KR20190078439A - Electrostatic chuck, film forming apparatus including electrostatic chuck, substrate holding and separating method, film forming method including the same, and manufacturing method of electronic device using the same - Google Patents

Abstract

An electrostatic chuck of the present invention includes: a substrate holding unit having an electrode part; a voltage applying unit applying a voltage to the electrode part; and a voltage control unit controlling the voltage applied to the electrode part by the voltage applying unit. The electrostatic chuck includes a plurality of substrate holding units. The voltage applying unit applies a first voltage for holding the substrate and a second voltage for separating the substrate. The voltage control unit independently controls application of the second voltage for each substrate holding part.

Description

TECHNICAL FIELD [0001] The present invention relates to an electrostatic chuck, a deposition apparatus including the electrostatic chuck, a substrate holding and separation method, a deposition method including the electrostatic chuck, and a method of manufacturing an electronic device using the electrostatic chuck FORMING METHOD INCLUDING THE SAME, AND AND MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THE SAME}

The present invention relates to a deposition apparatus, and more particularly, to an electrostatic chuck used for holding a substrate in a deposition apparatus and a method for holding and separating a substrate on the electrostatic chuck.

Recently, an organic EL display device has been spotlighted as a flat panel display device. The organic EL display device is a self-luminous display, and its characteristics such as response speed, viewing angle, and thinness are superior to those of a liquid crystal panel display, and thus various types of portable terminals represented by monitors, televisions, and smart phones are rapidly replacing existing liquid crystal panel displays . In addition, automotive displays are expanding their applications.

The element of the organic EL display device has a basic structure in which an organic material layer causing light emission is formed between two opposing electrodes (cathode electrode, anode electrode). The organic material layer and the electrode layer of the organic EL display device are formed by depositing the evaporated evaporation material on the lower surface of the substrate placed on the upper part of the vacuum chamber through the mask having the pixel pattern by heating the evaporation source provided at the lower part of the vacuum chamber .

The substrate is held and supported by the substrate holder in the vacuum chamber of the deposition apparatus of the upward deposition type. The substrate is supported by the support of the substrate holder so that the periphery of the lower surface of the substrate is not damaged by the organic layer / electrode layer formed on the substrate . In this case, as the size of the substrate increases, the central portion of the substrate, which is not supported by the support portion of the substrate holder, is sagged by the weight of the substrate, which causes a decrease in the deposition accuracy.

A technique of using an electrostatic chuck as a method for reducing deflection due to the weight of the substrate has been studied. That is, an electrostatic chuck is provided on the upper portion of the support portion of the substrate holder, and an attraction voltage is applied to the electrostatic chuck in a state in which the electrostatic chuck is in close proximity to or in contact with the upper surface of the substrate, The center portion can be pulled by the electrostatic attraction of the electrostatic chuck, and the deflection of the substrate can be reduced.

However, since the substrate placed on the support of the conventional substrate holder sags the central portion of the substrate by its own weight, the peripheral portion of the substrate is supported in a shape closer to the electrostatic chuck than the central portion of the substrate. In this case, if an electrostatic chuck is brought close to or brought into contact with the substrate after the flat plate-shaped electrostatic chuck is applied to the entire surface of the electrostatic chuck, the peripheral portion of the substrate supported by the supporting portion of the substrate holder receives electrostatic attraction from the electrostatic chuck almost at the same time, And the central portion of the substrate receives the electrostatic attraction most recently.

That is, since the adsorption of the substrate to the electrostatic chuck proceeds from the periphery of the substrate toward the center of the substrate, the substrate is not flatly attracted to the electrostatic chuck but a gap is left between the substrate and the electrostatic chuck at the central portion of the substrate, Is attracted to the electrostatic chuck in a corrugated state.

On the other hand, even if the separation voltage is applied to the electrostatic chuck to separate the substrate from the electrostatic chuck after the substrate is attracted to the electrostatic chuck by applying the attraction voltage to the electrostatic chuck, the charges induced in the substrate by the attraction voltage It takes a considerable time from the application of the separation voltage to the electrostatic chuck until the point at which the substrate is actually separated from the electrostatic chuck. This increases the process time (Tact), thereby decreasing the productivity.

In addition, when the separation voltage is applied to the entire electrostatic chuck, the position at which the substrate starts to be separated is not stable, so that the posture or position of the substrate placed on the supporting portion of the substrate holder after the separation is not constant, Affecting substrate handling.

It is an object of the present invention to provide an electrostatic chuck and a voltage control method of an electrostatic chuck such that a substrate is flatly attracted to an electrostatic chuck and separation of the substrate from the electrostatic chuck is made constant.

