KR20200023078A - A vertical-cavity surface-emitting laser package - Google Patents

Abstract

The present invention relates to a vertical-cavity surface-emitting laser package with a new structure. The vertical-cavity surface-emitting laser package comprises: a housing including a seating part having a first pattern; a surface-emitting laser element disposed in the housing; and a diffusion part disposed on the seating part of the housing and having a second pattern having a shape corresponding to the shape of the first pattern.

Description

Surface-emitting laser package {A VERTICAL-CAVITY SURFACE-EMITTING LASER PACKAGE}

Embodiments relate to surface emitting laser packages.

A semiconductor device including a compound such as GaAs or AlGaAs may emit light of various wavelength bands by using a wide and easy-to-adjust band gap energy, and thus may be variously used as a light emitting device, a light receiving device, and various diodes.

In particular, light emitting devices such as light emitting diodes or laser diodes using group 3-5 or 2-6 compound semiconductor materials have been developed using thin film growth technology and device materials. Various colors such as ultraviolet rays can be realized, and efficient white light can be realized by using fluorescent materials or combining colors.Low power consumption, semi-permanent life, fast response speed, It has the advantages of safety and environmental friendliness.

In addition, when a light receiving device such as a photodetector or a solar cell is manufactured by using a group 3-5 or group 2-6 compound semiconductor material, the development of device materials absorbs light in various wavelength bands, thereby generating a photocurrent. It can receive light in various wavelength bands, ranging from radio wavelength bands. In addition, semiconductor devices have the advantages of fast response speed, safety, environmental friendliness, and easy control of device materials, so that they can be easily adopted in power control or microwave circuits or communication modules.

Therefore, the semiconductor device may replace a transmission / reception module of an optical communication system, a light emitting unit that replaces a cold cathode fluorescent lamp (CCFL) constituting a backlight of a liquid crystal display (LCD), a fluorescent lamp, or an incandescent bulb. Applications are expanding to lighting devices such as white light emitting diodes, automotive headlights, traffic lights or sensors to detect gas or fire.

In addition, the semiconductor device may be extended to high frequency application circuits, other power control devices, and communication modules. For example, there is a surface-emitting laser (VCSEL) device as a semiconductor device. Surface emitting laser devices are used in optical communication, optical parallel processing, optical connection, and the like. On the other hand, the laser diode used in such a communication module is designed to be easy to operate at a low current.

Surface-emitting laser devices are being developed for communication and sensors. The surface emitting laser device for communication is applied to an optical communication system.

The surface emitting laser element for the sensor is applied to a 3D sensing camera that detects a person's face. For example, a 3D sensing camera is a camera capable of capturing depth information of an object, and has recently been in the spotlight in conjunction with augmented reality.

It can be commercialized into a surface emitting laser package containing a surface emitting laser element.

In a conventional surface emitting laser package, a diffusion portion is disposed on the surface emitting laser element to diffuse the laser beam of the surface emitting laser element, and the diffusion portion is fixed by the adhesive member.

However, even if the diffusion part is fixed by the adhesive member, a problem arises in which the diffusion part is detached by an impact. When the diffusion is detached as described above, the laser beam emitted from the surface emitting laser device disposed below the diffusion is exposed as it is. When the surface emitting laser package is applied to the face recognition field, there is a risk that the laser beam exposed by the detachment of the diffuser is transmitted to the eyes of the user and blinded.

The embodiment aims to solve the above and other problems.

Another object of the embodiment is to provide a surface emitting laser package having a new structure.

Another object of the embodiment is to provide a surface emitting laser package with enhanced fixing of the diffusion portion.

Yet another object of the embodiment is to provide a surface emitting laser package that can provide high power light and prevent moisture from penetrating therein.

Another object of the embodiment is to provide a surface emitting laser package that can improve the heat dissipation performance.

It is still another object of the embodiment to provide a surface emitting laser package having enhanced fixability of the surface emitting laser device.

Another object of the embodiment is to provide a surface emitting laser package that can ensure the reliability of the electrical connection.

Yet another object of the embodiment is to provide a surface emitting laser package capable of preventing surface damage of the diffuser.

According to an aspect of an embodiment to achieve the above or another object, the surface emitting laser package, the housing comprising a seating portion having a first pattern; A surface emitting laser device disposed in the housing; And a diffusion part disposed on the seating part of the housing and having a second pattern having a shape corresponding to the shape of the first pattern.

Referring to the effect of the surface-emitting laser package according to the embodiment as follows.

According to at least one of the embodiments, the surface emitting laser device is embedded in the adhesive portion, and the surface emitting laser device is firmly fixed by the adhesive portion to prevent detachment of the surface emitting laser device.

According to at least one of the embodiments, the wire is embedded in the adhesive portion has the advantage that the wire is firmly fixed by the adhesive portion can prevent the disconnection of the wire due to the impact.

According to at least one of the embodiments, even if oxygen or moisture is permeated into the housing through the housing from the outside, there is an advantage that it is blocked by the adhesive portion to prevent the surface emitting laser device from being exposed to oxygen or moisture.

According to at least one of the embodiments, if only the material for forming the diffusion portion is formed on the first pattern of the adhesive portion, since the second pattern is naturally formed on the lower surface of the diffusion portion, the second pattern of the diffusion portion need not be formed separately. This has the advantage of being simple and reducing process time.

According to at least one of the embodiments, there is no need for a separate bonding process for attaching the diffusion as in the prior art, and there is no need to make the diffusion in advance separately, so that the diffusion including the second pattern directly in the housing is formed. There is an advantage in that the design of the target divergence angle is not easy because the scratch of the diffuser is not generated when a separate bonding process for attaching the diffuser is performed.

According to at least one of the embodiments, the distance between the upper surface of the surface emitting laser element and the lower surface of the diffuser is smaller than the distance between the upper surface of the surface emitting laser element and the bottom surface of the housing, so that the laser beam emitted from the surface emitting laser element The shortest distance to enter the diffusion portion has the advantage that the divergence angle can be minimized.

According to at least one of the embodiments, the mounting portion and the diffusion portion of the housing is fastened using a screw thread, so that the diffusion portion is securely fixed to the mounting portion, the separation of the diffusion portion can be prevented to improve the reliability of the product There is this.

According to at least one of the embodiments, when the fastening portion is fastened to the mounting portion, it is rotated in a direction opposite to the rotational direction so that the diffusion portion can be easily separated from the mounting portion, so that if the diffusion portion defects, etc. occurs It is easy to replace.

According to at least one of the embodiments, the first pattern of the seating portion of the housing and the second pattern of the diffusion portion are fastened more tightly by an adhesive member disposed between the first pattern of the seating portion of the housing and the second pattern of the diffusion portion. Therefore, there is an advantage that the desorption of the diffusion part can be blocked at the source.

According to at least one of the embodiments, the diameter of the diffuser is made smaller than the diameter of the seating portion of the housing, such that a gap is formed between the outer face of the diffuser and the inner face of the seating portion of the housing and an adhesive member can be arranged in this gap. have. Accordingly, not only the diffusion part is more easily fitted into the seating part of the housing but also the fitting fastening between the first pattern of the seating part of the housing and the second pattern of the diffusion part, as well as the adhesion of the diffusion part to the seating part of the housing by the adhesive member. There is an advantage that the desorption of the diffusion portion is blocked by the source can be improved reliability of the product.

According to at least one of the embodiments, the side of the diffusion portion and the side of the seating portion of the housing are screwed together, while an adhesive member is disposed between the bottom surface of the diffusion portion and the bottom surface of the seating portion of the housing, whereby the detachment of the diffusion portion is essentially There is an advantage that can be blocked to improve the reliability of the product.

According to at least one of the embodiments, since the upper surface of the diffusion portion is located lower than the upper surface of the housing, the upper surface of the diffusion is protected by the upper surface of the housing has the advantage that the defects such as scratches that may occur on the upper surface of the housing can be blocked. have.

Further scope of the applicability of the embodiments will become apparent from the detailed description below. However, various changes and modifications within the spirit and scope of the embodiments can be clearly understood by those skilled in the art, and therefore, specific embodiments, such as the detailed description and the preferred embodiments, are to be understood as given by way of example only.

1 is a cross-sectional view illustrating a surface light emitting laser package according to a first embodiment.
2 is a plan view of the surface-emitting laser device according to the first embodiment.
3 is an enlarged view of one region C1 of the surface emitting laser device according to the first embodiment shown in FIG. 2.
4A is a first cross-sectional view taken along line A1-A2 of the surface emitting laser device according to the first embodiment shown in FIG. 3.
4B is a second cross-sectional view taken along line A3-A4 of the surface emitting laser device according to the first embodiment shown in FIG. 3.
5 to 7 are views illustrating a manufacturing process of the surface emitting laser package according to the first embodiment.
8 is a cross-sectional view illustrating a surface emitting laser package according to a second embodiment.
9 is a plan view illustrating a surface emitting laser package according to a third embodiment.
10 is a cross-sectional view taken along the line K-K 'of the surface emitting laser package of FIG.
11 is a sectional view showing a housing according to the third embodiment.
12 is a perspective view illustrating a diffusion unit according to a third embodiment.
13 is a sectional view showing a diffusion unit according to a third embodiment.
14 is a cross-sectional view showing a surface emitting laser package according to the fourth embodiment.
15 is a cross-sectional view of a surface emitting laser package according to a fifth embodiment.
16 is a cross-sectional view illustrating a surface emitting laser package according to a sixth embodiment.
17 is another cross-sectional view of the surface emitting laser device according to the embodiment.
18 is a perspective view of a mobile terminal to which a surface emitting laser device is applied according to an embodiment.

DETAILED DESCRIPTION Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

In the description of the embodiments, when described as being formed on the "on or under" of each element, the on or under is It includes both the two elements are in direct contact with each other (directly) or one or more other elements are formed indirectly between the two (element). In addition, when expressed as "on" or "under", it may include the meaning of the downward direction as well as the upward direction based on one element.

(First embodiment)

1 is a cross-sectional view illustrating a surface light emitting laser package 100 according to a first embodiment.

Referring to FIG. 1, the surface emitting laser package 100 according to the first embodiment may provide a housing 110.

The housing 110 can support all the components disposed on the housing 110. For example, the housing 110 may support the surface emitting laser device 201 and the diffuser 140 disposed thereon. The housing 110, the surface emitting laser device 201, and the diffuser 140 may be modules modularized by a packaging process. One or more such modules may be mounted on a circuit board (not shown).

The housing 110 of the embodiment may include a material having excellent support strength, heat dissipation, insulation, and the like.

