KR102117513B1 - Antenna apparatus and antenna module - Google Patents

Abstract

The antenna device according to an embodiment of the present invention includes a ground pattern having a through hole, an antenna pattern disposed on the upper side of the ground pattern and configured to transmit or receive an RF signal, and an antenna pattern disposed to penetrate through the through hole And a meta member having a structure in which a plurality of cells each including a feed via electrically connected to the plurality of cells and at least one conductive via electrically connecting the plurality of conductive patterns and the plurality of conductive patterns are repeatedly spaced apart, The meta member is disposed along at least a portion of the side border of the antenna pattern from the upper side of the ground pattern, and may be disposed to extend to a higher level than the antenna pattern.

Description

Antenna device and antenna module

The present invention relates to an antenna device and an antenna module.

Data traffic of mobile communication is increasing rapidly every year. Active technology development is in progress to support such leap data in real time in a wireless network. For example, the content of IoT (Internet of Thing)-based data, live VR/AR combined with Augmented Reality (AR), Virtual Reality (VR), and SNS, autonomous driving, sync view (Sync View) Applications such as real-time video transmission) require communication (eg, 5G communication, mmWave communication, etc.) to support the exchange of large amounts of data.

Therefore, in recent years, millimeter wave (mmWave) communication including the 5th generation (5G) communication has been actively researched, and research for commercialization/standardization of the antenna module that smoothly implements it has been actively conducted.

RF signals in high frequency bands (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lead to loss in the process of transmission, so the quality of communication may drop rapidly. Therefore, the antenna for communication in the high frequency band requires a different technical approach from the existing antenna technology, and separates for securing the antenna gain, integrating the antenna with the RFIC, and securing the effective isotropic radiated power (EIRP). It may require the development of special technologies such as power amplifiers.

Traditionally, antenna modules that provide millimeter wave communication environments have coaxial cables by placing ICs and antennas on the board to satisfy high-level antenna performance (e.g., transmit/receive rate, gain, directivity, etc.) according to high frequencies. It has been using structures to connect to. However, such a structure may cause an insufficient space for antenna placement, limited freedom in antenna shape, increased interference between the antenna and the IC, and increased size/cost of the antenna module.

U.S. Patent Publication No. 9,030,360

The present invention provides an antenna device and an antenna module that can improve antenna performance (eg, transmit/receive rate, gain, bandwidth, directivity, etc.) or have a structure advantageous for miniaturization.

An antenna device according to an embodiment of the present invention, a ground pattern having a through hole; An antenna pattern disposed above the ground pattern and configured to transmit or receive an RF signal; A feed via disposed through the through hole and electrically connected to one end of the antenna pattern; And a plurality of cells each including a plurality of conductive patterns and at least one conductive via electrically connecting the plurality of conductive patterns. Including, the meta member is disposed along at least a portion of the side border of the antenna pattern on the upper side of the ground pattern, it may be extended to be disposed above the antenna pattern.

The antenna module according to an embodiment of the present invention includes a plurality of wiring lines, a ground pattern disposed above the plurality of wiring lines, and a plurality of wiring vias electrically connected to the plurality of wiring lines below the plurality of wiring lines. Connection member comprising a; An IC electrically connected to the wiring via and disposed under the connection member; And a plurality of antenna devices electrically connected to the plurality of wires and disposed above the connecting member. Including, and at least one of the plurality of antenna devices, an antenna pattern configured to transmit or receive an RF signal; An upper coupling pattern disposed on the upper side of the antenna pattern so that at least a portion overlaps the antenna pattern when viewed in the vertical direction; A first feed via having one end electrically connected to a point biased in a second lateral direction from the center of the antenna pattern; A second feed via having one end electrically connected to a point biased in a first lateral direction from the center of the antenna pattern; And a plurality of conductive patterns arranged to have a negative refractive index for the RF signal, and a meta member surrounding the antenna pattern when viewed in the vertical direction; It may include.

The antenna device and the antenna module according to an embodiment of the present invention further improve the antenna performance (eg, transmission/reception rate, gain, bandwidth, directivity, etc.) by concentrating the radiation pattern of the antenna pattern, or have a structure advantageous for miniaturization Can have

The antenna device and the antenna module according to an embodiment of the present invention may have a wide bandwidth or dual-band transmission/reception by extending a frequency band according to an intrinsic element of an antenna pattern.

The antenna device and the antenna module according to an embodiment of the present invention can further improve antenna performance by concentrating each of a plurality of surface currents of a dual feeding type antenna pattern.

1 is a perspective view showing an antenna device according to an embodiment of the present invention.
2A to 2E are plan views illustrating various structures of an antenna device according to an embodiment of the present invention.
3A and 3B are plan views illustrating meta members corresponding to surface current flow in an antenna device according to an embodiment of the present invention.
4A and 4B are side views illustrating various structures of an antenna device according to an embodiment of the present invention.
5A is a perspective view showing a cross-section of an antenna device according to an embodiment of the present invention.
5B is a perspective view showing a cross-section of a meta member of an antenna device according to an embodiment of the present invention.
6A and 6B are side views illustrating various structures of a meta member of an antenna device according to an embodiment of the present invention.
7 is a side view showing an RF signal transmission path of an antenna device according to an embodiment of the present invention.
8A is a circuit diagram showing an equivalent circuit of an antenna device according to an embodiment of the present invention.
8B is a graph showing S parameters of an antenna device according to an embodiment of the present invention.
9A and 9B are perspective and plan views illustrating a circular antenna pattern and a meta member surrounding a circular antenna pattern of an antenna device according to an embodiment of the present invention.
10A to 10C are plan views illustrating an antenna module in which an antenna device according to an embodiment of the present invention is arranged.
11 is a side view showing a schematic structure of an antenna module including an antenna device according to an embodiment of the present invention.
12A and 12B are side views illustrating various structures of an antenna module including an antenna device according to an embodiment of the present invention.
13A and 13B are diagrams illustrating a lower structure of a connecting member of an antenna module including an antenna device according to an embodiment of the present invention.
14A and 14B are plan views illustrating an arrangement of an antenna module in an electronic device according to an embodiment of the present invention.

For a detailed description of the present invention, which will be described later, reference is made to the accompanying drawings that illustrate, by way of example, specific embodiments in which the invention may be practiced. These examples are described in detail enough to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain shapes, structures, and properties described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in relation to one embodiment. In addition, it should be understood that the location or placement of individual components within each disclosed embodiment can be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention is limited only by the appended claims, along with all ranges equivalent to those claimed. In the drawings, similar reference numerals refer to the same or similar functions throughout several aspects.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those skilled in the art to easily implement the present invention.

