KR20190112422A - Light emitting device package and light module - Google Patents

Abstract

According to an embodiment of the present invention, a light emitting element package which can increase heat dissipation characteristics comprises: a first frame including a first bonding unit; a second frame including a second bonding unit and arranged to be spaced apart from the first frame; a body arranged between the first frame and the second frame; and a light emitting element arranged on the first bonding unit. The light emitting element is electrically connected with the first and second bonding units. The body includes a first side surface which is extended in a second direction and has a length of the second direction and a third side surface which is extended in a first direction at one end of the first side surface and has a length of the first direction. Each of the first and second frames includes at least one protrusion unit which protrudes from each of the first and third side surfaces. Moreover, according to an embodiment of the present invention, a light source module comprises: a circuit substrate; and a light emitting element package arranged on the circuit substrate.

Description

Light emitting device package and light source module {LIGHT EMITTING DEVICE PACKAGE AND LIGHT MODULE}

Embodiments relate to a light emitting device package and a light source module including the same.

A semiconductor device including a compound such as GaN, AlGaN, etc. has many advantages, such as having a wide and easy to adjust band gap energy, and can be used in various ways as a light emitting device, a light receiving device, and various diodes.

In particular, light emitting devices such as light emitting diodes or laser diodes using Group 3-Group 5 or Group 2-6 compound semiconductor materials have been developed using thin film growth technology and device materials. There is an advantage that can implement light of various wavelength bands such as green, blue and ultraviolet. In addition, a light emitting device such as a light emitting diode or a laser diode using a group 3 to 5 or 2 to 6 group compound semiconductor material may implement a white light source having high efficiency by using a fluorescent material or combining colors. Such a light emitting device has advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

In addition, when a light-receiving device such as a photodetector or a solar cell is also fabricated using a Group 3-5 Group 2 or Group 6 compound semiconductor material, development of device materials absorbs light in various wavelength ranges to generate a photocurrent. As a result, light in various wavelengths can be used from gamma rays to radio wavelengths. In addition, such a light receiving device has the advantages of fast response speed, safety, environmental friendliness and easy control of the device material, so that it can be easily used in power control or microwave circuits or communication modules.

Therefore, the semiconductor device may replace a light emitting diode backlight, a fluorescent lamp, or an incandescent bulb, which replaces a cold cathode tube (CCFL) constituting a backlight module of an optical communication means, a backlight of a liquid crystal display (LCD) display device. Applications are expanding to include white light emitting diode lighting devices, automotive headlights and traffic lights, and sensors that detect gas or fire. In addition, the semiconductor device may be extended to high frequency application circuits, other power control devices, and communication modules.

The light emitting device may be provided as a pn junction diode having a characteristic in which electrical energy is converted into light energy using, for example, a group 3-5 element or a group 2-6 element on the periodic table. Various wavelengths can be realized by adjusting the composition ratio.

For example, nitride semiconductors are receiving great attention in the field of optical devices and high power electronic devices due to their high thermal stability and wide bandgap energy. In particular, ultraviolet (UV) light emitting devices, blue light emitting devices, green light emitting devices, yellow light emitting devices, and red light emitting devices using nitride semiconductors are commercially used and widely used.

For example, in the case of an ultraviolet light emitting device, a light emitting diode which emits light distributed in a wavelength range of 200 nm to 400 nm, and is used in the wavelength band, for short wavelengths, for sterilization and purification, and for long wavelengths, an exposure machine or a curing machine. Can be used.

 Ultraviolet rays can be classified into UV-A (315nm ~ 400nm), UV-B (280nm ~ 315nm), and UV-C (200nm ~ 280nm) in order of long wavelength. The UV-A (315nm ~ 400nm) area is applied to various fields such as industrial UV curing, printing ink curing, exposure machine, forgery discrimination, photocatalyst sterilization, special lighting (aquarium / agriculture, etc.), and UV-B (280nm ~ 315nm). ) Area is used for medical purposes, UV-C (200nm ~ 280nm) area is applied to air purification, water purification, sterilization products.

In addition, the visible light emitting device is also used in various fields, in particular, the light emitting device that emits yellow light is used as a direction indicator of the side repeater (Rear combination lamp) and rear combination lamp (RCL) of the vehicle. However, the light emitting device that emits yellow light has a heat dissipation problem by emitting a larger amount of heat than a light emitting device that emits light of a different color, and the light emitting device is eliminated from the package by the heat. .

In addition, the size of the light emitting device package is different according to the applied product or the required product, and the circuit board design on which the light emitting device package is disposed may also be different. That is, since the design of the light emitting device package or the circuit board needs to be changed according to the application target, there is a problem in that manufacturing cost increases and process efficiency decreases.

Therefore, there is a need for a new light emitting device package and a semiconductor device package that can solve the above problems.

The embodiment includes a light emitting device package or a light source module including a first frame and a second frame and optimizing the size of the first frame and exposing the first frame through a through hole of the body to improve heat dissipation characteristics. To provide.

In addition, the embodiment is to provide a light emitting device package or a light source module that can prevent the light emitting device from falling in the light emitting device package.

In addition, the embodiment provides a light emitting device package and a light source module that can be connected to a variety of circuit boards without changing the design by using a plurality of protrusions protruding from the body.

The light emitting device package according to the embodiment includes a first frame including a first bonding portion, a second frame including a second bonding portion and spaced apart from the first frame, and disposed between the first frame and the second frame. And a light emitting device disposed on the body and the first bonding portion, wherein the light emitting element is electrically connected to the first and second bonding portions, and the body extends in a second direction and has a length in a second direction. And a third side surface extending in a first direction at one end of the first side surface and having a length in a first direction, wherein the first and second frames each include the first and third sides. It includes at least one protrusion projecting on each side.

In addition, the light source module according to the embodiment includes a circuit board and the light emitting device package disposed on the circuit board.

The embodiment may include a first frame and a second frame, and a part of the first frame in which the light emitting device is disposed may be exposed to the outside of the body through the through hole of the body. In addition, the size of the first frame in which the light emitting device is disposed may be larger than the size of the second frame. Accordingly, the light emitting device package can effectively discharge the heat emitted from the light emitting device can improve the heat dissipation characteristics.

In addition, the embodiment can effectively discharge the heat emitted from the light emitting device as described above, it is possible to prevent the light emitting device from falling off inside the package. It is possible to prevent the light emitting device from falling off from the first frame. Accordingly, the overall reliability of the light emitting device package can be improved.

In addition, the light emitting device package according to the embodiment includes a body including the first to the fourth side, the length of the first side of the first side and the second side of the third side and the fourth side It may be longer than the length. In this case, the first frame and the second frame may include protrusions protruding from the respective frames, and the protrusions may be connected to various circuit boards without changing the design of the package and the design of the circuit board. As a result, manufacturing costs can be reduced and process efficiency can be improved.

The first frame may include a first hole in which the body is disposed, and the second frame may include a second hole in which the body is disposed. In this case, the first hole and the second hole may be located at a position overlapping in the vertical direction with the upper body disposed on the body. Accordingly, the reliability of the light emitting device package can be improved, and the first hole and the second hole are not visible from the outside, so that the light emitting device package can have an improved appearance.

