CN113085168A - Electronic component 3D printing device and method based on selective electrodeposition - Google Patents

Electronic component 3D printing device and method based on selective electrodeposition Download PDF

Info

Publication number
CN113085168A
CN113085168A CN202110329847.4A CN202110329847A CN113085168A CN 113085168 A CN113085168 A CN 113085168A CN 202110329847 A CN202110329847 A CN 202110329847A CN 113085168 A CN113085168 A CN 113085168A
Authority
CN
China
Prior art keywords
printing
electrolyte
distilled water
conductive
spray head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110329847.4A
Other languages
Chinese (zh)
Inventor
吴文征
王静
郭金雨
刘天宇
赵继
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jilin University
Original Assignee
Jilin University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jilin University filed Critical Jilin University
Priority to CN202110329847.4A priority Critical patent/CN113085168A/en
Publication of CN113085168A publication Critical patent/CN113085168A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/118—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using filamentary material being melted, e.g. fused deposition modelling [FDM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/379—Handling of additively manufactured objects, e.g. using robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B33Y40/20—Post-treatment, e.g. curing, coating or polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Robotics (AREA)
  • Ceramic Engineering (AREA)
  • Civil Engineering (AREA)
  • Composite Materials (AREA)
  • Structural Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention relates to a 3D printing device and method for an electronic component based on selective electrodeposition, and belongs to the technical field of 3D printing and electrodeposition. The X-axis moving device, the Y-axis moving device and the Z-axis moving device are arranged on the support, the spray head device is arranged on the X-axis moving device and the Y-axis moving device, the supporting plate is arranged on the Z-axis moving device, the printing and depositing chamber is arranged above the supporting plate and can move in the Z direction, and the electrolyte circulating device and the distilled water circulating device are arranged at the bottom of the support. The method is based on Fused Deposition Modeling (FDM) principle and selective electrodeposition principle, the electronic component is prepared in a 3D printing mode, compared with the traditional method for producing the electronic component, the forming process is greatly simplified, the process cost is low, the complex structure is convenient to form, compared with other methods for printing and forming the electronic component in 3D, the method combines the electrodeposition principle to conveniently realize the forming of the metal structure with better conductivity, and the performance of the prepared electronic component is improved.

