KR102085791B1 - Antenna apparatus and antenna module - Google Patents

Abstract

An antenna device according to an embodiment of the present invention includes a ground layer having a through hole, a feed via disposed to pass through the through hole, a patch antenna pattern disposed at an upper side of the ground layer and electrically connected to one end of the feed via; A first coupling patch pattern disposed above the patch antenna pattern, a second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern, and at least the first and second coupling patches. Occupy at least a portion of the interspace of the pattern, wherein the dielectric constant of at least a portion of the space between the patch antenna pattern and the second coupling patch pattern is less than the dielectric constant of the space between the first and second coupling patch patterns It may comprise a dielectric layer.

Description

Antenna apparatus and antenna module

The present invention relates to an antenna device and an antenna module.

Data traffic of mobile communication is increasing rapidly every year. Active technology development is under way to support such breakthrough data in real time in wireless networks. For example, the content of Internet of Thing (IoT) -based data, Augmented Reality (AR), Virtual Reality (VR), Live VR / AR combined with SNS, Autonomous driving, Sync View, Miniature camera Applications such as real-time video transmission require communication (eg, 5G communication, mmWave communication, etc.) to support sending and receiving large amounts of data.

Therefore, recently, millimeter wave (mmWave) communication including 5G (5G) communication has been actively studied, and research for commercialization / standardization of an antenna module for smoothly implementing it has been actively conducted.

RF signals in high frequency bands (e.g., 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lost in the way they are delivered, so the quality of communication can drop dramatically. Therefore, the antenna for the communication of high frequency band requires a different technical approach from the existing antenna technology, and separate for securing the antenna gain, integration of the antenna and RFIC, and securing effective isotropic radiated power (EIRP). It may require development of special technologies such as power amplifiers.

Korean Laid-Open Patent Publication 10-2009-0068799

The present invention provides an antenna device and an antenna module that can have a structure that is advantageous for improving or minimizing antenna performance (eg, transmit / receive rate, gain, bandwidth, directivity, etc.).

An antenna device according to an embodiment of the present invention, a ground layer having a through hole; A feed via disposed to pass through the through hole; A patch antenna pattern disposed above the ground layer and electrically connected to one end of the feed via; A first coupling patch pattern disposed above the patch antenna pattern; A second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern; And at least a portion of the space between the first and second coupling patch patterns, wherein the dielectric constant of at least a portion of the space between the patch antenna pattern and the second coupling patch pattern is equal to the first and second coupling patch patterns. A dielectric layer disposed to be smaller than the dielectric constant of the space between the coupling patch patterns; It may include.

An antenna module according to an embodiment of the present invention, a ground layer having a plurality of through holes; A plurality of feed vias disposed to pass through the plurality of through holes, respectively; A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively; A plurality of first coupling patch patterns disposed on the plurality of patch antenna patterns; A plurality of second coupling patch patterns disposed between the plurality of first coupling patch patterns and the plurality of patch antenna patterns; And occupy at least a portion of a space between the plurality of first coupling patch patterns and the plurality of second coupling patch patterns, wherein the space between the plurality of patch antenna patterns and the plurality of second coupling patch patterns A dielectric layer disposed such that a dielectric constant of at least a portion of the dielectric constant is smaller than a dielectric constant of a space between the plurality of first coupling patch patterns and the plurality of second coupling patch patterns; It may include.

An antenna device and an antenna module according to an embodiment of the present invention may have an advantageous structure for improving or minimizing antenna performance according to an efficient configuration of a plurality of coupling patch patterns and an effective dielectric constant.

1 is a side view schematically showing an antenna device and an antenna module according to an embodiment of the present invention.
2A to 2J are side views illustrating an antenna device and an antenna module according to an embodiment of the present invention.
3A to 3C illustrate a plurality of conductive arrangement patterns that may be included in an antenna device and an antenna module according to an embodiment of the present invention.
4A to 4C are plan views illustrating an antenna device and an antenna module according to an embodiment of the present invention.
5A to 5F illustrate connection members that may be included in an antenna device and an antenna module according to an embodiment of the present invention.
6 is a diagram illustrating a modified structure of the antenna device and the antenna module according to an embodiment of the present invention.
7A and 7B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. Like reference numerals in the drawings refer to the same or similar functions throughout the several aspects.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

1 is a side view schematically showing an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 1, the antenna device 100 according to an embodiment of the present invention may be disposed above the connection member 200, and the antenna module according to an embodiment of the present invention may include the antenna device 100. It may include a plurality of antenna devices corresponding to the. According to the design, the connection member 200 may be included in the antenna device 100 and the antenna module according to an embodiment of the present invention. An integrated circuit (IC) may be disposed under the connection member 200.

The connection member 200 may be disposed in the third region 153 and may electrically connect the antenna device 100 and the antenna module to the IC according to an embodiment of the present invention, and the antenna device 100 and It may provide electromagnetic isolation and / or impedance between the antenna module and the IC.

The connection member 200 may provide an electrical ground to the antenna device 100, the antenna module, and the IC, and may include a ground layer 125, a second ground layer 202, a third ground layer 203, and a fourth ground. At least some of the layer 204, the fifth ground layer 205, and the shield via 245 may be included.

Depending on the design, the connection member 200 may include at least one end-fire antenna. The end-fire antenna may include at least some of an end-fire antenna pattern 210, an end-fire antenna feed via 211, a director pattern 215, and an end-fire antenna feedline 220, x It can transmit and receive RF (Radio Frequency) signal in the direction.

The antenna device 100 and the antenna module according to an embodiment of the present invention may include an antenna package 105 and a feed via 120, and may transmit and receive an RF signal in the z direction.

