KR102486786B1 - Antenna apparatus - Google Patents

Abstract

An antenna device according to an embodiment of the present invention includes a ground plane, a first patch antenna pattern spaced apart from above the ground plane and configured to have a first bandwidth, and a first patch antenna spaced apart from above the ground plane Electrical connection between a second patch antenna pattern configured to overlap at least a portion of the pattern and have a second bandwidth corresponding to a frequency higher than the frequency of the first bandwidth, and the first patch antenna pattern and the ground plane, respectively and a plurality of guide vias disposed so as to be aligned, and the plurality of guide vias may be arranged along one side of the first patch antenna pattern.

Description

Antenna apparatus {Antenna apparatus}

The present invention relates to an antenna device.

Data traffic of mobile communication is increasing rapidly every year. Active technology development is in progress to support such rapid data in real time in a wireless network. For example, IoT (Internet of Thing)-based data content creation, AR (Augmented Reality), VR (Virtual Reality), live VR/AR combined with SNS, autonomous driving, Sync View (user's point of view using a subminiature camera) Applications such as real-time video transmission) require communication (eg, 5G communication, mmWave communication, etc.) that supports exchanging large amounts of data.

Therefore, millimeter wave (mmWave) communication, including fifth generation (5G) communication, has recently been actively researched, and research for commercialization/standardization of an antenna device that smoothly implements it is also being actively conducted.

Since RF signals of high frequency bands (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lead to loss in the process of transmission, the quality of communication may rapidly deteriorate. Therefore, antennas for high-frequency communication require a different technical approach from the existing antenna technology, and a separate antenna for securing antenna gain, integration of antenna and RFIC, and securing EIRP (Effective Isotropic Radiated Power) is required. Development of special technologies such as power amplifiers may be required.

Publication No. 10-2019-0062064

The present invention provides an antenna device capable of improving antenna performance (eg, gain, bandwidth, directivity, etc.) or having a structure advantageous to miniaturization.

An antenna device according to an embodiment of the present invention includes a ground plane; a first patch antenna pattern spaced apart from the upper side of the ground plane and configured to have a first bandwidth; a second patch antenna pattern spaced apart from above the ground plane, arranged so that at least a portion of the first patch antenna pattern overlaps, and configured to have a second bandwidth corresponding to a frequency higher than a frequency of the first bandwidth; and a plurality of guide vias disposed to electrically connect the first patch antenna pattern and the ground plane to each other. Including, the plurality of guide vias may be arranged along one side of the first patch antenna pattern.

An antenna device according to an embodiment of the present invention includes a ground plane; a plurality of first patch antenna patterns spaced apart from each other above the ground plane and having a polygonal shape; and a plurality of guide vias arranged to electrically connect the plurality of first patch antenna patterns and the ground plane, respectively; The plurality of guide vias may be arranged along one side that is open between the ground plane and the other side of each of the plurality of first patch antenna patterns that does not face each other and is located in a direction opposite to the other side. .

An antenna device according to an embodiment of the present invention may have a structure advantageous for improving antenna performance (eg, gain, bandwidth, directivity, etc.) or miniaturization.

1 is a perspective view illustrating an antenna device according to an embodiment of the present invention.
2A is a cross-sectional view showing an antenna device according to an embodiment of the present invention.
2B is a side view illustrating an antenna device according to an embodiment of the present invention.
2C is a cross-sectional view showing dimensions of an antenna device according to an embodiment of the present invention.
3A is a plan view illustrating an antenna device and a second patch antenna pattern according to an embodiment of the present invention.
3B is a plan view illustrating an antenna device and a first patch antenna pattern according to an embodiment of the present invention.
3C is a plan view illustrating a disposition direction of an antenna device according to an embodiment of the present invention.
4A is a cross-sectional view illustrating E-field distribution of frequencies belonging to a first bandwidth of an antenna device according to an embodiment of the present invention.
4B is a cross-sectional view illustrating E-field distribution of frequencies belonging to a second bandwidth of an antenna device according to an embodiment of the present invention.
5A is a plan view illustrating a ground plane of an antenna device according to an embodiment of the present invention.
FIG. 5B is a plan view illustrating a feed line on the lower side of the ground plane of FIG. 5A.
FIG. 5C is a plan view illustrating a wiring via and a second ground plane below the feed line of FIG. 5B.
FIG. 5D is a plan view illustrating an IC placement area and an end-fire antenna on the lower side of the second ground plane of FIG. 5C.
6A to 6B are side views illustrating a lower structure of a connection member included in an antenna device according to an embodiment of the present invention.
7 is a side view illustrating the structure of an antenna device according to an embodiment of the present invention.
8A to 8C are plan views illustrating the arrangement of an antenna device according to an embodiment of the present invention in an electronic device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The detailed description of the present invention which follows refers to the accompanying drawings which illustrate, by way of illustration, specific embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable one skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different from each other but are not necessarily mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented in one embodiment in another embodiment without departing from the spirit and scope of the invention. Additionally, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. Accordingly, the detailed description set forth below is not to be taken in a limiting sense, and the scope of the present invention is limited only by the appended claims, along with all equivalents as claimed by those claims. Like reference numbers in the drawings indicate the same or similar function throughout the various aspects.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily practice the present invention.

