KR20190087173A - Negative-type Photosensitive Resin Composition - Google Patents

Abstract

The present invention relates to a negative photosensitive resin composition comprising: an alkali-soluble resin; a photopolymerizable compound; a photopolymerization initiator; and a solvent, wherein the alkali-soluble resin includes an oxetanyl group-containing repeating unit and an epoxy group-containing repeating unit, to a photocured film formed therefrom, and to an image display device. The negative photosensitive resin composition according to the present invention is capable of low temperature curing, and has excellent adhesion, chemical resistance and reliability for chemical treatment used in a post process.

Description

[0001] Negative-type Photosensitive Resin Composition [

More particularly, the present invention relates to a negative photosensitive resin composition which is capable of curing at low temperature and which is excellent in adhesion, chemical resistance, and reliability against chemical treatments used in a post-process, and a negative photosensitive resin composition And an image display apparatus including the photo-curable film.

In the display field, the photosensitive resin composition is used for forming various photocured films such as a photoresist, an insulating film, a protective film, a black matrix, and a column spacer.

The pattern formation by the photosensitive resin composition is classified into a positive type and a negative type according to the solubility of the photosensitive portion in development. In the positive type photoresist, the exposed portion is dissolved by the developing solution, and the negative type photoresist is a method in which the exposed portion is not dissolved in the developing solution and the unexposed portion is dissolved to form a pattern. In the positive type and negative type, A binder resin, a cross-linking agent, and the like.

2. Description of the Related Art Recently, the use of a touch screen equipped with a touch panel has been explosively increased. Recently, a flexible touch screen has received much attention. As a result, substrates such as various substrates used in the touch screen must have flexible characteristics, so that usable materials are also limited by flexible polymer materials, and manufacturing processes are also required to be performed under milder conditions have.

Accordingly, the curing conditions of the photosensitive resin composition also require the low-temperature curing in the conventional high-temperature curing. Also, when cured under mild conditions, properties such as excellent adhesion, chemical resistance, and reliability with respect to chemical treatments used in post-processes are required.

Korean Patent No. 10-1302508 discloses a negative photosensitive resin composition having a polymerized copolymer using a cyclohexenyl acrylate monomer and having improved heat resistance and light resistance and improved sensitivity. However, the negative photosensitive resin composition does not exhibit the adhesion, chemical resistance, and / or reliability required for the chemical treatment used in post-processing at low temperature curing.

Korean Patent No. 10-1302508

An object of the present invention is to provide a negative photosensitive resin composition which is capable of low-temperature curing and is excellent in adhesion, chemical resistance, and reliability to a chemical treatment used in a post-process.

Another object of the present invention is to provide a photocurable film formed from the above negative-type photosensitive resin composition.

Still another object of the present invention is to provide an image display device including the photocurable film.

On the other hand, the present invention is a negative photosensitive resin composition comprising an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator and a solvent, wherein the alkali-soluble resin is a negative-type photosensitive resin containing a repeating unit represented by the following general formulas Lt; / RTI >

[Chemical Formula 1]

(2)

In this formula,

R ¹ and R ⁴ are each independently hydrogen or methyl,

R ² and R ⁵ are each independently a C ₁ -C ₁₀ alkylene group or a C ₁ -C ₁₀ oxyalkylene group or is absent,

R ³ is hydrogen or a C ₁ -C ₁₀ alkyl group.

On the other hand, the present invention provides a photocurable film formed from the negative photosensitive resin composition.

On the other hand, the present invention provides an image display device including the photocurable film.

The negative-working photosensitive resin composition according to the present invention is capable of curing at a low temperature, and is excellent in adhesion, chemical resistance, and reliability with respect to a chemical treatment used in a post-process.

Hereinafter, the present invention will be described in more detail.

An embodiment of the present invention is a negative-working photosensitive resin composition comprising an alkali-soluble resin (A), a photopolymerizable compound (B), a photopolymerization initiator (C) and a solvent (D) A silyl group-containing repeating unit, a silyl group-containing silyl group-containing repeating unit, a silyl group-containing silyl group-containing silyl group-containing silyl group-

The alkali-soluble resin (A)

In one embodiment of the present invention, the alkali-soluble resin has a reactivity due to the action of light or heat, and is a component that imparts solubility to an alkali developer used in a development process when forming a pattern.

The alkali-soluble resin includes an oxetanyl-containing repeating unit represented by the following formula (1) and an epoxy group-containing repeating unit represented by the following formula (2).

