KR102307121B1 - Antenna apparatus - Google Patents

Abstract

An antenna device according to an embodiment of the present invention includes a plurality of ground layers arranged so that at least a portion thereof overlaps in a vertical direction, a feed line spaced apart from the plurality of ground layers and extending forward of the plurality of ground layers, and a feed A feed antenna pattern electrically connected to the line and extending in a direction different from the extension direction of the feed line, and a mirroring antenna pattern arranged not to overlap the feed antenna pattern in the vertical direction and extending in a direction different from the extension direction of the feed antenna pattern; , a feed via extending in the vertical direction to electrically connect between the feed antenna pattern and the feed line, and electrically connecting between at least one of the plurality of ground layers and the mirroring antenna pattern, and at least a portion is vertically connected to the feed line may include a ground line disposed to overlap with the .

Description

Antenna apparatus

The present invention relates to an antenna device.

Data traffic of mobile communication is rapidly increasing every year. Active technology development is in progress to support this breakthrough data in real time in the wireless network. For example, contentization of IoT (Internet of Thing)-based data, AR (Augmented Reality), VR (Virtual Reality), live VR/AR combined with SNS, autonomous driving, Sync View (User's point of view using a small camera) Applications such as real-time video transmission) require communication (eg, 5G communication, mmWave communication, etc.) that supports sending and receiving large amounts of data.

Therefore, recently, millimeter wave (mmWave) communication including fifth generation (5G) communication has been actively studied, and research for commercialization/standardization of an antenna module that smoothly implements this is being actively conducted.

Since RF signals in high frequency bands (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lost in the course of transmission, the quality of communication may drop sharply. Therefore, an antenna for communication in a high frequency band requires a different technical approach from the existing antenna technology, and a separate method for securing antenna gain, integrating antenna and RFIC, and securing EIRP (Effective Isotropic Radiated Power), etc. It may require the development of special technologies such as power amplifiers.

Japanese Patent Publication No. 5609772

The present invention provides an antenna device.

An antenna device according to an embodiment of the present invention includes: a plurality of ground layers arranged to overlap at least a portion in a vertical direction; a feed line spaced apart from the plurality of ground layers and extending in front of the plurality of ground layers; a feed antenna pattern electrically connected to the feed line and extending in a direction different from an extension direction of the feed line; a mirroring antenna pattern disposed so as not to overlap the feed antenna pattern in a vertical direction and extending in a direction different from an extension direction of the feed antenna pattern; a feed via extending in the vertical direction to electrically connect the feed antenna pattern and the feed line; and a ground line electrically connecting at least one of the plurality of ground layers and the mirroring antenna pattern and disposed such that at least a portion thereof overlaps the feed line in a vertical direction. may include.

An antenna device according to an embodiment of the present invention includes: a plurality of ground layers arranged to overlap at least a portion in a vertical direction; a feed line spaced apart from the plurality of ground layers and extending in front of the plurality of ground layers; a feed antenna pattern electrically connected to the feed line and extending in a direction different from an extension direction of the feed line; a mirroring antenna pattern disposed so as not to overlap the feed antenna pattern in a vertical direction and extending in a direction different from an extension direction of the feed antenna pattern; a ground line electrically connecting at least one of the plurality of ground layers and the mirroring antenna pattern and disposed so that at least a portion thereof overlaps the feed line in a vertical direction; and a mirroring core pattern electrically connecting the ground line and the mirroring antenna pattern, at least a portion of which is oblique with respect to an extension direction of the mirroring antenna pattern. may include.

Since the antenna device according to an embodiment of the present invention can reduce the number, length, and complexity of feedlines connected to the antenna while maintaining the antenna performance, it has a reduced size or substantially increases the size while maintaining the antenna performance. It is possible to additionally include components advantageous to the antenna performance without the need.

The antenna device according to an embodiment of the present invention can more closely couple the component corresponding to the RF signal path and the component corresponding to the ground in various directions, so that the antenna support performance of the component corresponding to the ground is improved. It can be further improved, and it can have a wider bandwidth.

1 is a perspective view showing an antenna device according to an embodiment of the present invention.
2A to 2D are views illustrating a structure in which a connection member is additionally disposed in the antenna device shown in FIG. 1 .
3 is a plan view illustrating a dimension and a positional relationship of an antenna device according to an embodiment of the present invention.
4A to 4D are plan views illustrating each layer of an antenna device according to an embodiment of the present invention.
5A to 5C are diagrams illustrating an antenna module according to an embodiment of the present invention.
6A to 6B are side views illustrating a lower structure of a connection member included in an antenna device and an antenna module according to an embodiment of the present invention.
7 is a side view illustrating the structure of an antenna device and an antenna module according to an embodiment of the present invention.
8A and 8B are plan views illustrating an arrangement of an antenna module in an electronic device according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0023] Reference is made to the accompanying drawings, which show by way of illustration specific embodiments in which the present invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein with respect to one embodiment may be embodied in other embodiments without departing from the spirit and scope of the invention. In addition, it should be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention is limited only by the appended claims, along with all equivalents as claimed by the claims. Like reference numerals in the drawings refer to the same or similar functions throughout the various aspects.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those of ordinary skill in the art to easily practice the present invention.

