KR20180103471A - 3D printing apparatus using selective electrochemical deposition - Google Patents

Abstract

The present invention relates to a 3D printing apparatus using a selective electrochemical deposition capable of increasing 3D printing speed of a metal product put on a substrate by selectively depositing a metal material on the substrate using a nozzle for injecting an electrolyte at predetermined pressure. Because the 3D printing apparatus three-dimensionally prints a metal product by selectively depositing a metal material on a substrate while continuously injecting an electrolyte at predetermined pressure, compared with a cited reference (Korean Publication No. 10-2015-0020356) which can plate only when a meniscus is formed, the 3D printing apparatus according to the present invention can remarkably increase 3D printing speed of the metal material put on the substrate, and may be applied to 3D printing for metal products of a bulk type having relatively large sizes. The 3D printing apparatus comprises a plating bath, a reservoir, a substrate, a nozzle assembly, a first pump, an electrolyte, a discharge unit, a power supply unit, an input unit, a driving unit, and a control unit.

Description

[0001] The present invention relates to a 3D printing apparatus using selective electrochemical deposition,

The present invention relates to a 3D printing apparatus using selective electrochemical electrodeposition, and more particularly, to a 3D printing apparatus using selective electrochemical electrodeposition, in which a metal material is selectively electrodeposited on a substrate using a nozzle for ejecting an electrolyte at a predetermined pressure, The present invention relates to a 3D printing apparatus capable of increasing the size of a 3D printing apparatus.

The 3D printing technology is based on three-dimensional design data, and can be applied to a real model, a prototype, a tool, and a part by using an additive manufacturing method in which a material such as a polymer material, a plastic or a metal powder is laminated And so on.

In the 3D printing method, a liquid-based method and a powder-based method are mainly used depending on the characteristics of a raw material to be used. In the liquid-based method, one layer is laminated by using a liquid polymer synthetic resin, And the powder-based method is a method of melting or sintering a metal raw material in powder form.

3D printers using polymers or plastics as the raw materials are widely used because they can be implemented in a liquid-based manner, while metal materials are difficult to implement in a liquid-based manner and can be implemented mainly in a powder-based manner, Unlike a 3D plasticizer using plastic raw materials for reasons such as cost, complex processing method, high sintering temperature, and explosion risk, it is not widely used.

As a prior art for solving such a problem, Korean Patent Laid-Open Publication No. 10-2015-0098947 discloses a " 3D printing apparatus and method using an electroplating method ".

The 3D printing apparatus according to the prior art applies a voltage to the inside of the meniscus when a meniscus of a metal solution is formed between the printing pen for discharging the metal solution and the substrate, Ions are plated on the substrate.

The 3D printing apparatus according to the prior art provides an advantage that a high-temperature application process for sintering a metal material is not required unlike the powder-based method, which is conventionally used in the case of metal raw materials.

However, in the 3D printing apparatus according to the prior art, since the substrate is plated only in the state in which the meniscus is formed between the printing pen and the substrate, the 3D printing for the bulk scale metal product having a relatively large shape There is a problem in that it is not suitable.

That is, the meniscus refers to the liquid surface phenomenon in the tube which is raised or lowered by the capillary phenomenon due to the surface tension. Since the supply rate of the metal ions supplied into the meniscus is made only by the diffusion, If the substrate is plated only in the state where the meniscus is formed, the 3D printing speed of the metal product stacked on the substrate also depends on the diffusion speed of the metal ions. Therefore, in the 3D printing apparatus according to the prior art, Is so slow that it is not suitable for 3D printing for bulk scale metal products having relatively large shapes.

SUMMARY OF THE INVENTION The present invention provides a 3D printing apparatus capable of increasing the 3D printing speed of a metal product stacked on a substrate without requiring a high temperature application process for sintering a metal material.

A 3D printing apparatus according to an embodiment of the present invention includes a plating bath; A reservoir for storing an electrolyte; A substrate positioned within the plating bath; A nozzle assembly for jetting the electrolyte onto the substrate at a predetermined pressure through a nozzle provided at an end of the nozzle assembly; A first pump for supplying the electrolyte stored in the storage unit to the nozzle assembly at a predetermined pressure; A second pump for supplying the electrolytic solution stored in the storage unit into the plating tank; A discharging unit for discharging the electrolytic solution sprayed through the nozzle and the electrolytic solution supplied to the plating tank by the second pump to the storage unit; A first electrode having a contact with an electrolyte sprayed through the nozzle; and a second electrode having a contact with the electrolyte, wherein a voltage or current is applied to the electrolyte sprayed through the nozzle, A power supply part forming an electrodeposition area in a substrate area; An input unit for inputting 3D printing data of a metal product to be 3D-printed; A driving unit for moving the nozzle assembly to change a position of a nozzle through which the electrolyte is ejected; And a control unit for controlling the driving unit and the power supply unit according to the 3D printing data input from the input unit to selectively stack the electrodeposition area to be electrodeposited on the substrate.

