CN201232091Y - Quick-speed forming device for electrochemical deposition at numerical control selected area - Google Patents
Quick-speed forming device for electrochemical deposition at numerical control selected area Download PDFInfo
- Publication number
- CN201232091Y CN201232091Y CNU2008201216874U CN200820121687U CN201232091Y CN 201232091 Y CN201232091 Y CN 201232091Y CN U2008201216874 U CNU2008201216874 U CN U2008201216874U CN 200820121687 U CN200820121687 U CN 200820121687U CN 201232091 Y CN201232091 Y CN 201232091Y
- Authority
- CN
- China
- Prior art keywords
- anode
- deposition
- worktable
- driven
- sedimentation tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 13
- 238000000151 deposition Methods 0.000 claims abstract description 17
- 230000008021 deposition Effects 0.000 claims abstract description 17
- 238000005323 electroforming Methods 0.000 claims abstract description 16
- 238000004062 sedimentation Methods 0.000 claims description 16
- 230000009972 noncorrosive effect Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 17
- 239000002184 metal Substances 0.000 abstract description 11
- 238000007493 shaping process Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000000465 moulding Methods 0.000 abstract description 5
- 230000005684 electric field Effects 0.000 abstract description 3
- 230000005518 electrochemistry Effects 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract 2
- 150000001455 metallic ions Chemical class 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
- 238000000110 selective laser sintering Methods 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 241000446313 Lamella Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000001457 metallic cations Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a rapid molding device with numerical control area selection and electro-chemistry deposition. Working tables moving along X and Y directions are arranged on a machine tool working table, a deposition trough which is internally provided with a cathode plate is arranged on the working table moving along Y direction, an anode is arranged at the lower end of a vertical column moving along the Z direction, and is inserted into the deposition trough; electroforming liquid spouted from a nozzle is sprayed into the cathode plate, a computer control system controls the relative position of the anode and the cathode, the moving speed of three motors, the on and off of a power supply and the volume of deposition current. The electroforming liquid with higher concentration is input circularly for providing enough metallic ions for deposition, and then the anode is connected to a positive pole and the cathode plate is connected to a negative pole, therefore, electric field can be passed between the ultra thin anode and cathode, metal can be deposited under the anode. By combining the basic principles of electroforming and a rapid shaping technique, the molding device can fully play the characteristics of the rapid shaping technique and an electrochemical deposition technique and can be directly used for manufacturing metal parts with high quality and high precision.
Description
Technical field
The utility model relates to galvanoplastics and rapid shaping technique, relates in particular to a kind of numerical control selected area electrochemical deposition rapid forming device.
Background technology
Rapid shaping technique (Rapid Prototyping, RP) be a kind of new manufacture that produces early 1980s and grow up, it is the new and high technology that the modern sophisticated technologies achievement with multinomial engineering fields such as computer, CAD/CAM, numerical control, laser, novel material, elaborate servo, physics and chemistry is integrated in one.This technology adopt buildup of material method directly with cad data under the control of computer, the component of disposal molding complexity, obtain the profile of each layer cross section according to the Three Dimensional Design Model hierarchy slicing of product, the making problem of 3 d part is converted into the making of two-dimentional lamella, makes the processing of complex parts become very simple.At present, the most frequently used RP technology mainly contains selective laser sintering (SLS), photocuring moulding (SLA), fusion sediment manufacturing (FDM), laminated solid body manufacturing (LOM) and 3 D-printing (3D-P) etc.The processing object of these methods mainly is non-metallic material, for the bigger difficulty of direct manufacturing existence of metal parts.
Can directly make metal parts though also occurred some rapid shaping techniques now, selective laser sintering (SLS) is arranged, laser constituency fusing (SLM), the laser near-net-shape is made (LENS), the shape deposition is made (SDM), electron-beam melting is made (EBM), direct metal deposition (DMD), directly laser manufacturing (DLF), laser adds makes (LAM), scolder droplet printing (SDP) etc., but still can not on producing, be used widely, major cause is exactly the element precision that these methods produce, surface smoothness, mechanical property all can not reach the level of actual needs, special surface smoothness, with traditional processing means sizable gap is arranged, and expensive price.