1 is a perspective view showing an antenna device according to an embodiment of the present invention.

Referring to FIG. 1, an antenna device 100a according to an embodiment of the present invention may include an antenna pattern 110a, a feed via 120a, a ground pattern 125a, and a meta member 130a. In the present specification, the vertical direction means the vertical direction of the upper surface and/or the lower surface of the ground pattern 125a, and in this specification, an upper level and a lower level are defined based on the vertical direction.

The antenna pattern 110a may be configured to remotely receive and transmit an RF signal to the feed via 120a or to receive and transmit an RF signal from the feed via 120a. The antenna pattern 110a may have an intrinsic frequency band (eg, 28 GHz) according to an intrinsic element (eg, shape, size, height, dielectric constant of an insulating layer, etc.).

For example, the antenna pattern 110a may have a structure of a patch antenna having both circular and polygonal surfaces. Both sides of the patch antenna may act as a boundary through which the RF signal passes between the conductor and the non-conductor.

The feed via 120a may transmit the RF signal received from the antenna pattern 110a to the IC, and may transmit the RF signal received from the IC to the antenna pattern 110a.

For example, the number of feed vias 120a electrically connected to one antenna pattern may be two or more. When the number of the feed vias 120a is plural, the feed vias 120a may be configured such that RF signals of different phases (for example, 90 degree phase difference and 180 degree phase difference) pass through, respectively, and RF signals at different times. Can be configured to pass through, and the RF signal to be transmitted and the received RF signal can be configured to pass through, respectively. Here, the phase difference of the RF signal may be implemented through a phase shifter of the IC, or may be implemented through a difference in electrical length of the wiring.

The ground pattern 125a may be disposed under the antenna pattern 110a, and may have at least one through hole. The feed via 120a may be disposed to penetrate the at least one through hole.

Since the ground pattern 125a is disposed to block between the upper antenna pattern 110a and the lower connecting member 1200a, the isolation between the antenna pattern 110a and the connecting member 1200a can be improved. In addition, the ground pattern 125a may provide capacitance according to electromagnetic coupling with the antenna pattern 110a to the antenna pattern 110a. In addition, since the ground pattern 125a reflects the RF signal of the antenna pattern 110a, the RF signal can be further concentrated in the upward direction, thereby improving the antenna performance of the antenna pattern 110a.

The meta member 130a may have a structure in which a plurality of cells each including a plurality of conductive patterns smaller than the antenna pattern 110a and at least one via electrically connecting the plurality of conductive patterns are repeatedly spaced apart. have. Accordingly, the meta member 130a may have an electromagnetic bandgap structure, and thus may have a negative refractive index for the RF signal.

The meta member 130a is spaced apart on the upper surface of the ground pattern 125a so as not to overlap the antenna pattern 110a when viewed in the vertical direction, and spaced from the middle height of the meta member 130a to the ground pattern 125a The distance may be arranged to be longer than the separation distance between the antenna pattern 110a and the ground pattern 125a. That is, the meta member 130a is disposed along at least a portion of the side boundary of the antenna pattern 110a on the upper side of the ground pattern 125a, but may be extended and disposed above the antenna pattern 110a.

Accordingly, the meta member 130a can more effectively utilize the negative refractive index to concentrate the RF signal of the antenna pattern 110a in the upward direction, thereby further improving the antenna performance of the antenna pattern 110a. .

Referring to FIG. 7, the ground pattern 125a may reflect an RF signal incident from the antenna pattern 110a. The reflected RF signal may be transmitted to the meta member 130a. The direction of the side vector of the RF signal passing through the meta member 130a may be changed in the opposite direction by the negative refractive index of the meta member 130a. Accordingly, the RF signal passing through the meta member 130a may be focused in the upward direction.

Meanwhile, the meta member 130a may be electromagnetically coupled to the antenna pattern 110a. Elements of the meta member 130a (eg, height, metal plate shape, metal plate size, number of metal plates, spacing between a plurality of metal plates, Frequency characteristics of the antenna pattern 110a may be affected depending on the distance between the antenna pattern and the like.

Accordingly, the antenna pattern 110a may have an extended frequency band (eg, 26 GHz, 38 GHz). When the extended frequency band is adjacent to the intrinsic frequency band, the antenna pattern 110a may have a wide bandwidth. When the extended frequency band is not adjacent to the intrinsic frequency band, the antenna pattern 110a may perform dual-band transmission and reception.

Referring to FIG. 1, the antenna device 100a according to an embodiment of the present invention may further include an upper coupling member 115a spaced apart on the upper surface of the antenna pattern 110a. The upper coupling member 115a may provide capacitance according to electromagnetic coupling with the antenna pattern 110a to the antenna pattern 110a, and enlarge the RF signal transmission/reception area of the antenna pattern 110a. . Accordingly, the gain or bandwidth of the antenna pattern 110a can be improved.

Depending on the arrangement of the upper coupling member 115a, the optimal position for connection of the feed via 120a in the antenna pattern 110a may be far from the center of the antenna pattern 110a.

Referring to FIG. 3A, when the optimal position is closest to the second side direction (for example, 270 degree direction) of the antenna pattern 110a, the antenna pattern 110a is transmitted and received according to the RF signal transmission/reception of the antenna pattern 110a. The flowing surface current may flow toward the fourth lateral direction of the antenna pattern 110a (eg, 90 degree direction). At this time, the surface current may be distributed in the first lateral direction (eg, 0 degree direction) and the third lateral direction (eg, 180 degree direction). It is possible to suppress the RF signal according to the dispersed component from counting in the first and third side directions.

Referring to FIG. 3B, when the optimal position is closest to the first lateral direction (for example, the 0-degree direction) of the antenna pattern 110a, the antenna pattern 110a is transmitted and received according to the RF signal transmission/reception of the antenna pattern 110a. The flowing surface current may flow toward the third side direction (eg, 180 degree direction) of the antenna pattern 110a. At this time, the surface current may be distributed in the second side direction (for example, 270 degree direction) and the fourth side direction (for example, 90 degree direction). It is possible to suppress the RF signal according to the dispersed component from counting in the second and fourth side directions.

Accordingly, the meta member 130a surrounding the antenna pattern 110a and/or the upper coupling member 115a can suppress the RF signal of the antenna pattern 110a from being lateral, so that the antenna pattern 110a Antenna performance can be further improved.

2A to 2E are plan views illustrating various structures of an antenna device according to an embodiment of the present invention.