1 is a perspective view showing an antenna device according to an embodiment of the present invention.

Referring to FIG. 1 , the antenna device according to an embodiment of the present invention includes a feed line 110 , a feed via 115 , a feed antenna pattern 120 , a director pattern 125 , a mirroring antenna pattern 130 , It may include a mirroring core pattern 132 and a ground line 135 .

The feedline 110 may be configured to allow an RF signal to pass therethrough. For example, the feed line 110 may electrically connect the IC and the feed antenna pattern 120 , and may have a structure extending in the x direction.

One end of the feed via 115 may be electrically connected to the feed line 110 and configured to allow an RF signal to pass therethrough. For example, since the feed via 115 may have a structure extending in the z direction, the transmission direction of the RF signal may be bent. The electromagnetic coupling may be concentrated at a point where the transmission direction of the RF signal is bent. Accordingly, the feed via 115 may provide an environment for concentration of electromagnetic coupling.

The feed antenna pattern 120 may be electrically connected to the other end of the feed via 115 and extend in one direction (eg, the +y direction) from the other end of the feed via 115 . The feed antenna pattern 120 may receive the RF signal from the feed via 115 and transmit it in the x direction, and may transmit the RF signal received in the x direction to the feed via 115 .

The mirroring antenna pattern 130 may be spaced apart from the feed antenna pattern 120 and extend in a direction opposite to the extension direction of the feed antenna pattern 120 (eg, a -y direction). The mirroring antenna pattern 130 may be electromagnetically coupled to the feed antenna pattern 120 . Accordingly, the mirroring antenna pattern 130 may operate by being mirrored in the y-direction with respect to the feed antenna pattern 120 .

The ground line 135 may be electrically isolated from the feed line 110 . The ground line 135 may be disposed side by side with the feed line 110 , and may be electromagnetically coupled to the feed line 110 . Accordingly, the ground line 135 may operate by being mirrored in the z-direction with respect to the feed line 110 .

The ground line 135 may be electrically connected to the mirroring antenna pattern 130 . The mirroring antenna pattern 130 may operate on a principle similar to that of a dipole antenna together with the feed antenna pattern 120 . In general, a dipole antenna may have a wider bandwidth than a monopole antenna, but uses more feedlines. The feedline is configured to pass the RF signal through, so a large space can be used.

The antenna device according to an embodiment of the present invention can reduce the number of feedlines by half while operating on a principle similar to that of a dipole antenna. Accordingly, the antenna device according to an embodiment of the present invention may have a reduced size while maintaining antenna performance (eg, bandwidth, gain).

The mirroring core pattern 132 may be disposed to electrically connect between the ground line 135 and the mirroring antenna pattern 130 and may be disposed to bypass the feed via 115 . The mirroring core pattern 132 may be electromagnetically coupled to the feed via 115 . Accordingly, the mirroring core pattern 132 may be operated by being diagonally mirrored with respect to the feed via 115 .

Since the feed via 115 can provide an environment for the concentration of electromagnetic coupling, the mirroring core pattern 132 is more intensively coupled to the RF signal path than the mirroring antenna pattern 130 and the ground line 135 . can be ringed. Accordingly, the mirroring antenna pattern 130 of the antenna device according to an embodiment of the present invention can support transmission and reception of RF signals more efficiently and can further widen the bandwidth.

In addition, the components (feed line, feed via, feed antenna pattern) of the RF signal path of the antenna device according to an embodiment of the present invention are connected to the ground components (ground line, mirroring core pattern, mirroring antenna pattern) in various directions. It can be mirrored and more tightly coupled between the components of the RF signal path and the ground components. Accordingly, the mirroring antenna pattern 130 of the antenna device according to an embodiment of the present invention can support transmission and reception of RF signals more efficiently and can further widen the bandwidth.

FIG. 2A is a perspective view illustrating a structure in which a connection member is additionally disposed in the antenna device shown in FIG. 1 .

Referring to FIG. 2A , the antenna device according to an embodiment of the present invention includes a feed line 110 , a feed via 115 , a feed antenna pattern 120 , a director pattern 125 , a mirroring antenna pattern 130 , At least a portion of the ground line 135 , the second ground layer 140 , and the connection member 200 may be included.