Electroforming is a kind of modern processing of producing product based on metal ion in the cathode electrodeposition principle, make the solution metal positive ion under the effect of electrical forces, move to the negative electrode electron gain and be reduced into atom, and be deposited on negative electrode master mold surface, and the demoulding, thereby produce the manufacturing technology with the identical product of master mold, it has high manufacturing accuracy and surface smoothness and can make multicomponent composite materials.Being widely used in high-tech sectors such as aerospace, nuclear industry, micromechanics, electronics industry has succeeded, be mainly used in various precisions, abnormal shape, complexity, be difficult to make or the very high part of tooling cost such as fine with machining process, such as being used to make rocket jet engine cool chamber, solar energy storage flywheel, print soldering paste, tackiness agent template in the manufacturing of automotive upholstery, the electronic industry, aspects such as laser trademark, CD, precision gear, precision die, label, cavity liner.But galvanoplastics must depend on master mold, and this has limited the development of galvanoplastics greatly.
Summary of the invention
The purpose of this utility model is to provide a kind of numerical control selected area electrochemical deposition rapid forming device.
The technical solution adopted in the utility model is:
On the worktable of bed piece, the worktable that is moved at directions X by first driven by motor is installed, on the worktable that the directions X of first driven by motor moves, the worktable that installation is moved in the Y direction by second driven by motor, on the worktable that the Y direction of second driven by motor moves, sedimentation tank is installed, negative plate is set in the sedimentation tank, by the column lower end that the Z direction of the 3rd driven by motor moves anode is installed, anode inserts in the sedimentation tank, the positive pole of power supply is connected with anode, negative pole is connected with negative plate, well heater is arranged in the reservoir, electroforming solution is behind noncorrosive pump and strainer, one the tunnel is ejected to negative plate through shut off valve and under meter from nozzle, another road connects reservoir through surplus valve, and reservoir also is connected with sedimentation tank, and computer control system control is cloudy, the anode relative position, the movement velocity of three motors, the break-make of power supply, the size of deposition current.
The step of this method is as follows:
(1) the utilization CAD software design part three-dimensional entity model that draws, and derive the solid data file of describing with tri patch;
(2) utilize hierarchy slicing software, handle above-mentioned file, obtain the outline data of cutting into slices;
(3) in conjunction with the part process characteristic, the planning fill path, and, produce numerical control machining code in conjunction with the Controlling System requirement;
(4) the synthetic numerical control selected area electrochemical deposition control of PC+delamination software+control card system of processing, control cathode and anode relative position, movement velocity, the break-make of power supply, the size of electric current;
(5) numerical control selected area electrochemical deposition rapid forming has adopted the anode of 0.05-5mm, and metal ion deposits under anode head, and anode is made single deposition head or two kinds of basic forms of deposition head array;
(6) demoulding forms metal parts from the negative plate;
(7) to sedimentary metal parts aftertreatment.
The beneficial effect that the utlity model has is:
The utility model is intended to the ultimate principle of electroforming is combined with rapid shaping technique, gives full play to the characteristics separately of rapid shaping technique and electrochemical deposition technique, can be directly used in to make high quality, high-precision metal parts product.Solved well and be difficult to obtain the defective that high-test metal part and galvanoplastics must rely on master mold in the long-term puzzlement rapid shaping technique, widened the application in rapid shaping and galvanoplastics greatly.
Description of drawings
Fig. 1 is the deposition principle schematic.
Fig. 2 is a numerical control selected area electrochemical deposition rapid forming apparatus structure principle schematic.
Among the figure: 1, computer control system, 2, bed piece, 3, the worktable that moves of directions X, 4, the worktable that moves of Y direction, 5, negative plate, 6, sedimentation tank, 7, reservoir, 8, well heater, 9, noncorrosive pump, 10, strainer, 11, tensimeter, 12, surplus valve, 13, shut off valve, 14, under meter, 15, nozzle, 16, the column that moves of Z direction, 17, anode, 18, power supply.