Description

Electronic component 3D printing device and method based on selective electrodeposition
Technical Field
The invention belongs to the field of 3D printing technology and electrodeposition technology, and particularly relates to a 3D printing device and a method for manufacturing an electronic component by utilizing Fused Deposition Modeling (FDM) technology and selective electrodeposition technology.
Background
The 3D printing technique is also called additive manufacturing, which is a technique of constructing an object by printing layer by layer using an adhesive material such as powdered metal or polymer based on a target digital model file.
Fused Deposition Modeling (FDM) is one of 3D printing techniques that heat melts a filamentous hot melt material that is extruded through an extrusion head with a fine nozzle. After melting, the hot melting material sprayed out from the nozzle is deposited on the panel or the solidified material of the previous layer, and the material starts to solidify after the temperature is lower than the solidification temperature, and the final finished part is formed by stacking the materials layer by layer.
Selective electrodeposition technology is a method of selectively depositing a metal in regions based on the principle of electrodeposition. The electrodeposition process is the basis of techniques such as electroplating and electroforming, and refers to a process in which ions of a metal or an alloy are subjected to electrochemical reduction reaction at a cathode based on the principle of electrochemical reaction from a compound aqueous solution, a nonaqueous solution or a salt melt, thereby finally depositing the metal or the alloy. Selective electrodeposition is to make the surface part to be deposited conductive by chemical plating and other technical means, and then the metal can be deposited only on the conductive part of the structure after the electrification to form the metal part with a specific shape.
Electronic components are components of electronic components and small-sized machines and instruments, are generally composed of a plurality of parts, can be commonly used in similar products, and generally comprise components such as resistors, inductors, Printed Circuit Boards (PCBs) and integrated circuits in electronic devices. With the development of electronic technology, electronic devices become more and more complex, the requirements for electronic components are higher and higher, and the electronic components are increasingly developed in a direction of miniaturization and complexity. In the last 60 years, integrated circuits integrating electronic components on a substrate were first introduced, which greatly advanced chip technology and electronic computer technology, and the invented integrated circuits provided researchers with more advanced tools and thus produced a number of more advanced technologies that further promoted the emergence of higher performance integrated circuits, i.e., made higher demands on the electronic components that make up the integrated circuits.
Disclosure of Invention
The invention provides a 3D printing device and method for electronic components based on selective electrodeposition.
The technical scheme adopted by the invention is as follows: electronic components 3D printing device based on selective electrodeposition technique, which comprises a bracket, x axle mobile device, y axle mobile device, the shower nozzle device, z axle mobile device, the backup pad, print the deposit room, electrolyte circulating device, distilled water circulating device, wherein x axle mobile device, y axle mobile device, on the z axle mobile device installing support, the shower nozzle device is installed on x axle mobile device, y axle mobile device, can do xy direction and remove, the backup pad is installed on z axle mobile device, it arranges the backup pad top in to print the deposit room, can do z direction and remove, electrolyte circulating device, distilled water circulating device arranges the support bottom in.
The x-axis moving device comprises a first optical lever, a first moving block, a first belt, a first stepping motor, a first driving belt pulley, a first driving shaft rod, a first driven belt pulley and a first driven shaft rod, wherein the two sides of the first optical lever are inserted into the support to be fixed, the first moving block is connected with the first optical lever in a sliding mode and only has the freedom degree in the x direction, the first driving belt pulley and the first driven belt pulley are fixedly connected with the first driving shaft rod and the first driven shaft rod respectively, the first belt is wound on the first driving belt pulley and the first driven belt pulley, and an output shaft of the stepping motor is fixedly connected with the first driving shaft rod.
The y-axis moving device comprises a second optical lever, a second belt, a second moving block, a second stepping motor, a second driving belt pulley, a second driving shaft rod, a second driven belt pulley and a second driven shaft rod, wherein the two sides of the optical lever are inserted into the support to be fixed, the second moving block is in sliding connection with the second optical lever and only has the freedom degree in the y direction, the second driving belt pulley and the second driven belt pulley at the two ends are respectively fixedly connected with the second driving shaft rod and the second driven shaft rod, the second belt is wound on the second driving belt pulley and the second driven belt pulley, and an output shaft of the second stepping motor is fixedly connected with the second driving shaft rod.
The spray head device comprises an insulating wire spray head, a conductive wire spray head, a spray head clamping block, a conductive wire feed pipe, an insulating wire feed pipe, a third optical lever and a fourth optical lever, wherein the insulating wire feed pipe and the conductive wire feed pipe respectively convey insulating wires and conductive wires to the insulating wire spray head and the conductive wire spray head, the insulating wire spray head and the conductive wire spray head are fixed on the spray head clamping block, the third optical lever and the fourth optical lever are inserted into the spray head clamping block, and the first movable block on the x-axis moving device and the second movable block on the y-axis moving device respectively drive the third optical lever, the fourth optical lever and the spray head clamping block thereon, the insulating wire spray head and the conductive wire spray head to move in the x direction and the y direction.