Referring to FIG. 2A, the meta member 130a may be disposed to surround the antenna pattern 110a when viewed in the vertical direction, and may be disposed to have a uniform separation distance to the antenna pattern 110a. Accordingly, the meta member 130a can effectively suppress the RF signal of the antenna pattern 110a from being sideways, and efficiently concentrate the RF signal reflected from the ground pattern in the upward direction.

2B and 2C, the meta member 130a may surround only a portion of the antenna pattern 110a. Accordingly, the antenna device according to an embodiment of the present invention can suppress the increase in size due to the use of the meta member 130a while improving the antenna performance by utilizing the negative refractive index of the meta member 130a.

Referring to FIG. 2D, the meta member 130a may further include a plurality of dummy cells disposed adjacent to a vertex of a polygon. In addition, the size of the conductive pattern of each of the plurality of dummy cells may be larger than the size of the conductive pattern of the meta member. Accordingly, the antenna device according to an embodiment of the present invention can be easily combined with the meta member of the adjacent antenna device in the antenna module without significantly affecting the negative refractive index characteristic of the meta member 130a. Therefore, the antenna device according to an embodiment of the present invention can improve antenna performance in terms of an array.

Meanwhile, referring to FIGS. 2A to 2D, the antenna pattern 110a may include a slit 122a formed adjacent to a point where the feed via is connected. The slit 122a may affect the impedance of the antenna pattern 110a, and induce surface current flowing through the antenna pattern 110a to flow from one slit to the other slit. Accordingly, the RF signal counting from the antenna pattern 110a to the side may be reduced.

Meanwhile, referring to FIG. 2E, an antenna device according to an embodiment of the present invention may include an antenna pattern 110d, a ground pattern 125d, and a meta member 130d. Here, the plurality of cells included in the meta member 130d may be arranged in a structure of n X 1. Here, n is a natural number greater than 2. That is, a plurality of cells may be arranged in one string. Accordingly, the size of the antenna device according to an embodiment of the present invention may be reduced.

4A and 4B are side views illustrating various structures of an antenna device according to an embodiment of the present invention.

Referring to FIG. 4A, the lower conductive pattern of the meta member 130a may be disposed at the same height as the antenna pattern. Therefore, the separation distance from the middle height of the meta member 130a to the ground pattern 125a may be longer than the separation distance from the antenna pattern to the ground pattern 125a.

Referring to FIG. 4B, the entire conductive pattern of the meta member 130a may be disposed at a higher position than the antenna pattern 110a. The height of the meta member 130a may vary depending on the frequency of the RF signal, the antenna performance design condition, or the number/interval/size of the antenna devices included in the antenna module.

5A is a perspective view showing a cross-section of an antenna device according to an embodiment of the present invention.

Referring to FIG. 5A, the ground pattern 125a includes at least a portion of the meta member 130a and at least a portion of the antenna pattern 110a to cover between the meta member 130a and the antenna pattern 110a when viewed in the vertical direction. Can overlap together. Accordingly, since the ground pattern 125a can more intensively reflect the RF signal of the antenna pattern 110a to the meta member 130a, antenna performance of the antenna device according to an embodiment of the present invention may be improved. .

Referring to FIG. 5A, the average separation distance d2 from the ground pattern 125a of the plurality of conductive patterns included in the meta member 130a is the separation distance from the ground pattern 125a of the antenna pattern 110a ( It may be disposed to be longer than d3) and shorter than the distance d4 of the upper coupling pattern 115a from the ground pattern 125a. Accordingly, the RF signal reflected from the ground pattern 125a may be transmitted from the meta member 130a to the meta member 130a at an appropriate angle concentrated in the upward direction. Accordingly, antenna performance of the antenna device according to an embodiment of the present invention may be improved.

Referring to FIG. 5A, the distance from the ground pattern 125a of the uppermost conductive pattern among the plurality of conductive patterns included in the meta member 130a is the distance from the ground pattern 125a of the upper coupling pattern 115a ( d4), and the distance from the ground pattern 125a of the lowest conductive pattern among the plurality of conductive patterns included in the meta member 130a is from the ground pattern 125a of the antenna pattern 110a. It may be arranged to be substantially equal to the separation distance (d3) of. That is, the meta member 130a is disposed along at least a portion of the side border of the antenna pattern 110a, and may be extended to the same level as the upper coupling pattern 115a. Accordingly, the meta member 130a can more efficiently induce the RF signal counting from the antenna pattern 110a and the upper coupling pattern 115a in the upward direction.

Referring to FIG. 5A, a separation distance from a ground pattern of at least one of a plurality of conductive patterns included in the meta member 130a (eg, a middle height conductive pattern) is a ground pattern 125a of the upper coupling pattern 115a. It may be arranged to be shorter than the separation distance d4 from and longer than the separation distance d3 from the ground pattern 125a of the antenna pattern 110a. At least one of the plurality of conductive patterns included in the meta member 130a physically blocks the antenna pattern and the upper coupling pattern and the antenna pattern 110a and the upper coupling pattern 115a of another antenna device in the antenna module. Can be. Accordingly, the isolation between the antenna device and the adjacent antenna device according to an embodiment of the present invention can be improved.

Referring to FIG. 5A, the separation distance d1 for the antenna pattern 110a of the plurality of conductive patterns included in the meta member 130a is the separation distance from the ground pattern 125a of the upper coupling pattern 115a ( It may be arranged to be shorter than d4) and longer than the distance d3 of the antenna pattern 110a from the ground pattern 125a. Accordingly, the RF signal reflected from the ground pattern 125a may be transmitted from the meta member 130a to the meta member 130a at an appropriate angle concentrated in the upward direction. Accordingly, antenna performance of the antenna device according to an embodiment of the present invention may be improved.

Referring to FIG. 5A, the side length of each of the plurality of conductive patterns included in the meta member 130a is shorter than the separation distance from the ground pattern 125a of the top conductive pattern among the plurality of conductive patterns and among the plurality of conductive patterns The lowest conductive pattern may be longer than the distance from the ground pattern 125a. In addition, the separation distance from the lowest conductive pattern of the meta member 130a to the ground pattern 125a may be longer than the separation distance from the highest conductive pattern to the lowest conductive pattern among the plurality of conductive patterns included in the meta member 130a. . Accordingly, the meta member 130a may have an appropriate negative refractive index so that the RF signal passing through the meta member 130a is concentrated in the upward direction. Accordingly, antenna performance of the antenna device according to an embodiment of the present invention may be improved.

On the other hand, referring to Figure 5a, the antenna device according to an embodiment of the present invention is disposed to be electrically connected to the ground pattern 125a and arranged to surround at least a portion of the meta member 130a when viewed in the vertical direction A plurality of first shielding vias 126a may be further included. Accordingly, the isolation between the antenna device and the adjacent antenna device according to an embodiment of the present invention may be improved, and the RF signal reflection performance of the ground pattern 125a may be further improved.