1 is a perspective view showing an antenna device according to an embodiment of the present invention, FIG. 2A is a cross-sectional view showing an antenna device according to an embodiment of the present invention, and FIG. 2B is an antenna device according to an embodiment of the present invention. FIG. 3A is a plan view illustrating an antenna device and a second patch antenna pattern according to an embodiment of the present invention, and FIG. 3B is a plan view illustrating an antenna device and a first patch antenna pattern according to an embodiment of the present invention. to be.

Referring to FIGS. 1, 2a, 2b, 3a, and 3b, antenna devices 100a, 100b, 100c, and 100d according to an embodiment of the present invention include a ground plane 201a and a first patch antenna pattern. 111a, the second patch antenna pattern 112a, and a plurality of guide vias 130a, and at least one of the feed via 120a, the feed pattern 126a, the dielectric layer 151a, and the connecting member 200a. may contain one more.

The first patch antenna pattern 111a may be spaced apart from the upper side of the ground plane 201a and configured to have a first bandwidth. For example, the first bandwidth may be designed to have a center frequency within a range of 20 GHz or more and 40 GHz or less, and intrinsic elements of the first patch antenna pattern 111a (eg, size, shape, It can be determined by the separation distance for other components, the permittivity of the dielectric layer, etc.).

The first patch antenna pattern 111a may form a radiation pattern in the vertical direction (eg, z direction) as surface current flows to the upper surface, and transmits RF (Radio Frequency) signals in the vertical direction (eg, z direction). You can send and receive remotely.

The direction and/or magnitude of the surface current flowing through the first patch antenna pattern 111a may be determined based on the impedance (capacitance and/or inductance) corresponding to the intrinsic element of the first patch antenna pattern 111a.

For example, the first patch antenna pattern 111a may be configured as a polygon having a plurality of sides. The electromagnetic boundary condition of the polygonal side of the first patch antenna pattern 111a may cause the surface current to flow from one side to the other side of the first patch antenna pattern 111a.

The ground plane 201a may be spaced apart from the lower side of the first patch antenna pattern 111a and may overlap the first patch antenna pattern 111a in a vertical direction (eg, a z direction).

The ground plane 201a may be included in the connecting member 200a. For example, the connection member 200a may have a structure in which a metal layer and an insulating layer are alternately laminated in the same or similar manner as that of a printed circuit board (PCB).

Since the ground plane 201a may act as a reflector electromagnetically for the first patch antenna pattern 111a, the RF signal remote transmission/reception direction of the first patch antenna pattern 111a is further increased in a vertical direction (eg, z direction) can be focused.

The second patch antenna pattern 112a is spaced apart from the upper side of the ground plane 201a, is arranged so that at least a portion of the first patch antenna pattern 111a overlaps, and has a second bandwidth higher than the first bandwidth. can For example, the second bandwidth may be designed to include 60 GHz, and intrinsic elements of the second patch antenna pattern 112a (eg, size and shape of the second patch antenna pattern, separation distance to other components, dielectric layer It can be determined by the permittivity of , etc.).

The second patch antenna pattern 112a may form a radiation pattern in the vertical direction (eg, z direction) as the surface current flows to the upper surface, and transmits an RF (Radio Frequency) signal in the vertical direction (eg, z direction). You can send and receive remotely.

