more detail, the outer peripheral surface of the first lens module may be coupled to the inner peripheral surface of the first bobbin 1210. A first coil 1220 may be coupled to the first bobbin 1210. The lower part of the first bobbin 1210 may be coupled to the first lower support member 1620. The upper part of the first bobbin 1210 may be coupled to the first upper support member 1610. The first bobbin 1210 may move in the optical axis direction with respect to the first housing 1310.

The first bobbin 1210 may include a through hole 1211 and a coil receiving portion 1212. However, in the first bobbin 1210, one or more of the through hole 1211 and the coil receiving portion 1212 may be omitted or changed.

The through hole 1211 may be formed inside the first bobbin 1210. The through hole 1211 may be formed as open top and bottom. A first lens module may be coupled to the through hole 1211. A screw thread having a shape corresponding to a screw thread formed on the outer circumferential surface of the first lens module may be formed on the inner peripheral surface of the through hole 1211. That is, the through hole 1211 can be screwed to the first lens module. An adhesive may be interposed between the first lens module and the first bobbin 1210. At this time, the adhesive may be an epoxy that is cured by ultraviolet rays (UV), heat, or laser. That is, the first lens module and the first bobbin 1210 may be bonded using ultraviolet curing epoxy and/or thermal curing epoxy.

The coil receiving portion 1212 may accommodate at least a portion of the first coil 1220. The coil receiving portion 1212 may be formed integrally with the outer surface of the first bobbin 1210. Additionally, the coil receiving portion 1212 may be formed continuously along the outer surface of the first bobbin 1210 or may be formed spaced apart at predetermined intervals. As an example, the coil receiving portion 1212 may be formed by recessing a portion of the outer surface of the first bobbin 1210 to correspond to the shape of the first coil 1220. At this time, the first coil 1220 may be directly wound on the first driving unit coupling unit 1212. As a variation, the coil receiving portion 1212 may be formed to be open at the top or bottom. At this time, the first coil 1220 may be inserted and coupled to the coil receiving portion 1212 through the open portion in a pre-wound state.

The first coil 1220 may be located on the first bobbin 1210. The first coil 1220 may be disposed on the outer peripheral surface of the first bobbin 1210. The first coil 1220 may be directly wound on the outer peripheral surface of the first bobbin 1210. The first coil 1220 may electromagnetically interact with the first magnet unit 1320. The first coil 1220 may face the first magnet unit 1320. In this case, when current is supplied to the first coil 1220 and a magnetic field is formed around the first coil 1220, electromagnetic interaction between the first coil 1220 and the first magnet unit 1320 creates a magnetic field. One coil 1220 may move with respect to the first magnet unit 1320. The first coil 1220 can move for AF driving. In this case, the first coil 1220 may be referred to as an “AF coil.”

The first coil 1220 may include a pair of lead wires (not shown) for power supply. A pair of lead wires of the first coil 1220 may be electrically connected to the first lower support member 1620. Each pair of lead wires of the first coil 1220 may be electrically connected to the first and second support units 1620a and 1620b. In this case, power may be supplied to the first coil 1220 through the first lower support member 1620, which is electrically connected to the first substrate 100 through the terminal portion 1624.

The stator 1300 can accommodate the mover 1200 inside. The stator 1300 is a fixed member and can move the mover 1200 through electromagnetic interaction.

The stator 1300 may include a first housing 1310 and a first magnet unit 1320. However, in the stator 1300, one or more of the first housing 1310 and the first magnet unit 1320 may be omitted or changed.

The first housing 1310 may be located outside the first bobbin 1210. The first housing 1310 may be spaced apart from the first bobbin 1210. At least a portion of the first housing 1310 may be formed in a shape corresponding to the inner surface of the first cover member 1100. In particular, the outer surface of the first housing 1310 may be formed in a shape corresponding to the inner surface of the side plate 1102 of the first cover member 1100. As an example, the first housing 1310 may have a hexahedral shape including four sides. However, the shape of the first housing 1310 may be any shape that can be placed inside the first cover member 1100. The first housing 1310 may be formed of an insulating material. The first housing 1310 may be formed as an injection molded product considering productivity. The first housing 1310 may be fixed on the first base 1500. As a modified example, the first housing 1310 may be omitted and the first magnet unit 1320 may be fixed to the first cover member 1100. A first upper support member 1610 may be coupled to the upper part of the first housing 1310. A first lower support member 1620 may be coupled to the lower part of the first housing 1310.

The first housing 1310 may include first to fourth sides 1301, 1302, 1303, and 1304. The first housing 1310 may include first to fourth sides 1301, 1302, 1303, and 1304 that are continuously arranged. The first housing 1310 has a first side 1301 where the first magnet 1321 is placed, a second side 1302 where the third magnet unit 1410 is placed, and a second magnet 1322 is placed. It may include a third side 1303. The first housing 1310 may include a fourth side 1304 on which the fourth magnet unit 1420 is disposed. The second side 1302 may face the eighth side 2304.

The first housing 1310 may include a through hole 1311, a magnet receiving portion 1312, and a third magnet unit receiving portion 1313. The first housing 1310 may further include a fourth magnet unit accommodating portion (not shown). However, in the first housing 1310, one or more of the through hole 1311, the magnet accommodating part 1312, the third magnet unit accommodating part 1313, and the fourth magnet unit accommodating part may be omitted or changed.

The through hole 1311 may be formed inside the first housing 1310. The through hole 1311 may be formed in the first housing 1310 to be open at the top and bottom. The first bobbin 1210 can be accommodated in the through hole 1311. The first bobbin 1210 may be movably disposed in the through hole 1311. The through hole 1311 may be provided in a shape corresponding to the first bobbin 1210.

The magnet receiving portion 1312 may be formed on the side of the first housing 1310. The magnet receiving portion 1312 may be formed as a hole penetrating the first housing 1310. Alternatively, the magnet receiving portion 1312 may be formed as a groove formed by recessing a portion of the first housing 1310. The magnet accommodating portion 1312 may accommodate at least a portion of the first magnet unit 1320. An adhesive (not shown) may be disposed between the magnet receiving portion 1312 and the first magnet unit 1320. That is, the magnet receiving portion 1312 and the first magnet unit 1320 may be coupled with an adhesive. The magnet receiving portion 1312 may be located on the inner surface of the first housing 1310. The magnet receiving portion 1312 may be formed by partially recessing the inner surface of the first housing 1310 to the outside. In this case, there is an advantage in electromagnetic interaction with the first coil 1220 located inside the first magnet unit 1320.

