KR20200022875A - Led package, floodlight plate body and led package manufacturing method - Google Patents

Abstract

The present invention relates to a light emitting element package in which a quantum dot (QD) fluorescent body is accommodated, a floodlight plate body and a light emitting element package manufacturing method. According to an embodiment of the present invention, the light emitting element package comprises: a light emitting element; a floodlight plate body in which a lower floodlight plate, a side surface floodlight plate, an upper floodlight plate, and an internal empty portion are formed; a QD fluorescent body layer formed in the empty portion and covering an upper surface of the lower floodlight plate; and a reflection body surrounding a lower surface and a side surface of the light emitting element and the floodlight plate body.

Description

Manufacturing method of light emitting device package, floodlight body and light emitting device package {LED PACKAGE, FLOODLIGHT PLATE BODY AND LED PACKAGE MANUFACTURING METHOD}

The present invention relates to a light emitting device package, a light transmitting plate body and a method of manufacturing a light emitting device package, and more particularly, to a light emitting device package, a light transmitting plate body and a light emitting device package manufacturing method for receiving a QD (Quantum Dot) phosphor. .

LIGHT EMITTING DEVICE (LED) is a kind of semiconductor device that converts electrical energy into light energy. The light emitting device has advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps.

Accordingly, many researches are being conducted to replace existing light sources with light emitting devices, and the use of light emitting devices as light sources for lighting devices such as various lamps, liquid crystal displays, electronic signs, and street lamps, which are used indoors and outdoors, is increasing. .

Meanwhile, in the LED field, the demand for white LEDs is high. The white LED may be implemented by combining LED chips of various colors, and combining LED chips emitting light of a specific color with phosphors that convert wavelengths of light emitted from the chips. Currently, the latter method is mainly used to realize a white LED, and most typically, a white LED is implemented by coating YAG: Ce bulk phosphor on a blue LED chip.

However, the light emitting device package to which the bulk phosphor is applied has a problem that it is difficult to realize high color reproducibility when manufacturing a display. In order to solve this problem, various attempts have recently been made to implement a light emitting device package using a QD (Quantum Dot) phosphor.

QD refers to nanoparticles of a few tens of nanometers (nm) in size with semiconductor characteristics, and is a key material that is attracting much attention because they exhibit different characteristics from bulk-sized particles due to quantum confinement effects.

Such QD phosphors are very vulnerable to external environmental conditions (moisture, oxygen, heat, etc.), and thus have a problem in that performance degradation occurs easily. In particular, the rail-type QD phosphor has a difficulty in processing according to the rail shape and has a problem of being vulnerable to heat. In addition, the QD phosphor of the film type has a high cost problem due to the large area used.

Accordingly, a structure has been proposed to protect the QD phosphor, which is vulnerable to external environmental conditions, by injecting the QD phosphor into the empty space between the glasses to form the QD phosphor layer, and welding the glass to each other to seal the QD phosphor layer. .

However, in the light emitting device package manufactured with the above structure, the light emitting device is adhered to the lower portion of the flat glass. Therefore, the light is emitted from the top of the light emitting element, and mainly passes through the QD phosphor layer, and the light output from the side of the light emitting element is relatively reflected on the inner surface of the reflector. However, since the incident angle is small when the light output from the side of the light emitting device is incident on the reflector, the reflected light is not sufficiently reflected through the QD phosphor layer to the top of the light emitting device package, resulting in a decrease in the overall amount of light. There is this.

In addition, when the LED light emitting device is adhered to the lower portion of the glass of the flat form, due to the nature of the glass slippery surface there is a problem that the tilting phenomenon occurs in the light emitting device flows on the lower surface of the glass, there is a problem that the performance of the light emitting device package.

The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a light emitting device package, a light transmitting plate body, and a light emitting device package manufacturing method in which a space for stably accommodating and fixing the light emitting device is provided.

Another object of the present invention is to provide a light emitting device package, a transparent plate body, and a light emitting device package manufacturing method capable of sufficiently reflecting light emitted from the light emitting device to an upper portion of the light emitting device package to output an increased amount of light. .

Light emitting device package according to an embodiment of the present invention for solving the above problems is a light emitting device; A lower transmissive plate formed in a central region of a lower surface of the insertion groove into which a portion of the light emitting element is inserted, a plurality of side transmissive plates formed on an upper surface of the lower transmissive plate, and corresponding to an upper surface of the lower transmissive plate; An upper transmissive plate formed on an upper surface of the translucent plate and a transmissive plate body having an hollow port formed therein; A QD phosphor layer formed in the hollow region and covering an upper surface of the lower floodlight plate; And a reflector surrounding lower surfaces and side surfaces of the light emitting device and the light transmitting plate body, wherein an area of the QD phosphor layer formed on an upper surface of the lower light transmitting plate may be larger than an area of the insertion groove.