1 is a perspective view of a light emitting device package according to an embodiment.
2 is a plan view of a light emitting device package according to an embodiment.
3 is a rear view of the light emitting device package according to the embodiment.
4 is a plan view of a frame according to an embodiment.
5 is a cross-sectional view taken along line AA ′ of the light emitting device package of FIG. 2.
6 is a cross-sectional view taken along line BB ′ of the light emitting device package of FIG. 2.
7 is a diagram illustrating an example in which a light emitting device package is disposed on a substrate.
8 illustrates another example in which a light emitting device package according to an exemplary embodiment is disposed on a substrate.
9 is a side cross-sectional view showing an example of a light emitting device applied to the light emitting device package according to the embodiment.

Embodiments of the invention will be described with reference to the accompanying drawings. In the description of an embodiment of the invention, each layer (film), region, pattern or structures may be “on / over” or “under” the substrate, each layer (film), region, pad or pattern. "On / over" and "under" are defined as being "directly" or "indirectly" through another layer. It includes everything. In addition, the reference to the top / top or bottom of each layer will be described based on the drawings, but embodiments are not limited thereto.

A semiconductor device package according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present invention, the device package may include a semiconductor device or a light emitting device that emits light of ultraviolet rays, infrared rays, or visible light. Hereinafter, a description will be given based on a case in which a light emitting device is applied as an example of a semiconductor device. The light emitting device may include a non-light emitting device such as a zener diode or a sensing device that monitors a wavelength or heat. Can be. Hereinafter, a description will be given based on a case in which a light emitting device is applied as an example of a semiconductor device, and the light emitting device package will be described in detail.

Before describing a light emitting device package according to an embodiment of the present invention, the first direction may be the x-axis direction shown in the drawings, and the second direction may be the direction orthogonal to the x-axis direction in the y-axis direction shown in the drawings. Can be. In addition, the third direction may be a direction perpendicular to the x-axis and the y-axis in the z-axis direction shown in the drawing.

1 is a perspective view of a light emitting device package according to the embodiment, FIG. 2 is a plan view of the light emitting device package according to the embodiment, FIG. 3 is a rear view of the light emitting device package according to the embodiment, and FIG. 4 is a frame according to the embodiment. Top view of the. 5 is a cross-sectional view taken along line AA ′ of the light emitting device package of FIG. 2, and FIG. 6 is a cross-sectional view taken along line B-B ′ of the light emitting device package of FIG. 2.

1 to 6, the light emitting device package 1000 according to the embodiment may include a package body 100 and a light emitting device 500.

The light emitting device package 1000 may extend in a first direction and in a second direction perpendicular to the first direction. The light emitting device package 1000 may have a length in the first direction greater than a length in the second direction. The length of the first direction of the light emitting device package 1000 may be longer than or equal to the length of the first direction of the package body 100. Here, the first direction may be a direction of a longer side of the sides of the light emitting device 500. For example, the first direction may be a long side direction of the light emitting device 500, and the second direction may be a short side direction of the light emitting device 500. In detail, the first direction may be an x-axis direction in the drawing, and the second direction may be a y-axis direction in the drawing. In addition, the vertical direction may be a z-axis direction in the drawing.

The package body 100 may include a plurality of frames. In detail, the frame may include at least two frames. For example, the plurality of frames may include a first frame 200 and a second frame 300.

The first frame 200 and the second frame 300 may be spaced apart from each other. The first frame and the second frame may have different polarities. For example, the first frame 200 may be connected to the P-type electrode of the light emitting device 500, and the second frame 300 may be connected to the N-type electrode of the light emitting device 500. Alternatively, the first frame 200 may be connected to the N-type electrode of the light emitting device 500, and the second frame 300 may be connected to the P-type electrode of the light emitting device 500.

The package body 100 may include a body 110. The package body 100 may include a body 110 including a through hole TH. In addition, the body 110 may be disposed between the plurality of frames. The body 110 may be combined with the plurality of frames. For example, the body 110 may be disposed to surround the first frame 200 and the second frame 300. In detail, the body 110 may be disposed to partially surround the first frame 200 and the second frame 300. The body 110 may function as an electrode separation line between the first frame 200 and the second frame. The body 110 may be referred to as an insulating member.

The through hole TH may be a hole penetrating the upper and lower surfaces of the body 110. The width of the through hole TH may change from the upper surface of the body 110 toward the lower surface thereof. For example, an upper width of the through hole TH may be wider than a lower width of the through hole TH. The through hole TH may have a gradually narrower width from top to bottom. The through hole TH may have a shape corresponding to a frame disposed in the through hole to be described later.

The package body 100 may be disposed on the first frame 200. In addition, the package body 100 may be disposed on the second frame 300. For example, the package body 100 may further include an upper body 110 disposed on the body 110. That is, the upper body 110 may be disposed on the first frame 200 and the second frame 300. The upper body 110 may provide an inclined surface disposed on the first frame 200 and the second frame. Accordingly, the cavity 122 may be provided on the first frame 200 and the second frame 300. The height h1 of the cavity 122 may be about 550 μm to about 650 μm. In detail, the height h1 of the cavity 122 may be about 580 μm to about 620 μm. Preferably, the height h1 of the cavity 122 may be about 590 μm to about 610 μm. The body 110 and the upper body 110 may include the same material or different materials. In addition, the body 110 and the upper body 110 may be integrally formed or separately formed. The light emitting device package 1000 according to the embodiment may be provided in a structure in which a cavity 122 is formed in the package body 100, and a structure in which the upper surface of the package body 100 is flat without the cavity 122, eg On the upper body 110 is omitted, the upper surface of the body 110 may be provided in a flat structure.

The body 110 may be made of a resin material or an insulating resin material. The body 110 is polyphthalamide (PPA), polychloro triphenyl (PCT), liquid crystal polymer (LCP), polyamide 9T (PA9T), silicone, epoxy, epoxy molding compound (EMC: epoxy molding compound), silicone It may be formed of at least one selected from the group consisting of molding compound (SMC), ceramic, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ) and the like. The body 110 may be formed of a resin material, and may include a filler of a high refractive material such as TiO ₂ and SiO ₂ therein. The body 110 may be formed of a thermoplastic resin, and the thermoplastic resin is a material that hardens when heated and is hardened again when cooled, so that the first frame 200 and the second frame 300 contact with the thermoplastic resin. When the materials to be expanded or contracted by heat, the body 110 may act as a buffer. In this case, when the body 110 has the buffering function, it is possible to prevent the conductive parts such as solder paste, Ag paste, and SAC (Sn-Ag-Cu) paste from being damaged. In the package, a coefficient of thermal expansion (CTE) according to thermal expansion and contraction may be greater in the first direction than in the second direction. Body 110 according to the embodiment may preferably comprise a PCT or PPA material, the PCT or PPA material is a high melting point and a thermoplastic resin.

The upper body 110 may provide inclined side surfaces IS1 and IS2 around the cavity 122. The inclined side surfaces IS1 and IS2 may include side surfaces IS1 and IS2 inclined in a first direction and a second direction, and the side surface IS1 inclined in the first direction is inclined in the second direction. It may have an inclination angle corresponding to the photograph side surface IS2. Alternatively, the side surface IS1 inclined in the first direction may have a different inclination angle from the side surface IS2 inclined in the second direction. For example, the inclination angle of the side surface IS1 inclined in the first direction may be smaller than the inclination angle of the side surface IS2 inclined in the second direction.