In the 3D printing apparatus according to an embodiment of the present invention, a partition wall is formed on the inner side of the plating vessel at a height lower than the upper end of the outer wall of the plating vessel by a predetermined height to overflow the electrolyte filled in the plating vessel. The discharge unit includes a first discharge port provided under the plating tank and through which the electrolyte is ejected through the nozzle and an electrolyte solution supplied into the plating tank by the second pump is discharged, And a second discharge port for discharging the electrolytic solution discharged to the first discharge port and the electrolytic solution flowing into the overflow channel to the storage section.

According to another aspect of the present invention, there is provided a 3D printing apparatus, wherein the partition wall forms a separate space inside the outer wall with a predetermined distance from the outer wall, wherein the space has a circular or oval shape Lt; / RTI >

In the 3D printing apparatus according to an embodiment of the present invention, an inlet through which the electrolyte supplied from the second pump flows into the plating vessel may be provided on the bottom surface of the plating vessel.

In addition, the 3D printing apparatus according to an embodiment of the present invention may be provided with a disperser at an end of the inlet to disperse an electrolyte flowing into the plating vessel through the inlet.

In addition, the 3D printing apparatus according to an embodiment of the present invention may further include a water level sensing unit for sensing a level of the electrolyte filled in the plating tank, and the control unit controls the second pump according to the sensing of the water level sensing unit. So that the level of the electrolytic solution in the plating bath can be adjusted.

In the 3D printing apparatus according to an embodiment of the present invention, the controller may control the second pump so that the level of the electrolyte in the plating vessel is higher than the end of the nozzle by a predetermined height.

In the 3D printing apparatus according to an embodiment of the present invention, the level sensing unit may be disposed outside the nozzle assembly or the nozzle at a position higher than the end of the nozzle by a predetermined height to sense the electrolyte filled in the plating tank Sensor.

In addition, the 3D printing apparatus according to an embodiment of the present invention may further include a water level adjusting unit for adjusting a water level of the electrolytic solution filled in the plating tank by the second pump.

According to another aspect of the present invention, there is provided a 3D printing apparatus, wherein the water level adjusting unit forms a separate space in a state of being spaced apart from the outer wall by a predetermined distance on the inner side of the outer wall of the plating tank and has a bellow shape As shown in FIG.

According to another aspect of the present invention, there is provided a 3D printing apparatus, wherein the water level adjusting unit forms a separate space inside the outer wall of the plating vessel at a predetermined distance from the outer wall, And a gate member that is adjustable in height in the opening.

According to another aspect of the present invention, there is provided a 3D printing apparatus comprising: a first temperature regulating unit provided between the storage unit and the nozzle assembly for controlling a temperature of an electrolyte supplied to the nozzle assembly by the first pump; And a second temperature adjusting unit provided between the storage unit and the plating bath to adjust the temperature of the electrolyte supplied into the plating bath by the second pump.

The 3D printing apparatus using selective electrochemical electrodeposition according to an embodiment of the present invention having the above-described structure selectively deposits a metal raw material on a substrate using a nozzle for ejecting an electrolyte at a predetermined pressure, It is possible to increase the 3D printing speed of the metal product stacked on the substrate without requiring a high-temperature application process.

In addition, the 3D printing apparatus using selective electrochemical electrodeposition according to an embodiment of the present invention can maintain a state in which the pre-formed electrodeposited layer is immersed in an electrolyte, so that the surface of the electrodeposited layer is exposed to air It is possible to prevent dissolution by the flow of the electrolytic solution ejected through the nozzle.

The effects according to the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims and the detailed description It will be possible.

1 is a schematic view of a 3D printing apparatus according to an embodiment of the present invention,
2 is an enlarged view of a portion 'A' in FIG. 1,
FIG. 3 is a schematic configuration diagram of the 3D printing apparatus according to FIG. 1,
FIG. 4 is a view showing a state where the electrodeposition area is stacked at a predetermined height or more in FIG. 2,
5 is a schematic view of a 3D printing apparatus according to another embodiment of the present invention,
6 is a schematic cross-sectional view of a plating bath according to an embodiment of the present invention,
FIG. 7 is a schematic plan view of the plating bath according to FIG. 6,
8 is a schematic configuration diagram of a 3D printing apparatus according to another embodiment of the present invention,
9 is a view for explaining a water level sensing unit according to an embodiment of the present invention,
10 and 11 are views for explaining a water level adjusting unit according to an embodiment of the present invention,
12 to 14 are views for explaining a water level adjusting unit according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. Rather, the intention is not to limit the invention to the particular forms disclosed, but rather, the invention includes all modifications, equivalents and substitutions that are consistent with the spirit of the invention as defined by the claims.

