KR20200038836A - Antenna module and electronic device including thereof - Google Patents

Abstract

The present invention relates to an antenna module having a structure easy to increase antenna performance or reduce the size and an electronic device including the same. According to one embodiment of the present invention, the antenna module comprises: an IC package including an IC and a mounted electric connection structure; a first antenna package including a first patch antenna pattern, a first feed via electrically connected to the first patch antenna pattern and a first antenna dielectric layer surrounding at least a part of the first feed via; a second antenna package spaced apart from the first antenna package and including a second patch antenna pattern, a second feed via electrically connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a part of the second feed via; and a connection member including a stacked structure electrically connecting the IC with the first and second feed vias and electrically connected to the mounted electric connection structure. The connection member comprises: a first region disposed between the first antenna package and the IC package; a second region providing an arrangement surface of the second antenna package; and a third region electrically connecting the first and second regions.

Description

Antenna module and electronic device including the same {Antenna module and electronic device including thereof}

The present invention relates to an antenna module and an electronic device including the same.

Data traffic of mobile communication is increasing rapidly every year. Active technology development is in progress to support such leap data in real time in a wireless network. For example, contents of IoT (Internet of Thing) based data, live VR / AR combined with Augmented Reality (AR), Virtual Reality (VR), and SNS, autonomous driving, sync view (Sync View) Applications such as real-time video transmission) require communication (eg, 5G communication, mmWave communication, etc.) to support the exchange of large amounts of data.

Accordingly, in recent years, millimeter wave (mmWave) communication including the 5th generation (5G) communication has been actively researched, and research for commercialization / standardization of the antenna module that smoothly implements it has been actively conducted.

RF signals in high frequency bands (eg, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lead to loss in the process of transmission, so the quality of communication may drop rapidly. Therefore, the antenna for communication in the high frequency band requires a different technological approach from the existing antenna technology, and separate antennas for securing the antenna gain, integrating the antenna with the RFIC, and securing the effective isotropic radiated power (EIRP), etc. It may require the development of special technologies such as power amplifiers.

United States Patent Application Publication No. US200a0 / 0240327

The present invention provides an antenna module and an electronic device including the same.

An antenna module according to an embodiment of the present invention includes an IC package including an IC and a mounting electrical connection structure; A first antenna package including a first patch antenna pattern, a first feed via electrically connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via; A second patch antenna pattern, a second feed via electrically connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and spaced apart from the first antenna package A second antenna package; And a connecting member having a stacked structure that electrically connects the IC and the first and second feed vias and is electrically connected to a mounting electrical connection structure. Including, The connecting member, A first area disposed between the first antenna package and the IC package; A second region providing an arrangement surface of the second antenna package; And a third region electrically connecting between the first region and the second region.

Electronic device according to an embodiment of the present invention, the case; A set substrate disposed in the case; And the antenna module disposed in the case and electrically connected to the set substrate.

The antenna module according to an embodiment of the present invention can easily extend the direction of RF signal remote transmission and reception, and does not easily increase the RF signal transmission and reception gain and bandwidth in the extension direction, or cause an increase in the actual size for this. You can. Therefore, the antenna module according to an embodiment of the present invention may have an advantageous structure for improving antenna performance or miniaturization.

In addition, the antenna module according to an embodiment of the present invention can flexibly set the location of the RF signal remote transmission and reception according to the structure / type of the electronic device, and can be arranged to reduce negative effects according to the use state of the electronic device user. , Antenna performance can be improved.

In addition, the antenna module according to an embodiment of the present invention can efficiently dissipate heat generated in the IC despite the expansion of the RF signal remote transmission / reception direction.

1 is a side view showing an antenna module according to an embodiment of the present invention.
2A is a side view showing an antenna module and a third antenna package according to an embodiment of the present invention.
2B is a side view showing an antenna module and a second IC package according to an embodiment of the present invention.
2C is a side view showing an antenna module and a passive component package according to an embodiment of the present invention.
3A and 3B are plan views illustrating an antenna module according to an embodiment of the present invention.
4A and 4B are plan views illustrating first and third regions of a connecting member of an antenna module according to an embodiment of the present invention.
5A to 5C are side views illustrating an antenna module and electronic devices according to an embodiment of the present invention.
Figure 5d is a side view showing the antenna module and the electronic device and the fourth antenna package according to an embodiment of the present invention.
6A and 6B are plan views illustrating electronic devices according to an embodiment of the present invention.

