KR20190120134A - Antenna apparatus - Google Patents

Abstract

According to one embodiment of the present invention, provided is an antenna apparatus, which comprises: a patch antenna pattern; a feed via providing a feeding path for the patch antenna pattern; a conductive ring pattern surrounding the patch antenna pattern; and a plurality of conductive array patterns surrounded by the conductive ring pattern, spaced apart from the patch antenna pattern and the conductive ring pattern, and disposed spaced apart from each other.

Description

Antenna apparatus

The present invention relates to an antenna device.

Data traffic of mobile communication is increasing rapidly every year. Active technology development is under way to support such breakthrough data in real time in wireless networks. For example, the content of Internet-based data (IoT) -based data, Augmented Reality (AR), Virtual Reality (VR), Live VR / AR combined with SNS, Autonomous driving, Sync View, Micro-camera Applications such as real-time video transmission require communication (eg, 5G communication, mmWave communication, etc.) to support large data exchange.

Therefore, recently, millimeter wave (mmWave) communication including 5G (5G) communication has been actively studied, and research for commercialization / standardization of an antenna module for smoothly implementing it has been actively conducted.

RF signals in high frequency bands (e.g., 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lost in the way they are delivered, so the quality of communication can drop dramatically. Therefore, the antenna for high frequency communication requires a different technical approach from the conventional antenna technology, and it is necessary to separate the antenna gain (Gain), the integration of the antenna and the RFIC, and the effective isotropic radiated power (EIRP). It may require development of special technologies such as power amplifiers.

United States Patent Application Publication 2007/0052587

The present invention provides an antenna device.

An antenna device according to an embodiment of the present invention, a patch antenna pattern; A feed via providing a feed path for the patch antenna pattern; A conductive ring pattern surrounding the patch antenna pattern; And a plurality of conductive arrangement patterns surrounded by the conductive ring patterns and spaced apart from the patch antenna pattern and the conductive ring patterns and spaced apart from each other. It may include.

The antenna device according to an embodiment of the present disclosure may further improve antenna performance since the RF signal may be further concentrated in the z direction.

The antenna device according to an embodiment of the present disclosure can reduce the counting of the RF signal to the adjacent antenna device, thereby improving the electromagnetic isolation of the adjacent antenna device, and is disposed closer to the adjacent antenna device or electromagnetically. It may have a reduced size by omitting a separate component for shielding.

The antenna device according to an embodiment of the present disclosure may improve the electromagnetic isolation between the patch antenna and the end-fire antenna, and may have a reduced size while expanding the RF signal transmission / reception direction.

1 is a perspective view showing an antenna device according to an embodiment of the present invention.
2A to 2C are views illustrating a structure in which an end-fire antenna is additionally disposed in the antenna device shown in FIG. 1.
3A and 3B are perspective views illustrating the conductive arrangement pattern and the conductive ring pattern of the antenna device according to an exemplary embodiment of the present invention.
3C and 3D are side views illustrating a barrier function of the conductive ring pattern of the antenna device according to the embodiment of the present invention.
3E is a circuit diagram illustrating an equivalent circuit of an antenna device according to an embodiment of the present invention.
4A to 4E are plan views illustrating each layer of the antenna device according to an exemplary embodiment.
5 is a plan view showing an antenna module according to an embodiment of the present invention.
6A to 6B are side views illustrating the lower structure of the connection member included in the antenna device and the antenna module according to an embodiment of the present invention.
7 is a side view illustrating the structure of an antenna device and an antenna module according to an embodiment of the present invention.
8A and 8B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. Like reference numerals in the drawings refer to the same or similar functions throughout the several aspects.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

1 is a perspective view showing an antenna device according to an embodiment of the present invention.

Referring to FIG. 1, an antenna device according to an exemplary embodiment may include a patch antenna pattern 110a, a feed via 120a, a conductive array pattern 130a, and a conductive ring pattern 180a.

The feed via 120a may be configured to pass a radio frequency (RF) signal. For example, the feed via 120a may electrically connect between the IC and the patch antenna pattern 110a and may have a structure extending in the z direction.