Also, in the accompanying drawings, thickness and size are exaggerated for the sake of clarity of the description, and thus the present invention is not limited by the relative size or thickness shown in the accompanying drawings.

FIG. 1 is a schematic view of a 3D printing apparatus according to an embodiment of the present invention, FIG. 2 is an enlarged view of a portion 'A' of FIG. 1, and FIG. 3 is a schematic configuration diagram of a 3D printing apparatus according to FIG. to be.

Referring to FIGS. 1 to 3, a 3D printing apparatus 10 according to an embodiment of the present invention includes a plating bath 100, a substrate 20 located inside the plating vessel 100, A control unit 50, an input unit 52, a driving unit 54, an electrolyte solution 12, and a nozzle unit 30. The nozzle assembly 30 has a nozzle 34 at its end, A first pump 70, and a discharge port 101 provided below the plating tank 100. The first pump 70 may be provided with a discharge port 101,

The nozzle assembly 30 ejects the electrolyte solution 12 to the substrate 20 at a predetermined pressure through the nozzle 34 provided at the end.

Thus, when the electrolyte 12 is ejected at a predetermined pressure through the nozzle 34, the electrolyte 12 directed toward the substrate 20 has a substantially straight line.

2, the area 14 where the ejection surface of the electrolyte 12 ejected through the nozzle 34 contacts the substrate 20 is substantially the same as the size of the end 37 of the nozzle 34 It can have a corresponding size.

The power supply unit 40 includes a first electrode 42 having a contact point with the electrolyte 12 ejected through the nozzle 34 and a second electrode 43 having the contact point with the substrate 20, A voltage or an electric current is applied to the electrolytic solution 12.

The metal ions contained in the electrolyte solution 12 ejected through the nozzle 34 can be selectively deposited only in the region 14 where the ejection surface of the electrolyte solution 12 contacts the substrate 20 do.

That is, in the 3D printing apparatus 10 according to the present invention, electrodeposition is performed only in the region 14 where the ejection face of the electrolytic solution 12 ejected through the nozzle 34 by the power supply unit 40 contacts the substrate 20 The electrodeposition region 14 can be formed.

The area of the unit electrodeposition area 14 may be the same as the size of the end surface 37 of the nozzle 34 or the size of the end of the nozzle 34 Can be determined by the distance between the portion (37) and the substrate (20).

For example, the larger the size of the cross section of the end portion 37 of the nozzle 34, the wider the area of the unit electrodeposition region 14 can be. This is because the larger the size of the end face 37 of the nozzle 34 is, the larger the size of the ejection face of the electrolyte 12 ejected through the nozzle 34 becomes.

The area of the unit electrodeposition region 14 is increased as the distance between the end portion 37 of the nozzle 34 and the substrate 20 is larger, . When the gap is large, the electrolyte solution 12 ejected through the nozzle 34 spreads until reaching the substrate 20, and the ejected surface of the electrolyte solution 12, which contacts the substrate 20, (37) cross section.

The input unit 52 receives 3D printing data of a metal product to be 3D-printed. The 3D printing data includes a plane path of a nozzle 34 capable of 3D printing a metal product into the unit electrodeposition area 14, and may include path data.

The driving unit 54 is configured to move the nozzle assembly 30 such that the position of the nozzle 34 from which the electrolyte solution 12 is ejected is changed.

For example, the driving unit 54 can move the position of the nozzle assembly 30 in a plane so that the nozzle 34 moves along the plane path data input from the input unit 52, The nozzle assembly 30 can be vertically moved so that the height of the nozzle 34 can be increased.

The control unit 50 controls the power supply unit 40 and the driving unit 54 according to the 3D printing data input from the input unit 52 to selectively deposit the electrodeposition area 14 to be electrodeposited on the substrate 20. [

For example, the control unit 50 can drive the driving unit 54 to control the position of the nozzle assembly 30 on the plane so that the nozzle 34 can move along the plane path data input from the input unit 52 The power supply part 40 can be controlled so that the electrodeposition area 14 to be electrodeposited on the substrate 20 can be selectively formed and the nozzle 34 can be controlled as the stack height of the electrodeposition area 14 is increased. The height of the nozzle assembly 30 can be controlled by driving the driving unit 54 so that the height of the nozzle assembly 30 can be increased.

The first pump 70 is configured to supply the electrolyte solution 12 stored in the storage unit 60 to the nozzle assembly 30 at a predetermined pressure. The first pump 70 supplies a predetermined pressure to the nozzle assembly 30, The electrolytic solution 12 can be ejected to the substrate 20 at a predetermined pressure through the nozzle 34 provided at the end thereof with a substantially straight line. The electrolytic solution 12 sprayed through the nozzle 34 is selectively deposited on the substrate 20 to form an electrodeposited region 14 and then discharged through a discharge port 101 provided under the plating tank 100 to be stored And can be stored again in the unit 60.