Embodiment
As shown in Figure 1, negative electrode 17 is connected with power supply 18 positive poles, and negative plate 5 is connected with power supply 5 negative poles, and middle 0.5mm spacing is full of electroforming solution, thereby forms a loop, according to electrochemical principle as can be known, and Cu in the electroforming solution
2+Under electric field action, on negative plate, obtain electronics and be reduced into atom, finally deposit.Numerical control selected area electrochemical deposition rapid forming is exactly in fact to utilize the electrochemical deposition principle, feed the electroforming solution of very high concentrations at the sedimentation tank internal recycle, for deposition provides competent metal ion, then superfine anode is being inserted positive pole, negative plate connects negative pole, between superfine cathode and anode, just there is electric field to pass through like this, in will be under the anode very little scope of metal under the deposition.Under the control of computer, the relative position of cathode and anode changes, and in the sedimentary local energising of needs, does not need sedimentary local outage, thus just realized electroforming numerical controlization, can selection.
As shown in Figure 2, the utility model is on the worktable of bed piece 2, the worktable 3 that is moved at directions X by first driven by motor is installed, on the worktable 3 that the directions X of first driven by motor moves, the worktable 4 that installation is moved in the Y direction by second driven by motor, on the worktable 4 that the Y direction of second driven by motor moves, sedimentation tank 6 is installed, negative plate 5 is set in the sedimentation tank 6, by column 16 lower ends that the Z direction of the 3rd driven by motor moves anode 17 is installed, anode 17 inserts in the sedimentation tank 6, the positive pole of power supply 18 is connected with anode 16, negative pole is connected with negative plate 5, well heater 8 is arranged in the reservoir 7, and electroforming solution is behind noncorrosive pump 9 and strainer 10, one the tunnel is ejected to negative plate 5 through shut off valve 13 and under meter 14 from nozzle 15, another road connects reservoir 7 through surplus valve, reservoir 7 also is connected with sedimentation tank 6, and computer control system 1 control is cloudy, the anode relative position, the movement velocity of three motors, the break-make of power supply, the size of deposition current.
The utility model deposition process is as follows:
Electroforming solution is heated to certain temperature in reservoir, ejection from nozzle provides sufficient electroforming solution for deposition through noncorrosive pump and filtration then, anode exceeds very little distance (but than each sedimentary height height in the deposition process) than negative plate, after yin, yang is all switched on, metallic cation is in the deposition at negative plate last layer one deck, be back to reservoir through the post-depositional slightly electroforming solution of lower concentration, through stirring, circulation once more.The device running gear is by three motors and transmission rig, and the realization anode moves vertical (Z axle) direction, and negative plate is made level (X, Y-axis) direction and moved on worktable, thereby realizes numerical controlization.Computer system produces control signal control drive-motor according to the digital control processing file, make cathode and anode produce relatively moving of worktable that X, Y direction move, thereby realize the scanning on anticathode surface, control the break-make of power supply simultaneously, thereby be implemented on the negative plate deposition whether, last control current and then control current density, and controls movement speed reach the purpose of controlling deposit thickness.After cast layer finishes, anode with respect to negative plate rise a bed thickness distance and begin new coating, so move in circles, thereby finally obtain required part.
The Controlling System of computer+control card+delamination software, negative plate are fixed in the sedimentation tank on the worktable, and atomic thin anodically deposit head places the negative plate top, and nozzle provides competent solution for deposition process being fixed near the anode head
Present technique is owing to adopted the 0.05-5mm anode, and its current density is relatively very big, thereby has also improved sedimentation velocity greatly, has overcome the problems such as cast layer defective that traditional electroforming time is long and non-uniform electric is brought.Particularly importantly, because sedimentary alternative, this technology has been abandoned the master mold that conventional art must rely on.
Therefore, the utility model meets the basic thought of rapid shaping fully, and the ultimate principle of Applied Electrochemistry, and the two is combined, formed a kind of novelty low cost, high quality, high-precisionly can directly prepare the metal parts quick molding method.
