JP2020515708A - Component device for fastening carrier to device - Google Patents

Abstract

A component is provided for securing or fastening the carrier to the device during processing in the processing chamber. The component device comprises a first fastening element connected to the carrier and a second fastening element connected to the device. The first fastening element and the second fastening element are configured such that they can be fixed or fastened to each other. The component device further comprises a stop element that supports the carrier when one of the first fastening element and the second fastening element fails. [Selection diagram] Fig. 6

Description

[0001] Embodiments of the present disclosure relate to apparatus for securing or fastening a carrier to a device, and more particularly to an alignment device during processing in a processing chamber. Embodiments of the present disclosure also relate to carriers for supporting a substrate or mask, apparatus for depositing layers on the substrate, and holding and alignment arrangements.

[0002] Several methods are known for depositing materials on substrates. As an example, the substrate may be coated by using an evaporation process, a physical vapor deposition (PVD) process (such as a sputtering process or a spray process), or a chemical vapor deposition (CVD) process. The process may be carried out in the processing chamber of a deposition apparatus in which the substrate to be coated is placed. Deposition material is provided in the processing chamber. Multiple materials such as organic materials, molecules, metals, oxides, nitrides, and carbides can be used for deposition on the substrate. In addition, other processes such as etching, structuring, annealing processes, etc. may be performed in the processing chamber.

[0003] For example, the coating process may be considered for large area substrates, for example in display manufacturing technology. Coated substrates can be used in some applications and in some technical fields. For example, one application is in organic light emitting diode (OLED) panels. Further applications include insulating panels, microelectronics such as semiconductor devices, substrates with thin film transistors (TFTs), color filters and the like. An OLED is a solid-state device composed of a thin film of (organic) molecules that emit light when electricity is applied. As an example, OLED displays can provide bright displays for electronic devices, and can use less power, for example, compared to liquid crystal displays (LCDs). Within the processing chamber, organic molecules are generated (eg, evaporated, sputtered, or atomized, etc.) and deposited as a layer on the substrate. The material can pass, for example, a mask having boundaries or a specific pattern, which deposits the material at desired locations on the substrate, eg, forming an OLED pattern on the substrate.

[0004] One aspect related to the quality of processed substrates, and in particular the quality of deposited layers, is the alignment of the substrate with respect to the mask. For example, alignment must be accurate and stable in order to achieve good processing results. Therefore, a device coupled to the substrate and/or the mask carrier is used to align the substrate with respect to the mask. However, the system used to align the substrate and the mask can be subject to external interference such as vibration. Such external interference can impair the alignment of the substrate with the mask during processing, resulting in poor quality of the substrate after processing, and especially alignment of the deposited layer. Therefore, the device used to align the substrate with respect to the mask is conveniently fixable to the carrier in a reliable manner.

[0005] To secure the alignment device to the carrier, the carrier can be fastened to the device by, for example, interacting with the carrier and dedicated fastening elements respectively present on the surface of the device.

[0006] From the above, there is a need for arrangements, carriers and devices that can be provided to improve the fastening operation between a carrier and a device coupled to the carrier.

[0007] In light of the above, a component apparatus for securing or fastening a carrier to a device during processing in a processing chamber, a carrier for supporting a substrate, an apparatus for depositing a layer on a substrate, a holding and An alignment component is provided. Further aspects, advantages and features of the disclosure will be apparent from the claims, the description and the accompanying drawings.

[0008] One embodiment provides a component for securing or fastening a carrier to a device during processing in a processing chamber. The component device comprises a first fastening element connected to the carrier, a second fastening element connected to the device, the first fastening element and the second fastening element being fixable or fastenable with respect to each other. As configured, the configuration device also includes a stop element for supporting the carrier when one of the first fastening element and the second fastening element fails.

[0009] According to another embodiment, a carrier is provided for supporting a substrate or mask in a vacuum chamber. The carrier includes a fastening component for securing or fastening the carrier to the device and a stop element for supporting the carrier when the fastening component fails.

[0010] According to another embodiment, an apparatus for depositing a layer on a substrate is provided. The apparatus comprises a processing chamber adapted for layer deposition on a substrate, a component apparatus according to embodiments described herein with respect to a carrier in the processing chamber, and a deposition source for deposition material that forms a layer on the substrate. A carrier is included and is configured to carry a substrate or a mask disposed between the substrate and a deposition source.

