KR102069236B1 - Antenna module - Google Patents

Abstract

According to an embodiment of the present invention, an antenna module includes a ground layer having at least one through hole, a plurality of feed vias disposed to pass through at least one through hole, and a plurality of feeds disposed above the ground layer, respectively. Providing a plurality of patch antenna patterns electrically connected to one end of the via, a plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns, and a space for arranging a plurality of patch antenna patterns and a plurality of coupling patch patterns A first dielectric layer, a second dielectric layer disposed such that at least a portion of each of the plurality of feed vias is disposed therein and providing an arrangement space of the ground layer, and the first dielectric layer and the first dielectric layer spaced apart from each other. It may include a plurality of electrical connection structure disposed between the two dielectric layers.

Description

Antenna module

The present invention relates to an antenna module.

Data traffic of mobile communication is increasing rapidly every year. Active technology development is under way to support such breakthrough data in real time in wireless networks. For example, the content of Internet of Thing (IoT) -based data, Augmented Reality (AR), Virtual Reality (VR), Live VR / AR combined with SNS, Autonomous driving, Sync View, Miniature camera Applications such as real-time video transmission require communication (eg, 5G communication, mmWave communication, etc.) to support sending and receiving large amounts of data.

Therefore, recently, millimeter wave (mmWave) communication including 5G (5G) communication has been actively studied, and research for commercialization / standardization of an antenna module for smoothly implementing it has been actively conducted.

RF signals in high frequency bands (e.g., 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lost in the way they are delivered, so the quality of communication can drop dramatically. Therefore, the antenna for the communication of high frequency band requires a different technical approach from the existing antenna technology, and separate for securing the antenna gain, integration of the antenna and RFIC, and securing effective isotropic radiated power (EIRP). It may require development of special technologies such as power amplifiers.

United States Patent Application Publication No. 2017/0125895

The present invention provides an antenna module that can have an advantageous structure for improving or minimizing antenna performance (eg, transmit / receive rate, gain, bandwidth, directivity, etc.).

An antenna module according to an embodiment of the present invention, a ground layer having at least one through hole; A plurality of feed vias disposed to pass through the at least one through hole; A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively; A plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns; A first dielectric layer providing an arrangement space of the plurality of patch antenna patterns and the plurality of coupling patch patterns; A second dielectric layer disposed such that at least a portion of each of the plurality of feed vias is located therein and providing an arrangement space of the ground layer; And a plurality of electrical connection structures disposed between the first dielectric layer and the second dielectric layer to space the first dielectric layer and the second dielectric layer from each other. It may include.

An antenna module according to an embodiment of the present invention, a ground layer having at least one through hole; A plurality of feed vias disposed to pass through the at least one through hole; A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively; A plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns; A first dielectric layer providing an arrangement space of the plurality of coupling patch patterns; A second dielectric layer providing an arrangement space of the plurality of patch antenna patterns and the ground layer; And a plurality of electrical connection structures disposed between the first dielectric layer and the second dielectric layer to space the first dielectric layer and the second dielectric layer from each other. It may include.

The antenna module according to an embodiment of the present invention provides an environment having an advantageous structure for each part (RF transmission and reception, electrical connection, etc.) for each part, and thus has an advantageous structure for miniaturization with improved antenna performance. Can provide.

In addition, the antenna module according to an embodiment of the present invention can be manufactured more efficiently for each part, thereby reducing the overall manufacturing cost of the antenna module and increasing the manufacturing yield.

In addition, since the antenna module according to an embodiment of the present invention can easily have a low dielectric constant region, it is possible to easily widen the dielectric constant diversity, it can provide an efficient utilization environment of the low dielectric region.

1 is a side view schematically showing an antenna module according to an embodiment of the present invention.
2A to 2D are side views illustrating a structure in which a patch antenna pattern is disposed in a first dielectric layer in an antenna module according to an embodiment of the present invention.
3A to 3D are side views illustrating a structure in which a patch antenna pattern is disposed in a second dielectric layer in an antenna module according to an embodiment of the present invention.
4A to 4E are plan views illustrating the inside of an antenna module according to an embodiment of the present invention.
5A through 5C are plan views illustrating antenna modules according to an exemplary embodiment.
6A to 6B are side views illustrating a lower structure of a connection member included in an antenna module according to an embodiment of the present invention.
7 is a side view illustrating a structure of an antenna module according to an embodiment of the present invention.
8A and 8B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. Like reference numerals in the drawings refer to the same or similar functions throughout the several aspects.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

1 is a side view schematically showing an antenna module according to an embodiment of the present invention.

Referring to FIG. 1, the antenna device 100 may be disposed above the connection member 200, and the antenna module according to an exemplary embodiment may include a plurality of antenna devices corresponding to the antenna device 100. It may include. According to the design, the connection member 200 may be included in the antenna module according to an embodiment of the present invention. An integrated circuit (IC) may be disposed under the connection member 200.

The connection member 200 may be disposed in the third region 153 and may electrically connect the antenna module to the IC according to an embodiment of the present invention, and may provide electromagnetic isolation between the antenna module and the IC and / or Impedance can be provided.