The z-axis moving device comprises a third stepping motor, a fifth feed rod, a sixth feed rod, a seventh feed rod, an eighth feed rod, a first screw, a second screw, a first lifting block and a second lifting block, wherein the fifth feed rod, the sixth feed rod, the first screw, the seventh feed rod, the eighth feed rod and the second screw are respectively fixed on the bracket, the first lifting block is in threaded connection with the first screw, the second lifting block is in threaded connection with the second screw, and three output shafts of the stepping motor are fixedly connected with the upper end of the second screw.
The printing deposition chamber comprises a printing deposition groove, a copper plate, a positive terminal, a negative terminal and a conductive adhesive tape, wherein the copper plate and the conductive adhesive tape are respectively fixed on the side surface and the bottom of the printing deposition groove, the positive terminal is fixedly connected to the copper plate, and the negative terminal is fixedly connected to the conductive adhesive tape.
The electrolyte circulating device comprises an electrolyte tank, an electrolyte supply pipeline and an electrolyte output pipeline, wherein the electrolyte supply pipeline is connected with the electrolyte tank and the printing and depositing tank, and the electrolyte output pipeline is connected with the electrolyte tank and the printing and depositing tank.
The distilled water circulating device comprises a distilled water tank, a distilled water supply pipeline and a distilled water output pipeline, wherein the distilled water supply pipeline is connected with the distilled water tank and the printing sedimentation tank, and the distilled water output pipeline is connected with the distilled water tank and the printing sedimentation tank.
A3D printing method of an electronic component based on selective electrodeposition comprises the following steps:
(1) preparing an FDM wire material: preparing an insulating wire material: selecting thermoplastic high polymer material powder: drying the powder to remove moisture, and then melting and extruding to prepare a wire material, wherein the diameter of the wire material depends on the requirements of a printer; preparing an electric conduction wire material: selecting thermoplastic high polymer material powder: polylactic acid PLA, polyether ether ketone PEEK or polyphenylene sulfide PPS and conductive functional particle powder: respectively drying the two kinds of powder to remove moisture, then mixing the two kinds of powder by using a mixer, drying the uniformly mixed powder again to remove moisture, and then carrying out melt extrusion to prepare a wire material, wherein the diameter of the wire material depends on the requirement of a printer and is the same as that of an insulating wire material;
(2) and preparing electrolyte: taking CuSO4·5H20, 20-30 g, concentrated H2SO40-30mL, adding into a proper amount of distilled water, stirring by using a magnetic stirrer to uniformly mix, and preparing into 250mL of electrolyte;
(3) and model data conversion: designing a 3D printed part structure according to the structure of a required conductive element, wherein the part structure consists of a conductive area and an insulating area, the conductive area of the part is in contact with a conductive adhesive tape in a printing deposition chamber, then constructing a corresponding Catia model, slicing and layering the model from the Z direction to enable the thickness of each layer to be micron-sized, and importing graphic information of each layer of the model into a calculated control program;
(4) printing the three-dimensional part: based on a corresponding three-dimensional part Catia model, an insulating wire spray head and a conductive wire spray head in a spray head device respectively melt and extrude insulating wires and conductive wires, and three-dimensional parts consisting of insulating areas and conductive areas are stacked layer by layer;
(5) selective electrodeposition of copper metal: the conductive area of the three-dimensional part formed after 3D printing is contacted with a conductive adhesive tape in a printing deposition chamber, the three-dimensional part is connected with a power supply cathode through a cathode wiring to be used as an electrodeposition cathode, a copper plate is connected with a power supply anode through an anode wiring to be used as an electrodeposition anode, electrolyte in an electrolyte tank is supplied to the printing deposition tank through an electrolyte supply pipeline, then the power supply is switched on, and metal copper is selectively deposited on the surface of the conductive area of the three-dimensional part according to the electrochemical reaction principle to prepare an electronic component;
(6) and cleaning and drying the electronic components: after the conductive element is prepared by printing the three-dimensional part and selectively electrodepositing copper metal, the electrolyte is output to the electrolyte tank again through the electrolyte output pipe and the printing and depositing tank, then distilled water in the distilled water tank is supplied to the printing and depositing tank through the distilled water supply pipe, the electronic component and the printing and depositing chamber are cleaned, the cleaned distilled water is output to the distilled water tank through the distilled water output pipe and the printing and depositing tank, and the electronic component is taken out after being dried.
The invention has the following advantages:
the method is based on Fused Deposition Modeling (FDM) principle and selective electrodeposition principle, the electronic component is prepared in a 3D printing mode, compared with the traditional method for producing the electronic component, the forming process is greatly simplified, the process cost is low, and the complex structure is convenient to form.
Compared with other methods for forming electronic components by 3D printing, the method disclosed by the invention combines the electro-deposition principle to conveniently realize the formation of the metal structure with better conductivity, and improves the performance of the prepared electronic components.
Drawings
FIG. 1 is a schematic diagram of the apparatus of the present invention;
FIG. 2 is a schematic view of an x-axis displacement apparatus of the present invention;
FIG. 3 is a schematic view of a y-axis motion device of the present invention;
FIG. 4 is a schematic view of a showerhead arrangement according to the present invention;
