KR20180130687A - Inspecting apparatus for electronic device - Google Patents

Abstract

The present invention relates to a probe for inspecting an electronic device. According to an embodiment of the present invention, the probe for inspecting an electronic device includes a plurality of probe pins which are electrically connected to a plurality of terminals provided at one end of the electronic device and are formed to have elasticity along a length direction, a fixing plate which has a plurality of through holes which a plurality of probe pins are inserted into to expose both the ends of the plurality of probe pins, a driving film which has one end electrically connected to the one end of each of the plurality of probe pins and applies a test signal for inspecting an electronic device to each of the plurality of probe pins, and a probe block for fixedly coupling the fixing plate and the driving film. It is possible to correctly perform the inspection process.

Description

[0001] DESCRIPTION [0002] Inspecting apparatus for electronic device [

More particularly, the present invention relates to a probe for inspecting an electronic device, and more particularly, to a probe for inspecting an electronic device that minimizes damage to an inspection object when a plurality of probe pins contact a plurality of terminals formed on the inspection object, And more particularly to an electronic device inspection probe which can accurately perform an inspection on an inspection object.

In general, a product in which a circuit pattern is formed, such as a semiconductor device, a flat panel display (FPD), or the like, must be inspected for electrical conditions such as a circuit pattern during a manufacturing process.

For example, a semiconductor device on which an electric circuit is formed on a silicon wafer performs an electrical dicing (EDS) process to inspect electrical characteristics. The inspection device applies an electrical signal to a chip formed on a silicon wafer, The EDS process can be performed by determining whether the chip is defective or not.

As another example, a flat panel display (FPD) such as a liquid crystal display (LCD), a plasma display panel (PDP) or the like is manufactured through a cell process, The test apparatus applies a test signal to a plurality of terminals of a display panel to detect a pixel error mode of the display panel, that is, a color, Resolution, Brightness and so on.

As described above, an inspection apparatus for inspecting an electronic device such as a semiconductor device, a flat panel display (FPD), or the like uses an inspection process for an object to be inspected using a probe provided directly on a chip or a terminal provided in the inspection object. .

In general, the probe for electronic device inspection can be divided into a method using a blade pin and a method using a pogo pin. As described above, the probe for inspecting an electronic device using a blade pin or a pogo pin is mainly used in a case where a gap between a plurality of terminals provided on a test subject is relatively large (approximately 100 mu m or more).

However, in recent years, semiconductor devices, display panels, and the like, on which electronic circuits integrated with high density are formed, are continuously being developed. However, there is a problem in that there are many limitations on the use of the probe for inspecting an electronic device such as a blade pin or a pogo pin.

First, a conventional probe for inspecting an electronic device has a problem in that it can not accommodate a plurality of terminals provided in an electronic device having a fine pattern due to the size of a blade pin or a pogo pin.

Particularly, in the case of a flexible display type organic light emitting diode (OLED) display, which has been actively developed in recent years, due to the characteristics of the display, when a blade pin or a pogo pin is used, a slight scratch or the like remains on the surface of the display, There was a problem that the body was damaged.

Further, there is a problem in that a probe for inspecting an electronic device using a blade pin or a pogo pin is very limited in miniaturization of an inspection apparatus due to the provision of an elastic member such as a spring or a spring for providing an elastic force to the blade pin or pogo pin.

Therefore, when the plurality of probe pins contact the plurality of terminals formed on the object to be inspected, the damage of the object to be inspected is minimized and accurate contact is made to the plurality of terminals provided in the electronic device having the fine pattern. There is a need for a probe for electronic device inspection that can be accurately performed.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems described above, and it is an object of the present invention to provide a probe card which has a plurality of probe pins formed to have elasticity along the longitudinal direction, An electronic device inspection capable of accurately performing inspection on an object to be inspected because damage to an object to be inspected is minimized when contacting a plurality of terminals formed on a carcass and precise contact is made with a plurality of terminals provided in an electronic device having a fine pattern And a probe for use with the probe.

