KR102314700B1 - Antenna apparatus and antenna module - Google Patents

Abstract

An antenna device according to an embodiment of the present invention, a ground layer; a patch antenna pattern spaced apart from the top surface of the ground layer; a feed via disposed to penetrate the ground layer and providing a feed path to the patch antenna pattern; and a plurality of conductive ring patterns disposed at different heights above the ground layer and each having through regions overlapping the patch antenna pattern in the vertical direction; Including, the area of the through area of the upper conductive ring pattern among the plurality of conductive ring patterns is larger than the area of the through area of the lower conductive ring pattern, and the height between the lowermost conductive ring pattern and the ground layer among the plurality of conductive ring patterns The difference may be greater than a height difference between two conductive ring patterns adjacent to each other among the plurality of conductive ring patterns.

Description

Antenna apparatus and antenna module

The present invention relates to an antenna device and an antenna module.

Data traffic of mobile communication is rapidly increasing every year. Active technology development is in progress to support this breakthrough data in real time in the wireless network. For example, contentization of IoT (Internet of Thing)-based data, AR (Augmented Reality), VR (Virtual Reality), live VR/AR combined with SNS, autonomous driving, Sync View (User's point of view using a small camera) Applications such as real-time video transmission) require communication (eg, 5G communication, mmWave communication, etc.) that supports sending and receiving large amounts of data.

Therefore, recently, millimeter wave (mmWave) communication including fifth generation (5G) communication has been actively studied, and research for commercialization/standardization of an antenna module that smoothly implements this is being actively conducted.

Since RF signals in high frequency bands (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lost in the course of transmission, the quality of communication may drop sharply. Therefore, an antenna for communication in a high frequency band requires a technical approach different from that of the existing antenna technology, and a separate method for securing antenna gain, integrating antenna and RFIC, and securing EIRP (Effective Isotropic Radiated Power), etc. It may require the development of special technologies such as power amplifiers.

Republic of Korea Patent Publication No. 10-0702406

The present invention provides an antenna device and an antenna module that can improve antenna performance (eg, transmit/receive rate, gain, bandwidth, directivity, etc.) or have a structure advantageous for miniaturization.

An antenna device according to an embodiment of the present invention, a ground layer; a patch antenna pattern spaced apart from the top surface of the ground layer; a feed via disposed to pass through the ground layer and providing a feeding path to the patch antenna pattern; and a plurality of conductive ring patterns disposed at different heights above the ground layer and each having a through region overlapping the patch antenna pattern in a vertical direction; Including, the area of the through region of the upper conductive ring pattern among the plurality of conductive ring patterns is larger than the area of the through area of the lower conductive ring pattern, the lowermost conductive ring pattern and the ground of the plurality of conductive ring patterns A height difference between the layers may be greater than a height difference between two adjacent conductive ring patterns among the plurality of conductive ring patterns.

An antenna device according to an embodiment of the present invention, a ground layer; a patch antenna pattern spaced apart from the top surface of the ground layer; a feed via disposed to pass through the ground layer and providing a feeding path to the patch antenna pattern; a plurality of conductive ring patterns disposed at different heights above the ground layer and each having a through region overlapping the patch antenna pattern in a vertical direction; a plurality of first chain vias disposed between a lowermost conductive ring pattern among the plurality of conductive ring patterns and a conductive ring pattern higher than the lowest conductive ring pattern and arranged to surround the through region; and a plurality of second chain vias disposed above the plurality of first chain vias and arranged to surround the through region; Including, the area of the through region of the upper conductive ring pattern among the plurality of conductive ring patterns is greater than the area of the through region of the lower conductive ring pattern, the area surrounded by the plurality of first chain vias and the plurality of A difference in width between the areas surrounded by the second chain vias may be smaller than a difference in width between penetration regions of two conductive ring patterns adjacent to each other among the plurality of conductive ring patterns.

An antenna module according to an embodiment of the present invention, a ground layer; a plurality of patch antenna patterns spaced apart from each other on the upper surface of the ground layer; a plurality of feed vias disposed to pass through the ground layer and providing a feeding path to a corresponding patch antenna pattern among the plurality of patch antenna patterns; and a plurality of conductive perforated plate patterns disposed at different heights above the ground layer and each having a plurality of through-regions overlapping a corresponding patch antenna pattern from among the plurality of patch antenna patterns in a vertical direction; Including, wherein the total area of the plurality of penetration regions of the upper conductive porous plate pattern among the plurality of conductive porous plate patterns is greater than the total area of the plurality of penetration regions of the lower conductive porous plate pattern, and the plurality of conductive A height difference between the lowest conductive porous plate pattern among the stencil patterns and the ground layer may be greater than a height difference between two adjacent conductive porous plate patterns among the plurality of conductive porous plate patterns.