FIG. 5 is a schematic view of a z-axis motion mechanism of the present invention;
FIG. 6 is a schematic view of a printing deposition chamber of the present invention;
FIG. 7 is a schematic view of an electrolyte circulation device according to the present invention;
FIG. 8 is a schematic view of a distilled water circulation device according to the present invention;
FIG. 9 is a schematic view of a cylindrical helical line structure in Experimental example 1 of the present invention;
FIG. 10 is a schematic view of a planar linear structure in Experimental example 2 of the present invention.
Detailed Description
Electronic components 3D printing device based on selective electrodeposition, including support 1, x axle mobile device 2, y axle mobile device 3, shower nozzle device 4, z axle mobile device 5, backup pad 6, print deposit room 7, electrolyte circulating device 8, distilled water circulating device 9, wherein x axle mobile device 2, y axle mobile device 3, z axle mobile device 5 is installed on support 1, shower nozzle device 4 is installed on x axle mobile device 2, y axle mobile device 3, can do xy direction and remove, backup pad 6 is installed on z axle mobile device 5, it arranges backup pad 6 top in to print deposit room 7, can do z direction and remove, electrolyte circulating device 8, distilled water circulating device 9 are arranged in support 1 bottom, realize the liquid circulation and supply.
The x-axis moving device 2 comprises a first light bar 201, a first moving block 202, a first belt 203, a first stepping motor 204, a first driving pulley 206, a first driving shaft rod 205, a first driven pulley 207 and a first driven shaft rod 208, wherein two sides of the first light bar 201 are inserted into the support 1 to be fixed, the first moving block 202 is in sliding connection with the first light bar 201 and only has freedom degrees in the x direction, the first driving pulley 206 and the first driven pulley 207 are fixedly connected with the first driving shaft rod 205 and the first driven shaft rod 208 respectively, the first belt 203 is wound on the first driving pulley 206 and the first driven pulley 207, an output shaft of the first stepping motor 204 is fixedly connected with the first driving shaft rod 205, and rotation of the first stepping motor 204 drives the first driving shaft rod 205 and the first driving pulley 206 to rotate, so that the first belt 203 drives the first moving block 202 to move in the x direction.
The y-axis moving device 3 comprises a second optical lever 301, a second belt 302, a second moving block 303, a second stepping motor 304, a second driving pulley 305, a second driving shaft 306, a second driven pulley 307 and a second driven shaft 308, wherein two sides of the second optical lever 301 are inserted into the bracket 1 and fixed, the second moving block 303 is in sliding connection with the second optical lever 301 and only has freedom degrees in the y direction, the second driving pulley 305 and the second driven pulley 307 at two ends are fixedly connected with the second driving shaft 306 and the second driven shaft 308 respectively, the second belt 302 is wound on the second driving pulley 305 and the second driven pulley 307, an output shaft of the second stepping motor 304 is fixedly connected with the second driving shaft 306, the second driving shaft 305 and the second driving pulley 306 are driven to rotate by rotation of the second stepping motor 305, and the second driving belt 302 drives the second moving block 303 to move in the y direction.
The nozzle device 4 comprises an insulating wire nozzle 401, a conductive wire nozzle 402, a nozzle clamp block 403, a conductive wire feed pipe 404, an insulating wire feed pipe 405, a third optical lever 406 and a fourth optical lever 407, wherein the insulating wire feed pipe 405 and the conductive wire feed pipe 404 respectively convey insulating wires and conductive wires to the insulating wire nozzle 401 and the conductive wire nozzle 402, the insulating wire nozzle 401 and the conductive wire nozzle 402 are fixed on the nozzle clamp block 403 to realize melt extrusion of the insulating wires and the conductive wires, and then stacked into a three-dimensional entity, the third optical lever 406 and the fourth optical lever 407 are inserted into the nozzle clamp block 403, and the third optical lever 406, the fourth optical lever 407 and the nozzle clamp block 403, the insulating wire nozzle 401 and the conductive wire nozzle 402 on the third optical lever and the fourth optical lever 407 are respectively driven by a first moving block 202 on the x-axis moving device 2 and a second moving block 303 on the y-axis moving device 3 to move in the x direction and the y.
The z-axis moving device 5 comprises a third stepping motor 501, a fifth beam 502, a sixth beam 505, a seventh beam 506, an eighth beam 509, a first lead screw 503, a second lead screw 508, a first lifting block 504 and a second lifting block 507, wherein a fifth feed rod 502, a sixth feed rod 505, a first screw 503, a seventh feed rod 506, an eighth feed rod 509 and a second screw 508 are respectively fixed on the bracket 1, a first lifting block 504 is in threaded connection with the first screw 503, a second lifting block 507 is in threaded connection with the second screw 508, an output shaft of a third stepping motor 501 is fixedly connected with the upper end of the second screw 508, the second screw 508 is driven to rotate by the rotation of the third stepping motor 501, thereby driving the second lifting block 507 and the first lifting block 504 to move up and down along the seventh optical rod 506, the eighth optical rod 509, the fifth optical rod 502 and the sixth optical rod 505 in the z direction, thereby driving the supporting plate 6 arranged on the second lifting block 507 and the first lifting block 504 and the printing deposition chamber 7 above the supporting plate 6 to move up and down in the z direction.
The printing deposition chamber 7 comprises a printing deposition groove 701, a copper plate 702, a positive terminal 703, a negative terminal 704 and a conductive adhesive tape 705, wherein the copper plate 702 and the conductive adhesive tape 705 are respectively fixed on the side surface and the bottom of the printing deposition groove 701, the positive terminal 703 is fixedly connected to the copper plate 702 and is connected with a positive electrode of a power supply, so that the copper plate 702 is used as an anode in the subsequent electrodeposition process, the negative terminal 704 is fixedly connected to the conductive adhesive tape 705 and is connected with a negative electrode of the power supply, and the conductive adhesive tape 705 and a 3D printing part contacted with the conductive adhesive tape 705 are used as a cathode in the subsequent electrodeposition process.
