KR20180039846A - Lens driving device, camera module and optical apparatus - Google Patents

Abstract

The present invention relates to a lens operating device which comprises: a housing; a bobbin which is installed inside the housing in order to move in a first direction; a first coil which is installed on the outer circumferential surface of the bobbin; a first magnet which is combined with the housing; a base which is placed below the housing; a first substrate which includes a circuit member having a second coil placed between the housing and the base in order to face the first magnet; an upper elastic member which is placed in the upper part of the bobbin and is combined with the bobbin and the housing; a lower elastic member which is placed in the lower part of the bobbin and is combined with the bobbin and the housing; a supporting member which is combined with the upper elastic member and the first substrate; a current carrying member which is combined with the upper elastic member and the lower elastic member; a second magnet which is placed in the bobbin; a second substrate which is placed in the housing in order to be elastically connected with the upper elastic member; and a sensor which is placed on the second substrate in order to sense the second magnet. In addition, the second substrate is electrically connected with the first coil through the upper elastic member, the current carrying member, and the lower elastic member. Therefore, the lens operating device can include a hole driver IC where a hole element is integrated with a driver.

Description

[0001] LENS DRIVING DEVICE, CAMERA MODULE, AND OPTICAL APPARATUS [0002]

The present embodiment relates to a lens driving device, a camera module, and an optical device.

The following description provides background information for the present embodiment and does not describe the prior art.

Background of the Invention [0002] With the widespread use of various portable terminals and the commercialization of wireless Internet services, demands of consumers related to portable terminals have diversified, and various kinds of additional devices have been installed in portable terminals.

Among them, there is a camera module which photographs a subject as a photograph or a moving picture. On the other hand, in recent camera modules, an auto focus (AF) function that automatically adjusts focus according to the distance of a subject is applied. In addition, autofocus feedback control is applied to more precisely control the autofocus function.

However, in the conventional camera module to which the autofocus feedback control is applied, a change occurs in the lens and the Hall element depending on the temperature characteristic in accordance with the temperature change during operation, so that the position information of the lens is outputted incorrectly, leading to deterioration of resolution.

The present embodiment is intended to provide a lens driving apparatus including a Hall element IC in which a Hall element and a driver are integrally provided.

Another object of the present invention is to provide a lens driving apparatus including a conductive line arrangement structure for a Hall driver IC disposed in a housing.

Furthermore, it is desirable to provide a camera module and an optical device including the lens driving device.

The lens driving apparatus according to the present embodiment includes a housing; A bobbin installed inside the housing to move in a first direction; A first coil installed on an outer circumferential surface of the bobbin; A first magnet coupled to the housing; A base disposed below said housing; A first substrate including a circuit member having a second coil disposed between the housing and the base so as to face the first magnet; An upper elastic member disposed above the bobbin and coupled to the bobbin and the housing; A lower elastic member disposed below the bobbin and coupled to the bobbin and the housing; A supporting member coupled to the upper elastic member and the first substrate; An energizing member coupled to the upper elastic member and the lower elastic member; A second magnet disposed on the bobbin; A second substrate disposed on the housing and electrically connected to the upper elastic member; A sensor disposed on the second substrate and sensing the second magnet; And the second substrate may be electrically connected to the first coil through the upper elastic member, the energizing member, and the lower elastic member.

The sensor includes a driver, and the driver is electrically connected to the sensor and may have a temperature sensing function.

The sensor may be disposed on the lower surface of the first substrate, and six terminals may be formed on the upper surface of the first substrate.

The upper elastic member may include at least six upper supporting portions spaced from each other, and the six upper supporting portions may be paired with the six terminals.

The circuit member may include a substrate portion to be energized with the first substrate, and the second coil may be formed of a pattern coil on the substrate portion.

Four terminals among the six terminals are connected to the first substrate through the upper elastic member, the support member, and the base plate, and the remaining two terminals of the six terminals are connected to the upper elastic member, And the lower elastic member is connected to the first coil through a lower elastic member, and the lower elastic member may include two lower supporting portions spaced from each other.

The cover member may include an upper plate including an opening, and a side plate extending downward from the upper plate and coupled with the base.

The upper elastic member includes eight upper supporting portions spaced from each other, and the supporting members include eight wires spaced from each other, and the energizing members may include two conductive portions that are spaced apart from each other.

The energizing member may be disposed at one corner of the housing so as to be spaced apart from the supporting member.

The length of the energizing member in the longitudinal direction may be shorter than the length of the supporting member in the longitudinal direction.

And a third magnet disposed on the bobbin, wherein the third magnet is symmetrical with respect to the second magnet with respect to the optical axis.

The lens driving apparatus according to the present embodiment includes a housing including a through hole; A bobbin arranged to move along the optical axis in the through hole; A first magnet disposed in the housing; A first coil disposed in the bobbin and facing the first magnet; A stator disposed on the lower side of the housing, the stator including a second coil facing the first magnet; An upper elastic member disposed above the bobbin and coupled to the bobbin and the housing; A lower elastic member disposed below the bobbin and coupled to the bobbin and the housing; A supporting member coupled to the upper elastic member and the stator; An energizing member coupled to the upper elastic member and the lower elastic member; A second magnet disposed on the bobbin; A substrate disposed in the housing; A sensor disposed on the substrate and sensing the second magnet; And a driver disposed on the substrate and applying a current to the first coil, wherein the driver can be electrically connected to the first coil through the upper elastic member, the energizing member, and the lower elastic member.

The camera module according to the present embodiment includes a printed circuit board to which an image sensor is coupled; A lens module disposed above the image sensor; A housing disposed above the printed circuit board; A bobbin installed inside the housing to move in a first direction; A first coil installed on an outer circumferential surface of the bobbin; A first magnet coupled to the housing; A base disposed below said housing; A first substrate including a circuit member having a second coil disposed between the housing and the base so as to face the first magnet; An upper elastic member disposed above the bobbin and coupled to the bobbin and the housing; A lower elastic member disposed below the bobbin and coupled to the bobbin and the housing; A supporting member coupled to the upper elastic member and the first substrate; An energizing member coupled to the upper elastic member and the lower elastic member; A second magnet disposed on the bobbin; A second substrate disposed on the housing and electrically connected to the upper elastic member; A sensor disposed on the second substrate and sensing the second magnet; And the second substrate may be electrically connected to the first coil through the upper elastic member, the energizing member, and the lower elastic member.

The optical apparatus according to the present embodiment includes a main body, a camera module disposed in the main body and photographing a subject, and a display unit disposed on one side of the main body and outputting an image photographed by the camera module, A printed circuit board to which the image sensor is coupled; A lens module disposed above the image sensor; A housing disposed above the printed circuit board; A bobbin installed inside the housing to move in a first direction; A first coil installed on an outer circumferential surface of the bobbin; A first magnet coupled to the housing; A base disposed below said housing; A first substrate including a circuit member having a second coil disposed between the housing and the base so as to face the first magnet; An upper elastic member disposed above the bobbin and coupled to the bobbin and the housing; A lower elastic member disposed below the bobbin and coupled to the bobbin and the housing; A supporting member coupled to the upper elastic member and the first substrate; An energizing member coupled to the upper elastic member and the lower elastic member; A second magnet disposed on the bobbin; A second substrate disposed on the housing and electrically connected to the upper elastic member; A sensor disposed on the second substrate and sensing the second magnet; And the second substrate may be electrically connected to the first coil through the upper elastic member, the energizing member, and the lower elastic member.

In this embodiment, even if a temperature change occurs through the temperature sensing function of the Hall-effect IC, accurate autofocus feedback control can be realized.

1 is a perspective view of a lens driving apparatus according to the present embodiment.
2 is an exploded perspective view of the lens driving apparatus according to the present embodiment.
Figs. 3 and 4 are perspective views of a part of the configuration of the lens driving apparatus according to the present embodiment.
5 is a bottom view of a part of the configuration of the lens driving apparatus according to the present embodiment.
Figs. 6 to 9 are exploded perspective views of a part of the configuration of the lens driving apparatus according to the present embodiment.
10 is a conceptual diagram showing a communication structure of the Hall driver IC and the control unit of the camera module according to the present embodiment.
11 is a perspective view of a camera module according to the present embodiment.

Hereinafter, some embodiments of the present invention will be described with reference to exemplary drawings. In describing the components in the drawings, the same components are denoted by the same reference numerals whenever possible, even if they are displayed on other drawings.

In describing the components of the embodiment of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are intended to distinguish the constituent elements from other constituent elements, and the terms do not limit the nature, order or order of the constituent elements. When a component is described as being "connected", "coupled", or "connected" to another component, the component may be directly connected, coupled, or connected to the other component, It should be understood that another element may be "connected", "coupled" or "connected" between elements.

The 'optical axis direction' used below is defined as the optical axis direction of the lens module in a state of being coupled to the lens driving device. On the other hand, 'optical axis direction' can be used in combination with 'vertical direction', 'z axis direction', and the like.

The 'autofocus function' used below automatically adjusts the distance to the image sensor by moving the lens module in the direction of the optical axis according to the distance of the subject so that a clear image of the subject can be obtained with the image sensor. It is defined as matching function. On the other hand, 'autofocus' can be mixed with 'AF (Auto Focus)'.

The 'camera shake correction function' used below is defined as a function of moving or tilting the lens module in a direction perpendicular to the optical axis direction so as to cancel the vibration (motion) generated in the image sensor by an external force. Meanwhile, 'camera shake correction' can be mixed with 'OIS (Optical Image Stabilization)'.

Any one of the AF driving coil 220, the driving magnet 320 and the OIS driving coil 422 will be referred to as a "first driving part", the other one as a "second driving part" and the other as a "third driving part" . On the other hand, the AF drive coil 220, the drive magnet 320, and the OIS drive coil 422 can be arranged with their positions mutually changed.

