KR20190092589A - 수지 조성물 및 전자 부품 장치 - Google Patents

수지 조성물 및 전자 부품 장치 Download PDF

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Publication number
KR20190092589A
KR20190092589A KR1020197021755A KR20197021755A KR20190092589A KR 20190092589 A KR20190092589 A KR 20190092589A KR 1020197021755 A KR1020197021755 A KR 1020197021755A KR 20197021755 A KR20197021755 A KR 20197021755A KR 20190092589 A KR20190092589 A KR 20190092589A
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KR
South Korea
Prior art keywords
inorganic
resin composition
resin
inorganic particles
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020197021755A
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English (en)
Korean (ko)
Inventor
동철 강
게이치 호리
마사시 야마우라
미카 다나카
Original Assignee
히타치가세이가부시끼가이샤
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Publication of KR20190092589A publication Critical patent/KR20190092589A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H01L23/295—
    • H01L23/31—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020197021755A 2016-12-27 2017-12-19 수지 조성물 및 전자 부품 장치 Ceased KR20190092589A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2016253847 2016-12-27
JPJP-P-2016-253846 2016-12-27
JP2016253846 2016-12-27
JPJP-P-2016-253847 2016-12-27
PCT/JP2017/045605 WO2018123745A1 (ja) 2016-12-27 2017-12-19 樹脂組成物及び電子部品装置

Publications (1)

Publication Number Publication Date
KR20190092589A true KR20190092589A (ko) 2019-08-07

Family

ID=62707715

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197021755A Ceased KR20190092589A (ko) 2016-12-27 2017-12-19 수지 조성물 및 전자 부품 장치

Country Status (5)

Country Link
US (1) US20200102454A1 (https=)
JP (3) JP7573358B2 (https=)
KR (1) KR20190092589A (https=)
TW (1) TWI897842B (https=)
WO (1) WO2018123745A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021048977A1 (ja) 2019-09-12 2021-03-18 昭和電工マテリアルズ株式会社 圧縮成形用封止材及び電子部品装置
JP7696121B2 (ja) * 2020-03-27 2025-06-20 パナソニックＩｐマネジメント株式会社 成形用樹脂組成物及び電子デバイス
JP7207610B2 (ja) * 2020-06-17 2023-01-18 日本製鉄株式会社 電磁鋼板用コーティング組成物、接着用表面被覆電磁鋼板及び積層鉄心
KR102855962B1 (ko) 2020-06-17 2025-09-05 닛폰세이테츠 가부시키가이샤 전자 강판용 코팅 조성물, 접착용 표면 피복 전자 강판 및 적층 철심

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09157497A (ja) 1995-12-06 1997-06-17 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び該樹脂組成物で封止した半導体装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07216197A (ja) * 1994-01-28 1995-08-15 Matsushita Electric Works Ltd エポキシ樹脂組成物の製造方法
JP3588539B2 (ja) * 1996-09-30 2004-11-10 株式会社東芝 ポリフェニレンサルファイド樹脂組成物、およびこれを用いた樹脂封止型半導体装置
JPH1192624A (ja) * 1997-09-18 1999-04-06 Toshiba Corp エポキシ樹脂組成物および樹脂封止型半導体装置
JP2000026742A (ja) * 1998-07-09 2000-01-25 Toshiba Chem Corp 封止用樹脂組成物および半導体装置
JP3446730B2 (ja) * 2000-09-26 2003-09-16 松下電工株式会社 エポキシ樹脂組成物及び半導体装置
JP2006045343A (ja) * 2004-08-04 2006-02-16 Yaskawa Electric Corp 注形用エポキシ樹脂組成物およびそれを用いた電動機用モールドコイル
JP5419338B2 (ja) * 2007-11-16 2014-02-19 日揮触媒化成株式会社 着色アルミナ・シリカ粒子、その製造方法および該粒子を配合してなる化粧料
JP2012224799A (ja) * 2011-04-22 2012-11-15 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および液状封止樹脂組成物を用いた半導体装置
JP2013014671A (ja) * 2011-07-01 2013-01-24 Hitachi Chemical Co Ltd 樹脂組成物シート、金属箔付樹脂組成物シート、メタルベース配線板材料、メタルベース配線板、及び電子部材
JP5928477B2 (ja) 2011-11-02 2016-06-01 日立化成株式会社 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板
JP2013103968A (ja) * 2011-11-11 2013-05-30 Sumitomo Chemical Co Ltd 熱可塑性樹脂組成物の製造方法及び成形体
WO2013146342A1 (ja) * 2012-03-26 2013-10-03 三菱樹脂株式会社 積層多孔フィルム、非水電解液二次電池用セパレータ、及び非水電解液二次電池
US9944787B2 (en) * 2012-03-30 2018-04-17 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and laminate
JP6477483B2 (ja) 2013-10-17 2019-03-06 住友ベークライト株式会社 エポキシ樹脂組成物、樹脂層付きキャリア材料、金属ベース回路基板および電子装置
JP6405981B2 (ja) * 2014-12-18 2018-10-17 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板及びプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09157497A (ja) 1995-12-06 1997-06-17 Hitachi Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び該樹脂組成物で封止した半導体装置

Also Published As

Publication number Publication date
TW201833233A (zh) 2018-09-16
JP7573358B2 (ja) 2024-10-25
JP2022125150A (ja) 2022-08-26
JP2024096265A (ja) 2024-07-12
US20200102454A1 (en) 2020-04-02
TWI897842B (zh) 2025-09-21
JPWO2018123745A1 (ja) 2019-10-31
WO2018123745A1 (ja) 2018-07-05

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