An electrostatic chuck according to the first aspect of the present invention comprises: And a voltage control unit for controlling a voltage applied to the electrode unit by the voltage applying unit, wherein the electrostatic chuck is mounted on the substrate holding unit, the substrate holding unit including the electrode unit, Wherein the voltage applying section applies a first voltage for holding the substrate and a second voltage for separating the substrate to the plurality of substrate holding sections, and the voltage controlling section applies the second voltage Is independently controlled for each of the substrate holding portions.

An electrostatic chuck according to a second aspect of the present invention comprises: And a control section for controlling the holding of the substrate on the plurality of substrate holding sections and the separation of the substrate held on the plurality of substrate holding sections, wherein the control section controls the substrate holding section Is independently controlled for each of the substrate holding portions.

A film forming apparatus according to a third aspect of the present invention comprises an electrostatic chuck according to the first or second aspect of the present invention for holding a substrate, a mask base provided below the electrostatic chuck for mounting the mask, And an evaporation source mounting base provided below the mask base so as to face the electrostatic chuck and for installing an evaporation source for accommodating the evaporation material.

According to a fourth aspect of the present invention, A method of holding and separating a substrate includes the steps of holding a substrate on the plurality of substrate holding portions by applying a first voltage to the plurality of substrate holding portions and applying a second voltage to the plurality of substrate holding portions And separating the substrate from the plurality of substrate holding portions, wherein in the separating step, the second voltage is independently controlled and applied to each of the substrate holding portions.

According to a fifth aspect of the present invention, A method of holding and separating a substrate includes the steps of holding a substrate on the plurality of substrate holding portions by applying a first voltage to the plurality of substrate holding portions and applying a second voltage to the plurality of substrate holding portions And separating the substrate from the plurality of substrate holding portions, wherein in the separating step, the order of separation of the substrates is controlled independently for each of the substrate holding portions.

A film forming method according to a sixth aspect of the present invention includes the steps of placing a mask on a mask table, placing the substrate on a substrate support, holding and separating the substrate according to the fourth or fifth aspect of the present invention, And depositing an evaporation source of the evaporation source on the substrate through a mask.

A method of manufacturing an electronic device according to a seventh aspect of the present invention comprises: An electronic device is manufactured using the film forming method according to the sixth aspect of the present invention.

According to the present invention, since the electrostatic chuck has a plurality of substrate holding portions and the voltage is independently controlled for each substrate holding portion of the electrostatic chuck when holding and separating the substrate, It should be done by supporting parts. As a result, not only can the substrate be held flat on the electrostatic chuck but also the separation starting position becomes stable even when the substrate is separated from the electrostatic chuck. As a result, the posture and position of the substrate separated from the electrostatic chuck and placed on the substrate supporting portion can be made uniform, and the influence on the handling after the substrate is separated can be reduced.

1 is a schematic view of a part of a manufacturing line of an organic EL display device
2 is a schematic view of a film forming apparatus of the present invention.
3 is a schematic diagram showing the planar structure of the electrostatic chuck of the present invention.
4 is a schematic view for explaining a method of holding and separating a substrate on an electrostatic chuck of the present invention.
5 is a schematic view for explaining the film forming method of the present invention.
6 is a schematic diagram showing a structure of an organic EL display device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration, the software configuration, the process flow, the manufacturing conditions, the size, the material, the shape, and the like of the apparatus are intended to limit the scope of the present invention unless otherwise specified no.

The present invention can be suitably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum evaporation on the surface of a substrate. As the material of the substrate, any material such as glass, a film of a polymer material, or a metal can be selected, and as the evaporation material, an arbitrary material such as an organic material, a metallic material (metal, metal oxide, etc.) can be selected. Specifically, the technique of the present invention is applicable to an organic electronic device (for example, an organic EL display, a thin film solar cell), an optical member, and the like. In particular, in an apparatus for manufacturing an organic EL display device, an evaporation material is vaporized and deposited on a substrate through a mask to form an organic EL display device, which is one of preferred applications of the present invention.

<Electronic Device Manufacturing Line>

1 is a plan view schematically showing a part of the configuration of a manufacturing line of an electronic device. The manufacturing line of Fig. 1 is used, for example, in manufacturing a display panel of an organic EL display device for a smart phone. In the case of a display panel for a smart phone, after the organic EL film is formed on a substrate having a size of, for example, about 1800 mm x about 1500 mm, the substrate is diced to produce a plurality of small-sized panels.