The connection member 200 may include at least a portion of a wiring ground layer 210 , a ground layer 215 , an IC ground layer 225 , and a plurality of shielding vias 245 . An IC may be disposed on a lower side of the connection member 200 , and a patch antenna pattern 190 may be disposed on an upper side of the connection member 200 . The plurality of shielding vias 245 may be arranged adjacent to the boundary between the wiring ground layer 210 , the ground layer 215 , and the IC ground layer 225 .

The patch antenna pattern 190 may receive an RF signal from the IC through the connection member 200 and remotely transmit the RF signal or receive the RF signal remotely and transmit it to the IC through the connection member 200 . The patch antenna pattern 190 may be electromagnetically coupled to the coupling patch pattern 195 , and may form a radiation pattern in a first direction (eg, a z direction). For example, as the patch antenna pattern 190 is surrounded by the meta member 180 , the radiation pattern may be further concentrated in the z-direction.

The antenna device according to an embodiment of the present invention may be disposed adjacent to a side surface of the connection member 200 to transmit/receive an RF signal in the second direction (eg, the x-direction). Since a portion of the side surface of the connection member 200 may be recessed, the antenna device may be disposed close to the recessed region of the connection member 200 , and thus the size of the antenna device may be reduced. 2A shows that the connecting member 200 has a recessed area, the recessed area may be omitted depending on the design. When the recessed region is omitted, the boundary between the wiring ground layer 210 , the ground layer 215 , and the IC ground layer 225 is the boundary of the second ground layer 140 when viewed in the vertical direction (eg, the z direction). can be substantially overlapped with Since the boundary may act as a reflector for the antenna device according to an embodiment of the present invention, it may affect the antenna performance of the antenna device.

The feed line 110 may be disposed at the same level as the wiring ground layer 210 of the connection member 200 . That is, the feed line 110 may transmit a radio frequency (RF) signal to the IC via the wiring ground layer 210 , and may receive the RF signal from the IC via the wiring ground layer 210 . .

The feed via 115 may be disposed to be electrically connected between the feed line 110 and the feed antenna pattern 120 . Accordingly, the feed antenna pattern 120 may be disposed at a position lower or higher than the feed line 110 in the vertical direction (eg, the z direction), and may transmit/receive RF signals in a direction based on the arrangement height. have.

The feed antenna pattern 120 may be electrically connected to the feed via 115 and/or the feed line 110 to transmit or receive an RF signal. For example, the feed antenna pattern 120 may be disposed adjacent to a side surface of the connection member 200 and may have a monopole shape. The feed antenna pattern 120 is a frequency band according to at least one of a pole length, a pole thickness, a separation distance with respect to the mirroring antenna pattern 130, a separation distance with respect to the connection member 200, and the dielectric constant of the insulating layer of the connection member (eg, : 28 GHz, 60 GHz).

The ground line 135 may be disposed to be electrically connected between the ground layer 215 of the connection member 200 and the mirroring antenna pattern 130 . That is, the mirroring antenna pattern 130 may receive a ground from the ground layer 215 without directly receiving the RF signal from the IC, not directly transmitting the RF signal to the IC.

The mirroring antenna pattern 130 may be disposed to form a dipole shape together with the feed antenna pattern 120 when viewed in the vertical direction (eg, the z direction). Accordingly, the feed antenna pattern 120 may operate on a principle similar to that of the dipole antenna together with the mirroring antenna pattern 130 .

Compared with a general dipole antenna, the antenna device according to an embodiment of the present invention can reduce the number of feed lines 110 by half. In the wiring ground layer 210 of the connection member 200 , as the number of the feed lines 110 decreases, the size of the arrangement space of the wiring for electrical connection between the feed line 110 and the IC may be reduced. The size may be more effectively reduced as the number of antenna devices electrically connected to the connection member 200 increases. Accordingly, the antenna device according to an embodiment of the present invention may have improved antenna performance compared to its size.

For example, the wiring ground layer 210 may have an extra space for an increase in the size of the second ground layer surrounding the wiring or an increase in the number of vias arranged at the boundary of the second ground layer 140 . , since it is possible to have an extra space for providing an impedance converter such as a quarter-wavelength transformer, the antenna device according to an embodiment of the present invention can improve antenna performance by using the extra space of the wiring ground layer 210 . . That is, the antenna device according to an embodiment of the present invention may have the effect of reducing the size and/or improving the antenna performance flexibly.