In addition, referring to FIG. 5A, a plurality of second shielding vias 121a disposed to be electrically connected to the ground pattern 125a and arranged to surround the feed vias 120a when viewed in the vertical direction may be further included. . Accordingly, electromagnetic noise of the RF signal passing through the feed via 120a may be reduced.

5B is a perspective view showing a cross-section of a meta member of an antenna device according to an embodiment of the present invention, and FIGS. 6A and 6B are side views showing various structures of a meta member of an antenna device according to an embodiment of the present invention.

5B, 6A, and 6B, each of the plurality of cells included in the meta member 130a is conductive via 131a, first conductive pattern 132a, second conductive pattern 133a, and third conductive The pattern 134a, the fourth conductive pattern 135a, and the fifth conductive pattern 136a may be included.

Referring to FIG. 5B, the plurality of cells may be arranged in a structure of n X 2. Here, n is a natural number greater than 2. That is, a plurality of cells may be arranged in two strings. In the antenna pattern, the RF signal counting in the lateral direction can be transmitted as if entering a medium of negative refractive index due to a narrow gap between a string closer to the antenna pattern and a string farther from the antenna pattern among the two strings. Therefore, a plurality of cells arranged in a structure of n X 2 can further concentrate the RF signal in the upward direction. The structure of the plurality of cells is not limited to the structure of n X and may vary according to design. For example, the plurality of cells may be arranged in a structure of n X 1 as shown in FIG. 2E.

The conductive vias 131a may electrically connect the first to fifth conductive patterns 132a, 133a, 134a, 135a, and 136a, and the first to fifth conductive patterns 132a, 133a, 134a, 135a, and 136a ) Can improve the structural stability.

In addition, the conductive via 131a is disposed to physically intercept the antenna pattern and the upper coupling pattern and the antenna pattern 110a and the upper coupling pattern 115a of another antenna device in the antenna module, so an embodiment of the present invention The isolation between the antenna device and the adjacent antenna device can be improved.

Since the first to fifth conductive patterns 132a, 133a, 134a, 135a, and 136a have substantially the same shape and size, and may be spaced apart from each other at substantially the same distance, the meta member 130a has an electromagnetic bandgap characteristic ( Negative refractive index).

8A is a circuit diagram showing an equivalent circuit of an antenna device according to an embodiment of the present invention.

Referring to Figure 8a, the antenna pattern 110b of the antenna device according to an embodiment of the present invention can transmit or receive an RF signal to a source (SRC2), such as an IC, the RF signal, the resistance value (R2) and It may have an inductance (L3, L4).

The meta member 130b includes the capacitances C5 and C12 for the antenna pattern 110b, the capacitances C6 and 10 between the plurality of conductive patterns, and the inductances L5 and L6 of the conductive vias, the conductive pattern and the ground. Capacitances between patterns C7 and C11 may be provided.

The frequency band and bandwidth of the antenna device according to an embodiment of the present invention may be determined by the above-described resistance value, capacitance, and inductance.

Meanwhile, the capacitances C7 and C11 between the conductive pattern and the ground pattern may be replaced with inductance depending on whether the meta member 130b is electrically connected to the ground pattern. That is, the antenna device according to an embodiment of the present invention may further include a via disposed to electrically connect between the conductive pattern and the ground pattern of the meta member 130b.

When the via is not connected, the meta member 130b may act more adaptively to the frequency of the RF signal. Accordingly, the antenna device according to an embodiment of the present invention can further widen the bandwidth.

8B is a graph showing S parameters of an antenna device according to an embodiment of the present invention.

Referring to FIG. 8B, the S parameter of the antenna device according to an embodiment of the present invention (eg, the first energy of the RF signal transmitted from the feed via to the antenna pattern, and the second of the RF signal transmitted from the antenna pattern to the feed via) The ratio of energy) may have a low value at about 26 GHz and about 28 GHz. That is, since an RF signal of about 26 GHz and an RF signal of about 28 GHz may have low reflectance in the transmission process, the antenna pattern may have high antenna performance for the RF signal of 26 GHz and the RF signal of about 28 GHz.

When the bandwidth is set to the S parameter of -10dB, the antenna module according to an embodiment of the present invention may have a bandwidth of about 4.7GHz.

The S parameter having a low value at about 28 GHz may be determined according to the intrinsic factor of the antenna pattern, and the S parameter having a low value at about 26 GHz may be determined according to the element of the meta member. That is, the antenna device according to an embodiment of the present invention can further increase the bandwidth using a meta member.

9A and 9B are perspective and plan views illustrating a circular antenna pattern and a meta member surrounding a circular antenna pattern of an antenna device according to an embodiment of the present invention.

9A and 9B, an antenna device according to an embodiment of the present invention includes an antenna pattern 110e, an upper coupling pattern 115e, a ground pattern 125e, a first shielding via 126e, and It may include at least a part of the meta member (130e).

The shape of the antenna pattern 110e may be circular. Accordingly, the meta member 130e may be disposed to surround the antenna pattern 110e in a circular shape when viewed in the vertical direction. For example, the plurality of conductive patterns included in the meta member 130e may each have a trapezoidal shape. Accordingly, the meta member 130e may further focus the RF signal counting on the side of the antenna pattern 110e in the upward direction.

10A to 10C are plan views illustrating an antenna module in which an antenna device according to an embodiment of the present invention is arranged.

10A and 10B, an antenna module according to an embodiment of the present invention includes an antenna pattern 110c, a ground layer 125c, a meta member 130c, a second antenna pattern 210c, and a director pattern ( 215c) and the feed line 220c.

The antenna pattern 110c may form a radiation pattern in a first direction to transmit or receive an RF signal in a first direction (eg, an upward direction).

The second antenna pattern 210c may form a radiation pattern in a second direction to transmit or receive an RF signal in a second direction (eg, a side direction). For example, the second antenna pattern 210c may be disposed adjacent to the side of the connecting member in the connecting member, and may have a dipole shape or a folded dipole shape. Here, one end of each pole of the second antenna pattern 210c may be electrically connected to the first and second lines of the feed line 220c. The frequency band of the second antenna pattern 210c may be designed substantially the same as the frequency band of the antenna pattern 110c, but is not limited thereto.

The second antenna pattern 210c may be disposed at a lower position than the ground pattern 125c. Accordingly, the ground pattern 125c may improve the isolation between the second antenna pattern 210c and the antenna pattern 110c.

