KR20190116977A - Arrangement for clamping the carrier to the device - Google Patents

Abstract

An arrangement is provided for securing or clamping the carrier to the device during processing in the processing chamber. The arrangement includes a first clamping element coupled to the carrier and a second clamping element coupled to the device. The first clamping element and the second clamping element are configured to be fixable or clampable with respect to each other. The arrangement further includes stop elements for supporting the carrier in the event of a failure of one of the first clamping element and the second clamping element.

Description

Arrangement for clamping the carrier to the device

[0001] Embodiments of the present disclosure relate to arrangements for securing or clamping a carrier to a device, and more particularly, to an alignment device during processing in a processing chamber. Embodiments of the present disclosure also relate to carriers for supporting a substrate or mask, devices for depositing a layer on a substrate, and holding and alignment arrangements.

[0002] Several methods are known for depositing material on a substrate. By way of example, the substrates may be coated by using an evaporation process, a physical vapor deposition (PVD) process, such as a sputtering process, a spraying process, or the like, or a chemical vapor deposition (CVD) process. The process can be performed in the processing chamber of the deposition apparatus, where the substrate to be coated is located. A deposition material is provided to the processing chamber. A plurality of materials may be used for deposition on the substrate, such as organic materials, molecules, metals, oxides, nitrides and carbides. In addition, other processes such as etching, structuring, annealing, and the like may be performed in the processing chambers.

[0003] For example, for large area substrates in display fabrication technology, coating processes may be considered. Coated substrates may be used in some applications and in some technical fields. For example, the application may be organic light emitting diode (OLED) panels. Additional applications include insulating panels, microelectronics such as semiconductor devices, substrates with thin film transistors (TFTs), color filters, and the like. OLEDs are solid state devices composed of thin films of (organic) molecules that produce light upon application of electricity. As an example, OLED displays can provide bright displays on electronic devices, for example using reduced power as compared to liquid crystal displays (LCDs). In the processing chamber, organic molecules are produced (eg, evaporated, sputtered or sprayed, etc.) and deposited as layers on the substrates. For example, to deposit the material at desired positions on the substrate, such as to form an OLED pattern on the substrate, the material may pass through a mask having a boundary or a specific pattern.

[0004] An aspect related to the quality of the processed substrate, especially the deposited layer, is the alignment of the substrate with respect to the mask. As an example, in order to achieve good process results, the alignment must be accurate and stable. Accordingly, devices coupled to the substrate and / or the mask carrier are used to align the substrate with respect to the mask. However, systems used to align substrates and masks may be vulnerable to external interferences, such as vibrations. Such external interferences can impair the alignment of the substrate with the mask during processing, which results in a reduced quality of the processed substrate, and in particular, the alignment of the deposited layers can be impaired. Therefore, it is advantageous that the device used to align the substrate with respect to the mask can be secured to the carrier in a safe manner.

[0005] In order to secure the alignment device to the carrier, the carrier can be clamped to the device, for example by mutual interaction of dedicated clamping elements respectively present on the surface of the carrier and the surface of the device.

[0006] In view of the above, there is a need for arrangements, carriers and devices that can provide improved clamping action between a carrier and a device coupled to the carrier.

[0007] In view of the above, an arrangement for securing or clamping a carrier to a device during processing in a processing chamber, a carrier for supporting a substrate, an apparatus for depositing a layer on a substrate, and a holding and alignment arrangement are provided. . Additional aspects, benefits, and features of the disclosure are apparent from the claims, the description, and the accompanying drawings.

[0008] According to one embodiment, an arrangement is provided for securing or clamping a carrier to a device during processing in a processing chamber. The arrangement includes a first clamping element coupled to the carrier; A second clamping element coupled to the device, wherein the first clamping element and the second clamping element are configured to be clampable or clampable relative to each other; And a stop element for supporting the carrier in the event of a failure of one of the first clamping element and the second clamping element.

[0009] According to another embodiment, a carrier is provided for supporting a substrate or mask in a vacuum chamber. The carrier may include a clamping arrangement for securing or clamping the carrier to the device; And a stop element for supporting the carrier in the event of a failure of the clamping arrangement.

[0010] According to another embodiment, an apparatus for depositing a layer on a substrate is provided. The apparatus includes a processing chamber adapted for layer deposition therein; An arrangement according to the embodiments described herein for a carrier in a processing chamber; And a deposition source for depositing a material forming a layer on the substrate, wherein the carrier is configured to carry a substrate or a mask disposed between the substrate and the deposition source.