For a detailed description of the present invention, which will be described later, reference is made to the accompanying drawings that illustrate, by way of example, specific embodiments in which the present invention may be practiced. These examples are described in detail enough to enable those skilled in the art to practice the present invention. It should be understood that the various embodiments of the present invention are different, but need not be mutually exclusive. For example, certain shapes, structures, and properties described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in relation to one embodiment. In addition, it should be understood that the location or placement of individual components within each disclosed embodiment can be changed without departing from the spirit and scope of the invention. Therefore, the following detailed description is not intended to be taken in a limiting sense, and the scope of the present invention is limited only by the appended claims, along with all ranges equivalent to those claimed. In the drawings, similar reference numerals refer to the same or similar functions across various aspects.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those skilled in the art to easily implement the present invention.

1 is a side view showing an antenna module according to an embodiment of the present invention.

Referring to FIG. 1, an antenna module according to an embodiment of the present invention includes a base module 100 and an expansion module 200, and electrically connects between the base module 100 and the expansion module 200 It includes a connecting member. The connecting member includes first, second and third regions 150, 250 and 190.

The base module 100 includes a first antenna package 140, a first region 150 of a connecting member, and an IC package 300, and may be mounted on a set substrate through a mounting electrical connection structure 390. .

The base module 100 may receive a base signal from the set substrate to generate a radio frequency (RF) signal, and remotely transmit a portion of the generated RF signal. Similarly, the base module 100 may remotely receive a portion of the RF signal to generate a base signal, and transmit the generated base signal to the set substrate. Here, the base signal may be an IF (Intermediate Frequency) signal or a baseband signal.

The base module 100 may transmit and receive RF signals in the z direction. For example, the z direction may be set in a direction opposite to the display direction of the electronic device (eg, a portable terminal).

In general, a user of an electronic device (for example, a portable terminal) grasps and uses a direction opposite to the display direction, so that the z direction can be blocked by hand. At this time, the hand may interfere with the remote transmission and reception of the RF signal, thereby causing a decrease in communication quality of the electronic device, or increasing power consumption of the electronic device. The antenna module according to an embodiment of the present invention may have a structure capable of efficiently transmitting and receiving an RF signal in a direction other than the z direction.

The expansion module 200 includes a second antenna package 240 and a second region 250 of the connecting member, and may not be mounted on the set substrate.

The extension module 200 may remotely transmit another portion of the RF signal generated by the base module 100, and may remotely receive the other portion of the RF signal and transmit it to the base module 100.

The extension module 200 may transmit and receive RF signals in a direction according to the deployment posture.

1, the antenna module according to an embodiment of the present invention, the first region 150 of the connecting member of the base module 100 and the second region 250 of the connecting member of the expansion module 200 It further includes a third region 190 of the connecting member that electrically connects between them.

The first, second, and third regions 150, 250, and 190 of the connecting member may form a stacked structure. Accordingly, the connecting member may have a short z-direction length, reduce electrical length from the IC 310 to the first and second patch antenna patterns 110 and 210, and reduce the RF signal. Transmission loss can be reduced.

The third region 190 of the connecting member may be flexed more flexibly than the base module 100 and the expansion module 200. For example, the base module 100 and the third region 190 of the connecting member and the expansion module 200 may be implemented as a rigid-flexible printed circuit board (RFPCB), but are not limited thereto. Does not.

For example, the first and second antenna dielectric layers 142 and 152 included in the base module 100 and the expansion module 200 may be prepreg or FR4 or LTCC (Low Temperature Co-fired Ceramic) or glass. It may be implemented as (glass), the dielectric layer included in the third region 190 of the connecting member may be implemented as a more flexible liquid crystal polymer (LCP) or polyimide (polyimide), but is not limited to this, the design It may vary depending on the specifications (eg, flexibility, dielectric constant, ease of bonding between multiple substrates, durability, cost, etc.).

Since the posture of the base module 100 can be fixed relative to the set substrate, the expansion module 200 can rotate as the third region 190 of the connecting member is bent.

For example, the extension module 200 may rotate and rotate 90 degrees relative to the base module 100 to transmit and receive RF signals in the x-direction and / or the y-direction.

Depending on the design, the expansion module 200 may rotate and rotate 180 degrees relative to the base module 100 to transmit and receive RF signals in the -z direction.

That is, the RF signal transmission / reception direction of the expansion module 200 may be easily and variously set.

Therefore, the antenna module according to an embodiment of the present invention uses the base module 100 to transmit and receive RF signals in the z direction, and also uses the extension module 200 to transmit RF signals in directions other than the z direction. Can transmit and receive efficiently.