The director pattern 215c may be electromagnetically coupled to the second antenna pattern 210c to improve the gain or bandwidth of the second antenna pattern 210c. The director pattern 215c may be shorter than the total dipole length of the second antenna pattern 210c. The shorter the length of the director pattern 215c, the second antenna pattern 210c may concentrate electromagnetic coupling. Accordingly, gain or directivity of the second antenna pattern 210c may be further improved.

The feed line 220c may transmit the RF signal received from the second antenna pattern 210c to the IC, and may transmit the RF signal received from the IC to the second antenna pattern 210c. The feed line 220c may be implemented by wiring of a connecting member.

Therefore, since the antenna module according to an embodiment of the present invention can form a radiation pattern in the first and second directions, it is possible to enlarge the RF signal transmission/reception direction omni-directional.

On the other hand, the antenna device according to an embodiment of the present invention may be arranged in a structure of n X m as shown in Figure 10a, the antenna module including the antenna device may be arranged adjacent to the vertex of the electronic device have.

In addition, the antenna device according to an embodiment of the present invention can be arranged in a structure of n X 1 as shown in Figure 10b, the antenna module including the antenna device is adjacent to the middle point of the edge of the electronic device Can be deployed.

Referring to Figure 10c, the antenna module according to an embodiment of the present invention, a plurality of antenna patterns (110d), the ground layer (125d), a plurality of meta members (130d), a plurality of second antenna pattern (210d), A plurality of director patterns 215d and a plurality of feed lines 220d may be included.

The plurality of meta members 130d may each include a plurality of cells arranged in a structure of n X 1. The plurality of meta members 130d may be arranged to surround each of the plurality of antenna patterns 110d, and may be spaced apart from each other. Accordingly, the influence of the plurality of antenna devices on each other can be reduced.

11 is a side view showing a schematic structure of an antenna module including an antenna device according to an embodiment of the present invention.

Referring to FIG. 11, an antenna module according to an embodiment of the present invention may have an integrated structure of an antenna 10a and an IC 20a, and an antenna 10a, a second direction antenna 15a, and a chip antenna (16a), IC (20a), passive components (40a), may include at least a portion of the substrate (50a) and the sub-substrate (60a).

The antenna 10a may correspond to the antenna pattern and the upper coupling pattern described above with reference to FIGS. 1 to 10C, and may be disposed on the top of the substrate 50a.

The meta member 30a may correspond to the meta member described above with reference to FIGS. 1 to 10C.

The second directional antenna 15a may correspond to the second antenna pattern and the director pattern described above with reference to FIGS. 10A and 10C, and may be disposed adjacent to the side of the substrate 50a to transmit and receive RF signals in the lateral direction. Can be.

The chip antenna 16a may have a three-dimensional structure including a dielectric having a dielectric constant higher than that of the insulating layer 52a and a plurality of electrodes disposed on both sides of the dielectric, and an RF signal in a lateral direction and/or an upward direction It may be disposed adjacent to the top and side of the substrate 50a to transmit and receive.

The antenna module according to an embodiment of the present invention may form an radiation pattern omni-directionally by including at least two of the antenna 10a, the second directional antenna 15a, and the chip antenna 16a. .

The IC 20a may convert RF signals received from the antenna 10a, the second directional antenna 15a, and/or the chip antenna 16a into an IF (intermediate frequency) signal or a base band signal, , The converted IF signal or baseband signal can be transmitted to an IF IC, baseband IC or communication modem disposed outside the antenna module. In addition, the IC 20a may convert IF signals or baseband signals received from an IF IC, baseband IC, or communication modem disposed outside the antenna module into RF signals, and convert the converted RF signals to the antenna 10a. , May be transmitted to the second directional antenna 15a and/or the chip antenna 16a. Here, the frequency of the RF signal (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.). Meanwhile, the IC 20a may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation. Meanwhile, according to the design, the antenna module may further include an IF IC or a baseband IC disposed on the lower surface of the substrate 50a.

The IC 20a and the passive component 40a may be disposed adjacent to the lower surface of the substrate 50a. The passive component 40a may include a capacitor (eg, multilayer ceramic capacitor (MLCC)), an inductor, or a chip resistor to provide the necessary impedance to the IC 20a.

The substrate 50a may include at least one conductive layer 51a and at least one insulating layer 52a, and may include at least one via penetrating the insulating layer to electrically connect the plurality of conductive layers. have. For example, the substrate 50a may be implemented as a printed circuit board, and may have a structure in which an antenna package at the top and a connecting member at the bottom are combined. For example, the antenna package may be designed from the viewpoint of transmission and reception efficiency of the RF signal, and the connecting member may be designed from the viewpoint of wiring efficiency.

For example, a conductive layer that is relatively close to the top surface of the substrate 50a among the at least one conductive layer 51a may be used as a ground pattern of the antenna 10a, and a relative substrate among the at least one conductive layer 51a The conductive layer close to the lower surface of (50a) includes a wiring layer through which an RF signal, an IF signal, or a baseband signal passes, a wiring ground layer for electromagnetic isolation of the wiring layer, and an IC ground layer providing ground to the IC 20a. Can be used as

The sub-substrate 60a may be disposed on the lower surface of the substrate 50a, and may provide a path for an IF signal or a baseband signal. For example, the sub-board 60a may be mounted on the outside of the antenna module to be implemented as a support member to support the antenna module.

Depending on the design, the sub-board 60a may be replaced with a connector to which a coaxial cable is connected, or a flexible insulating layer on which a signal transmission line for electrically connecting the external set board and the IC 20a is disposed. Can be.

12A and 12B are side views illustrating various structures of an antenna module including an antenna device according to an embodiment of the present invention.

12A, an antenna module according to an embodiment of the present invention may have a structure in which an antenna package and a connection member are combined.

The connecting member may include at least one wiring layer 1210b and at least one insulating layer 1220b, and a wiring via 1230b connected to the at least one wiring layer 1210b and a connection connected to the wiring via 1230b A pad 1240b may be included, and may have a structure similar to a copper redistribution layer (RDL). An antenna package may be disposed on the upper surface of the connecting member.

The antenna package includes at least some of a plurality of upper coupling members 1110b, a plurality of antenna patterns 1115b, a plurality of feed vias 1120b, a meta member 1130b, a dielectric layer 1140b, and a finishing member 1150b. It can be, and can correspond to the antenna device described above with reference to FIGS. 1 to 11.

The dielectric layer 1140b may be disposed to surround each side of the plurality of feed vias 1120b. The dielectric layer 1140b may have a height that is longer than the height of at least one insulating layer 1220b of the connecting member. The antenna package may be advantageous from a viewpoint of securing antenna performance as the height and/or width of the dielectric layer 1140b is large, and boundary conditions (eg, small manufacturing tolerances, short electrical) that are advantageous for RF signal transmission/reception operations of a plurality of antenna patterns 1115b. Length, smooth surface, large size of the dielectric layer, dielectric constant control, etc.).