The third magnet unit receiving portion 1313 may be formed on the second side 1302 of the first housing 1310. The third magnet unit receiving portion 1313 may be formed on the outer surface of the first housing 1310. The third magnet unit receiving portion 1313 may be recessed inward on the outer surface of the first housing 1310. Alternatively, the third magnet unit receiving portion 1313 may be formed as a hole penetrating the first housing 1310. The third magnet unit accommodating portion 1313 can accommodate the third magnet unit 1410. The third magnet unit accommodating portion 1313 may accommodate at least a portion of the third magnet unit 1410. The third magnet unit receiving portion 1313 may be formed in a shape corresponding to the third magnet unit 1410.

The fourth magnet unit receiving portion may be formed on the fourth side 1304 of the first housing 1310. The fourth magnet unit receiving portion may be formed on the outer surface of the first housing 1310. The fourth magnet unit receiving portion may be recessed inward on the outer surface of the first housing 1310. Alternatively, the fourth magnet unit receiving portion may be formed as a hole penetrating the first housing 1310. The fourth magnet unit accommodating portion can accommodate the fourth magnet unit 1420. The fourth magnet unit accommodating portion may accommodate at least a portion of the fourth magnet unit 1420. The fourth magnet unit receiving portion may be formed in a shape corresponding to the fourth magnet unit 1420. The fourth magnet unit accommodating part may be symmetrical with the third magnet unit accommodating part 1313 based on the optical axis of the first camera module.

The first magnet unit 1320 may be located in the first housing 1310. The first magnet unit 1320 may be accommodated in the magnet receiving portion 1312 of the first housing 1310. The first magnet unit 1320 may electromagnetically interact with the first coil 1220. The first magnet unit 1320 may face the first coil 1220. The first magnet unit 1320 can move the first bobbin 1210 to which the first coil 1220 is fixed. The first magnet unit 1320 can move the first coil 1220 for AF driving. In this case, the first magnet unit 1320 may be referred to as an “AF driving magnet.”

The first magnet unit 1320 may include first and second magnets 1321 and 1322. The first magnet unit 1320 may include first and second magnets 1321 and 1322 that are spaced apart from each other. The first magnet unit 1320 may include first and second magnets 1321 and 1322 located opposite to each other. The first magnet unit 1320 may include a first magnet 1321 and a second magnet 1322 disposed on opposite sides of the first housing 1310. The first magnet unit 1320 may include a first magnet 1321 located on the first side 1301 and a second magnet 1322 located on the third side 1303.

The first and second magnets 1321 and 1322 may be symmetrical about the optical axis of the first camera module. The first and second magnets 1321 and 1322 may have a size and shape that are symmetrical about the optical axis of the first camera module. The first and second magnets 1321 and 1322 may be disposed at corresponding positions around the optical axis of the first camera module. The first and second magnets 1321 and 1322 may be arranged parallel to each other. The first and second magnets 1321 and 1322 may be arranged so that the same polarity faces inward. The first and second magnets 1321 and 1322 may be arranged so that the N pole faces inward. The first and second magnets 1321 and 1322 may have a flat plate shape. In this case, the first and second magnets 1321 and 1322 may be referred to as “flat magnets.”

The third magnet unit 1410 may be located on the side of the first housing 1310 opposite the second housing 2310. The third magnet unit 1410 may be located on the second side 1302 of the first housing 1310. The third magnet unit 1410 may be disposed between the first magnet 1321 and the second magnet 1322. The third magnet unit 1410 may be smaller than the first magnet 1321. The third magnet unit 1410 may have a smaller width than the first magnet 1321. The third magnet unit 1410 may have a thickness smaller than that of the first magnet 1321. The third magnet unit 1410 may have a smaller height than the first magnet 1321. Alternatively, the third magnet unit 1410 may have the same height as the first magnet 1321. The third magnet unit 1410 may be smaller than the second magnet 1322. The third magnet unit 1410 may be located on an imaginary line connecting the optical axis of the first camera module and the optical axis of the second camera module. The third magnet unit 1410 may be arranged so that the same polarity as the first and second magnets 1321 and 1322 faces inward. The third magnet unit 1410 may be arranged so that the N pole faces inward. Alternatively, the third magnet unit 1410 may be arranged so that the S pole faces inward.

In this embodiment, the magnetic force exerted by the magnet of the AF camera module on the corner magnet of the OIS camera module can be minimized by placing the third magnet unit 1410 on the AF camera module equipped with a flat magnet. If the third magnet unit 1410 is removed in this embodiment without current correction, the optical axis of the second camera module may move by more than 5 μm.

The fourth magnet unit 1420 may be located in the first housing 1310. The fourth magnet unit 1420 may be located on the fourth side 1304 of the first housing 1310. The fourth magnet unit 1420 may be arranged to be symmetrical to the third magnet unit 1410 about the optical axis of the first camera module. The fourth magnet unit 1420 may be disposed at a position corresponding to the third magnet unit 1410 around the optical axis of the first camera module. The fourth magnet unit 1420 may have a size and shape corresponding to the third magnet unit 1410 around the optical axis of the first camera module. The fourth magnet unit 1420 may be disposed between the first magnet 1321 and the second magnet 1322. The fourth magnet unit 1420 may be smaller than the first magnet 1321. The fourth magnet unit 1420 may have a smaller width than the first magnet 1321. The fourth magnet unit 1420 may have a thickness smaller than that of the first magnet 1321. The fourth magnet unit 1420 may have a smaller height than the first magnet 1321. Alternatively, the fourth magnet unit 1420 may have the same height as the first magnet 1321. The fourth magnet unit 1420 may be smaller than the second magnet 1322. The fourth magnet unit 1420 may be located on a virtual straight line connecting the optical axis of the first camera module and the optical axis of the second camera module. The fourth magnet unit 1420 may be arranged so that the same polarity as the first and second magnets 1321 and 1322 faces inward. The fourth magnet unit 1420 may be arranged so that the same polarity as the third magnet unit 1410 faces inward. The fourth magnet unit 1420 may be arranged so that the N pole faces inward. Alternatively, the fourth magnet unit 1420 may be arranged so that the S pole faces inward.

In this embodiment, by arranging the fourth magnet unit 1420 corresponding to the third magnet unit 1410, the third magnet unit 1410 can offset the influence of the AF driving of the first camera module. Alternatively, the fourth magnet unit 1420 may have a symmetrical influence on the influence of the third magnet unit 1410 on the AF operation of the first camera module.