The body 110 may include a plurality of side surfaces. In detail, the body 110 may include a first side surface S1 and a second side surface S2 that face each other and face each other in the first direction. The first side surface S1 and the second side surface S2 may extend in a second direction and have a length in a second direction. In addition, the body 110 may include a third side surface S3 and a fourth side surface S4 disposed to face each other in a second direction. The third side surface S3 and the fourth side surface S4 may extend in a first direction and have a length in a first direction. Each of the third side surface S3 and the fourth side surface S4 may be a side surface connecting the first side surface S1 and the second side surface S2. For example, the third side surface S3 may extend from one end of the first side surface S1 in a first direction and be connected to one end of the second side surface S2. In addition, the fourth side surface S4 may extend in the first direction from the other end of the first side surface S1 and be connected to the other end of the second side surface S2. The first side surface S1 and the second side surface S2 may be surfaces perpendicular to or inclined with respect to the bottom surface of the body 110. The third side surface S3 and the fourth side surface S4 may be surfaces perpendicular to or inclined with respect to the bottom surface of the body 110. The third side surface S3 and the fourth side surface S4 may be longer than the first side surface S1 and the second side surface S2. For example, the length of the third and fourth side surfaces S3 and S4 in the first direction may be longer than the length of the first and second side surfaces S1 and S2 in the second direction. The first side surface S1 and the second side surface S2 may be disposed in directions perpendicular to both ends of the third side surface S3 and the fourth side surface S4. The first to fourth side surfaces S1, S2, S3, and S4 may be vertically or inclined with respect to the bottom surface of the body 110.

Although not shown in the drawings, a recess is recessed in at least one of the upper and lower regions of the frame 110, for example, the region between the first frame 200 and the second frame in the body 110. May be further arranged. The recess may cushion the frames and the surrounding materials as they expand or contract.

The first frame 200 and the second frame 300 may be provided as a conductive frame. The conductive frame may be made of metal such as copper (Cu), titanium (Ti), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver ( Ag), and may be formed in a single layer or multiple layers. The thickness of the first frame 200 and the second frame 300 may be formed in consideration of heat dissipation characteristics and electrical conduction characteristics, it may be formed in the range of about 100㎛ to about 300㎛. The thicknesses of the first frame 200 and the second frame 300 may correspond to each other. For example, the first frame 200 and the second frame 300 may have the same thickness within the above-described thickness range.

The first frame 200 and the second frame 300 may be provided as a metal frame. The first frame 200 and the second frame 300 may stably provide structural strength of the package body 100, and may be electrically connected to the light emitting device 500.

The first frame 200 may have a length in a first direction and a length in a second direction, and the length in the first direction of the first frame 200 may be in the second direction of the first frame 200. It can be equal to or longer than the length. In addition, the second frame 300 may have a length in a first direction and a length in a second direction, and the length in the first direction of the second frame 300 may be the second of the second frame 300. It may be equal to or longer than the length of the direction.

The length in the first direction of the first frame 200 may be longer than the length in the first direction of the second frame 300. The length in the second direction of the first frame 200 may be longer than the length in the second direction of the second frame 300. That is, the first frame 200 and the second frame 300 may have different sizes. For example, the size of the first frame 200 may be larger than the size of the second frame 300. In detail, the planar area of the first frame 200 may be larger than the planar area of the second frame 300 when viewed in a plan view.

The first frame 200 may extend in the lateral direction of the package body 100. In detail, the first frame 200 may include a first bonding unit 205, and the first bonding unit 205 may include the first side surface S1, the second side surface S2, and the first side surface. It may extend in at least one side direction of the third side (S3) and the fourth side (S4).

The second frame 300 may extend in the lateral direction of the package body 100. In detail, the second frame 300 may include a second bonding portion 305, and the second bonding portion 305 may include the first side surface S1, the second side surface S2, and the second side surface. It may extend in at least one side direction of the third side (S3) and the fourth side (S4). In more detail, the second bonding part 305 may extend in the directions of the first side surface S1 and the third side surface S3.

The first bonding part 205 and the second bonding part 305 may be spaced apart from each other. For example, the distance d0 between the first bonding portion 205 and the second bonding portion 305 may be about 80 μm to about 120 μm. In detail, the distance d0 between the first bonding portion 205 and the second bonding portion 305 may be about 90 μm to about 110 μm. Preferably, the distance d0 between the first bonding portion 205 and the second bonding portion 305 may be about 95 μm to about 105 μm. When the gap is less than about 80 μm, the gap between the first frame 200 and the second frame 300 is narrow, and thus may not function as an electrode separation line. In addition, when the interval d0 exceeds about 120 μm, the amount of wire used in the wire bonding process for the electrical connection of the light emitting device 500 may increase, and the volume of the entire light emitting device package may increase. have.

The first frame 200 may further include a first extension part. In detail, the first frame 200 may further include a first extension part extending from the first bonding part 205 toward the first side surface S1. The first extension part may be adjacent to the second bonding part 305.

The length in the second direction of the first bonding part 205 may vary. For example, a second direction length of the first bonding portion 205 adjacent to the second side surface S2 may correspond to a second direction of the first bonding portion 205 adjacent to the first side surface S1. It can be longer than the length.

In addition, the length of the second bonding part 305 in the first direction may vary. For example, the length of the first direction of the second bonding part 305 may decrease from the third side surface S3 toward the fourth side direction.

At least one frame of the first frame 200 and the second frame 300 may include a first recess R1. For example, when the size of the first frame 200 is larger than the second frame 300, the first frame 200 may include a first recess R1. The first recess R1 may be positioned at a position corresponding to the through hole TH of the body 110 in a vertical direction. The first recess R1 may overlap the through hole TH in a vertical direction. Here, the vertical direction may refer to the z-axis direction in the drawing. That is, the first frame 200 may be inserted into the through hole TH of the body 110 and disposed therein. In detail, a part of the first bonding part 205 may be inserted into the through hole TH. For example, an area in which the first recess R1 is formed in the first frame 200 may be inserted into the through hole TH. An area where the first recess R1 is formed in the bottom surface of the first frame 200 may directly contact the inner surface of the through hole TH. Accordingly, the through hole TH may not be visually recognized from the outside. The light emitting device 500 may be disposed on the first recess R1.

The first recess R1 may be located on an upper surface of the first frame 200. The first recess R1 may have a length in the first direction and a length in the second direction, and the length of the first recess R1 in the first direction may be the first length of the first recess R1. It can be longer than the length in two directions. In addition, the length of the first direction of the first recess R1 may be smaller than the length of the first direction of the bottom of the cavity 122, and the length of the first recess of the first recess R1 may be the cavity 122. ) May be smaller than the length of the bottom in the second direction. Accordingly, the thermal expansion or contraction in the first direction can be buffered. When the first recess R1 of the first frame 200 buffers thermal expansion or contraction in the first direction, cracks may occur in the conductive part disposed on the first frame 200 and the upper portion thereof. It can be suppressed or prevented.

The height h2 of the first recess R1 may be smaller than the thickness of the light emitting device 500. In detail, the vertical height h2 of the first recess R1 may be smaller than the vertical thickness of the light emitting device 500. Here, the vertical direction refers to the z-axis direction in the drawing. As shown in FIG. 6, the light emitting device 500 may be disposed on the first recess R1, and the distance from the bottom surface of the body 110 to the top surface of the light emitting device 500 may be determined. It may be larger than the distance from the bottom surface of the body 110 to the top surface of the first frame 200. Accordingly, the light emitted from the light emitting device 500 in the lateral and lower surfaces may be reflected upward through the first recess R1.