[Chemical Formula 1]

(2)

In this formula,

R ¹ and R ⁴ are each independently hydrogen or methyl,

R ² and R ⁵ are each independently a C ₁ -C ₁₀ alkylene group or a C ₁ -C ₁₀ oxyalkylene group or is absent,

R ³ is hydrogen or a C ₁ -C ₁₀ alkyl group.

As used herein, a C ₁ -C ₁₀ alkylene group means a linear or branched divalent hydrocarbon having 1 to 10 carbon atoms and includes, for example, methylene, ethylene, propylene, butylene, pentylene, hexylene But are not limited thereto.

As used herein, the C ₁ -C ₁₀ oxyalkylene group means a functional group in which at least one of the chain carbons in the linear or branched divalent hydrocarbon having 1 to 10 carbon atoms is substituted with oxygen, But are not limited to, methylene, oxyethylene, oxypropylene, oxybutylene, oxypentylene, oxyhexylene, and the like.

As used herein, a C ₁ -C ₁₀ alkyl group means a linear or branched monovalent hydrocarbon group having 1 to 10 carbon atoms, and examples thereof include methyl, ethyl, n-propyl, i-propyl, n-butyl , i-butyl, t-butyl, n-pentyl, n-hexyl, and the like.

In one embodiment of the present invention, the repeating unit represented by the above-mentioned formula (1) is a compound wherein R ¹ is hydrogen or methyl, R ² is a C ₁ -C ₁₀ alkylene group, and R ³ is a C ₁ -C ₁₀ alkyl group .

In one embodiment of the present invention, the repeating unit represented by the formula (2) may be such that R ⁴ is hydrogen or methyl, and R ⁵ is a C ₁ -C ₁₀ alkylene group.

The epoxy group-containing repeating unit represented by the above formula (2) plays a role of thermosetting reaction in the prebaking to form a temporary hardening film, and the oxetanyl group-containing repeating unit represented by the above formula (1) reacts rapidly during post- It increases the degree of crosslinking. Accordingly, the oxetanyl group-containing repeating unit represented by the formula (1) and the epoxy group-containing repeating unit represented by the formula (2) improve adhesion and chemical resistance to a substrate such as a metal substrate and enable low temperature curing.

The repeating unit represented by the above formula (1) may be contained in an amount of 10 to 40 mol% based on 100 mol% of all the repeating units constituting the alkali-soluble resin. When the repeating unit represented by the above-mentioned formula (1) is contained in the above-mentioned mol% range, the adhesion of the cured film can be improved and an appropriate resolution can be realized.

The repeating unit represented by the formula (2) may be contained in an amount of 30 to 60 mol% based on 100 mol% of all the repeating units constituting the alkali-soluble resin. When the repeating unit represented by the above formula (2) is contained in the above-mentioned mol% range, the adhesion of the cured film can be improved and an appropriate resolution can be realized.

In one embodiment of the present invention, the alkali-soluble resin may further include a repeating unit represented by the following formula (3).

(3)

In this formula,

R < ⁶ > is hydrogen or methyl,

R ⁷ is a C ₁ -C ₁₀ alkylene group or a C ₁ -C ₁₀ oxyalkylene group or is absent,

p is 0 or 1;

In one embodiment of the present invention, the repeating unit represented by the general formula (3) is such that R ⁶ is hydrogen or methyl, R ⁷ is absent, and p is 0 or 1.

The repeating unit represented by the above formula (3) may be contained in an amount of 5 to 30 mol% based on 100 mol% of all the repeating units constituting the alkali-soluble resin.

The alkali-soluble resin may contain a carboxyl group-containing repeating unit to ensure solubility in an alkali developing solution.

The carboxyl group-containing repeating unit may be introduced by an ethylenically unsaturated monomer having a carboxyl group. Specific examples of the ethylenically unsaturated monomer having a carboxyl group include monocarboxylic acids such as acrylic acid, methacrylic acid and crotonic acid; Dicarboxylic acids such as fumaric acid, mesaconic acid and itaconic acid; And anhydrides of these dicarboxylic acids; (meth) acrylates of a polymer having a carboxyl group and a hydroxyl group at both terminals such as? -carboxypolycaprolactone mono (meth) acrylate, and acrylic acid and methacrylic acid are preferable.

The carboxyl group-containing repeating unit may be contained in an amount of 5 to 20 mol% based on 100 mol% of all the repeating units constituting the alkali-soluble resin.

The alkali-soluble resin may be a block copolymer in which the repeating units represented by the formulas (1) to (3) and the carboxyl group-containing repeating unit are repeatedly repeated, or may be a random copolymer in which these repeating units are randomly repeated.