An antenna module according to an embodiment of the present invention, a ground layer; a plurality of patch antenna patterns spaced apart from each other on the upper surface of the ground layer; a plurality of feed vias disposed to pass through the ground layer and providing a feeding path to a corresponding patch antenna pattern among the plurality of patch antenna patterns; a plurality of conductive perforated plate patterns disposed at different heights above the ground layer and each having a plurality of penetrating regions overlapping a corresponding patch antenna pattern among the plurality of patch antenna patterns in a vertical direction; a plurality of first chain vias disposed between a lowermost conductive porous plate pattern among the plurality of conductive porous plate patterns and a conductive porous plate pattern higher than the lowest conductive porous plate pattern and arranged to surround the plurality of through regions, respectively; and a plurality of second chain vias disposed above the plurality of first chain vias and arranged to surround the plurality of through regions. Including, the total area of the plurality of penetration regions of the upper conductive porous plate pattern among the plurality of conductive porous plate patterns is greater than the total area of the plurality of penetration regions of the lower conductive porous plate pattern, and the plurality of first The difference in the area between the total area surrounded by the chain vias and the total area respectively surrounded by the plurality of second chain vias is the difference in width between the plurality of penetration regions of two adjacent conductive porous plate patterns among the plurality of conductive porous plate patterns. may be smaller than

The antenna device and the antenna module according to an embodiment of the present invention can have more improved antenna performance because the RF signal can be further concentrated in the z-direction without a substantial increase in size.

The antenna device and the antenna module according to an embodiment of the present invention can reduce the leakage of an RF signal to the adjacent antenna device, so it is possible to improve the electromagnetic isolation degree for the adjacent antenna device, and to be disposed closer to the adjacent antenna device Alternatively, it may have a reduced size by omitting a separate component for electromagnetic shielding.

1 is a side view showing an antenna device according to an embodiment of the present invention.
2A is a side view illustrating a dimension and a positional relationship of an antenna device according to an embodiment of the present invention.
2B is a diagram illustrating an equivalent circuit of an antenna device according to an embodiment of the present invention.
3 is a plan view illustrating an antenna device and an antenna module according to an embodiment of the present invention.
4 is a side view illustrating an antenna module according to an embodiment of the present invention.
5A to 5D are plan views illustrating each layer of an antenna module according to an embodiment of the present invention.
6A to 6B are diagrams illustrating an IC peripheral structure of an antenna module according to an embodiment of the present invention.
7 is a side view illustrating the structure of an antenna device and an antenna module according to an embodiment of the present invention.
8A and 8B are plan views illustrating an arrangement of an antenna module in an electronic device according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0023] Reference is made to the accompanying drawings, which show by way of illustration specific embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein with respect to one embodiment may be embodied in other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention is limited only by the appended claims, along with all equivalents as claimed by the claims. Like reference numerals in the drawings refer to the same or similar functions throughout the various aspects.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those of ordinary skill in the art to easily practice the present invention.

1 is a side view showing an antenna device according to an embodiment of the present invention.

Referring to FIG. 1 , the antenna device according to an embodiment of the present invention may include a patch antenna pattern 110a, feed vias 121a and 122a, and a conductive ring pattern 130a. The conductive ring pattern 130a includes a first conductive ring pattern 131a, a second conductive ring pattern 136a, a third conductive ring pattern 132a, a fourth conductive ring pattern 133a, and a fifth conductive ring pattern ( 134a) and at least a portion of the sixth conductive ring pattern 135a.

The feed vias 121a and 122a may be configured to allow a radio frequency (RF) signal to pass therethrough. For example, the feed vias 121a and 122a may electrically connect the IC and the patch antenna pattern 110a, and may have a structure extending in the z direction.

The patch antenna pattern 110a may be electrically connected to one end of the feed vias 121a and 122a. The patch antenna pattern 110a may receive the RF signal from the feed vias 121a and 122a and transmit it in the z direction, and may transmit the RF signal received in the z direction to the feed vias 121a and 122a.

The core region 140a may be provided between the patch antenna pattern 110a and the ground layer 125a, and may be spaced apart from the patch antenna pattern 110a and the ground layer 125a. For example, the core region 140a may be filled with an insulating layer.

Some of the RF signals transmitted from the patch antenna pattern 110a may be directed toward the ground layer 125a disposed below. The RF signal directed to the ground layer 125a may be reflected by the ground layer 125a and directed in the z-direction. Accordingly, the RF signal transmitted from the patch antenna pattern 110a may be further concentrated in the z-direction.

For example, the patch antenna pattern 110a may have a patch antenna structure having both circular or polygonal surfaces. Both sides of the patch antenna pattern 110a may act as a boundary through which an RF signal passes between a conductor and a non-conductor. The patch antenna pattern 110a may have an intrinsic frequency band (eg, 28 GHz) according to intrinsic factors (eg, shape, size, height, dielectric constant of an insulating layer, etc.).