The technical problem of the present invention is not limited to those mentioned above, and another technical problem which is not mentioned can be clearly understood by those skilled in the art from the following description.

According to an aspect of the present invention, there is provided a probe for inspecting an electronic device, comprising: a plurality of probes each having one end electrically connected to a plurality of terminals provided in an electronic device, A plurality of probe pins, a plurality of probe pins, and a plurality of probe pins, wherein the plurality of probe pins are inserted and coupled to expose both ends of the plurality of probe pins, And a probe block connected to the plurality of probe pins for applying a test signal for inspecting the electronic device to each of the plurality of probe pins and fixing the fixing plate and the driving film to each other.

In this case, each of the plurality of probe pins has a long, thin plate-like shape, and a portion to be inserted and bonded to each of the plurality of through-holes is formed so that a projection shape from one side has a coil shape.

The fixing plate may be polyetheretherketone (PEEK) or ceramic.

In addition, each of the plurality of probe pins is fixed by a curing agent injected into each of the plurality of through-holes.

The plurality of probe pins are arranged in a plurality of rows along a direction in which the plurality of terminals are arranged, and a plurality of probe pins belonging to each of the plurality of columns are arranged so as not to cross each other.

The details of other embodiments are included in the detailed description and drawings.

According to the probe for inspecting an electronic device according to an embodiment of the present invention, by using a plurality of probe pins formed to have elasticity along the longitudinal direction, a plurality of probe pins can be provided on a plurality of terminals It is possible to accurately perform the inspection of the inspection object because the damage to the inspection object is minimized and the plurality of terminals provided in the electronic device having the fine pattern are accurately contacted with each other.

In addition, according to the probe for inspecting an electronic device according to an embodiment of the present invention, a plurality of probe pins formed to have elasticity along the longitudinal direction and a fixed plate for fixedly coupling the probe pins are provided, The structure of the probe can be simplified and the manufacturing cost can be reduced by simplifying the process for manufacturing the probe for electronic device inspection.

According to the probe for inspecting an electronic device according to an embodiment of the present invention, a plurality of probe pins are fixedly coupled by a hardening agent injected into each of a plurality of through-holes formed in a fixed plate, It is possible to provide more elasticity to the plurality of probe pins without having a separate elastic structure such as a spring. Therefore, when a plurality of probe pins come in contact with a plurality of terminals provided on the electronic device, So that accurate contact can be achieved.

According to the probe for inspecting an electronic device according to an embodiment of the present invention, a plurality of probe pins are arranged in a row or a plurality of rows so as not to intersect with each other in accordance with the interval between a plurality of terminals provided in the electronic device, It is possible to accurately perform the inspection for the electronic device having the light emitting element.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 is a perspective view showing a structure of an electronic element inspection probe according to an embodiment of the present invention.
2 is an exploded perspective view showing a structure of an electronic element inspection probe according to an embodiment of the present invention.
3 is a view showing a structure of a probe pin constituting a probe for inspection of an electronic device according to an embodiment of the present invention.
4 is a view illustrating a structure in which a probe pin constituting a probe for testing an electronic device according to an embodiment of the present invention is coupled to a fixing plate.
5 is a view showing an arrangement of probe pins constituting a probe for testing electronic devices according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, so that those skilled in the art can easily carry out the present invention.

In the following description of the embodiments of the present invention, descriptions of techniques which are well known in the technical field of the present invention and are not directly related to the present invention will be omitted. This is for the sake of clarity of the present invention without omitting the unnecessary explanation.

For the same reason, some of the components in the drawings are exaggerated, omitted, or schematically illustrated. Also, the size of each component does not entirely reflect the actual size. In the drawings, the same or corresponding components are denoted by the same reference numerals.