[0011] According to another embodiment, a holding and alignment arrangement is provided. The arrangement includes a clamping device for supporting a carrier that is a substrate carrier and / or a mask carrier during processing in a processing chamber, and an alignment device for moving the substrate carrier relative to the mask carrier, wherein the clamping device is at least A first clamping element coupled to the substrate carrier or mask carrier and a second clamping element coupled to the alignment device, wherein the first clamping element and the second clamping element are configured to be clampable or clampable relative to one another. And the holding and alignment arrangement further comprises a stop element for supporting the carrier in the event of a failure of one of the first clamping element and the second clamping element.

In a manner in which the above-mentioned features of the present disclosure may be understood in detail, a more specific description of the present disclosure briefly summarized above may be made by reference to embodiments. The accompanying drawings are directed to embodiments of the present disclosure and are described in the following:
1 shows a schematic diagram of a deposition process for fabricating OLEDs on a substrate;
2A shows a schematic front view of a holding arrangement for supporting a substrate and a mask in a vertical orientation during layer deposition in a processing chamber;
FIG. 2B shows a schematic side view of the holding arrangement of FIG. 2A;
3 shows a schematic diagram of an arrangement for securing or clamping a carrier to a device, in accordance with an embodiment of the present disclosure;
4 shows a schematic representation of a carrier for supporting a substrate or mask, according to an embodiment of the disclosure;
5 shows a sectional view of the clamping arrangement shown in FIG. 4;
6 shows a schematic representation of an arrangement for securing or clamping a carrier to a device in an unengaged state, according to an embodiment of the disclosure;
FIG. 7 shows a schematic representation of the arrangement of FIG. 6 in an engaged state; FIG.
8A shows a schematic representation of an arrangement according to an embodiment of the present disclosure, with reference to the stationary elements;
FIG. 8B shows details of the stationary elements of the arrangement of FIG. 8A, in steady state; FIG.
FIG. 8C shows details of the stop elements of the arrangement of FIG. 8A, in a slipping state; FIG.
9 shows a schematic representation of an arrangement for securing or clamping a carrier to a device in an engaged state, in accordance with another embodiment of the present disclosure;
10 shows a schematic representation of an arrangement for securing or clamping a carrier to a device in an engaged state, according to another embodiment of the present disclosure;
FIG. 11A shows a schematic representation of an arrangement for securing or clamping a carrier to a device in an engaged state, in accordance with an alternative embodiment of the present disclosure; FIG.
FIG. 11B shows details of the stop elements of the arrangement of FIG. 11A, in the disengaged state; FIG.
FIG. 11C shows details of the stop elements of the arrangement of FIG. 11A in an engaged state; FIG.
12 shows a schematic representation of an apparatus for depositing a layer on a substrate, in accordance with an embodiment of the present disclosure; And
13 shows a schematic representation of a holding and alignment arrangement, in accordance with an embodiment of the present disclosure.

[0013] Reference will now be made in detail to various embodiments of the present disclosure, and one or more examples of such various embodiments are illustrated in the drawings. Within the following description of the drawings, like reference numerals refer to like components. Only differences to individual embodiments are described. Each example is provided through the description of the present disclosure and is not to be considered as a limitation of the present disclosure. In addition, features illustrated or described as part of one embodiment may be used with or in conjunction with other embodiments, such that additional embodiments may be calculated. The detailed description is intended to cover these modifications and variations.

[0014] Embodiments described herein may be utilized, for example, to inspect large area coated substrates for manufactured displays. Substrates or substrate receiving regions in which the devices and methods described herein are constructed may be large area substrates having a size of, for example, 1 m² or more. For example, a large area substrate or carrier may comprise a GEN 4.5 corresponding to about 0.67 m² substrates (0.73 x 0.92 m), a GEN 5 corresponding to about 1.4 m² substrates (1.1 m x 1.3 m), about 4.29 m² substrates (1.95). GEN 7.5 corresponding to mx 2.2 m), GEN 8.5 corresponding to about 5.7 m² substrates (2.2 mx 2.5 m), or even GEN 10 corresponding to about 8.7 m² substrates (2.85 mx 3.05 m). Even larger generations, such as GEN 11 and GEN 12, and corresponding substrate areas can be similarly implemented. For example, for OLED display manufacture, half the sizes of the above-mentioned substrate generations, including GEN 6, can be coated by evaporation of the device for evaporating the material. Half sizes of substrate generation may be due to some processes executed for the entire substrate size, and subsequent processes executed for half of the previously processed substrate.