The conductive ring pattern 130a may be spaced apart from the patch antenna pattern 110a and have a penetration region to surround the patch antenna pattern 110a when viewed in the vertical direction (eg, the z direction).

The conductive ring pattern 130a may be electromagnetically coupled to the patch antenna pattern 110a, and may provide capacitance between the conductive ring pattern 130a and the patch antenna pattern 110a.

Here, the elements of the conductive ring pattern 130a (eg, height, shape, size, number, spacing, spacing between the patch antenna patterns, etc.) may affect the frequency characteristics of the patch antenna pattern 110a. .

The first conductive ring pattern 131a is disposed to be spaced apart from the patch antenna pattern 110a in the lateral direction (eg, the x-direction and/or the y-direction), and when viewed in the vertical direction (eg, the z-direction), the patch antenna pattern 110a It may have a first penetration region to surround the .

The second conductive ring pattern 136a may be disposed on the upper side of the first conductive ring pattern 131a and may have a second penetration region to surround the patch antenna pattern 110a when viewed in the vertical direction (eg, the z direction). .

The third to sixth conductive ring patterns 132a, 133a, 134a, and 135a may be disposed above or below the first and second conductive ring patterns 131a and 136a, respectively, and among the third to sixth through-regions. It may have a corresponding penetration area. At least some of the third to sixth conductive ring patterns 132a, 133a, 134a, and 135a may be omitted according to design.

Here, an area of the second through-region may be greater than an area of the first through-area. If the conductive ring pattern 130a includes the third to sixth conductive ring patterns 132a, 133a, 134a, and 135a, the area of the third to sixth through-regions is larger than that of the first through-region and the second through area. may be smaller than the width. That is, the conductive ring pattern 130a may have a structure similar to that of a corrugated waveguide.

Accordingly, since the RF signal transmitted from the patch antenna pattern 110a may be further induced in the z-direction, the gain of the patch antenna pattern 110a may be improved. That is, the antenna device according to an embodiment of the present invention can improve antenna performance without a substantial increase in size.

In addition, the antenna device according to an embodiment of the present invention utilizes the corrugated side boundary of the conductive ring pattern 130a to reduce the phase distortion error due to the path difference of the main beam of the patch antenna pattern 110a. and can reduce the high-order mode reverse propagation of the RF signal.

On the other hand, referring to FIG. 1 , the antenna device according to an embodiment of the present invention is disposed to electrically connect between the first conductive ring pattern 131a and the second conductive ring pattern 136a and is disposed in the vertical direction ( For example, a plurality of chain vias 139a arranged to surround the patch antenna pattern 110a when viewed in the z-direction may be further included.

Due to the size difference between the first through region and the second through region and the plurality of chain vias 139a, the top surface area of the first conductive ring pattern 131a may be larger than the top surface area of the second conductive ring pattern 136a. .

The plurality of chain vias 139a may reduce the number of RF signals transmitted from the patch antenna pattern 110a in a lateral direction (eg, an x-direction and/or a y-direction).

If the conductive ring pattern 130a includes the third to sixth conductive ring patterns 132a, 133a, 134a, and 135a, the plurality of chain vias 139a may include a plurality of first to fifth chain vias. can For example, the plurality of first chain vias is disposed to electrically connect between the first conductive ring pattern 131a and the third conductive ring pattern 132a, and the plurality of second chain vias includes the second conductive ring pattern. It may be disposed to electrically connect between the 136a and the third conductive ring pattern 132a. Here, the plurality of first to fifth chain vias may overlap each other when viewed in the vertical direction (eg, the z direction). Accordingly, spaces between the first to sixth conductive ring patterns 131a, 136a, 132a, 133a, 134a, and 135a may have different sizes.

A portion of the RF signal transmitted from the patch antenna pattern 110a may be reflected from the first and/or second conductive ring patterns 131a and 136a. The plurality of chain vias 139a may reflect RF signals reflected from the first and/or second conductive ring patterns 131a and 136a. The RF signal reflected from the plurality of chain vias 139a may be directed in the z-direction or toward the ground layer 125a. The RF signal directed to the ground layer 125a may be reflected from the ground layer 125a and may be directed in the z-direction. Accordingly, the plurality of chain vias 139a may further concentrate the RF signal transmitted from the patch antenna pattern 110a in the z-direction.

Meanwhile, referring to FIG. 1 , the antenna device according to an embodiment of the present invention is disposed to electrically connect the first conductive ring pattern 131a and the ground layer 125a in the vertical direction (eg, the z direction). It may further include a grounding via 145a arranged to surround the patch antenna pattern 110a when viewed as . Accordingly, the conductive ring pattern 130a and the plurality of chain vias 139a may more efficiently guide the RF signal transmitted from the patch antenna pattern 110a in the z direction.