The reflector may surround a side surface of the light emitting device formed by protruding from the insertion groove.

The upper floodlight plate may be bonded to an upper portion of the plurality of side floodlight plates by laser irradiation.

The hollow region may be in a vacuum state.

The bottom of the light emitting device includes at least one electrode, and the electrode may protrude further downward than the bottom of the reflector.

An adhesive layer may be formed between the insertion groove and the light emitting device.

In addition, the light emitting device package according to another embodiment of the present invention for solving the above problems; A lower transmissive plate formed in a central region of a lower surface of the insertion groove into which a portion of the light emitting element is inserted, a plurality of side transmissive plates formed on an upper surface of the lower transmissive plate, and corresponding to an upper surface of the lower transmissive plate; An upper transmissive plate formed on an upper surface of the translucent plate and a transmissive plate body having an hollow port formed therein; A QD phosphor layer formed in the hollow region and covering an upper surface of the lower floodlight plate; And a reflector surrounding the lower surface and the side surfaces of the light emitting element and the light transmitting plate body, wherein a curvature having a curvature may be formed at an edge of the lower surface of the lower light transmitting plate.

The curvature may be formed to protrude toward the hollow region.

The reflector may surround a side surface of the light emitting device formed by protruding from the insertion groove.

The upper floodlight plate may be bonded to an upper portion of the plurality of side floodlight plates by laser irradiation.

The hollow region may be in a vacuum state.

The bottom of the light emitting device includes at least one electrode, and the electrode may protrude further downward than the bottom of the reflector.

An adhesive layer may be formed between the insertion groove and the light emitting device.

In addition, a light transmitting plate body according to another embodiment of the present invention for solving the above problems is a lower light transmitting plate formed in the center area of the lower surface of the insertion groove is inserted into the light emitting element; A plurality of side floodlight plates formed on an upper surface of the lower floodlight plate; An upper floodlight plate corresponding to an upper surface of the lower floodlight plate and formed on upper surfaces of the plurality of side floodlight plates; And a hollow region on an upper surface of the lower light-transmitting plate, wherein an area of the hollow region may be larger than that of the insertion groove.

A curvature having a curvature may be formed at an edge of a lower surface of the lower floodlight plate.

The curvature may be formed to protrude toward the hollow region.

The upper floodlight plate may be welded to an upper portion of the plurality of side floodlight plates.

In addition, the light emitting device package manufacturing method according to another embodiment of the present invention for solving the above problems is a plurality of light-transmitting a plurality of hollow region (Empty Portion) and a plurality of insertion grooves formed in the lower portion of the plurality of hollow region Etching the plate body; Injecting a QD phosphor into each of the plurality of hollow regions; A translucent plate welding step of forming one upper translucent plate on the plurality of hollow regions; Separating the plurality of floodlight plate bodies separately; Accommodating a light emitting element in each of the insertion grooves of the plurality of light transmitting plate bodies separately separated; And forming a reflector on a periphery of the light transmitting plate body in which the light emitting element is accommodated to form a light emitting device package, wherein the etching of the plurality of light transmitting plate bodies comprises etching a plurality of upper parts of the lower light transmitting plate. Forming a side transmissive plate and etching the plurality of hollow regions; and etching a lower portion of the lower transmissive plate to form a plurality of insertion grooves for accommodating the light emitting elements. In the etching step, an area of the hollow region may be larger than that of the insertion groove.

Etching the plurality of translucent plate bodies may include forming a curvature having a curvature by protruding an edge of a lower surface of the lower translucent plate and having a curvature and protruding toward the hollow region; It may further include.

In the forming of the insertion groove, the insertion groove may be formed to have a thickness thinner than the thickness of the light emitting device such that the insertion groove accommodates a part of the light emitting device and a part thereof protrudes.

The present invention has the effect of improving the light emitting performance of the light emitting device package by reducing the fluidity of the light emitting device by further strengthening the adhesion and fixing state of the light emitting device to the transparent plate body.

In addition, the present invention can increase the amount of light emitted by the light emitting device package by effectively reflecting the light output from the side of the light emitting device to pass through the QD phosphor layer.

However, effects according to an embodiment of the present invention are not limited to those mentioned above, and other effects not mentioned are clearly understood by those skilled in the art from the following description. Could be.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings included as part of the detailed description to provide a better understanding of the present invention provide embodiments of the present invention, and together with the detailed description, describe the technical idea of the present invention.
1 is a view for explaining a light transmitting plate body according to an embodiment of the present invention.
2 is a view for explaining a light transmitting plate body according to another embodiment of the present invention.
3 is a view illustrating a light emitting device package including a light transmitting plate body according to the embodiment of FIG. 2.
4 is a view for explaining a method of etching a transparent plate body according to another embodiment of the present invention.
5 is a view for explaining a method of etching a transparent plate body according to another embodiment of the present invention.
6 is a view for explaining a method of manufacturing a light emitting device package according to another embodiment of the present invention.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be described in detail with reference to the accompanying drawings.