The first base 1500 may be located on the lower side of the first housing 1310. The first base 1500 may be located on the top surface of the first substrate 100. A first infrared filter may be coupled to the first base 1500.

The first base 1500 may include an opening 1510, a support portion 1520, a terminal receiving groove 1530, and a step portion 1540. However, in the first base 1500, one or more of the opening 1510, support 1520, terminal receiving groove 1530, and step 1540 may be omitted or changed.

The opening 1510 may be formed at the center of the first base 1500. The opening 1510 may be formed to penetrate up and down the first base 1500. The opening 1510 may overlap the first lens module in the optical axis direction. The opening 1510 may pass light that has passed through the first lens module.

The support portion 1520 may protrude upward from the upper surface of the first base 1500. Support portions 1520 may be formed at each of the four corners. The support portion 1520 may be fitted to the first housing 1310. Through this shape, the support portion 1520 can secure the first housing 1310 to the inside.

The terminal receiving groove 1530 may be formed on the side of the first base 1500. The terminal receiving groove 1530 may be formed by a portion of the outer side of the first base 1500 being depressed inward. The terminal receiving groove 1530 can accommodate at least a portion of the terminal portion 1624 of the first lower support member 1620. The terminal receiving groove 1530 may be formed to have a width corresponding to that of the terminal portion 1624.

The step portion 1540 may be formed at the bottom of the outer surface of the first base 1500. The step portion 1540 may be formed to protrude outward from the outer surface of the first base 1500. The step portion 1540 may support the lower end of the side plate 1102 of the first cover member 1100.

The AF support member 1600 may be coupled to the first bobbin 1210 and the first housing 1310. The AF support member 1600 can elastically support the first bobbin 1210. The AF support member 1600 may support the first bobbin 1210 movably with respect to the first housing 1310. At least a portion of the AF support member 1600 may have elasticity.

The AF support member 1600 may include a first upper support member 1610 and a first lower support member 1620. However, in the AF support member 1600, one or more of the first upper support member 1610 and the first lower support member 1620 may be omitted or changed.

The first upper support member 1610 may be coupled to the top of the first bobbin 1210 and the top of the first housing 1310. The first upper support member 1610 may be formed integrally.

The first upper support member 1610 may include an outer portion 1611, an inner portion 1612, and a connection portion 1613. However, in the first upper support member 1610, one or more of the outer portion 1611, the inner portion 1612, and the connecting portion 1613 may be omitted or changed.

The outer portion 1611 may be coupled to the first housing 1310. The outer portion 1611 may be coupled to the upper surface of the first housing 1310.

The inner portion 1612 may be coupled to the first bobbin 1210. The inner portion 1612 may be coupled to the upper surface of the first bobbin 1210.

The connection portion 1613 may connect the outer portion 1611 and the inner portion 1612. The connection portion 1613 can elastically connect the outer portion 1611 and the inner portion 1612. The connection portion 1613 may have elasticity.

The first lower support member 1620 may be coupled to the lower part of the first bobbin 1210 and the lower part of the first housing 1310. The first upper support member 1610 may be electrically connected to the first coil 1220. The first lower support member 1620 may include first and second support units 1620a and 1620b. Each of the first and second support units 1620a and 1620b may be coupled to a pair of lead lines of the first coil 1220.

The first lower support member 1620 may include an outer portion 1621, an inner portion 1622, a connection portion 1623, and a terminal portion 1624. However, in the first lower support member 1620, one or more of the outer part 1621, the inner part 1622, the connection part 1623, and the terminal part 1624 may be omitted or changed.

The outer portion 1621 may be coupled to the first housing 1310. The outer portion 1621 may be coupled to the lower surface of the first housing 1310.

The inner portion 1622 may be coupled to the first bobbin 1210. The inner portion 1622 may be coupled to the lower surface of the first bobbin 1210.

The connection portion 1623 may connect the outer portion 1621 and the inner portion 1622. The connection portion 1623 can elastically connect the outer portion 1621 and the inner portion 1622. The connection portion 1623 may have elasticity.

The terminal portion 1624 may extend from the outer portion 1621. The terminal portion 1624 may be formed by bending from the outer portion 1621. The terminal portion 1624 may be bent and extended downward from the outer portion 1621. Alternatively, as a modified example, the terminal portion 1624 may be provided as a separate member from the outer portion 1621. The separately provided terminal portion 1624 and the outer portion 1621 may be coupled by a conductive member. The terminal portion 1624 may be coupled to the first substrate 100. The terminal portion 1624 may be coupled to the first substrate 100 by soldering. The terminal portion 1624 may be accommodated in the terminal receiving groove 1530 of the first base 1500.

The second camera module includes a second lens driving device 2000, a second lens module (not shown), a second infrared filter (not shown), a second image sensor 10, a second substrate 200, and a second control unit. (not shown) may be included. However, in the second camera module, one or more of the second lens driving device 2000, the second lens module, the second infrared filter, the second image sensor 20, the second substrate 200, and the second control unit are omitted. Or it may change. Here, the description of the second image sensor 20 and the second substrate 200 is the same as described above.

The second lens module may include a lens and a lens barrel. The second lens module may include one or more lenses (not shown) and a lens barrel that accommodates one or more lenses. However, the configuration of the second lens module is not limited to the lens barrel, and any holder structure capable of supporting one or more lenses is possible. The second lens module is coupled to the second lens driving device 2000 and can move together with the second lens driving device 2000. The second lens module may be coupled to the inside of the second lens driving device 2000. The second lens module may be screw-coupled with the second lens driving device 2000. The second lens module may be coupled to the second lens driving device 2000 using an adhesive (not shown). Meanwhile, light passing through the second lens module may be irradiated to the second image sensor 20. The second lens module may be arranged so that its optical axis is aligned with the first lens module.

The second infrared filter may block light in the infrared region from being incident on the second image sensor 20. The second infrared filter may be located between the second lens module and the second image sensor 20. The second infrared filter may be located on a holder member (not shown) that is provided separately from the second base 2500. However, the second infrared filter may be mounted in the opening 2510 formed in the center of the second base 2500. The second infrared filter may be made of a film material or a glass material. The second infrared filter may be formed by coating an infrared blocking coating material on a flat optical filter, such as a cover glass for protecting the imaging surface. The second infrared filter may be an infrared blocking filter or an infrared absorbing filter.