In addition, the height h2 of the first recess R1 may be smaller than the thickness of the first frame 200 and the second frame 300. The height h2 of the first recess R1 may be smaller than the thickness of the body 110. The height h2 of the first recess R1 may be about 30% or more of the thickness of the first frame 200. In detail, the height h2 of the first recess R1 may be about 30% to about 80% of the thickness of the first frame 200. When the height h2 of the first recess R1 is less than about 30%, the effect of improving heat dissipation may be insignificant. When the depth exceeds about 80%, the first frame 200 Reliability may be degraded.

The first recess R1 may have a narrow width gradually from the top to the bottom. Accordingly, the first frame 200 may include a side surface inclined by the first recess R1. The inclined side surface may include an inner side surface inclined in a first direction and a second direction, and the inner side surface inclined in the first direction may have an inclination angle corresponding to the inner side surface inclined in the second direction. . Alternatively, the inner surface inclined in the first direction may have a different inclination angle from the inner surface inclined in the second direction.

The inclination angle of the inner side surface inclined in the first direction may be smaller than the inclination angle of the inner side surface inclined in the second direction. In addition, the inclination angle of the inner side surface inclined in the first direction in the first recess R1 may correspond to or be smaller than the inclination angle of the side surface IS1 inclined in the first direction in the upper body 120. In addition, the inclination angle of the inner side surface inclined in the second direction in the first recess R1 may correspond to or be smaller than the inclination angle of the side surface IS2 inclined in the second direction in the upper body 120.

The first frame 200 may include at least one protrusion protruding from the first side surface S1. The first frame 200 may include at least one protrusion protruding from each of the first side surface S1, the second side surface S2, the third side surface S3, and the fourth side surface S4. Can be. In detail, the first frame 200 may include the first side surface S1, the second side surface S2, the third side surface S3, and the fourth side surface S4 at the first bonding part 205. It may include at least one protrusion projecting to each. For example, the first frame 200 may include a first protrusion 210 extending from the first bonding portion 205 toward the first side surface S1. The first protrusion 210 may protrude from the first side surface S1. In addition, the first frame 200 may include a fourth protrusion 220 extending from the first bonding portion 205 toward the third side surface S3. The fourth protrusion 220 may protrude from the third side surface S3. In addition, the first frame 200 may include a fifth protrusion 230 and a sixth protrusion 240 extending from the first bonding part 205 in the direction of the second side surface S2. The fifth protrusion 230 and the sixth protrusion 240 may protrude from the second side surface S2. In addition, the first frame 200 may include a seventh protrusion 250 and an eighth protrusion 260 extending in the direction of the fourth side surface S4 from the first bonding portion 205. The seventh protrusion 250 and the eighth protrusion 260 may protrude from the fourth side surface S4. The protrusions protruding from the same side may be spaced apart from each other. For example, the fifth protrusion 230 and the sixth protrusion 240 protruding from the second side surface S2 may be spaced apart from each other. In addition, the seventh protrusion 250 and the eighth protrusion 260 protruding from the fourth side surface S4 may be spaced apart from each other.

The second frame 300 may be spaced apart from the first frame 200. In addition, the second frame 300 may include at least one protrusion protruding from the third side surface S3. The second frame 300 may include at least one protrusion protruding from each of the first side surface S1 and the third side surface S3. In detail, the second frame 300 may include at least one protrusion protruding from the second bonding part 305 to each of the first side surface S1 and the third side surface S3. For example, the second frame 300 may include a second protrusion 310 extending in the direction of the first side surface S1 from the second bonding part 305. The second protrusion 310 may protrude from the first side surface S1. In addition, the second frame 300 may include a third protrusion 320 extending in the direction of the third side surface S3. The third protrusion 320 may protrude from the third side surface S3. Here, the protrusions protruding from the same side may be spaced apart from each other. For example, the first protrusion 210 of the first frame 200 protruding from the first side surface S1 and the second protrusion 310 of the second frame 300 may be spaced apart from each other. have. In addition, the fourth protrusion 220 of the first frame 200 and the third protrusion 320 of the second frame 300 may be spaced apart from each other.

That is, a first protrusion 210 and a second protrusion 310 may be located on the first side surface S1, and a third protrusion 320 and a fourth protrusion 220 on the third side surface S3. May be located. In addition, a fifth protrusion 230 and a sixth protrusion 240 may be positioned on the second side surface S2, and a seventh protrusion 250 and an eighth protrusion 260 may be disposed on the fourth side surface S4. May be located.

The first protrusion 210 and the second protrusion 310 may have different polarities, and the third protrusion 320 and the fourth protrusion 220 may have different polarities. In addition, the first protrusion 210, the fourth protrusion 220, the fifth protrusion 230, the sixth protrusion 240, the seventh protrusion 250, and the eighth protrusion may have the same polarity. The second protrusion 310 and the third protrusion 320 may have the same polarity.

The first protrusion 210 may face the sixth protrusion 240. The first protrusion 210 may face the sixth protrusion 240 spaced apart in a first direction. The second protrusion 310 may face the fifth protrusion 230. The second protrusion 310 may face the fifth protrusion 230 spaced apart in the first direction. The third protrusion 320 may face the eighth protrusion 260. The third protrusion 320 may face the eighth protrusion 260 spaced apart in a second direction. The fourth protrusion 220 may face the seventh protrusion 250. The fourth protrusion 220 may face the seventh protrusion 250 spaced apart in the second direction.

The first directional distance between the first protrusion 210 and the sixth protrusion 240 may correspond to the first directional distance between the second protrusion 310 and the fifth protrusion 230. The second direction distance between the third protrusion 320 and the eighth protrusion 260 may correspond to a second direction distance between the fourth protrusion 220 and the seventh protrusion 250. In addition, a first direction distance between the first protrusion 210 and the sixth protrusion 240 may be greater than a second direction distance between the third protrusion 320 and the eighth protrusion 260. In addition, a first direction distance between the second protrusion 310 and the fifth protrusion 230 may be greater than a second direction distance between the fourth protrusion 220 and the seventh protrusion 250.

The first protrusion 210 and the second protrusion 310 disposed on the first side surface S1 may be spaced apart by a first distance d1. The first distance d1 may be a distance between the center of the first protrusion 210 and the center of the second protrusion 310. The third protrusion 320 and the fourth protrusion 220 disposed on the third side surface S3 may be spaced apart by a second distance d2. The second distance d2 may be a distance between the centers of the third protrusion 320 and the fourth protrusion 220. The fifth protrusion 230 and the sixth protrusion 240 disposed on the second side surface S2 may be spaced apart by a third distance d3. The third distance d3 may be a distance between the center of the fifth protrusion 230 and the center of the sixth protrusion 240. The seventh protrusion 250 and the eighth protrusion 260 disposed on the fourth side surface S4 may be spaced apart by a fourth distance d4. The fourth distance d4 may be a distance between the center of the seventh protrusion 250 and the center of the eighth protrusion 260.

The first distance d1 may correspond to the third distance d3. The second distance d2 may correspond to the fourth distance d4. In addition, the first distance d1 may be different from the second distance d2. In detail, the first distance d1 may be smaller than the second distance d2.