Since the second bandwidth is higher than the first bandwidth, the antenna devices 100a, 100b, 100c, and 100d according to an embodiment of the present invention have different antennas through the first and second patch antenna patterns 111a and 112a. It is possible to remotely transmit and receive a plurality of RF signals of different frequencies in up and down directions (eg, z-direction).

In addition, since at least a portion of the first patch antenna pattern 111a overlaps the second patch antenna pattern 112a in the vertical direction (eg, the z direction), the antenna devices 100a, 100b, and 100c according to an embodiment of the present invention , 100d) can remotely transmit and receive a plurality of RF signals of different frequencies in the vertical direction (eg, the z direction) without a significant increase in size in the horizontal direction (eg, the x-direction and/or the y-direction).

Meanwhile, since the second bandwidth is higher than the first bandwidth, the second wavelength of the RF signal remotely transmitted and received in the second patch antenna pattern 112a is the first wavelength of the RF signal remotely transmitted and received in the first patch antenna pattern 111a. may be shorter than the wavelength.

The first and second surface currents flowing through the first and second patch antenna patterns 111a and 112a, respectively, may be affected by the first and second wavelengths, respectively. It may be formed by resonance of the second patch antenna patterns 111a and 112a.

Accordingly, the first and second patch antenna patterns 111a and 112a may be designed so that the first and second surface currents flow in a resonance environment corresponding to the first and second wavelengths, respectively.

The plurality of guide vias 130a are disposed to electrically connect each of the first patch antenna patterns 111a and the ground plane 201a.

In addition, the plurality of guide vias 130a may be arranged along one side of the first patch antenna pattern 111a. The combination of the plurality of guide vias 130a can widen the width of the electrical path between the first patch antenna pattern 111a and the ground plane 201a, and the first surface current flowing through the first patch antenna pattern 111a It may have an appropriate impedance to efficiently flow through the plurality of guide vias 130a.

Accordingly, the first surface current flowing through the first patch antenna pattern 111a can efficiently flow to the ground plane 201a through the plurality of guide vias 130a. That is, the length corresponding to the resonance of the first patch antenna pattern 111a is the length of the first patch antenna pattern 111a, the length of the plurality of guide vias 130a, and the first patch antenna in the ground plane 201a It may correspond to the sum of the lengths of the portions overlapping the pattern 111a.

Therefore, the first patch antenna pattern 111a can more easily have a first bandwidth lower than the second bandwidth without a significant increase in size in the horizontal direction (eg, x direction and/or y direction), and the second patch antenna pattern ( 112a) may have a first bandwidth that is larger than the second bandwidth (eg, a ratio of 50%) even though it has a similar size (eg, a ratio of 80% to 120%).

In addition, the antenna devices 100a, 100b, 100c, and 100d according to an embodiment of the present invention have a small horizontal direction (eg, x-direction) corresponding to the second patch antenna pattern 112a having a relatively higher second bandwidth. and/or y-direction), the first patch antenna pattern 111a having a lower first bandwidth may be included without increasing the size in the horizontal direction, so that a plurality of RF signals of different frequencies are transmitted in the vertical direction ( Ex: z-direction), and can be more easily miniaturized while remotely transmitting and receiving.

Meanwhile, for example, the plurality of guide vias 130a may be three or more and may be arranged in a straight line. Accordingly, the plurality of guide vias 130a may have more appropriate impedance so that the first surface current flowing through the first patch antenna pattern 111a flows efficiently through the plurality of guide vias 130a.

For example, the plurality of guide vias 130a closes between one side of the first patch antenna pattern 111a and the ground plane 201a, and the other sides of the first patch antenna pattern 111a except for one side (eg : 3 sides) and the ground plane 201a.

Accordingly, since the first surface current flowing through the first patch antenna pattern 111a can be more efficiently concentrated in one direction, dispersion of the length factor affecting the resonance of the first patch antenna pattern 111a is prevented. It can be.

For example, the plurality of guide vias 130a may be separated from the second patch antenna pattern 112a. Accordingly, since the plurality of guide vias 130a may not more reliably interfere with the radiation pattern formation of the first and/or second patch antenna patterns 111a and 112a, the first and/or second patch antenna patterns ( Gains of 111a and 112a) may be improved.