The encapsulation member 1150b may be disposed on the dielectric layer 1140b, and may improve durability against impact or oxidation of the plurality of antenna patterns 1115b and/or the plurality of upper coupling members 1110b. have. For example, the finishing member 1150b may be implemented as a PIE (Photo Imageable Encapsulant), an ABF (Ajinomoto Build-up Film), or an epoxy molding compound (EMC), but is not limited thereto.

The IC 1301b, the PMIC 1302b, and the plurality of passive components 1351b, 1352b, and 1353b may be disposed on the lower surface of the connecting member. The IC 1301b may correspond to the IC shown in FIG. 10.

The PMIC 1302b generates power and may transfer the generated power to the IC 1301b through at least one wiring layer 1210b of the connecting member.

The plurality of passive components 1351b, 1352b, and 1353b may provide impedance to the IC 1301b and/or the PMIC 1302b. For example, the plurality of passive components 1351b, 1352b, and 1353b may include at least a portion of a capacitor (eg, Multi Layer Ceramic Capacitor (MLCC)), an inductor, or a chip resistor.

Referring to FIG. 12B, the IC package includes an IC 1300a, a sealing material 1305a for sealing at least a portion of the IC 1300a, and a support member 1355a having a first side facing the IC 1300a. And, may include a connecting member including at least one wiring layer 1310a and an insulating layer 1280a electrically connected to the IC 1300a and the supporting member 1355a, and may be coupled to a connecting member or an antenna package. .

The connection member may include at least one wiring layer 1210a, at least one insulating layer 1220a, wiring vias 1230a, a connection pad 1240a, and a passivation layer 1250a. The antenna package includes a plurality of upper coupling members 1110a, 1110b, 1110c, 1110d, a plurality of antenna patterns 1115a, 1115b, 1115c, 1115d, a plurality of feed vias 1120a, 1120b, 1120c, 1120d, and multiple meta The members 1130a, 1130b, 1130c, and 1130d may include a dielectric layer 1140a and a finishing member 1150a.

The IC package can be coupled to the above-described connecting member. The RF signal generated by the IC 1300a included in the IC package may be transmitted to the antenna package through at least one wiring layer 1310a and transmitted in an upward direction of the antenna module, and the first RF signal received from the antenna package is It may be transferred to the IC 1300a through at least one wiring layer 1310a.

The IC package may further include a connection pad 1330a disposed on the upper and/or lower surfaces of the IC 1300a. The connection pads disposed on the upper surface of the IC 1300a may be electrically connected to at least one wiring layer 1310a, and the connection pads disposed on the lower surface of the IC 1300a may support members 1355a through the lower wiring layer 1320a. Or it may be electrically connected to the core plating member 1365a. Here, the core plating member 1365a may provide a ground region to the IC 1300a.

The support member 1355a includes a core dielectric layer 1356a contacting the connection member, a core wiring layer 1359a disposed on the upper and/or lower surfaces of the core dielectric layer 1356a, and a core wiring layer passing through the core dielectric layer 1356a. It may include at least one core via 1360a electrically connected to (1359a) and electrically connected to the connection pad 1330a. The at least one core via 1360a may be electrically connected to an electrical connection structure 1340a such as a solder ball, pin, or land.

Accordingly, the support member 1355a may receive a base signal or power from a lower surface and transmit the base signal and/or power to the IC 1300a through at least one wiring layer 1310a of the connection member.

The IC 1300a may generate an RF signal in a millimeter wave (mmWave) band using the base signal and/or a power source. For example, the IC 1300a may receive a low-frequency base signal and perform frequency conversion, amplification, filtering phase control, and power generation of the base signal, and take into account high-frequency characteristics to compound semiconductors (eg GaAs). It may be implemented as a silicon semiconductor.

Meanwhile, the IC package may further include a passive component 1350a electrically connected to a corresponding wiring of the at least one wiring layer 1310a. The passive component 1350a may be disposed in an accommodation space 1306a provided by the support member 1355a, and may provide impedance to the IC 1300a and/or at least one second direction antenna pattern 1370a. have. For example, the passive component 1350a may include at least some of a multi-layer ceramic capacitor (MLCC), an inductor, and a chip resistor.

Meanwhile, the IC package may include core plating members 1365a and 1370a disposed on the side surface of the support member 1355a. The core plating members 1365a and 1370a may provide a grounding region to the IC 1300a, and may dissipate heat from the IC 1300a to the outside or remove noise from the IC 1300a.

Meanwhile, the IC package and the connecting member may be independently manufactured and combined, but may be manufactured together according to design. That is, a separate combining process between a plurality of packages may be omitted.

Meanwhile, the IC package may be coupled to the connection member through the electrical connection structure 1290a and the passivation layer 1285a, but depending on the design, the electrical connection structure 1290a and the passivation layer 1285a may be omitted. .

13A and 13B are diagrams illustrating a lower structure of a connecting member of an antenna module including an antenna device according to an embodiment of the present invention.

Referring to Figure 13a, the antenna module according to an embodiment of the present invention, the connecting member 200, IC 310, the adhesive member 320, the electrical connection structure 330, the sealing material 340, passive components At least some of the 350 and the sub-substrate 410 may be included.

The connecting member 200 may have a structure similar to the connecting member shown in FIGS. 12A and 12B. For example, the connection member 200 may include a wiring layer, a ground layer, and an IC ground layer.

The wiring layer may include a wiring through which an RF signal flows and a wiring ground pattern surrounding the wiring. The wiring may be arranged to electrically connect the aforementioned feed via and IC 310.

The ground layer may be disposed between the antenna device and the wiring layer according to an embodiment of the present invention, and the antenna device and the wiring layer may be electromagnetically isolated.

The IC ground layer provides the ground required for the circuit of the IC 310, and is disposed between the wiring layer and the IC 310 to electromagnetically isolate between the wiring layer and the IC 310, IF signal, baseband It may include wiring through which a signal or power is passed.

The IC 310 is the same as the above-described IC, and may be disposed under the connecting member 200. The IC 310 may be electrically connected to the wiring layer of the connecting member 200 to transmit or receive an RF signal, and may be electrically connected to the ground layer of the connecting member 200 to receive ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may bond the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200. For example, the electrical connection structure 330 may be disposed to electrically connect between the wiring layer and the ground layer of the connection member 200, and a solder ball, pin, land, pad It can have the same structure as (pad). The electrical connection structure 330 may have a lower melting point than the wiring layer and the ground layer of the connection member 200 to electrically connect the IC 310 and the connection member 200 through a predetermined process using the low melting point.