Referring to FIG. 5, the protrusions may be bent from the end of each frame body to protrude in a branched shape. For example, the first protrusion 210 and the fourth to eighth protrusions 220, 230, 240, 250, and 260 protrude from the ends of the first bonding portion 205 in a branched manner. Can be. In detail, the first protrusion 210 may be bent at the end of the first bonding portion 205 and extend in the direction of the first side surface S1, and may protrude from the first side surface S1. The fourth protrusion 220 may be bent at an end of the body 110 of the first frame 200 to extend in the direction of the third side surface S3, and may protrude from the third side surface S3. . Each of the fifth protrusion 230 and the sixth protrusion 240 may be bent at an end of the first bonding portion 205 to extend in the direction of the second side surface S2, and the second side surface S2. Can protrude from). Each of the seventh protrusion 250 and the eighth protrusion 260 may be bent at an end of the first bonding part 205 to extend in the direction of the fourth side surface S4, and the fourth side surface S4. Can protrude from).

In addition, the second protrusion 310 and the third protrusion 320 may be bent and branched from the end of the second bonding portion 305. In detail, the second protrusion 310 may be bent at an end of the second bonding part 305 to extend in the direction of the first side surface S1, and may protrude from the first side surface S1. The third protrusion 320 may be bent from an end of the second bonding portion 305 to extend in the direction of the third side surface S3, and may protrude from the third side surface S3.

The height from the bottom surface of the body 110 to an upper surface of one protrusion selected from the first protrusion 210 and the fourth to eighth protrusions 220, 230, 240, 250, and 260 is the first height. The overall thickness of the first frame 200, for example, may be less than the height from the bottom surface of the body 110 to the top surface of the first frame 200. In addition, the height from the bottom surface of the body 110 to the top surface of one of the protrusions selected from the second protrusion 310 and the third protrusion 320 is, for example, the overall thickness of the second frame 300, for example. It may be less than the height from the bottom surface of the body 110 to the top surface of the second frame (300). That is, the bottom surface of the first protrusion 210 and the fourth to eighth protrusions 220, 230, 240, 250, and 260 may be lower than the bottom surface of the first bonding portion 205. In addition, a bottom surface of the second protrusion 310 and the third protrusion 320 may be lower than a bottom surface of the second bonding portion 305.

A portion of the body 110 may be disposed in an open area between the first protrusion 210 and the second protrusion 310. In addition, a portion of the body 110 may be disposed in an open area between the third protrusion 320 and the fourth protrusion 220. In addition, a part of the body 110 may be disposed in an open area between the fifth protrusion 230 and the sixth protrusion 240. In addition, a portion of the body 110 may be disposed in an open area between the seventh protrusion 250 and the eighth protrusion 260.

The first frame 200 may be exposed on the bottom surface of the body 110. For example, a portion of the first frame 200 may be exposed to the bottom surface of the body 110 by the through hole TH of the body 110. In detail, a part of the first bonding part 205 may be exposed by the through hole TH of the body 110. In addition, the first to eighth protrusions 210, 310, 320, 220, 230, 240, 250, and 260 may protrude from the body 110 to be exposed to the bottom surface of the body 110.

The bottom surface of the first bonding portion 205 exposed by the through hole TH of the body 110 may be located on the same surface as the bottom surface of the body 110.

In this case, the bottom surface area SA1 of the first bonding part 205 exposed by the through hole TH is about 15% to about 30% of the total surface area SA2 of the bottom surface of the body 110. Can be. In detail, the exposed bottom surface area SA1 of the first bonding part 205 may be about 18% to about 27% of the total bottom area SA2 of the body 110. Preferably, the exposed bottom surface area SA1 of the first bonding part 205 may be about 20% to about 25% of the total bottom area SA2 of the body 110. Here, the total area SA2 of the bottom surface of the body 110 is a region having a ring shape in which the first frame 200 and the second frame 300 are removed when the light emitting device package is viewed from the rear side. It can mean the area. When the area is less than 15%, the effect of improving heat dissipation characteristics may be insignificant. When the area is more than 30%, the ratio of the body 110 may be reduced, thereby reducing the reliability of the light emitting device package. That is, the area of the bottom surface of the exposed first frame 200 may be in the above-described range to improve reliability and heat dissipation characteristics.

In addition, an upper surface area of the first bonding portion 205 disposed on the bottom of the cavity 122 may be twice or more than an upper surface area of the second bonding portion 305 disposed on the bottom of the cavity 122. Accordingly, heat dissipation characteristics of the light emitting device package may be improved.

The bottom surface of each protrusion may be located on the same surface as the bottom surface of the body 110. Alternatively, the bottom surface of each protrusion may be located on a surface different from the bottom surface of the body 110. For example, the bottom surface of the protrusions may further protrude downward from the bottom surface of the body 110. Accordingly, there may be a step between the protrusions and the bottom surface.

At least one hole may be disposed in the first frame 200. For example, at least one hole may be disposed in the first bonding portion 205. In detail, at least one first hole TH1 may be disposed in the first bonding unit 205. In addition, at least one hole may be disposed in the second frame 300. For example, at least one hole may be disposed in the second bonding portion 305. In detail, at least one second hole TH2 may be disposed in the second bonding unit 305. The first hole TH1 and the second hole TH2 may be spaced apart from the first recess R1. The first hole TH1 and the second hole TH2 may be disposed at positions adjacent to the first recess R1. The body 110 may be disposed in the first hole TH1 and the second hole TH2.

The first hole TH1 and the second hole TH2 may have a shape of at least one of a circle, an ellipse, a rectangle, a triangle, and a polygon. The first hole TH1 and the second hole TH2 may have shapes corresponding to each other. In addition, the first hole TH1 may have a size corresponding to the second hole TH2. Here, the size may mean the diameter, width or width of the hole. The first frame 200 and the second frame 300 may be coupled to the body 110 through the first hole TH1 and the second hole TH2.

Step structures may be further disposed on the first frame 200 and the second frame 300 to strengthen coupling with the body 110. In addition, at least one hole may be further disposed in the first frame 200 to reinforce the bonding force with the body 110. For example, at least one third hole TH3 may be further disposed in the first frame 200, and at least one fourth hole TH4 may be further disposed in the second frame 300. have. The third hole TH3 may be disposed in the protrusion extending from the first bonding portion 205, and the fourth hole TH4 may be disposed in the protrusion extending from the second bonding portion 305. have.

The third hole TH3 and the fourth hole TH4 may have a shape of at least one of a circle, an ellipse, a rectangle, a triangle, and a polygon. The third hole TH3 and the fourth hole TH4 may have shapes corresponding to each other. In addition, the third hole TH3 and the fourth hole TH4 may have sizes corresponding to each other.

The third hole TH3 and the fourth hole TH4 may have a shape corresponding to the first hole TH1 and the second hole TH2. In addition, the third hole TH3 and the fourth hole TH4 may have sizes different from those of the first hole TH1 and the second hole TH2. For example, the size of the third hole TH3 and the fourth hole TH4 may be smaller than the size of the first hole TH1 and the second hole TH2. Here, the size may mean the diameter, width or width of the hole. The first frame 200 and the second frame 300 may be more strongly coupled to the body 110 through the first to fourth holes TH1, TH2, TH3, and TH4.

The first hole TH1 may be positioned adjacent to the fourth protrusion 220, the seventh protrusion 250, and the eighth protrusion 260. In addition, the third hole TH3 may be positioned adjacent to the first protrusion 210, the fifth protrusion 230, and the sixth protrusion 240. The second hole TH2 may be located adjacent to the third protrusion 320. In addition, the fourth hole TH4 may be positioned adjacent to the second protrusion 310.

In addition, the first to fourth holes TH1, TH2, TH3, and TH4 may be disposed in regions corresponding to the upper body 110. In detail, the first hole TH1 and the second hole TH2 may be disposed at positions corresponding to the upper body 110 in a vertical direction. In more detail, the first hole TH1 and the second hole TH2 may be disposed at positions overlapping the upper body 110 in the vertical direction.