Any one of the AF drive coil 220 and the OIS drive coil 422 may be referred to as a 'first coil' and the other as a 'second coil'.

Any one of the driving magnet 320, the sensing magnet 730 and the compensating magnet 740 may be referred to as a 'first magnet', another one as a 'second magnet', and the other as a 'third magnet' .

Hereinafter, the configuration of the optical device according to the present embodiment will be described.

The optical device may be any one of a mobile phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcast terminal, a PDA (Personal Digital Assistants), a PMP Lt; / RTI > However, the type of the optical device is not limited thereto, and any device for photographing the image or the photograph may be referred to as an optical device.

The optical device may include a main body (not shown), a camera module, and a display portion (not shown). However, any one or more of the main body, the camera module, and the display unit may be omitted or changed in the optical apparatus.

The body can form the appearance of the optical device. For example, the body may include a rectangular parallelepiped shape. As another example, the body may be rounded at least in part. The main body can accommodate the camera module. A display section may be disposed on one side of the main body. For example, the display unit and the camera module may be disposed on one side of the main body and the camera module may be further disposed on the other side (the side opposite to the one side) of the main body.

The camera module may be disposed in the main body. The camera module may be disposed on one side of the main body. At least a part of the camera module may be accommodated in the main body. The plurality of camera modules may be provided. The plurality of camera modules may be disposed on one surface of the main body and on each of the other surfaces of the main body. The camera module can take an image of a subject.

The display portion may be disposed in the main body. The display unit may be disposed on one side of the main body. That is, the display unit can be disposed on the same plane as the camera module. Alternatively, the display portion may be disposed on the other surface of the main body. The display portion may be disposed on a side of the main body opposite to the side on which the camera module is disposed. The display unit can output the image photographed by the camera module.

Hereinafter, the configuration of the camera module according to the present embodiment will be described with reference to the drawings.

11 is a perspective view of a camera module according to the present embodiment.

The camera module may include a lens driving device, a lens module (not shown), an infrared cut filter (not shown), a printed circuit board 10, an image sensor (not shown), and a controller 80. However, at least one of the lens driving device, the lens module, the infrared cut filter, the printed circuit board 10, the image sensor, and the control unit 80 may be omitted or changed in the camera module.

The lens module may include at least one lens. The lens module may include a lens and a lens barrel. The lens module may include at least one lens (not shown) and a lens barrel for receiving the lens. However, one configuration of the lens module is not limited to the lens barrel, and any structure can be used as long as it can support one or more lenses. The lens module may be coupled to the inside of the lens driving device. The lens module may be coupled to the bobbin 210 of the lens driving device. The lens module can move integrally with the bobbin 210. The lens module may be coupled to the bobbin 210 by an adhesive (not shown). In one example, the lens module may be threaded with the bobbin 210. On the other hand, the light having passed through the lens module can be irradiated to the image sensor.

The infrared filter can block the light of the infrared region from entering the image sensor. An infrared filter may be disposed between the lens module and the image sensor. For example, the infrared filter may be disposed on the holder member 11 provided separately from the base 430. In another example, the infrared filter may be mounted in the through hole 431 of the base 430. The infrared filter may be formed of a film material or a glass material. The infrared filter may be formed by coating an infrared blocking coating material on a plate-shaped optical filter such as a cover glass for protecting an image pickup surface or a cover glass. For example, the infrared filter may be an infrared absorbing filter that absorbs infrared rays. In another example, the infrared filter may be an infrared reflective filter that reflects infrared light.

A lens driving device may be disposed on the upper surface of the printed circuit board 10. [ The printed circuit board 10 may be disposed on the lower surface of the lens driving apparatus. The printed circuit board 10 may be combined with the lens driving apparatus. An image sensor may be disposed on the printed circuit board 10. The printed circuit board 10 may be electrically connected to the image sensor. For example, the holder member 11 may be disposed between the printed circuit board 10 and the lens driving device. At this time, the holder member 11 can house the image sensor inside. As another example, the lens driving apparatus may be disposed directly on the printed circuit board 10. [ At this time, the lens driving device can accommodate the image sensor on the inner side. With this structure, the light passing through the lens module coupled to the lens driving device can be irradiated to the image sensor disposed on the printed circuit board 10. [ The printed circuit board 10 can supply power (current) to the lens driving apparatus. On the other hand, a control unit 80 for controlling the lens driving apparatus may be disposed on the printed circuit board 10. [

The image sensor may be disposed on the printed circuit board 10. The image sensor may be electrically connected to the printed circuit board (10). In one example, the image sensor may be coupled to the printed circuit board 10 by Surface Mounting Technology (SMT). As another example, the image sensor may be coupled to the printed circuit board 10 by a flip chip technique. The image sensor may be arranged so that the optical axis and the lens module are aligned with each other. That is, the optical axis of the image sensor and the optical axis of the lens module may be aligned. Thereby, the image sensor can acquire light passing through the lens module. The image sensor can convert the light irradiated to the effective image area of the image sensor into an electrical signal. The image sensor may be any one of a charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD, and a CID. However, the type of the image sensor is not limited thereto, and the image sensor may include any structure capable of converting incident light into an electrical signal.

The control unit 80 may be disposed on the printed circuit board 10. For example, the control section 80 can be disposed inside the lens driving apparatus. As another example, the control section 80 may be located outside the lens driving apparatus. The control unit 80 can individually control the direction, intensity, and amplitude of the current supplied to the AF driving coil 220 and the OIS driving coil 422 of the lens driving device. However, the intensity of the current supplied to the AF drive coil 220 can be controlled by the driver 750 of the Hall driver IC 70. [ The controller 80 controls the lens driving device to perform at least one of the autofocus function and the camera shake correction function of the camera module. That is, the control unit 80 controls the lens driving unit to move the lens module in the optical axis direction or tilt it in the direction perpendicular to the optical axis direction. Further, the control unit 80 may perform at least one of feedback control of the autofocus function and feedback control of the shake correction function. The control unit 80 receives the position of the bobbin 210 or the housing 310 sensed by the first sensor unit 700 and controls the current to be applied to the AF driving coil 220, Can be performed. The control unit 80 receives the position of the bobbin 210 or the housing 310 sensed by the second sensor 800 and controls the current applied to the OIS driving coil 422 to perform the camera shake correction feedback control can do. The feedback control by the control unit 80 is generated in real time, so that a more precise autofocus function and an image stabilization function can be performed. The control unit 80 may be electrically connected to the Hall driver IC 70 as shown in FIG. The control unit 80 can perform I 2 C communication with the Hall driver IC 70 as shown in FIG.

Hereinafter, the configuration of the lens driving apparatus according to the present embodiment will be described with reference to the drawings.

1 is a perspective view of the lens driving apparatus according to the present embodiment, FIG. 2 is an exploded perspective view of the lens driving apparatus according to the present embodiment, and FIGS. 3 and 4 are perspective views of a part of the configuration of the lens driving apparatus according to the present embodiment 6 to 9 are exploded perspective views of a part of the configuration of the lens driving apparatus according to the present embodiment, and Fig. 10 is a cross-sectional view of the lens driving apparatus according to the present embodiment Fig. 7 is a conceptual diagram showing a communication structure of a Hall IC and a control unit of the camera module according to the first embodiment of the present invention.

The lens driving device includes a cover member 100, a first mover 200, a second mover 300, a stator 400, a first support member 500, a second support member 600, Unit 700, and a second sensor 800. [0034] In the lens driving apparatus, the cover member 100, the first movable element 200, the second movable element 300, the stator 400, the first supporting member 500, the second supporting member 600, One or more of the first sensor unit 700 and the second sensor 800 may be omitted or changed. In particular, the first sensor unit 700 and the second sensor 800 are configured for autofocus feedback control and shake correction feedback control, and one or more of them may be omitted.

The cover member 100 can form an appearance of the lens driving device. The cover member 100 may be in the form of a hexahedron having an open bottom. However, the shape of the cover member 100 is not limited thereto. The cover member 100 may be a non-magnetic body. If the cover member 100 is formed of a magnetic material, the magnetic force of the cover member 100 may affect at least one of the drive magnet 320, the sensing magnet 730, and the compensation magnet 740. The cover member 100 may be formed of a metal material. More specifically, the cover member 100 may be formed of a metal plate. In this case, the cover member 100 may block electromagnetic interference (EMI). Because of this feature of the cover member 100, the cover member 100 can be referred to as an " EMI shield can ". The cover member 100 can block the airflow generated from the outside of the lens driving apparatus from flowing into the cover member 100. [ In addition, the cover member 100 can prevent the radio wave generated inside the cover member 100 from being emitted to the outside of the cover member 100.

The cover member 100 may include an upper plate 101 and a side plate 102. The cover member 100 may include an upper plate 101 and a side plate 102 extending downward from an outer periphery of the upper plate 101. [ In one example, the cover member 100 may be coupled to the base 430. A portion of the side plate 102 of the cover member 100 may be coupled to the base 430. [ The lower end of the side plate 102 of the cover member 100 may be disposed at the step 435 of the base 430. [ The inner surface of the side plate 102 of the cover member 100 can be in direct contact with the outer side surface of the base 430. [ The inner surface of the side plate 102 of the cover member 100 can be joined to the base 430 by an adhesive (not shown). As another example, the cover member 100 may be directly coupled to the upper surface of the printed circuit board 10. The first movable member 200, the second movable member 300, the stator 400, the first supporting member 500, and the second supporting member 500 are formed in the inner space formed by the cover member 100 and the base 430. [ (600) may be disposed. With such a structure, the cover member 100 can protect the internal components from external impact and prevent the penetration of external contaminants.