 The housing 110 may include a material having high thermal conductivity. The housing 110 may be made of a material having good heat dissipation characteristics so as to efficiently discharge heat generated from the surface emitting laser device 201 to the outside. The housing 110 may include an insulating material.

For example, the housing 110 may include a ceramic material. The housing 110 may include a low temperature co-fired ceramic (LTCC) or a high temperature co-fired ceramic (HTCC) that is co-fired.

In addition, the housing 110 may include a metal compound. The housing 110 may include a metal oxide having a thermal conductivity of 140 W / mK or more. For example, the housing 110 may include aluminum nitride (AlN) or alumina (Al 2 O 3).

As another example, the housing 110 may include a resin-based insulating material. The housing 110 may be provided of a silicone resin, an epoxy resin, a thermosetting resin including a plastic material, or a high heat resistant material.

The housing 110 may include a conductive material. When the housing 110 is made of a conductive material such as metal, an insulating member for electrical insulation is provided between the housing 110 and the surface emitting laser element 201 or between the housing 110 and the electrodes 181 to 186. Can be provided.

The housing 110 of the first embodiment may include a first body 110a and a second body 110b. The second body 110b may be disposed on the first body 110a.

The first and second bodies 110a and 110b may be made of the same material and integrally formed. For example, the first and second bodies 110a and 110b may be formed by a batch process by molding.

The first and second bodies 110a and 110b may be formed of different materials and formed by separate processes. The second body 110b is made of a different material from the first body 110a and may be formed by a separate process. In this case, the bottom surface of the second body 110b and the top surface of the first body 110a may be adhered to each other by an adhesive member (not shown). As an example, the adhesive member may include an organic material. For example, the adhesive member may include an epoxy resin. For example, the adhesive member may include a silicone resin.

An upper surface of the first body 110a may include a first area and a second area surrounding the first area.

The second body 110b may have an opening therein and protrude vertically from an edge of the first body 110a. That is, the second body 110b may have an opening corresponding to the first region of the upper surface of the first body 110a. In this case, the second body 110b may be disposed on the second area of the upper surface of the first body 110a. The cavity 111 may be defined by the first region of the upper surface of the first body 110a and the opening of the second body 110b. The cavity 111 may be provided in the housing 110. The first region of the top surface of the first body 110a exposed by the cavity 111 may be the bottom surface 113.

The second body 110b may have a side surface 115 that contacts the opening or the cavity 111. The cavity 111 may be formed by the bottom surface 113 and the side surface 115. The side surface 115 may have a surface perpendicular to the bottom surface 113 of the first body 110a, but is not limited thereto.

The housing 110 of the first embodiment may include first and second via holes (not shown) spaced apart from each other. In detail, the first body 110a of the housing 110 may include first and second via holes vertically penetrating through the housing 110. As will be described later, the first and second connection wires 185 and 186 may be disposed in the first and second via holes.

The surface emitting laser package 100 according to the first embodiment may include a first electrode portion 181 and a second electrode portion 182.

The first electrode part 181 and the second electrode part 182 may be disposed in the housing 110. In detail, the first electrode part 181 and the second electrode part 182 may be disposed on the bottom surface 113 of the first body 110a. The first electrode portion 181 and the second electrode portion 182 may be spaced apart from each other for electrical insulation.

The first electrode part 181 and the second electrode part 182 may have the same shape as that of the bottom surface 113 of the first body 110a.

The surface emitting laser package 100 according to the first embodiment may provide the surface emitting laser device 201.

The surface emitting laser device 201 may be disposed on the first electrode part 181. The lower side of the surface emitting laser device 201 may be electrically connected to the first electrode unit 181. For example, the first electrode unit 181 may be electrically connected to the first electrode 215 of FIG. 4A of the surface light emitting laser device 201. The surface emitting laser device 201 may be disposed on a portion of the first electrode part 181. The size of the first electrode unit 181 may be larger than that of the surface emitting laser device 201. For example, the surface emitting laser device 201 may have a square when viewed from above, but is not limited thereto. The width and height of the surface emitting laser device 201 may be the same. In consideration of the size of the surface emitting laser device 201, the size of the first electrode part 181 may be larger than that of the second electrode part 182.

The surface emitting laser device 201 is electrically connected to the light emitting unit E and the second electrode unit 182 including a plurality of emitters (E1, E2, and E3 in FIG. 3) that emit laser beams, respectively. The pad electrode 280 may include a pad part P disposed thereon.

The surface emitting laser device 201 may be disposed adjacent to the second electrode unit 182. In detail, the pad part P of the surface emitting laser device 201 may be disposed adjacent to the second electrode part 182.

2 to 4B, the surface emitting laser device 201 will be described in detail.

FIG. 2 is a plan view of the surface light emitting laser device according to the first embodiment, and FIG. 3 is an enlarged view of one region C1 of the surface light emitting laser device according to the first embodiment shown in FIG. 4A is a first cross-sectional view taken along line A1-A2 of the surface emitting laser device according to the first embodiment shown in FIG. 3, and FIG. 4B is A3 of the surface emitting laser device according to the first embodiment shown in FIG. Second section along the line A4.

2 to 4B, the surface emitting laser device 201 according to the first embodiment may include a light emitting part E and a pad part P. FIG. As illustrated in FIG. 3, the light emitting unit E may be a region including a plurality of light emitting emitters E1, E2, and E3, and may emit a laser beam. For example, the light emitting unit E may include tens to hundreds of light emitting emitters. The pad part P may be a region that is not disposed in the light emitting emitters E1, E2, and E3.

The surface emitting laser device 201 according to the first embodiment may include a second electrode 282. That is, in each of the light emitting emitters E1, E2, and E3, the second electrode 282 may be disposed in the remaining regions except for the region corresponding to the aperture 241. For example, the second electrode 282 may be disposed in the second region of the second reflective layer 250. The first region of the second reflective layer 250 is surrounded by the second region and may be equal to or larger than the size of the opening 241. Therefore, the beam generated in the emission layer 230 may pass through the opening 241 and be emitted to the outside through the opening defined by the second electrode 282.

The surface emitting laser device 201 according to the first embodiment includes a first electrode 215, a substrate 210, a first reflective layer 220, a light emitting layer 230, an oxide layer 240, a second reflective layer 250, One or more of the passivation layer 270 and the second electrode 282 may be included.

The oxide layer 240 may include an opening 241 and an insulating region 242. The opening 241 may be a passage area through which current flows. The insulating region 242 may be a blocking region that blocks the flow of current. The insulating region 242 may be referred to as an oxide layer or an oxide layer.

The oxide layer 240 may be referred to as a current confinement layer because it restricts the flow or density of the current to emit a more coherent laser beam.

The surface emitting laser device 201 according to the first embodiment may further include a pad electrode 280. The pad electrode 280 may be disposed in an area excluding the pad part P, that is, the light emitting part E. FIG. The pad electrode 280 may be electrically connected to the second electrode 282. The first electrode 282 and the pad electrode 280 may be formed integrally or separately.

Hereinafter, technical features of the surface emitting laser device 201 according to the first embodiment will be described with reference to FIGS. 2 to 4B. In the drawing of the first embodiment, the direction of the x-axis may be a direction parallel to the longitudinal direction of the substrate 210, the y-axis may be a direction perpendicular to the x-axis.

<Substrate, first electrode>

The surface emitting laser device 201 according to the first embodiment provides a substrate 210. The substrate 210 may be a conductive substrate or a nonconductive substrate. As the conductive substrate, a metal having excellent electrical conductivity may be used. Since the heat generated during the operation of the surface emitting laser device 201 should be sufficiently dissipated, a GaAs substrate or a metal substrate having a high thermal conductivity or a silicon (Si) substrate may be used as the conductive substrate. As the non-conductive substrate, an AlN substrate, a sapphire (Al ₂ O ₃ ) substrate, or a ceramic-based substrate may be used.

The surface emitting laser device 201 according to the first embodiment provides a first electrode 215. The first electrode 215 may be disposed under the substrate 210. The first electrode 215 may be disposed in a single layer or multiple layers of a conductive material. For example, the first electrode 215 may be a metal and include at least one of aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). Therefore, it is formed in a single layer or a multi-layer structure, it is possible to improve the electrical characteristics to increase the light output.

<1st reflective layer>

The surface emitting laser device 201 according to the first embodiment provides a first reflective layer 220. The first reflective layer 220 may be disposed on the substrate 210. When the substrate 210 is omitted to reduce the thickness, the bottom surface of the first reflective layer 220 may contact the top surface of the first electrode 215.

The first reflective layer 220 may be doped with a first conductivity type dopant. For example, the first conductivity type dopant may include an n type dopant such as Si, Ge, Sn, Se, Te, or the like.

The first reflective layer 220 may include a gallium-based compound, for example, AlGaAs, but is not limited thereto. The first reflective layer 220 may be a distributed bragg reflector (DBR). For example, the first reflective layer 220 may have a structure in which a first layer and a second layer including materials having different refractive indices are alternately stacked at least once.

For example, the first reflective layer 220 may include a plurality of layers disposed on the substrate 210. Each layer may include a semiconductor material having a composition formula of Al _x Ga _(1-x) As (0 <x <1), and if the Al in each layer increases, the refractive index of each layer decreases, and if Ga increases The refractive index of each layer can increase. Each layer may have a thickness of λ / 4n, λ may be a wavelength of light generated in the light emitting layer 230, and n may be a refractive index of each layer with respect to light having the aforementioned wavelength. Here, λ may be 650 to 980 nanometers (nm), and n may be the refractive index of each layer. The first reflective layer 220 having such a structure may have a reflectance of 99.999% for light having a wavelength of about 940 nanometers.

The thickness of the layer in each first reflective layer 220 may be determined according to the refractive index and the wavelength λ of the light emitted from the light emitting layer 230.

<Active layer>

The surface emitting laser device 201 according to the first embodiment may include a light emitting layer 230. The light emitting layer 230 may be disposed on the first reflective layer 220. In detail, the emission layer 230 may be disposed on the first reflective layer 220. The light emitting layer 230 may be disposed between the first reflective layer 220 and the second reflective layer 250.

The light emitting layer 230 may include an active layer and at least one cavity. For example, the emission layer 230 may include an active layer, a first cavity disposed below the active layer, and a second cavity disposed above the active layer. The light emitting layer 230 of the first embodiment may include both the first cavity and the second cavity, or may include only one of them.