In the present invention, the repeating unit or compound represented by the formula includes the repeating unit or the isomer of the compound, and when the repeating unit represented by each formula or the isomer of the compound is present, the repeating unit or compound represented by the formula Compounds also include their isomers.

The acid value of the alkali-soluble resin is preferably in the range of 20 to 200 (KOH mg / g), for example, 50 to 100 (KOH mg / g). When the acid value is in the above range, excellent developability and long-term stability can be obtained.

The weight average molecular weight (hereinafter simply referred to as "weight average molecular weight") of the polymer in terms of polystyrene measured by gel permeation chromatography (GPC; tetrahydrofuran as an elution solvent) is 3,000 to 100,000, preferably 5,000 to 50,000 Alkali-soluble resins are preferable. When the molecular weight is within the above range, the hardness of the coating film is improved, the residual film ratio is high, the solubility of the non-exposed portion in the developer is excellent, and the resolution tends to be improved.

The molecular weight distribution (weight average molecular weight (Mw) / number average molecular weight (Mn)) of the alkali-soluble resin is preferably 1.5 to 6.0, more preferably 1.8 to 4.0. When the molecular weight distribution is from 1.5 to 6.0, the developing property is excellent.

The alkali-soluble resin may be contained in an amount of 10 to 90% by weight, preferably 25 to 70% by weight, based on 100% by weight of the total solid content in the negative-working photosensitive resin composition. When the alkali-soluble resin is contained in the above-described range, the photocurable film having excellent mechanical properties can be formed because the solubility in a developing solution is sufficient and the developability is excellent.

Photopolymerization  The compound (B)

In one embodiment of the present invention, the photopolymerizable compound (B) increases the crosslinking density during the manufacturing process and enhances the mechanical properties of the photocurable film.

The photopolymerizable compound is a compound that can be polymerized by the action of light and a photopolymerization initiator described later, and examples thereof include monofunctional monomers, bifunctional monomers, and other polyfunctional monomers.

Specific examples of monofunctional monomers include nonylphenylcarbitol acrylate, 2-hydroxy-3-phenoxypropyl acrylate, 2-ethylhexylcarbitol acrylate, 2-hydroxyethyl acrylate, N- Ralidon, and the like.

Specific examples of the bifunctional monomer include 1,6-hexanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) , Bis (acryloyloxyethyl) ether of bisphenol A, 3-methylpentanediol di (meth) acrylate, and the like.

Specific examples of other polyfunctional monomers include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) Dipentaerythritol hexa (meth) acrylate, and the like.

Of these, multifunctional monomers having two or more functional groups are preferably used.

The content of the photopolymerizable compound is not particularly limited, but is preferably 5 to 45% by weight, more preferably 7 to 45% by weight, based on 100% by weight of the total solid content in the negative-working photosensitive resin composition More preferable. When the photopolymerizable compound is contained in the above content range, it can have excellent durability and can improve developability.

Light curing Initiator (C)

In one embodiment of the present invention, the photopolymerization initiator (C) can be used without any particular limitation as long as it can polymerize the photopolymerizable compound (B). In particular, the photopolymerization initiator (C) is preferably selected from the group consisting of an acetophenone-based compound, a benzophenone-based compound, a triazine-based compound, a nonimidazole-based compound, an oxime- It is preferable to use at least one compound selected from the group consisting of thioxanthone compounds.

Specific examples of the acetophenone-based compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethylketal, 2-hydroxy- 1- [4- 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one, 2-methylcyclohexyl phenyl ketone, 2-methyl-1- [4- (1-methylvinyl) phenyl] propane-1-one 2- (4-methylbenzyl) -2- (dimethylamino) -1- (4-morpholinophenyl) butan-1-one.

Examples of the benzophenone compound include benzophenone, methyl 0-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 3,3 ', 4,4'-tetra tert-butylperoxycarbonyl) benzophenone, 2,4,6-trimethylbenzophenone, and the like.

Specific examples of the triazine compound include 2,4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6 - (4-methoxynaphthyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-piperonyl-1,3,5-triazine, (Trichloromethyl) -6- [2- (5-methylfuran-2- (4-methoxystyryl) -1,3,5-triazine, Yl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (furan- , 2,4-bis (trichloromethyl) -6- [2- (4-diethylamino-2-methylphenyl) ethenyl] -1,3,5-triazine, 2,4- ) -6- [2- (3,4-dimethoxyphenyl) ethenyl] -1,3,5-triazine.