The cover member 100 may include an opening 110.

The opening 110 may be formed in the top plate 101 of the cover member 100. The opening 110 can expose the lens module to the upper side. The opening 110 may be formed in a shape corresponding to the lens module. The size of the opening 110 may be larger than the diameter of the lens module so that the lens module can be assembled through the opening 110. The light introduced through the opening 110 can pass through the lens module. At this time, the light passing through the lens module can be converted into an electrical signal in the image sensor and can be acquired as an image.

The first movable element 200 may be combined with a lens module (which may be described as a component of the lens driving device), which is one component of the camera module. The first movable element 200 can house the lens module inside. The outer periphery surface of the lens module can be coupled to the inner periphery surface of the first movable element 200. [ The first mover 200 can move through interaction with the second mover 300 and / or the stator 400. [ At this time, the first movable element 200 can move integrally with the lens module. On the other hand, the first movable element 200 can move for an autofocus function. At this time, the first mover 200 may be referred to as an 'AF mover'. However, the present invention is not limited to the member that moves the first mover 200 only for the autofocus function. The first movable element 200 can also be moved for the shake correction function.

The first movable element 200 may include a bobbin 210 and an AF driving coil 220. However, any one or more of the bobbin 210 and the AF driving coil 220 in the first mover 200 may be omitted or changed.

The bobbin 210 may be disposed inside the housing 310. The bobbin 210 may be disposed in the through hole 311 of the housing 310. The bobbin 210 can move in the optical axis direction with respect to the housing 310. The bobbin 210 may be arranged to move along the optical axis in the through hole 311 of the housing 310. The bobbin 210 may be coupled to a lens module. The outer circumferential surface of the lens module may be coupled to the inner circumferential surface of the bobbin 210. The AF drive coil 220 may be coupled to the bobbin 210. The AF drive coil 220 may be coupled to the outer circumferential surface of the bobbin 210. [ The lower portion of the bobbin 210 can be engaged with the lower support member 520. The upper portion of the bobbin 210 may be coupled with the upper support member 510.

The bobbin 210 may include a through hole 211, a driving portion coupling portion 212, an upper coupling portion 213, and a lower coupling portion (not shown). However, at least one of the through hole 211, the driving part coupling part 212, the upper coupling part 213 and the lower coupling part may be omitted from the bobbin 210.

The through hole 211 may be formed on the inner side of the bobbin 210. The through holes 211 may be formed in a vertically open type. The lens module may be coupled to the through hole 211. A screw thread corresponding to a thread formed on the outer peripheral surface of the lens module may be formed on the inner circumferential surface of the through hole 211. That is, the lens module can be screwed into the through hole 211. An adhesive may be disposed between the lens module and the bobbin 210. At this time, the adhesive may be an epoxy which is cured by at least one of ultraviolet (UV), heat, and laser.

The AF driving coil 220 may be coupled to the driving unit engaging portion 212. The driving portion coupling portion 212 may be formed on the outer peripheral surface of the bobbin 210. The driving part coupling part 212 may be formed as a groove formed by a part of the outer circumferential surface of the bobbin 210 being recessed inward. At this time, at least a part of the AF driving coil 220 may be accommodated in the driving part engaging part 212. The driving portion coupling portion 212 may be formed integrally with the outer circumferential surface of the bobbin 210. For example, the driving portion engaging portion 212 may be continuously formed along the outer circumferential surface of the bobbin 210. At this time, the AF drive coil 220 may be wound around the driving portion coupling portion 212. [ As another example, the plurality of the driving portion coupling portions 212 may be formed to be spaced apart from each other. At this time, a plurality of AF driving coils 220 may also be coupled to each of the driving unit engaging portions 212. As another example, the driving portion engaging portion 212 may be formed as an upper side or a lower side opening type. At this time, the AF driving coil 220 may be inserted into the driving unit engaging portion 212 through the opened portion in the previously wound state, and may be coupled.

The upper coupling portion 213 may be coupled to the upper support member 510. The upper engagement portion 213 can be engaged with the inner side portion 512 of the upper support member 510. The upper coupling portion 213 may protrude upward from the upper surface of the bobbin 210. For example, the protrusion of the upper coupling portion 213 may be inserted into the groove or the hole of the inner side portion 512 of the upper support member 510, and may be coupled. At this time, the protrusion of the upper coupling part 213 is thermally fused in a state of being inserted into the hole of the inner side part 512, so that the upper side support member 510 can be fixed between the upper surface of the bobbin 210 and the heat-

And the lower engaging portion can be engaged with the lower supporting member 520. [ And the lower coupling portion can be engaged with the inner side portion 522 of the lower support member 520. [ The lower coupling part may protrude downward from the lower surface of the bobbin 210. For example, the protrusion of the lower coupling portion may be inserted into the groove or the hole of the inner side portion 522 of the lower support member 520, and may be engaged. At this time, the protrusion of the lower coupling part is thermally fused in a state of being inserted into the hole of the inner side part 522, so that the lower side support member 520 can be fixed between the bottom of the bobbin 210 and the heat-

The AF drive coil 220 may be disposed on the bobbin 210. The AF drive coil 220 may be disposed on the outer circumferential surface of the bobbin 210. The AF drive coil 220 can be directly wound on the bobbin 210. [ The AF drive coil 220 can be opposed to the drive magnet 320. In this case, when a current is supplied to the AF drive coil 220 to form a magnetic field around the AF drive coil 220, the electromagnetic force is generated between the AF drive coil 220 and the drive magnet 320, (220) can move relative to the drive magnet (320). The AF drive coil 220 can be electromagnetically interacted with the drive magnet 320. The AF drive coil 220 can move the bobbin 210 in the direction of the optical axis with respect to the housing 310 through an electromagnetic interaction with the drive magnet 320. [ For example, the AF drive coil 220 may be a single coil formed integrally. As another example, the AF drive coil 220 may include a plurality of coils spaced from each other. The AF driving coil 220 may be provided with four coils spaced apart from each other. At this time, the four coils may be disposed on the outer circumferential surface of the bobbin 210 so that two neighboring coils form a 90 DEG angle with each other.

The AF drive coil 220 may include a pair of lead wires for power supply. At this time, a pair of outgoing lines of the AF driving coil 220 may be electrically connected to the fifth and sixth upper supporting portions 505 and 506, which are the divisional structure of the upper supporting member 510. That is, the AF drive coil 220 can receive power through the upper support member 510. More specifically, the AF drive coil 220 is sequentially supplied with power through the driver 750 of the Hall driver IC 70, the upper support member 510, the energizing member 610, and the lower support member 520 have. In this embodiment, the driver 750 for controlling the current supplied to the AF driving coil 220 is disposed inside the lens driving apparatus. More specifically, the driver 750 may be formed integrally with the first sensor 710 and disposed in the housing 310 as the Hall-effect IC 70.

The second mover 300 can accommodate at least a part of the first mover 200 on the inner side. The second mover 300 can move the first mover 200 or move with the first mover 200. [ The second mover 300 can move through interaction with the stator 400. The second mover 300 can move for the shake correction function. At this time, the second mover 300 may be referred to as an 'OIS mover'. The second mover 300 can move integrally with the first mover 200 when the mobile mover 300 is moved for the purpose of compensating for the shaking motion.

The second mover 300 may include a housing 310 and a driving magnet 320. However, at least one of the housing 310 and the driving magnet 320 may be omitted or changed in the second mover 300.

The housing 310 may be disposed outside the bobbin 210. The housing 310 can accommodate at least a part of the bobbin 210 inside. In one example, the housing 310 may include a hexahedral shape. The housing 310 may include four side surfaces and four corner portions disposed between the four side surfaces. A drive magnet 320 may be disposed in the housing 310. For example, the drive magnet 320 may be disposed on each of the four sides of the housing 310. As another example, the driving magnet 320 may be disposed at each of the four corners of the housing 310. At least a part of the outer circumferential surface of the housing 310 may be formed in a shape corresponding to the inner circumferential surface of the cover member 100. In particular, the outer circumferential surface of the housing 310 may be formed in a shape corresponding to the inner circumferential surface of the side plate 102 of the cover member 100. The housing 310 may be formed of an insulating material. The housing 310 may be formed of a material different from that of the cover member 100. The housing 310 may be formed of an injection molding material in consideration of productivity. The outer side surface of the housing 310 may be spaced apart from the inner side surface of the side plate 102 of the cover member 100. In a spaced-apart space between the housing 310 and the cover member 100, the housing 310 can be moved for OIS driving. An upper support member 510 may be coupled to the upper portion of the housing 310. A lower support member 520 may be coupled to the lower portion of the housing 310.

The housing 310 may include a through hole 311, a driving portion coupling portion 312, an upper coupling portion 313, a lower coupling portion (not shown), and a sensor coupling portion 315. At least one of the through hole 311, the driving part coupling part 312, the upper coupling part 313, the lower coupling part and the sensor coupling part 315 in the housing 310 may be omitted or changed.

The through hole 311 may be formed in the housing 310. The through hole 311 may be formed on the inner side of the housing 310. The through hole 311 may be formed to penetrate the housing 310 in the vertical direction. The bobbin 210 may be disposed in the through hole 311. The bobbin 210 may be movably disposed in the through hole 311. The through hole 311 may be formed in a shape corresponding to the bobbin 210 at least in part. The inner circumferential surface of the housing 310 forming the through hole 311 may be spaced apart from the outer circumferential surface of the bobbin 210. However, a stopper may be formed on the inner circumferential surface of the housing 310 forming the through hole 311 to protrude inward to mechanically limit the movement of the bobbin 210 in the optical axis direction.