The active layer may include any one of a single well structure, a multi well structure, a single quantum well structure, a multi quantum well (MQW) structure, a quantum dot structure, and a quantum line structure.

The active layer may include a quantum well layer and a quantum wall layer using a group 3-5 or group 2-6 compound semiconductor material. The quantum well layer may be formed of a material having an energy band gap smaller than the energy band gap of the quantum wall layer. The active layer may be formed of one to three pair structures such as InGaAs / AlxGaAs, AlGaInP / GaInP, AlGaAs / AlGaAs, AlGaAs / GaAs, GaAs / InGaAs, but is not limited thereto. The dopant may not be doped in the active layer.

The first cavity and the second cavity may be formed of Al _y Ga _(1-y) As (0 <y <1), but are not limited thereto. For example, the first cavity and the second cavity may each include a plurality of layers of Al _y Ga _(1-y) As.

<Oxide layer>

The surface emitting laser device 201 according to the first embodiment may provide the oxide layer 240. The oxide layer 240 may include an insulating region 242 and an opening 241. The insulating region 242 may surround the opening 241. For example, the opening 241 may be disposed on the first area (center area) of the light emitting layer 230, and the insulating area 242 may be disposed on the second area (edge area) of the light emitting layer 230. The second region may surround the first region.

The opening 241 may be a passage area through which current flows. The insulating region 242 may be a blocking region that blocks the flow of current. The insulating region 242 may be referred to as an oxide layer or an oxide layer.

The amount of current supplied from the second electrode 282 to the light emitting layer 230, that is, the current density may be determined by the size of the opening 241. The size of the opening 241 may be determined by the insulating region 242. As the size of the insulating region 242 increases, the size of the opening 241 may decrease, and thus the current density supplied to the light emitting layer 230 may increase. In addition, the opening 241 may be a passage through which the beam generated in the emission layer 230 travels in an upward direction, that is, in a direction of the second reflective layer 250. That is, the divergence angle of the beam of the light emitting layer 230 may vary according to the size of the opening 241.

The insulating region 242 may be formed of an insulating layer, for example, aluminum oxide (Al ₂ O ₃ ). For example, when the oxide layer 240 includes aluminum gallium arsenide (AlGaAs), the AlGaAs of the oxide layer 240 reacts with H ₂ O to change the edge to aluminum oxide (Al ₂ O ₃ ), thereby insulating the region 242. The central region, which is formed of H ₂ O and does not react with H ₂ O, may be an opening 241 including AlGaAs.

According to the first embodiment, the light emitted from the light emitting layer 230 through the opening 241 may be emitted to the upper region, and the light transmittance of the opening 241 may be excellent compared to the insulating region 242. .

The insulating region 242 may include a plurality of layers. For example, the insulating region 242 may be disposed between the first insulating region, the second insulating region disposed on the first insulating region, and the second insulating region. It may include a third insulating region. One insulating region of the first to third insulating regions may have the same thickness as the other insulating region or may have a different thickness. The first to third insulating regions may include at least an oxidation material. The first to third insulating regions may include at least a group 3-5 or a group 2-6 compound semiconductor material.

<Second reflective layer>

The surface emitting laser device 201 according to the first embodiment may include a second reflective layer 250. The second reflective layer 250 may be disposed on the oxide layer 240.

The second reflective layer 250 may include a gallium-based compound, for example, AlGaAs, and the second reflective layer 250 may be doped with a second conductive dopant. The second conductivity type dopant may be a p-type dopant such as Mg, Zn, Ca, Sr, Ba, or the like. Meanwhile, the first reflective layer 220 may be doped with a p-type dopant, and the second reflective layer 250 may be doped with an n-type dopant.

The second reflecting layer 250 may also be a distributed Bragg reflector (DBR). For example, the second reflective layer 250 may have a structure in which a plurality of layers including materials having different refractive indices are alternately stacked at least once.

Each layer of the second reflective layer 250 may include AlGaAs, and in detail, may be formed of a semiconductor material having a compositional formula of Al _x Ga _(1-x) As (0 <x <1). Herein, when Al increases, the refractive index of each layer may decrease, and when Ga increases, the refractive index of each layer may increase. Each layer of the second reflective layer 250 may have a thickness of λ / 4n, λ may be a wavelength of light emitted from the active layer, and n may be a refractive index of each layer with respect to light having the aforementioned wavelength.

The second reflective layer 250 having such a structure may have a reflectance of 99.9% for light having a wavelength of about 940 nanometers.

The second reflective layer 250 may be formed by alternately stacking layers, and the number of pairs of layers in the first reflective layer 220 may be greater than the number of pairs of layers in the second reflective layer 250. . As described above, the reflectance of the first reflective layer 220 may be 99.999%, which may be greater than 99.9% of the reflectance of the second reflective layer 250.

In the first embodiment, the second reflective layer 250 may include a plurality of layers disposed on the light emitting layer 230. Each layer may be formed of a single or a plurality of layers.

Passivation layer, second electrode

The surface emitting laser device 201 according to the first embodiment may provide a passivation layer 270. The passivation layer 270 may surround a portion of the light emitting structure. Some regions of the light emitting structure may include, for example, the light emitting layer 230, the oxide layer 240, and the second reflective layer 250. The passivation layer 270 may be disposed on the top surface of the first reflective layer 220. The passivation layer 270 may be disposed on an edge region of the second reflective layer 250. When the light emitting structure is partially mesa-etched, a portion of the upper surface of the first reflective layer 220 may be exposed, and a portion of the light emitting structure may be formed. The passivation layer 270 may be disposed on a circumference of a portion of the light emitting structure and on an upper surface of the exposed first reflective layer 220.

The passivation layer 270 may protect the light emitting structure from the outside and block electrical short between the first reflective layer 220 and the second reflective layer 250. The passivation layer 270 may be formed of an inorganic material such as SiO ₂ , but is not limited thereto.

The surface emitting laser device 201 according to the first embodiment may provide the second electrode 282. The second electrode 282 may be electrically connected to the pad electrode 280. The second electrode 282 may contact a portion of the top surface of the second reflective layer 250.

The second electrode 282 and the pad electrode 280 may be made of a conductive material. For example, the second electrode 282 and the pad electrode 280 may include platinum (Pt), aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), tungsten (W), and copper (Cu). ), Gold (Au) may be formed in a single layer or a multi-layer structure.

3 and 4, the surface emitting laser package 100 according to the first embodiment may provide a plurality of wires 191. The wire 191 may be a connection member for electrically connecting the surface emitting laser device 201 to the second electrode unit 182.

The plurality of wires 191 may be spaced apart from each other. One side of each wire 191 is electrically connected to the pad electrode 280 of the pad portion P of the surface emitting laser device 201, and the other side of each wire 191 is electrically connected to the second electrode portion 182. Can be connected. For example, the pad electrode 280 may be electrically connected to the second electrode 282 of the surface emitting laser device 201. The pad electrode 280 may be integrally formed with the second electrode 282 of the surface emitting laser device 201.

The wire 191 may be electrically connected to the pad portion P and the second electrode portion 182 of the surface emitting laser device 201 using a bonding process.

The highest point of the wire 191 may be located higher than the upper surface of the surface emitting laser device 201, specifically, the upper surface of the pad portion P of the surface emitting laser device 201.

The surface emitting laser package 100 according to the first embodiment may provide a first bonding part 183 and a second bonding part 184.

The first bonding part 183 and the second bonding part 184 may be disposed under the housing 110. For example, the first bonding portion 183 and the second bonding portion 184 may be disposed on the bottom surface of the first body 110a of the housing 110.

In the drawing, the first bonding portion 183 and the second bonding portion 184 may be disposed to protrude downward from the lower surface of the first body 110a of the housing 110.

As another example, first and second recesses spaced apart from each other are formed on the bottom surface of the first body 110a of the housing 110, and a first bonding part 183 is disposed in the first recess, and a second The second bonding portion 184 may be disposed in the recess. In this case, the bottom surface of the first bonding portion 183 disposed in the first recess and the second bonding portion 184 disposed in the second recess may be disposed. The lower surface may horizontally coincide with the lower surface of the first body 110a of the housing 110.

For example, each of the lower surface of the first bonding unit 183 and the lower surface of the second bonding unit 184 may be in surface contact with and electrically connected to a signal line (not shown) of a circuit board (not shown). In this case, the housing 110 may be referred to as a first substrate, and the circuit board 160 may be referred to as a second substrate.

The first bonding part 183 and the second bonding part 184 may be spaced apart from each other under the housing 110. The first bonding portion 183 and the second bonding portion 184 may have a pad having a circular shape when viewed from below, but the embodiment is not limited thereto.

The first bonding part 183 may be electrically connected to the first electrode part 181. The first bonding unit 183 may be electrically connected to the first electrode unit 181 through the first connection line 185. For example, the first connection line 185 may be disposed in the first via hole provided in the housing 110. The first bonding part 183 and the first connection wiring 185 may be integrally formed using the same metal material.

The second bonding part 184 may be electrically connected to the second electrode part 182. The second bonding unit 184 may be electrically connected to the second electrode unit 182 through the second connection line 186. For example, the second connection wiring 186 may be disposed in the second via hole provided in the housing 110. The second bonding portion 184 and the second connection wiring 186 may be integrally formed using the same metal material.

For example, the first connection wire 185 and the second connection wire 186 may include tungsten (W), but are not limited thereto. Tungsten (W) may be melted at a high temperature of 1000 ° C. or higher, injected into the first and second via holes, and cured to form a first connection line 185 and a second connection line 186. A portion of the tungsten (W) may be hardened under the housing 110 to be formed of the first and second bonding portions 183 and 184, but is not limited thereto.

According to the embodiment, the driving power can be provided to the surface emitting laser device 201 through a circuit board (not shown).

The surface emitting laser package 100 according to the first embodiment may provide an adhesive part 130.

The adhesive part 130 may be disposed in the cavity 111 of the housing 110.

The adhesion part 130 may surround the first electrode part 181 and the second electrode part 182. The adhesive part 130 may surround the surface emitting laser device 201. The adhesive part 130 may surround the wire 191. The top surface of the adhesive portion 130 may be located at least higher than the highest point of the wire 191.

An upper surface of the adhesive part 130 may include a plurality of first patterns 132. The first pattern 132 may include an intaglio pattern recessed into the adhesion part 130. The first pattern 132 may be referred to as a groove, a recess, or a groove.

The first electrode part 181 and the second electrode part 182 may be embedded in the adhesive part 130. The surface emitting laser device 201 may be embedded in the adhesive part 130. The wire 191 may be embedded in the adhesive part 130.