[0015] As used herein, the term "substrate" may specifically encompass substantially inflexible substrates, such as slices of transparent crystals such as wafers, sapphires, or the like, or glass plates. However, the present disclosure is not so limited, and the term "substrate" may encompass flexible substrates, such as webs or foils. The term "substantially inflexible" is understood to be distinct from "flexible". In particular, a substantially inflexible substrate, such as a glass plate having a thickness of 0.5 mm or less, may have some degree of flexibility, where the flexibility of the substantially inflexible substrate is small when compared to flexible substrates.

[0016] The substrate may be made of any material suitable for material deposition. For example, the substrate may be a glass (eg, soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound materials, carbon fiber materials, metal or any other material or materials that may be coated by a deposition process. It can be made of a material selected from the group consisting of bonds.

[0017] 1 shows a schematic diagram of a deposition process for fabricating OLEDs on a substrate 10, while FIGS. 2A and 2B show a substrate 10 and a mask carrier on a substrate carrier 11 during layer deposition in a processing chamber. An example of a holding arrangement 40 for supporting the mask 20 on 21 is shown, where the substrate 10 and the mask 20 remain essentially in a vertical position.

[0018] As shown in FIG. 1, to manufacture OLEDs, organic molecules may be provided (eg, evaporated) by the deposition source 30 and deposited on the substrate 10. A mask arrangement comprising a mask 20 is positioned between the substrate 10 and the deposition source 30. The mask 20 has a specific pattern, for example provided by a plurality of openings or holes 22, so that organic molecules (eg, path 32) are deposited such that a patterned layer or film of organic compound is deposited on the substrate 10. Pass through the openings or holes 22). For example, a plurality of layers or films may be deposited on the substrate 10 using, for example, different masks or positions of the mask 20 relative to the substrate 10 to produce pixels with different color characteristics. . By way of example, a first layer or film may be deposited to produce red pixels 34, a second layer or film may be deposited to produce green pixels 36, and blue pixels 38. A third layer or film can be deposited to produce Layer (s) or film (s), such as an organic material, may be arranged between two electrodes, such as an anode and a cathode (not shown). At least one of the two electrodes may be transparent.

[0019] Substrate 10 and mask 20 may be arranged in a vertical orientation during the deposition process. In FIG. 1, the arrows indicate the vertical direction Y and the horizontal direction X. In FIG. As used throughout this disclosure, the term "vertical direction" or "vertical orientation" is understood to be distinct from "horizontal direction" or "horizontal orientation". That is, “vertical direction” or “vertical orientation” relates to, for example, the substantially vertical orientation of the holding arrangement and the substrate, where a deviation of several degrees, such as up to 10 degrees or even up to 15 degrees from the exact vertical or vertical orientation, It is still considered as "substantially vertical" or "substantially vertical". The vertical direction may be substantially parallel to gravity.

[0020] 2A illustrates a holding arrangement 40 for supporting a substrate carrier 11 and a mask carrier 21 during layer deposition in a processing chamber that may be used in arrangements and apparatuses, in accordance with embodiments described herein. A schematic diagram is shown. FIG. 2B shows a side view of the holding arrangement 40 shown in FIG. 2A.

[0021] Alignment systems used for vertically-actuated tools can operate from outside the processing chamber, ie from the atmosphere side. The alignment system may be connected to the substrate carrier and the mask carrier using, for example, stiff arms extending through the wall of the processing chamber. In the case of an alignment system outside the vacuum, the mechanical path between the mask carrier or mask and the substrate carrier or substrate is long, making the system vulnerable to external interference (vibrations, heating, etc.) and tolerances.

[0022] Additionally or alternatively, an actuator of the alignment system may be included in the vacuum chamber. Accordingly, the length of the stiff arm can be reduced. For example, an actuator capable of mechanically contacting the substrate carrier and the mask carrier may be provided at least partially between the track for the mask carrier and the track for the substrate carrier.

[0023] The holding arrangement 40 may comprise two or more alignment actuators connectable to at least one of the substrate carrier 11 and the mask carrier 21, where the holding arrangement 40 may be used to guide the substrate carrier 11 in a first plane. Configured to support in or parallel to the first plane, wherein the first alignment actuator 41 of the two or more alignment actuators has the substrate carrier 11 and the mask carrier 21 relative to each other in at least a first direction (Y). Wherein the second alignment actuator 42 of the two or more alignment actuators is at least in a first direction Y and in a second direction X that is different from the first direction Y. And the mask carrier 21 can be configured to move relative to each other, wherein the first direction Y and the second direction X are in the first plane. Two or more alignment actuators may also be referred to as “align blocks”. Accordingly, the alignment blocks or alignment actuators can change the positions of the substrate 10 and the mask 20 relative to each other. For example, the alignment block may consist of a first element fixed to the substrate carrier 11 or the mask carrier 21 and a second element fixed to the alignment device provided with one or more actuators. The first element may be clamped to the second element through interaction (ie, mechanical, magnetic, electromagnetic, etc.).