The connection member 200 may provide an electrical ground to the antenna module and the IC, and include the ground layer 125, the second ground layer 202, the third ground layer 203, the fourth ground layer 204, and the first ground layer 125. 5 may include at least some of the ground layer 205 and the shield via 245.

Depending on the design, the connection member 200 may include at least one end-fire antenna. The end-fire antenna may include at least some of an end-fire patch antenna pattern 210, an end-fire antenna feed via 211, a director pattern 215, and an end-fire antenna feedline 220. RF (Radio Frequency) signal can be transmitted and received in the x direction.

An antenna module according to an embodiment of the present disclosure may include an antenna package 105 and a feed via 120, and may transmit and receive an RF signal in a z direction.

The antenna package 105 may be disposed in the first region 151 and may include a coupling patch pattern and / or a patch antenna pattern to be described later.

The feed via 120 may be disposed in the second region 152 and may electrically connect the antenna package 105 with the connection member 200.

Antenna module according to an embodiment of the present invention, to have an antenna package 105 having a structure that is advantageous for improving antenna performance, and a connecting member 200 having a structure that is advantageous for providing electrical connection, electromagnetic isolation and impedance. Can be designed.

For example, the antenna module according to an exemplary embodiment may have a structure in which the antenna package 105 and the connection member 200, which are separately manufactured, are bonded to each other. Accordingly, the antenna package 105 and the connection member 200 may easily have a structure that is advantageous for their role (RF signal transmission, electrical connection, etc.). Accordingly, the antenna module according to an embodiment of the present invention can provide a structure that is advantageous in miniaturization while having improved antenna performance.

In addition, compared with manufacturing the antenna package 105 and the connecting member 200 together, the junction structure of the antenna package 105 and the connecting member 200 can be manufactured more efficiently, so that the overall manufacturing cost of the antenna module Can reduce the production yield.

In addition, according to the bonding structure of the antenna package 105 and the connection member 200, the antenna module according to an embodiment of the present invention may have a low dielectric region between the antenna package 105 and the connection member 200 As a result, the diversity of genetic constants can be improved.

2A to 2D are side views illustrating a structure in which a patch antenna pattern is disposed in a first dielectric layer in an antenna module according to an embodiment of the present invention.

2A to 2D, an antenna module according to an embodiment of the present invention may include a patch antenna pattern 110, a coupling patch pattern 115, a feed via 120, a ground layer 125, and an electrical connection. The structure 130 may include the second dielectric layer 140, the low dielectric region 145, and the first dielectric layer 150.

The ground layer 125 may improve the electromagnetic isolation between the patch antenna pattern 110 and the aforementioned connecting member, and acts as a reflector for the patch antenna pattern 110, thereby causing the RF of the patch antenna pattern 110 to be improved. The signal may be reflected in the z direction to further concentrate the RF signal in the z direction. The ground layer 125 may be disposed to secure a separation distance with respect to the patch antenna pattern 110 and may have a reflector characteristic.

Antenna module according to an embodiment of the present invention has a junction structure between the second dielectric layer 140 and the first dielectric layer 150 can easily secure the separation distance, reducing the manufacturing cost for securing the separation distance Production yield can be improved.

The ground layer 125 may have a through hole through which the feed via 120 passes. The through hole may overlap the patch antenna pattern 110 when viewed in the z direction.

The feed via 120 may transmit the RF signal received from the patch antenna pattern 110 to the aforementioned connection member and / or the IC, and transmit the RF signal received from the connection member and / or the IC to the aforementioned connection member and / or Can be delivered to the IC. Depending on the design, the plurality of feed vias 120 may be connected to a single or a plurality of patch antenna patterns 110. When the plurality of feed vias 120 are connected to a single patch antenna pattern 110, each of the plurality of feed vias 120 may include a horizontal pole RF signal and a vertical pole RF signal that are polarized with each other. It can be configured to flow.

The patch antenna pattern 110 may be disposed above the ground layer 125 and electrically connected to one end of the feed via 120. The patch antenna pattern 110 may receive the RF signal from the feed via 120 and transmit the RF signal to the feed via 120 by remotely transmitting in the z direction or remotely receiving the RF signal in the z direction.

The coupling patch pattern 115 may be disposed above the patch antenna pattern 110. The coupling patch pattern 115 may be electromagnetically coupled to the patch antenna pattern 110, and may further concentrate the RF signal in the z direction to improve the gain of the patch antenna pattern 110.

The first dielectric layer 150 may provide an arrangement space of the patch antenna pattern 110 and the coupling patch pattern 115. For example, the patch antenna pattern 110 and the coupling patch pattern 115 may be inserted into the first dielectric layer 150 or disposed on the top and / or bottom surfaces of the first dielectric layer 150.

The second dielectric layer 140 may be disposed such that at least a portion of the feed via 120 is located therein, and may provide an arrangement space of the ground layer 125. For example, the ground layer 125 may be inserted into the second dielectric layer 140 or disposed on the top surface of the second dielectric layer 140.

The electrical connection structure 130 may be disposed between the first dielectric layer 150 and the second dielectric layer 140 to space the first dielectric layer 150 and the second dielectric layer 140 from each other. That is, the electrical connection structure 130 may support the first dielectric layer 150 and / or the second dielectric layer 140.