The antenna package 105 may be disposed in the first region 154, and may include patch antenna patterns, first and second coupling patch patterns to be described later, and further include a plurality of conductive array patterns according to design. can do.

The feed via 120 may be disposed in the second region 152 and may electrically connect the antenna package 105 with the connection member 200.

The antenna device 100 and the antenna module according to an embodiment of the present invention may be advantageous in miniaturization as the dielectric constants of the first and second regions 151 and 152 become larger, and the first and second regions 151 and 152. The smaller the dielectric constant, the better the antenna performance (eg gain, bandwidth).

The antenna device 100 and the antenna module according to an embodiment of the present invention may provide an advantageous structure for miniaturization while having improved antenna performance through the dielectric constant configuration of the first and second regions 151 and 152. .

2A to 2J are side views illustrating an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 2A, an antenna device according to an embodiment of the present invention may include a patch antenna pattern 110, a first coupling patch pattern 111, a second coupling patch pattern 112, and a feed via 120. , The ground layer 125, the grounding via 127, the pad 128, the electrical connection structure 129, the plurality of conductive array patterns 130, the second dielectric layer 140, the low dielectric region 145, and the dielectric layer ( 150).

Here, the dielectric layer 150 and the second dielectric layer 140 may provide an arrangement space of some of the patch antenna pattern 110, the first coupling patch pattern 111, and the second coupling patch pattern 112, respectively. have. For example, the antenna pattern 110 may be disposed on the top surface of the second dielectric layer 140 or disposed inside the second dielectric layer 140. For example, the first and second coupling patch patterns 111 and 112 may be disposed on the top or bottom surface of the dielectric layer 150 or disposed in the dielectric layer 150. For example, the dielectric layer 150 and the second dielectric layer 140 may each have a form in which a plurality of layers are stacked. Thus, each of the dielectric layer 150 and the second dielectric layer 140 may be seen to include a plurality of dielectric components in accordance with the point of view.

The ground layer 125 may improve the electromagnetic isolation between the patch antenna pattern 110 and the aforementioned connecting member, and acts as a reflector for the patch antenna pattern 110, thereby causing the RF of the patch antenna pattern 110 to be improved. The signal may be reflected in the z direction to further concentrate the RF signal in the z direction. The ground layer 125 may be disposed to secure the separation distance H4 with respect to the patch antenna pattern 110 and may have a reflector characteristic.

The ground layer 125 may have a through hole through which the feed via 120 passes. The through hole may overlap the patch antenna pattern 110 when viewed in the z direction.

The feed via 120 may transmit the RF signal received from the patch antenna pattern 110 to the aforementioned connection member and / or the IC, and transmit the RF signal received from the connection member and / or the IC to the aforementioned connection member and / or Can be delivered to the IC. Depending on the design, the plurality of feed vias 120 may be connected to a single or a plurality of patch antenna patterns 110. When the plurality of feed vias 120 are connected to a single patch antenna pattern 110, each of the plurality of feed vias 120 may include a horizontal pole RF signal and a vertical pole RF signal that are polarized with each other. It can be configured to flow.

The patch antenna pattern 110 may be disposed above the ground layer 125 and electrically connected to one end of the feed via 120. The patch antenna pattern 110 may receive the RF signal from the feed via 120 and transmit the RF signal to the feed via 120 by remotely transmitting in the z direction or remotely receiving the RF signal in the z direction.

The first coupling patch pattern 111 may be disposed above the patch antenna pattern 110. The first coupling patch pattern 111 may be electromagnetically coupled to the patch antenna pattern 110, affect the resonance frequency of the patch antenna pattern 110, and concentrate the RF signal in the z direction to patch the patch antenna pattern 110. The gain of the antenna pattern 110 can be improved.

The wavelength of the RF signal transmitted between the patch antenna pattern 110 and the first coupling patch pattern 111 becomes longer as the effective dielectric constant between the patch antenna pattern 110 and the first coupling patch pattern 111 becomes smaller. Can be. In addition, the z-direction concentration of the RF signal according to the electromagnetic coupling between the patch antenna pattern 110 and the first coupling patch pattern 111 may be greater as the wavelength of the RF signal is longer. Therefore, the gain of the patch antenna pattern 110 may be improved as the effective dielectric constant between the patch antenna pattern 110 and the first coupling patch pattern 111 is smaller.

When the effective dielectric constant between the patch antenna pattern 110 and the first coupling patch pattern 111 decreases, the size of the patch antenna pattern 110 for maintaining the resonance frequency may increase, and the patch antenna pattern 110 may be increased. ) Bandwidth can be narrowed.

Therefore, the antenna device and the antenna module according to an embodiment of the present invention further include a second coupling patch pattern 112 disposed between the patch antenna pattern 110 and the first coupling patch pattern 111. The resonance frequency of the patch antenna pattern 110 may be lowered and the bandwidth of the patch antenna pattern 110 may be widened.

The second coupling patch pattern 112 may be disposed between the first coupling patch pattern 111 and the patch antenna pattern 110. Here, the second coupling patch pattern 112 has an effective dielectric constant between the first coupling patch pattern 111 and the second coupling patch pattern 112 and the second coupling patch pattern 112 and the patch antenna pattern. It may be arranged to be higher than the effective dielectric constant between (110). Accordingly, the patch antenna pattern 110 may more easily cancel the resonance frequency shift and the bandwidth reduction according to the effective dielectric constant decrease between the patch antenna pattern 110 and the first coupling patch pattern 111. .

