KR20190104848A - Antenna apparatus and antenna module - Google Patents

Abstract

According to one embodiment of the present invention, provided is an antenna apparatus, which comprises: a feed via; a patch antenna pattern electrically connected to one end of the feed via; a ground layer having a through hole disposed on the lower side of the patch antenna pattern and passing through the feed via; a first conductive ring pattern having a first through area so as to surround the patch antenna pattern when disposed laterally spaced apart from the patch antenna pattern and viewed in the vertical direction; and a second conductive ring pattern disposed on the upper side of the first conductive ring pattern and having a second through area to surround the patch antenna pattern when viewed in the vertical direction, wherein the width of the second through area may be greater than the width of the first through area.

Description

Antenna apparatus and antenna module

The present invention relates to an antenna device and an antenna module.

Data traffic of mobile communication is increasing rapidly every year. Active technology development is under way to support such breakthrough data in real time in wireless networks. For example, the content of Internet-based data (IoT) -based data, Augmented Reality (AR), Virtual Reality (VR), Live VR / AR combined with SNS, Autonomous driving, Sync View, Micro-camera Applications such as real-time video transmission require communication (eg, 5G communication, mmWave communication, etc.) to support large data exchange.

Therefore, recently, millimeter wave (mmWave) communication including 5G (5G) communication has been actively studied, and research for commercialization / standardization of an antenna module for smoothly implementing it has been actively conducted.

RF signals in high frequency bands (e.g., 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) are easily absorbed and lost in the way they are delivered, so the quality of communication can drop dramatically. Therefore, the antenna for high frequency communication requires a different technical approach from the conventional antenna technology, and it is necessary to separate the antenna gain (Gain), the integration of the antenna and the RFIC, and the effective isotropic radiated power (EIRP). It may require development of special technologies such as power amplifiers.

Traditionally, antenna modules that provide millimeter-wave communication environments have coaxial cables by placing ICs and antennas on boards to satisfy high levels of antenna performance (eg transmit / receive, gain, directivity, etc.) at high frequencies. Has been using structure to connect. However, such a structure may cause insufficient antenna placement space, limited antenna type freedom, increased interference between the antenna and the IC, and increased size / cost of the antenna module.

Republic of Korea Patent Publication 10-0702406

The present invention provides an antenna device and an antenna module which can have an advantageous structure for improving or minimizing antenna performance (eg, transmit / receive rate, gain, bandwidth, directivity, etc.).

An antenna device according to an embodiment of the present invention, a feed via; A patch antenna pattern electrically connected to one end of the feed via; A ground layer disposed under the patch antenna pattern and having a through hole through which the feed via passes; A first conductive ring pattern disposed laterally spaced from the patch antenna pattern and having a first through area to surround the patch antenna pattern when viewed in a vertical direction; And a second conductive ring pattern disposed above the first conductive ring pattern and having a second through area to surround the patch antenna pattern when viewed in the vertical direction. The width of the second through area may be greater than the width of the first through area.

Antenna module according to an embodiment of the present invention, a plurality of feed vias; A plurality of patch antenna patterns each electrically connected to one end of a corresponding feed via of the plurality of feed vias; A ground layer disposed below the plurality of patch antenna patterns and having a plurality of through holes through which the plurality of feed vias respectively pass; A first conductive porous plate pattern disposed on an upper side of the ground layer and having a plurality of first through regions respectively surrounding the patch antenna pattern when viewed in a vertical direction; And a second conductive porous plate pattern disposed on an upper side of the first conductive porous plate pattern and having a plurality of second through regions respectively surrounding the patch antenna pattern when viewed in the vertical direction. And a total width of the plurality of second through areas may be greater than a total width of the plurality of first through areas.

The antenna device and the antenna module according to an embodiment of the present invention can further improve antenna performance because the RF signal can be further concentrated in the z direction without increasing the size.

The antenna device and the antenna module according to an embodiment of the present invention can reduce the counting of the RF signal to the adjacent antenna device, thereby improving electromagnetic isolation of the adjacent antenna device, and are disposed closer to the adjacent antenna device. Can be reduced in size by omitting a separate component for electromagnetic shielding.