That is, in the 3D printing apparatus 10 according to the present invention, the metal ions of the electrolyte 12 ejected at a predetermined pressure through the nozzle 34 are selectively deposited on the substrate 20 to form the electrodeposited region 14, The electrolytic solution 12 can be configured to circulate the electrolytic solution 12 continuously until the metal ion concentration of the electrolytic solution 12 reaches a predetermined metal ion threshold value (lower limit value).

The 3D printing apparatus 10 further includes a pressure sensor 74 for sensing the pressure of the electrolyte 12 ejected through the nozzle 34. The control unit 50 controls the pressure The pressure of the electrolyte 12 ejected through the nozzle 34 can be controlled by controlling the first pump 70 according to the detection result of the sensor 74.

For example, the 3D printing data input through the input unit 52 may include information on the ejection pressure range of the electrolyte solution 12, and the controller 50 may control the jetting of the electrolyte solution 12 ejected through the nozzle 34 The first pump 70 can be controlled from the detection result of the pressure sensor 74 so that the pressure can maintain the ejection pressure range included in the 3D printing data.

As described above, according to the 3D printing apparatus 10 according to an embodiment of the present invention, as the metal raw material is selectively electrodeposited on the substrate 20 while the electrolyte 12 is continuously ejected at a predetermined pressure, The 3D printing of the metal product stacked on the substrate 20 is performed in comparison with the prior art in which the plating is performed only when the meniscus is formed (Korean Patent Laid-Open Publication No. 10-2015-0098947) The printing speed can be remarkably increased, so that the 3D printing apparatus 10 according to the present invention can be applied to 3D printing for a bulk scale metal product having a comparatively large shape.

In the 3D printing apparatus 10 according to an embodiment of the present invention, only the region where the electrolyte 12 ejected at a predetermined pressure through the nozzle 34 contacts the substrate 20, that is, only the electrodeposition region 14 In 3D printing by selectively electrodepositing, it is an important factor to determine the quality of the 3D printing of the metal product to be formed so that the electrodeposition in the electrodeposition area 14 is precisely performed with uniform thickness and area do.

That is, in the 3D printing apparatus 10 according to an embodiment of the present invention, in order to improve the 3D printing quality of the metal product, it is necessary to precisely perform the electrodeposition region 14 with uniform thickness and area, Pressure and temperature of the electrolytic solution 12 ejected at a predetermined pressure through the nozzle 34 and the distance between the end portion 37 of the nozzle 34 and the substrate 20, It is necessary to precisely control the 3D shape of the product, target characteristics such as the texture, mechanical properties, composition and the like of the material to be electrodeposited on the substrate 20, the kind of electrolyte, and the like.

Particularly, in the configuration in which the electrolytic solution 12 is circulated by the first pump 70 as in the 3D printing apparatus 10 according to the embodiment of the present invention, the temperature of the circulating electrolytic solution 12 can be easily changed It is necessary to adjust the temperature of the electrolyte solution 12 ejected through the nozzle 34 to a temperature range in which electrodeposition can smoothly occur depending on the type of the electrolyte solution 12.

The 3D printing apparatus 10 according to an embodiment of the present invention includes an electrolyte solution supplied to the nozzle assembly 30 by the first pump 70 provided between the storage unit 60 and the nozzle assembly 30, And a first temperature regulating unit 80 for regulating the temperature of the heat exchanger 12.

The first temperature regulating unit 80 is provided so as to surround a predetermined portion of the pipe 17 which is a moving passage through which the electrolytic solution 12 is circulated and can heat or cool the electrolytic solution 12 moved to the pipe 17 And a thermoelectric device.

The 3D printing apparatus 10 according to an embodiment of the present invention may further include a temperature sensor 83 for sensing the temperature of the electrolyte 12 circulating through the pipe 17.

The controller 50 controls the first temperature controller 80 to adjust the temperature of the electrolyte 12 ejected to the substrate 20 through the nozzle 34 according to the detection result of the temperature sensor 83 have.

For example, the 3D printing data input through the input unit 52 may include temperature range information of the electrolytic solution 12 in which electrodeposition can smoothly occur depending on the type of the electrolytic solution 12, The first temperature regulator 80 can be controlled from the detection result of the temperature sensor 83 so that the temperature of the electrolyte 12 ejected through the nozzle 34 can maintain the temperature range included in the 3D printing data .

The temperature range information according to the type of the electrolyte 12 may be about 35 to 55 ° in the case of a nickel alloy electrolyte and about 0 to 25 ° in the case of a copper alloy electrolyte.