The following examples are provided to assist in a comprehensive understanding of the methods, devices, and / or systems described herein. However, this is only an example and the present invention is not limited thereto.

In describing the embodiments of the present invention, when it is determined that the detailed description of the known technology related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, terms to be described below are terms defined in consideration of functions in the present invention, and may be changed according to intention or custom of a user or an operator. Therefore, the definition should be made based on the contents throughout the specification. The terminology used in the description is for the purpose of describing particular embodiments only and should not be limiting. Unless expressly used otherwise, the singular forms “a,” “an,” and “the” include plural forms of meaning. In this description, expressions such as "comprises" or "equipment" are intended to indicate certain features, numbers, steps, actions, elements, portions or combinations thereof, and one or more than those described. It should not be construed to exclude the presence or possibility of other features, numbers, steps, actions, elements, portions or combinations thereof.

In addition, terms such as first and second may be used to describe various components, but the components are not limited by the terms, and the terms are used to distinguish one component from another component. Only used as

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view for explaining a light transmitting plate body according to an embodiment of the present invention.

Referring to FIG. 1, a light transmitting plate body 10 according to an embodiment of the present invention may include a side light transmitting plate 11, a lower light transmitting plate 12, and an upper light transmitting plate 13.

The light transmitting plate body 10 according to the embodiment of the present invention is formed on the upper surface of the lower light transmitting plate 12, the lower light transmitting plate 12 is formed in the center region of the lower surface of the insertion groove into which a portion of the light emitting element is inserted A plurality of side light-transmitting plate 11, an upper light-transmitting plate 13 corresponding to an upper surface of the lower light-transmitting plate 12 and formed on an upper surface of the plurality of side light-transmitting plate 11, and an hollow port (14) inside. ) May be formed.

The transparent plate body 10 may accommodate a QD phosphor layer for converting a wavelength of light emitted from the light emitting device through the hollow region 14 formed therein. The upper transmissive plate 13 is welded to face the upper surface of the side transmissive plate 11 on the hollow region 14 in which the QD phosphor layer is accommodated, thereby sealing the QD phosphor layer to be blocked from the outside.

In another embodiment, the hollow region 14 may remain in a vacuum.

The QD phosphor layer is a color light conversion material including quantum dots (or quantum dots), and is formed by mixing or dispersing quantum dots in a matrix material such as an acrylate or an epoxy polymer or a combination thereof. Can be.

QD phosphors are semiconductor nanoparticles with a diameter of several nanometers (nm) and have quantum mechanics characteristics such as quantum confinement effect or quantum confinement effect. Here, the quantum confinement effect refers to a phenomenon in which the band gap energy increases (conversely, the wavelength decreases) as the size of the semiconductor nanoparticles decreases. QD phosphors made by chemical synthesis processes can achieve the desired color simply by changing the particle size without changing the material. For example, according to the quantum confinement effect, the smaller the nanoparticle size may emit blue light having a shorter wavelength, and the larger the nanoparticle size may emit red light having a longer wavelength. In this embodiment, the nanoparticles may have a size of about 100 nm or less, about 50 nm or less, about 20 nm or less, about 15 nm or less, or may range in size from about 2 to 10 nm.

The QD phosphor may be a group II-VI, III-V or IV material, specifically, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, InP, GaP, GaInP2, PbS, ZnO, TiO2, AgI, AgBr, It may be Hg12, PbSe, In2S3, In2Se3, Cd3P2, Cd3As2 or GaAs. In addition, the quantum dot may have a core-shell structure. Here, the core includes any one material selected from the group consisting of CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe and HgS, and the shell includes CdSe, CdTe, CdS, ZnSe, ZnTe, It may include any one material selected from the group consisting of ZnS, HgTe and HgS.

The transparent plate body 10 for accommodating the QD phosphor layer may be formed of a transparent material having good light transmittance. In addition, the light transmitting plate body 10 may be formed of a good weldability or bonding material. In a preferred embodiment, each of the light transmitting plates 11, 12, 13 of the light transmitting plate body 10 may be formed of a glass material.

The transparent plate body 10 may include a hollow region 14 for accommodating the QD phosphor layer and an insertion groove 15 for accommodating the light emitting device. Here, the hollow region 14 is formed on the side translucent plate 11 formed to surround at least a portion of the upper surface of the lower translucent plate 12 and a portion of the upper surface of the lower translucent plate 12 to accommodate the QD phosphor layer. Can be formed.