1 is a side view showing an antenna device according to an embodiment of the present invention.
Figure 2a is a side view illustrating the dimensions and positional relationship of the antenna device according to an embodiment of the present invention.
2B is a view showing an equivalent circuit of an antenna device according to an embodiment of the present invention.
3 is a plan view showing an antenna device and an antenna module according to an embodiment of the present invention.
4 is a side view showing the antenna module according to an embodiment of the present invention.
5A through 5D are plan views illustrating each layer of the antenna module according to an exemplary embodiment.
6A to 6B are diagrams illustrating an IC peripheral structure of an antenna module according to an embodiment of the present invention.
7 is a side view illustrating the structure of an antenna device and an antenna module according to an embodiment of the present invention.
8A and 8B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain shapes, structures, and characteristics described herein may be embodied in other embodiments without departing from the spirit and scope of the invention with respect to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. Like reference numerals in the drawings refer to the same or similar functions throughout the several aspects.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention.

1 is a side view showing an antenna device according to an embodiment of the present invention.

Referring to FIG. 1, an antenna device according to an embodiment of the present disclosure may include a patch antenna pattern 110a, feed vias 121a and 122a, and a conductive ring pattern 130a. The conductive ring pattern 130a may include a first conductive ring pattern 131a, a second conductive ring pattern 136a, a third conductive ring pattern 132a, a fourth conductive ring pattern 133a, and a fifth conductive ring pattern ( 134a) and the sixth conductive ring pattern 135a.

The feed vias 121a and 122a may be configured to pass a radio frequency (RF) signal. For example, the feed vias 121a and 122a may electrically connect between the IC and the patch antenna pattern 110a and may have a structure extending in the z direction.

The patch antenna pattern 110a may be electrically connected to one end of the feed vias 121a and 122a. The patch antenna pattern 110a may receive the RF signals from the feed vias 121a and 122a and transmit them in the z direction, and transmit the RF signals received in the z direction to the feed vias 121a and 122a.

The core region 140a may be provided between the patch antenna pattern 110a and the ground layer 125a and may be spaced apart from the patch antenna pattern 110a and the ground layer 125a. For example, the core region 140a may be filled with an insulating layer.

Some of the RF signals transmitted from the patch antenna pattern 110a may face the ground layer 125a disposed below. The RF signal directed toward the ground layer 125a may be reflected by the ground layer 125a and directed in the z direction. Accordingly, the RF signal transmitted from the patch antenna pattern 110a may be further concentrated in the z direction.

For example, the patch antenna pattern 110a may have a structure of a patch antenna having both sides of a circular or polygonal shape. Both surfaces of the patch antenna pattern 110a may serve as a boundary through which an RF signal passes between a conductor and a non-conductor. The patch antenna pattern 110a may have an intrinsic frequency band (for example, 28 GHz) according to an intrinsic element (for example, shape, size, height, dielectric constant of the insulating layer, etc.).

The conductive ring pattern 130a may be disposed to be spaced apart from the patch antenna pattern 110a and have a through area to surround the patch antenna pattern 110a when viewed in the vertical direction (eg, z direction).

The conductive ring pattern 130a may be electromagnetically coupled to the patch antenna pattern 110a, and may provide capacitance between the conductive ring pattern 130a and the patch antenna pattern 110a.

Here, elements of the conductive ring pattern 130a (eg, height, shape, size, number, spacing, spacing for the patch antenna pattern, etc.) may affect the frequency characteristics of the patch antenna pattern 110a. .

The first conductive ring pattern 131a is spaced apart from the patch antenna pattern 110a in the lateral direction (for example, in the x direction and / or y direction) and viewed in the vertical direction (for example, in the z direction). It may have a first through area to surround the.

The second conductive ring pattern 136a may be disposed above the first conductive ring pattern 131a and have a second through area to surround the patch antenna pattern 110a when viewed in the vertical direction (for example, z direction). .

The third to sixth conductive ring patterns 132a, 133a, 134a, and 135a may be disposed above or below the first and second conductive ring patterns 131a and 136a, respectively. It may have a corresponding through area. At least some of the third to sixth conductive ring patterns 132a, 133a, 134a, and 135a may be omitted according to design.

Here, the width of the second through area may be greater than the width of the first through area. If the conductive ring pattern 130a includes the third to sixth conductive ring patterns 132a, 133a, 134a, and 135a, the width of the third to sixth through areas is greater than the width of the first through area and the second through areas. It can be smaller than its width. That is, the conductive ring pattern 130a may have a structure similar to a corrugated waveguide.

Accordingly, since the RF signal transmitted from the patch antenna pattern 110a may be further induced in the z direction, the gain of the patch antenna pattern 110a may be improved. That is, the antenna device according to an embodiment of the present invention can improve antenna performance without actually increasing the size.