[0024] As shown in FIG. 2B, the mask 20 can be attached to the mask carrier 21, the holding arrangement 40 being at least one of the substrate carrier 11 and the mask carrier 21, in particular during layer deposition. It is configured to support both the substrate carrier 11 and the mask carrier 21 in a substantially vertical orientation. Deposition takes place along the direction Z according to the arrows illustrated in FIG. 2B.

[0025] By moving the substrate carrier 11 and the mask carrier 21 with respect to each other in at least the first direction Y and the second direction X using two or more alignment actuators, the substrate carrier 11 is a mask carrier 21. ) Or mask 20, and the quality of the layers deposited may be improved.

[0026] Optical inspection may also be performed to check for possible variations or deviations to the correct alignment, to perform adjustment of the position of the mask 20 relative to the substrate 10 by operation of the alignment blocks.

[0027] 3 illustrates an arrangement 50 for securing or clamping the carrier 51 to the device 52. The arrangement 50 comprises a first clamping element 53 coupled to the carrier 51 and a second clamping element 54 coupled to the device 52. According to the embodiments described herein, which can be combined with other embodiments described herein, the first clamping element is a part of the carrier, a clamping element attached to the carrier, a clamping element integrally formed with the carrier and a It may be one of the surfaces. Additionally or alternatively, according to the embodiments described herein, which may be combined with other embodiments described herein, the second clamping element may be part of a device, a clamping element attached to the device, a device and It may be one of the integrally formed clamping element and the surface of the device. The first clamping element 53 and the second clamping element 54 are configured to be fixable with respect to each other. For this purpose, once the device 52 is clamped to the carrier 51, part of the surface of the first clamping element 53 is in contact with part of the surface of the second clamping element 54. In order to support the carrier 51 in the event of a failure of one of the first clamping element 53 and the second clamping element 54, the arrangement 50 further comprises stop elements 55. It is noted that the carrier 51 may be configured to carry the substrate 10 or the mask 20 as the substrate carrier 11 or the mask carrier 21 shown in FIG. 2B.

[0028] In this way, the arrangement 50 according to the present disclosure provides for improved clamping between the carrier 51 and the device 52. Advantageously, device 52 may be an alignment device that may be secured to carrier 51 to perform relative movement of substrate 10 and mask 20. Such improved clamping may advantageously be useful, for example, when the carrier 51 is configured to carry the substrate 10 and / or the mask 20 in an essentially vertical position. Indeed, after securing the device 52 to the carrier 51 through the interaction of the clamping elements 53, 54, the stop elements 55 with respect to the substrate 10, which may occur over time, may occur. It can prevent or reduce drift movement of the device.

[0029] 4 shows a carrier 51 for supporting a substrate and / or mask, in accordance with an embodiment of the present disclosure. Carrier 51 includes a clamping arrangement for securing carrier 51 to device 52. The clamping arrangement includes a first clamping portion 501 coupled to the carrier 51 and a second clamping portion 502 (not shown in the figure) coupled to the device 52. The first clamping portion 501 may be fixable to or clampable to the second clamping portion 502. In particular, FIG. 4 shows a carrier 51 having a rectangular shape having four first clamping parts 501 located at or adjacent to four corners. The device 52 to be secured to the carrier 51 may have four second clamping portions 502 that may be coupled to corresponding first clamping portions 501 on the carrier 51. Alternatively, the four devices 52, each having at least a second clamping portion 502, may each have its own second clamping portion (501) in its corresponding first clamping portion 501 present on the carrier 51. It can be fixed to the carrier 51 by coupling 502. According to an alternative arrangement, two devices 52 each having two second clamping parts 502 are to be fixed in pair with two first clamping parts 501 present on the carrier 51. Can be.

[0030] FIG. 5 shows a cross-sectional view of the first clamping portion 501 of FIG. 4 along line AA. The first clamping portion 501 contacts or angles the first clamping element 53 and the carrier 51 having an outer surface 531 that can contact the second clamping element 54 (not shown in the figure). Positioning element 56, such as an inner surface 532 in contact with the hinge. Connection means 57 are provided for securing the first clamping element 53 to the angular positioning element 56 and / or the carrier 51. The first clamping element 53 may comprise a magnetically attracted material, ie a magnetic plate. Magnets included in the second clamping portion, such as permanent magnets, electromagnets or electric permanent magnets, may be connected to a magnetic plate, such as a plate of magnetic material.