Accordingly, the antenna module according to an embodiment of the present invention easily increases the distance between the ground layer 125 included in the second dielectric layer 140 and the patch antenna pattern 110 included in the first dielectric layer 150. Since it is possible to, the antenna performance of the patch antenna pattern 110 can be easily improved.

Since the electrical connection structure 130 may have a predetermined height, the low dielectric region 145 may be provided while coupling the second dielectric layer 140 and the first dielectric layer 150 to each other. That is, the dielectric constant D _K of at least a portion of the space between the patch antenna pattern 110 and the ground layer 125 may be smaller than the dielectric constants of the first and second dielectric layers 150 and 140. For example, the low dielectric region 145 may have a dielectric constant equal to that of air.

Accordingly, in the antenna module according to the exemplary embodiment, the second dielectric layer 140 and the first dielectric layer 150 may be formed even though the second dielectric layer 140 and the first dielectric layer 150 do not have separate low dielectric regions. ) May have a low dielectric region 145. Accordingly, since the patch antenna pattern 110 and the ground layer 125 may each easily have boundary conditions of various dielectric constants, the antenna performance may be easily improved.

Accordingly, since the second dielectric layer 140 and the first dielectric layer 150 can reduce the number and / or height of the layers, respectively, the overall cost in manufacturing or the overall yield can be increased.

Since the electrical connection structure 130 may have a melting point lower than that of the patch antenna pattern 110, the coupling patch pattern 115, and the ground layer 125, the first dielectric layer 150 and the second dielectric layer 140 may be separated. It is possible to provide an electrical bonding environment in the manufactured state.

Meanwhile, the dielectric constant of the first dielectric layer 150 may be greater than the dielectric constant of the second dielectric layer 140. The size of the patch antenna pattern 110 and the coupling patch pattern 115 to maintain the resonance frequency may be smaller as the dielectric constant of the first dielectric layer 150 becomes larger. In addition, the separation distance between the patch antenna pattern 110 and the adjacent antenna device may be smaller as the dielectric constant of the first dielectric layer 150 increases. That is, the antenna module according to an embodiment of the present invention may improve antenna performance by providing a low dielectric region 145 while miniaturization using the first dielectric layer 150 having a large dielectric constant.

For example, the first dielectric layer 150 may have a dielectric tangent smaller than the dielectric tangent D _F of the second dielectric layer 140. Accordingly, energy loss due to RF signal transmission and reception of the patch antenna pattern 110 may be reduced.

Referring to FIG. 2B, the first dielectric layer 150 may provide the recessed region 135 below.

Referring to FIG. 2C, the second dielectric layer 140 may provide the recessed region 135 upward.

The recessed region 135 may lower the effective dielectric constant without increasing the physical distance between the patch antenna pattern 110 and the ground layer 125 or the overall height of the antenna module. Therefore, the size compared to the antenna performance of the antenna module can be further reduced.

On the other hand, the antenna module according to an embodiment of the present invention increases the size and / or height of the electrical connection structure 130 even if it does not have a recessed area 135, and thus between the ground layer 125 and the patch antenna pattern 110. The distance may be increased or the height of each of the first and second dielectric layers 150 and 140 may be reduced. For example, the electrical connection structure 130 may be designed to be larger than the electrical connection structure between the IC and the connection member. For example, the electrical connection structure 130 may be selected from a structure such as solder balls, pins, pads, lands, bumps, and the like. It may have a structure different from the electrical connection structure to increase the size and / or height.

Referring to FIG. 2D, an antenna module according to an embodiment of the present disclosure may include a sub substrate 160 disposed between the first dielectric layer 150 and the second dielectric layer 140 and connected to the electrical connection structure 130. It may further include. The sub-substrate 160 may provide an environment in which the gap between the first dielectric layer 150 and the second dielectric layer 140 may be more easily extended, and the electrical connection stability of the electrical connection structure 130 may be further improved. .

The sub-substrate 160 may include a core via 161 connected to the electrical connection structure 130, and the upper core layer 162 connected to the top of the core via 161 and the bottom of the core via 161. At least some of the lower core layer 163, the upper electrical connection structure 164 connected to the upper core layer 162, and the lower electrical connection structure 165 connected to the lower core layer 163 may be included.

The sub-substrate 160 may provide an arrangement space of at least some of the second, third and fourth portions 120b, 120c, and 120d of the feed via, but may be spaced apart from the feed via according to the design.

Meanwhile, referring to FIG. 2D, the antenna module according to an exemplary embodiment of the present disclosure may further include an encapsulant 147 sealing between the first dielectric layer 150 and the second dielectric layer 140. That is, the encapsulant 147 may be disposed to fill at least a portion of the low dielectric region 145 described above. Accordingly, insulation reliability, heat dissipation performance, and impact protection performance between the first dielectric layer 150 and the second dielectric layer 140 may be improved.