That is, the hollow region 14 and the side light transmitting plate 12 may be formed on the upper surface (or top) of the lower light transmitting plate 12. To this end, it may be formed to have a predetermined step between the hollow region 14 of the lower transparent plate 12 and the side transparent plate 11.

The top and bottom surfaces of the lower floodlight plate 12 may be formed in a predetermined shape (eg, rectangular, square, circular, oval, etc.). Upper and lower surfaces of the lower light-transmitting plate 12 may be formed to have the same shape and / or size, or may be formed to have different shapes and / or sizes.

The overall shape of the hollow region 14 may be formed in the same or similar shape as the outer shape of the lower light transmitting plate 12, but is not necessarily limited thereto. The hollow region 14 may be formed in a predetermined shape (eg, rectangular, square, round, oval, etc.).

The side floodlight plate 11 may be formed to surround the hollow region 14 along the top edge of the floodlight plate body 10 at the top of the lower floodlight plate 12. For example, the side floodlight plate 11 may be formed in a rectangular annular shape.

An insertion groove 15 may be formed on the lower surface of the light transmitting plate body 10 (or the lower surface of the lower light transmitting plate 12). The insertion groove 15 is an area for accommodating the light emitting device under the hollow region 14, and the partition wall 16 may be provided adjacent to the insertion groove 15. The lower surface of the lower floodlight plate 12 may be formed to have a predetermined step between the insertion groove 15 and the partition wall 16.

 The overall shape of the insertion groove 15 may be formed in the same or similar shape as the external shape of the transparent plate body 10, but is not necessarily limited thereto. Insertion groove 15 may be formed in a predetermined shape (eg, rectangular, square, circular, elliptical, etc.).

The partition wall 16 may be formed to surround the insertion groove 15 along the far edge of the lower floodlight plate 12. For example, the partition wall 16 may be formed in a rectangular annular shape.

The partition wall 16 may be provided adjacent to the insertion groove 15 closer to the center of the lower light transmission plate 12 than the side light transmission plate 11 so that the insertion groove 15 has a smaller area than the hollow area 14. have.

 The insertion groove 15 may be opened downward to accommodate the light emitting device. As a result, at least 50% of the height of the light emitting device may be accommodated in the insertion groove 15 of the light emitting device. The light emitting element region corresponding to 50% of the height of the light emitting element from the upper surface of the light emitting element is accommodated in the insertion groove 15, the remaining area of the light emitting element is in the state protruded to the lower portion of the insertion groove 15 Can be. In this case, an electrode of the light emitting device may be included in the remaining area of the light emitting device protruding below the insertion groove 15.

 The insertion groove 15 may prevent the flow of the light emitting device in the completed light emitting device package by fixing the light emitting device accommodated through the partition wall 16. To this end, the partition wall 16 may be formed to be adjacent to the insertion groove 15 corresponding to the size of the light emitting device to be received later.

Here, the hollow region 14 is open toward the upper portion of the light transmitting plate body 10 in a state surrounded by the side light transmitting plate 11, and the insertion groove 15 is surrounded by the partition wall 16. It can be opened toward the bottom of. In other words, it can be understood that the hollow region 14 and the insertion groove 15 are opened in a direction facing each other.

The upper light transmitting plate 13 may be formed of the same material as the light transmitting plate body 10, that is, a transparent material having good light transmittance and weldability. In a preferred embodiment, the upper floodlight plate 13 may be formed of a glass material.

The upper light transmitting plate 13 may be disposed on the light transmitting plate body 10 to cover the QD phosphor layer accommodated in the hollow region 14 of the light transmitting plate body 10. The area where the side light transmitting plate 11 and the top light transmitting plate 13 meet each other is welded by a femto laser beam to form a light transmitting plate body 10 to which the side light transmitting plate 11 and the top light transmitting plate 13 are connected. can do. Through the laser glass welding, the QD phosphor layer may be sealed in the hollow region 14, which is an empty space between the lower light emitting plate 12, the side light transmitting plate 11, and the upper light transmitting plate 13. Will be.

The overall shape of the upper floodlight plate 13 may be formed in a thin plate shape, but is not necessarily limited thereto. The top and bottom surfaces of the top floodlight plate 13 may be formed in a predetermined shape (eg, rectangular, square, round, oval, etc.). The upper and lower surfaces of the upper light transmitting plate 13 may be formed to have the same shape and / or size, or may have different shapes and / or sizes.

2 is a view for explaining a light transmitting plate body 10 according to another embodiment of the present invention. Referring to FIG. 2, it can be seen that, unlike FIG. 1, the curvature portion 17 having a curvature is formed on the outer surface of the lower floodlight plate 12. In describing FIG. 2, descriptions of configurations or effects overlapping with those of FIG. 1 will be omitted.