The electrolyte circulation device 8 comprises an electrolyte tank 801, an electrolyte supply pipeline 802 and an electrolyte output pipeline 803, wherein the electrolyte supply pipeline 802 is connected with the electrolyte tank 801 and the printing and depositing tank 701 to supply the electrolyte from the electrolyte tank 801 to the printing and depositing tank 701, and the electrolyte output pipeline 803 is connected with the electrolyte tank 801 and the printing and depositing tank 701 to output the electrolyte from the printing and depositing tank 701 to the electrolyte tank 801.
The distilled water circulation device 9 comprises a distilled water tank 901, a distilled water supply pipeline 902 and a distilled water output pipeline 903, wherein the distilled water supply pipeline 902 is connected with the distilled water tank 901 and the printing deposition tank 701 to supply distilled water to the printing deposition tank 701 from the distilled water tank 901, and the distilled water output pipeline 903 is connected with the distilled water tank 901 and the printing deposition tank 701 to output distilled water to the distilled water tank 901 from the printing deposition tank 701.
A3D printing method of an electronic component based on selective electrodeposition comprises the following steps:
(1) preparing an FDM wire material: preparing an insulating wire material: selecting thermoplastic high polymer material powder: polylactic acid (PLA), Polyetheretherketone (PEEK) or polyphenylene sulfide (PPS), drying the powder (drying temperature below the glass transition temperature) to remove moisture, and then melt-extruding to make a wire, the wire diameter depending on the printer requirements; preparing an electric conduction wire material: selecting thermoplastic high polymer material powder: polylactic acid (PLA), polyether ether ketone (PEEK), or polyphenylene sulfide (PPS), and conductive functional particle powder: the carbon nano tube, the graphene or the carbon black are respectively dried (the drying temperature is lower than the glass transition temperature) to remove moisture, then the two kinds of powder are mixed by a mixer, the uniformly mixed powder is dried again to remove moisture, and then the mixture is melted and extruded to prepare a wire material, wherein the diameter of the wire material depends on the requirement of a printer and is the same as that of an insulating wire material;
(2) and preparing electrolyte: taking CuSO4·5H20, 20-30 g, concentrated H2SO40-30mL, adding into a proper amount of distilled water, stirring by using a magnetic stirrer to uniformly mix, and preparing into 250mL of electrolyte;
(3) and model data conversion: designing a 3D printed part structure according to the structure of a required conductive element, wherein the part structure consists of a conductive area and an insulating area, the conductive area of the part is in contact with a conductive adhesive tape 705 in a printing deposition chamber 7, then constructing a corresponding Catia model, slicing and layering the model from the Z direction to enable the thickness of each layer to be micron-sized, and importing the graphic information of each layer of the model into a calculated control program;
(4) printing the three-dimensional part: based on a corresponding three-dimensional part Catia model, an insulating wire spray head 401 and a conductive wire spray head 402 in the spray head device 4 respectively melt and extrude insulating wires and conductive wires, and three-dimensional parts consisting of insulating areas and conductive areas are stacked layer by layer;
(5) selective electrodeposition of copper metal: the conductive area of the three-dimensional part formed after 3D printing is contacted with a conductive adhesive tape 705 in a printing deposition chamber 7, the three-dimensional part is connected with a power supply cathode through a cathode wire 704 to be used as an electrodeposition cathode, a copper plate 702 is connected with a power supply anode through an anode wire 703 to be used as an electrodeposition anode, electrolyte in an electrolyte tank 801 is supplied to the printing deposition tank 701 through an electrolyte supply pipeline 802, then the power supply is switched on, and metal copper is selectively deposited on the surface of the conductive area of the three-dimensional part according to the electrochemical reaction principle to prepare an electronic component;
(6) and cleaning and drying the electronic components: after the conductive element is prepared by printing and selectively electrodepositing copper metal on the three-dimensional part, the electrolyte is output from the printing and depositing tank 701 to the electrolyte tank 801 again through the electrolyte output pipeline 803, then distilled water in the distilled water tank 901 is supplied to the printing and depositing tank 701 through the distilled water supply pipeline 902, the electronic component and the printing and depositing chamber 7 are cleaned, the cleaned distilled water is output from the printing and depositing tank 701 to the distilled water tank 901 through the distilled water output pipeline 903, and the electronic component is taken out after being dried.
The present invention is further illustrated by the following specific experimental examples.
Experimental example 1 preparation of inductor coil
(1) And preparing an insulating wire and a conductive wire: selecting polylactic acid (PLA) material powder, drying the powder to remove moisture, and performing melt extrusion to prepare an insulating PLA wire material; selecting PLA material powder and carbon nanotube conductive functional particle powder, respectively drying the two kinds of powder to remove moisture, then mixing the two kinds of powder by using a mixer (the mass fraction of the carbon nanotubes is 7-9%), drying the uniformly mixed powder again to remove moisture, and then melting and extruding the uniformly mixed powder to prepare a PLA and carbon nanotube mixed conductive wire material, so that the preparation of an insulating wire material and a conductive wire material is respectively realized;
(2) and preparing electrolyte: 25g of CuSO was taken4·5H20. 26.6mL of concentrated H2SO4Adding into a proper amount of distilled water, stirring by using a magnetic stirrer to uniformly mix, and preparing into 250mL of electrolyte;