Also, according to design, the mirroring antenna pattern 130 and the mirroring antenna pattern of an adjacent antenna device may be electrically connected to the same ground layer 215 . Accordingly, the ground layer 215 may electromagnetically decouple between the antenna device and the adjacent antenna device. Accordingly, the degree of isolation between the antenna device and the adjacent antenna device may be improved, and the antenna device and the adjacent antenna device may be disposed closer to each other. That is, the antenna device according to an embodiment of the present invention may have improved antenna performance compared to its size.

The director pattern 125 may be disposed to be spaced apart from the feed antenna pattern 120 in an outer direction (eg, an x direction) of the connection member 200 . The director pattern 125 may be electromagnetically coupled to the feed antenna pattern 120 to improve a gain or bandwidth of the feed antenna pattern 120 . Depending on the design, the number of the director patterns 125 may be two or more, or may be omitted.

The second ground layer 140 may be disposed above the feed line 110 and the ground line 135 , and may improve the degree of isolation between the antenna device and the patch antenna pattern 190 according to an embodiment of the present invention. have.

FIG. 2B is a side view illustrating the antenna device shown in FIG. 2A.

Referring to FIG. 2B , the ground line 135 may be disposed at a lower position than the feed line 110 , and the mirroring antenna pattern 130 may be disposed at a higher position than the feed antenna pattern 120 . Accordingly, since the antenna device according to an embodiment of the present invention can balance the electromagnetic between the feed antenna pattern 120 and the mirroring antenna pattern 130 , RF signal transmission/reception efficiency can be further improved.

Meanwhile, the patch antenna pattern and the meta member 180 may be disposed to be spaced apart from the connecting member 200 by the patch antenna spacing region 185 .

FIG. 2C is a rear view showing the antenna device shown in FIG. 2A, and FIG. 2D is a plan view showing the antenna device shown in FIG. 2A.

2C and 2D , the ground line 135 may be disposed such that at least a portion thereof overlaps the feed line 110 . Also, the ground line 135 may be diagonally bent adjacent to the feed via 115 to be connected to the mirroring antenna pattern 130 . Accordingly, since the ground line 135 may act symmetrically with respect to the feed line 110 from an electromagnetic point of view, the mirroring antenna pattern 130 may also act symmetrically with respect to the feed antenna pattern 120 from an electromagnetic point of view. can Accordingly, the antenna device according to an embodiment of the present invention may have improved antenna performance (eg, bandwidth, gain).

The length of the mirroring antenna pattern 130 may be longer than the length of the feed antenna pattern 120 . Also, the director pattern 125 may be disposed so that the center thereof is more biased toward the mirroring antenna pattern 130 than the feed antenna pattern 120 . Accordingly, since the antenna device according to an embodiment of the present invention can balance the electromagnetic between the feed antenna pattern 120 and the mirroring antenna pattern 130 , RF signal transmission/reception efficiency can be further improved.

Meanwhile, the recessed region of the connecting member 200 may have a symmetrical structure with respect to the feed line 110 and the ground line 135 . That is, the mirroring antenna pattern 130 may have a shape that is further extended laterally as compared to the feed antenna pattern 120 on the basis of the recessed area. Accordingly, the capacitance according to the connecting member 200 of the mirroring antenna pattern 130 is the feed antenna pattern 120 and the connecting member 200 of the feed antenna pattern 120 so that the electromagnetic balance between the mirroring antenna pattern 130 is balanced. ) may be different from the capacitance according to

3 is a plan view illustrating a dimension and a positional relationship of an antenna device according to an embodiment of the present invention.

Referring to FIG. 3 , the width W3 of the ground line may be greater than the width W5 of the feed line. Accordingly, the ground line can be coupled to the feed line more intensively.

Also, the central width W4-1 of the mirroring core pattern may be shorter than the width W4-3 of one end of the mirroring core pattern and shorter than the width W4-2 of the other end of the mirroring core pattern. Accordingly, the mirroring core pattern may be more intensively coupled to the feed via.

Also, the length L2 from one end to the other end of the mirroring antenna pattern may be longer than the length L1 from one end to the other end of the feed antenna pattern. Accordingly, the feed antenna pattern and the mirroring antenna pattern may be electromagnetically balanced.

For example, the length L2 from one end of the mirroring antenna pattern to the other end may be the same as the length L3 from one end of the mirroring antenna pattern to the other end of the feed antenna pattern. Since the electromagnetic center of the antenna device according to an embodiment of the present invention may be close to the mirroring core pattern according to the coupling concentration of the mirroring core pattern, the antenna device has an electromagnetic balance when L2 and L3 are substantially the same. can be optimized.

In order to improve the electromagnetic balance of the antenna device, the director pattern may be disposed so that the center thereof is biased to correspond to the extension length of the mirroring antenna pattern. For example, the y-direction distance L5 from one end of the director pattern to one end of the mirroring antenna pattern and the y-direction distance L6 from the other end of the director pattern to one end of the mirroring antenna pattern may be substantially equal to each other.