Depending on the design, the encapsulant 147 may be higher than the dielectric constant of the first and second dielectric layers 150 and 140. Accordingly, since the effective dielectric constant between the ground layer 125 and the patch antenna pattern 110 can be increased, the wavelength of the RF signal transmitted between the ground layer 125 and the patch antenna pattern 110 can be shortened. . That is, since an electrical length between the ground layer 125 and the patch antenna pattern 110 may be long, the antenna module according to an embodiment of the present invention may not increase the overall height, Antenna performance may be improved according to the distance between the patch antenna patterns 110.

2D, the upper surface size L1 of the second dielectric layer 150 may be larger than the lower surface size L2 of the first dielectric layer 150. That is, the junction structure of the first dielectric layer 150 and the second dielectric layer 140 may provide an easily coupled environment even if the first dielectric layer 150 and the second dielectric layer 140 have different sizes.

For example, the second dielectric layer 140 may be larger than the first dielectric layer 150 to provide an arrangement of the end-fire antenna described above with reference to FIG. 1 or to provide more stable electrical connection and ground. It may be larger than the first dielectric layer 150 for structural stability of the entire module.

2D, the feed via may have a first portion 120a, a second portion 120b, a third portion 120c, and a fourth portion 120d. Here, the second portion 120b and the fourth portion 120d may have a shape similar to that of the electrical connection structure 130, and may be simultaneously formed with the electrical connection structure 130. That is, the feed via may be configured such that the width of the portion corresponding to the level between the first dielectric layer 150 and the second dielectric layer 140 is thicker.

3A to 3D are side views illustrating a structure in which a patch antenna pattern is disposed in a second dielectric layer in an antenna module according to an embodiment of the present invention.

3A to 3D, the patch antenna pattern 110 may be disposed on the second dielectric layer 140, and the coupling patch pattern 115 may be disposed on the first dielectric layer 150.

The wavelength of the RF signal transmitted between the patch antenna pattern 110 and the coupling patch pattern 115 may be longer as the effective dielectric constant between the patch antenna pattern 110 and the coupling patch pattern 115 becomes smaller. In addition, the z-direction concentration of the RF signal according to the electromagnetic coupling between the patch antenna pattern 110 and the coupling patch pattern 115 may be greater as the wavelength of the RF signal is longer. Therefore, the gain of the patch antenna pattern 110 may be improved as the effective dielectric constant between the patch antenna pattern 110 and the coupling patch pattern 115 becomes smaller.

The electrical connection structure 130 may couple the second dielectric layer 140 and the first dielectric layer 150 to each other while electrically connecting the second dielectric layer 140 and the first dielectric layer 150. For example, the electrical connection structure 130 may have a lower melting point than the patch antenna pattern 110, the coupling patch pattern 115, and the feed via 120. For example, the second dielectric layer 140 and the first dielectric layer 150 may be bonded to each other with the electrical connection structure 130 disposed on the top surface of the second dielectric layer 140 or the bottom surface of the first dielectric layer 150. The heat treatment may then be performed at a temperature higher than the melting point of the electrical connection structure 130.

The low dielectric region 145 may be formed by the height of the electrical connection structure 130 according to the coupling of the second dielectric layer 140 and the first dielectric layer 150 through the electrical connection structure 130.

Since the low dielectric region 145 is positioned between the second dielectric layer 140 and the first dielectric layer 150, insulation reliability may be secured without a separate insulating material. Therefore, the low dielectric region 145 may be made of air. The air has a dielectric constant of substantially 1 and does not require a separate process for filling the low dielectric region 145. Accordingly, the effective dielectric constant between the patch antenna pattern 110 disposed on the second dielectric layer 140 and the coupling patch pattern 115 disposed on the first dielectric layer 150 may be easily lowered.

According to the design, the low dielectric region 145 is filled with a dielectric material having a lower dielectric constant than the dielectric constants of the first and second dielectric layers 150 and 140 (eg, the encapsulant 147) to improve insulation reliability. It can be further improved.

Referring to FIG. 3B, the first dielectric layer 150 may have a recessed region 135.

Referring to FIG. 3C, the second dielectric layer 140 may have a recessed region 135.

Accordingly, the effective dielectric constant between the patch antenna pattern 110 and the coupling patch pattern 115 may be lower as the height of the recessed region 135 becomes longer, and the patch antenna pattern 110 and the coupling patch pattern 115 may be reduced. It can be lowered without increasing the physical distance therebetween.

On the other hand, the antenna module according to an embodiment of the present invention can further lower the effective dielectric constant by increasing the size and / or height of the electrical connection structure 130 even without having a recessed region (135). For example, the electrical connection structure 130 may be designed to be larger than the electrical connection structure between the IC and the connection member. For example, the electrical connection structure 130 may be selected from structures such as solder balls, pins, pads, and lands, which may be different from the electrical connection structure between the IC and the connection member. It can have a structure to increase its size and / or height.

On the other hand, referring to Figure 3d, the antenna module according to an embodiment of the present invention can more easily secure the separation distance between the patch antenna pattern 110 and the coupling patch pattern 115, including the sub-substrate 160. have.

4A to 4E are plan views illustrating the inside of an antenna module according to an embodiment of the present invention.

Referring to FIG. 4A, the plurality of electrical connection structures 130 included in the antenna module according to an embodiment of the present invention may include a plurality of antenna patterns 110 and / or a plurality of coupling patch patterns when viewed in the z direction. Each may be arranged to surround.