For example, at least some of the plurality of guide vias 130a may overlap one side of the second patch antenna pattern 112a.

Since the first surface current flowing through the first patch antenna pattern 111a can be bent between the first patch antenna pattern 111a and the plurality of guide vias 130a, the first patch antenna pattern 111a and the plurality of guide vias The electromagnetic boundary condition of the boundary line where the vias 130a meet may be similar to the electromagnetic boundary condition of one side of the second patch antenna pattern 112a.

Accordingly, when at least a portion of the plurality of guide vias 130a overlaps one side of the second patch antenna pattern 112a, the first and second patch antenna patterns 111a and 112a operate electromagnetically and harmoniously with each other. Therefore, electromagnetic interference with each other can be effectively suppressed, and the gain of the first and second patch antenna patterns 111a and 112a can be improved.

The feed via 120a may be electrically connected to the second patch antenna pattern 112a. The feed via 120a may transfer the RF signal received from the IC (Integrated Circuit) to the second patch antenna pattern 112a during transmission, and the RF signal received from the second patch antenna pattern 112a during reception. can be passed to the IC.

The first patch antenna pattern 111a may have a through hole through which the feed via 120a passes. Accordingly, the second patch antenna pattern 112a may overlap the first patch antenna pattern 111a in the vertical direction (eg, z direction) while being electrically connected to the feed via 120a. The antenna devices 100a, 100b, 100c, and 100d according to the example can be more easily miniaturized.

The feed pattern 126a may be electrically connected to the feed via 120a, have a width larger than that of the feed via 120a, and may be positioned in the through hole of the first patch antenna pattern 111a.

Accordingly, the feed via 120a may indirectly transfer the RF signal received from the IC to the first patch antenna pattern 111a during transmission, and indirectly transfer it from the first patch antenna pattern 111a during reception. The received RF signal can be delivered to the IC.

That is, the feed via 120a may provide an electrical connection path for each IC of the first and second patch antenna patterns 111a and 112a.

For example, the feed vias 120a may be displaced from the center of the first patch antenna pattern 111a toward the plurality of guide vias 130a. Accordingly, the impedance between the first patch antenna pattern 111a and the feed via 120a is appropriately determined so that the first surface current flowing through the first patch antenna pattern 111a flows efficiently through the plurality of guide vias 130a. can

For example, the feed via 120a may be disposed to pass through a through hole of the ground plane 201a. Here, the second feed pattern 127a may be disposed in the through hole of the ground plane 201a.

Accordingly, the IC can be disposed below the ground plane 201a, and the ground plane 201a can effectively prevent electromagnetic interference between the IC and the first and second patch antenna patterns 111a and 112a. .

2C is a cross-sectional view showing dimensions of an antenna device according to an embodiment of the present invention.

Referring to FIG. 2C , the first patch antenna pattern 111a may have a first length L1, the second patch antenna pattern 112a may have a second length L2, and the feed via 120a ) may have a first width W1, the plurality of guide vias 130a may have a second width W2, and the feed pattern 126a may have a third width W3.

The feed pattern 126a may have a third width W3 greater than the first width W1 of the feed via 120a. Since the third width W3 is greater than the first width W1 , the feed via 120a is coupled to the first patch antenna pattern 111a by electromagnetic coupling without contacting the first patch antenna pattern 111a. can be electrically connected to

The first length L1 of the first patch antenna pattern 111a may be greater than or equal to 0.8 times and less than or equal to 1.2 times the second length L2 of the second patch antenna pattern 112a. Here, the second bandwidth includes 60 GHz, and the center frequency of the first bandwidth may belong to a range of 20 GHz or more and 40 GHz or less.

That is, due to the plurality of guide vias 130a, the first patch antenna pattern 111a has a first bandwidth that is significantly lower than the second bandwidth of the second patch antenna pattern 112a, while maintaining the second patch antenna pattern 112a. may have a size relatively similar to that of

Meanwhile, the separation distance H2 between the first and second patch antenna patterns 111a and 112a may be shorter than the separation distance H1 between the first patch antenna pattern 111a and the ground plane 201a.