The adhesive part 130 may be made of a material having excellent support strength, heat resistance, heat dissipation, adhesiveness, and insulation. For example, the adhesive part 130 may be made of an organic / inorganic hybrid resin, an aliphatic fluorene-modified acrylate-based resin or an acrylate-acrylate resin, but is not limited thereto. For example, the refractive index of the organic / inorganic hybrid resin is about 1.3, the refractive index of the aliphatic fluorene-modified acrylate-based resin is about 1.43, and the refractive index of the acrylate-based resin may be about 1.46.

Since the adhesiveness of the adhesive part 130 is excellent, the adhesive part 130 may include the side surface 115 and the bottom surface 113 of the housing 110, the first and second electrode parts 181 and 182, and the surface emitting laser device ( 201) and the wire 191 can be easily bonded.

Since the adhesive part 130 has excellent heat dissipation characteristics, heat generated in the surface emitting laser device 201 may be quickly released to the outside.

Since the adhesive part 130 has excellent insulating properties, electrical insulation between the surface emitting laser device 201 and other components may be ensured.

Since the adhesive part 130 has excellent heat resistance, deformation may not occur even when the adhesive part 130 is cured, and thus optical properties of the adhesive part 130 may be maintained.

According to the first embodiment, the surface emitting laser device 201 is embedded in the adhesive part 130 so that the surface emitting laser device 201 is firmly fixed by the adhesive part 130 to remove the surface emitting laser device 201. It can prevent.

According to the first embodiment, the wire 191 is embedded in the adhesive portion 130, the wire 191 is firmly fixed by the adhesive portion 130 can prevent the disconnection of the wire 191 due to the impact.

According to the first embodiment, even if oxygen or moisture is permeated into the housing 110 through the housing 110 from the outside, it is blocked by the adhesive unit 130 so that the surface emitting laser device 201 is not exposed to oxygen or moisture. can do.

The surface emitting laser package 100 according to the first embodiment may provide the diffuser 140.

The diffusion unit 140 may be disposed in the cathy of the housing 110. The diffusion part 140 may be disposed on the adhesive part 130. The bottom surface of the diffusion part 140 may be in contact with the top surface of the adhesive part 130, and the side surface 115 of the diffusion part 140 may be in contact with the side surface 115 of the housing 110.

An upper surface of the diffusion part 140 may horizontally coincide with an upper surface of the second body 110b of the housing 110, but is not limited thereto.

The lower surface of the diffusion unit 140 may include a plurality of second patterns 142. The second pattern 142 may include an embossed pattern protruding from the diffuser 140 to the outside, that is, toward the surface light emitting laser device 201. The second pattern 142 may be referred to as a protrusion, a protruding region, and an extension.

The second pattern 142 may be disposed on the entire area of the bottom surface of the diffusion unit 140.

The second pattern 142 of the diffusion part 140 may have a shape corresponding to the first pattern 132 of the adhesive part 130. As will be described later, after the first pattern 132 of the adhesive part 130 is formed, a material for forming the diffusion part 140 is formed in the first pattern 132, so that the adhesive part ( A second pattern 142 corresponding to the first pattern 132 of 130 may be formed.

The laser beam incident through the adhesion part 130 is diffused from the surface light emitting laser device 201 by the first pattern 132 of the adhesion part 130 and the second pattern 142 of the diffusion part 140. can do.

The pattern part may be formed by the first pattern 132 of the adhesive part 130 and the second pattern 142 of the diffusion part 140. That is, the pattern unit may include the first pattern 132 and the second pattern 142. The pattern part may be disposed at an interface between the adhesive part 130 and the diffusion part 140. The pattern part may be configured by the first pattern 132 formed on the upper surface of the adhesive part 130 and the second pattern 142 formed to correspond to the first pattern at the interface between the adhesive part 130 and the diffusion part 140. .

As described above, when only the material for forming the diffusion part 140 is formed on the first pattern 132 of the adhesive part 130, the second pattern 142 is naturally formed on the bottom surface of the diffusion part 140. Therefore, since the second pattern of the diffusion part does not need to be formed separately, the process is simple and the process time can be reduced.

In addition, in the related art, a process of attaching the diffusion part 140 having the pattern to the housing using a separate bonding process was required. For this attachment process, the diffusion part must be pressed against the housing. In this case, a defect such as a scratch occurs on the surface of the diffusion part, and a divergence angle defect occurs in which the divergence angle of the laser beam emitted from the surface of the diffusion part is larger than the target divergence angle. Can be.

However, according to the first embodiment, there is no need for a separate bonding process for attaching the diffusion portion as in the prior art, and there is no need to separately make the diffusion portion in advance, and include the second pattern 142 directly in the housing 110. The diffusion unit 140 may be formed. Accordingly, scratches of the diffusion parts generated when a separate bonding process for attaching the diffusion parts are not generated, thereby making it easier to design a target divergence angle.

The diffusion unit 140 may be made of a material having excellent support strength, heat resistance, heat dissipation, adhesiveness, and insulation. For example, the diffusion part 140 may be made of urethane acrylate-based resin, polyamide-imide-based resin, or polyether-imide-based resin, but is not limited thereto. The refractive index of the diffusion part 140 may be greater than the refractive index of the adhesion part 130, so that the laser beam incident through the adhesion part 130 may be diffused by the surface light emitting laser device 201. For example, the refractive index of the urethane acrylic resin is approximately 1.6, the refractive index of the polyamide-imide resin is approximately 1.65, the refractive index of the polyetheramide resin may be approximately 1.63, but is not limited thereto.

Since the adhesion of the diffusion part 140 is excellent, the diffusion part 140 may be easily adhered to the side surface 115 and the adhesion part 130 of the housing 110.

Since the diffusion part 140 has excellent heat dissipation characteristics, heat generated in the surface emitting laser device 201 may be quickly discharged to the outside.

Since the diffusion unit 140 has excellent heat resistance, deformation may not occur even when the diffusion unit 140 is cured, and thus the optical characteristics of the diffusion unit 140 may be maintained.

For example, the adhesion part 130 may be referred to as a first layer, and the diffusion part 140 may be referred to as a second layer. For example, the adhesive part 130 may be referred to as a first resin layer, and the diffusion part 140 may be referred to as a second resin layer.

When the thickness of the adhesive part 130 is called T1 and the thickness of the diffusion part 140 is called T2, the thickness of the first body 110a of the housing 110 may be called T3. In this case, the thickness T1 of the adhesive part 130 may be the same as the thickness T2 of the diffusion part 140. The thickness T1 of the adhesive part 130 may be the same as the thickness T2 of the first body 110a of the housing 110.

The thickness T1 of the adhesive part 130 may be greater than the thickness T2 of the diffusion part 140. For example, the ratio of the thickness T2 of the diffusion part 140 and the thickness T1 of the adhesive part 130 may be about 1: 1 to about 1: 1.5.

The distance L1 between the top surface of the surface emitting laser element 201 and the bottom surface of the diffuser 140 is the distance L2 between the top surface of the surface emitting laser element 201 and the bottom surface 113 of the housing 110. By making it smaller, the diverging angle can be minimized by allowing the laser beam emitted from the surface emitting laser device 201 to enter the diffusion unit 140 at the shortest distance.

5 to 7 are views illustrating a manufacturing process of the surface emitting laser package according to the first embodiment.

As shown in FIG. 5, a housing 110 in which the surface emitting laser device 201 is mounted may be provided. The surface emitting laser device 201 may be disposed on one of the first electrode part 181 and the second electrode part 182.

First and second electrode parts 181 and 182, first and second bonding parts 183 and 184, and first and second connection wirings 185 and 186 may be disposed in the housing 110.

As another example, the first and second bonding parts 183 and 184 and the first and second connection wires 185 and 186 may be formed in the housing 110 after the diffusion part (see 140 in FIG. 7) is formed. have.

Subsequently, the first resin material 130a may be filled in the cavity 111 of the housing 110. The first resin material 130a may be made of a material having excellent support strength, heat resistance, heat dissipation, adhesiveness, and insulation. For example, the first resin material 130a may be made of an organic / inorganic hybrid resin, an aliphatic fluorene-modified acrylate-based resin, or an acrylate-acrylate resin, but is not limited thereto. For example, the refractive index of the organic / inorganic hybrid resin is about 1.3, the refractive index of the aliphatic fluorene-modified acrylate-based resin is about 1.43, and the refractive index of the acrylate-based resin may be about 1.46.

Subsequently, after the stamp 350 having the embossed pattern 352 is placed on the first resin material 130a, the stamp 350 may be pressed.

As shown in FIG. 6, the stamp 350 is pressed to form a plurality of first patterns 132 corresponding to the relief patterns 352 on the upper surface of the first resin material 130a. The first pattern 132 may include an intaglio pattern corresponding to the embossed pattern 352 of the stamp 350.

Subsequently, the first resin material 130a may be cured using the curing process to be changed to the adhesive part 130.

As shown in FIG. 7, the second resin material may be filled in the cavity 111 of the housing 110. The second resin material may be formed on the adhesive part 130 in the cavity 111 of the housing 110. The second resin material may be made of a material having excellent support strength, heat resistance, heat dissipation, adhesiveness, and insulation. For example, the second resin material may be made of urethane acrylate-based resin, polyamide-imide resin, or polyether-imide resin, but is not limited thereto. The refractive index of the diffusion part 140 may be greater than the refractive index of the adhesion part 130, so that the laser beam incident through the adhesion part 130 may be diffused by the surface light emitting laser device 201. For example, the refractive index of the urethane acrylic resin is about 1.6, the refractive index of the polyamide-imide resin is approximately 1.65, the refractive index of the polyetheramide-based resin may be approximately 1.63, but not limited to this, so that the curing process is used. As a result, the second resin material may be cured to be changed to the diffusion part 140.

Since the plurality of first patterns 132 are already formed on the upper surface of the adhesive part 130, when the second resin material is cured on the adhesive part 130, the first pattern of the adhesive part 130 is formed on the lower surface of the second resin material ( The second pattern 142 corresponding to the 132 may be formed.

Since the embossed pattern 352 is formed on the stamp 350, the first pattern 132 of the adhesive part 130 may include an engraved pattern corresponding to the embossed pattern 352 of the stamp 350. In addition, since the diffusion part 140 is formed on the adhesion part 130, the first pattern 132 of the adhesion part 130, that is, the second pattern 142 corresponding to the intaglio pattern is formed on the bottom surface of the diffusion part 140. That is, an embossed pattern may be formed. The second pattern 142 of the diffusion unit 140 may include an embossed pattern having the same shape as the embossed pattern 352 of the stamp 350, but is not limited thereto.