Specific examples of the imidazole-based compound include 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'- Dichlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (2-chlorophenyl) -4,4', 5,5'-tetra (alkoxyphenyl) Bis (2,6-dichlorophenyl) -4, 5,5'-tetra (trialkoxyphenyl) bimidazole, 2,2- , 4 ', 5,5'-tetraphenyl-1,2'-biimidazole or a nonimidazole compound in which the phenyl group at the 4,4', 5,5 'position is substituted by a carboalkoxy group have. Among them, 2,2'-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis (2,3- , 2,2-bis (2,6-dichlorophenyl) -4,4 ', 5,5'-tetraphenyl-1,2'-biimidazole, Is used.

Specific examples of the oxime-based compound include o-ethoxycarbonyl- alpha -oximimino-1-phenylpropan-1-one, 1,2-octanedione, 1- (4-phenylthio) (o-benzoyloxime), ethanone, 1- (9-ethyl) -6- (2-methylbenzoyl) CGI-124 (Ciba-Gai article), CGI-224 (Shiba Gai article), Igakure OXE-01 (BASF company), Igakure OXE-02 (BASF company), N-1919 Adeca).

Examples of the thioxanthone compound include 2-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4- .

The photopolymerization initiator may further include a photopolymerization initiator to improve the sensitivity of the negative photosensitive resin composition of the present invention. The negative-working photosensitive resin composition according to the present invention contains a photopolymerization initiation auxiliary agent, so that the sensitivity can be further increased and productivity can be improved.

As the photopolymerization initiation assistant, for example, at least one compound selected from the group consisting of an amine compound, a carboxylic acid compound and an organic sulfur compound having a thiol group can be preferably used.

Specific examples of the amine compound include aliphatic amine compounds such as triethanolamine, methyldiethanolamine and triisopropanolamine; aliphatic amines such as methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-ethylhexyl aminobenzoate, 2-dimethylaminoethyl benzoate, N, N-dimethylparatoluidine, 4,4'-bis (dimethylamino) benzophenone (commonly known as Michler's ketone), 4,4'- Ethylamino) benzophenone, and it is particularly preferable to use an aromatic amine compound.

The carboxylic acid compound is preferably an aromatic heteroacetic acid, and more specifically, it is preferably an aromatic heteroaromatic acid such as phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylthioacetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthio Acetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, N-phenylglycine, phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, naphthoxyacetic acid and the like.

Specific examples of the organic sulfur compound having a thiol group include 2-mercaptobenzothiazole, 1,4-bis (3-mercaptobutyryloxy) butane, 1,3,5-tris (3-mercaptobutyloxyethyl) Triazine-2,4,6 (1H, 3H, 5H) -thione, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis Butyrate), pentaerythritol tetrakis (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate) .

The photopolymerization initiator may be contained in an amount of 0.1 to 40 parts by weight, preferably 1 to 30 parts by weight, based on 100 parts by weight of the total amount of the alkali-soluble resin and the photopolymerizable compound. When the photopolymerization initiator is contained within the above range, the sensitivity of the negative photosensitive resin composition becomes high and the exposure time is shortened, so that productivity is improved and high resolution can be maintained.

When the photopolymerization initiator is further used, the photopolymerization initiator may be added in an amount of 0.1 to 40 parts by weight, preferably 1 to 30 parts by weight based on 100 parts by weight of the total amount of the alkali-soluble resin and the photopolymerizable compound. When the amount of the photopolymerization initiator is within the above range, the sensitivity of the negative photosensitive resin composition becomes higher, and the productivity of the photocurable film formed using the composition can be improved.

Solvent (D)

In one embodiment of the present invention, the solvent (D) is not particularly limited and may be used without limitation as long as it is commonly used in the art.

Specific examples of the solvent include ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene glycol monobutyl ether; Diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether and diethylene glycol dibutyl ether; Ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate; Alkylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate and methoxypentyl acetate; Aromatic hydrocarbons such as benzene, toluene, xylene, and mesitylene; Ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, and cyclohexanone; Alcohols such as ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol and glycerin; Esters such as ethyl 3-ethoxypropionate and methyl 3-methoxypropionate; and cyclic esters such as? -butyrolactone.

The solvent is preferably an organic solvent having a boiling point of 100 ° C to 200 ° C, more preferably an alkylene glycol alkyl ether acetate, a ketone or an ester, and the solvent is preferably propylene glycol monomethyl ether acetate, propylene glycol More preferred are monoethyl ether acetate, cyclohexanone, ethyl 3-ethoxypropionate and methyl 3-methoxypropionate. These solvents may be used alone or in combination of two or more.