In addition, the antenna device according to an embodiment of the present invention reduces the phase distortion error due to the path difference of the main beam of the patch antenna pattern 110a by utilizing the corrugated side boundary of the conductive ring pattern 130a. It can reduce the higher order mode back propagation of the RF signal.

On the other hand, referring to Figure 1, the antenna device according to an embodiment of the present invention, is arranged to electrically connect between the first conductive ring pattern 131a and the second conductive ring pattern 136a and the vertical direction ( For example, a plurality of chain vias 139a arranged to surround the patch antenna pattern 110a may be further included in the z direction.

Due to the size difference between the first through region and the second through region and the plurality of chain vias 139a, the top surface of the first conductive ring pattern 131a may be larger than the top surface of the second conductive ring pattern 136a. .

The plurality of chain vias 139a may reduce the counting of the RF signal transmitted from the patch antenna pattern 110a in the lateral direction (eg, the x direction and / or the y direction).

If the conductive ring pattern 130a includes the third to sixth conductive ring patterns 132a, 133a, 134a, and 135a, the plurality of chain vias 139a may include a plurality of first to fifth chain vias. Can be. For example, the plurality of first chain vias are arranged to electrically connect between the first conductive ring pattern 131a and the third conductive ring pattern 132a and the plurality of second chain vias are second conductive ring patterns. It may be arranged to electrically connect between the 136a and the third conductive ring pattern 132a. Here, the plurality of first to fifth chain vias may overlap each other when viewed in the vertical direction (eg, z direction). Accordingly, the spaces between the first to sixth conductive ring patterns 131a, 136a, 132a, 133a, 134a, and 135a may have different sizes.

Some of the RF signals transmitted through the patch antenna pattern 110a may be reflected by the first and / or second conductive ring patterns 131a and 136a. The plurality of chain vias 139a may reflect the RF signals reflected from the first and / or second conductive ring patterns 131a and 136a. The RF signals reflected from the plurality of chain vias 139a may be directed toward the z direction or toward the ground layer 125a. The RF signal directed to the ground layer 125a may be reflected by the ground layer 125a and directed in the z direction. Accordingly, the plurality of chain vias 139a may further concentrate the RF signal transmitted through the patch antenna pattern 110a in the z direction.

On the other hand, referring to Figure 1, the antenna device according to an embodiment of the present invention, is arranged to electrically connect the first conductive ring pattern 131a and the ground layer 125a and up and down direction (for example, z direction) When viewed as further may include a grounding via 145a arranged to surround the patch antenna pattern 110a. Accordingly, the conductive ring pattern 130a and the plurality of chain vias 139a may induce the RF signal transmitted from the patch antenna pattern 110a in the z direction more efficiently.

Meanwhile, referring to FIG. 1, the antenna device according to the exemplary embodiment of the present invention is disposed above the patch antenna pattern 110a and overlaps the patch antenna pattern 110a when viewed in the vertical direction (eg, z direction). The coupling patch pattern 115a may be further included. Accordingly, the antenna device according to an embodiment of the present invention may have a wider bandwidth.

The coupling patch pattern 115a and the second conductive ring pattern 136a may be disposed at the same level, and the patch antenna pattern 110a and the first conductive ring pattern 131a may be disposed at the same level. Accordingly, the first and second conductive ring patterns 131a and 136a can more efficiently concentrate the RF signal transmitted through the patch antenna pattern 110a in the z direction.

Figure 2a is a side view illustrating the dimensions and positional relationship of the antenna device according to an embodiment of the present invention.

Referring to FIG. 2A, an angle A in a vertical direction (z direction) of a line connecting the boundary of the first conductive ring pattern and the boundary of the second conductive ring pattern may be 20 degrees or more and 30 degrees or less. Accordingly, the antenna device according to an exemplary embodiment may further concentrate the RF signal transmitted through the patch antenna pattern in the z direction.

In addition, the antenna device according to an embodiment of the present invention may have various adjusted angles A as well as a range of 20 degrees or more and 30 degrees or less, and thus may have various electric field characteristics.

Further, the first distance B from the point where the line connecting the boundary of the first conductive ring pattern and the boundary of the second conductive ring pattern meets to the ground layer is the second distance C from the ground layer to the patch antenna pattern. May be greater than). Accordingly, the RF signal transmitted through the patch antenna pattern may be further concentrated in the z direction.