The temperature sensor 83 may be located on the outlet side of the first temperature regulating unit 80 so as to measure the temperature of the electrolytic solution 12 heated or cooled by the first temperature regulating unit 80 Or the end of the nozzle 34 so as to more accurately measure the temperature of the electrolyte solution 12 ejected through the nozzle 34. However, the present invention is not limited thereto.

The 3D printing apparatus 10 according to an embodiment of the present invention may further include a heater 64 that heats the temperature of the electrolyte solution 12 stored in the storage unit 60 to maintain a predetermined temperature have.

The temperature of the electrolyte solution 12 in the first temperature controller 80 can be more easily controlled by keeping the temperature of the electrolyte solution 12 stored in the storage unit 60 constant by the heater 64. [

4 is a view showing a state in which the electrodeposition region is stacked at a predetermined height or more in FIG.

4, when the electrodeposition area 14 is stacked at a predetermined height, the height of the end portion 37 of the nozzle 34 can be increased by the stack height of the electrodeposition area 14.

For example, the control unit 50 may vertically move the nozzle assembly 30 by driving the driving unit 54 as the electrodeposition area 14 is stacked. The height of the tip end portion 37 of the nozzle 34 can be increased by the height of the stacking of the electrodeposition region 14 so that the height of the top end surface 15 of the electrodeposition region 14 and the tip end portion 37 of the nozzle 34 The interval can be kept constant.

4, in the 3D printing apparatus 10 according to the present embodiment, the surface of the electrodeposition layer 17 is corroded by oxidation or ejected into the electrodeposition region 14 as the surface of the electrodeposition layer 17 is exposed to the air There is a problem that the electrolytic solution 12 comes into contact with the electrolytic solution 12 and dissolves.

Hereinafter, a 3D printing apparatus according to another embodiment of the present invention will be described in detail. However, the 3D printing apparatus according to the present embodiment has a problem in that the surface of the electrodeposition layer 17 is exposed to the air and is corroded by oxidation or dissolved by the flow of the electrolyte 12, Hereinafter, only the structure for solving the above problems will be described in detail, and detailed descriptions and reference numerals for other structures will be used for the detailed description and reference numerals in the above embodiments.

5 is a schematic view of a 3D printing apparatus according to another embodiment of the present invention.

Referring to FIG. 5, the 3D printing apparatus 10 according to the present embodiment may further include a second pump 72 for filling the inside of the plating tank 100 with the electrolyte solution 12.

That is, the 3D printing apparatus 10 according to the present embodiment is different from the above-described embodiment in that the first pump 70 for supplying the electrolytic solution 12 stored in the storage unit 60 to the nozzle assembly 30 And a second pump 72 for supplying the electrolytic solution 12 stored in the storage unit 60 into the plating tank 100.

The discharging unit 110 according to the present embodiment stores the electrolytic solution 12 ejected through the nozzle 34 and the electrolytic solution 12 supplied into the plating bath 100 by the second pump 72 (60).

Therefore, in the 3D printing apparatus 10 according to the present embodiment, the water level of the electrolytic solution 12 filled in the plating tank 100 is supplied to the nozzle assembly 30 by the first pump 70, The supply amount of the electrolytic solution 12 to be supplied to the plating tank 100 by the second pump 70 and the amount of the electrolytic solution to be discharged through the discharge unit 110 Lt; / RTI >

In this case, the interior of the plating vessel 100 can be easily filled with the electrolyte solution 12 by the second pump 72. When the inside of the plating vessel 100 is filled with the electrolyte solution 12 and 3D printing is performed, Since the electrodeposited layer 17 can be immersed in the electrolyte solution 12, it is possible to prevent surface corrosion due to oxidation caused by exposure of the electrodeposition layer 17 to air.

When a current or voltage for forming the electrodeposited region 14 is applied while the inside of the plating vessel 100 is filled with the electrolytic solution 12, a minute current flows in the electrolytic solution 12 filled in the plating bath 100 This makes it possible to prevent dissolution of the surface of the base electrodeposited layer 17 due to the electrolyte 12 which is ejected into the electrodeposition area 14 and flows to the base electrodeposited layer 17.

The 3D printing apparatus 10 according to the present embodiment is provided between the storage unit 60 and the plating tank 100 so that the temperature of the electrolytic solution supplied into the plating tank 100 by the second pump 72 And a second temperature regulator 85 for regulating the temperature.

Thus, not only the temperature of the electrolyte 12 ejected through the nozzle 34 but also the temperature of the electrolyte 12 filled in the plating bath 100 can be controlled, thereby enabling smooth and precise control of the temperature of the electrolyte Can be.

The detailed configuration of the second temperature regulator 85 may be the same as that of the first temperature regulator 85, and thus a detailed description thereof will be omitted for the first temperature regulator 85 The detailed description will be given.