[0031] 6 illustrates the function of the arrangement 50 according to the present disclosure in an unlocked state. By moving the outer surface 531 of the first clamping element 53 with respect to the surface 541 of the second clamping element 54, the first clamping portion 501 present on the carrier 51 has a device 52. Can be engaged with or disengaged from the second clamping portion 502 present on the substrate. The double arrow in FIG. 6 illustrates this movement.

[0032] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the stop elements 55 comprise at least a protrusion and a corresponding recess, the protrusion being engageable with the recess. Or insert into the recess. Engagement of the recess and protrusion ensures that the first clamping element 53 remains fixed to the second clamping element 54 at approximately the same position. In fact, the protrusion and recess act as hard stop elements that can reduce or prevent relative slip movement between the clamping elements, which can occur over time.

[0033] In particular, as shown in FIGS. 5 and 6, the protrusion may be a pin 551 and the recess may be a cavity 552 such that the pin 551 is inserted into the cavity 552 or May be extracted from 552.

[0034] In particular, according to one embodiment of the present disclosure, the pin 551 is connectable to or is part of the carrier 51 and the cavity 552 is part of the second clamping element 54.

[0035] 6 and 7 illustrate the outer surface 531 of the first clamping element 53 (or the first clamping portion 501) and the outer surface of the second clamping element 54 (or the second clamping portion 502). It is described that the first clamping element 53 is fixable or clampable to the second clamping element 54 by contacting 541. The first clamping element 53 can be clamped to the second clamping element 54 through the interaction of the corresponding outer surfaces 531, 541 (ie mechanical, magnetic, electromagnetic, etc.).

[0036] For example, an additional securing or clamping action is thereby performed by inserting pin 551 into the corresponding cavity 552. In this way, the device 52 is firmly fixed to the carrier 51. The stop elements 55, and in particular the pins 551, which are coupled with the cavities 552, may elapse over time for mutual clamping action between the two clamping elements 53, 54, for example due to drift movement. This can reduce or prevent possible problems that can occur.

[0037] As illustrated by FIGS. 4 and 5, the first clamping element 53 has a flat surface and may consist of a plate (eg a magnetic plate) fixed to the carrier 51. The stop elements 55 may comprise two pins 551 located on opposite sides of the first clamping element 53, where each pin 551 is inserted into a corresponding cavity 552. It is possible. The two pins 551 are oriented along a vertical line of the major surface of the carrier 51, for example extending from the carrier. In this way, the connection between the first clamping element 53 and the second clamping element 54 is further improved. In an alternative configuration, the pins 551 may be arranged according to different orientations with respect to the first clamping element 53.

[0038] According to embodiments of the present disclosure, the carrier may be clamped to a device, such as an alignment actuator. For example, embodiments include a first clamping element coupled to a carrier and a second clamping element coupled to a device, wherein the first clamping element and the second clamping element are configured to be clampable or clampable relative to one another. . A stop element is provided. The stop element supports the carrier in the event of a failure of one of the first clamping element and the second clamping element. For example, if the carrier slips, ie if the first clamping element and the second clamping element slide with respect to each other, for example if they move unintentionally, the stop element supports or grasps the carrier. As another example, if one of the clamping elements fails, the stop element supports or holds the carrier.

[0039] According to the embodiments described herein, the stop element or components of the stop element may be in one or both of the clamping elements. For example, the stop element can be coupled to one or both of the clamping elements or can be formed integrally with one or both of the clamping elements. According to the embodiments described herein, the stationary element or components of the stationary element may be in a carrier and / or a device. For example, the stop element may be coupled to the carrier and / or the device or formed integrally with the carrier and / or the device.

[0040] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the stop element is a recess in a protrusion, one of the carrier and the device, and a corresponding other entity of the carrier and the device. It can be formed by. Still further, additionally or alternatively, the stop element may be formed by the protrusions and the carrier and the device. The arrangement for securing or clamping the carrier to the device, which may be provided by the second clamping element, comprises an additional protrusion overlapping the protrusion of the first clamping element.