(3) and designing a three-dimensional model: designing a cylindrical spiral part structure model shown in fig. 9 by using three-dimensional modeling software (CATIA, SolidWorks, etc.), wherein A is an insulation region; b is a conductive area, and the conductive area B of the cylindrical spiral part structure model extends out of a certain length and is in contact with a conductive adhesive tape in the printing deposition chamber;
(4) and model layered slicing: slicing and layering the three-dimensional structure model from the Z direction to enable the thickness of each layer to be in a micron level, and importing the graphic information of each layer of the model into a calculated control program;
(5) printing a cylindrical spiral part: based on a corresponding three-dimensional part Catia model, an insulating wire spray head and a conductive wire spray head in a spray head device respectively melt and extrude insulating PLA wire materials, PLA and carbon nano tube mixed conductive wire materials through a feeding pipe, and cylindrical spiral parts consisting of insulating areas and conductive areas are stacked layer by layer;
(6) selective electrodeposition of copper metal: the conductive area B of the cylindrical spiral part formed after 3D printing is contacted with a conductive adhesive tape in a printing deposition chamber and is connected with a power supply cathode through a cathode connection wire to be used as an electrodeposition cathode, a copper plate in the printing deposition chamber is connected with a power supply anode through an anode connection wire to be used as an electrodeposition anode, electrolyte in an electrolyte tank is supplied to the printing deposition tank through an electrolyte supply pipeline, and after the power supply is switched on, metal copper is selectively deposited on the surface of the conductive area B of the three-dimensional part according to an electrochemical reaction principle, so that the conductive function of the conductive area B of the cylindrical spiral three-dimensional circuit is realized, and a finished product inductance coil is prepared;
(7) cleaning and drying the inductance coil: after copper metal is selectively electrodeposited in a conductive area of the cylindrical spiral part, electrolyte is output to the electrolyte tank again through the electrolyte output pipeline and the printing deposition tank, then distilled water in the distilled water tank is supplied to the printing deposition tank through the distilled water supply pipeline, the inductance coil and the printing deposition chamber are cleaned, the cleaned distilled water is output to the distilled water tank through the distilled water output pipeline and the printing deposition tank, and the inductance coil is taken out after being dried.
Experimental example 2 preparation of PCB Circuit Board
(1) And preparing an insulating wire and a conductive wire: selecting polylactic acid (PLA) material powder, drying the powder to remove moisture, and performing melt extrusion to prepare an insulating PLA wire material; selecting PLA material powder and carbon nanotube conductive functional particle powder, respectively drying the two kinds of powder to remove moisture, then mixing the two kinds of powder by using a mixer (the mass fraction of the carbon nanotubes is 7-9%), drying the uniformly mixed powder again to remove moisture, and then melting and extruding the uniformly mixed powder to prepare a PLA and carbon nanotube mixed conductive wire material, so that the preparation of an insulating wire material and a conductive wire material is respectively realized;
(2) and preparing electrolyte: 25g of CuSO was taken4·5H20. 26.6mL of concentrated H2SO4Adding into a proper amount of distilled water, stirring by using a magnetic stirrer to uniformly mix, and preparing into 250mL of electrolyte;
(3) and designing a three-dimensional model: designing a planar linear part structure model shown in fig. 10 by using three-dimensional modeling software (CATIA, SolidWorks, etc.), wherein a is an insulation region; b is a conductive area, and the conductive area B of the planar linear part structure model extends out of a certain length and is in contact with a conductive adhesive tape in the printing deposition chamber;
(4) and model layered slicing: slicing and layering the three-dimensional structure model from the Z direction to enable the thickness of each layer to be in a micron level, and importing the graphic information of each layer of the model into a calculated control program;
(5) printing the planar linear part: based on a corresponding three-dimensional part Catia model, an insulating wire spray head and a conductive wire spray head in a spray head device respectively melt and extrude insulating PLA wire materials, PLA and carbon nano tube mixed conductive wire materials through a feeding pipe, and cylindrical spiral parts consisting of insulating areas and conductive areas are stacked layer by layer;
(6) selective electrodeposition of copper metal: the conductive area B of the planar linear part formed after 3D printing is contacted with a conductive adhesive tape in a printing deposition chamber and is connected with a power supply cathode through a cathode connection wire to be used as an electrodeposition cathode, a copper plate in the printing deposition chamber is connected with a power supply anode through an anode connection wire to be used as an electrodeposition anode, electrolyte in an electrolyte tank is supplied to the printing deposition tank through an electrolyte supply pipeline, and after the power supply is switched on, metal copper is selectively deposited on the surface of the conductive area B of the three-dimensional part according to an electrochemical reaction principle, so that the conductive function of the conductive area B of the planar linear three-dimensional circuit is realized, and a finished product PCB circuit board is prepared;
(7) and cleaning and drying the PCB: after copper metal is selectively electrodeposited in the conductive area of the planar linear part, electrolyte is output to the electrolyte tank again through the electrolyte output pipeline and the printing deposition tank, then distilled water in the distilled water tank is supplied to the printing deposition tank through the distilled water supply pipeline, the PCB circuit board and the printing deposition chamber are cleaned, the cleaned distilled water is output to the distilled water tank through the distilled water output pipeline and the printing deposition tank, and the PCB circuit board is taken out after being dried.