The patch antenna pattern 110a may be electrically connected to one end of the feed via 120a. The patch antenna pattern 110a may receive an RF signal from the feed via 120a and transmit the RF signal in the z direction, and transmit the RF signal received in the z direction to the feed via 120a.

Some of the RF signals transmitted from the patch antenna pattern 110a may face the ground layer 125a disposed below. The RF signal directed toward the ground layer 125a may be reflected by the ground layer 125a and directed in the z direction. Accordingly, the RF signal transmitted from the patch antenna pattern 110a may be further concentrated in the z direction.

For example, the patch antenna pattern 110a may have a structure of a patch antenna having both sides of a circular or polygonal shape. Both surfaces of the patch antenna pattern 110a may serve as a boundary through which an RF signal passes between a conductor and a non-conductor. The patch antenna pattern 110a may have an intrinsic frequency band (for example, 28 GHz) according to an intrinsic element (for example, shape, size, height, dielectric constant of the insulating layer, etc.).

The plurality of conductive array patterns 130a may be spaced apart from the patch antenna pattern 110a and arranged to correspond to at least a portion of the side boundary of the patch antenna pattern 110a. The plurality of conductive array patterns 130a may be electromagnetically coupled to the patch antenna pattern 110a and may induce a path of the RF signal of the patch antenna pattern 110a in the z direction.

For example, the plurality of conductive array patterns 130a may have the same shape and may be repeatedly arranged. That is, the plurality of conductive array patterns 130a may have an electromagnetic bandgap characteristic and have a negative refractive index with respect to the RF signal. Accordingly, the path of the RF signal of the patch antenna pattern 110a may be further guided in the z direction.

In addition, the plurality of conductive array patterns 130a may be electromagnetically coupled to the patch antenna pattern 110a, and the elements (eg, height, shape, size, number, spacing between the plurality of conductive array patterns 130a) may be provided. The separation distance with respect to the patch antenna pattern) may affect the frequency characteristics of the patch antenna pattern 110a.

Most of the RF signals passing through the plurality of conductive array patterns 130a may be induced close to the z direction, but some may be far from the z direction. Accordingly, some of the RF signals passing through the plurality of conductive array patterns 130a may be counted in the x direction and / or the y direction in the plurality of conductive array patterns 130a.

The conductive ring pattern 180a may be spaced apart from the patch antenna pattern 110a and the plurality of conductive array patterns 130a and may surround the patch antenna pattern 110a and the plurality of conductive array patterns 130a together.

Accordingly, the conductive ring pattern 180a may reflect the RF signal counting in the x direction and / or the y direction among the RF signals passing through the plurality of conductive array patterns 130a. The RF signal reflected from the conductive ring pattern 180a may be induced in the z direction in the plurality of conductive array patterns 130a.

Therefore, the antenna device according to an embodiment of the present invention can further improve gain because the RF signal can be concentrated in the z direction, and the neighboring antenna can be reduced because the RF signal is counted by the adjacent antenna device. The electromagnetic isolation for the device can be improved and can be placed closer to the adjacent antenna device. Therefore, an antenna module including a plurality of antenna devices according to an embodiment of the present invention may be further miniaturized.

On the other hand, the antenna device according to an embodiment of the present invention is disposed on the upper side of the patch antenna pattern (110a) and at least a portion when viewed in the vertical direction (z direction) is arranged so as to be surrounded by a plurality of conductive array pattern (130a) The coupling patch pattern 115a may be further included. Accordingly, the antenna device according to an embodiment of the present invention may have a wider bandwidth.