[0041] 8A shows the arrangement 50 in an engaged state. Accordingly, the second clamping element 54 is in contact with the first clamping element 53. Pins 551 are inserted into cavities 552. 8B and 8C show the steady state (FIG. 8B) when the pin 551 does not touch any inner surfaces of the cavity 552, and the pin 551 may touch the inner surface of the cavity 552. The details of the interaction between the pin 551 and the cavity 552, in the slip state of FIG. 8C, are shown. Interaction between the pin and the cavity reduces the movement that can occur. For example, especially for vertically oriented substrates, the carrier can slip during the failure of the magnet. The interaction between the pin and the cavity prevents the complete drop of the carrier. As a further optional modification that may be combined with other embodiments, due to the presence of the step or hook, the pin 551 may be prevented from exiting the cavity 552 in the slipped state.

[0042] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the pin 551 has a width and the cavity 552 has edges that define an additional width, such as an inner edge. Have walls or walls. The additional width of the cavity 552 may be larger than the width of the pin 551. Accordingly, as shown in FIG. 8B, once the pin 551 is inserted into the cavity 552, a clearance 553 is formed between the edges of the cavity 552 and the pin 551. In particular, the clearance 553 may be in the range of 1 mm to 2 mm, preferably about 1.5 mm.

[0043] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the pin 551 has a circular diameter (or other shape, such as dimensions of a rectangle or polygon), and the cavity 552 ) Have edges or walls forming additional circular diameters (or other dimensions, such as additional dimensions of rectangles or polygons). In particular, the circular diameter or dimension of the pin 551 is in the range of 8 mm to 12 mm, preferably about 10 mm. Additional circular diameters or additional dimensions of the cavity 552 have a diameter in the range of 9.5 mm to 13.5 mm, preferably about 11.5 mm. Based on the needs, the contour of the cavity 552 and the pin 551 can have different shapes and sizes.

[0044] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the cavity 552 may have a depth in the range of 4 mm to 6 mm, preferably 5 mm.

[0045] These dimensions of the pin 551 and the cavity 552 are adapted such that the stop element 55 can support the carrier 51 in the event of a failure of at least one of the first clamping element 53 or the second clamping element 54. It is noted that the values are considered to be in the preferred range. This is provided by taking into account, for example, that the carrier 51 can carry the substrate 10 (or mask 20) in an essentially vertical position, the substrate 10 having the dimensions mentioned above.

[0046] According to some embodiments of the present disclosure, the pin 551 may be connectable to the first clamping element 53 or may be part of the first clamping element 53, and / or the cavity 552 may be removed. It may be part of the two clamping element 54. This is shown in FIG. 9 illustrating the arrangement 50 in the engaged state.

[0047] According to a further alternative embodiment of the arrangement 50 of the present disclosure, shown in FIG. 10, the protrusion, for example pin 551, may be connectable to the second clamping element 54 or the second clamping element 54. ), The recess, for example cavity 552, may be part of the first clamping element 53.

[0048] According to these types of configurations, the two opposing pins 551 may be located closer to each other and may help a stronger connection between the first clamping element 53 and the second clamping element 54.

[0049] 11A shows a further embodiment of the arrangement 50 according to the present disclosure. The stop elements 55 may comprise at least a first hard stop edge 554 formed in the first clamping element 53 and a corresponding second hard stop edge 555 formed in the second clamping element 54. have. The first hard stop edge 554 is engageable or engages with a portion of the second clamping element 54. The second hard stop edge is engageable or engages with a portion of the first clamping element 53.

[0050] FIG. 11B details the disengagement state when the first clamping element 53 and the second clamping element 54 are moved away from each other, and FIG. 11C shows the first clamping element 53 and the second clamping element ( The engagement state when 54) is moved closer to each other. The hard stop edges 554, 555 may be configured as upper or lower protrusions of the outer surfaces 531 and 541 of the first clamping element 53 and the second clamping element 54. In order to realize the engagement, when the hard stop edge 554 of the first clamping element 53 is formed by the upper protrusion of the outer surface 531 of the first clamping element 53, the second clamping element 54 The corresponding lower protrusion of the outer surface 541 forms the hard stop edge 555 of the second clamping element 54, and vice versa.

[0051] According to some embodiments of the present disclosure, which can be combined with other embodiments described herein, the carrier is configured to carry the substrate 10 or mask 20 in an essentially vertical position.

[0052] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the first clamping element 53 may comprise a magnetically attracted material, ie a magnetic plate, The second clamping element 54 may comprise an electrical permanent magnet element. In this way, the clamping action between the two clamping elements 53, 54, and consequently, the fixing between the carrier 51 and the device 52 is further improved.

[0053] In particular, the electric permanent magnet element may be switchable between the magnetized state and the non-magnetized state by applying a current, where the electric permanent magnet element is configured to remain in the magnetized state or non-magnetized state after removal of the current.