In manufacturing the light emitting device package, a reflector may be provided to surround the outside of the light transmitting plate body 10. The reflector is a component for reflecting light output from the light emitting element. The reflector is output from the light emitting element, and serves to reflect the light irradiated through the transparent plate body 10 to the QD phosphor layer. The curvature 17 may be formed at the edge of the lower light-transmitting plate 12 so that the reflector can more efficiently reflect light emitted from the side of the light emitting device.

The curvature 17 may be formed along the outer surface of the lower end of the partition 16. The curvature 17 may have a shape protruding toward the hollow region 14. The curvature 17 may vary depending on the size or length of the lower transparent plate 12 or the partition wall 16. In addition, the curvature 17 may be formed to have a constant radius length around the point a of FIG. 2 or may be formed in the shape of an elliptical arc having a different radius length.

A method of operating the light emitting device package including the light transmitting plate body 10 having the curvature 17 formed thereon will be described with reference to FIG. 3.

3 is a view illustrating a light emitting device package including a light transmitting plate body according to the embodiment of FIG. 2. Referring to FIG. 3, the light emitting device package according to the embodiment of the present invention may include a light transmitting plate body 10, a QD phosphor layer 20, a light emitting device 30, and a reflector 40.

The transparent plate body 10 may have a configuration corresponding to the transparent plate body 10 described with reference to FIG. 1 or FIG. 2.

The transparent plate body 10 and the QD phosphor layer 20 may be disposed on the light emitting device 30 to effectively convert wavelengths of light emitted from the light emitting device 30. In addition, by sealing the QD phosphor layer 20 in the hollow region 14 of the transparent plate body 10, it is possible to safely protect the QD phosphor vulnerable to external environmental conditions.

The light emitting device 30 is a configuration for emitting predetermined light, and a flip chip type LED light emitting device may be representatively exemplified. The light emitting device 30 may output light through the upper part and the side part. The light emitting device 30 may include a substrate, a conductive semiconductor layer, an active layer, a conductive metal layer, and the like.

The light emitting device 43 may emit light having different wavelengths according to the composition ratio of the compound semiconductor. That is, the light emitting device 30 may include at least one of colored LED chips emitting red, green, and blue light, white LED chips emitting white light, or UV (Ultra Violet) LED chips emitting ultraviolet light. have.

The light emitting device 30 may be attached to the insertion groove 15 through the adhesive layer 31 in a state of being accommodated in the insertion groove 15. The adhesive layer (or adhesive sheet 31) may be disposed between the light emitting device 30 and the insertion groove 15 of the light transmitting plate body 10 to adhere the light emitting device 30 to the light transmitting plate body 10. The adhesive layer 31 may be entirely coated on the upper surface of the light emitting device 30. In addition, the adhesive layer 31 may be formed of a transparent material so that light emitted from the light emitting device 30 may be easily transmitted.

The light emitting device 30 may include an electrode to be electrically connected to an external configuration of the light emitting device package at a bottom surface of the light emitting device 30.

The reflector 40 may be formed to surround the transparent plate body 10 and the light emitting device 30. The reflector 40 may protect the light emitting device 30 and the light transmitting plate body 10 from the external environment and / or external impact. In addition, the reflector 40 may reflect light emitted from the light emitting device 30 in a specific direction (eg, an upper direction).

The reflector 40 may be formed to surround the side surface of the partially protruding light emitting device 30 without being inserted into the insertion groove 15 in the lower portion of the transparent plate body 10. More specifically, as shown in FIG. 3, the reflector 40 may be formed to surround the side surface of the light emitting element 30 protruding to the bottom of the light transmitting plate body 10 so that the bottom surface of the light emitting element 30 coincides with the bottom surface of the reflector. Can be. As a result, the bottom of the reflector 40 may be formed on the same plane as the bottom of the light emitting device 30.

In addition, unlike the above example, the bottom of the light emitting device 30 may have a shape protruding from the bottom of the reflector 40 through at least one electrode formed on the bottom of the light emitting device 30. That is, the bottom of the light emitting device 30 may include at least one electrode, and the electrode may protrude further downward than the bottom of the reflector 40.

The reflector 40 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, photosensitive glass (PSG), polyamide 9T (PA9T), neogeotactic polystyrene (SPS), a metal material, sapphire (Al2O3), beryllium oxide (BeO) may be formed of at least one. In a preferred embodiment, the reflector 40 may be formed of silicon material.