According to the arrangement of the coupling patch pattern 115a, an optimal position for connecting the feed via 120a in the patch antenna pattern 110a may be close to the boundary of the patch antenna pattern 110a. When the optimum position is closest to the edge of the first direction (eg, 0 degree direction) of the patch antenna pattern 110a, the surface current flowing through the patch antenna pattern 110a according to the RF signal transmission and reception of the patch antenna pattern 110a is The patch antenna pattern 110a may flow in a third direction (eg, 180 ° direction). In this case, the surface current may be distributed in the second direction (eg, 90 ° direction) and the fourth direction (eg, 270 ° direction), and the plurality of conductive array patterns 130a and / or the conductive ring patterns 180a may be As the surface current is distributed in the second and fourth directions, the RF signal counting laterally may be guided in the top direction. Accordingly, since the radiation pattern of the patch antenna pattern 110a may be further concentrated in the upper surface direction, the antenna performance of the patch antenna pattern 110a may be improved. Meanwhile, depending on the design, the coupling patch pattern 115a may be omitted.

2A is a perspective view illustrating a structure in which an end-fire antenna is additionally disposed in the antenna device shown in FIG. 1.

Referring to FIG. 2A, an antenna device according to an embodiment of the present disclosure may include at least a portion of an end-fire antenna pattern 210a, a director pattern 215a, a feed line 220a, and a coupling ground pattern 235a. It may further include.

The end-fire antenna pattern 210a may form a radiation pattern in a second direction (eg, x direction) to transmit or receive an RF signal in a second direction (eg, x direction). Therefore, the antenna device according to an embodiment of the present invention can extend the RF signal transmission / reception direction omni-directional.

For example, the end-fire antenna pattern 210a may have a dipole form or a folded dipole form. Here, one end of each pole of the end-fire antenna pattern 210a may be electrically connected to the feed line 220a. The frequency band of the end-fire antenna pattern 210a may be designed to be substantially the same as the frequency band of the patch antenna pattern 110a, but is not limited thereto.

The director pattern 215a may be electromagnetically coupled to the end-fire antenna pattern 210a to improve the gain or bandwidth of the end-fire antenna pattern 210a.

The feed line 220a may transmit the RF signal received from the end-fire antenna pattern 210a to the IC, and may transfer the RF signal received from the IC to the end-fire antenna pattern 210a.

The conductive ring pattern 180a may improve electromagnetic isolation between the patch antenna pattern 110a and the end-fire antenna pattern 210a. Therefore, the antenna device according to an embodiment of the present invention can be further miniaturized while ensuring antenna performance.

The coupling ground pattern 235a may be disposed above or below the feed line 220a. The coupling ground pattern 235a may be electromagnetically coupled to the end-fire antenna pattern 210a. Thus, the end-fire antenna pattern 210a may have a wider bandwidth.

FIG. 2B is a side view illustrating the antenna device shown in FIG. 2A.

Referring to FIG. 2B, the patch antenna pattern and the coupling patch pattern may be disposed on the same layer as the layer on which the plurality of conductive array patterns 130a and the conductive ring pattern 180a are disposed. Accordingly, the plurality of conductive array patterns 130a and the conductive ring patterns 180a can efficiently induce the RF signal counted by the patch antenna pattern in the upward direction.

The conductive array pattern 130a and the conductive ring pattern 180a may each have a plurality of layers (for example, five). As the number of layers of the conductive array pattern 130a and the conductive ring pattern 180a increases, the RF signal induction performance of the conductive array pattern 130a and the RF signal reflection performance of the conductive ring pattern 180a may be improved.

The connection member 200a may include the above-described ground layer 125a and may further include a wiring ground layer 202a, a second ground layer 203a, and an IC ground layer 204a. The feed line 220a may be disposed at a same level with respect to the wiring ground layer 202a.

FIG. 2C is a cross-sectional view of the antenna device shown in FIG. 2A.

Referring to FIG. 2C, the plurality of conductive array patterns 130a may be arranged in one line. An interval between the plurality of conductive arrangement patterns 130a may be shorter than an interval between the plurality of conductive arrangement patterns 130a and the conductive ring patterns 180a. Accordingly, the plurality of conductive array patterns 130a can induce the RF signal more efficiently in the z direction.

Meanwhile, referring to FIG. 2C, the plurality of first shielding vias 126a may be arranged under the plurality of conductive array patterns 130a, and the plurality of second shielding vias 121a may surround the feed vias 120a. It can be arranged to be. Accordingly, electromagnetic noise affecting the feed via 120a may be reduced, and transmission loss of the RF signal may be reduced.