Accordingly, the radiation pattern formed by the U-shaped structure formed by the first patch antenna pattern 111a, the plurality of guide vias 130a, and the ground plane 201a can be further concentrated in the vertical direction (eg, z direction). Therefore, the gain of the first patch antenna pattern 111a can be further improved.

3B is a plan view illustrating an antenna device and a first patch antenna pattern according to an embodiment of the present invention, and FIG. 3C is a plan view illustrating a disposition direction of an antenna device according to an embodiment of the present invention.

When the remote transmission/reception direction of the RF signal is in the vertical direction (eg z direction), the electric field of the plurality of first patch antenna patterns 111a is horizontal and in the same direction as the direction of the surface current (eg x direction or y direction) , and the magnetic field of the plurality of first patch antenna patterns 111a may be formed in a horizontal direction and in a direction perpendicular to the direction of the surface current (eg, y direction or x direction).

The gain of the plurality of first patch antenna patterns 111a may be higher as the number of the plurality of first patch antenna patterns 111a increases. However, electric and magnetic fields of the plurality of first patch antenna patterns 111a may cause electromagnetic interference with adjacent first patch antenna patterns. The electromagnetic interference may degrade gain and/or directivity of the plurality of first patch antenna patterns 111a.

Referring to FIG. 3B, the plurality of guide vias 130a open a space between the other side (eg, +x direction) of each of the plurality of first patch antenna patterns 111a not facing each other and the ground plane 201a, It may be arranged to close between one side opposite to the other side (eg, -x direction) and the ground plane 201a.

Accordingly, since the surface current of each of the plurality of first patch antenna patterns 111a can be further concentrated in a direction (eg, x direction) between one side and the other side, the plurality of first patch antenna patterns 111a The flow of the surface current in the y direction can be further suppressed.

Therefore, electromagnetic interference from the plurality of first patch antenna patterns 111a to adjacent first patch antenna patterns can be further suppressed, and the antenna devices 100a, 100b, 100c, and 100d according to an embodiment of the present invention can be further suppressed. The gain and/or directivity of may be improved.

For example, the plurality of first patch antenna patterns 111a are arranged in a first direction (eg, y direction), and one side and the other side of each of the plurality of first patch antenna patterns 111a are corresponding to the first It may be in a direction different from the first direction in the patch antenna pattern (eg, x direction).

Accordingly, since the direction (eg, x direction) of the surface current flowing through the plurality of first patch antenna patterns 111a is different from the first direction (eg, y direction), the plurality of first direction Electromagnetic interference of the patch antenna patterns 111a to each other can be reduced. Referring to FIG. 3C, the plurality of guide vias 130a of the antenna devices 100e and 100f according to an embodiment of the present invention may be arranged along one side close to an adjacent first patch antenna pattern in the first patch antenna pattern 111a of .

5A is a plan view showing a ground plane of an antenna device according to an embodiment of the present invention, FIG. 5B is a plan view showing a feed line below the ground plane of FIG. 5A, and FIG. 5C is a plan view showing a feed line below the feed line of FIG. 5B. FIG. 5D is a plan view showing the wiring vias and the second ground plane, and FIG. 5D is a plan view showing the IC arrangement area and the end-fire antenna below the second ground plane of FIG. 5C.

Referring to FIG. 5A , the ground plane 201a may have a through hole through which the feed vias 120a pass, and may electromagnetically shield between the patch antenna pattern and the feed line. The second shielding via 185a may extend downward (eg, in the -z direction).

Referring to FIG. 5B , the wiring ground plane 202a may surround at least a portion of the end-fire antenna feed line 220a and the feed line 221a, respectively. The end-fire antenna feed line 220a may be electrically connected to the second wiring via 232a, and the feed line 221a may be electrically connected to the first wiring via 231a. The wiring ground plane 202a may electromagnetically shield between the end-fire antenna feed line 220a and the feed line 221a. One end of the end-fire antenna feed line 220a may be connected to the second feed via 211a.

Referring to FIG. 5C , the second ground plane 203a may have a plurality of through holes through which the first wiring vias 231a and the second wiring vias 232a respectively pass, and the coupling ground pattern 235a may be formed. can have The second ground plane 203a may electromagnetically shield between the feed line and the IC.