Claims (1)
1, a kind of numerical control selected area electrochemical deposition rapid forming device, it is characterized in that: on the worktable of bed piece (2), the worktable (3) that is moved at directions X by first driven by motor is installed, on the worktable (3) that the directions X of first driven by motor moves, the worktable that installation is moved in the Y direction by second driven by motor (4), on the worktable (4) that the Y direction of second driven by motor moves, sedimentation tank (6) is installed, negative plate (5) is set in the sedimentation tank (6), by column (16) lower end that the Z direction of the 3rd driven by motor moves anode (17) is installed, anode (17) inserts in the sedimentation tank (6), the positive pole of power supply (18) is connected with anode (16), negative pole is connected with negative plate (5), well heater (8) is arranged in the reservoir (7), electroforming solution is behind noncorrosive pump (9) and strainer (10), one the tunnel is ejected to negative plate (5) through shut off valve (13) and under meter (14) from nozzle (15), another road connects reservoir (7) through surplus valve, reservoir (7) also is connected with sedimentation tank (6), and computer control system (1) control is cloudy, the anode relative position, the movement velocity of three motors, the break-make of power supply, the size of deposition current.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201216874U CN201232091Y (en) | 2008-07-22 | 2008-07-22 | Quick-speed forming device for electrochemical deposition at numerical control selected area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201216874U CN201232091Y (en) | 2008-07-22 | 2008-07-22 | Quick-speed forming device for electrochemical deposition at numerical control selected area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201232091Y true CN201232091Y (en) | 2009-05-06 |
Family
ID=40618466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201216874U Expired - Fee Related CN201232091Y (en) | 2008-07-22 | 2008-07-22 | Quick-speed forming device for electrochemical deposition at numerical control selected area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201232091Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104141161A (en) * | 2014-08-20 | 2014-11-12 | 江苏理工学院 | Method for processing drill bit by supercritical composite electroplating based on mobile anode |
| CN104480505A (en) * | 2014-12-11 | 2015-04-01 | 江苏理工学院 | Supercritical fluid-based 3D electro-deposition processing device and method |
| CN105112965A (en) * | 2015-09-16 | 2015-12-02 | 上海圣匡机电科技有限公司 | Printing head, printing device and printing method for rapid forming of metal piece |
| WO2018028000A1 (en) * | 2016-08-08 | 2018-02-15 | 江苏大学 | Device and method for multi-potential liquid-sucking electrodeposition 3d printing |
| CN109136999A (en) * | 2018-10-10 | 2019-01-04 | 江苏师范大学 | A kind of devices and methods therefor of microparticle jetting electro-deposition forming micrometallic component |
| WO2020177066A1 (en) * | 2019-03-03 | 2020-09-10 | 吉林大学 | Array composite electric field metal electrochemical micro-nano scale additive manufacturing device and method |
-
2008
- 2008-07-22 CN CNU2008201216874U patent/CN201232091Y/en not_active Expired - Fee Related
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106087008A (en) * | 2014-08-20 | 2016-11-09 | 江苏理工学院 | Method for machining drill bit through supercritical composite electroplating based on moving anode with good effect |
| CN106087008B (en) * | 2014-08-20 | 2017-11-21 | 江苏理工学院 | Method for machining drill bit through supercritical composite electroplating based on moving anode with good effect |
| CN104141161A (en) * | 2014-08-20 | 2014-11-12 | 江苏理工学院 | Method for processing drill bit by supercritical composite electroplating based on mobile anode |
| CN104141161B (en) * | 2014-08-20 | 2016-08-17 | 江苏理工学院 | Method for processing drill bit by supercritical composite electroplating based on mobile anode |
| CN106222707A (en) * | 2014-12-11 | 2016-12-14 | 江苏理工学院 | 3D electro-deposition processing device based on supercritical fluid |
| CN106222707B (en) * | 2014-12-11 | 2018-02-06 | 江苏理工学院 | 3D electro-deposition processing device based on supercritical fluid |