3A and 3B are perspective views illustrating the conductive arrangement pattern and the conductive ring pattern of the antenna device according to an exemplary embodiment of the present invention.

3A and 3B, the plurality of conductive array patterns 130a may include a plurality of first conductive array patterns 136a, a plurality of second conductive array patterns 132a, and a plurality of third conductive array patterns 133a. The plurality of fourth conductive array patterns 134a and the plurality of fifth conductive array patterns 135a may be formed. The plurality of first, second, third, fourth, and fifth conductive array patterns 136a, 132a, 133a, 134a, and 135a may be electrically connected by the plurality of array vias 131a. Accordingly, the plurality of conductive array patterns 130a may further have characteristics close to the electromagnetic bandgap characteristics.

In addition, the conductive ring patterns 180a may include the first conductive ring patterns 180-1a, the second conductive ring patterns 180-5a, the third conductive ring patterns 180-2a, and the fourth conductive ring patterns 180-a. 3a) and the fifth conductive ring pattern 180-4a may be arranged in parallel.

For example, the plurality of first conductive array patterns 136a may be disposed in the same position with respect to the patch antenna pattern 110a and the first conductive ring patterns 180-1a of the conductive ring patterns 180a. The second conductive array pattern 132a may be disposed at the same position with respect to the coupling patch pattern 115a and the second conductive ring pattern 180-5a of the conductive ring pattern 180a. Accordingly, the plurality of conductive array patterns 130a and the conductive ring patterns 180a may induce the RF signal passing through the patch antenna pattern 110a in the z direction more efficiently.

Meanwhile, referring to FIG. 3B, an antenna device according to an embodiment of the present disclosure may electrically connect the first and second conductive ring patterns 180-1a and 180-5a of the conductive ring pattern 180a to each other. It may further include a chain via 181a. Accordingly, the counting of the RF signal passing through the patch antenna pattern 110a in the x direction and / or the y direction may be further reduced.

Meanwhile, referring to FIG. 3B, the antenna device according to an embodiment of the present disclosure further includes at least one grounding via 185a disposed to electrically connect the conductive ring pattern 180a and the ground layer 125a. can do. For example, the at least one grounding via 185a may be configured in plural and may be arranged to surround the feed via 120a. Accordingly, the counting of the RF signal passing through the patch antenna pattern 110a in the x direction and / or the y direction may be further reduced.

In addition, at least one grounding via 185a may be disposed between the patch antenna pattern 110a and the end-fire antenna pattern, thereby reducing the electromagnetic isolation between the patch antenna pattern 110a and the end-fire antenna pattern. It can be further improved.

Meanwhile, the plurality of conductive array patterns 130a may be electrically separated from the ground layer 125a. Accordingly, the plurality of conductive array patterns 130a may have a more adaptive characteristic with respect to an RF signal having a frequency adjacent to the frequency band of the patch antenna pattern 110a, thereby further widening the bandwidth.

3C and 3D are side views illustrating a barrier function of the conductive ring pattern of the antenna device according to the embodiment of the present invention.

Referring to FIG. 3C, the RF signal transmitted from the patch antenna pattern 110a is reflected by a barrier, reflected by the ground layer of the connection member 200a, and refracted by the plurality of conductive array patterns 130a. Can be transmitted in a direction.

In addition, the RF signal transmitted from the end-fire antenna pattern 210a may be reflected by a barrier and transmitted in the x direction.

Since the barrier corresponds to the aforementioned conductive ring pattern, the antenna device according to an embodiment of the present invention may improve the electromagnetic isolation between the patch antenna pattern 110a and the end-fire antenna pattern 210a. have.

Referring to FIG. 3D, the RF signal transmitted from each of the plurality of patch antenna patterns 110a is reflected by a barrier, reflected by the ground layer of the connection member 200a, and then by the plurality of conductive array patterns 130a. It may be refracted and transmitted in the z direction.