The second control unit may be mounted on the second board 200. The second control unit may be located outside the second lens driving device 2000. However, the second control unit may be located inside the second lens driving device 2000. The second control unit can control the direction, intensity, and amplitude of the current supplied to each component of the second lens driving device 2000. The second control unit may control the second lens driving device 2000 to perform one or more of the autofocus function and the camera shake correction function of the second camera module. That is, the second control unit can control the second lens driving device 2000 to move the second lens module in the optical axis direction, or to move or tilt the second lens module in a direction perpendicular to the optical axis direction. Furthermore, the second control unit may perform feedback control of the autofocus function and the handshake correction function. In more detail, the second control unit receives the position of the second bobbin 2210 and/or the second housing 2310 detected by the Hall sensor 2800 and an additional sensor (not shown) and operates the second coil 2220 and /Or by controlling the power or current applied to the third coil 2422, a more precise autofocus function and/or camera shake correction function can be provided.

The second lens driving device 2000 includes a second cover member 2100, an AF movable member 2200, an OIS movable member 2300, a stator 2400, a second base 2500, an AF support member 2600, It may include an OIS support member 2700 and a Hall sensor 2800. However, in the second camera module 2000, a second cover member 2100, an AF movable member 2200, an OIS movable member 2300, a stator 2400, a second base 2500, and an AF support member 2600. , one or more of the OIS support member 2700 and the Hall sensor 2800 may be omitted or changed.

The second cover member 2100 can accommodate the second housing 2310. The second cover member 2100 may be spaced apart from the first cover member 1100. At this time, the separation distance between the second cover member 2100 and the first cover member 1100 may be within 4 mm. Alternatively, the separation distance between the second cover member 2100 and the first cover member 1100 may be within 3 mm. Alternatively, the separation distance between the second cover member 2100 and the first cover member 1100 may be within 2 mm. The separation distance between the second cover member 2100 and the first cover member 1100 may be 1 mm.

The second cover member 2100 may form the exterior of the second lens driving device 2000. The second cover member 2100 may have a hexahedral shape with an open bottom. However, it is not limited to this. The second cover member 2100 may be a non-magnetic material. If the second cover member 2100 is made of a magnetic material, the magnetic force of the second cover member 2100 may affect the second magnet unit 2320. The second cover member 2100 may be formed of a metal material. In more detail, the second cover member 2100 may be made of a metal plate. In this case, the second cover member 2100 can block electromagnetic interference (EMI). Because of these characteristics of the second cover member 2100, the second cover member 2100 may be referred to as an “EMI shield can.” The second cover member 2100 can block radio waves generated outside the second lens driving device from flowing into the second cover member 2100. Additionally, the second cover member 2100 may block radio waves generated inside the second cover member 2100 from being emitted to the outside of the second cover member 2100. However, the material of the second cover member 2100 is not limited thereto.

The second cover member 2100 may include a top plate 2101 and a side plate 2102. The second cover member 2100 may include an upper plate 2101 and a side plate 2102 extending downward from the outside of the upper plate 2101. The lower end of the side plate 2102 of the second cover member 2100 may be mounted on the second base 2500. The second cover member 2100 may be mounted on the second base 2500 with its inner surface in close contact with part or all of the side surface of the second base 2500. The internal space formed by the second cover member 2100 and the second base 2500 includes an AF movable member 2200, an OIS movable member 2300, a stator 2400, an AF support member 2600, and an OIS support member. (2700) may be located. Through this structure, the second cover member 2100 can protect internal components from external impact and simultaneously prevent penetration of external contaminants. However, it is not limited to this, and the lower end of the side plate 2102 of the second cover member 2100 may be directly coupled to the second substrate 200 located below the second base 2500.

Some of the plurality of side plates 2102 may face the first cover member 1100. The longitudinal length of the side plate 2102 of the second cover member 2100 (see L2 in FIG. 11) is the longitudinal length of the side plate 1102 of the first cover member 1100 (see L1 in FIG. 11). may not exceed 1.5 times.

The second cover member 2100 may include an opening 2110 and a marking portion 2120. However, the marking portion 2120 may be omitted or changed in the second cover member 2100.

The opening 2110 may be formed in the upper plate 2101. The opening 2110 may expose the second lens module. The opening 2110 may be provided in a shape corresponding to the second lens module. The size of the opening 2110 may be larger than the diameter of the second lens module so that the second lens module can be assembled through the opening 2110. Meanwhile, light introduced through the opening 2110 may pass through the second lens module. At this time, the light passing through the second lens module can be acquired as an image by the second image sensor.

The marking portion 2120 may be formed on the upper plate 2102 of the second cover member 2100. The marking portion 2120 may be formed so that the operator can see the direction of the second cover member 2100 at a glance. In the case of the OIS lens driving device, since directionality is important when soldering on a printed circuit board, a marking portion 2120 can be formed so that workers can easily recognize the directionality of the OIS lens driving device. The marking portion 2120 may be formed on one corner of the upper plate 2102.

The AF mover 2200 may be combined with the second lens module. The AF mover 2200 can accommodate the second lens module inside. The outer circumferential surface of the second lens module may be coupled to the inner circumferential surface of the AF mover 2200. The AF mover 2200 can move integrally with the second lens module through interaction with the OIS mover 2300 and/or the stator 2400.

The AF mover 2200 may include a second bobbin 2210 and a second coil 2220. However, in the AF mover 2200, one or more of the second bobbin 2210 and the second coil 2220 may be omitted or changed.

The second bobbin 2210 may be located inside the second housing 2310. The second bobbin 2210 can be accommodated in the through hole 2311 of the second housing 2310. The second bobbin 2210 may be combined with the second lens module. In more detail, the outer peripheral surface of the second lens module may be coupled to the inner peripheral surface of the second bobbin 2210. A second coil 2220 may be coupled to the second bobbin 2210. The lower part of the second bobbin 2210 may be coupled to the second lower support member 2620. The upper part of the second bobbin 2210 may be coupled to the second upper support member 2610. The second bobbin 2210 may move in the optical axis direction with respect to the second housing 2310.

The second bobbin 2210 may include a through hole 2211 and a coil receiving portion 2212. However, in the second bobbin 2210, one or more of the through hole 2211 and the coil receiving portion 2212 may be omitted or changed.