The dielectric layer 150 occupies at least a portion of the space between the first and second coupling patch patterns 111 and 112, but the space between the patch antenna pattern 110 and the second coupling patch pattern 112. At least a portion of the dielectric constant D _K may be disposed to be smaller than the dielectric constant D _K of the space between the first and second coupling patch patterns 111 and 112.

That is, the effective dielectric constant between the first coupling patch pattern 111 and the second coupling patch pattern 112 and the effective dielectric constant between the second coupling patch pattern 112 and the patch antenna pattern 110 may be a dielectric layer. It may be determined according to the placement position of 150.

For example, the dielectric constant of at least a portion of the space between the patch antenna pattern 100 and the second coupling patch pattern 112 may be smaller than the dielectric constant of the dielectric layer 150. That is, the space between the patch antenna pattern 110 and the second coupling patch pattern 112 may include a low dielectric region 145. For example, the low dielectric region 145 may have the same dielectric constant as air, but may include a dielectric material or an encapsulant smaller than the dielectric constant of the dielectric layer 150 to secure insulation reliability according to design. have.

For example, the dielectric layer 150 may provide a cavity below. The recessed region may lower the effective dielectric constant without increasing the physical distance between the patch antenna pattern 110 and the first and second coupling patch patterns 111 and 112 or increasing the length of the dielectric layer 150 in the z direction (H12). have. Therefore, the antenna performance and the antenna module compared to the size of the antenna performance can be further reduced.

For example, the first coupling patch pattern 111 is disposed on the dielectric layer 150 and is exposed to the upper side of the dielectric layer 150, and the second coupling patch pattern 112 is a recessed region of the dielectric layer 150. (Cavity) can be placed. For example, the distance between the second coupling patch pattern 112 and the patch antenna pattern 110 may be longer from H3 to (H2 + H3), and the second coupling patch pattern 112 and the first coupling patch may be longer. The distance between the patterns 111 may be shortened from H12 to H1. That is, the antenna device and the antenna module can more efficiently use the characteristics advantageous for the antenna performance of the low dielectric constant and more efficiently use the characteristics advantageous for the miniaturization of the high dielectric constant.

For example, the lateral length L3 of the first coupling patch pattern may be longer than the lateral length L2 of the second coupling patch pattern and shorter than the lateral length L4 of the recessed area of the dielectric layer. Accordingly, the second coupling patch pattern 112 may effectively utilize the boundary of the recessed area to improve the gain and widen the bandwidth.

For example, the lateral length L1 of the patch antenna pattern may be shorter than the lateral length L2 of the second coupling patch pattern. Accordingly, the second coupling patch pattern 112 may be more easily coupled to the patch antenna pattern 110, and the bandwidth of the patch antenna pattern 110 may be wider.

The recessed area Cavity may be omitted according to design. That is, the antenna device and the antenna module according to an embodiment of the present invention may be implemented by omitting the filling of the dielectric material and filling the dielectric material having a low dielectric constant even without the cavity, and the dielectric layer 150 The second dielectric layer 140 may be implemented through electrical bonding in a separately manufactured state.

The second dielectric layer 140 may be disposed to occupy at least a portion of the region between the ground layer 125 and the patch antenna pattern 110.

The plurality of electrical connection structures 129 may be disposed on the ground layer 125 and support the dielectric layer 150. Since each of the plurality of electrical connection structures 129 may have a predetermined height, the low dielectric region 145 may be provided.

The low dielectric region 145 may be made of air because insulation reliability can be secured without a separate insulating material. Air has a dielectric constant of substantially 1 and does not require a separate process to fill the low dielectric region 145. Therefore, the effective dielectric constant between the patch antenna pattern 110 disposed on the second dielectric layer 140 and the second coupling patch pattern 112 disposed on the dielectric layer 150 may be easily lowered.

The plurality of electrical connection structures 129 may electrically connect conductive components (eg, conductive array patterns) disposed on the dielectric layer 150 and conductive components (eg, ground layers) disposed on the second dielectric layer 140. It may have a lower melting point than the conductive component, thereby providing an electrical bonding environment in a state where the dielectric layer 150 and the second dielectric layer 140 are manufactured separately.

Meanwhile, the antenna device and the antenna module according to an embodiment of the present invention increase the sizes and / or heights of the plurality of electrical connection structures 129 even if they do not have a cavity, so that the patch antenna pattern 110 and the second antenna module are increased. The effective dielectric constant between the coupling patches 112 can be further lowered. For example, the plurality of electrical connection structures 129 may be designed to be larger than the electrical connection structure between the IC and the connection member. For example, the plurality of electrical connection structures 129 may be selected from structures such as solder balls, pins, pads, lands, or sub-substrates. It may have a structure different from the electrical connection structure to increase the size and / or height.

Meanwhile, the dielectric constant of the second dielectric layer 140 may be smaller than the dielectric constant of the dielectric layer 150. The size of the patch antenna pattern 110 and the first and second coupling patch patterns 111 and 112 to maintain the resonance frequency may be smaller as the dielectric constant of the dielectric layer 150 increases. In addition, the separation distance between the patch antenna pattern 110 and the adjacent antenna device may be smaller as the dielectric constant of the dielectric layer 150 increases. That is, the antenna device and the antenna module according to an embodiment of the present invention may improve the antenna performance by providing a low dielectric region 145 while miniaturization using the dielectric layer 150 having a large dielectric constant.

For example, the dielectric layer 150 may have a dielectric tangent smaller than the dielectric tangent D _F of the second dielectric layer 140. Accordingly, energy loss due to RF signal transmission and reception of the patch antenna pattern 110 may be reduced.