[0011] According to another embodiment, a retention and alignment component is provided. The component apparatus includes a fastening device for supporting a carrier that becomes a substrate carrier and/or a mask carrier during processing in the processing chamber, and an alignment device for moving the substrate carrier with respect to the mask carrier. The fastening device comprises at least a first fastening element coupled to the substrate carrier or the mask carrier and a second fastening element coupled to the alignment device, the first fastening element and the second fastening element being included. Are configured so that they can be fixed or fastened to each other, and the holding and aligning configuration device is further adapted when one of the first fastening element and the second fastening element fails. A stop element for supporting the carrier.

[0012] For a better understanding of the above features of the present disclosure, reference can be made to the embodiments to obtain a more specific description of the present disclosure briefly outlined above. The accompanying drawings are described below with respect to embodiments of the present disclosure.

FIG. 3 shows a schematic view of a deposition process for manufacturing an OLED on a substrate. FIG. 3 shows a schematic front view of a holding arrangement for supporting the substrate and mask in a vertical orientation during layer deposition in the processing chamber. 2B illustrates a side view of the retention component of FIG. 2A. FIG. FIG. 6 shows a schematic view of a configuration device for securing or fastening a carrier to a device according to an embodiment of the present disclosure. FIG. 6 shows a schematic view of a carrier for supporting a substrate or mask according to one embodiment of the present disclosure. FIG. 5 is a cross-sectional view of the fastening component device shown in FIG. 4. FIG. 6 shows a schematic view of a configuration apparatus for securing or fastening a disengaged carrier to a device, according to one embodiment of the present disclosure. Figure 7 shows a schematic view of the component device of Figure 6 in the engaged state. Referring to the stop element, there is shown a schematic view of a component device according to an embodiment of the present disclosure. 8B shows a detail of the stop element of the component of FIG. 8A in a normal state. 8B shows a detail of the stop element of the component of FIG. 8A in a sliding state. FIG. 6 shows a schematic view of a component apparatus for securing or fastening an engaged carrier to a device according to another embodiment of the present disclosure. FIG. 6 shows a schematic view of a component apparatus for securing or fastening an engaged carrier to a device according to yet another embodiment of the present disclosure. FIG. 7 shows a schematic view of a component apparatus for securing or fastening an engaged carrier to a device, according to an alternative embodiment of the present disclosure. 11B shows a detail of the stop element of the component of FIG. 11A in the disengaged state. 11B shows details of the stop element of the component device of FIG. 11A in the engaged state. FIG. 6 shows a schematic diagram of an apparatus for depositing a layer on a substrate according to an embodiment of the disclosure. FIG. 6 shows a schematic view of a holding and aligning configuration device, according to one embodiment of the present disclosure.

[0013] Reference will now be made in detail to various embodiments of the present disclosure. One or more examples of these embodiments are illustrated in the drawings. In the following description of the drawings, the same reference numbers represent the same components. With regard to the individual embodiments, only the differences will be described. While each example is provided by way of explanation of the present disclosure, the example is not intended to limit the present disclosure. Furthermore, features illustrated or described as part of one embodiment, can be used on another embodiment or combined with another embodiment to create a further embodiment. It is possible. The description is intended to include such modifications and variations.

[0014] The embodiments described herein may be utilized in the inspection of large area substrates, such as for display manufacturing. The substrate or substrate receiving area in which the devices and methods described herein are constructed can be, for example, a large area substrate having a size of 1 m ² or more. For example, large area substrates or carrier, corresponds to GEN4.5 corresponds to the substrate of about 0.67m ² (0.73m × 0.92m), of about 1.4 m ² substrate (1.1 m × 1.3 m) GEN5, GEN7.5 corresponding to a substrate of about 4.29 m ² (1.95 m×2.2 m), GEN8.5 corresponding to a substrate of about 5.7 m ² (2.2 m×2.5 m), or , GEN10 corresponding to a substrate (2.85 m×3.05 m) of about 8.7 m ² . Larger generations such as GEN11 and GEN12, and corresponding board areas, can be implemented as well. For example, for OLED display manufacturing, half the size of the above mentioned substrate generation, including GEN6, can be coated by evaporation of a device for material evaporation. Half the size of the substrate generation results from some processes operating on the full substrate size and subsequent processes operating on half of the pre-treated substrates.