It will also be appreciated that the device or element orientation (e.g., "front," "back," "up," "down," "top," "bottom, Expressions and predicates used herein for terms such as "left," " right, "" lateral, " and the like are used merely to simplify the description of the present invention, Or that the element has to have a particular orientation.

Hereinafter, the present invention will be described with reference to the drawings for explaining an electronic element inspection probe according to an embodiment of the present invention.

FIG. 1 is a perspective view illustrating a structure of an electronic element inspection probe according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view illustrating a structure of an electronic element inspection probe according to an embodiment of the present invention.

1 and 2, an electronic component inspection probe 100 according to an embodiment of the present invention includes a plurality of probe pins 110, a fixing plate 120, a driving film 130, Block 140, as shown in FIG.

The electronic element inspection probe 100 is electrically connected to a plurality of terminals (not shown) provided in an electronic element (not shown) as an object to be inspected, and uses a signal transmitted from an inspection apparatus So that the state of the electronic device can be inspected.

That is, the electronic device inspection probe 100 transmits a test signal transmitted from the testing device to the electronic device, receives the signal output from the electronic device, and transmits the signal to the testing device. Thus, the testing device can check the state of the electronic device . Here, the electronic device is a comprehensive concept that means various types of electric / electronic parts to be tested using a test signal.

As shown in FIGS. 1 and 2, a plurality of probe pins 110 are provided on one end 111 (the upper end of the probe pin 110 in FIG. 2) on an electronic element (not shown) And the other end 112 (the lower end of the probe pin 110 in FIG. 2) is electrically connected to a plurality of wirings 131 provided on the driving film 130 .

Accordingly, the plurality of probe pins 110 may transmit a test signal to a plurality of terminals provided in the electronic device, or may transmit a signal output from a plurality of terminals to an inspection device (not shown).

The probe pin 110 may have a long, thin plate shape and may have elasticity along the length direction. At this time, the cross section of the probe pin 110 may be formed to have a relatively long length and a short width. When the probe pin 110 having such a structure is used, it is possible to deal with an electronic device having a fine pattern and to minimize damage to a plurality of terminals provided in the electronic device.

Preferably, the probe pin 110 is made of a nickel-cobalt alloy (Ni-Co alloy), and the surface can be plated with gold (Au). Thus, the durability and electrical conductivity of the probe pin 110 can be improved.

The specific structure of the probe pin 110 will be described later in detail with reference to FIG. The arrangement of the probe pins 110 will be described later in detail with reference to FIG.

The fixing plate 120 has a thin plate shape and includes a plurality of through holes 121 through which a plurality of probe pins 110 are inserted and coupled such that both ends 111 and 112 of the plurality of probe pins 110 are exposed upward and downward .

Preferably, the fixing plate 120 is made of a polyether ether ketone (PEEK) or a ceramic (PEEK) having excellent chemical resistance, water resistance, heat resistance and excellent workability and processability such as injection molding and extrusion molding, and ceramic. Further, the plurality of through-holes 121 formed in the fixed plate 120 can be formed by laser processing.

The driving film 130 is electrically connected at one end to the other end 112 of each of the plurality of probe pins 110 (the lower end of the probe pin 110 in Fig. 2) and at the other end to the inspection device (not shown) . Therefore, the driving film 130 can receive a test signal for inspecting an electronic device on each of the plurality of probe pins 110 from an inspection device (not shown) and apply the test signal to each of the plurality of probe pins 110.

As shown in FIG. 2, the driving film 130 has a thin and flexible film form, and a plurality of wirings 131 are formed on the surface of the film so as to electrically connect the plurality of probe pins 110 and the testing apparatus. And can be formed in a constant pattern. Also, although not shown, a driver IC (not shown) for applying a test signal to the plurality of wirings 131 may be provided. The driving film 130 may be a flexible printed circuit board (FPCB).