[0054] According to one embodiment, the electrical permanent magnet element may comprise a clamping magnet assembly comprising clamping magnets and a control magnet assembly comprising at least one control magnet and at least a coil. In particular, one coil can substantially surround one control magnet of the control magnet assembly and is configured to reverse the polarity of one control magnet. The electrical permanent magnet element may comprise at least a permanent magnet made of rare earth metal, in particular neodymium alloy.

[0055] 12 illustrates an apparatus 60 for depositing a layer on a substrate 10. The apparatus includes a processing chamber 61 adapted for layer deposition and an arrangement 50 according to any of the embodiments described above. The arrangement 50 may be used to secure or clamp the carrier 51 to the device 52 during processing in the processing chamber 61. The apparatus also includes a deposition source 30 for depositing a material that forms a layer on the substrate 10. In particular, the carrier may be configured to carry the substrate 10, or a mask 20 disposed between the substrate 10 and the deposition source 30. By way of example, in the apparatus of FIG. 12, the carrier 51 is configured to carry the substrate 10 as the substrate carrier 11 of FIG. 2B.

[0056] The use of the arrangement 50 in the apparatus 60 is beneficial for securing the device 52 to the carrier 51 in a stable and more permanent manner. The device 52 may be, for example, an alignment device for moving the carrier 12 relative to the mask 20 to accurately align the mask pattern with respect to the surface of the substrate 10 to be processed. For example, the device may be connected to the substrate carrier 51 and the mask carrier. Advantageously, arrangement 50 maintains clamping over time without failure in clamping device 52 and, for example, within processing chamber 61 during processing (ie, layer deposition) of substrate 10. Used for.

[0057] 13 illustrates a holding and alignment arrangement 70 in accordance with the present disclosure. The arrangement 70 includes a clamping device 58 for supporting the substrate carrier 51 and / or the mask carrier 21 during processing in the processing chamber. The arrangement 70 of FIG. 13 shows the clamping device 58 supporting the substrate carrier 51. The arrangement 70 also includes an alignment device 52 for moving the substrate carrier 51 relative to the mask carrier 21. In particular, the clamping device 58 comprises at least a first clamping element 53 coupled to the substrate carrier 51 or mask carrier 21 and a second clamping element 54 coupled to the alignment device 52. Include. The first clamping element 53 and the second clamping element 54 are configured to be fixable or clampable with respect to each other. The clamping device 58 comprises stop elements 55 which support the carrier 51 in the event of a failure of one of the first clamping element 53 and the second clamping element 54. According to some embodiments, which can be combined with other embodiments described herein, the holding of the alignment arrangement is a first clamping device (see reference numeral 58 in FIG. 13) coupling the substrate carrier to the alignment device. And a second clamping device (not shown in FIG. 13) coupling the mask carrier to the alignment device. The second clamping device may be provided according to the embodiments described herein and / or similar to the first clamping device.

[0058] The stop elements 55 prevent slippage between the first clamping element 53 and the second clamping element 54, which may occur over time due to the drift movement of the device 52 relative to the carrier 51. Since this can be prevented, the stop elements 55 improve the clamping action of the clamping device 58.

[0059] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the alignment device 52 may be secured or clamped to both the substrate carrier 51 and the mask carrier 21. Can be configured. Therefore, the clamping device 58 may comprise dedicated stop elements 55 for supporting both the substrate carrier 51 and the mask carrier 21 in the event of failure of the corresponding clamping elements.

[0060] Alignment device 52 may include one or more actuators acting on substrate carrier 51 and / or mask carrier 21 to effect movement of substrate 10 relative to mask 20. The actuator may be an integral part of the device 52, or may be a separate component connected to the device 52 via suitable connection means.

[0061] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the first clamping element 53 may be coupled to the hinge element. Accordingly, the alignment device 52 is perpendicular to this plane in a different direction, ie, along a linear direction or parallel to this plane in a plane defined by the carrier 51 (eg, the XY plane of FIG. 2A). The carrier 51 can be moved along a linear direction (eg, the z-direction of FIG. 2B) and / or in an angular direction about an axis perpendicular to the plane.

[0062] The presence of the clearance 553 between the pin 551 and the cavity 552 (or protrusions and recesses) is also in different directions after the first clamping element 53 is secured to the second clamping element 54. May serve to allow fine adjustment movements of the carrier 51. For example, the clearance 553 may allow angular movement of the carrier 51 about an axis perpendicular to the plane defined by the carrier 51.