The solvent may be contained in an amount of 40 to 95% by weight, preferably 45 to 85% by weight based on 100% by weight of the total of the negative photosensitive resin composition. When the content of the solvent satisfies the above range, the coating property tends to be good when applied with a coating apparatus such as a roll coater, a spin coater, a slit and spin coater, a slit coater (sometimes referred to as a die coater) Therefore, it is desirable.

Additive (E)

The negative-type photosensitive resin composition according to one embodiment of the present invention may contain other polymer compounds, curing agents, surfactants, adhesion promoters, antioxidants, ultraviolet absorbers, An additive such as an anti-aggregation agent may be used in combination.

Specific examples of the other polymer compound include a curable resin such as epoxy resin and maleimide resin, a thermoplastic resin such as polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester, polyurethane and the like .

The curing agent is used for deep curing and for increasing mechanical strength. Specific examples of the curing agent include an epoxy compound, a polyfunctional isocyanate compound, a melamine compound, and an oxetane compound.

Specific examples of the epoxy compound in the curing agent include bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated bisphenol F epoxy resin, novolac epoxy resin, other aromatic epoxy resin, alicyclic epoxy Aliphatic, alicyclic or aromatic epoxy compounds other than the brominated derivatives, epoxy resins and brominated derivatives of such epoxy resins, butadiene (co) polymeric epoxides, isoprene (co) polymeric epoxy resins, glycidyl ester resins, glycidyl amine resins, (Co) polymer epoxides, glycidyl (meth) acrylate (co) polymers, and triglycidyl isocyanurate.

Specific examples of the oxetane compound in the curing agent include carbonate bisoxetane, xylene bisoxetane, adipate bisoxetane, terephthalate bisoxetane, and cyclohexanedicarboxylic acid bisoxetane.

The curing agents exemplified above may be used alone or in combination of two or more.

The curing agent may be used together with a curing agent in combination with a curing auxiliary compound capable of ring-opening polymerization of the epoxy group of the epoxy compound and the oxetane skeleton of the oxetane compound. The curing assistant compound includes, for example, polyvalent carboxylic acids, polyvalent carboxylic anhydrides, and acid generators. The polyvalent carboxylic acid anhydrides may be those commercially available as an epoxy resin curing agent. Specific examples of the above-mentioned epoxy resin curing agent include epoxy resin curing agents such as epoxy resins, epoxy resins, epoxy resins, epoxy resins, epoxy resins, epoxy resins, Manufactured by Japan Ehwa Co., Ltd.).

The surfactant may be used to further improve film-forming properties of the photosensitive resin composition, and a fluorine-based surfactant or a silicone-based surfactant may be preferably used.

Examples of the silicone surfactant include DC3PA, DC7PA, SH11PA, SH21PA and SH8400 from Dow Corning Toray Silicone Co., Ltd. and TSF-4440, TSF-4300, TSF-4445, TSF-4446 and TSF-4460 , And TSF-4452. Examples of the fluorine-based surfactant include Megapis F-470, F-471, F-475, F-482 and F-489 commercially available from Dainippon Ink and Chemicals, Incorporated. The above-exemplified surfactants may be used alone or in combination of two or more.

Specific examples of the adhesion promoter include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, N- Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- ( 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3- 3-isocyanatopropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, and the like. The adhesion promoters exemplified above may be used alone or in combination of two or more.

Specific examples of the antioxidant include 2,2'-thiobis (4-methyl-6-t-butylphenol) and 2,6-di-t-butyl-4-methylphenol.

Specific examples of the ultraviolet absorber include 2- (3-t-butyl-2-hydroxy-5-methylphenyl) -5-chlorobenzotriazole and alkoxybenzophenone.

Specific examples of the anti-aggregation agent include sodium polyacrylate and the like.

One embodiment of the present invention relates to a photocurable film formed using the above-described negative photosensitive resin composition.

The photocurable film may be used as an array planarizing film, a protective film, an insulating film, or the like, and may be used as a photoresist pattern, a black matrix pattern, a column spacer pattern, a black column spacer pattern, It is very suitable as a photoresist pattern.

The photocurable film according to an embodiment of the present invention can be produced by applying the above-described negative photosensitive resin composition on a substrate and exposing the substrate, and further performing development as needed to form a pattern.

First, the negative photosensitive resin composition of the present invention is coated on a substrate and then heated and dried to remove volatile components such as a solvent to obtain a smooth coated film.