Referring to FIG. 5D , the IC ground plane 204a may have a plurality of through holes through which the first and second wiring vias 231a and 232a respectively pass. The IC 310a may be disposed below the IC ground plane 204a and may be electrically connected to the first wiring via 231a and the second wiring via 232a. The end-fire antenna pattern 210a and the director pattern 215a may be disposed at substantially the same height as the IC ground plane 204a.

The IC ground plane 204a may provide a ground used in circuits and/or passive components of the IC 310a to the IC 310a and/or passive components. Depending on the design, the IC ground plane 204a may provide a transmission path for power and signals used in the IC 310a and/or passive components. Thus, the IC ground plane 204a can be electrically connected to the IC and/or passive components.

Meanwhile, the top-down relationship and shape of the wiring ground plane 202a, the second ground plane 203a, and the IC ground plane 204a may vary according to design.

6A to 6B are side views illustrating a lower structure of an antenna device according to an embodiment of the present invention.

Referring to FIG. 6A , the antenna device according to an embodiment of the present invention includes a connecting member 200, an IC 310, an adhesive member 320, an electrical connection structure 330, a sealing material 340, and passive components. 350 and at least a portion of the core member 410.

The connecting member 200 may have a structure in which the aforementioned ground plane, wiring ground plane, second ground plane, IC ground plane, and insulating layer are stacked.

The IC 310 is the same as the aforementioned IC and may be disposed below the connecting member 200 . The IC 310 may be electrically connected to the wire of the connecting member 200 to transmit or receive an RF signal, and may be electrically connected to the ground plane of the connecting member 200 to receive a ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may adhere the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 can electrically connect the IC 310 and the connecting member 200, and has a melting point lower than that of the wiring and the ground plane of the connecting member 200, and through a predetermined process using the low melting point. The IC 310 and the connection member 200 may be electrically connected.

The encapsulant 340 may encapsulate at least a portion of the IC 310 and improve heat dissipation performance and impact protection performance of the IC 310 . For example, the encapsulant 340 may be implemented with Photo Imageable Encapsulant (PIE), Ajinomoto Build-up Film (ABF), or epoxy molding compound (EMC).

The passive component 350 may be disposed on the lower surface of the connecting member 200 and may be electrically connected to the wiring and/or the ground plane of the connecting member 200 through the electrical connection structure 330 . For example, the passive component 350 may include at least some of capacitors (eg, Multi Layer Ceramic Capacitor (MLCC)), inductors, and chip resistors.

The core member 410 may be disposed on the lower side of the connection member 200, receive an intermediate frequency (IF) signal or base band signal from the outside and transfer it to the IC 310 or from the IC 310. It may be electrically connected to the connection member 200 to receive an IF signal or a baseband signal and transmit it to the outside. Here, the frequency of the RF signal (eg 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) is greater than the frequency of the IF signal (eg 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the core member 410 may transfer an IF signal or a baseband signal to or receive an IF signal or a baseband signal from the IC 310 through a wire that may be included in an IC ground plane of the connection member 200 . Since the first ground plane of the connection member 200 is disposed between the IC ground plane and the wiring, the IF signal or baseband signal and the RF signal can be electrically isolated within the antenna device.

Referring to FIG. 6B , an antenna device according to an embodiment of the present invention may include at least a portion of a shield member 360, a connector 420, and a chip antenna 430.

The shielding member 360 may be disposed below the connection member 200 to confine the IC 310 together with the connection member 200 . For example, the shielding member 360 may be disposed to cover the IC 310 and the passive component 350 together (eg, a conformal shield) or each cover (eg, a compartment shield). For example, the shielding member 360 may have the shape of a hexahedron with one surface open, and may have a hexahedral accommodation space through coupling with the connection member 200 . The shielding member 360 may be made of a material of high conductivity such as copper, may have a short skin depth, and may be electrically connected to the ground plane of the connecting member 200 . Accordingly, the shielding member 360 can reduce electromagnetic noise that the IC 310 and the passive component 350 may receive.

The connector 420 may have a connection structure of a cable (eg, coaxial cable, flexible PCB), may be electrically connected to the IC ground plane of the connecting member 200, and may perform a role similar to that of the sub-board described above. there is. That is, the connector 420 may receive an IF signal, a baseband signal, and/or power from a cable, or may provide an IF signal and/or a baseband signal to a cable.