[0015] As used herein, the term "substrate" may specifically include a wafer, a slice of a transparent crystal such as sapphire, or a substantially non-flexible substrate such as a glass plate. However, the present disclosure is not so limited and the term "substrate" may also include flexible substrates such as webs and foils. The term "substantially inflexible" is understood separately from "flexible". Specifically, a substantially non-flexible substrate such as a glass plate having a thickness of 0.5 mm or less may also have some flexibility, and the flexibility of the substantially non-flexible substrate is , Lower than flexible substrates.

[0016] The substrate can be made of any material suitable for material deposition. For example, the substrate comprises glass (eg, soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite material, carbon fiber material, or any other material or combination of materials that may be coated by a deposition process. It can be made of a material selected from the group.

[0017] FIG. 1 shows a schematic diagram of a deposition process for manufacturing an OLED on a substrate 10, and FIGS. 2A and 2B show that on a substrate carrier 11 during layer deposition in a processing chamber. An example of a holding and constituting device 40 is shown which supports the substrate and the mask 20 on the mask carrier 21, and the substrate 10 and the mask 20 are maintained in a basically vertical posture.

[0018] As shown in FIG. 1, organic molecules may be provided (eg, evaporated) by a deposition source 30 and deposited on the substrate 10 to manufacture an OLED. A mask forming device including a mask 20 is arranged between the substrate 10 and the deposition source 30. The mask 20 has a particular pattern, eg, provided by a plurality of openings or holes 22, which allows organic molecules to pass through the openings or holes 22 (eg, along the path 32) to cause the substrate 10 to move. A layer or film of organic compound is deposited on top. For example, multiple layers or films may be deposited on the substrate 10 using different masks or different positions of the mask 20 relative to the substrate 10 to produce pixels with different color characteristics. As an example, a first layer or film can be deposited to produce red pixels 34, a second layer or film can be deposited to produce green pixels 36, and A third layer or film can be deposited to produce blue pixels 38. One or more layers or films, eg organic semiconductors, may be arranged between two electrodes (not shown), such as an anode and a cathode. At least one of the two electrodes may be transparent.

[0019] The substrate 10 and mask 20 may be arranged in a vertical orientation during the deposition process. Throughout this disclosure, in which the arrows indicate a vertical direction Y and a horizontal direction X in FIG. 1, the terms “vertical direction” or “vertical orientation” are used to refer to “horizontal direction”. Or "horizontal orientation". That is, the "vertical direction" or "vertical orientation" refers to, for example, the substantially vertical orientation of the holding device and the substrate, and may be a few degrees from the precise vertical orientation or vertical orientation (eg, up to 10°, or Deviations of up to 15° are still considered “substantially vertical orientation” or “substantially vertical orientation”. The vertical direction can be approximately parallel to gravity.

[0020] FIG. 2A is a schematic of a holding arrangement 40 for supporting a substrate carrier 11 and a mask carrier 21 during layer deposition in a processing chamber that may be used in the arrangement and apparatus according to embodiments described herein. The figure is shown. 2B shows a side view of the holding component 40 shown in FIG. 2A.

[0021] The alignment system used on vertically operating tools can be operated from outside the processing chamber, ie from the atmospheric side. The alignment system can be connected to the substrate carrier and the mask carrier using, for example, rigid arms that extend through the walls of the processing chamber. For out-of-vacuum alignment systems, the long mechanical path between the mask carrier or mask and the substrate carrier or substrate makes the system susceptible to external interference (vibration, heating, etc.) and tolerances.

[0022] Additionally or alternatively, the actuators of the alignment system may be contained within a vacuum chamber. Therefore, the length of the rigid arm can be shortened. For example, an actuator that can mechanically contact the substrate carrier and the mask carrier can be provided at least partially between the track for the mask carrier and the track for the substrate carrier.

[0023] The holding component 40 includes two or more alignment actuators connectable to at least one of the substrate carrier 11 and the mask carrier 21, the holding component 40 placing the substrate carrier 11 in a first plane. The first alignment actuator 41 of the two or more alignment actuators is configured to support the substrate carrier 11 and the mask carrier 21 at least with respect to each other. The second alignment actuator 42 of the two or more alignment actuators may be configured to move in the first direction Y, and the second alignment actuator 42 may move the substrate carrier 11 and the mask carrier 21 in at least a first direction relative to each other. It is configured to move in a second direction X different from Y and the first direction Y, the first direction Y and the second direction X being in a first plane. The two or more alignment actuators are also referred to as "alignment blocks." Therefore, the alignment block or the alignment actuator can mutually change the positions of the substrate 10 and the mask 20. For example, the alignment block may be constituted by a first element fixed to the substrate carrier 11 or the mask carrier 21 and a second element fixed to an alignment device comprising one or more actuators. The first element may be fastened to the second element by (eg, mechanical, magnetic, electromagnetic) interactions.