The through hole 2211 may be formed inside the second bobbin 2210. The through hole 2211 may be formed as open top and bottom. A second lens module may be coupled to the through hole 2211. A screw thread having a shape corresponding to a screw thread formed on the outer circumference of the second lens module may be formed on the inner peripheral surface of the through hole 2211. That is, the through hole 2211 can be screwed to the second lens module. An adhesive may be interposed between the second lens module and the second bobbin 2210. At this time, the adhesive may be an epoxy that is cured by ultraviolet rays (UV), heat, or laser. That is, the second lens module and the second bobbin 2210 may be bonded using ultraviolet curing epoxy and/or heat curing epoxy.

The coil receiving portion 2212 may accommodate at least a portion of the second coil 2220. The coil receiving portion 2212 may be formed integrally with the outer surface of the second bobbin 2210. Additionally, the coil receiving portion 2212 may be formed continuously along the outer surface of the second bobbin 2210 or may be formed spaced apart at predetermined intervals. As an example, the coil receiving portion 2212 may be formed by recessing a portion of the outer surface of the second bobbin 2210 to correspond to the shape of the second coil 2220. At this time, the second coil 2220 may be serially wound around the coil receiving portion 2212. As a variation, the coil receiving portion 2212 may be formed to be open at the top or bottom. At this time, the second coil 2220 may be inserted and coupled to the coil receiving portion 2212 through the open portion in a pre-wound state.

The second coil 2220 may be located on the second bobbin 2210. The second coil 2220 may be disposed on the outer peripheral surface of the second bobbin 2210. The second coil 2220 may be directly wound on the outer peripheral surface of the second bobbin 2210. The second coil 2220 may electromagnetically interact with the second magnet unit 2320. The second coil 2220 may face the second magnet unit 2320. In this case, when current is supplied to the second coil 2220 and a magnetic field is formed around the second coil 2220, electromagnetic interaction between the second coil 2220 and the second magnet unit 2320 creates a magnetic field. 2 Coils 2220 can move with respect to the second magnet unit 2320. The second coil 2220 can move for AF driving. In this case, the second coil 2220 may be referred to as an “AF coil.”

The second coil 2220 may include a pair of lead wires (not shown) for power supply. A pair of lead wires of the second coil 2220 may be electrically connected to the second upper support member 2610. Each pair of lead wires of the second coil 2220 may be electrically connected to the third and fourth support units 2610a and 2610b. In this case, the second coil 2220 is connected to the second coil 2220 through the second upper support member 2610, which is electrically connected to the second substrate 200 through the substrate 2410, the substrate portion 2421, and the OIS support member 2700. Power can be supplied.

The OIS movable unit 2300 can be moved for image stabilization function. The OIS mover 2300 may be located outside the AF mover 2200 and opposite to the AF mover 2200. The OIS mover 2300 can move the AF mover 2200 or move together with the AF mover 2200. The OIS mover 2300 may be movably supported by the stator 2400 and/or the second base 2500 located below. The OIS mover 2300 may be located in the inner space of the second cover member 2100.

The OIS mover 2300 may include a second housing 2310 and a second magnet unit 2320. However, in the OIS mover 2300, one or more of the second housing 2310 and the second magnet unit 2320 may be omitted or changed.

The second housing 2310 may be positioned to be spaced apart from the first housing 1310 of the first camera module 1000. The second housing 2310 may be located outside the second bobbin 2210. The second housing 2310 may be positioned spaced apart from the second bobbin 2210. At least a portion of the second housing 2310 may be formed in a shape corresponding to the inner surface of the second cover member 2100. In particular, the outer surface of the second housing 2310 may be formed in a shape corresponding to the inner surface of the side plate 2102 of the second cover member 2100. As an example, the second housing 2310 may have a hexahedral shape including four sides. However, the shape of the second housing 2310 may be any shape that can be placed inside the second cover member 2100. The second housing 2310 may be formed of an insulating material. The second housing 2310 may be formed as an injection molded product considering productivity. The second housing 2310 is a movable part for OIS operation and may be placed at a certain distance from the second cover member 2100. A second upper support member 2610 may be coupled to the upper part of the second housing 2310. A second lower support member 2620 may be coupled to the lower part of the second housing 2310.

The second housing 2310 may include fifth to eighth sides 2301, 2302, 2303, and 2304. The second housing 2310 may include fifth to eighth sides 2301, 2302, 2303, and 2304 that are continuously arranged. The eighth side 2304 may face the second side 1302.

The second housing 2310 may include a through hole 2311 and a magnet receiving portion 2312. However, in the second housing 2310, one or more of the through hole 2311 and the magnet receiving portion 2312 may be omitted or changed.

The through hole 2311 may be formed inside the second housing 2310. The through hole 2311 may be formed in the second housing 2310 to be open at the top and bottom. The second bobbin 2210 can be accommodated in the through hole 2311. The second bobbin 2210 may be movably disposed in the through hole 2311. The through hole 2311 may be provided in a shape corresponding to the second bobbin 2210.

The magnet receiving portion 2312 may be formed on the side of the second housing 2310. The magnet receiving portion 2312 may accommodate at least a portion of the second magnet unit 2320. An adhesive (not shown) may be disposed between the magnet receiving portion 2312 and the second magnet unit 2320. That is, the magnet receiving portion 2312 and the second magnet unit 2320 may be coupled with an adhesive. The magnet receiving portion 2312 may be located on the inner surface of the second housing 2310. The magnet receiving portion 2312 may be formed by partially recessing the inner surface of the second housing 2310 to the outside. In this case, there is an advantage in electromagnetic interaction with the second coil 2220 located inside the second magnet unit 2320. The magnet receiving portion 2312 may have an open bottom. In this case, there is an advantage in electromagnetic interaction with the third coil 2422 located below the second magnet unit 2320.

The second magnet unit 2320 may be located in the second housing 2310. The second magnet unit 2320 may be accommodated in the magnet receiving portion 2312 of the second housing 2310. The second magnet unit 2320 may electromagnetically interact with the second coil 2220. The second magnet unit 2320 may face the second coil 2220. The second magnet unit 2320 can move the second bobbin 2210 to which the second coil 2220 is fixed. The second magnet unit 2320 can move the second coil 2220 for AF driving. In this case, the second magnet unit 2320 may be referred to as an “AF driving magnet.” Additionally, the second magnet unit 2320 can move to drive OIS. In this case, the second magnet unit 2320 may be referred to as an “OIS driving magnet.” Accordingly, the second magnet unit 2320 may be called an “AF/OIS common driving magnet.”

The second magnet unit 2320 may include four corner magnets. The four corner magnets can be arranged so that the N pole faces inward. Alternatively, the four corner magnets may be arranged so that the S pole faces inward. The four corner magnets may have a pillar shape where the inner side is larger than the outer side.