In addition, the separation distance between the base module 100 and the expansion module 200 may be variously set according to the folding of the third region 190 of the connecting member.

Accordingly, the antenna module according to an embodiment of the present invention may be configured such that the expansion module 200 is disposed at a location where an RF signal can be efficiently transmitted and received in an electronic device (eg, a portable terminal), and the RF signal is transmitted. It can transmit and receive more efficiently.

The first antenna package 140 includes a first patch antenna pattern 110, a first coupling patch pattern 115, a first feed via 120, a first ground layer 125, and a first coupling structure 130 ) And the first antenna dielectric layer 142.

The second antenna package 240 includes a second patch antenna pattern 210, a second coupling patch pattern 215, a second feed via 220, a second coupling structure 230 and a second antenna dielectric layer 242 ).

The first and second patch antenna patterns 110 and 210 may be electrically connected to one end of the first and second feed vias 120 and 220, respectively. The number of each of the first and second patch antenna patterns 110 and 210 may be plural. The gain of the first and second patch antenna patterns 110 and 210 may be improved as the number of each of the first and second patch antenna patterns 110 and 210 increases.

The first and second patch antenna patterns 110 and 210 may transmit and receive RF signals through planes (eg, top and bottom surfaces). Since the RF signals transmitted and received through the lower plane can be reflected by the first ground layer 125 and the second ground layer, the first and second patch antenna patterns 110 and 210 radiate patterns in the direction that the upper plane faces. Can focus.

Since the first and second patch antenna patterns 110 and 210 have relatively wide planes than other types of antennas (for example, dipole antennas and monopole antennas), the reflection patterns can be more easily concentrated in one direction, so different types of antennas are provided. It can have even more improved gain and bandwidth.

The first and second coupling patch patterns 115 and 215 may be disposed to overlap the first and second patch antenna patterns 110 and 210 in the z direction (or stacking direction), respectively. And electromagnetically coupled to the second patch antenna patterns 110 and 210, respectively. The combination structure of the patch antenna pattern and the coupling patch pattern can improve the gain by extending the RF signal transmission / reception plane, and the bandwidth can be extended by using the capacitance formed by the patch antenna pattern and the coupling patch pattern.

The first and second feed vias 120 and 220 may be connected to the first and second regions 150 and 250 of the connecting member, respectively. When the number of each of the first and second patch antenna patterns 110 and 210 is plural, the number of each of the first and second feed vias 120 and 220 may also be plural.

The length of each of the first and second feed vias 120 and 220 is the optimum separation distance between the first and second patch antenna patterns 110 and 210 and the first and second ground layers (eg, the wavelength of the RF signal). 1/2 times, 1/4 times).

The first ground layer 125 may be disposed under the first patch antenna pattern 110 and act as a reflector with respect to the first patch antenna pattern 110 to further concentrate the RF signal upward. have.

The first and second coupling structures 130 and 230 may surround at least a portion of the first and second patch antenna patterns 110 and 210 in the horizontal direction (eg, the x direction and / or the y direction). .

The first and second coupling structures 130 and 230 reflect or count RF signals counting on the side surfaces of the first and second patch antenna patterns 110 and 210 (eg, x-direction and / or y-direction), respectively. By changing the transmission direction of the signal, the counting RF signal can be focused more upward.

When the number of the first and second patch antenna patterns 110 and 210 is plural, the first and second coupling structures 130 and 230 may reduce electromagnetic interference between the patch antenna patterns. Accordingly, beamforming efficiency of the first and second patch antenna patterns 110 and 210 may be improved, and gains of the first and second patch antenna patterns 110 and 210 may be improved.

The first and second antenna dielectric layers 142 and 242 may surround at least a portion of the first and second feed vias 120 and 220, respectively.

The first and second antenna dielectric layers 142 and 242 may have a dielectric constant (Dk) greater than that of air, and may have insulation characteristics. The dielectric constants of the first and second antenna dielectric layers 142 and 242 can be set large to reduce the size of the first and second antenna packages 140 and 240, and the first and second antenna packages 140 and 240 ) May be set small for bandwidth or transmission / reception efficiency.

The first and second regions 150 and 250 of the connecting member may be disposed under the first and second antenna packages 140 and 150, respectively, and may be connected to each other through the third region 190 of the connecting member. have.

The first and second regions 150 and 250 of the connecting member include first and second signal path wiring layers 151 and 251, first and second signal path dielectric layers 152 and 252, and first and second signal paths The wiring vias 153 and 253 may have at least a portion.