A driving magnet 320 may be coupled to the driving part coupling part 312. The driving portion coupling portion 312 may be formed in the housing 310. The driving portion engaging portion 312 may be formed on the inner peripheral surface of the housing 310. In this case, there is an advantage in that the drive magnet 320 disposed at the drive portion engaging portion 312 is advantageous for electromagnetic interaction with the AF drive coil 220 located inside the drive magnet 320. The driving portion coupling portion 312 may have a bottom open form. In this case, there is an advantage that the drive magnet 320 disposed at the drive portion coupling portion 312 is advantageous for electromagnetic interaction with the OIS drive coil 422 located below the drive magnet 320. The driving portion coupling portion 312 may be formed as a groove formed by recessing the inner peripheral surface of the housing 310 outwardly. At this time, a plurality of the driving portion coupling portions 312 may be provided. Meanwhile, the driving magnet 320 may be accommodated in each of the plurality of driving portion engaging portions 312. For example, the driving portion coupling portion 312 may be divided into four. The driving magnet 320 may be disposed in each of the four driving portion engaging portions 312. For example, the driving portion engaging portion 312 may be formed on a side surface of the housing 310. As another example, the driving portion engaging portion 312 may be formed at a corner of the housing 310.

The upper coupling portion 313 may be coupled with the upper support member 510. The upper coupling portion 313 can be engaged with the outer side portion 511 of the upper support member 510. The upper coupling portion 313 may protrude upward from the upper surface of the housing 310. For example, the protrusion of the upper coupling portion 313 may be inserted into the groove or the hole of the outer side portion 511 of the upper side support member 310 to be coupled. At this time, the protrusion of the upper coupling portion 313 is thermally fused in a state of being inserted into the hole of the outer side portion 511, so that the upper side support member 510 can be fixed between the heat fusion bonded projection and the upper surface of the housing 310.

And the lower engaging portion can be engaged with the lower supporting member 520. [ And the lower coupling portion can be engaged with the outer side portion 521 of the lower support member 520. [ The lower coupling portion may protrude downward from the lower surface of the housing 310. For example, the protrusion of the lower coupling portion may be inserted into the groove or the hole of the outer side portion 521 of the lower support member 520 and be coupled. At this time, the protrusion of the lower coupling part is thermally fused in a state of being inserted into the hole of the outer side part 521, so that the lower side support member 520 can be fixed between the heat-welded projection and the lower surface of the housing 310.

At least part of the first sensor unit 700 may be disposed in the sensor coupling portion 315. [ The first sensor 710 may be disposed at the sensor coupling portion 315. The sensor coupling portion 315 may be formed in the housing 310. The sensor coupling portion 315 may be formed as a groove formed by a part of the upper surface of the housing 310 being depressed downward. At this time, at least a part of the first sensor 710 may be accommodated in the sensor coupling part 315. At least a part of the sensor coupling portion 315 may be formed in a shape corresponding to the first sensor 710.

The drive magnet 320 may be disposed in the housing 310. The drive magnet 320 may be disposed outside the AF drive coil 220. [ The driving magnet 320 can be opposed to the AF driving coil 220. The drive magnet 320 may be electromagnetically interacted with the AF drive coil 220. The drive magnet 320 may be disposed on the upper side of the OIS drive coil 422. The drive magnet 320 can be opposed to the OIS drive coil 422. The drive magnet 320 can be electromagnetically interacted with the OIS drive coil 422. The drive magnet 320 can be commonly used for the autofocus function and the shake prevention function. However, the driving magnet 320 may include a plurality of magnets separately used for the autofocus function and the shake prevention function. For example, the drive magnet 320 may be disposed on a side surface of the housing 310. At this time, the driving magnet 320 may be a flat plate magnet. The driving magnet 320 may have a flat plate shape. As another example, the driving magnet 320 may be disposed at the corner of the housing 310. [ At this time, the driving magnet 320 may be a corner magnet. The driving magnet 320 may have a hexahedral shape whose inner side surface is wider than the outer side surface.

The drive magnet 320 may include a plurality of magnets that are spaced apart from each other. The drive magnet 320 may include four magnets that are spaced apart from each other. At this time, the four magnets may be disposed in the housing 310 such that two neighboring magnets make 90 DEG to each other. That is, the driving magnets 320 may be equally spaced on four sides of the housing 310. In this case, the internal volume of the housing 310 can be efficiently used. In addition, the driving magnet 320 may be bonded to the housing 310 with an adhesive.

The stator 400 may be disposed on the lower side of the housing 310. The stator 400 may be disposed on the lower side of the second mover 300. The stator 400 may be opposed to the second mover 300. The stator 400 can movably support the second mover 300. The stator 400 can move the second mover 300. [ At this time, the first mover 200 can move with the second mover 300 as well.

The stator 400 may include a substrate 410, a circuit member 420, and a base 430. However, at least one of the substrate 410, the circuit member 420, and the base 430 may be omitted or changed in the stator 400.

The substrate 410 can supply power to the circuit member 420. The substrate 410 may be coupled to the circuit member 420. The substrate 410 may be coupled to a printed circuit board 10 disposed below the base 430. The substrate 410 may be disposed on the lower surface of the circuit member 420. The substrate 410 may be disposed on the upper surface of the base 430. The substrate 410 may be disposed between the circuit member 420 and the base 430.

The substrate 410 may include a flexible printed circuit board (FPCB). The substrate 410 may be partly bent. The substrate 410 can supply power to the Hall driver IC 70. In one example, the substrate 410 may supply power to the Hall driver IC 70 through the second support member 600 and the upper support member 510. Further, the power supplied to the Hall driver IC 70 can be used to drive the first sensor 710 and the driver 750. [

The substrate 410 may include an opening 411 and a terminal portion 412. However, any one or more of the openings 411 and the terminal portions 412 in the substrate 410 may be omitted or changed.

The opening 411 may be formed in the substrate 410. The opening 411 may be formed at the center of the substrate 410. The opening 411 may be formed to penetrate the substrate 410. The opening 411 can pass light that has passed through the lens module. The opening 411 may be formed in a circular shape. However, the shape of the opening 411 is not limited thereto.

The terminal portion 412 may be formed on the substrate 410. The terminal portion 412 may be formed by bending a part of the substrate 410 downward. At least a part of the terminal portion 412 may be exposed to the outside. The terminal portion 412 may be coupled to the printed circuit board 10 disposed below the base 430 by soldering. The lower end of the terminal portion 412 may be in direct contact with the printed circuit board 10. The terminal portion 412 may be disposed at the terminal fitting portion 434 of the base 430. [

The circuit member 420 may be disposed on the base 430. The circuit member 420 may be disposed on the substrate 410. The circuit member 420 may be disposed on the upper surface of the substrate 410. The circuit member 420 may be disposed below the drive magnet 320. The circuit member 420 may be disposed between the driving magnet 320 and the base 430. The circuit member 420 may be coupled to the second support member 600. The circuit member 420 can movably support the second mover 300. [

The circuit member 420 may include a substrate portion 421 and an OIS drive coil 422. However, any one or more of the substrate portion 421 and the OIS drive coil 422 may be omitted or changed.

The substrate portion 421 may be a circuit substrate. The substrate portion 421 may be an FPCB. An OIS drive coil 422 may be integrally formed on the substrate portion 421. The second support member 600 may be coupled to the base portion 421. [ The substrate portion 421 may be formed with a hole through which the second support member 600 passes. The lower surface of the substrate portion 421 and the lower end of the second supporting member 600 can be coupled by soldering. The substrate portion 421 may have an opening. The substrate portion 421 may be provided with an opening through the substrate portion 421. The opening of the substrate portion 421 may be formed to correspond to the opening portion 411 of the substrate 410.

The OIS drive coil 422 may include at least one coil. The OIS drive coil 422 may be a fine pattern coil (FP pattern coil) formed integrally with the substrate portion 421. The OIS drive coils 422 may include a plurality of coils spaced from one another. The OIS drive coil 422 may include four coils spaced apart from one another. At this time, the four coils may be disposed on the substrate portion 421 such that two neighboring coils form an angle of 90 ° with respect to each other. On the other hand, the four coils can be separately controlled. The OIS drive coil 422 can be sequentially supplied with power through the printed circuit board 10, the substrate 410, and the substrate unit 421. The OIS drive coil 422 can be opposed to the drive magnet 320. In this case, when a current is supplied to the OIS drive coil 422 to form a magnetic field around the OIS drive coil 422, the drive magnet 421 is driven by the electromagnetic interaction between the OIS drive coil 422 and the drive magnet 320 320 can move with respect to the OIS drive coil 422. The OIS drive coil 422 may be electromagnetically interacted with the drive magnet 320. The OIS drive coil 422 can move the housing 310 and the bobbin 210 in a direction perpendicular to the optical axis with respect to the base 430 through an electromagnetic interaction with the drive magnet 320. [

The base 430 may be disposed on the lower surface of the substrate 410. The substrate 410 may be disposed on the upper surface of the base 430. An OIS drive coil 422 may be disposed on the base 430. The base 430 may be engaged with the cover member 100. The base 430 may be disposed on the upper surface of the printed circuit board 10. However, a separate holder member 11 may be disposed between the base 430 and the printed circuit board 10. The base 430 may function as a sensor holder for protecting an image sensor mounted on the printed circuit board 10. [

The base 430 may include a through hole 431, a foreign matter collecting part 432, a sensor coupling part 433, a terminal fitting part 434 and a stepped part 435. At least one of the through hole 431, the foreign matter collecting part 432, the sensor coupling part 433, the terminal coupling part 434 and the stepped part 435 may be omitted or changed from the base 430 .