FIG. 6 is a schematic cross-sectional view of a plating bath according to an embodiment of the present invention, and FIG. 7 is a schematic plan view of a plating bath according to FIG.

6 and 7, the plating vessel 100 according to the present embodiment may be provided with an inlet 104 through which the electrolytic solution supplied from the second pump 72 flows into the plating vessel 100.

The inlet 104 may be provided on a side surface of the plating tank 100, but it may be provided on the bottom surface of the plating tank 100 as in the present embodiment. This is to minimize unnecessary flow of the electrolytic solution 12 into the plating tank 100 by the electrolytic solution flowing into the inlet 104.

An electrolytic solution 12 ejected at a predetermined pressure through a nozzle 34 is present in the plating bath 100 filled with the electrolytic solution 12. The current for forming the electrodeposited region 14 A fine current flows through the electrolytic solution 12 filled in the plating bath 100 by the applied current or voltage. In this state, due to the electrolytic solution flowing into the inlet 104, If unnecessary flow of the electrolytic solution 12 is generated within the electrodeposits 100, it may adversely affect the formation of the uniform electrodeposition region 14, and unnecessary electrochemical reactions may occur and unnecessary electrodeposition may be performed in an undesired region, I do not.

A disperser 107 may be provided at an end of the inlet 104 to disperse an electrolyte flowing into the plating vessel 100 through an inlet 104. For example, the disperser 107 may be in the form of a shower head having a plurality of small holes at its end.

When the disperser 107 is provided at the end of the inlet 104 as described above, the electrolytic solution flowing into the plating vessel 100 through the inlet 104 is scattered and dispersed, and the electrolytic solution flowing into the inlet 104 The unnecessary flow of the electrolytic solution 12 inside the plating bath 100 can be further minimized.

Meanwhile, a partition wall 120 having a height lower than the outer wall 102 by a predetermined height may be provided on the inner side of the plating vessel 100 according to the present embodiment.

The discharging unit 110 according to the present embodiment is disposed below the plating tank 100 and is disposed inside the plating tank 100 by the electrolyte 12 and the second pump 72 ejected through the nozzle 34. [ An overflow flow path 114 in which an electrolyte overflows over the partition 120 flows; an electrolytic solution discharged to the first discharge port 112; And a second discharge port 115 for discharging the electrolytic solution introduced into the reservoir portion 114 to the storage portion 60.

The partition wall 120 and the discharge unit 110 are configured such that the electrolyte 12 filled in the plating vessel 100 is overflowed to the outside of the outer wall 102 by the supply of the electrolyte by the second pump 72 .

7, the partition 120 forms a separate space 125 inside the outer wall 102 in a state of being spaced apart from the outer wall 102 by a predetermined distance, Or oval shape. Here, the space 125 is a space filled with the electrolyte 12 supplied through the nozzle 34 and the electrolyte supplied by the second pump 72.

If the end face of the space 125 formed by the partition 120 has a circular or elliptical shape, the unnecessary electrolyte 12 in the space 125 due to the flow of the electrolyte overflowing the partition 120, Flow generation can be minimized.

That is to say that the electrolyte flow that overflows the partition 120 also flows in the space 125 as well as the electrolyte flow that flows into the inlet 104 generates an unnecessary flow of electrolyte 12 in the space 125 The unnecessary flow of the electrolytic solution 12 may be generated. If the cross section of the space 125 defined by the partition 120 has a circular or oval shape as shown in FIG. 7, Can be minimized.

8 is a schematic block diagram of a 3D printing apparatus according to another embodiment of the present invention.

Referring to FIG. 8, the 3D printing apparatus 10 according to the present embodiment includes a water level sensing unit 130 for sensing the level of the electrolytic solution 12 filled in the plating tank 100, And a water level adjusting unit 140 for adjusting the water level of the electrolyte 12 to be filled.

At this time, the controller 50 can control the second pump 72 or the water level controller 140 according to the detection of the water level detector 130 to adjust the water level of the electrolytic solution 12 in the plating tank 100.

The controller 50 controls the second pump 72 or the water level controller (not shown) so that the water level of the electrolytic solution 12 in the plating tank 100 is maintained at a predetermined level higher than the end 37 of the nozzle 34 140).

When the level of the electrolyte 12 in the plating bath 100 is lower than the end 37 of the nozzle 34, the electrolyte 12 ejected from the end 37 of the nozzle 34 It is undesirable because it is disturbed. Conversely, if the level of the electrolytic solution 12 in the plating bath 100 is too high, a large part of the nozzle assembly 30 may be immersed in the electrolytic solution 12, thereby causing a problem in the durability of the nozzle assembly 30 due to corrosion And an electrolytic solution to fill the inside of the plating bath 100 is required.

