DE112017004024A5 - Silikonzusammensetzung - Google Patents

Silikonzusammensetzung Download PDF

Info

Publication number
DE112017004024A5
DE112017004024A5 DE112017004024.8T DE112017004024T DE112017004024A5 DE 112017004024 A5 DE112017004024 A5 DE 112017004024A5 DE 112017004024 T DE112017004024 T DE 112017004024T DE 112017004024 A5 DE112017004024 A5 DE 112017004024A5
Authority
DE
Germany
Prior art keywords
silicone composition
silicone
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112017004024.8T
Other languages
English (en)
Inventor
Hansjörg Schöll
Stephan Blaszczak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112017004024A5 publication Critical patent/DE112017004024A5/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE112017004024.8T 2016-08-11 2017-08-04 Silikonzusammensetzung Pending DE112017004024A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016114921.7 2016-08-11
DE102016114921.7A DE102016114921A1 (de) 2016-08-11 2016-08-11 Silikonzusammensetzung
PCT/EP2017/069817 WO2018029107A1 (de) 2016-08-11 2017-08-04 Silikonzusammensetzung

Publications (1)

Publication Number Publication Date
DE112017004024A5 true DE112017004024A5 (de) 2019-05-02

Family

ID=59558409

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102016114921.7A Withdrawn DE102016114921A1 (de) 2016-08-11 2016-08-11 Silikonzusammensetzung
DE112017004024.8T Pending DE112017004024A5 (de) 2016-08-11 2017-08-04 Silikonzusammensetzung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102016114921.7A Withdrawn DE102016114921A1 (de) 2016-08-11 2016-08-11 Silikonzusammensetzung

Country Status (5)

Country Link
US (1) US11111385B2 (de)
JP (1) JP2019525469A (de)
CN (1) CN109564962A (de)
DE (2) DE102016114921A1 (de)
WO (1) WO2018029107A1 (de)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9273830B2 (en) 2007-06-14 2016-03-01 Cree, Inc. Light source with near field mixing
JP2009267289A (ja) * 2008-04-30 2009-11-12 Citizen Electronics Co Ltd 発光装置
JP5325560B2 (ja) * 2008-12-18 2013-10-23 スタンレー電気株式会社 発光装置、および、発光装置の製造方法
JP5062446B2 (ja) * 2010-03-10 2012-10-31 信越化学工業株式会社 光拡散性ジメチルシリコーンゴム組成物及びｌｅｄ光拡散成型体
DE102010034913B4 (de) * 2010-08-20 2023-03-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlung emittierendes Bauelement und Verfahren zur Herstellung des Strahlung emittierenden Bauelements
DE102010041236A1 (de) 2010-09-23 2012-03-29 Osram Ag Optoelektronisches Halbleiterbauelement
CN102081184B (zh) * 2010-11-23 2013-03-27 吴明番 一种覆盖有光学膜层的导光体
DE102011111917A1 (de) * 2011-08-30 2013-02-28 Osram Opto Semiconductors Gmbh Licht emittierendes Halbleiterbauelement und Verfahren zur Herstellung eines Licht emittierenden Halbleiterbauelements
DE102011085645B4 (de) * 2011-11-03 2014-06-26 Osram Gmbh Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls
JP6001676B2 (ja) * 2011-12-30 2016-10-05 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 固体ライト及び形成方法
JP6358960B2 (ja) * 2012-02-09 2018-07-18 ダウ シリコーンズ コーポレーション 勾配ポリマー構造及び方法
CN103383986A (zh) * 2012-05-04 2013-11-06 旭明光电股份有限公司 具有波长转换层的发光二极管晶粒及其制造方法
DE102012219460A1 (de) 2012-10-24 2014-04-24 Osram Gmbh Leuchtdiodenmodul
JP2014220431A (ja) * 2013-05-09 2014-11-20 日東電工株式会社 回路基板、光半導体装置およびその製造方法
JP6010503B2 (ja) * 2013-05-14 2016-10-19 信越化学工業株式会社 硬化性樹脂組成物、その硬化物及び光半導体デバイス
CN106687832B (zh) * 2014-07-25 2019-12-13 艾弗里丹尼森有限公司 二合一的半透明着色膜
CN104393155B (zh) * 2014-11-03 2017-02-15 中国计量学院 基于对称周期的发光二极管封装方法以及led封装体

Also Published As

Publication number Publication date
US20190161614A1 (en) 2019-05-30
JP2019525469A (ja) 2019-09-05
DE102016114921A1 (de) 2018-02-15
CN109564962A (zh) 2019-04-02
WO2018029107A1 (de) 2018-02-15
US11111385B2 (en) 2021-09-07

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