Further, the third distance D between the first to sixth conductive ring patterns is shorter than the fourth distance E1 between the first conductive ring pattern and the patch antenna pattern, and between the second conductive ring patterns and the coupling patch pattern. It may be shorter than the fifth distance E2. Accordingly, the RF signal transmitted through the patch antenna pattern may be further concentrated in the z direction.

In addition, the upper surface area L2 of the coupling patch pattern may be larger than the upper surface area L1 of the patch antenna pattern, and the fourth distance E1 may be shorter than the fifth distance E2. Accordingly, the RF signal transmitted through the patch antenna pattern may be further concentrated in the z direction.

2B is a view showing an equivalent circuit of an antenna device according to an embodiment of the present invention.

Referring to FIG. 2B, the patch antenna pattern 110b of the antenna device according to an embodiment of the present invention may transmit an RF signal or receive an RF signal to a source SRC2 such as an IC, and have a resistance value R2. And may have inductances L3 and L4.

The conductive ring pattern 130b includes the capacitances C5 and C12 for the patch antenna pattern 110b, the capacitances C6 and 10 between the conductive ring patterns, the inductances L5 and L6 of the chain vias, and the conductive ring pattern. And capacitance C7 and C11 between the ground layer and the ground layer.

Frequency band and bandwidth of the antenna device according to an embodiment of the present invention may be determined by the above-described resistance value, capacitance and inductance.

3 is a plan view showing an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 3, an antenna module according to an embodiment of the present invention may include a plurality of end-fire antennas including an end-fire antenna pattern 161a, a director pattern 162a, and a second feed line 172a, respectively. It may further include.

The end-fire antenna pattern 161a may form a radiation pattern in a second direction (eg, x direction) to transmit or receive an RF signal in a second direction (eg, x direction). Therefore, the antenna module according to an embodiment of the present invention can extend the RF signal transmission / reception direction omni-directional.

For example, the end-fire antenna pattern 161a may have a dipole form or a folded dipole form. Here, one end of each pole of the end-fire antenna pattern 161a may be electrically connected to the second feed line 172a. The frequency band of the end-fire antenna pattern 161a may be designed to be substantially the same as the frequency band of the patch antenna pattern 110a, but is not limited thereto.

The director pattern 162a may be electromagnetically coupled to the end-fire antenna pattern 161a to improve the gain or bandwidth of the end-fire antenna pattern 161a.

The second feed line 172a may transmit the RF signal received from the end-fire antenna pattern 161a to the IC, and may transfer the RF signal received from the IC to the end-fire antenna pattern 161a.

Also, referring to FIG. 3, an antenna module according to an embodiment of the present invention is disposed above the ground layer 125a and surrounds the patch antenna patterns 110a when viewed in an up and down direction (eg, z direction). The first conductive porous plate pattern 131b having the plurality of first through regions S1 and the patch antenna pattern disposed above the first conductive porous plate pattern 131b and viewed in the vertical direction (for example, z direction). It may include a second conductive porous plate pattern 136b having a plurality of second through regions S2 surrounding each of 110a.

According to the design, the antenna module according to an embodiment of the present invention is disposed between the first conductive porous plate pattern 131b and the second conductive porous plate pattern 136b and has a third through fifth through region, respectively. The third to fifth conductive porous plate patterns 133b, 134b, and 135b may be further included.

The total width of the plurality of second through regions S2 may be larger than the total width of the plurality of first through regions S1. If the antenna module according to an embodiment of the present invention further includes the third to fifth conductive porous plate patterns 133b, 134b, and 135b, the total width of the third to fifth through areas is a plurality of second through holes. The area S2 may be smaller than the total width and larger than the total width of the plurality of first through areas S1.

That is, the first to fifth conductive porous plate patterns 131b, 133b, 134b, 135b, and 136b may have a structure similar to a corrugated waveguide. Accordingly, RF signals transmitted through the plurality of patch antenna patterns 110a may be further concentrated in the z direction.

The patch antenna pattern 110a may include a plurality of slits 111a formed at both sides of the connection position of the feed via 120a. Accordingly, the impedance of the patch antenna pattern 110a can be optimized.

4 is a side view showing the antenna module according to an embodiment of the present invention.

Referring to FIG. 4, the ground layer 221a may be disposed below the patch antenna pattern 110a, and the wiring ground layer 220a may be disposed below the ground layer 221a, and the second ground layer may be disposed below the patch antenna pattern 110a. 222a may be disposed under the wiring ground layer 220a.

The IC 300a may be disposed under the second ground layer 222a and may be electrically connected to the wiring via 230a.