The first and second signal path wiring layers 151 and 251 may be connected to the first and second feed vias 120 and 220, respectively.

The first and second signal path dielectric layers 152 and 252 may each have insulation characteristics, and may have greater flexibility than the first and second antenna dielectric layers 142 and 242. That is, the first and second regions 150 and 250 of the connecting member may be integrated with the third region 190 of the connecting member.

The first and second signal path wiring vias 153 and 253 may be electrically connected to the first and second signal path wiring layers 151 and 251, respectively.

Here, the first signal path wiring via 153 may be connected to the circuit support member 160.

The circuit support member 160 may be disposed between the first region 150 of the connecting member and the IC package 300, and at least one of the circuit wiring layer 161, the circuit dielectric layer 162, and the circuit wiring via 163 may be provided. It may contain some.

The circuit wiring layer 161 may electrically connect the first signal path wiring layer 151 and the IC 310. Also, the circuit wiring layer 161 may electrically connect the IC 310 and the passive component 350. Also, the circuit wiring layer 161 may provide electrical ground to the IC 310.

The circuit dielectric layer 162 may have a dielectric constant (Dk) greater than that of air, and may have insulation characteristics. Depending on the design, the circuit dielectric layer 162 may have a low dielectric loss tangent (Df) to reduce loss of the RF signal.

The circuit wiring via 163 may be connected between the circuit wiring layer 161 and the first signal path wiring layer 151, or may be connected between the circuit wiring layer 161 and the IC 310 and / or passive components 350. have.

The third region 190 of the connection member may include RF signal extension path wiring 191 and RF signal extension path ground layers 192 and 193.

The RF signal extension path wiring 191 may be electrically connected between the first and second signal path wiring layers 151 and 251. That is, the RF signal extension path wiring 191 may provide an RF signal extension path between the base module 100 and the extension module 200.

The RF signal extension path ground layers 192 and 193 may be disposed above and / or below the RF signal extension path wiring 191. Accordingly, the RF signal extension path wiring 191 may be protected from external electromagnetic noise.

The support member 260 may be fixed in an electronic device (eg, a portable terminal) of the expansion module 200. For example, the support member 260 may be attached to the electronic device by including an adhesive member, or may be physically coupled to the electronic device by including a physical bonding member.

The IC package 300 may provide a mounting structure on the set substrate of the base module 100, provide a base signal input / output path to the set substrate, and provide an arrangement space of the IC 310, It may have a structure that efficiently dissipates heat generated by the IC 310.

The IC 310 may receive the base signal to generate an RF signal or receive an RF signal to generate a base signal. For example, the converted signal may be generated by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation on the received signal.

For example, the IC 310 includes an active surface (for example, an upper surface) electrically connected to the first region 150 of the connecting member, and an inactive surface (for example, a lower surface) providing an arrangement space of the heat slug 370. Can have

The IC electrical connection structure 330 may provide an electrical coupling structure between the IC 310 and the circuit support member 160. For example, the IC electrical connection structure 330 may have a structure such as a solder ball, a pin, a land, or a pad.

Since the encapsulant 340 can seal at least a portion of each of the IC 310 and the passive component 350, the IC 310 and the passive component 350 can be protected from external factors. For example, the encapsulant 340 may be implemented with PIE (Photo Imageable Encapsulant), ABF (Ajinomoto Build-up Film), or epoxy molding compound (EMC).

Passive component 350 may provide capacitance, inductance, or resistance to IC 310. For example, the passive component 350 may include at least a part of a capacitor (eg, Multi Layer Ceramic Capacitor (MLCC)), an inductor, or a chip resistor. Depending on the design, the passive component 350 may separately perform some operations (eg, filtering and amplification) of the IC 310 with respect to the IC 310.

The mounting electrical connection structure 390 may provide an electrical coupling structure between the IC package 300 and the set substrate, and may support mounting on the set substrate of the base module 100. The mounting electrical connection structure 390 may provide a base signal input / output path to the set substrate, and may have a structure similar to the IC electrical connection structure 330.

The core member 410 may provide one surface disposed in the first region 150 of the connecting member and the other surface on which the mounting electrical connection structure 390 is disposed, and may be spaced apart from the IC 310.

That is, the core member 410 may be disposed between the first region 150 of the connecting member and the set substrate, and the mounting electrical connection structure 390 may be disposed between the core member 410 and the set substrate. have.

For example, the core member 410 may surround at least a portion of the IC 310, may be electrically connected to the mounting electrical connection structure 390, may provide a base signal transmission path, and a base module ( 100).