(2nd Example)

8 is a cross-sectional view illustrating a surface emitting laser package according to a second embodiment.

The second embodiment is the same as the first embodiment except for the second pattern 142 of the diffusion unit 140. In the second embodiment, the same reference numerals are given to the same functions, shapes, and / or structures as those of the first embodiment, detailed descriptions thereof are omitted, and the omitted technical idea may be easily understood from the description of the first embodiment. .

Referring to FIG. 8, the surface emitting laser package 100A according to the second embodiment may include a housing 110, a surface emitting laser device 201, an adhesive part 130, and a diffusion part 140.

The surface emitting laser package 100A according to the second embodiment may further include a first electrode part 181 and a second electrode part 182. The first electrode part 181 and the second electrode part 182 may be disposed on the bottom surface 113 provided in the cavity 111 of the housing 110.

The surface emitting laser element 201 is, for example, disposed on the first electrode portion 181, but is not limited thereto. The first electrode of the surface emitting laser device 201 may be electrically connected to the first electrode part 181.

The surface emitting laser device 201 may be electrically connected to the second electrode unit 182 using a wire 191. For example, one side of the wire may be electrically connected to the second electrode of the surface emitting laser device 201.

For example, the surface emitting laser device 201 may include an active layer for emitting a laser beam. The surface emitting laser device 201 may be a flip chip type, although the first electrode 215 may be disposed below the active layer, and the second electrode 280 may be, for example, a vertical surface emitting laser device 201 that may be disposed above the active layer. It may be a surface emitting laser element (see FIG. 9).

An upper surface of the adhesive part 130 may include a plurality of first patterns 132. The lower surface of the diffusion unit 140 may include a plurality of second patterns 142 corresponding to the first pattern 132.

The plurality of first patterns 132 may be formed on a portion of the upper surface of the adhesive part 130 (hereinafter, referred to as a first pattern region). The plurality of second patterns 142 may be formed in a portion of the lower surface of the diffusion part 140 (hereinafter referred to as a second pattern region).

Since the second pattern 142 is formed corresponding to the first pattern 132, the second pattern region and the first pattern region may have the same width W2.

According to the second embodiment, the width W2 of each of the first pattern region and the second pattern region is equal to or larger than the width W1 of the surface light emitting laser element 201, and the diffusion portion 140 and the adhesive portion 130 are formed. It may be smaller than each width W3. In detail, the width W2 of each of the first pattern area and the second pattern area may be equal to or larger than the width of the light emitting part E of the surface light emitting laser device 201.

The surface emitting laser device 201 may vertically overlap each of the first pattern region or the second pattern region.

A portion of the first pattern region or the second pattern region (hereinafter referred to as a first region) is vertically overlapped with the surface light emitting laser device 201, and another region of the first pattern region or the second pattern region (hereinafter, The second region may not vertically overlap with the surface emitting laser device 201. The second region may surround the first region.

According to the second embodiment, since the laser beam is emitted from the surface emitting laser element 201, the divergence angle of the laser beam is not large, and thus, the pattern region including the first pattern 132 (or the second pattern 142). It is not necessary to form the width W2 of the entire area of the adhesive portion 130 (or the diffusion portion 140), and the width W1 of the surface light emitting laser element 201, specifically, the surface light emitting laser element 201. The width of the light emitting unit E may be equal to or larger than the width W3 of the adhesive unit 130 (or the diffusion unit 140).

(Third Embodiment)

9 is a plan view illustrating a surface emitting laser package according to a third embodiment, and FIG. 10 is a cross-sectional view taken along the line K-K 'of the surface emitting laser package of FIG. 11 is a sectional view showing a housing according to the third embodiment. 12 is a perspective view illustrating a diffusion unit according to a third embodiment, and FIG. 13 is a cross-sectional view illustrating a diffusion unit according to a third embodiment.

9 to 13, the surface emitting laser package 100B according to the third embodiment may provide a housing 110.

The housing 110 can support all the components disposed on the housing 110. For example, the housing 110 may support the surface emitting laser device 201 and the diffuser 140 disposed thereon. The housing 110, the surface emitting laser device 201, and the diffuser 140 may be modules modularized by a packaging process. One or more such modules may be mounted on a circuit board (not shown).

The housing 110 of the embodiment may include a material having excellent support strength, heat dissipation, insulation, and the like.

 The housing 110 may include a material having high thermal conductivity. The housing 110 may be made of a material having good heat dissipation characteristics so as to efficiently discharge heat generated from the surface emitting laser device 201 to the outside. The housing 110 may include an insulating material.

For example, the housing 110 may include a ceramic material. The housing 110 may include a low temperature co-fired ceramic (LTCC) or a high temperature co-fired ceramic (HTCC) that is co-fired.

In addition, the housing 110 may include a metal compound. The housing 110 may include a metal oxide having a thermal conductivity of 140 W / mK or more. For example, the housing 110 may include aluminum nitride (AlN) or alumina (Al 2 O 3).

As another example, the housing 110 may include a resin-based insulating material. The housing 110 may be provided of a silicone resin, an epoxy resin, a thermosetting resin including a plastic material, or a high heat resistant material.

The housing 110 may include a conductive material. When the housing 110 is made of a conductive material such as metal, an insulating member for electrical insulation is provided between the housing 110 and the surface emitting laser element 201 or between the housing 110 and the electrodes 181 to 186. Can be provided.

The outer edge of the housing 110 may have a square shape when viewed from above, but is not limited thereto. For example, the housing 110 may have a width of X1 and a height of X2.

The interior of the housing 110 may have a first cavity 111 and a second cavity 112 larger than the size of the first cavity 111. The first cavity 111 and the second cavity 112 may refer to a recessed shape therein.

The housing 110 of the embodiment may include a first body 110a, a second body 110b, and a third body 110c.

The first to third bodies 110a to 110c may be made of the same material and integrally formed. For example, the first to third bodies 110a to 110c may be formed by a batch process by molding.

The first to third bodies 110a to 110c may be formed of different materials and formed by separate processes. For example, the first to third bodies 110a to 110c are made of the same material and integrally formed, and the first body 110a is made of a different material from the second and third bodies 110b and 110c and is separate. It can be formed by the process. In this case, the lower surfaces of the second and third bodies 110b and 110c integrally formed with the upper surface of the first body 110a may be adhered to each other by an adhesive member (not shown). As an example, the adhesive member may include an organic material. For example, the adhesive member may include an epoxy resin. For example, the adhesive member may include a silicone resin.

The second body 110b may be disposed on the first body 110a, and the third body 110c may be disposed on the second body 110b.

An upper surface of the first body 110a may include a first area and a second area surrounding the first area. The second body 110b may have a first opening corresponding to the first area of the first body 110a. In this case, the second body 110b may be disposed on the second area of the first body 110a. The first cavity 111 may be defined by the first region of the first body 110a and the first opening of the second body 110b. The first area of the first body 110a exposed by the first cavity 111 may be the first bottom surface 121.

The second body 110b may have a first side surface 122 contacting the first opening or the first cavity 111. A step (hereinafter, referred to as a first step) corresponding to the thickness T22 of the second body 110b may be formed between the second body 110b and the first body 110a. A first step may be formed by the first side surface 122 positioned between the first bottom surface 121 of the first body 110a and the second bottom surface 123 of the second body 110b. The second bottom surface 123 of the second body 110b may be an upper surface of the second body 110b.

The upper surface of the second body 110b may include a first area that contacts the first opening and a second area that surrounds the first opening and the first area.

The third body 110c may have a second opening having a diameter larger than the diameter of the first opening of the second body 110b. The third body 110c may be disposed on the second area of the second body 110b.

The second cavity 112 may be defined by the first region of the second body 110b and the second opening of the third body 110c. The first area of the second body 110b exposed by the second cavity 112 may be the second bottom surface 123.

The second bottom surface 123 of the second body 110b may be in contact with the first cavity 111 and disposed in the second cavity 112, but is not limited thereto. That is, the second bottom surface 123 of the second body 110b may be disposed along the circumference of the first cavity 111 adjacent to the first cavity 111.

The third body 110c may have a second side surface 124 in contact with the second cavity 112. A step (hereinafter referred to as a second step) corresponding to the thickness T33 of the third body 110c may be formed between the third body 110c and the second body 110b. A second step may be formed by the second side surface 124 positioned between the second bottom surface 123 of the second body 110b and the top surface of the third body 110c.

The second cavity 112 may communicate with the first cavity 111. The size of the second cavity 112 may be larger than the size of the first cavity 111.

When viewed from above, the first cavity 111 may have a rectangular shape, and the second cavity 112 may have a circular shape, but is not limited thereto. When viewed from above, the first opening of the second body 110b may have a rectangular shape, and the second opening of the third body 110c may have a circular shape. When viewed from above, the first bottom surface 121 of the first body 110a may have a quadrangular shape, and the second bottom surface 123 of the second body 110b may have a circular shape.

In summary, the first bottom surface 121 of the first body 110a, the first opening of the second body 110b, and the first cavity 111 may have the same rectangular shape. The second bottom surface 123 of the second body 110b, the second opening of the third body 110c, and the second cavity 112 may have the same circular shape.

For example, the central axis of the first bottom surface 121 of the first body 110a may coincide with the central axis of the housing 110, but is not limited thereto.

The thickness of the first body 110a may be referred to as T11, the thickness of the second body 110b may be referred to as T22, and the thickness of the third body 110c may be referred to as T33. In this case, between the first to third thicknesses T11 to T33 may be represented by Equation 1.

[Equation 1]

T11≥T22≥T33

For example, the thickness T33 of the third body 110c may be about 0.3 mm to about 0.6 mm. For example, the thickness T33 of the third body 110c may be 0.5 mm.

The thickness T33 of the third body 110c may be the same as the thickness of the diffusion unit 140. For example, the upper surface of the diffusion unit 140 may horizontally coincide with the upper surface of the housing 110, that is, the upper surface 125 of the third body 110c.

As described above, the first step may be determined by the thickness T22 of the second body 110b, and the second step may be determined by the thickness T33 of the third body 110c. Thus, the height of the second step may be less than or equal to the height of the first step.

Meanwhile, the mounting part 117 may be defined by the bottom surface 123 of the second body 110b and the second side surface 124 of the third body 110c. The seating part 117 may be an area where the diffusion part 140 to be described later is fixed. The diffusion part 140 may have a shape corresponding to the shape of the seating part 117 so that the diffusion part 140 is seated on the seating part 117. For example, when viewed from above, the outer edge of the diffusion unit 140 may have a circular shape. The fixing of the diffusion part 140 and the housing 110 will be described later in detail.