The passive component 350a and the sub substrate 250a may be disposed under the second ground layer 222a, respectively, and may be electrically connected to the IC 300a.

Since the ground layer 221a, the wiring ground layer 220a, and the second ground layer 222a have a larger area than the patch antenna pattern 110a, the antenna module according to an embodiment of the present invention may include the first and the first layers. Even if the second conductive ring patterns 131a and 136a are further provided, a substantial increase in size may not be caused. Thus, the antenna module according to an embodiment of the present invention can improve antenna performance without increasing the actual size.

5A through 5D are plan views illustrating each layer of the antenna module according to an exemplary embodiment.

Referring to FIG. 5A, the ground layer 201a may have a through hole through which the feed vias 121a and 122a pass, and may be connected to the other end of the grounding via 185a. The ground layer 201a may electromagnetically shield between the patch antenna pattern and the feed line.

Referring to FIG. 5B, the wiring ground layer 202a may surround at least a portion of the second feed line 220a and the first feed line 221a, respectively. The second feed line 220a may be electrically connected to the second wiring via 232a, and the first feed line 221a may be electrically connected to the first wiring via 231a. The wiring ground layer 202a may electromagnetically shield between the second feed line 220a and the first feed line 221a. One end of the second feed line 220a may be connected to the second feed via 211a.

Referring to FIG. 5C, the second ground layer 203a may have a plurality of through holes through which the first wiring via 231a and the second wiring via 232a pass, respectively, and form the coupling ground pattern 235a. Can have The second ground layer 203a may electromagnetically shield between the feedline and the IC.

Referring to FIG. 5D, the IC ground layer 204a may have a plurality of through holes through which the first wiring via 231a and the second wiring via 232a respectively pass. The IC 310a may be disposed under the IC ground layer 204a, and may be electrically connected to the first wiring via 231a and the second wiring via 232a. The end-fire antenna pattern 210a and the director pattern 215a may be disposed at substantially the same height as the IC ground layer 225.

IC ground layer 204a may provide the ground used in circuitry and / or passive components of IC 310a as IC 310a and / or passive components. Depending on the design, the IC ground layer 204a may provide a path for the transmission of power and signals used in the IC 310a and / or passive components. Thus, IC ground layer 204a may be electrically connected to the IC and / or passive components.

Meanwhile, the wiring ground layer 202a, the second ground layer 203a, and the IC ground layer 204a may have a recessed shape to provide a cavity. Accordingly, the end-fire antenna pattern 210a may be further disposed closer to the IC ground layer 204a.

Meanwhile, the vertical relationship and shape of the wiring ground layer 202a, the second ground layer 203a, and the IC ground layer 204a may vary depending on the design.

6A to 6B are diagrams illustrating an IC peripheral structure of an antenna module according to an embodiment of the present invention.

Referring to FIG. 6A, an antenna module according to an embodiment of the present disclosure may include a connection member 200, an IC 310, an adhesive member 320, an electrical connection structure 330, an encapsulant 340, and a passive component. At least some of the 350 and the sub-substrate 410 may be included.

The connection member 200 may include at least some of the ground layer, the wiring ground layer, the second ground layer, and the IC ground layer described above with reference to FIGS. 4 to 5.

The IC 310 is the same as the above-described IC, and may be disposed under the connection member 200. The IC 310 may be electrically connected to a wire of the connection member 200 to transmit or receive an RF signal, and may be electrically connected to a ground layer of the connection member 200 to receive ground. For example, the IC 310 may generate a converted signal by performing at least some of frequency conversion, amplification, filtering, phase control, and power generation.

The adhesive member 320 may bond the IC 310 and the connection member 200 to each other.

The electrical connection structure 330 may electrically connect the IC 310 and the connection member 200. For example, the electrical connection structure 330 may have a structure such as solder balls, pins, lands, and pads. The electrical connection structure 330 may have a lower melting point than the wiring and the ground layer of the connection member 200 to electrically connect the IC 310 and the connection member 200 through a predetermined process using the low melting point.

The encapsulant 340 may seal at least a portion of the IC 310, and may improve heat dissipation performance and impact protection performance of the IC 310. For example, the encapsulant 340 may be implemented with a photo imageable encapsulant (PIE), an Ajinomoto build-up film (ABF), an epoxy molding compound (EMC), or the like.