Meanwhile, the distance L4 - 1 between the ground line and the feed antenna pattern may be substantially the same as the distance L4 - 2 between the mirroring antenna pattern and the feed antenna pattern. The width W6 of the mirroring antenna pattern, the width W7 of the feed antenna pattern, and the width W8 of the director pattern may be substantially the same. The separation distance D1 of the feed antenna pattern with respect to the ground layer may be longer than the separation distance D2 of the mirroring antenna pattern with respect to the ground layer. The x-direction length D4 of the recessed region of the ground layer may be longer than the separation distance D3 from the ground layer to the director pattern. A width length W1 in one direction (+y direction) of the depression region of the ground layer may be substantially the same as a width length W2 in the other direction (-y direction) of the depression region of the ground layer.

4A to 4D are plan views illustrating each layer of an antenna device according to an embodiment of the present invention.

Referring to FIG. 4A , the IC ground layer 225 may have a plurality of through holes through which the wiring via 231 and the patch antenna wiring vias 232 and 233 pass, respectively. The IC 310 may be disposed under the IC ground layer 225 , and may be electrically connected to the wiring via 231 and the patch antenna wiring vias 232 and 233 . The feed antenna pattern 120 and the director pattern 125 may be disposed at substantially the same height as the IC ground layer 225 .

The IC ground layer 225 may provide a ground used in circuits and/or passive components of the IC 310 to the IC 310 and/or passive components. Depending on the design, the IC ground layer 225 may provide a transmission path for power and signals used in the IC 310 and/or passive components. Accordingly, the IC ground layer 225 may be electrically coupled to the IC and/or passive components.

Referring to FIG. 4B , the ground layer 215 may have a plurality of through holes through which the wiring via 231 and the patch antenna wiring vias 232 and 233 pass, respectively. The ground line 135 , the mirroring core pattern 132 , and the mirroring antenna pattern 130 may be electrically connected to the ground layer 215 , and may be disposed at substantially the same height as the ground layer 215 . The ground layer 215 may electromagnetically shield the feed line and the IC.

Also, the ground layer 215 may have a recessed shape to provide a cavity. The ground line 135 may be disposed to bypass the center of the cavity of the ground layer 215 .

Referring to FIG. 4C , the wiring ground layer 210 may surround at least a portion of the feed line 110 and the patch antenna feed lines 212 and 213 , respectively. The feed line 110 may be electrically connected to the wiring via 231 , and the patch antenna feed lines 212 and 213 may be electrically connected to the patch antenna wiring vias 232 and 233 . The wiring ground layer 210 may electromagnetically shield between the feed line 110 and the patch antenna feed lines 212 and 213 .

Referring to FIG. 4D , the second ground layer 140 may have a through hole through which the patch antenna feed vias 192 and 193 pass. One end of the patch antenna feed vias 192 and 193 may be connected to the patch antenna pattern 190 , and the other end of the patch antenna feed vias 192 and 193 may be electrically connected to the patch antenna feed line. The second ground layer 140 may electromagnetically shield a gap between the patch antenna pattern 190 and the feed antenna pattern, and reflects the RF signal of the patch antenna pattern 190 in the z-direction to form the patch antenna pattern 190 . It is possible to further concentrate the RF signal in the z-direction.

Meanwhile, the vertical relationship and shape of the IC ground layer 225 , the ground layer 215 , the wiring ground layer 210 , and the second ground layer 140 may vary depending on the design.

5A to 5C are diagrams illustrating an antenna module according to an embodiment of the present invention.

5A and 5B , an antenna module according to an embodiment of the present invention may include a plurality of antenna devices arranged in a 1 X n structure. Here, n is a natural number of 2 or more. The antenna module may be disposed adjacent to the center of the edge of the electronic device. The plurality of patch antenna patterns 190b and the plurality of coupling patch patterns 195b may be disposed on the upper side of the connection member 200b and may be arranged in a 1 X n structure. When the plurality of patch antenna patterns 190b are connected to the connection member 200b, the number of wires through which the RF signal flows in the connection member 200b may be 2n or 3n.

Each of the plurality of antenna devices includes a feed line 110b, a feed via 115b, a feed antenna pattern 120b, a director pattern 125b, a mirroring antenna pattern 130b, a mirroring core pattern 132b, and a ground line 135b). may include at least a portion of Accordingly, since the number of wires through which the RF signal flows in the connecting member 200b may be reduced by n, the size of the connecting member 200b may be further reduced. Also, the plurality of antenna devices may be more adjacent to each other.