The manufacturing line of the electronic device generally includes a plurality of film forming chambers 11 and 12 and a transport chamber 13 as shown in Fig. In the transfer chamber 13, a transfer robot 14 for holding and transferring the substrate 10 is provided. The carrying robot 14 is, for example, a robot having a structure in which a robot hand for holding a substrate 10 is mounted on a multi-joint arm, and performs carrying in / out of the substrate 10 into each of the film forming chambers.

Each of the deposition chambers 11 and 12 is provided with a deposition apparatus (also referred to as a deposition apparatus). A series of film formation processes such as the transfer of the substrate 10 to the transfer robot 14, the alignment of the relative position of the substrate 10 and the mask, the fixing of the substrate 10 onto the mask, Is automatically performed by the film forming apparatus.

Hereinafter, the structure of the film forming apparatus of the film forming chamber will be described.

&Lt;

2 is a cross-sectional view schematically showing the structure of the film forming apparatus 2. As shown in Fig. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. Assuming that the substrate is fixed parallel to the horizontal plane (XY plane) at the time of film formation, the direction parallel to the short side of the substrate is defined as X direction, and the direction parallel to the long side is defined as Y direction. Also, the rotation angle around the Z axis is denoted by?.

The film forming apparatus 2 has a vacuum chamber 20 defining a space in which a film forming process is performed. The inside of the vacuum chamber 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

A substrate support 21 for supporting the substrate, a mask table 22 on which the mask is placed, an electrostatic chuck 23 for holding the substrate by electrostatic attraction, A magnet 24 for applying a magnetic force to the mask of the deposition chamber, and an evaporation source 25 for accommodating the evaporation material in the lower part of the vacuum chamber 20 of the deposition apparatus.

The substrate 10 transported into the vacuum chamber 20 by the transport robot 14 of the transport chamber 13 is mounted on the substrate support 21. The substrate support 21 may be fixed to the vacuum chamber 20 or be vertically movable. The substrate support 21 includes supports 211, 212 that support the periphery of the lower surface of the substrate.

A frame-shaped mask table 22 is provided below the substrate support 21 and a mask 221 having an opening pattern corresponding to the thin film pattern to be formed on the substrate 10 is placed on the mask table 22 . Particularly, a mask used for manufacturing an organic EL device for a smart phone is also called a fine metal mask (FMM) as a metal mask having a fine opening pattern.

An electrostatic chuck 23 is provided above the support portions 211 and 212 of the substrate support 21 for holding and fixing the substrate by electrostatic attraction. The electrostatic chuck 23 has a structure in which an electric circuit such as a metal electrode is embedded in a dielectric (e.g., ceramic) matrix. When positive (+) and negative (-) voltages are applied to the metal electrode, a polarized charge having a polarity opposite to that of the metal electrode is induced on the substrate through the dielectric matrix, and the electrostatic chuck 23, As shown in Fig. The electrostatic chuck 23 may be formed of a single plate or a plurality of sub-plates. Further, even in the case of a single plate, it is possible to include a plurality of electric circuits in the plate and to control the electrostatic attraction differently according to the position in one plate.

In the present invention, the electrostatic chuck 23 includes a plurality of substrate holding portions as described later with reference to Fig. 3, and the holding and separation of the substrates can be performed independently for each substrate holding portion.

A magnet 24 for applying a magnetic force to the metal mask 221 to prevent sagging of the mask and to closely contact the mask 221 and the substrate 10 is provided on the electrostatic chuck 23. The magnet 24 may be made of a permanent magnet or an electromagnet, and may be divided into a plurality of modules.

Although not shown in FIG. 2, a cooling plate for cooling the substrate is provided between the electrostatic chuck 23 and the magnet 24. The cooling plate may be integrally formed with the electrostatic chuck 23 or the magnet 24.

The evaporation source 25 includes a crucible (not shown) in which an evaporation material to be formed on the substrate is housed, a heater (not shown) for heating the crucible, and evaporation materials scattered to the substrate until the evaporation rate from the evaporation source becomes constant. And a shutter (not shown) for blocking the shutter. The evaporation source 25 may have various configurations depending on the application such as a point evaporation source, a linear evaporation source, and a revolver evaporation source.

Although not shown in FIG. 2, the film forming apparatus 2 includes a film thickness monitor (not shown) and a film thickness calculating unit (not shown) for measuring the film thickness deposited on the substrate.

A drive mechanism for moving the substrate support 21, the electrostatic chuck 23, the magnet 24, and the like in the vertical direction (Z direction) is formed on the outer upper surface of the vacuum chamber 20 of the film forming apparatus 2, A driving mechanism and the like for moving the electrostatic chuck 23 and / or the substrate support 21 in parallel to the horizontal plane (in the X direction, the Y direction, and the? Direction) are provided. An alignment camera (not shown) is also provided for taking an alignment mark formed on the substrate and the mask through a window provided on the ceiling of the vacuum chamber 20 for aligning the mask and the substrate.