Referring to FIG. 3, a process of reflecting light output from the light emitting device 30 is as follows. Light output from the light emitting device 30 may be transmitted to the QD phosphor layer 20 through the light transmitting plate body 10. At this time, the light output from the upper portion of the light emitting device 30 reaches the QD phosphor layer 20 directly through the transparent plate body 10. The light output from the side of the light emitting element 30 reaches the reflector 40 through the light transmitting plate body 10.

The reflector 40 may have a shape that partially protrudes toward the hollow region 14 in correspondence with the shape of the curvature 17. Accordingly, the light output from the side of the light emitting device 30 reaches the protruding portion of the reflector 40, is reflected by the protruding reflector 40 and is reflected toward the upper direction of the light emitting device package. As a result, the light output from the side of the light emitting device 30 can be transmitted to the QD phosphor layer 20 by the light propagating direction by the projecting reflector 40.

Therefore, since the light output from the side of the light emitting device 30 is relatively more reflected to the QD phosphor layer 20, the overall amount of light of the light emitting device package is increased.

In addition, as described above, the light emitting device 30 is accommodated in the insertion groove 15, and the partition wall 16 supports the state in which the light emitting device 30 is bonded to the insertion groove 15 through the adhesive layer 31. Therefore, the left and right flow of the light emitting device 30 can be prevented.

4 is a view for explaining a method of etching a transparent plate body according to another embodiment of the present invention. Referring to FIG. 4, the method of etching a transparent plate body according to an exemplary embodiment of the present invention may include forming a hollow region 14 (S110) and forming an insertion groove 15 (S120).

Referring to FIG. 4, a lower floodlight plate 100 having a constant size and thickness may be provided. In this case, the lower floodlight plate 100 is not yet etched, and may be configured in a plate shape having a predetermined shape (eg, rectangular or square).

The forming of the hollow region 14 (S110) may be a process of forming a plurality of hollow regions 14 on the upper surface of the lower floodlight plate 100. In more detail, a plurality of hollow regions 14 may be formed by cutting the upper surface of the glass plate 100 with a grinder. Through this, the hollow region 14 and the side light-transmitting plate 11 having a step with the hollow region 14 may be formed. In addition, a lower floodlight plate may be formed below the hollow region 14 and the side floodlight plate 11. Meanwhile, in another embodiment, the plurality of hollow regions 14 may be formed by etching the upper surface of the plate with an etching solution and a mask.

The plurality of hollow regions 14 may be arranged in a matrix form on the upper surface of the lower floodlight plate 100. The plurality of hollow regions 14 may be formed to be arranged at regular intervals. Meanwhile, in another embodiment, the plurality of hollow regions 14 may be formed to be arranged in a row on the upper surface of the lower light transmitting plate 100.

Each hollow region 14 may be formed to have the same shape and size with each other. For example, each hollow region 14 may be formed in a thin rectangular parallelepiped shape. In addition, each hollow region 14 may be formed to have a uniform depth from the upper surface of the side light-transmitting plate.

Forming the insertion groove 15 (S120) may be a process of forming a plurality of insertion grooves 15 on the lower surface of the lower floodlight plate 100. More specifically, the lower surface of the plate may be shaved with a grinder to form a plurality of insertion grooves 15. Meanwhile, in another embodiment, a plurality of insertion grooves 15 may be formed by etching the bottom surface of the plate with an etching solution and a mask.

The plurality of insertion grooves 15 may be arranged in a matrix form on the lower surface of the lower floodlight plate 100. At this time, the insertion grooves 15 may be formed corresponding to the position and size of the hollow region 14 formed before, respectively.

Each insertion groove 15 may be formed to have the same shape and size with each other. For example, each insertion groove 15 may be formed in a thin rectangular parallelepiped shape. In addition, each insertion groove 15 may be formed to have a uniform depth.

Then, in the step of forming the insertion groove (S120), the insertion groove may be formed to a depth of a thickness thinner than the thickness of the light emitting device so as to accommodate a portion of the light emitting device to be accommodated later, a portion.

Although the step S110 of forming the hollow area in FIG. 4 is illustrated as being performed before the step S120 of forming the insertion groove, the present invention is not limited thereto, and the step S110 of forming the hollow area is an insertion groove. It may be performed after the step (S120) to form a.

5 is a view for explaining a method of etching a transparent plate body according to another embodiment of the present invention. Unlike the embodiment of FIG. 4, the transparent plate body etching method according to the embodiment of FIG. 5 may further include forming a curvature 17 (S130). In FIG. 5, a description of the steps and effects overlapping with those of FIG. 4 will be omitted.

Forming the curvature 17 (S130) is to form a curvature 17 to protrude toward the adjacent hollow region 14 having a predetermined curvature by etching the lower portion of the region where the plurality of side light-transmitting plate is located. It may be a step.