The plurality of conductive arrangement patterns 130 have a predetermined lateral length L5 and are arranged to surround along the side boundaries of the first or second coupling patch patterns 111 and 112 and the plurality of electrical connection structures 129. Can be electrically connected to the The dielectric layer 150 may provide an arrangement space of the plurality of conductive array patterns 130. The plurality of conductive array patterns 130 may be electromagnetically coupled to the first or second coupling patch patterns 111 and 112, and may improve electromagnetic isolation between the patch antenna pattern 110 and the adjacent antenna device. You can.

For example, the plurality of conductive array patterns 130 may be electrically connected to the plurality of first conductive array patterns 132 disposed at the same level as the first coupling patch patterns 111 and the plurality of grounding vias 127. It may include a plurality of connected second conductive array patterns 138 and a plurality of array vias 131 connecting the plurality of first conductive array patterns 132 and the plurality of second conductive array patterns 138, respectively. . Accordingly, since the plurality of conductive array patterns 130 may approach an electromagnetic bandgap structure, the plurality of conductive array patterns 130 may further induce a transmitted RF signal in the z direction.

For example, the plurality of conductive array patterns 130 may be electrically connected to the ground layer 125 through the plurality of grounding vias 127 and the pads 128. That is, at least a portion of each of the plurality of grounding vias 127 may be disposed in the second dielectric layer. Accordingly, the electromagnetic shielding performance of the plurality of conductive array patterns 130 may be further improved.

FIG. 2B is a diagram illustrating a structure in which a plurality of conductive array patterns are omitted in comparison with the antenna device of FIG. 2A. That is, the antenna device may not include the plurality of conductive array patterns described above.

Compared to the antenna device shown in FIG. 2A, the antenna device shown in FIG. 2B has improved antenna performance as the number of patch antenna patterns 110 decreases, and as the interval between the patch antenna patterns 110 and the adjacent antenna patterns increases, It can have improved antenna performance. Therefore, whether the aforementioned plurality of conductive array patterns are included may vary depending on the number and / or spacing of the patch antenna patterns 110.

For example, an interval between the patch antenna pattern 110 and the second coupling patch pattern 112 may be about 0.2 mm, and between the second coupling patch pattern 112 and the first coupling patch pattern 111. The spacing may be about 0.2 mm, the height in the z direction of the recessed area may be about 0.1 mm, and the height in the z direction of the first and second coupling patch patterns 111 and 112 may be about 0.015 mm. The distance between the 110 and the ground layer 125 may be about 0.3 mm.

FIG. 2C is a diagram illustrating a structure in which the size of the first and second coupling patch patterns is smaller than that of the antenna device of FIG. 2B.

Referring to FIG. 2C, the dielectric layer 150 may have a dielectric constant higher than that of the second dielectric layer 140, and may have a higher dielectric constant than the dielectric layers illustrated in FIGS. 2A and 2B. Accordingly, compared to the antenna device shown in FIG. 2B, the antenna device shown in FIG. 2C may have smaller and smaller first and second coupling patch patterns 111 and 112.

For example, the horizontal length of the patch antenna pattern 110 may be about 2.5 mm, the horizontal length of the first coupling patch pattern 111 may be about 2.1 mm, and the second coupling patch pattern ( The horizontal length of 112 may be about 1.7 mm.

FIG. 2D illustrates a structure in which the dielectric constant of the dielectric layer is lower than that of the antenna device of FIG. 2C.

Referring to FIG. 2D, the dielectric layer 150 may have a dielectric constant substantially the same as that of the second dielectric layer 140, and may have a lower dielectric constant than the dielectric layers illustrated in FIGS. 2A and 2B.

Accordingly, the distance between the first coupling patch pattern 111 and the second coupling patch pattern 112 may be shorter than that of the antenna device illustrated in FIG. 2C, and the second coupling patch pattern 112 may be shortened. ) And the patch antenna pattern 110 may be shorter than the interval.

Also, compared with the antenna device shown in FIG. 2C, the lateral length of the recessed area Cavity may be longer.

For example, an interval between the patch antenna pattern 110 and the second coupling patch pattern 112 may be about 0.28 mm, and between the second coupling patch pattern 112 and the first coupling patch pattern 111. The spacing may be about 0.12 mm, the height of the electrical connection structure 129 may be about 0.1 mm, the horizontal length of the patch antenna pattern 110 may be about 2.5 mm, the first coupling patch pattern 111 ), The horizontal length may be about 2.7 mm, and the horizontal length of the second coupling patch pattern 112 may be about 1.5 mm.

FIG. 2E is a view illustrating a structure in which a plurality of conductive array patterns are additionally arranged as compared to the antenna device of FIG. 2D.

Referring to FIG. 2E, the dielectric layer 150 includes a plurality of array vias 131, a plurality of first conductive array patterns 132, a plurality of second conductive array patterns 138, and a plurality of third conductive array patterns 133. ), A plurality of fourth conductive array patterns 134, a plurality of fifth conductive array patterns 135, a plurality of sixth conductive array patterns 136, and a plurality of seventh conductive array patterns 137. .

Compared to the antenna device shown in FIG. 2D, the antenna device shown in FIG. 2E has improved antenna performance as the number of patch antenna patterns 110 increases, and as the spacing between the patch antenna patterns 110 and the adjacent antenna patterns becomes shorter. It can have improved antenna performance. For example, the spacing may be longer than half of the wavelength of the RF signal.

FIG. 2F is a view illustrating a structure in which a second upper dielectric layer of an antenna pattern is additionally disposed as compared to the antenna device of FIG.