The height of the end portion 37 of the nozzle 34 gradually increases as the electrodeposition region 14 is stacked in the nozzle 34 according to the present embodiment, The second pump 72 or the water level control unit 140 is controlled according to the detection of the water level sensing unit 130 so that the water level of the water level sensor 12 gradually increases as the height of the end portion 37 of the nozzle 34 increases .

9 is a view for explaining a water level sensing unit according to an embodiment of the present invention.

9, the water level sensing unit 130 according to the present embodiment is provided at a position higher than the end portion 37 of the nozzle 34 by a predetermined height on the outside of the nozzle assembly 30 or the nozzle 34 And a sensor 134 for sensing the electrolyte.

If the electrolyte sensing sensor 134 is provided at a position higher than the end 37 of the nozzle 34 by a predetermined height above the nozzle assembly 30 or the nozzle 34, The second pump 72 or the water level control unit 70 may be controlled according to the detection of the sensor 134 so that the water level of the electrolytic solution 12 in the tank 100 is kept higher than the end 37 of the nozzle 34 by a predetermined height, The control unit 140 can be controlled.

For example, when the electrolyte is detected by the sensor 134, the control unit 50 stops the operation of the second pump 72, and when the detection of the electrolyte is released, the second pump 72 The second pump 72 can be controlled so that the level of the electrolyte 12 in the plating bath 100 is higher than the end 37 of the nozzle 34 by a predetermined height.

Particularly, since the sensor 134 is provided on the outer side of the nozzle assembly 30 or the nozzle 34, as the electrodeposition region 14 is stacked, The control unit 50 controls the second pump 72 or the water level control unit 140 in accordance with the detection of the sensor 134 so that the water level of the electrolytic solution 12 in the plating tank 100 is lowered Can be adjusted so as to be maintained at a predetermined height higher than the height of the tip portion (37) of the nozzle (34).

In another embodiment, the water level sensing unit 130 may include a camera for directly photographing and sensing the water level of the electrolyte solution 12 filled in the plating bath 100.

10 and 11 are views for explaining a water level adjusting unit according to an embodiment of the present invention.

10 and 11, the water level adjusting unit 140 according to the present embodiment forms a separate space on the inner side of the outer wall 102 of the plating tank 100 with a predetermined distance from the outer wall 102 And may include a height-adjustable bellow-shaped partition wall 142.

Then, as shown in FIG. 10, the water level of the electrolytic solution 12 in the plating tank 100 can be adjusted by adjusting the height of the barrier ribs 142.

The electrolytic solution overflowed onto the bellows-shaped partition wall 142 may be discharged to the storage unit 60 through the overflow passage 114 and the second discharge port 115 of the discharge unit 110.

In this case, the cross section of the space formed by the partition 142 may be circular or elliptical. If the cross section of the space formed by the partition 142 has a circular or oval shape, It is possible to minimize the occurrence of unnecessary flow of the electrolytic solution 12 in the space due to the overflow of the electrolytic solution.

The water level adjusting unit 140 may further include a height adjusting unit (not shown) for adjusting the height of the bellows-shaped partition wall 142.

11, the controller 50 controls the height adjusting device according to the detection of the water level sensing unit 120 such as the sensor 124 to adjust the height of the bellows-shaped partition wall 142 The water level of the electrolytic solution 12 in the plating bath 100 can be kept higher than the end 37 of the nozzle 34 by a predetermined height.

12 to 14 are views for explaining a water level adjusting unit according to another embodiment of the present invention.

12 to 14, the water level adjusting part 140 according to the present embodiment forms a separate space inside the outer wall 102 of the plating tank 100 in a state of being spaced apart from the outer wall 102 by a predetermined distance A partition 143 having an opening 145 formed in a vertical direction and a gate member 147 provided to adjust the height of the opening 145.

Then, as shown in FIG. 12, the height of the gate member 147 can be adjusted to adjust the water level of the electrolytic solution 12 in the plating bath 100.

The electrolytic solution overflowed onto the gate member 147 may be discharged to the storage unit 60 through the overflow passage 114 and the second discharge port 115 of the discharge unit 110.

In this case, the cross section of the space defined by the partition 143 may be circular or elliptical. If the cross section of the space formed by the partition 143 has a circular or oval shape, It is possible to minimize the occurrence of unnecessary flow of the electrolytic solution 12 in the space due to the overflow of the electrolytic solution.

The water level adjusting unit 140 may further include a height adjusting unit (not shown) for adjusting the height of the gate member 147.

14, the control unit 50 controls the height adjusting unit according to the detection of the level sensing unit 120 such as the sensor 124 to adjust the height of the gate member 147, The water level of the electrolytic solution 12 in the plating bath 100 can be kept higher than the end 37 of the nozzle 34 by a predetermined height.