The film forming apparatus is provided with a control section (26). The control unit 26 has functions such as conveyance and alignment of the substrate 10, control of an evaporation source, and control of film formation. The control unit 26 can be configured by a computer having a processor, memory, storage, I / O, and the like. In this case, the function of the control section 26 is realized by the processor executing the program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded type computer or a PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 26 may be configured by a circuit such as an ASIC or an FPGA. Further, the control unit 26 may be provided for each deposition apparatus, or one control unit 26 may control a plurality of deposition apparatuses.

<Structure of Electrostatic Chuck and Holding and Separation Method of Substrate>

Hereinafter, the structure of the electrostatic chuck 23 of the present invention and the method of holding and separating the substrate on the electrostatic chuck 23 will be described with reference to Figs. 3 and 4. Fig.

The electrostatic chuck 23 of the present invention includes a dielectric portion 30, an electrode portion 31, a voltage control portion 32, and a voltage applying portion 33, as shown in FIG. The voltage application unit 33 applies positive (+) voltage and negative (-) voltage to the electrode unit 31 of the electrostatic chuck 23. The voltage control unit 32 controls the magnitude of the voltage applied to the electrode unit 31 from the voltage application unit 33, the application start time, the holding time, and the like in accordance with the progress of the film formation process of the film formation apparatus 2. In this embodiment, the voltage control unit 32 is separately implemented from the control unit 26 of the film forming apparatus 2, but may be integrated into the control unit 26 of the film forming apparatus 2. In this case, the voltage control of the electrostatic chuck 23 is performed by the control unit 26 of the film forming apparatus 2.

The electrode unit 31 may include a plurality of sub-electrode units. For example, the electrode unit 31 of the present invention includes two electrode units, that is, a first sub-electrode unit 311 and a second sub-electrode unit 312 as shown in FIG. 3 (a) But the present invention is not limited thereto, and may include three or more sub-electrode portions.

The electrostatic chuck 23 of the present invention includes a plurality of substrate holding portions corresponding to a plurality of sub-electrode portions. For example, the electrostatic chuck 23 of the present invention may have two substrate holding portions 231 and 232 corresponding to the two sub-electrode portions 311 and 312 as shown in Fig. 3 (b) But is not limited to this, and may have more than one substrate holding portion in order to more precisely control holding and separation of the substrate. For example, three or more substrate holding portions may be provided depending on the number of sub-electrode portions.

The substrate holding portion has an elongated shape in the long side direction (Y axis direction, first direction) of the substrate and is separated in the short side direction (X axis direction, second direction) of the substrate, but not limited thereto, May also be separated. The plurality of substrate holding portions may be realized by a plate having one physical sub-electrode portion, and each of the plurality of physically separated sub-plates may have one or more sub-electrode portions. The physical structure and the electric circuit structure may be different so long as a voltage for substrate holding and separation can be independently applied to each of the plurality of substrate holding portions.

Hereinafter, voltage control for holding and separating a substrate in the electrostatic chuck 23 of the present invention will be described with reference to FIG.

Fig. 4 (a) shows the voltage control in the process of holding the substrate on the electrostatic chuck 23. The voltage control unit 32 of the present invention is configured such that in the step of holding the substrate, a voltage is applied from the first substrate holding portion 231 disposed on either side of the long side (first side) (Holding voltage) for holding the substrate sequentially (refer to arrows in Fig. 3 (b)) toward the second substrate holding portion 232 disposed on the first side (second side) . That is, as shown in Fig. 4A, the first voltage is first applied to the first substrate holding portion 231, and then the first voltage is applied to the second substrate holding portion 232. Next, as shown in Fig. The first voltage is set to a magnitude sufficient to provide a holding force sufficient to hold the substrate by the electrostatic chuck 23.

When the first voltage V1 is applied to the first substrate holding portion 231, the electric charges of the first substrate holding portion 231 and the electric charges of the first substrate holding portion 231 are applied to the upper surface of the substrate corresponding to the first substrate holding portion 231 of the electrostatic chuck 23 A polarized charge of opposite polarity is induced. As a result, the central portion of the substrate is attracted to and held by the first substrate holding portion 231 from the first side edge portion of the substrate. As a result, the deflection at the central portion of the substrate moves toward the second side of the substrate from the central portion of the substrate.