Depending on the design, the core member 410 may be implemented as a FOPLP (Fan-Out Panal Level Package) to improve the base signal transmission path efficiency (eg, loss rate, ground stability) or provide electromagnetic shielding performance.

Meanwhile, the core member 410 includes at least a portion of the core wiring 411, the core dielectric layer 412, and the core via 413 corresponding to the circuit wiring layer 161, the circuit dielectric layer 162, and the circuit wiring via 163, respectively. It may include.

The heat slug 370 can absorb heat generated by the IC 310 and transfer the absorbed heat to the heat dissipation structure 380. For example, the heat slug 370 may be implemented as a metal slag, thereby improving heat absorption and emission efficiency.

The heat slug 370 is disposed between the IC 310 and the set substrate and can be electrically connected to the set substrate through a heat dissipation structure 380.

The heat dissipation structure 380 may be electrically connected to the heat slug 370 to release heat transferred from the heat slug 370 to the set substrate. For example, the heat dissipation structure 380 may have a structure corresponding to the mounting electrical connection structure 390, and a plurality of heat dissipation structures 380 may form a heat sink structure to improve heat dissipation efficiency. It can be further improved.

The heat slug 370 and the heat dissipation structure 380 are not only the heat generated from the IC 310 according to the RF signal transmission and reception of the base module 100, but also from the IC 310 according to the RF signal transmission and reception of the expansion module 200. The generated heat can also be released.

Accordingly, since the expansion module 200 does not need to have a structure for heat dissipation, it is possible to set the deployment posture more freely and use the support member 260 more efficiently to improve the deployment stability.

2A is a side view showing an antenna module and a third antenna package according to an embodiment of the present invention.

Referring to Figure 2a, the antenna module according to an embodiment of the present invention, the second antenna package 240 in the second area 250 of the connecting member is disposed (e.g., the top surface) and the other surface (e.g. (Lower side) may further include a third antenna package 270.

Accordingly, the remote signal transmission / reception direction and / or location of the RF signal can be more freely designed in the electronic device.

For example, the third antenna package 270 includes a third patch antenna pattern 210b corresponding to the second patch antenna pattern 210a, and a third coupling patch pattern corresponding to the second coupling patch pattern 215a. (215b), the third feed via 220b corresponding to the second feed via 220a, the third coupling structure 230b corresponding to the second coupling structure 230a and the second antenna dielectric layer 242a A corresponding third antenna dielectric layer 242b may be included.

2B is a side view showing an antenna module and a second IC package according to an embodiment of the present invention.

Referring to FIG. 2B, an antenna module according to an embodiment of the present invention includes a second IC 310b and a placement surface in which the second antenna package 240 is disposed in the second area 250 of the connection member A second IC package 280 disposed on a different surface (eg, a lower surface) from the (eg, upper surface) may be further included.

The second IC 310b may correspond to the IC 310a and be disposed in the second region 250 of the connecting member through the second IC electrical connection structure 330b corresponding to the IC electrical connection structure 330a. You can.

Since the electrical length from the second patch antenna pattern 210 to the second IC 310b is shorter than the electrical length from the second patch antenna pattern 210 to the IC 310a, the second patch antenna pattern 210 The transmission loss of the RF signal transmitted and / or received by the user can be reduced.

The heat generated from the second IC 310b may be transferred to the mounting electrical connection structure 390 through the RF signal extension path ground layers 192 and 193 of the third region 190 of the connecting member. That is, the antenna module according to an embodiment of the present invention can secure heat dissipation performance of the expansion module 200 that is not mounted on the set substrate.

2C is a side view showing an antenna module and a passive component package according to an embodiment of the present invention.

Referring to Figure 2c, the antenna module according to an embodiment of the present invention, the second antenna package 240 in the second area 250 of the connecting member is disposed (e.g., the top surface) and the other surface (e.g. It may include a passive component package 290 including a second passive component (350b) disposed on the (lower surface), and a second sealing material (340b) for sealing at least a portion of the second passive component (350b).

The second passive component 350b may correspond to the first passive component 350a of the IC package 300, and the second sealing material 340b corresponds to the first sealing material 340a of the IC package 300. Can be.

That is, in the antenna module according to an embodiment of the present invention, the placement space of the passive components may be distributed into the IC package 300 and the passive components package 290. Therefore, the antenna module according to an embodiment of the present invention can be easily downsized by reducing the size of the IC package 300.

3A and 3B are plan views illustrating an antenna module according to an embodiment of the present invention.