Accordingly, the antenna device according to an embodiment of the present disclosure may improve electromagnetic isolation between the plurality of patch antenna patterns 110a.

3E is a circuit diagram illustrating an equivalent circuit of an antenna device according to an embodiment of the present invention.

Referring to FIG. 3E, the patch antenna pattern 110b of the antenna device according to an embodiment of the present invention may transmit an RF signal or receive an RF signal to a source SRC2 such as an IC, and have a resistance value R2. And may have inductances L3 and L4.

The plurality of conductive array patterns 130b may include capacitances C5 and C12 for the patch antenna pattern 110b, capacitances C6 and 10 between the plurality of conductive array patterns, and inductances L5 and L6 of the array vias. The capacitors may have capacitances C7 and C11 between the plurality of conductive array patterns and the ground layer.

Frequency band and bandwidth of the antenna device according to an embodiment of the present invention may be determined by the above-described resistance value, capacitance and inductance.

4A to 4E are plan views illustrating each layer of the antenna device according to an exemplary embodiment.

Referring to FIG. 4A, one end of the feed via 120a may be connected to the patch antenna pattern 110a. The plurality of first conductive array patterns 136a may surround the patch antenna pattern 110a, and the conductive ring patterns 180a may surround the plurality of first conductive array patterns 136a and the grounding vias 185a. Can be connected to one end of

Referring to FIG. 4B, the ground layer 201a may have a through hole through which the feed via 120a passes, and may be connected to the other end of the grounding via 185a. The ground layer 201a may electromagnetically shield between the patch antenna pattern 110a and the feed line.

Referring to FIG. 4C, the wiring ground layer 202a may surround at least a portion of the feedline 220a and the patch antenna feedline 221a, respectively. The feed line 220a may be electrically connected to the second wiring via 232a, and the patch antenna feed line 221a may be electrically connected to the first wiring via 231a. The wiring ground layer 202a may electromagnetically shield between the feedline 220a and the patch antenna feedline 221a. One end of the feed line 220a may be connected to the second feed via 211a.

Referring to FIG. 4D, the second ground layer 203a may have a plurality of through holes through which the first wiring via 231a and the second wiring via 232a pass, respectively, and form the coupling ground pattern 235a. Can have The second ground layer 203a may electromagnetically shield between the feedline and the IC.

Referring to FIG. 4E, the IC ground layer 204a may have a plurality of through holes through which the first wiring via 231a and the second wiring via 232a respectively pass. The IC 310a may be disposed under the IC ground layer 204a, and may be electrically connected to the first wiring via 231a and the second wiring via 232a. The end-fire antenna pattern 210a and the director pattern 215a may be disposed at substantially the same height as the IC ground layer 225.

IC ground layer 204a may provide the ground used in circuitry and / or passive components of IC 310a as IC 310a and / or passive components. Depending on the design, the IC ground layer 204a may provide a path for the transmission of power and signals used in the IC 310a and / or passive components. Thus, IC ground layer 204a may be electrically connected to the IC and / or passive components.

Meanwhile, the wiring ground layer 202a, the second ground layer 203a, and the IC ground layer 204a may have a recessed shape to provide a cavity. Accordingly, the end-fire antenna pattern 210a may be further disposed closer to the IC ground layer 204a.

Meanwhile, the vertical relationship and shape of the wiring ground layer 202a, the second ground layer 203a, and the IC ground layer 204a may vary depending on the design.

5 is a plan view showing an antenna module according to an embodiment of the present invention.

Referring to FIG. 5, an antenna module according to an exemplary embodiment may include a plurality of patch antenna patterns, a plurality of coupling patch patterns 115b, a ground layer 125b, a plurality of conductive array patterns 130b, and conductive materials. Perforated plate pattern 180b, a plurality of chain vias 181b, a plurality of end-fire antenna patterns 210b, a plurality of director patterns 215b, a plurality of feed lines 220b, and a plurality of coupling ground patterns 235b. ) May include at least some.