The probe block 140 may fix the stationary plate 120 and the driving film 130 in a fixed manner. 2, the probe block 140 includes a first probe block 141 on which a driving film 130 is coupled to an upper surface thereof, and a fixed plate 142 on which a plurality of probe pins 110 are disposed, 120 may be coupled to the second probe block 142.

That is, the probe block 140 includes a driving film 130 disposed on the upper surface of the first probe block 141, and a plurality of probe pins 110 disposed on the upper surface of the driving film 130 The second probe block 142 is coupled to the first probe block 141 using the coupling member 143 in a state where the driving film 130 and the fixing plate 120 are coupled to each other, .

The first probe block 141, the driving film 130, the fixing plate 120, and the second probe block 142 are coupled to the first probe block 141, the driving plate 130, Guide holes 141a, 132, 122 and 142a may be formed in the fixed plate 120 and the second probe block 142, respectively. Therefore, the first probe block 141, the driving film 130, the fixing plate 120, and the second probe block 142 are respectively connected to the guide holes 141a, 132, 122, 142a and the dowel pins, Such as by a guide pin (not shown).

As described above, the electronic component inspection probe 100 according to an embodiment of the present invention includes a plurality of probe pins 110 formed to have elasticity along the length direction, 110 are brought into contact with a plurality of terminals provided on an object to be inspected, damage to the object is minimized and accurate contact is made to a plurality of terminals provided in the electronic device having a fine pattern, .

The probe 100 according to an exemplary embodiment of the present invention includes a plurality of probe pins 110 formed to have elasticity along a longitudinal direction and a fixing plate 120 fixedly coupling the probe pins 110, It is possible to simplify the structure of the electronic element inspection probe 100 and simplify the process for manufacturing the electronic element inspection probe 100, thereby reducing the manufacturing cost.

3, the structure of the probe pin 110 constituting the electronic element inspection probe 100 according to an embodiment of the present invention will be described in detail.

3 is a view showing a structure of a probe pin constituting a probe for inspection of an electronic device according to an embodiment of the present invention.

As shown in FIGS. 2 and 3, the probe pin 110 has a thin and long plate shape, and one end 111 is connected to a plurality of terminals (not shown) provided on an electronic device And the other end 112 may be electrically connected to a plurality of wirings 131 provided on the driving film 130.

In FIG. 3, the both ends 111 and 112 of the probe pin 110 are each in the form of a rectangular plate, and a portion contacting the plurality of terminals provided in the electronic device is a flat type. However, And the shape of both ends 111 and 112 can be changed by a person skilled in the art such as a flat type, a concave type and a convex type according to the type of electronic device.

Preferably, the probe pin 110 may be formed such that the body portion 113, which is a portion to be inserted into and bonded to each of the plurality of through holes 121, has a projected shape from one side to have a coil shape. For example, as shown in FIG. 3, the body 113 may have an approximately 'S' shape, and if necessary, may have a spring shape by repeating a plurality of 'S' shapes. Meanwhile, the probe pin 110 may be manufactured by a semiconductor MEMS (Micro Electro Mechanical Systems) process.

Hereinafter, with reference to FIG. 4, a coupling structure of the probe pin 110 and the fixing plate 120 constituting the probe 100 for testing an electronic device according to an embodiment of the present invention will be described.

4 is a view illustrating a structure in which a probe pin constituting a probe for testing an electronic device according to an embodiment of the present invention is coupled to a fixing plate.

As shown in FIG. 4, each of the plurality of probe pins 110 may be fixed by a curing agent 123 injected into each of the plurality of through-holes 121. Each of the probe pins 110 is inserted into the through hole 121 and then injected into the void space between the probe pin 110 and the through hole 121. After the hardener 123 is injected into the void space between the probe pin 110 and the through hole 121, It can be firmly coupled to the through-hole 121 when it is cured. The hardening agent 123 is preferably a silicone rubber having excellent elasticity and returning force.