Depending on the design, the antenna module according to an embodiment of the present invention may include a plurality of antenna devices arranged in a structure of m X n. Here, m is a natural number greater than or equal to 2. The antenna module may be disposed adjacent to a vertex of the electronic device.

5B and 5C , the IC 310b may be disposed below the connection member 200b. The plurality of antenna devices may be arranged such that the feed antenna pattern 120b faces one direction (eg, the -y direction) as shown in FIG. 5B , and as shown in FIG. 5C , some of the feed antenna patterns 120b are It is oriented in one direction (eg, -y direction) and some other feed antenna patterns 120c may be disposed to face the other direction (eg, +y direction). Some other feed lines 110c, director pattern 125c, mirroring antenna pattern 130c, and mirroring core pattern 132c may be disposed at positions corresponding to feed antenna pattern 120c.

According to the arrangement shown in FIG. 5C , electromagnetic interference between the plurality of antenna devices may be further reduced, and isolation between the plurality of antenna devices may be improved, but is not limited thereto. For example, a plurality of antenna devices may be arranged as shown in FIG. 5B to improve beamforming efficiency.

6A to 6B are side views illustrating a lower structure of a connection member included in an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 6A , the antenna module according to an embodiment of the present invention includes a connection member 200 , an IC 310 , an adhesive member 320 , an electrical connection structure 330 , an encapsulant 340 , and a passive component. At least a portion of the 350 and the sub-substrate 410 may be included.

The connecting member 200 may have a structure similar to that of the connecting member described above with reference to FIGS. 1 to 5C .

The IC 310 is the same as the aforementioned IC, and may be disposed below the connection member 200 . The IC 310 may be electrically connected to the wiring of the connecting member 200 to transmit or receive an RF signal, and may be electrically connected to the ground layer of the connecting member 200 to receive a ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may adhere the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200 . For example, the electrical connection structure 330 may have a structure such as a solder ball, a pin, a land, or a pad. The electrical connection structure 330 has a melting point lower than that of the wiring and the ground layer of the connection member 200 , so that the IC 310 and the connection member 200 can be electrically connected through a predetermined process using the low melting point.

The encapsulant 340 may encapsulate at least a portion of the IC 310 , and may improve heat dissipation performance and impact protection performance of the IC 310 . For example, the encapsulant 340 may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like.

The passive component 350 may be disposed on the lower surface of the connection member 200 , and may be electrically connected to the wiring and/or the ground layer of the connection member 200 through the electrical connection structure 330 . For example, the passive component 350 may include at least a portion of a capacitor (eg, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

The sub-board 410 may be disposed below the connection member 200 , and receives an intermediate frequency (IF) signal or a base band signal from the outside and transmits it to the IC 310 or from the IC 310 . It may be electrically connected to the connection member 200 so as to receive the IF signal or the baseband signal and transmit it to the outside. Here, the frequency of the RF signal (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the sub-board 410 may transmit an IF signal or a baseband signal to or from the IC 310 through a wiring that may be included in the IC ground layer of the connection member 200 . Since the first ground layer of the connecting member 200 is disposed between the IC ground layer and the wiring, the IF signal or the baseband signal and the RF signal can be electrically isolated in the antenna module.

Referring to FIG. 6B , the antenna module according to an embodiment of the present invention may include at least a portion of a shielding member 360 , a connector 420 , and a chip antenna 430 .

The shielding member 360 may be disposed below the connecting member 200 to confine the IC 310 together with the connecting member 200 . For example, the shielding member 360 may be disposed to cover the IC 310 and the passive component 350 together (eg, a conformal shield) or respectively cover (eg, a compartment shield). For example, the shielding member 360 may have a hexahedral shape with one open surface, and may have a hexahedral accommodation space through coupling with the connecting member 200 . The shielding member 360 may be implemented with a material of high conductivity, such as copper, to have a short skin depth, and may be electrically connected to the ground layer of the connecting member 200 . Accordingly, the shielding member 360 may reduce electromagnetic noise that the IC 310 and the passive component 350 may receive.

The connector 420 may have a connection structure of a cable (eg, a coaxial cable, a flexible PCB), may be electrically connected to the IC ground layer of the connection member 200, and may perform a role similar to the above-described sub-board. have. That is, the connector 420 may receive an IF signal, a baseband signal, and/or power from a cable, or may provide an IF signal and/or a baseband signal through a cable.

The chip antenna 430 may transmit or receive an RF signal by assisting the antenna device according to an embodiment of the present invention. For example, the chip antenna 430 may include a dielectric block having a dielectric constant greater than that of the insulating layer, and a plurality of electrodes disposed on both surfaces of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connecting member 200 , and the other may be electrically connected to the ground layer of the connecting member 200 .