In addition, the distance between the first hole TH1 and / or the second hole TH2 in the light emitting device 500 is the third hole TH3 and / or the fourth in the light emitting device 500. It may be shorter than the distance between the holes TH4. Accordingly, when the light emitting device package 1000 is viewed in a plan view, the first hole TH1, the second hole TH2, the third hole TH3, and the third hole are formed by the upper body 110. The four holes TH4 may not be visually recognized from the outside.

The light emitting device 500 may be disposed on the first frame 200. In detail, the light emitting device 500 may be disposed on the first bonding part 205. In more detail, the light emitting device 500 may be disposed on the first recess R1. The light emitting device 500 may be electrically connected to the first frame 200 and the second frame 300. The light emitting device 500 may be electrically connected to the first bonding portion 205 and the second bonding portion 305. The first electrode 91 and the second electrode 90 may be disposed on the light emitting device 500. In detail, a first electrode 91 may be disposed above the light emitting device 500, and a second electrode 90 may be disposed below the light emitting device 500. The second electrode 90 of the light emitting device 500 may face the first frame 200. In detail, the second electrode 90 may be electrically connected to the first frame 200. In addition, the first electrode 91 of the light emitting device 500 may be electrically connected to the second frame 300. In detail, the first electrode 91 of the light emitting device 500 may be electrically connected to the second frame 300 through a wire 550.

The light emitting device package 1000 according to the embodiment may further include a molding unit 190. The molding part 190 may be provided on the light emitting device 500. The molding part 190 may be disposed on the first frame 200 and the second frame 300. The molding part 190 may be disposed in the cavity 122 provided by the package body 100. The molding part 190 may be disposed in the cavity 122 and the first recess R1. The molding part 190 may be disposed to surround the light emitting device 500.

The molding part 190 may include an insulating material. In addition, the molding part 190 may include wavelength conversion means for receiving the light emitted from the light emitting device 500 and providing the wavelength-converted light. For example, the molding unit 190 may be at least one selected from the group including phosphors, quantum dots, and the like. The light emitting device 500 may emit light of yellow, blue, green, red, white, infrared or ultraviolet light. The phosphor or quantum dot may emit light of blue, green, and red. The molding part 190 may not be formed.

The phosphor disposed inside or below the molding unit 190 may include a phosphor of a fluoride compound, and may include, for example, at least one of an MGF phosphor, a KSF phosphor, or a KTF phosphor. The phosphor may emit light of different peak wavelengths, and the light emitted from the light emitting device may emit light of different yellow and red colors or different red peak wavelengths. One kind of the phosphor may include a red phosphor. The red phosphor may have a wavelength range of 610 nm to 650 nm, and the wavelength may have a half width of less than 10 nm. The red phosphor may include a fluoride phosphor. The fluorite-based phosphor is KSF red K ₂ SiF ₆ : Mn ⁴⁺ , K ₂ TiF ₆ : Mn ⁴⁺ , NaYF ₄ : Mn ⁴⁺ , NaGdF ₄ : Mn ⁴⁺ , K ₃ SiF ₇ : Mn ⁴⁺ It may include at least one of. For example, the KSF-based phosphor may have a composition formula of K _a Si _1-c F _b : Mn ⁴⁺ _c , wherein a is 1 ≦ a ≦ 2.5, b is 5 ≦ b ≦ 6.5, and c is 0.001 ≦ c <0.1 may be satisfied. In addition, the fluorite-based red phosphor may further include an organic coating on the surface of the fluoride or Mn-containing fluoride or the surface of the fluoride coating does not contain Mn in order to improve the reliability at high temperature / high humidity. Unlike the other phosphors, the above-described fluerite-based red phosphor may implement a narrow width of 10 nm or less, and thus may be utilized in a high resolution device.

The phosphor composition according to the embodiment should basically conform to stoichiometry, and each element may be substituted with another element in each group on the periodic table. For example, Sr may be substituted with Ba, Ca, Mg, etc. of the alkaline earth (II) group, and Y may be substituted with Tb, Lu, Sc, Gd, etc. of the lanthanide series. In addition, the active agent Eu, etc. may be substituted by Ce, Tb, Pr, Er, Yb, etc. according to a desired energy level, and an active agent alone or a deactivator may be additionally applied to modify properties.

The quantum dot phosphor may include a II-VI compound or a III-V compound semiconductor, and may emit red light. The quantum dot is, for example, ZnS, ZnSe, ZnTe, CdS , CdSe, CdTe, GaN, GaP, GaAs, GaSb, InP, InAs, In, Sb, AlS, AlP, AlAs, PbS, PbSe, Ge, Si, CuInS 2, Such as CuInSe ₂ and the like, and combinations thereof.

7 is a diagram illustrating an example of a light source module in which a light emitting device package is disposed on a substrate, and FIG. 8 is a diagram illustrating another example.

7 and 8, the light emitting device package 1000 according to the embodiment may be disposed on the substrate 600. The substrate 600 may be a circuit board. The circuit board 600 may be provided with a power supply circuit for controlling the driving of the light emitting device 500.

The substrate 600 may include a plurality of pads 611, 613, 615, and 617. In detail, the first frame 200 and the second frame 300 of the light emitting device package 1000 may be connected to the pads 611, 613, 615, and 617 of the substrate 600 by bonding. For example, protrusions of the first frame 200 and the second frame 300 may be positioned at positions corresponding to the pads 611, 613, 615, and 617 of the substrate 600. It may be connected to the bonding portion. Accordingly, the light emitting device 500 of the light emitting device package 1000 may receive power from each of the pads 611, 613, 615, and 617 of the substrate 600.

Each of the pads 611, 613, 615, 617 is at least one selected from the group consisting of Ti, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, P, Fe, Sn, Zn, Al It may include a material or an alloy thereof. In addition, each of the pads 611, 613, 615, and 617 may have a shape of at least one of a circle, an oval, a rectangle, a triangle, and a polygon.

Top surfaces of the pads 611, 613, 615, and 617 may be coplanar with the top surface of the substrate 600. Alternatively, the top surfaces of the pads 611, 613, 615, and 617 may be located on a plane different from the top surface of the substrate 600. For example, the top surfaces of the pads 611, 613, 615, and 617 may protrude from the top surface of the substrate 600 and be disposed higher than the top surface of the substrate 600.

The width in the first direction of each of the pads 611, 613, 615, 617 may be equal to or greater than the width in the first direction of each of the protrusions. Further, the width in the second direction of each of the pads 611, 613, 615, 617 may be equal to or greater than the width in the second direction of each of the protrusions. For example, the width in the first direction of the first pad 611 may be equal to or greater than the width in the first direction of one protrusion located at an upper portion thereof. In addition, the width in the second direction of the first pad 611 may be equal to or larger than the width in the second direction of one protrusion located at an upper portion thereof.

Referring to FIG. 7, the pad may include a first pad 611, a second pad 613, a third pad 615, and a fourth pad 617. For example, the first pad 611 may face the third pad 615 in a second direction, and the second pad 613 may face the fourth pad 617 in a second direction. can do. In addition, the first pad 611 may be spaced apart from the second pad 613 in a first direction. The third pad 615 may be spaced apart from the fourth pad 617 in a first direction.