After the application, it is heated and dried (prebaking) or reduced-pressure drying, followed by heating to volatilize volatile components such as solvents. The heating temperature is 70 to 150 DEG C which is relatively low. The thickness of the coating film after heat drying is usually about 1 to 8 mu m.

Ultraviolet rays are irradiated to the coating film thus obtained. In the case of patterning, ultraviolet rays are irradiated through a mask for forming a desired pattern. At this time, it is preferable to use an apparatus such as a mask aligner or a stepper to uniformly irradiate a parallel light beam onto the entire exposed portion and accurately align the mask and the substrate. When ultraviolet light is irradiated, the site irradiated with ultraviolet light is cured.

The ultraviolet rays may be g-line (wavelength: 436 nm), h-line, i-line (wavelength: 365 nm), or the like. The irradiation amount of ultraviolet rays can be appropriately selected according to need.

In the case of patterning, a step of dissolving the non-visible portion and developing it by contacting the coated film after curing with a developer can be further performed.

The developing method may be any of a liquid addition method, a dipping method, and a spraying method. Further, the substrate may be inclined at an arbitrary angle during development.

After development, the substrate is post-baked for 10 to 60 minutes at 70 to 100 ° C, which is relatively low temperature.

One embodiment of the present invention relates to an image display apparatus including the photocurable film described above. The image display device may include a liquid crystal display device, an OLED, a flexible display, and the like, but the present invention is not limited thereto and may include all image display devices known to those skilled in the art.

Hereinafter, the present invention will be described more specifically with reference to Examples, Comparative Examples and Experimental Examples. It should be apparent to those skilled in the art that these examples, comparative examples and experimental examples are only for illustrating the present invention, and the scope of the present invention is not limited thereto.

Manufacturing example  1: Preparation of alkali-soluble resin (A-1)

A 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer was charged with nitrogen at 0.02 L / min to make a nitrogen atmosphere, and 200 g of diethylene glycol methyl ethyl ether was added and heated to 70 캜 with stirring. Subsequently, 33.0 g (0.15 mol) of a mixture of the compounds represented by the following formulas (a) and (b) (molar ratio of 50:50), 44.2 g (0.24 mol) of (3-ethyl-3-oxetanyl) methyl methacrylate, 71.1 g (0.50 mol) of glycidyl methacrylate and 9.5 g (0.11 mol) of methacrylic acid were dissolved in 200 g of diethylene glycol methyl ethyl ether to prepare a solution.

(A)

[Formula b]

The prepared solution was dropped into a flask using a dropping funnel, 27.9 g (0.11 mol) of polymerization initiator 2,2'-azobis (2,4-dimethylvaleronitrile) was added to 150 g of diethylene glycol methyl ethyl ether The dissolved solution was added dropwise to the flask over 4 hours using a separate dropping funnel. After completion of the dropwise addition of the polymerization initiator solution, the mixture was maintained at 70 DEG C for 4 hours, and then cooled to room temperature to obtain a copolymer resin (A) having a solid content of 35.6% by weight and an acid value of 69 mgKOH / g -1). The obtained resin (A-1) had a weight average molecular weight (Mw) of 7,850 and a molecular weight distribution (Mw / Mn) of 1.90.

Manufacturing example  2: Preparation of alkali-soluble resin (A-2)

(3-ethyl-3-oxetanyl) methyl methacrylate instead of 44.2 g (0.24 mol) of (3-ethyl-3-oxetanyl) methyl methacrylate and 71.1 g (0.50 mol) of glycidyl methacrylate (A-2) was prepared in the same manner as in Preparation Example 1, except for using 62.6 g (0.34 mol) of 2,2'-biphenyltetrahydrophthalic anhydride and 56.9 g (0.40 mol) of glycidyl methacrylate. The resulting resin (A-2) had a solid content of 35.1 wt%, a solid acid value of 67 mgKOH / g, a weight average molecular weight (Mw) of 8,500 and a molecular weight distribution (Mw / Mn) of 1.85.

Manufacturing example  3: Preparation of alkali-soluble resin (A-3)

Except that 30.9 g (0.15 mol) of dicyclopentanyl acrylate was used instead of 33.0 g (0.15 mol) of the mixture of the compounds represented by the general formulas (a) and (b) (the molar ratio was 50:50) To prepare a copolymer resin (A-3). The resulting resin (A-3) had a solid content of 34.6 wt%, a solid acid value of 71 mgKOH / g, a weight average molecular weight (Mw) of 10,900 and a molecular weight distribution (Mw / Mn) of 1.98.