The chip antenna 430 may transmit or receive an RF signal by assisting the antenna device according to an embodiment of the present invention. For example, the chip antenna 430 may include a dielectric block having a higher permittivity than an insulating layer, and a plurality of electrodes disposed on both sides of the dielectric block. One of the plurality of electrodes may be electrically connected to the wire of the connecting member 200 and the other electrode may be electrically connected to the ground plane of the connecting member 200 .

7 is a side view illustrating the structure of an antenna device according to an embodiment of the present invention.

Referring to FIG. 7 , in the antenna device according to an embodiment of the present invention, an end-fire antenna 100f, a patch antenna pattern 1110f, an IC 310f, and a passive component 350f are integrated into a connecting member 500f. may have a structure.

The end-fire antenna 100f and the patch antenna pattern 1110f may be designed in the same manner as the aforementioned antenna device and the aforementioned patch antenna pattern, respectively, and receive and transmit RF signals from the IC 310f or receive RF signals from the IC 310f. The signal may be passed to IC 310f.

The connecting member 500f may have a structure in which at least one conductive layer 510f and at least one insulating layer 520f are stacked (eg, a printed circuit board structure). The conductive layer 510f may have the aforementioned ground plane and feed line.

In addition, the antenna device according to an embodiment of the present invention may further include a flexible connection member 550f. The flexible connecting member 550f may include a first flexible region 570f overlapping the connecting member 500f and a second flexible region 580f not overlapping the connecting member 500f when viewed in a vertical direction.

The second flexible region 580f may be flexibly bent in the vertical direction. Accordingly, the second flexible region 580f may be flexibly connected to a connector of the set board and/or an adjacent antenna device.

The flexible connection member 550f may include a signal line 560f. An intermediate frequency (IF) signal and/or a baseband signal may be transferred to the IC 310f through the signal line 560f or may be transferred to a connector of a set board and/or an adjacent antenna device.

8A to 8C are plan views illustrating the arrangement of an antenna device according to an embodiment of the present invention in an electronic device.

Referring to FIG. 8A , an antenna device including an antenna unit 100g may be disposed adjacent to a side boundary of the electronic device 700g on a set substrate 600g of the electronic device 700g.

Electronic devices (700g) include a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, and a computer. ), monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc., but Not limited.

A communication module 610g and a baseband circuit 620g may be further disposed on the set substrate 600g. The antenna device may be electrically connected to the communication module 610g and/or the baseband circuit 620g through a coaxial cable 630g.

The communication module 610g includes memory chips such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory to perform digital signal processing; Application processor chips such as central processors (eg, CPU), graphic processors (eg, GPUs), digital signal processors, encryption processors, microprocessors, and microcontrollers; It may include at least some of logic chips such as an analog-to-digital converter and an application-specific IC (ASIC).

The baseband circuit 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on an analog signal. Base signals input and output from the baseband circuit 620g may be transferred to an antenna device through a cable.

For example, the base signal may be transmitted to an IC through an electrical connection structure, a core via, and wiring. The IC may convert the base signal into a millimeter wave (mmWave) band RF signal.

Referring to FIG. 8B , a plurality of antenna devices each including an antenna unit 100h are disposed adjacent to one side boundary and the other side boundary of the electronic device 700h on a set substrate 600h of the electronic device 700h. A communication module 610h and a baseband circuit 620h may be further disposed on the set substrate 600h. The plurality of antenna devices may be electrically connected to the communication module 610h and/or the baseband circuit 620h through a coaxial cable 630h.

Referring to FIG. 8C , a plurality of antenna devices each including an antenna unit 100i may be disposed adjacent to the center of a side of the polygonal electronic device 700i on a set substrate 600i of the electronic device 700i. , A communication module 610i and a baseband circuit 620i may be further disposed on the set board 600i. The antenna device may be electrically connected to the communication module 610i and/or the baseband circuit 620i through a coaxial cable 630i.