Claims (9)

1. The utility model provides an electronic components 3D printing device based on selectivity electro-deposition which characterized in that: the device comprises a support, an x-axis moving device, a y-axis moving device, a sprayer device, a z-axis moving device, a supporting plate, a printing deposition chamber, an electrolyte circulating device and a distilled water circulating device, wherein the x-axis moving device, the y-axis moving device and the z-axis moving device are arranged on a support, the sprayer device is arranged on the x-axis moving device and the y-axis moving device and can move in the xy direction, the supporting plate is arranged on the z-axis moving device, the printing deposition chamber is arranged above the supporting plate and can move in the z direction, and the electrolyte circulating device and the distilled water circulating device are arranged at the bottom of the support.
2. The electronic component 3D printing device based on selective electrodeposition is characterized in that: the x-axis moving device comprises a first optical lever, a first moving block, a first belt, a first stepping motor, a first driving belt pulley, a first driving shaft rod, a first driven belt pulley and a first driven shaft rod, wherein the two sides of the first optical lever are inserted into the support to be fixed, the first moving block is connected with the first optical lever in a sliding mode and only has the freedom degree in the x direction, the first driving belt pulley and the first driven belt pulley are fixedly connected with the first driving shaft rod and the first driven shaft rod respectively, the first belt is wound on the first driving belt pulley and the first driven belt pulley, and an output shaft of the stepping motor is fixedly connected with the first driving shaft rod.
3. The electronic component 3D printing device based on selective electrodeposition is characterized in that: the y-axis moving device comprises a second optical lever, a second belt, a second moving block, a second stepping motor, a second driving belt pulley, a second driving shaft rod, a second driven belt pulley and a second driven shaft rod, wherein the two sides of the optical lever are inserted into the support to be fixed, the second moving block is in sliding connection with the second optical lever and only has the freedom degree in the y direction, the second driving belt pulley and the second driven belt pulley at the two ends are respectively fixedly connected with the second driving shaft rod and the second driven shaft rod, the second belt is wound on the second driving belt pulley and the second driven belt pulley, and an output shaft of the second stepping motor is fixedly connected with the second driving shaft rod.
4. The electronic component 3D printing device based on selective electrodeposition is characterized in that: the spray head device comprises an insulating wire spray head, a conductive wire spray head, a spray head clamping block, a conductive wire feed pipe, an insulating wire feed pipe, a third optical lever and a fourth optical lever, wherein the insulating wire feed pipe and the conductive wire feed pipe respectively convey insulating wires and conductive wires to the insulating wire spray head and the conductive wire spray head, the insulating wire spray head and the conductive wire spray head are fixed on the spray head clamping block, the third optical lever and the fourth optical lever are inserted into the spray head clamping block, and the first movable block on the x-axis moving device and the second movable block on the y-axis moving device respectively drive the third optical lever, the fourth optical lever and the spray head clamping block thereon, the insulating wire spray head and the conductive wire spray head to move in the x direction and the y direction.
5. The electronic component 3D printing device based on selective electrodeposition is characterized in that: the z-axis moving device comprises a third stepping motor, a fifth feed rod, a sixth feed rod, a seventh feed rod, an eighth feed rod, a first screw, a second screw, a first lifting block and a second lifting block, wherein the fifth feed rod, the sixth feed rod, the first screw, the seventh feed rod, the eighth feed rod and the second screw are respectively fixed on the bracket, the first lifting block is in threaded connection with the first screw, the second lifting block is in threaded connection with the second screw, and three output shafts of the stepping motor are fixedly connected with the upper end of the second screw.
6. The electronic component 3D printing device based on selective electrodeposition is characterized in that: the printing deposition chamber comprises a printing deposition groove, a copper plate, a positive terminal, a negative terminal and a conductive adhesive tape, wherein the copper plate and the conductive adhesive tape are respectively fixed on the side surface and the bottom of the printing deposition groove, the positive terminal is fixedly connected to the copper plate, and the negative terminal is fixedly connected to the conductive adhesive tape.
7. The electronic component 3D printing device based on selective electrodeposition is characterized in that: the electrolyte circulating device comprises an electrolyte tank, an electrolyte supply pipeline and an electrolyte output pipeline, wherein the electrolyte supply pipeline is connected with the electrolyte tank and the printing and depositing tank, and the electrolyte output pipeline is connected with the electrolyte tank and the printing and depositing tank.
8. The electronic component 3D printing device based on selective electrodeposition is characterized in that: the distilled water circulating device comprises a distilled water tank, a distilled water supply pipeline and a distilled water output pipeline, wherein the distilled water supply pipeline is connected with the distilled water tank and the printing sedimentation tank, and the distilled water output pipeline is connected with the distilled water tank and the printing sedimentation tank.
9. The method for adopting the electronic component 3D printing device based on selective electrodeposition as claimed in any one of claims 1 to 8, comprising the following steps:
(1) preparing an FDM wire material: preparing an insulating wire material: selecting thermoplastic high polymer material powder: drying the powder to remove moisture, and then melting and extruding to prepare a wire material, wherein the diameter of the wire material depends on the requirements of a printer; preparing an electric conduction wire material: selecting thermoplastic high polymer material powder: polylactic acid PLA, polyether ether ketone PEEK or polyphenylene sulfide PPS and conductive functional particle powder: respectively drying the two kinds of powder to remove moisture, then mixing the two kinds of powder by using a mixer, drying the uniformly mixed powder again to remove moisture, and then carrying out melt extrusion to prepare a wire material, wherein the diameter of the wire material depends on the requirement of a printer and is the same as that of an insulating wire material;
(2) and preparing electrolyte: taking CuSO4·5H20，20g30g, concentrated H2SO40-30mL, adding into a proper amount of distilled water, stirring by using a magnetic stirrer to uniformly mix, and preparing into 250mL of electrolyte;
(3) and model data conversion: designing a 3D printed part structure according to the structure of a required conductive element, wherein the part structure consists of a conductive area and an insulating area, the conductive area of the part is in contact with a conductive adhesive tape in a printing deposition chamber, then constructing a corresponding Catia model, slicing and layering the model from the Z direction to enable the thickness of each layer to be micron-sized, and importing graphic information of each layer of the model into a calculated control program;
(4) printing the three-dimensional part: based on a corresponding three-dimensional part Catia model, an insulating wire spray head and a conductive wire spray head in a spray head device respectively melt and extrude insulating wires and conductive wires, and three-dimensional parts consisting of insulating areas and conductive areas are stacked layer by layer;
(5) selective electrodeposition of copper metal: the conductive area of the three-dimensional part formed after 3D printing is contacted with a conductive adhesive tape in a printing deposition chamber, the three-dimensional part is connected with a power supply cathode through a cathode wiring to be used as an electrodeposition cathode, a copper plate is connected with a power supply anode through an anode wiring to be used as an electrodeposition anode, electrolyte in an electrolyte tank is supplied to the printing deposition tank through an electrolyte supply pipeline, then the power supply is switched on, and metal copper is selectively deposited on the surface of the conductive area of the three-dimensional part according to the electrochemical reaction principle to prepare an electronic component;
(6) and cleaning and drying the electronic components: after the conductive element is prepared by printing the three-dimensional part and selectively electrodepositing copper metal, the electrolyte is output to the electrolyte tank again through the electrolyte output pipe and the printing and depositing tank, then distilled water in the distilled water tank is supplied to the printing and depositing tank through the distilled water supply pipe, the electronic component and the printing and depositing chamber are cleaned, the cleaned distilled water is output to the distilled water tank through the distilled water output pipe and the printing and depositing tank, and the electronic component is taken out after being dried.
CN202110329847.4A 2021-03-28 2021-03-28 Electronic component 3D printing device and method based on selective electrodeposition Pending CN113085168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110329847.4A CN113085168A (en) 2021-03-28 2021-03-28 Electronic component 3D printing device and method based on selective electrodeposition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110329847.4A CN113085168A (en) 2021-03-28 2021-03-28 Electronic component 3D printing device and method based on selective electrodeposition