The distance between the first directions of the first and second pads 611 and 613 may be shorter than the distance between the second directions of the first and third pads 611 and 615. That is, the distance between the centers of the first and second pads 611 and 613 may be shorter than the distance between the centers of the first and third pads 611 and 615.

The distance between the first direction of the first and second pads 611 and 613 may be shorter than the distance between the second direction of the second and fourth pads 615 and 617. That is, the distance between the centers of the first and second pads 611 and 613 may be shorter than the distance between the centers of the second and fourth pads 617 and 617.

The distance between the second directions of the first and third pads 611 and 615 may correspond to the distance between the second directions of the second and fourth pads 613 and 617. That is, the distance between the centers of the first and third pads 611 and 615 may be shorter than the distance between the centers of the second and fourth pads 613 and 617.

The pads 611, 613, 615, and 617 may be located in regions corresponding to protrusions of the first frame 200 and the second frame 300. In detail, the pads 611, 613, 615, and 617 may be disposed at positions overlapping the protrusions. For example, the first pad 611 may be located below the fourth protrusion 220, and the second pad 613 may be located below the third protrusion 320, and the third pad may be disposed on the third pad 320. 615 may be located under the seventh protrusion 250, and the fourth pad 617 may be located under the eighth protrusion 260. In addition, the pads 611, 613, 615, and 617 are positioned below the first protrusion 210, the second protrusion 310, the fifth protrusion 230, and the sixth protrusion 240. You can't.

Accordingly, the light emitting device 500 of the light emitting device package 1000 includes the first to fourth pads 611, 613, 615, and 617, the third protrusion 320, and the fourth protrusion 220. The power may be supplied by the seventh protrusion 250 and the eighth protrusion 260. In detail, the first pad 611, the third pad 615, and the fourth pad 617 may be connected to the second electrode 90 of the light emitting device package 1000, and the second pad ( 613 may be connected to the first electrode 91 of the light emitting device package 1000.

In addition, referring to FIG. 8, the pad may include a first pad 611, a second pad 613, a third pad 615, and a fourth pad 617. For example, the first pad 611 may face the third pad 615 in a first direction, and the second pad 613 may face the fourth pad 617 in a first direction. can do. In addition, the first pad 611 may be spaced apart from the second pad 613 in a second direction. The third pad 615 may be spaced apart from the fourth pad 617 in a second direction.

The distance between the second directions of the first and second pads 611 and 613 may be shorter than the distance between the first directions of the first and third pads 611 and 615. That is, the distance between the centers of the first and second pads 611 and 613 may be shorter than the distance between the centers of the first and third pads 611 and 615.

The distance between the second directions of the first and second pads 611 and 613 may be shorter than the distance between the first directions of the second and fourth pads 615 and 617. That is, the distance between the centers of the first and second pads 611 and 613 may be shorter than the distance between the centers of the second and fourth pads 617 and 617.

The distance between the first directions of the first and third pads 611 and 615 may correspond to the distance between the first directions of the second and fourth pads 613 and 617. That is, the distance between the centers of the first and third pads 611 and 615 may be shorter than the distance between the centers of the second and fourth pads 613 and 617.

The pads 611, 613, 615, and 617 may be located in regions corresponding to protrusions of the first frame 200 and the second frame 300. In detail, the pads 611, 613, 615, and 617 may be disposed at positions overlapping the protrusions. For example, the first pad 611 may be located below the fifth protrusion 230, and the second pad 613 may be located below the sixth protrusion 240. The third pad 615 may be located below the second protrusion 310, and the fourth pad 617 may be located below the first protrusion 210. In addition, the pads 611, 613, 615, and 617 are positioned under the third protrusion 320, the fourth protrusion 220, the seventh protrusion 250, and the eighth protrusion 260. You can't.

Accordingly, the light emitting device 500 of the light emitting device package 1000 may include the first to fourth pads 611, 613, 615, and 617, the first protrusion 210, and the second protrusion 310. The power may be supplied by the fifth protrusion 230 and the sixth protrusion 240. In detail, the first pad 611, the second pad 613, and the fourth pad 617 may be connected to the second electrode 90 of the light emitting device package 1000, and the third pad ( 615 may be connected to the first electrode 91 of the light emitting device package 1000.

That is, the light emitting device package 1000 according to the embodiment may correspond to a substrate of various sizes without changing the design of the circuit board or the package, and may be electrically connected.

9 is a side cross-sectional view showing an example of a light emitting device applied to the light emitting device package according to the embodiment.

Referring to FIG. 9, the light emitting device 500 includes a first electrode 91 electrically connected to the first conductive semiconductor layer 11 and a second conductive semiconductor layer 13 disposed below. It may have a structure in which the second electrode 90 is electrically connected.

The light emitting device 500 may include a first electrode 91, a light emitting structure 10, and a second electrode having a plurality of conductive layers 96, 97, 98, and 99 under the light emitting structure 10. have. The first electrode 91 may be disposed on the light emitting structure 10 and may have an electrode such as a branch pattern or a female pattern 91A. The second electrode 90 may be electrically connected to the first frame 200, and the first electrode 91 may be electrically connected to the second frame 300. For example, the first electrode 91 may be electrically connected to the second frame 300 through a wire 550.

The light emitting structure 10 may include a first conductive semiconductor layer 11, a second conductive semiconductor layer 13, and between the first conductive semiconductor layer 11 and the second conductive semiconductor layer 13. The active layer 13 may be included. The first conductive semiconductor layer 11 may be a semiconductor having an n-type dopant, and the second conductive semiconductor layer 13 may be a semiconductor having a p-type dopant. The light emitting structure 10 may be selectively formed from a compound semiconductor of Group II to Group V elements and Group III to Group V elements, and may emit a predetermined peak wavelength within a wavelength range of the ultraviolet band to the visible light band. The first conductive semiconductor layer 11 and the second conductive semiconductor layer 13 may be, for example, a semiconductor layer using a compound semiconductor of a group III-V group element, for example, GaN, InN, AlN, InGaN, AlGaN, InAlGaN. It may include at least one of, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, GaP. The active layer 13 includes a well layer / barrier layer, and the period of the well layer / barrier layer is, for example, InGaN / GaN, GaN / AlGaN, AlGaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, AlGaAs / GaA, At least one of a pair of InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, and InP / GaAs. The light emitting structure 10 may be implemented as any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure.

The second electrode 90 is disposed under the second conductive semiconductor layer 13 and includes a contact layer 96, a reflective layer 97, a bonding layer 98, and a conductive support member 99. The second electrode 90 may be electrically connected to the second conductive semiconductor layer 13.

The contact layer 96 is in contact with a semiconductor layer, for example, the second conductivity type semiconductor layer 13. The contact layer 96 may be a low conductive material such as ITO, IZO, IZTO, IAZO, IGZO, IGTO, AZO, ATO, or a metal of Ni and Ag. A reflective layer 97 is disposed below the contact layer 96, and the reflective layer 97 is composed of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, and a combination thereof. It may be formed into a structure including at least one layer of a material selected from the group. The reflective layer 97 may be in contact with the second conductive semiconductor layer 13, but is not limited thereto. A bonding layer 98 is disposed below the reflective layer 97, and the bonding layer 98 may be used as a barrier metal or a bonding metal, and the material may be, for example, Ti, Au, Sn, Ni, Cr, And at least one of Ga, In, Bi, Cu, Ag, and Ta and an optional alloy.