Accordingly, the electrical connection structure 130 can improve the electromagnetic isolation between the plurality of antenna patterns 110, can improve the electromagnetic shielding performance of the antenna module, and electromagnetic for the plurality of antenna patterns 110 By providing a boundary condition, the RF signals transmitted through the plurality of antenna patterns 110 may be further induced in the z direction.

Referring to FIG. 4B, the ground layer 201a may have a through hole through which the feed via 120a passes, and may be connected to the other end of the grounding via 185a. The ground layer 201a may electromagnetically shield between the patch antenna pattern 110a and the feed line.

Referring to FIG. 4C, the second ground layer 202a may surround at least a portion of the end-fire antenna feedline 220a and the patch antenna feedline 221a, respectively. The end-fire antenna feedline 220a may be electrically connected to the second wiring via 232a, and the patch antenna feedline 221a may be electrically connected to the first wiring via 231a. The second ground layer 202a may electromagnetically shield between the end-fire antenna feedline 220a and the patch antenna feedline 221a. One end of the end-fire antenna feedline 220a may be connected to the end-fire antenna feed via 211a.

Referring to FIG. 4D, the third ground layer 203a may have a plurality of through holes through which the first wiring via 231a and the second wiring via 232a pass, respectively, and form the coupling ground pattern 235a. Can have. The third ground layer 203a may electromagnetically shield between the feedline and the IC.

Referring to FIG. 4E, the fourth ground layer 204a may have a plurality of through holes through which the first wiring via 231a and the second wiring via 232a respectively pass. The IC 310a may be disposed under the fourth ground layer 204a and may be electrically connected to the first wiring via 231a and the second wiring via 232a. The end-fire patch antenna pattern 210a and the director pattern 215a may be disposed at substantially the same height as the fourth ground layer 204a.

The fourth ground layer 204a may provide a ground used in a circuit and / or a passive component of the IC 310a to the IC 310a and / or a passive component. Depending on the design, the fourth ground layer 204a may provide a path for the transmission of power and signals used in the IC 310a and / or passive components. Thus, the fourth ground layer 204a may be electrically connected to the IC and / or the passive component.

Meanwhile, the second ground layer 202a, the third ground layer 203a, and the fourth ground layer 204a may have a recessed shape to provide a cavity. Accordingly, the end-fire patch antenna pattern 210a may be further disposed closer to the IC ground layer 204a. The recessed region may be disposed at a position different from the recessed region described above with reference to FIGS. 1 to 4C.

Meanwhile, the vertical relationship and shape of the second ground layer 202a, the third ground layer 203a, and the fourth ground layer 204a may vary depending on the design. The fifth ground layer shown in FIG. 1 may have a structure / role similar to that of the fourth ground layer 204a.

5A through 5C are plan views illustrating antenna modules according to an exemplary embodiment.

5A and 5B, an antenna module according to an exemplary embodiment may include a plurality of patch antenna patterns 110c, ground layers 125c, a plurality of conductive array patterns 130c, and a plurality of end-fires. At least some of the antenna pattern 210c, the plurality of director patterns 215c, and the plurality of end-fire feed lines 220c may be included.

The plurality of end-fire antenna patterns 210c may form a radiation pattern in a second direction to transmit or receive an RF signal in a second direction (eg, a lateral direction). For example, the plurality of end-fire antenna patterns 210c may be disposed adjacent to the side of the connecting member in the connecting member, and may have a dipole form or a folded dipole form. Here, one end of each pole of the plurality of end-fire antenna patterns 210c may be electrically connected to the first and second lines of the plurality of end-fire antenna feed lines 220c. The frequency band of the plurality of end-fire antenna patterns 210c may be designed to be substantially the same as the frequency band of the plurality of patch antenna patterns 110c, but is not limited thereto.

The plurality of director patterns 215c may be electromagnetically coupled to the plurality of end-fire antenna patterns 210c to improve the gain or bandwidth of the plurality of end-fire antenna patterns 210c.

The plurality of end-fire antenna feedlines 220c may transmit RF signals received from the plurality of end-fire antenna patterns 210c to the IC, and the RF signals received from the IC may receive the plurality of end-fire antenna patterns 210c. ) Can be delivered. The plurality of end-fire antenna feed lines 220c may be implemented by wiring of a connection member.

Therefore, since the antenna module according to an embodiment of the present invention can form radiation patterns in the first and second directions, the RF signal transmission / reception direction can be expanded omni-directionally.

On the other hand, the plurality of antenna devices may be arranged in a structure of n X m as shown in Figure 4a, the antenna module including a plurality of antenna devices may be disposed adjacent to the vertex of the electronic device.

In addition, the plurality of antenna devices may be arranged in a structure of n × 1 as shown in FIG. 4B, and the antenna module including the plurality of antenna devices may be disposed adjacent to an intermediate point of an edge of the electronic device.

Referring to FIG. 5C, an antenna module according to an exemplary embodiment may include a plurality of patch antenna patterns 110d, ground layers 125d, a plurality of conductive array patterns 130d, and a plurality of end-fire antenna patterns ( 210d), a plurality of director patterns 215d, and a plurality of end-fire antenna feedlines 220d.