Meanwhile, referring to FIG. 1 , the antenna device according to an embodiment of the present invention is disposed above the patch antenna pattern 110a and overlaps the patch antenna pattern 110a when viewed in the vertical direction (eg, the z direction). It may further include a coupling patch pattern 115a. Accordingly, the antenna device according to an embodiment of the present invention may have a wider bandwidth.

The coupling patch pattern 115a and the second conductive ring pattern 136a may be disposed on the same level, and the patch antenna pattern 110a and the first conductive ring pattern 131a may be disposed on the same level. Accordingly, the first and second conductive ring patterns 131a and 136a may more efficiently concentrate the RF signal transmitted from the patch antenna pattern 110a in the z direction.

2A is a side view illustrating a dimension and a positional relationship of an antenna device according to an embodiment of the present invention.

Referring to FIG. 2A , the angle A with respect to the vertical direction (z direction) of a line connecting the boundary of the first conductive ring pattern and the boundary of the second conductive ring pattern may be 20 degrees or more and 30 degrees or less. Accordingly, the antenna device according to an embodiment of the present invention may further concentrate the RF signal transmitted from the patch antenna pattern in the z-direction.

In addition, the antenna device according to an embodiment of the present invention may have variously adjusted angle A as well as a range of 20 degrees or more and 30 degrees or less, and thus may have various electric field characteristics.

In addition, the first distance (B) from the point where the line connecting the boundary of the first conductive ring pattern and the boundary of the second conductive ring pattern meet to the ground layer is the second distance (C) from the ground layer to the patch antenna pattern. ) can be greater than Accordingly, the RF signal transmitted from the patch antenna pattern may be more concentrated in the z direction.

In addition, the third distance D between the first to sixth conductive ring patterns is shorter than the fourth distance E1 between the first conductive ring pattern and the patch antenna pattern, and between the second conductive ring pattern and the coupling patch pattern. may be shorter than the fifth distance E2 of . Accordingly, the RF signal transmitted from the patch antenna pattern may be more concentrated in the z direction.

In addition, the upper surface area L2 of the coupling patch pattern may be greater than the upper surface area L1 of the patch antenna pattern, and the fourth distance E1 may be shorter than the fifth distance E2 . Accordingly, the RF signal transmitted from the patch antenna pattern may be more concentrated in the z direction.

2B is a diagram illustrating an equivalent circuit of an antenna device according to an embodiment of the present invention.

Referring to FIG. 2B , the patch antenna pattern 110b of the antenna device according to an embodiment of the present invention may transmit or receive an RF signal to a source SRC2 such as an IC, and a resistance value R2 . and inductances L3 and L4.

The conductive ring pattern 130b includes capacitances C5 and C12 for the patch antenna pattern 110b, capacitances C6 and 10 between the conductive ring patterns, inductances L5 and L6 of the chain vias, and the conductive ring pattern. It may have capacitances C7 and C11 between the ground layer and the ground layer.

The frequency band and bandwidth of the antenna device according to an embodiment of the present invention may be determined by the aforementioned resistance value, capacitance, and inductance.

3 is a plan view illustrating an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 3 , the antenna module according to an embodiment of the present invention includes a plurality of end-fire antennas each including an end-fire antenna pattern 161a, a director pattern 162a, and a second feedline 172a. may further include.

The end-fire antenna pattern 161a may form a radiation pattern in the second direction (eg, the x direction) to transmit or receive an RF signal in the second direction (eg, the x direction). Accordingly, the antenna module according to an embodiment of the present invention can expand the RF signal transmission/reception direction in an omni-directional manner.

For example, the end-fire antenna pattern 161a may have a dipole shape or a folded dipole shape. Here, one end of each pole of the end-fire antenna pattern 161a may be electrically connected to the second feed line 172a. The frequency band of the end-fire antenna pattern 161a may be designed to be substantially the same as that of the patch antenna pattern 110a, but is not limited thereto.

The director pattern 162a may be electromagnetically coupled to the end-fire antenna pattern 161a to improve a gain or bandwidth of the end-fire antenna pattern 161a.

The second feed line 172a may transfer the RF signal received from the end-fire antenna pattern 161a to the IC, and may transfer the RF signal received from the IC to the end-fire antenna pattern 161a.

Also, referring to FIG. 3 , the antenna module according to an embodiment of the present invention is disposed on the upper side of the ground layer 125a and surrounds the patch antenna pattern 110a when viewed in the vertical direction (eg, the z direction). A first conductive porous plate pattern 131b having a plurality of first through regions S1 and a patch antenna pattern disposed above the first conductive porous plate pattern 131b and viewed in the vertical direction (eg, z-direction) A second conductive porous plate pattern 136b having a plurality of second through regions S2 surrounding the 110a, respectively, may be included.