The housing 110 of the embodiment may provide first and second via holes (not shown) spaced apart from each other. In detail, the first body 110a of the housing 110 may include first and second via holes vertically penetrating through the housing 110. As will be described later, the first and second connection wires 185 and 186 may be disposed in the first and second via holes.

The surface emitting laser package 100B according to the third embodiment may include a first electrode part 181 and a second electrode part 182.

The first electrode part 181 and the second electrode part 182 may be disposed in the housing 110. The first electrode part 181 and the second electrode part 182 may be disposed on the first bottom surface 121 of the first body 110a. The first electrode part 181 and the second electrode part 182 may be spaced apart from each other.

Since the surface emitting laser device 201 is to be disposed in the first electrode part 181, the size of the first electrode part 181 may be larger than that of the second electrode part 182.

For example, the first electrode portion 181 is electrically connected to the first electrode of the surface emitting laser element 201, and the second electrode portion 182 is formed of the surface emitting laser element 201 through the wire 191. Can be electrically connected with the two electrodes.

When the wire 191 is connected between the surface emitting laser element 201 and the second electrode portion 182, the highest point of the wire 191 is first from the first bottom surface 121 of the first body 110a. It may be located lower than the second bottom surface 123 of the body (110b). When the wire 191 is positioned in this way, even when the diffusion part 140 is seated on the seating part 117, the wire 191 is not in contact with the bottom surface of the diffusion part 140, so that the diffusion part 140 and the wire ( A defect due to the contact of 191 can be prevented. Such defects may include, for example, disconnection of the wire 191 or heat generation of the wire 191 to be transmitted to the diffusion unit 140 to deform the diffusion unit 140.

The surface emitting laser package 100B according to the third embodiment may provide the surface emitting laser device 201.

The surface emitting laser device 201 may be disposed on one of the first electrode part 181 and the second electrode part 182. For example, the surface emitting laser device 201 may be disposed on the first electrode part 181. The surface emitting laser device 201 may be disposed on a portion of the first electrode part 181. The size of the first electrode unit 181 may be larger than that of the surface emitting laser device 201. For example, the surface emitting laser device 201 may have a quadrangle when viewed from above, but is not limited thereto. The vertical width and the horizontal width of the surface emitting laser device 201 may be the same but are not limited thereto.

The surface emitting laser device 201 uses a light emitting part (E in FIG. 9) and a wire 191 including a plurality of emitters (E1, E2 and E3 in FIG. 3) that emit a laser beam, respectively. The pad electrode 280 may be disposed on the pad 182 to be electrically connected to the unit 182.

The surface emitting laser package 100B according to the third embodiment may provide the first bonding portion 183 and the second bonding portion 184.

The first bonding part 183 and the second bonding part 184 may be disposed under the housing 110. For example, the first bonding portion and the second bonding portion may be disposed on the bottom surface of the first body 110a of the housing 110.

In the drawing, the first bonding portion and the second bonding portion may be disposed to protrude downward from the lower surface of the first body 110a of the housing 110.

As another example, first and second recesses spaced apart from each other are formed on the bottom surface of the first body 110a of the housing 110, and a first bonding part 183 is disposed in the first recess, and a second The second bonding portion 185 may be disposed in the recess. In this case, the lower surface of the first bonding portion disposed in the first recess and the lower surface of the second bonding portion disposed in the second recess may be formed of the housing 110. It may coincide horizontally with the lower surface of the first body (110a).

For example, each of the lower surface of the first bonding unit 183 and the lower surface of the second bonding unit 184 may be in surface contact with and electrically connected to a signal line (not shown) of a circuit board (not shown). In this case, the housing 110 may be referred to as a first substrate, and the circuit board may be referred to as a second substrate.

The first bonding part 183 and the second bonding part 184 may be spaced apart from each other under the housing 110. The first bonding portion 183 and the second bonding portion 184 may have a pad having a circular shape when viewed from below, but the embodiment is not limited thereto.

The first bonding part 183 may be electrically connected to the first electrode 181. The first bonding part 183 may be electrically connected to the first electrode 181 through the first connection line 185. For example, the first connection line 185 may be disposed in the first via hole provided in the housing 110. The first bonding part 183 and the first connection wiring 185 may be integrally formed using the same metal material.

The second bonding part 184 may be electrically connected to the second electrode 182. The second bonding unit 184 may be electrically connected to the second electrode 182 through the second connection line 186. For example, the second connection wiring 186 may be disposed in the second via hole provided in the housing 110. The second bonding portion 184 and the second connection wiring 186 may be integrally formed using the same metal material.

For example, the first connection wire 185 and the second connection wire 186 may include tungsten (W), but are not limited thereto. Tungsten (W) may be melted at a high temperature of 1000 ° C. or higher, injected into the first and second via holes, and cured to form a first connection line 185 and a second connection line 186. A portion of the tungsten (W) may be hardened under the housing 110 to be formed of the first and second bonding portions 183 and 184, but is not limited thereto.

According to the embodiment, the driving power can be provided to the surface emitting laser device 201 through a circuit board (not shown).

The surface emitting laser package 100B according to the third embodiment may provide the diffusion part 140.

The diffusion unit 140 may be disposed on the surface emitting laser device 201. For example, the diffusion part 140 may be disposed on the seating part 117 of the housing 110.

The diffusion part 140 may be firmly fastened to the seating part 117 of the housing 110 and may not be separated.

Various features can be presented to securely fasten the diffuser 140 to the seating portion 117 of the housing 110.

According to the third embodiment, the first pattern 107 is formed in the seating portion 117, and the second pattern corresponding to the shape of the first pattern 107 of the seating portion 117 in the diffusion portion 140 ( 143 may be formed. The first pattern 107 may be formed along the inner side surface of the seating portion 117, that is, the second side surface 124 of the third body 110c of the housing 110. The second pattern 143 may be formed along the outer surface of the diffusion unit 140. For example, each of the first pattern 107 and the second pattern 143 may be a plurality of threads formed in one direction. For example, the thread of the first pattern 107 may be formed along the clockwise direction from the upper side to the lower side of the second side surface 124 of the third body 110c. For example, the thread of the second pattern 143 may be formed along the clockwise direction from the upper side to the lower side of the outer surface of the diffusion unit 140. Thread may mean a region between troughs and valleys. Accordingly, the first pattern 107 and the second pattern 143 may have a shape in which valleys and mountains are alternately arranged.

The first pattern 107 may be integrally formed with the seating part 117 and the third body 110c of the housing 110, but is not limited thereto. The second pattern 143 may be formed integrally with the diffusion unit 140, but the embodiment is not limited thereto.

In the thread of the first pattern 107, an intaglio area and an embossed area may be alternately disposed along the vertical direction. In the thread of the second pattern 143, an intaglio area and an embossed area may be alternately disposed along the vertical direction. An intaglio area of the thread of the second pattern 143 may correspond to an embossed area of the thread of the first pattern 107. An embossed area of the thread of the second pattern 143 may correspond to an engraved area of the thread of the first pattern 107.

Accordingly, after the lower thread of the diffusion part 140 is fitted to the upper thread of the seating part 117, the diffusion part 140 is rotated clockwise or the seating part 117 is rotated in the counterclockwise direction. The lower thread of the portion 140 rotates in engagement with the upper thread of the seating portion 117 and the diffusion portion 140 gradually moves downward, so that the diffusion portion 140 is firmly attached to the seating portion 117. Can be fastened. As the screw thread of the diffusion part 140 and the screw thread of the mounting part 117 are engaged with each other, the diffusion part 140 is not detached, and the surface light emitting laser device 201 is exposed due to the detachment of the diffusion part 140. Eye damage due to the laser beam can be prevented.

Rotation of the diffusion part 140 may be stopped when the lower side of the diffusion part 140 contacts the bottom surface of the seating part 117, that is, the second bottom surface 123 of the second body 110b. Therefore, when the diffusion part 140 is completely fastened to the seating part 117, the lower surface of the diffusion part 140 may contact the second bottom surface 123 of the second body 110b.

The side surface of the seating portion 117, that is, the second side surface 124 of the third body 110c may have an inclined surface. For example, the inclined surface of the seating portion 117 may be inclined at an angle of about 100 ° to 120 ° with respect to the bottom surface of the housing 110, that is, the second bottom surface 123 of the second body 110b. The inclined surface of the seating portion 117 may be 20 ° to the second bottom surface 123 of the second body 110b, but is not limited thereto. The diameter D1 at the upper side of the seating portion 117 may be larger than the diameter D2 at the lower side of the seating portion 117.

As the seating portion 117 is inclined, the outer surface of the diffusion portion 140 may also be inclined to correspond to the inclined surface of the seating portion 117. The inclined surface of the diffuser 140 may be inclined at an angle of about 10 ° to 30 ° with respect to the top surface of the diffuser 140. The inclined surface of the diffuser 140 may be 20 ° with respect to the upper surface of the diffuser 140, but is not limited thereto. The diameter D1 at the upper side of the diffusion part 140 may be larger than the diameter D2 at the lower side of the diffusion part 140. The upper diameter of the seating portion 117 may be the same as the diameter (D1) of the upper side of the diffusion portion 140. The diameter of the lower side of the seating portion 117 may be equal to the diameter D2 of the lower side of the diffusion portion 140.

As another example, each of the side surface 124 of the seating portion 117 and the side surface of the diffusion portion 140 may have a vertical surface perpendicular to the bottom surface of the housing 110.

The diffusion part 140 may be moved into the second cavity 112 of the housing 110 to fasten the diffusion part 140 to the seating part 117. Since the diameter D2 of the lower side of the diffusion portion 140 is smaller than the diameter of the upper side of the seating portion 117, the outer side surface of the lower side of the diffusion portion 140 contacts the inner side surface 124 of the seating portion 117. It doesn't work. When the lower side of the diffusion portion 140 is moved to the middle region of the seating portion 117, the thread formed on the lower side of the diffusion portion 140 contacts the thread formed on the inner side surface 124 of the seating portion 117. Can be. At this time, the diffuser 140 is rotated in a clockwise direction or the seating portion 117 is rotated in a counterclockwise direction, so that the lower side of the diffuser 140 can be moved downward by riding the thread of the seating portion 117. have. As the lower side of the diffusion part 140 contacts the second bottom surface 123 of the second body 110b, for example, the diffusion part 140 may be fitted to the seating part 117.