The encapsulant 340 may seal at least a portion of the IC 310 and may improve heat dissipation performance and impact protection performance of the IC 310. For example, the encapsulant 340 may be implemented with a PIE (Photo Imageable Encapsulant), ABF (Ajinomoto Build-up Film), epoxy molding compound (EMC), or the like.

The passive component 350 may be disposed on the lower surface of the connecting member 200, and may be electrically connected to the wiring layer and/or ground layer of the connecting member 200 through the electrical connecting structure 330, and FIGS. 11 to 11 It may correspond to the passive component shown in Figure 12b.

The sub-substrate 410 may be disposed under the connecting member 200, receive an IF (intermediate frequency) signal or a base band signal from the outside, and transmit it to the IC 310 or from the IC 310. It may be electrically connected to the connecting member 200 to receive the IF signal or the baseband signal and transmit it to the outside. Here, the frequency of the RF signal (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the sub-substrate 410 may transmit the IF signal or the baseband signal to the IC 310 through the wiring that may be included in the IC ground layer of the connecting member 200 or may be received from the IC 310.

Referring to FIG. 13B, an antenna module according to an embodiment of the present invention may include at least a part of a shielding member 360, a connector 420, and a chip antenna 430.

The shielding member 360 may be disposed under the connecting member 200 and may be disposed to confine the IC 310 together with the connecting member 200. For example, the shield member 360 may be disposed to cover the IC 310 and the passive component 350 together (eg, a conformal shield) or to cover each (eg, compartment shield). For example, the shielding member 360 may have a hexahedral shape in which one surface is open, and may have a receiving space of the hexahedron through coupling with the connection member 200. The shielding member 360 may be formed of a material having high conductivity, such as copper, to have a short skin depth, and may be electrically connected to the ground layer of the connecting member 200. Therefore, the shielding member 360 may reduce electromagnetic noise that can be received by the IC 310 and the passive component 350.

The connector 420 may have a connection structure of a cable (for example, a coaxial cable, a flexible PCB), and may be electrically connected to the IC ground layer of the connection member 200, and may perform a role similar to that of the aforementioned sub-substrate. have. That is, the connector 420 may be provided with an IF signal, a baseband signal and/or power from a cable, or an IF signal and/or a baseband signal with a cable.

The chip antenna 430 may transmit or receive an RF signal in support of the antenna device according to an embodiment of the present invention, and may correspond to the chip antenna shown in FIG. 11.

14A and 14B are plan views illustrating an arrangement of an antenna module in an electronic device according to an embodiment of the present invention.

Referring to FIG. 14A, an antenna module including an antenna device 100g, an antenna pattern 1110g, and a dielectric layer 1140g is adjacent to a side boundary of the electronic device 400g on a set substrate 300g of the electronic device 400g. Can be arranged.

The electronic device (400g) is a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer ), a monitor, a tablet, a laptop, a netbook, a television, a video game, a smart watch, automotive, etc. It is not limited.

A communication module 310g and a baseband circuit 320g may be further disposed on the set substrate 300g. The communication module 310g includes memory chips such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory to perform digital signal processing; Application processor chips such as a central processor (eg, CPU), graphics processor (eg, GPU), digital signal processor, encryption processor, microprocessor, microcontroller; It may include at least some of logic chips such as analog-to-digital converters and application-specific ICs (ASICs).

The baseband circuit 320g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion for the analog signal. The base signal input/output from the baseband circuit 320g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through the electrical connection structure, the core via, and the wiring layer. The IC may convert the base signal into an RF signal in the millimeter wave (mmWave) band.

Referring to FIG. 14B, a plurality of antenna modules each including the antenna device 100h, the antenna pattern 1110h, and the dielectric layer 1140h is one of the electronic devices 400h on the set substrate 300h of the electronic device 400h. Side borders and other side borders may be disposed adjacent to each other, and a communication module 310h and a baseband circuit 320h may be further disposed on the set substrate 300h.

Meanwhile, the conductive layer, wiring layer, ground layer, feed line, feed via, antenna pattern, upper coupling pattern, second antenna pattern, meta member, ground pattern, first and second shielding vias, and director pattern disclosed herein , Electrical connection structure, metal materials (e.g., copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti)) , Or a conductive material such as an alloy thereof, chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, subtractive, additive, or SAP It may be formed according to plating methods such as Semi-Additive Process (MSAP), Modified Semi-Additive Process (MSAP), but is not limited thereto.

On the other hand, the dielectric layer and/or insulating layer disclosed herein are FR4, LCP (Liquid Crystal Polymer), LTCC (Low Temperature Co-fired Ceramic), thermosetting resin such as epoxy resin, thermoplastic resin such as polyimide, or these resins. Resin impregnated with core materials such as glass fiber, glass cloth, glass fabric together with inorganic filler, prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine), It may also be implemented with a photo-imaging dielectric (PID) resin, a copper clad laminate (CCL), or a glass or ceramic-based insulating material. The insulating layer is a conductive layer, a wiring layer, a ground layer, a feed line, a feed via, an antenna pattern, an upper coupling pattern, a second antenna pattern, a meta member, a ground pattern, a first in the antenna device and antenna module disclosed herein. And a second shielding via, a director pattern, and at least a portion of a position where the electrical connection structure is not disposed.

On the other hand, RF signals developed herein are Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, It may have a format according to GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols specified thereafter, but is not limited thereto.

In the above, the present invention has been described by specific matters such as specific components and limited embodiments and drawings, but this is provided only to help a more comprehensive understanding of the present invention, and the present invention is not limited to the above embodiments , Those skilled in the art to which the present invention pertains can make various modifications and variations from these descriptions.

