KR20180085009A - 실리콘 감압 접착제 조성물 - Google Patents

실리콘 감압 접착제 조성물 Download PDF

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Publication number
KR20180085009A
KR20180085009A KR1020187017999A KR20187017999A KR20180085009A KR 20180085009 A KR20180085009 A KR 20180085009A KR 1020187017999 A KR1020187017999 A KR 1020187017999A KR 20187017999 A KR20187017999 A KR 20187017999A KR 20180085009 A KR20180085009 A KR 20180085009A
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KR
South Korea
Prior art keywords
sensitive adhesive
adhesive composition
pressure sensitive
silicone pressure
silicone
Prior art date
Application number
KR1020187017999A
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English (en)
Other versions
KR102668369B1 (ko
Inventor
원범 장
군 조
보경 김
Original Assignee
다우 실리콘즈 코포레이션
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Application filed by 다우 실리콘즈 코포레이션 filed Critical 다우 실리콘즈 코포레이션
Publication of KR20180085009A publication Critical patent/KR20180085009A/ko
Application granted granted Critical
Publication of KR102668369B1 publication Critical patent/KR102668369B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
    • C08J3/092—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
    • C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
    • C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
    • C08J3/095—Oxygen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C09J2201/606—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020187017999A 2015-12-15 2016-12-12 실리콘 감압 접착제 조성물 KR102668369B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562267323P 2015-12-15 2015-12-15
US62/267,323 2015-12-15
PCT/US2016/066123 WO2017106087A1 (en) 2015-12-15 2016-12-12 Silicone pressure-sensitive adhesive composition

Publications (2)

Publication Number Publication Date
KR20180085009A true KR20180085009A (ko) 2018-07-25
KR102668369B1 KR102668369B1 (ko) 2024-05-24

Family

ID=59057449

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187017999A KR102668369B1 (ko) 2015-12-15 2016-12-12 실리콘 감압 접착제 조성물

Country Status (6)

Country Link
US (1) US10604688B2 (ko)
EP (1) EP3390568B1 (ko)
JP (1) JP7041058B2 (ko)
KR (1) KR102668369B1 (ko)
CN (1) CN108431166B (ko)
WO (1) WO2017106087A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI767036B (zh) * 2017-08-25 2022-06-11 美商陶氏有機矽公司 壓敏性聚矽氧黏著劑組成物
EP3645651B1 (en) * 2017-10-19 2023-09-06 Dow Silicones Corporation A method for fabricating a flexible organic light emitting diode using a pressure sensitive adhesive composition
KR20210039412A (ko) * 2018-08-01 2021-04-09 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 점착제 조성물 및 이것을 사용한 점착 테이프 또는 점착 필름
JP7420471B2 (ja) * 2018-11-15 2024-01-23 スリーエム イノベイティブ プロパティズ カンパニー シリコーン感圧接着剤及びシリコーン感圧接着剤組成物
US20220056322A1 (en) * 2018-12-27 2022-02-24 Dow Toray Co., Ltd. Curable silicone composition, release coating agent comprising said composition, release film obtained using said release coating agent, and layered product including said release film
WO2021081863A1 (en) * 2019-10-31 2021-05-06 Dow Silicones Corporation Silicone pressure sensitive adhesive composition and methods for the preparation and use thereof
EP3874004B1 (en) * 2020-01-15 2023-10-11 Dow Silicones Corporation Silicone pressure sensitive adhesive composition and methods for the preparation and use thereof
CN117098823A (zh) * 2021-04-27 2023-11-21 美国陶氏有机硅公司 有机硅压敏粘合剂组合物及其制备方法以及在柔性显示设备中的用途