In more detail, the step S130 of forming the curvature 17 may be a process of forming the plurality of curvatures 17 on the lower surface of the lower floodlight plate 100. More specifically, the lower surface of the plate may be shaved with a grinder to form a plurality of curvatures 17. In another embodiment, the lower surface of the plate may be etched with an etching solution and a mask to form the curvature 17.

The plurality of curvatures 17 may be formed at a position corresponding to a region between the plurality of hollow regions 14 formed on the upper surface of the lower light-transmitting plate or a region between the insertion grooves 15 formed on the lower surface of the lower light-transmitting plate. Can be.

In FIG. 5, the step S130 of forming the curvature 17 is illustrated as being performed after the step S120 of forming the insertion groove 15, but the present invention is not limited thereto. Forming step (S130) may be performed prior to forming an insertion groove (S120).

6 is a view for explaining a method of manufacturing a light emitting device package according to another embodiment of the present invention. In the description of FIG. 6, a description of a configuration or an effect overlapping with that of FIG. 4 or 5 will be omitted.

Referring to FIG. 6, a method of manufacturing a light emitting device package includes a step of etching a transparent plate body (S100), a step of injecting a QD phosphor (S200), a step of contacting and welding an upper light transmitting plate (S300), and a light transmitting plate body. Separating step (S400) separately, receiving the light emitting device in the separated transparent plate body (S500), forming a reflector on the transparent plate body accommodated light emitting device to form a light emitting device package (S600) Can be.

The transparent plate body etching step S100 may include forming a hollow region described above with reference to FIGS. 4 or 5 (S110), forming an insertion groove (S120), or forming a curvature (S130). Can be.

The transparent plate body 10 generated through forming the hollow region (S110), forming an insertion groove (S120), or forming a curvature (S130) may be individually formed through a series of steps described below. It may be generated as a light emitting device package.

Injecting the QD phosphor (S200) is to move the light transmitting plate body formed with a hollow region into the jig, and then to make the jig in a vacuum state and inject the phosphor into the phosphor receiving region of the light transmitting plate body. Can mean. Since the QD phosphor is in a sol state, the QD phosphor is filled from the bottom to the top of the hollow region. When the QD phosphor is filled to form the QD phosphor layer, the temperature inside the jig may be raised to a predetermined temperature to harden the QD phosphor layer.

The welding step (S300) may be a step of allowing the QD phosphor layer to be sealed by placing the upper floodlight plate in contact with the top of the floodlight plate body filled with the QD phosphor. Thereafter, the lower light transmitting plate and the side light transmitting plate may be bonded to the upper light transmitting plate by irradiating a laser beam to a region where the side light transmitting plate and the upper light transmitting plate of the light transmitting plate body 10 are in contact with each other by using a laser device.

Separating the light transmitting plate body (S400) may be a step (singulation) of the plurality of light transmitting plate body separately in a state in which the QD phosphor layer is accommodated therein. The separation process may include a braking process performed by physical force using a blade, a laser scribing process of irradiating and separating a laser, and an etching process of separating using wet or dry etching, but is not limited thereto. It doesn't.

The accommodating the light emitting device (S500) may refer to a step of accommodating the light emitting devices arranged in a predetermined interval on the light transmitting plate body separated into individual units in the insertion groove of the light transmitting plate body. An adhesive layer may be applied to an upper surface of the light transmitting plate body or the light emitting device separated into individual units, and the light emitting device and the corresponding light transmitting plate body may be adhered by curing the adhesive layer in a state accommodated in the insertion groove.

The forming of the reflector to form the light emitting device package (S600) may be a step of filling the reflector to surround the reflector on the light transmitting plate body in which the light emitting device is accommodated using the silicon injection device. The reflector may be filled so that at least one or more electrodes formed on the bottom surface of the light emitting device may be exposed to the outside. By forming a reflector on the light transmitting plate body, an individual light emitting device package may be completed.

The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments described in the present invention are not intended to limit the technical spirit of the present invention but to describe the present invention, and are not limited to these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas falling within the scope of the present invention should be construed as being included in the scope of the present invention.