Manufacturing example  4: Preparation of alkali-soluble resin (A-4)

33.0 g (0.15 mol) of a mixture of the compounds represented by the general formulas (a) and (b) (molar ratio of 50:50), 44.2 g (0.24 mol) of (3-ethyl-3-oxetanyl) methyl methacrylate, 132.2 g (0.60 mol) of a mixture of the compounds represented by the general formulas (a) and (b) (50 mol%) and (3-ethyl (meth) acrylate) instead of 71.1 g (0.50 mol) (A-4) was obtained in the same manner as in Preparation Example 1, except that 55.3 g (0.30 mol) of methyl methacrylate and 8.6 g (0.10 mol) . The resulting resin (A-4) had a solid content of 35.9% by weight, a solid acid value of 62 mgKOH / g, a weight average molecular weight (Mw) of 8,570 and a molecular weight distribution (Mw / Mn) of 1.83.

Manufacturing example  5: Preparation of alkali-soluble resin (A-5)

33.0 g (0.15 mol) of a mixture of the compounds represented by the general formulas (a) and (b) (molar ratio of 50:50), 44.2 g (0.24 mol) of (3-ethyl-3-oxetanyl) methyl methacrylate, Instead of 71.1 g (0.50 mol) of methacrylate and 9.5 g (0.11 mol) of methacrylic acid, 132.2 g (0.60 mol) of a mixture of the compounds represented by the general formulas a and b (molar ratio 50:50) Copolymer resin (A-5) was prepared in the same manner as in Preparation Example 1 except that 42.6 g (0.30 mol) of acrylate and 8.6 g (0.10 mol) of methacrylic acid were used. The prepared resin (A-5) had a solid content of 32.0% by weight, a solid acid value of 58 mgKOH / g, a weight average molecular weight (Mw) of 7,560 and a molecular weight distribution (Mw / Mn) of 1.90.

Example  1 to 3 and Comparative Example  One: Negative  Preparation of Photosensitive Resin Composition

Each component was mixed with the composition shown in Table 1 below to prepare a negative photosensitive resin composition (unit: wt%).

Example 1 Example 2 Example 3 Comparative Example 1 Alkali-soluble resin A-1 16.8 - - - A-2 - 16.8 - - A-3 - - 16.8 - A-4 - - - 8.4 A-5 8.4 Photopolymerizable compound B-1 11.2 11.2 11.2 11.2 Photopolymerization initiator C-1 0.7 0.7 0.7 0.7 additive E-1 One One One One E-2 One One One One solvent D-1 69.3 69.3 69.3 69.3

A-1: An alkali-soluble resin of Production Example 1

A-2: An alkali-soluble resin of Production Example 2

A-3: An alkali-soluble resin of Production Example 3

A-4: An alkali-soluble resin of Production Example 4

A-5: An alkali-soluble resin of Production Example 5

B-1: Dipentaerythritol hexaacrylate (KAYARAD DPHA: Nippon Yakuza Co., Ltd.)

C-1: IGACURE OXE-01 (BASF)

D-1: Propylene glycol monomethyl ether acetate (PGMEA)

E-1: Silicone surfactant, SH8400 (Dow Corning Toray Silicone Co., Ltd.)

E-2: adhesion promoter, KBM-403 (Shin-Etsu Silicone Co., Ltd.)

Experimental Example  One

The photocurable films were prepared as follows using the negative photosensitive resin compositions prepared in Examples and Comparative Examples. The adhesiveness, surface damage and film shrinkage were measured by the following methods, and the results are shown in Table 2 below. Respectively.

≪ Preparation of photocurable film &

A glass substrate (Eagle 2000, manufactured by Corning) having a thickness of 2 inches on each of which an ITO film was formed was sequentially washed with a neutral detergent, water and alcohol, and then dried. The negative photosensitive resin composition was spin-coated on the glass substrate, and then pre-baked at 80 DEG C for 120 seconds using a hot plate. The prebaked substrate was cooled to room temperature and light was irradiated at an exposure dose of 60 mJ / cm 2 (based on 365 nm) using an exposure machine (UX-1100SM, Ushio Co., Ltd.) with an interval of 150 μm from the quartz glass photomask Respectively.

At this time, a photomask was used in which openings (hole patterns) each having a square pattern of 30 mu m in length and width were formed on the same plane with a gap of 100 mu m.

After the light irradiation, the coating film was immersed in an aqueous developing solution containing 0.12% by weight of a nonionic surfactant and 0.04% by weight of potassium hydroxide for 60 seconds at 25 캜 for development, washed with water and post baked at 90 캜 for 1 hour.