[0063] Embodiments according to the present disclosure have several advantages, including the possibility of improving the clamping action between the device 52 and the carrier 51. In particular, these embodiments are clamping elements 53, 54, which can occur over time, especially when the carrier 51 is configured to carry the substrate 10 or the mask 20 in an essentially vertical position. ) Has the advantage of preventing slippage between. Embodiments according to the present disclosure also have the advantage of allowing fine adjustments of the position of the carrier 51 in several different directions.

[0064] While the foregoing is directed to embodiments of the present disclosure, other and additional embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure, the scope of which is set forth in the following claims. Determined by them.

10 boards
11 substrate carrier
20 masks
21 mask carrier
22 holes
30 deposition source
32 route
34 red pixels
36 green pixels
38 blue pixels
40 holding arrangement
41 First Alignment Actuator
42 2nd alignment actuator
50 arrangement
51 carrier
52 devices
53 First clamping element
54 Second clamping element
55 stop elements
56 angular positioning elements
57 Connection means
58 devices
60 devices
61 processing chamber
70 arrangement
501 first clamping part
502 2nd clamping part
531 outer surface
532 inner surface
541 outer surface
551 pin
552 cavity
553 clearance
554 hard stop edge
555 hard stop edge

Claims (17)

An arrangement for securing or clamping a carrier to a device during processing in a processing chamber,
A first clamping element coupled to the carrier;
A second clamping element coupled to the device, wherein the first clamping element and the second clamping element are configured to be clampable or clampable relative to one another; And
A stop element for supporting the carrier in the event of a failure of one of the first clamping element and the second clamping element
Including,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method of claim 1,
The stop element comprises: at least one of at least a protrusion and at least a pin,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method according to claim 1 or 2,
The stop element comprises: at least one of at least a recess and at least a cavity,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method of claim 3, wherein
The protrusion is insertable into the recess or the pin is insertable into the cavity,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method of claim 2,
The protrusion or the pin is connectable to the carrier or the first clamping element, or is part of the carrier or the first clamping element,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method according to any one of claims 2 to 4,
The second clamping element comprises an additional protrusion overlapping a protrusion of the first clamping element,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method of claim 3, wherein
The pin is connectable to the second clamping element, or is part of the second clamping element,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method according to claim 3 or 4,
The pin has a width, the cavity having edges or walls forming an additional width that is larger than the width,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method according to claim 3 or 4,
Upon insertion of the pin into the cavity, a clearance is formed between the pin and the cavity, in particular the clearance in the range of 1 mm to 2 mm, in particular about 1.5 mm,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method according to any one of claims 1 to 9,
A clearance is provided between the carrier and the device, the clearance being in the range of 1 mm to 2 mm, in particular about 1.5 mm,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method according to any one of claims 1 to 10,
The stop element comprises at least a first hard stop edge and a second hard stop edge, the first hard stop edge being engageable with the second hard stop edge,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method according to any one of claims 1 to 11,
The carrier is configured to carry the substrate or mask in an essentially vertical position,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. The method according to any one of claims 1 to 12,
Wherein the first clamping element comprises a magnetic plate and the second clamping element comprises an electric permanent magnet,
Arrangement for securing or clamping a carrier to a device during processing in a processing chamber. A carrier for supporting a substrate or mask in a vacuum chamber,
A clamping arrangement for securing or clamping the carrier to the device; And
Stop element supporting the carrier in case of failure of the clamping arrangement
Including,
Carrier for supporting a substrate or mask in a vacuum chamber. An apparatus for depositing a layer on a substrate, the apparatus comprising:
A processing chamber adapted for layer deposition therein;
An arrangement according to any one of claims 1 to 13 for a carrier in said processing chamber; And
A deposition source for depositing a material forming the layer on the substrate
Including;
The carrier is configured to carry the substrate, or a mask disposed between the substrate and the deposition source,
An apparatus for depositing a layer on a substrate. Holding and alignment arrangement,
A clamping device for supporting a carrier that is a substrate carrier and / or a mask carrier during processing in the processing chamber; And
Alignment device for moving the substrate carrier relative to the mask carrier
Including;
The clamping device comprises at least a first clamping element coupled to the substrate carrier or the mask carrier and a second clamping element coupled to the alignment device, wherein the first clamping element and the second clamping element are mutually different. Configured to be lockable or clampable relative to the clamping device, and wherein the holding and alignment arrangement further comprises a stop element supporting the carrier in the event of a failure of one of the first clamping element and the second clamping element.
Holding and sorting arrangement. The method of claim 16,
Hinge element coupled to the first clamping element
Further comprising,
Holding and sorting arrangement.

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