As described above, the present invention relates to a 3D printing apparatus capable of increasing the 3D printing speed of a metal product stacked on a substrate by selectively depositing a metal material on a substrate using a nozzle for ejecting an electrolyte at a predetermined pressure It is to be understood that the embodiments may be embodied in various forms. Accordingly, the present invention is not limited to the embodiments disclosed herein, and all changes which can be made by those skilled in the art are also within the scope of the present invention.

10: 3D printing device 12: electrolyte
14: electrodeposition region 20: substrate
30: nozzle assembly 34: nozzle
40: power supply unit 42: first electrode
43: second electrode 50:
52: input unit 54:
60: storage part 70: first pump
72: second pump 74: pressure sensor
80: first temperature regulator 83: temperature sensor
85: second temperature regulator
100: plating tank 102: outer wall
104: inlet 107: disperser
110: discharging part 112: first discharging port
114: overflow channel 115: second outlet
120: partition wall 130:
134: sensor 140:

Claims (12)

A plating bath;
A reservoir for storing an electrolyte;
A substrate positioned within the plating bath;
A nozzle assembly for jetting the electrolyte onto the substrate at a predetermined pressure through a nozzle provided at an end of the nozzle assembly;
A first pump for supplying the electrolyte stored in the storage unit to the nozzle assembly at a predetermined pressure;
A second pump for supplying the electrolytic solution stored in the storage unit into the plating tank;
A discharging unit for discharging the electrolytic solution sprayed through the nozzle and the electrolytic solution supplied to the plating tank by the second pump to the storage unit;
A first electrode having a contact with an electrolyte sprayed through the nozzle; and a second electrode having a contact with the electrolyte, wherein a voltage or current is applied to the electrolyte sprayed through the nozzle, A power supply part forming an electrodeposition area in a substrate area;
An input unit for inputting 3D printing data of a metal product to be 3D-printed;
A driving unit for moving the nozzle assembly to change a position of a nozzle through which the electrolyte is ejected; And
And a control unit controlling the driving unit and the power supply unit according to the 3D printing data input from the input unit to selectively stack the electrodeposition area to be electrodeposited on the substrate. The method according to claim 1,
Wherein the plating vessel is provided at its inner side with a partition wall which is formed at a height lower than the upper end of the outer wall of the plating vessel by a predetermined height to overflow the electrolyte filled in the plating vessel,
The discharge portion
A first discharge port provided below the plating vessel and through which the electrolyte is ejected through the nozzle and the electrolyte supplied into the plating vessel by the second pump,
An overflow passage through which the electrolytic solution overflows over the partition,
And a second outlet for discharging the electrolytic solution discharged to the first discharge port and the electrolytic solution flowing into the overflow channel to the storage part. 3. The method of claim 2,
Wherein the partition wall forms a separate space inside the outer wall with a predetermined distance from the outer wall, and the space has a circular or elliptical shape in cross section. The method according to claim 1,
And an inlet port through which the electrolyte supplied from the second pump flows into the plating vessel is provided on the bottom surface of the plating vessel. 5. The method of claim 4,
And a disperser for dispersing an electrolyte flowing into the plating vessel through the inlet is provided at an end of the inlet. The method according to claim 1,
The 3D printing apparatus may further include a water level sensing unit for sensing a water level of the electrolyte filled in the plating tank,
Wherein the controller controls the level of the electrolyte in the plating tank by controlling the second pump according to the detection of the level sensing unit. The method according to claim 6,
Wherein the control unit controls the second pump so that the level of the electrolytic solution in the plating tank is higher than the end of the nozzle by a predetermined height. 8. The method of claim 7,
Wherein the level sensing unit includes a sensor disposed at an outer side of the nozzle assembly or the nozzle at a predetermined height higher than an end of the nozzle to sense the electrolyte filled in the plating tank. The method according to claim 1,
Wherein the 3D printing apparatus further comprises a water level adjusting unit for adjusting a water level of the electrolytic solution filled in the plating tank by the second pump. 10. The method of claim 9,
Wherein the water level adjusting part includes a bellow-shaped partition wall which is formed on the inside of the outer wall of the plating vessel so as to be spaced apart from the outer wall by a predetermined distance and is adjustable in height. 10. The method of claim 9,
Wherein the water level adjusting part includes a partition wall having an opening formed in a vertical direction and forming a separate space inside the outer surface of the plating vessel so as to be spaced apart from the outer wall by a predetermined distance and a gate member provided to adjust the height of the opening, Wherein the 3D printing device is a 3D printing device. The method according to claim 1,
The 3D printing apparatus includes a first temperature regulating unit provided between the storage unit and the nozzle assembly for regulating the temperature of the electrolyte supplied to the nozzle assembly by the first pump, And a second temperature controller for controlling the temperature of the electrolyte supplied to the plating vessel by the second pump.

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