Referring to FIG. 2F, the second dielectric layer 140 may further include a second upper dielectric layer 141 surrounding the side of the patch antenna pattern 110. The second upper dielectric layer 141 may improve durability of the patch antenna pattern 110.

FIG. 2G is a view illustrating a structure in which an upper dielectric layer of a dielectric layer is additionally disposed in comparison with the antenna device of FIG. 2E.

Referring to FIG. 2G, the dielectric layer 150 may further include an upper dielectric layer 151 disposed over the dielectric layer 150. The upper dielectric layer 151 may improve durability of the first coupling patch pattern 111.

FIG. 2H is a view illustrating a structure in which a second upper dielectric layer of a patch antenna pattern is additionally disposed as compared to the antenna device of FIG. 2G.

Referring to FIG. 2H, the second dielectric layer 140 may further include a second upper dielectric layer 141 surrounding the side of the patch antenna pattern 110, and the dielectric layer 150 may include the first coupling patch pattern ( It may further include an upper dielectric layer 151 disposed above the 111.

FIG. 2I illustrates a structure in which the size of the recessed area is increased compared to the antenna device of FIG. 2E.

Referring to FIG. 2I, the dielectric layer 150 may include a recessed area (Cavity) having a relatively long height. Accordingly, since the effective dielectric constant of the antenna device according to an embodiment of the present invention may be further lowered, the gain of the antenna device may be further improved.

For example, the height of the recessed area Cavity may be about 0.18 mm, and the distance between the first coupling patch pattern 111 and the second coupling patch pattern 112 may be about 0.1 mm.

FIG. 2J illustrates a structure in which the recessed area is omitted in comparison with the antenna device of FIG. 2E.

Referring to FIG. 2J, the dielectric layer 150 may not include the recessed region. Accordingly, the bandwidth of the antenna device according to an embodiment of the present invention can be further widened.

For example, the height of the electrical connection structure 129 may be about 0.1mm.

3A to 3C illustrate a plurality of conductive arrangement patterns that may be included in an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 3A, the plurality of conductive array patterns 130a may include a plurality of array vias 131a, a plurality of first conductive array patterns 132a, a third conductive array pattern 133a, and a fourth conductive array pattern 134a. ), The fifth conductive array pattern 135a and the sixth conductive array pattern 136a may be disposed on the ground layer 125a including the shield via 126a.

For example, the plurality of conductive array patterns 130a may be arranged in a structure of n × 2. N is a natural number of 2 or more. That is, the plurality of conductive array patterns 130a may be arranged in two strings. The RF signal counting in the x or y direction in the patch antenna pattern may be transmitted as if it is incident on the medium of negative refractive index by a narrow gap between the string closest to the patch antenna pattern and the string farther from the patch antenna pattern among the two strings. . Therefore, the plurality of conductive array patterns 130a arranged in the structure of n × 2 may further concentrate the RF signal in the z direction. The structure of the plurality of conductive array patterns 130a is not limited to a structure of n × 2, and may vary according to design. For example, the plurality of conductive array patterns 130a may be arranged in a structure of n × 1.

Referring to FIG. 3B, the antenna device 100a may include a plurality of conductive array patterns 130a disposed to surround a side boundary of the patch antenna pattern 110a and the coupling patch pattern 115a. Accordingly, the plurality of conductive array patterns 130a can induce the RF signal more efficiently in the z direction.

In addition, the feed via 120a may be connected to the patch antenna pattern 110a and disposed to penetrate the ground layer 125a. The ground layer 125a may be included in the connection member 1200a.

Referring to FIG. 3C, the patch antenna pattern 110b of the antenna device according to an embodiment of the present invention may transmit an RF signal or receive an RF signal to a source SRC2 such as an IC, and have a resistance value R2. And may have inductances L3 and L4.

The plurality of conductive array patterns 130b may include capacitances C5 and C12 for the patch antenna pattern 110b, capacitances C6 and 10 between the plurality of conductive array patterns, and inductances L5 and L6 of the array vias. The capacitors may have capacitances C7 and C11 between the plurality of conductive array patterns and the ground layer.

Frequency band and bandwidth of the antenna device according to an embodiment of the present invention may be determined by the above-described resistance value, capacitance and inductance.

4A to 4C are plan views illustrating an antenna device and an antenna module according to an embodiment of the present invention.

4A and 4B, an antenna module according to an embodiment of the present disclosure may include a plurality of patch antenna patterns 110c, ground layers 125c, a plurality of conductive array patterns 130c, and a plurality of end-fires. At least some of the antenna pattern 210c, the plurality of director patterns 215c, and the plurality of end-fire feed lines 220c may be included.

The plurality of end-fire antenna patterns 210c may form a radiation pattern in a second direction to transmit or receive an RF signal in a second direction (eg, a lateral direction). For example, the plurality of end-fire antenna patterns 210c may be disposed adjacent to the side of the connection member in the connection member, and may have a dipole shape or a folded dipole shape. Here, one end of each pole of the plurality of end-fire antenna patterns 210c may be electrically connected to the first and second lines of the plurality of end-fire antenna feed lines 220c. The frequency band of the plurality of end-fire antenna patterns 210c may be designed to be substantially the same as the frequency band of the plurality of patch antenna patterns 110c, but is not limited thereto.

The plurality of director patterns 215c may be electromagnetically coupled to the plurality of end-fire antenna patterns 210c to improve the gain or bandwidth of the plurality of end-fire antenna patterns 210c.