According to the third embodiment, since the diffusion part 140 and the seating part 117 are fitted and fastened using a screw thread, and the diffusion part 140 is firmly fixed to the seating part 117, the diffusion part 140 is Deviation can be prevented to improve the reliability of the product.

According to the third embodiment, when the fastening part 140 is fastened to the seating part 117, the diffusion part 140 can be easily separated from the seating part 117 by being rotated in a direction opposite to the rotational direction. When a defect or the like of the diffusion unit 140 occurs, it is easy to replace the diffusion unit 140.

Meanwhile, the diffusion unit 140 may be disposed to be spaced apart from the surface light emitting laser device 201. The diffusion part 140 may be supported by the second bottom surface 123 of the second body 110b of the housing 110.

The diffusion unit 140 may extend the divergence angle of the laser beam emitted from the surface emitting laser device 201.

The diffusion unit 140 may include an anti-reflective layer. For example, the diffuser 140 may include an antireflective layer disposed on an upper surface of the diffuser 140. The antireflective layer may be formed separately from the diffusion part 140.

The antireflective layer may, for example, comprise an antireflective coating film. The antireflective coating film may be attached to the upper surface of the diffusion unit 140. The antireflective layer may be formed on the surface of the diffusion part 140 by spin coating or spray coating. For example, the antireflective layer may be formed of a single layer or multiple layers including at least one of a group containing TiO 2, SiO 2, Al 2 O 3, Ta 2 O 3, ZrO 2, MgF 2.

The diffusion unit 140 may include a body 141 and a plurality of third patterns 145 disposed under the body 141.

For example, the third pattern 145 may be formed of a material different from that of the body 141. For example, the body 141 may include a resin material, and the third pattern 145 may include a glass material.

As another example, the third pattern 145 may be integrally formed with the body 141.

The third pattern 145 may include protrusions protruding downward, that is, toward the surface of the surface emitting laser device 201. Adjacent third patterns 145 may be in contact with or spaced apart from each other. Each of the third patterns 145 may have a random shape.

(Example 4)

14 is a cross-sectional view showing a surface emitting laser package according to the fourth embodiment.

The fourth embodiment is the third embodiment except for the adhesive member 150 disposed between the first pattern 107 of the seating portion 117 of the housing 110 and the second pattern 143 of the diffusion portion 140. Same as the example. In the fourth embodiment, components having the same functions, shapes, and / or structures as those of the third embodiment are denoted by the same reference numerals and detailed description thereof will be omitted. The disclosure omitted in the following description can be easily understood from the third embodiment (Figs. 1 to 13). Components not shown in the drawings are the same as those shown in the drawings shown in FIGS. 1 to 13.

Referring to FIG. 14, the surface emitting laser package 100C according to the fourth embodiment may include a housing 110, first and second electrode portions 181 and 182, a surface emitting laser element 201, and a diffusion portion 140. ) May be included.

A mounting portion 117 on which the diffusion portion 140 may be mounted may be formed on the upper side of the housing 110, that is, the third body 110c.

The first and second electrode portions 181 and 182 may be disposed on the bottom surface of the housing 110, that is, on the first bottom surface 121 of the first body 110a. The surface emitting laser device 201 may be disposed on one of the first and second electrode portions 181 and 182.

The mounting part 117 of the housing 110 may be formed at a position having the first terminal from the first bottom surface 121 of the first body 110a. The seating part 117 of the housing 110 may have a step height of a predetermined height from the first bottom surface 121 of the first body 110a. The seating part 117 of the housing 110 may include a second bottom surface 123 and a third body (123) of the second body 110b positioned at a predetermined height from the first bottom surface 121 of the first body 110a. Second side 124 of 110c). The second body 110b has a first opening and is disposed on the first body 110a, and the third body 110c has a second opening having a diameter larger than the diameter of the first opening and the second body 110b. It can be placed on.

Accordingly, the first cavity 111 is formed by the first bottom surface 121 of the first body 110a and the first opening of the second body 110b, and the second cavity 112 is formed by the second body ( The second bottom surface 123 of 110b and the second opening of the third body 110c may be formed. In this case, the first electrode part 181, the second electrode part 182, and the surface light emitting laser element 201 may be disposed in the first cavity 111 of the housing 110.

According to the fourth embodiment, the diameter of the diffusion part 140 may be smaller than the diameter of the seating part 117 of the housing 110. For example, the difference between the diameter of the seating portion 117 of the housing 110 and the diameter of the diffusion 140 may be approximately 50 nm to approximately 300 nm. In this case, the diameter of the seating portion 117 of the housing 110 and the diffusion portion between the first pattern 107 of the seating portion 117 of the housing 110 and the second pattern 143 of the diffusion portion 140. There may be as much gap as the difference between the diameters of 140.

Even if such a gap exists, when the diffusion portion 140 is positioned in the seating portion 117 of the housing 110, the first pattern 107 of the diffusion portion 140 and the seating portion 117 of the housing 110 are present. The second pattern 143 may be fitted to each other.

According to the fourth embodiment, the adhesive member 150 may be disposed between the first pattern 107 of the seating portion 117 of the housing 110 and the second pattern 143 of the diffusion portion 140. As the adhesive member 150, a material having excellent adhesion, moisture resistance, insulation, and support strength may be used. For example, the adhesive member 150 may include an organic material. The adhesive member 150 may include an epoxy resin. In addition, the adhesive member 150 may include a silicone resin.

For example, first, an adhesive paste may be coated on the first pattern 107 of the seating portion 117 of the housing 110. Subsequently, the diffuser 140 and / or the housing 110 are rotated such that the second pattern 143 of the diffuser 140 engages with the first pattern 107 of the seating portion 117 of the housing 110. do. The diffuser 140 and / or until the lower side of the diffuser 140 contacts the bottom surface of the seating portion 117 of the housing 110, that is, the second bottom surface 123 of the second body 110b. The housing 110 may be rotated. Subsequently, the adhesive paste is cured to form the adhesive member 150. The adhesive member 150 is formed by the first pattern 107 of the seating part 117 of the housing 110 and the second pattern of the diffusion part 140 ( 143).

According to the fourth embodiment, the first of the seating portion 117 of the housing 110 by the adhesive member 150 disposed between the first pattern 107 and the second pattern 143 of the diffusion portion 140. The pattern 107 and the second pattern 143 of the diffusion unit 140 are tighter and tighter, so that the detachment of the diffusion unit 140 may be blocked.

On the other hand, when the diameter of the diffusion portion 140 is the same as the diameter of the seating portion 117 of the housing 110, the second pattern 143 of the diffusion portion 140 of the seating portion 117 of the housing 110 The contact of the first pattern 107 is too strong, the rotation of the diffusion portion 140 or the seating portion 117 of the housing 110 may be difficult to fit.

According to the fourth embodiment, the diameter of the diffusion portion 140 is smaller than the diameter of the seating portion 117 of the housing 110, so that the outer surface of the diffusion portion 140 and the seating portion 117 of the housing 110 are provided. By forming a gap between the inner surface 124 of the adhesive member 150 is disposed in this gap, the diffusion portion 140 is more easily fitted to the seating portion 117 of the housing 110. In addition, not only the fastening between the first pattern 107 of the seating part 117 of the housing 110 and the second pattern 143 of the diffusion part 140 but also the diffusion part 140 by the adhesive member 150 and Desorption of the diffusion unit 140 is blocked by adhesion of the mounting unit 117 of the housing 110, thereby improving reliability of the product.

Meanwhile, as another embodiment, the fourth embodiment and the fifth embodiment may be combined. That is, the first adhesive member 150 is disposed between the second side surface 124 of the seating portion 117 of the housing 110 and the side surface of the diffusion portion 140, and the seating portion 117 of the housing 110. The second adhesive member 155 may be disposed between the bottom surface and the bottom surface of the diffusion part 140. As described above, since the first and second adhesive members 155 adhere not only the bottom surface of the diffusion portion 140 but also the side surface of the diffusion portion 140 to the seating portion 117, the diffusion portion 140 is not detachable. Can be done.

As another embodiment, the fourth embodiment and the fifth embodiment are combined, but in the fourth embodiment, the first pattern 107 of the seating part 117 and the second pattern 143 of the diffusion part 140 are omitted. Can be. As such, even without the first pattern 107 of the seating part 117 and the second pattern 143 of the diffusion part 140, the diffusion part is formed by the first adhesive member 150 and the second adhesive member 155. Since not only the bottom surface of the 140 but also the side surface of the diffusion portion 140 is bonded to the seating portion 117, detachment of the diffusion portion 140 can be prevented.

(Example 5)

15 is a cross-sectional view of a surface emitting laser package according to a fifth embodiment.

The fifth embodiment is the same as the first and fourth embodiments except for the adhesive member 155 disposed between the bottom surface of the seating portion 117 of the housing 110 and the bottom surface of the diffusion portion 140. In the fifth embodiment, components having the same functions, shapes, and / or structures as those in the first and fourth embodiments will be denoted by the same reference numerals and detailed description thereof will be omitted. The disclosure omitted in the following description can be easily understood from the first and fourth embodiments (Figs. 1 to 14). Components not shown in the drawings are the same as those in the drawings shown in FIGS. 1 to 14.

Referring to FIG. 15, the surface emitting laser package 100D according to the fifth embodiment may include a housing 110, first and second electrode portions 181 and 182, a surface emitting laser element 201, and a diffusion portion 140. ) May be included.

A mounting portion 117 on which the diffusion portion 140 may be mounted may be formed on the upper side of the housing 110, that is, the third body 110c.

For example, the first pattern 107 of the seating part 117 of the housing 110 and the second pattern 143 of the diffusion part 140 may be engaged with each other to be fitted.

According to the fifth embodiment, the adhesive member 155 between the bottom surface of the diffusion portion 140 and the bottom surface of the seating portion 117 of the housing 110, that is, the second bottom surface 123 of the second body 110b. ) May be arranged. As the adhesive member 155, a material having excellent adhesion, moisture resistance, insulation, and support strength may be used. For example, the adhesive member 155 may include an organic material. The adhesive member 155 may include an epoxy resin. In addition, the adhesive member 155 may include a silicone resin.

The adhesive member 155 may or may not be the same as the material of the adhesive member 150 of the fourth embodiment.

The adhesive member 155 may be in contact with the third pattern 145 provided below the diffusion part 140. Due to the convex shape of the third pattern 145 of the diffusion part 140, since the adhesive member 155 contacts the wider area of the diffusion part 140, the diffusion part 140 is formed by the adhesive member 155. It may be fixed to the seating portion 117 of the housing 110 more firmly.