The passive component 350 may be disposed on the bottom surface of the connection member 200, and may be electrically connected to the wiring and / or the ground layer of the connection member 200 through the electrical connection structure 330. For example, the passive component 350 may include at least some of a capacitor (eg, a multi-layer ceramic capacitor (MLCC)), an inductor, and a chip resistor.

The sub-substrate 410 may be disposed under the connection member 200, and may receive an intermediate frequency (IF) signal or a base band signal from the outside and transmit the received signal to the IC 310 or from the IC 310. It may be electrically connected to the connection member 200 to receive the IF signal or the baseband signal to transmit to the outside. Here, the frequency (eg, 24 GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz) of the RF signal is greater than the frequency of the IF signal (eg, 2 GHz, 5 GHz, 10 GHz, etc.).

For example, the sub-substrate 410 may transfer an IF signal or a baseband signal to or from the IC 310 through a wire that may be included in the IC ground layer of the connection member 200. Since the first ground layer of the connection member 200 is disposed between the IC ground layer and the wiring, the IF signal or the baseband signal and the RF signal may be electrically isolated in the antenna module.

Referring to FIG. 6B, the antenna module according to the exemplary embodiment may include at least some of the shielding member 360, the connector 420, and the chip antenna 430.

The shielding member 360 may be disposed under the connection member 200 to confine the IC 310 together with the connection member 200. For example, the shielding member 360 may be arranged to cover (eg, conformal shield) the IC 310 and the passive component 350 together or to cover each other (eg, the compartment shield). For example, the shielding member 360 may have a shape of a hexahedron having one surface open, and may have a hexahedral receiving space through coupling with the connection member 200. The shielding member 360 may be made of a high conductivity material such as copper to have a short skin depth, and may be electrically connected to the ground layer of the connection member 200. Accordingly, the shielding member 360 may reduce electromagnetic noise that may be received by the IC 310 and the passive component 350.

The connector 420 may have a connection structure of a cable (eg, a coaxial cable, a flexible PCB), may be electrically connected to the IC ground layer of the connection member 200, and may play a role similar to that of the above-described sub substrate. have. That is, the connector 420 may receive an IF signal, a baseband signal and / or a power from a cable, or provide an IF signal and / or a baseband signal to a cable.

The chip antenna 430 may transmit or receive an RF signal in support of an antenna device according to an exemplary embodiment. For example, the chip antenna 430 may include a dielectric block having a dielectric constant greater than that of the insulating layer, and a plurality of electrodes disposed on both surfaces of the dielectric block. One of the plurality of electrodes may be electrically connected to the wiring of the connection member 200, and the other may be electrically connected to the ground layer of the connection member 200.

7 is a side view illustrating the structure of an antenna device and an antenna module according to an embodiment of the present invention.

Referring to FIG. 7, in the antenna module according to the exemplary embodiment, the end-fire antenna 100f, the patch antenna pattern 1110f, the IC 310f, and the passive component 350f are integrated into the connection member 500f. It can have a structure.

The end-fire antenna 100f and the patch antenna pattern 1110f may be designed in the same manner as the antenna device and the patch antenna pattern described above, respectively, and receive or transmit an RF signal from the IC 310f, or receive the received RF. The signal can be passed to the IC 310f.

The connection member 500f may have a structure in which at least one conductive layer 510f and at least one insulating layer 520f are stacked (eg, a structure of a printed circuit board). The conductive layer 510f may have the above-described ground layer and a feed line.

In addition, the antenna module according to an exemplary embodiment may further include a flexible connection member 550f. The flexible connecting member 550f may include a first flexible region 570f overlapping the connecting member 500f and a second flexible region 580f not overlapping the connecting member 500f when viewed in the vertical direction.

The second flexible region 580f may be flexibly curved in the vertical direction. Accordingly, the second flexible region 580f may be flexibly connected to the connector of the set board and / or the adjacent antenna module.

The flexible connection member 550f may include a signal line 560f. The intermediate frequency (IF) signal and / or the baseband signal may be transmitted to the IC 310f through the signal line 560f or to a connector and / or an adjacent antenna module of the set board.

8A and 8B are plan views illustrating an arrangement in an electronic device of an antenna module according to an exemplary embodiment of the present disclosure.

Referring to FIG. 8A, an antenna module including an end-fire antenna 100g, a patch antenna pattern 1110g, and an insulating layer 1140g may be used for the electronic device 700g on the set substrate 600g of the electronic device 700g. May be disposed adjacent to the lateral boundary.

The electronic device 700g is a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer. ), Monitor, tablet, laptop, netbook, television, video game, smart watch, automotive, etc. It is not limited.