Subsequently, when the first voltage V2 is applied to the second substrate holding portion 232, the upper surface of the second substrate holding portion 232 corresponding to the second substrate holding portion 232 of the electrostatic chuck 23 A polarized charge of opposite polarity to the charge is induced. As a result, the second side edge portion of the substrate is attracted to and held by the second substrate holding portion 232 from the central portion of the substrate. Accordingly, the deflection moved between the central portion of the substrate and the second side edge portion of the substrate is spread while moving toward the second side edge portion of the substrate substrate, and the substrate is adsorbed flat on the electrostatic chuck 23, do.

As described above, according to the electrostatic chuck 23 of the present invention, since the holding of the substrate can be independently controlled for each substrate holding portion, the deflection of the central portion of the substrate can be effectively spread toward the second side edge portion of the substrate. Conventionally, since the attracting voltage is applied all over the electrostatic chuck 23, the first side and the second side edge of the substrate are almost simultaneously adsorbed to the electrostatic chuck 23, and the center of the substrate is adsorbed the latest . In contrast, in the present invention, when the upper surface portions of the substrates corresponding to the plurality of substrate holding portions are sequentially provided (for example, when the three substrate holding and supporting portions are provided so as to correspond to the first side edge portions, the central portion, and the second side edge portions, The center portion and the second side edge portion of the substrate) are attracted and held by the electrostatic chuck 23, so that the deflection of the central portion of the substrate can be extended toward the second side edge portion, I can solve the problem.

The voltage control in the process of separating the substrate from the electrostatic chuck 23 will be described below.

In separating the substrate from the electrostatic chuck 23, the voltage control unit 32 of the present invention independently controls the voltage for each substrate holding unit of the electrostatic chuck. For example, the voltage control unit 32 may control the start timing, the magnitude, the holding time of the second voltage, and the like of the second voltage, which is a separation voltage, differently for each substrate holding unit. The second voltage V2 may be a zero voltage (i.e., a ground voltage) or a voltage of a reverse polarity of the first voltage V1.

The voltage control section 32 of the present invention applies the second voltage V2 to the first substrate holding section 231 first and then the second substrate holding section 232 The second voltage V2 is applied. That is, the second voltage, which is a separate voltage, is applied to the plurality of substrate holding portions in the order of holding in the substrate holding step.

This results in that more of the polarization charge is induced in the upper surface portion of the substrate corresponding to the first substrate holding portion to which the first voltage is applied than the upper surface portion of the substrate corresponding to the second substrate holding portion to which the first voltage is applied later, This is because the time for the discharge of the polarized electric charges takes a relatively long time. The substrate can be first separated from the first substrate holding portion 231 side by applying the second voltage to the first substrate holding portion 231 side first so that the separation position of the substrate from the electrostatic chuck 23 And the posture can be made constant.

4 (c), when a voltage having a polarity opposite to that of the first voltage is applied as the second voltage, the magnitude of the second voltage applied to the first substrate holding portion 231 is set to be smaller than that of the second substrate holding portion 231 Can be made greater than the magnitude of the second voltage applied to the supporting portion 232. [ As a result, the polarization charge can be discharged from the upper surface portion of the substrate corresponding to the first substrate holding portion 231 more quickly. In addition, the substrate can be surely separated from the first substrate holding portion 231 first.

4 (d) or 4 (e), the holding time of the second voltage to the first substrate holding portion 231 is longer than the holding time of the second voltage to the second substrate holding portion 231 It can be long.

In addition, it is possible to control various combinations of the initiation time, the size, and the holding time of the second voltage so that the substrate can be separated from the first substrate holding portion 231 before the second substrate holding portion 232 . For example, a second voltage having a larger magnitude of opposite polarity may be applied to the first substrate holding portion 231 earlier and longer than the second substrate holding portion 232, and the first substrate holding portion 231 ) By applying a second voltage of a polarity opposite to that of the second substrate holder 232 to the first substrate holder 231 so that the substrate is separated from the first substrate holder 231 It is possible.

 In the present embodiment, it is described that the first voltage, which is the holding voltage, is applied and then the second voltage, which is the separation voltage, is applied. However, before the second voltage is applied after the first voltage is applied, . In this case, the third voltage is preferably a voltage smaller than the first voltage. This makes it possible to shorten the overall time required for actually separating the substrate from the electrostatic chuck 23 after applying the second voltage to the electrode portion 31 of the electrostatic chuck 23.

In the present embodiment, it is assumed that the order of applying the held voltage (first voltage) to the plurality of substrate holding portions of the electrostatic chuck 23 is the same as the order of applying the divided voltage (second voltage) , But the present invention is not limited thereto, and the order may be changed as long as the voltages (the first voltage and / or the second voltage) applied to the plurality of substrate holding portions can be independently controlled. For example, the second voltage may be applied in the reverse order to the order in which the first voltage is applied to the plurality of substrate holding portions of the electrostatic chuck 23.