According to the design, the antenna module according to an embodiment of the present invention is disposed between the first conductive porous plate pattern 131b and the second conductive porous plate pattern 136b and has third to fifth through-regions, respectively. Third to fifth conductive porous plate patterns 133b, 134b, and 135b may be further included.

A total area of the plurality of second through areas S2 may be greater than a total area of the plurality of first through areas S1 . If the antenna module according to an embodiment of the present invention further includes the third to fifth conductive perforated plate patterns 133b, 134b, and 135b, the total area of the third to fifth penetration regions is a plurality of second penetrations. It may be smaller than the total area of the area S2 and larger than the total area of the plurality of first through areas S1 .

That is, the first to fifth conductive porous plate patterns 131b, 133b, 134b, 135b, and 136b may have a structure similar to that of a corrugated waveguide. Accordingly, the RF signal passing through the plurality of patch antenna patterns 110a may be further concentrated in the z-direction.

Meanwhile, the patch antenna pattern 110a may include a plurality of slits 111a formed on both sides of the connection position of the feed via 120a. Accordingly, the impedance of the patch antenna pattern 110a may be optimized.

4 is a side view showing an antenna module according to an embodiment of the present invention.

Referring to FIG. 4 , the ground layer 221a may be disposed under the patch antenna pattern 110a, the wiring ground layer 220a may be disposed under the ground layer 221a, and the second ground layer The 222a may be disposed below the wiring ground layer 220a.

The IC 300a may be disposed under the second ground layer 222a and may be electrically connected to the wiring via 230a.

The passive component 350a and the sub-board 250a may be disposed below the second ground layer 222a, respectively, and may be electrically connected to the IC 300a.

Since the ground layer 221a, the wiring ground layer 220a, and the second ground layer 222a have a larger area than the patch antenna pattern 110a, the antenna module according to an embodiment of the present invention includes the first and second ground layers. Even if the two conductive ring patterns 131a and 136a are additionally provided, a substantial increase in size may not be caused. Accordingly, the antenna module according to an embodiment of the present invention can improve antenna performance without substantially increasing the size.

5A to 5D are plan views illustrating each layer of an antenna module according to an embodiment of the present invention.

Referring to FIG. 5A , the ground layer 201a may have a through hole through which the feed vias 121a and 122a pass, and may be connected to the other end of the grounding via 185a. The ground layer 201a may electromagnetically shield between the patch antenna pattern and the feed line.

Referring to FIG. 5B , the wiring ground layer 202a may surround at least a portion of the second feed line 220a and the first feed line 221a, respectively. The second feed line 220a may be electrically connected to the second wiring via 232a , and the first feed line 221a may be electrically connected to the first wiring via 231a . The wiring ground layer 202a may electromagnetically shield between the second feed line 220a and the first feed line 221a. One end of the second feed line 220a may be connected to the second feed via 211a.

Referring to FIG. 5C , the second ground layer 203a may have a plurality of through holes through which the first wiring via 231a and the second wiring via 232a pass, respectively, and the coupling ground pattern 235a is formed in the second ground layer 203a. can have The second ground layer 203a may electromagnetically shield the feed line and the IC.

Referring to FIG. 5D , the IC ground layer 204a may have a plurality of through holes through which the first wiring via 231a and the second wiring via 232a pass respectively. The IC 310a may be disposed under the IC ground layer 204a and may be electrically connected to the first wiring via 231a and the second wiring via 232a. The end-fire antenna pattern 210a and the director pattern 215a may be disposed at substantially the same height as the IC ground layer 225 .

The IC ground layer 204a may provide a ground used in circuits and/or passive components of the IC 310a to the IC 310a and/or passive components. Depending on the design, the IC ground layer 204a may provide a path for power and signals used in the IC 310a and/or passive components. Accordingly, the IC ground layer 204a may be electrically coupled to the IC and/or passive components.

Meanwhile, the wiring ground layer 202a, the second ground layer 203a, and the IC ground layer 204a may have a recessed shape to provide a cavity. Accordingly, the end-fire antenna pattern 210a may be disposed closer to the IC ground layer 204a.

Meanwhile, the vertical relationship and shape of the wiring ground layer 202a, the second ground layer 203a, and the IC ground layer 204a may vary depending on the design.

6A to 6B are diagrams illustrating an IC peripheral structure of an antenna module according to an embodiment of the present invention.

Referring to FIG. 6A , the antenna module according to an embodiment of the present invention includes a connection member 200 , an IC 310 , an adhesive member 320 , an electrical connection structure 330 , an encapsulant 340 , and a passive component. At least a portion of the 350 and the sub-substrate 410 may be included.