The communication module 610g and the baseband circuit 620g may be further disposed on the set substrate 600g. The antenna module may be electrically connected to the communication module 610g and / or the baseband circuit 620g through the coaxial cable 630g.

The communication module 610g may include a memory chip such as volatile memory (eg, DRAM), non-volatile memory (eg, ROM), and flash memory to perform digital signal processing; Application processor chips such as central processors (eg, CPUs), graphics processors (eg, GPUs), digital signal processors, cryptographic processors, microprocessors, microcontrollers; It may include at least a portion of a logic chip, such as an analog-to-digital converter, an application-specific IC (ASIC).

The baseband circuit 620g may generate a base signal by performing analog-to-digital conversion, amplification, filtering, and frequency conversion on the analog signal. The base signal input and output from the baseband circuit 620g may be transmitted to the antenna module through a cable.

For example, the base signal may be transmitted to the IC through an electrical connection structure, core vias, and wiring. The IC may convert the base signal into an RF signal of a millimeter wave (mmWave) band.

Referring to FIG. 8B, a plurality of antenna modules each including an end-fire antenna 100h, a patch antenna pattern 1110h, and an insulating layer 1140h may be formed on the set substrate 600h of the electronic device 700h. 700h may be disposed adjacent to one side boundary and the other side boundary, and a communication module 610h and a baseband circuit 620h may be further disposed on the set substrate 600h. The plurality of antenna modules may be electrically connected to the communication module 610h and / or the baseband circuit 620h through the coaxial cable 630h.

Meanwhile, the patch antenna pattern, the coupling patch pattern, the conductive ring pattern, the conductive porous plate pattern, the feed via, the array via, the chain via, the grounding via, the shield via, the ground layer, the end-fire antenna pattern, and the director disclosed herein The pattern, coupling ground pattern, and electrical connection structure may be a metal material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and lead (Pb). Conductive material such as titanium (Ti), or an alloy thereof), and may include chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering, subtractive, and additive It may be formed according to a plating method such as (Additive), Semi-Additive Process (SAP), Modified Semi-Additive Process (MSAP), but is not limited thereto.

On the other hand, the insulating layer disclosed herein is FR4, Liquid Crystal Polymer (LCP), Low Temperature Co-fired Ceramic (LTCC), thermosetting resin such as epoxy resin, thermoplastic resin such as polyimide, or these resins and inorganic filler Resin, prepreg, Ajinomoto build-up film (ABF), FR-4, Bisaleimide Triazine (BT), photosensitive insulation (Photo) impregnated with core materials such as glass fiber, glass cloth, and glass fabric. Imagable Dielectric (PID) resins, copper clad laminates (Copper Clad Laminate, CCL) or glass or ceramic-based insulation may be implemented. The insulating layer is a patch antenna pattern, a coupling patch pattern, a conductive ring pattern, a conductive porous plate pattern, a feed via, an array via, a chain via, a grounding via, a shield via, and a ground layer in the antenna device and the antenna module disclosed herein. The end-fire antenna pattern, the director pattern, the coupling ground pattern, and the electrical connection structure may be filled in at least part of the position where they are not disposed.

On the other hand, RF signals disclosed herein are Wi-Fi (IEEE 802.11 family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA +, HSDPA +, HSUPA +, EDGE, It may have a format in accordance with, but not limited to, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G and any other wireless and wired protocols designated.

Although the present invention has been described by specific embodiments such as specific components and the like, but the embodiments and the drawings are provided to assist in a more general understanding of the present invention, the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations can be made from these descriptions.

110: patch antenna pattern
115: coupling patch pattern
120, 121, 122: feed via
125: ground layer
130a: conductive ring pattern
131a: first conductive ring pattern
131b: first conductive porous plate pattern
136a: second conductive ring pattern
136b: second conductive porous plate pattern
140: core area
145, 185: grounding vias
161: end-fire antenna pattern
162: director pattern
172: second feedline

Claims (16)