That is, the plurality of conductive array patterns 130d may be arranged in a structure of n × 1, may be arranged to surround each of the plurality of patch antenna patterns 110d, and may be spaced apart from each other. Accordingly, the influence of the plurality of antenna devices on each other can be reduced.

6A to 6B are side views illustrating a lower structure of a connection member included in an antenna module according to an embodiment of the present invention.

Referring to FIG. 6A, an antenna module according to an embodiment of the present disclosure may include a connection member 200, an IC 310, an adhesive member 320, an electrical connection structure 330, an encapsulant 340, and a passive component. At least some of the 350 and the sub-substrate 410 may be included.

The connection member 200 may have a structure similar to the connection member described above with reference to FIGS. 1 to 5C.

The IC 310 is the same as the above-described IC, and may be disposed below the connection member 200. The IC 310 may be electrically connected to a wire of the connection member 200 to transmit or receive an RF signal, and may be electrically connected to a ground layer of the connection member 200 to receive ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may bond the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200. For example, the electrical connection structure 330 may have a structure such as solder balls, pins, lands, and pads. The electrical connection structure 330 may have a lower melting point than the wiring of the connection member 200 and the ground layer to electrically connect the IC 310 and the connection member 200 through a predetermined process using the low melting point.

The encapsulant 340 may seal at least a portion of the IC 310, and may improve heat dissipation performance and impact protection performance of the IC 310. For example, the encapsulant 340 may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like.

The passive component 350 may be disposed on the bottom surface of the connection member 200, and may be electrically connected to the wiring and / or the ground layer of the connection member 200 through the electrical connection structure 330. For example, the passive component 350 may include at least some of a capacitor (eg, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

The sub-substrate 410 may be disposed under the connection member 200, and may receive an intermediate frequency (IF) signal or a base band signal from the outside and transmit the received signal to the IC 310 or from the IC 310. It may be electrically connected to the connection member 200 to receive the IF signal or the baseband signal to transmit to the outside. Here, the frequency (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) of the RF signal is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the sub-substrate 410 may transfer the IF signal or the baseband signal to or from the IC 310 through a wire that may be included in the IC ground layer of the connection member 200. Since the first ground layer of the connection member 200 is disposed between the IC ground layer and the wiring, the IF signal or the baseband signal and the RF signal may be electrically isolated in the antenna module.

Referring to FIG. 6B, the antenna module according to the exemplary embodiment may include at least some of the shielding member 360, the connector 420, and the chip antenna 430.

The shielding member 360 may be disposed under the connection member 200 to confine the IC 310 together with the connection member 200. For example, the shield member 360 may be arranged to cover (eg, conformal shield) the IC 310 and the passive component 350 together or to cover each other (eg, the compartment shield). For example, the shielding member 360 may have a shape of a hexahedron having one surface opened, and may have a hexahedral receiving space through coupling with the connection member 200. The shielding member 360 may be made of a material having high conductivity, such as copper, to have a short skin depth, and may be electrically connected to the ground layer of the connection member 200. Accordingly, the shielding member 360 may reduce electromagnetic noise that may be received by the IC 310 and the passive component 350.

The connector 420 may have a connection structure of a cable (eg, coaxial cable, flexible PCB), may be electrically connected to the IC ground layer of the connection member 200, and may play a role similar to that of the above-described sub substrate. have. That is, the connector 420 may receive an IF signal, a baseband signal and / or a power from a cable, or provide an IF signal and / or a baseband signal to a cable.

The chip antenna 430 may transmit or receive an RF signal in support of an antenna module according to an embodiment of the present invention. For example, the chip antenna 430 may include a dielectric block having a larger dielectric constant than the insulating layer, and a plurality of electrodes disposed on both surfaces of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connection member 200, and the other may be electrically connected to the ground layer of the connection member 200.

7 is a side view illustrating a structure of an antenna module according to an embodiment of the present invention.

Referring to FIG. 7, in the antenna module according to the exemplary embodiment, the end-fire antenna 100f, the patch antenna pattern 1110f, the IC 310f, and the passive component 350f are integrated into the connection member 500f. It can have a structure.

The end-fire antenna 100f and the patch antenna pattern 1110f may be designed in the same manner as the end-fire antenna and the patch antenna pattern described above, respectively, and receive or transmit RF signals from the IC 310f. The received RF signal to the IC 310f.

The connection member 500f may have a structure in which at least one conductive layer 510f and at least one insulating layer 520f are stacked (eg, a structure of a printed circuit board). The conductive layer 510f may have the above-described ground layer and a feed line.

In addition, the antenna module according to an exemplary embodiment may further include a flexible connection member 550f. The flexible connecting member 550f may include a first flexible region 570f overlapping the connecting member 500f and a second flexible region 580f not overlapping the connecting member 500f when viewed in the vertical direction.

The second flexible region 580f may be flexibly curved in the vertical direction. Accordingly, the second flexible region 580f may be flexibly connected to the connector of the set board and / or the adjacent antenna module.

The flexible connection member 550f may include a signal line 560f. The intermediate frequency (IF) signal and / or the baseband signal may be transmitted to the IC 310f through the signal line 560f or to the connector and / or the adjacent antenna module of the set board.