7 is a side view illustrating the structure of an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 7 , the antenna module according to an embodiment of the present invention has a structure in which an antenna device 100f, a patch antenna pattern 1110f, an IC 310f, and a passive component 350f are integrated into a connection member 500f. can have

The antenna device 100f and the patch antenna pattern 1110f may be designed the same as the aforementioned antenna device and the aforementioned patch antenna pattern, respectively, and receive and transmit an RF signal from the IC 310f or transmit the received RF signal. may be transmitted to the IC 310f.

The connection member 500f may have a structure (eg, a structure of a printed circuit board) in which at least one conductive layer 510f and at least one insulating layer 520f are stacked. The conductive layer 510f may have the above-described ground layer and feed line.

In addition, the antenna module according to an embodiment of the present invention may further include a flexible connection member (550f). The flexible connection member 550f may include a first flexible region 570f overlapping the connection member 500f and a second flexible region 580f not overlapping the connection member 500f when viewed in the vertical direction.

The second flexible region 580f may be flexibly bent in the vertical direction. Accordingly, the second flexible region 580f may be flexibly connected to the connector of the set board and/or to the adjacent antenna module.

The flexible connection member 550f may include a signal line 560f. An intermediate frequency (IF) signal and/or a baseband signal may be transmitted to the IC 310f through a signal line 560f or may be transmitted to a connector of a set board and/or an adjacent antenna module.

8A and 8B are plan views illustrating an arrangement of an antenna module in an electronic device according to an embodiment of the present invention.

Referring to FIG. 8A , the antenna module including the antenna device 100g, the patch antenna pattern 1110g and the dielectric layer 1140g is on the set substrate 600g of the electronic device 700g on the side boundary of the electronic device 700g. They may be disposed adjacent to each other.

The electronic device 700g includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, and a computer. ), monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc., but may be not limited

A communication module 610g and a baseband circuit 620g may be further disposed on the set substrate 600g. The antenna module may be electrically connected to the communication module 610g and/or the baseband circuit 620g through a coaxial cable 630g. Depending on the design, the coaxial cable 630g may be replaced with the flexible connection member shown in FIG. 7 .

The communication module 610g may include a memory chip such as a volatile memory (eg, DRAM), a non-volatile memory (eg, ROM), a flash memory, etc. to perform digital signal processing; application processor chips such as a central processor (eg, CPU), a graphics processor (eg, GPU), a digital signal processor, an encryption processor, a microprocessor, and a microcontroller; It may include at least a part of logic chips such as analog-to-digital converters and application-specific ICs (ASICs).

The baseband circuit 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input/output from the baseband circuit 620g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through an electrical connection structure, a core via, and a wiring. The IC may convert the base signal into an RF signal of a millimeter wave (mmWave) band.

Referring to FIG. 8B , a plurality of antenna modules each including an antenna device 100h, a patch antenna pattern 1110h, and a dielectric layer 1140h are formed on a set substrate 600h of the electronic device 700h of the electronic device 700h. It may be disposed adjacent to the boundary of one side and the boundary of the other side, respectively, and a communication module 610h and a baseband circuit 620h may be further disposed on the set substrate 600h. The plurality of antenna modules may be electrically connected to the communication module 610h and/or the baseband circuit 620h through a coaxial cable 630h.

On the other hand, the feed line, feed via, feed antenna pattern, mirroring antenna pattern, mirroring core pattern, ground line, ground layer, director pattern, patch antenna pattern, coupling patch pattern, wiring via, shield via, electricity disclosed herein. The connection structure may include a metal material (eg, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or conductive material such as alloys thereof), and may include chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, subtractive, additive, and semi- It may be formed according to a plating method such as Additive Process) or Modified Semi-Additive Process (MSAP), but is not limited thereto.

On the other hand, the insulating layer disclosed herein is FR4, LCP (Liquid Crystal Polymer), LTCC (Low Temperature Co-fired Ceramic), a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or these resins with an inorganic filler Resin impregnated with core material such as glass fiber (Glass Fiber, Glass Cloth, Glass Fabric), prepreg, Ajinomoto Build-up Film (ABF), FR-4, BT (Bismaleimide Triazine), photosensitive insulation (Photo Imagable Dielectric (PID) resin, a general copper clad laminate (CCL), or an insulating material such as glass or ceramic may be implemented. The insulating layer is a feed line, a feed via, a feed antenna pattern, a mirroring antenna pattern, a mirroring core pattern, a ground line, a ground layer, a director pattern, a patch antenna pattern, a coupling patch pattern in the antenna device and antenna module disclosed herein. , the wiring via, the shielding via, and the electrical connection structure may be filled in at least a part of the position.

On the other hand, the RF signal presented herein is Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, It may have a format according to, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated thereafter.