Feedvia;
A patch antenna pattern electrically connected to one end of the feed via;
A ground layer disposed under the patch antenna pattern and having a through hole through which the feed via passes;
A first conductive ring pattern disposed laterally spaced from the patch antenna pattern and having a first through area to surround the patch antenna pattern when viewed in a vertical direction; And
A second conductive ring pattern disposed on an upper side of the first conductive ring pattern and having a second through region to surround the patch antenna pattern when viewed in a vertical direction; Including,
An antenna device, wherein the width of the second through area is greater than the width of the first through area.
The method of claim 1,
And a grounding via arranged to electrically connect the first conductive ring pattern and the ground layer and arranged to surround the patch antenna pattern when viewed in a vertical direction.
The method of claim 1,
And a plurality of chain vias arranged to electrically connect between the first conductive ring pattern and the second conductive ring pattern and arranged to surround the patch antenna pattern when viewed in a vertical direction.
The method of claim 1,
A third conductive ring pattern disposed between the first conductive ring pattern and the second conductive ring pattern and having a third through region to surround the patch antenna pattern when viewed in a vertical direction;
And the third through area width is greater than the first through area width and less than the second through area width.
The method of claim 4, wherein
A plurality of first chain vias arranged to electrically connect between the first conductive ring pattern and the third conductive ring pattern and arranged to surround the patch antenna pattern when viewed in a vertical direction; And
A plurality of second chain vias arranged to electrically connect between the second conductive ring pattern and the third conductive ring pattern and arranged to surround the patch antenna pattern when viewed in a vertical direction; More,
And the plurality of first chain vias respectively overlap the plurality of second chain vias when viewed in the vertical direction.
The method of claim 1,
An antenna device having a top surface area of the first conductive ring pattern is larger than a top surface area of the second conductive ring pattern.
The method of claim 1,
And a coupling patch pattern disposed above the patch antenna pattern and overlapping the patch antenna pattern when viewed in a vertical direction.
The method of claim 7, wherein
The coupling patch pattern and the second conductive ring pattern are disposed at the same level with each other,
And the patch antenna pattern and the first conductive ring pattern are disposed in the same position with each other.
The method of claim 8,
The upper surface area of the coupling patch pattern is larger than the upper surface area of the patch antenna pattern,
The shortest distance between the coupling patch pattern and the second conductive ring pattern is longer than the shortest distance between the patch antenna pattern and the first conductive ring pattern.
The method of claim 1,
An antenna device having an angle in a vertical direction of a line connecting a boundary between the first conductive ring pattern and a boundary between the second conductive ring pattern is 20 degrees or more and 30 degrees or less.
A plurality of feed vias;
A plurality of patch antenna patterns each electrically connected to one end of a corresponding feed via of the plurality of feed vias;
A ground layer disposed below the plurality of patch antenna patterns and having a plurality of through holes through which the plurality of feed vias respectively pass;
A first conductive porous plate pattern disposed on an upper side of the ground layer and having a plurality of first through regions respectively surrounding the patch antenna pattern when viewed in a vertical direction; And
A second conductive porous plate pattern disposed on an upper side of the first conductive porous plate pattern and having a plurality of second through regions respectively surrounding the patch antenna pattern when viewed in a vertical direction; Including,
And the total width of the plurality of second through areas is greater than the total width of the plurality of first through areas.
The method of claim 11,
And a plurality of coupling patch patterns each disposed on an upper side of a corresponding patch antenna pattern among the plurality of patch antenna patterns and overlapping the plurality of patch antenna patterns when viewed in a vertical direction,
And the total width of the plurality of coupling patch patterns is greater than the total width of the plurality of patch antenna patterns.
The method of claim 11,
A plurality of first feed lines disposed below the ground layer and electrically connected to the other ends of corresponding feed vias of the plurality of feed vias, respectively;
A plurality of first wiring vias disposed under the ground layer and electrically connected to the plurality of first feed lines, respectively; And
An IC disposed below the ground layer and electrically connected to the plurality of first wiring vias; Antenna module further comprising.
The method of claim 13,
A plurality of second wiring vias disposed under the ground layer and electrically connected to the IC, respectively;
A plurality of second feed lines disposed under the ground layer and electrically connected to corresponding second wiring vias of the plurality of second wiring vias, respectively; And
A plurality of end-fire antennas electrically connected to corresponding second feedlines of the plurality of second feedlines; Antenna module further comprising.
The method of claim 14,
A second ground disposed below the first and second feed lines and disposed above the IC and electrically connected to the ground layer with a plurality of through holes through which the plurality of first and second wiring vias respectively pass; An antenna module further comprising a layer.
The method of claim 15,
A chain via disposed to electrically connect the first conductive porous plate pattern and the second conductive porous plate pattern;
A grounding via disposed to electrically connect the first conductive porous plate pattern and the ground layer; And
A shielding member disposed below the second ground layer and electrically connected to the second ground layer and the ground layer and disposed to surround the IC; Antenna module further comprising.

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