The connection member 200 may include at least a portion of the ground layer, the wiring ground layer, the second ground layer, and the IC ground layer described above with reference to FIGS. 4 to 5 .

The IC 310 is the same as the aforementioned IC, and may be disposed below the connection member 200 . The IC 310 may be electrically connected to the wiring of the connecting member 200 to transmit or receive an RF signal, and may be electrically connected to the ground layer of the connecting member 200 to receive a ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may adhere the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200 . For example, the electrical connection structure 330 may have a structure such as a solder ball, a pin, a land, or a pad. The electrical connection structure 330 has a melting point lower than that of the wiring and the ground layer of the connection member 200 , so that the IC 310 and the connection member 200 can be electrically connected through a predetermined process using the low melting point.

The encapsulant 340 may encapsulate at least a portion of the IC 310 , and may improve heat dissipation performance and impact protection performance of the IC 310 . For example, the encapsulant 340 may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like.

The passive component 350 may be disposed on the lower surface of the connection member 200 , and may be electrically connected to the wiring and/or the ground layer of the connection member 200 through the electrical connection structure 330 . For example, the passive component 350 may include at least a portion of a capacitor (eg, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

The sub-board 410 may be disposed below the connection member 200 , and receives an intermediate frequency (IF) signal or a base band signal from the outside and transmits it to the IC 310 or from the IC 310 . It may be electrically connected to the connection member 200 so as to receive the IF signal or the baseband signal and transmit it to the outside. Here, the frequency of the RF signal (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the sub-board 410 may transmit an IF signal or a baseband signal to or from the IC 310 through a wiring that may be included in the IC ground layer of the connection member 200 . Since the first ground layer of the connecting member 200 is disposed between the IC ground layer and the wiring, the IF signal or the baseband signal and the RF signal can be electrically isolated in the antenna module.

Referring to FIG. 6B , the antenna module according to an embodiment of the present invention may include at least a portion of a shielding member 360 , a connector 420 , and a chip antenna 430 .

The shielding member 360 may be disposed below the connecting member 200 to confine the IC 310 together with the connecting member 200 . For example, the shielding member 360 may be disposed to cover the IC 310 and the passive component 350 together (eg, a conformal shield) or respectively cover (eg, a compartment shield). For example, the shielding member 360 may have a hexahedral shape with one open surface, and may have a hexahedral accommodation space through coupling with the connecting member 200 . The shielding member 360 may be implemented with a material of high conductivity, such as copper, to have a short skin depth, and may be electrically connected to the ground layer of the connecting member 200 . Accordingly, the shielding member 360 may reduce electromagnetic noise that the IC 310 and the passive component 350 may receive.

The connector 420 may have a connection structure of a cable (eg, a coaxial cable, a flexible PCB), may be electrically connected to the IC ground layer of the connection member 200, and may perform a role similar to the above-described sub-board. have. That is, the connector 420 may receive an IF signal, a baseband signal, and/or power from a cable, or may provide an IF signal and/or a baseband signal through a cable.

The chip antenna 430 may transmit or receive an RF signal by assisting the antenna device according to an embodiment of the present invention. For example, the chip antenna 430 may include a dielectric block having a higher permittivity than the insulating layer, and a plurality of electrodes disposed on both surfaces of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connecting member 200 , and the other may be electrically connected to the ground layer of the connecting member 200 .

7 is a side view illustrating the structure of an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 7 , in the antenna module according to an embodiment of the present invention, an end-fire antenna 100f, a patch antenna pattern 1110f, an IC 310f, and a passive component 350f are integrated into a connection member 500f. can have a structured structure.

The end-fire antenna 100f and the patch antenna pattern 1110f may be designed the same as the aforementioned antenna device and the aforementioned patch antenna pattern, respectively, and receive and transmit an RF signal from the IC 310f or receive RF signal. A signal may be passed to the IC 310f.

The connection member 500f may have a structure in which at least one conductive layer 510f and at least one insulating layer 520f are stacked (eg, a structure of a printed circuit board). The conductive layer 510f may have the above-described ground layer and feed line.

In addition, the antenna module according to an embodiment of the present invention may further include a flexible connection member (550f). The flexible connection member 550f may include a first flexible region 570f overlapping the connection member 500f and a second flexible region 580f not overlapping the connection member 500f when viewed in the vertical direction.

The second flexible region 580f may be flexibly bent in the vertical direction. Accordingly, the second flexible region 580f may be flexibly connected to the connector of the set board and/or to the adjacent antenna module.

The flexible connection member 550f may include a signal line 560f. An intermediate frequency (IF) signal and/or a baseband signal may be transmitted to the IC 310f through a signal line 560f or may be transmitted to a connector of a set board and/or an adjacent antenna module.