The plurality of end-fire antenna feedlines 220c may transmit RF signals received from the plurality of end-fire antenna patterns 210c to the IC, and the RF signals received from the IC may receive the plurality of end-fire antenna patterns 210c. ) Can be delivered. The plurality of end-fire antenna feed lines 220c may be implemented by wiring of a connection member.

Therefore, since the antenna module according to an embodiment of the present invention can form radiation patterns in the first and second directions, the RF signal transmission / reception direction can be expanded omni-directionally.

On the other hand, the antenna device according to an embodiment of the present invention may be arranged in a structure of n X m as shown in Figure 4a, the antenna module including the antenna device may be disposed adjacent to the vertex of the electronic device have.

In addition, the antenna device according to an embodiment of the present invention may be arranged in a structure of n X 1 as shown in Figure 4b, the antenna module including the antenna device is adjacent to the middle point of the corner of the electronic device Can be arranged.

Referring to FIG. 4C, an antenna module according to an exemplary embodiment may include a plurality of patch antenna patterns 110d, ground layers 125d, a plurality of conductive array patterns 130d, and a plurality of end-fire antenna patterns ( 210d), a plurality of director patterns 215d, and a plurality of end-fire antenna feedlines 220d.

That is, the plurality of conductive array patterns 130d may be arranged in a structure of n × 1, may be arranged to surround each of the plurality of patch antenna patterns 110d, and may be spaced apart from each other. Accordingly, the influence of the plurality of antenna devices on each other can be reduced.

5A to 5F illustrate connection members that may be included in an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 5A, an antenna module according to an embodiment of the present disclosure may include a connection member 200, an IC 310, an adhesive member 320, an electrical connection structure 330, an encapsulant 340, and a passive component. At least some of the 350 and the sub-substrate 410 may be included.

The connection member 200 may have a structure similar to the connection member described above with reference to FIGS. 1 to 4C.

The IC 310 is the same as the above-described IC, and may be disposed below the connection member 200. The IC 310 may be electrically connected to a wire of the connection member 200 to transmit or receive an RF signal, and may be electrically connected to a ground layer of the connection member 200 to receive ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may bond the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200. For example, the electrical connection structure 330 may have a structure such as solder balls, pins, lands, and pads. The electrical connection structure 330 may have a lower melting point than the wiring of the connection member 200 and the ground layer to electrically connect the IC 310 and the connection member 200 through a predetermined process using the low melting point.

The encapsulant 340 may seal at least a portion of the IC 310, and may improve heat dissipation performance and impact protection performance of the IC 310. For example, the encapsulant 340 may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like.

The passive component 350 may be disposed on the bottom surface of the connection member 200, and may be electrically connected to the wiring and / or the ground layer of the connection member 200 through the electrical connection structure 330. For example, the passive component 350 may include at least some of a capacitor (eg, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

The sub-substrate 410 may be disposed under the connection member 200, and may receive an intermediate frequency (IF) signal or a base band signal from the outside and transmit the received signal to the IC 310 or from the IC 310. It may be electrically connected to the connection member 200 to receive the IF signal or the baseband signal to transmit to the outside. Here, the frequency (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) of the RF signal is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the sub-substrate 410 may transfer the IF signal or the baseband signal to or from the IC 310 through a wire that may be included in the IC ground layer of the connection member 200. Since the first ground layer of the connection member 200 is disposed between the IC ground layer and the wiring, the IF signal or the baseband signal and the RF signal may be electrically isolated in the antenna module.

Referring to FIG. 5B, the antenna module according to an exemplary embodiment may include at least some of the shielding member 360, the connector 420, and the chip antenna 430.

The shielding member 360 may be disposed under the connection member 200 to confine the IC 310 together with the connection member 200. For example, the shield member 360 may be disposed to cover (eg, conformal shield) the IC 310 and the passive component 350 together or to cover each other (eg, the compartment shield). For example, the shielding member 360 may have a shape of a hexahedron having one surface opened, and may have a hexahedral receiving space through coupling with the connection member 200. The shielding member 360 may be made of a material having high conductivity, such as copper, to have a short skin depth, and may be electrically connected to the ground layer of the connection member 200. Accordingly, the shielding member 360 may reduce electromagnetic noise that may be received by the IC 310 and the passive component 350.

The connector 420 may have a connection structure of a cable (eg, coaxial cable, flexible PCB), may be electrically connected to the IC ground layer of the connection member 200, and may play a role similar to that of the above-described sub substrate. have. That is, the connector 420 may receive an IF signal, a baseband signal and / or a power from a cable, or provide an IF signal and / or a baseband signal to a cable.

The chip antenna 430 may transmit or receive an RF signal in support of an antenna device according to an exemplary embodiment. For example, the chip antenna 430 may include a dielectric block having a dielectric constant greater than that of the insulating layer, and a plurality of electrodes disposed on both surfaces of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connection member 200, and the other may be electrically connected to the ground layer of the connection member 200.

Referring to FIG. 5C, the ground layer 201a may have a through hole through which the feed via 120a passes, and may be connected to the other end of the grounding via 185a. The ground layer 201a may electromagnetically shield between the patch antenna pattern 110a and the feed line.

Referring to FIG. 5D, the second ground layer 202a may surround at least a portion of the end-fire antenna feedline 220a and the patch antenna feedline 221a, respectively. The end-fire antenna feedline 220a may be electrically connected to the second wiring via 232a, and the patch antenna feedline 221a may be electrically connected to the first wiring via 231a. The second ground layer 202a may electromagnetically shield between the end-fire antenna feedline 220a and the patch antenna feedline 221a. One end of the end-fire antenna feedline 220a may be connected to the end-fire antenna feed via 211a.