[0024] As shown in FIG. 2B, the mask 20 is attachable to the mask carrier 21, and the holding and configuring device 40 includes at least one of the substrate carrier 11 and the mask carrier 21, particularly the substrate carrier 11 and the mask carrier 21. Both 21 are specifically configured to support a substantially vertical orientation during layer deposition. Deposition occurs along the Z direction according to the arrows shown in Figure 2B.

[0025] The substrate carrier 11 is moved into the mask carrier 21 by moving the substrate carrier 11 and the mask carrier 21 in at least a first direction Y and a second direction X with respect to each other using two or more alignment actuators. Alternatively, it can be aligned with the mask 20 and the quality of the deposited layer can be improved.

[0026] To perform the alignment of the mask 20 with respect to the substrate 10 by driving the alignment block, an optical inspection can be performed to check for possible misalignments or deviations for correct alignment.

[0027] FIG. 3 illustrates a configuration device 50 for securing or fastening a carrier 51 to a device 52. The configuration device 50 includes a first fastening (clamping) element 53 connected to a carrier 51 and a second fastening (clamping) element 54 connected to a device 52. According to embodiments that may be combined with other embodiments described herein, the first fastening element may include a portion of the carrier, a fastening element mounted on the carrier, a fastening element integrally formed with the carrier, and a carrier. Can be one of the surfaces of Additionally or alternatively, according to embodiments described herein, the second fastening element includes a portion of the device, a fastening element attached to the device, a fastening element integrally formed with the device, and a fastening element of the device. It can be one of the surfaces. The first fastening element 53 and the second fastening element 54 are configured to be fixable to each other. To this end, when the device 52 is fastened to the carrier 51, part of the surface of the first fastening element 53 contacts part of the surface of the second fastening element 54. The configuration device 50 further comprises a stop element 55 for supporting the carrier 51 when one of the first fastening element 53 and the second fastening element 54 fails. Note that the carrier 51 can be configured to carry the substrate 10 or mask 20 as the substrate carrier 11 or mask carrier 21 shown in FIG. 2B.

[0028] Thus, the configuration apparatus 50 according to the present disclosure improves the fastening between the carrier 51 and the device 52. Advantageously, the device 52 can be an alignment device that can be fastened to the carrier 51 in order to carry out a relative movement between the substrate 10 and the mask 20. This fastening improvement may be useful, for example, when the carrier 51 is configured to carry the substrate 10 and/or the mask 20 in an essentially vertical position. In fact, due to the interaction of the fastening elements 53, 54, after fixing the device 52 to the carrier 51, the stopping element 55 can prevent or reduce the possible drift movement of the device with respect to the substrate 10 over time.

[0029] Figure 4 illustrates a carrier 51 for supporting a substrate and/or a mask, according to an embodiment of the present disclosure. Carrier 51 includes a fastening component for securing carrier 51 to device 52. The fastening arrangement includes a first fastening portion 501 connected to the carrier 51 and a second fastening portion 502 (not shown) connected to the device 52. The first fastening portion 501 can be fixed or fastened to the second fastening portion 502. In particular, FIG. 4 shows a rectangular shaped carrier 51 having four first fastening portions 501 located at or adjacent to the four corners. The device 52 fixed to the carrier 51 can have four second fastening portions 502 that can be coupled to the corresponding first fastening portions 501 of the carrier 51. Alternatively, four devices 52, each having at least a second fastening portion 502, by coupling each second fastening portion 502 to a corresponding first fastening portion 501 on the carrier 51, It can be fixed to the carrier 51. According to an alternative configuration, the two devices 52 each have two second fastening parts 502 and are secured in pairs to the two first fastening parts 501 on the carrier 51. Can be done.