8A and 8B are plan views illustrating an arrangement of an antenna module in an electronic device according to an embodiment of the present invention.

Referring to FIG. 8A , the antenna module including the end-fire antenna 100g, the patch antenna pattern 1110g and the insulating layer 1140g is formed on the set substrate 600g of the electronic device 700g of the electronic device 700g. It may be disposed adjacent to a side boundary.

The electronic device 700g includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, and a computer. ), monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc., but may be not limited

A communication module 610g and a baseband circuit 620g may be further disposed on the set substrate 600g. The antenna module may be electrically connected to the communication module 610g and/or the baseband circuit 620g through a coaxial cable 630g.

The communication module 610g may include a memory chip such as a volatile memory (eg, DRAM), a non-volatile memory (eg, ROM), a flash memory, etc. to perform digital signal processing; application processor chips such as a central processor (eg, CPU), a graphics processor (eg, GPU), a digital signal processor, an encryption processor, a microprocessor, and a microcontroller; It may include at least a part of logic chips such as analog-to-digital converters and application-specific ICs (ASICs).

The baseband circuit 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input/output from the baseband circuit 620g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through an electrical connection structure, a core via, and a wiring. The IC may convert the base signal into an RF signal of a millimeter wave (mmWave) band.

Referring to FIG. 8B , a plurality of antenna modules each including an end-fire antenna 100h, a patch antenna pattern 1110h and an insulating layer 1140h are disposed on the set substrate 600h of the electronic device 700h. 700h) may be disposed adjacent to the boundary of one side and the boundary of the other side, respectively, and a communication module 610h and a baseband circuit 620h may be further disposed on the set substrate 600h. The plurality of antenna modules may be electrically connected to the communication module 610h and/or the baseband circuit 620h through a coaxial cable 630h.

On the other hand, the patch antenna pattern disclosed herein, coupling patch pattern, conductive ring pattern, conductive perforated plate pattern, feed via, array via, chain via, grounding via, shield via, ground layer, end-fire antenna pattern, director The pattern, the coupling ground pattern, and the electrical connection structure are made of a metal material (eg, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb) ), titanium (Ti), or a conductive material such as an alloy thereof), CVD (chemical vapor deposition), PVD (Physical Vapor Deposition), sputtering (sputtering), subtractive (Subtractive), additive (Additive), may be formed according to a plating method such as SAP (Semi-Additive Process), MSAP (Modified Semi-Additive Process), but is not limited thereto.

On the other hand, the insulating layer disclosed herein is FR4, LCP (Liquid Crystal Polymer), LTCC (Low Temperature Co-fired Ceramic), a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or these resins with an inorganic filler Resin impregnated with core material such as glass fiber (Glass Fiber, Glass Cloth, Glass Fabric), prepreg, Ajinomoto Build-up Film (ABF), FR-4, BT (Bismaleimide Triazine), photosensitive insulation (Photo Imagable Dielectric (PID) resin, a general copper clad laminate (CCL), or an insulating material such as glass or ceramic may be implemented. The insulating layer is a patch antenna pattern, a coupling patch pattern, a conductive ring pattern, a conductive perforated plate pattern, a feed via, an array via, a chain via, a grounding via, a shielding via, a ground layer in the antenna device and antenna module disclosed herein. , the end-fire antenna pattern, the director pattern, the coupling ground pattern, and at least a portion of a position where the electrical connection structure is not disposed may be filled.

On the other hand, the RF signal presented herein is Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, It may have a format according to, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated thereafter.

In the above, the present invention has been described with specific matters such as specific components and limited embodiments and drawings, but these are provided to help a more general understanding of the present invention, and the present invention is not limited to the above embodiments. , those of ordinary skill in the art to which the present invention pertains can make various modifications and variations from these descriptions.

110: patch antenna pattern (patch antenna pattern)
115: coupling patch pattern
120, 121, 122: feed via
125: ground layer
130a: conductive ring pattern
131a: first conductive ring pattern
131b: first conductive porous plate pattern
136a: second conductive ring pattern
136b: second conductive porous plate pattern
140: core area
145, 185: grounding via
161: end-fire antenna pattern
162: director pattern
172: second feed line