<Film formation process>

Hereinafter, a film forming method employing the electrostatic chuck voltage control of the present invention will be described with reference to FIG.

The substrate is brought into the vacuum chamber 20 of the film forming apparatus 2 by the transfer robot 14 of the transfer chamber 13 in a state in which the mask 221 is placed on the mask table 22 in the vacuum chamber 20 (Fig. 5 (a)).

The substrate 10 is mounted on the support portions 211 and 212 of the substrate support 21 while the hand of the transfer robot 14 that has entered the vacuum chamber 20 is lowered (FIG. 5 (b)).

Subsequently, after the electrostatic chuck 23 descends toward the substrate 10 and sufficiently approaches or contacts the substrate 10, a first voltage V1 is applied to the electrostatic chuck 23 to hold the substrate 10 (Fig. 5 (c)). At this time, in the present invention, the first voltage (V1) is applied to the plurality of substrate holding portions of the electrostatic chuck (23) independently of each other, rather than the first voltage (V1). For example, the first voltage V1 is sequentially applied from the first substrate holding portion 231 corresponding to the first side edge portion of the substrate to the second substrate holding portion 232 corresponding to the second side edge portion of the substrate .

The substrate 10 is lowered toward the mask 221 in order to measure the positional deviation of the substrate relative to the mask while the substrate 10 is held on the electrostatic chuck 23 (Fig. 5 (d)).

When the substrate 10 is lowered to the measurement position, alignment marks formed on the substrate 10 and the mask 221 are photographed by the alignment camera to measure the relative positional displacement between the substrate and the mask (see Fig. 5 (e)).

When it is determined that the relative positional deviation of the substrate with respect to the mask exceeds the threshold value as a result of the measurement, the substrate 10 held in the electrostatic chuck 23 is moved in the horizontal direction (XY &amp;thetas; (Refer to Fig. 5 (f)).

After the aligning process, the substrate 10 held by the electrostatic chuck 23 is placed on the mask 221, the magnet 24 is lowered, and the substrate and the mask are moved by the magnetic force of the magnet 24 on the mask (Fig. 5 (g)).

Then, the shutter of the evaporation source 25 is opened and the evaporation material is deposited on the substrate 10 through the mask (Fig. 5 (h)). When a film having a desired thickness is formed on the substrate, the shutter of the evaporation source 25 is closed, and the film formation process is terminated.

When the film forming process is completed, the magnet 24 is lifted and the close contact between the mask and the substrate is released (Fig. 5 (i)).

Subsequently, the substrate is separated from the mask and raised by the rise of the electrostatic chuck 23 and the substrate support 21 (Fig. 5 (j)).

Subsequently, after the hand of the carrying robot enters the vacuum chamber of the film forming apparatus and a second voltage as a separation voltage is applied to the electrostatic chuck 23 and the attraction force of the electrostatic chuck 23 is sufficiently weakened, (Fig. 5 (k)). In the present invention, when the second voltage is applied to separate the substrate from the electrostatic chuck 23, the magnitude of the second voltage, the start time of the application, the sustain period, and the like are independently controlled for each of the plurality of substrate holding portions of the electrostatic chuck , And the position and posture at which the substrate is separated from the electrostatic chuck are made constant.

Thereafter, the substrate on which the deposition is completed is taken out of the vacuum chamber 20.

In the present embodiment, the process of separating the substrate from the electrostatic chuck 23 has been described as being performed after the adhesion between the substrate and the mask is released and the substrate is separated from the mask. However, the present invention is not limited to this, A second voltage as a separation voltage may be applied to the electrostatic chuck 23 before the film formation process is started after the adjusted substrate is placed on the mask and the magnet 24 is lowered and the substrate and the mask are brought into close contact with each other . This is because the substrate is placed on the mask and the substrate and the mask are kept in close contact with each other by the magnetic force of the magnet 24. [

,

&Lt; Method of manufacturing electronic device &

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be exemplified as an example of the electronic device.

First, an organic EL display device to be manufactured will be described. 6 (a) is an overall view of the organic EL display device 60, and Fig. 6 (b) shows a cross-sectional structure of one pixel.

6A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 each having a plurality of light emitting elements are arranged in a matrix form. Each of the light emitting devices has a structure including an organic layer sandwiched between a pair of electrodes. The term &quot; pixel &quot; as used herein refers to a minimum unit capable of displaying a desired color in the display region 61. [ In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B, . The pixel 62 is often formed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. no.