The lower passivation layer 83 and the current blocking layer 85 are disposed between the second conductive semiconductor layer 13 and the second electrode 90. The lower protective layer 83 may be formed along the bottom edge of the second conductive semiconductor layer 13 and may be formed in a ring shape, a loop shape, or a frame shape. The lower protective layer 83 may include a transparent conductive material or an insulating material, for example, ITO, IZO, IZTO, IAZO, IGZO, IGTO, AZO, ATO, SiO ₂ , SiOx, SiO _x N _y , Si ₃ N ₄ , It may include at least one of Al ₂ O ₃ , TiO ₂ . An inner portion of the lower passivation layer 83 is disposed under the second conductive semiconductor layer 13, and an outer portion is disposed outside the side of the light emitting structure 10. The current blocking layer 85 may be disposed between the second conductive semiconductor layer 13 and the contact layer 96 or the reflective layer 97. The current blocking layer 85 may include an insulating material, and for example, may include at least one of SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ . As another example, the current blocking layer 85 may also be formed of metal for Schottky contact.

The current blocking layer 85 is disposed to correspond to the thickness direction of the first electrode 91 and the light emitting structure 10 disposed on the light emitting structure 10. The current blocking layer 85 may block a current supplied from the second electrode 90 and diffuse it in another path. The current blocking layer 85 may be disposed in one or a plurality, and at least a portion or the entire area of the current blocking layer 85 may overlap with the first electrode 91.

A conductive support member 99 is formed below the bonding layer 98, and the conductive support member 99 may be formed as a conductive member, and the materials may be copper (copper) or gold (Au-gold). , Nickel (Ni-nickel), molybdenum (Mo), copper-tungsten (Cu-W), a carrier wafer (eg, Si, Ge, GaAs, ZnO, SiC, etc.) may be formed of a conductive material. As another example, the conductive support member 99 may be implemented as a conductive sheet.

An upper surface of the first conductive semiconductor layer 11 may be formed with a light extraction structure (not shown) such as roughness. An insulating layer 87 may be disposed on the surface of the semiconductor layer, but is not limited thereto. Accordingly, a light emitting chip having a vertical electrode structure having a first electrode 91 on the light emitting structure 10 and a conductive support member 99 below may be manufactured.

Meanwhile, the light emitting device package according to the embodiment may be applied to the light source device. In addition, the light source device may include a display device, a lighting device, a head lamp, or the like according to an industrial field. As an example of the light source device, the display device includes a bottom cover, a reflector disposed on the bottom cover, a light emitting module emitting light and including a light emitting element, and a light disposed in front of the reflector and guiding light emitted from the light emitting module to the front. An optical sheet including a light guide plate, prism sheets disposed in front of the light guide plate, a display panel disposed in front of the optical sheet, an image signal output circuit connected to the display panel and supplying an image signal to the display panel; It may include a color filter disposed in front. The bottom cover, the reflector, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit. In addition, the display device does not include a color filter and may have a structure in which light emitting devices emitting red, green, and blue light are disposed.

As another example of the light source device, the head lamp may include a light emitting module including a light emitting device package disposed on a substrate, a reflector reflecting light emitted from the light emitting module in a predetermined direction, for example, a front, and reflected by the reflector. It may include a lens for refracting the light forward, and a shade for blocking or reflecting a portion of the light reflected by the reflector toward the lens to achieve a light distribution pattern desired by the designer.

Another example of a light source device may include a lighting device, a cover, a light source module, a heat sink, a power supply, an inner case, and a socket. In addition, the light source device according to the embodiment may further include any one or more of the member and the holder. The light source module may include a light emitting device package according to an embodiment.

That is, the light emitting device package 1000 according to the embodiment may include a first frame 200 and a second frame 300, a part of the first frame 200 in which the light emitting device 500 is disposed It may be exposed to the bottom surface through the through hole TH of the body 110. Accordingly, the light emitting device package 1000 may effectively discharge heat, thereby improving heat dissipation characteristics. Therefore, it is possible to prevent the light emitting device 500 from falling off from the first frame 200 by the heat emitted from the light emitting device 500, thereby improving the reliability of the overall light emitting device package 1000. .

In addition, the light emitting device package 1000 according to the embodiment includes a body 110 including first to fourth side surfaces S1, S2, S3, and S4, and the first side surface S1 and the second side. The length of the first direction of the side surface S2 may be longer than the length of the third direction S3 and the second direction of the fourth side surface S4. In this case, the light emitting device package 1000 may include a first frame 200 and a second frame 300 including a plurality of protrusions, one by adjusting the interval between the protrusions protruding from each frame The package may be connected to various substrates 600. Accordingly, it is possible to correspond to and electrically connect the substrates of various sizes without changing the design of the circuit board and / or the design of the package. Therefore, manufacturing cost can be reduced and process efficiency can be improved.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (10)

A first frame including a first bonding part;
A second frame including a second bonding portion and spaced apart from the first frame;
A body disposed between the first frame and the second frame; And
It includes a light emitting element disposed on the first bonding portion,
The light emitting device is electrically connected to the first and second bonding portions,
The body includes a first side surface extending in a second direction and having a length in a second direction, and a third side surface extending in a first direction at one end of the first side surface and having a length in a first direction,
Each of the first and second frames includes at least one protrusion protruding from the first and third side surfaces, respectively. The method of claim 1,
The body,
A second side facing the first side in a first direction; And
Further comprising a fourth side facing the third side in a second direction,
A light emitting device package having a length in the second direction of the first and second side surfaces shorter than a length in the first direction of the third and fourth side surfaces. The method of claim 2,
The first frame,
A first protrusion protruding from the first side;
Fifth and sixth protrusions protruding from the second side surface;
A fourth protrusion protruding from the third side; And
A seventh protrusion and an eighth protrusion protruding from the fourth side;
The second frame,
A second protrusion protruding from the first side; And
The light emitting device package including a third protrusion protruding from the third side. The method of claim 3, wherein
The light emitting device package of claim 1, wherein a first direction gap between the first protrusion and the sixth protrusion is greater than a second direction gap between the fourth protrusion and the seventh protrusion. The method of claim 3, wherein
The bottom surface of the first protrusion and the fourth to eighth protrusions is lower than the bottom surface of the first bonding portion,
The bottom surface of the second protrusion and the third protrusion, the light emitting device package lower than the bottom surface of the second bonding portion. The method of claim 3, wherein
The distance between the center of the first protrusion and the second protrusion disposed on the first side, the light emitting device package is longer than the distance between the center of the third protrusion and the fourth protrusion disposed on the third side. The method of claim 1,
The planar area of the first frame is larger than the planar area of the second frame. A circuit board; And
A light emitting device package disposed on the circuit board;
The light emitting device package is a light source module according to claim 6. The method of claim 8,
The circuit board includes first to fourth pads spaced apart from each other,
The first pad is disposed at a position overlapping with the fourth protrusion in the vertical direction,
The second pad is disposed at a position overlapping with the third protrusion in the vertical direction,
The third pad is disposed at a position overlapping with the seventh protrusion in the vertical direction,
The fourth pad is disposed at a position overlapping with the eighth protrusion in the vertical direction. The method of claim 8,
The circuit board includes first to fourth pads spaced apart from each other,
The first pad is disposed at a position overlapping with the fifth protrusion in the vertical direction,
The second pad is disposed at a position overlapping with the sixth protrusion in the vertical direction,
The third pad is disposed at a position overlapping with the second protrusion in the vertical direction,
The fourth pad is disposed at a position overlapping the first protrusion in the vertical direction.

Images