Claims (10)

ground layer;
a patch antenna pattern spaced apart from the top surface of the ground layer;
a feed via disposed to pass through the ground layer and providing a feeding path to the patch antenna pattern; and
a plurality of conductive ring patterns disposed at different heights above the ground layer and each having a through region overlapping the patch antenna pattern in a vertical direction; including,
The width of the through region of the upper conductive ring pattern among the plurality of conductive ring patterns is larger than the width of the through region of the lower conductive ring pattern,
The height difference between the lowest conductive ring pattern among the plurality of conductive ring patterns and the ground layer is greater than the height difference between two adjacent conductive ring patterns among the plurality of conductive ring patterns.
According to claim 1,
The antenna device further comprising a plurality of chain vias arranged to electrically connect between the plurality of conductive ring patterns and surround the through region.
The method of claim 2, wherein the plurality of chain vias,
a plurality of first chain vias disposed between a lowermost conductive ring pattern among the plurality of conductive ring patterns and a conductive ring pattern higher than the lowest conductive ring pattern and arranged to surround the through region; and
a plurality of second chain vias disposed above the plurality of first chain vias and arranged to surround the through region; including,
A difference in an area between an area surrounded by the plurality of first chain vias and an area surrounded by the plurality of second chain vias is smaller than an area difference between penetration regions of two adjacent conductive ring patterns among the plurality of conductive ring patterns. Device.
ground layer;
a patch antenna pattern spaced apart from the top surface of the ground layer;
a feed via disposed to pass through the ground layer and providing a feeding path to the patch antenna pattern;
a plurality of conductive ring patterns disposed at different heights above the ground layer and each having a through region overlapping the patch antenna pattern in a vertical direction;
a plurality of first chain vias disposed between a lowermost conductive ring pattern among the plurality of conductive ring patterns and a conductive ring pattern higher than the lowest conductive ring pattern and arranged to surround the through region; and
a plurality of second chain vias disposed above the plurality of first chain vias and arranged to surround the through region; including,
The width of the through region of the upper conductive ring pattern among the plurality of conductive ring patterns is larger than the width of the through region of the lower conductive ring pattern,
A difference in an area between an area surrounded by the plurality of first chain vias and an area surrounded by the plurality of second chain vias is smaller than an area difference between penetration regions of two adjacent conductive ring patterns among the plurality of conductive ring patterns. Device.
5. The method of claim 1 or 4,
The antenna device further comprising a plurality of grounding vias arranged to electrically connect at least one of the plurality of conductive ring patterns and the ground layer, and arranged to surround the feed via.
5. The method of claim 1 or 4,
The antenna device further comprising a coupling patch pattern spaced apart from the upper side of the patch antenna pattern and larger than the patch antenna pattern and smaller than the smallest penetration area among the plurality of conductive ring patterns.
According to claim 1 or 4, The feed via,
a first feed via disposed to be biased in a first direction from the center of the patch antenna pattern; and
a second feed via disposed to be biased in a second direction from the center of the patch antenna pattern; An antenna device comprising a.
ground layer;
a plurality of patch antenna patterns spaced apart from each other on the upper surface of the ground layer;
a plurality of feed vias disposed to pass through the ground layer and providing a feeding path to a corresponding patch antenna pattern among the plurality of patch antenna patterns; and
a plurality of conductive perforated plate patterns disposed at different heights above the ground layer and each having a plurality of penetrating regions overlapping a corresponding patch antenna pattern among the plurality of patch antenna patterns in a vertical direction; including,
The total area of the plurality of penetration regions of the upper conductive porous plate pattern among the plurality of conductive porous plate patterns is greater than the total area of the plurality of penetration regions of the lower conductive porous plate pattern,
A height difference between the lowest conductive porous plate pattern among the plurality of conductive porous plate patterns and the ground layer is greater than a height difference between two adjacent conductive porous plate patterns among the plurality of conductive porous plate patterns.
ground layer;
a plurality of patch antenna patterns spaced apart from each other on the upper surface of the ground layer;
a plurality of feed vias disposed to pass through the ground layer and providing a feeding path to a corresponding patch antenna pattern among the plurality of patch antenna patterns;
a plurality of conductive perforated plate patterns disposed at different heights above the ground layer and each having a plurality of penetrating regions overlapping a corresponding patch antenna pattern among the plurality of patch antenna patterns in a vertical direction;
a plurality of first chain vias disposed between a lowermost conductive porous plate pattern among the plurality of conductive porous plate patterns and a conductive porous plate pattern higher than the lowest conductive porous plate pattern and arranged to surround the plurality of through regions, respectively; and
a plurality of second chain vias disposed above the plurality of first chain vias and arranged to surround the plurality of through regions; including,
The total area of the plurality of penetration regions of the upper conductive porous plate pattern among the plurality of conductive porous plate patterns is greater than the total area of the plurality of penetration regions of the lower conductive porous plate pattern,
A difference in an area between a total area surrounded by the plurality of first chain vias and a total area surrounded by each of the plurality of second chain vias is a plurality of conductive porous plate patterns adjacent to each other among the plurality of conductive porous plate patterns. Antenna module smaller than the width difference of the penetration area.
10. The method of claim 9,
A height difference between the lowest conductive porous plate pattern among the plurality of conductive porous plate patterns and the ground layer is greater than a height difference between two adjacent conductive porous plate patterns among the plurality of conductive porous plate patterns.

Images