Fig. 6 (b) is a partial sectional schematic view taken along the line A-B in Fig. 6 (a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, light emitting layers 66R, 66G and 66B, an electron transport layer 67, a second electrode (cathode) 68 The organic EL device according to claim 1, Of these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. In the present embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to the light emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue, respectively. The first electrode 64 is formed separately for each light emitting device. The hole transport layer 65, the electron transport layer 67 and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed separately for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Further, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture or oxygen is provided.

Although the hole transport layer 65 and the electron transport layer 67 are shown as one layer in FIG. 6 (b), depending on the structure of the organic EL display device, a plurality of layers including a hole blocking layer and an electron blocking layer It is possible. A hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 64 into the hole transport layer 65 is formed between the first electrode 64 and the hole transport layer 65 . Similarly, an electron injection layer may be formed between the second electrode 68 and the electron transport layer 67 as well.

Next, an example of a manufacturing method of the organic EL display device will be described in detail.

First, a circuit (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

An acrylic resin is formed on the substrate 63 on which the first electrode 64 is formed by spin coating and the acrylic resin is patterned by lithography so as to form an opening in a portion where the first electrode 64 is formed, . This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is brought into the first organic material film forming apparatus to hold the substrate by the substrate supporter and the electrostatic chuck and the hole transport layer 65 is formed on the first electrode 64 A film is formed as a common layer. The hole transport layer 65 is formed by vacuum evaporation. In practice, since the hole transport layer 65 is formed in a size larger than the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transporting layer 65 is brought into the second organic film forming apparatus, and held by the substrate support and the electrostatic chuck. Alignment of the substrate and the mask is performed and the substrate is placed on the mask to form a light emitting layer 66R that emits red light on the portion where the red emitting element of the substrate 63 is disposed.

The light emitting layer 66G that emits green light is formed by the third organic film forming apparatus similarly to the film formation of the light emitting layer 66R and further the light emitting layer 66B that emits blue light by the fourth organic film forming apparatus is formed. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth organic material film forming apparatus. The electron transporting layer 67 is formed as a common layer to the three color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transporting layer 67 is moved to the metallic deposition material film forming apparatus to form the second electrode 68. [

According to the present invention, the electrostatic chuck 23 has a plurality of substrate holding portions, and independently controlling the holding voltage (first voltage) and the divided voltage (second voltage) applied to the substrate holding portions, Can be adsorbed on the electrostatic chuck more evenly, and the position or posture in which the substrate is separated from the electrostatic chuck can be kept constant.

Thereafter, the protective layer 70 is formed by moving to a plasma CVD apparatus to complete the organic EL display device 60.

When the substrate 63 having the insulating layer 69 is exposed to an atmosphere containing moisture or oxygen from the time when the substrate 63 having been patterned is transferred to the film forming apparatus to the completion of film formation of the protective layer 70, There is a possibility of deterioration due to moisture or oxygen. Therefore, in this example, the carrying-in and carrying-out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, but may be appropriately modified within the scope of the technical idea.

21: Substrate support
22: Mask band
23: Electrostatic Chuck
24: Magnet
31:
32:
33:
211: first supporting member
212: second supporting member
231: a first substrate holding portion
232: second substrate holder

Claims (35)