The conductive porous plate pattern 180b may have a structure in which the above-described conductive ring pattern and the above-described conductive ring pattern are combined with each other, and a plurality of patch antennas (patch antenna patterns, feed vias, and sets of a plurality of conductive array patterns) are provided. It may be configured to have a plurality of arrangement spaces each arranged.

Since the conductive porous plate pattern 180b may have characteristics similar to those of the conductive ring pattern described above, the electromagnetic isolation of the plurality of patch antennas may be improved. For example, the conductive porous plate pattern 180b may be formed of first, second, third, fourth, and fifth conductive porous plate patterns. The first, second, third, fourth, and fifth conductive porous plate patterns may have the same shape and may be disposed at the same position when viewed in the vertical direction (eg, z direction).

The plurality of chain vias 181b may electrically connect the first, second, third, fourth, and fifth conductive porous plate patterns. In addition, the conductive porous plate pattern 180b may be electrically connected to the ground layer 125b through the grounding via.

An antenna device according to an embodiment of the present invention may be arranged in a 1 X n structure. Where n is a natural number. The antenna module in which the antenna devices are arranged in a 1 × n structure may be efficiently disposed at the corners of the electronic device.

6A to 6B are side views illustrating the lower structure of the connection member included in the antenna device and the antenna module according to an embodiment of the present invention.

Referring to FIG. 6A, an antenna module according to an embodiment of the present disclosure may include a connection member 200, an IC 310, an adhesive member 320, an electrical connection structure 330, an encapsulant 340, and a passive component. At least some of the 350 and the sub-substrate 410 may be included.

The connection member 200 may have a structure similar to the connection member described above with reference to FIGS. 1 to 5.

The IC 310 is the same as the above-described IC, and may be disposed under the connection member 200. The IC 310 may be electrically connected to a wire of the connection member 200 to transmit or receive an RF signal, and may be electrically connected to a ground layer of the connection member 200 to receive ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may bond the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200. For example, the electrical connection structure 330 may have a structure such as solder balls, pins, lands, and pads. The electrical connection structure 330 may have a lower melting point than the wiring and the ground layer of the connection member 200 to electrically connect the IC 310 and the connection member 200 through a predetermined process using the low melting point.

The encapsulant 340 may seal at least a portion of the IC 310, and may improve heat dissipation performance and impact protection performance of the IC 310. For example, the encapsulant 340 may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like.

The passive component 350 may be disposed on the bottom surface of the connection member 200, and may be electrically connected to the wiring and / or the ground layer of the connection member 200 through the electrical connection structure 330. For example, the passive component 350 may include at least some of a capacitor (eg, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

The sub-substrate 410 may be disposed under the connection member 200, and may receive an intermediate frequency (IF) signal or a base band signal from the outside and transmit the received signal to the IC 310 or from the IC 310. It may be electrically connected to the connection member 200 to receive the IF signal or the baseband signal to transmit to the outside. Here, the frequency (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) of the RF signal is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the sub-substrate 410 may transfer an IF signal or a baseband signal to or from the IC 310 through a wire that may be included in the IC ground layer of the connection member 200. Since the first ground layer of the connection member 200 is disposed between the IC ground layer and the wiring, the IF signal or the baseband signal and the RF signal may be electrically isolated in the antenna module.

Referring to FIG. 6B, the antenna module according to the exemplary embodiment may include at least some of the shielding member 360, the connector 420, and the chip antenna 430.

The shielding member 360 may be disposed under the connection member 200 to confine the IC 310 together with the connection member 200. For example, the shielding member 360 may be arranged to cover (eg, conformal shield) the IC 310 and the passive component 350 together or to cover each other (eg, the compartment shield). For example, the shielding member 360 may have a shape of a hexahedron having one surface open, and may have a hexahedral receiving space through coupling with the connection member 200. The shielding member 360 may be made of a high conductivity material such as copper to have a short skin depth, and may be electrically connected to the ground layer of the connection member 200. Accordingly, the shielding member 360 may reduce electromagnetic noise that may be received by the IC 310 and the passive component 350.