The through hole 431 may be formed in the base 430. The through hole 431 may be formed to penetrate the base 430 in the up and down direction. An infrared filter may be disposed in the through hole 431. However, the infrared filter may be coupled to a separate holder member 11 disposed under the base 430. Light passing through the lens module through the through hole 431 can be incident on the image sensor. That is, the light having passed through the lens module can be incident on the image sensor through the opening of the circuit member 420, the opening 411 of the substrate 410, and the through hole 431 of the base 430. The through hole 431 may be formed to have a circular shape. However, the shape of the through hole 431 is not limited thereto.

The foreign matter collecting unit 432 can collect foreign matter introduced into the lens driving apparatus. The foreign matter collecting part 432 may include a groove formed by sinking the upper surface of the base 430 downward and an adhesive part disposed in the groove. The adhesive portion may comprise an adhesive material. The foreign matter introduced into the lens driving device can be adhered to the bonding portion.

The second sensor 800 may be disposed at the sensor coupling portion 433. [ The sensor engaging portion 433 can accommodate at least a part of the second sensor 800. The sensor coupling portion 433 may be formed as a groove formed by sinking the upper surface of the base 430 downward. The sensor coupling portion 433 may be disposed apart from the foreign matter collecting portion 432. The sensor coupling portion 433 may be formed with a plurality of grooves. For example, the sensor coupling portion 433 may be formed with two grooves. At this time, the second sensor 800 may be disposed in each of the two grooves.

A terminal portion 412 of the substrate 410 may be disposed on the terminal fitting portion 434. The terminal fitting portion 434 may be formed as a groove formed by a part of one side surface of the base 430 being recessed inward. At this time, at least a part of the terminal portion 412 of the substrate 410 may be received in the terminal fitting portion 434. The width of the terminal fitting portion 434 may be formed to correspond to the width of the terminal portion 412 of the substrate 410. The length of the terminal fitting portion 434 may be formed to correspond to the length of the terminal portion 412 of the substrate 410.

The stepped portion 435 may be formed on the side surface of the base 430. The stepped portion 435 can be formed around the outer peripheral surface of the base 430. The stepped portion 435 may be formed by recessing the upper portion of the side surface of the base 430. Alternatively, the stepped portion 435 may be formed by protruding a lower portion of the side surface of the base 430. The lower end of the side plate 102 of the cover member 100 may be disposed on the stepped portion 435.

The first support member 500 may be coupled to the bobbin 210 and the housing 310. The first support member 500 can elastically support the bobbin 210. [ The first support member 500 may have elasticity at least in part. At this time, the first support member 500 may be referred to as a 'first elastic member'. The first support member 500 may movably support the bobbin 210. [ The first support member 500 can support the bobbin 210 movably in the optical axis direction with respect to the housing 310. That is, the first support member 500 can support the bobbin 210 to be driven by AF. At this time, the first support member 500 may be referred to as an AF support member.

The first support member 500 may include an upper support member 510 and a lower support member 520. However, at least one of the upper support member 510 and the lower support member 520 in the first support member 500 may be omitted or changed.

The upper support member 510 may be disposed on the upper side of the bobbin 210 and may be coupled to the bobbin 210 and the housing 310. The upper support member 510 may be coupled to the bobbin 210 and the housing 310. The upper support member 510 may be coupled to the upper portion of the bobbin 210 and the upper portion of the housing 310. The upper support member 510 can elastically support the bobbin 210. [ The upper support member 510 may have elasticity at least in part. In this case, the upper support member 510 may be referred to as an " upper elastic member ". The upper support member 510 may movably support the bobbin 210. The upper support member 510 can support the bobbin 210 movably in the optical axis direction with respect to the housing 310. The upper support member 510 may be formed of a leaf spring.

The upper support member 510 may be formed in a plurality of divisional configurations. The upper support member 510 may include eight upper supports 501, 502, 503, 504, 505, 506, 507, 508 spaced from each other. The upper support member 510 includes a first upper support 501, a second upper support 502, a third upper support 503, a fourth upper support 504, a fifth upper support 505, A sixth upper support 506, a seventh upper support 507, and an eighth upper support 508. At least one of the first to eighth upper supports 501, 502, 503, 504, 505, 506, 507, 508 in the upper support member 510 may be omitted or changed. The upper supports 501, 502, 503, 504, 505, 506, 507, 508 may have elasticity. In this case, the upper supports 501, 502, 503, 504, 505, 506, 507, 508 may be referred to as "upper elastic portions".

The first to eighth upper supports 501, 502, 503, 504, 505, 506, 507, 508 may be spaced apart from each other. Accordingly, the first to eighth upper supports 501, 502, 503, 504, 505, 506, 507, 508 can be used as conductive lines in the lens driving apparatus. The first to sixth upper supports 501, 502, 503, 504, 505 and 506 are connected to the first to sixth terminals 721, 722, 723, 724, 725 of the substrate 720 of the first sensor unit 700 , 726, respectively. Accordingly, the first to sixth upper supports 501, 502, 503, 504, 505, and 506 may be electrically connected to the Hall driver IC 70. The first to fourth upper supports 501, 502, 503, and 504 may be electrically connected to the substrate 410 through the second support member 600. The fifth and sixth upper supporting portions 505 and 506 may be electrically connected to the AF driving coil 220 through the energizing member 610 and the lower supporting member 520. [

The upper support member 510 may include an outer portion 511, a medial portion 512, a connection portion 513, and a coupling portion 514. At least one of the outer side portion 511, the inner side portion 512, the connecting portion 513 and the engaging portion 514 in the upper side support member 510 may be omitted or changed.

The outer portion 511 may be coupled to the housing 310. The outer portion 511 may be coupled to the upper portion of the housing 310. The outer side portion 511 may be engaged with the upper side engaging portion 313 of the housing 310. The outer side portion 511 may include a hole or a groove that is engaged with the upper side engaging portion 313 of the housing 310.

The inner portion 512 may be coupled to the bobbin 210. The inner portion 512 may be coupled to the upper portion of the bobbin 210. The inner side portion 512 can be engaged with the upper side coupling portion 213 of the bobbin 210. The inner side portion 512 may include a hole or a groove which is engaged with the upper side coupling portion 213 of the bobbin 210.

The connection portion 513 can connect the outer portion 511 and the inner portion 512. The connection portion 513 can elastically connect the outer side portion 511 and the inner side portion 512. The connection portion 513 may have elasticity. At this time, the connection portion 513 may be referred to as an " elastic portion ". The connection portion 513 may be formed by bending two or more times.

The engaging portion 514 may be engaged with the second supporting member 600. The engaging portion 514 may be coupled to the second supporting member 600 by soldering. For example, the engaging portion 514 may include a hole through which the second supporting member 600 penetrates. As another example, the engagement portion 514 may include a groove to which the second support member 600 is coupled. The engaging portion 514 may extend from the lateral portion 511. The engaging portion 514 may extend outward from the outer side portion 511. The engaging portion 514 may include a bent portion formed by bending. The engaging portion 514 can be engaged with the energizing member 610. The engaging portion 514 can be coupled to the energizing member 610 by soldering.

Some of the first to eighth upper supports 501, 502, 503, 504, 505, 506, 507 and 508 include an outer portion 511, a medial portion 512, a connecting portion 513 and a fitting portion 514 And the remaining part may not include any one or more of the outer side part 511, the inner side part 512, the connecting part 513 and the engaging part 514.

The lower support member 520 may be disposed below the bobbin 210 and may be coupled to the bobbin 210 and the housing 310. The lower support member 520 may be coupled to the bobbin 210 and the housing 310. The lower support member 520 may be coupled to the lower portion of the bobbin 210 and the lower portion of the housing 310. The lower support member 520 can elastically support the bobbin 210. [ The lower support member 520 may have elasticity at least in part. In this case, the lower support member 520 may be referred to as a " lower elastic member ". The lower support member 520 may movably support the bobbin 210. [ The lower support member 520 can support the bobbin 210 movably in the optical axis direction with respect to the housing 310. The lower support member 520 may be formed of a leaf spring.

The lower support members 520 may include two lower supports 520a, 520b spaced apart from one another. The lower support members 520 may include first and second lower supports 520a, 520b spaced apart from one another. The first and second lower supports 520a and 520b may be spaced apart from each other. The two lower supports 520a and 520b may be paired with a pair of outgoing lines of the AF drive coil 220. That is, the two lower supports 520a and 520b may be used as a conductive line for supplying current to the AF driving coil 220. [ The two lower supports 520a and 520b may be energized with the upper support member 510 through the energizing member 610. [ The lower supports 520a and 520b may have elasticity. In this case, the lower supports 520a and 520b may be referred to as a " lower elastic portion ".

The lower support member 520 may include an outer portion 521, a medial portion 522, a connection portion 523, and a coupling portion 524. However, at least one of the outer side portion 521, the inner side portion 522, the connecting portion 523, and the engaging portion 524 in the lower side support member 520 may be omitted or changed.

The outer portion 521 may be coupled to the housing 310. The outer portion 521 may be coupled to the lower portion of the housing 310. The outer side portion 521 can be engaged with the lower side engaging portion of the housing 310. The outer side portion 521 may include a hole or a groove that is engaged with the lower side engaging portion of the housing 310.

The inner portion 512 may be coupled to the bobbin 210. The inner portion 512 may be coupled to the upper portion of the bobbin 210. The inner side portion 512 can be engaged with the lower side engaging portion of the bobbin 210. The inner portion 512 may include a hole or groove that engages the lower coupling portion of the bobbin 210.

The connection portion 523 can connect the outer portion 521 and the inner portion 522. The connection portion 523 can elastically connect the outer side portion 521 and the inner side portion 522. The connection portion 523 may have elasticity. At this time, the connection portion 523 may be referred to as an " elastic portion ". The connection portion 523 may be formed by bending two or more times.