An electrostatic chuck for holding a substrate,
A substrate holding portion including an electrode portion,
A voltage applying unit for applying a voltage to the electrode unit,
And a voltage control unit for controlling a voltage applied to the electrode unit by the voltage application unit,
Wherein the electrostatic chuck includes a plurality of substrate holding portions,
The voltage applying section applies a first voltage for holding the substrate and a second voltage for separating the substrate to the plurality of substrate holding sections,
Wherein the voltage control unit controls the application of the second voltage independently for each substrate holding unit.
The method according to claim 1,
Wherein the voltage control unit controls the start timing of application of the second voltage independently for each substrate holding unit.
The electrostatic chuck according to claim 2, wherein the voltage control unit controls the start timing of application of the second voltage to be different for each substrate holding unit.
3. The plasma display apparatus according to claim 2, wherein the voltage control unit controls the voltage application unit to apply a voltage to each of the plurality of substrate holding units based on an order in which the plurality of substrate holding units hold the substrates, chuck.
The electrostatic chuck according to claim 2, wherein the voltage control unit controls the second voltage to be sequentially applied to the plurality of substrate holding units.
The method according to claim 1,
Wherein the voltage control unit independently controls the holding time of the second voltage for each of the substrate holding units.
The electrostatic chuck according to claim 6, wherein the voltage control unit controls the holding time of the second voltage to be different for each substrate holding unit.
The apparatus according to claim 6, wherein the voltage control unit controls the voltage holding unit to control the holding time of the second voltage to each of the plurality of substrate holding units based on an order in which the plurality of substrate holding units hold the substrates, .
The electrostatic chuck according to claim 1, wherein the voltage control unit controls the magnitude of the second voltage independently for each substrate holding unit.
The electrostatic chuck according to claim 9, wherein the voltage control unit controls the magnitude of the second voltage to be different for each substrate holding unit.
10. The plasma display apparatus according to claim 9, wherein the voltage control unit is configured to control the magnitude of the second voltage applied to each of the plurality of substrate holding units based on an order in which the plurality of substrate holding units hold the substrates, .
The electrostatic chuck according to claim 1, wherein the second voltage is a ground voltage or a voltage that is reverse polarity to the first voltage.
The electrostatic chuck according to claim 1, wherein the voltage control unit controls the application of the first voltage independently for each substrate holding unit.
14. The electrostatic chuck according to claim 13, wherein the voltage control unit independently controls the application start timing of the first voltage for each of the substrate holding units.
An electrostatic chuck for holding a substrate,
A plurality of substrate holding portions, and
And a control section for controlling the holding of the substrate on the plurality of substrate holding sections and the separation of the substrates held on the plurality of substrate holding sections,
Wherein the control section controls the order of separation of the substrates independently for each of the substrate holding sections.
16. The electrostatic chuck according to claim 15, wherein the control unit independently controls the order of holding the substrates by the substrate holding unit.
A film forming apparatus for forming an evaporation material on a substrate through a mask,
An electrostatic chuck according to any one of claims 1 to 16 for holding a substrate,
A mask table provided below the electrostatic chuck for placing the mask,
And an evaporation source mounting unit provided below the mask stand so as to face the electrostatic chuck and for installing an evaporation source for accommodating the evaporation material,
.
A method for holding and separating a substrate into an electrostatic chuck having a plurality of substrate holding portions,
Applying a first voltage to the plurality of substrate holding portions to hold the substrate on the plurality of substrate holding portions, and
And applying a second voltage to the plurality of substrate retention portions to separate the substrate from the plurality of substrate retention portions,
Wherein said separating step independently controls and applies said second voltage to said substrate holding portions.
19. The method of claim 18,
Wherein the separation start timing of the second voltage is independently controlled for each of the substrate holding portions.
20. The method of claim 19, wherein in the separating step, the start timing of application of the second voltage is different for each substrate holding portion.
20. The method of claim 19, wherein in the holding step, in the separating step, based on the order in which the plurality of substrate holding portions each hold the substrate, And controlling the start of application of the substrate.
20. The method of claim 19, wherein in the separating step, the second voltage is sequentially applied to the plurality of substrate holding portions. 19. The method of claim 18, wherein in the disconnecting step, the holding time of the second voltage is independently controlled for each of the substrate holding portions.
24. The method of claim 23, wherein in the separating step, the holding time of the second voltage is controlled to be different for each substrate holding portion.
24. The method according to claim 23, wherein, in the holding step, the plurality of substrate holding portions hold each of the plurality of substrate holding portions, A method of holding and separating a substrate, the method comprising:
19. The method of claim 18, wherein in the disengaging step, the magnitude of the second voltage is independently controlled for each substrate holder.
27. The method of claim 26, wherein in the separating step, the magnitude of the second voltage is different for each substrate holder.
27. The method according to claim 26, wherein, in the holding step, the plurality of substrate holding portions hold each of the plurality of substrate holding portions, And controlling the size of the substrate.
19. The method of claim 18, wherein the second voltage is a voltage that is reverse to the ground voltage or the first voltage.
19. The method of claim 18, wherein in the holding step, the application of the first voltage is independently controlled for each of the substrate holding portions.
31. The method of claim 30, wherein in the holding step, the start timing of application of the first voltage is controlled independently for each of the substrate holding portions.
A method for holding and separating a substrate into an electrostatic chuck having a plurality of substrate holding portions,
Applying a first voltage to the plurality of substrate holding portions to hold the substrate on the plurality of substrate holding portions, and
And applying a second voltage to the plurality of substrate retention portions to separate the substrate from the plurality of substrate retention portions,
And wherein in the separating step, the order of separation of the substrates is controlled independently for each of the substrate holding portions.
33. The method of claim 32, wherein in said holding step, the order of holding of the substrate is independently controlled for each of the substrate holding portions.
A film forming method for forming an evaporation material on a substrate through a mask,
Placing a mask on a mask table,
Placing the substrate on a substrate support,
Holding and separating a substrate to an electrostatic chuck according to the method of any one of claims 18 to 33, and
A step of depositing a deposition material of an evaporation source on a substrate through a mask
&Lt; / RTI &gt;
34. A method of manufacturing an electronic device, the method of claim 34.

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