[0030] FIG. 5 illustrates a cross-sectional view of the first fastening portion 501 taken along the line AA of FIG. The first fastening portion 501 has an outer surface 531 that may contact a second fastening element 54 (not shown) and an inner surface 532 that contacts the carrier 51 or an angular positioning element 56 such as a hinge. Comprising a first fastening element 53 having. Connecting means 57 are provided for fixing the first fastening element 53 to the angular positioning element 56 and/or the carrier 51. The first fastening element 53 may comprise a magnetically attractable material, i.e. a magnetic plate. The magnets included in the second fastening part, such as permanent magnets, electromagnets or electromagnetic permanent magnets, can be connected to a magnetic plate, such as a magnetic material plate.

[0031] FIG. 6 illustrates the functionality of component device 50 in a disengaged state according to the present disclosure.
The first fastening portion 501, which is on the carrier 51, the second fastening element 501, which is on the device 52, by moving the outer surface 531 of the first fastening element 53 against the surface 541 of the second fastening element 54. It is possible to engage or disengage the fastening portion 502. The double-headed arrow in FIG. 6 indicates this movement.

[0032] According to some embodiments of the present disclosure that may be combined with other embodiments described herein, the stop element 55 includes at least a protrusion and a corresponding recess, the protrusion being engageable with the recess. Alternatively, it can be inserted into the recess. The engagement of the projections and the recesses ensures that the first fastening element 53 is fixed to the second fastening element 54 and remains in approximately the same position. Indeed, the protrusions and recesses act as rigid stop elements and can reduce or prevent long-term relative sliding movements between the fastening elements.

[0033] In particular, as shown in FIGS. 5 and 6, the protrusion can be a pin 551 and the recess can be a cavity 552 so that the pin 551 can be inserted into or removed from the cavity 552.

[0034] In particular, according to one embodiment of the present disclosure, the pin 551 can be connected to or is part of the carrier 51 and the cavity 552 is part of the second fastening element 54.

[0035] FIGS. 6 and 7 show that by contacting the outer surface 531 of the first fastening element 53 with the outer surface 541 of the second fastening element 54, the first fastening element 53 (or the first fastening portion 501). Indicates that it can be fixed to or fastened to the second fastening element 54 (or the second fastening portion 502). The first fastening element 53 can be fastened to the second fastening element 54 by the mutual (ie mutual magnetic, electromagnetic etc.) action of the corresponding outer surfaces 531 and 541.

[0036] For example, additional fixation or fastening is performed by inserting pins 551 into corresponding cavities 552. In this way, the device 52 is firmly fixed to the carrier 51. The stop element 55, and in particular the pin 551 connected to the cavity 552, reduces or prevents long-term potential problems with respect to the mutual fastening operation between the two fastening elements 53, 54, for example by a drift movement. You can

[0037] As shown by FIGS. 4 and 5, the first fastening element 53 has a flat surface and may be constituted by a plate (eg, a magnetic plate) fixed to the carrier 51. The stop element 55 can include two pins 551 arranged on the opposite side of the first fastening element 53, each pin 551 being insertable into a corresponding cavity 552. The two pins 551 are oriented to extend from the carrier, for example along a vertical line on the major surface of the carrier 51. In this way, the connection between the first fastening element 53 and the second fastening element 54 is further improved. In an alternative configuration, the pins 551 can be arranged according to different orientations with respect to the first fastening element 53.

[0038] According to embodiments of the present disclosure, the carrier may be fastened to a device such as an alignment actuator. For example, embodiments include a first fastening element coupled to a carrier and a second fastening element coupled to a device, the first fastening element and the second fastening element being securable to each other or It is configured so that it can be fastened. A stop element is provided. The stop element supports the carrier when one of the first fastening element and the second fastening element fails. For example, when the carrier slides, that is, slides between the first fastening element and the second fastening element, for example when it moves unintentionally, the stop element supports or captures the carrier. As another example, the stop element supports or captures the carrier when one of the stop elements fails.

[0039] According to embodiments described herein, the stop element or components of the stop element may be on one or both of the fastening elements. For example, the stop element may be coupled to one or both of the fastening elements or may be integrally formed with one or both of the fastening elements. According to the embodiments described herein, the stop element or component of the stop element may be at the location of the carrier and/or device. For example, the stop element may be coupled to the carrier and/or device or may be integrally formed with the carrier and/or device.

[0040] According to embodiments that may be combined with other embodiments described herein, the stop element may be a recess at the location of one of the protrusion, the carrier and the device, and the corresponding other entity of the carrier and the device. Can be formed by. Moreover, additionally or alternatively, the stop element may be formed by a protrusion, a carrier and a device. The component for fixing or fastening the carrier to the device, which may be provided by the second fastening element, further comprises a protrusion which overlaps the protrusion of the first fastening element.