Publications (1)

Publication Number Publication Date
CN113085168A true CN113085168A (en) 2021-07-09

Family

ID=76670610

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110329847.4A Pending CN113085168A (en) 2021-03-28 2021-03-28 Electronic component 3D printing device and method based on selective electrodeposition

Country Status (1)

Country Link
CN (1) CN113085168A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114603844A (en) * 2022-05-12 2022-06-10 之江实验室 Integrated material increase manufacturing monolithic integration method for electronic device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170044680A1 (en) * 2015-08-14 2017-02-16 University Of Cincinnati Additive manufacturing by localized electrochemical deposition
CN106863770A (en) * 2017-01-12 2017-06-20 南京航空航天大学 The preparation method of the structural circuit unitary member based on fusion sediment forming technique
WO2018028000A1 (en) * 2016-08-08 2018-02-15 江苏大学 Device and method for multi-potential liquid-sucking electrodeposition 3d printing
KR20180103471A (en) * 2017-03-10 2018-09-19 (주)애니캐스팅 3D printing apparatus using selective electrochemical deposition
US20190242024A1 (en) * 2018-02-05 2019-08-08 U.S. Army Research Laboratory Attn: Rdrl-Loc-I Selective electroplating of 3d printed parts
CN110712365A (en) * 2019-09-24 2020-01-21 浙江工业大学 A small-size integration 3D printer for teaching and family
CN211518518U (en) * 2019-12-13 2020-09-18 重庆市美客无双智能科技有限公司 Automatic cleaning and drying device of photocuring 3D printer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170044680A1 (en) * 2015-08-14 2017-02-16 University Of Cincinnati Additive manufacturing by localized electrochemical deposition
WO2018028000A1 (en) * 2016-08-08 2018-02-15 江苏大学 Device and method for multi-potential liquid-sucking electrodeposition 3d printing
CN106863770A (en) * 2017-01-12 2017-06-20 南京航空航天大学 The preparation method of the structural circuit unitary member based on fusion sediment forming technique
KR20180103471A (en) * 2017-03-10 2018-09-19 (주)애니캐스팅 3D printing apparatus using selective electrochemical deposition
US20190242024A1 (en) * 2018-02-05 2019-08-08 U.S. Army Research Laboratory Attn: Rdrl-Loc-I Selective electroplating of 3d printed parts
CN110712365A (en) * 2019-09-24 2020-01-21 浙江工业大学 A small-size integration 3D printer for teaching and family
CN211518518U (en) * 2019-12-13 2020-09-18 重庆市美客无双智能科技有限公司 Automatic cleaning and drying device of photocuring 3D printer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114603844A (en) * 2022-05-12 2022-06-10 之江实验室 Integrated material increase manufacturing monolithic integration method for electronic device

Similar Documents

Publication Publication Date Title
Espera et al. 3D-printing and advanced manufacturing for electronics
US20180319108A1 (en) Methods of fabricating electronic and mechanical structures
CN1193649C (en) Method, facility and device for producing electrical connecting element, product and semi-finished products thereof
CN101394710B (en) Manufacturing and repairing method for conductive circuit of three dimensional mold interconnecting device
US20160198576A1 (en) Printed three-dimensional (3d) functional part and method of making
CN109732899B (en) Polymer matrix composite high-resolution 3D printing device and working method thereof
US11535947B2 (en) Electrochemical three-dimensional printing and soldering
JP2008218459A (en) Circuit board and manufacturing method thereof
JP2008063449A (en) Polymer nanocomposite material, method for producing the same, electronic component apparatus and method for manufacturing the component apparatus
CN113085168A (en) Electronic component 3D printing device and method based on selective electrodeposition
CN105792510A (en) Wire structure and manufacturing method thereof
CN109487249A (en) A kind of method of electroless copper activator and preparation method thereof and the full addition production route based on the activator
US20050053772A1 (en) Wiring board and multilayer wiring board
CN1604726A (en) Interconnection substrate and fabrication method thereof
CN201232091Y (en) Quick-speed forming device for electrochemical deposition at numerical control selected area
Perera et al. Recent progress in functionalized plastic 3D printing in creation of metallized architectures
Kim et al. Polyphenylene sulfide/liquid crystal polymer blend system for laser direct structuring and electroless plating applications
CN113134968B (en) Flexible electronic component 3D printing device and method based on electrodeposition and double nozzles
Ryspayeva et al. Multimaterial 3D Printing Technique for Electronic Circuitry Using Photopolymer and Selective Metallization
CN1352870A (en) Composition and method for manufacturing integral resistor in printed circuit boards
JP2006269557A (en) Method of forming circuit pattern, circuit pattern formed by using same, and laminate
CN112074090B (en) 3D printing preparation method of circuit board and prepared circuit board
JP2004342645A (en) Method for manufacturing planar coil
CN109986779A (en) A kind of increasing material manufacturing extrusion device of circuit board, increasing material manufacturing device and its application method using it
CN115505972A (en) Electrochemical deposition integrated device based on fused deposition preparation mask

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20210709