In the above, the present invention has been described with specific matters such as specific components and limited embodiments and drawings, but these are provided to help a more general understanding of the present invention, and the present invention is not limited to the above embodiments. , those of ordinary skill in the art to which the present invention pertains can make various modifications and variations from these descriptions.

110: feed line (feed line)
115: feed via (feed via)
120: feed antenna pattern (feed antenna pattern)
125: director pattern
130: mirroring antenna pattern (mirroring antenna pattern)
132: mirroring core pattern (mirroring core pattern)
135: ground line (ground line)
140: second ground layer
180: meta member (meta member)
185: patch antenna separation area
190: patch antenna pattern (patch antenna pattern)
195: coupling patch pattern
200: connection member
210: wiring ground layer
215: ground layer
225: IC ground layer
245: shield via (shield via)

Claims (15)

a plurality of ground layers, at least a portion of which overlaps in the vertical direction;
a feed line spaced apart from the plurality of ground layers and extending in front of the plurality of ground layers;
a feed antenna pattern electrically connected to the feed line and extending in a direction different from an extension direction of the feed line;
a mirroring antenna pattern disposed so as not to overlap the feed antenna pattern in a vertical direction and extending in a direction different from an extension direction of the feed antenna pattern;
a feed via extending in the vertical direction to electrically connect the feed antenna pattern and the feed line; and
a ground line electrically connecting at least one of the plurality of ground layers and the mirroring antenna pattern and disposed so that at least a portion thereof overlaps the feed line in a vertical direction; An antenna device comprising a.
According to claim 1,
The ground line is disposed below the feed line and disposed above the feed antenna pattern.
According to claim 1,
A width of the ground line is greater than a width of the feed line.
According to claim 1,
The antenna device further comprising a mirroring core pattern electrically connecting between the ground line and the mirroring antenna pattern, at least a portion of which is oblique with respect to an extension direction of the mirroring antenna pattern.
According to claim 1,
The antenna device further comprising a mirroring core pattern electrically connecting the ground line and the mirroring antenna pattern, and configured to have a central width shorter than a width of one end and shorter than a width of the other end.
According to claim 1,
The antenna device further comprising a mirroring core pattern electrically connecting the ground line and the mirroring antenna pattern and having a width shorter than a width of the ground line and shorter than a width of the mirroring antenna pattern.
According to claim 1,
The antenna device further comprising a mirroring core pattern electrically connecting between the ground line and the mirroring antenna pattern and winding the feed via.
According to claim 1,
The antenna device further comprising a director pattern disposed so as not to overlap the feed antenna pattern and the mirroring antenna pattern in a vertical direction, a part disposed in front of the feed antenna pattern and another part disposed in front of the mirroring antenna pattern .
9. The method of claim 8,
In the director pattern, a length of another portion disposed in front of the mirroring antenna pattern is longer than a length of a portion disposed in front of the feed antenna pattern.
a plurality of ground layers, at least a portion of which overlaps in the vertical direction;
a feed line spaced apart from the plurality of ground layers and extending in front of the plurality of ground layers;
a feed antenna pattern electrically connected to the feed line and extending in a direction different from an extension direction of the feed line;
a mirroring antenna pattern disposed so as not to overlap the feed antenna pattern in a vertical direction and extending in a direction different from an extension direction of the feed antenna pattern;
a ground line electrically connecting at least one of the plurality of ground layers and the mirroring antenna pattern and disposed so that at least a portion thereof overlaps the feed line in a vertical direction; and
a mirroring core pattern electrically connecting the ground line and the mirroring antenna pattern, at least a portion of which is oblique with respect to an extension direction of the mirroring antenna pattern; An antenna device comprising a.
11. The method of claim 10,
The mirroring core pattern is configured such that the width of the center is shorter than the width of one end and shorter than the width of the other end.
11. The method of claim 10,
A width of the mirroring core pattern is shorter than a width of the ground line and shorter than a width of the mirroring antenna pattern.
11. The method of claim 10,
The antenna device further comprising a director pattern disposed so as not to overlap the feed antenna pattern and the mirroring antenna pattern in a vertical direction, a part disposed in front of the feed antenna pattern and another part disposed in front of the mirroring antenna pattern .
14. The method of claim 13,
In the director pattern, a length of another portion disposed in front of the mirroring antenna pattern is longer than a length of a portion disposed in front of the feed antenna pattern.
11. The method of claim 10,
At least one of the plurality of ground layers has a recessed shape to provide a cavity in the front,
At least a portion of the ground line overlaps the cavity in a vertical direction,
The mirroring core pattern is disposed so that a portion oblique to the extension direction of the mirroring antenna pattern does not overlap the cavity in the vertical direction.

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