The engaging portion 524 can be engaged with the energizing member 610. The engaging portion 524 can be coupled to the energizing member 610 by soldering. For example, the engaging portion 524 may include a hole through which the energizing member 610 penetrates. As another example, the engaging portion 514 may include a groove to which the energizing member 610 is coupled. The engaging portion 514 may extend from the lateral portion 511. The engaging portion 514 may extend outward from the outer side portion 511. The engaging portion 514 may include a bent portion formed by bending.

The second support member 600 is capable of movably supporting the housing 310. The second support member 600 can elastically support the housing 310. The second support member 600 may have elasticity at least in part. At this time, the second support member 600 may be referred to as a 'second elastic member'. For example, the second support member 600 can support the housing 310 in a direction perpendicular to the optical axis with respect to the stator 400. At this time, the bobbin 210 can move integrally with the housing 310. As another example, the second support member 600 may support the housing 310 in a tiltable manner with respect to the stator 400. That is, the second support member 600 can support the housing 310 and the bobbin 210 to be OIS driven. At this time, the second support member 600 may be referred to as an 'OIS support member'. In one example, the second support member 600 may be formed from a wire. As another example, the second support member 600 may be formed of a leaf spring.

The second support member 600 may be coupled to the upper support member 510 and the stator 400. The lower end of the second support member 600 may be coupled to the base portion 421 of the circuit member 420. The second support member 600 may penetrate the base portion 421 of the circuit member 420. In this structure, the lower end of the second support member 600 can be soldered to the lower surface of the base portion 421 of the circuit member 420. The upper end of the second support member 600 may be coupled to the engagement portion 514 of the upper support member 510. The upper end of the second support member 600 may penetrate the engagement portion 514 of the upper support member 510. In this structure, the upper end of the second support member 600 may be soldered to the upper surface of the engagement portion 514 of the upper support member 510. Alternatively, the lower end of the second support member 600 may be coupled to the substrate 410. The lower end of the second support member 600 may be coupled to the base 430. The upper end of the second support member 600 may be coupled to the housing 310. The structure of the second support member 600 is not limited to the above and may be provided with any structure capable of movably supporting the second mover 300 with respect to the stator 400. [

The second support member 600 may be formed in a plurality of division structures. The second support member 600 may be formed of eight supports 601, 602, 603, 604, 605, 606, 607, 608 spaced from each other. The second support member 600 may include first to eighth support portions 601, 602, 603, 604, 605, 606, 607, and 608 that are spaced apart from each other. However, at least one of the first to eighth support portions 601, 602, 603, 604, 605, 606, 607, and 608 in the second support member 600 may be omitted or changed.

The first to eighth support portions 601, 602, 603, 604, 605, 606, 607, 608 may be spaced apart from each other. Accordingly, the first to eighth support portions 601, 602, 603, 604, 605, 606, 607 and 608 can be used as a conductive line in the lens driving device. The first to eighth support portions 601, 602, 603, 604, 605, 606, 607, and 608 may be engaged with the base portion 421 of the circuit member 420. The first to eighth support portions 601, 602, 603, 604, 605, 606, 607, and 608 may be engaged with the upper support member 510. That is, the first to eighth support portions 601, 602, 603, 604, 605, 606, 607 and 608 can electrically connect the base portion 421 of the circuit member 420 and the upper support member 510 . Four of the first to eighth support portions 601, 602, 603, 604, 605, 606, 607, and 608 are coupled to the upper support portion of the upper support member 510, To the upper support of the upper support member 510. For example, as shown in FIG. 9, the first and eighth support portions 601 and 608 may be coupled to the first upper support portion 501. The second support portion 602 may be coupled to the second upper support portion 502. The third support portion 603 may be coupled to the third upper support portion 503. The fourth support portion 604 may be coupled to the fourth upper support portion 504. The fifth support portion 605 may be coupled to the eighth upper support portion 508. The sixth and seventh support portions 606 and 607 may be coupled to the seventh upper support portion 507. [ Each of the first to eighth support portions 601, 602, 603, 604, 605, 606, 607, 608 may be a wire. The first to eighth support portions 601, 602, 603, 604, 605, 606, 607, and 608 may be disposed in each of the four corners of the housing 310.

The energizing member 610 may be coupled to the upper support member 510 and the lower support member 520. The upper end of the energizing member 610 may be coupled to the upper support member 510. The lower end of the energizing member 610 may be coupled to the lower supporting member 520. The energizing member 610 can electrically connect the upper side support member 510 and the lower side support member 520. The length of the energizing member 610 in the longitudinal direction may be shorter than the length of the second supporting member 600 in the longitudinal direction. The energizing member 610 may be disposed at one corner of the housing 310. The energizing member 610 may be disposed apart from the second supporting member 600. The energizing member 610 may be disposed on the outer side of the second supporting member 600. [ The energizing member 610 may be disposed on the inner side of the second support member 600. [ The energizing member 610 may be disposed adjacent to the second support member 600. [ Two supporting portions 602 and 603 and two conductive portions 611 and 612 may be disposed on one corner of the housing 310. [

The energizing member 610 may include two conductive parts 611 and 612 that are spaced apart from each other. The energizing member 610 may include first and second conductive parts 611 and 612 that are spaced apart from each other. The first and second conductive parts 611 and 612 may be spaced apart from each other. The first conductive part 611 may be coupled to the fifth upper support part 505 and the first lower support part 520a. The first power transmission unit 611 can electrically connect the fifth upper support unit 505 and the first lower support unit 520a. The second power supply unit 612 may be coupled to the sixth upper support unit 506 and the second lower support unit 520b. The second conductive part 612 can electrically connect the sixth upper support part 506 and the second lower support part 520b.

A damper (not shown) may be disposed on the second support member 600. The damper may be disposed in the second support member 600 and the housing 310. The damper may be disposed on the first support member 500. The damper may be disposed on the first support member 500 and / or the second support member 600 to prevent a resonance phenomenon occurring in the first support member 500 and / or the second support member 600. The shock absorber (not shown) may be provided on at least one of the first supporting member 500 and the second supporting member 600. The shock absorber may be formed by changing the shape of the first support member 500 and / or a part of the second support member 600.

The first sensor unit 700 may be provided for autofocus feedback. The first sensor unit 700 can sense movement of the bobbin 210 in the optical axis direction. The first sensor unit 700 senses the movement amount of the bobbin 210 in the optical axis direction and can provide the control unit in real time.

The first sensor unit 700 may include a first sensor 710, a substrate 720, and a sensing magnet 730. However, at least one of the first sensor 710, the substrate 720, and the sensing magnet 730 in the first sensor unit 700 may be omitted or changed. In addition, the first sensor unit 700 may further include a compensation magnet 740. However, since the compensation magnet 740 is not related to the position sensing of the bobbin 210, the compensation magnet 740 can be described as a separate structure from the first sensor unit 700.

The first sensor 710 may be provided for autofocus feedback. In this case, the first sensor 710 may be referred to as an 'AF feedback sensor'. The first sensor 710 can sense the sensing magnet 730. The first sensor 710 may sense the sensing magnet 730 disposed on the bobbin 210. The first sensor 710 may sense the position of the bobbin 210. The first sensor 710 can sense the movement amount of the bobbin 210 in the optical axis direction. The first sensor 710 may be disposed in the housing 310. The first sensor 710 may be disposed on the substrate 720. The first sensor 710 may be electrically connected to the substrate 720. The first sensor 710 may be a hall sensor. The first sensor 710 may be a Hall IC (Hall IC). The first sensor 710 can sense the magnetic force of the sensing magnet 730. That is, the first sensor 710 can detect the amount of displacement of the bobbin 210 by detecting a change in the magnetic force that is changed by the movement of the sensing magnet 730 when the bobbin 210 moves. In this embodiment, the first sensor 710 may be integrated with the driver 750. Alternatively, the first sensor 710 may incorporate a driver 750. At this time, the integrated configuration of the first sensor 710 and the driver 750 may be referred to as a Hall driver IC 70.

The substrate 720 may be disposed in the housing 310. The substrate 720 may be coupled to the first sensor 710. The substrate 720 may be electrically connected to the first sensor 710. The substrate 720 may be coupled to the upper support member 510. The substrate 720 may be electrically connected to the first to sixth upper supports 501, 502, 503, 504, 505, 506 of the upper support member 510. The substrate 720 and the upper support member 510 may be coupled by soldering.

A hole driver IC 70 may be disposed on the substrate 720. A first sensor 710 and a driver 750 may be disposed on a lower surface of the substrate 720. Six terminals 721, 722, 723, 724, 725, and 726 may be formed on the upper surface of the substrate 720. At this time, the six terminals 721, 722, 723, 724, 725, and 726 may be paired with the six upper supports 501, 502, 503, 504, 505, and 506. The four terminals 721, 722, 723 and 724 of the six terminals 721, 722, 723, 724, 725 and 726 are connected to the upper support member 510, the second support member 600, (Not shown). The remaining two terminals 725 and 726 of the six terminals 721, 722, 723, 724, 725 and 726 are driven by the AF support member 510 via the upper supporting member 510, the energizing member 610, And may be connected to the coil 220.

The sensing magnet 730 may be disposed on the bobbin 210. The sensing magnet 730 may be sensed by the first sensor 710. The sensing magnet 730 may be opposed to the first sensor 710. The sensing magnet 730 may have a hexahedral shape. However, the shape of the sensing magnet 730 is not limited thereto. The sensing magnet 730 may be disposed on one side of the bobbin 210. The sensing magnet 730 may be disposed at a corner of the bobbin 210. That is, the sensing magnet 730 may be arranged to face the corner of the housing 310.