As described above, the probe 100 for testing an electronic device according to an embodiment of the present invention includes a plurality of probe pins (not shown) by a curing agent 123 injected into each of a plurality of through-holes 121 formed in a fixed plate 120 110 are fixedly coupled to each other so that the position of each of the plurality of probe pins 110 can be adjusted more precisely and elasticity can be provided to the plurality of probe pins 110 without a separate elastic structure such as a spring, When a plurality of probe pins 110 are brought into contact with a plurality of terminals provided on the electronic device, damage to the electronic device can be reduced and accurate contact can be achieved.

Hereinafter, referring to FIG. 5, various arrangements of the probe pins 110 constituting the probe 100 for testing an electronic device according to an embodiment of the present invention will be described.

5 is a view showing an arrangement of probe pins constituting a probe for testing electronic devices according to an embodiment of the present invention.

5, the plurality of probe pins 110 may include a plurality of probe pins 110, which may correspond to a plurality of terminals (not shown) provided in an electronic device (not shown) Can be arranged in rows.

5A, when the interval p1 between the plurality of wirings 131 formed on the driving film 130 is relatively large corresponding to the interval between the plurality of terminals, the plurality of probe pins 110 are arranged in a row 5B and 5C show a case where the intervals p2 and p3 between the plurality of wirings 131 are relatively narrow, Are arranged in a plurality of columns (C1, C2, C3, ...).

For example, as shown in FIG. 5 (b), when the interval p2 between the plurality of wirings 131 is relatively narrow (for example, p2 <p1), the plurality of probe pins 110 (For example, two columns C1 and C2) along the direction in which the plurality of wirings 131 are arranged. At this time, the plurality of probe pins 110 belonging to each of the plurality of columns C1 and C2 may be arranged so as not to intersect with each other.

5 (c), when the interval p3 between the plurality of wirings 131 is very narrow, the plurality of probe pins 110 are arranged such that a plurality of wirings 131 are arranged (E.g., three columns C 1, C 2, C 3) along the direction. At this time, the plurality of probe pins 110 belonging to each of the plurality of columns C1, C2, and C3 may be arranged so as not to intersect with each other. In particular, each of the plurality of probe pins 110 can rotate the direction of the probe pin 110 having a thin plate shape by a predetermined angle so as not to overlap the adjacent wirings 131.

As described above, the probe 100 for inspecting an electronic device according to an embodiment of the present invention is configured such that a plurality of probe pins 110 do not cross each other according to a distance between a plurality of terminals provided in the electronic device, By arranging them in rows, it is possible to accurately perform inspection of an electronic device having a fine pattern.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, And is not intended to limit the scope of the invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

Description of the Related Art
100: Probe for electronic device inspection
110: probe pin 120: fixed plate
130: driving film 140: probe block

Claims (5)

A plurality of probe pins electrically connected to a plurality of terminals of the electronic element, the probe pins being formed to have elasticity along the longitudinal direction;
A plurality of through-holes through which the plurality of probe pins are inserted and coupled such that both ends of the plurality of probe pins are exposed upward and downward;
A drive film electrically connected to the other end of each of the plurality of probe pins at one end and applying a test signal for inspecting the electronic device to each of the plurality of probe pins; And
And a probe block fixedly coupling the fixed plate and the driving film. The method according to claim 1,
Wherein each of the plurality of probe pins comprises:
Wherein the elongated thin plate-like shape is formed such that the projected shape from one side has a coil shape in a portion inserted into and engaged with each of the plurality of through grooves. The method according to claim 1,
Wherein the fixing plate is made of polyether ether ketone (PEEK) or ceramic. The method according to claim 1,
Wherein each of the plurality of probe pins is fixed by a curing agent injected into each of the plurality of through-holes. The method according to claim 1,
Wherein the plurality of probe pins are arranged in a plurality of rows along a direction in which the plurality of terminals are arranged, and a plurality of probe pins belonging to each of the plurality of columns are arranged so as not to cross each other.

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