Referring to Figure 3a, the expansion module 200 may be arranged to be extended to one side (for example, x-direction) of the base module 100. Also, the number of second patch antenna patterns 210 included in the extension module 200 may be plural.

3B, an antenna module according to an embodiment of the present invention may include first and second expansion modules 200a and 200b. The first expansion module 200a may be electrically connected to the base module 100 through the 3-1 region 190a of the connection member, and the second expansion module 200b may include the 3-2 region ( 190b) may be electrically connected to the base module 100.

Accordingly, the remote signal transmission / reception direction and / or location of the RF signal can be more freely designed in the electronic device.

4A and 4B are plan views illustrating a first region R1 and a third region R2 of a connecting member of an antenna module according to an embodiment of the present invention.

Referring to FIG. 4A, the first ground layer 125 may include a plurality of through holes TH, and may be disposed to overlap the arrangement space of the patch antenna pattern 110 in the z direction.

The plurality of feed vias 120 may be arranged to penetrate the plurality of through holes TH, respectively.

Referring to FIG. 4B, the wiring ground layer 154 is disposed closer to the IC than the first ground layer 125 illustrated in FIG. 4A, and provides the arrangement space of the first and second feed lines 151a and 151b can do. The wiring ground layer 154 may be spaced apart from the first and second feed lines 151a and 151b, and may have a shape surrounding the first and second feed lines 151a and 151b.

The first feed line 151a may electrically connect the feed via 120 and the first wiring via 153a.

The second feed line 151b may extend from the second wiring via 153b to the third region R2, and may be electrically connected to the second patch antenna pattern.

The first and second wiring vias 153a and 153b may be disposed to overlap the arrangement space of the IC 310 in the z direction, and may be electrically connected to the IC 310.

5A to 5C are side views illustrating an antenna module and electronic devices according to an embodiment of the present invention.

5A to 5C, the electronic device 700 according to an embodiment of the present invention includes a case including a first surface 701, a second surface 702, and a third surface 703 And a set substrate 600 disposed in the case.

The base module 100 of the antenna module according to an embodiment of the present invention may be mounted on the set substrate 600 through the mounting electrical connection structure 390.

The first patch antenna pattern 110 is disposed closer to the first surface 701 than the second surface 702 of the case, and the second patch antenna pattern 210a is second to the first surface 701 of the case. It can be disposed closer to the face 702.

Accordingly, the probability of remote transmission and reception of RF signals of the first and second patch antenna patterns 110 and 210a is interrupted by obstacles (eg, a display panel, a battery, etc.) or external obstacles (eg, a user's hand) in the electronic device, respectively. Can be reduced.

For example, the plane (eg, top surface) of the first patch antenna pattern 110 and the plane (eg, top surface) of the second patch antenna pattern 210a may be respectively arranged to face the z direction.

Referring to FIG. 5A, an extension module 200 of an antenna module according to an embodiment of the present invention may be disposed closer to the first surface 701 than the third surface 703 of the electronic device 700.

Referring to FIG. 5B, the extension module 200 of the antenna module according to an embodiment of the present invention may be disposed closer to the third surface 703 than the first surface 701 of the electronic device 700.

5C, a direction in which the plane of the first patch antenna pattern 110 faces may be different from a direction in which the plane of the second patch antenna pattern 210a faces.

Accordingly, the antenna module and the electronic device according to an embodiment of the present invention can utilize a high gain of the patch antenna in all directions.

Meanwhile, referring to FIGS. 5A and 5C, the third patch antenna patterns 210b and 210c may be disposed on the lower surface of the 3-2 region 190b of the connecting member.

Figure 5d is a side view showing the antenna module and the electronic device and the fourth antenna package according to an embodiment of the present invention.

Referring to FIG. 5D, an antenna module according to an embodiment of the present invention and a third extension module 200c including a fourth antenna package 240d may be included. The fourth antenna package 240d may include a fourth patch antenna pattern 210d.

Here, the connecting member is a fourth region 250d that provides an arrangement surface of the fourth antenna package 200c, and a fifth region 190c that electrically connects between the fourth region 250d and the second region. It may further include.

Accordingly, remote transmission and reception of RF signals of the first, second, and fourth patch antenna patterns 110, 210a, and 210d are obstacles (eg, a display panel, a battery, etc.) or external obstacles (eg, a user's hand), respectively. The probability of being disturbed by can be reduced more easily.

6A and 6B are plan views illustrating electronic devices according to an embodiment of the present invention.