[0041] FIG. 8A shows component device 50 in an engaged condition. Therefore, the second fastening element 54 contacts the first fastening element 53. The pin 551 is inserted into the cavity 552. 8B and 8C show a normal state (FIG. 8B) when the pin 551 is not in contact with any of the inner surfaces of the cavity 552, and a sliding state when the pin 551 is in contact with the inner surface of the cavity 552. FIG. 8C shows details of the interaction between the pin 551 and the cavity 552 in FIG. 8C. The interaction between the pin and the cavity reduces possible movement. For example, the carrier may slip relative to a vertically oriented substrate, especially while the magnet is not functioning. The interaction of the pin with the cavity prevents the carrier from falling completely. As a further optional variation that may be combined with other embodiments, the presence of steps or hooks may prevent the pin 551 from being pulled out of the slipping cavity 552.

[0042] According to some embodiments of the present disclosure that may be combined with other embodiments described herein, the pin 551 has a width and the cavity 552 has an edge, eg, an inner edge or wall. Form a larger width. The larger width of cavity 552 can be larger than the width of pin 551. Therefore, as shown in FIG. 8B, when the pin 551 is inserted into the cavity 552, a clearance 553 is formed between the pin 551 and the edge of the cavity 552. In particular, the clearance 553 can be in the range between 1 mm and 2 mm, preferably about 1.5 mm.

[0043] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the pin 551 has a circular diameter (or another shape, such as a rectangle or polygon of one dimension). Cavity 552 has an additional circular diameter (or a shape such as a larger sized rectangle or polygon). In particular, the circular diameter or dimension of the pin 551 is in the range between 8 mm and 12 mm, preferably about 10 mm. The further circular diameter or further dimension of the cavity 552 has a diameter in the range of 9.5 mm to 13.5 mm, preferably about 11.5 mm. If desired, the contours of pin 551 and cavity 552 can have different shapes and sizes.

[0044] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the cavity 552 has a depth in the range of about 4 mm to 6 mm, preferably 5 mm. Can have.

[0045] These dimensions of the pin 551 and the cavity 552 allow the stop element 55 to support the carrier 51 when at least one of the first fastening element 53 or the second fastening element 54 fails. It should be noted that the values have been considered to be values within a preferable range. Thereby, the carrier 51 is defined (for example, assumed) to be able to carry the substrate 10 (or the mask 20) having the above-described dimensions in a basically vertical posture.

[0046] According to some embodiments of the present disclosure, the pin 551 may be connectable to the first fastening element 53, may be part of the first fastening element 53, and/or the cavity 552 may be It can be part of the second fastening element 54. This is shown in FIG. 9 which illustrates the component device 50 in the engaged state.

[0047] According to a further alternative embodiment of the component device 50 of the present disclosure shown in FIG. 10, a protrusion, eg, a pin 551, is connectable to the second fastening element 54 or of the second fastening element 54. In part, the recess (eg, cavity 552) can be part of the first fastening element 53.

[0048] With this type of configuration, two opposing pins 551 can be placed closer together, allowing for a stronger connection between the first fastening element 53 and the second fastening element 54. Become.

[0049] FIG. 11A further illustrates an embodiment of a configuration device 50 according to the present disclosure. The stop element 55 has at least one of a first hard stop edge 554 formed in the first fastening element 53 and a second hard stop edge 555 formed in the second fastening element 54. May be included. The first hard stop edge 554 is engageable with or engages a portion of the second fastening element 54. The second hard stop edge is engageable with or engages a portion of the first fastening element 53.

[0050] FIG. 11B shows in detail that the first fastening element 53 and the second fastening element 54 are in the disengaged state when moved away from each other, and FIG. 11C shows the first fastening element. When the element 53 and the second fastening element 54 are moved close to each other, they are shown to be in engagement. The hard stop edges 554, 555 can be configured as upper or lower protrusions on the outer surfaces 531 and 541 of the first fastening element 53 and the second fastening element 54. To achieve the engagement, if the hard stop edge 554 of the first fastening element 53 is formed by an upper projection of the outer surface 531 of the first fastening element 53, the hard stop edge 555 of the second fastening element 54. Are formed by corresponding lower protrusions on the outer surface 541 of the second fastening element 54 and vice versa.

[0051] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the carrier is configured to carry the substrate 10 or mask 20 in an essentially vertical position.