The compensation magnet 740 may be disposed on the bobbin 210. The compensating magnet 740 may be disposed so as to be magnetically balanced with the sensing magnet 730. The compensation magnet 740 may be symmetrical with the sensing magnet 730 about the optical axis. The compensation magnet 740 may be disposed at a position corresponding to the sensing magnet 730 around the optical axis. The compensation magnet 740 may have a size and / or shape corresponding to the sensing magnet 730 about the optical axis. The compensating magnet 740 may be disposed on the other side of the bobbin 210 (on the opposite side of the bobbin 210). That is, a sensing magnet 730 may be disposed on one side of the bobbin 210 and a compensating magnet 740 may be disposed on the other side of the bobbin 210. The compensation magnet 740 may be disposed at the corner of the bobbin 210. [ That is, the compensation magnet 740 may be arranged to face the corner of the housing 310. The compensating magnet 740 may be provided for balancing with the sensing magnet 730. In this case, the compensation magnet 740 may be referred to as a " balancing magnet ".

The second sensor 800 may be provided for shake correction feedback. In this case, the second sensor 800 may be referred to as an 'OIS feedback sensor'. The second sensor 800 can detect the movement of the housing 310. The second sensor 800 may sense movement or tilt in a direction perpendicular to the optical axis of the housing 310 and / or the bobbin 210. [ And the second sensor 800 can sense the driving magnet 320. [ The second sensor 800 may sense the driving magnet 320 disposed in the housing 310. The second sensor 800 can sense the position of the housing 310. [ The second sensor 800 can sense the amount of movement in a direction perpendicular to the optical axis of the housing 310. At this time, the movement amount of the housing 310 in the direction perpendicular to the optical axis may correspond to the movement amount of the lens module coupled to the bobbin 210 and the bobbin 210. The second sensor 800 may be disposed in the stator 400. The second sensor 800 may be disposed on the lower surface of the substrate 410. The second sensor 800 may be electrically connected to the substrate 410. The second sensor 800 may be disposed on the base 430. The second sensor 800 may be received in the sensor coupling portion 433 formed on the upper surface of the base 430. The second sensor 800 may be a hall sensor. The second sensor 800 may be a Hall IC (Hall IC). The second sensor 800 can sense the magnetic force of the driving magnet 320. [ That is, when the housing 310 moves, the second sensor 800 senses the amount of displacement of the housing 310 by detecting a change in the magnetic force that is changed by the movement of the driving magnet 320. The second sensor 800 may be provided in plural. For example, the second sensor 800 may be provided in two to sense movement of the x-axis and y-axis (optical axis is z-axis) of the housing 310.

The Hall driver IC 70 may be disposed on the substrate 720. The Hall driver IC 70 can be understood as a configuration in which the first sensor 710 and the driver 750 are integrally formed. The Hall driver IC 70 may have a temperature sensing function. In this embodiment, accurate autofocus feedback control can be realized even if a temperature change occurs through the temperature sensing function of the Hall driver IC 70. [

The first sensor 710 may be a silicon-based sensor. At this time, the output of the first sensor 710 may increase as the ambient temperature increases. In another embodiment, the first sensor 710 may be made of GaAs. At this time, the output of the first sensor 710 with respect to the ambient temperature may have a slope of about -0.06% / ° C.

The Hall driver IC 70 may further include a temperature sensing element (not shown) capable of sensing an ambient temperature. The temperature sensing element can output a temperature sensing signal to the driver 750 according to a result of measuring the temperature around the Hall driver IC 70.

The first sensor 710 may generate an output according to a result of sensing the intensity of the magnetic force of the sensing magnet 730. The driver 750 may output a driving signal for driving the first sensor 710 and a driving signal for driving the AF driving coil 220. [ The driver 750 can receive the clock signal SCL, the data signal SDA, and the power supply signals VCC and GND from the control unit 80 using data communication using protocol, for example, I2C communication have. The driver 750 may generate a drive signal for driving the first sensor 710 and a drive signal for driving the AF drive coil 220 using the clock signal SCL and the power supply signals VCC and GND have.

The driver 750 may receive the output of the first sensor 710. The driver 750 transmits the clock signal SCL and the data signal SDA relating to the output of the first sensor 710 to the control unit 80 by using data communication using protocols such as I2C communication . The driver 750 may receive the temperature sensing signal measured by the temperature sensing element. The driver 750 may transmit a temperature sensing signal to the control unit 80 using data communication using a protocol, for example, I2C communication.

As shown in FIG. 10, the Hall driver IC 70 may include six essential pins. More specifically, the six required pins may be SCL, SDA, VCC, GND, VCM +, VCM-. The SCL may be a configuration for clock (time) information. The SDA may be a configuration for data (data) information. VCC and GND may be configurations for power supply. VCM + and VCM- may be a configuration for applying current to the AF drive coil 220. [ Six necessary pins of the Hall driver IC 70 may be electrically coupled in pairs with the six terminals 721, 722, 723, 724, 725, and 726 of the substrate 720. More specifically, SCL, SDA, VCC, and GND of the Hall driver IC 70 can be electrically coupled to the first to fourth terminals 721, 722, 723, and 724 of the substrate 720. Further, VCM + and VCM- of the Hall driver IC 70 can be electrically coupled to the fifth and sixth terminals 725 and 726 of the substrate 720. The fifth terminal 725 may be coupled to one end of the AF drive coil 220 through the fifth upper support portion 505, the first power supply portion 611, and the first lower support portion 520a. The sixth terminal 726 may be coupled to the other end of the AF driving coil 220 through the sixth upper supporting portion 506, the second energizing portion 612, and the second lower supporting portion 520b.

The Hall driver IC 70 may include two options (Test Pin). More specifically, the two options may be Test, Hall output. The test may be a configuration for testing the operation of the Hall driver IC 70. The Hall output may be configured to process the hall value sensed by the first sensor 710 and transmit the hall value to the control unit 80. [ For reference, the sensed value sensed by the first sensor 710 through the SCL and the SDA can be transmitted to the control unit 80 without the Hall output. However, the difference between the two is the format difference of the data that sends the value sensed by the first sensor 710. For example, when the sensing value of the first sensor 710 is transmitted to the control unit 80 through the SCL and the SDA, it can be transmitted as an analog signal. When the sensed value of the first sensor 710 is transmitted to the control unit 80 through the Hall output, it can be transmitted as a digital signal. However, the above explanation is merely an example, and conversely, it is possible to transmit a digital signal through SCL and SDA and transmit an analog signal through a Hall output.

The Hall driver IC 70 may be energized with the control unit 80. [ The Hall driver IC 70 is connected to the control unit 80 through the control unit 80 and the upper support member 510, the second support member 600, the circuit member 420, the substrate 410, and the printed circuit board 10. [ As shown in FIG. The Hall driver IC 70 can transmit and receive information to and from the control unit 80 through I 2 C communication.

The Hall driver IC 70 may include a first sensor 710 and a driver 750. However, any one or more of the first sensor 710 and the driver 750 in the Hall driver IC 70 may be omitted or changed.

The driver 750 may be disposed on the substrate 720. The driver 750 can apply a current to the AF drive coil 220. [ The driver 750 may be electrically connected to the AF driving coil 220 through the upper supporting member 510, the energizing member 610 and the lower supporting member 520. [ The driver 750 may have a temperature sensing function. The driver 750 may be electrically connected to the first sensor 710. The driver 750 may be formed integrally with the first sensor 710.

In this embodiment, a change may occur in the Hall element of the lens module and the first sensor 710 according to the temperature change. At this time, the temperature change may be caused by the sensor temperature, peripheral circuit temperature, mobile phone chip temperature, and the like. The Hall element of the first sensor 710 may be gallium arsenide (GaAs). In this case, the Hall element may have a slope of about -0.06% / ° C with respect to temperature. In this embodiment, by applying a Hall driver IC 70, which is a driver-integrated product including temperature sensing and a Hall element function, the temperature can be measured to set the hole inclination to zero or the opposite direction to the inclination of the lens. In this embodiment, six or more conductive lines are required for energizing the Hall driver IC 70. [ This is different from the point that four conductive lines are required in the conventional Hall sensor.

In the above description, VCC- and VCC + of the Hall-effect IC 70 are the same as the fifth and sixth terminals 725 and 726 of the substrate 720, the fifth and sixth upper support portions 605 and 606, And the AF drive coil 220 are connected to each other through the two conductive parts 611 and 612 and the first and second lower supporting parts 520a and 520b. However, any one of VCC- and VCC + of the Hall driver IC 70 may be coupled to the AF driving coil 220 through the sixth upper supporting portion 606. [ That is, the sixth upper support portion 606 can be directly coupled to the lead wire of the AF drive coil 220. [ In this case, the other one of VCC- and VCC + of the Hall-driver IC 70 may be energized with the AF driving coil 220 through the upper supporting member 510, the energizing member 610 and the lower supporting member 520 . At this time, the lower support members 520 need not be provided in two different configurations. That is, the lower support member 520 may be integrally formed. In addition, in the modification, the number of the wires constituting the second supporting member 600 and the energizing member 610 can also be reduced.

In the above description, the upper support member 510, the lower support member 520, the second support member 600, and the energizing member 610 are all formed as separate members as an example. Alternatively, the second supporting member 600 and the energizing member 610 may be integrally formed with the upper supporting member 510 or the lower supporting member 520. For example, the second supporting member 600 and / or the energizing member 610 may be formed by bending a part of the lower supporting member 520 upward. Alternatively, the second supporting member 600 and / or the energizing member 610 may be formed by bending a part of the upper supporting member 510 downward.