Referring to FIG. 6A, an antenna module including a base module 100g and an expansion module 400g may be disposed on a set substrate 600g, and is disposed on an electronic device 700g according to an embodiment of the present invention. Can be.

The electronic device 700g includes a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, and a computer. ), Monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc. It is not limited.

A communication module 610g and a second IC 620g may be further disposed on the set substrate 600g. The antenna module may be electrically connected to the communication module 610g and / or the second IC 620g through a coaxial cable 630g.

The communication module 610g includes a memory chip such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory to perform digital signal processing; Application processor chips such as a central processor (eg, CPU), graphics processor (eg, GPU), digital signal processor, encryption processor, microprocessor, microcontroller; It may include at least a part of logic chips such as an analog-to-digital converter and an application-specific IC (ASIC).

The second IC 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input / output from the second IC 620g may be transmitted to the antenna module through a coaxial cable. When the base signal is an IF signal, the second IC 620g may be implemented as an Intermediate Frequency Integrated Circuit (IFIC). When the base signal is a baseband signal, the second IC 620g may be implemented as a base band integrated circuit (BBIC).

For example, the base signal may be transmitted to the IC through an electrical connection structure, a core via, and circuit wiring. The IC may convert the base signal into an RF signal in the millimeter wave (mmWave) band.

Referring to FIG. 6B, a plurality of antenna modules each including a base module 100h, a first patch antenna pattern 110h, and an extension module 400h is an electronic device 700h on a set substrate 600h of the electronic device 700h. ) May be disposed adjacent to one side boundary and the other side boundary, and a communication module 610h and a second IC 620h may be further disposed on the set substrate 600h. The plurality of antenna modules may be electrically connected to the communication module 610h and / or the second IC 620h through a coaxial cable 630h.

On the other hand, patch antenna patterns, coupling patch patterns, feed vias, ground layers, coupling structures, wiring layers, wiring vias, electrical connection structures, heat slugs, and heat dissipation structures disclosed herein are metal materials, such as copper ( Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or conductive materials such as alloys thereof). Chemical vapor deposition (CVD), Physical Vapor Deposition (PVD), Sputtering, Subtractive, Additive, Semi-Additive Process (SAP), Modified Semi-Additive Process (MSAP) ) May be formed according to a plating method, but is not limited thereto.

On the other hand, the dielectric layer disclosed herein is a prepreg (FRpreg), FR4, LTCC, LCP, polyimide, as well as thermoplastic resins such as thermosetting resins such as epoxy resins, or these resins together with inorganic fillers (Glass Fiber) , Glass Cloth, Glass Fabric) and other impregnated resins, ABF (Ajinomoto Build-up Film), BT (Bismaleimide Triazine), Photo Imagable Dielectric (PID) resin, General Copper Clad Laminate, CCL ) Or a ceramic-based insulating material.

Meanwhile, the RF signals developed herein are Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, It may have a format according to GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols specified thereafter, but is not limited thereto. Also, the frequency of the RF signal (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

In the above, the present invention has been described by specific matters such as specific components, etc. and limited embodiments and drawings, which are provided to help the overall understanding of the present invention, but the present invention is not limited to the above embodiments , Those skilled in the art to which the present invention pertains can make various modifications and variations from these descriptions.

100: base module
110: first patch antenna pattern (patch antenna pattern)
115: first coupling patch pattern (coupling patch pattern)
120: first feed via
125: first ground layer
130: first coupling structure
140: first antenna package
142: first antenna dielectric layer
150: first area of the connecting member
151: first signal path wiring layer
151a: first feedline
151b: second feed line
152: first signal path dielectric layer
153: first signal path wiring via
153a: first wiring via
153b: second wiring via
154: wiring ground layer
160: lack of circuit support
161: circuit wiring layer
162: circuit dielectric layer
163: circuit wiring via
190, 190a: the third area of the connecting member
190b: area 3-2 of the connecting member
190c: fifth region of connecting member
191: RF signal extension path wiring
192, 193: RF signal extension path ground layer
200: expansion module
200a: first expansion module
200b: second expansion module
200c: third expansion module
210, 210a: second patch antenna pattern
210b: third patch antenna pattern
210d: 4th patch antenna pattern
215, 215a: second coupling patch pattern
215b: Third coupling patch pattern
220, 220a: Second feedvia
220b: Third Feedvia
230, 230a: second coupling structure
230b: third coupling structure
240: second antenna package
240d: fourth antenna package
242, 242a: second antenna dielectric layer
242b: third antenna dielectric layer
250: second area of the connecting member
250d: fourth area of connecting member
251: second signal path wiring layer
252: second signal path dielectric layer
253: second signal path wiring via
260: support member
270: third antenna package
280: second IC package
290: Passive parts package
300: IC package
310, 310a: IC (Integrated Circuit)
310b: Second IC
330, 330a: IC electrical connection structure
330b: Second IC electrical connection structure
340, 340a: encapsulant
340b: second sealing material
350: passive components
350a: first passive component
350b: second passive component
370: heat slug
380: heat dissipation structure
390: mounting electrical connection structure
410: core member
411: core wiring layer
412: core dielectric layer
413: Core Via
600: set substrate
700: electronic devices
701: first side of the electronic device
702: second side of the electronic device
703: third side of the electronic device