[0052] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the first fastening element 53 comprises a magnetically attractable material, i.e., a magnetic plate. The second fastening element 54 can include a permanent electromagnet. In this way, the fastening action between the two fastening elements 53, 54 and consequently the fixing between the carrier 51 and the device 52 is further improved.

[0053] In particular, the permanent electromagnet element is switchable between a magnetized state and a non-magnetized state by applying an electric current, and the permanent electromagnet element remains in the magnetized state or the non-magnetized state even after removing the electric current. Is configured.

[0054] According to one embodiment, the permanent electromagnet element may include a fastening magnet assembly including a fastening magnet and a control magnet assembly including at least one control magnet and at least one coil. In particular, one coil can substantially enclose one control magnet of the control magnet assembly and is configured to switch the polarity of one control magnet. The permanent electromagnet may include at least one permanent magnet of a rare earth metal, especially a neodymium alloy.

[0055] FIG. 12 illustrates an apparatus 60 for depositing layers on a substrate 10. The apparatus comprises a processing chamber 61 adapted for layer deposition, and a configurator 50 according to any of the previously described embodiments. The component 50 can be used to secure or fasten the carrier 51 to the device 52 during processing in the processing chamber 61. The apparatus further includes a deposition source 30 for depositing the material forming the layer on the substrate 10. In particular, the carrier may be configured to carry the substrate 10 or a mask 20 disposed between the substrate 10 and the deposition source 30. As an example, in the apparatus of Figure 12, carrier 51 is configured to carry substrate 10 as substrate carrier 11 of Figure 2B.

[0056] The use of component 50 of apparatus 60 is useful for securing device 52 to carrier 51 in a stable and more permanent manner. The device 52 can be, for example, an alignment device for moving the carrier 12 with respect to the mask 20 to accurately align the mask pattern with the surface of the substrate 10 to be processed. For example, the device may be connected to the substrate carrier 51 and the mask carrier. Advantageously, the configurator 50 is used, for example, for fastening and maintaining the fastening of the device 52 for a long time during the processing (ie layer deposition) of the substrate 10 without interruption in the processing chamber 61. To be done.

[0057] FIG. 13 illustrates a retention and alignment component 70 according to the present disclosure. The configurator 70 includes a fastening device 58 for supporting the substrate carrier 51 and/or the mask carrier 21 during processing in the processing chamber. The configuration device 70 of FIG. 13 shows the fastening of the device 58 supporting the substrate carrier 51. The configurator 70 further comprises an alignment device 52 for moving the substrate carrier 51 with respect to the mask carrier 21. In particular, the fastening device 58 comprises at least one first fastening element 53 connected to the substrate carrier 51 or the mask carrier 21 and a second fastening element 54 connected to the alignment device 52. The first fastening element 53 and the second fastening element 54 are configured such that they can be fixed or fastened to each other. The fastening device 58 includes a stop element 55 that supports the carrier 51 when one of the first fastening element 53 and the second fastening element 54 fails. According to some embodiments of the present disclosure that may be combined with other embodiments described herein, retention of the alignment component includes a first fastening device (FIG. 13 of FIG. 13) that couples the substrate carrier to the alignment device. Reference numeral 58), and a second fastening device (not shown in FIG. 13) connecting the mask carrier to the alignment device. The second fastening device may be provided by the embodiments described herein and/or similar embodiments to the first fastening device.

[0058] The stop element 55 can prevent slippage between the first fastening element 53 and the second fastening element 54 that may occur over time due to the drift movement of the device 52 with respect to the carrier 51 and thus the fastening The fastening operation of the device 58 is improved.

[0059] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, alignment device 52 may be configured to secure or fasten substrate carrier 51 and mask carrier 21 together. .. The fastening device 58 may thus include a dedicated stop element 55 for supporting the substrate carrier 51 and the mask carrier 21 together when the corresponding fastening element fails.

[0060] Alignment device 52 may include one or more actuators that act on substrate carrier 51 and/or mask carrier 21 to effect movement of substrate 10 relative to mask 20. The actuator may be an integral part of the device 52, or it may be a separate component connected to the device 52 by suitable connecting means.

[0061] According to some embodiments of the present disclosure, which may be combined with other embodiments described herein, the first fastening element 53 may be coupled to a hinge element. Therefore, the alignment device 52 may be oriented in a different direction, ie, a linear direction of a plane defined by the carrier 51 (eg, the XY plane of FIG. 2A), or a parallel direction perpendicular to the plane (eg, along a parallel direction). , The z-direction of FIG. 2B) and/or the carrier 51 can be moved along an angular direction about an axis perpendicular to the plane.