8A and 8B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

Referring to FIG. 8A, an antenna module including an end-fire antenna 100g, a patch antenna pattern 1110g, and an insulating layer 1140g may be used for the electronic device 700g on the set substrate 600g of the electronic device 700g. May be disposed adjacent to the lateral boundary.

The electronic device 700g includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer. ), Monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc. It is not limited.

The communication module 610g and the baseband circuit 620g may be further disposed on the set substrate 600g. The antenna module may be electrically connected to the communication module 610g and / or the baseband circuit 620g through the coaxial cable 630g. Depending on the design, the coaxial cable 630g may be replaced with the flexible connecting member shown in FIG.

The communication module 610g may include a memory chip such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory to perform digital signal processing; Application processor chips such as central processors (eg, CPUs), graphics processors (eg, GPUs), digital signal processors, cryptographic processors, microprocessors, microcontrollers; It may include at least a portion of a logic chip such as an analog-digital converter, an application-specific IC (ASIC).

The baseband circuit 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input and output from the baseband circuit 620g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through the electrical connection structure, the core via, and the wiring. The IC may convert the base signal into an RF signal of millimeter wave (mmWave) band.

Referring to FIG. 8B, a plurality of antenna modules each including an end-fire antenna 100h, a patch antenna pattern 1110h, and an insulating layer 1140h may be formed on the set substrate 600h of the electronic device 700h. 700h may be disposed adjacent to one side boundary and the other side boundary, and a communication module 610h and a baseband circuit 620h may be further disposed on the set substrate 600h. The plurality of antenna modules may be electrically connected to the communication module 610h and / or the baseband circuit 620h through the coaxial cable 630h.

Meanwhile, the patch antenna pattern, the coupling patch pattern, the feed via, the ground layer, the end-fire antenna pattern, the director pattern, and the electrical connection structure disclosed herein are metal materials (eg, copper (Cu), aluminum (Al)). And conductive materials such as silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof), and chemical vapor deposition (CVD). Depending on plating methods such as deposition, physical vapor deposition (PVD), sputtering, subtractive, additive, SAP (semi-additive process), and modified semi-additive process (MSAP) It may be formed, but is not limited thereto.

Meanwhile, the dielectric layers disclosed herein include FR4, Liquid Crystal Polymer (LCP), Low Temperature Co-fired Ceramic (LTCC), thermosetting resins such as epoxy resins, thermoplastic resins such as polyimide, or these resins together with inorganic fillers. Resin, prepreg, Ajinomoto build-up film (ABF), FR-4, Bisaleimide Triazine (BT), Photo Imagable (impregnated) in core materials such as glass fiber, glass cloth, and glass fabric Dielectric: PID) resin, copper clad laminate (CCL), or glass or ceramic-based insulation may be implemented. The dielectric layer may be filled in at least a portion of a patch antenna pattern, a coupling patch pattern, a feed via, a ground layer, an end-fire antenna pattern, a director pattern, and an electrical connection structure in the antenna module disclosed herein. .

On the other hand, RF signals disclosed herein are Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, It may have a format in accordance with, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated.

Although the present invention has been described by specific embodiments such as specific components and limited embodiments and drawings, it is provided to help a more general understanding of the present invention, but the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations can be made from such a description.

110: patch antenna pattern
115: coupling patch pattern
120: feed via
125: ground layer
130: electrical connection structure
135: depression area
140: second dielectric layer
145: low dielectric area
147: suture
150: first dielectric layer
160: sub-board
161: corevia
200: connecting member
202: second ground layer
203: third ground layer
204: fourth ground layer
205: fifth ground layer
210: end-fire antenna pattern
215: director pattern
220: end-fire antenna feedline
245: shielded via

Claims (16)