The connector 420 may have a connection structure of a cable (eg, a coaxial cable, a flexible PCB), may be electrically connected to the IC ground layer of the connection member 200, and may play a role similar to that of the above-described sub substrate. have. That is, the connector 420 may receive an IF signal, a baseband signal and / or a power from a cable, or provide an IF signal and / or a baseband signal to a cable.

The chip antenna 430 may transmit or receive an RF signal in support of an antenna device according to an exemplary embodiment. For example, the chip antenna 430 may include a dielectric block having a dielectric constant greater than that of the insulating layer, and a plurality of electrodes disposed on both surfaces of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connection member 200, and the other may be electrically connected to the ground layer of the connection member 200.

7 is a side view illustrating the structure of an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 7, in the antenna module according to the exemplary embodiment, the end-fire antenna 100f, the patch antenna pattern 1110f, the IC 310f, and the passive component 350f are integrated into the connection member 500f. It can have a structure.

The end-fire antenna 100f and the patch antenna pattern 1110f may be designed in the same manner as the antenna device and the patch antenna pattern described above, respectively, and receive or transmit an RF signal from the IC 310f, or receive the received RF. The signal can be passed to the IC 310f.

The connection member 500f may have a structure in which at least one conductive layer 510f and at least one insulating layer 520f are stacked (eg, a structure of a printed circuit board). The conductive layer 510f may have the above-described ground layer and a feed line.

In addition, the antenna module according to an exemplary embodiment may further include a flexible connection member 550f. The flexible connecting member 550f may include a first flexible region 570f overlapping the connecting member 500f and a second flexible region 580f not overlapping the connecting member 500f when viewed in the vertical direction.

The second flexible region 580f may be flexibly curved in the vertical direction. Accordingly, the second flexible region 580f may be flexibly connected to the connector of the set board and / or the adjacent antenna module.

The flexible connection member 550f may include a signal line 560f. The intermediate frequency (IF) signal and / or the baseband signal may be transmitted to the IC 310f through the signal line 560f or to a connector and / or an adjacent antenna module of the set board.

8A and 8B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

Referring to FIG. 8A, an antenna module including an end-fire antenna 100g, a patch antenna pattern 1110g, and an insulating layer 1140g may be used for the electronic device 700g on the set substrate 600g of the electronic device 700g. May be disposed adjacent to the lateral boundary.

The electronic device 700g is a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer. ), Monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc. It is not limited.

The communication module 610g and the baseband circuit 620g may be further disposed on the set substrate 600g. The antenna module may be electrically connected to the communication module 610g and / or the baseband circuit 620g through the coaxial cable 630g.

The communication module 610g may include a memory chip such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory to perform digital signal processing; Application processor chips such as central processors (eg, CPUs), graphics processors (eg, GPUs), digital signal processors, cryptographic processors, microprocessors, microcontrollers; It may include at least a portion of a logic chip, such as an analog-digital converter, an application-specific IC (ASIC).

The baseband circuit 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input and output from the baseband circuit 620g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through an electrical connection structure, core vias, and wiring. The IC may convert the base signal into an RF signal of a millimeter wave (mmWave) band.

Referring to FIG. 8B, a plurality of antenna modules each including an end-fire antenna 100h, a patch antenna pattern 1110h, and an insulating layer 1140h may be formed on the set substrate 600h of the electronic device 700h. 700h may be disposed adjacent to one side boundary and the other side boundary, and a communication module 610h and a baseband circuit 620h may be further disposed on the set substrate 600h. The plurality of antenna modules may be electrically connected to the communication module 610h and / or the baseband circuit 620h through the coaxial cable 630h.

Meanwhile, the patch antenna pattern, the coupling patch pattern, the conductive array pattern, the conductive ring pattern, the conductive porous plate pattern, the feed via, the array via, the chain via, the grounding via, the shield via, the ground layer, and the end-fire described in the present specification. The antenna pattern, the director pattern, the coupling ground pattern, and the electrical connection structure may be formed of a metal material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), or nickel (Ni). , Conductive materials such as lead (Pb), titanium (Ti), or alloys thereof), and may include chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, and subtractive. ), But may be formed according to plating methods such as additive, semi-additive process (SAP), modified semi-additive process (MSAP), and the like.