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5190827A (en) 1991-03-26 1993-03-02 General Electric Company Silicone pressure sensitive adhesive compositions having high solids content
JPH07102224A (ja) * 1993-10-01 1995-04-18 Sekisui Chem Co Ltd 布粘着テープの製造方法
JPH09320368A (ja) * 1996-05-31 1997-12-12 Nitto Denko Corp 有機複合絶縁体及びその製造方法
US20110097579A1 (en) 2007-08-24 2011-04-28 Haruna Mizuno Silicone-based pressure-sensitive adhesive composition and pressure-sensitive tape or sheet
CN103305179A (zh) * 2013-06-28 2013-09-18 黑龙江省科学院石油化学研究院 一种硅氢加成/自由基双交联有机硅压敏胶的制备方法
CN104152104A (zh) * 2014-08-21 2014-11-19 岳胜武 一种自粘性有机硅压敏胶粘剂及其制备方法
WO2015095173A1 (en) * 2013-12-16 2015-06-25 3M Innovative Properties Company Blended release materials

Family Cites Families (14)

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US2676182A (en) 1950-09-13 1954-04-20 Dow Corning Copolymeric siloxanes and methods of preparing them
US3284406A (en) 1963-12-18 1966-11-08 Dow Corning Organosiloxane encapsulating resins
US4309520A (en) * 1980-01-28 1982-01-05 Dow Corning Corporation Silicone adhesive formulations
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
US4591622A (en) * 1984-10-29 1986-05-27 Dow Corning Corporation Silicone pressure-sensitive adhesive process and product thereof
US5357007A (en) 1993-03-12 1994-10-18 General Electric Company Method for making a solventless silicone pressure sensitive adhesive composition and product
US20040109853A1 (en) 2002-09-09 2004-06-10 Reactive Surfaces, Ltd. Biological active coating components, coatings, and coated surfaces
JP3912525B2 (ja) * 2002-12-12 2007-05-09 信越化学工業株式会社 付加硬化型シリコーンゴム組成物及び粘着ゴムシート
US7407709B2 (en) 2003-12-22 2008-08-05 3M Innovative Properties Company Silicone pressure sensitive adhesive and articles
JP5117713B2 (ja) 2006-12-25 2013-01-16 東レ・ダウコーニング株式会社 シリコーン系感圧接着剤組成物および粘着テープ
JP5049584B2 (ja) 2006-12-25 2012-10-17 東レ・ダウコーニング株式会社 過酸化物硬化型シリコーン系感圧接着剤組成物および粘着テープ
KR101727305B1 (ko) 2009-08-25 2017-04-14 다우 코닝 코포레이션 실리콘 감압 접착제의 제조 방법
TW201638223A (zh) * 2015-03-31 2016-11-01 羅傑斯公司 雙溫度固化型聚矽氧組合物、其製造方法及由其製備之物件
CN108102604B (zh) * 2018-01-23 2018-09-18 苏州世华新材料科技股份有限公司 一种高剥离力低硅残留有机硅压敏胶、压敏胶带及其制备方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5190827A (en) 1991-03-26 1993-03-02 General Electric Company Silicone pressure sensitive adhesive compositions having high solids content
JPH07102224A (ja) * 1993-10-01 1995-04-18 Sekisui Chem Co Ltd 布粘着テープの製造方法
JPH09320368A (ja) * 1996-05-31 1997-12-12 Nitto Denko Corp 有機複合絶縁体及びその製造方法
US20110097579A1 (en) 2007-08-24 2011-04-28 Haruna Mizuno Silicone-based pressure-sensitive adhesive composition and pressure-sensitive tape or sheet
CN103305179A (zh) * 2013-06-28 2013-09-18 黑龙江省科学院石油化学研究院 一种硅氢加成/自由基双交联有机硅压敏胶的制备方法
WO2015095173A1 (en) * 2013-12-16 2015-06-25 3M Innovative Properties Company Blended release materials
CN104152104A (zh) * 2014-08-21 2014-11-19 岳胜武 一种自粘性有机硅压敏胶粘剂及其制备方法

Also Published As

Publication number Publication date
KR102668369B1 (ko) 2024-05-24
US20180362816A1 (en) 2018-12-20
CN108431166B (zh) 2021-04-20
US10604688B2 (en) 2020-03-31
EP3390568A4 (en) 2019-05-22
JP2019502782A (ja) 2019-01-31
JP7041058B2 (ja) 2022-03-23
WO2017106087A1 (en) 2017-06-22
CN108431166A (zh) 2018-08-21
EP3390568B1 (en) 2020-05-06
EP3390568A1 (en) 2018-10-24

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