In another embodiment, when the third pattern 145 is not provided at the lower edge of the diffusion unit 140, the adhesive member 155 may contact the bottom surface of the body 141 of the housing 110.

In another embodiment, although not shown, the adhesive member 155 may be disposed to be narrower than the width of the second bottom surface 123 of the second body 110b so as not to contact the first side 122 of the second body 110b. It may not be, and may not affect the divergence angle of the laser beam emitted from the surface emitting laser device 201.

(Example 6)

16 is a cross-sectional view illustrating a surface emitting laser package according to a sixth embodiment.

The sixth embodiment is the same as the first to fifth embodiments except that the upper surface of the diffusion portion 140 is positioned lower than the upper surface 125 of the housing 110. In the sixth embodiment, components having the same functions, shapes, and / or structures as those in the first to fifth embodiments will be denoted by the same reference numerals and detailed description thereof will be omitted. The disclosure omitted in the following description can be easily understood from the first to fifth embodiments (Figs. 1 to 15). Components not shown in the drawings are the same as those shown in the drawings shown in FIGS. 1 to 15.

Referring to FIG. 16, the surface emitting laser package 100E according to the sixth embodiment may include a housing 110, first and second electrode portions 181 and 182, a surface emitting laser element 201, and a diffusion portion 140. ) May be included.

The housing 110 may include a first body 110a, a second body 110b, and a third body 110c. The first cavity 111 may be formed by the first bottom surface 121 of the first body 110a and the first opening of the second body 110b. The second cavity 112 may be formed by the second bottom surface 123 of the second body 110b and the second opening of the third body 110c. The diameter of the second opening may be larger than the diameter of the first opening. The area of the second bottom surface 123 of the second body 110b may vary according to the difference between the diameter of the second opening and the diameter of the first opening.

A mounting portion 117 on which the diffusion portion 140 may be mounted may be formed on the upper side of the housing 110, that is, the third body 110c.

The seating portion 117 of the housing 110 may be located above the housing 110. The seating portion 117 of the housing 110 may surround the second cavity 112. The seating portion 117 of the housing 110 may have a second bottom surface 123 of the second body 110b and a second side surface 124 of the third body 110c. The first pattern 107 may be formed on the inner side surface 124 of the seating portion 117. For example, the first pattern 107 of the seating part 117 of the housing 110 and the second pattern 143 of the diffusion part 140 may be engaged with each other to be fitted.

The thickness of the seating part 117 may be the same as the thickness T33 of the third body 110c. In this case, the thickness Td of the diffusion part 140 may be smaller than the thickness T33 of the seating part 117. Therefore, when the bottom surface of the diffusion portion 140 is positioned to contact the bottom surface of the seating portion 117, that is, the second bottom surface 123 of the second body 110b, the top surface of the diffusion portion 140 is disposed in the housing. The upper surface of the 110 may be located lower than the upper surface 125 of the third body 110c.

For example, the depth d at which the upper surface of the diffusion 140 is lower than the upper surface 125 of the housing 110 may be 3% to 10% of the thickness Td of the diffusion 140. For example, the depth d at which the upper surface of the diffusion portion 140 is positioned lower than the upper surface 125 of the housing 110 is about 3% to about the thickness T33 of the third body 110c of the housing 110. May be 10%. For example, when the thickness Td of the diffusion part 140 is 500 μm, the depth d may be 15 μm to 50 μm.

According to the sixth embodiment, since the upper surface of the diffusion unit 140 is positioned lower than the upper surface 125 of the housing 110, the upper surface of the diffusion unit 140 is protected by the upper surface 125 of the housing 110. Defects such as scratches that may occur on the upper surface 125 of the housing 110 may be blocked.

In addition, although not shown, an adhesive member may be disposed between the outer portion of the upper surface of the diffusion portion 140 and the seating portion 115 exposed by the depth d, and the detachment of the diffusion portion 140 may be performed by the adhesive member. It can be impossible.

(Flip Chip Type Surface Emitting Laser Device)

17 is another cross-sectional view of the surface emitting laser device according to the embodiment.

The surface emitting laser device according to the first to sixth embodiments may be applied to the flip chip type surface emitting laser device shown in FIG. 17.

In addition to the vertical type, the surface emitting laser device according to the first to sixth embodiments may be a flip chip type in which the first electrode 215 and the second electrode 282 face the same direction as shown in FIG. 17.

For example, the flip chip type surface emitting laser device illustrated in FIG. 17 may include a first electrode part 215 and 217, a substrate 210, a first reflective layer 220, an active region 230, and an aperture region 240. The second reflective layer 250, the second electrode parts 280 and 282, the first passivation layer 271, the second passivation layer 272, and the anti-reflection layer 290 may be included. In this case, the reflectance of the second reflecting layer 250 may be designed to be higher than that of the first reflecting layer 220.

In this case, the first electrode parts 215 and 217 may include a first electrode 215 and a first pad electrode 217, and the first electrode on the first reflective layer 220 exposed through a predetermined mesa process. The 215 may be electrically connected, and the first pad electrode 217 may be electrically connected to the first electrode 215.

The first electrode portions 215 and 217 may be made of a conductive material, for example, metal. For example, the first electrode 215 may include a single layer or a multilayer structure including at least one of aluminum (Al), titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), and gold (Au). It can be formed as. The first electrode 215 and the first pad electrode 217 may include the same metal or different metals.

When the first reflective layer 220 is an n-type reflective layer, the first electrode 215 may be an electrode for the n-type reflective layer.

The second electrode parts 280 and 282 may include a second electrode 282 and a second pad electrode 280, and the second electrode 282 is electrically connected to the second reflective layer 250. The second pad electrode 280 may be electrically connected to the second electrode 282.

When the second reflective layer 250 is a p-type reflective layer, the second electrode 282 may be a p-type electrode.

The second electrode (see FIG. 12) according to the above-described embodiment may be equally applied to the second electrode 282 of the flip chip type surface emitting laser device.

The first insulating layer 271 and the second insulating layer 272 may be made of an insulating material, for example, may be formed of nitride or oxide, for example, polyimide, silica (SiO ₂ ), Or silicon nitride (Si ₃ N ₄ ).

The embodiment has a technical effect of providing a surface emitting laser device having a highly reliable electrode structure.

In addition, the embodiment has a technical effect that can provide a surface emitting laser device that can solve the optical problem that the beam pattern of the exit beam is split or the divergence angle of the beam is increased.

In addition, the embodiment has a technical effect that can provide a surface emitting laser device that can improve the ohmic characteristics.

(Mobile terminal)

18 is a perspective view of a mobile terminal to which a surface emitting laser device is applied according to an embodiment.

The vertical surface emitting laser device and the flip surface emitting laser device shown in FIG. 17 according to the first to sixth embodiments may be applied to the mobile terminal shown in FIG.

As shown in FIG. 18, the mobile terminal 1500 of the embodiment may include a camera module 1520, a flash module 1530, and an auto focusing device 1510 provided at a rear surface thereof. Here, the auto focusing device 1510 may include one of the packages of the surface emitting laser device according to the first to sixth embodiments described above as the light emitting layer.

The flash module 1530 may include a light emitting device that emits light therein. The flash module 1530 may be operated by camera operation of a mobile terminal or control of a user.

The camera module 1520 may include an image capturing function and an auto focus function. For example, the camera module 1520 may include an auto focus function using an image.

The auto focus device 1510 may include an auto focus function using a laser. The auto focus device 1510 may be mainly used in a condition in which the auto focus function using the image of the camera module 1520 is degraded, for example, in a proximity or dark environment of 10 m or less. The auto focus device 1510 may include a light emitting layer including the surface emitting laser device of the above-described embodiment, and a light receiving unit for converting light energy such as a photodiode into electrical energy.

The foregoing detailed description should not be construed as limiting in all respects, but should be considered as illustrative. The scope of the embodiments should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the embodiments are included in the scope of the embodiments.

The foregoing detailed description should not be construed as limiting in all respects, but should be considered as illustrative. The scope of the embodiments should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the embodiments are included in the scope of the embodiments.

100: surface emitting laser package
107, 143, 145: pattern
110: housing
110a, 110b, 110c, 141: body
111, 112: cavity
113, 121, 123: Bottom
115, 122, 124: side
117: seating area
125: top
130: adhesive
132, 142: pattern
140: diffusion part
141: body
145: pattern
150, 155: adhesive member
181, 182: electrode portion
183, 184: bonding part
185, 186: connection wiring
191: wire
201: surface emitting laser device
210: substrate
215: first electrode
217 and 280: pad electrode
220: first reflective layer
230: light emitting layer
240: oxide layer
241: opening
242: insulation area
250: second reflective layer
270: passivation layer
282: second electrode
350: stamp
352: embossed pattern
E: light emitting part
E1, E2, E3: Emitter
M: mesa area
P: Pad part

Claims (10)

A housing including a seating portion having a first pattern;
A surface emitting laser device disposed in the housing; And
A diffusion part disposed on the seating part of the housing and having a second pattern having a shape corresponding to the shape of the first pattern;
Surface emitting laser package comprising a. The method of claim 1,
The housing is
Has a first bottom surface,
The surface emitting laser device is disposed on the first bottom surface,
The seating portion,
And a second bottom surface and a side surface having a step from the first bottom surface. The method of claim 2,
The first pattern is disposed along the side surface of the seating portion,
The second pattern is a surface light emitting laser package disposed along the side of the diffusion. The method of claim 2,
The side surface of the seating portion has a first inclined surface,
The side of the diffusion portion has a second inclined surface corresponding to the first inclined surface of the seating portion,
And the inclined surface has an angle of 100 ° to 120 ° with respect to the second bottom surface. The method of claim 4, wherein
A surface light emitting laser package having a diameter of an upper surface of the diffusion portion larger than a diameter of a lower surface of the diffusion portion. The method of claim 2,
And the first pattern and the second pattern comprise threads. The method of claim 2,
The first bottom surface has a square shape,
And the second bottom surface has a circular shape. The method of claim 2,
A first adhesive member disposed between the first pattern of the seating portion and the second pattern of the diffusion portion;
Surface light emitting laser package further comprising. The method of claim 8,
A second adhesive member disposed between the second bottom surface of the seating portion and a bottom surface of the diffusion portion;
Surface light emitting laser package further comprising. The method of claim 1,
The upper surface of the diffusion portion is lower surface than the upper surface of the housing laser package.

Images