On the other hand, the insulating layer disclosed herein is FR4, Liquid Crystal Polymer (LCP), Low Temperature Co-fired Ceramic (LTCC), thermosetting resin such as epoxy resin, thermoplastic resin such as polyimide, or these resins and inorganic filler Resin, prepreg, Ajinomoto build-up film (ABF), FR-4, Bisaleimide Triazine (BT), and photosensitive insulation (impregnated with core materials such as glass fiber, glass cloth, and glass fabric) Imagable Dielectric (PID) resins, copper clad laminates (Copper Clad Laminate, CCL) or glass or ceramic-based insulation may be implemented. The insulating layer may include a patch antenna pattern, a coupling patch pattern, a conductive array pattern, a conductive ring pattern, a conductive porous plate pattern, a feed via, an array via, a chain via, a grounding via, and shielding in the antenna device and the antenna module disclosed herein. The via, ground layer, end-fire antenna pattern, director pattern, coupling ground pattern, and at least some of the positions where the electrical connection structure is not disposed may be filled.

On the other hand, RF signals disclosed herein are Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, It may have a format in accordance with, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated.

Although the present invention has been described by specific embodiments such as specific components and the like, but the embodiments and the drawings are provided to assist in a more general understanding of the present invention, the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations can be made from these descriptions.

110: patch antenna pattern
115: coupling patch pattern
120: feed via
121: second shielding via
125: ground layer
126: first shielded via
130: conductive array pattern
131: array via
132: first conductive array pattern
133: third conductive array pattern
134: fourth conductive array pattern
135: fifth conductive array pattern
136: second conductive array pattern
180a: conductive ring pattern
180b: conductive porous plate pattern
181: serial via
185: Grounding Via
200: connecting member
202: wiring ground layer
203: second ground layer
204: IC ground layer
210: end-fire antenna pattern
215: Director Pattern
220: feed line
235: coupling ground pattern

Claims (10)

Patch antenna patterns;
A feed via providing a feed path for the patch antenna pattern;
A conductive ring pattern surrounding the patch antenna pattern; And
A plurality of conductive arrangement patterns surrounded by the conductive ring patterns and spaced apart from the patch antenna pattern and the conductive ring patterns and spaced apart from each other; Antenna device comprising a.
The method of claim 1,
A ground layer having a through hole through which the feed via passes; And
A plurality of grounding vias disposed to electrically connect the conductive ring pattern and the ground layer; Antenna device further comprising.
The method of claim 2,
And the plurality of conductive array patterns are electrically separated from the ground layer.
The method of claim 2,
Feedline; And
An end-fire antenna pattern electrically connected to one end of the feed line; Including,
And the plurality of grounding vias are disposed between the patch antenna pattern and the end-fire antenna pattern.
The method of claim 1,
A second conductive ring pattern disposed above or below the conductive ring pattern; And
A plurality of chain vias arranged to electrically connect the conductive ring pattern and the second conductive ring pattern; Antenna device further comprising.
The method of claim 1,
A second conductive ring pattern disposed above or below the conductive ring pattern; And
A plurality of second conductive array patterns surrounded by the second conductive ring patterns and spaced apart from each other; Antenna device further comprising.
The method of claim 6,
And a plurality of array vias arranged to electrically connect the plurality of conductive array patterns and the plurality of second conductive array patterns, respectively.
The method of claim 6,
And a coupling patch pattern surrounded by the second conductive ring pattern and spaced apart from the plurality of second conductive array patterns.
The method of claim 8,
A third conductive ring pattern disposed between the conductive ring pattern and the second conductive ring pattern; And
A plurality of third conductive array patterns surrounded by the third conductive ring patterns; Antenna device further comprising.
The method of claim 1,
The plurality of conductive array patterns have the same shape and are spaced apart from each other,
And an interval between the plurality of conductive arrangement patterns is shorter than an interval between the plurality of conductive arrangement patterns and the patch antenna pattern.

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