A ground layer having at least one through hole;
A plurality of feed vias disposed to pass through the at least one through hole;
A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively;
A plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns;
A first dielectric layer providing an arrangement space of the plurality of patch antenna patterns and the plurality of coupling patch patterns;
A second dielectric layer disposed such that at least a portion of each of the plurality of feed vias is located therein and providing an arrangement space of the ground layer;
A plurality of electrical connection structures disposed between the first dielectric layer and the second dielectric layer to space the first dielectric layer and the second dielectric layer from each other; And
At least one end-fire antenna disposed below the ground layer and at least partially disposed within the second dielectric layer; Including,
And an upper surface size of the second dielectric layer is larger than a lower surface size of the first dielectric layer.
The method of claim 1,
And at least a dielectric constant of at least a portion of the space between the plurality of patch antenna patterns and the ground layer is smaller than the dielectric constant of the first and second dielectric layers.
The method of claim 1,
And the dielectric constant of the first dielectric layer is greater than the dielectric constant of the second dielectric layer.
A ground layer having at least one through hole;
A plurality of feed vias disposed to pass through the at least one through hole;
A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively;
A plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns;
A first dielectric layer providing an arrangement space of the plurality of patch antenna patterns and the plurality of coupling patch patterns;
A second dielectric layer disposed such that at least a portion of each of the plurality of feed vias is located therein and providing an arrangement space of the ground layer; And
A plurality of electrical connection structures disposed between the first dielectric layer and the second dielectric layer to space the first dielectric layer and the second dielectric layer from each other; Including,
And the first dielectric layer provides a plurality of first recessions below.
A ground layer having at least one through hole;
A plurality of feed vias disposed to pass through the at least one through hole;
A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively;
A plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns;
A first dielectric layer providing an arrangement space of the plurality of patch antenna patterns and the plurality of coupling patch patterns;
A second dielectric layer disposed such that at least a portion of each of the plurality of feed vias is located therein and providing an arrangement space of the ground layer; And
A plurality of electrical connection structures disposed between the first dielectric layer and the second dielectric layer to space the first dielectric layer and the second dielectric layer from each other; Including,
And the second dielectric layer provides a plurality of second recessed regions upwards.
The method of claim 1,
And the plurality of electrical connection structures are arranged to surround each of the plurality of coupling patch patterns when viewed in the vertical direction.
delete A ground layer having at least one through hole;
A plurality of feed vias disposed to pass through the at least one through hole;
A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively;
A plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns;
A first dielectric layer providing an arrangement space of the plurality of patch antenna patterns and the plurality of coupling patch patterns;
A second dielectric layer disposed such that at least a portion of each of the plurality of feed vias is located therein and providing an arrangement space of the ground layer; And
A plurality of electrical connection structures disposed between the first dielectric layer and the second dielectric layer to space the first dielectric layer and the second dielectric layer from each other; Including,
At least one of the plurality of feed vias is configured to have a greater width of a portion corresponding to a level between the first dielectric layer and the second dielectric layer.
A ground layer having at least one through hole;
A plurality of feed vias disposed to pass through the at least one through hole;
A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively;
A plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns;
A first dielectric layer providing an arrangement space of the plurality of patch antenna patterns and the plurality of coupling patch patterns;
A second dielectric layer disposed such that at least a portion of each of the plurality of feed vias is located therein and providing an arrangement space of the ground layer; And
A plurality of electrical connection structures disposed between the first dielectric layer and the second dielectric layer to space the first dielectric layer and the second dielectric layer from each other; Including,
And an encapsulant sealing between the first dielectric layer and the second dielectric layer.
A ground layer having at least one through hole;
A plurality of feed vias disposed to pass through the at least one through hole;
A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively;
A plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns;
A first dielectric layer providing an arrangement space of the plurality of patch antenna patterns and the plurality of coupling patch patterns;
A second dielectric layer disposed such that at least a portion of each of the plurality of feed vias is located therein and providing an arrangement space of the ground layer;
A plurality of electrical connection structures disposed between the first dielectric layer and the second dielectric layer to space the first dielectric layer and the second dielectric layer from each other; And
A sub substrate disposed between the first dielectric layer and the second dielectric layer and connected to the plurality of electrical connection structures; Including,
The sub substrate may include a plurality of core vias connected to the plurality of electrical connection structures, respectively.
The method of claim 1,
A plurality of patch antenna feedlines disposed below the ground layer and each electrically connected to the plurality of feed vias;
An IC disposed below the plurality of patch antenna feedlines; And
A plurality of wiring vias arranged to electrically connect the plurality of patch antenna feedlines to the IC; Antenna module further comprising.
A ground layer having at least one through hole;
A plurality of feed vias disposed to pass through the at least one through hole;
A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively;
A plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns;
A first dielectric layer providing an arrangement space of the plurality of coupling patch patterns;
A second dielectric layer providing an arrangement space of the plurality of patch antenna patterns and the ground layer; And
A plurality of electrical connection structures disposed between the first dielectric layer and the second dielectric layer to space the first dielectric layer and the second dielectric layer from each other; Including,
And at least one of the first dielectric layer and the second dielectric layer provides a plurality of recessed areas overlapping each of the plurality of patch antenna patterns when viewed in a vertical direction.
delete The method of claim 12,
And the plurality of electrical connection structures are arranged to surround each of the plurality of recessed areas when viewed in the vertical direction.
The method of claim 12,
And a dielectric constant of the second dielectric layer is greater than a dielectric constant of at least a portion of a space between the plurality of patch antenna patterns and the plurality of coupling patch patterns and smaller than the dielectric constant of the first dielectric layer.
A ground layer having at least one through hole;
A plurality of feed vias disposed to pass through the at least one through hole;
A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively;
A plurality of coupling patch patterns disposed above each of the plurality of patch antenna patterns;
A first dielectric layer providing an arrangement space of the plurality of coupling patch patterns;
A second dielectric layer providing an arrangement space of the plurality of patch antenna patterns and the ground layer; And
A plurality of electrical connection structures disposed between the first dielectric layer and the second dielectric layer to space the first dielectric layer and the second dielectric layer from each other;
At least one end-fire antenna disposed below the ground layer and at least partially disposed within the second dielectric layer;
A plurality of feedlines disposed below the ground layer and electrically connected to the plurality of feed vias or the at least one end-fire antenna, respectively;
An IC disposed below the plurality of feed lines; And
A plurality of wiring vias arranged to electrically connect the plurality of feed lines to the IC; Antenna module comprising a.

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