10: floodlight plate body 11: side floodlight plate
12: lower floodlight plate 13: upper floodlight plate
14: hollow area 15: insertion groove
16: bulkhead 17: curvature
20: QD phosphor layer 30: light emitting element
40: reflector

Claims (20)

Light emitting element;
A lower transmissive plate formed in a central region of a lower surface of the insertion groove into which a portion of the light emitting element is inserted; a plurality of side transmissive plates formed on an upper surface of the lower transmissive plate; An upper transmissive plate formed on an upper surface of the translucent plate and a transmissive plate body having an hollow port formed therein;
A QD phosphor layer formed in the hollow region and covering an upper surface of the lower floodlight plate; And
And a reflector surrounding lower and side surfaces of the light emitting device and the light transmitting plate body.
The light emitting device package, characterized in that the area of the QD phosphor layer formed on the upper surface of the lower transparent plate is larger than the area of the insertion groove. The method of claim 1, wherein the reflector
The light emitting device package, characterized in that surrounding the side surface of the light emitting device formed protruding from the insertion groove. The method of claim 1, wherein the upper floodlight plate is
The light emitting device package, characterized in that bonded to the upper portion of the plurality of side light-transmitting plate by laser irradiation. The method of claim 1, wherein the hollow region is
Light emitting device package, characterized in that the vacuum (vacuum) state. According to claim 1,
At least one electrode on the bottom surface of the light emitting device,
The electrode is a light emitting device package, characterized in that more protruding downward than the bottom of the reflector. According to claim 1,
Light emitting device package, characterized in that the adhesive layer is formed between the insertion groove and the light emitting device. Light emitting element;
A lower transmissive plate formed in a central region of a lower surface of the insertion groove into which a portion of the light emitting element is inserted; a plurality of side transmissive plates formed on an upper surface of the lower transmissive plate; An upper transmissive plate formed on an upper surface of the translucent plate and a transmissive plate body having an hollow port formed therein;
A QD phosphor layer formed in the hollow region and covering an upper surface of the lower floodlight plate; And
And a reflector surrounding lower and side surfaces of the light emitting device and the light transmitting plate body.
The edge of the lower surface of the lower light-transmitting plate is a light emitting device package, characterized in that the curvature having a curvature is formed. The method of claim 7, wherein the curvature is
The light emitting device package, characterized in that protruding toward the hollow area. The method of claim 7, wherein the reflector
The light emitting device package, characterized in that surrounding the side surface of the light emitting device formed protruding from the insertion groove. The method of claim 7, wherein the upper floodlight plate is
The light emitting device package, characterized in that bonded to the upper portion of the plurality of side light-transmitting plate by laser irradiation. The method of claim 7, wherein
The hollow region is a light emitting device package, characterized in that the vacuum (vacuum) state. The method of claim 7, wherein
At least one electrode on the bottom surface of the light emitting device,
The electrode is a light emitting device package, characterized in that more protruding downward than the bottom of the reflector. The method of claim 7, wherein
Light emitting device package, characterized in that the adhesive layer is formed between the insertion groove and the light emitting device. A lower floodlight plate formed at a central area of a lower surface of an insertion groove into which a portion of the light emitting device is inserted;
A plurality of side floodlight plates formed on an upper surface of the lower floodlight plate;
An upper floodlight plate corresponding to an upper surface of the lower floodlight plate and formed on upper surfaces of the plurality of side floodlight plates; And
It includes a hollow region (Empty Portion) on the upper surface of the lower floodlight plate,
The area of the hollow area is larger than the area of the insertion groove of the transparent plate body. 15. The method of claim 14, wherein the edge of the lower surface of the lower floodlight plate is
Light transmitting plate body, characterized in that the curvature having a curvature is formed. The method of claim 15, wherein the curvature is
The light emitting device package, characterized in that protruding toward the hollow area. The method of claim 14, wherein the upper floodlight plate is
A transparent plate body, characterized in that welded on top of the plurality of side light-transmitting plate. Etching a plurality of transparent plate bodies having a plurality of hollow regions and a plurality of insertion grooves formed under the plurality of hollow regions;
Injecting a QD phosphor into each of the plurality of hollow regions;
A translucent plate welding step of forming one upper translucent plate on the plurality of hollow regions;
Separating the plurality of floodlight plate bodies separately;
Accommodating a light emitting element in each of the insertion grooves of the plurality of light transmitting plate bodies separately separated; And
And forming a light emitting device package by forming a reflector on an outer surface of the light transmitting plate body in which the light emitting device is accommodated.
Etching the plurality of flood plate body is
Etching a top of the lower floodlight plate to form a plurality of side floodlight plates and etching the plurality of hollow regions;
Etching a lower portion of the lower floodlight plate to form a plurality of insertion grooves for receiving the light emitting device;
And etching the plurality of translucent plate bodies, wherein the area of the hollow area is larger than the area of the insertion groove. 19. The method of claim 18, wherein etching the plurality of translucent plate bodies is
Etching the edge of the lower surface of the lower light-transmitting plate has a curvature, and forming a curvature protruding toward the hollow region; The light emitting device package manufacturing method further comprising. 19. The method of claim 18, wherein forming the insertion groove
The insertion groove is a light emitting device package manufacturing method, characterized in that formed in a thickness thinner than the thickness of the light emitting device so as to accommodate a portion of the light emitting device, a portion protrudes.

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