The stator 2400 may be located below the AF mover 2200. The stator 2400 may be located below the OIS mover 2300. The stator 2400 can move the OIS mover 2300. At this time, the AF mover 2200 can also be moved along with the OIS mover 2300. That is, the stator 2400 can move the AF mover 2200 and the OIS mover 2300.

The stator 2400 may include a substrate 2410 and a third coil portion 2420. However, in the stator 2400, one or more of the substrate 2410 and the third coil unit 2420 may be omitted or changed.

The substrate 2410 may be a flexible printed circuit board (FPCB). The substrate 2410 may be placed on the upper surface of the second base 2500. The substrate 2410 may be positioned between the second base 2500 and the third coil portion 2420. The substrate 2410 may be electrically connected to the third coil 2422. The substrate 2410 may be electrically connected to the second coil 2220. The substrate 2410 may be electrically connected to the second coil 2220 through the OIS support member 2700 and the second upper support member 2610.

The substrate 2410 may include a through hole 2411 and a terminal portion 2412. However, in the substrate 2410, one or more of the through hole 2411 and the terminal portion 2412 may be omitted or changed.

The through hole 2411 may be formed in the center of the substrate 2410. The through hole 2411 may be formed to penetrate upward and downward through the substrate 2410. The through hole 2411 may overlap the second lens module in the optical axis direction. The through hole 2411 can pass light that has passed through the second lens module.

The terminal portion 2412 may be formed by bending a portion of the substrate 2410. The terminal portion 2412 may be formed by bending a portion of the substrate 2410 downward. At least a portion of the terminal portion 2412 may be exposed to the outside. The lower end of the terminal portion 2412 may be coupled to the second substrate 200. The terminal portion 2412 may be soldered to the second substrate 200. The substrate 2410 may be electrically connected to the second substrate 200 through the terminal portion 2412.

The third coil unit 2420 may be disposed on the upper surface of the substrate 2410. The third coil unit 2420 may be disposed on the second base 2500. The third coil portion 2420 may face the second magnet unit 2320. The third coil unit 2420 may electromagnetically interact with the second magnet unit 2320. The third coil unit 2420 can move the second magnet unit 2320 to drive OIS.

The third coil unit 2420 may include a substrate unit 2421 and a third coil 2422. However, in the third coil unit 2420, one or more of the substrate unit 2421 and the third coil 2422 may be omitted or changed.

The substrate portion 2421 may be a flexible printed circuit board (FPCB). The third coil 2422 may be formed in the substrate portion 2421 as a fine pattern coil (FPC). The substrate portion 2421 may be disposed on the upper surface of the substrate 2410. The substrate 2421 may be electrically connected to the substrate 2410. The substrate portion 2421 may be electrically connected to the third coil 2422.

The third coil 2422 may be formed as a fine pattern coil (FPC) on the substrate 2421. The third coil 2422 may be located on the base 2500. The third coil 2422 may electromagnetically interact with the second magnet unit 2320. The third coil 2422 may face the second magnet unit 2320. In this case, when current is supplied to the third coil 2422 and a magnetic field is formed around the third coil 2422, electromagnetic interaction between the third coil 2422 and the second magnet unit 2320 creates a magnetic field. The 2 magnet unit 2320 can move with respect to the third coil 2422. The third coil 2422 can move the second magnet unit 2320 to drive OIS. In this case, the third coil 2422 may be referred to as an “OIS coil.”

The second base 2500 may be located on the lower side of the second housing 2310. The second base 2500 may movably support the second housing 2310. The second base 2500 may be located on the upper surface of the second substrate 200. A second infrared filter may be coupled to the second base 2500.

The second base 2500 may include an opening 2510, a terminal accommodating part 2520, and a sensor accommodating part 2530. However, in the second base 2500, one or more of the opening 2510, the terminal accommodating part 2520, and the sensor accommodating part 2530 may be omitted or changed.

The opening 2510 may be formed at the center of the second base 2500. The opening 2510 may be formed to penetrate up and down the second base 2500. The opening 2510 may overlap the second lens module in the optical axis direction. The opening 2510 may pass light that has passed through the second lens module.

The terminal receiving portion 2520 may be formed on the side of the second base 2500. The terminal receiving portion 2520 may be formed by partially recessing the outer side of the second base 2500 inward. The terminal receiving portion 2520 may accommodate at least a portion of the terminal portion 2412 of the board 2410. The terminal receiving portion 2520 may be formed to have a width corresponding to that of the terminal portion 2412.

The sensor receiving portion 2530 may be formed on the upper surface of the second base 2500. The sensor receiving portion 2530 may be formed by partially recessing the upper surface of the second base 2500 downward. The sensor receiving portion 2530 may be formed as a groove. The sensor accommodation unit 2530 may accommodate at least a portion of the Hall sensor 2800. The sensor receiving portion 2530 may be formed in a shape corresponding to the hall sensor 2800. The sensor receiving portion 2530 may be formed in a number corresponding to the number of hall sensors 2800. There may be two sensor receptors 2530.

The AF support member 2600 may be coupled to the second bobbin 2210 and the second housing 2310. The AF support member 2600 can elastically support the second bobbin 2210. The AF support member 2600 may support the second bobbin 2210 movably with respect to the second housing 2310. At least a portion of the AF support member 2600 may have elasticity.

The AF support member 2600 may include a second upper support member 2610 and a second lower support member 2620. However, in the AF support member 2600, one or more of the second upper support member 2610 and the second lower support member 2620 may be omitted or changed.

The second upper support member 2610 may be coupled to the upper part of the second bobbin 2210 and the upper part of the second housing 2310. The second upper support member 2610 may be electrically connected to the second coil 2220. The second upper support member 2610 may include third and fourth support units 2610a and 2610b. Each of the third and fourth support units 2610a and 2610b may be coupled to a pair of lead lines of the second coil 2220.

The second upper support member 2610 may include an outer portion 2611, an inner portion 2612, a connecting portion 2613, and a coupling portion 2614. However, in the second upper support member 2610, one or more of the outer portion 2611, the inner portion 2612, the connecting portion 2613, and the coupling portion 2614 may be omitted or changed.

The outer portion 2611 may be coupled to the second housing 2310. The outer portion 2611 may be coupled to the upper surface of the second housing 2310.

The inner portion 2612 may be coupled to the second bobbin 2210. The inner portion 2612 may be coupled to the upper surface of the second bobbin 2210.