On the other hand, the patch antenna pattern, feed via, guide via, feed pattern, ground plane, and electrical connection structure disclosed in this specification are made of metal materials (eg, copper (Cu), aluminum (Al), silver (Ag), tin ( Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof), and may include chemical vapor deposition (CVD), physical vapor deposition (PVD) ), sputtering, subtractive, additive, SAP (Semi-Additive Process), MSAP (Modified Semi-Additive Process), etc. may be formed according to a plating method, but is not limited thereto. don't

On the other hand, the insulating layer and dielectric layer disclosed in this specification are thermosetting resins such as FR4, LCP (Liquid Crystal Polymer), LTCC (Low Temperature Co-fired Ceramic), epoxy resin, thermoplastic resin such as polyimide, or these resins are inorganic Resin, prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine), photosensitive insulation impregnated with core material such as glass fiber (Glass Fiber, Glass Cloth, Glass Fabric) with filler (Photo Imagable Dielectric: PID) resin, a general Copper Clad Laminate (CCL), or a glass or ceramic-based insulating material may be implemented. The insulating layer and the dielectric layer may fill at least a portion of a position where a patch antenna pattern, a feed via, a guide via, a feed pattern, a ground plane, and an electrical connection structure are not disposed in the antenna device disclosed herein.

Meanwhile, the RF signals disclosed in this specification include Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, long term evolution (LTE), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, It may be formatted according to GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, any other wireless and wired protocols designated as, but not limited to, 3G, 4G, 5G and beyond.

In the above, the present invention has been described by specific details such as specific components and limited embodiments and drawings, but these are provided to help a more general understanding of the present invention, and the present invention is not limited to the above embodiments. , Those skilled in the art to which the present invention pertains may seek various modifications and variations from these descriptions.

100a: antenna device
111a: first patch antenna pattern
112a: second patch antenna pattern
120a: feed via
126a: feed pattern
130a: multiple guide vias
151a: dielectric layer
200a: connection member
201a: ground plane

Claims (10)

ground plane;
a plurality of first patch antenna patterns spaced apart from each other above the ground plane and configured to have a first bandwidth and each having a polygonal shape;
a plurality of feed vias configured to supply power to corresponding first patch antenna patterns among the plurality of first patch antenna patterns;
A plurality of second patches configured to be spaced apart from the ground plane and arranged to overlap at least a portion of the plurality of first patch antenna patterns and to have a second bandwidth corresponding to a frequency higher than the frequency of the first bandwidth antenna pattern; and
a plurality of guide vias arranged to electrically connect each of the plurality of first patch antenna patterns and the ground plane; including,
The plurality of guide vias are arranged along edges adjacent to the plurality of feed vias among edges of each of the plurality of first patch antenna patterns.
According to claim 1,
The plurality of guide vias include guide vias connected to each of the plurality of first patch antenna patterns, and the guide vias are arranged to form a straight line.
According to claim 1,
The plurality of guide vias are arranged to open between edges other than the edges adjacent to the plurality of feed vias and the ground plane.
According to claim 1,
At least some of the plurality of guide vias overlap one edge of the plurality of second patch antenna patterns.
According to claim 1,
The plurality of second patch antenna patterns are positioned higher than the plurality of first patch antenna patterns;
A separation distance between the plurality of first and second patch antenna patterns is shorter than a separation distance between the plurality of first patch antenna patterns and the ground plane.
According to claim 1,
The second bandwidth includes 60 GHz,
A center frequency of the first bandwidth belongs to a range of 20 GHz or more and 40 GHz or less.
According to claim 6,
The first direction length of each of the plurality of first patch antenna patterns is 0.8 times or more and 1.2 times or less of the first direction length of each of the plurality of second patch antenna patterns.
According to claim 1,
The plurality of feed vias are electrically connected to corresponding second patch antenna patterns among the plurality of second patch antenna patterns;
The plurality of first patch antenna patterns have a through hole through which a corresponding feed via among the plurality of feed vias passes;
The plurality of feed vias are configured to indirectly feed power to a corresponding first patch antenna pattern.
According to claim 8,
Each of the plurality of feed vias is disposed biased toward a plurality of guide vias electrically connected to the corresponding first patch antenna pattern at the center of the corresponding first patch antenna pattern among the plurality of first patch antenna patterns.
According to claim 8,
It is electrically connected to a corresponding feed via among the plurality of feed vias, has a width larger than that of each of the plurality of feed vias, and is formed in a through hole of a corresponding first patch antenna pattern among the plurality of first patch antenna patterns. An antenna device further comprising a plurality of positioned feed patterns.

Images