100: antenna device
110: antenna pattern
115: upper coupling pattern
120: feed via
121: second shielded via
122: slit
125: ground pattern
126: first shielding via
130: no meta
131: conductive via
132, 133, 134, 135, 136: a plurality of conductive patterns
200, 1200: no connection
210: second antenna pattern
215: director pattern
220: feed line
310: IC (Integrated Circuit)
320: adhesive member
330: electrical connection structure
340: encapsulant
350: passive component
360: no shielding
410: sub-board
420: connector

Claims (20)

Ground pattern having a through hole;
An antenna pattern disposed above the ground pattern and configured to transmit or receive an RF signal;
An upper coupling pattern disposed on the upper side of the antenna pattern so that at least a portion overlaps the antenna pattern when viewed in the vertical direction;
A feed via disposed to penetrate the through hole and electrically connected to a point at which one end is biased in a second lateral direction different from the first lateral direction in the center of the antenna pattern;
A second feed via having one end electrically connected to a point biased in the first lateral direction from the center of the antenna pattern; And
A meta member having a structure in which a plurality of cells each including a plurality of conductive patterns and at least one conductive via electrically connecting the plurality of conductive patterns are repeatedly spaced apart; Including,
The meta member is disposed along at least a part of a side boundary of the antenna pattern from an upper side of the ground pattern, and is extended and disposed above the antenna pattern,
The meta member is a first plurality of cells spaced apart in the first lateral direction from the antenna pattern when viewed in the vertical direction, and spaced apart in a direction opposite to the first side direction in the antenna pattern when viewed in the vertical direction. A second plurality of cells, a third plurality of cells spaced apart from the antenna pattern in the second side direction when viewed in the vertical direction, and a direction opposite to the second side direction in the antenna pattern when viewed in the vertical direction An antenna device including a fourth plurality of cells spaced apart.
delete delete delete According to claim 1,
The first plurality of cells are arranged in a X n structure,
The second plurality of cells are arranged in a b X n structure,
The third plurality of cells are arranged in a c X n structure,
The fourth plurality of cells are arranged in a d X n structure,
The n is a natural number, the a, b, c, d is an antenna device that is a natural number greater than n.
The method of claim 5,
The meta member includes a first plurality of dummy cells arranged between one end of the first plurality of cells and one end of the third plurality of cells, and the other end of the first plurality of cells and the fourth plurality of cells. A second plurality of dummy cells arranged between one end, a third plurality of dummy cells arranged between one end of the second plurality of cells and the other end of the third plurality of cells, and the second plurality of cells And a fourth plurality of dummy cells disposed between the other end of and the other end of the fourth plurality of cells,
The first, second, third and fourth plural dummy cells are larger than each of the first, second, third and fourth plural cells, respectively.
According to claim 1,
The meta member is disposed along at least a portion of a side boundary of the antenna pattern, and the antenna device is extended and disposed to the same level as the upper coupling pattern.
According to claim 1,
The meta member is disposed such that a vertical separation distance from the ground pattern of the uppermost conductive pattern among the plurality of conductive patterns is equal to a vertical separation distance from the ground pattern of the upper coupling pattern,
The meta member is an antenna device in which a vertical separation distance from the ground pattern of the lowest conductive pattern among the plurality of conductive patterns is equal to a vertical separation distance from the ground pattern of the antenna pattern.
The method of claim 8,
In the meta member, a vertical separation distance from the ground pattern of at least one of the plurality of conductive patterns is shorter than a vertical separation distance from the ground pattern of the upper coupling pattern, and a vertical separation distance from the ground pattern of the antenna pattern. Antenna device arranged to be longer.
According to claim 1,
When viewed in the vertical direction, the meta member has a horizontal separation distance to the antenna pattern of the plurality of cells shorter than a vertical separation distance from the ground pattern of the highest conductive pattern among the plurality of conductive patterns and the lowest of the plurality of conductive patterns. The antenna device is arranged to be longer than the vertical separation distance of the conductive pattern from the ground pattern.
According to claim 1,
The meta member is an antenna device that is arranged such that horizontal distances to the antenna pattern of the plurality of cells are uniform to each other and longer than an interval between the cells when viewed in the vertical direction.
According to claim 1,
The antenna pattern has a polygonal patch (patch) form,
Each of the plurality of conductive patterns has a polygonal shape corresponding to the antenna pattern,
The antenna length of each side of the plurality of conductive patterns is shorter than the separation distance from the ground pattern of the highest conductive pattern among the plurality of conductive patterns and longer than the separation distance from the ground pattern of the lowest conductive pattern among the plurality of conductive patterns. .
According to claim 1,
The meta member is an antenna device that is arranged such that a separation distance from a lowest conductive pattern to the ground pattern is longer than a separation distance from a highest conductive pattern to the lowest conductive pattern among the plurality of conductive patterns.
Ground pattern having a through hole;
An antenna pattern disposed above the ground pattern and configured to transmit or receive an RF signal;
A feed via disposed through the through hole and electrically connected to one end of the antenna pattern; And
A meta member having a structure in which a plurality of cells each including a plurality of conductive patterns and at least one conductive via electrically connecting the plurality of conductive patterns are repeatedly spaced apart; Including,
It is arranged to be electrically connected to the ground pattern, and further includes a plurality of first shielding vias arranged to surround at least a portion of the meta member when viewed in the vertical direction,
The meta member is disposed along at least a portion of a side boundary of the antenna pattern from an upper side of the ground pattern, and the antenna device is extended and disposed above the antenna pattern.
The method of claim 14,
The antenna device further includes a plurality of second shielding vias arranged to be electrically connected to the ground pattern and arranged to surround the through hole when viewed in the vertical direction.
According to claim 1,
When the ground pattern is viewed in the vertical direction, the antenna device overlaps the meta member and the antenna pattern, the antenna pattern, and at least a portion of the meta member together.
According to claim 1,
The plurality of cells is an antenna device that is arranged to have a negative refractive index for the RF signal.
A connecting member including a plurality of wiring lines, a ground pattern disposed above the plurality of wiring lines, and a plurality of wiring vias electrically connected to the plurality of wiring lines under the plurality of wiring lines;
An IC electrically connected to the wiring via and disposed under the connection member; And
A plurality of antenna devices electrically connected to the plurality of wires and disposed above the connecting member; Including,
At least one of the plurality of antenna devices,
An antenna pattern configured to transmit or receive RF signals;
An upper coupling pattern disposed on the upper side of the antenna pattern so that at least a portion overlaps the antenna pattern when viewed in the vertical direction;
A first feed via having one end electrically connected to a point biased in a second lateral direction from the center of the antenna pattern;
A second feed via having one end electrically connected to a point biased in a first lateral direction from the center of the antenna pattern; And
A meta member including a plurality of conductive patterns arranged to have a negative refractive index for the RF signal, and surrounding the antenna pattern when viewed in the vertical direction; Antenna module comprising a.
The method of claim 18,
The connecting member is electrically connected to the plurality of wires and further includes a second antenna pattern configured to transmit or receive an RF signal in a direction different from the antenna pattern.
The method of claim 18,
A support member disposed below the connecting member and having a height higher than that of the IC, and including a core via which is electrically connected to a wiring that is not electrically connected to the plurality of antenna devices among the plurality of wirings; And
An electrical connection structure disposed under the support member to be electrically connected to the core via; Antenna module further comprising a.

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