On the other hand, in the above description, the second supporting member 600 and the energizing member 610 are all formed as a wire. However, at least one of the second supporting member 600 and the energizing member 610 may be formed of a spring or an iron plate. Alternatively, the second supporting member 600 and the energizing member 610 may be omitted and a through hole (not shown) may be formed in the housing 310 in the direction of the optical axis to insert a conductive material into the through hole, And the energizing member 610 can be substituted for the function of the energizing member 610. Alternatively, a spring, an iron plate, or a conductive wire may be inserted into the housing 310.

Hereinafter, the operation of the camera module according to the present embodiment will be described.

First, the autofocus function of the camera module according to the present embodiment will be described. When the power is supplied to the AF drive coil 220, the AF drive coil 220 moves relative to the drive magnet 320 by electromagnetic interaction between the AF drive coil 220 and the drive magnet 320 . At this time, the bobbin 210 to which the AF driving coil 220 is coupled moves integrally with the AF driving coil 220. That is, the bobbin 210 to which the lens module is coupled moves in the direction of the optical axis with respect to the housing 310. This movement of the bobbin 210 results in movement of the lens module toward or away from the image sensor. Thus, in this embodiment, power is supplied to the AF driving coil 220 to perform focus adjustment on the subject You can do it. On the other hand, the aforementioned focus adjustment can be performed automatically according to the distance of the subject.

On the other hand, in the camera module according to the present embodiment, autofocus feedback control can be performed for more precise realization of the autofocus function. The first sensor 710 disposed in the housing 310 senses the magnetic field of the sensing magnet 730 disposed on the bobbin 210. Accordingly, when the bobbin 210 moves relative to the housing 310, the amount of the magnetic field sensed by the first sensor 710 changes. The first sensor 710 senses the movement amount of the bobbin 210 in the optical axis direction or the position of the bobbin 210 in this manner and transmits the detection value to the control unit. The control unit determines whether to perform an additional movement with respect to the bobbin 210 through the received sensing value. Since such a process is generated in real time, the autofocus function of the camera module according to the present embodiment can be performed more precisely through the autofocus feedback control. In this embodiment, the first sensor 710 is embedded in the Hall driver IC 70 having the temperature sensing function, so that accurate autofocus feedback control can be realized even if a temperature change occurs.

The camera shake correction function of the camera module according to the present embodiment will be described. When power is supplied to the OIS drive coil 420, the drive magnet 320 moves relative to the OIS drive coil 420 by electromagnetic interaction between the OIS drive coil 420 and the drive magnet 320 . At this time, the housing 310 to which the driving magnet 320 is coupled moves integrally with the driving magnet 320. That is, the housing 310 is moved in the horizontal direction (direction perpendicular to the optical axis) with respect to the base 430. However, at this time, the housing 310 may be tilted with respect to the base 430. Meanwhile, the bobbin 210 moves integrally with the housing 310 with respect to the horizontal movement of the housing 310. This movement of the housing 310 thus results in the lens module coupled to the bobbin 210 moving relative to the image sensor in a direction parallel to the direction in which the image sensor lies. That is, in this embodiment, power is supplied to the OIS driving coil 420 to perform the camera-shake correction function.

Meanwhile, the camera shake correction feedback control may be performed for more precise realization of the shake correction function of the camera module according to the present embodiment. The second sensor 800 disposed on the base 430 detects the magnetic field of the driving magnet 320 disposed on the housing 310. Therefore, when the housing 310 performs the relative movement with respect to the base 430, the amount of the magnetic field sensed by the second sensor 800 changes. The pair of second sensors 800 senses the movement amount or position in the horizontal direction (x-axis and y-axis direction) of the housing 310 in this manner and transmits the detection value to the control unit. The control unit determines whether to perform the additional movement to the housing 310 through the received sensing value. Since such a process is generated in real time, the camera shake correction function of the camera module according to the present embodiment can be performed more precisely through the camera shake correction feedback control.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments. That is, within the scope of the present invention, all of the components may be selectively coupled to one or more of them. It is to be understood that the terms such as 'include', 'comprising', or 'having', as used herein, mean that a component can be implied unless specifically stated to the contrary. But should be construed as including other elements. All terms, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless otherwise defined. Commonly used terms, such as predefined terms, should be interpreted to be consistent with the contextual meanings of the related art, and are not to be construed as ideal or overly formal, unless expressly defined to the contrary.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100: cover member 200: first movable member
300: second movable element 400: stator
500: first supporting member 600: second supporting member
700: first sensor unit 800: second sensor

Claims (14)

housing;
A bobbin installed inside the housing to move in a first direction;
A first coil installed on an outer circumferential surface of the bobbin;
A first magnet coupled to the housing;
A base disposed below said housing;
A first substrate including a circuit member having a second coil disposed between the housing and the base so as to face the first magnet;
An upper elastic member disposed above the bobbin and coupled to the bobbin and the housing;
A lower elastic member disposed below the bobbin and coupled to the bobbin and the housing;
A supporting member coupled to the upper elastic member and the first substrate;
An energizing member coupled to the upper elastic member and the lower elastic member;
A second magnet disposed on the bobbin;
A second substrate disposed on the housing and electrically connected to the upper elastic member;
A sensor disposed on the second substrate and sensing the second magnet; And
And the second substrate is electrically connected to the first coil through the upper elastic member, the energizing member, and the lower elastic member. The method according to claim 1,
The sensor includes a driver,
Wherein the driver is electrically connected to the sensor and has a temperature sensing function. The method according to claim 1,
The sensor is disposed on the lower surface of the first substrate,
And six terminals spaced apart from each other are formed on the top surface of the first substrate. The method of claim 3,
Wherein the upper elastic member includes at least six upper supporting portions spaced from each other,
And the six upper supports are paired with the six terminals. The method of claim 3,
Wherein the circuit member includes a substrate portion that is energized with the first substrate,
And the second coil is formed of a pattern coil on the substrate portion. 6. The method of claim 5,
Four terminals among the six terminals are connected to the first substrate through the upper elastic member, the support member, and the substrate portion,
The remaining two terminals of the six terminals are connected to the first coil through the upper elastic member, the energizing member, and the lower elastic member,
Wherein the lower elastic member includes two lower supporting portions spaced from each other. 6. The method of claim 5,
Further comprising a cover member for housing the housing therein,
Wherein the cover member includes an upper plate including an opening and a side plate extending downward from the upper plate and coupled with the base. The method according to claim 1,
Wherein the upper elastic member includes eight upper supporting portions spaced from each other,
Wherein the support member comprises eight wires spaced apart from each other,
Wherein the energizing member includes two electrically conductive portions that are spaced apart from each other. The method according to claim 1,
Wherein the energizing member is disposed at one corner of the housing so as to be spaced apart from the supporting member. The method according to claim 1,
Wherein the length of the energizing member in the longitudinal direction is shorter than the length of the supporting member in the longitudinal direction. The method according to claim 1,
And a third magnet disposed on the bobbin,
Wherein the third magnet is symmetrical with respect to the second magnet with respect to the optical axis. A housing including a through hole;
A bobbin arranged to move along the optical axis in the through hole;
A first magnet disposed in the housing;
A first coil disposed in the bobbin and facing the first magnet;
A stator disposed on the lower side of the housing, the stator including a second coil facing the first magnet;
An upper elastic member disposed above the bobbin and coupled to the bobbin and the housing;
A lower elastic member disposed below the bobbin and coupled to the bobbin and the housing;
A supporting member coupled to the upper elastic member and the stator;
An energizing member coupled to the upper elastic member and the lower elastic member;
A second magnet disposed on the bobbin;
A substrate disposed in the housing;
A sensor disposed on the substrate and sensing the second magnet; And
And a driver disposed in the substrate and applying a current to the first coil,
Wherein the driver is electrically connected to the first coil through the upper elastic member, the energizing member, and the lower elastic member. A printed circuit board to which an image sensor is coupled;
A lens module disposed above the image sensor;
A housing disposed above the printed circuit board;
A bobbin installed inside the housing to move in a first direction;
A first coil installed on an outer circumferential surface of the bobbin;
A first magnet coupled to the housing;
A base disposed below said housing;
A first substrate including a circuit member having a second coil disposed between the housing and the base so as to face the first magnet;
An upper elastic member disposed above the bobbin and coupled to the bobbin and the housing;
A lower elastic member disposed below the bobbin and coupled to the bobbin and the housing;
A supporting member coupled to the upper elastic member and the first substrate;
An energizing member coupled to the upper elastic member and the lower elastic member;
A second magnet disposed on the bobbin;
A second substrate disposed on the housing and electrically connected to the upper elastic member;
A sensor disposed on the second substrate and sensing the second magnet; And
And the second substrate is electrically connected to the first coil through the upper elastic member, the energizing member, and the lower elastic member. A camera module disposed in the main body and configured to photograph a subject; and a display unit disposed on one side of the main body and configured to output an image captured by the camera module,
The camera module includes:
A printed circuit board to which an image sensor is coupled;
A lens module disposed above the image sensor;
A housing disposed above the printed circuit board;
A bobbin installed inside the housing to move in a first direction;
A first coil installed on an outer circumferential surface of the bobbin;
A first magnet coupled to the housing;
A base disposed below said housing;
A first substrate including a circuit member having a second coil disposed between the housing and the base so as to face the first magnet;
An upper elastic member disposed above the bobbin and coupled to the bobbin and the housing;
A lower elastic member disposed below the bobbin and coupled to the bobbin and the housing;
A supporting member coupled to the upper elastic member and the first substrate;
An energizing member coupled to the upper elastic member and the lower elastic member;
A second magnet disposed on the bobbin;
A second substrate disposed on the housing and electrically connected to the upper elastic member;
A sensor disposed on the second substrate and sensing the second magnet; And
And the second substrate is electrically connected to the first coil through the upper elastic member, the energizing member, and the lower elastic member.

Images