(1) Adhesiveness

A photocured film was obtained in the same manner as the photocured film except that no photomask was used. The coating film was treated with HNO ₃ / HCl in an etchant aqueous solution for 45 minutes / 2 minutes.

Thereafter, the substrate was cut with a cutter according to ASTM D-3359-08 standard test conditions, and then the tape was affixed to the surface thereof and then peeled off to confirm the adhesion.

The degree of peeling of the coating film in the cutting / tape test after the treatment with the aqueous solution of the etchant was evaluated by the following evaluation criteria based on the standard test method.

<Evaluation Criteria>

5B: peeling 0%

4B: peeling 0% to less than 5%

3B: peeling 5% or more and less than 15%

2B: peeling 15% or more and less than 35%

1B: peeling 35% or more and less than 65%

0B: peeling more than 65%

(2) Surface damage

The resulting pattern was observed with a scanning electron microscope (SEM) after the treatment with the aqueous solution of the etchant, and the surface damage was evaluated as the following evaluation criteria.

<Evaluation Criteria>

◎: No surface damage

○: 10 or less patterns among 100 patterns have surface damage

△: Out of 100 patterns, there are 10 to 50 pattern damage

×: Over 50 patterns out of 100 patterns have surface damage

(3) membrane shrinkage

The resulting pattern was evaluated by the following evaluation criteria by comparing the film thickness changes before and after the treatment in a HNO ₃ / HCl etchant aqueous solution for 45 minutes / 2 minutes.

<Evaluation Criteria>

?: Film thickness change less than 1%

?: Change in film thickness 1% or more and less than 3%

?: Change in film thickness 3% or more and less than 5%

X: Change in film thickness 5% or more

Adhesiveness Surface damage Membrane shrinkage Example 1 5B ◎ ◎ Example 2 5B ◎ ○ Example 3 5B ◎ ○ Comparative Example 1 2B × ○

As shown in Table 2, the negative-working photosensitive resin compositions of Examples 1 to 3, in which the alkali-soluble resin includes the repeating units represented by the formulas (1) and (2), were used in the post- (Surface damage) and reliability (film shrinkage) with respect to the etchant aqueous solution. On the other hand, it was confirmed that the negative-working photosensitive resin composition of Comparative Example 1 in which the alkali-soluble resin did not contain any one of the repeating units represented by the general formulas (1) and (2) had poor adhesion and chemical resistance.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Do. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Accordingly, the actual scope of the invention is defined by the appended claims and their equivalents.

Claims (8)

1. A negative-working photosensitive resin composition comprising an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator and a solvent,
Wherein the alkali-soluble resin comprises a repeating unit represented by the following general formulas (1) and (2): &lt; EMI ID =
[Chemical Formula 1]

(2)

In this formula,
R ¹ and R ⁴ are each independently hydrogen or methyl,
R ² and R ⁵ are each independently a C ₁ -C ₁₀ alkylene group or a C ₁ -C ₁₀ oxyalkylene group or is absent,
R ³ is hydrogen or a C ₁ -C ₁₀ alkyl group. The positive photosensitive resin composition according to claim 1, wherein the alkali-soluble resin further comprises a repeating unit represented by the following formula (3): &lt; EMI ID =
(3)

In this formula,
R &lt; ⁶ &gt; is hydrogen or methyl,
R ⁷ is a C ₁ -C ₁₀ alkylene group or a C ₁ -C ₁₀ oxyalkylene group or is absent,
p is 0 or 1; The negative-type photosensitive resin composition according to claim 1, wherein in Formula (1), R ¹ is hydrogen or methyl, R ² is a C ₁ -C ₁₀ alkylene group, and R ³ is a C ₁ -C ₁₀ alkyl group. The negative-type photosensitive resin composition according to claim 1, wherein in the general formula (2), R ⁴ is hydrogen or methyl, and R ⁵ is a C ₁ -C ₁₀ alkylene group. The negative photosensitive resin composition according to claim 2, wherein in the general formula (3), R ⁶ is hydrogen or methyl, R ⁷ is absent, and p is 0 or 1. A photocurable film formed from the negative-working photosensitive resin composition according to any one of claims 1 to 5. The photocurable film according to claim 6, wherein the photocurable film is selected from the group consisting of an array planarizing film, a protective film, an insulating film, a photoresist pattern, a black matrix pattern, a column spacer pattern and a black column spacer pattern. An image display apparatus comprising the photocurable film of claim 6.