The connection portion 2613 may connect the outer portion 2611 and the inner portion 2612. The connection portion 2613 can elastically connect the outer portion 2611 and the inner portion 2612. The connection portion 2613 may have elasticity.

The coupling portion 2614 may extend from the outer portion 2611. The coupling portion 2614 may extend outward from the outer portion 2611. The coupling portion 2614 may be located on the four corner sides of the second housing 2310. The coupling portion 2614 may be coupled to the OIS support member 2700.

The second lower support member 2620 may be coupled to the lower part of the second bobbin 2210 and the lower part of the second housing 2310. The second lower support member 2620 may be formed integrally.

The second lower support member 2620 may include an outer portion 2621, an inner portion 2622, and a connection portion 2623. However, in the second lower support member 2620, one or more of the outer part 2621, the inner part 2622, and the connection part 2623 may be omitted or changed.

The outer portion 2621 may be coupled to the second housing 2310. The outer portion 2621 may be coupled to the lower surface of the second housing 2310.

The inner portion 2622 may be coupled to the second bobbin 2210. The inner portion 2622 may be coupled to the lower surface of the second bobbin 2210.

The connection part 2623 can connect the outer part 2621 and the inner part 2622. The connection portion 2623 can elastically connect the outer portion 2621 and the inner portion 2622. The connection portion 2623 may have elasticity.

The OIS support member 2700 can movably support the second housing 2310. The OIS support member 2700 can movably support the OIS mover 2300 with respect to the stator 2400. The lower end of the OIS support member 2700 may be coupled to the third coil portion 2420. The upper end of the OIS support member 2700 may be coupled to the second upper support member 2610. The OIS support member 2700 may include a plurality of wires. Alternatively, the OIS support member 2700 may include a plurality of plate slings. The OIS support member 2700 may have elasticity at least in part. The OIS support member 2700 may be formed as a current-carrying member. The second coil unit 2420 and the second upper support member 2610 may be energized by the OIS support member 2700. The OIS support member 2700 may be provided in four pieces so that it can be disposed at each of the four corners of the second housing 2310.

A damper (not shown) may be disposed on the OIS support member 2700 and the second housing 2310. Dampers may be disposed on the OIS support member 2700 and the AF support member 2600. The damper can prevent resonance that can occur in AF/OIS feedback drive. Alternatively, as a modified example, a buffer portion (not shown) formed by changing the shape of a portion of the OIS support member 2700 and/or the AF support member 2600 may be provided instead of the damper. The buffer portion may be bent or curved.

The Hall sensor 2800 can be used for an image stabilization feedback function. The Hall sensor 2800 may be a Hall IC. The Hall sensor 2800 can detect the magnetic force of the second magnet unit 2320. The Hall sensor 2800 can detect movement of the second housing 2310. The Hall sensor 2800 can detect the second magnet unit 2320 fixed to the second housing 2310. The Hall sensor 2800 may be electrically connected to the substrate 2410. The Hall sensor 2800 may be accommodated in the sensor receiving portion 2530 of the second base 2500. Two Hall sensors 2800 are arranged at an angle of 90 degrees to each other with respect to the optical axis, and can detect the movement of the second housing 2310 as x-axis and y-axis components.

Below, a method of manufacturing a dual camera module according to this embodiment will be described.

The manufacturing method of the dual camera module is to mount the first image sensor 10 on the first substrate 100, and to install a first image sensor 10 spaced apart from the first substrate 100 and connected to the first substrate 100 by a connection unit 400. Mounting the second image sensor 20 on the second substrate 200, coupling the first lens driving device 1000 to which the first lens module is coupled to the first substrate 100, the second lens module A step of coupling the combined second lens driving device 2000 to the second substrate 200, a step of coupling the first substrate 100 to the stiffener 40, and the step of coupling the second substrate 200 to the stiffener 40. It may include a step of binding to.

The step of coupling the first lens driving device 1000 to the first substrate 100 involves temporarily bonding the first substrate 100 and the first lens driving device 1000 with a first epoxy (not shown). It may include aligning the first lens module and the first image sensor 10 and curing the first epoxy. The step of coupling the second lens driving device 2000 to the second substrate 200 involves temporarily bonding the second substrate 200 and the second lens driving device 2000 with a second epoxy (not shown). It may include aligning the second lens module and the second image sensor 20 and curing the second epoxy. The step of coupling the second substrate 200 to the stiffener 40 involves attaching the second substrate 200 and the stiffener 40 to the first image sensor 10 in a state where the second substrate 200 and the stiffener 40 are temporarily bonded by a third epoxy (not shown). It may include aligning the second image sensor 20 and curing the third epoxy.

Here, the step of coupling the first lens driving device 1000 to the first substrate 100 and the step of coupling the second lens driving device 2000 to the second substrate 200 are realized before the other step. It can be done and it can be realized at the same time. In addition, although it has been described that the first substrate 100 is first coupled to the stiffener 40 and the second substrate 200 is coupled to the stiffener 40 later, the second substrate 200 is coupled to the stiffener 40 first. And the first substrate 100 can be later combined with the stiffener 40. In addition, the stiffener 40 is not limited to a flat steel material and may also include a wall of the main body of an optical device.

In this embodiment, as described, active alignment may be performed a total of three times to complete alignment of the first camera module and the second camera module. In this process, the connection unit 400 fluidly connects the first substrate 100 and the second substrate 200, so that the first lens driving device 1000 is attached to each of the first substrate 100 and the second substrate 200. And it functions so that mutual alignment can be performed even when the second lens driving device 2000 is coupled. On the other hand, the connection unit 400 restricts the movement of the first substrate 100 and the second substrate 200, so either the first substrate 100 or the second substrate 200 is connected to the stiffener 40. In the process of fixing it first, it prevents the other one from deviating from its correct position.

Hereinafter, the configuration of the dual camera module according to the modified example will be described with reference to the drawings.

Figure 13 is a perspective view showing a printed circuit board and related configuration of a dual camera module according to a modification.

The dual camera module according to the modified example may include a first image sensor 10, a first substrate 100, a second image sensor 20, a second substrate 200, and a third substrate 300. That is, the dual camera module according to the modified example may have the connection unit 400 omitted compared to the dual camera module according to the present embodiment. Meanwhile, the description in this embodiment can be inferred and applied to the configuration corresponding to the present embodiment among the configurations of the modified example.