[0062] The clearance 553 between the pin 551 and the cavity 552 (or the protrusion and the recess) is provided in the carrier 51 even after the first fastening element 53 is fixed to the second fastening element 54. It can function to allow fine tuning of movement in different directions. For example, clearance 553 allows angular movement of carrier 51 about an axis perpendicular to the plane defined by carrier 51.

[0063] Embodiments according to the present disclosure have several advantages, including the possibility of improving the fastening between the device 52 and the carrier 51. In particular, these embodiments provide a fastening element 53 and a fastening element 54 which can occur over time, especially when the carrier 51 is arranged to carry the substrate 10 or the mask 20 in an essentially vertical position. It has the advantage of preventing slippage between. Moreover, the embodiments according to the present disclosure have the advantage of enabling fine adjustment of the position of the carrier 51 in several different directions.

[0064] While the above description is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope of the disclosure, The scope of the present disclosure is determined by the claims that follow.

Claims (17)

A component for securing or fastening a carrier to a device during processing in a processing chamber, comprising:
A first fastening element connected to the carrier,
A second fastening element coupled to the device, the first fastening element and the second fastening element being configured to be fixable or fastenable to each other, and
A configuration device comprising a stop element that supports the carrier when one of the first fastening element and the second fastening element fails.   The component device of claim 1, wherein the stop element comprises at least one of at least one protrusion and at least one pin.   3. The component device according to claim 1 or 2, wherein the stop element comprises at least one of at least one recess and at least one cavity.   4. The component device of claim 3, wherein the protrusion is insertable into the recess or the pin is insertable into the cavity.   3. The configuration device according to claim 2, wherein the protrusion or the pin is connectable to the carrier or the first fastening element or is part of the carrier or the first fastening element.   5. A configuration device according to any one of claims 2 to 4, wherein the second fastening element comprises a further protrusion that overlaps the protrusion of the first fastening element.   4. The configuration device according to claim 3, wherein the pin is connectable to the second fastening element or is part of the second fastening element.   5. A configuration device according to claim 3 or 4, wherein the pin has a width and the cavity has an edge or wall forming an additional width greater than the width.   Inserting the pin into the cavity creates a clearance between the pin and the cavity, in particular the clearance is in the range between 1 mm and 2 mm, in particular about 1.5 mm. The constituent device according to 1.   10. Arrangement according to any of the preceding claims, wherein a clearance is provided between the carrier and the device, the clearance being in the range between 1 mm and 2 mm, in particular about 1.5 mm. apparatus.   11. The stop element of claim 1, wherein the stop element comprises at least a first hard stop edge and a second hard stop edge, the first hard stop edge being engageable with the second hard stop edge. The constituent device according to any one of claims.   12. Arrangement device according to any of the preceding claims, wherein the carrier is arranged to carry the substrate or mask in an essentially vertical position.   13. A component device according to any one of claims 1 to 12, wherein the first fastening element comprises a magnetic plate and the second fastening element comprises a permanent electromagnet. A carrier for supporting a substrate or mask in a vacuum chamber, comprising:
A fastening configuration device for fixing or fastening the carrier to a device,
A carrier that supports the carrier when the fastening component fails. An apparatus for depositing a layer on a substrate, comprising:
A processing chamber adapted for internal layer deposition,
14. A component device according to any one of claims 1 to 13 for a carrier in the processing chamber,
A deposition source for a deposition material forming the layer on the substrate, the carrier configured to carry the substrate or a mask disposed between the substrate and the deposition source. apparatus. A holding and aligning component,
A fastening device for supporting a carrier which is a substrate carrier and/or a mask carrier during processing in the processing chamber,
An alignment device for moving the substrate carrier with respect to the mask carrier, the fastening device comprising at least a first fastening element coupled to the substrate carrier or the mask carrier, and the alignment device. A second fastening element connected to the first fastening element and the second fastening element, wherein the first fastening element and the second fastening element are configured such that they can be fixed or fastened to each other, Further comprises a holding and aligning arrangement comprising a stop element for supporting the carrier when one of the first fastening element and the second fastening element fails. 17. The configuration device of claim 16, further comprising a hinge element coupled to the first fastening element.

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