Referring to FIG. 5E, the third ground layer 203a may have a plurality of through holes through which the first wiring via 231a and the second wiring via 232a pass, respectively, and form the coupling ground pattern 235a. Can have. The third ground layer 203a may electromagnetically shield between the feedline and the IC.

Referring to FIG. 5F, the fourth ground layer 204a may have a plurality of through holes through which the first wiring via 231a and the second wiring via 232a respectively pass. The IC 310a may be disposed under the fourth ground layer 204a and may be electrically connected to the first wiring via 231a and the second wiring via 232a. The end-fire antenna pattern 210a and the director pattern 215a may be disposed at substantially the same height as the fourth ground layer 204a.

The fourth ground layer 204a may provide a ground used in a circuit and / or a passive component of the IC 310a to the IC 310a and / or a passive component. Depending on the design, the fourth ground layer 204a may provide a path for the transmission of power and signals used in the IC 310a and / or passive components. Thus, the fourth ground layer 204a may be electrically connected to the IC and / or the passive component.

Meanwhile, the second ground layer 202a, the third ground layer 203a, and the fourth ground layer 204a may have a recessed shape to provide a cavity. Accordingly, the end-fire antenna pattern 210a may be further disposed closer to the IC ground layer 204a. The cavity may be disposed at a position different from the recessed region described above with reference to FIGS. 1 to 4C.

Meanwhile, the vertical relationship and shape of the second ground layer 202a, the third ground layer 203a, and the fourth ground layer 204a may vary depending on the design. The fifth ground layer shown in FIG. 1 may have a structure / role similar to that of the fourth ground layer 204a.

6 is a diagram illustrating a modified structure of the antenna device and the antenna module according to an embodiment of the present invention.

Referring to FIG. 6, in the antenna module according to the exemplary embodiment, the end-fire antenna 100f, the patch antenna pattern 1110f, the IC 310f, and the passive component 350f are integrated into the connection member 500f. It can have a structure.

The end-fire antenna 100f and the patch antenna pattern 1110f may be designed in the same manner as the end-fire antenna and the patch antenna pattern described above, respectively, and receive or transmit RF signals from the IC 310f. The received RF signal to the IC 310f.

The connection member 500f may have a structure in which at least one conductive layer 510f and at least one insulating layer 520f are stacked (eg, a structure of a printed circuit board). The conductive layer 510f may have the above-described ground layer and a feed line.

In addition, the antenna module according to an exemplary embodiment may further include a flexible connection member 550f. The flexible connecting member 550f may include a first flexible region 570f overlapping the connecting member 500f and a second flexible region 580f not overlapping the connecting member 500f when viewed in the vertical direction.

The second flexible region 580f may be flexibly curved in the vertical direction. Accordingly, the second flexible region 580f may be flexibly connected to the connector of the set board and / or the adjacent antenna module.

The flexible connection member 550f may include a signal line 560f. The intermediate frequency (IF) signal and / or the baseband signal may be transmitted to the IC 310f through the signal line 560f or to the connector and / or the adjacent antenna module of the set board.

7A and 7B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

Referring to FIG. 7A, an antenna module including an end-fire antenna 100g, a patch antenna pattern 1110g, and an insulating layer 1140g may be used for the electronic device 700g on the set substrate 600g of the electronic device 700g. May be disposed adjacent to the lateral boundary.

The electronic device 700g includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer. ), Monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc. It is not limited.

The communication module 610g and the baseband circuit 620g may be further disposed on the set substrate 600g. The antenna module may be electrically connected to the communication module 610g and / or the baseband circuit 620g through the coaxial cable 630g. Depending on the design, the coaxial cable 630g may be replaced with the flexible connecting member shown in FIG.

The communication module 610g may include a memory chip such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory to perform digital signal processing; Application processor chips such as central processors (eg, CPUs), graphics processors (eg, GPUs), digital signal processors, cryptographic processors, microprocessors, microcontrollers; It may include at least a portion of a logic chip, such as an analog-to-digital converter, an application-specific IC (ASIC).

The baseband circuit 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input and output from the baseband circuit 620g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through the electrical connection structure, the core via, and the wiring. The IC may convert the base signal into an RF signal of millimeter wave (mmWave) band.

Referring to FIG. 7B, a plurality of antenna modules each including an end-fire antenna 100h, a patch antenna pattern 1110h, and an insulating layer 1140h may be provided on the set substrate 600h of the electronic device 700h. 700h may be disposed adjacent to one side boundary and the other side boundary, and a communication module 610h and a baseband circuit 620h may be further disposed on the set substrate 600h. The plurality of antenna modules may be electrically connected to the communication module 610h and / or the baseband circuit 620h through the coaxial cable 630h.

Meanwhile, the patch antenna pattern, the coupling patch pattern, the conductive array pattern, the feed via, the array via, the grounding via, the shield via, the ground layer, the end-fire antenna pattern, the director pattern, and the electrical connection structure disclosed in the present specification may be made of metal. Materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof Conductive material), and may include chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, subtractive, additive, additive (Semi-Additive Process), MSAP It may be formed according to a plating method such as (Modified Semi-Additive Process), but is not limited thereto.