The modified example has the advantage of being able to adjust the alignment after mounting the first and second image sensors 10 and 20, as in the present embodiment. However, compared to the present embodiment, the first substrate 100 and the second substrate 200 are connected only by the third substrate 300, so the process of transferring the first and second substrates 100 and 200 and the first substrate 200 are connected only by the third substrate 300. There is a disadvantage in that it is difficult to maintain the first substrate 100 and the second substrate 200 aligned side by side during the process of coupling the second substrates 100 and 200 to the stiffener 40.

Hereinafter, the configuration of the dual camera module according to different variations will be described with reference to the drawings.

Figure 14 is a perspective view showing a printed circuit board and related configuration of a dual camera module according to another modification.

A dual camera module according to another modification includes a first image sensor 10, a first substrate 100, a second image sensor 20, a second substrate 200, a third substrate 300, and a connection unit 400. ) may include. However, the dual camera module according to another modification may have a difference in the shape of the third substrate 300 compared to the dual camera module according to the present embodiment. Meanwhile, the description in this embodiment can be inferred and applied to the configuration corresponding to the present embodiment among the configurations of other modified examples.

The third substrate 300 may include a first connection part 340 and a second connection part 350. That is, the third substrate 300 according to another modification may have the body portion 310 omitted compared to the third substrate 300 according to the present embodiment. Additionally, the connector 30 may be omitted. The first connection portion 340 of the third substrate 300 according to another modification corresponds to the first connection portion 320 of the third substrate 300 according to the present embodiment, and the third substrate according to another modification ( The second connection portion 350 of 300 may correspond to the second connection portion 330 of the third substrate 300 according to this embodiment.

The first connection part 340 can be electrically connected to an external component through connector connection bonding using ACF. The first connection part 340 may be connected to the first substrate 100. The first connection part 340 may be spaced apart from the second connection part 330. A space may be disposed between the first connection part 340 and the second connection part 350. The first connection part 340 may be connected to the third side 102 of the first substrate 100. The first connection portion 340 may be connected to the third side 102 with a bias toward the corner on the side closer to the second substrate 200 among both corners of the third side 102.

The first connection part 350 can be electrically connected to an external component through connector connection bonding using ACF. The second connection portion 350 may be connected to the second substrate 200. The second connection part 350 may be spaced apart from the first connection part 340. The second connection portion 350 may be connected to the fourth side 202 of the second substrate 200. The second connection portion 350 may be connected to the fourth side 202 with a bias toward the corner on the side closer to the first substrate 100 among both corners of the fourth side 202.

In the above, even though all the components constituting the embodiment of the present invention have been described as being combined or operated in combination, the present invention is not necessarily limited to this embodiment. That is, as long as it is within the scope of the purpose of the present invention, all of the components may be operated by selectively combining one or more of them. In addition, terms such as “include,” “comprise,” or “have” described above mean that the corresponding component may be present, unless specifically stated to the contrary, and therefore do not exclude other components. Rather, it should be interpreted as being able to include other components. All terms, including technical or scientific terms, unless otherwise defined, have the same meaning as generally understood by a person of ordinary skill in the technical field to which the present invention pertains. Commonly used terms, such as terms defined in a dictionary, should be interpreted as consistent with the contextual meaning of the related technology and, unless explicitly defined in the present invention, should not be interpreted in an idealized or overly formal sense.

The above description is merely an illustrative explanation of the technical idea of the present invention, and various modifications and variations will be possible to those skilled in the art without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but rather to explain it, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted in accordance with the claims below, and all technical ideas within the equivalent scope should be construed as being included in the scope of rights of the present invention.

10: first image sensor 20: second image sensor
30: Connector 100: First board
200: second substrate 300: third substrate
310: body portion 320: first connection portion
330: second connection 400: connection unit
410: first flowing part 420: second flowing part

Claims (15)

A rigid first substrate on which a first image sensor is disposed;
a rigid second substrate on which a second image sensor is disposed and spaced apart from the first substrate;
a third substrate connected to the first substrate and the second substrate; and
It includes a flexible connection unit connecting the first substrate and the second substrate,
The first substrate includes a first side and the second substrate includes a second side opposite the first side,
The connection unit connects the first side of the first substrate and the second side of the second substrate,
The connection unit has insulation properties and no conductive line is formed in the connection unit,
The connection unit includes a first flow part and a second flow part spaced apart from the first flow part,
The part where the first flowing part meets the first side and the part where the second flowing part meets the first side are symmetrical with respect to the center of the first side,
A dual camera module in which the cross-sectional area of the first and second moving parts parallel to the first side becomes smaller as at least a portion of the first and second moving parts are spaced apart from the first and second substrates. According to paragraph 1,
The third substrate includes a body portion, a first connection portion extending from the body portion and connected to the first substrate, and a second connection portion extending from the body portion and connected to the second substrate,
A dual camera module wherein the first connection part is spaced apart from the second connection part. According to paragraph 2,
The first substrate includes a third side adjacent to the first side, and the second substrate includes a fourth side adjacent to the second side,
A dual camera module wherein the first connection part is connected to the third side and the second connection part is connected to the fourth side. According to paragraph 3,
The first connection portion is connected to the third side with a bias toward a corner on a side closer to the second substrate among both corners of the third side,
A dual camera module wherein the second connection unit is connected to the fourth side with a bias toward a corner on a side closer to the first substrate among both corners of the fourth side. According to paragraph 2,
The third substrate is a flexible printed circuit board (FPCB),
A dual camera module in which a connector for connection to the outside is placed in the body. According to paragraph 1,
a first base disposed on the first substrate;
a first housing disposed on the first base;
a first bobbin disposed within the first housing;
A first coil disposed on the first bobbin; and
A dual camera module including a first magnet unit disposed in the first housing. According to clause 6,
A dual camera module disposed in the first housing and including a third magnet unit that is smaller than the first magnet unit. According to paragraph 1,
It includes a stiffener disposed on a lower surface of the first substrate and a lower surface of the second substrate,
A dual camera module in which the first substrate and the second substrate are coupled to the stiffener by epoxy for active align (AA). According to paragraph 1,
The connection unit is a dual camera module formed integrally with the first substrate and the second substrate. According to paragraph 1,
The length of the connection unit in the width direction is 50% or more of the length in the long side direction of the first side of the first substrate,
A dual camera module in which the width direction of the connection unit and the long side direction of the first side are parallel. delete delete main body;
The dual camera module of any one of claims 1 to 10 disposed in the main body; and
An optical device including a display unit disposed on the main body and outputting images captured by the dual camera module. delete delete

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