| CN106086961A (en) * | 2014-12-11 | 2016-11-09 | 江苏理工学院 | Method for processing parts based on supercritical fluid 3D electrodeposition |
| CN106191933A (en) * | 2014-12-11 | 2016-12-07 | 江苏理工学院 | Method for processing parts based on supercritical fluid 3D electrodeposition |
| CN104480505B (en) * | 2014-12-11 | 2016-11-02 | 江苏理工学院 | Supercritical fluid-based 3D electro-deposition processing device and method |
| CN106191933B (en) * | 2014-12-11 | 2017-11-21 | 江苏理工学院 | Method for processing parts based on supercritical fluid 3D electrodeposition |
| CN104480505A (en) * | 2014-12-11 | 2015-04-01 | 江苏理工学院 | Supercritical fluid-based 3D electro-deposition processing device and method |
| CN106086961B (en) * | 2014-12-11 | 2017-11-21 | 江苏理工学院 | Method for processing parts based on supercritical fluid 3D electrodeposition |
| CN105112965A (en) * | 2015-09-16 | 2015-12-02 | 上海圣匡机电科技有限公司 | Printing head, printing device and printing method for rapid forming of metal piece |
| WO2018028000A1 (en) * | 2016-08-08 | 2018-02-15 | 江苏大学 | Device and method for multi-potential liquid-sucking electrodeposition 3d printing |
| GB2567992A (en) * | 2016-08-08 | 2019-05-01 | Univ Jiangsu | Device and method for multi-potential liquid-sucking eletrodeposition 3D printing |
| GB2567992B (en) * | 2016-08-08 | 2022-04-13 | Univ Jiangsu | Device and method for multi-potential liquid-sucking eletrodeposition 3D printing |
| CN109136999A (en) * | 2018-10-10 | 2019-01-04 | 江苏师范大学 | A kind of devices and methods therefor of microparticle jetting electro-deposition forming micrometallic component |
| WO2020177066A1 (en) * | 2019-03-03 | 2020-09-10 | 吉林大学 | Array composite electric field metal electrochemical micro-nano scale additive manufacturing device and method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101328599A (en) | Numerical control selected area electrochemical deposition rapid forming method and apparatus | |
| CN204097583U (en) | Dot matrix anode type electroreduction metal deposition part 3D prints equipment | |
| CN104178782B (en) | Electroreduction metal deposit dot matrix distributed anodes important actor | |
| CN201232091Y (en) | Quick-speed forming device for electrochemical deposition at numerical control selected area | |
| CN105945281B (en) | The deposition forming machining manufacture of part and mold | |
| Atwood et al. | Laser engineered net shaping (LENS™): A tool for direct fabrication of metal parts | |
| US5461769A (en) | Method of manufacturing electrically conductive elements particularly EDM or ECM electrodes | |
| CN103590076A (en) | Laser-reinforced electrodeposition rapid-prototyping processing apparatus and method | |
| CN110756805B (en) | 3D printing device for laser selective solidification metal and application method thereof | |
| CN106271486A (en) | Mould manufacturing method | |
| CN105383060A (en) | 3D printing device integrating material supplying, fluxing and crystal leveling assistance | |
| CN104164683A (en) | Dot-matrix-anode-type electroreduction metal deposition part 3D printing device | |
| CN103590080A (en) | Laser-reinforced jet-electrodeposition rapid-prototyping processing apparatus and method | |
| CN101545121A (en) | Method and device for electron beam electroforming rapid prototyping | |
| CN108971482B (en) | Planar array type magnetic control additive manufacturing method | |
| CN205614344U (en) | Metal 3D prints compound lathe with milling process | |
| Kechagias et al. | EDM electrode manufacture using rapid tooling: a review | |
| JP2010121187A (en) | Three-dimensional shaped article and method for producing the same | |
| CN103341591A (en) | Selective-failure-based 3D (three-dimensional) printing method for preparing mold | |
| CN1140377C (en) | Method and equipment for directly and quickly manufacturing mould and parts | |
| CN211071828U (en) | 3D printing device for laser selective solidified metal | |
| CN109128162A (en) | A kind of metal works processing method being embedded in prefabricated component | |
| CN108312492A (en) | A kind of 3D printing apparatus and method based on chemical reaction deposit | |
| CN203593801U (en) | Laser strengthening electro-deposition rapid prototyping processing device | |
| Tay et al. | The potential of plating techniques in the development of rapid EDM tooling |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090506 Termination date: 20090824 |