Meanwhile, the dielectric layers disclosed herein include FR4, Liquid Crystal Polymer (LCP), Low Temperature Co-fired Ceramic (LTCC), thermosetting resins such as epoxy resins, thermoplastic resins such as polyimide, or these resins together with inorganic fillers. Resin, prepreg, Ajinomoto build-up film (ABF), FR-4, Bisaleimide Triazine (BT), Photo Imagable (impregnated) in core materials such as glass fiber, glass cloth, and glass fabric Dielectric: PID) resin, copper clad laminate (CCL), or glass or ceramic-based insulation may be implemented. The dielectric layer may include a patch antenna pattern, a coupling patch pattern, a conductive array pattern, a feed via, an array via, a grounding via, a shield via, a ground layer, an end-fire antenna pattern, and a director pattern in the antenna device and the antenna module disclosed herein. The coupling ground pattern and the electrical connection structure may be filled in at least part of the non-positioned position.

On the other hand, RF signals disclosed herein are Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, It may have a format in accordance with, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless and wired protocols designated.

Although the present invention has been described by specific embodiments such as specific components and limited embodiments and drawings, it is provided to help a more general understanding of the present invention, but the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations can be made from such a description.

110: patch antenna pattern
111: first coupling patch pattern
112: second coupling patch pattern
120: feed via
125: ground layer
127: grounding via
129: electrical connection structure
130: conductive array pattern
131: array via
132: first conductive array pattern
138: second conductive array pattern
140: second dielectric layer
141: second upper dielectric layer
145: low dielectric area
150: dielectric layer
151: upper dielectric layer
200: connecting member
202: second ground layer
203: third ground layer
204: fourth ground layer
205: fifth ground layer
210: end-fire antenna pattern
215: director pattern
220: end-fire antenna feedline
245: shielded via

Claims (16)

A ground layer having a through hole;
A feed via disposed to pass through the through hole;
A patch antenna pattern disposed above the ground layer and electrically connected to one end of the feed via;
A first coupling patch pattern disposed above the patch antenna pattern;
A second coupling patch pattern disposed between the first coupling patch pattern and the patch antenna pattern; And
Occupy at least a portion of a space between the first and second coupling patch patterns, wherein a dielectric constant of at least a portion of the space between the patch antenna pattern and the second coupling patch pattern is A dielectric layer disposed to be smaller than the dielectric constant of the space between the ring patch patterns; Antenna device comprising a.
The method of claim 1,
And a dielectric constant of at least a portion of the space between the patch antenna pattern and the second coupling patch pattern is smaller than the dielectric constant of the dielectric layer.
The method of claim 1,
And the dielectric layer provides a recessed area below.
The method of claim 3,
The first coupling patch pattern is disposed on the dielectric layer and is disposed to be exposed to an upper side of the dielectric layer,
The second coupling patch pattern is disposed in the recessed region of the dielectric layer.
The method of claim 4, wherein
And the lateral length of the first coupling patch pattern is longer than the lateral length of the second coupling patch pattern and shorter than the lateral length of the recessed area of the dielectric layer.
The method of claim 5,
And the lateral length of the patch antenna pattern is shorter than the lateral length of the second coupling patch pattern.
The method of claim 4, wherein
And an upper dielectric layer disposed over the dielectric layer and surrounding the first coupling patch pattern.
The method of claim 1,
A plurality of electrical connection structures disposed on the ground layer and supporting the dielectric layer; And
A plurality of grounding vias disposed to electrically connect the plurality of electrical connection structures and the ground layer; Antenna device further comprising.
The method of claim 8,
A second dielectric layer disposed to occupy at least a portion of an area between the ground layer and the patch antenna pattern,
At least a portion of each of the plurality of grounding vias is disposed in the second dielectric layer,
And the plurality of electrical connection structures are disposed above the second dielectric layer.
The method of claim 9,
And a dielectric constant of the second dielectric layer is smaller than that of the dielectric layer.
The method of claim 8,
And a plurality of conductive arrangement patterns arranged to enclose along side boundaries of the first or second coupling patch patterns and electrically connected to the plurality of electrical connection structures.
The method of claim 11, wherein the plurality of conductive array patterns,
A plurality of first conductive array patterns disposed equal to the first coupling patch pattern;
A plurality of second conductive array patterns electrically connected to the plurality of grounding vias; And
A plurality of array vias connecting the plurality of first conductive array patterns and the plurality of second conductive array patterns, respectively; Antenna device comprising a.
The method of claim 1,
And a plurality of conductive array patterns arranged to enclose along a side boundary of the first or second coupling patch pattern and at least a portion of which is disposed in the dielectric layer.
The method of claim 13, wherein the plurality of conductive array patterns,
A plurality of first and second conductive array patterns; And
A plurality of array vias connecting the plurality of first conductive array patterns and the plurality of second conductive array patterns, respectively; Antenna device comprising a.
A ground layer having a plurality of through holes;
A plurality of feed vias disposed to pass through the plurality of through holes, respectively;
A plurality of patch antenna patterns disposed above the ground layer and electrically connected to one ends of the plurality of feed vias, respectively;
A plurality of first coupling patch patterns disposed on the plurality of patch antenna patterns;
A plurality of second coupling patch patterns disposed between the plurality of first coupling patch patterns and the plurality of patch antenna patterns; And
Occupy at least a portion of a space between the plurality of first coupling patch patterns and the plurality of second coupling patch patterns, wherein the space between the plurality of patch antenna patterns and the plurality of second coupling patch patterns A dielectric layer disposed such that at least a portion of the dielectric constant is smaller than a dielectric constant of a space between the plurality of first coupling patch patterns and the plurality of second coupling patch patterns; Antenna module comprising a.
The method of claim 15,
A plurality of patch antenna feedlines disposed below the ground layer and each electrically connected to the plurality of feed vias;
An IC disposed below the plurality of patch antenna feedlines; And
A plurality of wiring vias arranged to electrically connect the plurality of patch antenna feedlines to the IC; Antenna module further comprising.

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