Claims (16)

An IC package including an IC and a mounting electrical connection structure;
A first antenna package including a first patch antenna pattern, a first feed via electrically connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via;
A second patch antenna pattern, a second feed via electrically connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and spaced apart from the first antenna package A second antenna package; And
A connecting member having a stacked structure electrically connected between the IC and the first and second feed vias and electrically connected to a mounting electrical connection structure; Including,
The connecting member,
A first region disposed between the first antenna package and the IC package;
A second region providing an arrangement surface of the second antenna package;
An antenna module including a third region electrically connecting between the first region and the second region.
According to claim 1,
The direction in which the plane of the first patch antenna pattern faces is different from the direction in which the plane of the second patch antenna pattern faces.
According to claim 1,
The connecting member is an antenna module comprising a signal path dielectric layer more flexible than the first antenna dielectric layer.
According to claim 1,
The antenna module further includes a third antenna package disposed on a different surface from the arrangement surface where the second antenna package is disposed in the second region of the connection member.
According to claim 1,
An antenna module including a second IC, and further comprising a second IC package disposed on a surface different from an arrangement surface in which the second antenna package is disposed in a second region of the connecting member.
According to claim 1,
A passive component disposed on a surface different from an arrangement surface on which the second antenna package is disposed in the second area of the connection member; And
An encapsulant that seals at least a portion of the passive component; Antenna module further comprising a.
According to claim 1, wherein the IC package,
An antenna module further comprising a core member provided on one surface of the connection member and the other surface on which the mounting electrical connection structure is disposed and spaced apart from the IC.
According to claim 1,
The IC package further includes a heat slug disposed on an inactive surface of the IC,
The IC is an antenna module that is electrically connected to the connecting member through an active surface.
The method of claim 8,
The IC package further includes a heat dissipation structure electrically connected to the heat slug,
The heat slug is an antenna module disposed between the IC and the heat dissipation structure.
According to claim 1,
The second antenna package further includes a second coupling structure surrounding at least a portion of the second patch antenna pattern.
According to claim 1,
The second antenna package further includes a second coupling patch pattern disposed to overlap the second patch antenna pattern when viewed in the stacking direction of the connecting member.
case;
A set substrate disposed in the case; And
It includes an antenna module disposed in the case and electrically connected to the set substrate,
The antenna module,
An IC package including an IC and a mounting electrical connection structure;
A first antenna package including a first patch antenna pattern, a first feed via electrically connected to the first patch antenna pattern, and a first antenna dielectric layer surrounding at least a portion of the first feed via;
A second patch antenna pattern, a second feed via electrically connected to the second patch antenna pattern, and a second antenna dielectric layer surrounding at least a portion of the second feed via, and spaced apart from the first antenna package A second antenna package; And
A connecting member having a stacked structure electrically connected between the IC and the first and second feed vias and electrically connected to a mounting electrical connection structure; Including,
The connecting member,
A first region disposed between the first antenna package and the IC package;
A second region providing an arrangement surface of the second antenna package;
An electronic device including a third region electrically connecting between the first region and the second region.
The method of claim 12,
The IC package further includes a core member disposed between the first region of the connecting member and the set substrate,
The mounting electrical connection structure is an electronic device disposed between the core member and the set substrate.
The method of claim 12,
The IC package further comprises a heat slug disposed between the IC and the set substrate and electrically connected to the set substrate.
The method of claim 12,
The first patch antenna pattern is disposed closer to the first surface than the second surface of the case,
The second patch antenna pattern is an electronic device disposed closer to the second surface than the first surface of the case.
The method of claim 12,
Further comprising a fourth antenna package,
The connecting member,
A fourth area providing an arrangement surface of the fourth antenna package; And
And a fifth region electrically connecting between the fourth region and the second region.

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